TWI886053B - A stacking test device - Google Patents

Abstract

A stacking test device includes: a machine, a test rack, a chip placement area, a transfer assembly, a shuttle assembly and a material transfer arm assembly. The test rack is arranged on the machine, and the test rack is provided with multiple test slots. The test slots are provided with test carriers that can be inserted and removed, and the test carriers are provided with a plurality of test units for carrying chips. The chip placement area is arranged on the machine on one side of the test rack; the shuttle assembly is arranged on the machine on one side of the chip placement area; the transfer assembly is arranged on the machine, and the transfer assembly is used to transfer chips between the chip placement area and the shuttle assembly; the material transfer arm assembly is arranged on the machine, and the transfer arm assembly is used to transfer chips between the shuttle assembly and the test units. By means of the stacking test device of the present invention, more chips can be tested in a limited space of the machine.

Description

A stacking test device

The present invention relates to the technical field of a testing device, and more particularly to a multi-layer stacked testing device.

Generally speaking, memory must pass various electrical tests before leaving the factory. The current testing method is to place multiple packaged memory chips on a tray, collect multiple trays and send them to a test machine. The test machine has multiple test work areas arranged in a planar array. Each test work area is equipped with a related circuit board and multiple test units. Each test unit is used to place a single memory chip and can perform various tests on the memory chip through the cooperation of the circuit board. The test machine is equipped with a pick-and-place mechanism that is responsible for removing multiple chips from the tray at a time and sending them to multiple test units in the corresponding test operation area. The time difference required for the test is used to transfer the memory chips to meet the test of a large number of memory chips at the same time. However, if the number of test chips is to be increased, more test operation areas must be distributed on the test machine, which will make the machine too large. Not only will a larger factory space be required, but the test machine may also need to be disassembled into several parts during the transportation process, and then assembled and fine-tuned in the factory, which is extremely troublesome and inconvenient.

The present invention is a stacking test device, which mainly adopts a vertical stacking method to form a plurality of test slots, and uses a special transfer method to quickly move the chips on the tray to the test slots in the corresponding space for testing. In this way, under the same machine volume, the design of the present invention can perform more chip testing operations.

To achieve the above-mentioned purpose, the present invention adopts the following technical solutions:

The present invention is a stacking test device, comprising: a machine, a test rack, a chip placement area, a transfer assembly, a shuttle movement assembly and a material transfer arm assembly, wherein: the test rack is arranged on the machine, the test rack is provided with multiple test slots, the test slots are provided with an in-and-out test carrier, the test carrier is provided with a plurality of test units, and the test units are used to carry chips; the chip placement area is arranged on the machine at one side of the test rack; the shuttle movement assembly is arranged on the machine at one side of the chip placement area; the transfer assembly is arranged on the machine, and the transfer assembly is used to transfer chips between the chip placement area and the shuttle movement assembly; the material transfer arm assembly is arranged on the machine, and the material transfer arm assembly is used to transfer chips between the shuttle movement assembly and the test unit.

As one of the preferred embodiments, a replaceable carrier plate is provided in the test slot, and the test carrier plate is supported by the carrier plate. A moving assembly is provided on the carrier plate and connected to the test carrier plate. When the moving assembly is actuated, the test carrier plate is extended from the carrier plate or retracted onto the carrier plate.

As one of the preferred embodiments, the chip placement area is provided with a plurality of tray carrying mechanisms for carrying trays, and the trays are used to place a plurality of chips.

As one of the preferred implementation schemes, the transfer assembly is responsible for controlling the movement of multiple pick-and-place heads between the chip placement area and the shuttle movement assembly. The transfer assembly also includes a spacing adjustment mechanism, a material picking reciprocating mechanism and a lateral movement mechanism. Multiple pick-and-place heads are arranged on the spacing adjustment mechanism. The spacing adjustment mechanism can adjust the spacing between adjacent pick-and-place heads. The material picking reciprocating mechanism is responsible for driving the spacing adjustment mechanism to move back and forth. The lateral movement mechanism is responsible for driving the material picking reciprocating mechanism to move between multiple tray carrying mechanisms and the shuttle movement assembly.

