TWI872651B - Embossing apparatus in pattern combination type - Google Patents

Abstract

The present invention provides an embossing apparatus in pattern combination type, which includes a platform, a displacement mechanism disposed on the platform, a spraying mechanism arranged corresponding to the platform, an embossing mask, and a camera mechanism. The embossing mask and the camera mechanism are connected to the displacement mechanism. The spraying mechanism is configured to sequentially form a plurality of colloid layers on a carrier. The embossing mask includes a substrate, an embossing layer formed on the substrate, and a plurality of mask alignment marks formed on the substrate and located outside of the embossing layer. The camera mechanism of the embossing apparatus can be operated to align the mask alignment marks with at least two carrier alignment marks of the carrier that are adjacent to any one of the colloid layers, and then the embossing mask can be driven to sequentially emboss the colloid layers so as to form a plurality of unit film layer.

Description

Group printing equipment

The present invention relates to an embossing device, in particular to a group-type embossing device.

When the existing embossing equipment forms a layout pattern composed of multiple unit patterns on an optical film by embossing, a noticeable gap often occurs between two adjacent unit patterns of the layout pattern of the optical film, thereby affecting its subsequent application. Therefore, the inventors of the present invention believe that the above defects can be improved, and have conducted intensive research and applied scientific principles, and finally proposed a reasonable design and effective improvement of the above defects of the present invention.

The present invention provides a modular embossing device that can effectively improve the defects that may occur in existing embossing devices.

The present invention discloses a type of modular embossing device, which includes: a workbench for a carrier to be placed, and the carrier has a plurality of carrier alignment marks; a displacement mechanism, which is arranged on the workbench, and the displacement mechanism can move relative to the workbench along a height direction, a first direction, and a second direction that are mutually orthogonal; a coating mechanism, which is arranged corresponding to the workbench, and the coating mechanism is used to sequentially form mutually spaced and arranged layers on the carrier. A plurality of adhesive layers of uniform thickness; an embossing mask connected to the displacement mechanism, and the embossing mask comprises: a substrate having a penetration block, an alignment block in an annular shape and surrounding the penetration block, and a non-penetrating block in an annular shape and surrounding the alignment block; wherein the substrate is passed through only by a curing light provided by the penetration block, and the alignment block can be passed through by an alignment light, and the wavelength of the curing light is different from the wavelength of the alignment light; a mask alignment mark located in the alignment block; and an embossing layer formed in the penetration block; wherein the embossing layer allows the curing light to pass through and has a unit pattern on a surface away from the substrate; wherein the unit pattern has a first outer edge and a second outer edge; the first outer edge and the second outer edge are located on opposite sides of the embossing layer, respectively, and the first outer edge and the second outer edge are both irregular and complementary in shape; and a camera mechanism connected to the displacement mechanism and capable of moving synchronously with the embossing mask; wherein the group-type embossing device can use the camera mechanism to align the multiple mask alignment marks of the embossing mask with at least two carrier alignment marks located next to any one of the adhesive layers along the height direction, and then drive the embossing mask along the height direction through the displacement mechanism, so that the multiple adhesive layers are embossed in sequence and each forms a unit film layer.

In summary, the plate-forming embossing device disclosed in the embodiment of the present invention can manufacture a plurality of the unit film layers through the structure of the embossing mask (e.g., the first outer edge and the second outer edge having irregular shapes and complementary shapes) and other matching components, thereby being more conducive to forming a gap between any two adjacent unit film layers that is difficult to be observed by the naked eye.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and do not limit the protection scope of the present invention in any way.

The following is an explanation of the implementation of the "group plate type imprinting device" disclosed in the present invention through specific concrete embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without deviating from the concept of the present invention. In addition, the drawings of the present invention are only for simple schematic illustrations and are not depicted according to actual sizes. Please note in advance. The following implementation will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.

[Example 1]

Please refer to Figures 1 to 8, which are the first embodiment of the present invention. This embodiment discloses a method for manufacturing a modular optical film, which includes a preparation step S100 and an embossing and curing step S300. To facilitate understanding of this embodiment, the respective contents of the preparation step S100 and the embossing and curing step S300 will be described below.

The preparation step S100: as shown in FIG1 and FIG2, a stamping mask 1 is provided. The preparation step S100 in this embodiment can also be regarded as a stamping mask manufacturing method, which includes a pre-step, a mark forming step, and a pattern forming step.

