TWI894522B - Delamination equipment - Google Patents

Abstract

A delamination equipment for removing a film from a wafer includes: a loading port, on which the wafer with the film attached thereon is provided; a wafer transferring robot for transferring the wafer; a tape supply portion configured to supply a tape for stripping the film; a film stripping device configured to strip the film from the wafer using the tape; and a tape recovery portion configured to recover the tape with the film attached thereon. The film stripping device includes: a chuck on which the wafer with the film attached is placed, configured to be movable in a horizonal direction; a stripping roller configured to enable the tape for stripping the film from the wafer to be in contact with the film and configured to be able to rotate at a speed corresponding to a moving speed of the chuck; a stripping bar driven by rotation to adjust a stripping angle between the film attached on the tape and the wafer; and a chuck rotation driving portion configured to rotate the chuck for aligning the chuck and the stripping bar.

Description

Layered equipment

The present invention relates to a delamination apparatus for peeling a film attached to a wafer.

Typically, semiconductor devices are formed on a silicon wafer serving as a semiconductor substrate by repeatedly performing a series of manufacturing processes. The semiconductor devices thus formed are then manufactured into semiconductor packages through dicing, bonding, and packaging processes.

Recently, stacking semiconductor chips on a wafer has been increasingly adopted to increase integration density. Meanwhile, as a method for simultaneously bonding multiple chips on a wafer, one approach being considered is to pre-bond each chip on the wafer, then cover it with a film, create a high-temperature and high-pressure environment, and then bond the chips all at once using high-energy gas (Gas-Assisted Bonding).

After the batch bonding is completed, an additional process is required to remove the film from the wafer.

Thus, embodiments of the present invention are used in delamination apparatus for removing films from wafers.

The problems to be solved by the present invention are not limited to the problems mentioned above, and those skilled in the art can clearly understand other problems not mentioned from the following description.

The delamination equipment according to the present invention includes: a loading port to which a wafer with a film attached thereto is supplied; a wafer transfer robot to transfer the wafer; a tape supply unit to supply a tape for stripping the film; a film stripping device to strip the film from the wafer using the tape; and a tape recovery unit to recover the tape with the film attached thereto. The film stripping device includes: a chuck on which a wafer with a film attached is placed and configured to move in a horizontal direction; a stripping roller that allows a belt used to strip the film from the wafer to contact the film and configured to rotate at a speed corresponding to the moving speed of the chuck; a stripping bar that adjusts the stripping angle between the film with the belt attached and the wafer by rotational drive; and a chuck rotation drive unit that rotates the chuck to align the chuck and the stripping roller.

According to an embodiment of the present invention, the film stripping device may further include: a chuck driving unit that moves the chuck in a horizontal direction; and a roller rotation driving unit that works synchronously with the chuck driving unit and rotates the stripping roller, wherein the roller rotation driving unit rotates the stripping roller at the same speed as the movement speed of the chuck performed by the chuck driving unit.

According to an embodiment of the present invention, the film stripping device may further include: a moving plate disposed above the chuck driving portion and configured to move along the horizontal direction through the chuck driving portion; and distance sensors disposed on both sides above the moving plate to measure the distance relative to the chuck.

According to an embodiment of the present invention, the chuck rotation drive unit may rotate the chuck according to the distance relative to the chuck measured by the distance sensor to maintain the levelness of the chuck.

According to an embodiment of the present invention, the film stripping device may further include: a chuck load sensor for measuring the pressure applied to both sides of the chuck.

According to an embodiment of the present invention, the chuck rotation drive unit may rotate the chuck in order to align the chuck and the peeling roller based on the pressure applied to the chuck load sensor.

According to an embodiment of the present invention, the peeling strip may be provided in the shape of a strip with a triangular cross section.

According to an embodiment of the present invention, the film stripping device may further include: a stripping bar rotation driving portion, which is coupled to the stripping bar and causes the stripping bar to rotationally drive.

According to an embodiment of the present invention, the angle at which the film is peeled from the wafer may be adjusted by rotating the peeling bar.

According to an embodiment of the present invention, the film stripping device may further include: a roller temperature adjustment unit, which is arranged in the inner space of the stripping roller and adjusts the temperature of the stripping roller.

According to an embodiment of the present invention, the film stripping device may further include: a roller vertical driving unit, which moves the stripping roller and the stripping bar in a vertical direction.

The delamination equipment according to the present invention includes: a loading port to which a wafer with a film attached thereto is supplied; a wafer transfer robot to transfer the wafer; a tape supply unit to supply a tape for stripping the film; a film stripping device to strip the film from the wafer using the tape; and a tape recovery unit to recover the tape with the film attached thereto. The film stripping device includes: a chuck on which a wafer with a film attached is placed and configured to move horizontally; a stripping roller that brings a tape used to strip the film from the wafer into contact with the film and is configured to rotate at a speed corresponding to the chuck's movement speed; and a stripping bar that is driven by rotation to adjust the stripping angle between the film with the tape attached and the wafer. The tape supply unit includes: a supply tape storage unit that provides a rolled supply tape to the film stripping device; a supply tension control unit that controls the tension of the supply tape; and a supply position control unit that controls the position of the supply tape. The tape recovery unit includes: a recovery tape storage unit that stores the recovery tape with the film attached thereto in a rolled state; a recovery tension control unit that controls the tension of the recovery tape; and a recovery position control unit that controls the position of the recovery tape relative to the stripping roller.

According to an embodiment of the present invention, the supply tension control unit may include: a belt supply roller, which supplies the supply belt to the film stripping device; a supply tension measuring load sensor, which measures the tension of the supply belt; a supply roller motor, which provides power for rotating the belt supply roller; and a supply roller clutch, which adjusts the coupling force between the belt supply roller and the supply roller motor.

According to an embodiment of the present invention, the supply position control unit may include: a supply belt position sensor for measuring the position of the supply belt; and a supply roller horizontal drive unit for moving the supply roller according to the position information of the supply belt measured by the supply belt position sensor to adjust the horizontal position of the supply roller.

