TWI835675B - Automatic probe card pick-and-place device and method of controlling the same - Google Patents

Abstract

An automatic probe card pick-and-place device includes a transport vehicle, at least one accommodating rack shelf configured to accommodate a probe card, a lap joint location adjusting module, a pick-and-place assembly configured to pick-and-place a probe card, a plurality of telescopic forks, and a controlling element. The controlling element is electrically or communicatively connected to the transport vehicle, the lap joint location adjusting module, the telescopic forks, and the pick-and-place assembly. The controlling element is configured to: control the transport vehicle to move to a targeted location adjacent to a prober; drive the lap joint location adjusting module to calibrate a relative location of the at least one accommodating rack shelf and the pick-and-place assembly relative to the prober; actuate the telescopic forks to move the at least one accommodating rack shelf and the pick-and-place assembly forward to or away from the prober; and actuate the pick-and-place assembly to pick-and-place the probe card accommodated in the at least one accommodating rack shelf or a carrying platform of the prober.

Description

Automatic probe card picking and placing device and control method thereof

The present disclosure relates to an automated probe card picking and placing device and a control method thereof.

At present, various packaging and testing factories and test equipment manufacturers need to manually transport probe cards (Probe Cards) and load and unload probe cards into probe test machines (Probers). However, this took a lot of time and engineering manpower. In addition, since the operating proficiency of the probe card installers varies, improper operation may easily cause damage to the probe card.

Therefore, how to propose an automated probe card pick-and-place device and its control method to reduce the risk of manual installation of probe cards is one of the issues that the industry is currently eager to invest in research and development resources to solve.

In view of this, one purpose of the present disclosure is to provide an automated probe card pick-and-place device and a control method thereof that can solve the above problems.

In order to achieve the above object, according to an embodiment of the present disclosure, an automatic probe card pick-and-place device includes a transportation carrier, at least one accommodation shelf configured to accommodate probe cards, an overlapping position adjustment module, and a pick-and-place component. Configured to access probe cards, several telescoping members, and control components. At least one accommodation shelf is located above the transport vehicle. At least one accommodation shelf is configured to accommodate the probe card. The overlapping position adjustment module is disposed between at least one accommodation shelf and the transport vehicle. The pick-and-place component is arranged above at least one accommodation shelf. The pick and place component is configured to pick and place probe cards. The telescopic component is connected in at least one accommodation shelf and between the pick-and-place component and at least one accommodation shelf. The control element is electrically or communicatively connected to the transportation vehicle, the overlapping position adjustment module, the telescopic part, and the pick-and-place component. The control element is configured to: control the transport vehicle to move to a target position adjacent to the needle test machine; drive the overlap position adjustment module to calibrate the relative position of at least one accommodation shelf and the pick-and-place component relative to the needle test machine; actuate the telescopic member To move at least one accommodating shelf and the pick-and-place component toward and away from the probe test machine; and activate the pick-and-place component to pick up and place the probe card accommodated in at least one accommodating shelf or the stage of the probe test machine.

In one or more embodiments of the present disclosure, at least one accommodation shelf further includes a first accommodation shelf and a second accommodation shelf. The first accommodation shelf is arranged on the overlapping position adjustment module. The second accommodating shelf is movably located between the first accommodating shelf and the access component.

In one or more embodiments of the present disclosure, the telescopic member is further connected between the first accommodation layer and the second accommodation layer and actuates the second accommodation layer to move toward and away from the first accommodation layer. Move. The second accommodation layer and the first accommodation layer are separated from each other in a direction parallel to the actuation direction of the telescopic component.

In one or more embodiments of the present disclosure, the overlapping position adjustment module includes a lateral displacement component, and the lateral displacement component actuates at least one accommodation shelf to move in a direction perpendicular to the actuating direction of the telescopic component.

In one or more embodiments of the present disclosure, the overlapping position adjustment module includes a horizontal adjustment component, and the horizontal adjustment component actuates at least one accommodation shelf to swing relative to the transport vehicle.

In one or more embodiments of the present disclosure, the level adjustment component further includes a base, a movable part, at least one rolling element, and an actuator. The movable part is connected to the base. The movable part includes a connecting plate connected to at least one accommodation shelf and a pendulum block connected to the connecting plate. The pendulum block has an arc chute. At least one rolling element is pivotally connected to the base and connected to the arc-shaped slide groove, so that the pendulum block is slidably connected to the base. The actuator actuates the movable part to swing the movable part relative to the base.

In one or more embodiments of the present disclosure, the automated probe card pick-and-place device further includes a plurality of sensing devices. The sensing device is configured to emit and sense light.

In one or more embodiments of the present disclosure, the overlap position adjustment module includes a rotation adjustment component. The rotation adjustment component causes at least one accommodation shelf to rotate with the center of the rotation adjustment component as the center of the circle.

In one or more embodiments of the present disclosure, the automated probe card pick-and-place device further includes at least a first positioning shaft disposed on the telescopic member. At least one first positioning shaft is configured to be combined with the positioning sleeve of the needle measuring machine.

In one or more embodiments of the present disclosure, the overlapping position adjustment module includes a plurality of floating components connected to at least one accommodation shelf. Each of the floating components contains several sliders stacked on top of each other. The slider includes a first track extending along a first direction and a second track extending along a second direction perpendicular to the first direction.

In one or more embodiments of the present disclosure, the overlapping position adjustment module further includes a plurality of locking structures. The locking structure is configured to fix at least one accommodating shelf to the overlapping position adjustment module and is configured to make at least one accommodating shelf movable relative to the overlapping position adjusting module.

In one or more embodiments of the present disclosure, each of the locking structures includes a hole piece connected to at least one receiving shelf and a hole disposed on the overlapping position adjustment module and corresponding to the hole piece. Second positioning axis.

In order to achieve the above object, according to an embodiment of the present disclosure, a control method is used to automate a probe card pick-and-place device. The automated probe card pick-and-place device includes a transport carrier, a first storage shelf and a second storage shelf located above the transport carrier, connected to the overlapping position between the first storage shelf and the transport vehicle. The adjustment module, the pick-and-place component located above the second accommodating shelf, and the pick-and-place component connected between the first accommodating shelf and the second accommodating shelf, and between the second accommodating shelf and the pick-and-place component. Several telescopic parts. The control method includes: controlling the transport vehicle to move to a target position adjacent to the needle test machine; driving the overlap position adjustment module to calibrate the relative position of the first accommodation layer, the second accommodation layer, and the pick-and-place component relative to the needle test machine. position; actuating the telescopic member to move the second accommodation shelf and the pick-and-place assembly so that the second accommodation shelf and the first accommodation shelf are separated from each other in a direction parallel to the actuation direction of the telescopic member; and actuating the take-out assembly The component is placed to pick up and place the probe card accommodated in the first storage shelf, the second storage shelf or the carrier of the probe test machine.

In one or more embodiments of the present disclosure, the step of actuating the telescopic member to move the second accommodation shelf and the pick-and-place assembly causes the pick-and-place assembly and the second accommodation shelf to separate from each other.

In one or more embodiments of the present disclosure, the step of driving the overlapping position adjustment module to calibrate the relative positions of the first accommodation shelf, the second accommodation shelf and the pick-and-place component with respect to the probe test machine further includes: Activate the horizontal adjustment component of the overlap position adjustment module so that the load-bearing surface of the first accommodation shelf and the load-bearing surface of the second accommodation shelf connected to the horizontal adjustment component are parallel to the top surface of the needle measuring machine; actuate The rotation adjustment component of the overlapping position adjustment module causes the first accommodation shelf, the second accommodation shelf and the pick-and-place component connected to the rotation adjustment component to rotate with the center of the rotation adjustment component as the center of the circle; and actuating the overlap The lateral displacement component of the position adjustment module causes the first accommodation shelf, the second accommodation shelf and the pick-and-place component connected to the lateral displacement component to move laterally relative to the needle measuring machine.

