TWI863515B - Manufacturing method of embossing mask - Google Patents

Abstract

The present invention provides a manufacturing method of an embossing mask, which includes: providing a substrate; forming a plurality of mask alignment marks on the substrate that are spaced apart from each other; and forming an embossing layer on a region of the substrate arranged inside of the mask alignment marks. A surface of the embossing layer arranged away from the substrate has a first pattern and a second pattern. The first pattern has a first inner edge and a first outer edge that is opposite to the first inner edge, and the second pattern has a second inner edge and a second outer edge that is opposite to the second inner edge. The first inner edge and the second inner edge are spaced apart from each other by an elongated gap that is less than or equal to 50 μm. The first inner edge and the second inner edge have irregular shapes that are complement in shape.

Description

Imprinting mask manufacturing method

The present invention relates to a manufacturing method, and in particular to a method for manufacturing an embossing mask.

The embossed pattern of the embossed mask produced by the existing embossed mask manufacturing method often needs to be composed of multiple sub-patterns; however, when the existing embossed mask is used to emboss on an optical film, the gaps between the multiple sub-patterns are often transferred to the pattern embossed on the optical film, resulting in gaps or defects visible to the naked eye, thus affecting its subsequent application. Therefore, the inventor believes that the above defects can be improved, and has conducted intensive research and combined with the application of scientific principles, and finally proposed a reasonable design and effective improvement of the above defects.

The present invention provides a method for manufacturing an embossing mask, which can effectively improve the defects that may be caused by the existing embossing mask manufacturing method.

The present invention discloses a method for manufacturing an imprinting mask, which includes: a pre-step: providing a substrate having a penetration block, an alignment block in a ring shape and surrounding the penetration block, and a non-penetration block in a ring shape and surrounding the alignment block; wherein the substrate is only penetrated by a curing light provided by the penetration block, and the alignment block can be penetrated by an alignment light, and the wavelength of the curing light is different from that of the alignment light; a mark forming step: forming a plurality of mask alignment marks spaced apart from each other in the alignment block of the substrate; and a Pattern forming step: forming an embossing layer in the penetration area, and the embossing layer can allow the curing light to pass through and has: a first pattern with a first inner edge and a first outer edge located at opposite sides; and a second pattern with a second inner edge and a second outer edge located at opposite sides; wherein the first inner edge and the second inner edge are separated from each other by a long slit of no more than 50 micrometers (μm), and the first inner edge and the second inner edge are both irregular and complementary in shape.

In summary, the embossing mask manufacturing method disclosed in the embodiment of the present invention can combine the required pattern with the elongated assembly slit, thereby effectively reducing the manufacturing difficulty of the embossing mask, and can be used for transfer printing to form a unit film layer whose assembly slit cannot be observed with the naked eye.

To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and do not limit the scope of protection of the present invention.

100: Group printing equipment

1: Imprinting mask

11: Base material

111: Penetration block

112: Alignment block

113: Non-penetrating block

12: Mask alignment mark

13: Embossing layer

130:Unit pattern

130-1: The first pattern

130-2: Second pattern

131: First outer edge

132: Second outer edge

133: Upper edge

133-1: First upper edge

133-2: Second upper edge

134: Lower edge

134-1: First lower edge

134-2: Second lower edge

135: Reflective embossing unit

1351: Reflective embossed area

136: First inner edge

137: Second inner edge

2: Carrier

21: Carrier alignment mark

3a: Adhesive layer

3: Unit film layer

30: Sub-block

31: The first outer edge

32: The second outer edge

33: Upper edge

34: Lower edge

35: Reflective part

351: Reflective area

36: The first inner edge

37: The second inner edge

4: Workbench

5: Displacement mechanism

6: Coating mechanism

7: Camera mechanism

8: Curing light source

200: Set of optical films

S100: Preparation steps

S300: Imprint curing step

G1: First gap

G2: Second gap

S13: Long-shaped assembly seam

S3: Plate assembly gap

D1: First direction

D2: Second direction

H: height direction

M: Mask

UV: ultraviolet light exposure

L: Curing light

IR: Positioning light

Figure 1 is a three-dimensional schematic diagram of the preparation steps of the assembly type optical film manufacturing method (or the embossing mask manufacturing method) of the first embodiment of the present invention.

