TWI816371B - Substrate and display device with partition wall - Google Patents

Abstract

A resin composition containing: a resin; an organic metal compound containing at least one metal selected from the group consisting of silver, gold, platinum and palladium; a photopolymerization initiator or a quinonediazide compound; and a solvent. The present invention provides a resin composition that can form a partition wall with both high reflectivity and high light-shielding properties even under heating conditions of 250° C. or below.

Description

Substrate and display device with partition wall

The present invention relates to a resin composition, a light-shielding film formed from the resin composition, a method for manufacturing the light-shielding film, and a substrate with partition walls having patterned partition walls.

Liquid crystal display devices, which are one type of image display devices, generally use white light sources such as light emitting diodes (LEDs) and color filters that selectively transmit red, green, and blue to perform color display. However, such color display using color filters has problems of poor light utilization efficiency and color reproducibility.

Therefore, as a color display device with improved light utilization efficiency, a color display device including a wavelength converting section including a wavelength converting phosphor, a polarization separation mechanism, and a polarization conversion mechanism has been proposed (for example, see Patent Document 1). For example, a color display device has been proposed that includes a blue light source, a liquid crystal element, and a wavelength converter including a phosphor that is excited by blue light and emits red phosphor, and a phosphor that is excited by blue light and emits green phosphor. A fluorescent phosphor and a light scattering layer that scatters blue light (for example, see Patent Document 2).

However, a color filter containing a color-converting phosphor as described in Patent Document 1 and Patent Document 2 generates fluorescence in all directions, so the light extraction efficiency is low and the brightness is insufficient. In particular, in high-definition display devices called 4K and 8K, the pixel size becomes smaller, so the issue of brightness is significant, and therefore higher brightness is required.

[Prior art documents]

[Patent Document]

Patent Document 1: Japanese Patent Application Laid-Open No. 2000-131683

Patent Document 2: Japanese Patent Application Publication No. 2009-244383

Patent Document 3: Japanese Patent Application Laid-Open No. 2000-347394

Patent Document 4: Japanese Patent Application Publication No. 2006-259421

In order to increase the brightness of the display device, it is effective to increase the reflectivity of the partition wall that separates the color-converting phosphors. In addition, in order to prevent light color mixing between adjacent pixels, the light-shielding property of the partition wall needs to be improved. Based on the above, there is a demand for partition wall materials that have both high reflectivity and light-shielding properties.

In order to form a partition wall with both high reflectivity and light-shielding properties, the inventors first studied a method of using a material in which a black pigment was added to a white partition wall material with high reflectivity. However, in this method, the light is absorbed by the white pigment and the black pigment during exposure, so that the light cannot reach the bottom of the film, and the problem of poor pattern processability becomes clear.

On the other hand, as described in Patent Document 3 and Patent Document 4, a technology has been proposed in which blackening is performed by adding a specific metal compound and sintering after pattern formation. However, these blackening technologies require calcination at 400°C or higher, and there is a problem that light-shielding properties are not improved by heating at 250°C or lower.

Therefore, an object of the present invention is to provide a resin composition that can form a partition wall having both high reflectivity and light-shielding properties even under heating conditions of 250° C. or lower.

The present invention is a resin composition containing: a resin; an organic metal compound containing at least one metal selected from the group consisting of silver, gold, platinum and palladium; a photopolymerization initiator or a quinonediazide compound; and solvent.

The resin composition of the present invention transmits light during the step of pattern exposure after film formation. However, since the light-shielding property is improved by heating the exposed film at a temperature of 120°C or more and 250°C or less, even at 250°C Under the following heating conditions, a fine thick-film barrier pattern with high reflectivity and high light-shielding properties can also be formed.

1: Base substrate

2:Separation wall

3: Pixel

3(CL-2): Pixels formed from color-changing luminescent material composition (CL-2)

3(CL-3): Pixel formed from color-changing luminescent material composition (CL-3)

4: Low refractive index layer

5: Inorganic protective layer I

6: Inorganic protective layer II

7: Color filter

8: Inorganic protective layer III and/or yellow organic protective layer

9: Inorganic protective layer IV and/or yellow organic protective layer

10:Light-shielding partition wall

11:Blue organic EL unit

H: Thickness of partition wall

L: width of partition wall

θ: cone angle

FIG. 1 is a cross-sectional view showing an aspect of a substrate with partition walls according to the present invention having patterned partition walls.

2 is a cross-sectional view showing an aspect of a substrate with isolation walls of the present invention having patterned isolation walls and pixels containing a color-changing luminescent material.

3 is a cross-sectional view showing an aspect of the substrate with partition walls of the present invention having a low refractive index layer.

4 is a cross-sectional view showing an aspect of the substrate with partition walls of the present invention having a low refractive index layer and an inorganic protective layer I.

5 is a cross-sectional view showing an aspect of the substrate with partition walls of the present invention having a low refractive index layer and an inorganic protective layer II.

FIG. 6 is a diagram showing a substrate with partition walls according to the present invention having a color filter; A cross-sectional view of the shape.

7 is a cross-sectional view showing an aspect of the substrate with partition walls of the present invention having a color filter, an inorganic protective layer III and/or a yellow organic protective layer.

8 is a cross-sectional view showing an aspect of the substrate with partition walls of the present invention having a color filter, an inorganic protective layer IV and/or a yellow organic protective layer.

9 is a cross-sectional view showing an aspect of the partition-walled substrate of the present invention having a light-shielding partition wall.

10 is a cross-sectional view showing the structure of a display device used for color mixture evaluation in the embodiment.

Hereinafter, preferred embodiments of the resin composition, the light-shielding film formed from the resin composition, the light-shielding film manufacturing method, and the substrate with partition walls of the present invention are specifically described. However, the present invention is not limited to the following embodiments. Various changes can be made to the purpose or use.

The resin composition of the present invention can be preferably used as a material for forming partition walls that separate color-changing phosphors. The resin composition of the present invention preferably contains: a resin; an organic metal compound containing at least one metal selected from the group consisting of silver, gold, platinum, and palladium (hereinafter, may be described as "organometallic compound") ; Photopolymerization initiator or quinonediazide compound; and solvent.

Resin has the function of improving the crack resistance and light resistance of the partition wall. From the viewpoint of improving the crack resistance of the partition wall during heat treatment, the content of the resin in the solid content of the resin composition is preferably 10% by weight or more, more preferably 20% by weight or more. superior. On the other hand, from the viewpoint of improving light resistance, the content of the resin in the solid content of the resin composition is preferably 60% by weight or less, more preferably 50% by weight or less. Here, the solid content refers to all the components contained in the resin composition excluding volatile components such as solvents. The amount of solid content can be determined by measuring the remaining components after heating the resin composition to evaporate the volatile components.

Examples of the resin include polysiloxane, polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, (meth)acrylic acid polymer, and the like. Here, the (meth)acrylic polymer refers to a polymer of methacrylate and/or acrylate. Two or more of these compounds may be contained. Among these, polysiloxane is preferred in terms of excellent transparency, heat resistance, and light resistance.

Polysiloxane is the hydrolysis of organosilane. Dehydration condensate. When the resin composition of the present invention has negative photosensitivity, the polysiloxane preferably contains at least a repeating unit represented by the following general formula (2). Other repeating units may also be further included. By containing a repeating unit derived from a bifunctional alkoxysilane compound represented by general formula (2), excessive thermal polymerization (condensation) of polysiloxane caused by heating can be suppressed, and the resistance of the partition wall can be improved. Crackability. Among all the repeating units in the polysiloxane, it is preferable to contain 10 mol% to 80 mol% of the repeating units represented by the general formula (2). By containing 10 mol% or more of the repeating unit represented by the general formula (2), the crack resistance can be further improved. The content of the repeating unit represented by the general formula (2) is more preferably 15 mol% or more, further preferably 20 mol% or more. On the other hand, by containing 80 mol% or less of the repeating unit represented by the general formula (2), the molecular weight of the polysiloxane can be sufficiently increased during polymerization, thereby improving the coatability. The content of the repeating unit represented by the general formula (2) is preferably 70 mol Ear% or less.

In the general formula (2), R ¹ and R ² may be the same or different, respectively, and represent a monovalent organic group having 1 to 20 carbon atoms. From the viewpoint of making it easy to adjust the molecular weight of polysiloxane during polymerization, R ¹ and R ² are preferably groups selected from an alkyl group having 1 to 6 carbon atoms and an aryl group having 6 to 12 carbon atoms. Among them, at least part of the hydrogens of the alkyl group and the aryl group may be substituted with a radically polymerizable group. In this case, in the cured material of the negative photosensitive resin composition, radical polymerizable groups can undergo radical polymerization.

