JP2006012971A - Device for peeling masking tape - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent breakage of a wafer caused by the peeling force when a masking tape is peeled from the wafer, in such a similar way whereby the peeling may be carried out with human fingers. <P>SOLUTION: A release tape T and a masking tape P in an adhesion state are folded up and turn up in a position A1 so that they are set in a state of sticking to the wafer W side. Namely, the inside of the release tape T, the portion located in the downstream (transport direction downstream of the release tape T) near the masking tape P and the pasted-up portion turns up to the surface side of the wafer W so that the turned up portion is pressed against so as to stick closely to the wear surface side. Moreover, in the above state, the masking tape P is peeled as it turns up from the wafer W in the position A1. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a protective tape peeling apparatus and method for peeling off a protective tape attached to a surface of a semiconductor wafer (hereinafter abbreviated as a wafer) by using the peeling tape.

  In general, when polishing the back surface of a wafer that has undergone pattern formation processing (back grinding), a protective tape is applied to the wafer surface in advance. When affixing the protective tape, a protective tape wider than the wafer is affixed to the wafer surface, and then a portion protruding from the outer periphery of the wafer is cut out along the outer peripheral edge of the wafer. A wafer whose entire surface is protected by a protective tape is subjected to a polishing process by sucking and holding it from the surface side with a suction cup. Thereafter, the protective tape that is no longer needed is peeled off from the wafer surface.

  As a method for peeling off the protective tape, there is a method using a peeling tape. In this method, a peeling tape having a strong adhesive force is stuck on the protective tape stuck on the surface of the wafer, and the peeling tape is wound up by a peeling roller that moves while rolling on the wafer. The protective tape is peeled off from the wafer.

  However, since the peeling tape is wound up in a substantially vertical direction by the peeling roller, the peeling force at the peeling point between the wafer surface and the protective tape acts in a direction substantially perpendicular to the wafer. For this reason, there is a possibility that the peeling force acts directly on the thin and fragile wafer and breakage occurs.

  Therefore, there is a protective tape peeling device disclosed in Patent Document 1 as a solution to this problem. As shown in FIG. 13, this protective tape peeling apparatus affixes a release tape T on a protective tape P attached to the surface of a wafer W supported by a support base 101, and applies it to the surface of the release tape T. The protective tape P is integrated with the release tape T by running along the protective tape P while the edge member 100 is in contact, and peeling off the release tape T at a large angle of 90 ° or more at the tip of the edge member 100. It is peeled off from the wafer surface. As described above, since the peeling tape T is folded at the front end portion of the edge member 100 with an inclination angle θ and the protective tape P is peeled off from the wafer W using the edge member 100, the wafer W The peeling force at the peeling point between the surface of the wafer and the protective tape is inclined in the direction of the inclination angle θ to prevent damage to the wafer W.

However, in the above-described protective tape peeling apparatus, since the tip of the edge member 100 is formed with a sharp edge, the surface of the wafer W may be damaged when the protective tape P is peeled off by the peeling tape T.
Further, the peeling force is tilted in the direction of the inclination angle θ, so that the peeling force acting in a direction substantially orthogonal to the wafer is reduced, but the wafer W is surely prevented from being damaged without completely disappearing. I can't do it.
JP 2002-124494 A

  The present invention has been made in view of the above problems, and provides a protective tape peeling apparatus and a tape peeling method capable of reliably peeling off a protective tape adhered to a surface without damaging a wafer. Objective.

  In order to solve the above-described problems, the protective tape peeling apparatus provided by the present invention is configured to attach the protective tape attached to the surface of a wafer to the peeling tape, and pull the peeling tape to attach the protective tape. In a protective tape peeling apparatus for peeling off from a wafer, the release tape is wound and a delivery drum that feeds the release tape, a take-up drum that winds the release tape sent from the delivery drum downstream, and the delivery drum And a sticking means for attaching the release tape to the protective tape, and in the vicinity of the portion of the release tape that is bonded to the protective tape, on the downstream side The part to be positioned is folded back to the surface side of the wafer, and the peeling tape is attached to the wafer surface so that the folded part is in close contact with the wear surface side. A pressing means for pressing to the C side, and a moving peeling means for sequentially shifting the bonding position by the sticking means and rotating the winding drum to pull the peeling tape to the downstream side. .

  In the above-described configuration, it is preferable that the moving peeling unit includes a wafer moving unit that shifts the bonding position by moving the wafer.

