TWI817783B - Film peeling device, layering equipment equipped with the same, and semiconductor manufacturing equipment - Google Patents

Abstract

Embodiments of the present invention provide a film peeling device capable of peeling a film from a wafer, a layering equipment and a semiconductor manufacturing equipment provided with the same. The film peeling device according to the present invention includes: a chuck placed on a wafer with a film attached thereon; a peeling roller so that an adhesive tape for peeling the film from the wafer is in contact with the film; and a peeling lever ( Bar), adjusting the peeling angle between the film to which the tape is attached and the wafer.

Description

Film peeling device, layering equipment equipped with the same, and semiconductor manufacturing equipment

The present invention relates to a film peeling device for removing a film attached to a wafer, a layering equipment and a semiconductor manufacturing equipment including the same.

Generally, a semiconductor element can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes. The semiconductor element formed as described above can be manufactured into a semiconductor package through a cutting process, a bonding process, and a packaging process.

Recently, in order to improve the degree of integration, a process in which semiconductor chips are stacked on a wafer has been vigorously adopted. On the other hand, as a method of bonding multiple wafers to a wafer simultaneously, it is considered to pre-bond each wafer to the wafer and then cover it with a film to create a high-temperature and high-pressure environment and use high-energy gas. The method of one-time bonding of wafers (Gas Assisted Bonding).

After the batch bonding is completed in this way, an additional process of removing the film from the wafer is required.

Therefore, embodiments of the present invention provide a film peeling device capable of peeling a film from a wafer, a layering equipment and a semiconductor manufacturing equipment provided with the same.

The problems to be solved by the present invention are not limited to the above-mentioned problems, and those having ordinary knowledge in the relevant technical field can clearly understand other problems to be solved that are not mentioned from the following description.

The film peeling device according to the present invention includes: a chuck placed on a wafer with a film attached thereon; a peeling roller so that an adhesive tape for peeling the film from the wafer is in contact with the film; and a peeling lever ( Bar), adjusting the peeling angle between the film to which the tape is attached and the wafer.

According to an embodiment of the present invention, the film peeling device further includes: a chuck driving part to move the chuck in a horizontal direction; and a roller rotation driving part to work synchronously with the chuck driving part and make the The peeling roller rotates. The roller rotation driving unit may rotate the peeling roller at the same speed as the movement speed of the chuck by the chuck driving unit.

According to an embodiment of the present invention, the peeling rod may be provided in a rod shape with a triangular cross-section.

According to an embodiment of the present invention, the film peeling device may further include: a peeling rod rotation driving part, which is combined with the peeling rod and drives the peeling rod to rotate, and adjusts the peeling rod through the rotation of the peeling rod. The angle at which the film peels off the wafer.

According to an embodiment of the present invention, the film peeling device may further include: a roller temperature adjustment part, which is disposed in the internal space of the peeling roller and adjusts the temperature of the peeling roller.

According to an embodiment of the present invention, the film peeling device may further include: a roller vertical driving part to move the peeling roller and the peeling rod in a vertical direction.

According to an embodiment of the present invention, the film peeling device may be equipped with: a chuck load sensor for measuring the pressure applied to both sides of the chuck, and the film peeling device may further include: a chuck The rotation drive unit rotates the chuck in order to align the chuck and the peeling roller based on the pressure applied to the chuck load sensor.

The layering equipment according to an embodiment of the present invention includes: a loading port that is supplied with wafers with films attached thereon; a wafer transport machine that transports the wafers; and a tape supply section that supplies tape for peeling off the film; a film peeling device that peels the film from the wafer using the tape; and a tape recovery unit that collects the tape to which the film is attached. The film peeling device includes: a chuck on which a wafer with a film attached is placed and is configured to move in a horizontal direction; and a peeling roller so that a tape for peeling off the film from the wafer is in contact with The film is configured to rotate at a speed corresponding to the moving speed of the chuck; and a peeling bar (Bar) adjusts a peeling angle between the film to which the tape is attached and the wafer.

According to an embodiment of the present invention, the tape supply unit may include: a supply tape storage unit that provides the supply tape in a rolled state to the film peeling device; a supply tension control unit that controls the tension of the supply tape; and a supply position control unit that controls the position of the supply tape.

According to an embodiment of the present invention, the supply tension control unit may include: a tape supply roller that supplies the supply tape to the film peeling device; and a supply tension measurement load sensor that measures the tension of the supply tape. ; A supply roller motor that provides power for rotating the tape supply roller; and a supply roller clutch that adjusts the binding force between the tape supply roller and the supply roller motor.

According to an embodiment of the present invention, the supply position control unit may include: a supply tape position sensor that measures the position of the supply tape; and a supply roller horizontal drive unit that determines the position of the supply tape according to the position of the supply tape through the supply tape position sensor. The measured position information of the tape supply moves the tape supply roller to adjust the horizontal position of the tape supply roller.

According to an embodiment of the present invention, the tape recycling unit may include: a recycling tape storage unit that stores the recycling tape with the film attached in a rolled state; a recycling tension control unit that controls the tension of the recycling tape; and a recycling position control unit to control the position of the recycling tape.

According to an embodiment of the present invention, the recycling tension control unit may include: a tape recycling roller to provide the recycling tape to the recycling tape storage unit; and a recycling tension measurement load sensor to measure the tension of the recycling tape Tension; a recovery roller motor that provides power for rotating the tape recovery roller; and a recovery roller clutch that adjusts the binding force between the tape recovery roller and the recovery roller motor.

According to an embodiment of the present invention, the recycling position control unit may include: a recycling tape position sensor to measure the position of the recycling tape; and a recycling roller horizontal drive unit to measure the position of the recycling tape based on the position sensor. The acquired position information of the tape recovery makes the tape recovery roller move to adjust the horizontal position of the tape recovery roller.

According to an embodiment of the present invention, the layering device may further include: a tape direction control unit that corrects the skew of the tape provided to the film peeling device.

According to an embodiment of the present invention, the tape direction control unit may include a tape correction roller configured to be rotatable relative to a vertical direction and to transfer the tape supplied from the tape supply unit to the film peeling device. Provided are: a tape position measurement sensor that measures the position of the tape supplied to the film peeling device; and a tape correction drive unit that controls rotational drive of the tape correction roller based on slope information of the tape.