According to an embodiment of the present invention, the recovery tension control unit may include: a belt recovery roller that provides the recovery belt to the recovery belt storage unit; a recovery tension measurement load sensor that measures the tension of the recovery belt; a recovery roller motor that provides power for rotating the belt recovery roller; and a recovery roller clutch that adjusts the coupling force between the belt recovery roller and the recovery roller motor.

According to an embodiment of the present invention, the recovery position control unit may include: a recovery belt position sensor for measuring the position of the recovery belt; and a recovery roller horizontal driving unit for moving the belt recovery roller according to the position information of the recovery belt measured by the recovery belt position sensor to adjust the horizontal position of the belt recovery roller.

According to an embodiment of the present invention, the lamination apparatus may further include: a belt direction control unit for correcting the skew of the belt provided to the film stripping device.

According to an embodiment of the present invention, the belt direction control unit may include: a belt correction roller, which is configured to rotate relative to the vertical direction and provide the belt supplied from the belt supply unit to the film stripping device; a belt position measurement sensor, which measures the position of the belt supplied to the film stripping device; and a belt correction drive unit, which controls the rotation drive of the belt correction roller based on the inclination information of the belt.

The delamination equipment according to the present invention includes: a loading port to which a wafer with a film attached thereto is supplied; a wafer aligner to align the wafer in a specific direction; a wafer transfer robot to transfer the wafer; a tape supply unit to supply a tape for stripping the film; a film stripping device to strip the film from the wafer using the tape; and a tape recovery unit to recover the tape with the film attached thereto. The film stripping device includes: a chuck on which a wafer with a film attached is placed and configured to move horizontally; a stripping roller that brings a tape used to strip the film from the wafer into contact with the film and is configured to rotate at a speed corresponding to the chuck's movement speed; and a stripping bar that is driven by rotation to adjust the stripping angle between the film with the tape attached and the wafer. The tape supply unit includes: a supply tape storage unit that provides a rolled supply tape to the film stripping device; a supply tension control unit that controls the tension of the supply tape; and a supply position control unit that controls the position of the supply tape. The tape recovery unit includes: a recovery tape storage unit that stores the recovery tape with the film attached thereto in a rolled state; a recovery tension control unit that controls the tension of the recovery tape; and a recovery position control unit that controls the position of the recovery tape relative to the stripping roller.

According to the present invention, the chuck on which the wafer is placed is horizontally moved by the chuck drive unit, so that the roller that brings the stripping tape into contact with the wafer and the chuck operate synchronously, thereby enabling the film to be further effectively stripped from the wafer.

The effects of the present invention are not limited to the above-mentioned effects, and those skilled in the art can clearly understand other effects not mentioned from the following description.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings so that a person skilled in the art can easily implement the present invention. The present invention can be implemented in various ways and is not limited to the embodiments described herein.

In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same or similar components are marked with the same drawing symbols throughout the specification.

In addition, among the multiple embodiments, the same reference numerals are used for components having the same structure to describe only a representative embodiment, and only structures different from the representative embodiment are described in the remaining embodiments.

Throughout this specification, when a part is described as being "connected (or coupled)" to another part, this includes not only "directly connected (or coupled)" but also "indirectly connected (or coupled)" with another part interposed therebetween. Furthermore, when a part is described as "including" certain constituent elements, unless otherwise specified, this implies that the other constituent elements may also be included, not that the other constituent elements are excluded.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by persons of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the context of the relevant technical text and will not be ideally or excessively interpreted as formal meanings unless expressly defined in this application.

Figure 1 illustrates the concept of gas-assisted bonding according to the present invention. Unlike conventional physical pressure bonding methods, the bonding method according to an embodiment of the present invention creates a high-temperature and high-pressure environment within the processing chamber of a wafer W, and uses a high-temperature and high-pressure gas to bond a chip C to wafer W. Unlike conventional physical pressure bonding methods, which bond chips C individually by applying pressure to each chip C, the present invention allows for simultaneous bonding of multiple chips C to wafer W using high-temperature and high-pressure gas. While Figure 1 illustrates the process of bonding chips C to a circular wafer W using gas pressure, the gas-assisted bonding method shown in Figure 1 is applicable not only to wafers W but also to all technologies for bonding any component to substrates such as glass and printed circuit boards (PCBs).

The film stripping apparatus according to the present invention can be used to remove the film F attached to the upper surface of the wafer W after bonding a chip C to the wafer W by gas pressure as shown in FIG1 . The delamination apparatus 1 according to the present invention will be described below.

2 and 3 show the structure of the lamination device 1. FIG2 shows the structure of the lamination device 1 as viewed from above, and FIG3 shows the structure of the lamination device 1 as viewed from the side.

The delamination apparatus 1 according to the present invention can be deployed in a semiconductor manufacturing facility and is used to peel and remove a film F from a wafer W used in a previous process. The delamination apparatus 1 can peel the film F from the wafer W and provide the wafer W, with the film F removed, to equipment for subsequent processes.

The delamination equipment 1 according to the present invention includes a loading port 10 to which a wafer W with a film F attached to its upper portion is supplied, a wafer transfer robot 20 for transferring the wafer W, a tape supply unit 40 for supplying a tape T for removing the film F, a film stripping device 30 for removing the film F from the wafer W using the tape T, and a tape recovery unit 50 for recovering the tape T with the film F attached thereto.

The film stripping device 30 according to the present invention includes a chuck 310 on which a wafer W with a film F attached thereto is placed and which is configured to be movable in the horizontal direction (X direction); a stripping roller 320 that allows a tape T for stripping the film F from the wafer W to contact the film F and is configured to rotate at a speed corresponding to the moving speed of the chuck 310; a stripping bar 330 that adjusts the stripping angle between the film F with the tape T attached and the wafer W by being driven by rotation; and a chuck rotation drive unit 350 that adjusts the inclination of the chuck 310 in order to align the chuck 310 and the stripping roller 320.

