JP2000329809A - Testing device for electronic part substrate and testing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To miniaturize a testing device for an electronic part substrate suitable for testing the electronic part substrate while the electronic part substrate such as, for example, memory module is stored, provide a testing method therefor, and improve throughput of a test process. SOLUTION: In this testing method, when memory modules are taken out of a tray 20 for testing moved into an unloader part 400, are classified based on the results of a test, and are transferred into a tray 204 for storage standing-by in a storage part 200, memory modules which cannot be classified in the tray 204 for storage and/or memory modules which cannot be stored in the tray 204 for storage are temporarily held in a buffer part 405.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test apparatus and a test method for an electronic component substrate suitable for testing an electronic component substrate in a state in which the electronic component substrate such as a memory module is accommodated.

[0002]

2. Description of the Related Art In a process of manufacturing an electronic component substrate such as a memory module, a test device for testing a finally manufactured memory module is required. As one type of such a test apparatus, an apparatus for testing a memory module under a temperature condition higher or lower than room temperature is known. This is because, as a characteristic of the memory module, it is guaranteed that the memory module operates well even at high or low temperature.

When a high-temperature test is performed in a conventional memory module test apparatus, the memory module before the test is heated by a preheating unit in the apparatus, and the heated memory module is measured by a pick-and-place operation. To a high-temperature test by preheating applied to the memory module.

When a low-temperature test is to be performed in a conventional memory module testing apparatus, the memory module before the test is cooled by a cooling unit in the apparatus, and the cooled memory module is picked and placed. It is conceivable that a low-temperature test is performed by transporting the memory module to the measurement unit by operation and using the cold applied to the memory module.

[0005]

However, in such a conventional test apparatus for electronic component substrates, several memory modules are transported from the preheating section or the cooling section to the measuring section by pick-and-place operation. Test throughput is very poor. In addition, the temperature applied to the memory module changes before the memory module is transported to the measurement unit, and the temperature accuracy in the measurement unit is poor, and it is difficult to perform a test at an accurate temperature. In particular, in a low-temperature test, dew condensation may occur on the surface of a memory module cooled to a low temperature. As a practical matter, it has been difficult to perform a low-temperature test with a conventional test apparatus. This is because if condensation occurs on the memory module, the condensation adheres to the terminals or socket terminals of the memory module and adversely affects the test.

In order to solve such inconvenience, it is conceivable to cover all the preheating section (or cooling section) and the measuring section with a chamber and maintain the inside of the chamber at a predetermined temperature. However, causing the pick and place operation of the memory module inside the chamber is
The mechanism becomes complicated and the chamber must be designed large, which leads to an increase in size, complexity and cost of the test apparatus, which is not preferable.

Further, when a large electronic component substrate such as a memory module is carried into or taken out of a test apparatus, a tray of a type in which the electronic component substrates are arranged upright is used, but such trays cannot be stacked on each other. . For this reason, the loading and unloading sections of the test equipment
A drawer shelf-like tray storage unit for storing trays one by one is provided. However, in the drawer shelf-shaped tray storage unit, there is a problem that the larger the number of classifications, the larger the test apparatus itself.

Therefore, the present applicant has developed a test apparatus having a test tray capable of performing a test while holding an electronic component substrate such as a memory module in a test tray, and has filed an application beforehand. .

However, even with such a test apparatus,
It is necessary to classify and transfer the tested electronic component substrates from the test tray to the storage tray waiting in the tray storage unit according to the test result. The greater the number of classifications, the greater the number of storage trays that need to be kept in the tray storage unit, the larger the area of the tray standby position in the tray storage unit, and consequently the larger the storage unit. In addition, there is a problem that the size of the test apparatus itself is increased.

In addition, when the storage tray is further made to stand by below the tray standby position in the tray storage part, and the electronic component substrates to be classified into the storage trays that are waiting below are stored, It is also possible to reduce the size of the tray storage unit by adopting a structure in which the tray can be moved and replaced.

However, in this case, it is necessary to perform an operation of moving the upper and lower trays to exchange them, and there is a problem that the throughput of the sorting operation is significantly reduced.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and provides an electronic component substrate test apparatus and a test method suitable for testing an electronic component substrate in a state in which the electronic component substrate such as a memory module is housed. And especially
An object of the present invention is to provide a test apparatus and a test method for an electronic component substrate, which can reduce the size of the apparatus and improve the throughput of the test process.

[0013]

In order to achieve the above object, an electronic component board test apparatus according to the present invention comprises: a storage unit for storing a pre-tested and tested electronic component board; A measuring section for testing the component board, a loader section for sending the electronic component board before the test to the measuring section, and a classifying and taking out of the tested electronic component board which has been tested by the measuring section; Unloader part to be delivered to
A supply tray movably housed inside the storage section and holding the electronic component board before the test, and a supply tray movably housed inside the storage section and holding the tested electronic component board. A storage tray, a test tray arranged to circulate the loader section, the measurement section and the unloader section and holding the electronic component substrate; and a test tray provided in the loader section and held in the supply tray. A first transporting unit for transporting the electronic component substrate into the test tray, and classifying the tested electronic components provided in the unloader unit and held in the test tray according to test results. A second transporting means for transporting the paper into the storage tray by
A buffer unit that is installed in the unloader unit and temporarily holds electronic component boards that cannot be classified into the storage tray and / or electronic component boards that cannot be stored in the storage tray.

The test tray has an insert formed with holding grooves into which both side ends of the electronic component substrate are movably inserted so that the board terminals of the electronic component substrate are exposed; It is preferable to have a tray main body that holds the insert so that substrate terminals of the substrate are exposed.

The measuring unit includes a test socket into which a board terminal of the electronic component board is removably inserted, and the electronic component board in a state where the electronic component board is mounted in the test tray. And a board pusher for pushing the substrate terminal into the test socket.

It is preferable that the buffer unit holds an electronic component substrate belonging to a classification to be retested.

The storage section includes a first tray storage section in which the supply tray and / or the storage tray are independently stored vertically, and the supply tray and / or
Alternatively, a second tray storage section in which the storage trays are independently stored vertically and a first tray storage section and a second tray storage section are provided so as to be movable up and down, and First elevating means for transferring the supply tray and / or the storage tray between the first tray storage unit and the second tray storage unit; and the first tray storage unit and the second tray storage unit. Is provided above the first tray storage unit and the first elevating means, and is movable in a direction in which these trays are arranged, and is provided between the first elevating means and the supply tray and / or the storage tray. And a second elevating means capable of moving up and down with respect to a target position and transferring the supply tray and / or the storage tray to and from the horizontal conveying device. Equipped It is preferable are.

The method for testing an electronic component substrate according to the present invention comprises:
A step of taking out the electronic component substrate before the test from the supply tray movably accommodated inside the storage unit and transferring the electronic component substrate to the test tray waiting in the loader unit, and the electronic component held in the test tray Moving the substrate to the measurement unit together with the test tray; and, in a state where the electronic component substrate is mounted in the test tray moved to the measurement unit, connecting the substrate terminal of the electronic component substrate to the measurement unit. Pushing into the test socket mounted on the, the step of testing the electronic component board, and without taking out the electronic component board tested by the measuring unit from the test tray, as it is, Moving the electronic component board from the test tray moved to the unloader section, and placing the electronic component board in a storage tray waiting in the storage section based on the test result. When transferring classified to, and a step for temporarily holding the electronic component substrate that can not be accommodated in the electronic component substrate and / or the accommodating tray not be classified into the accommodating tray to the buffer portion.