When the resin composition of the present invention has negative photosensitivity, the polysiloxane preferably further contains a repeating unit selected from the group consisting of a repeating unit represented by the following general formula (3) and a unit represented by the following general formula (4) a repeating unit within a repeating unit. By containing a repeating unit derived from a fluorine-containing alkoxysilane compound represented by the general formula (3) or the general formula (4), the refractive index of the polysiloxane can be reduced. When a white pigment described below is contained , can expand the refractive index difference with white pigments, further improve interface reflection, and further increase reflectivity. More preferably, the polysiloxane contains a total of 20 mol% to 80 mol% of repeating units selected from the group consisting of repeating units represented by general formula (3) and repeating units represented by general formula (4). unit. By containing a repeating unit represented by the general formula (3) and a repeating unit represented by the general formula (4) at a total of 20 mol% or more, when the white pigment described below is contained, it can be carried out Step by step to improve the interface reflection between polysiloxane and white pigment, further increasing the reflectivity. The total content of the repeating unit represented by the general formula (3) and the repeating unit represented by the general formula (4) is more preferably 40 mol% or more. On the other hand, by containing a total of 80 mol% or less of the repeating unit represented by the general formula (3) and the repeating unit represented by the general formula (4), excessive hydrophobization of the polysiloxane can be suppressed, thereby improving the Compatibility with other ingredients in the composition to improve resolution. The total content of the repeating unit represented by the general formula (3) and the repeating unit represented by the general formula (4) is more preferably 70 mol% or less. Other repeating units may also be further included.

In the general formulas (3) and (4), R ³ represents an alkyl group, alkenyl group, aryl group or aralkyl group having 1 to 10 carbon atoms in which all or part of hydrogen is substituted with fluorine. R ⁴ represents a single bond, -O-, -CH ₂ -CO-, -CO- or -O-CO-. R ⁵ represents a monovalent organic group having 1 to 20 carbon atoms. From the viewpoint of further reducing the refractive index of polysiloxane, R ³ is preferably an alkyl group having 1 to 6 carbon atoms in which all or part of hydrogen is substituted with fluorine. Furthermore, in the photocured product of the negative photosensitive resin composition, the alkenyl group may undergo radical polymerization.

The repeating units represented by the general formulas (2) to (4) are respectively derived from alkoxysilane compounds represented by the following general formulas (5) to (7). That is, the polysiloxane containing the repeating units represented by the general formulas (2) to (4) can be obtained by converting the polysiloxane containing the following general formula (5) The alkoxysilane compound represented by ~(7) is obtained by subjecting the alkoxysilane compound to hydrolysis and polycondensation. Furthermore, other alkoxysilane compounds can also be used.

In the general formulas (5) to (7), R ¹ to R ⁵ respectively represent the same groups as R ¹ to R ⁵ in the general formulas (2) to (4). R ⁶ may be the same or different, and represents a monovalent organic group having 1 to 20 carbon atoms, preferably an alkyl group having 1 to 6 carbon atoms.

Examples of the alkoxysilane compound represented by the general formula (5) include dimethyldimethoxysilane, dimethyldiethoxysilane, ethylmethyldimethoxysilane, and methylpropane. Dimethoxysilane, methylpropyldiethoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, cyclohexylmethyldimethoxysilane, cyclohexylmethyldimethoxysilane Ethoxysilane, vinylmethyldimethoxysilane, vinylmethyldiethoxysilane, allylmethyldimethoxysilane, allylmethyldiethoxysilane, styryl Methyl dimethoxysilane, styrylmethyl diethoxysilane, γ-methacrylylpropylmethyldimethoxysilane, γ-methacrylylpropylmethyldiethoxysilane silane, γ-acrylylpropylmethyldimethoxysilane, γ-acrylylpropylmethyldiethoxysilane, 3-glycidyloxypropylmethyldimethoxysilane, 3 - Glycidol Oloxypropylmethyldiethoxysilane, 2-(3,4-epoxycyclohexyl)ethylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyl Ethyldimethoxysilane, 3-dimethylmethoxysilylpropylsuccinic anhydride, 3-dimethylethoxysilylpropylsuccinic anhydride, 3-dimethylmethoxysilane propionic acid, 3-dimethylethoxysilylpropionic acid, 3-dimethylmethoxysilylpropylcyclohexyldicarboxylic anhydride, 3-dimethylethoxysilylpropylcyclohexyldi Carboxylic anhydride, 5-dimethylmethoxysilylvaleric acid, 5-dimethylethoxysilylvaleric acid, 3-dimethylmethoxysilylpropylphthalic anhydride, 3-dimethyl Methylethoxysilylpropylphthalic anhydride, 4-dimethylmethoxysilylbutyric acid, 4-dimethylethoxysilylbutyric acid, etc. Two or more of these compounds may also be used.

Examples of the alkoxysilane compound represented by the general formula (6) include: trifluoropropyltrimethoxysilane, trifluoropropyltriethoxysilane, perfluoropentyltrimethoxysilane, and perfluoropentyl triethoxysilane, tridecafluorooctyltrimethoxysilane, tridecafluorooctyltriethoxysilane, tridecafluorooctyltripropoxysilane, tridecafluorooctyltriisopropoxysilane , Heptadecafluorodecyltrimethoxysilane, heptadecafluorodecyltriethoxysilane, etc. Two or more of these compounds may also be used.

Examples of the alkoxysilane compound represented by general formula (7) include bis(trifluoromethyl)dimethoxysilane, bis(trifluoropropyl)dimethoxysilane, and bis(trifluoropropyl)dimethoxysilane. )Diethoxysilane, trifluoropropylmethyldimethoxysilane, trifluoropropylmethyldiethoxysilane, trifluoropropylethyldimethoxysilane, trifluoropropylethyldimethoxysilane Ethoxysilane, heptadecafluorodecylmethyldimethoxysilane, etc. Two or more of these compounds may also be used.

Examples of other alkoxysilane compounds include: methyltrimethoxy Silane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, propyltrimethoxysilane, propyltriethoxysilane, isobutyltrimethoxysilane, isobutyl Triethoxysilane, cyclohexyltrimethoxysilane, cyclohexyltriethoxysilane, 3-isocyanatopropyltrimethoxysilane, 3-isocyanatopropyltriethoxysilane, 3-aminopropyltrimethyl Oxysilane, 3-aminopropyltriethoxysilane, 3-ureidopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane and other trifunctional alkoxysilane compounds; tetramethoxysilane Tetrafunctional alkoxysilane compounds such as silane, tetraethoxysilane, and silicate 51 (tetraethoxysilane oligomer); monofunctional silane compounds such as trimethylmethoxysilane and triphenylmethoxysilane Alkoxysilane compounds; 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxy silane, 2-(3,4-epoxycyclohexyl)ethyltriethoxysilane, 3-ethyl-3-{[3-(trimethoxysilyl)propoxy]methyl}oxy Hetetane, 3-ethyl-3-{[3-(triethoxysilyl)propoxy]methyl}oxetane and other alkanes containing epoxy or oxetanyl groups Oxysilane compounds; phenyltrimethoxysilane, phenyltriethoxysilane, 1-naphthyltrimethoxysilane, 2-naphthyltrimethoxysilane, tolyltrimethoxysilane, tolyltriethoxy Silane, 1-phenylethyltrimethoxysilane, 1-phenylethyltriethoxysilane, 2-phenylethyltrimethoxysilane, 2-phenylethyltriethoxysilane, 3 - Alkoxysilane compounds containing aromatic rings such as trimethoxysilylpropyl phthalic anhydride and 3-triethoxysilylpropyl phthalic anhydride; styryltrimethoxysilane, styrene Triethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, allyltrimethoxysilane, allyltriethoxysilane, γ-acrylylpropyltrimethoxysilane , γ-acrylylpropyltriethoxysilane, γ- Methacrylylpropyltrimethoxysilane, γ-methacrylpropyltriethoxysilane and other alkoxysilane compounds containing free radical polymerizable groups; 3-trimethoxysilylpropionic acid, 3-triethoxysilylpropionic acid, 4-trimethoxysilylbutyric acid, 4-triethoxysilylbutyric acid, 5-trimethoxysilylvaleric acid, 5-triethoxysilylbutyric acid Valeric acid, 3-trimethoxysilylpropylsuccinic anhydride, 3-triethoxysilylpropylsuccinic anhydride, 3-trimethoxysilylpropylcyclohexyldicarboxylic anhydride, 3-triethoxy Alkoxysilane compounds containing carboxyl groups such as silylpropylcyclohexyldicarboxylic anhydride, 3-trimethoxysilylpropylphthalic anhydride, and 3-triethoxysilylpropylphthalic anhydride. wait.

