TWI816586B - Test equipment and test methods - Google Patents

Abstract

The embodiment of the present invention discloses a test equipment, which includes a frame, a transfer plate, a transfer module and a flip module that holds a test carrier plate. The transfer module and the flip module are located on the machine. The transfer plate is placed on the frame, and the frame has a first area and a second area; when the transfer plate is in the first area, the transfer module moves the intermediate The turntable reaches the second area, the flipping module holds the intermediate turntable, presses the intermediate turntable and the test carrier tray, flips the intermediate turntable and the test carrier tray, so that the intermediate turntable All the loaded untested wafers are transferred to the test carrier. Transfer multiple untested wafers on the intermediate carousel to the test carrier. At this time, the pins of the wafers are facing upwards, realizing automatic flipping of multiple wafers at one time to improve testing efficiency.

Description

Test equipment and test methods

The present invention relates to the technical field of wafer testing, and in particular to a testing equipment and a testing method thereof.

As the control brain of electronic and electrical products, chips play an important role. With the continuous improvement of technological level and people's consumption level in recent years, the market demand for chips is growing day by day. For chip manufacturers, in order to ensure the quality of chip manufacturing, they generally need to conduct regular testing and sorting operations before leaving the factory. Since the wafer is stored in the tray, the pins of the wafer are facing down. The wafer placed in this way cannot be contacted by the test probe of the tester. For this reason, the wafer needs to be turned over so that the pins of the wafer are facing up. However, At present, automatic flipping requires taking out the wafer and then flipping it over, and only one wafer is flipped at a time, resulting in low testing efficiency.

In view of this, the present invention provides a testing device and a testing method thereof to solve the problem in the prior art that automatic flipping involves flipping one wafer at a time, resulting in low testing efficiency.

In order to achieve one, part or all of the above objects or other objects, the present invention proposes a test equipment, including a rack, a transfer plate, a transfer module and a flip module holding a test carrier plate. The transfer module The group and the flip module are arranged on the frame, the intermediate turntable is placed on the frame, and the frame has a first area and a second area; When the transfer plate is in the first area, the transfer module moves the transfer plate to the second area, the flip module holds the transfer plate, and presses the transfer plate and The test carrier turns over the intermediate turntable and the test carrier, so that all the untested wafers carried by the intermediate turntable are transferred to the test carrier.

Preferably, when the intermediate turntable is in the second area, the flip module holds the intermediate turntable, presses the intermediate turntable and the test carrier plate, and flips the intermediate turntable and the test carrier. Test the carrier tray to transfer all the tested wafers carried by the test carrier tray to the transfer tray, and the transfer module transfers the transfer tray to the first area.

Preferably, the first area is a normal temperature area, and the second area is a temperature adjustment area.

Preferably, the flip module is located in the second area.

Preferably, the testing equipment further includes a suction mechanism and a first carrier tray. The suction mechanism is provided on the frame. The first area includes a material waiting area and a transfer area. The first carrier tray is placed In the rack and located in the material waiting area, the suction mechanism absorbs all the untested wafers carried by the first carrier tray and transfers them to the transfer tray located in the transfer area.

Preferably, the suction mechanism is located in the first area.

Preferably, the first area also includes a sorting area and a second carrier tray, the second carrier tray is placed on the rack and is located in the sorting area, and the suction mechanism sucks the materials located in the transfer area. All the tested wafers carried on the transfer plate are transferred to the second carrier plate.

Preferably, the test equipment further includes a pre-temperature adjustment module, the pre-temperature adjustment module is provided in the transfer module, and the pre-temperature adjustment module adjusts the temperature of the transfer module to the first A preset temperature, the difference between the first preset temperature and the temperature of the test carrier is within a first preset range.

Preferably, the transfer module is made of a material with a first thermal expansion coefficient, the test carrier is made of a material with a second thermal expansion coefficient, and the difference between the first thermal expansion coefficient and the second thermal expansion coefficient is within the second preset range.

Preferably, the test equipment also includes a soaking station and a transmission mechanism with a first temperature adjustment module. The transmission mechanism and soaking station are located on the frame, and the second area includes a turning area and a transfer area. , the soaking station is located in the transfer area, the flipping module is located in the flipping area, the soaking station has at least two stacking structures, each stacking structure has multiple levels of storage space for accommodating stacks. Multiple test carriers are stored, and the first temperature adjustment module adjusts the temperature of the test carriers in the stacked structure to the test temperature; The transfer mechanism transfers a test carrier with a plurality of untested wafers from the flipping area to a stacked structure in the soak station.

Preferably, the transfer mechanism transfers a test carrier with a plurality of tested wafers from the transfer area to the flip module.

Preferably, the second area also includes a transmission area, the transmission mechanism includes an XYZ axis mechanism, the transmission mechanism moves to the flipping area through the XYZ axis mechanism, and sucks multiple modules from the flipping module. A test carrier with untested wafers moves along the X-axis into the transfer area, moves along the Y-axis in the transfer area, then moves along the X-axis into the transfer area, and then moves along the Z-axis for alignment Storage spaces at different levels transfer test carriers with multiple untested wafers to the stacked structure.

Preferably, the transmission mechanism moves along the Z-axis through the XYZ-axis mechanism to align the test carriers with multiple tested wafers in storage spaces at different levels, and then moves along the X-axis into the transmission area, move along the Y-axis in the transfer area, then move along the X-axis into the flipping area, and transfer the test carrier with multiple tested wafers to the flipping module.

Preferably, the test equipment further includes a test sending mechanism located on the rack, the second area further includes a test area, and the test sending mechanism obtains a plurality of untested wafers from the transfer area. The test carrier disk is moved to the test area.

Preferably, the test sending mechanism includes an XZ axis mechanism, and the testing sending mechanism moves along the X axis in the transfer area through the XZ axis mechanism, and transfers the test carrier with a plurality of untested wafers to the The test area then moves along the Z-axis and transfers the test carrier with multiple untested wafers for testing.

Preferably, the test sending mechanism moves along the Z axis in the test area through the XZ axis mechanism, causing the test carrier with multiple tested wafers to leave the test, and then moves along the X axis to transfer the test carrier with multiple tested wafers. Test wafer test carrier to transfer area.

Preferably, the test sending mechanism has a correction platform, and a camera unit is provided on the correction platform. The correction platform detects the position of the test carrier with multiple untested wafers through the camera unit, and detects the position of the test carrier with multiple untested wafers through the XY The test carrier with a plurality of untested wafers is rotated in an axial direction to correct the position of the test carrier with a plurality of untested wafers on the correction platform.

Preferably, the soaking station is provided with a rotating door, the rotating door rotates to a first position, the storage space of the stack structure has an opening, the rotating door rotates to a second position, the storage space of the stack structure For a closed cavity.

Preferably, the upper side wall of the test carrier is provided with a plurality of adsorption holes, and the plurality of adsorption holes are used for vacuum adsorption of wafers.

Preferably, the test equipment includes a first air bearing plate, the first air bearing plate is provided on the flip module, and the upper side plate of the first air bearing plate is provided with at least two vacuum holes and at least two vacuum holes. Exhaust air outlet, the bottom side wall of the test carrier is provided with a strip-shaped vacuum input slot, the direction of the strip is consistent with the length direction of the test carrier, the vacuum input slot is in contact with the plurality of adsorption The holes are connected and correspond up and down to the at least two vacuum holes. The at least two rows of air outlets are provided with air bearings. The test carrier is placed on the air bearing plate and can move on the air bearings.