The pre-step is to provide a substrate 11, which is described as a flat plate in this embodiment, but the present invention is not limited thereto. The substrate 11 has a penetration block 111, an annular alignment block 112 surrounding the penetration block 111, and an annular non-penetration block 113 surrounding the alignment block 112.

In further detail, the substrate 11 is only penetrated by a curing light L (e.g., ultraviolet light as shown in FIG. 5 ) provided by the penetrating block 111; that is, the curing light L cannot penetrate the alignment block 112 and the non-penetrating block 113. Furthermore, the alignment block 112 is in a square ring shape in this embodiment and can allow a aligning light IR (e.g., infrared light as shown in FIG. 4 ) to penetrate, and the aligning light IR preferably cannot penetrate the non-penetrating block 113, and the wavelength of the curing light L is different from that of the aligning light IR.

The mark forming step: forming a plurality of mask alignment marks 12 spaced apart from each other in the alignment area 112 of the substrate 11, and the plurality of mask alignment marks 12 are respectively formed at a plurality of corners of the alignment area 112 in this embodiment. Each of the mask alignment marks 12 may be in a cross shape to facilitate alignment in two directions perpendicular to each other, but the present invention is not limited thereto.

The pattern forming step: forming an embossing layer 13 in the penetration area 111, and the embossing layer 13 can allow the curing light L to pass through and has a unit pattern 130 on the surface away from the substrate 11. In this embodiment, the embossing layer 13 is formed by irradiating a photoresist layer with an exposure ultraviolet light UV through a mask M or interference, and the preset exposure wavelength of the exposure ultraviolet light UV falls outside the preset light curing band of the curing light L (such as FIG. 5). For example, the preset exposure wavelength can be 190 nanometers (nm) to 250 nanometers, and the preset light curing band is at least 100 nanometers different from the above-mentioned preset exposure wavelength (such as: the preset light curing band is 350 nanometers to 410 nanometers).

In more detail, the outline of the unit pattern 130 is generally square (e.g., rectangular or square), but the edge of the unit pattern 130 is irregular. The unit pattern 130 has a first outer edge 131 and a second outer edge 132 located at opposite sides, and an upper edge 133 and a lower edge 134 located at the other two opposite sides. Furthermore, the two ends of the first outer edge 131 and the two ends of the second outer edge 132 are respectively adjacent to the plurality of mask alignment marks 12. That is, the embossing mask 1 forms a plurality of mask alignment marks 12 on the outer side of the embossing layer 13.

The first outer edge 131 and the second outer edge 132 are respectively disposed at two opposite outer sides of the embossing layer 13 along a first direction D1 and are spaced apart from each other, and the first outer edge 131 and the second outer edge 132 are both irregular and complementary in shape. Furthermore, the upper edge 133 and the lower edge 134 are disposed at two opposite outer sides of the embossing layer 13 along a second direction D2 perpendicular to the first direction D1 and are spaced apart from each other, and the upper edge 133 and the lower edge 134 are both irregular and complementary in shape, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the unit pattern 130 may also adopt the regular upper edge 133 and the lower edge 134 according to needs.

It should be further explained that the unit pattern 130 in this embodiment includes a plurality of irregularly arranged reflective embossed portions 135 having the same appearance. Each of the reflective embossed portions 135 has a plurality of reflective embossed areas 1351 arranged in a matrix shape, which can reflect light in the same direction, and the reflective directions of the plurality of reflective embossed portions 135 are irregularly arranged. In other words, when the plurality of reflective embossed portions 135 are irradiated by visible light, they can reflect and form a variety of colors.

Furthermore, each of the reflective embossed portions 135 is circular, and the multiple reflective embossed portions 135 of the unit pattern 130 are overlapped with each other, so that the first outer edge 131, the second outer edge 132, the upper edge 133, and the lower edge 134 are each composed of arc edges of the multiple reflective embossed portions 135.

The above is a description of the technical content of the preparation step S100 (or the embossing mask manufacturing method) in this embodiment; that is, this embodiment is equivalent to disclosing an embossing mask 1 in the above description, which has a different irregular structure from the previous ones. The technical content of the embossing curing step S300 is introduced below.