According to the present invention, the film stripping device 30 includes a chuck drive unit 340 that moves the chuck 310 horizontally, and a roller rotation drive unit 325 that operates in synchronization with the chuck drive unit 340 and rotates the stripping roller 320 at the same speed as the chuck 310 is moved by the chuck drive unit 340. The chuck 310, on which the wafer W is placed, is moved horizontally (in the X direction) by the chuck drive unit 340, and the stripping roller 320, which brings the stripping tape T into contact with the wafer W, operates in synchronization with the chuck 310, thereby enabling the film F to be stripped from the wafer W more efficiently. In addition, the chuck 310 is configured to move when the position of the stripping roller 320 is fixed. Compared with the case where the stripping roller 320 moves when the position of the chuck 310 is fixed, there is an advantage in that the position of the stripping roller 320 relative to the tape supply part 40 and the tape recovery part 50 is fixed, and the overall equipment structure can be simplified.

The loading port 10 can be located outside the stacking apparatus 1 and accommodates a transport container (e.g., a front-opening unified pod (FOUP)) 5 for wafers W. The transport container 5 can be placed into the loading port 10 by a transport device (e.g., an overhead hoist transport (OHT)). After the film F has been stripped, the wafer W can be placed back into the transport container 5 at the loading port 10 and then transferred to the transport device for subsequent processing while still in the transport container 5.

The wafer transport robot 20 unloads the wafer W from the transport container 5 placed in the loading port 10 and transfers the wafer W to the chuck 310, returning the wafer W from which the film F has been removed to the transport container 5. The wafer transport robot 20 may include a robot arm that supports the wafer W from below and a robot arm that moves the robot arm horizontally and vertically.

4 and 5 show a film stripping device 30 according to the present invention.

The film stripping device 30 includes a chuck 310 on which a wafer W with a film F attached is placed and is configured to move in the horizontal direction (X direction), a stripping roller 320 that allows a tape T for stripping the film F from the wafer W to contact the film F and is configured to rotate at a speed corresponding to the movement speed of the chuck 310, and a stripping bar 330 that adjusts the stripping angle between the film F with the tape T attached and the wafer W.

The chuck 310 is a structure having a certain area and can be provided in the form of a plate capable of receiving the wafer W. The chuck 310 includes a wafer receiving surface on which the wafer W is received and can be linearly or rotationally driven by a drive unit for driving the chuck 310. In one example, a temperature control device for adjusting the temperature of the wafer W can be provided on the chuck 310.

The peeling roller 320 is a cylindrical roller rotatable about its central axis. It can move the tape T by rotating while wrapped around it. In particular, the peeling roller 320 can rotate while contacting the upper film F of the wafer W to peel the film F from the wafer W, thereby adhering the film F to the tape T. The peeling roller 320 can be rotationally driven by a roller rotation drive unit 325 .

According to one embodiment, the film stripping device 30 may include a roller temperature regulating portion 322 disposed in the inner space of the stripping roller 320 and regulating the temperature of the stripping roller 320. The roller temperature regulating portion 322 may be a heater and/or a cooler, and may regulate the temperature of the stripping roller 320 to maintain an optimal temperature for stripping the film F.

The roller rotation drive unit 325 is coupled to the peeling roller 320 and rotates the peeling roller 320. The roller rotation drive unit 325 is connected to the central axis of the peeling roller 320 to rotate the peeling roller 320. Furthermore, the roller rotation drive unit 325 is configured to operate synchronously with the chuck drive unit 340. Specifically, the rotation speed of the peeling roller 320 generated by the roller rotation drive unit 325 can be set to the same speed as the movement speed of the chuck 310 generated by the chuck drive unit 340. The roller rotation drive unit 325 can be operated by a control signal synchronized with the chuck drive unit 340.

The peeling bar 330 is positioned adjacent to the peeling roller 320 along the direction in which the tape T moves, allowing the film F to be peeled from the wafer W while still attached to the tape T. The peeling bar 330 is configured to be spaced a certain distance from the wafer W. The peeling bar 330 can be configured to be higher than the peeling roller 320 relative to the chuck 310. In other words, the peeling bar 330 can be configured to be located at a higher position than the peeling roller 320.

The peeling strip 330 may be provided in a strip shape having a triangular cross section. The angles of the triangles constituting the peeling strip 330 may be the same or different. The peeling angle of the film F may be variably adjusted by rotating the peeling strip 330.

6 , an adhesive tape T is wrapped around a peeling roller 320 and attached to a film F above a wafer W. Specifically, the film F adheres to the tape T through the horizontal movement of the chuck 310 and the rotation of the peeling roller 320. The tape T, with the film F attached, moves toward the tape recovery unit 50 at a peeling angle set by the peeling bar 330.

According to an embodiment of the present invention, the film stripping device 30 includes a stripping bar rotation drive unit 335 coupled to the stripping bar 330 to rotationally drive the stripping bar 330. The stripping bar 330 is configured to rotate via the stripping bar rotation drive unit 335. As shown in FIG. 7 (a) and (b), the stripping angle of the film F can be adjusted by rotating the stripping bar 330.

According to an embodiment of the present invention, the film stripping device 30 may include a roller vertical drive unit 360 that moves the stripping roller 320 and the stripping bar 330 in the vertical direction. The roller vertical drive unit 360 can work in conjunction with the stripping roller 320 and the stripping bar 330 to move the stripping roller 320 and the stripping bar 330 in the vertical direction (Z direction). The roller vertical drive unit 360 can be composed of a drive device such as a ball screw, a cylinder, or a linear motor. The roller vertical driving portion 360 can be fixed to a structure 365 that fixes and secures the stripping roller 320 and the stripping bar 330, and can be raised and lowered together with the stripping roller 320 and the stripping bar 330 by the lifting and lowering of the roller vertical driving portion 360.

As shown in FIG8 and FIG9, the chuck rotation drive unit 350 may be disposed above the moving plate 315 below the chuck 310 and may be configured so that the chuck 310 can rotate about a horizontal axis (X-axis direction).

According to an embodiment of the present invention, the film stripping device 30 may include a chuck rotation driver 350 for adjusting the tilt of the chuck 310 to align the chuck 310 with the stripping roller 320. To accurately strip the film F, it is crucial that the entire stripping roller 320 is in uniform and tight contact with the chuck 310. Therefore, the stripping roller 320 and the chuck 310 need to be aligned, and the tilt of the chuck 310 can be adjusted by the chuck rotation driver 350.

