TW202501004A - Automatic probe card pick-and-place device and method of controlling the same - Google Patents

Abstract

An automatic probe card pick-and-place device includes a transport vehicle, at least one accommodating rack shelf configured to accommodate a probe card, a lap joint location adjusting module, a pick-and-place assembly configured to pick-and-place a probe card, a plurality of telescopic forks, and a controlling element. The controlling element is electrically or communicatively connected to the transport vehicle, the lap joint location adjusting module, the telescopic forks, and the pick-and-place assembly. The controlling element is configured to: control the transport vehicle to move to a targeted location adjacent to a prober; drive the lap joint location adjusting module to calibrate a relative location of the at least one accommodating rack shelf and the pick-and-place assembly relative to the prober; actuate the telescopic forks to move the at least one accommodating rack shelf and the pick-and-place assembly forward to or away from the prober; and actuate the pick-and-place assembly to pick-and-place the probe card accommodated in the at least one accommodating rack shelf or a carrying platform of the prober.

Description

Automatic probe card pick-up and placement device and control method thereof

The present disclosure relates to an automated probe card pick-up and placement device and a control method thereof.

Currently, each packaging and testing factory and test equipment manufacturer needs to manually transport the probe card and load and unload the probe card into the prober. However, this takes a lot of time and engineering manpower. In addition, since the installation skills of the probe card installers vary, improper operation can easily cause damage to the probe card.

Therefore, how to provide an automated probe card placement device and a control method thereof to reduce the risk of manual installation of the probe card is one of the problems that the industry is eager to invest in research and development resources to solve.

In view of this, one purpose of the present disclosure is to provide an automated probe card placement device and a control method thereof that can solve the above-mentioned problem.

In order to achieve the above-mentioned purpose, according to one embodiment of the present disclosure, an automated probe card pick-up and placement device includes a transport vehicle, at least one storage shelf configured to accommodate probe cards, an overlap position adjustment module, a pick-up and placement assembly configured to pick-up and place probe cards, a plurality of telescopic members, and a control element. At least one storage shelf is located above the transport vehicle. At least one storage shelf is configured to accommodate probe cards. The overlap position adjustment module is disposed between at least one storage shelf and the transport vehicle. The pick-up and placement assembly is disposed above at least one storage shelf. The pick-up and placement assembly is configured to pick-up and place probe cards. The telescopic member is connected to at least one storage shelf and connected between the pick-up and placement assembly and at least one storage shelf. The control element is electrically or communicatively connected to the transport vehicle, the overlap position adjustment module, the telescopic member, and the pick-up and placement assembly. The control element is configured to: control the transport vehicle to move to a target position adjacent to the probe tester; drive the overlap position adjustment module to calibrate the relative position of at least one storage shelf and a pick-and-place assembly relative to the probe tester; actuate the telescopic member to move at least one storage shelf and a pick-and-place assembly toward and away from the probe tester; and actuate the pick-and-place assembly to pick and place a probe card contained in at least one storage shelf or a carrier of the probe tester.

In one or more embodiments of the present disclosure, at least one accommodating shelf further includes a first accommodating shelf and a second accommodating shelf. The first accommodating shelf is disposed on the overlap position adjustment module. The second accommodating shelf is movably disposed between the first accommodating shelf and the pick-and-place assembly.

In one or more embodiments of the present disclosure, a telescopic member is further connected between the first accommodating shelf and the second accommodating shelf and actuates the second accommodating shelf to move toward and away from the first accommodating shelf. The second accommodating shelf and the first accommodating shelf are separated from each other in a direction parallel to the actuation direction of the telescopic member.

In one or more embodiments of the present disclosure, the overlap position adjustment module includes a lateral displacement assembly, and the lateral displacement assembly actuates at least one accommodating shelf to move along a direction perpendicular to the actuation direction of the telescopic member.

In one or more embodiments of the present disclosure, the overlap position adjustment module includes a horizontal adjustment assembly, and the horizontal adjustment assembly actuates at least one accommodating shelf to swing relative to the transport vehicle.

In one or more embodiments of the present disclosure, the horizontal adjustment assembly further includes a base, a movable part, at least one roller, and an actuator. The movable part is connected to the base. The movable part includes a connecting plate connected to at least one accommodating shelf and a swing block connected to the connecting plate. The swing block has an arc-shaped slide. At least one roller is pivoted on the base and connected to the arc-shaped slide, so that the swing block can be slidably connected to the base. The actuator actuates the movable part to swing the movable part relative to the base.

In one or more embodiments of the present disclosure, the automated probe card pick-and-place device further comprises a plurality of sensing devices configured to emit and sense light.

In one or more embodiments of the present disclosure, the overlap position adjustment module includes a rotation adjustment assembly that causes at least one accommodating shelf to rotate with the center of the rotation adjustment assembly as the center.

In one or more embodiments of the present disclosure, the automated probe card pick-up and placement device further includes at least one first positioning shaft disposed on the telescopic member. The at least one first positioning shaft is configured to be combined with a positioning sleeve of a probe testing machine.

In one or more embodiments of the present disclosure, the overlap position adjustment module includes a plurality of floating components connected to at least one accommodating shelf. Each of the floating components includes a plurality of sliders stacked on top of each other. The slider includes a first track extending along a first direction and a second track extending along a second direction perpendicular to the first direction.

In one or more embodiments of the present disclosure, the overlap position adjustment module further includes a plurality of locking structures configured to fix at least one accommodating shelf to the overlap position adjustment module and configured to allow at least one accommodating shelf to be movable relative to the overlap position adjustment module.

In one or more embodiments of the present disclosure, each of the locking structures includes a sleeve member connected to at least one accommodating shelf and a second positioning axis disposed on the overlap position adjustment module and corresponding to the sleeve member.

In order to achieve the above-mentioned purpose, according to one embodiment of the present disclosure, a control method is provided for an automated probe card pick-up and placement device. The automated probe card pick-up and placement device comprises a transport carrier, a first storage shelf and a second storage shelf located above the transport carrier, an overlap position adjustment module connected between the first storage shelf and the transport carrier, a pick-up and placement assembly located above the second storage shelf, and a plurality of retractable members connected between the first storage shelf and the second storage shelf and between the second storage shelf and the pick-up and placement assembly. The control method includes: controlling the transport vehicle to move to a target position adjacent to the probe tester; driving the overlap position adjustment module to calibrate the relative positions of the first storage shelf, the second storage shelf and the pick-and-place assembly relative to the probe tester; actuating the telescopic member to move the second storage shelf and the pick-and-place assembly so that the second storage shelf and the first storage shelf are separated from each other in a direction parallel to the actuation direction of the telescopic member; and actuating the pick-and-place assembly to pick and place the probe card accommodated in the first storage shelf, the second storage shelf or the carrier of the probe tester.

In one or more embodiments of the present disclosure, the step of actuating the telescopic member to move the second accommodating shelf and the pick-and-place assembly separates the pick-and-place assembly from the second accommodating shelf.

In one or more embodiments of the present disclosure, the step of driving the overlap position adjustment module to calibrate the relative positions of the first accommodating shelf, the second accommodating shelf, and the pick-and-place assembly relative to the probe tester further includes: actuating the horizontal adjustment assembly of the overlap position adjustment module so that the supporting surface of the first accommodating shelf connected to the horizontal adjustment assembly and the supporting surface of the second accommodating shelf are parallel to the top surface of the probe tester. ; actuating the rotation adjustment assembly of the overlapping position adjustment module so that the first accommodating shelf, the second accommodating shelf and the pick-and-place assembly connected to the rotation adjustment assembly rotate with the center of the rotation adjustment assembly as the center; and actuating the lateral displacement assembly of the overlapping position adjustment module so that the first accommodating shelf, the second accommodating shelf and the pick-and-place assembly connected to the lateral displacement assembly move laterally relative to the probe tester.