It is preferable that, after one test lot, the electronic component boards temporarily held in the buffer section are classified and transferred to a storage tray waiting in the storage section based on a test result.

The electronic component boards temporarily stored in the buffer section are classified and transferred to the storage tray waiting in the storage section during the waiting time between one test lot based on the test result. May be.

[0021]

According to the electronic component board test apparatus and the test method of the present invention, the electronic component board is taken out of the test tray moved to the unloader section, and the test results are stored in the storage tray waiting in the storage section. When the electronic component substrates are classified and transferred based on the above, electronic component substrates that cannot be classified into the storage tray and / or electronic component substrates that cannot be stored in the storage tray are temporarily held in the buffer unit. For this reason,
The number of storage trays waiting in the storage unit can be reduced, and it is not necessary to increase the area of the tray standby position in the tray storage unit. As a result, it contributes to downsizing of the entire test apparatus.

In the test apparatus and the test method of the present invention, since the sorting operation is interrupted and the operation of transferring the storage tray at the standby position is not performed, the tested electronic component substrates are sorted and transferred. Operation can be performed quickly. Therefore, the throughput of the test process can be improved.

For example, at the tray standby position in the tray storage unit, a storage tray for storing electronic component boards that have passed the test, and a storage tray for storing electronic component boards that have failed the test are provided. Is kept in a standby state, and the electronic component substrate requiring a retest is temporarily held in the buffer unit. Alternatively, if the storage tray for storing the electronic component boards that have passed the test becomes full, temporarily replace the electronic component boards that have passed the test in the buffer while replacing the storage tray. May be.

The electronic component substrate held in the buffer unit is transferred to another storage tray after the completion of one test lot or during the waiting time between the one test lot,
Classification can be performed by effectively using wasted time. Therefore, also in this respect, the throughput of the test process can be improved.

In the method for testing an electronic component substrate according to the present invention, the inside of the test apparatus is moved while the plurality of electronic component substrates are held on the test tray,
Since a plurality of electronic component substrates can be tested at the same time, the test throughput is greatly improved. Further, in the test and measurement section, it is not necessary to perform the pick and place operation of the electronic component substrate, so that the internal structure of the test apparatus can be simplified, and the size, simplification, and cost reduction of the entire test apparatus can be reduced. Can be planned. In addition, by maintaining the inside of the chamber in which the test measurement unit is installed at a constant high or low temperature, the temperature accuracy at the time of testing the electronic component substrate is improved, and an accurate test can be performed.

[0026]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on embodiments shown in the drawings. 1A is a conceptual plan view showing an embodiment of an electronic component substrate testing apparatus according to the present invention, FIG. 1B is a cross-sectional view taken along line BB, FIG. 2 is a side cross-sectional view, and FIG. FIG. 4A is a perspective view showing an example of a supply or storage tray used in the embodiment, FIG. 4A is a perspective view showing a memory module storage section of the present embodiment, and FIG. 4B is a view showing a tray storage section and an elevator. FIG. 5 is a perspective view showing a memory module gripping mechanism used in the XY transfer devices 303 and 403 of the present embodiment. FIG. 6 is a cross-sectional view showing the entire measurement unit of the present embodiment. 8 is a perspective view showing a test tray used in FIG. 8, FIG. 8 is a plan view, FIG. 9B is a front view, and FIG. 9C is a side view showing an insert of the test tray of FIG. FIG. 10 is a perspective view showing a head part, and FIG. It is a sectional view showing a contact state between the re module and the socket.

In the following embodiment, the present invention will be described by taking as an example a memory module 10 having the shape shown in FIG. 3 as a test object. However, the test object of the test apparatus of the present invention has a shape shown in FIG. The invention is not limited to the memory module, but includes all electronic components that cannot be stacked and stored in the tray storage unit.

First, the overall configuration of the test apparatus according to the present embodiment will be outlined with reference to FIGS. As shown in FIG. 2, the test apparatus of the present embodiment includes a handler 1 for handling a memory module 10 to be tested and a test head TH to which the memory module 10 is electrically contacted.
And a tester T that sends a test signal of a predetermined pattern to the test head TH and executes a test of the memory module.
S.

The test apparatus of the present invention can be applied to all test heads TH and testers TS, and includes all test heads TH and testers TS. Therefore, these are shown only in FIG. 2 and omitted from other drawings. I do.

As shown in FIG. 1, a handler 1 stores a chamber 100 in which a test head TH is mounted, a memory module 10 for performing a test from now on, and a memory for classifying and storing the tested memory modules 10. A module storage unit 200, a loader unit 300 for feeding the memory module 10 into the chamber 100,
And an unloader section 400 for classifying and taking out the tested memory modules 10 that have been tested.

The handler 1 includes a memory module 10
The memory module 10 is tested (inspected) for proper operation in a state where high or low temperature stress is applied to the memory module 1, and according to the test result, the memory module 1 is tested.
The operation test in a state where such a temperature stress is applied is a test tray transported in the handler 1 from a supply tray 202 on which a large number of memory modules 10 to be tested are mounted. 20 is implemented by replacing the memory module 20 with the memory module 20.

The test tray 20 includes a loader 300
After the memory module 10 is loaded in the chamber 10
0, and each memory module 10 is tested in the measuring section 102 of the chamber 100 while being mounted on the test tray 20. Then, after the tested memory module 10 is carried out to the unloader unit 400,
In the unloader section 400, each memory module 1
0 is replaced on the storage tray 204 according to the test result.

The chamber 100 is a soak chamber (constant temperature chamber) for applying a desired high or low temperature stress to the memory module 10 loaded on the test tray 20.
101, a measuring unit 102 for bringing the memory module 10 in a state of being subjected to thermal stress in the soak chamber 101 into contact with the socket 50 of the test head TH, and a memory module 10 tested by the measuring unit 102. And an unsoak chamber (heat removal tank) 103 for removing thermal stress.

In the unsoak chamber 103, when a high temperature is applied in the soak chamber 101, the memory module 10 is cooled to a room temperature by blowing air, or is cooled naturally to near room temperature. On the other hand, when a low temperature of, for example, about −30 ° C. is applied in the soak chamber 101, the memory module 10 is heated with warm air or a heater to return the temperature to a temperature at which dew condensation does not occur. Then, the heat-removed memory module 10 is carried out to the unloader unit 400.

Since it is preferable that the unsoak chamber 103 is thermally disconnected from the soak chamber 101 and the measuring section 102, the unsoak chamber 103 is provided outside the chamber 100 in this embodiment. The chamber 100 may also include a soak chamber 103.

The structure of each area of the memory module storage section 200, the loader section 300, the chamber 100 and the unloader section 400 will be described in more detail.

Memory Module Storage Unit 200 First, the memory module 10 to be tested is loaded on the trays 202 and 204 shown in FIG. ,
It is also carried out in the same package. Reference numeral 205 shown in FIG. 5 denotes a protrusion for keeping the memory module 10 in an upright posture.

The tray for mounting the memory module 10 before the test is referred to as a supply tray 202, and the tray for mounting the memory module 10 after the test is referred to as a storage tray 204. The trays 202 and 204 may have the same shape or different shapes. However, at least the supply tray 202 is
It is desirable to have a function of positioning the mounted memory module 10. The memory module 10 mounted on the supply tray 202 is loaded into the handler 1 from now on and is provided with a plurality of pickup devices (an XY transfer device 3 described later).
This is because an operation such as reloading is performed in step 03).