Preferably, the first air bearing plate is provided with a push rod, and the push rod is used to push the test carrier plate to move on the air bearing.

Preferably, the bottom side wall of the test carrier is provided with a sliding seal, and the sliding seal is arranged around the vacuum input groove.

Preferably, the test equipment includes a second air bearing plate, the second air bearing plate is provided on the transmission mechanism, the first air bearing plate and the second air bearing plate have the same structure. When the flip module transfers the test carrier with multiple untested wafers from the flip area to the transfer area, the push rod of the first air bearing plate pushes the test carrier with multiple untested wafers to the transfer area. The second air bearing plate moves to the nearest vacuum hole in the second air bearing plate, and at least one vacuum hole in the first air bearing plate and one vacuum hole in the second air bearing plate are connected simultaneously with The vacuum input slots correspond to each other up and down, and both provide vacuum to the vacuum input slots.

Preferably, the suction mechanism adopts a whole-plate suction cup structure, which is used to suck all the untested wafers carried by the first carrier tray with one suction action, or to suck all the untested wafers carried by the intermediate turntable with one suction action. Test wafer.

Preferably, the testing equipment includes a vibrator, which is provided in the flipping module and used to provide vibration when flipping the intermediate turntable and the test carrier.

Preferably, the testing equipment includes a sorting device, and the second area also includes a good product area, a defective product area and an area to be retested, and the sorting device selects the corresponding type from the second carrier tray. The wafer is moved to the good product area, the defective product area or the area to be retested.

Preferably, the testing equipment includes a pallet stack structure provided on the rack, the pallet stack structure is located in the good product area, the defective product area or the area to be retested, and the pallet stack structure is used for stacking. Multiple pallets.

Preferably, the test equipment includes a pallet lift installed on the frame. The pallet lift moves a pallet to the bottom of the pallet stack structure along the XY axis direction and to the pallet stack structure along the Z axis direction. stacked in the middle.

Preferably, the transmission mechanism is provided with a cleaning device for blowing air to clean the plurality of adsorption holes.

The present invention proposes a testing method for testing equipment. The testing method includes the following steps: The transfer module receives the loading signal and recognizes that the transfer disk is in the first area; The transfer module moves the transfer disk to the second area; The flip module holds the intermediate turntable, presses the intermediate turntable and the test carrier tray, and flips the intermediate turntable and the test carrier tray, so that all the untested wafers carried by the intermediate turntable are transferred to the test carrier disk; and Transfer a test carrier with multiple untested wafers for testing.

Preferably, after the step of transferring a test carrier with a plurality of untested wafers for testing, the following steps are included: The transfer module receives the unloading signal and recognizes that the transfer disk is in the second area; The flipping module holds the intermediate turntable, presses the intermediate turntable and the test carrier tray, and flips the intermediate turntable and the test carrier tray so that the test carrier tray carries multiple tested wafers. All transferred to said staging tray; and The transfer module moves the transfer disk to the first area.

Implementing the embodiments of the present invention will have the following beneficial effects: When the transfer plate is in the first area, the transfer module moves to the first area, moves the transfer plate from the first area to the second area, and puts it into the flip module. The flip module holds the transfer plate and presses it together. The turntable and the test carrier are brought into contact with each other, and the intermediate turntable and the test carrier are turned over, so that the multiple untested wafers on the intermediate turntable are transferred to the test carrier. At this time, the pins of the wafers are facing upwards, solving the problem In the existing technology, automatic flipping involves flipping one wafer at a time, which leads to the problem of low testing efficiency.

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the technical field to which the present invention belongs without making any progressive changes shall fall within the scope of protection of the present invention.

As shown in Figures 1 to 3, the embodiment of the present invention discloses a test equipment, including a frame 2, a transfer plate 11, a transfer module 21 and a flip module 22 holding the test carrier 12. The transfer module 21 and the flip module 22 are provided on the rack 2 , the transfer disk 11 is placed on the rack 2 , and the rack 2 has a first area A and a second area B.

The area where the rack 2 is located is divided into a first area A and a second area B. The first area A is a normal temperature area, and the second area B is a temperature adjustment area.

When the transfer plate 11 is in the first area A, the transfer module 21 moves the transfer plate 11 to the second area B, and the flip module 22 holds the transfer plate 11, The intermediate turntable 11 and the test carrier 12 are pressed together, and the intermediate turntable 11 and the test carrier 12 are turned over, so that all the untested wafers carried by the intermediate turntable 11 are transferred to the test carrier. 12.

The transfer plate 11 carries a plurality of untested wafers and is located in the first area A. At this time, the pins of the wafers on the transfer plate 11 are facing down. The transfer module 21 is used to move back and forth between the first area A and the second area B. , transfer the intermediate carousel 11 from the first area A to the second area B, or transfer the intermediate carousel 11 from the second area B to the first area A.

The transfer module 21 holds the transfer plate 11 in the first area A, and then moves the transfer plate 11 from the first area A to the second area B, and then moves it to the flip module 22. The flip module 22 holds the transfer plate 11. The intermediate transfer plate 11, that is to say, the intermediate transfer plate 11 is changed from being held by the transfer module 21 to being held by the flip module 22. The intermediate transfer plate 11 is located below the test carrier 12, and the intermediate turntable 11 is above and below the test carrier 12. Correspondingly, the intermediate turntable 11 and the test carrier 12 are pressed together. Specifically, the flip module 22 pushes the intermediate turntable 11 to move toward the test carrier 12 , and the upper side wall of the intermediate turntable 11 abuts the lower side wall of the test carrier 12 . The flip module 22 flips the intermediate turntable 11 and the test carrier tray 12 so that the intermediate turntable 11 is located below the test carrier tray 12, and becomes the intermediate turntable 11 above the test carrier tray 12, and multiple untested items originally in the intermediate turntable 11 The wafer is transferred to the test carrier 12. At this time, the pins of the plurality of untested wafers on the test carrier 12 are facing upward. For this reason, a flipping action is completed with the pins of the wafer facing downward. The feet are turned upward, and then the test carrier 12 is removed from the flip module 22 and sent for testing.

To sum up, when the transfer tray 11 is in the first area A, the transfer module 21 moves to the first area A, the transfer tray 11 is moved from the first area A to the second area B, and placed in the flip module 22 During the process, the flip module 22 holds the intermediate turntable 11, presses the intermediate turntable 11 and the test carrier 12, so that the intermediate turntable 11 and the test carrier 12 are in contact, flips the intermediate turntable 11 and the test carrier 12, and allows the intermediate turntable 11 to Multiple untested wafers are transferred to the test carrier 12. At this time, the pins of the wafers are facing up. This solves the problem in the prior art that automatic flipping involves flipping one wafer at a time, resulting in low testing efficiency.

In this embodiment, when the intermediate turntable 11 is in the second area B, the flip module 22 holds the intermediate turntable 11 and presses the intermediate turntable 11 and the test carrier 12 together. The transfer plate 11 and the test carrier 12 are turned over, so that all the tested wafers carried by the test carrier 12 are transferred to the transfer plate 11 , and the transfer module 21 transfers the transfer plate 11 to the first area A.