From the viewpoint of making the content of the repeating unit represented by the general formula (2) in all the repeating units of the polysiloxane fall within the above range, in the alkoxysilane compound that is the raw material of the polysiloxane, The content of the alkoxysilane compound represented by the general formula (5) is preferably 10 mol% or more, more preferably 15 mol% or more, and still more preferably 20 mol% or more. On the other hand, from the same viewpoint, the content of the alkoxysilane compound represented by the general formula (5) is preferably 80 mol% or less, more preferably 70 mol% or less. In addition, regarding the total content of the alkoxysilane compound represented by the general formula (6) and the general formula (7), the total content of the repeating units represented by the general formula (3) and the general formula (4) is From the viewpoint of being within the above range, it is preferably 20 mol% or more, and more preferably 40 mol% or more. On the other hand, from the same viewpoint, the total content of the alkoxysilane compound represented by the general formula (6) and the general formula (7) is preferably 80 mol% or less, more preferably 70 mol% or less. .

From the viewpoint of coatability, the weight average molecular weight (Mw) of polysiloxane is preferably 1,000 or more, more preferably 2,000 or more. On the other hand, from the perspective of developability Specifically speaking, the Mw of polysiloxane is preferably 50,000 or less, more preferably 20,000 or less. Here, the Mw of polysiloxane in the present invention refers to a polystyrene-converted value measured by gel permeation chromatography (GPC).

Polysiloxane can be obtained by hydrolyzing the organosilane compound and subjecting the hydrolyzate to a dehydration condensation reaction in the presence of a solvent or in the absence of a solvent.

Various conditions for hydrolysis can be set based on physical properties suitable for the intended use, taking into account the reaction scale, the size and shape of the reaction vessel, etc. Examples of various conditions include oxygen concentration, reaction temperature, reaction time, and the like.

Acid catalysts such as hydrochloric acid, acetic acid, formic acid, nitric acid, oxalic acid, sulfuric acid, phosphoric acid, polyphosphoric acid, polycarboxylic acid or its anhydride, and ion exchange resin can be used in the hydrolysis reaction. Among these, an acidic aqueous solution containing an acid selected from formic acid, acetic acid and phosphoric acid is preferred.

When an acid catalyst is used in the hydrolysis reaction, from the viewpoint of making the hydrolysis proceed more quickly, the amount of the acid catalyst added is preferably based on 100 parts by weight of all the alkoxysilane compounds used in the hydrolysis reaction. It is 0.05 part by weight or more, and more preferably it is 0.1 part by weight or more. On the other hand, from the viewpoint of appropriately adjusting the progress of the hydrolysis reaction, the amount of the acid catalyst added is preferably 20 parts by weight or less, more preferably 10 parts by weight or less based on 100 parts by weight of all the alkoxysilane compounds. . Here, the total amount of the alkoxysilane compound refers to the amount including all the alkoxysilane compounds, their hydrolysates and their condensates. Same as below.

The hydrolysis reaction can be carried out in a solvent. Consider the stability of the resin composition, The solvent should be selected based on its wettability and volatility.

When a solvent is generated by a hydrolysis reaction, hydrolysis may be performed without a solvent. When used in a resin composition, it is also preferable to further add a solvent after the hydrolysis reaction is completed, thereby adjusting the resin composition to an appropriate concentration. In addition, after hydrolysis, the total amount or a part of the alcohol etc. produced can also be distilled off and removed by heating and/or under reduced pressure, and then a suitable solvent can be added.

When a solvent is used in the hydrolysis reaction, from the viewpoint of suppressing the formation of gel, the amount of the solvent added is preferably 50 parts by weight or more, more preferably 80 parts by weight, based on 100 parts by weight of all the alkoxysilane compounds. parts by weight or more. On the other hand, from the viewpoint of making hydrolysis proceed more quickly, the added amount of the solvent is preferably 500 parts by weight or less, more preferably 200 parts by weight or less based on 100 parts by weight of all the alkoxysilane compounds.

In addition, the water used in the hydrolysis reaction is preferably ion-exchange water. The amount of water can be set arbitrarily, but is preferably 1.0 mol to 4.0 mol relative to 1 mol of all alkoxysilane compounds.

Examples of the dehydration condensation reaction method include a method of directly heating a silanol compound solution obtained by a hydrolysis reaction of an organosilane compound. The heating temperature is preferably above 50°C and below the boiling point of the solvent, and the heating time is preferably between 1 hour and 100 hours. In addition, in order to increase the degree of polymerization of polysiloxane, reheating or the addition of an alkali catalyst can also be performed. In addition, according to the purpose, after the dehydration and condensation reaction, an appropriate amount of the generated alcohol, etc. may be distilled off under heating and/or reduced pressure, and then a suitable solvent may be added.

From the viewpoint of the storage stability of the resin composition, it is preferable that the polysiloxane solution after hydrolysis and dehydration condensation does not contain the catalyst, and the catalyst may be removed if necessary. From the viewpoint of ease of operation and removability, water washing, treatment with an ion exchange resin, etc. are preferred as the catalyst removal method. The so-called water washing refers to a method of diluting the polysiloxane solution with an appropriate hydrophobic solvent, washing it with water several times, and then concentrating the obtained organic layer using an evaporator or the like. Treatment with an ion exchange resin refers to a method of bringing a polysiloxane solution into contact with an appropriate ion exchange resin.

The organic metal compound is decomposed during the exposure step and/or the heating step when forming the pattern of the partition wall (A-1) described below. The particles aggregate to form black particles or yellow particles and have the function of increasing the optical density (OD) value of the partition wall (A-1) described below. Since the OD value is low before exposure and increases after pattern formation, the post-exposure light can be fully transmitted to the bottom during the exposure step for photohardening or photodecomposition. For example, in the case of a resin composition having negative photosensitivity, if a resin composition containing a large amount of black pigment is used for pattern formation in advance in order to form the partition wall (A-1) with a high OD value, the photocuring of the bottom will be easy become inadequate. As a result, the shape of the resulting partition wall (A-1) tends to become an inverse taper. If the resin composition of the present invention containing the organic metal compound is used for pattern formation, it can be sufficiently photocured to the bottom, so the taper angle can be easily set within a preferable range described below.

Examples of the organic metal compounds include silver-containing organic metal compounds such as silver neodecanoate, silver octoate, and silver salicylate; gold-containing organic metal compounds such as chloro(triphenylphosphine)gold and tetrachloroauric acid tetrahydrate. Metal compounds; bis(acetylacetone)platinum, dichlorobis(trifluoroethylene) Phenylphosphine) platinum, dichlorobis(benzonitrile) platinum and other organic metal compounds containing platinum; bis(acetyl acetone) palladium, dichlorobis(triphenylphosphine) palladium, dichlorobis(benzonitrile) palladium, Organic metal compounds containing palladium such as tetrakis(triphenylphosphine)palladium, dibenzylideneacetone palladium, etc. Two or more of these compounds may be contained.

Among them, if they contain organic metal compounds containing silver such as silver neodecanoate, silver octoate, silver salicylate, etc., they will be decomposed during the exposure step. It condenses and turns black, and is further decomposed in the subsequent heating step. Condensed and yellowed.

On the other hand, if it contains platinum-containing organic metal compounds such as bis(acetylacetone)platinum, dichlorobis(triphenylphosphine)platinum, dichlorobis(benzonitrile)platinum; bis(acetylacetylacetone)palladium, dichlorobis(benzonitrile)platinum Organometallic compounds selected from palladium such as chlorobis(triphenylphosphine)palladium, dichlorobis(benzonitrile)palladium, tetrakis(triphenylphosphine)palladium, dibenzylideneacetonepalladium, etc., are used in the exposure step and/or By decomposition in the heating step. Condensed and blackened.

Among these, from the viewpoint of further increasing the OD value, it is preferable to be selected from the group consisting of bis(acetyl acetone) palladium, dichlorobis(triphenylphosphine) palladium, dichlorobis(benzonitrile) palladium and tetrakis(triphenyl phosphine) palladium. Organometallic compounds in phenylphosphine) palladium.