The memory module storage section 20 of the present embodiment
0 is provided with a pair of tray storage sections 212 and 214. As shown in FIGS. 1, 2 and 4, one of the tray storage sections 212 mainly has a supply tray 20 on which the memory module 10 to be tested is mounted.
2 are vertically held independently of each other without being stacked. On the other hand, in the other tray storage section 214, storage trays 204 in which the memory modules 10 that have been tested are appropriately classified are vertically stored independently of each other without being stacked. That is, the trays 202 and 204 are stored in the tray storage portions 212 and 214, for example, in a drawer shelf shape.

The tray storage sections 212 and 214
The number of trays that can be stored in the
Can be appropriately determined based on the relationship between the size of the image and the classification ability. In this example, a maximum of 7
Each of the trays 202 and 204 can be stored.

Although the details will be described later, the tray storage 21
2 and 214 have the same structure, so that both the supply tray 202 and the storage tray 204 can be stored in each other. In other words, the classification of test results is not only good and bad, but also high-speed, medium-speed, low-speed, and defective products that require re-testing. If classification is required,
The problem can be solved by using the two tray storage sections 212 and 214 comprehensively.

An elevator 206 is provided between the pair of tray storage sections 212 and 214 so as to be able to move up and down. As shown in FIG. 4A, the elevator 206 is controlled to move vertically at least between the lowermost stage and the uppermost stage of each of the tray storage sections 212 and 214 by, for example, a ball screw driving device 206a.

The elevator 206 transfers the trays 202 and 204 to and from the respective tray storage sections 212 and 214. Such an operation is performed by, for example, hooking a rod or the like of the fluid pressure cylinder 206b on the trays 202 and 204 or a plate on which the tray is mounted, and driving the fluid pressure cylinder 206b forward and backward as shown in FIG.
The operation of taking in and out the trays 202 and 204 is performed.

Immediately above the tray storage sections 212 and 214 and the elevator 206, a transfer arm 208 is provided.
It is provided movably in the ± X-axis direction shown in FIG. The transfer arm 208 is controlled to move to a desired position in the ± X-axis direction by, for example, a ball screw driving device 208a. The transfer arm 208 receives the trays 202 and 204 placed on the elevator 206 and transfers them to a set plate 210 described later, or conversely receives the trays 202 and 204 placed on the set plate 210 and transfers them to the elevator 206. . At this time, the tray 20
Hook mechanism 20 to hold and release
8b (see FIG. 11) is provided so as to be openable and closable.

In this embodiment, the transfer arm 208 is provided.
Are set only in the ± X-axis direction, but the trays 202 and 204 can be moved up and down in the ± Z-axis direction.
May be raised and lowered in the ± Z-axis direction at the time of delivery. Further, it is also possible to be movable in the ± Y-axis direction so that a setting range of a set plate 210 described later has a degree of freedom.

In this embodiment, three set plates 210 are provided immediately above the transfer arm 208. These set plates 210 can be independently raised and lowered in the ± Z-axis direction by, for example, a ball screw driving device 210a, and can be raised and lowered at least between a position lower than the transfer arm 208 and a position higher than the transfer arm 208. Can be. The lower limit position here is the position when the trays 202 and 204 are delivered, and the upper limit position is the set position of the trays 202 and 204 (that is, the position where the XY transfer device 303 transfers the memory module 10 to the test tray 20 and This is a position where the XY transfer device 403 receives the memory module 10 from the test tray 20).

In this example, three set plates 21
4 is set as the set plate 210 of the loader unit 300 on the left side of FIG.
Set plates 210, 210. However, the present invention is not limited to this and may be two or four or more.

Loader section 300 The above-described supply tray 202 is provided in the window section 3 of the loader section 300.
06 from below, the memory module 10 loaded in the supply tray 202 in the loader unit 300 is the test tray 2 stopped in the loader unit 300.
It is transshipped to 0.

From the supply tray 202 to the test tray 20
As shown in FIG. 1, as a transfer device for reloading the memory module 10, a Y-axis rail 301 and a space between the supply tray 202 and the test tray 20 along the Y-axis rail 301 in the ± Y-axis direction are provided. An XY transport device 303 including an X-axis rail 302 that can move in the X-axis direction and a movable head 304 that can move in the ± X-axis direction along the X-axis rail 302 is used.

The movable head 30 of the XY transport device 303
4, a memory module gripping mechanism 500 shown in FIG. 5 is mounted downward. The gripping mechanism 500 shown in FIG.
A fluid pressure cylinder 502 for moving the gripped memory module 10 in the ± Z-axis direction;
A pair of chucks 504 for grasping both side edges of the "0" and a fluid pressure cylinder 506 for opening and closing the pair of chucks 504 are provided. By opening and closing the chuck 504 by the fluid pressure cylinder 506, both side edges of the memory module 10 can be grasped or released, and the grasped memory module 10 can be moved up and down by the fluid pressure cylinder 502.

As described above, the gripping mechanism 500 moves while grasping the memory module 10, thereby gripping the memory module 10 from the supply tray 202 and reloading the memory module 10 to the test tray 20. The gripping mechanism 500 of this example is mounted on the movable head 303, for example, about eight, and can transfer eight memory modules to the test tray 20 at a time.

In the supply tray 202, the pocket formed in a concave shape for mounting the memory module is formed to be relatively larger than the shape of the memory module 10, so that the pocket is stored in the supply tray 202. The position of the memory module 10 in the state has some variation. Therefore, if the memory module 10 is gripped by the gripping mechanism 500 in this state and directly carried to the test tray 20, it may be difficult to accurately drop the memory module 10 into the insert 30 of the test tray 20.

For this reason, in the present embodiment, a position correcting means called a precisor 305 is provided between the installation position of the supply tray 202 and the test tray 20. The precisor 305 has a relatively deep concave portion into which the memory module 10 can be inserted, and has a shape in which the periphery of the concave portion is surrounded by an inclined surface. Therefore, when the memory module 10 is dropped into the recess, the falling position of the memory module 10 is corrected on the inclined surface. As a result, the mutual positions of the eight memory modules 10 are accurately determined, and the memory modules 10 whose positions have been corrected are sucked again by the gripping mechanism 500 and reloaded on the test tray 20, whereby the test tray 20 Memory module 1 with high accuracy in insert 30
0 can be transshipped.

[0054] As the chamber portion 100 described above, the test tray 20 is loading the memory module 10 in the loader section 300, soak chamber 10
It is carried to 1. Although not shown, the soak chamber 101 is provided with a vertical transfer device, and the vertical transfer device waits while the plurality of test trays 20 are supported by the vertical transfer device until the measurement unit 102 becomes empty. . Then, high-temperature or low-temperature stress is applied to the memory module 10 mainly during this standby.

A test head TH is arranged at the center of the measuring section 102, and the socket 50 is set so as to face the inside of the measuring section 102 from below. Then, the test tray 20 is carried over the set test head TH, and the test is performed by electrically contacting each of the plurality of memory modules 10 with the plurality of sockets 50 at the same time. The test tray 20 after the test is completed
After the heat is removed in the unsoak chamber 103 and the temperature of the memory module 10 is returned to room temperature or a temperature corresponding thereto, the memory module 10 is carried out to the unloader section 400.

The test tray 20 carried out to the unloader section 400 is returned to the loader section 300 and the chamber 100 again by a roller conveyor or the like (not shown).

As shown in detail in FIG. 7, the test tray 20 of the memory module holds the insert 30 in which the memory module 10 is removably accommodated and a plurality of inserts 30 in a line along the X-axis direction. Tray body 20
a. The tray body 20a has a rectangular upper frame 22 and a rectangular lower frame 24 of the same size and rectangular. These frames 22 and 24 are connected in parallel by a plurality of rod-shaped spacers 26.