Figure 2 is an enlarged schematic diagram of area II in Figure 1.

Figure 3 is a three-dimensional schematic diagram of the group plate type embossing device of the first embodiment of the present invention.

Figures 4 to 6 are schematic plan views of the embossing and curing steps of the assembly optical film manufacturing method of the first embodiment of the present invention.

Figure 7 is a partial top view of the assembly type optical film of the first embodiment of the present invention.

Figure 8 is an enlarged schematic diagram of region VIII of Figure 7.

Figure 9 is a three-dimensional schematic diagram of the preparation step of the assembly type optical film manufacturing method (or the embossing mask manufacturing method) of the second embodiment of the present invention.

Figure 10 is a partial top view of the assembly type optical film of the second embodiment of the present invention.

The following is a specific embodiment to illustrate the implementation of the "imprint mask manufacturing method" disclosed in the present invention. Technical personnel in this field can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without deviating from the concept of the present invention. In addition, the attached drawings of the present invention are only for simple schematic illustrations and are not depicted according to actual sizes. Please note in advance. The following implementation will further explain the relevant technical content of the present invention in detail, but the disclosed content is not used to limit the scope of protection of the present invention.

It should be understood that although the terms "first", "second", "third" and so on may be used in this article to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used in this article may include any one or more combinations of the related listed items depending on the actual situation.

[Implementation Example 1]

Please refer to Figures 1 to 8, which are the first embodiment of the present invention. This embodiment discloses a method for manufacturing a modular optical film, which includes a preparation step S100 and an embossing and curing step S300. To facilitate understanding of this embodiment, the respective contents of the preparation step S100 and the embossing and curing step S300 will be described below.

The preparation step S100: As shown in FIG. 1 and FIG. 2, a stamping mask 1 is provided. The preparation step S100 in this embodiment can also be regarded as a stamping mask manufacturing method, which includes a pre-step, a mark forming step, and a pattern forming step.

The preceding step is to provide a substrate 11, which is described as a flat plate in this embodiment, but the present invention is not limited thereto. The substrate 11 has a penetration block 111, a ring-shaped alignment block 112 surrounding the penetration block 111, and a ring-shaped non-penetration block 113 surrounding the alignment block 112.

In other words, the substrate 11 is only penetrated by a curing light L (such as ultraviolet light as shown in FIG. 5) provided by the penetrating block 111; that is, the curing light L cannot penetrate the alignment block 112 and the non-penetrating block 113. Furthermore, the alignment block 112 is in a square ring shape in this embodiment and can allow a aligning light IR (such as infrared light as shown in FIG. 4) to penetrate, and the aligning light IR is preferably unable to penetrate the non-penetrating block 113, and the wavelength of the curing light L is different from the wavelength of the aligning light IR.

The mark forming step: forming a plurality of mask alignment marks 12 spaced apart from each other in the alignment block 112 of the substrate 11, and the plurality of mask alignment marks 12 are respectively formed at a plurality of corners of the alignment block 112 in this embodiment. Each of the mask alignment marks 12 may be in the shape of a cross to facilitate alignment in two mutually perpendicular directions, but is not limited thereto.

The pattern forming step: forming an embossing layer 13 in the penetration area 111, and the embossing layer 13 can allow the curing light L to pass through and has a unit pattern 130 on the surface away from the substrate 11. In this embodiment, the embossing layer 13 is formed by irradiating an exposure ultraviolet light UV on a photoresist layer through a mask M or interference, and the preset exposure wavelength of the exposure ultraviolet light UV falls outside the preset light curing band of the curing light L (such as: Figure 5). For example, the preset exposure wavelength can be 190 nanometers (nm) ~ 250 nanometers, and the preset light curing band is at least 100 nanometers different from the above-mentioned preset exposure wavelength (such as: the preset light curing band is 350 nanometers ~ 410 nanometers).