In the resin composition of the present invention, the content of the organic metal compound in the solid content is preferably 0.2% to 5% by weight. By setting the content of the organic metal compound to 0.2% by weight or more, the OD value of the obtained partition wall can be further increased. The content of the organic metal compound is more preferably 1.5% by weight or more. On the other hand, by setting the content of the organic metal compound to 5% by weight or less, the reflectance can be further improved.

When the resin composition of the present invention is used for pattern formation of partition walls (A-1) described below, it is preferred that the resin composition has negative or positive photosensitivity. To impart negative photosensitivity In the case of , it is preferable to contain a photopolymerization initiator so that a high-definition pattern-shaped partition wall can be formed. The negative photosensitive resin composition preferably further contains a photopolymerizable compound. On the other hand, when imparting positive photosensitivity, it is preferable to contain a quinonediazide compound.

The photopolymerization initiator may be any photoradical polymerization initiator as long as it decomposes and/or reacts by irradiation with light (including ultraviolet rays and electron beams) to generate free radicals. Examples include: 2-methyl-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-dimethylamino-2-(4-methylbenzyl) -1-(4-morpholin-4-yl-phenyl)-butan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan α-aminophenylalkyl ketone compounds such as ketone-1; 2,4,6-trimethylbenzylphenylphosphine oxide, bis(2,4,6-trimethylbenzylphenyl)-benzene 1-Phenyl-1, 2-propanedione-2-(O-ethoxycarbonyl)oxime, 1,2-octanedione-1-[4-(phenylthio)-2-(O-benzoyloxime)], 1-phenyl-1,2-butanone-2-(O-methoxycarbonyl)oxime, 1,3-diphenylpropanetrione-2-(O-ethoxycarbonyl)oxime, ethanone- 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-1-(O-acetyl oxime) and other oxime ester compounds; benzyl dimethyl benzyl ketal compounds such as methyl ketal; 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropane -α-hydroxyketone compounds such as 1-one, 4-(2-hydroxyethoxy)phenyl-(2-hydroxy-2-propyl)one, 1-hydroxycyclohexyl-phenylketone; benzophenone , 4,4-bis(dimethylamino)benzophenone, 4,4-bis(diethylamino)benzophenone, methyl o-phenylbenzoate, 4-phenyldi Benzophenone, 4,4-dichlorobenzophenone, hydroxybenzophenone, 4-benzoyl-4'-methyl-diphenyl sulfide, alkylated benzophenone, 3, 3',4,4'-tetrakis(tert-butylperoxycarbonyl)benzophenone Other benzophenone compounds; 2,2-diethoxyacetophenone, 2,3-diethoxyacetophenone, 4-tert-butyldichloroacetophenone, benzylideneacetophenone , 4-azidobenzylideneacetophenone and other acetophenone compounds; 2-phenyl-2-oxyacetic acid methyl ester and other aromatic ketone ester compounds; 4-dimethylaminobenzoic acid ethyl ester, 4 - Benzoate compounds such as (2-ethyl)hexyl dimethylaminobenzoate, ethyl 4-diethylaminobenzoate, and methyl 2-benzoylbenzoate. Two or more of these compounds may be contained.

From the viewpoint of effectively performing radical curing, the content of the photopolymerization initiator in the resin composition of the present invention is preferably 0.01% by weight or more, and more preferably 1% by weight or more based on the solid content. On the other hand, from the viewpoint of suppressing elution of the remaining photopolymerization initiator and further increasing yellowing, the content of the photopolymerization initiator in the solid content is preferably 20% by weight or less, more preferably 10% by weight. weight% or less.

The photopolymerizable compound in the present invention refers to a compound having two or more ethylenically unsaturated double bonds in the molecule. In consideration of ease of radical polymerization, the photopolymerizable compound preferably has a (meth)acrylic acid group.

Examples of the photopolymerizable compound include: diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, diethylene glycol dimethacrylate, and triethylene glycol dimethyl acrylate, tetraethylene glycol dimethacrylate, trimethylolpropane diacrylate, trimethylolpropane triacrylate, trimethylolpropane dimethacrylate, trimethylolpropane trimethylacrylate acrylate, 1,3-butanediol diacrylate, 1,3-butanediol dimethacrylate, neopentyl glycol diacrylate, 1,4-butanediol diacrylate, 1,4 -Butanediol dimethacrylate, 1,6-hexanediol diacrylate, 1,9-nonanediol dimethacrylate, 1,10-decanediol dimethacrylate, Dimethylol-tricyclodecane diacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, pentaerythritol trimethacrylate, pentaerythritol tetramethacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, trisacrylate Pentaerythritol heptaacrylate, tripentaerythritol octaacrylate, pentaerythritol nonacrylate, pentaerythritol tenacrylate, pentaerythritol undecyl acrylate, pentaerythritol dodecacrylate, tripentaerythritol heptamethacrylate, tripentaerythritol octaacrylate Acrylate, pentaerythritol nona methacrylate, pentaerythritol ten methacrylate, pentaerythritol undeca methacrylate, pentaerythritol dodeca methacrylate, dimethylol-tricyclodecane diacrylate, etc. . Two or more of these compounds may be contained.

From the viewpoint of effectively performing radical curing, the content of the photopolymerizable compound in the resin composition of the present invention is preferably 1% by weight or more based on the solid content. On the other hand, from the viewpoint of suppressing excess reaction of radicals and improving resolution, the content of the photopolymerizable compound in the solid content is preferably 40% by weight or less.

As the quinonediazide compound, a compound in which a sulfonic acid of quinonediazide is bonded to a compound having a phenolic hydroxyl group via an ester is preferred. Examples of the compound having a phenolic hydroxyl group used here include BIs-Z, TekP-4HBPA (tetraP-DO-BPA), TrIsP-HAP, TrIsP-PA, BIsRS-2P, and BIsRS-3P (the above are commercial products). name, manufactured by Honshu Chemical Industry Co., Ltd.), BIR-PC, BIR-PTBP, BIR-BIPC-F (the above are trade names, manufactured by Asahi Organic Materials Industry Co., Ltd.), 4,4'-sulfonyldiphenol , BPFL (trade name, manufactured by JFE Chemical Co., Ltd.), etc. The quinonediazide compound is preferably a compound in which 4-naphthoquinonediazide sulfonic acid or 5-naphthoquinonediazide sulfonic acid is introduced via an ester bond into a compound having a phenolic hydroxyl group. Examples thereof include THP. -17、TDF- 517 (trade name, manufactured by Toyo Gosei Industry Co., Ltd.), SBF-525 (trade name, manufactured by AZ Electronic Materials Co., Ltd.), etc.

From the viewpoint of improving sensitivity, the content of the quinonediazide compound in the resin composition of the present invention is preferably 0.5% by weight or more in solid content, more preferably 1% by weight or more. On the other hand, from the viewpoint of improving resolution, the content of the quinonediazide compound in the solid content is preferably 25% by weight or less, more preferably 20% by weight or less.

The solvent has the function of adjusting the viscosity of the resin composition to a range suitable for coating and improving the uniformity of the partition wall. As a solvent, it is preferable to combine the solvent whose boiling point under atmospheric pressure exceeds 150 degreeC and 250 degreeC or less, and the solvent which is 150 degreeC or less.

Examples of the solvent include: alcohols such as ethanol, propanol, isopropyl alcohol, and diacetone alcohol; glycols such as ethylene glycol and propylene glycol; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, and propylene glycol monomethyl ether. , propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether and other ethers; methyl ethyl ketone, acetylacetone, methyl propyl ketone, methyl butyl ketone, methyl isobutyl ketone, diisobutyl ketone Ketones such as base ketone and cyclopentanone; amides such as dimethylformamide and dimethylacetamide; ethyl acetate, propyl acetate, butyl acetate, isobutyl acetate, and ethylene glycol monoethyl ether Acetate, propylene glycol monomethyl ether acetate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, methyl lactate, ethyl lactate, butyl lactate and other acetate esters ; Toluene, xylene, hexane, cyclohexane and other aromatic or aliphatic hydrocarbons, γ-butyrolactone, N-methyl-2-pyrrolidone, dimethyl sulfoxide, etc. Two or more of these compounds may be contained. Among these, from the viewpoint of coatability, it is preferable to combine diacetone alcohol, which is a solvent having a boiling point under atmospheric pressure exceeding 150°C and 250°C or lower, and diacetone alcohol, which is a solvent having a boiling point of 150°C or lower. Propylene glycol monomethyl ether as solvent.

The content of the solvent can be set arbitrarily according to the coating method, etc. For example, when forming a film by spin coating, the content of the solvent in the resin composition is generally set to 50% by weight or more and 95% by weight or less.