According to an embodiment of the present invention, the layering equipment may further include: a feed speed control unit that works synchronously with the peeling roller and the chuck driving unit to control the supply speed and recovery speed of the tape.

According to an embodiment of the present invention, the layering device may further include: a supply tape replacement detection sensor disposed in the tape supply part and measuring the amount of supply tape wound in the supply tape storage part; and A recovery tape replacement detection sensor is provided in the tape recovery section and measures the amount of recovery tape wound in the recovery tape storage section.

According to an embodiment of the present invention, the layering device may further include: a supply tape replacement unit provided in the tape supply part and configured to hold the supply tape in order to cut the supply tape when replacing the supply tape. Both ends of the tape; and a recovered tape replacement unit provided in the tape recovery part and configured to hold both ends of the recovered tape in order to cut the recovered tape when replacing the recovered tape.

The semiconductor manufacturing equipment according to the present invention includes: a loading port that is supplied with wafers with films attached thereon; a wafer transfer module that transports the wafers; a process processing module that performs process processing on the wafers; and A delamination module removes the film from the wafer. The layered module includes: a tape supply part that supplies tape for peeling off the film; a film peeling device that uses the tape to peel off the film from the wafer; and a tape recovery part that recycles the tape attached to the film. Membrane tape. The film peeling device may include: a chuck that is placed on the wafer with the film attached thereon and is configured to be movable in a horizontal direction; and a peeling roller that is used to peel the film from the wafer. The tape is in contact with the film and is configured to be rotatable at a speed corresponding to the moving speed of the chuck; and a peeling bar (Bar) is provided in a bar shape and is driven by rotation to adjust the film to which the tape is attached and the peel angle between the wafers.

According to the present invention, the chuck on which the wafer is mounted is moved horizontally by the chuck drive unit, and the roller that brings the peeling tape into contact with the wafer operates in synchronization with the chuck, so that the film can be peeled off from the wafer more efficiently.

The effects of the present invention are not limited to the above-mentioned effects, and those with ordinary skill in the art can clearly understand other effects not mentioned above from the following description.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings so that those with ordinary skill in the technical field to which the present invention belongs can easily implement them. The invention can be implemented in various ways and is not limited to the embodiments described here.

In order to clearly explain the present invention, parts irrelevant to the description are omitted, and the same or similar components are designated with the same reference numerals throughout the entire specification.

In addition, in a plurality of embodiments, only the representative embodiment will be described using the same reference numerals for constituent elements having the same structure, and only structures different from the representative embodiment will be described in the remaining other embodiments.

Throughout this specification, when it is stated that a certain part is "connected (or combined)" with other parts, it is not only a case of "direct connection (or combination)", but also includes "indirect connection (or combination)" with other parts placed in the middle. " situation. In addition, when it is stated that a certain part "includes" a certain constituent element, as long as there is no special statement to the contrary, it means that other constituent elements may also be included rather than excluded.

Unless otherwise defined, all terms including technical or scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this invention belongs. Terms such as terms defined in commonly used dictionaries should be interpreted to have meanings consistent with the meanings they have in the relevant technical context, and will not be ideally or excessively interpreted as formal meanings as long as they are not clearly defined in this application. .

The present invention relates to a film removal device for removing a film attached to a wafer and a layering equipment and semiconductor manufacturing equipment equipped with the same. The structure and operation of the film removal device, layering equipment and semiconductor manufacturing equipment according to the invention will be described below. .

The film removal device according to the present invention can be used in a process of removing a film attached to a wafer. Here, the film can be pre-bonded to the wafer using high-temperature and high-pressure gases. A film used during the bonding process and removed from the wafer for subsequent processing. However, the scope of application of the film removal device according to the present invention is not limited, and it can be used in processes of peeling off and removing any kind of film-form attachments on a substrate (eg, wafer, glass).

The film removal device and the layering module according to the invention can be constructed as separate devices. In addition, the film removal device according to the present invention may be configured as a module in a semiconductor manufacturing equipment (for example, a bonding equipment) as shown in FIG. 19 . For example, the bonding equipment may include a plurality of process processing modules 1310, 1320 and a layering module 1240. As a module for removing the film remaining on the wafer after completing bonding in each chamber, it may include Membrane removal device according to the invention.

1 and 2 show the schematic structure of the layering device 1 according to the present invention. The layering equipment 1 according to the present invention can be disposed in a semiconductor manufacturing factory and is an equipment that performs the function of peeling off and removing the film F of the wafer W used in the previous process. The layering equipment 1 can peel off the film F from the wafer W, and provide the wafer W from which the film F has been removed to equipment used for the next process.

The layering apparatus 1 according to the present invention includes a loading port 10 to which a wafer W with a film F attached thereon is supplied, a wafer transfer machine 20 to transport the wafer W, and a tape supply part 40 to supply a tape T for peeling off the film F. , a film peeling device 30 that peels off the film F from the wafer W using the tape T, and a tape recovery unit 50 that recovers the tape T to which the film F is attached.

The film peeling device 30 according to the present invention includes a chuck 310 configured to be movable in the horizontal direction (X direction) on which the wafer W with the film F attached is placed, so that the film F is peeled off from the wafer W. The tape T is in contact with the film F and is configured as a peeling roller 320 that can rotate at a speed corresponding to the moving speed of the chuck 310 and a peeling bar (Bar) that adjusts the peeling angle between the film F to which the tape T is attached and the wafer W. 330.

According to the present invention, the film peeling device 30 includes a chuck driving part 340 that moves the chuck 310 in a horizontal direction, and a chuck driving part 340 that operates synchronously and causes the peeling roller 320 to move in the same direction as the chuck driving part 340 . The moving speed of 310 is the same as the speed of rotation of the roller rotation drive unit 325. The chuck 310 on which the wafer W is mounted is moved horizontally (in the The film F is peeled off the wafer W. In addition, the chuck 310 is moved while the position of the peeling roller 320 is fixed, so that compared with the case where the peeling roller 320 is moved while the position of the chuck 310 is fixed, the peeling roller 320 is positioned relative to the tape supply unit. 40 and the tape recovery part 50 are fixed in position, thereby simplifying the entire equipment structure.