In one or more embodiments of the present disclosure, the horizontal adjustment assembly further includes a connecting plate connecting the first accommodating shelf, the second accommodating shelf and the pick-and-place assembly. The step of actuating the horizontal adjustment assembly of the overlapping position adjustment module makes the connecting plate parallel to the top surface of the probe tester.

In one or more embodiments of the present disclosure, the automated probe card pick-up and placement device further includes two sensing devices configured to emit and sense light. The probe tester further includes two reference positioning plates disposed on the top surface of the probe tester and corresponding to the two sensing devices. The step of driving the overlap position adjustment module to calibrate the relative positions of the first accommodating shelf, the second accommodating shelf, and the pick-up and placement assembly relative to the probe tester further includes: driving the two sensing devices to emit light toward the two reference positioning plates.

In one or more embodiments of the present disclosure, the step of actuating the rotation adjustment assembly of the overlap position adjustment module makes the distance values of the light reflected from the two reference positioning plates sensed by the two sensing devices to be the same.

In one or more embodiments of the present disclosure, the step of actuating the lateral displacement assembly of the overlap position adjustment module causes the light emitted by the two sensing devices to align with the two positioning rods of the two reference positioning plates respectively.

In one or more embodiments of the present disclosure, the automated probe card pick-up and placement device further includes at least one first positioning axis disposed on the telescopic member. The probe testing machine further includes at least one positioning sleeve corresponding to the at least one first positioning axis. The telescopic member is actuated to move the second accommodating shelf and the step of picking and placing the assembly causes the at least one first positioning axis to be combined with the at least one positioning sleeve.

In one or more embodiments of the present disclosure, the overlap position adjustment module further includes a plurality of locking structures. The steps of actuating the telescopic member to move the second accommodating shelf and placing and removing the assembly enable the first accommodating shelf to be fixed to the overlap position adjustment module by the locking structures or to be movable relative to the overlap position adjustment module.

In one or more embodiments of the present disclosure, the step of actuating the telescopic member to move the second accommodating shelf and the pick-and-place assembly enables the first accommodating shelf to move relative to the overlap position adjustment module when the second accommodating shelf and the pick-and-place assembly move toward the carrier of the probe testing machine.

In one or more embodiments of the present disclosure, the step of actuating the telescopic member to move the second accommodating shelf and the pick-and-place assembly enables the first accommodating shelf to be fixed to the overlapping position adjustment module when the second accommodating shelf and the pick-and-place assembly move away from the carrier of the needle detection machine.

In one or more embodiments of the present disclosure, the step of actuating the pick-and-place assembly takes the probe card contained in the carrier and places the probe card in the first containing shelf.

In one or more embodiments of the present disclosure, the step of actuating the pick-and-place assembly takes the probe card contained in the second containing shelf and places the probe card in the carrier.

In one or more embodiments of the present disclosure, the carrier accommodates a first probe card, and the second accommodating shelf accommodates a second probe card. The step of actuating the pick-and-place assembly further includes: taking the first probe card accommodated in the carrier and placing the first probe card in the first accommodating shelf; and after placing the first probe card in the first accommodating shelf, taking the second probe card accommodated in the second accommodating shelf and placing the second probe card in the carrier.

In summary, in the automatic probe card pick-up and placement device and control method thereof disclosed in the present invention, since the overlap position adjustment module is equipped with a sensing device, and the telescopic member is equipped with a floating assembly, the automatic probe card pick-up and placement device and the probe testing machine can be precisely connected to facilitate the automatic loading and unloading of the probe card. In the automatic probe card pick-up and placement device and control method thereof disclosed in the present invention, since the first accommodating shelf, the second accommodating shelf and the pick-up and placement assembly can be horizontally separated by the actuation of the telescopic member, the automatic probe card pick-up and placement device can complete the replacement operation of the new probe card and the old probe card at one time, or can simultaneously install a plurality of new probe cards and simultaneously recycle a plurality of old probe cards. In the automated probe card picking and placing device and control method disclosed herein, the automated probe card picking and placing device can be used in conjunction with a self-made front opening shipping box (FOSB) loading and unloading vehicle and an intelligent warehousing system under development to construct an intelligent factory of a cyber-physical (CP) system, thereby realizing full automation of the probe card loading and unloading system.

The above description is only used to explain the problem to be solved by the present disclosure, the technical means for solving the problem, and the effects produced, etc. The specific details of the present disclosure will be introduced in detail in the following implementation method and related drawings.

The following will disclose multiple embodiments of the present disclosure with drawings. For the purpose of clarity, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present disclosure. In other words, in some embodiments of the present disclosure, these practical details are not necessary. In addition, in order to simplify the drawings, some commonly used structures and components will be depicted in the drawings in a simple schematic manner. The same reference numerals will be used to represent the same or similar components in all drawings.

The following will introduce in detail the structure, function and connection relationship between each component included in the automated probe card placement device 100 of this embodiment.

Please refer to FIG. 1. FIG. 1 is a three-dimensional diagram of an automated probe card pick-and-place device 100 according to one embodiment of the present disclosure. In this embodiment, the automated probe card pick-and-place device 100 includes a transport vehicle 110, an overlap position adjustment module 120, at least one storage shelf 130, and a pick-and-place assembly 140. The overlap position adjustment module 120, the storage shelf 130, and the pick-and-place assembly 140 are disposed on the transport vehicle 110. As shown in FIG. 1, the transport vehicle 110 equipped with the overlap position adjustment module 120, the storage shelf 130, and the pick-and-place assembly 140 can reach the target position along the route RT. The overlap position adjustment module 120 is disposed on the transport vehicle 110. The overlapping position adjustment module 120 is configured to adjust the positions of the storage rack 130 and the pick-and-place assembly 140 in space. As shown in FIG. 1 , the storage rack 130 is disposed above the transport vehicle 110 and is configured to accommodate the probe card PC. Specifically, the storage rack 130 is disposed on the overlapping position adjustment module 120, in other words, the overlapping position adjustment module 120 is disposed between the storage rack 130 and the transport vehicle 110. The pick-and-place assembly 140 is movably disposed above the storage rack 130 and is configured to pick and place the probe card PC. In some embodiments, the overlapping position adjustment module 120 further includes a horizontal adjustment assembly 122, a rotation adjustment assembly 124, a lifting assembly 126, a lateral displacement assembly 128, and a floating assembly 129. In some embodiments, the accommodating shelf 130 includes a first accommodating shelf 132 and a second accommodating shelf 134. However, the present disclosure is not intended to limit the number of accommodating shelves 130, that is, the present disclosure may include any number of accommodating shelves 130 as required. In some embodiments, as shown in FIG. 1 , the first accommodating shelf 132 is disposed on the overlap position adjustment module 120, and the second accommodating shelf 134 is movably disposed between the first accommodating shelf 132 and the pick-and-place assembly 140. The detailed structures, functions, and connection relationships between the above components will be described below.

In some implementations, the transport vehicle 110 may be, for example, an Automatic Guided Vehicle (AGV) or other automated powertrains.

In some implementations, the probe card PC is, for example, a media device used to test an integrated circuit on a wafer (not shown).

Please continue to refer to FIG. 1. As shown in FIG. 1, the automated probe card pick-and-place device 100 further includes a plurality of telescopic members 150. The telescopic member 150 is connected in the storage shelf 130 and is connected between the pick-and-place assembly 140 and the storage shelf 130. In some embodiments, as shown in FIG. 1, the telescopic member 150 includes a first telescopic member 152 and a second telescopic member 154. The first telescopic member 152 is connected between the first storage shelf 132 and the second storage shelf 134 and is configured to move along the actuation direction AD. The second telescopic member 154 is connected between the second storage shelf 134 and the pick-and-place assembly 140 and is configured to move along the actuation direction AD. In some embodiments, the actuation direction AD is parallel to the first direction (eg, direction X).