As one of the preferred implementation schemes, a plurality of the pick-and-place heads are arranged at the spacing adjustment mechanism in two rows, with a plurality of heads in each row.

As one of the preferred implementation schemes, the shuttle moving assembly includes a reciprocating moving mechanism and a shuttle carrier, the shuttle carrier is provided with a plurality of supporting fixtures, the supporting fixture is provided with at least one placing seat, the placing seat is responsible for carrying the chip, and the reciprocating moving mechanism is responsible for driving the shuttle carrier to move between the material transfer arm assembly and the chip placement area.

As one of the preferred implementation schemes, a plurality of the supporting fixtures arranged side by side are provided on the shuttle carrier, and the supporting fixture is provided with two placing seats for supporting chips.

As one of the better preferred implementation schemes, the material transfer arm assembly is responsible for controlling a plurality of suction heads to move the chip between the lowest position and the test slot of the corresponding height on the test rack. The material transfer arm assembly also includes a horizontal moving mechanism, a vertical moving mechanism, a material transfer mechanism and a support cantilever. A plurality of the suction heads are fixed to the support cantilever, and the support cantilever is moved horizontally by the material transfer mechanism. The vertical moving mechanism is responsible for driving the material transfer mechanism to move to different height positions, and the horizontal moving mechanism is responsible for driving the vertical moving mechanism to move to the test slot positions in different longitudinal directions of the test rack.

As one of the preferred implementation schemes, the suction heads are arranged in two rows, front and rear, with a plurality of suction heads in each row arranged in parallel on the supporting arm. The suction heads in the front and rear rows are used to suck the wafer to be tested and the wafer that has been tested, respectively.

As one of the preferred implementation schemes, the material moving mechanism is also equipped with a scanning moving mechanism and a scanning unit in the direction facing the test rack. The scanning moving mechanism is responsible for driving the scanning unit to move horizontally, and the scanning unit is used to scan the chip position on the test unit.

Compared with the prior art, the stacking test device of the present invention is a test rack with multiple layers of test slots in a stacking mode. In conjunction with a transfer assembly, a shuttle movement assembly and a material transfer arm assembly, multiple chips on a tray in a chip placement area are timely transferred to the test slots of corresponding heights and positions for testing. In the transfer process, the chips to be tested and the tested chips can be moved synchronously respectively to avoid the idle running of some mechanism assemblies, thereby greatly improving the transfer efficiency. In this way, the number of test chips can be greatly increased in a limited machine space. In addition, a replaceable carrier plate is provided, which can be replaced with a test unit that matches the chip to be tested, thereby improving applicability; and when the test unit is damaged, it is also convenient to replace or repair it, thereby improving efficiency.

The technical solution of the present invention will be described clearly and completely below in conjunction with specific embodiments and accompanying drawings. It should be noted that when an element is referred to as being "mounted on or fixed to" another element, it means that it can be directly on the other element or there can also be a centered element. When an element is considered to be "connected to" another element, it means that it can be directly connected to the other element or there can be a centered element at the same time. In the illustrated embodiments, the directions indicating up, down, left, right, front and back, etc. are relative, and are used to explain that the structures and movements of different components in this case are relative. These representations are appropriate when the components are in the positions shown in the figures. However, if the description of the component positions changes, it is believed that these representations will also change accordingly.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention pertains. The terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and/or" used herein includes any and all combinations of one or more of the related listed items.