The loading port 10 may be located outside the layering apparatus 1 and accommodate a transport container (eg, FOUP (Front Opening Unified Pod; Front Opening Unified Pod)) 5 for accommodating the wafer W. The transport container 5 can be placed in the loading port 10 through a transport device (for example: OHT (Overhead Hoist Transport; overhead transport)), and the wafer W after the peeling of the film F is completed can be put into the transport container 5 located in the loading port 10 again. For the subsequent process, it is transported by the transport device in a state of being loaded in the transport container 5 .

The wafer transfer machine 20 unloads the wafer W from the transfer container 5 placed in the loading port 10 , transfers the wafer W to the chuck 310 , and transfers the wafer W with the film F peeled off to the transfer container 5 again. The wafer transfer machine 20 may include a robot arm that supports the lower side of the wafer W and a robot arm that moves the robot arm in horizontal and vertical directions.

3 and 4 illustrate the film peeling device 30 according to the present invention.

The film peeling device 30 includes a chuck 310 on which the wafer W with the film F attached thereon is placed and is configured to be movable in the horizontal direction (X direction) so that the tape T for peeling the film F from the wafer W is in contact with The film F is further configured as a peeling roller 320 that can rotate at a speed corresponding to the moving speed of the chuck 310 and a peeling bar (Bar) 330 that adjusts the peeling angle between the film F to which the tape T is attached and the wafer W.

The chuck 310 is a structure having a certain area, and may be provided in a disk shape capable of placing the wafer W. The chuck 310 may include a wafer placement surface on which the wafer W is placed, and may be driven linearly or rotationally by a driving unit for driving the chuck 310 . According to one example, a temperature adjustment device for adjusting the temperature of the wafer W may be provided on the chuck 310 .

The peeling roller 320 is a cylindrical roller configured to be rotatable about a central axis, and can move the tape T by rotating in a state in which the tape T is wound. In particular, in order to peel off the film F of the wafer W, the peeling roller 320 may rotate in a state of being in contact with the film F at the upper end of the wafer W so that the film adheres to the tape T. The peeling roller 320 can be rotationally driven by the roller rotation driving unit 325 .

According to an embodiment, the film peeling device 30 may include a roller temperature adjustment part 322 disposed in an internal space of the peeling roller 320 and adjusting the temperature of the peeling roller 320 . The roller temperature adjustment unit 322 may be composed of a heater and/or a cooler, and may adjust the temperature of the peeling roller 320 to maintain the optimal temperature for peeling the film F.

The roller rotation driving part 325 is coupled to the peeling roller 320 and rotates the peeling roller 320 . The roller rotation drive unit 325 is connected to the central axis of the peeling roller 320 to rotate the peeling roller 320 . On the other hand, the roller rotation drive unit 325 is configured to operate in synchronization with the chuck drive unit 340 . That is, the rotation speed of the peeling roller 320 by the roller rotation drive unit 325 may be set to the same speed as the movement speed of the chuck 310 by the chuck drive unit 340. The roller rotation driving part 325 can operate through a control signal synchronized with the chuck driving part 340.

The peeling rod 330 is provided adjacent to the peeling roller 320 in the direction in which the tape T moves, and peels the film F from the wafer W while being attached to the tape T. The peeling bar 330 is spaced apart from the wafer W by a certain distance. The height of the peeling rod 330 relative to the chuck 310 may be configured to be higher than the height of the peeling roller 320 relative to the chuck 310 . That is, the peeling lever 330 may be located at a higher position than the peeling roller 320 .

The peeling rod 330 may be provided in a rod shape with a triangular cross-section. Each corner of the triangle forming the peeling rod 330 may have the same or different angles. The peeling angle of the film F can be variably adjusted by rotation of the peeling lever 330.

Referring to FIG. 5 , the adhesive tape T is attached to the film F above the wafer W in a state of being wound around the peeling roller 320 . Specifically, the film F is attached to the tape T by the horizontal movement of the chuck 310 and the rotation of the peeling roller 320 , and the tape T with the film F attached due to the peeling angle set by the peeling lever 330 moves to the tape recovery unit 50 .

According to an embodiment of the present invention, on the other hand, the film peeling device 30 includes a peeling rod rotation driving part 335 that is coupled to the peeling rod 330 and drives the peeling rod 330 to rotate. The peeling rod 330 is configured to be rotatable by the peeling rod rotation driving unit 335. As shown in FIGS. 6(a) and (b), the peeling angle of the film F can be adjusted by the rotation of the peeling rod 330.

According to an embodiment of the present invention, the film peeling device 30 may include a roller vertical driving part 360 that moves the peeling roller 320 and the peeling rod 330 in a vertical direction. The roller vertical driving part 360 can work in combination with the peeling roller 320 and the peeling rod 330, and move the peeling roller 320 and the peeling rod 330 along the vertical direction (Z direction). The roller vertical driving part 360 may be composed of a driving device such as a ball screw, a cylinder, or a linear motor. The roller vertical driving part 360 may be fixed to the structure 365 that fastens the peeling roller 320 and the peeling rod 330, and the peeling roller 320 and the peeling rod 330 may be raised and lowered together by the lifting and lowering drive of the roller vertical driving part 360.

According to an embodiment of the present invention, the film peeling device 30 may further include a chuck rotation driving part 350 that adjusts the slope of the chuck 310 in order to align the chuck 310 and the peeling roller 320. In order to accurately peel off the film F, it is important that the front portion of the peeling roller 320 is in close contact with the chuck 310 evenly. Therefore, it is necessary to align the peeling roller 320 and the chuck 310, and the inclination of the chuck 310 can be adjusted by the chuck rotation driving part 350. As shown in FIGS. 7 and 8 , the chuck rotation driving unit 350 may be provided below the chuck 310 and configured to rotate the chuck 310 about the horizontal axis (X-axis). The chuck rotation driving part 350 is located above the driving plate 315, and the driving plate 315 can move horizontally through the chuck driving part 340.