After the multiple untested wafers in the test carrier 12 have been tested, the test carrier 12 is moved back to the test carrier 12 in the second area B, and the flip module 22 holds the test carrier 12 again. At this time, the test carrier 12 The tray 12 is located below the intermediate turntable 11, and then the intermediate turntable 11 and the test carrier tray 12 are pressed together, and then turned over, so that the positions of the test carrier tray 12 and the intermediate turntable 11 change, and the test carrier tray 12 is located above the intermediate turntable 11 , all the tested wafers in the test carrier 12 are transferred to the transfer tray 11, and the transfer module 21 moves the transfer tray 11 out of the test carrier 12 and returns it to the first area A. To this end, the flipping module 22 not only flips untested wafers and then loads them, but also flips and unloads tested wafers.

In this embodiment, the flip module 22 is located in the second area B.

In this embodiment, the test equipment also includes a suction mechanism 23 and a first carrier tray 13. The suction mechanism 23 is provided on the frame 2. The first area A includes a material waiting area A1 and a transfer area. A2, the first carrier 13 is placed in the rack 2 and located in the material waiting area A1. The suction mechanism 23 absorbs all the untested wafers carried by the first carrier 13 and transfers them to the waiting area A1. The transfer disk 11 of the transfer area A2.

The first carrier tray 13 is placed in the material waiting area A1, and the transfer tray 11 is placed in the transfer area A2. If the first carrier tray 13 carries multiple untested wafers, the intermediate transfer tray 11 is empty, and the suction mechanism 23 starts from the first transfer area A2. A plurality of untested wafers are picked up in a carrier tray 13 , and the plurality of untested wafers are transferred from the material waiting area A1 to the transfer area A2 , and then placed in the transfer tray 11 .

In this embodiment, the suction mechanism 23 is located in the first area A.

In this embodiment, the first area A also includes a sorting area A3 and a second carrier tray 14. The second carrier tray 14 is placed on the rack 2 and located in the sorting area A3. The mechanism 23 absorbs all the tested wafers carried by the transfer tray 11 located in the transfer area A2 and transfers them to the second carrier tray 14 .

The second carrier tray 14 is placed in the sorting area A3. When the turntable 11 carries multiple tested wafers in the transfer area A2, the suction mechanism 23 picks up multiple tested wafers in the transfer tray 11 and transfers them to the sorting area from the transfer area A2. A3, and place a plurality of tested wafers in the second carrier tray 14.

In this embodiment, the test equipment further includes a pre-temperature adjustment module. The pre-temperature adjustment module is provided in the transfer module 21 . The pre-temperature adjustment module is responsible for the transfer module 21 The temperature is adjusted to a first preset temperature, and the difference between the first preset temperature and the temperature of the test carrier 12 is within a first preset range.

The pre-temperature regulating module heats the transfer module 21 to a first preset temperature. The temperature of the test carrier 12 is close to the test temperature. The first preset range is [1°C, 4°C].

In this embodiment, the transfer module 21 is made of a material with a first thermal expansion coefficient, and the test carrier 12 is made of a material with a second thermal expansion coefficient. The first thermal expansion coefficient is the same as the second thermal expansion coefficient. The thermal expansion coefficients differ within the second preset range. The first thermal expansion coefficient is the same as or similar to the second expansion coefficient, and the second preset range is [5, 30].

In this embodiment, the testing equipment also includes a soaking station 24 with a first temperature adjustment module and a transmission mechanism 25. The transmission mechanism 25 and the soaking station 24 are provided in the frame 2, and the second area B includes a flip area B1 and a transfer area B2. The soaking station 24 is located in the transfer area B2. The flip module 22 is located in the flip area B1. The soaking station 24 has at least two stacked structures. A stacked structure has multiple levels of storage space for accommodating multiple test carriers 12 stored in a stack. The first temperature adjustment module adjusts the temperature of the test carriers 12 in the stacked structure to the test temperature;

The transfer mechanism 25 transfers the test carrier 12 with a plurality of untested wafers from the flipping area B1 to a stacked structure in the soaking station 24 .

The transfer mechanism 25 moves between the flip area B1 and the transfer area B2. The transfer mechanism 25 removes the test carrier 12 with multiple untested wafers from the flip module 22, and transfers the test carrier 12 from the flip area B1 to the transfer area. The connection area B2 is placed in the storage space of the stacked structure in the soaking station 24. The first temperature adjustment module heats the test carrier 12 in the stacked structure and adjusts its temperature to the test temperature.

Specifically, one of the at least two stacked structures is used to store the test carrier 12 carrying untested wafers, and the other of the at least two stacked structures is used to store test carriers 12 carrying the tested wafers. Loading disk 12.

In this embodiment, the transfer mechanism 25 transfers the test carrier 12 with a plurality of tested wafers from the transfer area B2 to the flip module 22 .

The transfer mechanism 25 removes the test carrier 12 of the tested wafer from the stacked structure in the soaking station 24, and then moves the test carrier 12 from the transfer area B2 to the flip area B1, and transfers it to the flip module 22 for holding.

In this embodiment, the second area B also includes a transmission area B3, and the transmission mechanism 25 includes an XYZ axis mechanism. The transmission mechanism 25 moves to the flipping area B1 through the XYZ axis mechanism, and moves from the XYZ axis mechanism to the flipping area B1. The flip module 22 holds the test carrier 12 of multiple untested wafers, then moves along the X-axis into the transfer area B3, moves along the Y-axis in the transfer area B3, and then moves along the X-axis into the transfer area B3. The transfer area B2 then moves along the Z-axis to align with the storage spaces at different levels, and transfers the test carrier 12 with a plurality of untested wafers to the stacked structure.

The transmission mechanism 25 has an XYZ axis mechanism, which can move in the X-axis direction, the Y-axis direction and the Z-axis direction. When the transmission mechanism 25 needs to obtain the test carrier 12 with multiple untested wafers in the flip area B1 , the transmission mechanism 25 first moves to the flip area B1, holds the test carrier 12 from the flip module 22, and then moves through the X-axis and Y-axis to make the test carrier 12 enter the transfer area B2, and then moves along the Z-axis. , move the test carrier 12 upward, align it with the storage spaces at different levels, and move the test carrier 12 into the stacking structure.

In this embodiment, the transmission mechanism 25 moves along the Z axis through the XYZ axis mechanism to align the test carrier 12 with multiple tested wafers in storage spaces at different levels, and then moves along the X axis. Enter the transfer area B3, move along the Y-axis in the transfer area B3, and then move along the X-axis into the flipping area B1, and transfer the test carrier 12 with multiple tested wafers to the flipping module 22 .

The transmission mechanism 25 moves to the transfer area B2 through the XYZ axis mechanism, moves on the Z axis, enters the stacking structure, and is aligned with a test carrier 12 in the storage space at different levels. Multiple wafers carried by the test carrier 12 have been Test, the transport mechanism 25 holds the test carrier 12 transferred from the stacked structure, then moves along the X-axis and Y-axis, enters the flip area B1, and transfers the test carrier 12 with multiple tested wafers to the flip module 22. The test carrier 12 is held by the flip module 22 .

In this embodiment, the test equipment further includes a test sending mechanism 26 provided in the rack 2, and the second area B also includes a test area B4. The test sending mechanism 26 is connected from the transfer area B2 The test carrier 12 containing a plurality of untested wafers is obtained and transferred to the test area B4.

The test sending mechanism 26 obtains the test carrier 12 with multiple untested wafers from the stacked structure in the soaking station 24, moves the test carrier 12 to the test area B4, and checks multiple test carriers 12 in the test area B4. No wafers were tested for testing.