The embossing and curing step S300: As shown in FIG. 3 to FIG. 6, a plurality of adhesive layers 3a are formed on a carrier 2 and are spaced apart from each other and have uniform thickness, and the embossing layer 13 of the embossing mask 1 is used to sequentially emboss and cure the plurality of adhesive layers 3a to form a plurality of unit film layers 3. In this embodiment, the plurality of adhesive layers 3a are illustrated as a plurality of light-cured adhesive layers formed by coating or spraying, which can be cured by irradiation of the curing light L; the plurality of unit film layers 3 are spaced apart from each other and formed together on the carrier 2 to form a set of format optical films 200.

More specifically, the carrier 2 is described as a flat sheet structure in this embodiment, and the carrier 2 has a plurality of carrier alignment marks 21 arranged at intervals, but the present invention is not limited thereto. In the imprint curing step S300, each of the adhesive layers 3a is substantially formed within the area surrounded by four of the carrier alignment marks 21 (that is, any of the unit film layers 3 is disposed within the area surrounded by four of the carrier alignment marks 21), and the plurality of carrier alignment marks 21 are not shielded by the plurality of adhesive layers 3a.

Furthermore, in the imprint curing step S300, the embossing mask 1 uses the plurality of mask alignment marks 12 to align with at least two of the carrier alignment marks 21 located next to any one of the adhesive layers 3a along a height direction H perpendicular to the first direction D1 and the second direction D2, and then uses the embossing layer 13 to perform the imprint curing operation along the height direction H, so that the plurality of unit film layers 3 can be precisely formed at preset positions while maintaining preset intervals and having substantially the same appearance.

In addition, as shown in FIG. 1 , FIG. 7 , and FIG. 8 , the following describes the assembly optical film 200 formed after the assembly optical film manufacturing method of the present embodiment is implemented; that is, the present embodiment in the following description is equivalent to disclosing an assembly optical film 200, which has a different irregular structure from the previous one. Among them, the plurality of unit film layers 3 of the assembly optical film 200 are described as being arranged in a matrix, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the plurality of unit film layers 3 may also be arranged in a row along the first direction D1.

In this embodiment, each of the unit film layers 3 includes a first outer edge 31 and a second outer edge 32 located at opposite sides, respectively, which are embossed by the first outer edge 131 and the second outer edge 132 of the unit pattern 130, respectively, so that the first outer edge 31 and the second outer edge 32 are both irregular and complementary in shape. Furthermore, each of the unit film layers 3 also has an upper edge 33 and a lower edge 34 located on the other two opposite sides, which are respectively embossed by the upper edge 133 and the lower edge 134 of the unit pattern 130, so that the upper edge 33 and the lower edge 34 are both irregular and complementary in shape.

Furthermore, each of the unit film layers 3 includes a plurality of irregularly arranged reflective portions 35, which are embossed by the unit pattern 130 of the embossing layer 13 and have the same appearance. That is, in each of the unit film layers 3 of this embodiment, each of the reflective portions 35 has a plurality of reflective areas 351 arranged in a matrix, which reflect light in the same direction, and the reflective directions of the plurality of reflective portions 35 are irregularly arranged. That is, when the plurality of reflective portions 35 are irradiated by visible light, they can reflect to form a variety of colors.

Furthermore, each of the reflective portions 35 is circular in this embodiment, and the multiple reflective portions 35 of each of the unit film layers 3 are overlapped with each other, so that the first outer edge 31, the second outer edge 32, the upper edge 33, and the lower edge 34 of each of the unit film layers 3 are each composed of arc edges of multiple reflective portions 35.

From another perspective, among the two unit film layers 3 adjacent to each other along the first direction D1, the first outer edge 31 of one of the unit film layers 3 is adjacent to the second outer edge 32 of the other unit film layer 3 (and has an irregular shape that complements each other), and there is a first gap G1 of no more than 50 microns between them. Furthermore, among the two unit film layers 3 adjacent to each other along the second direction D2, the upper edge 33 of one of the unit film layers 3 is adjacent to the lower edge 34 of the other unit film layer 3 along the second direction D2 (and has an irregular shape that complements each other), and there is a second gap G2 of no more than 50 microns between them.

That is, the plurality of carrier alignment marks 21 are exposed in the plurality of first gaps G1 and the plurality of second gaps G2 between the plurality of unit film layers 3. In this embodiment, the plurality of first gaps G1 and the plurality of second gaps G2 are interconnected and generally present a chessboard shape, and any one of the first gaps G1 and the second gaps G2 is preferably not larger than 30 microns, but is not limited thereto.