The resin composition of the present invention preferably further contains a coordination compound having a phosphorus atom (hereinafter, may be described as a "coordination compound"). The coordination compound coordinates with the organic metal compound in the resin composition, improves the solubility of the organic metal compound in the solvent, promotes the decomposition of the organic metal compound, and can further increase the OD value of the obtained partition wall. Examples of the coordination compound include triphenylphosphine, tri-tert-butylphosphine, trimethylphosphine, tricyclohexylphosphine, tri-tert-butylphosphine tetrafluoroborate, tris(2-furyl ) phosphine, tris(1-adamantyl)phosphine, tris(diethylamino)phosphine, tris(4-methoxyphenyl)phosphine, tris(O-tolyl)phosphine, etc. Two or more of these compounds may be contained. Relative to the organometallic compound, the content of the coordination compound in the resin composition of the present invention is preferably 0.5 molar equivalent to 3.0 molar equivalent.

The resin composition of the present invention preferably further contains a white pigment and/or a black pigment. The white pigment has the function of further improving the reflectivity of the partition wall. Black pigment has the function of adjusting the OD value.

Examples of white pigments include titanium dioxide, zirconium oxide, zinc oxide, barium sulfate, and composite compounds of these. Two or more of these compounds may be contained. Among these, titanium dioxide has high reflectivity and is easily industrially utilized.

The crystal structure of titanium dioxide is divided into anatase type, rutile type and brookite type. Among these, rutile titanium oxide is preferable in terms of low photocatalytic activity.

Surface treatment of white pigments is also possible. It is preferable to use a metal selected from Al, Si and Zr for surface treatment, which can improve the light resistance and heat resistance of the formed partition wall.

From the viewpoint of further improving the reflectance of the partition wall, the median particle diameter of the white pigment is preferably 100 nm to 500 nm. Here, the median particle diameter of the white pigment can be calculated from the particle size distribution measured by the laser diffraction method using a particle size distribution measuring device (N4-PLUS; manufactured by Beckman Coulter Co., Ltd.) or the like. .

Examples of titanium dioxide pigments that can be preferably used as white pigments include: R960; manufactured by DuPont Co., Ltd. (rutile type, SiO ₂ /Al ₂ O ₃ treatment, average primary particle diameter 210 nm), CR-97; Ishihara Sangyo Co., Ltd. (rutile type, Al ₂ O ₃ /ZrO ₂ treatment, average primary particle size 250 nm), JR-301; manufactured by Tayca Co., Ltd. (rutile type, Al ₂ O ₃ treatment, average Primary particle size 300 nm), JR-405; manufactured by Tayca Co., Ltd. (rutile type, Al ₂ O ₃ treatment, average primary particle size 210 nm), JR-600A; manufactured by Tayca Co., Ltd. ( Rutile type, Al ₂ O ₃ treatment, average primary particle size 250 nm), JR-603; Tayca (Rutile type, Al ₂ O ₃ /ZrO ₂ treatment, average primary particle size 280 nm), etc. . Two or more of these compounds may be contained.

From the viewpoint of further improving the reflectance, the content of the white pigment in the resin composition is preferably 20% by weight or more of the solid content, more preferably 30% by weight or more. On the other hand, from the viewpoint of improving the surface smoothness of the partition wall, the content of the white pigment is preferably 60% by weight or less of the solid content, more preferably 55% by weight or less.

Examples of the black pigment include black organic pigments, mixed color organic pigments, black inorganic pigments, and the like.

Examples of black organic pigments include carbon black, perylene black, aniline black, and benzofuranone-based pigments. These can also be coated with resin.

Examples of mixed-color organic pigments include those in which two or more pigments selected from the group consisting of red, blue, green, violet, yellow, magenta, cyan, etc. are mixed to simulate blackening. Among these, a mixed pigment of a red pigment and a blue pigment is preferable from the viewpoint of having both a moderately high OD value and pattern processability. The weight ratio of the red pigment and the blue pigment in the mixed pigment is preferably 20/80~80/20, and more preferably 30/70~70/30. If specific examples of representative pigments are represented by color index (color index, CI) numbers, the following examples can be cited. Examples of red pigments include: Pigment Red (hereinafter referred to as PR) 9, PR48, PR97, PR122, PR123, PR144, PR149, PR166, PR168, PR177, PR179, PR180, PR192, PR209, PR215, PR216, PR217, PR220, PR223, PR224, PR226, PR227, PR228, PR240, PR254, etc. Two or more of these compounds may be contained. Examples of the blue pigment include pigment blue (hereinafter referred to as PB) 15, PB15:3, PB15:4, PB15:6, PB22, PB60, PB64, and the like. Two or more of these compounds may be contained.

Examples of black inorganic pigments include: graphite; fine particles of metals such as titanium, copper, iron, manganese, cobalt, chromium, nickel, zinc, calcium, silver, gold, platinum, and palladium; metal oxides; metal composite oxides; Metal sulfides; metal nitrides; metal oxynitrides; metal carbides, etc. Two or more of these compounds may be contained.

Among the above black pigments, in terms of having high light-shielding properties, it is preferable to be selected from titanium nitride, zirconium nitride, carbon black, and the weight ratio of red pigments to blue pigments is 20/80~80/ 20's of pigments in the mix. Furthermore, from the viewpoint of easily adjusting the taper angle of the partition wall (A-1) within a preferable range described below, it is more preferably selected from the group consisting of titanium nitride, zirconium nitride, and red and blue pigments. Pigments in mixed pigments with a weight ratio of 20/80~80/20.

From the viewpoint of adjusting the reflectance and OD to the above ranges to further suppress light color mixing in adjacent pixels, the content of the black pigment in the resin composition is preferably 0.01% by weight or more of the solid content, more preferably 0.05% by weight or more. On the other hand, from the viewpoint of adjusting the reflectance and OD to the above ranges, the content of the black pigment is preferably 5% by weight or less of the solid content, more preferably 3% by weight or less.

The resin composition of the present invention preferably further contains a photobase generator. By containing a photobase generator, a base is generated during the exposure step to promote the decomposition of the organic metal compounds in the resin composition. agglomeration, so the organic metal compound can be converted into black particles or yellow particles more efficiently, and the OD value of the obtained partition wall can be further increased.

The photobase generator may be any photobase generator as long as it is decomposed and/or reacted by irradiation with light (including ultraviolet rays and electron beams) to generate a base. Examples include: 2-(9-oxanthene-2-yl)propionic acid 1,5,7-triazacyclo[4,4,0]dec-5-ene, N-cyclohexylcarbamic acid 1 -(Anthraquinone-2-yl)ethyl, 9-anthracenylmethyl N,N-diethylcarbamate, 9-anthracenylmethyl N-cyclohexylcarbamate, 9-anthracene 1-carboxylate Methylpiperidine, 9-anthracenylmethyl N,N-dicyclohexylcarbamate, 1-(anthraquinone-2-yl)ethyl N,N-dicyclohexylcarbamate, cyclohexyl propionate Ammonium-(3-benzoylphenyl), butyltriphenylboronic acid 1,2-dicyclohexyl-4,4,5,5-tetramethylbiguanide, 2-(3-benzylphenyl)propionate 1,2-diisopropyl-3-[bis(di Methylamino)methylene]guanidine, (2-nitrophenyl)methyl 4-hydroxypiperidine-1-carboxylic acid, 2-(3-benzoylphenyl)guanidine propionate, etc. Two or more of these compounds may also be used.

From the viewpoint of further improving the OD value, the content of the photobase generator in the resin composition of the present invention is preferably 0.5% by weight or more of the solid content. On the other hand, from the viewpoint of improving resolution, the content of the photobase generator is preferably 2.0% by weight or less of the solid content.

The resin composition of the present invention may also contain a liquid-repellent compound. The liquid-repellent compound refers to a compound that imparts properties (liquid-repellent performance) to the resin composition to repel water or organic solvents. It is not particularly limited as long as it is a compound having the properties described above. Specifically, a compound having a fluoroalkyl group can be preferably used. By containing a liquid-proof compound, after the partition wall (A-1) is formed, the top of the partition wall can be given liquid-proof properties. Thereby, for example, when forming (B) pixels containing a color-converting luminescent material described later, color-converting luminescent materials with different compositions can be easily applied to each pixel.