Please continue to refer to FIG. 1. As shown in FIG. 1, the automated probe card placement device 100 further includes a sensing device 160. The sensing device 160 is configured to emit and sense light L. In some embodiments, the light L can be, for example, laser light (Laser) or other suitable types of light. The sensing device 160 configured to emit and sense light L is used for ranging, which will be described in more detail below. In some embodiments, the automated probe card placement device 100 may include one, two, or more than two sensing devices 160. The present disclosure is not intended to limit the number of sensing devices 160.

Please continue to refer to FIG. 1. As shown in FIG. 1, the automated probe card placement device 100 further includes a first positioning shaft 170. The first positioning shaft 170 is disposed on the telescopic member 150. In some embodiments, the first positioning shaft 170 is disposed on the first telescopic member 152. The first positioning shaft 170 is configured to combine the automated probe card placement device 100 with a probe testing machine (not shown in FIG. 1). This will be described in more detail below.

In some embodiments, the telescopic member 150 can be, for example, a telescopic fork or other similar slide rail assemblies. In some embodiments, the telescopic member 150 can also be combined with a pulley block to achieve a mechanical advantage and labor-saving effect.

In some implementations, the sensing device 160 may be, for example, a laser sensor or other similar optical sensor.

Please refer to Figures 2 and 3. Figure 2 is a functional block diagram of the automated probe card pick-up and placement device 100 according to one embodiment of the present disclosure. Figure 3 is a flow chart of the control method CM of the automated probe card pick-up and placement device 100 according to one embodiment of the present disclosure. As shown in Figure 2, the automated probe card pick-up and placement device 100 further includes a control element CE. The control element CE is electrically or communicatively connected to the transport carrier 110, the overlap position adjustment module 120, the pick-up and placement assembly 140, and the telescopic member 150. Specifically, the control method CM of the automated probe card pick-up and placement device 100 is controlled by the control element CE. As shown in Figure 3, the control method CM of the automated probe card pick-up and placement device 100 includes step S10, step S12, step S14, and step S16. For a better understanding of step S10, please refer to Fig. 4. For a better understanding of step S12, please refer to Figs. 5 to 11. For a better understanding of step S14, please refer to Figs. 12 to 20. For a better understanding of step S16, please refer to Figs. 21 to 24.

The following will describe in detail the steps S10, S12, S14 and S16 of the control method CM of the automated probe card pick-and-place device 100.

Step S10: Control the transport vehicle 110 to move to a target position adjacent to the probe measuring machine 200.

Please refer to Figure 4. Figure 4 is a schematic diagram of an automated probe card placement device 100 and a probe tester 200 according to one embodiment of the present disclosure. For the sake of simplicity, some components of the automated probe card placement device 100 are omitted. In this embodiment, as shown in Figures 1, 2 and 4, the control element CE controls the automated probe card placement device 100 to move to a target position. Specifically, the control element CE can control the transport vehicle 110 to reach the target position along the route RT shown in Figure 1. For example, as shown in Figure 4, the target position is a position adjacent to the probe tester 200. As shown in Figure 4, the probe tester 200 includes a carrier 230, a reference positioning plate 260 and a positioning sleeve 270, and the probe tester 200 has a top surface 200a. The carrier 230 is disposed on the top surface 200a. In some embodiments, the carrier 230 is configured to carry a wafer and accommodate a probe card PC. The reference positioning plate 260 is configured to receive the light L from the sensing device 160. The positioning sleeve 270 is configured to be combined with the first positioning axis 170 of the automated probe card pick-and-place device 100. This will be described in more detail below.

In some implementations, the prober 200 may be, for example, a wafer prober that carries a wafer and performs electrical testing on integrated circuits of the wafer using a probe card PC.

Step S12: driving the overlapping position adjustment module 120 to calibrate the relative positions of the first accommodating shelf 132 , the second accommodating shelf 134 , and the pick-and-place assembly 140 with respect to the probe testing machine 200 .

In this embodiment, step S12 is performed before step S14, and step S12 is a pre-step of step S14. Step S12 is performed to adjust the positions of the first receiving shelf 132, the second receiving shelf 134, and the pick-and-place assembly 140 in space, thereby achieving the purpose of calibrating the relative positions of the first receiving shelf 132, the second receiving shelf 134, and the pick-and-place assembly 140 relative to the probe tester 200. Specifically, the control element CE performs step S12 to ensure that the first receiving shelf 132, the second receiving shelf 134, and the pick-and-place assembly 140 are aligned in three axial directions (e.g., direction X, direction Y, and direction Z).

Please refer to FIG. 5. FIG. 5 is a detailed flow chart of step S12 of the control method CM of the automated probe card placement device 100 according to one embodiment of the present disclosure. In this embodiment, step S12 further includes step S121, step S122, step S123 and step S124. For a better understanding of step S121, please refer to FIG. 6 and FIG. 7. For a better understanding of step S122, please refer to FIG. 8 and FIG. 9. For a better understanding of step S123, please refer to FIG. 10. For a better understanding of step S124, please refer to FIG. 11.

Step S121, step S122, step S123 and step S124 are described in detail below.

Step S121: Drive the two sensing devices 160 to emit light L toward the two reference positioning plates 260.

Please refer to FIG. 6. FIG. 6 is a partial enlarged view of the automated probe card placement device 100 and the probe testing machine 200 according to one embodiment of the present disclosure. In this embodiment, after the control element CE executes step S10, the control element CE controls the sensing device 160 to emit light L toward the reference positioning plate 260. Then, when the light L reaches the reference positioning plate 260, the light L is reflected by the reference positioning plate 260 and then sensed by the sensing device 160. Thereby, the control element CE can measure the distance value (The Value of Distance) between the sensing device 160 and the reference positioning plate 260 through the sensing device 160. In this embodiment, the automated probe card pick-up and placement device 100 substantially includes two sensing devices 160 (as shown in FIG. 13 ), and the two sensing devices 160 are located on both sides of the automated probe card pick-up and placement device 100. Therefore, the probe tester 200 also includes two reference positioning plates 260 accordingly. In this case, the control element CE can measure two distance values between the sensing device 160 on one side and the reference positioning plate 260 and between the sensing device 160 on the other side and the reference positioning plate 260 through the two sensing devices 160 located on both sides, as a basis for calibration.

Please refer to FIG. 7. FIG. 7 is a side view of the automated probe card placement device 100 and the probe tester 200 according to one embodiment of the present disclosure. In this embodiment, as shown in FIG. 7, the reference positioning plate 260 includes a positioning rod 262. In some embodiments, the positioning rod 262 is elongated and extended in a third direction (e.g., direction Z), and the positioning rod 262 protrudes from the reference positioning plate 260 along a second direction (e.g., direction Y). The provision of the positioning rod 262 helps the control element CE determine whether the operation of step S12 is completed. For example, when the light L emitted by the sensing device 160 senses the positioning rod 262, the distance value measured by the control element CE becomes smaller, thereby determining that the relative positions of the first accommodating shelf 132, the second accommodating shelf 134 and the pick-and-place assembly 140 relative to the probe machine 200 have reached the reference point.

In some embodiments, the distance between the two positioning rods 262 of the two reference positioning plates 260 is equal to the distance between the two sensing devices 160.