In addition, as shown in FIG. 1 and FIG. 3 to FIG. 6, a modular embossing device 100 is also disclosed in this embodiment, and the modular optical film manufacturing method can be implemented by the modular embossing device 100, but the present invention is not limited thereto. In other words, the modular optical film manufacturing method can also be implemented by other devices. In addition, the modular embossing device 100 is used in this embodiment to manufacture the modular optical film 200 as described above, so the specific structure of the modular optical film 200 will not be repeated in the following description.

The assembly type embossing device 100 in this embodiment includes a workbench 4, a displacement mechanism 5 disposed on the workbench, a coating mechanism 6 disposed corresponding to the workbench 4, the embossing mask 1 and a camera mechanism 7 connected to the displacement mechanism 5, and a curing light source 8 connected to the displacement mechanism 5 and disposed corresponding to the embossing mask 1. In this embodiment, the specific structure of the embossing mask 1 is the same as that in the above-mentioned assembly type optical film manufacturing method, so it will not be repeated in the following description.

It should be noted that the assembly type imprinting device 100 is described in this embodiment by combining the above-mentioned components, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the camera mechanism 7 and/or the curing light source 8 may also be omitted or replaced by other components.

The workbench 4 is used for placing the carrier 2, and the specific structure of the carrier 2 is roughly the same as that described in the above-mentioned method for manufacturing the assembly type optical film, so it will not be repeated in the following description.

The displacement mechanism 5 can move relative to the workbench 4 along the height direction H, the first direction D1, and the second direction D2 that are orthogonal to each other. Furthermore, the coating mechanism 6 is installed on the displacement mechanism 5 in this embodiment, and can be driven by the displacement mechanism 5 to sequentially form a plurality of the adhesive layers 3a that are spaced apart and have uniform thickness on the carrier 2, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the operation of the coating mechanism 6 can also be independent of the displacement mechanism 5.

It should be noted that the coating mechanism 6 accurately forms the plurality of glue layers 3a by a coating or spraying method other than dispensing glue, so that each of the glue layers 3a has a uniform thickness and is formed within an area surrounded by the four carrier alignment marks 21 and does not cover any of the carrier alignment marks 21.

In addition, the embossing mask 1, the camera mechanism 7, and the curing light source 8 can be synchronously moved by the displacement mechanism 5. The embossing mask 1 can also move relative to the camera mechanism 7 and the curing light source 8 along the height direction H, but the present invention is not limited thereto.

Accordingly, the group-type imprinting device 100 can use the camera mechanism 7 to align the multiple mask alignment marks 12 of the imprinting mask 1 with at least two carrier alignment marks 21 located beside any one of the adhesive layers 3a along the height direction H, and then drive the imprinting mask 1 to be imprinted along the height direction H through the displacement mechanism 5, so that the multiple adhesive layers 3a are imprinted in sequence and each forms a unit film layer 3. The curing light source 8 can be used to emit the curing light L toward the substrate 11 of the imprinted mask 1 to pass through the penetration block 111 and the imprinting layer 13, thereby curing the unit film layer 3.

As described above, the assembly optical film manufacturing method or the assembly embossing device 100 in this embodiment can manufacture the assembly optical film 200 through the structure of the embossing mask 1 (e.g., having the first outer edge 131 and the second outer edge 132 which are irregular and complementary in shape) and its other matching components or steps, so that the first gap G1 is formed in a specific size (e.g., not more than 50 microns) between any two adjacent unit film layers 3 of the assembly optical film 200 by the first outer edge 31 and the second outer edge 32 which are irregular and complementary in shape, so that the user cannot observe the first gap G1 with the naked eye. On the other hand, if the gap is defined by two edges of a regular shape, the size of the gap needs to be at least less than 5 microns to make it difficult to observe directly with the naked eye.

That is, as shown in FIG. 1 , FIG. 7 and FIG. 8 , the optical film set 200 provided in this embodiment has a different structure from the conventional ones, so that it is more convenient for production and manufacturing, and can effectively improve its application range. In other words, the embossing mask 1 or its manufacturing method provided in this embodiment can form the optical film set 200 in which the first gap G1 (and the second gap G2) cannot be observed by naked eyes with a relatively low manufacturing difficulty.