According to an embodiment of the present invention, load sensors 360A and 360B for measuring the load caused by the peeling roller 320 may be respectively provided on both sides of the chuck 310, and the chuck rotation driving unit 350 may be configured according to the load sensors 360A, 360B. The slope of the chuck 310 is adjusted based on the load measured by 360B. For example, as shown in FIG. 7 , a first chuck load sensor 360A and a second chuck load sensor 360B can be respectively configured on the left and right sides of the chuck 310 to respectively measure the load applied to the first chuck. Load F1 of sensor 360A and load F2 applied to second chuck load sensor 360B. The chuck rotation driving part 350 may adjust the slope of the chuck 310 by comparing the load F1 applied to the first chuck load sensor 360A and the load F2 applied to the second chuck load sensor 360B.

In addition, according to another embodiment of the present invention, as shown in FIG. 9 , elastic bodies 312A and 312B such as springs may be provided on both sides above the peeling roller 320 . The peeling roller 320 is configured to be able to swing to a certain extent by the elastic bodies 312A and 312B, so that the peeling roller 320 and the chuck 310 can be brought into uniform contact with each other by the force exerted by the elastic bodies 312A and 312B.

Next, the tape supply unit 40 that supplies the tape T to the film peeling device 30 and the tape recovery unit 50 that collects the tape T to which the film F is attached will be described.

According to the present invention, the tape supply unit 40 includes a supply tape storage unit 405 that supplies the supply tape UT in a rolled state to the film peeling device 30, a supply tension control unit 40A that controls the tension of the supply tape UT, and a supply unit that controls the position of the supply tape UT. Position control unit 40B.

The supply tape storage unit 405 may store the supply tape UT supplied in the form of a reel, and the tape wound around the supply tape storage unit 405 may be supplied to the film peeling device 30 through each roller included in the tape supply unit 40 . Supply tape UT.

As shown in FIG. 10 , the supply tape storage unit 405 may be provided with a tape supply roller 410 for winding the tape, a supply roller motor 430 that provides power for rotating the tape supply roller 410 , and an adjustable tape supply roller 410 and a supply roller. The supply roller clutch 440 of the coupling force between the roller motor 430 further includes a supply roller horizontal driving part 465 for moving the tape supply roller 410 in order to align the center position of the tape supply roller 410 .

According to an embodiment of the present invention, the supply tension control unit 40A that controls the tension of the supply tape UT may include a tape supply roller 410 that supplies the supply tape UT to the film peeling device 30 , a supply tension measurement load sensor that measures the tension of the supply tape UT. 420 , a supply roller motor 430 that provides power for rotating the tape supply roller 410 , and a supply roller clutch 440 that adjusts the coupling force between the tape supply roller 410 and the supply roller motor 430 .

The supply tension measurement load sensor 420 may be provided on one of the rollers that supplies the supply tape UT to the film peeling device 30, and may measure the pressure (tension) of the supply tape UT generated in the corresponding roller and supply it to the control supply roller motor. 430 and a controller (not shown) supplying roller clutch 440 are provided. The controller may control the supply roller clutch 440 so that the tension of the supply tape UT remains at a certain level. For example, the supply roller clutch 440 may be maintained in a state in which the tape supply roller 410 and the supply roller motor 430 are partially coupled (half-clutch state). However, when the tension of the supply tape UT is lower than the reference range, it may be that the supply roller clutch 440 fully couples the tape supply roller 410 with the supply roller motor 430 and the supply roller motor 430 causes the tape supply roller 410 to unhook at a higher tension than the supply tape UT. The current speed is rotated at a low speed to increase the tension of the supply tape UT. When the tension of the supply tape UT is higher than the reference range, it may be that the supply roller clutch 440 couples the tape supply roller 410 with the supply roller motor 430 and the supply roller motor 430 causes the tape supply roller 410 to unwind at a current speed faster than the supply tape UT. Rotate at a high speed to reduce the tension of the supply tape UT. If the tension of the supply tape UT is measured to be within the reference range, the supply roller clutch 440 releases the coupling between the tape supply roller 410 and the supply roller motor 430 .

According to another embodiment of the present invention, a tension adjustment mechanism 480 for adjusting the tension of the supply tape UT may be provided. The tension adjustment mechanism 480 may include a rotation arm 484 that is rotatable about the rotation axis 482 and a tension adjustment roller 486 that is fixed to the rotation arm 484 and is rotatable. As shown in FIG. 11 , the tension adjustment roller 486 may be in contact with the supply tape UT and the rotation arm 484 may be configured to rotate about the rotation axis 482 . The rotating arm 484 can rotate based on the pressure measured by the supply tension measurement load sensor 420. Referring to FIG. 11, when the tension of the supply tape UT is low, the rotating arm 484 rotates clockwise to increase the supply tape UT. When the tension of the supply tape UT is high, the rotating arm 484 rotates counterclockwise to reduce the tension of the supply tape UT. The tension adjustment mechanism 480 may be similarly configured as a part of the recovery tension control part 50A in order to adjust the tension of the recovery tape RT.

According to an embodiment of the present invention, the supply position control part 40B may include a supply tape position sensor 450 that measures the position of the supply tape UT and the tape supply roller 410 according to the position information of the supply tape measured by the supply tape position sensor 450 The supply roller horizontal drive unit 465 moves to adjust the horizontal position of the tape supply roller 410 .

Referring to FIG. 12 , the supply tape position sensor 450 may be disposed on a roller on the route from the supply tape storage unit 405 to the film peeling device 30 , and may measure the relative position of the supply tape UT with respect to the roller. That is, the supply tape position sensor 450 can confirm whether the supply tape UT is located in the center or deviated to the left or right side. If it is confirmed by the supply tape position sensor 450 that the supply tape UT deviates in a specific direction, a process for correcting the position of the supply tape UT toward the center may be performed.

The supply roller horizontal drive unit 465 can adjust the horizontal position (Y-direction position) of the tape supply roller 410 based on the position of the supply tape UT measured by the supply tape position sensor 450 . More specifically, referring to FIG. 12 , the tape supply roller 410 is coupled to the horizontal movement structure 415 , and the supply roller horizontal drive portion 465 moves the horizontal movement structure 415 so that the position of the tape supply roller 410 can be adjusted. For example, when the supply tape UT deviates in the -Y direction, the tape supply roller 410 may be moved in the +Y direction, and when the supply tape UT deviates in the +Y direction, the tape supply roller 410 may be moved in the -Y direction.