In one or more embodiments of the present disclosure, the level adjustment component further includes a connecting plate connecting the first accommodation shelf, the second accommodation shelf, and the pick-and-place component. The step of actuating the horizontal adjustment component of the overlap position adjustment module makes the connecting plate parallel to the top surface of the needle measuring machine.

In one or more embodiments of the present disclosure, the automated probe card pick-and-place device further includes two sensing devices configured to emit and sense light. The needle test machine further includes two reference positioning plates disposed on the top surface of the needle test machine and corresponding to the two sensing devices. The step of driving the overlapping position adjustment module to calibrate the relative positions of the first accommodation shelf, the second accommodation shelf, and the pick-and-place component with respect to the needle measuring machine further includes: driving the two sensing devices to emit light toward the two reference positioning plates. .

In one or more embodiments of the present disclosure, the step of activating the rotation adjustment component of the overlap position adjustment module causes the two sensing devices to sense the same distance value of the light reflected from the two reference positioning plates.

In one or more embodiments of the present disclosure, the step of activating the lateral displacement component of the overlap position adjustment module causes the light emitted by the two sensing devices to be respectively aligned with the two positioning rods of the two reference positioning plates.

In one or more embodiments of the present disclosure, the automated probe card pick-and-place device further includes at least a first positioning shaft disposed on the telescopic member. The probing machine further includes at least one positioning sleeve corresponding to at least one first positioning axis. The step of actuating the telescopic member to move the second accommodation shelf and the pick-and-place assembly causes at least one first positioning shaft to be combined with at least one positioning sleeve.

In one or more embodiments of the present disclosure, the overlapping position adjustment module further includes a plurality of locking structures. The step of actuating the telescopic component to move the second accommodation shelf and the pick-and-place assembly makes the first accommodation shelf fixed to the overlapping position adjustment module through the locking structure or movable relative to the overlapping position adjustment module.

In one or more embodiments of the present disclosure, the step of actuating the telescopic member to move the second accommodation shelf and the pick-and-place assembly is such that when the second accommodation shelf and the pick-and-place assembly move toward the stage of the probe test machine , the first accommodation shelf is movable relative to the overlapping position adjustment module.

In one or more embodiments of the present disclosure, the step of actuating the telescopic member to move the second accommodation shelf and the pick-and-place assembly is such that when the second accommodation shelf and the pick-and-place assembly move away from the stage of the probe machine At this time, the first accommodation shelf is fixed on the overlapping position adjustment module.

In one or more embodiments of the present disclosure, the step of actuating the pick-and-place component takes the probe card accommodated in the carrier and places the probe card in the first receiving shelf.

In one or more embodiments of the present disclosure, the step of activating the pick-and-place component takes the probe card accommodated in the second accommodation shelf and places the probe card in the carrier.

In one or more embodiments of the present disclosure, the carrier accommodates the first probe card, and the second accommodation shelf accommodates the second probe card. The step of actuating the pick-and-place assembly further includes: taking the first probe card accommodated in the carrier and placing the first probe card in the first accommodation shelf; and placing the first probe card in the first accommodation shelf. After being placed in the first accommodation shelf, take the second probe card accommodated in the second accommodation shelf and place the second probe card in the carrier.

To sum up, in the automated probe card picking and placing device and its control method disclosed in the present disclosure, since the overlapping position adjustment module is equipped with a sensing device, and the telescopic part is equipped with a floating component, automatic probe card picking and placing can be achieved The device and the probe tester can be precisely connected to facilitate the automatic loading and unloading of the probe card. In the automated probe card pick-and-place device and its control method of the present disclosure, since the first storage shelf, the second storage shelf, and the pick-and-place component can achieve horizontal separation through the actuation of the telescopic member, the automated probe card The needle card pick-and-place device can complete the replacement of new probe cards and old probe cards at one time, or can install several new probe cards and recycle several old probe cards at the same time. In the disclosed automated probe card pick-and-place device and its control method, the automated probe card pick-and-place device can be used with a self-made Front Opening Shipping Box (FOSB) loading and unloading vehicle and an under-development smart warehousing vehicle. system to build a smart factory of cyber-physical (CP) system, thereby realizing comprehensive automation of the probe card loading and unloading system.

The above is only used to describe the problems to be solved by the present disclosure, the technical means to solve the problems, the effects thereof, etc. The specific details of the present disclosure will be introduced in detail in the following implementation modes and related drawings.

A plurality of implementation manners of the present disclosure will be disclosed below with drawings. For clarity of explanation, many practical details will be explained together in the following description. However, it should be understood that these practical details should not be used to limit the disclosure. That is to say, in some implementations of the present disclosure, these practical details are not necessary. In addition, for the sake of simplifying the drawings, some commonly used structures and components will be illustrated in a simple schematic manner in the drawings. The same reference numbers will be used throughout the drawings to refer to the same or similar elements.

The structure and function of each component included in the automated probe card pick-and-place device 100 of this embodiment, as well as the connection relationship between each component, will be introduced in detail below.

Please refer to picture 1. Figure 1 is a perspective view of an automated probe card pick-and-place device 100 according to an embodiment of the present disclosure. In this embodiment, the automated probe card pick-and-place device 100 includes a transport carrier 110, an overlapping position adjustment module 120, at least one accommodation shelf 130, and a pick-and-place component 140. The overlapping position adjustment module 120 , the accommodation shelf 130 and the pick-and-place component 140 are provided on the transport vehicle 110 . As shown in FIG. 1 , the transport vehicle 110 equipped with the overlapping position adjustment module 120 , the storage shelf 130 and the pick-and-place component 140 can follow the route RT to reach the target location. The overlapping position adjustment module 120 is provided on the transportation vehicle 110 . The overlapping position adjustment module 120 is configured to adjust the positions of the accommodating shelf 130 and the pick-and-place assembly 140 in space. As shown in FIG. 1 , the storage shelf 130 is disposed above the transport carrier 110 and configured to accommodate the probe card PC. Specifically, the accommodating shelf 130 is disposed on the overlapping position adjustment module 120 . In other words, the overlapping position adjusting module 120 is disposed between the accommodating shelf 130 and the transport vehicle 110 . The pick-and-place assembly 140 is movably disposed above the accommodating shelf 130 and configured to pick and place the probe card PC. In some embodiments, the overlap position adjustment module 120 further includes a horizontal adjustment component 122 , a rotation adjustment component 124 , a lifting component 126 , a lateral displacement component 128 and a floating component 129 . In some embodiments, the accommodating shelf 130 includes a first accommodating shelf 132 and a second accommodating shelf 134 . However, the present disclosure is not intended to limit the number of accommodating shelves 130 , that is, the present disclosure may include any number of accommodating shelves 130 according to requirements. In some embodiments, as shown in FIG. 1 , the first accommodation shelf 132 is disposed on the overlapping position adjustment module 120 , and the second accommodation shelf 134 is movably located on the first accommodation shelf 132 between the pick and place assembly 140. The detailed structure, function and connection relationship between the above components will be described below.

In some embodiments, the transportation vehicle 110 may be, for example, an automated guided vehicle (AGV) or other automated powertrain.

In some embodiments, the probe card PC is a media component, such as an integrated circuit used to test a wafer (not shown).

Please continue to refer to Figure 1. As shown in FIG. 1 , the automated probe card picking and placing device 100 further includes a plurality of telescopic members 150 . The telescopic member 150 is connected in the accommodation shelf 130 and between the pick-and-place assembly 140 and the accommodation shelf 130 . In some embodiments, as shown in FIG. 1 , the telescopic member 150 includes a first telescopic member 152 and a second telescopic member 154 . The first telescopic member 152 is connected between the first receiving shelf 132 and the second receiving shelf 134 and is configured to move along the actuation direction AD. The second telescopic member 154 is connected between the second accommodation shelf 134 and the pick-and-place assembly 140 and is configured to move along the actuation direction AD. In some embodiments, the actuation direction AD is parallel to the first direction (eg, direction X).