In this embodiment, the test equipment further includes a tester 27 provided in the rack 2, and the tester 27 is located in the test area B4. The test sending mechanism 26 moves the test carrier 12 to the test area B4. The test carrier 12 is located below the tester 27. The test sending mechanism 26 holds the test carrier 12 and moves it upward so that the pins of the chip are in contact with the control of the tester 27. The pins make contact, and then the tester 27 tests the wafer in the test carrier 12 .

In this embodiment, the test sending mechanism 26 includes an XZ-axis mechanism. The test sending mechanism 26 moves along the X-axis in the transfer area B2 through the The carrier 12 moves to the test area B4 and then moves along the Z-axis to transfer the test carrier 12 with a plurality of untested wafers for testing.

The test sending mechanism 26 moves between the test area B4 and the transfer area B2 through the XZ axis mechanism. The test sending mechanism 26 moves to the transfer area B2 through the The test carrier 12 of the wafer moves to the test area B4 along the The instrument 27 tests a plurality of untested wafers in the test carrier 12 .

In this embodiment, the test sending mechanism 26 moves along the Z axis in the test area B4 through the XZ axis mechanism, so that the test carrier 12 with multiple tested wafers leaves the test, and then moves along the X axis, The test carrier 12 with a plurality of tested wafers is transferred to the transfer area B2.

The test sending mechanism 26 moves along the Z axis through the XZ axis mechanism, so that the test carrier 12 moves downward, the test carrier 12 leaves the tester 27, and then moves along the transfer area B2, and then transferred to the stacking structure.

In this embodiment, the test sending mechanism 26 has a correction platform, and a camera unit is provided on the correction platform. The correction platform detects the position of the test carrier 12 with multiple untested wafers through the camera unit, The position of the test carrier 12 with multiple untested wafers on the correction platform is corrected by plane-rotating the test carrier 12 with multiple untested wafers in the XY axis direction.

The camera unit captures the position of the test carrier 12 on the correction platform. The correction platform is equipped with a reference column, and the reference column is used as a reference standard to determine whether there is a deviation in the placement of the test position. If there is a deviation, the correction platform is set on the X-axis or/ and the Y-axis to rotate the test carrier 12 to correct the position of the test carrier 12 on the correction platform, so that when the test carrier 12 is in the test area B4, the wafer pins in the test carrier 12 are aligned with the probes of the tester 27 Accurate.

In this embodiment, the soaking station 24 is provided with a rotating door. The rotating door rotates to a first position. The storage space of the stacking structure has an opening. The rotating door rotates to a second position. The stacking structure The storage space is a closed cavity.

Specifically, the rotating door is provided at the entrance and exit of the opening of the stacking structure. When the rotating door rotates to the first position, the opening of the stacking structure opens. When the rotating door rotates to the second position, the opening of the stacking structure closes. , forming a closed cavity, so that the stacked structure has a thermal insulation effect.

In this embodiment, the upper side wall of the test carrier 12 is provided with a plurality of adsorption holes, and the plurality of adsorption holes are used for vacuum adsorption of wafers.

In this embodiment, the test equipment includes a first air bearing plate. The first air bearing plate is provided on the flip module 22 . The upper side plate of the first air bearing plate is provided with at least two vacuum holes. and at least two rows of air outlets. The bottom side wall of the test carrier 12 is provided with a strip-shaped vacuum input slot. The direction of the strip is consistent with the length direction of the test carrier 12. The vacuum input slot is in line with the length direction of the test carrier 12. The plurality of adsorption holes are connected and correspond to the at least two vacuum holes up and down. The at least two rows of air outlets are provided with air bearings. The test carrier 12 is placed on the air bearing plate and can be placed there. moves on the air bearing.

At least two vacuum holes are connected to the vacuum input slot, thereby connecting at least two vacuum holes to a plurality of adsorption holes, thereby providing vacuum adsorption for the plurality of adsorption holes. The test carrier 12 moves on an air bearing plate to reduce friction generated by the movement of the test carrier 12 .

In this embodiment, the first air bearing plate is provided with a push rod, and the push rod is used to push the test carrier 12 to move on the air bearing.

In this embodiment, the bottom side wall of the test carrier 12 is provided with a sliding seal, and the sliding seal is arranged around the vacuum input groove.

In this embodiment, the test equipment includes a second air bearing plate, and the second air bearing plate is provided on the transmission mechanism 25. The structure of the first air bearing bearing plate and the second air bearing plate Similarly, when the flip module 22 transfers the test carrier 12 with multiple untested wafers from the flip area B1 to the transfer area B3, the push rod of the first air bearing plate pushes the test carrier 12 with multiple untested wafers. The test carrier 12 of the test wafer moves toward the second air bearing plate, moves to the nearest vacuum hole in the second air bearing plate, at least one vacuum hole in the first air bearing plate and the second air bearing plate. One vacuum hole of the air bearing plate corresponds to the upper and lower parts of the vacuum input groove at the same time, and both provide vacuum to the vacuum input groove.

The test carrier 12 is transferred from the flip module 22 to the transmission mechanism 25, and the adsorption holes of the test carrier 12 can maintain vacuum adsorption during the transfer process.

In some embodiments, the testing equipment includes a third air bearing plate and a fourth air bearing plate. The third air bearing plate and the fourth air bearing plate are respectively provided at the immersion station 24 and the testing mechanism 26. The third air bearing plate Both the plate and the fourth air bearing plate have the same structure as the first air bearing plate.

In this embodiment, the suction mechanism 23 adopts a whole-plate suction cup structure, which is used to suck all the untested wafers carried by the first carrier tray 13 with one suction action, or to suck the intermediate turntable with one suction action. 11 carries all tested wafers.

The suction mechanism 23 adopts a whole-plate suction cup structure and can suck the entire wafer plate of the first carrier plate 13 and the entire wafer plate of the intermediate turntable 11 at one time.

In this embodiment, the test equipment includes a vibrator, which is provided in the flip module 22 and used to provide vibration when the intermediate turntable 11 and the test carrier 12 are flipped. The vibrator generates vibration to vibrate the wafer, thereby facilitating the transfer of the wafer from the intermediate turntable 11 to the test carrier 12 , or from the test carrier 12 to the intermediate turntable 11 . You can also shake the wafer to straighten it so that the adsorption holes can adsorb the wafer more firmly.

In this embodiment, the testing equipment includes a sorting device, and the second area B also includes a good product area A4, a defective product area A5, and an area to be retested. The sorting device selects from the second carrier tray 14 Select the corresponding type of wafers and move them to the good product area A4, the defective product area A5 or the area to be retested. The sorting device sorts and places the tested wafers.

In this embodiment, the testing equipment includes a pallet stack structure provided on the rack 2. The pallet stack structure is located in the good product area A4, the defective product area A5 or the area to be retested. The pallet stack structure Structure for stacking multiple pallets on top of each other.

In this embodiment, the test equipment includes a pallet lift installed on the frame 2. The pallet lift moves a pallet to the bottom of the pallet stack structure along the XY axis direction and moves it to the bottom of the pallet stack structure along the Z axis direction. Pallets are stacked in a stack structure. The pallet lift has the function of XYZ axis movement. It first moves a pallet under the pallet stack structure through X-axis and Y-axis movement, and then moves the pallet upward through Z-axis movement and stacks it in the pallet stack structure.