  The said structure WHEREIN: It is desirable for the said press means to be comprised from the some roller which moves along a predetermined track | orbit.

  The present invention can reliably peel off the protective tape adhered to the surface without damaging the wafer.

Embodiments of the present invention will be described below with reference to the drawings.
<Embodiment>
A protective tape peeling apparatus 10 according to an embodiment of the present invention will be described with reference to FIGS. 1 to 11.

(1) Configuration of Protective Tape Peeling Device 10 FIG. 1 is a schematic diagram of a protective tape peeling device 10 according to this embodiment, and FIG. 2 is a functional block diagram of the protective tape peeling device 10. The protective tape peeling apparatus 10 includes a wafer transfer unit 20 and a tape peeling unit 30. The units 20 and 30 are provided on the same base (not shown). The protective tape peeling device 10 is a device that peels off the protective tape P attached to the surface of the wafer W with the peeling tape T.

(1-1) Wafer transfer unit 20
The wafer transfer unit 20 includes a moving stage 21 that attracts the wafer W, and a moving actuator 25 and a moving mechanism 26 that are fixed to the base and move the moving stage 21 in the horizontal direction of the drawing. The moving stage 21 is formed with a recess 21A on which the wafer W is placed and a plurality of suction holes 21B, 21B,... Drilled in the bottom of the recess 21A. The suction hole 21B is connected to the suction pump 22 via a pipe 22A to which an electromagnetic valve 22B is connected midway. The electromagnetic valve 22B has three positions which are switched to intake / stop / exhaust in response to a signal from the controller 50. Then, the suction pump 22 is activated in response to a control signal from the controller 50 in a state where the wafer W is placed in the recess 21A, and the electromagnetic valve 22B is set to the intake position, whereby the suction hole 21B is opened. At this time, a suction force is generated, and the wafer W receiving this suction force is fixed to the moving stage 21.

  Further, a pressure air source (for example, an air pump) is connected to the moving actuator 25 via a pipe (not shown), and an electromagnetic switching valve is provided in the middle of the pipe. This electromagnetic switching valve receives a signal from the controller 50 and supplies / stops air to the moving actuator 25. The moving actuator 25 has a variable portion connected to the moving stage 21 via a moving mechanism 26, and reciprocates the moving stage 21 in the direction of arrow a as the variable portion moves. As a result, the wafer W on the moving stage 21 moves in the direction indicated by the arrow a with respect to the tape peeling unit 30.

(1-2) Protection tape peeling unit 30
The protective tape peeling unit 30 includes a supply drum 31 around which one side of the peeling tape T is wound, and a winding drum 32 around which the other side of the peeling tape T is wound. The shaft of the winding drum 32 is connected to the shaft of the winding actuator 32A (motor). The shaft of the take-up actuator 32A is rotated by a motor, and this rotation turns the take-up drum 32 in the direction indicated by the arrow b 'and winds the peeling tape T.
The peeling tape T is guided while being folded back at a predetermined position by sending rollers 41 and 42, a sticking roller 43, a winding drum 51, a tape holding roller 52, and a sending and receiving roller 53 arranged in this order from the supply drum 31 side. 32 is reached. These rollers 41 to 43, 52, and 53 are rotatably attached to the shaft. The hoisting drum 51 is configured such that the peeling tape T is wound / delivered by a hoisting actuator 51A (not shown).
The tape holding roller 52 is swung in the direction indicated by an arrow g via the arm 52A by a swing actuator 52B driven by air. When the tape holding roller 52 is swung counterclockwise, the tape holding roller 52 holds the peeling tape T between the winding drum 51 and the tape holding roller 52.

  A tensioner roller 44 is disposed between the delivery rollers 41 and 42. The tensioner roller 44 is rotatably attached to the tip end of an arm 44A that swings in the direction indicated by the arrow c with the axis of the delivery roller 41 as the center of rotation. The tensioner roller 44 is oscillated through the arm 44A by the oscillating actuator 44B driven by air and pressed against the peeling tape T. The swing actuator 44B operates only when it rotates in the clockwise direction, and generates a predetermined biasing force by a spring (not shown) in the counterclockwise direction. Thereby, when the arm 44A rotates counterclockwise, the tensioner roller 44 generates tension on the tape T with a predetermined urging force.