According to an embodiment of the present invention, the film stripping device 30 further includes a movable plate 315 disposed above the chuck drive unit 340 and configured to move horizontally (in the X direction) via the chuck drive unit 340, and distance sensors 311A and 311B disposed above and on both sides of the movable plate 315 for measuring the distance relative to the chuck 310. Distance sensors 311A and 311B can measure the distance from the distance sensors 311A and 311B to the chuck 310 by irradiating laser light upward and measuring the reflection time. As shown in FIG. 9 , a first distance from a first distance sensor 311A located on the left side to the left end of the chuck 310 and a second distance from a second distance sensor 311B located on the right side to the right end of the chuck 310 are measured.

According to an embodiment of the present invention, the chuck rotation driver 350 can rotate the chuck 310 based on the distances relative to the chuck 310 measured by the distance sensors 311A and 311B to maintain the levelness of the chuck 310. Referring to FIG9 , a first distance from a first distance sensor 311A located on the left side to the left end of the chuck 310 and a second distance from a second distance sensor 311B located on the right side to the right end of the chuck 310 can be measured. The chuck rotation driver 350 rotates the chuck 310 so that the first and second distances are the same, thereby maintaining the levelness of the chuck 310. Such horizontal maintenance of the chuck 310 can be performed before the peeling roller 320 contacts the wafer W, which can prevent the tape T of the peeling roller 320 from being unevenly attached to the film F on the wafer W due to the tilt of the chuck 310.

According to an embodiment of the present invention, the film peeling device 30 may further include chuck load sensors 310A and 310B for measuring the pressure applied to both sides of the chuck 310, and a chuck rotation drive unit 350 for rotating the chuck 310 to align the chuck 310 and the peeling roller 320 based on the pressure applied to the chuck load sensors 310A and 310B. Chuck load sensors 310A and 310B for measuring the load applied by the peeling roller 320 can be installed on both sides of the chuck 310. The chuck rotation drive unit 350 can adjust the tilt of the chuck 310 based on the loads measured by the chuck load sensors 310A and 310B. For example, as shown in FIG9 , a first chuck load sensor 310A and a second chuck load sensor 310B can be installed on the left and right sides of the chuck 310, respectively, to measure the load F1 applied to the first chuck load sensor 310A and the load F2 applied to the second chuck load sensor 310B. The chuck rotation driver 350 can adjust the tilt of the chuck 310 by comparing the load F1 applied to the first chuck load sensor 310A with the load F2 applied to the second chuck load sensor 310B.

A video unit 370 for checking the placement of the wafer W can be installed above the chuck 310. The video unit 370 can capture images of the top of the chuck 310 to confirm the current position of the chuck 310 and check the position of the wafer W installed in the chuck 310. Furthermore, a chuck position adjustment unit 380 for moving the chuck drive unit 340 horizontally (in the Y-axis direction) can be installed below the chuck drive unit 340. The chuck position adjustment unit 380 can be moved along a shaft 385 extending in the horizontal direction (in the Y-direction). The chuck position adjustment unit 380 can move the chuck drive unit 340 to align with the position of the peeling roller 320.

In another embodiment of the present invention, elastic members 312A and 312B, such as springs, may be provided on both sides of the peeling roller 320. As shown in FIG10 , the peeling roller 320 may be configured to be able to rock to a certain extent by the elastic members 312A and 312B, and the force applied by the elastic members 312A and 312B may be used to ensure uniform contact between the peeling roller 320 and the chuck 310.

Hereinafter, the tape supply unit 40 that supplies the tape T to the film peeling device 30 and the tape recovery unit 50 that recovers the tape T to which the film F is attached will be described.

According to the present invention, the tape supply unit 40 includes a tape storage unit 405 that supplies the wound supply tape UT to the film peeling device 30, a supply tension control unit 40A that controls the tension of the supply tape UT, and a supply position control unit 40B that controls the position of the supply tape.

The supply tape storage unit 405 may store the supplied supply tape UT in a reel or the like, and the supply tape UT wound around the supply tape storage unit 405 may be supplied to the film peeling device 30 by rollers included in the tape supply unit 40 .

As shown in Figure 11, a belt supply roller 410 on which the belt is wound is provided in a supply belt storage portion 405, and is provided with a supply roller motor 430 for providing power for rotating the belt supply roller 410, a supply roller clutch 440 for adjusting the coupling force between the belt supply roller 410 and the supply roller motor 430, and a supply roller horizontal drive portion 465 for moving the belt supply roller 410 in order to align the center position of the belt supply roller 410.

According to an embodiment of the present invention, the supply tension control unit 40A for controlling the tension of the supply tape UT may include a tape supply roller 410 for supplying the supply tape UT to the film peeling device 30, a supply tension measuring load sensor 420 for measuring the tension of the supply tape UT, a supply roller motor 430 for providing power for rotating the tape supply roller 410, and a supply roller clutch 440 for adjusting the coupling force between the tape supply roller 410 and the supply roller motor 430.

The supply tension measurement load sensor 420 can be installed on one of the rollers that feed the supply tape UT to the film peeling device 30. It can measure the pressure (tension) of the supply tape UT generated in the corresponding roller and provide this information to a controller (not shown) that controls the supply roller motor 430 and the supply roller clutch 440. The controller can control the supply roller clutch 440 to maintain a constant tension in the supply tape UT. For example, the supply roller clutch 440 can normally maintain the supply roller 410 and the supply roller motor 430 in a partially engaged state (a semi-clutched state). However, when the tension of the supply tape UT is below the reference range, the supply roller clutch 440 may fully engage the tape supply roller 410 with the supply roller motor 430, and the supply roller motor 430 may rotate the tape supply roller 410 at a speed lower than the current speed at which the supply tape UT is being unwound, thereby increasing the tension of the supply tape UT. When the tension of the supply tape UT is above the reference range, the supply roller clutch 440 may engage the tape supply roller 410 with the supply roller motor 430, and the supply roller motor 430 may rotate the tape supply roller 410 at a speed higher than the current speed at which the supply tape UT is being unwound, thereby reducing the tension of the supply tape UT. If the tension of the supply belt UT is determined to be within the reference range, the supply roller clutch 440 releases the coupling between the supply roller 410 and the supply roller motor 430.