In more detail, the outline of the unit pattern 130 is roughly square (e.g., rectangular or square), but the edge of the unit pattern 130 is irregular. The unit pattern 130 has a first outer edge 131 and a second outer edge 132 located on opposite sides, and an upper edge 133 and a lower edge 134 located on the other two opposite sides. Furthermore, the two ends of the first outer edge 131 and the two ends of the second outer edge 132 are respectively adjacent to the plurality of mask alignment marks 12. That is, the embossing mask 1 forms a plurality of mask alignment marks 12 on the outer side of the embossing layer 13.

The first outer edge 131 and the second outer edge 132 are respectively disposed at two opposite outer sides of the embossing layer 13 along a first direction D1 and are spaced apart from each other, and the first outer edge 131 and the second outer edge 132 are both irregular and complementary in shape. Furthermore, the upper edge 133 and the lower edge 134 are disposed at two opposite outer sides of the embossing layer 13 along a second direction D2 perpendicular to the first direction D1 and are spaced apart from each other, and the upper edge 133 and the lower edge 134 are both irregular and complementary in shape, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the unit pattern 130 may also adopt the regular upper edge 133 and the lower edge 134 according to needs.

It should be further explained that the unit pattern 130 in this embodiment includes a plurality of irregularly arranged reflective embossed portions 135 having the same appearance. Each of the reflective embossed portions 135 has a plurality of reflective embossed areas 1351 arranged in a matrix shape, which can reflect light in the same direction, and the reflective directions of the plurality of reflective embossed portions 135 are irregularly arranged. In other words, when the plurality of reflective embossed portions 135 are irradiated with visible light, they can reflect to form a variety of colors.

Specifically, each of the reflective embossed portions 135 is circular, and the multiple reflective embossed portions 135 of the unit pattern 130 are overlapped with each other, so that the first outer edge 131, the second outer edge 132, the upper edge 133, and the lower edge 134 are each composed of arc edges of multiple reflective embossed portions 135.

The above is a description of the technical content of the preparation step S100 (or the method for manufacturing the embossing mask) in this embodiment; that is, the above description of this embodiment is equivalent to disclosing an embossing mask 1, which has an irregular structure different from the previous ones. The technical content of the embossing curing step S300 is introduced below.

The embossing and curing step S300: As shown in Figures 3 to 6, a plurality of adhesive layers 3a are formed on a carrier 2 and are spaced apart from each other and have uniform thickness, and the embossing layer 13 of the embossing mask 1 is used to sequentially emboss and cure the plurality of adhesive layers 3a to form a plurality of unit film layers 3. In this embodiment, the plurality of adhesive layers 3a are illustrated as a plurality of light-cured adhesive layers formed by coating or spraying, which can be cured by irradiation of the curing light L; the plurality of unit film layers 3 are spaced apart from each other and formed together on the carrier 2 to form a set of format optical films 200.

In more detail, the carrier 2 is described as a flat sheet structure in this embodiment, and the carrier 2 has a plurality of carrier alignment marks 21 arranged at intervals, but the present invention is not limited thereto. In the imprint curing step S300, each of the adhesive layers 3a is roughly formed within the area surrounded by the four carrier alignment marks 21 (that is, any one of the unit film layers 3 is arranged within the area surrounded by the four carrier alignment marks 21), and the plurality of carrier alignment marks 21 are not covered by the plurality of adhesive layers 3a.

Furthermore, in the imprint curing step S300, the imprint mask 1 uses a plurality of the mask alignment marks 12 to align at least two of the carrier alignment marks 21 located next to any one of the adhesive layers 3a along a height direction H perpendicular to the first direction D1 and the second direction D2, and then uses the imprint layer 13 to perform the imprint curing operation along the height direction H, so that the plurality of the unit film layers 3 can be accurately formed at the preset position and maintain the preset interval and have substantially the same appearance.

In addition, as shown in FIG. 1 , FIG. 7 , and FIG. 8 , the following describes the group-type optical film 200 formed after the group-type optical film manufacturing method of this embodiment is implemented; that is, this embodiment is equivalent to disclosing a group-type optical film 200 in the following description, which has a different irregular structure from the previous one. Among them, the multiple unit film layers 3 of the group-type optical film 200 are described as being arranged in a matrix, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the multiple unit film layers 3 can also be arranged in a row along the first direction D1.