The sticking roller 43 is moved substantially linearly in the direction indicated by the arrow d by the reciprocating actuator 43A. By pressing the peeling tape T against the wafer W during the partial sticking process described later, the peeling tape T is attached to the protective tape P. Paste to. In addition, an angular roller 45 is disposed on the sticking roller 43, and this roller 45 is rotatably attached to the tip of an arm 45A that swings in the direction indicated by the arrow e about the axis of the sticking roller 43 as a rotation center. . The arm 45 </ b> A is swung by a swing actuator 45 </ b> B driven by air, and adjusts an opening angle (opening angle of the bent portion) when the protective tape P is peeled off by the peeling tape T.
The pressing roller 46 is moved in the direction indicated by the arrow f by the reciprocating actuator 46A, and presses the peeling tape T against the wafer W during the bending portion forming process and the protective tape peeling process described later.

  The protective tape peeling apparatus 10 is provided with a controller 50 for controlling the suction pump 22, the moving actuator 25, and the actuators 32A, 43A, 44B, 45B, and 46A. The controller 50 receives signals from various sensors 54 and outputs control signals for driving the actuators. The controller 50 includes a CPU, a ROM (Read Only Memory), and a RAM (Random Access Memory) (all of which are not shown). The CPU executes a control program read from the ROM, thereby performing processing to be described later. Do. The RAM is used as a work area when the CPU executes various control programs. Further, the controller 50 controls the operation of the actuator by electrically controlling an electromagnetic switching valve provided in the middle of a pipe connecting the actuator and the air pump (suction pump) in order to output an electrical control signal. It is like that.

(2) Operation of Protective Tape Peeling Device 10 Next, the peeling operation of the protective tape P by the protective tape peeling device 10 will be described with reference to FIGS. 3 to 10, the illustration of the wafer transfer unit 20 is omitted for the sake of convenience, and only the wafer W is illustrated. 3 to 9 are views showing the state of the roller and the like in each process, and FIG. 10 is an enlarged view of the state in which the protective tape P is peeled off by the peeling tape T after the bent portion B is formed on the peeling tape T. FIG. Further, in order to define the position of the wafer W in the direction of arrow a, a line where the sticking roller 43 is lowered to the wafer W side is a position A0, and a line where the pressing roller 46 is lowered to the wafer W side is a position A1. .

(A) Wafer Fixing Step FIG. 3 shows a step of sucking and fixing the wafer W transferred by a wafer transfer device (not shown) to the moving stage 21. In this step, the peeling tape T is drawn around by sending rollers 41 and 42, a sticking roller 43, a winding drum 51, a tape holding roller 52, and a sending and receiving roller 53 as shown in the figure. In this state, the peeling tape T is not attached to the protective tape P of the wafer W. In this step, one end of the wafer W is positioned at the position A0.

(B) Partial pasting process FIGS. 4 and 5 show a process of partially pasting the peeling tape T on one end side of the wafer W. FIG. In this process, as shown in FIG. 4, the controller 50 drives the reciprocating actuator 43A to move the sticking roller 43 downward in the direction indicated by the arrow d. Thereby, the sticking roller 43 presses the peeling tape T against the wafer W side. At this time, the peeling tape T is slightly pulled back by bringing the hoisting drum 51 into a delivery state.
As shown in FIGS. 5 and 10A, the wafer W is slightly moved to the position A <b> 1 in the direction indicated by the arrow a while the sticking roller 43 is pressed against the wafer W. As the wafer W moves, the portion of the protective tape P that has moved from the position A0 to A1 is attached to the peeling tape T while attached to the wafer W.

(C) Bent Part Forming Process FIG. 6 shows a process of forming the bent part B in the peeling tape T. In this process, the controller 50 drives the reciprocating actuator 43A to move the sticking roller 43 to the upper side in the direction indicated by the arrow d, and drives the reciprocating actuator 46A to move the pressing roller 46 to the lower side in the direction indicated by the arrow f. Move to. Thereby, the pressing of the peeling tape T to the wafer W side by the sticking roller 43 is released, and the folded portion B of the peeling tape T is pressed from the upper side by the pressing roller 46 to form a bent portion B (FIG. 10B). reference). Further, the controller 50 drives the swing actuator 45B to rotate the arm 45A in the clockwise direction indicated by the arrow e, so that the angle adjusting roller 45 guides the peeling tape T. In the case of FIG. 6, since the part where the peeling tape T is stuck to the protective tape P and the part which is not stuck are matched, the opening angle of the bent part B is almost zero.