Examples of liquid-proof compounds include 1,1,2,2-tetrafluorooctyl (1,1,2,2-tetrafluoropropyl) ether and 1,1,2,2-tetrafluorooctylhexane Ether, octaethylene glycol di(1,1,2,2-tetrafluorobutyl) ether, hexaethylene glycol (1,1,2,2,3,3-hexafluoropentyl) ether, octapropylene glycol di(1,1,2,2,3-hexafluoropentyl) ether (1,1,2,2-tetrafluorobutyl) ether, hexapropylene glycol di(1,1,2,2,3,3-hexafluoropentyl) ether, sodium perfluorodecanesulfonate, 1 ,1,2,2,8,8,9,9,10,10-decafluorodecane, 1,1,2,2,3,3-hexafluorodecane, N-[3-(perfluorodecane Octanesulfonamide)propyl]-N,N'-dimethyl-N-carboxymethylene ammonium betaine, perfluoroalkylsulfonamide propyltrimethylammonium salt, perfluoroalkyl-N- Ethyl sulfonylglycinate, Bis(N-perfluorooctylsulfonyl-N-ethylaminoethyl) phosphate, monoperfluoroalkyl ethyl phosphate, etc. have fluoroalkyl or fluoroalkyl groups at the terminal, main chain and side chain compounds, etc. In addition, commercially available liquid-repellent compounds include: "Megafac" (registered trademark) F142D, F172, F173, F183, F444, and F477 (the above are manufactured by Dainippon Ink Chemical Industry Co., Ltd.), Ai Eftop EF301, 303, 352 (manufactured by Shin-Akita Chemical Co., Ltd.), Fluorad FC-430, FC-431 (manufactured by Sumitomo 3M Co., Ltd.), "Asahi Guard" )" (registered trademark) AG710, "Surflon" (registered trademark) S-382, SC-101, SC-102, SC-103, SC-104, SC-105, SC-106 (Asahi Glass ( Co., Ltd.), BM-1000, BM-1100 (manufactured by Yushang Co., Ltd.), NBX-15, FTX-218, DFX-18 (manufactured by Neos Co., Ltd.), etc. Two or more of these compounds may be contained. Among these, resins having a photopolymerizable group are more preferred in terms of high reactivity and the ability to form a strong bond with the resin. Examples of the liquid-repellent compound having a fluorine atom and a photopolymerizable group include "Megafac" (registered trademark) RS-76-E, RS-56, RS-72-k, RS-75, RS- 76-E, RS-76-NS, RS-76, RS-90 (the above are trade names, manufactured by DIC Corporation), etc. Furthermore, in this case, the photopolymerizable group can be photopolymerized in the partition wall (A-1) composed of the photocured material of the negative photosensitive resin composition.

From the viewpoint of improving the liquid-repellent performance of the partition wall and improving the inkjet coatability, the content of the liquid-repellent compound in the resin composition is preferably 0.01% by weight or more of the solid content, more preferably 0.1% by weight or more. On the other hand, from the viewpoint of improving compatibility with resin or white pigment, the content of the liquid-repellent compound is preferably 10% by weight or less of the solid content, more preferably 5% by weight or less.

In addition, the resin composition of the present invention may contain an ultraviolet absorber, a polymerization inhibitor, a surfactant, an adhesion improving agent, etc. as needed.

By containing an ultraviolet absorber in the resin composition of the present invention, the light resistance can be improved and the resolution can be further improved. As the ultraviolet absorber, from the viewpoint of transparency and non-coloring properties, 2-(2H-benzotriazol-2-yl)phenol and 2-(2H-benzotriazol-2-yl) are preferably used. )-4,6-tertiary amylphenol, 2-(2H benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol, 2(2H-benzene Triazol-2-yl)-6-dodecyl-4-methylphenol, 2-(2'-hydroxy-5'-methacryloyloxyethylphenyl)-2H-benzotriazole Benzotriazole compounds such as azole; benzophenone compounds such as 2-hydroxy-4-methoxybenzophenone; 2-(4,6-diphenyl-1,3,5triazine-2 Triazine compounds such as -yl)-5-[(hexyl)oxy]-phenol, etc.

By containing a polymerization inhibitor in the resin composition of the present invention, the resolution can be further improved. Examples of the polymerization inhibitor include di-tert-butylhydroxytoluene, butylhydroxyanisole, hydroquinone, 4-methoxyphenol, 1,4-benzoquinone, and tert-butylcatechu. phenol. In addition, examples of commercially available polymerization inhibitors include "IRGANOX" (registered trademark) 1010, 1035, 1076, 1098, 1135, 1330, 1726, 1425, 1520, 245, 259, 3114, 565, 295 (the above are trade names, manufactured by Japan BASF Co., Ltd.), etc. Two or more of these compounds may be contained.

By containing a surfactant in the resin composition of the present invention, the fluidity during coating can be improved. Examples of surfactants include "Megafac" (registered trademark) F142D, F172, F173, F183, F445, F470, F475, and F477 (The above are trade names, manufactured by Dainippon Ink Chemical Industry Co., Ltd.), NBX-15, FTX-218 (the above are trade names, manufactured by Neos Co., Ltd.) and other fluorine-based surfactants; Silicone surfactants such as BYK (registered trademark) F-333, 301, 331, 345, 307 (the above are trade names, manufactured by BYK-Chemie Japan (Co., Ltd.)); poly Alkylene oxide surfactants; poly(meth)acrylate surfactants, etc. Two or more of these compounds may be contained.

Since the resin composition of the present invention contains an adhesion improving agent, the adhesion to the base substrate is improved, and a highly reliable partition wall can be obtained. Examples of the adhesion improving agent include alicyclic epoxy compounds, silane coupling agents, and the like. Among these, alicyclic epoxy compounds have high heat resistance and can further suppress color change after heating.

Examples of alicyclic epoxy compounds include: 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 2,2-bis(hydroxymethyl) -1,2-epoxy-4-(2-oxiranyl)cyclohexane adduct of 1-butanol, ε-caprolactone modified 3',4'-epoxycyclohexyl Methyl 3',4'-epoxycyclohexanecarboxylate, 1,2-epoxy-4-vinylcyclohexane, butanetetracarboxylic acid tetrakis(3,4-epoxycyclohexyl Methyl) modified ε-caprolactone, 3,4-epoxycyclohexyl methyl methacrylate, hydrogenated bisphenol A diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, hydrogenated bisphenol E diglycidyl ether Ether, hydrogenated bisphenol A bis(propylene glycol glycidyl ether) ether, hydrogenated bisphenol A bis(ethylene glycol glycidyl ether) ether, 1,4-cyclohexanedicarboxylic acid diglycidyl ester, 1,4-cyclohexanedicarboxylic acid diglycidyl ether Hexane dimethanol diglycidyl ether, etc. Two or more of these compounds may be contained.

From the viewpoint of further improving the adhesiveness with the base substrate, the content of the adhesiveness improving agent in the resin composition of the present invention is preferably 0.1% by weight in the solid content. % by weight or more, more preferably 1% by weight or more. On the other hand, from the viewpoint of further suppressing color change due to heating, the content of the adhesion improving agent is preferably 20% by weight or less in the solid content, more preferably 10% by weight or less.

The resin composition of the present invention can be produced, for example, by mixing the resin, an organic metal compound, a photopolymerization initiator or a quinonediazide compound, a solvent, and other optional components.

Next, the light-shielding film of the present invention will be described. The light-shielding film of the present invention is obtained by curing the resin composition of the present invention. The light-shielding film of the present invention can be preferably used as a light-shielding film in a One Glass Solution (OGS) type touch panel, such as a decorative pattern covering a base material, in addition to the partition wall (A-1) described below. pattern. The film thickness of the light-shielding film is preferably 10 μm or more.

Next, the manufacturing method of the light-shielding film of this invention is demonstrated using an example. The manufacturing method of the light-shielding film of the present invention preferably includes: a film forming step, coating the resin composition of the present invention on a base substrate and drying to obtain a dry film; an exposure step, subjecting the obtained dry film to pattern exposure; and a developing step. , dissolving and removing the portion of the exposed dry film that is soluble in the developer; and a heating step, hardening the developed dry film by heating it.

The method of manufacturing a light-shielding film of the present invention is characterized in that, in the heating step, the developed film is heated at a temperature of 120°C or more and 250°C or less, so that the OD value per 10 μm of film thickness is increased by 0.3 or more. From the viewpoint of further increasing the OD value, the heating temperature in the heating step is preferably 150°C or higher, more preferably 180°C or higher. From the viewpoint of suppressing the occurrence of cracks in the heated film, the heating temperature during the heating step The temperature is preferably 250°C or lower, more preferably 240°C or lower. The preferred heating time is 15 minutes to 2 hours. The film formed from the resin composition of the present invention has a low OD value during exposure, and the OD value increases after pattern formation. Therefore, by fully photohardening it to the bottom during the exposure step, isolation with a better taper angle described later can be obtained. wall. In addition, since the OD value after pattern formation is high, a partition wall having both high reflectivity and light-shielding properties can be obtained.