According to an embodiment of the present invention, the supply position control unit 40B may include a supply belt position sensor 450 for measuring the position of the supply belt UT, and a supply roller horizontal drive unit 465 for moving the belt supply roller 410 according to the position information of the supply belt measured by the supply belt position sensor 450 to adjust the horizontal position of the belt supply roller 410.

Referring to Figure 12 , a supply tape position sensor 450 can be positioned on a roller on the line supplying the film from the supply tape storage unit 405 to the film stripping device 30. This sensor can measure the relative position of the supply tape UT relative to the roller. Specifically, the sensor can determine whether the supply tape UT is centered or tilted to the left or right. If the sensor detects that the supply tape UT is tilted in a specific direction, a process can be initiated to correct the position of the supply tape UT toward the center.

The supply roller horizontal drive unit 465 can adjust the horizontal position (Y-direction position) of the tape supply roller 410 based on the position of the supply tape UT measured by the supply tape position sensor 450. More specifically, referring to FIG. 12 , the tape supply roller 410 may be coupled to a horizontal moving structure 415, and the supply roller horizontal drive unit 465 may adjust the position of the tape supply roller 410 by moving the horizontal moving structure 415. For example, when the supply tape UT deflects in the -Y direction, the tape supply roller 410 may be moved in the +Y direction; when the supply tape UT deflects in the +Y direction, the tape supply roller 410 may be moved in the -Y direction.

As described above, the tape supply unit 40 can supply the supply tape UT with a certain tension aligned with the center portion to the film stripping device 30. The film F stripped by the film stripping device 30 can be supplied again to the tape recovery unit 50 for recovering the tape while still attached to the tape T.

According to the present invention, the belt recovery section 50 may include a recovery belt storage section 505 for storing the recovery belt RT with the film F attached in a rolled state, a recovery tension control section 50A for controlling the tension of the recovery belt RT, and a recovery position control section 50B for controlling the position of the recovery belt RT.

The recovery tape storage unit 505 can store the recovery tape RT in the form of a reel, and after the recovery tape RT is supplied from the film stripping device 30 to the recovery tape storage unit 505 via the rollers included in the tape recovery unit 50, the recovery tape is stored in a wound state.

It can be that a belt recovery roller 510 on which the recovery belt RT is wound is provided in the recovery belt storage section 505, and is equipped with a recovery roller motor 530 for providing power for rotating the belt recovery roller 510, a recovery roller clutch 540 for adjusting the coupling force between the belt recovery roller 510 and the recovery roller motor 530, and a recovery roller horizontal driving section 565 for moving the belt recovery roller 510 in order to align the center position of the belt recovery roller 510.

According to an embodiment of the present invention, the recovery tension control unit 50A for controlling the tension of the recovery belt RT may include a belt recovery roller 510 for recovering the recovery belt RT from the film stripping device 30, a recovery tension measuring load sensor 520 for measuring the tension of the recovery belt RT, a recovery roller motor 530 for providing power for rotating the belt recovery roller 510, and a recovery roller clutch 540 for adjusting the coupling force between the belt recovery roller 510 and the recovery roller motor 530.

Referring to Figure 13 , a recovery tension measurement load sensor 520 can be installed on one of the rollers that supply the recovery tape RT from the film stripping device 30 to the recovery tape storage unit 505. This sensor can measure the pressure (tension) of the recovery tape RT generated in the corresponding roller and provide this information to a controller (not shown) that controls the recovery roller motor 530 and the recovery roller clutch 540. The controller can control the recovery roller clutch 540 to maintain a constant tension in the recovery tape RT. For example, the recovery roller clutch 540 can normally maintain a partially engaged state (semi-engaged state) between the recovery roller 510 and the recovery roller motor 530. However, when the tension of the recovery tape RT is lower than the reference range, the recovery roller clutch 540 may fully engage the recovery roller 510 with the recovery roller motor 530, and the recovery roller motor 530 may rotate the recovery roller 510 at a speed higher than the current speed at which the recovery tape RT is wound, thereby increasing the tension of the recovery tape RT. When the tension of the recovery tape RT is higher than the reference range, the recovery roller clutch 540 may engage the recovery roller 510 with the recovery roller motor 530, and the recovery roller motor 530 may rotate the recovery roller 510 at a speed lower than the current speed at which the recovery tape RT is wound, thereby reducing the tension of the recovery tape RT. If the tension of the recovery belt RT is measured to be within the reference range, the recovery roller clutch 540 releases the coupling between the belt recovery roller 510 and the recovery roller motor 530.

According to an embodiment of the present invention, the recovery position control unit 50B may include a recovery belt position sensor 550 for measuring the position of the recovery belt RT and a recovery roller horizontal driving unit 565 for adjusting the horizontal position of the belt recovery roller 510 by moving the belt recovery roller 510 according to the position information of the recovery belt measured by the recovery belt position sensor 550.

The recovery tape position sensor 550 can be located on a roller on the line connecting the film stripping device 30 to the recovery tape storage unit 505. It can measure the relative position of the recovery tape RT relative to the corresponding roller. Specifically, the recovery tape position sensor 550 can determine whether the recovery tape RT is centered on the roller or deviated to the left or right. If the recovery tape position sensor 550 detects that the recovery tape RT is deviating in a specific direction, a process can be executed to correct the position of the recovery tape RT toward the center.

The recovery roller horizontal drive unit 565 can adjust the horizontal position (Y-direction position) of the recovery roller 510 based on the position of the recovery belt RT measured by the recovery belt position sensor 550. More specifically, referring to FIG13 , the recovery roller 510 can be coupled to a horizontal moving structure 515, and the recovery roller horizontal drive unit 565 can adjust the position of the recovery roller 510 by moving the horizontal moving structure 515. For example, when the recovery belt RT deflects in the -Y direction, the recovery roller 510 can be moved in the +Y direction, and when the recovery belt RT deflects in the +Y direction, the recovery roller 510 can be moved in the -Y direction.