Upper frame 22 and lower frame 24
, Holding holes 21 and 23 for penetrating and holding the respective inserts 30 are formed at predetermined intervals along the X-axis direction. A pair of positioning holes 2 are provided near both ends of the holding hole 21 formed in the upper frame 22 in the Y-axis direction.
5 are formed so as to be displaced in the X-axis direction. As shown in FIG. 8C, positioning pins 42 formed on the inserts 30 are fitted into these positioning holes 25, and each insert 30 is positioned with respect to the tray main body 20a.
Note that a cap 43 is attached to the lower end of the pin 42, and the insert 30 is prevented from coming off with respect to the tray main body 20a.

As shown in FIGS. 7 and 8 (A) and 8 (B), the insert 30 has a pair of side walls 32 in which inverted trapezoidal cutouts 31 are formed. These side walls 3 are formed so that a space 34 is formed.
2 is integrated by end walls 33a and 33b. Each insert 30 is made of, for example, a synthetic resin.

As shown in FIG. 8B, bosses 35 projecting from the accommodation space 34 are formed inside the end walls 33a and 33b. A groove 36 and a holding bottom wall 37 are formed. FIG.
As shown in (A) and (B), the bottom of the housing space 34 formed between the pair of side plates 32 is
5 and 35, a through hole 38 is formed, and the substrate terminal 12 of the memory module 10 held between the holding bottom walls 37 of the holding groove 36 is exposed downward through the through hole 38.

Both ends of the memory module 10 can be detachably inserted into the holding groove 36 from above, and as shown in FIG. Hold both sides of the memory module 10 with the holding grooves 3
6 are formed with a tapered guide groove 42 for guiding the inside. Inside the insert 30, the memory module 10 is positioned by the holding bottom wall 37 of the holding groove 36 with a slight clearance in the X-axis direction and the Y-axis direction, held by its own weight, and The clearance of the accommodation space 34 is formed with a relatively wide clearance so as not to contact with.

A flange 39 is integrally formed on the upper portions of the end walls 33a and 33b. The flange 39 is shown in FIG.
As shown in the figure, the insert 30 is placed on the edge of the holding hole of the upper frame 22 in a state of being inserted and held in the holding holes 21 and 23 of the tray main body 20a.
0 is prevented from falling downward from the holding holes 21 and 23. As shown in FIGS. 7 and 8, positioning pins 42 protrude from the lower surface of the flange 39.
These positioning pins 42 are, as shown in FIG.
It fits into a positioning hole 25 formed in the upper frame 22.

At the lower end of the positioning pin 42, a cap 4
3 is attached, and the insert 30 is prevented from coming off upward with respect to the tray main body 20a. As a result, each insert 30 is positioned and held with respect to the tray main body 20a. However, the clearance between the positioning hole 25 and the positioning pin 42 should be set large enough to allow the insert 30 to move about 0.5 to 1.5 mm in the X-axis and Y-axis directions with respect to the tray body 20a. Is preferred. As described later, each insert 30 needs to be positioned with respect to each board pusher 76 and each socket 50, and needs to be movable with respect to the tray main body 20a. In addition, since each insert 30 needs to be slightly movable in the Z-axis direction with respect to the tray body 20a, the cap 43 shown in FIG. ,
The insert 30 and the tray body 20a are attached so as to allow relative movement in the Z-axis direction. In addition, the insert 3 into the holding hole 23 formed in the lower frame 24
The clearance of the outer shape at the lower end of 0 is substantially the same as the clearance between the positioning hole 25 and the positioning pin 42, thereby preventing the insert 30 from tilting more than necessary with respect to the tray main body 20a.

In particular, as shown in FIG.
And 33b have an upper positioning hole 40 formed through the flange 39 and end walls 33a and 33b.
And a lower positioning hole 41 which is open at the bottom of the bottom. The positioning pins 80 formed on the holding plate 78 of the board pusher 76 shown in FIG. 6 are inserted into the upper positioning holes 40 to position the board pusher 76 and the insert 30. In addition, the lower positioning hole 41
6, a positioning pin 56 formed in the socket guide 52 of the test socket 50 shown in FIG. 6 is inserted, and the board terminal 12 of the memory module 10 held by the insert 30 is positioned with respect to the test socket 50. It has become.

As shown in FIG. 6, the test tray 20 holding the insert 30 is placed on a tray transport base 44 and can be transported, for example, in the X-axis direction. The tray transport base 44 is elastically held by a means such as a spring 46 (or a pressure cylinder) with respect to a test head base 48 holding the socket 50. As a result, a spring force is applied to the tray transport base 44 in a direction in which the test tray 20 moves away from the socket 50 on the test head base 48.

The structural relationship between the test tray 20 and the test head TH in the measuring section 102 is as follows. First, as shown in FIG. 9, a common test board 64 and an individual test board 66
, A plurality of sockets 50 are arranged along the X-axis direction. The number of sockets 50 shown in FIG. 9 depends on the number of inserts 30 held on the test tray 20 shown in FIG.
Is preferably 1 / integer of the number of arrangements. The arrangement pitch in the X-axis direction between the sockets 50 shown in FIG.
It is preferably an integral multiple of the arrangement pitch of the inserts 30 shown in FIG. 7 in the X-axis direction.

For example, when 16 inserts 30 shown in FIG. 7 are arranged along the X-axis direction, the socket 50 shown in FIG. It is arranged in the number of arrangements. The arrangement pitch in the X-axis direction between the sockets 50 shown in FIG. 9 is twice the arrangement pitch in the X-axis direction of the insert 30 shown in FIG. By arranging sockets 50 with such an arrangement number and an arrangement pitch, a plurality of times (for example, 2
), All the memory modules 10 held in the test tray 20 can be tested.

That is, first, among the memory modules 10 held in the respective inserts 30 of the test tray 20 shown in FIG. 7, the substrate terminals 12 of the odd-numbered (or even-numbered) memory modules 10 along the X-axis direction. Is inserted into the socket groove 51 of each socket 50 shown in FIG. 9, and these are simultaneously tested. Thereafter, the test tray 20 shown in FIG. 7 is moved along the X-axis direction by the same interval as the arrangement pitch of the inserts 30 in the X-axis direction. The board terminals 12 of the memory module 10 are inserted into the socket grooves 51 of each socket 50 shown in FIG. 9, and these are simultaneously tested. In this way, all the memory modules 10 held in the test tray 20 can be tested.

As shown in FIG. 9, each socket 50
It has a socket body 53 having a socket groove 51 formed along the axial direction, and a pedestal 68 for holding the socket body 53. The pedestal 68 is connected to the upper part of the individual test board 66. Further, the socket body 5 is located above the pedestal 68.
A socket guide 52 having an elongated through-hole 54 formed in the Y-axis direction is mounted on the outer periphery of the socket 3, and a through-hole 54 is provided between both ends of the socket body 53 in the Y-axis direction and the socket guide 52. Escape grooves 55 corresponding to both ends are formed. As shown in FIG. 6, the bosses 35 formed at the lower ends of the end walls 33 a and 33 b of the insert 30 enter these escape grooves 55, and the both ends are held in the holding grooves 36 of the boss 35. The board terminal 12 of the module 10 can be conveniently inserted into the socket groove 51 of the socket 50.