Step S122: Actuate the horizontal adjustment assembly 122 of the overlap position adjustment module 120 so that the supporting surface 132a of the first accommodating shelf 132 and the supporting surface 134a of the second accommodating shelf 134 connected to the horizontal adjustment assembly 122 are parallel to the top surface 200a of the probe tester 200.

Please refer to FIG. 8. FIG. 8 is a three-dimensional diagram of the horizontal adjustment assembly 122 according to one embodiment of the present disclosure. In this embodiment, the horizontal adjustment assembly 122 includes a first horizontal adjustment assembly 122A and a second horizontal adjustment assembly 122B. The first horizontal adjustment assembly 122A and the second horizontal adjustment assembly 122B are configured to adjust the leveling state of the first storage shelf 132, the second storage shelf 134 and the pick-and-place assembly 140. As shown in FIG. 8, the first horizontal adjustment assembly 122A includes a base 1221A and a first movable part MP1. The first movable part MP1 is connected to the base 1221A. The first movable part MP1 includes a connecting plate 1223A and two swing blocks 1222A connected to the connecting plate 1223A. The first movable part MP1 swings relative to the base 1221A. As shown in FIG. 8 , the second horizontal adjustment assembly 122B includes a base 1221B and a second movable part MP2. The second movable part MP2 is connected to the base 1221B. The base 1221B is connected to the connecting plate 1223A. The second movable part MP2 includes a connecting plate 1223B connected to the first accommodating shelf 132 and two swing blocks 1222B connected to the connecting plate 1223B. The second movable part MP2 swings relative to the base 1221B.

For example, as shown in FIG. 8 , the first movable portion MP1 swings relative to the base 1221A along an axis parallel to the direction Y, and the second movable portion MP2 swings relative to the base 1221B along an axis parallel to the direction X. Thus, the control element CE can adjust the leveling state of the first accommodating shelf 132, the second accommodating shelf 134, and the pick-and-place assembly 140 by actuating the leveling adjustment assembly 122. In detail, as shown in Figures 1, 4, 8 and 12, when the control element CE executes step S122, since the connecting plate 1223B is connected to the first accommodating shelf 132, the connecting plate 1223A and the connecting plate 1223B can be parallel to the top surface 200a of the probe machine 200, thereby making the supporting surface 132a of the first accommodating shelf 132 connected to the horizontal adjustment assembly 122 and the supporting surface 134a of the second accommodating shelf 134 both parallel to the top surface 200a of the probe machine 200.

Please refer to Figure 9. Figure 9 is a partially enlarged view of the horizontal adjustment assembly 122 according to one embodiment of the present disclosure. Figure 9 shows the structure of the horizontal adjustment assembly 122 in more detail. In order to more specifically illustrate how the horizontal adjustment assembly 122 works, the second horizontal adjustment assembly 122B is used as an example for explanation. It should be noted that the elements included in the first horizontal adjustment assembly 122A are similar to the elements included in the second horizontal adjustment assembly 122B, so the first horizontal adjustment assembly 122A is not described in detail here. As shown in Figure 9, the two swing blocks 1222B of the second horizontal adjustment assembly 122B have an arc-shaped slide groove 1224B, and the second horizontal adjustment assembly 122B further includes at least one roller 1225B and an actuator 1226. The roller 1225B is pivoted on the base 1221B and connected to the arc-shaped slide groove 1224B, so that the swing block 1222B can be slidably connected to the base 1221B. The actuator 1226 actuates the second movable part MP2 to make the second movable part MP2 swing relative to the base 1221B.

Step S123: Actuate the rotation adjustment assembly 124 of the overlap position adjustment module 120, so that the first accommodating shelf 132, the second accommodating shelf 134 and the pick-and-place assembly 140 connected to the rotation adjustment assembly 124 rotate with the center CTR of the rotation adjustment assembly 124 as the center.

Please refer to FIG. 10. FIG. 10 is a perspective view of the rotation adjustment assembly 124 and the lifting assembly 126 according to one embodiment of the present disclosure. In this embodiment, the rotation adjustment assembly 124 is configured to drive the first storage shelf 132, the second storage shelf 134 and the pick-and-place assembly 140 to rotate with the center CTR of the rotation adjustment assembly 124 as the center. Specifically, as shown in FIG. 1 and FIG. 10, since the rotation adjustment assembly 124 is connected to the first storage shelf 132 through the horizontal adjustment assembly 122, the first storage shelf 132, the second storage shelf 134 and the pick-and-place assembly 140 can be simultaneously rotated by the rotation adjustment assembly 124 along an axis parallel to, for example, the direction Z and passing through the center CTR. As shown in FIG. 10 , the rotation adjustment assembly 124 includes a movable platform 1242, a movable column 1243, a bearing ring 1244, and an actuator 1246. The movable column 1243 is connected to the four corners of the movable platform 1242, and the movable column 1243 is elongated and extended in a third direction (e.g., direction Z). The bearing ring 1244 is disposed on the movable platform 1242 and rotates around the center CTR. The actuator 1246 is connected to the bearing ring 1244, and the actuator 1246 is configured to reciprocate under the control of the control element CE to drive the bearing ring 1244 to rotate.

Please continue to refer to FIG. 10. The lifting assembly 126 is connected to the rotation adjustment assembly 124. In the present embodiment, the lifting assembly 126 is configured to drive the first storage shelf 132, the second storage shelf 134 and the pick-and-place assembly 140 to rise and fall. Specifically, as shown in FIG. 1 and FIG. 10, since the lifting assembly 126 is connected to the first storage shelf 132 through the rotation adjustment assembly 124 and the horizontal adjustment assembly 122, the first storage shelf 132, the second storage shelf 134 and the pick-and-place assembly 140 can be simultaneously raised and lowered along a third direction (e.g., direction Z) by the lifting assembly 126. As shown in FIG. 10, the lifting assembly 126 includes a base plate 1262, a column 1263 and an actuator 1266. The bottom plate 1262 extends parallel to the movable platform 1242. The cylinders 1263 are arranged at the four corners of the bottom plate 1262, and the cylinders 1263 are arranged corresponding to the movable columns 1243 and are reciprocatingly connected to the movable columns 1243. In other words, the lifting assembly 126 is connected to the rotation adjustment assembly 124 through the connection between the cylinders 1263 and the movable columns 1243. The actuator 1266 is arranged on the bottom plate 1262, and one end of the actuator 1266 is fixed to the bottom plate 1262, and the other end of the actuator 1266 is abutted against the movable platform 1242. In some embodiments, the actuator 1266 is configured to be controlled by the control element CE to actuate the rotation adjustment assembly 124 to rise and fall, so that the first storage shelf 132, the second storage shelf 134 and the pick-and-place assembly 140 can rise and fall along a third direction (e.g., direction Z) at the same time to achieve the purpose of adjusting the height.

In the present embodiment, the control element CE completes step S123 by means of two sensing devices 160. As shown in FIG. 1, FIG. 7 and FIG. 10, when the control element CE executes step S123, the control element CE not only actuates the rotation adjustment assembly 124, but also simultaneously monitors the two distance values of the light L reflected from the two reference positioning plates 260 sensed by the two sensing devices 160. When the control element CE determines that the two distance values are different, the control element CE actuates the actuator 1246 of the rotation adjustment assembly 124 to rotate the bearing ring 1244 to simultaneously drive the first accommodating shelf 132, the second accommodating shelf 134 and the pick-and-place assembly 140 to rotate with the center CTR of the rotation adjustment assembly 124 as the center until the two distance values are the same. When the control element CE determines that the two distance values are the same, the control element CE controls the actuator 1246 to stop moving so that the bearing ring 1244 stops rotating to complete the operation of step S123.

Step S124: Actuate the lateral displacement assembly 128 of the overlap position adjustment module 120 so that the first accommodating shelf 132 , the second accommodating shelf 134 , and the pick-and-place assembly 140 connected to the lateral displacement assembly 128 move laterally relative to the probe testing machine 200 .