The laminating apparatus 1 according to the present invention further includes a conveying speed control unit 60 that works synchronously with the stripping roller 320 and the chuck drive unit 340 and controls the supply and recovery speed of the tape T.

The conveyor speed control unit 60 can operate synchronously with the stripping roller 320 and the chuck drive unit 340 of the film stripping device 30 and can be used when it is necessary to control the speed of the entire tape T. In other words, the conveyor speed control unit 60 adjusts the overall moving speed of the tape T, while the stripping roller 320 and the chuck drive unit 340 operate synchronously with the conveyor speed control unit 60 to enable smooth stripping of the film F. Although the supply roller motor 430 and the recovery roller motor 530 driving the tape supply roller 410 and the tape recovery roller 510 provide power for supplying and recovering the tape T, the supply roller clutch 440 and the recovery roller clutch 540 usually operate in a semi-clutch state, and cooperate with the conveying speed control unit 60 to adjust the rotation speed of the tape supply roller 410 and the tape recovery roller 510.

15A and 15B , the transport speed control unit 60 may include an upper transport roller 610 and a lower transport roller 620, a lower structure 630 coupled to the lower transport roller 620, and a cylinder 640 for raising and lowering the lower transport roller 620. The upper transport roller 610 may be configured to rotate via a transport speed control motor 615, which may be used to determine the transport speed of the belt T. Meanwhile, the lower transport roller 620 may be raised or lowered by the cylinder 640. When the lower transport roller 620 is raised, both sides of the recovery belt RT are in close contact with the upper and lower transport rollers 610 and 620, allowing the upper transport roller 610 to adjust the speed of the recovery belt RT.

The laminating apparatus 1 according to the present invention may include a tape direction control unit 70 for correcting the skew of the tape T supplied to the film stripping device 30. To prevent the tape T from being centered on the stripping roller 320 and skewed to one side, the tape direction control unit 70 measures the position of the tape T supplied from the stripping roller 320 and corrects the skew of the tape T so that the tape T is centered.

According to an embodiment of the present invention, the tape direction control unit 70 may include a tape correction roller 710 configured to rotate relative to a vertical direction and supply the tape T supplied from the tape supply unit 40 to the film stripping device 30, a tape position measuring sensor 720 for measuring the position of the tape T supplied to the film stripping device 30, and a tape correction drive unit 730 for controlling the rotation drive of the tape correction roller 710 based on the tape position information.

As shown in Figures 16A and 16B , the tape correction roller 710 is provided in the form of a conveyor belt or the like, and guides the tape T supplied from the tape supply unit 40 toward the film peeling device 30. The tape correction roller 710 is coupled to a tape correction drive unit 730, capable of rotating about a vertical axis (Z axis). The tape correction drive unit 730 rotates the tape correction roller 710 based on information about the skew of the tape T to align the tape T with the center of the peeling roller 320. As shown in Figures 16A and 16B , a tape position sensor 720 can be located in the portion of the tape correction roller 710 facing the film peeling device 30 to measure the position of the tape T and provide the information to a controller (not shown) that controls the tape correction drive unit 730. When the tape T deviates to the left or right, the controller that controls the tape correction drive unit 730 causes the tape correction drive unit 730 to rotationally drive the tape correction roller 710. The tape correction roller 710 corrects the position of the tape T by being rotationally driven by the tape correction drive unit 730.

According to the present invention, the laminating device 1 may include a supply tape replacement sensing sensor 407 provided in the tape supply section 40 for measuring the amount of the supply tape UT wound into the supply tape storage section 405, and a recovery tape replacement sensing sensor 507 provided in the tape recovery section 50 for measuring the amount of the recovery tape RT wound into the recovery tape storage section 505. Referring to FIG. 17 , the supply tape replacement sensing sensor 407 may include a distance sensor using a laser, and may measure the distance between the supply tape replacement sensing sensor 407 and the supply tape UT to calculate the remaining amount of the supply tape UT. Similarly, the recycling tape replacement sensing sensor 507 may include a distance sensor using a laser, which can measure the distance between the recycling tape replacement sensing sensor 507 and the recycling tape RT to calculate the amount of remaining recycling tape RT.

When the supply tape UT is completely consumed, a new supply tape reel must be deployed to replace the consumed supply tape reel. Similarly, when the amount of recovery tape RT exceeds a certain level, a new recovery tape reel must be deployed to replace the recovery tape reel wound with the recovery tape RT. The laminating device 1 according to one embodiment of the present invention may include a device for efficiently replacing the supply tape UT or the recovery tape RT.

According to an embodiment of the present invention, it can include a supply tape replacement unit 45 arranged in the supply tape storage part 405 and configured to hold the two end portions of the supply tape UT in order to cut the supply tape UT when replacing the supply tape UT, and a recovery tape replacement unit 55 arranged in the tape recovery part 50 and configured to hold the two end portions of the recovery tape RT in order to cut the recovery tape RT when replacing the recovery tape.

Referring to FIG. 18 , the supply tape replacement unit 45 includes grippers 470A, 470B, 470C, and 470D for holding the ends of the supply tape UT, as well as upper and lower cutting guides 472 and 474 for cutting the supply tape UT. When the supply tape UT needs to be replaced, the grippers 470A, 470B, 470C, and 470D secure the supply tape UT, while the operator cuts the supply tape UT along the upper and lower cutting guides 472 and 474. After the existing supply tape UT is cut and a new supply tape UT is added, the ends of the new supply tape UT are bonded to the ends of the existing supply tape UT, ensuring a seamless connection between the supply tape UT and the supply tape.

Similarly, the recovery tape replacement unit 55 includes grippers 570A, 570B, 570C, and 570D for holding the ends of the recovery tape RT, as well as upper and lower cutting guides 572 and 574 for cutting the recovery tape RT. When the recovery tape RT needs to be replaced, the grippers 570A, 570B, 570C, and 570D secure the recovery tape RT, while the operator cuts the recovery tape RT along the upper and lower cutting guides 572 and 574. When the recovery tape RT is cut, the upper portion of the recovery tape RT remains, while the lower portion is removed. When the existing recovery tape RT is cut and a new one is added, the ends of the new recovery tape RT are bonded to the ends of the existing one, ensuring a seamless connection between the recovery tapes RT.