As shown in Fig. 1 and Fig. 2, which are the three-dimensional and top views of the present invention, a stacking test device of the present invention is provided with a test frame 2, a wafer placement area 3, a transfer assembly 4, a shuttle moving assembly 5 and a material transfer arm assembly 6 on a machine 1. The present invention uses a tray 7 to carry the wafer to be tested or tested, and a wafer placement area 3 is used to place a plurality of trays 7. The test rack 2 is a vertical stacking structure and is provided with multiple test slots 21. The transfer assembly 4 is responsible for moving the wafer in or out of the tray 7. The shuttle moving assembly 5 provides horizontal transfer of the wafer and is responsible for transferring the wafer between one side of the wafer placement area 3 and the material transfer arm assembly 6. The material transfer arm assembly 6 provides transfer of the wafer at different spatial positions and is responsible for transferring the wafer between the lowest position (where the shuttle moving assembly 5 is located) and the test slot 21 at the corresponding height position on the test rack 2. In this way, the present invention is a stacking test device that can accommodate more wafers and perform tests, but the area occupied by the machine 1 does not need to be increased.

Next, the structure of each component is described in detail:

As shown in Fig. 1 and Fig. 3, the test rack 2 is provided with a multi-layer test slot 21, and a test carrier 22 that can be entered and exited is provided in the test slot 21. A plurality of test units 23 are provided on the test carrier 22, and the test units 23 are used to carry the chips to be tested. In this embodiment, the multi-layer test slots 21 are arranged in parallel in multiple rows in the longitudinal direction, and each test carrier 22 is provided with 8 parallel test units 23. Each test unit 23 is a standard test fixture, and is provided with a probe, a test interface panel and related fixing mechanisms to fix, release and perform test operations on the chip placed thereon in a timely manner. The test carrier 22 is provided with related circuits and electrical connectors to transmit the test signals of the test unit 23 to the terminal host. Please refer to FIG. 4 and FIG. 5 together. In order to facilitate the replacement of different test modules when testing different chips, a replaceable carrier plate 24 is provided in the test slot 21 in this embodiment. The carrier plate 24 carries the test carrier 22, and the test carrier 22 can slide on the carrier plate 24. A moving assembly 25 is provided on the carrier plate 24 and is linked to the test carrier 22. When the moving assembly 25 is actuated, the test carrier 22 is extended from the carrier plate 24 (as shown in FIG. 4) or retracted onto the carrier plate 24 (as shown in FIG. 5). In this embodiment, the moving assembly 25 is a pneumatic cylinder. The carrier plate 24 is fixed to the test slot 21 when in use, and can be fixed by screws or other snap-fit structures. If a different chip test is to be performed, the original locking state can be released, and the carrier plate 24 can be pulled out from the back of the test rack 2 and replaced.

As shown in FIG6 , the wafer placement area 3 is disposed on the machine 1 at one side of the test rack 2. The wafer placement area 3 is provided with a plurality of tray carrying mechanisms 31. A plurality of trays 7 are stacked and placed on the tray carrying mechanisms 31. In this embodiment, the plurality of tray carrying mechanisms 31 are used for placing trays 7 of wafers to be tested, trays 7 of tested good wafers, or trays 7 of defective wafers, etc., according to different purposes.

As shown in Figures 6 and 7, the transfer assembly 4 is set on the machine 1 and is used to transfer the chip between the chip placement area 3 and the shuttle movement assembly 5. The transfer assembly 4 controls a plurality of pick-and-place heads 41 to move between the chip placement area 3 and the shuttle movement assembly 5, and the pick-and-place heads 41 move the chip into or out of the tray 7. The transfer assembly 4 uses multiple linkage mechanisms to drive the pick-and-place head 41 to move in three axes (X, Y, and Z directions). This mechanism can be achieved in many ways, and the present invention only explains one of them. The transfer assembly 4 of the present invention includes a spacing adjustment mechanism 42, a material reciprocating mechanism 43, and a lateral movement mechanism 44. Multiple pick-and-place heads 41 are arranged on the spacing adjustment mechanism 42. Each pick-and-place head 41 is also provided with an independent lifting mechanism, a suction nozzle, and an air supply pipe, so that the pick-and-place head 41 can descend in time and absorb the chip on the tray 7. The spacing adjustment mechanism 42 can adjust the spacing between adjacent pick-up and placement heads 41. The material picking reciprocating mechanism 43 is responsible for driving the spacing adjustment mechanism 42 to move back and forth to move to the chip position corresponding to the tray 7. The lateral moving mechanism 44 is responsible for driving the material picking reciprocating mechanism 43 to move between the multiple tray carrying mechanisms 31 in the chip placement area 3 and the shuttle moving assembly 5.