Examples of the coating method of the resin composition in the film forming step include slit coating, spin coating, and the like. Examples of the drying device include a hot air oven and a heating plate. The preferred drying temperature is 80°C to 120°C, and the preferred drying time is 1 minute to 15 minutes.

The exposure step is a step in which necessary parts of the dry film are photohardened by exposure, or unnecessary parts of the dry film are photodecomposed to make any part of the dry film soluble in the developer. In the exposure step, exposure can be performed through a mask having a predetermined opening, or an arbitrary pattern can be directly drawn using a laser or the like without using a mask.

Examples of the exposure device include a proximity exposure machine. Examples of active rays irradiated in the exposure step include near-infrared rays, visible rays, and ultraviolet rays, and ultraviolet rays are preferred. Examples of ultraviolet light sources include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, halogen lamps, germicidal lamps, and the like. However, ultra-high-pressure mercury lamps are preferred.

Exposure conditions can be appropriately selected according to the thickness of the exposed dry film. Generally, it is better to use an ultra-high-pressure mercury lamp with an output power of 1W/cm ² ~100mW/cm ² and perform exposure at an exposure dose of 1mJ/cm ² ~10,000mJ/cm ² .

The development step is to dissolve and remove the portion of the exposed dry film that is soluble in the developer by using the developer to obtain a dry film patterned into an arbitrary pattern shape in which only the portion insoluble in the developer remains (hereinafter referred to as pattern before heating). Examples of pattern shapes include grid-like shapes, striped shapes, and the like.

Examples of the development method include a dipping method, a spray method, a brush method, and the like.

As the developer, a solvent that can dissolve unnecessary parts of the dried film after exposure can be appropriately selected, and an aqueous solution containing water as the main component is preferred. For example, when the resin composition contains a polymer having a carboxyl group, an alkali aqueous solution is preferred as the developer. Examples of alkali aqueous solutions include inorganic alkali aqueous solutions such as sodium hydroxide, potassium hydroxide, sodium carbonate, and calcium hydroxide; organic alkali solutions such as tetramethylammonium hydroxide, trimethylbenzyl ammonium hydroxide, monoethanolamine, and diethanolamine; Alkaline aqueous solution, etc. Among these, from the viewpoint of improving resolution, a potassium hydroxide aqueous solution or a tetramethylammonium hydroxide aqueous solution is preferred. From the viewpoint of improving developability, the concentration of the alkali aqueous solution is preferably 0.05% by weight or more, more preferably 0.1% by weight or more. On the other hand, from the viewpoint of suppressing peeling or corrosion of the pattern before heating, the concentration of the alkali aqueous solution is preferably 5% by weight or less, more preferably 1% by weight or less. In order to facilitate step management, the development temperature is preferably 20°C to 50°C.

The heating step is a step of heating and hardening the pre-heated pattern formed in the development step. Examples of the heating device include a hot plate, an oven, and the like. The preferred heating temperature and heating time are as described above.

Next, the substrate with partition walls of the present invention will be described. The substrate with partitions of the present invention has (A-1) patterned partitions (hereinafter, sometimes referred to as “partitions (A-1)”) on a base substrate. The base substrate has as a Function of the support in the substrate. When the partition wall contains a pixel of a color-converting luminescent material described below, it has the function of suppressing color mixing of light between adjacent pixels.

In the substrate with an isolation wall of the present invention, the isolation wall (A-1) is characterized by a reflectance of 20% to 60% per 10 μm of thickness at a wavelength of 550 nm, and an OD value of 1.0 to 3.0 per 10 μm of thickness. By setting the reflectivity to 20% or more and the OD value to 3.0 or less, the brightness of the display device can be improved by utilizing the reflection from the side of the (A-1) partition wall. On the other hand, by setting the reflectance to 60% or less and the OD value to 1.0 or more, it is possible to suppress the light transmitted through the partition wall (A-1) and suppress the color mixing of light between adjacent pixels.

FIG. 1 shows a cross-sectional view of an aspect of a substrate with isolation walls of the present invention having patterned isolation walls. There is a patterned isolation wall 2 on the base substrate 1 .

<Base substrate>

Examples of the base substrate include a glass plate, a resin plate, a resin film, and the like. As the material of the glass plate, alkali-free glass is preferred. As the material of the resin plate and the resin film, polyester, (meth)acrylic polymer, transparent polyimide, polyether styrene, etc. are preferred. The thickness of the glass plate and the resin plate is preferably 1 mm or less, more preferably 0.8 mm or less. The thickness of the resin film is preferably 100 μm or less.

<Partition Wall (A-1)>

The isolation wall (A-1) is characterized by a reflectance of 20% to 60% per 10 μm of thickness at a wavelength of 550 nm and an OD value of 1.0 to 3.0. Here, the thickness of the partition wall (A-1) refers to the length of the partition wall (A-1) in a direction perpendicular to the base substrate (height direction). In the case of the substrate with partition walls shown in FIG. 1 , the partition wall 2 Thickness is represented by the symbol H. In addition, let the length of the partition wall (A-1) in the horizontal direction with respect to the base substrate be the width of the partition wall (A-1). In the case of the substrate with partition walls shown in FIG. 1 , the width of the partition walls 2 is represented by a symbol L.

In the present invention, it is considered that the reflectivity of the side surface of the partition wall contributes to the improvement of the brightness of the display device and the light-shielding property of the partition wall to suppress color mixing. On the other hand, the reflectance and OD value per thickness unit are considered to be the same regardless of the thickness direction and the width direction. Therefore, the present invention focuses on the reflectance and OD value per thickness unit of the partition wall. Furthermore, as will be described later, the thickness of the partition wall (A-1) is preferably 0.5 μm to 50 μm, and the width is preferably 5 μm to 40 μm. Therefore, in the present invention, 10 μm is selected as a representative value of the thickness of the partition wall (A-1), and attention is paid to the reflectance and OD value per 10 μm of thickness.

If the reflectance per 10 μm of thickness is less than 20%, the reflection from the side surfaces of the partition walls becomes small, and the brightness of the display device becomes insufficient. The reflectance per 10 μm of thickness is preferably 30% or more, more preferably 35% or more. The higher the reflectivity, the greater the reflection from the side of the partition wall, thus improving the brightness of the display device. However, if the reflectivity exceeds 60%, light color mixing will occur between adjacent pixels. The reflectivity per 10 μm of thickness is preferably 44% or less.

In addition, if the OD value per 10 μm of thickness is less than 1.0, light color mixing will occur between adjacent pixels. The OD value per 10 μm of thickness is preferably 1.5 or more, more preferably 2.0 or more. On the other hand, if the OD value per 10 μm of thickness exceeds 3.0, reflection from the side surfaces of the partition walls becomes small, and the brightness of the display device becomes insufficient. The OD value per 10 μm of thickness is more preferably 2.5 or less.

Regarding the reflectance per 10 μm of thickness of the partition wall (A-1) at a wavelength of 550 nm, spectrometry can be measured from the upper surface of the partition wall (A-1) with a thickness of 10 μm. A colorimeter (for example, CM-2600d manufactured by Konica Minolta Co., Ltd.) measures in the Specular Component Included (SCI) mode. However, when an area sufficient for measurement cannot be secured, or when a measurement sample with a thickness of 10 μm cannot be collected, the partition wall (A-1) can also be fabricated if the composition of the partition wall (A-1) is known. (A-1) A whole film with a thickness of 10 μm of the same composition is used instead of the partition wall (A-1). By measuring the reflectance in the same manner as the whole film, the reflectance per 10 μm in thickness can be determined. For example, except that the material on which the partition walls (A-1) are formed is used, the thickness is set to 10 μm, and no patterning is performed, the entire film is produced under the same processing conditions as those for forming the partition walls (A-1). The reflectance of the obtained whole film can also be measured similarly from the upper surface.