In this embodiment, each of the unit film layers 3 includes a first outer edge 31 and a second outer edge 32 located at opposite sides, respectively, which are embossed by the first outer edge 131 and the second outer edge 132 of the unit pattern 130, respectively, so that the first outer edge 31 and the second outer edge 32 are both irregular and complementary in shape. Furthermore, each of the unit film layers 3 also has an upper edge 33 and a lower edge 34 located on the other two opposite sides, which are respectively embossed by the upper edge 133 and the lower edge 134 of the unit pattern 130, so that the upper edge 33 and the lower edge 34 are both irregular and complementary in shape.

Furthermore, each of the unit film layers 3 includes a plurality of irregularly arranged reflective portions 35, which are embossed by the unit pattern 130 of the embossing layer 13 and have the same appearance. That is, in each of the unit film layers 3 of this embodiment, each of the reflective portions 35 has a plurality of reflective areas 351 arranged in a matrix, which reflect in the same direction, and the reflective directions of the plurality of reflective portions 35 are irregularly arranged. That is, when the plurality of reflective portions 35 are irradiated by visible light, they can reflect to form a variety of colors.

Furthermore, each of the reflective portions 35 is circular in this embodiment, and the multiple reflective portions 35 of each unit film layer 3 are overlapped with each other, so that the first outer edge 31, the second outer edge 32, the upper edge 33, and the lower edge 34 of each unit film layer 3 are each composed of the arc edges of the multiple reflective portions 35.

From another perspective, among the two unit film layers 3 adjacent to each other along the first direction D1, the first outer edge 31 of one of the unit film layers 3 is adjacent to the second outer edge 32 of the other unit film layer 3 (and has an irregular shape that complements each other), and there is a first gap G1 of no more than 50 microns. Furthermore, among the two unit film layers 3 adjacent to each other along the second direction D2, the upper edge 33 of one of the unit film layers 3 is adjacent to the lower edge 34 of the other unit film layer 3 along the second direction D2 (and has an irregular shape that complements each other), and there is a second gap G2 of no more than 50 microns.

That is, the plurality of carrier alignment marks 21 are exposed in the plurality of first gaps G1 and the plurality of second gaps G2 between the plurality of unit film layers 3. In this embodiment, the plurality of first gaps G1 and the plurality of second gaps G2 are interconnected and roughly present a chessboard shape, and any one of the first gaps G1 and the second gaps G2 is preferably not greater than 30 microns, but is not limited thereto.

In addition, as shown in FIG. 1 and FIG. 3 to FIG. 6, a group plate type embossing device 100 is also disclosed in this embodiment, and the group plate type optical film manufacturing method can be implemented by the group plate type embossing device 100, but the present invention is not limited thereto. In other words, the group plate type optical film manufacturing method can also be implemented by other devices. In addition, the group plate type embossing device 100 is used in this embodiment to manufacture the group plate type optical film 200 as described above, so the specific structure of the group plate type optical film 200 will not be described in detail in the following description.

The assembly type embossing device 100 in this embodiment includes a workbench 4, a displacement mechanism 5 arranged on the workbench, a coating mechanism 6 arranged corresponding to the workbench 4, the embossing mask 1 connected to the displacement mechanism 5 and a camera mechanism 7, and a curing light source 8 connected to the displacement mechanism 5 and arranged corresponding to the embossing mask 1. In this embodiment, the specific structure of the embossing mask 1 is as described in the above-mentioned assembly type optical film manufacturing method, so it will not be repeated in the following description.

It should be further explained that the group-type imprinting device 100 is described in this embodiment by combining the above-mentioned multiple components, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the camera mechanism 7 and/or the curing light source 8 can also be omitted or replaced by other components.

The workbench 4 is used to place the carrier 2, and the specific structure of the carrier 2 is roughly the same as that described in the above-mentioned method for manufacturing the composite optical film, so it will not be elaborated in the following description.