Please continue to refer to Figure 1. As shown in FIG. 1 , the automated probe card pick-and-place device 100 further includes a sensing device 160 . The sensing device 160 is configured to emit and sense light L. In some embodiments, the light L may be, for example, laser light (Laser) or other suitable light types. The sensing device 160 configured to emit and sense light L is used for distance measurement, which will be described in more detail below. In some embodiments, the automated probe card pick and place device 100 may include one, two, or more than two sensing devices 160 . The present disclosure is not intended to be limited in terms of the number of sensing devices 160 .

Please continue to refer to Figure 1. As shown in FIG. 1 , the automated probe card picking and placing device 100 further includes a first positioning shaft 170 . The first positioning shaft 170 is provided on the telescopic member 150 . In some embodiments, the first positioning shaft 170 is provided on the first telescopic member 152 . The first positioning shaft 170 is configured to combine the automated probe card pick-and-place device 100 with a probe test machine (not shown in Figure 1 ). This is explained in more detail below.

In some embodiments, the telescopic member 150 may be, for example, a telescopic fork or other similar slide rail assembly. In some embodiments, the telescopic member 150 can also be used with a pulley set to improve mechanical efficiency and save labor.

In some embodiments, the sensing device 160 may be, for example, a laser sensor or other similar optical sensor.

Please refer to Picture 2 and Picture 3. Figure 2 is a functional block diagram of an automated probe card pick-and-place device 100 according to an embodiment of the present disclosure. FIG. 3 is a flow chart of a control method CM of the automated probe card pick-and-place device 100 according to an embodiment of the present disclosure. As shown in Figure 2, the automated probe card picking and placing device 100 further includes a control element CE. The control element CE is electrically or communicatively connected to the transport vehicle 110, the overlapping position adjustment module 120, the pick-and-place component 140 and the telescopic member 150. Specifically, the control method CM of the automated probe card picking and placing device 100 is controlled by the control element CE. As shown in FIG. 3 , the control method CM of the automated probe card pick-and-place device 100 includes step S10 , step S12 , step S14 and step S16 . To better understand step S10, please refer to Figure 4. To better understand step S12, please refer to Figures 5 to 11. To better understand step S14, please refer to Figures 12 to 20. To better understand step S16, please refer to Figures 21 to 22.

Step S10, step S12, step S14 and step S16 of the control method CM of the automated probe card picking and placing device 100 will be described in detail below.

Step S10: Control the transport vehicle 110 to move to a target position adjacent to the needle testing machine 200.

Please refer to Figure 4. FIG. 4 is a schematic diagram of an automated probe card pick-and-place device 100 and a probe test machine 200 according to an embodiment of the present disclosure. For simplicity of explanation, some components of the automated probe card picking and placing device 100 are omitted. In this embodiment, as shown in Figures 1, 2 and 4, the control element CE controls the automated probe card pick-and-place device 100 to move to the target position. Specifically, the control element CE can control the transportation vehicle 110 to reach the target location along the route RT as shown in FIG. 1 . For example, as shown in FIG. 4 , the target position is a position adjacent to the probing machine 200 . As shown in FIG. 4 , the probing machine 200 includes a stage 230 , a reference positioning plate 260 and a positioning sleeve 270 , and the probing machine 200 has a top surface 200 a. The carrier 230 is disposed on the top surface 200a. In some embodiments, the carrier 230 is configured to carry the wafer and accommodate the probe card PC. The reference positioning plate 260 is configured to receive the light L from the sensing device 160 . The positioning sleeve 270 is configured to couple with the first positioning shaft 170 of the automated probe card pick-and-place device 100 . This is explained in more detail below.

In some embodiments, the probing machine 200 may be, for example, a wafer probing machine (Prober) that carries a wafer and performs electrical testing on the integrated circuit of the wafer through a probe card PC.

Step S12: Drive the overlap position adjustment module 120 to calibrate the relative positions of the first accommodation shelf 132, the second accommodation shelf 134, and the pick-and-place component 140 with respect to the needle measuring machine 200.

In this embodiment, step S12 is executed before step S14, and step S12 is a pre-step of step S14. Step S12 is performed to adjust the positions of the first accommodating shelf 132 , the second accommodating shelf 134 and the pick-and-place assembly 140 in the space, thereby calibrating the first accommodating shelf 132 and the second accommodating shelf 134 and the purpose of the relative position of the pick and place assembly 140 relative to the probe test machine 200 . In detail, the control element CE executes step S12 to ensure that the first accommodating shelf 132 , the second accommodating shelf 134 and the pick-and-place assembly 140 are aligned in three axes (eg, direction X, direction Y, and direction Z). of alignment.

Please refer to Figure 5. FIG. 5 is a detailed flow chart of step S12 of the control method CM of the automated probe card pick-and-place device 100 according to an embodiment of the present disclosure. In this embodiment, step S12 further includes step S121, step S122, step S123 and step S124. In order to better understand step S121, please refer to Figure 6 and Figure 7 . In order to better understand step S122, please refer to Figure 8 and Figure 9 . To better understand step S123, please refer to Figure 10. To better understand step S124, please refer to Figure 11.

Steps S121, S122, S123 and S124 will be described in detail below.

Step S121: drive the two sensing devices 160 to emit light L toward the two reference positioning plates 260.

Please refer to Figure 6. FIG. 6 is a partial enlarged view of the automated probe card pick-and-place device 100 and the probe test machine 200 according to an embodiment of the present disclosure. In this embodiment, after the control element CE performs step S10 , the control element CE controls the sensing device 160 to emit light L toward the reference positioning plate 260 . Then, when the light L reaches the reference positioning plate 260 , the light L is reflected by the reference positioning plate 260 and then sensed by the sensing device 160 . Thereby, the control element CE can measure the distance value (The Value of Distance) between the sensing device 160 and the reference positioning plate 260 through the sensing device 160 . In this embodiment, the automated probe card pick-and-place device 100 actually includes two sensing devices 160 (as shown in FIG. 13 ), and the two sensing devices 160 are located on both sides of the automated probe card pick-and-place device 100 . side, therefore, the probing machine 200 also includes two reference positioning plates 260 accordingly. In this case, the control element CE can use the two sensing devices 160 located on both sides to measure the distance between the sensing device 160 on one side and the reference positioning plate 260 and between the sensing device 160 on the other side and the reference positioning plate 260 . The two distance values between the positioning plates 260 are used as the basis for calibration.

Please refer to Figure 7. FIG. 7 is a side view of the automated probe card pick-and-place device 100 and the probe test machine 200 according to an embodiment of the present disclosure. In this embodiment, as shown in FIG. 7 , the reference positioning plate 260 includes a positioning rod 262 . In some embodiments, the positioning rod 262 is elongated in a third direction (eg, direction Z), and the positioning rod 262 protrudes from the reference positioning plate 260 along a second direction (eg, direction Y). The setting of the positioning rod 262 helps the control element CE determine whether the operation of step S12 is completed. For example, when the light L emitted by the sensing device 160 senses the positioning rod 262, the distance value measured by the control element CE becomes smaller, based on which the first accommodation shelf 132 and the second accommodation layer can be determined. The relative positions of the rack 134 and the pick-and-place assembly 140 relative to the probing machine 200 have reached the reference point.

In some embodiments, the distance between the two positioning rods 262 of the two reference positioning plates 260 is equal to the distance between the two sensing devices 160 .