In addition, the present invention has a plurality of pick-and-place heads 41 arranged in two rows, front and rear, with four heads in each row, at a spacing adjustment mechanism 42 (only the front row structure is shown in the figure, and the rear row also has the same number and structure of pick-and-place heads 41). During the pick-and-place process, the spacing adjustment mechanism 42 first adjusts the spacing between adjacent pick-and-place heads 41 in the same row, and then the material reciprocating mechanism 43 moves to the position above the corresponding tray 7. When the pick-and-place head 41 descends, it first takes 4 chips, and then the material reciprocating mechanism 43 moves the spacing adjustment mechanism 42 a certain distance, and then the plurality of pick-and-place heads 41 in another row descend to absorb another row of 4 chips on the tray 7, and finally move to the shuttle moving assembly 5 by the lateral moving mechanism 44.

As shown in FIG. 2 , FIG. 6 , and FIG. 7 , the shuttle moving assembly 5 is arranged on the machine 1 at one side of the wafer placement area 3 and is responsible for transferring the wafer between the wafer placement area 3 and the material transfer arm assembly 6. The shuttle moving assembly 5 includes a reciprocating mechanism 51 and a shuttle carrier 52. In this embodiment, the reciprocating mechanism 51 includes a pneumatic cylinder and a slide rail and a slide seat between the machine 1 and the shuttle carrier 52. The reciprocating mechanism 51 is responsible for driving the shuttle carrier 52 to move between the material transfer arm assembly 6 and the wafer placement area 3. A plurality of side-by-side carrying jigs 53 are arranged on the shuttle carrier 52, and the carrying jigs 53 are used to carry the wafer. In this embodiment, each carrier fixture 53 is provided with two placement seats 531, 532, wherein the placement seat 531 is used to place the wafer to be tested, and the other placement seat 532 is used to place the wafer that has been tested. In addition, each carrier fixture 53 can also be mounted on an electric rotating table. When the electric rotating table controls the carrier fixture 53 to rotate, the position of the wafer placed thereon can be adjusted, so that the subsequent wafer placement can be more accurate.

In addition, it can be clearly seen from the figure that the distance between adjacent carrier jigs 53 is much larger than the distance between adjacent chips on the tray 7. Therefore, when the distance adjustment mechanism 42 of the transfer assembly 4 is moved here, the distance adjustment mechanism 42 will synchronously adjust the distance between two adjacent pick-up and placement heads 41. The four pick-up and placement heads 41 in the front row will perform the pick-up and placement action first, and then the lateral movement mechanism 44 and the material reciprocating mechanism 43 will be operated in sequence, and then the four pick-up and placement heads 41 in the back row will continue to perform the pick-up and placement action, thereby placing or removing chips on the eight parallel carrier jigs 53.

As shown in Figs. 1, 2 and 8, the material transfer arm assembly 6 is disposed on the machine 1 between the test rack 2 and the wafer placement area 3, and is responsible for controlling a plurality of suction heads 61 to transfer the wafer between the lowest position and the test slots 21 of different heights and positions of the test rack 2, wherein the lowest position refers to the position on the carrier fixture 53 on the shuttle carrier plate 52. The material transfer arm assembly 6 also includes a horizontal movement mechanism 62, a vertical movement mechanism 63, a material transfer mechanism 64, and a supporting cantilever 65. The plurality of suction heads 61 arranged in parallel are driven by multiple sets of mechanisms to perform long-distance and high-drop transfer operations. A plurality of suction heads 61 are fixed to a supporting cantilever 65, and the supporting cantilever 65 is moved horizontally forward and backward by a material transfer mechanism 64. A vertical transfer mechanism 63 is responsible for driving the material transfer mechanism 64 to move to different height positions. A horizontal transfer mechanism 62 is responsible for driving the vertical transfer mechanism 63 to move to different longitudinal test slots 21 positions of the test rack 2. Thus, the suction heads 61 can place the chip on a test carrier 22 in a test slot 21 at different heights, or on a carrier fixture 53 of a shuttle carrier 52.