Please refer to FIG. 11. FIG. 11 is a perspective view of the lateral displacement assembly 128 according to one embodiment of the present disclosure. In this embodiment, the lateral displacement assembly 128 is configured to actuate the first accommodating shelf 132, the second accommodating shelf 134 and the pick-and-place assembly 140 to move along a direction perpendicular to the actuation direction AD. Specifically, as shown in FIG. 1 and FIG. 11, since the lateral displacement assembly 128 is connected to the first accommodating shelf 132 via the lifting assembly 126, the rotation adjustment assembly 124, and the horizontal adjustment assembly 122, the first accommodating shelf 132, the second accommodating shelf 134, and the pick-and-place assembly 140 can simultaneously move laterally relative to the probe tester 200 along the lateral displacement direction LD perpendicular to the actuation direction AD via the lateral displacement assembly 128. As shown in FIG. 11, the lateral displacement assembly 128 includes a base 1282, two side walls 1283, a linear rail 1284, and an actuator 1286. As shown in FIG. 1, FIG. 10, and FIG. 11, the base 1282 is connected between the transport vehicle 110 and the lifting assembly 126. Two side walls 1283 are disposed at two ends of the base 1282 along the lateral direction LD. A rail 1284 is disposed on the base 1282, and the rail 1284 is elongated along the lateral direction LD. An actuator 1286 is connected to the bottom plate 1262 of the lifting assembly 126, and the actuator 1286 is configured to be controlled by the control element CE to reciprocate to drive the components above the lifting assembly 126 to move laterally relative to the probe machine 200.

In the present embodiment, the control element CE completes step S124 by means of two sensing devices 160. As shown in FIG. 1, FIG. 7 and FIG. 11, when the control element CE executes step S124, the control element CE not only actuates the lateral displacement assembly 128, but also simultaneously monitors whether the light L emitted by the two sensing devices 160 is respectively aligned with the two positioning rods 262 of the two reference positioning plates 260. When the control element CE determines that the light L emitted by the two sensing devices 160 is not aligned with the two positioning rods 262, the control element CE actuates the actuator 1286 of the lateral displacement assembly 128 to simultaneously drive the first accommodating shelf 132, the second accommodating shelf 134 and the pick-and-place assembly 140 to move laterally relative to the probe machine 200. When the control element CE determines that the light L emitted by the two sensing devices 160 is respectively aligned with the two positioning rods 262, the control element CE controls the actuator 1286 to stop moving so that the components above the lifting assembly 126 stop moving, thereby completing the operation of step S124.

Step S14: Actuate the telescopic member 150 to move the second accommodating shelf 134 and the pick-and-place assembly 140 , so that the second accommodating shelf 134 and the first accommodating shelf 132 are separated from each other in the actuation direction AD parallel to the telescopic member 150 .

Please refer to FIG. 12. FIG. 12 is a schematic diagram of the horizontal separation of the first storage shelf 132, the second storage shelf 134 and the pick-and-place assembly 140 according to an embodiment of the present disclosure. After the control element CE executes step S12, step S14 is executed. In this embodiment, the control element CE is configured to actuate the telescopic member 150 to move the second storage shelf 134 and the pick-and-place assembly 140 to unfold the automated probe card pick-and-place device 100, as shown in FIG. 12. As shown in FIG. 2 and FIG. 12 , when the control element CE actuates the first telescopic member 152 and the second telescopic member 154 to move the second storage shelf 134 and the pick-and-place assembly 140, the first storage shelf 132, the second storage shelf 134 and the pick-and-place assembly 140 are separated from each other in the actuation direction AD (i.e., horizontally separated).

Please refer to FIG. 13. FIG. 13 is an oblique top view of the automated probe card placement device 100 and the probe testing machine 200 according to one embodiment of the present disclosure. FIG. 13 shows the structure of the automated probe card placement device 100 and the probe testing machine 200 in more detail. As shown in FIG. 13, the automated probe card placement device 100 includes two sensing devices 160 on both sides, and the probe testing machine 200 includes a reference positioning plate 260 corresponding to the two sensing devices 160. In some embodiments, the positioning sleeve 270 has a recess R, and the recess R coincides with the first positioning shaft 170. For example, as shown in FIG. 13, the positioning sleeve 270 has three recesses R, and three first positioning shafts 170 are provided on the first telescopic member 152. Each first positioning axis 170 is provided corresponding to each recess R, and each first positioning axis 170 is configured to be combined with each recess R. However, the present disclosure is not intended to limit the number of recesses R and first positioning axes 170. In the present embodiment, the control element CE is configured to actuate the telescopic member 150 to move the second accommodating shelf 134 and the pick-and-place assembly 140 toward and away from the probe tester 200. As shown in FIGS. 2, 12, and 13, when the control element CE actuates the telescopic member 150 to move the second accommodating shelf 134 and the pick-and-place assembly 140 toward the probe tester 200, the first accommodating shelf 132, the second accommodating shelf 134, and the pick-and-place assembly 140 are horizontally separated.

Please refer to FIG. 14. FIG. 14 is a schematic diagram of a first state S1 of the automatic probe card placement device 100 and the probe tester 200 being overlapped according to one embodiment of the present disclosure. In step S14, the control element CE actuates the first telescopic member 152 and the second telescopic member 154 to further enable the automatic probe card placement device 100 and the probe tester 200 to overlap each other. In this embodiment, the first state S1 is an intermediate stage (Intermediate Stage) of the automatic probe card placement device 100 and the probe tester 200 being overlapped. As shown in FIG. 14 , when the control element CE actuates the first telescopic member 152 and the second telescopic member 154 to make the automated probe card pick-up and placement device 100 in the first state S1 (equivalent to the unfolded state of the automated probe card pick-up and placement device 100), the first positioning shaft 170 is located directly above the positioning sleeve 270. In this state, the first positioning shaft 170 has not yet been combined with the positioning sleeve 270, which means that the control element CE has not yet completed the overlapping operation of the automated probe card pick-up and placement device 100 and the probe testing machine 200.

Please refer to FIG. 15. FIG. 15 is a schematic diagram of the second state S2 of the overlap of the automated probe card placement device 100 and the probe testing machine 200 according to one embodiment of the present disclosure. In the present embodiment, the second state S2 is the completion stage of the overlap of the automated probe card placement device 100 and the probe testing machine 200. As shown in FIG. 15, when the automated probe card placement device 100 is in the first state S1, the control element CE then actuates the overlap position adjustment module 120 to descend along the lifting direction UD parallel to the third direction (e.g., direction Z), so that the first positioning shaft 170 provided on the first telescopic member 152 is engaged with the positioning sleeve 270, and the control element CE completes the overlap operation of the automated probe card placement device 100 and the probe testing machine 200. When the first positioning shaft 170 is engaged with the positioning sleeve 270 , the control element CE stops actuating the overlapping position adjustment module 120 .