In this embodiment, the transmission mechanism 25 is provided with a cleaning device for blowing air to clean the plurality of adsorption holes.

In this embodiment, the rack 2 adopts a layered structure design, and the components of the test equipment are installed in the upper and lower spaces respectively. This is conducive to reducing the overall volume of the equipment, making full use of the longitudinal space, and reducing the equipment's impact on the installation space. requirements and improve the applicable scenarios of the equipment.

In some embodiments, as shown in Figures 5 and 6, it is the flip module 22 of Embodiment 1 of the present invention, including a flip drive mechanism 1a, a flip box 2a, a first bearing mechanism 3, and a second bearing mechanism. 4 and a merging mechanism 5. A flipping cavity is formed on the flipping box 2a. The first bearing mechanism 3 and the second bearing mechanism 4 are arranged in the flipping cavity oppositely. The merging mechanism 5 is provided with On the flip box 2 a and connected to the first bearing mechanism 3 , the merging mechanism 5 is used to drive the first bearing mechanism 3 to move closer to or away from the second bearing mechanism 4 .

When the first carrying mechanism 3 is driven by the merging mechanism 5 and attached to the second carrying mechanism 4 , the flipping driving mechanism 1a can drive the flipping box 2a to rotate.

When the first carrying mechanism 3 is located below the second carrying mechanism 4, the first carrying mechanism 3 can carry wafers to be tested, or can receive wafers that have been tested and carried by the second carrying mechanism 4. , the pins of the wafer located on the first carrying mechanism 3 face downward.

When the second carrying mechanism 4 is located below the first carrying mechanism 3, the second carrying mechanism 4 can receive the wafer to be tested carried by the first carrying mechanism 3, or can test the wafer that has completed the test. The wafer is loaded with the pins of the wafer located on the second carrying mechanism 4 facing upward.

After the above-mentioned flipping module 22 is adopted, the flipping box 2a can be rotated by the driving of the flipping driving mechanism 1a when the first bearing mechanism 3 and the second bearing mechanism 4 are in contact, so that the position of the flipping box 2a can be rotated. The wafer in the flip box 2a rotates, causing the direction of the pins of the wafer in the flip box 2a to change from downward to upward.

In some embodiments, the first carrying mechanism 3 includes a transfer carrying component 31 and a transfer receiving clip 32. The transfer receiving clip 32 is provided in the flipping cavity. The merging mechanism 5 and the central The transfer receiving clip 32 is connected, and the transfer bearing component 31 can be slidably connected with the transfer receiving clip 32 .

When the first carrying mechanism 3 is located below the test transport mechanism, the transfer carrying component 31 can carry wafers to be tested, or can receive wafers that have been tested and carried by the second carrying mechanism 4 .

The merging mechanism 5 can drive the transfer bearing assembly 31 to move closer to or away from the second bearing mechanism 4 , thereby causing the first bearing mechanism 3 to move closer to or away from the second bearing mechanism 4 . direction movement.

In some embodiments, the transfer carrying assembly 31 includes a transfer car body 311 , the transfer car body 311 can be slidably connected to the transfer receiving clip 32 , and the transfer plate 11 is provided on the transfer receiving clip 32 . On the car body 311.

When the first carrying mechanism 3 is located below the second carrying mechanism 4 , the intermediate turntable 11 can carry wafers to be tested, or can receive wafers that have been tested and carried by the second carrying mechanism 4 .

The transfer plate 11 is installed on the transfer car body 311. When the transfer car body 311 moves, the transfer plate 11 can follow the transfer car body 311 to move synchronously. When the car body 311 moves into the flip box 2a, the transfer plate 11 will also enter the flip box 2a with the transfer car body 311, so that the wafers carried on the transfer plate 11 will also move into the flip box 2a. It will enter the flipping box 2a for subsequent flipping and detection.

The side surface of the transfer car body 311 facing the second carrying mechanism 4 is flat, which makes the movement of the transfer plate 11 more stable and prevents the transfer plate 11 provided on the transfer car body 311 from being moved along with it. The transfer car body 311 tilts or shakes when it moves.

The side surface of the intermediate turntable 11 facing the second carrying mechanism 4 is also flat, so as to make the placement of the wafers more stable and prevent the wafers placed on the intermediate turntable 11 from being damaged when moving with the intermediate turntable 11 Tilt or shake.

A transfer groove is formed on the side wall of the transfer car body 311, and a transfer bump is formed on the transfer receiving clip 32 at a position corresponding to the transfer slot. The transfer bump can be plugged into the transfer slot. In the transfer groove, the transfer vehicle body 311 can slide relative to the transfer receiving clip 32 .

The transfer groove extends in the horizontal direction, and correspondingly, the transfer protrusion also extends in the horizontal direction, so that the transfer car body 311 can slide to the transfer receiving clip 32 in the horizontal direction.

There may be multiple transfer slots, and the multiple transfer slots are parallel to each other. Correspondingly, a plurality of said intermediate convex blocks are provided, and the plurality of said intermediate convex blocks are parallel to each other. A plurality of the transfer slots and a plurality of the transfer bumps are arranged in one-to-one correspondence. Furthermore, the intermediate bumps can be replaced by bearings and guide grooves, as long as they can reduce friction.

The flip module 22 also includes a transfer positioner 6. When the transfer car body 311 slides into the flip box 2a relative to the transfer receiving clip 32, the transfer positioner 6 can align The transfer car body 311 is positioned laterally to prevent the transfer car body 311 from sliding out of the flipping box 2a.

The transfer positioner 6 is provided with a positioning pin 61, and the transfer car body 311 is provided with a positioning pin hole that matches the positioning pin 61. When the transfer car body 311 is relative to the transfer receiving When the clip 32 slides into the flipping box 2a, the positioning pin 61 can pass through the flipping box 2a and be inserted into the positioning pin hole to achieve positioning of the transfer car body 311.

The first carrying mechanism 3 also includes a transfer adsorption component 33 provided on the flipping box 2a. The transfer adsorption component 33 is used to align the transfer car located on the transfer receiving clip 32. The body 311 is adsorbed and fixed.

It can be understood that when the transfer car body 311 slides into the flip box 2a relative to the transfer receiving clip 32, the transfer adsorption assembly 33 works, so that the transfer body 311 located in the transfer receiving clip can be The transfer car body 311 on 32 is adsorbed and fixed to realize the positioning of the transfer car body 311, prevent the transfer car body 311 from sliding out to the outside of the flip box 2a, and at the same time avoid the When the flipping box 2a is flipped, the transfer car body 311 moves.

The second carrying mechanism 4 includes a test receiving clip 42 for receiving and storing the test carrier 12. The test receiving clip 42 is provided in the flip cavity. The test carrier 12 can be connected to the test receiving clip 42. Sliding connection. The test receiving clip 42 can be used to receive and store the test carrier disk 12 .

When the second carrying mechanism 4 is located below the first carrying mechanism 3, the test carrier 12 can receive the wafer to be tested carried by the first carrying mechanism 3, or can carry the wafer that has been tested. .