As shown in FIGS. 8 and 9 , in this embodiment, a plurality of suction heads 61 are arranged in two rows, 8 in each row, on a supporting arm 65 . The front and rear rows are used to suction the wafer to be tested and the wafer that has been tested, respectively, to improve the transfer efficiency. For example, before the test operation is completed and the transfer is to be performed, the front row of multiple suction heads 61 can first suck the wafer to be tested from the carrying fixture 53, and the rear row is an empty suction head 61. Then, after the material transfer arm assembly 6 is actuated, when the suction head 61 moves to the test slot 21 at the corresponding height, the vertical movement mechanism 63 and the material transfer mechanism 64 are actuated, and the empty suction head 61 in the rear row first sucks the tested wafer from the multiple test units 23 on the test carrier 22 and moves it out. After that, the vertical movement mechanism 63 and the material transfer mechanism 64 continue to actuate, and the front row suction head 61 replaces the wafer to be tested and places it on the empty test unit 23. After descending and moving, the tested wafer is placed on the carrying fixture 53 of the shuttle carrier 52, thereby improving the transfer efficiency.

In addition, as shown in FIG9 , a scanning movement mechanism 66 and a scanning unit 67 are installed on the material moving mechanism 64 facing the direction of the test rack 2. The scanning movement mechanism 66 is responsible for driving the scanning unit 67 to move horizontally. The scanning unit 67 is responsible for scanning after the wafer to be tested is placed on the test unit 23 to confirm the position of the wafer that is poorly clamped, so as to facilitate the subsequent re-placement action by the suction head 61.

Next, a brief description of the operation process of the present invention is given:

As shown in FIG10 , in the initial position, the shuttle carrier 52 of the shuttle moving assembly 5 will move to the side of the tray supporting mechanism 31 of the wafer placement area 3. Then, the transfer assembly 4 uses the pick-and-place head 41 to transfer the wafer from the tray 7 to the supporting fixture 53, and the wafer to be tested is placed on the placement seat 531. Since there are only four pick-and-place heads 41 in a row, eight wafers will be sucked by the pick-and-place heads 41 in the front and rear rows twice. Then, when the pick-and-place head 41 moves to the top of the shuttle carrier 52, the distance between the two adjacent pick-and-place heads 41 is enlarged, and then the eight wafers in the front and rear rows are placed on the eight supporting fixtures 53 in parallel in two times. In addition, if another placement seat 532 on the carrier fixture 53 is placed with tested chips, the placement head 41 of the transfer assembly 4 can also take them out in sequence, and then place the good and defective products directly on the corresponding tray 7 in the chip placement area 3 according to the test results, so there is no need to reclassify them.

As shown in FIG11 , the shuttle moving assembly 5 moves the shuttle carrier 52 to the working area of the material transfer arm assembly 6 by means of the reciprocating moving mechanism 51, and then the material transfer arm assembly 6 controls the two rows of 16 suction heads 61 to descend simultaneously, but only the eight suction heads 61 in the same row take out the wafer to be tested from the placement seat 531 on the carrier fixture 53. If the other row of eight suction heads 61 of the material transfer arm assembly 6 has already sucked the wafer to be tested, it will be placed in another placement seat 532 of the carrier fixture 53 after the movement.