Please refer to Figures 16 to 18 at the same time. Figure 16 is a three-dimensional view of the automatic probe card pick-up and placement device 100 and the probe tester 200 overlapped according to one embodiment of the present disclosure. Figures 17 and 18 are respectively a side view and a three-dimensional view of a floating assembly 129 according to one embodiment of the present disclosure. In this embodiment, a plurality of floating assemblies 129 are located at the top of the overlapping position adjustment module 120 and connected to the first accommodating shelf 132. In some embodiments, the automatic probe card pick-up and placement device 100 includes four floating assemblies 129, but the present disclosure is not intended to limit the number of floating assemblies 129. As shown in Figures 17 and 18, each floating assembly 129 includes a plurality of sliders stacked on top of each other. In this embodiment, each floating assembly 129 includes a first slider 1291, a second slider 1293, and a third slider 1296. The first slider 1291 includes a track 1292. The second slider 1293 includes a plurality of sliders 1294. The third slider 1296 includes a track 1295. The first slider 1291 is connected to the horizontal adjustment assembly 122. The third slider 1296 is connected to the first accommodating shelf 132. The track 1292 is disposed on the first slider 1291 and extends in a second direction (e.g., direction Y). The track 1295 is disposed on the third slider 1296 and extends in a first direction (e.g., direction X). The second slider 1293 is slidably connected to the first slider 1291 and the third slider 1296 via the slider 1294. Thus, the floating assembly 129 allows the first receiving shelf 132 and the horizontal adjustment assembly 122 to slide relative to each other in a first direction (eg, direction X) and a second direction (eg, direction Y).

Please refer to FIG. 19. FIG. 19 is a schematic diagram of a third state S3 of a locking structure 180 according to an embodiment of the present disclosure. In this embodiment, the automated probe card placement device 100 further includes a plurality of locking structures 180. The locking structures 180 are configured to fix the first accommodating shelf 132 to the overlapping position adjustment module 120 (i.e., locked state) and configured to allow the first accommodating shelf 132 to be movable relative to the overlapping position adjustment module 120 (i.e., unlocked state). As shown in FIG. 19, each locking structure 180 includes a sleeve member 182 connected to the first accommodating shelf 132 and a second positioning axis 186 disposed on the overlapping position adjustment module 120 and corresponding to the sleeve member 182. In some embodiments, the hole member 182 has a receiving space 184 configured to receive the second positioning shaft 186. The second positioning shaft 186 reciprocates in the receiving space 184. As shown in FIG. 19, the third state S3 is the unlocked state of the locking structure 180, because the second positioning shaft 186 has not yet engaged with the hole member 182. In some embodiments, the second positioning shaft 186 reciprocates along a third direction (e.g., direction Z).

Please refer to FIG. 20. FIG. 20 is a schematic diagram of a fourth state S4 of the locking structure 180 according to an embodiment of the present disclosure. As shown in FIG. 20, the fourth state S4 is a locked state of the locking structure 180, because the second positioning shaft 186 is engaged with the hole member 182. For example, the second positioning shaft 186 moves upward along the third direction (e.g., direction Z) to engage with the hole member 182.

Please also refer to Figures 14, 15 and 19. In one usage scenario, when the automated probe card pick-up and placement device 100 is unfolded from the state shown in FIG. 1 and converted to the first state S1, or when the automated probe card pick-up and placement device 100 is converted from the first state S1 to the second state S2, since the second positioning shaft 186 is not engaged with the hole member 182, when the automated probe card pick-up and placement device 100 is intended to overlap with the probe tester 200, the floating assembly 129 slides freely between the first accommodating shelf 132 and the horizontal adjustment assembly 122, and when the first positioning shaft 170 is combined with the positioning sleeve 270, even if the calibration is not completed accurately enough when executing step S12, the automated probe card pick-up and placement device 100 can still be successfully overlapped with the probe tester 200.

Please refer to Figures 14, 15 and 20. In another use scenario, when the automated probe card pick-up and placement device 100 is converted from the second state S2 to the first state S1, or when the automated probe card pick-up and placement device 100 is converted from the first state S1 to the folded state shown in Figure 1, since the second positioning shaft 186 is engaged with the hole member 182, when the automated probe card pick-up and placement device 100 is to be separated from the probe detection machine 200 or the automated probe card pick-up and placement device 100 is to be folded, the control element CE can actuate the overlap position adjustment module 120 and the telescopic fork in a stable state.

Step S16: activating the pick-and-place assembly 140 to pick up and place the probe card PC accommodated in the first accommodation shelf 132 , the second accommodation shelf 134 or the carrier 230 of the probe testing machine 200 .

Please refer to Figure 5, Figure 21 and Figure 22. After the control element CE executes step S14, it executes step S16. Specifically, after the control element CE completes the overlapping operation of the automated probe card pick-up and placement device 100 and the probe tester 200, it executes the operation of picking up and placing the probe card PC using the pick-up and placement assembly 140.

As shown in FIG. 21, it illustrates different implementations of step S16 in FIG. 3. FIG. 21 illustrates step S161 and step S162. FIG. 22 illustrates a partial three-dimensional view of the automated probe card placement device 100 and the probe testing machine 200 being overlapped. For the sake of simplicity, some components of the automated probe card placement device 100 are omitted in FIG. 22. After the control element CE executes step S14, the first accommodating shelf 132, the second accommodating shelf 134 and the placement assembly 140 are separated from each other in the actuation direction AD, as shown in FIG. 22. It should be noted that FIG. 22 shows a probe card PC accommodated in the second accommodating shelf 134, but in practice one or more probe cards PC may be accommodated in the first accommodating shelf 132, the second accommodating shelf 134 and/or the carrier 230 of the probe tester 200 in different usage scenarios. For a better understanding of step S161 and step S162, please refer to FIG. 21 and FIG. 22.

Step S161: Take the first probe card PC accommodated in the carrier 230 and place the first probe card PC in the first accommodation rack 132. Step S162: Take the second probe card PC accommodated in the second accommodation rack 134 and place the second probe card PC in the carrier 230.

Please refer to FIG. 21 and FIG. 22. In a use scenario, after executing step S14, step S161 is executed, and then step S162 is executed. For example, when the carrier 230 of the probe tester 200 contains an old probe card PC and the second receiving shelf 134 contains a new probe card PC, the pick-and-place assembly 140 takes the old probe card PC contained in the carrier 230 and places the old probe card PC in the first receiving shelf 132. Then, the pick-and-place assembly 140 takes the new probe card PC contained in the second receiving shelf 134 and places the new probe card PC in the carrier 230.

Please continue to refer to FIG. 21 and FIG. 22. In another use scenario, after executing step S14, execute step S161. For example, when the carrier 230 of the probe tester 200 contains a probe card PC, the pick-and-place assembly 140 takes the probe card PC contained in the carrier 230 and places the probe card PC in the first containing shelf 132. In some embodiments, when the first containing shelf 132 and the second containing shelf 134 do not contain any probe card PC, the pick-and-place assembly 140 can also take the probe card PC contained in the carrier 230 and place the probe card PC in the first containing shelf 132 or the second containing shelf 134.

Please continue to refer to FIG. 21 and FIG. 22. In another use scenario, after executing step S14, execute step S162. For example, when the second receiving shelf 134 receives the probe card PC, the pick-and-place assembly 140 takes the probe card PC received in the second receiving shelf 134 and places the probe card PC in the carrier 230. In some embodiments, when the first receiving shelf 132 receives the probe card PC, the pick-and-place assembly 140 may also take the probe card PC received in the first receiving shelf 132 and place the probe card PC in the carrier 230.

In an additional usage scenario, for example, when both the first accommodating shelf 132 and the second accommodating shelf 134 accommodate new probe cards PC, the pick-and-place assembly 140 takes the new probe card PC accommodated in the first accommodating shelf 132 and places it in the carrier 230. Then, the control element CE controls the transport carrier 110 to go to a target position adjacent to another probe tester 200, and the pick-and-place assembly 140 takes the new probe card PC accommodated in the second accommodating shelf 134 and places it in another carrier 230 of another probe tester 200.

In another additional use scenario, for example, when the carrier 230 and another carrier 230 respectively contain old probe cards PC, the pick-and-place assembly 140 takes the old probe card PC contained in the carrier 230 and places it in the first containing shelf 132. Then, the control element CE controls the transport carrier 110 to go to a target position adjacent to another probe tester 200, and the pick-and-place assembly 140 takes the old probe card PC contained in another carrier 230 of another probe tester 200 and places it in the second containing shelf 134.