As described above, the tape supply unit 40 can supply the supply tape UT having a certain tension to the film peeling device 30 in a state aligned with the center portion. The film F peeled off by the film peeling device 30 can be supplied again to the tape collection part 50 which collects the tape in a state attached to the tape T.

According to the present invention, the tape recovery unit 50 may include a recovery tape storage unit 505 that stores the recovery tape RT to which the film F is attached in a rolled state, a recovery tension control unit 50A that controls the tension of the recovery tape RT, and controls the position of the recovery tape RT. The recovery position control unit 50B.

The recovered tape storage unit 505 may store the recovered tape RT in a roll form, and the recovered tape RT may be supplied from the film peeling device 30 to the recovered tape storage unit 505 via rollers included in the tape recovery unit 50 and then stored in a rolled state.

The recovered tape storage unit 505 may be provided with a tape recovery roller 510 that winds the recovery tape RT, a recovery roller motor 530 that provides power for rotating the tape recovery roller 510, and the adjustment tape recovery roller 510 and the recovery roller motor 530. The recovery roller clutch 540 of the binding force between the adhesive tape recovery roller 510 and the recovery roller clutch 540 further includes a recovery roller horizontal driving part 565 for moving the tape recovery roller 510 in order to align the center position of the tape recovery roller 510 .

According to an embodiment of the present invention, the recovery tension control unit 50A that controls the tension of the recovery tape RT may include a tape recovery roller 510 that recovers the recovery tape RT from the film peeling device 30 , and a recovery tension measurement load sensor that measures the tension of the recovery tape RT. 520 , a recovery roller motor 530 that provides power for rotating the tape recovery roller 510 , and a recovery roller clutch 540 that adjusts the coupling force between the tape recovery roller 510 and the recovery roller motor 530 .

13 , the recovery tension measurement load sensor 520 may be provided on one of the rollers that supplies the recovery tape RT from the film peeling device 30 to the recovery tape storage unit 505 , and may measure the pressure of the recovery tape RT generated in the corresponding roller ( Tension) and provide it to a controller (not shown) that controls the recovery roller motor 530 and the recovery roller clutch 540. The controller may control the recovery roller clutch 540 so that the tension of the recovery tape RT remains at a certain level. For example, the recovery roller clutch 540 may be maintained in a state where the tape recovery roller 510 and the recovery roller motor 530 are not completely coupled or partially coupled (a half-clutch state). However, when the tension of the recovery tape RT is lower than the reference range, it may be that the recovery roller clutch 540 completely combines the tape recovery roller 510 with the recovery roller motor 530 and the recovery roller motor 530 causes the tape recovery roller 510 to unwind at a higher speed than the recovery tape RT. The current speed rotates at a high speed to increase the tension of the recovery tape RT. When the tension of the recovery tape RT is higher than the reference range, it may be that the recovery roller clutch 540 couples the tape recovery roller 510 with the recovery roller motor 530 and the recovery roller motor 530 causes the tape recovery roller 510 to unwind at a current speed faster than the recovery tape RT. Rotate at a low speed to reduce the tension of the recovery tape RT. If the tension of the recovered tape RT is measured to be within the reference range, the recovery roller clutch 540 releases the coupling between the tape recovery roller 510 and the recovery roller motor 530 .

According to an embodiment of the present invention, the recycling position control unit 50B may include a recycling tape position sensor 550 that measures the position of the recycling tape RT, and controls the tape recycling roller according to the position information of the recycling tape measured by the recycling tape position sensor 550 . The recovery roller horizontal driving part 565 moves the tape recovery roller 510 to adjust the horizontal position of the tape recovery roller 510 .

The recovered tape position sensor 550 may be disposed on a roller on the route from the film peeling device 30 to the recovered tape storage unit 505 , and may measure the relative position of the recovered tape RT with respect to the corresponding roller. That is, the recovery tape position sensor 550 can confirm whether the recovery tape RT is located at the center of the roller or deviated to the left or right side. If it is confirmed by the recovery tape position sensor 550 that the recovery tape RT deviates in a specific direction, a process for correcting the position of the recovery tape RT toward the center may be performed.

The recovery roller horizontal drive unit 565 can adjust the horizontal position (Y-direction position) of the tape recovery roller 510 based on the position of the recovery tape RT measured by the recovery tape position sensor 550 . More specifically, referring to FIG. 14 , the tape recovery roller 510 is coupled to the horizontal movement structure 515 , and the recovery roller horizontal driving part 565 moves the horizontal movement structure 515 so that the position of the tape recovery roller 510 can be adjusted. For example, when the recovered tape RT deviates in the -Y direction, the tape recovery roller 510 may be moved in the +Y direction, and when the recovered tape RT deviates in the +Y direction, the tape recovery roller 510 may be moved in the -Y direction.

The layering apparatus 1 according to the present invention further includes a feed speed control part 60 that operates synchronously with the peeling roller 320 and the chuck driving part 340 and controls the supply and recovery speed of the tape T.

The feed speed control unit 60 can operate synchronously with the peeling roller 320 and the chuck driving unit 340 of the film peeling device 30, and can operate when the speed control of the entire tape T is required. That is, the feed speed control unit 60 adjusts the overall moving speed of the tape T, and the peeling roller 320 and the chuck driving unit 340 operate in synchronization with the feed speed control unit 60 to achieve smooth peeling of the film F. The supply roller motor 430 and the recovery roller motor 530 that drive the tape supply roller 410 and the tape recovery roller 510 provide power for supplying and recovering the tape T, but the supply roller clutch 440 and the recovery roller clutch 540 usually operate in a half-clutch state. , and cooperates with the feed speed control unit 60 to adjust the rotation speeds of the tape supply roller 410 and the tape recovery roller 510 .

Referring to FIGS. 15a and 15b , the feed speed control part 60 may include an upper feed roller 610 and a lower feed roller 620 , a lower structure 630 combined with the lower feed roller 620 , and a cylinder for raising and lowering the lower feed roller 620 640. The upper feed roller 610 may be configured to be rotatable by a feed speed control motor 615 , and the feed speed of the tape T may be determined by the feed speed control motor 615 . On the other hand, the lower feed roller 620 can be raised or lowered by the air cylinder 640. If the lower feed roller 620 is raised, both sides of the recovery tape RT are in close contact with the upper feed roller 610 and the lower feed roller 620. 610 adjusts the speed of recycling tape RT.