The displacement mechanism 5 can move relative to the workbench 4 along the mutually orthogonal height direction H, the first direction D1, and the second direction D2. Furthermore, the coating mechanism 6 is installed on the displacement mechanism 5 in this embodiment, and can be driven by the displacement mechanism 5 to sequentially form a plurality of the adhesive layers 3a with spaced configurations and uniform thickness on the carrier 2, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the operation of the coating mechanism 6 can also be independent of the displacement mechanism 5.

It should be noted that the coating mechanism 6 accurately forms multiple glue layers 3a in a coating or spraying method different from glue dispensing, so that each glue layer 3a has a uniform thickness and is formed within the area surrounded by the four carrier alignment marks 21 and does not cover any of the carrier alignment marks 21.

In addition, the embossing mask 1, the camera mechanism 7, and the curing light source 8 can move synchronously through the displacement mechanism 5. The embossing mask 1 can also move relative to the camera mechanism 7 and the curing light source 8 along the height direction H, but the present invention is not limited thereto.

Accordingly, the group-type imprinting device 100 can use the camera mechanism 7 to align the multiple mask alignment marks 12 of the imprinting mask 1 with at least two carrier alignment marks 21 located next to any one of the adhesive layers 3a along the height direction H, and then drive the imprinting mask 1 to be imprinted along the height direction H through the displacement mechanism 5, so that the multiple adhesive layers 3a are imprinted in sequence and each forms a unit film layer 3. The curing light source 8 can be used to emit the curing light L toward the substrate 11 of the imprinted mask 1 to pass through the penetration block 111 and the imprinting layer 13, thereby curing the unit film layer 3.

As described above, the method for manufacturing the composite optical film or the composite embossing device 100 in this embodiment can manufacture the composite optical film 200 by means of the structure of the embossing mask 1 (e.g., the first outer edge 131 and the second outer edge 132 having irregular shapes and complementary shapes) and other components or steps matched therewith, so that the first gap G1 is formed by the first outer edge 31 and the second outer edge 32 having irregular shapes and complementary shapes with a specific size (e.g., not more than 50 microns) between any two adjacent unit film layers 3 of the composite optical film 200, so that the user cannot observe the first gap G1 with the naked eye. On the other hand, if the gap is defined by two edges of a regular shape, the size of the gap needs to be at least less than 5 microns to make it difficult to observe directly with the naked eye.

That is to say, as shown in FIG. 1, FIG. 7 and FIG. 8, the optical film set 200 provided in this embodiment has a different structure from the previous one, which is more conducive to production and manufacturing, and can effectively improve its application range. In other words, the embossing mask 1 or its manufacturing method provided in this embodiment can form the optical film set 200 in which the first gap G1 (and the second gap G2) cannot be observed by the naked eye with a lower manufacturing difficulty.

[Implementation Example 2]

Please refer to Figures 9 and 10, which are the second embodiment of the present invention. Since this embodiment is similar to the first embodiment, the similarities between the two embodiments will not be described in detail. The difference between this embodiment and the first embodiment is mainly that the unit pattern 130 of the imprint mask 1 in this embodiment (e.g., in the pattern forming step) is formed with a first pattern 130-1 and a second pattern 130-2 that are spaced apart from each other, so that each unit film layer 3 is also formed with two spaced sub-blocks 30.

In more detail, the first pattern 130-1 has the first outer edge 131 and a first inner edge 136 located at opposite sides (along the first direction D1), and the second pattern 130-2 has the second outer edge 132 and a second inner edge 137 located at opposite sides (along the first direction D1). The first inner edge 136 and the second inner edge 137 are both irregular and complementary in shape, and the first inner edge 136 and the second inner edge 137 are adjacent to each other and are separated by a long slit S13 of no more than 50 microns along the first direction D1. The long slit S13 is preferably no more than 30 microns and its long axis direction is not parallel to (e.g., substantially perpendicular to) the first direction D1.

The first pattern 130-1 has a first upper edge 133-1 and a first lower edge 134-1 located on opposite sides, both of which are irregular and complementary in shape. One end of the first upper edge 133-1 and the first lower edge 134-1 are connected to the two ends of the first inner edge 136, and the other ends of the first upper edge 133-1 and the first lower edge 134-1 are connected to the two ends of the first outer edge 131.