Further, as shown in FIG.
A socket terminal 58 is arranged inside the 0 socket groove 51. The socket terminals 58 are formed by connecting the board terminals 12 formed at the lower end of the memory module 10 to the socket grooves 51.
Is electrically connected to the substrate terminal 12 in a state of being inserted into the inside. The socket terminals 58 are connected to the test head TH and the tester TS via the pedestal 68, the individual test board 66, the common test board 64, and the internal wiring of the test head base 48.
Each test result can be read.

In this embodiment, as shown in FIG. 10, a pad 60 for receiving the lower end of the module 10 and a return spring 62 for applying a spring force for pushing the pad 60 upward are provided at the bottom of the socket groove 51. Is provided. Therefore, when no external force acts on the memory module 10, the memory module 1
0 is pushed out from the socket groove 51 upward.

As shown in FIG. 6, a Z-axis drive unit 70 for moving the board pusher 76 in the vertical direction (Z direction) is provided above the test tray 20 held on the transport base 44. Are located. The Z-axis drive unit 70 includes a common drive plate 72 and a match plate 74
And a holding plate 78 for holding the board pusher 76.

On the lower surface of the board pusher 76, a pressing surface 71 for finally pressing the upper end of each memory module 10 is formed. Guide projections 73 projecting downward from the lower surface of the board pusher 76 are integrally formed at the positions of both ends of the pressing surface 71 in the Y-axis direction. Also,
The guide projection 73 can enter the inside of the accommodation space 34 of the insert 30.

Inside the guide projection 73, both upper end portions of the memory module 10 are inserted to guide the guide groove 77 for calibrating the inclination of the module 10 in the insert 30.
Are formed. A tapered portion 75 is formed at the lower end of the guide groove 77 so that both upper end portions of the memory module 10 can be easily inserted into the guide groove 77.

A holding plate 78 for holding the board pusher 76
Positioning pins 80 are provided on the lower surfaces of both ends in the Y-axis direction. When the holding plate 78 moves downward in the Z-axis direction, the positioning pin 80 is inserted into the upper positioning hole 40 of the insert 30 and the board pusher 7.
6 and the memory module 10 are positioned.

The board pusher 76 and the holding plate 78
A plurality of sockets 50 are arranged along the X-axis direction at intervals and the number of arrangements corresponding to the arrangement pitch in the X-axis direction, and each holding plate 78 is fixed to a lower end of each of the plurality of suspension rods 82. The upper end of the suspension rod 82 is fixed to the lower surface of the individual drive plate 84. A plurality of individual driving plates 84 are also arranged along the X-axis direction at intervals and the number of arrangements corresponding to the arrangement pitch of the sockets 50 in the X-axis direction. Are respectively movably mounted in the Z-axis direction inside each of the plurality of accommodation grooves 86 formed along the X-axis direction. Each accommodation groove 8
6 has a mortar-shaped taper, and the board pusher 76 is individually suspended in a state of being suspended from the match plate 74 via the holding plate 78, the suspension rod 82 and the individual driving plate 84. The driving plate 84 is provided with the accommodation groove 8.
6 and is held.

As shown in FIGS. 13A to 13D, the match plate 74 and the common drive plate 72 are connected by a connection block 92.
It is movable in the Z-axis direction. A drive mechanism (a pressure cylinder, a motor actuator, or the like) for moving the match plate 74 and the common drive plate 72 in the Z-axis direction is omitted.

As shown in FIG. 6, on the lower surface of the common drive plate 72, a pair of contact cylinders 88 are mounted in the Y-axis direction corresponding to the upper portions of the individual drive plates 84. Each contact cylinder 88 is provided with a pressing pad 90 that is freely drivable in the Z-axis direction. As described later, the individual driving plate 84 floating from the match plate 74 can be pressed downward at a predetermined timing. ing.

Unloader section 400 The unloader section 400 is also provided with an XY transfer device 403 having the same structure as the XY transfer device 303 provided in the loader section 300. The XY transfer device 403 also includes a Y-axis rail 401, an X-axis rail 402 that can move along the Y-axis rail 401 between the storage tray 204 and the test tray 20 in the ± Y-axis direction, The movable head 40 that can move in the ± X-axis direction along the X-axis rail 402
The memory module gripping mechanism 500 shown in FIG. 5 is attached to the movable head 404 in a downward direction. The XY transport device 403 causes the unloader section 4
The tested memory modules 10 are transferred from the test tray 20 carried out to the storage tray 204 to the storage tray 204.

The unloader unit 400 has a pair of windows 406a and 406b in which the storage tray 204 carried to the unloader unit 400 is disposed so as to face from below.
Has been established. As described, each window 4
Set plates 210 and 210 for raising and lowering the storage tray 204 are provided below the storage trays 06a and 406b. Here, the storage tray 204 in which the memory modules 10 that have been tested are reloaded and filled up is loaded. The tray 204 is put down and transferred to the transfer arm 208.

Incidentally, in the handler 1 of the present embodiment,
Even when the maximum number of categories that can be sorted is desired to be, for example, eight, the window portions 406a, 4
In 06b, only two storage trays 204 can be arranged at the maximum. Therefore, the categories that can be sorted in real time are limited to two categories. In general, good products are classified into three categories: high-speed response devices, medium-speed response devices, and low-speed response devices, and four categories are sufficient with defective products added thereto. There may be categories that do not belong to these categories, such as those that require a retest.

As described above, the window section 4 of the unloader section 400
06a, 406b, two storage trays 20
In the case where a memory module 10 classified into a category other than the category assigned to No. 4 occurs, one storage tray 204 is returned from the unloader unit 400 to the storage unit 200, and the newly generated category is replaced with the newly generated category. Storage tray 20 for storing the memory module 10
4 may be transferred to the unloader unit 400 and the memory module 10 may be stored.

However, if the storage trays 204 are replaced during the sorting operation, the sorting operation must be interrupted during that time, which causes a problem that the throughput is reduced. Therefore, in the handler 1 of the present embodiment, the test tray 20 of the unloader unit 400 and the window 406a,
A buffer unit 405 is provided between the memory module 10 and the buffer module 406b, and the memory module 10 of a category that rarely occurs is temporarily stored in the buffer unit 405.

For example, 30 to 60
A memory device is provided which has a capacity capable of storing about the number of memory modules 10 and stores a category of the memory module 10 stored in each storage position of the buffer unit 405, and a memory temporarily stored in the buffer unit 405. The category and position of the module 10 are stored for each memory module 10. Then, during the sorting operation or when the buffer unit 405 is full, the storage tray 204 of the category to which the memory module 10 stored in the buffer unit 405 belongs is stored in the storage unit 2.
00 and stored in the storage tray 204. At this time, the memory modules 10 temporarily stored in the buffer unit 405 may cover a plurality of categories. In such a case, when the storage trays 204 are called, the plurality of storage trays 204 are simultaneously loaded into the unloader unit 400. What is necessary is just to call it to the window parts 406a and 406b.

The specific structure of the buffer unit 405 is as follows.
There is no particular limitation. For example, as shown in FIG. 15, the memory module 10 may have a plurality of accommodation grooves having a large number of protrusions 415 at predetermined intervals for keeping the memory module 10 in an upright posture.

Next, the operation will be described. First, the operation of the memory module storage unit 200 will be described with reference to FIGS. 11 and 12, the supply tray 202 full of the memory modules 10 before the test is stored in all the stages of the tray storage section 212,
The operation of setting the storage tray 204 in which the tested memory modules 10 are fully loaded by the unloader unit 400 of the handler 1 to the tray storage unit 214 will be described continuously.