As shown in FIG12, after the wafer pick-up and placement operation is completed, the transfer arm assembly 6 first controls the plurality of suction heads 61 to rise, and the shuttle carrier 52 of the shuttle moving assembly 5 must be moved to a position on the side of the tray supporting mechanism 31 of the wafer placement area 3. At this time, the test carrier 22 on the test rack 2 that has completed the test operation is extended.

As shown in FIG13 , the horizontal moving mechanism 62 of the material transfer arm assembly 6 is actuated to move the vertical moving mechanism 63 to the corresponding test carrier 22, and the vertical moving mechanism 63 moves the material transfer mechanism 64 to the height corresponding to the test carrier 22. Then, the material transfer mechanism 64 controls one row of eight suction heads 61 to take out the tested wafers, and then another row of eight suction heads 61 place the wafers to be tested in the empty test unit 23. If the test unit 23 sends a signal of clamping failure, the scanning unit 67 re-scans, confirms the fault location, and then takes it out and fixes it again.

In summary, the present invention provides a stacking test device in which a test rack 2 is provided with multiple test slots 21 in a stacking mode, and cooperates with a transfer assembly 4, a shuttle movement assembly 5 and a material transfer arm assembly 6 to timely transfer a plurality of chips on a tray 7 in a chip placement area 3 to the test slots 21 of corresponding heights and positions for testing. In addition, during the transfer process, the chips to be tested and the tested chips can be moved synchronously respectively, thereby avoiding the idle running phenomenon of some mechanism assemblies, greatly improving the transfer efficiency, and thus greatly increasing the number of test chips in a limited machine 1 space.

The above is only the preferred embodiment of the present invention and is not intended to limit the scope of the embodiments of the present invention. That is, all equivalent changes and modifications made according to the scope of the patent application of the present invention are covered by the patent scope of the present invention.

1: Machine 2: Test rack 21: Test slot 22: Test carrier 23: Test unit 24: Carrier 25: Moving assembly 3: Wafer placement area 31: Tray carrier mechanism 4: Transfer assembly 41: Pick-up and placement head 42: Spacing adjustment mechanism 43: Reciprocating mechanism for material removal 44: Horizontal movement mechanism 5: Shuttle movement assembly 51: Reciprocating mechanism 52: Shuttle carrier 53: Carrier fixture 531: Placement seat 532: Placement seat 6: Material transfer arm assembly 61: Suction head 62: Horizontal movement mechanism 63: Vertical movement mechanism 64: Material transfer movement mechanism 65: Support cantilever 66: Scanning moving mechanism 67: Scanning unit 7: Tray

FIG. 1 is a perspective view of the present invention.

FIG. 2 is a top view of the present invention.

FIG. 3 is an enlarged view of a partial test rack of the present invention.

FIG. 4 is a perspective view of the test carrier of the present invention being pushed out.

FIG. 5 is a three-dimensional diagram of the test carrier of the present invention located on the support plate.

FIG. 6 is a three-dimensional diagram of the chip placement area, transfer assembly and shuttle movement assembly of the present invention.

FIG. 7 is an enlarged three-dimensional view of the transfer assembly and the shuttle transfer assembly of the present invention.

FIG8 is a perspective view of the material transfer arm assembly of the present invention.

FIG. 9 is a partial enlarged view of the material transfer arm assembly of the present invention from another angle.

FIG. 10 is a plan view of the present invention in operation, where the chip is transferred between the chip placement area and the shuttle carrier.

FIG. 11 is a second plan view of the present invention in operation, where the shuttle carrier moves to the material transfer arm assembly.

FIG. 12 is a third plan view of the present invention in operation, where the test carrier of the test rack is extended.

FIG. 13 is a fourth plan view of the present invention in operation, where the suction head is moved to the test carrier.