The lamination apparatus 1 according to the present invention may include a tape direction control section 70 that corrects the skew of the tape T supplied to the film peeling device 30 . The tape T is located at the center of the peeling roller 320 and needs to be prevented from skewing to one side. The tape direction control unit 70 can measure the position of the tape T supplied to the peeling roller 320 and correct the skew of the tape T so that the tape T is centered.

According to an embodiment of the present invention, the tape direction control part 70 may include a tape correction roller 710 configured to be rotatable relative to the vertical direction and supply the tape T supplied from the tape supply part 40 to the film peeling device 30 , a measuring direction film peeling device A tape position measurement sensor 720 for measuring the position of the supplied tape T and a tape correction drive unit 730 for controlling the rotational drive of the tape correction roller 710 based on the position information of the tape.

As shown in FIGS. 16a and 16b , the tape correcting roller 710 is provided in a form like a conveyor belt, and guides the tape T supplied from the tape supply unit 40 to the film peeling device 30 . The tape correction roller 710 is coupled to the tape correction drive unit 730 so as to be rotatable about a vertical axis (Z-axis). The tape correction drive unit 730 can rotate the tape correction roller 710 based on the skew information of the tape T to align the tape T with the center of the peeling roller 320 . The tape position measurement sensor 720 may be located in a portion of the tape correction roller 710 facing the film peeling device 30 as shown in FIGS. 16a and 16b , and a controller that controls the tape correction drive unit 730 to measure the position of the tape T may be provided. (not shown). When the tape T deviates to the left or right side, the controller that controls the tape correction drive unit 730 controls the tape correction drive unit 730 to rotationally drive the tape correction roller 710 . The tape correction roller 710 is rotationally driven by the tape correction drive unit 730 to correct the position of the tape T.

According to the present invention, the layering apparatus 1 may include a supply tape replacement detection sensor 407 provided in the tape supply unit 40 and measuring the amount of supply tape UT wound in the supply tape storage unit 405, and a supply tape replacement detection sensor 407 provided in the tape recovery unit 50. The recovery tape replacement detection sensor 507 measures the amount of recovery tape RT wound in the recovery tape storage unit 505 . Referring to FIG. 17 , the supply tape replacement detection sensor 407 may include a distance sensor using a laser, and the distance between the supply tape replacement detection sensor 407 and the supply tape UT may be measured to calculate the amount of the remaining supply tape UT. . Likewise, the recycled tape replacement detection sensor 507 may include a distance sensor using laser, and the distance between the recycling tape replacement detection sensor 507 and the recycling tape RT may be measured to calculate the amount of remaining recycling tape RT.

When the supply tape UT is completely exhausted, a new supply tape roll needs to be put in to replace all the exhausted supply tape rolls. Likewise, when the amount of recycled tape RT exceeds the reference, a new recycled tape roll needs to be put in and the recycled tape roll on which recycled tape RT is wound needs to be replaced. The layering apparatus 1 according to an embodiment of the present invention may include means for efficiently replacing the supply tape UT or the recovery tape RT.

According to an embodiment of the present invention, the supply tape replacement unit 45 provided in the supply tape storage unit 405 and configured to hold both ends of the supply tape UT in order to cut the supply tape UT when replacing the supply tape UT may be included, and the supply tape replacement unit 45 provided in the tape may be included. The recovery unit 50 is also configured as a recovery tape replacement unit 55 that holds both ends of the recovery tape RT in order to cut the recovery tape RT when replacing the recovery tape RT.

18 , the supply tape replacement unit 45 includes chucks 470A, 470B, 470C, and 470D for holding both ends of the supply tape UT and upper and lower shear guides 472 and lower shear guides for cutting the supply tape UT. slot474. When the supply tape UT needs to be replaced, the supply tape UT can be fixed by the chucks 470A, 470B, 470C, and 470D, and the operator cuts the supply tape UT along the upper shearing guide groove 472 and the lower shearing guide groove 474. If the existing supply tape UT is cut and a new supply tape UT is placed, the end of the new supply tape UT is connected to the end of the existing supply tape UT, so that the supply tape UT can be connected without interruption.

Similarly, the recovery tape replacement unit 55 includes chucks 570A, 570B, 570C, and 570D for holding both ends of the recovery tape RT, and upper and lower cutting guides 572 and 574 for cutting the recovery tape RT. . When the recycling tape RT needs to be replaced, the recycling tape RT can be fixed through the chucks 570A, 570B, 570C, and 570D, and the operator cuts the recycling tape RT along the upper shearing guide groove 572 and the lower shearing guide groove 574. When the recovery tape RT is cut, the upper recovery tape RT remains and the lower recovery tape RT is removed. If the existing recycling tape RT is cut and a new recycling tape RT is put in, the end of the new recycling tape RT is connected to the end of the existing recycling tape RT, so that the recycling tape RT can be connected without interruption.

On the other hand, the film peeling device 30 according to the present invention may be configured as a part of the layered module 1240 for peeling off the film F on the wafer W inside the semiconductor manufacturing equipment 1000.

As shown in FIG. 19 , a semiconductor manufacturing equipment 1000 according to the present invention includes a loading port 1100 for supplying a wafer W with a film F attached thereon, a wafer transfer module 1200 for transporting the wafer W, and a process for performing process processing on the wafer W. The process processing modules 1310 and 1320 and the layering module 1240 for removing the film F on the wafer W. The layering module 1240 includes a tape supply part 40 that is supplied with tape T for peeling off the film F, a film peeling device 30 that uses the tape T to peel off the film F from the wafer W, and a tape recovery part that collects the tape T to which the film F is attached. 50. The film peeling device 30 includes a chuck 310 on which the wafer W with the film F attached thereon is placed and can move in the horizontal direction (X direction) so that the tape T for peeling the film F from the wafer W is in contact with The film F is also configured as a peeling roller 320 that can rotate at a speed corresponding to the moving speed of the chuck 310 and a peeling roller 320 provided in a rod shape and adjusted by rotational driving to adjust the peeling angle between the film F to which the tape T is attached and the wafer W. Bar 330. On the other hand, although omitted in FIG. 19 , a wafer transfer machine for transporting the wafer W may be configured inside the layer module 1240 .