When the flipping drive mechanism 1a drives the flipping box 2a to rotate so that the second bearing mechanism 4 is located below the first bearing mechanism 3, under the action of gravity, the original position on the intermediate turntable 11 The wafers on the test carrier 12 will fall onto the test carrier 12 . After the merging mechanism 5 drives the transfer carrying assembly 31 to move away from the second carrying mechanism 4 , the wafers originally located on the transfer plate 11 will gradually separate from the transfer plate 11 . At this time, the test carrier 12 will receive the wafer to be tested carried by the first carrying mechanism 3 (ie, the intermediate turntable 11 ). After that, the test carrier 12 can transport the received wafer to be tested to the testing center. Test machine for testing. After the test is completed, the test carrier 12 can carry the tested wafers and transport the tested wafers to the flip cavity of the flip box 2 a.

The side surface of the test carrier 12 facing the first carrying mechanism 3 is flat, which makes the movement of the wafer loaded on the test carrier 12 more stable and prevents the movement of the wafer loaded on the test carrier 12. Tilting or shaking occurs when the test carrier 12 moves.

A test slot is formed on the side wall of the test carrier 12 , and a test bump is formed on the test receiving clip 42 at a position corresponding to the test slot. The test bump can be inserted into the test slot, so as to The test carrier 12 is slidable relative to the test receiving clip 42 .

The test slot extends along the horizontal direction, and correspondingly, the test bump also extends along the horizontal direction, so that the test carrier 12 can slide onto the test receiving clip 42 along the horizontal direction.

There may be a plurality of test slots, and the plurality of test slots are parallel to each other. Correspondingly, a plurality of test bumps are provided, and the plurality of test bumps are parallel to each other. A plurality of test slots and a plurality of test bumps are arranged in one-to-one correspondence.

The second carrying mechanism 4 also includes a test adsorption assembly 43 provided on the flip box 2a. The test adsorption assembly 43 is used to adsorb the test carrier 12 located on the test receiving clip 42. fixed.

It can be understood that when the test carrier 12 slides into the flip box 2a relative to the test receiving clip 42, the test adsorption assembly 43 works, so that all the test components located on the test receiving clip 42 can be removed. The test carrier 12 is adsorbed and fixed to realize the positioning of the test carrier 12, prevent the test carrier 12 from sliding out of the flipping box 2a, and at the same time avoid the trouble when the flipping box 2a is flipped. The test carrier disk 12 moves.

The merging mechanism 5 includes a merging drive assembly 51 and a merging block 52. The merging block 52 is slidingly connected to the flip box 2a and connected with the first load-bearing mechanism 3. The merging drive assembly 51 is used for The merging block 52 is driven to slide relative to the flipping box 2 a, so that the first bearing mechanism 3 moves toward or away from the second bearing mechanism 4 .

The flipping box 2a is provided with a sliding block 21a, and the merging block 52 is slidably connected to the sliding block 21a, so that the merging block 52 can be slidably connected to the flipping box 2a.

The combined driving assembly 51 includes a combined motor module 511 , a combined power transmission module 512 and two combined screws 513 . The combined motor module 511 , the combined power transmission module 512 and the combined screw 513 They are respectively installed on the flipping box 2a. The combined power transmission module 512 is connected between the combined motor module 511 and the combined screw rod 513. The combined motor module 511 passes through the combined power. The transmission module 512 drives the merging screw rod 513 to rotate, and the merging screw rod 513 is threadedly connected to the merging block 52 .

The merging motor module 511 can provide power for the movement of the merging block 52 . The combined power transmission module 512 can transmit the power provided by the combined motor module 511 to the combining block 52 .

When the merging motor module 511 drives the merging screw 513 to rotate through the merging power transmission module 512, due to the threaded connection between the merging screw 513 and the merging block 52, the merging screw 513 rotates. When 513 rotates, the merging block 52 can slide relative to the flip box 2a along the axial direction of the merging screw rod 513, so that the first bearing mechanism 3 can move closer to or away from the second bearing mechanism 4 direction movement.

The combined motor module 511 is provided with a combined motor. The combined power transmission module 512 includes a first roller 5121, a second roller 5122 and a conveyor belt 5123. The first roller 5121 is connected to the output shaft of the combined motor, and the second roller 5122 is connected to the output shaft of the combined motor. One end of the merging screw rod 513 is connected, and the conveyor belt 5123 is wound around the first roller 5121 and the second roller 5122 .

When the merging motor is working, the first roller 5121 rotates with the output shaft of the merging motor, thereby driving the conveyor belt 5123 to move, and further driving the second roller 5122 to rotate, so that the merging screw rod 513 rotates.

The combined power transmission module 512 also includes a third roller 5124. In addition to being wound around the first roller 5121 and the second roller 5122, the conveyor belt 5123 is also wound around on the third roller 5124. That is, the conveyor belt 5123 is wound around the first roller 5121 , the second roller 5122 and the third roller 5124 .

By arranging the third roller 5124, the transmission points of the combined power transmission module 512 are increased to ensure the effective rotation of the combined screw rod 513.

The flipping drive mechanism 1a includes a flipping bracket 11a, a flipping shaft 12a and a flipping power assembly 13a. The flipping shaft 12a is rotationally connected to the flipping bracket 11a and connected to the flipping box 2a. The flipping power assembly 13a is used to drive the turning shaft 12a to rotate, so as to rotate the turning box 2a.

The flipping bracket 11a includes a first bracket 111 and a second bracket 112. The flipping shaft 12a includes a first rotating shaft 121 and a second rotating shaft 122. One end of the first rotating shaft 121 is rotationally connected to the first bracket 111. The other end of the first rotating shaft 121 is connected to the flipping box 2a, one end of the second rotating shaft 122 is rotationally connected to the second bracket 112, and the other end of the second rotating shaft 122 is connected to the flipping box 2a. The box 2a is connected, the first rotating shaft 121 and the second rotating shaft 122 are coaxially arranged, the turning power component 13a is connected with the second rotating shaft 122, and the turning driving mechanism 1a and the turning are completed. Installation connection between boxes 2a.

The turning power assembly 13a includes a rotating plate 131 and a rotating handle 132. One end of the rotating plate 131 is connected to the flipping shaft 12a. The rotating handle 132 is connected to the other end of the rotating plate 131. By operation The rotating handle 132 causes the rotating plate 131 to drive the flip shaft 12a to rotate, thereby realizing the rotation of the flip box 2a.

The flipping module 22 also includes a flipping chassis 7 , and the flipping bracket 11 a is provided on the flipping chassis 7 . The flip chassis 7 serves as a base plate, which can be used to install other structures, such as the flip bracket 11a of the flip drive mechanism 1a.

The flipping module 22 also includes a vibrator 8 provided on the flipping box 2a. The vibrator 8 is used to provide a vibration source when positioning the wafer to prevent the wafer from adhering to the intermediate turntable 11 , thereby preventing the wafer from being unable to fall onto the wafer positioning angle of the test carrier 12 .

The working principle of the flip module 22 provided in Embodiment 1 of the present invention is as follows:

First, the wafer to be tested is carried by the first carrying mechanism 3 and transported into the flip box 2a, so that the first carrying mechanism 3 is located below the second carrying mechanism 4, and the merging mechanism 5 The first load-bearing mechanism 3 is driven for the first time, so that the first load-bearing mechanism 3 moves in a direction close to the second load-bearing mechanism 4 (upwards in the height direction) until it contacts the second load-bearing mechanism 4 During this process, the pins of the wafer located on the first carrying mechanism 3 always face downward.