The second pattern 130-2 has a second upper edge 133-2 and a second lower edge 134-2 located on the opposite sides, both of which are irregular and complementary in shape. One end of the second upper edge 133-2 and the second lower edge 134-2 are connected to the two ends of the second inner edge 137, and the other ends of the second upper edge 133-2 and the second lower edge 134-2 are connected to the two ends of the second outer edge 132.

That is, the upper edge 133 is divided into the first upper edge 133-1 and the second upper edge 133-2 by the elongated slit S13 in this embodiment, and the lower edge 134 is divided into the first lower edge 134-1 and the second lower edge 134-2 by the elongated slit S13. In addition, in other embodiments not shown in the present invention, the unit pattern 130 can also be divided into more than three patterns according to needs.

Furthermore, in this embodiment, the first pattern 130-1 and the second pattern 130-2 each include a plurality of reflective embossed portions 135 arranged irregularly and having the same appearance, each of which has a plurality of reflective embossed areas (not shown in the figure) arranged in a matrix and reflecting in the same direction, and the reflective directions of the plurality of reflective embossed portions 135 are arranged irregularly.

The above is a description of the difference between the embossing layer 13 of this embodiment and the embodiment 1. The difference between the assembly type optical film 200 embossed by the embossing layer 13 of this embodiment (through the embossing curing step S300) and the embodiment 1 will be described as follows.

Specifically, each of the unit film layers 3 has a first inner edge 36 and a second inner edge 37 adjacent to each other, the first outer edge 31 and the second outer edge 32 located at opposite sides (along the first direction D1), and an upper edge 33 and a lower edge 34 located at the other opposite sides (along the second direction D2). The first inner edge 36 and the second inner edge 37 are both irregular and complementary in shape, and the first outer edge 31 and the second outer edge 32 are both irregular and complementary in shape, and the upper edge 33 and the lower edge 34 are both irregular and complementary in shape.

In each of the unit film layers 3, the first inner edge 36 and the second inner edge 37 are respectively formed by embossing the first inner edge 136 and the second inner edge 137 of the unit pattern 130, and are separated from each other by a set of plate gaps S3 of no more than 50 microns. The set of plate gaps S3 is preferably no more than 30 microns and its long axis direction is not parallel to (e.g., approximately perpendicular to) the first direction D1.

That is, the upper edge 33 and the lower edge 34 are each divided into two separate sections by the assembly slit S3 in this embodiment, and are respectively located in two sub-blocks 30, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the unit film layer 3 can also be divided into more than three sub-blocks 30 according to needs.

In addition, the specific structure of each unit film layer 3 (such as the reflective portion 35 or the multiple reflective areas contained therein), and the first gap G1 or the second gap G2 formed by any two adjacent unit film layers 3 along the first direction D1 or the second direction D2 are the same as those in the first embodiment and are not described in detail here. It should be noted that any of the assembly gaps S3 is connected to the two second gaps G2.

As described above, the assembly optical film manufacturing method or the assembly embossing device 100 in this embodiment can manufacture the assembly optical film 200 through the structure of the embossing mask 1 (e.g., the first inner edge 136 and the second inner edge 137 having irregular shapes and complementary shapes) and other matching components or steps, so that any of the unit film layers 3 of the assembly optical film 200 is formed with the assembly gap S3 that the user cannot observe with the naked eye, thereby facilitating the production of the embossing mask 1.

From another perspective, the assembly type optical film 200 provided in this embodiment has a different structure from the previous one, which is more conducive to the production and manufacturing of the embossing mask 1, and further helps its promotion and mass production. Furthermore, the embossing mask 1 or its manufacturing method provided in this embodiment can assemble the unit pattern 130 with the elongated assembly slit S13, thereby effectively reducing the manufacturing difficulty of the embossing mask 1, and can be used to form the unit film layer 3 where the assembly slit S3 cannot be observed with the naked eye.

The above disclosed contents are only the preferred feasible embodiments of the present invention, and do not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the contents of the specification and drawings of the present invention are included in the patent scope of the present invention.