Step S122: Activate the horizontal adjustment component 122 of the overlapping position adjustment module 120 so that the bearing surface 132a of the first accommodation shelf 132 and the bearing surface 134a of the second accommodation shelf 134 connected to the horizontal adjustment component 122 are parallel to each other. on the top surface 200a of the needle measuring machine 200.

Please refer to Figure 8. FIG. 8 is a perspective view of the level adjustment component 122 according to an embodiment of the present disclosure. In this embodiment, the horizontal adjustment component 122 includes a first horizontal adjustment component 122A and a second horizontal adjustment component 122B. The first level adjustment component 122A and the second level adjustment component 122B are configured to adjust the leveling state of the first accommodation shelf 132 , the second accommodation shelf 134 and the pick-and-place assembly 140 . As shown in FIG. 8 , the first level adjustment component 122A includes a base 1221A and a first movable part MP1. The first movable part MP1 is connected to the base 1221A. The first movable part MP1 includes a connecting plate 1223A and two pendulum blocks 1222A connected to the connecting plate 1223A. The first movable part MP1 swings relative to the base 1221A. As shown in FIG. 8 , the second level adjustment component 122B includes a base 1221B and a second movable part MP2. The second movable part MP2 is connected to the base 1221B. The base 1221B is connected to the connecting plate 1223A. The second movable part MP2 includes a connecting plate 1223B connected to the first accommodation shelf 132 and two swing blocks 1222B connected to the connecting plate 1223B. The second movable part MP2 swings relative to the base 1221B.

For example, as shown in FIG. 8 , the first movable part MP1 swings relative to the base 1221A along an axis parallel to the direction Y, and the second movable part MP2 faces relative to the base 1221A along an axis parallel to the direction X. Swing on the base 1221B. Thereby, the control element CE can adjust the leveling state of the first accommodation shelf 132 , the second accommodation shelf 134 and the pick-and-place assembly 140 by actuating the level adjustment assembly 122 . Specifically, as shown in Figures 1, 4, 8, and 12, when the control element CE performs step S122, since the connection plate 1223B is connected to the first accommodation shelf 132, the connection plate 1223A can be And the connecting plate 1223B is parallel to the top surface 200a of the needle measuring machine 200, so that the bearing surface 132a of the first accommodation shelf 132 and the bearing surface 134a of the second accommodation shelf 134 connected to the horizontal adjustment assembly 122 are both parallel to The top surface 200a of the probing machine 200.

Please refer to Figure 9. FIG. 9 is a partial enlarged view of the horizontal adjustment component 122 according to an embodiment of the present disclosure. Figure 9 shows a more detailed structure of the horizontal adjustment component 122. In order to explain more specifically how the horizontal adjustment component 122 operates, the second horizontal adjustment component 122B is taken as an example for description here. It should be noted that the components included in the first level adjustment component 122A are similar to the components included in the second level adjustment component 122B, so the first level adjustment component 122A will not be described again here. As shown in FIG. 9 , the two pendulum blocks 1222B of the second level adjustment assembly 122B have arc-shaped slide grooves 1224B, and the second level adjustment assembly 122B further includes at least one rolling element 1225B and an actuator 1226 . The rolling member 1225B is pivotally connected to the base 1221B and connected to the arc-shaped slide groove 1224B, so that the swing block 1222B is slidably connected to the base 1221B. The actuator 1226 actuates the second movable part MP2 to swing the second movable part MP2 relative to the base 1221B.

Step S123: Activate the rotation adjustment component 124 of the overlapping position adjustment module 120, so that the first accommodation shelf 132, the second accommodation shelf 134 and the pick-and-place assembly 140 connected to the rotation adjustment assembly 124 rotate the adjustment assembly. The central CTR of 124 is the center of circle rotation.

Please refer to Figure 10. FIG. 10 is a perspective view of the rotation adjustment component 124 and the lifting component 126 according to an embodiment of the present disclosure. In this embodiment, the rotation adjustment assembly 124 is configured to drive the first accommodation shelf 132 , the second accommodation shelf 134 and the pick-and-place assembly 140 to rotate with the center CTR of the rotation adjustment assembly 124 as the center of the circle. Specifically, as shown in Figures 1 and 10, since the rotation adjustment component 124 is connected to the first accommodation shelf 132 through the horizontal adjustment component 122, the first accommodation shelf 132 and the second accommodation layer The rack 134 and the pick-and-place assembly 140 can be simultaneously rotated by the rotation adjustment assembly 124 along an axis parallel to, for example, the direction Z and passing through the central CTR. As shown in Figure 10, the rotation adjustment assembly 124 includes a movable platform 1242, a movable column 1243, a bearing ring 1244 and an actuator 1246. The movable columns 1243 are connected to the four corners of the movable platform 1242, and the movable columns 1243 are elongated in a third direction (eg, direction Z). The bearing ring 1244 is disposed on the movable platform 1242 and rotates with the central CTR as the center. The actuator 1246 is connected to the bearing ring 1244, and the actuator 1246 is configured to reciprocate under the control of the control element CE to drive the bearing ring 1244 to rotate.

Please continue to refer to Figure 10. The lifting component 126 is connected to the rotation adjustment component 124 . In this embodiment, the lifting assembly 126 is configured to drive the first accommodation shelf 132 , the second accommodation shelf 134 and the pick-and-place assembly 140 to rise and fall. Specifically, as shown in Figures 1 and 10, since the lifting component 126 is connected to the first accommodation shelf 132 through the rotation adjustment component 124 and the horizontal adjustment component 122, the first accommodation shelf 132, the The two accommodating shelves 134 and the pick-and-place assembly 140 can be raised and lowered along the third direction (eg, direction Z) at the same time through the lifting assembly 126 . As shown in FIG. 10 , the lifting assembly 126 includes a base plate 1262 , a cylinder 1263 and an actuator 1266 . The bottom plate 1262 extends parallel to the movable platform 1242. The cylinders 1263 are disposed at the four corners of the bottom plate 1262, and the cylinders 1263 are disposed corresponding to the movable columns 1243 and are reciprocally connected to the movable columns 1243. In other words, the lifting component 126 is connected to the rotation adjustment component 124 through the connection between the cylinder 1263 and the movable column 1243 . The actuator 1266 is disposed on the bottom plate 1262, and one end of the actuator 1266 is fixed on the bottom plate 1262, and the other end of the actuator 1266 is in contact with the movable platform 1242. In some embodiments, the actuator 1266 is configured to be controlled by the control element CE to actuate the rotation adjustment assembly 124 to rise and fall, so that the first accommodation shelf 132 , the second accommodation shelf 134 and the pick-and-place assembly 140 can At the same time, it rises and falls along the third direction (for example, direction Z) to achieve the purpose of adjusting the height.

In this embodiment, the control element CE uses two sensing devices 160 to complete step S123. As shown in Figures 1, 7 and 10, when the control element CE executes step S123, the control element CE not only actuates the rotation adjustment component 124, but also simultaneously monitors the two sensing devices 160 to sense reflections from two Two distance values of the light L of the reference positioning plate 260 . When the control element CE determines that the two distance values are different, the control element CE activates the actuator 1246 of the rotation adjustment assembly 124 to rotate the bearing ring 1244 to simultaneously drive the first accommodation shelf 132 and the second accommodation shelf 134 and the pick-and-place component 140 rotate with the center CTR of the rotation adjustment component 124 as the center of the circle until the two distance values are the same. When the control element CE determines that the two distance values are the same, the control element CE controls the actuator 1246 to stop operating to stop the rotation of the bearing ring 1244 to complete the operation of step S123.

Step S124: Activate the lateral displacement component 128 of the overlapping position adjustment module 120, so that the first accommodation shelf 132, the second accommodation shelf 134 and the pick-and-place component 140 connected to the lateral displacement component 128 are relative to the needle probe. Machine 200 moves sideways.