The loading port 1100 may be located outside the semiconductor manufacturing equipment 1000 and accommodate a transport container for containing the wafer W. The transport container can be placed in the loading port 1100 through a transport device, and the wafer W after the peeling of the film F is completed can be put again into the transport container at the loading port 1100 and then transported through the transport device in a state of being loaded in the transport container for subsequent processes.

The wafer transfer module 1200 transfers the wafer W between modules within the semiconductor manufacturing equipment 1000 . The wafer transfer module 1200 includes a robot that holds the lower part of the wafer W and supplies the wafer W to each module, and a transfer guide 1210 that moves the robot.

The process processing modules 1310 and 1320 perform process processing on the wafer W with the film F attached or the wafer W with the film F removed by the layering module 1240 . For example, the process processing modules 1310 and 1320 may be configured as chambers that perform batch bonding using high-temperature and high-pressure gas on wafers W pre-bonded with a plurality of die and with a film F attached thereon. Not only that, the process processing modules 1310 and 1320 can be composed of modules capable of performing various process processes such as coating, etching, evaporation, and cleaning.

The layering module 1240 can remove the film F attached to the wafer W that has been processed by the process processing modules 1310 and 1320 or the wafer W that is dropped from the loading port 1100 . The delamination module 1240 may include a similar structure to the film peeling device 30 and the delamination equipment 1 described above with reference to FIGS. 1 to 18 .

The present embodiments and the drawings attached to this specification only clearly illustrate a part of the technical concepts included in the present invention. It is obvious that those with ordinary skill in the relevant technical field can interpret the technical concepts included in the description and drawings of the present invention. Variations and specific embodiments that are easily derived within the scope of the technical concept are included in the patentable scope of the present invention.

Therefore, the concept of the present invention should not be limited to the illustrated embodiments. Not only the appended patent scope, but also all concepts that are equivalent or equivalent modifications of the patent scope fall within the scope of the concept of the present invention.

1: Layered equipment 5:Conveyor container 10:Loading port 20:Wafer transfer machine 30: Film peeling device 40:Tape supply department 40A: Supply tension control department 40B: Supply location control department 45: Supply of tape replacement unit 50: Tape recycling department 50A: Recovery tension control section 50B: Recovery position control department 55: Recycling tape replacement unit 60: Feed speed control department 70: Tape direction control part 310:Chuck 315:Driver board 312A: Elastomer 312B: Elastomer 320: Peeling roller 322:Roller temperature adjustment section 325:Roller rotation drive unit 330: Stripping rod 335: Peeling rod rotation drive part 340:Chuck drive department 350:Chuck rotation drive unit 360: Roller vertical drive unit 360A: The first chuck load sensor 360B: Second chuck load sensor 365:Structure 405: Supply tape storage department 407:Supply of tape replacement detection sensors 410:Tape supply roller 415: Horizontally moving structures 420: Supply of tension measurement load sensor 430:Supply roller motor 440: Supply roller clutch 450:Supply of tape position sensor 465: Supply roller horizontal drive section 470A:Chuck 470B:Collet 470C: Chuck 470D:Collet 472: Upper shear guide groove 474: Lower shear guide groove 480: Tension adjustment mechanism 482:Rotation axis 484:Swivel arm 486: Tension adjustment roller 505: Recycling tape storage department 507: Recycling tape replacement detection sensor 510:Tape recovery roller 515: Horizontally moving structure 520: Recycling tension measurement load sensor 530:Recovery roller motor 540:Recovery roller clutch 550: Recycling tape position sensor 565: Recovery roller horizontal drive unit 570A:Collet 570B:Collet 570C:Collet 570D:Collet 572: Upper shear guide groove 574: Lower shear guide groove 610: Upper feed roller 615: Feed speed control motor 620: Lower feed roller 630: Lower structure 640:Cylinder 710:Tape correction roller 720: Tape position measurement sensor 730: Tape correction drive unit 1000:Semiconductor manufacturing equipment 1100:Loading port 1200: Wafer transfer module 1210:Transmission guide 1240:Layered module 1310: Process processing module 1320: Process processing module F: membrane F1: Load F2: Load RT: Recycling tape T:Tape UT: supply tape W:wafer

1 and 2 show the schematic structure of the hierarchical device according to the present invention.

3 and 4 illustrate a film peeling device according to the present invention.

Figure 5 shows a process of peeling off a film in the film peeling device according to the present invention.

6 shows a process of adjusting the peeling angle of the film in the film peeling device according to the present invention.

7 to 9 illustrate a structure for aligning a wafer and a chuck in the film peeling device according to the present invention.

10 and 11 illustrate a schematic structure of a supply tension control unit that controls the tension of a supply tape in the layering apparatus according to the present invention.

12 shows a schematic structure of a supply position control section that controls the position of supplying tape in the layering apparatus according to the present invention.

13 shows a schematic structure of a recycling tension control section that controls the tension of a recycling tape in the layering apparatus according to the present invention.

FIG. 14 shows the schematic structure of the recycling position control section that controls the position of the recycling tape in the layering equipment according to the present invention.

15a and 15b show the schematic structure of the feed speed control unit that controls the supply and recovery speed of the tape in the layering equipment according to the present invention.

16a and 16b illustrate a tape direction control unit that corrects the horizontal skew of the tape in the layering device according to the present invention.

Figure 17 shows the operation of the tape change detection sensor in the layering device according to the present invention.

Figure 18 shows a tape changing unit for changing tapes in a layering device according to the invention.

FIG. 19 shows a semiconductor manufacturing equipment to which the layered module according to the present invention is applied.