(D) Process of Stripping Protective Tape FIG. 7 shows a process of stripping off the protective tape using the release tape T. In this process, the controller 50 moves the moving stage 21 until the other end of the wafer W reaches the position A1, and rotates the winding drum 51 by the winding actuator 51A to wind up the peeling tape T. At this time, the moving speed by the moving stage 21 and the winding speed of the peeling tape T by the winding drum 51 are set to the same speed. As a result, as shown in FIGS. 10C to 10E, the peelable tape T and the protective tape P in the bonded state are folded back so as to be folded at the position A1, and are in close contact with each other on the wafer W side.
Of the peeling tape T, a portion located on the downstream side (downstream in the conveyance direction of the peeling tape T) in the vicinity of the portion to which the protective tape P is bonded is folded back to the front surface side of the wafer W and folded. The pressed portion 46 is pressed by the pressing roller 46 so as to be in close contact with the wear surface side. In the above state, the protective tape P is peeled off so as to be folded from the wafer W at the position A1.

Then, as shown in FIG. 7, when the other end of the wafer W reaches the position A <b> 1 by the movement of the moving stage 21, the protective tape P adhered to the wafer W is completely peeled off by the peeling tape T.
Further, the controller 50 generates tension on the peeling tape T by energizing the tensioner roller 44 in the counterclockwise direction indicated by arrow c in the middle of the protective tape peeling process.

In this processing operation, as shown in FIG. 11, the pressing roller 46 can function like a finger in the same manner as when a person peels off the protective tape P with a finger. In the image of FIG. 11, the finger F folds the peeling tape T attached to the protective tape P, and slides the peeling tape T by sliding it in the plane direction while pressing the bent portion against the wafer W side. As a result, the peeling force acts substantially in the plane direction of the wafer W to prevent the wafer W from being damaged, and the protective tape is applied to the peeling tape, and the protective tape T is surely peeled off from the wafer W. In the present embodiment, the peeling force applied to the wafer W acts in a direction substantially parallel to the plane of the wafer W based on the same principle as the peeling step shown in FIG. The protective tape P can be reliably peeled off.
In addition, the angle of the peeling tape T after being folded depends on the radius R of the pressing roller 46. That is, as shown in FIG. 13, the peeled tape T after being folded back is pulled in the tangential direction of the pressing roller 46 (radius R) (open angles θ1, θ2 of the bent portion B) at each point on the circumference. become. Accordingly, it is possible to reduce the peeling force acting on the wafer in the vertical direction, which has conventionally occurred when the protective tape is peeled off from the wafer, and the protective tape P can be peeled off from the wafer W while preventing the wafer W from being damaged. .

(E) Release tape preparation process FIG.8 and FIG.9 has shown the release tape preparation process. In this step, the wafer W from which the protective tape P has been peeled is transferred by the wafer transfer device, and the controller 50 drives the reciprocating actuator 46A while continuing to wind the release tape T by the take-up drum 32. Then, the pressing roller 46 is moved upward in the direction indicated by the arrow f, and the swing actuator 44B is driven to move the angle adjusting roller 45 in the counterclockwise direction indicated by the arrow e. As a result, as shown in FIG. 8, the bent portion B sandwiched between the pressing roller 46 and the wafer W is released, and the release tape T near the bent portion B is applied in advance by the tensioner roller 44. The peeling tape T, which is pulled by the tension and is positioned between the delivery rollers 41 and 42, is bent into a “he” shape against the urging force of the tensioner roller 44, and the peeling tape T is applied to the sticking roller 43. Until the tensioner roller 44 detects that the peeling tape T has been stretched, the winding tape 51 is wound up by the hoisting drum 51. When the tensioner roller 44 is detected, the tensioner roller 44 is rotated in the clockwise direction indicated by the arrow c to the original position. return.
As described above, the protective tape peeling apparatus 10 applies the protective tape P attached to the wafer W to the peeling tape T by sequentially repeating the above processing, and peels the protective tape P from the wafer W. Become.