Please refer to Figure 11. FIG. 11 is a perspective view of a lateral displacement component 128 according to an embodiment of the present disclosure. In this embodiment, the lateral displacement component 128 is configured to actuate the first accommodation shelf 132 , the second accommodation shelf 134 and the pick-and-place assembly 140 to move along a direction perpendicular to the actuation direction AD. Specifically, as shown in Figures 1 and 11, since the lateral displacement component 128 is connected to the first accommodation shelf 132 through the lifting component 126, the rotation adjustment component 124 and the horizontal adjustment component 122, the first accommodation The shelf 132 , the second receiving shelf 134 and the pick-and-place assembly 140 can simultaneously move laterally relative to the needle testing machine 200 by the lateral displacement assembly 128 along the transverse direction LD perpendicular to the actuation direction AD. As shown in Figure 11, the lateral displacement assembly 128 includes a base 1282, two side walls 1283, a linear rail 1284 and an actuator 1286. As shown in FIGS. 1 , 10 and 11 , the base 1282 is connected between the transportation vehicle 110 and the lifting assembly 126 . Two side walls 1283 are provided at both ends of the base 1282 along the transverse direction LD. The wire rail 1284 is disposed on the base 1282, and the wire rail 1284 elongates and extends along the transverse direction LD. The actuator 1286 is connected to the bottom plate 1262 of the lifting assembly 126, and the actuator 1286 is configured to reciprocate under the control of the control element CE to drive the components above the lifting assembly 126 to move laterally relative to the probe test machine 200.

In this embodiment, the control element CE uses two sensing devices 160 to complete step S124. As shown in Figures 1, 7 and 11, when the control element CE performs step S124, the control element CE not only actuates the lateral displacement component 128, but also simultaneously monitors whether the light L emitted by the two sensing devices 160 is different. Align the two positioning rods 262 of the two reference positioning plates 260 . When the control element CE determines that the light L emitted by the two sensing devices 160 is not aligned with the two positioning rods 262, the control element CE activates the actuator 1286 of the lateral displacement assembly 128 to simultaneously drive the first accommodation shelf 132, The second accommodating shelf 134 and the pick-and-place assembly 140 move laterally relative to the needle testing machine 200 . When the control element CE determines that the light L emitted by the two sensing devices 160 is aligned with the two positioning rods 262 respectively, the control element CE controls the actuator 1286 to stop operating to stop the movement of the components above the lifting assembly 126 to complete step S124 operation.

Step S14: Activate the telescopic component 150 to move the second accommodation shelf 134 and the pick-and-place assembly 140 so that the second accommodation shelf 134 and the first accommodation shelf 132 are parallel to the actuation direction AD of the telescopic component 150 separated from each other.

Please refer to Figure 12. FIG. 12 is a schematic diagram of the first storage shelf 132 , the second storage shelf 134 and the pick-and-place component 140 being horizontally separated according to an embodiment of the present disclosure. After the control element CE executes step S12, step S14 is executed. In this embodiment, the control element CE is configured to activate the telescopic member 150 to move the second accommodation shelf 134 and the pick-and-place assembly 140 to unfold the automated probe card pick-and-place device 100, as shown in FIG. 12 . As shown in Figures 2 and 12, when the control element CE actuates the first telescopic part 152 and the second telescopic part 154 to move the second accommodation shelf 134 and the pick-and-place assembly 140, the first accommodation layer The rack 132, the second accommodation shelf 134 and the pick-and-place assembly 140 are separated from each other in the actuation direction AD (ie, horizontally separated).

Please refer to Figure 13. FIG. 13 is an oblique top view of the automated probe card pick-and-place device 100 and the probe test machine 200 according to an embodiment of the present disclosure. Figure 13 shows a more detailed structure of the automated probe card pick-and-place device 100 and the probe test machine 200. As shown in FIG. 13 , the automated probe card pick-and-place device 100 includes two sensing devices 160 on both sides, and the probe machine 200 includes a reference positioning plate 260 corresponding to the two sensing devices 160 . In some embodiments, the positioning sleeve 270 has a recess R, and the recess R matches the first positioning shaft 170 . For example, as shown in FIG. 13 , the positioning sleeve 270 has three recesses R, and three first positioning shafts 170 are provided on the first telescopic member 152 . Each first positioning shaft 170 is provided corresponding to each recess R, and each first positioning shaft 170 is configured to be combined with each recess R. However, the present disclosure is not intended to limit the number of recessed portions R and first positioning shafts 170 . In this embodiment, the control element CE is configured to actuate the telescopic member 150 to move the second receiving shelf 134 and the pick-and-place assembly 140 toward and away from the probing machine 200 . As shown in FIGS. 2 , 12 and 13 , when the control element CE actuates the telescopic member 150 to move the second accommodation shelf 134 and the pick-and-place assembly 140 toward the probe machine 200 , the first container is The storage shelf 132, the second storage shelf 134 and the pick-and-place assembly 140 are horizontally separated.

Please refer to Figure 14. FIG. 14 is a schematic diagram of the first aspect S1 of the overlap between the automated probe card pick-and-place device 100 and the probe test machine 200 according to an embodiment of the present disclosure. In step S14 , the control element CE actuates the first telescopic part 152 and the second telescopic part 154 to further enable the automated probe card picking and placing device 100 and the probe test machine 200 to overlap each other. In this embodiment, the first aspect S1 is an intermediate stage in which the automated probe card pick-and-place device 100 and the probe test machine 200 overlap. As shown in Figure 14, when the control element CE actuates the first telescopic member 152 and the second telescopic member 154, the automated probe card picking and placing device 100 is in the first state S1 (equivalent to the automated probe card picking and placing device 100 (deployed state), the first positioning shaft 170 is located directly above the positioning sleeve 270 . In this situation, the first positioning shaft 170 has not yet been combined with the positioning sleeve 270 , which means that the control element CE has not yet completed the overlapping operation of the automated probe card pick-and-place device 100 and the probe test machine 200 .

Please refer to Figure 15. FIG. 15 is a schematic diagram of the second aspect S2 of the overlap between the automated probe card pick-and-place device 100 and the probe test machine 200 according to an embodiment of the present disclosure. In this embodiment, the second aspect S2 is the completion stage of overlapping the automatic probe card pick-and-place device 100 and the probe test machine 200 . As shown in FIG. 15 , when the automated probe card pick-and-place device 100 is in the first state S1 , then the control element CE actuates the overlap position adjustment module 120 along a direction parallel to the third direction (eg, direction Z). The lifting direction UD descends, so that the first positioning shaft 170 provided on the first telescopic member 152 is combined with the positioning sleeve 270, and the control element CE completes the overlapping operation of the automated probe card pick-and-place device 100 and the probe test machine 200. . When the first positioning shaft 170 is combined with the positioning sleeve 270 , the control element CE stops actuating the overlap position adjustment module 120 .

Please also refer to Figure 16 to Figure 18. Figure 16 is a perspective view of the overlap between the automated probe card pick-and-place device 100 and the probe test machine 200 according to an embodiment of the present disclosure. Figures 17 and 18 are respectively a side view and a perspective view of the floating component 129 according to an embodiment of the present disclosure. In this embodiment, several floating components 129 are located on the top of the overlapping position adjustment module 120 and connected to the first accommodation shelf 132 . In some embodiments, the automated probe card pick-and-place device 100 includes four floating assemblies 129 , but the present disclosure is not intended to limit the number of floating assemblies 129 . As shown in Figures 17 and 18, each floating component 129 includes several sliders stacked on each other. In this embodiment, each floating component 129 includes a first slider 1291 , a second slider 1293 and a third slider 1296 . The first slider 1291 contains a track 1292. The second slider 1293 includes several sliders 1294 . Third slider 1296 contains track 1295 . The first slider 1291 is connected to the horizontal adjustment assembly 122 . The third sliding block 1296 is connected to the first accommodation shelf 132 . The track 1292 is disposed on the first slider 1291 and elongates along the second direction (eg, direction Y). The track 1295 is disposed on the third slider 1296 and elongates along the first direction (eg, direction X). The second slide block 1293 is slidably connected to the first slide block 1291 and the third slide block 1296 through the sliding member 1294. Thereby, the floating component 129 allows the first accommodation shelf 132 and the horizontal adjustment component 122 to slide relative to each other in the first direction (eg, direction X) and the second direction (eg, direction Y).