After that, the flipping driving mechanism 1a drives the flipping box 2a to rotate for the first time, turning the flipping box 2a 180°, so that the second carrying mechanism 4 is located between the first carrying mechanism 3 Below, the pin orientation of the wafer changes from downward to upward. After the first rotation of the flipping box 2a is completed, the merging mechanism 5 drives the first carrying mechanism 3 for the second time, so that the first carrying mechanism 3 moves away from the second carrying mechanism. 4 (upward along the height direction) until it is separated from the second carrying mechanism 4. The second carrying mechanism 4 receives the wafer to be tested originally carried by the first carrying mechanism 3 and will receive the wafer to be tested. The wafer is transported to an external testing machine for testing. After the test is completed, the second carrying mechanism 4 returns the tested wafer to the flip box 2a, so that the second carrying mechanism 4 is located again. Below the first carrying mechanism 3.

Then, the merging mechanism 5 drives the first carrying mechanism 3 for the third time, so that the first carrying mechanism 3 moves in a direction close to the second carrying mechanism 4 (downward in the height direction) until it is in contact with the second carrying mechanism 4 . The second carrying mechanism 4 is attached, and the flipping driving mechanism 1a drives the flipping box 2a to rotate for the second time, causing the flipping box 2a to flip 180°, so that the first carrying mechanism 3 can rotate again. Located below the second carrying mechanism 4 .

Finally, the merging mechanism 5 drives the first carrying mechanism 3 for the fourth time, causing the first carrying mechanism 3 to move in a direction away from the second carrying mechanism 4 (downwards in the height direction) until it is in contact with the second carrying mechanism 4 . The second carrying mechanism 4 is separated, and the first carrying mechanism 3 receives the tested wafer carried by the second carrying mechanism 4 .

As shown in Figure 4, an embodiment of the present invention also discloses a testing method for testing equipment. The method includes the following steps: Step S101: The transfer module receives the loading signal and recognizes that the transfer disk is in the first area; Step S102: The transfer module moves the transfer disk to the second area; Step S103: The flip module holds the intermediate turntable, presses the intermediate turntable and the test carrier tray, and flips the intermediate turntable and the test carrier tray to transfer all the untested wafers carried by the intermediate turntable. to the test carrier; and Step S104: Transfer the test carrier with multiple untested wafers for testing.

When the transfer plate is in the first area, the transfer module moves to the first area, moves the transfer plate from the first area to the second area, and puts it into the flip module. The flip module holds the transfer plate and presses it together. The turntable and the test carrier are brought into contact with each other, and the intermediate turntable and the test carrier are turned over, so that the multiple untested wafers on the intermediate turntable are transferred to the test carrier. At this time, the pins of the wafers are facing upwards, solving the problem In the existing technology, automatic flipping involves flipping one wafer at a time, which leads to the problem of low testing efficiency.

In this embodiment, after step S104, the following steps are included: The transfer module receives the unloading signal and recognizes that the transfer disk is in the second area; The flipping module holds the intermediate turntable, presses the intermediate turntable and the test carrier tray, and flips the intermediate turntable and the test carrier tray so that the test carrier tray carries multiple tested wafers. All transferred to said staging tray; and The transfer module moves the transfer disk to the first area.

What is disclosed above is only the preferred embodiment of the present invention. Of course, it cannot be used to limit the scope of rights of the present invention. Therefore, equivalent changes made according to the patent scope of the present invention are still within the scope of the present invention.

1a: Flip drive mechanism 11: Intermediate carousel 11a: Flip stand 111:First bracket 112:Second bracket 12: Test disk 12a: Flip axis 121:First axis 122:Second axis 13:First loading disk 13a: Flip the power assembly 131:Rotating plate 132:Turn the handle 14:Second loading disk 2:Rack 2a: Turn over the box 21:Transfer module 21a:Slider 22: Flip module 23:Absorption mechanism 24: Soaking station 25:Transmission mechanism 26:Sending institution for testing 27:Tester 3: The first carrying mechanism 31:Transfer carrying component 311:Transfer car body 32:Transfer receiving clip 33:Transfer adsorption component 4: Second carrying mechanism 42: Test the receiving clip 43: Test adsorption components 5: Merge institutions 51: Merge driver components 511: Merge motor module 512: Merge power transmission module 5121:First roller 5122:Second roller 5123:Conveyor belt 5124:Third roller 513: Combined screw 52: Merge blocks 6:Transit locator 61: Positioning pin 7: Flip the chassis 8:Vibrator A:First area A1: waiting area A2: Transit area A3: Sorting area A4: Good product area A5: Defective area B:Second area B1: flip area B2: Transfer area B3:Transmission area B4: Test area

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are only for the purpose of explaining the embodiments of the present invention or the technical solutions in the prior art. For some embodiments of the invention, for those of ordinary skill in the technical field to which the invention belongs, other drawings can be obtained based on these drawings without making any progressive changes. in: Figure 1 is a schematic diagram of the upper structure of the test equipment in one embodiment; Figure 2 is a schematic diagram of the underlying structure of the test equipment in one embodiment; Figure 3 is a regional distribution diagram of test equipment in one embodiment; Figure 4 is a flow chart of a testing method of testing equipment in one embodiment; Figure 5 is a schematic structural diagram of a flip module in an embodiment; and Figure 6 is a schematic structural diagram of the flip module in another direction in one embodiment.

12: Test disk

13:First loading disk

14:Second loading disk

2:Rack

22: Flip module

23:Absorption mechanism

24: Soaking station

27:Tester

Claims (31)