[Example 2]

Please refer to FIG. 9 and FIG. 10 , which are the second embodiment of the present invention. Since this embodiment is similar to the first embodiment, the similarities between the two embodiments will not be described in detail. The difference between this embodiment and the first embodiment is mainly that the unit pattern 130 of the imprint mask 1 in this embodiment (e.g., in the pattern forming step) is formed with a first pattern 130-1 and a second pattern 130-2 that are spaced apart from each other, so that each unit film layer 3 is also formed with two spaced-apart sub-blocks 30.

In more detail, the first pattern 130-1 has the first outer edge 131 and a first inner edge 136 located at opposite sides (along the first direction D1), and the second pattern 130-2 has the second outer edge 132 and a second inner edge 137 located at opposite sides (along the first direction D1). The first inner edge 136 and the second inner edge 137 are both irregular and complementary in shape, and the first inner edge 136 and the second inner edge 137 are adjacent to each other and are separated by a long-shaped slit S13 of no more than 50 microns along the first direction D1. The long-shaped slit S13 is preferably no more than 30 microns and its long axis direction is not parallel to (e.g., substantially perpendicular to) the first direction D1.

The first pattern 130-1 has a first upper edge 133-1 and a first lower edge 134-1 located on opposite sides, both of which are irregular and complementary in shape. One end of the first upper edge 133-1 and the first lower edge 134-1 are connected to the two ends of the first inner edge 136, and the other ends of the first upper edge 133-1 and the first lower edge 134-1 are connected to the two ends of the first outer edge 131.

The second pattern 130-2 has a second upper edge 133-2 and a second lower edge 134-2 located on the other two opposite sides, both of which are irregular and complementary in shape. One end of the second upper edge 133-2 and the second lower edge 134-2 are connected to the two ends of the second inner edge 137, and the other ends of the second upper edge 133-2 and the second lower edge 134-2 are connected to the two ends of the second outer edge 132.

That is, the upper edge 133 is divided into the first upper edge 133-1 and the second upper edge 133-2 by the elongated slit S13 in this embodiment, and the lower edge 134 is divided into the first upper edge 133-1 and the second upper edge 133-2 by the elongated slit S13. In addition, in other embodiments not shown in the present invention, the unit pattern 130 can also be divided into more than three patterns according to needs.

Furthermore, in this embodiment, the first pattern 130-1 and the second pattern 130-2 each include a plurality of reflective embossed portions 135 that are irregularly arranged and have the same appearance, each of which has a plurality of reflective embossed areas (not shown in the figure) that are arranged in a matrix and reflect in the same direction, and the reflective directions of the plurality of reflective embossed portions 135 are irregularly arranged.

The above is an explanation of the difference between the embossing layer 13 of this embodiment and the embodiment 1. The difference between the assembly optical film 200 embossed by the embossing layer 13 of this embodiment (through the embossing curing step S300) and the embodiment 1 will be explained as follows.

Specifically, each of the unit film layers 3 has a first inner edge 36 and a second inner edge 37 disposed adjacent to each other, the first outer edge 31 and the second outer edge 32 located at opposite sides (along the first direction D1), and an upper edge 33 and a lower edge 34 located at the other opposite sides (along the second direction D2). The first inner edge 36 and the second inner edge 37 are both irregular and complementary in shape, the first outer edge 31 and the second outer edge 32 are both irregular and complementary in shape, and the upper edge 33 and the lower edge 34 are both irregular and complementary in shape.

In each of the unit film layers 3, the first inner edge 36 and the second inner edge 37 are respectively formed by embossing the first inner edge 136 and the second inner edge 137 of the unit pattern 130, and are separated from each other by a set of slits S3 of no more than 50 microns. The set of slits S3 is preferably no more than 30 microns and its long axis direction is not parallel to (e.g., substantially perpendicular to) the first direction D1.

That is, the upper edge 33 and the lower edge 34 are each divided into two separate sections by the assembly slit S3 in this embodiment, and are respectively located in two sub-blocks 30, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the unit film layer 3 can also be divided into more than three sub-blocks 30 as required.

In addition, the specific structure of each unit film layer 3 (such as the reflective portion 35 or the multiple reflective areas contained therein), and the first gap G1 or the second gap G2 formed by any two adjacent unit film layers 3 along the first direction D1 or the second direction D2 are the same as those in the first embodiment and are not described in detail here. It should be noted that any one of the assembly gaps S3 is connected to two of the second gaps G2.