Please refer to Figure 19. FIG. 19 is a schematic diagram of a third aspect S3 of the locking structure 180 according to an embodiment of the present disclosure. In this embodiment, the automated probe card picking and placing device 100 further includes a plurality of locking structures 180 . The locking structure 180 is configured to fix the first accommodating shelf 132 to the overlapping position adjustment module 120 (ie, the locking state) and is configured to make the first accommodating shelf 132 relative to the overlapping position adjusting module 120 Movable (i.e., unlocked state). As shown in FIG. 19 , each locking structure 180 includes a hole member 182 connected to the first receiving shelf 132 and a second positioning member 182 provided on the overlapping position adjustment module 120 and corresponding to the hole member 182 . Axis 186. In some embodiments, the hole member 182 has a receiving space 184 configured to receive the second positioning shaft 186 . The second positioning shaft 186 reciprocates in the accommodation space 184 . As shown in FIG. 19 , the third aspect S3 is the unlocked state of the locking structure 180 because the second positioning shaft 186 has not yet engaged with the hole piece 182 . In some embodiments, the second positioning shaft 186 reciprocates along a third direction (eg, direction Z).

Please refer to Figure 20. FIG. 20 is a schematic diagram of a fourth aspect S4 of the locking structure 180 according to an embodiment of the present disclosure. As shown in FIG. 20 , the fourth aspect S4 is the locked state of the locking structure 180 because the second positioning shaft 186 is engaged with the hole member 182 . For example, the second positioning shaft 186 moves upward along the third direction (eg, direction Z) to engage with the hole member 182 .

Please also refer to Figure 14, Figure 15 and Figure 19. In a usage scenario, when the automated probe card picking and placing device 100 is deployed from the state shown in Figure 1 and transitions to the first state S1, or when the automated probe card picking and placing device 100 is deployed from the first state S1 When switching to the second aspect S2, since the second positioning shaft 186 is not engaged with the hole piece 182, when the automated probe card pick-and-place device 100 wants to overlap with the probe test machine 200, the first accommodation shelf 132 Because the floating component 129 slides freely between the horizontal adjustment component 122 and the first positioning shaft 170 when the first positioning shaft 170 is combined with the positioning sleeve 270, even if the calibration is not completed accurately enough when performing step S12, automation can still be achieved. The probe card pick-and-place device 100 is smoothly connected to the probe test machine 200 .

Please also refer to Figure 14, Figure 15 and Figure 20. In another usage scenario, when the automated probe card picking and placing device 100 transitions from the second aspect S2 to the first aspect S1, or when the automated probe card picking and placing device 100 transitions from the first aspect S1 to as follows: In the folded state shown in Figure 1, since the second positioning shaft 186 is engaged with the hole piece 182, the automated probe card picking and placing device 100 is about to separate from the probe testing machine 200 or the automated probe card picking and placing device 100 is about to separate. When folded, the control element CE can actuate the overlap position adjustment module 120 and the telescopic fork in a stable state.

Step S16: Activate the pick-and-place component 140 to pick and place the probe card PC accommodated in the first accommodation shelf 132, the second accommodation shelf 134, or the stage 230 of the probe test machine 200.

Please refer to Figure 5, Figure 21 and Figure 22. After the control element CE executes step S14, step S16 is executed. Specifically, after the control element CE completes the overlapping operation of the automated probe card pick-and-place device 100 and the probe test machine 200, the pick-and-place assembly 140 is used to pick and place the probe card PC.

As shown in FIG. 21 , different implementations according to step S16 in FIG. 3 are illustrated. Figure 21 illustrates step S161 and step S162. Figure 22 shows a partial perspective view of the automatic probe card pick-and-place device 100 and the probe test machine 200 overlapping each other. For simplicity of explanation, some components of the automated probe card picking and placing device 100 are omitted in FIG. 22 . After the control element CE executes step S14 , the first accommodation shelf 132 , the second accommodation shelf 134 and the pick-and-place assembly 140 are separated from each other in the actuation direction AD, as shown in FIG. 22 . It should be noted that in Figure 22, one probe card PC is shown to be accommodated in the second accommodation shelf 134, but in fact one or more probe cards PC can be accommodated in different usage scenarios. In the first accommodation shelf 132 , the second accommodation shelf 134 and/or the stage 230 of the needle testing machine 200 . In order to better understand step S161 and step S162, please refer to Figure 21 and Figure 22.

Step S161: Take the first probe card PC accommodated in the carrier 230 and place the first probe card PC in the first accommodation shelf 132. Step S162: Take the second probe card PC accommodated in the second accommodation shelf 134 and place the second probe card PC in the carrier 230.

Please refer to Figure 21 and Figure 22. In a usage scenario, after step S14 is executed, step S161 is executed, and then step S162 is executed. For example, when the old probe card PC is accommodated in the carrier 230 of the probe test machine 200 and the new probe card PC is accommodated in the second accommodation shelf 134, the pick-and-place component 140 takes and accommodates the probe card PC. The old probe card PC is placed in the carrier 230 and the old probe card PC is placed on the first receiving shelf 132 . Next, the pick-and-place assembly 140 takes the new probe card PC accommodated in the second accommodation shelf 134 and places the new probe card PC in the carrier 230 .

Please continue to refer to Figure 21 and Figure 22. In another usage scenario, after step S14 is performed, step S161 is performed. For example, when the probe card PC is accommodated in the carrier 230 of the probe test machine 200, the pick-and-place component 140 takes the probe card PC accommodated in the carrier 230 and places the probe card PC on the first One is accommodated in the shelf 132 . In some embodiments, when neither the first accommodating shelf 132 nor the second accommodating shelf 134 accommodates any probe card PC, the pick-and-place component 140 can also take the probe card PC accommodated in the carrier 230 . The probe card PC is placed in the first accommodating shelf 132 or the second accommodating shelf 134 .

Please continue to refer to Figure 21 and Figure 22. In yet another usage scenario, after step S14 is performed, step S162 is performed. For example, when the second accommodation shelf 134 accommodates the probe card PC, the pick-and-place component 140 takes the probe card PC accommodated in the second accommodation shelf 134 and places the probe card PC. in stage 230. In some embodiments, when the first accommodation shelf 132 accommodates the probe card PC, the pick-and-place component 140 can also take the probe card PC accommodated in the first accommodation shelf 132 and probe the probe card PC. The needle card PC is placed in the carrier 230 .

In an additional usage scenario, for example, when both the first accommodation shelf 132 and the second accommodation shelf 134 contain a new probe card PC, the pick-and-place component 140 takes the first accommodation shelf 132 and the second accommodation shelf 134 to accommodate a new probe card PC. The new probe card PC in the accommodation shelf 132 is placed in the carrier 230 . Then, the control element CE controls the transport carrier 110 to go to the target position adjacent to another probe test machine 200, and the pick-and-place component 140 then takes the new probe card PC accommodated in the second accommodation shelf 134 and places it in another In another carrier 230 of a needle testing machine 200.

In another additional usage scenario, for example, when old probe cards PC are accommodated in the carrier 230 and another carrier 230 respectively, the pick-and-place component 140 takes out the old probe card PC accommodated in the carrier 230 The probe card PC is placed in the first receiving shelf 132 . Then, the control element CE controls the transport vehicle 110 to go to the target position adjacent to another needle testing machine 200, and the pick-and-place assembly 140 then picks up the old probe accommodated in another carrier 230 of another needle testing machine 200. The card PC is placed in the second receiving shelf 134 .