FIG19 illustrates another example of a delamination apparatus 1 according to the present invention. Referring to FIG19 , the delamination apparatus 1 may include a wafer aligner 80 for aligning wafers W in a specific direction before transferring them to the film stripping apparatus 30. The wafer aligner 80 may include a wafer rotation mechanism 82 on which the wafer W is placed and rotated, and an alignment video unit 84 that captures the top of the wafer W to determine the current orientation of the wafer W. First, the wafer transfer robot 20 places the wafer W on top of the wafer rotation mechanism 82. Subsequently, while the wafer W is rotated by the wafer rotation mechanism 82, the alignment video unit 84 detects the orientation of the wafer W by sensing an identification mark (or pattern) located on the edge of the wafer W. If the alignment video unit 84 confirms that the orientation of the wafer W is aligned with a specific direction based on the identification mark on the wafer W, the wafer rotation mechanism 82 stops rotating the wafer W, and the wafer transport robot 20 picks up the wafer W and transfers it to the film stripping device 30.

19 , the lamination apparatus 1 according to the present invention includes a loading port 10 to which a wafer W with a film F attached thereto is supplied, a wafer aligner 80 for aligning the wafer W in a specific direction, a wafer transport robot 20 for transporting the wafer W, a tape supply unit 40 for supplying a tape T for stripping the film F, a film stripping device 30 for stripping the film F from the wafer W using the tape T, and a tape recovery unit 50 for recovering the tape T with the film F attached thereto.

The film stripping device 30 includes a chuck 310 on which a wafer W with a film F attached is placed and is configured to move in the horizontal direction (X direction), a stripping roller 320 that allows a tape T for stripping the film F from the wafer W to contact the film F and is configured to rotate at a speed corresponding to the moving speed of the chuck 310, and a stripping bar 330 that is driven by rotation to adjust the stripping angle between the film F with the tape T attached and the wafer W.

The tape supply unit 40 includes a supply tape storage unit 405 that supplies the wound supply tape UT to the film peeling device 30, a supply tension control unit 40A that controls the tension of the supply tape UT, and a supply position control unit 40B that controls the position of the supply tape.

The tape recovery unit 50 includes a tape storage unit 505 that stores the recovery tape RT with the film F attached thereto in a rolled state, a recovery tension control unit 50A that controls the tension of the recovery tape RT, and a recovery position control unit 50B that controls the position of the recovery tape RT.

This embodiment and the drawings attached to this specification only clearly represent a part of the technical concept included in the present invention. It is obvious that modifications and specific embodiments that can be easily derived by technical personnel in this field within the scope of the technical concept included in the specification and drawings of the present invention are all included in the scope of the rights of the present invention.

Therefore, the concept of the present invention should not be limited to the embodiments described, and not only the scope of the attached patent application, but all concepts that are equivalent to or equivalently modified to the scope of the patent application belong to the scope of the concept of the present invention.

1: Lamination Equipment 5: Transport Container 10: Loading Port 20: Wafer Handling Robot 30: Film Stripping Device 310: Chuck 310A: First Chuck Load Sensor 310B: Second Chuck Load Sensor 311A: First Distance Sensor 311B: Second Distance Sensor 312A: Elastic Body 312B: Elastic Body 315: Moving Plate 320: Stripping Roller 322: Roller Temperature Control Unit 325: Roller Rotation Drive Unit 330: Stripping Bar 335: Stripping Bar Rotation Drive Unit 340: Chuck drive unit 350: Chuck rotation drive unit 360: Roller vertical drive unit 365: Structure 370: Video unit 380: Chuck position adjustment unit 385: Shaft 40: Belt supply unit 40A: Supply tension control unit 40B: Supply position control unit 45: Supply belt replacement unit 405: Supply belt storage unit 407: Supply belt replacement sensor 410: Belt supply roller 415: Horizontal movement structure 420: Supply tension measurement load sensor 430: Supply roller motor 440: Supply roller clutch 450: Supply Belt Position Sensor 465: Supply Roller Horizontal Drive 470A: Gripper 470B: Gripper 470C: Gripper 470D: Gripper 472: Upper Shear Guide 474: Lower Shear Guide 50: Belt Recovery Unit 50A: Recovery Tension Control Unit 50B: Recovery Position Control Unit 55: Recovery Belt Replacement Unit 505: Recovery Belt Storage Unit 507: Recovery Belt Replacement Sensor 510: Belt Recovery Roller 515: Horizontal Movable Structure 520: Recovery Tension Measurement Load Sensor 530: Recovery Roller Motor 540: Recovery Roller Clutch 550: Recovery Belt Position Sensor 565: Recovery roller horizontal drive unit 570A: Gripper 570B: Gripper 570C: Gripper 570D: Gripper 572: Upper shear guide 574: Lower shear guide 60: Conveyor speed control unit 610: Upper conveyor roller 615: Motor 620: Lower conveyor roller 630: Lower structure 640: Cylinder 70: Belt direction control unit 710: Belt correction roller 720: Belt position sensor 730: Belt correction drive unit 80: Wafer aligner 82: Wafer rotation mechanism 84: Alignment video unit C: Wafer F: Film F1: Load F2: Load T: Belt W: Wafer UT: Supply Tape RT: Retrieval Tape

FIG1 is a diagram illustrating the concept of gas-assisted bonding according to the present invention.

FIG2 and FIG3 show the structure of the de-lamination device according to the present invention.

4 and 5 show a film peeling device according to the present invention.

FIG6 shows a process of stripping a film in the film stripping apparatus according to the present invention.

FIG7 shows a process of adjusting the film peeling angle in the film peeling device according to the present invention.

8 to 10 illustrate a structure for aligning a wafer and a chuck in a film stripping apparatus according to the present invention.

Figure 11 shows the schematic structure of the supply tension control part that controls the tension of the supply belt in the laminating device according to the present invention.

Figure 12 shows the schematic structure of the supply position control unit that controls the position of the supply belt in the laminating device according to the present invention.

Figure 13 shows the schematic structure of the recovery tension control unit that controls the tension of the recovery belt in the lamination device according to the present invention.