As described above, the assembly optical film manufacturing method or the assembly embossing device 100 in this embodiment can manufacture the assembly optical film 200 through the structure of the embossing mask 1 (such as: the first inner edge 136 and the second inner edge 137 having irregular shapes and complementary shapes) and its other matching components or steps, so that any of the unit film layers 3 of the assembly optical film 200 is formed with the assembly gap S3 that the user cannot observe with the naked eye, thereby facilitating the production of the embossing mask 1.

From another perspective, the assembly type optical film 200 provided in this embodiment has a different structure from the conventional ones, which is more conducive to the production and manufacturing of the embossing mask 1, and further facilitates its promotion and mass production. Furthermore, the embossing mask 1 or its manufacturing method provided in this embodiment can assemble the unit pattern 130 with the elongated assembly slit S13, thereby effectively reducing the manufacturing difficulty of the embossing mask 1, and can be used to form the unit film layer 3 in which the assembly slit S3 cannot be observed by the naked eye.

The above disclosed contents are only preferred feasible embodiments of the present invention and are not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the specification and drawings of the present invention are included in the patent scope of the present invention.

100: Layout type imprinting equipment 1: Imprinting mask 11: Substrate 111: Penetration block 112: Alignment block 113: Non-penetration block 12: Mask alignment mark 13: Imprinting layer 130: Unit pattern 130-1: First pattern 130-2: Second pattern 131: First outer edge 132: Second outer edge 133: Upper edge 133-1: First upper edge 133-2: Second upper edge 134: Lower edge 134-1: First lower edge 134-2: Second lower edge 135: reflective embossing part 1351: reflective embossing area 136: first inner edge 137: second inner edge 2: carrier 21: carrier alignment mark 3a: adhesive layer 3: unit film layer 30: sub-block 31: first outer edge 32: second outer edge 33: upper edge 34: lower edge 35: reflective part 351: reflective area 36: first inner edge 37: second inner edge 4: workbench 5: displacement mechanism 6: coating mechanism 7: camera mechanism 8: curing light source 200: assembly type optical film S100: preparation step S300: Imprint curing step G1: First gap G2: Second gap S13: Long plate assembly gap S3: Plate assembly gap D1: First direction D2: Second direction H: Height direction M: Photomask UV: Exposure ultraviolet light L: Curing light IR: Alignment light

FIG. 1 is a three-dimensional schematic diagram of the preparation steps of the method for manufacturing a modular optical film (or the method for manufacturing an embossing photomask) according to the first embodiment of the present invention.

FIG. 2 is an enlarged schematic diagram of region II in FIG. 1 .

FIG3 is a three-dimensional schematic diagram of the modular plate-type embossing device of the first embodiment of the present invention.

4 to 6 are schematic plan views of the embossing and curing steps of the method for manufacturing a modular optical film according to the first embodiment of the present invention.

FIG. 7 is a partial top view of the modular optical film of the first embodiment of the present invention.

FIG. 8 is an enlarged schematic diagram of region VIII of FIG. 7 .

FIG. 9 is a three-dimensional schematic diagram of the preparation steps of the method for manufacturing a modular optical film (or the method for manufacturing an embossing photomask) according to the second embodiment of the present invention.

FIG. 10 is a partial top view of the modular optical film of the second embodiment of the present invention.

100: Group printing equipment

1: Imprinting mask

11: Base material

111: Penetration block

112: Alignment block

113: Non-penetrating block

12: Mask alignment mark

13: Embossing layer

130:Unit pattern

2: Carrier

21: Carrier alignment mark

3a: Adhesive layer

3: Unit film layer

4: Workbench

5: Displacement mechanism

6: Coating mechanism

7: Camera mechanism

8: Curing light source

S300: Imprint curing step

D1: First direction

H: height direction

L: Curing light

Claims (9)