From the above detailed description of the specific embodiments of the present disclosure, it can be clearly seen that in the automatic probe card pick-and-place device and its control method of the present disclosure, since the overlap position adjustment module is equipped with a sensing device, and The telescopic part is equipped with a floating component, so that the automatic probe card pick-and-place device and the probe test machine can be accurately connected to facilitate the automatic loading and unloading of the probe card. In the automated probe card pick-and-place device and its control method of the present disclosure, since the first storage shelf, the second storage shelf, and the pick-and-place component can achieve horizontal separation through the actuation of the telescopic member, the automated probe card The needle card pick-and-place device can complete the replacement of new probe cards and old probe cards at one time, or can install several new probe cards and recycle several old probe cards at the same time. In the disclosed automated probe card pick-and-place device and its control method, the automated probe card pick-and-place device can be used with a self-made Front Opening Shipping Box (FOSB) loading and unloading vehicle and an under-development smart warehousing vehicle. system to build a smart factory of cyber-physical (CP) system, thereby realizing comprehensive automation of the probe card loading and unloading system.

Although the disclosure has been disclosed in the above embodiments, it is not intended to limit the disclosure. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the disclosure. Therefore, the protection of the disclosure is The scope shall be determined by the appended patent application scope.

100:Automated probe card pick-and-place device

110:Transportation vehicle

120: Overlap position adjustment module

122: Horizontal adjustment component

122A: First level adjustment component

122B: Second horizontal adjustment component

124: Rotation adjustment component

126:Lifting assembly

128: Lateral displacement component

129: Floating component

130: Accommodation shelf

132: First storage shelf

132a,134a: Bearing surface

134: Second storage shelf

140: Pick and place components

150:Telescopic parts

152: First telescopic part

154: Second retractable member

160: Sensing device

170: First positioning axis

180:Lock structure

182: Hole fittings

184: Accommodation space

186: Second positioning axis

200: Needle testing machine

200a:Top surface

230: Carrier stage

260: Reference positioning plate

262: Positioning rod

270: Positioning sleeve

1221A, 1221B: Base

1222A, 1222B: pendulum block

1223A,1223B:Connection board

1224B: Curved chute

1225B:Rolling parts

1226,1246,1266,1286: Actuator

1242:Activity platform

1243: Movable column

1244:Bearing ring

1262: Base plate

1263:Cylinder

1282:Base

1283:Side wall

1284: Line rail

1291: First slider

1292,1295: Orbit

1293: Second slider

1294:Sliding parts

1296:Third slider

AD: Actuation direction

CE: control element

CM:Control method

CTR:Central

L:Light

LD: traverse direction

MP1:First Activity Department

MP2:Second Activity Department

PC: probe card

R: concave part

RT:route

S1: First form

S2: Second form

S3: The third aspect

S4: The fourth form

S10, S12, S14, S16, S121, S122, S123, S124, S161, S162: Steps

UD: lifting direction

X,Y,Z: direction

In order to make the above and other objects, features, advantages and embodiments of the present disclosure more obvious and understandable, the accompanying drawings are described as follows: Figure 1 is a perspective view of an automated probe card pick-and-place device according to an embodiment of the present disclosure. Figure 2 illustrates a functional block diagram of an automated probe card pick-and-place device according to an embodiment of the present disclosure. Figure 3 illustrates a flow chart of a control method of an automated probe card pick-and-place device according to an embodiment of the present disclosure. Figure 4 is a schematic diagram of an automated probe card pick-and-place device and a probe test machine according to an embodiment of the present disclosure. FIG. 5 illustrates a flow chart of one step of a control method of an automated probe card pick-and-place device according to an embodiment of the present disclosure. Figure 6 illustrates a partial enlarged view of an automated probe card pick-and-place device and a probe test machine according to an embodiment of the present disclosure. FIG. 7 illustrates a side view of an automated probe card pick-and-place device and a probe test machine according to an embodiment of the present disclosure. FIG. 8 is a perspective view of a level adjustment component according to an embodiment of the present disclosure. FIG. 9 illustrates a partial enlarged view of a level adjustment component according to an embodiment of the present disclosure. Figure 10 illustrates a perspective view of a rotation adjustment component and a lifting component according to an embodiment of the present disclosure. Figure 11 is a perspective view of a lateral displacement component according to an embodiment of the present disclosure. Figure 12 is a schematic diagram of the horizontal separation of the first storage shelf, the second storage shelf and the pick-and-place component according to an embodiment of the present disclosure. Figure 13 illustrates an oblique top view of an automated probe card pick-and-place device and a probe test machine according to an embodiment of the present disclosure. Figure 14 is a schematic diagram of a first aspect of overlapping the automatic probe card pick-and-place device and the probe test machine according to an embodiment of the present disclosure. Figure 15 is a schematic diagram of a second aspect of overlapping the automatic probe card pick-and-place device and the probe test machine according to an embodiment of the present disclosure. Figure 16 illustrates a perspective view of an automated probe card pick-and-place device and a probe test machine according to an embodiment of the present disclosure. Figure 17 illustrates a side view of a floating component according to an embodiment of the present disclosure. Figure 18 is a perspective view of a floating component according to an embodiment of the present disclosure. Figure 19 is a schematic diagram of a third aspect of the locking structure according to an embodiment of the present disclosure. Figure 20 is a schematic diagram of a fourth aspect of the locking structure according to an embodiment of the present disclosure. FIG. 21 illustrates a flow chart of one step of a control method of an automated probe card pick-and-place device according to an embodiment of the present disclosure. Figure 22 illustrates a partial perspective view of an automated probe card pick-and-place device and a probe test machine according to an embodiment of the present disclosure.

Domestic storage information (please note in order of storage institution, date and number) without Overseas storage information (please note in order of storage country, institution, date, and number) without

100:Automated probe card pick-and-place device

110:Transportation vehicle

120: Overlap position adjustment module

122: Horizontal adjustment component

124: Rotation adjustment assembly

126:Lifting assembly

128: Lateral displacement component

129: Floating component

130: Accommodation shelf

132: First storage shelf

134: Second storage shelf

140: Pick and place components

150:Telescopic parts

152: First telescopic part

154: Second telescopic part

160: Sensing device

170: First positioning axis

AD: Actuation direction

L:Light

PC: probe card

RT:route

X,Y,Z: direction

Claims (25)