From the above detailed description of the specific implementation of the present disclosure, it can be clearly seen that in the automatic probe card pick-up and placement device and the control method thereof disclosed in the present disclosure, since the overlap position adjustment module is equipped with a sensing device, and the telescopic member is equipped with a floating assembly, the automatic probe card pick-up and placement device and the probe testing machine can be precisely connected to facilitate the automatic loading and unloading of the probe card. In the automatic probe card pick-up and placement device and the control method thereof disclosed in the present disclosure, since the first accommodating shelf, the second accommodating shelf and the pick-up and placement assembly can be horizontally separated by the actuation of the telescopic member, the automatic probe card pick-up and placement device can complete the replacement operation of the new probe card and the old probe card at one time, or can simultaneously install a plurality of new probe cards and simultaneously recycle a plurality of old probe cards. In the automated probe card picking and placing device and control method disclosed herein, the automated probe card picking and placing device can be used in conjunction with a self-made front opening shipping box (FOSB) loading and unloading vehicle and an intelligent warehousing system under development to construct an intelligent factory of a cyber-physical (CP) system, thereby realizing full automation of the probe card loading and unloading system.

Although the present disclosure has been disclosed in the above implementation form, it is not intended to limit the present disclosure. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be determined by the scope of the attached patent application.

100: Automated probe card pick-up and placement device 110: Transport vehicle 120: Overlap position adjustment module 122: Horizontal adjustment assembly 122A: First horizontal adjustment assembly 122B: Second horizontal adjustment assembly 124: Rotation adjustment assembly 126: Lifting assembly 128: Horizontal displacement assembly 129: Floating assembly 130: Accommodation shelf 132: First accommodation shelf 132a, 134a: Loading surface 134: Second accommodation shelf 140: Pick-up and placement assembly 150: Telescopic member 152: First telescopic member 154: Second telescopic member 160: Sensing device 170: First positioning axis 180: Locking structure 182: Hole-shaped member 184: Accommodation space 186: Second positioning axis 200: Probe 200a: Top surface 230: Carrier 260: Reference positioning plate 262: Positioning rod 270: Positioning sleeve 1221A, 1221B: Base 1222A, 1222B: Pendulum block 1223A, 1223B: Connecting plate 1224B: Arc-shaped slide 1225B: Rolling member 1226, 1246, 1266, 1286: Actuator 1242: Movable platform 1243: Movable column 1244: Bearing ring 1262: base plate 1263: column 1282: base 1283: side wall 1284: track 1291: first slider 1292,1295: track 1293: second slider 1294: slider 1296: third slider AD: actuation direction CE: control element CM: control method CTR: center L: light LD: lateral direction MP1: first movable part MP2: second movable part PC: probe card R: recess RT: route S1: first state S2: second state S3: third state S4: fourth state S10, S12, S14, S16, S121, S122, S123, S124, S161, S162: Steps UD: Lifting direction X, Y, Z: Direction

In order to make the above and other purposes, features, advantages and embodiments of the present disclosure more clearly understandable, the attached drawings are described as follows: FIG. 1 is a three-dimensional diagram of an automated probe card pick-up and placement device according to an embodiment of the present disclosure. FIG. 2 is a functional block diagram of an automated probe card pick-up and placement device according to an embodiment of the present disclosure. FIG. 3 is a flow chart of a control method of an automated probe card pick-up and placement device according to an embodiment of the present disclosure. FIG. 4 is a schematic diagram of an automated probe card pick-up and placement device and a needle tester according to an embodiment of the present disclosure. FIG. 5 is a flow chart of a step of a control method of an automated probe card pick-up and placement device according to an embodiment of the present disclosure. FIG. 6 is a partial enlarged diagram of an automated probe card pick-up and placement device and a needle tester according to an embodiment of the present disclosure. FIG. 7 shows a side view of an automated probe card pick-up and placement device and a probe tester according to one embodiment of the present disclosure. FIG. 8 shows a three-dimensional view of a horizontal adjustment assembly according to one embodiment of the present disclosure. FIG. 9 shows a partially enlarged view of a horizontal adjustment assembly according to one embodiment of the present disclosure. FIG. 10 shows a three-dimensional view of a rotation adjustment assembly and a lifting assembly according to one embodiment of the present disclosure. FIG. 11 shows a three-dimensional view of a lateral displacement assembly according to one embodiment of the present disclosure. FIG. 12 shows a schematic diagram of horizontal separation of a first accommodating shelf, a second accommodating shelf, and a pick-up and placement assembly according to one embodiment of the present disclosure. FIG. 13 shows an oblique top view of an automated probe card pick-up and placement device and a probe tester according to one embodiment of the present disclosure. FIG. 14 is a schematic diagram of a first state of an automatic probe card pick-up and placement device and a needle tester according to an embodiment of the present disclosure. FIG. 15 is a schematic diagram of a second state of an automatic probe card pick-up and placement device and a needle tester according to an embodiment of the present disclosure. FIG. 16 is a three-dimensional diagram of an automatic probe card pick-up and placement device and a needle tester according to an embodiment of the present disclosure. FIG. 17 is a side view of a floating assembly according to an embodiment of the present disclosure. FIG. 18 is a three-dimensional diagram of a floating assembly according to an embodiment of the present disclosure. FIG. 19 is a schematic diagram of a third state of a locking structure according to an embodiment of the present disclosure. FIG. 20 is a schematic diagram of a fourth state of a locking structure according to an embodiment of the present disclosure. FIG. 21 is a flow chart showing a step of a control method of an automated probe card pick-up and placement device according to an embodiment of the present disclosure. FIG. 22 is a partial three-dimensional diagram showing a connection between an automated probe card pick-up and placement device and a probe testing machine according to an embodiment of the present disclosure.

Domestic storage information (please note in the order of storage institution, date, and number) None Foreign storage information (please note in the order of storage country, institution, date, and number) None

100: Automated probe card placement device

110: Transport Vehicles

120: Overlap position adjustment module

122: Horizontal adjustment assembly

124: Rotation adjustment assembly

126: Lifting assembly

128: Lateral displacement assembly

129: Floating assembly

130: Storage rack

132: First storage shelf

134: Second storage shelf

140: Pick and place components

150: Telescopic parts

152: First telescopic member

154: Second telescopic member

160:Sensor device

170: First positioning axis

AD: Actuation direction

L: Light

PC: Probe card

RT:Route

X,Y,Z: Direction

Claims (26)