1: Imprinting mask

11: Base material

111: Penetration block

112: Alignment block

113: Non-penetrating block

12: Mask alignment mark

13: Embossing layer

130:Unit pattern

130-1: The first pattern

130-2: Second pattern

131: First outer edge

132: Second outer edge

133: Upper edge

133-1: First upper edge

133-2: Second upper edge

134: Lower edge

134-1: First lower edge

134-2: Second lower edge

135: Reflective embossing unit

136: First inner edge

137: Second inner edge

S100: Preparation steps

S13: Long-shaped assembly seam

D1: First direction

D2: Second direction

H: height direction

M: Mask

UV: ultraviolet light exposure

Claims (10)

A method for manufacturing an embossing mask, comprising: A pre-step: providing a substrate having a penetration block, an annular alignment block surrounding the penetration block, and an annular non-penetrating block surrounding the alignment block; wherein the substrate is only penetrated by a curing light provided by the penetration block, and the alignment block can be penetrated by an alignment light, the wavelength of the curing light is different from the wavelength of the alignment light; A mark forming step: forming a plurality of mask alignment marks spaced apart from each other in the alignment block of the substrate; and A pattern forming step: forming an embossing layer in the penetration area, and the embossing layer can allow the curing light to pass through and has on the surface away from the substrate: a first pattern, having a first inner edge and a first outer edge respectively located on opposite sides; and a second pattern, having a second inner edge and a second outer edge respectively located on opposite sides; wherein the first inner edge and the second inner edge are separated from each other by a long slit of no more than 50 micrometers (μm), and the first inner edge and the second inner edge are both irregular and complementary in shape. The method for manufacturing an imprinting mask as described in claim 1, wherein, in the preceding step, the curing light is an ultraviolet light, and the alignment light is an infrared light. The method for manufacturing an imprinting mask as described in claim 1, wherein the alignment block is in the shape of a square ring; in the mark forming step, a plurality of the mask alignment marks are respectively formed at a plurality of corners of the alignment block. The method for manufacturing an embossing mask as described in claim 1, wherein, in the pattern forming step, the first outer edge and the second outer edge are respectively located on opposite sides of the embossing layer, and the first outer edge and the second outer edge are both irregular and complementary in shape. A method for manufacturing an embossing mask as described in claim 4, wherein, in the pattern forming step, the first pattern has a first upper edge and a first lower edge located on two opposite sides, both of which are irregular and have shapes that complement each other; the second pattern has a second upper edge and a second lower edge located on two opposite sides, both of which are irregular and have shapes that complement each other. A method for manufacturing an embossing mask as described in claim 5, wherein one end of the first upper edge and the first lower edge are respectively connected to the two ends of the first inner edge, and the other ends of the first upper edge and the first lower edge are respectively connected to the two ends of the first outer edge; one end of the second upper edge and the second lower edge are respectively connected to the two ends of the second inner edge, and the other ends of the second upper edge and the second lower edge are respectively connected to the two ends of the second outer edge. A method for manufacturing an embossing mask as described in claim 1, wherein, in the pattern forming step, the first pattern and the second pattern each include a plurality of irregularly arranged reflective embossing portions having the same appearance. A method for manufacturing an embossed mask as described in claim 7, wherein, in the pattern forming step, in any one of the first pattern and the second pattern, each of the reflective embossed portions has a plurality of reflective embossed areas arranged in a matrix, which reflect in the same direction, and the reflective directions of the plurality of reflective embossed portions are irregularly arranged. The method for manufacturing an embossing mask as described in claim 1, wherein, in the pattern forming step, two ends of the first outer edge and two ends of the second outer edge are respectively adjacent to a plurality of the mask alignment marks. A method for manufacturing an embossing mask as described in claim 1, wherein, in the pattern forming step, the embossing layer is formed by irradiating a photoresist layer with an exposure ultraviolet ray via a mask or interference, and a preset exposure wavelength of the exposure ultraviolet ray falls outside a preset light curing band of the curing light, and the elongated assembly slit is not greater than 30 microns.