1: Machine

2: Test rack

21: Test tank

22: Test the carrier board

3: Chip placement area

31: Pallet loading mechanism

4: Transfer assembly

41: Pick and place head

5: Shuttle moving assembly

51: Reciprocating mechanism

52: Shuttle carrier

53: Bearing fixture

6: Material transfer arm assembly

61: Suction head

7: Tray

Claims (9)

A stacking test device includes: a machine, a test rack, a chip placement area, a transfer assembly, a shuttle assembly and a material transfer arm assembly, wherein: the test rack is arranged on the machine, the test rack is provided with multiple test slots, the test slots are provided with an in-and-out test carrier, the test carrier is provided with a plurality of test units, and the test units are used to carry chips; the chip placement area is arranged on the machine at one side of the test rack; the shuttle assembly is arranged on the machine at one side of the chip placement area; the transfer assembly is arranged on the machine, and the transfer assembly is used to transfer chips between the chip placement area and the shuttle assembly; the material transfer arm assembly is arranged on the machine The material transfer arm assembly is used to transfer the chip between the shuttle moving assembly and the test unit, wherein the material transfer arm assembly is responsible for controlling a plurality of suction heads to move the chip between the lowest position and the test slot of the corresponding height on the test rack. The material transfer arm assembly also includes a horizontal moving mechanism, a vertical moving mechanism, a material transfer moving mechanism and a supporting cantilever. A plurality of the suction heads are fixed to the supporting cantilever, and the supporting cantilever is driven by the material transfer moving mechanism to move horizontally. The vertical moving mechanism is responsible for driving the material transfer moving mechanism to move to different height positions, and the horizontal moving mechanism is responsible for driving the vertical moving mechanism to move to the test slot positions of different longitudinal directions of the test rack. A stacking test device as described in claim 1, wherein a replaceable carrier plate is provided in the test slot, the carrier plate supports the test carrier, and a moving assembly is provided on the carrier plate to be connected to the test carrier, so that the test carrier is extended from the carrier plate or retracted onto the carrier plate when the moving assembly is actuated. A stacking test device as described in claim 1, wherein the chip placement area is provided with a plurality of tray supporting mechanisms for supporting trays, and the tray is used to place a plurality of chips. A stacking test device as described in claim 3, wherein the transfer assembly is responsible for controlling a plurality of pick-and-place heads to move between the chip placement area and the shuttle movement assembly, and the transfer assembly also includes a spacing adjustment mechanism, a material picking reciprocating mechanism and a lateral movement mechanism. A plurality of the pick-and-place heads are arranged on the spacing adjustment mechanism, and the spacing adjustment mechanism can adjust the spacing between adjacent pick-and-place heads. The material picking reciprocating mechanism is responsible for driving the spacing adjustment mechanism to move back and forth, and the lateral movement mechanism is responsible for driving the material picking reciprocating mechanism to move between a plurality of the tray carrying mechanisms and the shuttle movement assembly. A stacking test device as described in claim 4, wherein a plurality of the pick-and-place heads are arranged at the spacing adjustment mechanism in two rows, with a plurality of heads in each row. A stacking test device as described in claim 1, the shuttle moving assembly includes a reciprocating moving mechanism and a shuttle carrier, the shuttle carrier is provided with a plurality of supporting fixtures, the supporting fixture is provided with at least one placing seat, the placing seat is responsible for carrying the chip, and the reciprocating moving mechanism is responsible for driving the shuttle carrier to move between the material transfer arm assembly and the chip placement area. A stacking test device as described in claim 6, wherein a plurality of the supporting fixtures arranged side by side are provided on the shuttle carrier, and the supporting fixture is provided with two placing seats for supporting chips. A stacking test device as described in claim 1, wherein the suction heads are arranged in two rows, front and rear, with a plurality of suction heads in each row arranged in parallel on the supporting arm, and the suction heads in the front and rear rows are respectively used to suck the chips to be tested and the chips that have been tested. As described in claim 1, a stacking test device, the material moving mechanism is also equipped with a scanning moving mechanism and a scanning unit in the direction facing the test rack, the scanning moving mechanism is responsible for driving the scanning unit to move horizontally, and the scanning unit is used to scan the chip position on the test unit.