An automated probe card pick-up and placement device comprises: a transport carrier; at least one storage shelf, located above the transport carrier and configured to accommodate a probe card; an overlap position adjustment module, disposed between the at least one storage shelf and the transport carrier; a pick-up and placement assembly, disposed above the at least one storage shelf and configured to pick-up and place the probe card; a plurality of retractable members, connected to the at least one storage shelf and connected between the pick-up and placement assembly and the at least one storage shelf; and a control element, electrically or communicatively connected to the transport carrier, the overlap position adjustment module, the retractable members and the pick-up and placement assembly, the control element being configured to: control the transport carrier to move to a target position adjacent to a probe detection machine; Driving the overlap position adjustment module to calibrate the relative position of the at least one storage shelf and the pick-and-place assembly relative to the probe machine; Actuating the retractable members to move the at least one storage shelf and the pick-and-place assembly toward and away from the probe machine; and Actuating the pick-and-place assembly to pick and place the probe card accommodated in the at least one storage shelf or a carrier of the probe machine. The automated probe card pick-and-place device as described in claim 1, wherein the at least one storage rack further comprises: a first storage rack, disposed on the overlap position adjustment module; and a second storage rack, movably disposed between the first storage rack and the pick-and-place assembly. An automated probe card placement device as described in claim 2, wherein the telescopic members are further connected between the first storage rack and the second storage rack and actuate the second storage rack to move toward and away from the first storage rack, and the second storage rack and the first storage rack are separated from each other in a driving direction parallel to the telescopic members. An automated probe card placement device as described in claim 3, wherein the overlapping position adjustment module includes a lateral displacement assembly, and the lateral displacement assembly actuates at least one accommodating shelf to move along a direction perpendicular to the actuation direction of the telescopic members. An automated probe card placement device as described in claim 1, wherein the overlapping position adjustment module includes a horizontal adjustment component, and the horizontal adjustment component actuates the at least one accommodating shelf to swing relative to the transport vehicle. The automated probe card placement device as described in claim 5, wherein the horizontal adjustment assembly further comprises: a base; a movable portion connected to the base and comprising a connecting plate connected to the at least one accommodating shelf and a swing block connected to the connecting plate, and the swing block has an arc-shaped slide groove; at least one roller, pivoted on the base and connected to the arc-shaped slide groove, so that the swing block can be slidably connected to the base; and an actuator, actuating the movable portion to swing the movable portion relative to the base. The automated probe card picking and placing device as described in claim 1 further comprises a plurality of sensing devices configured to emit and sense light. An automated probe card placement device as described in claim 1, wherein the overlapping position adjustment module includes a rotation adjustment assembly, and the rotation adjustment assembly causes the at least one accommodating shelf to rotate with the center of the rotation adjustment assembly as the center of the circle. The automated probe card placement device as described in claim 1 further comprises at least one first positioning axis disposed on the telescopic members, and the at least one first positioning axis is configured to be combined with a positioning sleeve of the probe testing machine. An automated probe card picking and placing device as described in claim 9, wherein the overlapping position adjustment module includes a plurality of floating components connected to the at least one accommodating shelf, each of the floating components includes a plurality of slide blocks stacked on each other, and the slide blocks include a first track extending along a first direction and a second track extending along a second direction perpendicular to the first direction. An automated probe card placement device as described in claim 9, wherein the overlapping position adjustment module further comprises a plurality of locking structures, and the locking structures are configured to fix the at least one accommodating shelf to the overlapping position adjustment module and configured to allow the at least one accommodating shelf to be movable relative to the overlapping position adjustment module. An automated probe card placement device as described in claim 11, wherein each of the locking structures includes a sleeve hole piece connected to the at least one accommodating shelf and a second positioning axis arranged on the overlapping position adjustment module and corresponding to the sleeve hole piece. A control method for controlling an automated probe card pick-and-place device, the automated probe card pick-and-place device comprising a transport carrier, a first storage shelf and a second storage shelf located above the transport carrier, an overlap position adjustment module connected between the first storage shelf and the transport carrier, a pick-and-place assembly located above the second storage shelf, and a plurality of retractable members connected between the first storage shelf and the second storage shelf and between the second storage shelf and the pick-and-place assembly, the control method comprising: Controlling the transport carrier to move to a target position adjacent to a probe test machine; Driving the overlap position adjustment module to calibrate a relative position of the first storage shelf, the second storage shelf, and the pick-and-place assembly relative to the probe test machine; Actuating the retractable members to move the second storage shelf and the pick-and-place assembly so that the second storage shelf and the first storage shelf are separated from each other in a direction parallel to the actuation of the retractable members; and Actuating the pick-and-place assembly to pick and place a probe card accommodated in the first storage shelf, the second storage shelf or a carrier of the probe testing machine. A control method as described in claim 13, wherein the step of actuating the retractable members to move the second storage shelf and the pick-and-place assembly separates the pick-and-place assembly and the second storage shelf from each other. The control method as described in claim 13, wherein the step of driving the overlapping position adjustment module to calibrate the relative positions of the first storage shelf, the second storage shelf and the pick-and-place assembly relative to the probe machine further comprises: Actuating a horizontal adjustment assembly of the overlapping position adjustment module so that a bearing surface of the first storage shelf and a bearing surface of the second storage shelf connected to the horizontal adjustment assembly are parallel to a top surface of the probe machine; Actuating a rotation adjustment assembly of the overlapping position adjustment module so that the first storage shelf, the second storage shelf and the pick-and-place assembly connected to the rotation adjustment assembly rotate with the center of the rotation adjustment assembly as the center; and Actuate a lateral displacement assembly of the overlap position adjustment module, so that the first accommodating shelf, the second accommodating shelf and the pick-and-place assembly connected to the lateral displacement assembly move laterally relative to the needle detection machine. A control method as described in claim 15, wherein the horizontal adjustment assembly further includes a connecting plate connecting the first storage shelf, the second storage shelf and the pick-and-place assembly, and the step of actuating the horizontal adjustment assembly of the overlapping position adjustment module makes the connecting plate parallel to the top surface of the probe machine. The control method as described in claim 15, wherein the automated probe card pick-up and placement device further comprises two sensing devices configured to emit and sense light, the probe test machine further comprises two reference positioning plates disposed on one top surface of the probe test machine and corresponding to the two sensing devices, and the step of driving the overlap position adjustment module to calibrate the relative positions of the first accommodating shelf, the second accommodating shelf and the pick-up and placement assembly relative to the probe test machine further comprises: Driving the two sensing devices to emit the light toward the two reference positioning plates. A control method as described in claim 17, wherein the step of actuating the rotation adjustment assembly of the overlapping position adjustment module makes the two sensing devices sense the same distance value of the light reflected from the two reference positioning plates. A control method as described in claim 17, wherein the step of actuating the lateral displacement assembly of the overlapping position adjustment module enables the light emitted by the two sensing devices to be respectively aligned with the two positioning rods of the two reference positioning plates. A control method as described in claim 13, wherein the automated probe card picking and placing device further includes at least one first positioning axis disposed on the telescopic parts, the probe testing machine further includes at least one positioning sleeve corresponding to the at least one first positioning axis, and the step of actuating the telescopic parts to move the second accommodating shelf and the picking and placing assembly causes the at least one first positioning axis to be combined with the at least one positioning sleeve. A control method as described in claim 20, wherein the overlapping position adjustment module further includes a plurality of locking structures, and the step of actuating the telescopic members to move the second storage shelf and the pick-and-place assembly enables the first storage shelf to be fixed to the overlapping position adjustment module by the locking structures or to be movable relative to the overlapping position adjustment module. A control method as described in claim 21, wherein the step of actuating the retractable members to move the second storage shelf and the pick-and-place assembly enables the first storage shelf to move relative to the overlap position adjustment module when the second storage shelf and the pick-and-place assembly move toward the carrier of the probe testing machine. A control method as described in claim 21, wherein the step of actuating the retractable members to move the second storage rack and the pick-and-place assembly enables the first storage rack to be fixed to the overlap position adjustment module when the second storage rack and the pick-and-place assembly move away from the carrier of the probe testing machine. A control method as described in claim 13, wherein the step of actuating the pick-and-place assembly takes the probe card contained in the carrier and places the probe card in the first containing shelf. A control method as described in claim 13, wherein the step of actuating the pick-and-place assembly takes the probe card contained in the second containing shelf and places the probe card in the carrier. The control method as described in claim 13, wherein the carrier accommodates a first probe card, the second accommodating shelf accommodates a second probe card, and the step of actuating the pick-and-place assembly further includes: taking the first probe card accommodated in the carrier and placing the first probe card in the first accommodating shelf; and after placing the first probe card in the first accommodating shelf, taking the second probe card accommodated in the second accommodating shelf and placing the second probe card in the carrier.

Images