A type of embossing device, comprising: A workbench for a carrier to be placed, and the carrier has a plurality of carrier alignment marks; A displacement mechanism, arranged on the workbench, and the displacement mechanism can move relative to the workbench along a height direction, a first direction, and a second direction that are mutually orthogonal; A coating mechanism, arranged corresponding to the workbench, and the coating mechanism is used to sequentially form a plurality of glue layers that are spaced apart and have uniform thickness on the carrier; An embossing mask, connected to the displacement mechanism, and the embossing mask includes: A substrate having a penetration block, an annular alignment block surrounding the penetration block, and an annular non-penetrating block surrounding the alignment block; wherein the substrate is penetrated only by a curing light provided by the penetration block, and the alignment block can allow an alignment light to pass through, and the wavelength of the curing light is different from the wavelength of the alignment light; A plurality of mask alignment marks, located in the alignment block; and An embossing layer, formed in the penetration block; wherein the embossing layer can allow the curing light to pass through and has a unit pattern on a surface away from the substrate; The unit pattern has a first outer edge and a second outer edge; the first outer edge and the second outer edge are located on opposite sides of the embossing layer, respectively, and the first outer edge and the second outer edge are both irregular and complementary in shape; and a camera mechanism connected to the displacement mechanism and capable of moving synchronously with the embossing mask; Wherein, the group-type embossing device can use the camera mechanism to align the multiple mask alignment marks of the embossing mask with at least two carrier alignment marks located beside any one of the adhesive layers along the height direction, and then use the displacement mechanism to drive the embossing mask to emboss along the height direction, so that the multiple adhesive layers are embossed in sequence and each forms a unit film layer; Each of the unit film layers formed by the group-type embossing device has a first outer edge and a second outer edge located on opposite sides, respectively, which are embossed by the first outer edge and the second outer edge of the unit pattern; wherein, among the two unit film layers adjacent to each other along the first direction, the first outer edge of one of the unit film layers is adjacent to the second outer edge of the other unit film layer and has a non-regular shape that complements each other, and is separated by a first gap of no more than 50 microns. A group-type embossing device as described in claim 1, wherein, when the coating mechanism is formed with a plurality of the adhesive layers, each of the adhesive layers is formed within an area surrounded by four of the carrier alignment marks, and the plurality of the carrier alignment marks are not obscured by the plurality of the adhesive layers. A group-type imprinting device as described in claim 1, wherein the plurality of mask alignment marks are respectively adjacent to two ends of the first outer edge and two ends of the second outer edge. A group-type imprinting device as described in claim 1, wherein each of the unit film layers formed by the group-type imprinting device has an upper edge and a lower edge located on opposite sides respectively; wherein, among the two unit film layers adjacent to each other along the second direction, the upper edge of one of the unit film layers is adjacent to the lower edge of the other unit film layer along the second direction and is separated by a second gap of no more than 50 microns; wherein the plurality of the carrier alignment marks of the carrier are exposed in the plurality of the first gaps and the plurality of the second gaps between the plurality of the unit film layers. A plate-forming imprinting device as described in claim 1, wherein the unit pattern includes a first pattern and a second pattern spaced apart from each other, and the first pattern has the first outer edge and a first inner edge, and the second pattern has the second outer edge and a second inner edge adjacent to the first inner edge; wherein the first inner edge and the second inner edge are both irregular and complementary in shape, and the first inner edge and the second inner edge are spaced apart from each other by an elongated plate-forming gap of no more than 50 micrometers (μm). A group-type embossing device as described in claim 1, wherein the unit pattern includes a plurality of irregularly arranged reflective embossing portions having the same appearance; each of the reflective embossing portions has a plurality of reflective embossing areas arranged in a matrix, which can reflect in the same direction, and the reflective directions of the plurality of reflective embossing portions are irregularly arranged. A plate-forming imprinting device as described in claim 1, wherein the plate-forming imprinting device further includes a curing light source, which is connected to the displacement mechanism and configured corresponding to the imprinting mask, so that the imprinting mask, the photographing mechanism, and the curing light source can move synchronously through the displacement mechanism; wherein the curing light source can be used to emit the curing light having a wavelength within a preset light curing band, and the curing light source can emit the curing light toward the substrate covered by the imprinting mask so as to pass through the penetration area and the imprinting layer. A plate-forming embossing device as described in claim 7, wherein the embossing layer is formed by irradiating a photoresist layer with an exposure ultraviolet ray via a mask or interference, and a preset exposure wavelength of the exposure ultraviolet ray falls outside the preset light curing band of the curing light. A plate-forming embossing device as described in claim 1, wherein the embossing layer is formed by irradiating a photoresist layer with an exposure ultraviolet ray via a mask or interference, and a preset exposure wavelength of the exposure ultraviolet ray falls outside a preset light curing band of the curing light.