1: Layered equipment

5:Conveyor container

10:Loading port

20:Wafer transfer machine

30: Film peeling device

40:Tape supply department

40A: Supply tension control department

40B: Supply location control department

45: Supply of tape replacement unit

50: Tape recycling department

50A: Recovery tension control section

50B: Recovery position control department

55: Recycling tape replacement unit

60: Feed speed control department

70: Tape direction control part

310:Chuck

320: Peeling roller

330: Stripping rod

340:Chuck drive department

350:Chuck rotation drive unit

405: Supply tape storage department

505: Recycling tape storage department

W:wafer

Claims (19)

A film peeling device includes: a chuck placed on a wafer with a film attached thereon and configured to move in a horizontal direction; and a peeling roller so that an adhesive tape for peeling the film from the wafer is in contact with The film is configured to rotate at a speed corresponding to the moving speed of the chuck; and a peeling lever adjusts a peeling angle between the film to which the tape is attached and the wafer, wherein the The stripping rod is provided in a rod shape with a triangular cross-section. The film peeling device according to claim 1, wherein the film peeling device further includes: a chuck driving part that moves the chuck in a horizontal direction; and a roller rotation driving part that is in contact with the chuck driving part. The peeling roller is operated synchronously and rotates, and the roller rotation driving unit rotates the peeling roller at the same speed as the movement speed of the chuck by the chuck driving unit. The film peeling device according to claim 1, wherein the film peeling device further includes: a peeling rod rotational driving part that is coupled to the peeling rod and rotationally drives the peeling rod, and the peeling rod rotates to The angle at which the film is peeled off the wafer is adjusted. The film peeling device according to claim 1, wherein the film peeling device further includes: a roller temperature adjustment unit arranged in the internal space of the peeling roller and adjusting the temperature of the peeling roller. The film peeling device according to claim 1, wherein the film peeling device further includes: A roller vertical driving unit moves the peeling roller and the peeling rod in a vertical direction. The film peeling device according to claim 1, further comprising: a chuck load sensor for measuring the pressure applied to both sides of the chuck. : A chuck rotation drive unit that rotates the chuck in order to align the chuck and the peeling roller based on the pressure applied to the chuck load sensor. A layering equipment includes: a loading port to be supplied with wafers with films attached thereon; a wafer transport machine to transport the wafers; a tape supply section to supply tape for peeling off the films; and a film peeling device to use The tape peels off the film from the wafer; and a tape recovery unit recovers the tape with the film attached, and the film peeling device includes a chuck that is placed above the wafer with the film attached, and is configured as The peeling roller is capable of moving in the horizontal direction so that the tape for peeling off the film from the wafer is in contact with the film, and is configured to be rotatable at a speed corresponding to the movement speed of the chuck; and A peeling rod adjusts a peeling angle between the film to which the tape is attached and the wafer, wherein the peeling rod is provided in a rod shape with a triangular cross-section. The layering equipment according to claim 7, wherein the tape supply unit includes: a supply tape storage unit that supplies the supply tape in a rolled state to the film peeling device; and a supply tension control unit that controls the supply tape. The tension; and a supply position control part to control the position of the supply tape. The layering equipment according to claim 8, wherein the supply tension control unit includes: a tape supply roller that supplies the supply tape to the film peeling device; and a supply tension measuring load sensor that measures the supply a tension of the tape; a supply roller motor that provides power for rotating the tape supply roller; and a supply roller clutch that adjusts the coupling force between the tape supply roller and the supply roller motor. The layering equipment according to claim 9, wherein the supply position control part includes: a supply tape position sensor that measures the position of the supply tape; and a supply roller horizontal drive part that passes the supply tape position according to The position information of the tape supply measured by the sensor causes the tape supply roller to move to adjust the horizontal position of the tape supply roller. The layering equipment according to claim 7, wherein the tape recovery unit includes: a recovery tape storage unit that stores the recovery tape with the film attached in a rolled state; and a recovery tension control unit that controls the recovery tape The tension; and a recycling position control part to control the position of the recycling tape. The layering equipment according to claim 11, wherein the recovery tension control unit includes: a tape recovery roller that supplies the recovery tape to the recovery tape storage unit; and a recovery tension measurement load sensor that measures the recovery tape. the tension of the recovered tape; a recovery roller motor that provides power for rotating the tape recovery roller; and a recovery roller clutch that adjusts the binding force between the tape recovery roller and the recovery roller motor. The hierarchical device according to claim 12, wherein the recycling position control part includes: The recycling tape position sensor measures the position of the recycling tape; the recycling roller horizontal drive unit moves the tape recycling roller to adjust the position of the recycling tape based on the position information of the recycling tape measured by the recycling tape position sensor. The horizontal position of the tape recovery roller. The layering equipment according to claim 7, wherein the layering equipment further includes: a tape direction control unit that corrects the skew of the tape supplied to the film peeling device. The layering apparatus according to claim 14, wherein the tape direction control section includes a tape correction roller configured to be rotatable relative to the vertical direction and to transfer the tape supplied from the tape supply section to the The film peeling device provides; a tape position measurement sensor that measures the position of the tape supplied to the film peeling device; and a tape correction drive unit that controls the rotational drive of the tape correction roller based on slope information of the tape. . The layering equipment according to claim 7, wherein the layering equipment further includes: a feed speed control part, working synchronously with the peeling roller and a chuck driving part to control the supply speed and recovery of the tape speed. The layering equipment according to claim 7, wherein the layering equipment further includes: a supply tape replacement detection sensor, which is provided in the tape supply part and measures the supply tape wound in the supply tape storage part. the amount of the recycled tape; and a recycled tape replacement detection sensor, which is provided in the tape recycling part and measures the amount of the recycled tape wound in the recycled tape storage part. The layering equipment according to claim 7, wherein the layering equipment further includes: a supply tape replacement unit provided in the tape supply part and configured to cut the supply tape when replacing the supply tape. Hold both ends of the supply tape; and The recovered tape replacement unit is provided in the tape recovery unit and is configured to hold both ends of the recovered tape in order to cut the recovered tape when replacing the recovered tape. A semiconductor manufacturing equipment includes: a loading port that is supplied with wafers with films attached thereon; a wafer transfer module that transports the wafers; a process processing module that performs process processing on the wafers; and a layered module A group that removes the film from the wafer, and the layered module includes: a tape supply part that supplies tape for peeling off the film; and a film peeling device that uses the tape to peel off the film from the wafer. film; and a tape recovery unit that recovers the tape with the film attached, and the film peeling device includes: a chuck that is placed above the wafer with the film attached and is configured to move in the horizontal direction; and a peeling roller so that a tape for peeling off the film from the wafer that is in contact with the film and configured to be rotatable at a speed corresponding to the moving speed of the chuck; and a peeling lever provided in a rod shape and driven by rotation The peeling angle between the film to which the tape is attached and the wafer is adjusted.

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