Figure 14 shows the schematic structure of the recovery position control unit that controls the position of the recovery belt in the lamination device according to the present invention.

15A and 15B show a schematic structure of a conveying speed control unit for controlling the supply and recovery speeds of the belt in the laminating apparatus according to the present invention.

Figures 16A and 16B show a belt direction control unit that corrects the horizontal skew of the belt in the lamination device according to the present invention.

FIG17 illustrates the operation of a belt replacement sensing sensor in a stratification apparatus according to the present invention.

Figure 18 shows a belt changing unit for replacing the belt in a stratification device according to the present invention.

FIG19 shows another example of a layered apparatus according to the present invention.

without

1: Lamination Equipment 10: Loading Port 20: Wafer Handling Robot 30: Film Stripping Device 40: Tape Supply Unit 50: Tape Recovery Unit 310: Chuck 320: Stripping Roller 325: Roller Rotary Drive Unit 330: Stripping Bar 335: Stripping Bar Rotary Drive Unit 340: Chuck Drive Unit W: Wafer

Claims (13)

A lamination apparatus includes: a loading port to which a wafer with a film attached is supplied; a wafer transport robot to transport the wafer; a tape supply unit to supply a tape for stripping the film; a film stripping device to strip the film from the wafer using the tape; and a tape recovery unit to recover the tape with the film attached. The film stripping device includes: a chuck to which the wafer with the film attached is placed and configured to move horizontally; a stripping roller to bring the tape used to strip the film from the wafer into contact with the film and configured to rotate at a speed corresponding to the movement speed of the chuck; A peeling bar is rotationally driven to adjust the peeling angle between the film attached with the tape and the wafer; and A chuck load sensor is used to measure the pressure applied to both sides of the chuck. The tape supply unit includes: A supply tape storage unit that supplies the wound supply tape to the film peeling device; A supply tension control unit that controls the tension of the supply tape; and A supply position control unit that controls the position of the supply tape. The tape recovery unit includes: A recovery tape storage unit that stores the wound recovery tape with the film attached; A recovery tension control unit that controls the tension of the recovery tape; and A recovery position control unit that controls the position of the recovery tape relative to the peeling roller. The lamination device of claim 1, wherein: The peeling strip is provided in the form of a strip having a triangular cross-section. The lamination apparatus of claim 1, wherein: the film stripping device further comprises: a stripping bar rotation drive unit coupled to the stripping bar and configured to rotationally drive the stripping bar. The lamination apparatus of claim 1, wherein: the film stripping device further comprises: a roller temperature adjustment unit disposed within the interior space of the stripping roller and configured to adjust the temperature of the stripping roller. The lamination apparatus of claim 1, wherein the film stripping device further comprises: a vertical roller drive unit for moving the stripping roller and the stripping bar in a vertical direction. The laminating apparatus of claim 1, wherein: the supply tension control unit comprises: a tape supply roller for supplying the tape to the film stripping device; a supply tension measuring load sensor for measuring the tension of the tape supply roller; a supply roller motor for providing power for rotating the tape supply roller; and a supply roller clutch for adjusting the coupling force between the tape supply roller and the supply roller motor. The laminating apparatus of claim 6, wherein: the supply position control unit comprises: a supply belt position sensor for measuring the position of the supply belt; and a supply roller horizontal drive unit for adjusting the horizontal position of the supply roller by moving the supply roller based on the supply belt position information measured by the supply belt position sensor. The laminating apparatus of claim 1, wherein: the recovery tension control unit comprises: a belt recovery roller for delivering the recovery belt to the recovery belt storage unit; a recovery tension measurement load sensor for measuring the tension of the recovery belt; a recovery roller motor for providing power for rotating the belt recovery roller; and a recovery roller clutch for adjusting the coupling force between the belt recovery roller and the recovery roller motor. The laminating apparatus of claim 8, wherein: the recovery position control unit comprises: a recovery belt position sensor for measuring the position of the recovery belt; and a recovery roller horizontal drive unit for adjusting the horizontal position of the recovery roller by moving the recovery roller based on the recovery belt position information measured by the recovery belt position sensor. The lamination apparatus of claim 1, further comprising: a tape direction control unit for correcting skew of the tape provided to the film stripping device. The laminating apparatus of claim 10, wherein: the tape direction control unit includes: a tape correction roller configured to rotate relative to a vertical direction and to supply the tape supplied from the tape supply unit to the film stripping device; a tape position sensor configured to detect the position of the tape supplied to the film stripping device; and a tape correction drive unit configured to control the rotational drive of the tape correction roller based on information about the tape's inclination. A lamination device includes: a loading port to which a wafer with a film attached thereto is supplied; a wafer aligner to align the wafer in a specific direction; a wafer transport robot to transport the wafer; a tape supply unit to supply a tape for stripping the film; a film stripping device to strip the film from the wafer using the tape; and a tape recovery unit to recover the tape with the film attached thereto. The film stripping device includes: a chuck to which the wafer with a film attached thereto is placed and configured to be movable in a horizontal direction; a stripping roller to bring the tape used to strip the film from the wafer into contact with the film and configured to rotate at a speed corresponding to the movement speed of the chuck; A peeling bar is rotationally driven to adjust the peeling angle between the film attached with the tape and the wafer; and A chuck load sensor is used to measure the pressure applied to both sides of the chuck. The tape supply unit includes: A supply tape storage unit that supplies the wound supply tape to the film peeling device; A supply tension control unit that controls the tension of the supply tape; and A supply position control unit that controls the position of the supply tape. The tape recovery unit includes: A recovery tape storage unit that stores the wound recovery tape with the film attached; A recovery tension control unit that controls the tension of the recovery tape; and A recovery position control unit that controls the position of the recovery tape relative to the peeling roller. The lamination apparatus of claim 12, wherein: the film stripping device further comprises: a chuck drive unit for moving the chuck horizontally; and a roller rotation drive unit for rotating the stripping roller in synchronization with the chuck drive unit, the roller rotation drive unit rotating the stripping roller at the same speed as the speed of movement of the chuck by the chuck drive unit.