A test equipment, which includes a rack, a transfer plate, a transfer module and a flip module holding a test carrier, the transfer module and the flip module are located on the rack, The transfer plate is placed on the rack, and the rack has a first area and a second area; When the transfer plate is in the first area, the transfer module moves the transfer plate to the second area. The flip module holds the transfer plate, presses the transfer plate and the test carrier plate, and flips the transfer plate. The turntable and the test carrier allow all the untested wafers carried by the intermediate turntable to be transferred to the test carrier. The testing equipment according to claim 1, wherein when the intermediate turntable is in the second area, the flip module holds the intermediate turntable and the test carrier, presses the intermediate turntable and the test carrier, and flips The transfer plate and the test carrier enable all the tested wafers carried by the test carrier to be transferred to the transfer plate, and the transfer module moves the transfer plate to the first area. The testing equipment according to claim 1, wherein the first area is a normal temperature area, and the second area is a temperature adjustment area. The testing equipment according to claim 1, wherein the flip module is located in the second area. The testing equipment as described in claim 2, wherein the testing equipment further includes a suction mechanism and a first carrier tray, the suction mechanism is located on the frame, and the first area includes a material waiting area and a transfer area. , the first carrier tray is placed in the rack and located in the material waiting area, and the suction mechanism absorbs all the untested wafers carried by the first carrier tray and transfers them to the transfer plate located in the transfer area. The testing equipment according to claim 5, wherein the suction mechanism is located in the first area. The testing equipment according to claim 5, wherein the first area further includes a sorting area and a second carrier tray, the second carrier tray is placed on the rack and is located in the sorting area, and the suction mechanism sucks the All the tested wafers carried by the transfer tray in the transfer area are transferred to the second carrier tray. The test equipment as described in claim 1, wherein the test equipment further includes a pre-temperature adjustment module, the pre-temperature adjustment module is located in the transfer module, and the pre-temperature adjustment module is responsible for the transfer module. The temperature is adjusted to a first preset temperature, and the difference between the first preset temperature and the temperature of the test carrier is within a first preset range. The testing equipment of claim 8, wherein the transfer module is made of a material with a first thermal expansion coefficient, the test carrier is made of a material with a second thermal expansion coefficient, and the first thermal expansion coefficient is the same as the first thermal expansion coefficient. The second thermal expansion coefficient differs within a second preset range. The test equipment according to claim 2, wherein the test equipment further includes a soaking station with a first temperature adjustment module and a transmission mechanism, the transmission mechanism and the soaking station are located on the rack, and the second The area includes a flipping area and a transfer area. The soaking station is located in the transfer area. The flipping module is located in the flipping area. The soaking station has at least two stacked structures, and each stacked structure has multiple levels of storage space. , used to accommodate a plurality of test carriers stored in a stack, and the first temperature adjustment module adjusts the temperature of the test carriers in the stacked structure to the test temperature; The transfer mechanism transfers the test carrier with a plurality of untested wafers from the flipping area to a stack structure in the soak station. The testing equipment of claim 10, wherein the transport mechanism transfers the test carrier with a plurality of tested wafers from the transfer area to the flip module. The test equipment according to claim 11, wherein the second area further includes a transmission area, the transmission mechanism includes an XYZ axis mechanism, the transmission mechanism moves to the flipping area through the XYZ axis mechanism, and moves from the flipping mold The group holds the test carrier plate holding multiple untested wafers, then moves along the X-axis into the transfer area, moves along the Y-axis in the transfer area, then moves along the X-axis into the transfer area, and then moves along the Z-axis Align the storage spaces at different levels, and transfer the test carrier with a plurality of untested wafers to the stacked structure. The testing equipment as described in claim 12, wherein the transmission mechanism moves along the Z axis through the XYZ axis mechanism to align the test carriers with a plurality of tested wafers in the storage spaces at different levels, and then moves along the Z axis. The X-axis moves into the transfer area, moves along the Y-axis in the transfer area, then moves along the X-axis into the flipping area, and transfers the test carrier with a plurality of tested wafers to the flipping module. The test equipment as claimed in claim 10, wherein the test equipment further includes a test sending mechanism located on the rack, the second area further includes a test area, and the test sending mechanism obtains multiple data from the transfer area. The test carrier tray with untested wafers is moved to the test area. The testing equipment as claimed in claim 14, wherein the testing mechanism includes an XZ-axis mechanism, and the testing mechanism moves along the X-axis in the transfer area through the XZ-axis mechanism to transfer the wafers with a plurality of untested wafers. The test carrier moves to the test area and then moves along the Z-axis to transfer the test carrier with multiple untested wafers for testing. The test equipment as described in claim 15, wherein the test sending mechanism moves along the Z axis in the test area through the XZ axis mechanism, so that the test carrier with a plurality of tested wafers leaves the test, and then moves along the X axis , transferring the test carrier with a plurality of tested wafers to the transfer area. The test equipment as described in claim 15, wherein the test sending mechanism has a correction platform, and a camera unit is provided on the correction platform. The correction platform uses the camera unit to detect the quality of the test carrier with a plurality of untested wafers. position, and by plane-rotating the test carrier with the plurality of untested wafers in the XY axis direction, the position of the test carrier with the plurality of untested wafers on the correction platform is corrected. The testing equipment of claim 10, wherein the soaking station is provided with a rotating door that rotates to a first position, and the storage space of the stack structure has an opening that rotates to a second position. , the storage space of the stacked structure is a closed cavity. The testing equipment according to claim 10, wherein the upper side wall of the test carrier is provided with a plurality of adsorption holes, and the plurality of adsorption holes are used for vacuum adsorption of wafers. The test equipment according to claim 19, wherein the test equipment includes a first air bearing plate, the first air bearing plate is provided on the flip module, and the upper side plate of the first air bearing plate is provided with at least two Vacuum holes and at least two rows of air outlets. The bottom side wall of the test carrier is provided with a strip-shaped vacuum input slot. The direction of the strip is consistent with the length direction of the test carrier. The vacuum input slot is in line with the multiple The adsorption holes are connected and correspond up and down to the at least two vacuum holes. The at least two rows of air outlets are provided with an air bearing. The test carrier is placed on the air bearing plate and can move on the air bearing. The test equipment of claim 20, wherein the first air bearing plate is provided with a push rod, and the push rod is used to push the test carrier plate to move on the air bearing. The testing equipment of claim 20, wherein the bottom side wall of the test carrier is provided with a sliding seal, and the sliding seal is arranged around the vacuum input groove. The test equipment according to claim 21, wherein the test equipment includes a second air bearing plate, the second air bearing plate is provided on the transmission mechanism, and the first air bearing support plate and the second air bearing plate are connected to each other. The structure is the same. When the flip module transfers the test carrier with a plurality of untested wafers in the flip area to the transfer area, the push rod of the first air bearing plate pushes the test carrier with a plurality of untested wafers. The carrier plate moves toward the second air bearing plate, moves to the nearest vacuum hole in the second air bearing plate, at least one vacuum hole in the first air bearing plate and one vacuum hole in the second air bearing plate. The holes correspond to the upper and lower sides of the vacuum input slot at the same time, and both provide vacuum to the vacuum input slot. The testing equipment as described in claim 7, wherein the suction mechanism adopts a whole-plate suction cup structure for sucking all the untested wafers carried by the first carrier with one suction action, or sucking the middle wafer with one suction action. The carousel carries all tested wafers. The test equipment of claim 1, wherein the test equipment includes a vibrator, which is provided in the flip module and used to provide vibration when flipping the intermediate turntable and the test carrier. The testing equipment according to claim 7, wherein the testing equipment includes a sorting device, the second area also includes a good product area, a primary product area and an area to be retested, and the sorting device starts from the second loader. Wafers of corresponding types are selected from the tray and moved to the good product area, the defective product area or the area to be retested. The test equipment as described in claim 26, wherein the test equipment includes a pallet stack structure located on the rack, and the pallet stack structure is located in the good product area, the defective product area or the to-be-retested area, and the pallet stack structure The stack structure is used to stack multiple pallets on top of each other. The test equipment as described in claim 27, wherein the test equipment includes a pallet lift installed on the rack, which lifts and moves one of the pallets along the XY axis direction to the bottom of the pallet stack structure, and moves along the Z axis direction. into the pallet stack structure. The testing equipment according to claim 19, wherein the transmission mechanism is provided with a cleaning device for blowing air to clean the plurality of adsorption holes. A testing method for testing equipment, wherein the testing method includes the following steps: A relay module receives a loading signal and recognizes that a relay disk is in a first area; The transfer module moves the transfer plate to a second area; A flip module holds the intermediate turntable, presses the intermediate turntable and a test carrier tray, and flips the intermediate turntable and the test carrier tray, so that all untested wafers carried by the intermediate turntable are transferred to the test carrier tray; as well as The test carrier with multiple untested wafers is transferred for testing. The testing method of test equipment as described in claim 30, wherein, after the step of transferring the test carrier with a plurality of untested wafers for testing, the following steps are included: The transfer module receives an unloading signal and recognizes that the transfer disk is in the second area; The flip module holds the intermediate turntable, presses the intermediate turntable and the test carrier tray, and flips the intermediate turntable and the test carrier tray, so that all the tested wafers carried by the test carrier tray are transferred to the intermediate turntable; as well as The transfer module transfers the transfer disk to the first area.