For example, when the supply tray 202 is taken out from the uppermost stage of the tray storage section 212, FIG.
First, as shown in FIG.
2 and is pushed out to the elevator 206 by the fluid pressure cylinder 206a shown in FIG. At about the same time, the transfer arm 208 is moved immediately above the elevator 206.

Next, the elevator on which the supply tray 202 is placed is raised to a transfer position with the transfer arm 208 and the hook mechanism 208b of the transfer arm 208 is closed to receive and hold the supply tray 202. . Then, the loader unit 3 which is the target position
The run arm 208 is moved to the lower part of 00. Before this movement, the set plate 210 of the loader unit 300 is lowered to the lower limit position.

This state is shown in FIG. 11 (B). Here, the set plate 210 is slightly raised (or, when the vertical movement function in the ± Z axis direction is added to the Tran arm 208, the Tran arm 208 side is moved). Then, the hook mechanism 208b of the transfer arm 208 is opened to transfer the supply tray 202 onto the set plate 210. After retracting the transfer arm 208 from that position, the set plate 210 is raised to the upper limit position as shown in FIG. 11C, and the supply tray 202 is set on the loader unit 300. As described above, the supply tray 202 full of the memory modules 10 before the test is moved to the loader unit 30.
The operation of setting to 0 is completed.

In FIG. 11C, the transfer arm 208 located at the lower part of the loader unit 300 is moved to the storage tray 20 full of the memory modules 10 which have been tested.
4 to the right side of the unloader unit 400 to receive the same. Before this movement, the set plate 210 on the right side of the unloader unit 400 is lowered to the lower limit position. Then, the set plate 210 is slightly raised (or, if the function of raising and lowering in the ± Z-axis direction is added to the trunnarm 208, the trunnarm 208 side is slightly lowered), and the hook mechanism 208b of the trunnarm 208 is closed. Then, the storage tray 204 is transferred to the transfer arm 208 and held.

Next, as shown in FIG. 12 (A), the transfer arm 208 is moved to the upper part of the elevator 206 waiting at the raised position, where the hook mechanism 208b of the transfer arm 208 is opened to open the storage tray 204. Is transferred to the elevator 206. Then, as shown in FIG. 12 (B), after lowering the elevator 206 to a predetermined empty stage (the third stage from the top in this example) of the tray storage unit 214,
The storage tray 204 is pulled into the tray storage section 214 using the fluid pressure cylinder 206b shown in FIG. As described above, the storage tray 204 full of the tested memory modules 10 is moved from the unloader unit 400 to the tray storage unit 2.
The operation of transferring to S14 is completed.

As described above, when the tray transfer device of this embodiment is used, there is no need to raise and lower the tray storage sections 212 and 214 themselves.
There is no need to provide a space for the lifting locus above the 214. Therefore, the test apparatus itself is reduced in size at least in the height direction.

The tray handling sequence shown in FIGS. 11 and 12 is merely an example of the present invention, and according to the present invention, the elevator 206 is housed in the pair of tray housings 212 and 214. Trays 202, 20
4, the loader unit 300, the unloader unit 400, and the tray storage unit 21 can be accessed.
2, 214, any of the trays 202, 204 can be taken in and out.

For example, when the supply tray 202 and the storage tray 204 are the same tray, the supply tray 202 on which the memory modules 10 are fully loaded is replaced with the tray shown in FIG.
(A)-transferred to the loader unit 300 according to the procedure shown in (C),
Thereafter, when the supply tray 202 of the loader unit 300 becomes empty, it is directly or indirectly transferred to the transfer arm 2.
08 and transferred to the unloader unit 400, and the storage tray 2
04 can also be used.

The storage tray in which the memory module 10 is fully loaded by the unloader section 400 is normally stored toward the tray storage section 214.
The use of the empty stage also allows flexible handling of an increase in the number of classifications.

That is, when the supply tray 202 and the storage tray 204 are used independently, when the number of supply trays is A, the number of storage trays is B, and the number of classifications is n, the storage tray 204 Cannot be operated continuously unless B = A + (n-1) or more. However, by sharing these trays 202 and 204, the classification operation can be performed continuously until n = B + 1. become.

The memory module 10 before the test loaded from the memory module storage section 200 to the supply tray 202 set in the window section 306 of the loader section 300 is fully loaded.
Is transferred to the test tray 20 of the memory module by the XY transfer device 303 shown in FIG. 1 and then transferred into the chamber 100 while being mounted on the test tray 20. In the chamber 100, the memory module 10 is heated or cooled to a temperature (high or low temperature) at which a test is to be performed in a soak chamber (constant temperature chamber) 101, and is pressed against a test head by a measuring unit 102.
This pressing to the test head is performed in a state where the memory module 2 is mounted on the test tray 20 and some of the memory modules 2 are pressed.
0 are pressed simultaneously.

The operation of the measuring section 102 will be described in detail with reference to FIGS.

First, the test tray 20 holding a plurality of the memory modules 10 shown in FIG. 7 is mounted on the socket 50 fixed on the upper portion of the test head base 48 by the tray transport base 44 as shown in FIG. It is conveyed from another position to the upper position, is positioned with respect to the socket 50, and stops.

Next, from the position shown in FIG.
The Z-axis drive unit 70 is moved down in the Z direction to the position shown in FIG. Then, the positioning pins 80 formed on the lower surface of the holding plate 78 shown in FIG.
Upper positioning holes 4 formed in each insert 30
0, the board pusher 78 and the memory module 10 held by the insert 30 are positioned.

At the same time, the guide projections 73 of each board pusher 76 enter the inside of the accommodation space 34 of the insert 30, and both upper end portions of the memory module 10 are in the guide grooves 7.
7, the inclination of the memory module 10 housed inside the insert 30 is calibrated, and the memory module 10 is kept substantially perpendicular to the pressing surface 71 of the board pusher 76.

At that time, the holding plate 78 of the board pusher 76 shown in FIG. 6 comes into contact with the upper surface of the insert 30 and presses the insert 30 together with the tray 20 downward. However, at that time, the pressing surface 71 of the board pusher shown in FIG. 6 is not completely in contact with the upper end of the memory module 10.

Thereafter, as shown in FIG. 13C, when the drive unit 70 is further moved down in the Z direction, the lower end of the connecting block 92 hits the upper end of the tray transport base 44. Since the distance between the match plate 74 and the common drive plate 72 in the Z direction does not change and the test tray 20 is held with respect to the transport base 44, the board pushers 76 that come into contact with the upper surface of the insert 30 are individually driven. Board 84
At the same time, it is lifted slightly upward relative to the match plate 74. However, even at that time, the pressing surface 71 of the board pusher 76 shown in FIG. 6 does not completely contact the upper end of the memory module 10 housed inside the insert 30.

Next, as shown in FIG. 13D, when the drive unit 70 is further moved down in the Z direction,
The connection block 92 pushes down the tray transport base 44 against the force of the spring 46 shown in FIG. As a result, the test tray 20 held by the tray transport base 44 is also pushed down in the Z direction, and the lower end of the boss 35 of the insert 30 shown in FIG. The lower end of module 10 contacts socket 50. At the same time, the positioning pins 56 of the socket 50 enter the lower positioning holes 41 of the insert 30, and the insert 30 and the socket 50 are positioned.