An automatic probe card pick-and-place device includes: a transport carrier; at least one storage shelf located above the transport carrier and configured to accommodate a probe card; an overlap position adjustment module disposed on the Between at least one storage shelf and the transport carrier; a pick-and-place component is disposed above the at least one storage shelf and configured to pick and place the probe card; a plurality of telescopic members connected to the at least one container placed in the shelf and connected between the pick-and-place component and the at least one accommodation shelf; and a control component electrically or communicatively connected to the transport vehicle, the overlapping position adjustment module, the telescopic members, and In the pick and place assembly, the control element is configured to: control the transport carrier to move to a target position adjacent to a needle measuring machine; drive the overlap position adjustment module to calibrate the at least one accommodation shelf and the pick and place assembly relative to At a relative position to the needle testing machine; actuating the telescopic members to move the at least one receiving shelf and the pick-and-place component toward and away from the needle test machine; and actuating the pick-and-place component to pick and place the container. The probe card is placed in the at least one accommodation shelf or a stage of the probe test machine, wherein the at least one accommodation shelf further includes: a first accommodation shelf, which is arranged at the overlapping position adjustment on the module; And a second storage shelf, movably located between the first storage shelf and the pick-and-place component. The automatic probe card picking and placing device as claimed in claim 1, wherein the telescopic members are further connected between the first accommodation shelf and the second accommodation shelf and activate the second accommodation shelf. Move toward and away from the first accommodating shelf, and the second accommodating shelf and the first accommodating shelf are separated from each other in a direction parallel to the actuation of the telescopic members. The automatic probe card pick-and-place device as claimed in claim 1, wherein the overlapping position adjustment module includes a lateral displacement component, and the lateral displacement component actuates the at least one accommodation shelf to move along a direction perpendicular to the The telescopic part moves in one of the actuation directions. The automatic probe card pick-and-place device according to claim 1, wherein the overlapping position adjustment module includes a horizontal adjustment component, and the horizontal adjustment component actuates the at least one accommodation shelf to swing relative to the transport carrier. . The automatic probe card picking and placing device as described in claim 4, wherein the level adjustment component further includes: a base; a movable part connected to the base and including at least one receiving shelf A connecting plate is connected to a pendulum block connected to the connecting plate, and the pendulum block has an arcuate chute; at least one rolling element is pivotally connected to the base and connected to the arcuate chute, so that the pendulum block The base is slidably connected; and an actuator actuates the movable part to swing the movable part relative to the base. The automated probe card pick-and-place device as claimed in claim 1 further includes a plurality of sensing devices configured to emit and sense light. The automatic probe card pick-and-place device according to claim 1, wherein the overlapping position adjustment module includes a rotation adjustment component, and the rotation adjustment component causes the at least one accommodation shelf to be oriented with the center of the rotation adjustment component The center of the circle rotates. The automatic probe card pick-and-place device according to claim 1, further comprising at least one first positioning shaft disposed on the telescopic members, and the at least one first positioning shaft is configured to connect with a positioning sleeve of the probe test machine barrel combination. The automatic probe card pick-and-place device as claimed in claim 1, wherein the overlapping position adjustment module includes a plurality of floating components connected to the at least one accommodation shelf, and each of the floating components includes a stack of components stacked on each other. a plurality of sliders, and the sliders include sliders extending along a first direction a first track and a second track extending along a second direction perpendicular to the first direction. The automatic probe card pick-and-place device as claimed in claim 1, wherein the overlapping position adjustment module further includes a plurality of locking structures, and the locking structures are configured to fix the at least one accommodation shelf to the The overlapping position adjustment module is configured to make the at least one accommodation shelf movable relative to the overlapping position adjustment module. The automatic probe card pick-and-place device according to claim 10, wherein each of the locking structures includes a hole piece connected to the at least one accommodation shelf and an overlapping position adjustment mold. A second positioning axis is formed on the set and corresponds to the set of holes. A control method for controlling an automated probe card pick-and-place device. The automated probe card pick-and-place device includes a transport carrier, a first storage shelf located above the transport carrier, and a second storage rack. The shelf, an overlap position adjustment module connected between the first accommodation shelf and the transport vehicle, a pick-and-place component located above the second accommodation shelf and connected to the first accommodation A plurality of telescopic members between the shelf and the second storage shelf and connected between the second storage shelf and the pick-and-place component. The control method includes: controlling the transport vehicle to move to an adjacent needle. A target position of the measuring machine; driving the overlap position adjustment module to calibrate the first accommodation shelf, the third The relative position of the two accommodating shelves and the pick-and-place component relative to the needle measuring machine; actuating the telescopic members to move the second accommodating shelf and the pick-and-place component so that the second accommodating shelf The first accommodation shelf is separated from each other in an actuating direction parallel to the telescopic members; and the pick-and-place component is actuated to pick and place the first accommodation shelf and the second accommodation layer. One of the probe cards in the rack or one of the stages of the probe machine. The control method as claimed in claim 12, wherein the step of actuating the telescopic members to move the second accommodation shelf and the pick-and-place assembly causes the pick-and-place assembly and the second accommodation shelf to separate from each other. The control method as described in claim 12, wherein the overlapping position adjustment module is driven to calibrate the relative position of the first accommodation shelf, the second accommodation shelf and the pick-and-place component with respect to the needle test machine. The step of positioning further includes: actuating a horizontal adjustment component of the overlapping position adjustment module, so that a bearing surface of the first accommodation shelf and one of the second accommodation shelf are connected to the horizontal adjustment component. The bearing surface is parallel to a top surface of the needle measuring machine; a rotation adjustment component of the overlap position adjustment module is actuated, so that the first accommodation layer and the second accommodation layer are connected to the rotation adjustment component. The frame and the pick-and-place component rotate with the center of the rotation adjustment component as the center of the circle; and actuate one of the lateral displacement components of the overlap position adjustment module so that the The first accommodating shelf, the second accommodating shelf and the pick-and-place component connected to the lateral displacement component move laterally relative to the needle measuring machine. The control method according to claim 14, wherein the level adjustment component further includes a connecting plate connecting the first accommodation shelf, the second accommodation shelf and the pick-and-place component, and the actuating the overlapping The step of the horizontal adjustment component of the position adjustment module makes the connecting plate parallel to the top surface of the probing machine. The control method as described in claim 12, wherein the automated probe card pick-and-place device further includes two sensing devices configured to emit and sense light, and the probe test machine further includes two reference positioning plates disposed on one of the probe test machines. The top surface corresponds to the two sensing devices, and drives the overlap position adjustment module to calibrate the first accommodating shelf, the second accommodating shelf and the pick-and-place component relative to the needle measuring machine. The relative position step further includes: driving the two sensing devices to emit the light toward the two reference positioning plates. The control method as described in claim 16, wherein the step of actuating the rotation adjustment component of the overlap position adjustment module causes the two sensing devices to sense the same distance value of the light reflected from the two reference positioning plates. . The control method as described in claim 16, wherein the cause The step of moving the lateral displacement component of the overlap position adjustment module causes the light emitted by the two sensing devices to be respectively aligned with the two positioning rods of the two reference positioning plates. The control method as claimed in claim 12, wherein the automated probe card pick-and-place device further includes at least one first positioning axis disposed on the telescopic members, and the probe test machine further includes a device corresponding to the at least one first positioning axis. At least one positioning sleeve is provided, and the step of actuating the telescopic members to move the second accommodation shelf and the pick-and-place assembly causes the at least one first positioning shaft to be combined with the at least one positioning sleeve. The control method according to claim 12, wherein the overlapping position adjustment module further includes a plurality of locking structures, and the step of actuating the telescopic members to move the second accommodation shelf and the pick-and-place component The first accommodation shelf is fixed to the overlapping position adjustment module through the locking structures or is movable relative to the overlapping position adjustment module. The control method as claimed in claim 12, wherein the step of actuating the telescopic members to move the second accommodation shelf and the picking and placing component is such that when the second containing shelf and the picking and placing component move towards the When the stage of the needle measuring machine moves, the first accommodation shelf can move relative to the overlapping position adjustment module. The control method as described in claim 12, wherein the cause The step of moving the telescopic members to move the second accommodation shelf and the pick-and-place assembly makes the first accommodation shelf and the pick-and-place assembly move away from the stage of the probe machine. The accommodation shelf is fixed on the overlapping position adjustment module. The control method as claimed in claim 12, wherein the step of actuating the pick-and-place component takes the probe card accommodated in the carrier and places the probe card in the first accommodation shelf. The control method as claimed in claim 12, wherein the step of actuating the pick-and-place component takes the probe card accommodated in the second accommodation shelf and places the probe card in the carrier. The control method as claimed in claim 12, wherein the carrier accommodates a first probe card, the second accommodation shelf accommodates a second probe card, and the step of actuating the pick-and-place component further including: taking the first probe card accommodated in the stage and placing the first probe card in the first accommodation shelf; and placing the first probe card in the first After being accommodated in the shelf, take the second probe card accommodated in the second accommodation shelf and place the second probe card in the carrier.