(3) Effects of the Embodiment In the protective tape peeling apparatus 10 according to the present embodiment, the bent portion B is formed on the peeling tape T, and then the bent portion B is pressed against the wafer W by the pressing roller 46. The hoisting drum 51 and the moving stage 21 are operated at the same speed. As a result, the bent portion B stops between the pressing roller 46 and the wafer W (position A1) with respect to the moving peeling tape T, and the protective tape P is removed from the wafer W with the moving bent portion B as a starting point. It will be stripped off. At this time, the wafer W is pressed against the pressing roller 46 from above, and the peeling tape T positioned at the bent portion B is brought into close contact with the protective tape P on the surface of the wafer W. The force acts in the direction in which the peeling tape T is pulled (substantially horizontal direction of the wafer W). As a result, it is possible to reliably prevent damage to the wafer W that may occur when the protective tape P is peeled off.

  Moreover, in this embodiment, the protective tape P is simply attached to a part of the protective tape P in the partial attaching step in advance, and the protective tape P is moved to the wafer at the position A1 in the subsequent protective tape peeling process. In contrast to being peeled off from W, in the prior art, the protective tape P is peeled off after a release tape is previously applied to the surface of the wafer W. For this reason, in this embodiment, compared with a prior art, the working man-hour can be reduced significantly.

(4) Modified Example In the above embodiment, each actuator is driven by supplying air. However, it is needless to say that the actuator may be configured by an electric actuator.

  In the above embodiment, the case where the wafer transport unit 20 moves relative to the tape transport unit 30 has been described. However, the present invention is not limited to this, and conversely, the tape transport unit 30 moves relative to the wafer transport unit 20. May be. In short, any configuration that allows relative movement is acceptable.

  Further, in the above-described embodiment, the protective tape P is peeled off from the wafer W at the position A1 by preliminarily attaching the release tape T to a part of the protective tape P and then winding up the release tape T. However, the protective tape P may be sequentially attached to the adhesive tape T and peeled off at the folded portion.

  Furthermore, the pressing roller 46 adjusts the pressing force by using the thickness dimension / strength of the wafer W, the adhesive force / elastic force of the peeling tape T, the thickness of the protective tape P, the adhesive force, etc. as parameters. Also good.

It is a figure which shows the structure of the protective tape peeling apparatus concerning embodiment of this invention. It is a figure which shows the functional block of the apparatus. It is a figure which shows the wafer fixing process by the same apparatus. It is a figure which shows the partial sticking process by the apparatus. It is a figure which shows the partial sticking process following FIG. It is a figure which shows the bending part formation process by the apparatus. It is a figure which shows the protective tape peeling process by the apparatus. It is a figure which shows the peeling tape preparation process by the apparatus. It is a figure which shows the peeling tape preparation process following FIG. It is an enlarged view which shows the detail of a bending part formation process and a protective tape stripping process. It is the figure which imaged the operation | movement by the protective tape peeling apparatus of this invention. It is the figure which expanded and showed the part which peels off the protection tape by this invention from a wafer. It is the figure which showed the peeling operation | movement of the protective tape by the protective tape peeling apparatus of a prior art.

Explanation of symbols

10 ... protective tape peeling device,
20 ... Wafer transfer unit,
21 ... Moving stage 30 ... Tape peeling unit,
31 ... Supply drum,
32 ... take-up drum,
43 ... Affixing roller,
44 ... Tensioner roller,
45 ... Ring tone roller,
46 ... Pressing roller,
51 ... Hoisting drum W ... Wafer,
T ... release tape,
P: protective tape.

Claims (3)

In the protective tape peeling apparatus that peels off the protective tape from the wafer by applying the protective tape attached to the surface of the wafer to the peeling tape and pulling the peeling tape.
A feeding drum around which the release tape is wound and delivering the release tape;
A take-up drum for winding the release tape sent from the feed drum on the downstream side;
An affixing means located in a tape transport path between the delivery drum and the take-up drum, and affixing the release tape to the protective tape;
Of the peeling tape, the portion located downstream in the vicinity of the portion that is bonded to the protective tape is folded back to the surface side of the wafer, and the folded portion is in close contact with the wear surface side. Pressing means for pressing the release tape toward the wafer;
A protective tape peeling apparatus comprising: a moving peeling means that sequentially shifts the bonding position by the sticking means and rotates the winding drum to pull the peeling tape downstream.   2. The protective tape peeling apparatus according to claim 1, wherein the moving peeling means has a wafer moving means for shifting the bonding position by moving the wafer. The protective tape peeling apparatus according to claim 1 or 2, wherein the pressing means includes a plurality of rollers that move along a predetermined track.

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