As shown in FIG. 14A, when the drive unit 70 is further moved down in the Z direction,
2 starts to enter the socket groove 51 of the socket 50, and only the memory module 10 remains at that position due to the repulsive force of the socket terminal 58. That is, since the memory module 10 is stationary with respect to the downward movement of the insert 30 and the tray 20, the memory module 10 is relatively pushed upward, and as a result, the upper end of the memory module 10 is pressed against the pressing surface 71 shown in FIG. Contact. The tray 20 including the insert 30 other than the memory module 10, the transport base 44, the match plate 74, and the common driving plate 72 will continue to move downward. However, by installing a spring mechanism such as a spring at any position of the socket 50 shown in FIG. 6, the insert 30 may be configured to temporarily stop the downward movement together with the memory module 10.

As shown in FIG. 14B, when the drive unit 70 is further moved down, the connecting block 44
The drive unit 70 is stopped from moving downward by abutting against a mechanical stopper 94 provided on the test head base 48. When the drive unit 70 is driven by a motor actuator other than the pressure cylinder,
The downward movement may be stopped at an accurate position by numerical control without using the mechanical stopper 94.

Next, as shown in FIG. 14C, the contact cylinder 88 shown in FIG.
0 is depressed, and the individual drive plate 84 floating above the match plate 74 is depressed. As a result, the pressing surface 71 of the board pusher 76 pushes down the memory module 10, and the lower end of the memory module 10 completely enters the inside of the socket groove 51 as shown in FIG.
2 is electrically connected to the socket terminal. At this time, the contact cylinder 88 shown in FIG. 6 is designed so as to have a necessary and sufficient pressing force for inserting the memory module 10 into the socket groove 51 of the socket 50 and not to apply an excessively large force. Is done. The memory module 10 is abutted against a mechanical end (not shown) provided in the socket 50 to perform positioning in the height direction. At this time, the contact cylinder 88 is designed to have a sufficient stroke, absorb a height dimensional error (for example, about 0.3 mm) of the memory module 10, and press the memory module 10 downward with a constant force. I have.

In the state shown in FIG. 14B, if the insert 30 and the memory module 10 are configured so that the downward movement is temporarily stopped,
In the state shown in (C), the board pusher 76 shown in FIG.
With the memory module 10, the insert 30
Is also pushed down.

In the state shown in FIG. 14 (C), as shown in FIG. 10, the substrate terminals 12 of each memory module 10 are electrically connected to the socket terminals 58, and a plurality of memory modules are accommodated in the tray 20. Testing of module 10 is performed simultaneously.

After the end of the test, the pressing by the contact cylinder 88 shown in FIG. 6 is released, and the drive unit 70 is moved upward. As a result, the tray transport base 44 holding the tray 20 attempts to return to the original tray transport height by a return mechanism such as a spring 46 or a pressure cylinder. The lower end of the memory module 10 is moved by the spring force of the return spring 62 attached to the bottom of the socket groove 51 of the socket 50 shown in FIG.
It is withdrawn from the socket groove 51 upward. In the present invention, the return spring 6 shown in FIG.
Not only a socket having a self-extracting force such as 2, but also a socket without a self-extracting force can be used.

In this case, since the socket itself has no pulling force, the memory module 10 tries to stay in the socket 50. For this reason, the spring shown in FIG. 6 is applied to the tray transport base 44 shown in FIG. 6 so that the force for pulling out the memory module 10 from the socket 50 and the force for lifting the tray 20 together with the insert 30 to the tray transport height are applied. Design lifting force of 46 or pressure cylinder. Note that a force for removing the memory module 10 from the socket is applied to the insert 30 or the socket 50 by a spring or the like that causes a force for separating the insert 30 and the socket 50 when the insert 30 and the socket 50 are positioned. You may respond by mounting.

By adopting such a structure, the memory module 10 can be inserted into and removed from the socket 50 without applying any extra force. Even if the insertion of the memory module 10 into the socket 50 fails, the contact cylinder 88 shown in FIG. 6 does not attempt to push down the memory module 10 with a force greater than the insertion force into the socket 50. There is little damage to the module 10 and no extra load acts on the tray 20.

In the handler 1 using the test tray 20, the inside of the handler 1 is moved while the plurality of memory modules 10 are held in the test tray 20, and the plurality of memory modules 10 Can be tested, and the test throughput is greatly improved. Further, the test and measurement unit 102 does not need to perform the pick-and-place operation of the memory module 10, so that the internal structure of the handler 1 can be simplified. Can be planned. Further, in the handler 1 according to the present embodiment, all or a part of such a test mechanism is disposed inside the chamber. Therefore, by maintaining the inside of the chamber at a constant high or low temperature, the memory module 10 The temperature accuracy during the test is improved, and an accurate test can be performed.

In the present embodiment, the means for positioning each member is not particularly limited, and other means other than the positioning pin and the positioning hole may be employed. Further, the socket body 52 and the socket body 53 may have an integral structure.

Further, the board pusher 76 is not limited to the embodiment shown in FIG. 6, and in the present invention, the guide projection 73, the guide groove 77 and the tapered portion 75 are not necessarily essential, and at least the pressing surface 71 may be used. However, it is preferable to provide the positioning pin 80 as the positioning means.

When the test is completed in such a procedure, the test tray 20 is transferred to the unsoak chamber 103, and the memory module 10 after the test is returned to near room temperature. This is performed mainly for the purpose of preventing dew condensation when a low temperature is applied.

The test tray 20 full of the memory modules 10 returned to room temperature is transported to the unloader section 400, where the tested memory modules 10 are transferred to the storage tray 204 by using the XY transport device 403. I do. At this time, each memory module 10 is transferred to the storage tray 204 according to each test result.

Here, the operation of the buffer unit shown in FIGS. 1 and 15 will be described in detail with reference to FIG. In the test apparatus and the test method according to the present embodiment, the memory module 10 is taken out from the test tray 20 that has moved to the unloader section 400 shown in FIG. 1 and stands by at the two windows 406 a and 406 b of the storage section 200. When sorting and transferring to the storage trays 204 and 204 based on the test results, the memory modules 10 and / or the storage trays 204 that cannot be completely classified into the storage trays 204
Memory module 10 that cannot be accommodated in
05 temporarily. Therefore, the window 4 of the storage unit 200
Storage tray 20 waiting at 06a and 406b
4 can be reduced, and it is not necessary to increase the area of the tray standby position in the tray storage section, and as a result, it contributes to downsizing of the entire test apparatus.

In the test apparatus and the test method of the present embodiment, the classification operation is interrupted and the operation of transferring the storage tray 204 at the standby position is not performed, so that the tested memory modules 10 are classified. The transfer operation can be performed quickly. Therefore, the throughput of the test process can be improved.

For example, windows 406a and 406b, which are tray standby positions in tray storage unit 200, have storage tray 204 for storing memory modules 10 that have passed the test, and memory modules 10 that have failed the test. The storage module 204 is stored in a standby state, and the buffer module 405 temporarily holds the memory module 10 that needs a retest. Alternatively, when the storage tray 204 for storing the memory module 10 that has passed the test is full, the memory module 10 that has passed the test is stored in the buffer unit 405 while the storage tray 204 is replaced. It may be stored temporarily.

The memory module 10 held in the buffer unit 405 is transferred to another storage tray 204 after the end of one test lot or during the waiting time between the test lots, thereby wasting time. Can be used effectively to perform classification work. Therefore, also in this respect, the throughput of the test process can be improved.

The present invention is not limited to the above-described embodiment, but can be variously modified within the scope of the present invention. For example, the method of using the buffer unit 405 is as follows.
The present invention is not limited to the embodiment described above, and the following uses are also possible. For example, the window section 406 of the unloader section 400
a, two storage trays 20 set in 406b
The memory modules 10 of “Pass” are transferred to 4,204, and the memory modules 10 of “Fail” or “Retest” are sequentially transferred to the buffer unit 405. When the buffer section 405 is full, the storage tray 204 for “fail” or the storage tray 204 for “retest” is set in the window 406a or 406b of the unloader section 400, and the buffer section 405 is set. May be transferred according to their respective classifications.

If the buffer unit 405 is filled with the tested memory module 10 before the end of one test lot, the sorting operation is automatically stopped and the buffer unit 40
Control may be performed so as to perform the transfer work from 5 to another storage tray. Alternatively, when the buffer unit 405 is filled with the tested memory module 10, an alarm may be generated for the operator to urge the operator to perform necessary processing.

In the above-described embodiment, the storage unit 20
0, two windows 406a and 406b for transferring the tested memory module 10 to the storage unit 200.
However, according to the present invention, all of the tested memory modules 10 of other classifications are used as a single window,
05 may be temporarily held. In that case, the size of the device can be further reduced.

Further, in the above-described embodiment, the memory module 10 is taken as an example of a test object. However, the test object of the test apparatus of the present invention is not limited to the memory module. The purpose is to include all electronic components that cannot be stored in a unit.

[0126]

As described above, according to the present invention, an electronic component substrate test apparatus and test suitable for testing an electronic component substrate in a state in which the electronic component substrate such as a memory module is housed. The method, in particular,
It is possible to provide a test apparatus and a test method for an electronic component substrate, which can reduce the size of the apparatus and improve the throughput of the test process.

[Brief description of the drawings]

FIG. 1A is a schematic plan view and FIG. 1B is a schematic front sectional view showing an embodiment of an electronic component substrate testing apparatus according to the present invention.

FIG. 2 is a schematic side sectional view of the electronic component substrate test apparatus shown in FIG.

FIG. 3 is a perspective view showing an example of a supply or storage tray used in the present invention.

4 (A) is a perspective view showing a memory module storage unit of FIG. 1, and FIG. 4 (B) is a perspective view showing a tray storage unit and an elevator.

FIG. 5 is a perspective view showing a memory module holding mechanism used in the XY transfer device in FIG. 1;

FIG. 6 is a cross-sectional view showing the entire measurement unit of FIG. 1;

FIG. 7 is a perspective view showing an example of a test tray used in the present invention.

8 shows the insert of the test tray of FIG. 7 (A).
It is a top view, (B) front view, and (C) side view.

FIG. 9 is a perspective view showing the test head unit of FIG. 1;

FIG. 10 is a cross-sectional view illustrating a contact state between a memory module and a socket in the test head unit of FIG. 1;

FIG. 11 is a conceptual diagram for explaining a method of operating a supply or storage tray according to the present invention.

FIG. 12 is a conceptual diagram (part 2) showing a continuation of FIG. 11;

FIG. 13 is a cross-sectional view of a main part for describing an operation in the measurement unit of FIG. 1;

FIG. 14 is a cross-sectional view of a main part showing a continuation of FIG. 13;

FIG. 15 is a perspective view of a buffer unit.

FIG. 16 is a conceptual diagram illustrating the operation of a buffer unit.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Handler (test apparatus of an electronic component board) 100 ... Chamber 200 ... Memory module storage part 202 ... Supply tray 204 ... Storage tray 206 ... Elevator (first lifting / lowering means) 208 ... Tran arm (horizontal transfer means) 210 .. Set plate (second elevating means) 212, 214 Tray storage unit 300 Loader unit 400 Unloader unit 405 Buffer unit 406a, 406b Window unit 10 Memory module (electronic component substrate) 12 Terminal 20 Test Tray 20a Tray body 30 Insert 40 Upper positioning hole (first positioning hole) 41 Lower positioning hole (second positioning hole) 50 Test socket 74 Match plate 76 Board pusher

Claims (8)

[Claims] A storage unit for storing a pre-tested and tested electronic component board; a measurement unit for testing the pre-test electronic component board; and a loader unit for sending the pre-test electronic component board to the measurement unit. An unloader unit that sorts and removes the tested electronic component boards that have been tested by the measuring unit, and transfers them to the storage unit; an electronic device that is movably accommodated inside the storage unit, A supply tray for holding a component board, a storage tray movably housed inside the storage unit and holding the tested electronic component board, and a loader unit, a measurement unit, and an unloader unit. A test tray that is arranged to move and holds the electronic component substrate, and a first tray that is provided in the loader unit and conveys the electronic component substrate held in the supply tray into the test tray.
Transport means, a second transport means provided in the unloader unit, for sorting the tested electronic components held in the test tray according to a test result and transporting the classified electronic components into the storage tray; An electronic component substrate which is installed in the unloader unit and temporarily holds an electronic component substrate that cannot be classified into the storage tray and / or an electronic component substrate that cannot be stored in the storage tray. Testing equipment. 2. An insert, wherein the test tray is formed with holding grooves into which both side ends of the electronic component substrate are movably inserted such that board terminals of the electronic component substrate are exposed; The electronic component board test apparatus according to claim 1, further comprising: a tray body that holds the insert so that board terminals of the electronic component board are exposed. 3. A test socket into which a board terminal of the electronic component board is removably inserted, and the electronic component board is mounted in the test tray. 3. The test apparatus for an electronic component board according to claim 1, further comprising a board pusher for pushing a board terminal of the component board into the test socket. 4. The electronic component board test apparatus according to claim 1, wherein the buffer section holds an electronic component board belonging to a class to be retested. 5. The storage section, wherein: a first tray storage section in which the supply tray and / or the storage tray is independently stored in a vertical direction; and the supply tray and / or the storage tray. A second tray storage section in which trays are independently stored in the up-down direction; and a first tray storage section provided so as to be able to move up and down between the first tray storage section and the second tray storage section. First elevating means for transferring the supply tray and / or the storage tray between the first tray storage unit and the second tray storage unit; the first tray storage unit and the second tray storage unit And an upper part of the first elevating means, which can be moved in the juxtaposed direction to transfer the supply tray and / or the storage tray to and from the first elevating means. With horizontal transport means A second elevating means, which is capable of ascending and descending with respect to a target position, and transfers the supply tray and / or the storage tray to and from the horizontal transfer device. 4. The test device for an electronic component substrate according to any one of items 4. 6. A step of taking out a pre-test electronic component substrate from a supply tray movably accommodated in a storage unit and transferring it to a test tray waiting in a loader unit; Moving the held electronic component substrate to the measuring section together with the test tray; and, in a state where the electronic component substrate is mounted in the test tray moved to the measuring section, the substrate of the electronic component substrate. Pushing the terminal into the test socket mounted on the measuring section, and performing a test of the electronic component board, without taking out the electronic component board tested by the measuring section from the test tray, Moving the electronic component substrate from the test tray that has moved to the unloader section, and moving the electronic component substrate to the storage tray that is waiting in the storage section. A step of temporarily holding, in the buffer unit, electronic component substrates that cannot be classified into the storage tray and / or electronic component substrates that cannot be fully stored in the storage tray when classifying and transferring based on the test result. Test method for electronic component substrates. 7. The method according to claim 7, wherein after the completion of one test lot, the electronic component boards temporarily stored in the buffer section are classified and transferred to a storage tray waiting in the storage section based on a test result. The method for testing an electronic component substrate according to claim 6. 8. The electronic component substrate temporarily stored in the buffer unit is classified into storage trays waiting in the storage unit during a waiting time during one test lot based on test results. The method for testing an electronic component substrate according to claim 6, wherein the electronic component substrate is transferred.