Regarding the OD value per 10 μm thickness of the partition wall (A-1), for the partition wall (A-1) with a thickness of 10 μm, use an optical densitometer (for example, 361T manufactured by X-rite Corporation) from the upper surface. The intensity of incident light and transmitted light is measured visually and can be calculated by the following formula (1). However, when a sufficient area cannot be secured for measurement, or when a measurement sample with a thickness of 10 μm cannot be collected, when the composition of the partition wall (A-1) is known, it can also be combined with the measurement of reflectance. Similarly, a whole film with a thickness of 10 μm having the same composition as the partition wall (A-1) was produced. Instead of the partition wall (A-1), the OD value of the whole film was measured in the same manner to determine the OD value per 10 μm thickness.

OD value=log10(I ₀ /I)…(1)

I ₀ : incident light intensity

I: transmitted light intensity.

In addition, as a method for making the reflectance and the OD value fall within the above range, for example, the partition wall (A-1) has a preferable composition described below.

The cone angle of the partition wall (A-1) is preferably 45°~110°. The so-called taper angle of the partition wall (A-1) refers to the angle formed by the side edge and the bottom edge of the partition wall section. In the case of the substrate with partition walls shown in FIG. 1 , the taper angle of the partition wall 2 is represented by the symbol θ. By setting the taper angle to 45° or more, the difference in width between the upper part and the bottom of the partition wall (A-1) becomes smaller, and the width of the partition wall (A-1) can be easily formed within the preferred range described below. . The cone angle is preferably above 70°. On the other hand, by setting the taper angle to 110° or less, when forming (B) a pixel containing a color-converting luminescent material described later by inkjet coating, ink bursting can be suppressed and inkjet coating properties can be improved. Here, the ink burst refers to a phenomenon in which the ink crosses the partition wall and mixes into the adjacent pixel portion. The cone angle is preferably 95° or less. The taper angle of the partition wall (A-1) can be observed by using a scanning electron microscope (FE-SEM (for example, S-4800 manufactured by Hitachi, Ltd.)) with an acceleration voltage of 3.0 kV and a magnification of 2,500 times. For any cross section of (A-1), the angle formed by the side and the bottom of the cross section of the partition wall (A-1) is measured to determine the angle.

In addition, as a method for making the taper angle of the partition wall (A-1) fall within the above range, for example, setting the partition wall (A-1) to a preferable composition described below and using the above-mentioned method of the present invention can be mentioned. Resin composition formation, etc.

The thickness of the partition wall (A-1) is preferably larger than the thickness of the partition wall (B) when the substrate with the partition wall has a pixel containing a color-converting luminescent material (B) described below. The thickness of the element. Specifically, the thickness of the partition wall (A-1) is preferably 0.5 μm or more, more preferably 10 μm or more. On the other hand, from the viewpoint of extracting the light emitted from the bottom of the pixel more efficiently, the thickness of the partition wall (A-1) is preferably 50 μm or less, and more preferably 20 μm or less. In addition, the width of the partition wall (A-1) is preferably a width sufficient to further increase the brightness by utilizing light reflection from the side surfaces of the partition wall and to further suppress color mixing of light in adjacent pixels due to light leakage. Specifically, the width of the partition wall is preferably 5 μm or more, more preferably 15 μm or more. On the other hand, from the viewpoint of ensuring more of the light-emitting area of the pixel and further improving the brightness, the width of the partition wall (A-1) is preferably 50 μm or less, and more preferably 40 μm or less.

The partition wall (A-1) has a repeating pattern of a predetermined number of pixels corresponding to the screen size of the image display device. The number of pixels of the image display device is, for example, 4000 horizontally and 2000 vertically. The number of pixels affects the resolution (fineness) of the displayed image. Therefore, it is necessary to form a number of pixels corresponding to the required image resolution and the screen size of the image display device, and it is preferable to determine the pattern formation size of the partition wall together with these.

The partition wall (A-1) preferably contains resin, white pigment, and at least one metal oxide selected from the group consisting of palladium oxide, platinum oxide, gold oxide, silver oxide, palladium, platinum, gold and silver. Particles made of materials or metals (hereinafter, sometimes described as "metal oxide particles or metal particles"). Resin has the function of improving the crack resistance and light resistance of the partition wall. The white pigment has the function of further improving the reflectivity of the partition wall. Metal oxide particles or metal particles have the function of adjusting the OD value and suppressing light color mixing in adjacent pixels.

The resin and white pigment are as described above as materials constituting the resin composition. From the viewpoint of improving the crack resistance of the partition wall during heat treatment, the content of the resin in the partition wall (A-1) is preferably 10% by weight or more, more preferably 20% by weight or more. On the other hand, from the viewpoint of improving light resistance, the content of the resin in the partition wall (A-1) is preferably 60% by weight or less, more preferably 50% by weight or less.

From the viewpoint of further improving the reflectance, the content of the white pigment in the partition wall (A-1) is preferably 20% by weight or more, more preferably 30% by weight or more. On the other hand, from the viewpoint of improving the surface smoothness of the partition wall, the content of the white pigment in the partition wall (A-1) is preferably 60% by weight or less, more preferably 55% by weight or less.

Metal oxide particles or metal particles are obtained by decomposing the organic metal compounds in the resin composition during the exposure step and/or heating step. Black particles or yellow particles produced by agglomeration. From the viewpoint of adjusting the reflectance and OD to the above ranges to further suppress light color mixing in adjacent pixels, the content of metal oxide particles or metal particles in the partition wall (A-1) is preferably 0.2% by weight. or more, more preferably 0.5% by weight or more. On the other hand, from the viewpoint of adjusting the reflectance and OD to the above ranges, the content of the metal oxide particles or metal particles in the partition wall (A-1) is preferably 5% by weight or less, more preferably 3% by weight. weight% or less.

It is preferable that the partition wall (A-1) further contains a liquid-proof compound. By containing a liquid-repellent compound, the partition wall (A-1) can be provided with liquid-repellent properties. For example, when forming (B) pixels containing a color-converting luminescent material described later, the composition can be easily coated on each pixel. Different color changing luminous materials. The liquid-repellent compound is as described above as a material constituting the resin composition.

From the viewpoint of improving the liquid-repellent performance of the partition wall and improving the inkjet coatability, the content of the liquid-repellent compound in the partition wall (A-1) is preferably 0.01% by weight or more, more preferably 0.1% by weight or more. On the other hand, from the viewpoint of improving compatibility with resin or white pigment, the content of the liquid-repellent compound in the partition wall (A-1) is preferably 10% by weight or less, more preferably 5% by weight or less.

From the viewpoint of improving inkjet coating properties and making it easier to separate the color-changing luminescent material, the surface contact angle of the partition (A-1) with respect to propylene glycol monomethyl ether acetate is preferably 10° or more, More preferably, it is 20° or more, and still more preferably, it is 40° or more. On the other hand, from the viewpoint of improving the adhesion between the partition wall and the base substrate, the surface contact angle of the partition wall (A-1) is preferably 70° or less, more preferably 60° or less. Here, the surface contact angle of the partition wall (A-1) can be measured on the upper part of the partition wall in accordance with the wettability test method of the substrate glass surface specified in JIS R3257 (enactment date = 1999/04/20). In addition, as a method of making the surface contact angle of the partition wall (A-1) fall within the said range, the method of using the said liquid repellent compound etc. are mentioned, for example.

As a method of patterning the partition walls (A-1) on the base substrate, the photosensitive paste method is preferable in terms of ease of adjustment of the pattern shape. As a method for pattern forming partition walls using a photosensitive paste method, for example, the following method is preferred, including: a coating step of coating the resin composition on a base substrate and drying to obtain a dry film; and an exposure step of The resulting dry film is pattern-exposed into a desired pattern shape; a development step is used to dissolve and remove the portion of the exposed dry film that is soluble in the developer; and a heating step is used to harden the developed partition wall. The resin composition preferably has positive or negative photosensitivity. Pattern exposure can be performed through a photomask having a prescribed opening. For exposure, you can also use laser light to directly draw any pattern without using a mask. Furthermore, when the substrate with the partition wall has a light-shielding partition wall (A-2) described below, the partition wall (A-1) can be formed in a similar pattern on the light-shielding partition wall (A-2). Regarding each step, the method for manufacturing the light-shielding film is as described above.

<Light-shielding partition wall (A-2)>

The substrate with isolation walls of the present invention preferably further has (A-2) an OD value of 0.5 or more per 1.0 μm of thickness between the base substrate and (A-1) patterned isolation walls. Patterned partition wall (hereinafter, may be described as "light-shielding partition wall (A-2)"). By having the light-shielding partition wall (A-2), the light-shielding property can be improved, light leakage of the backlight in the display device can be suppressed, and a high-contrast and clear image can be obtained.

FIG. 9 is a cross-sectional view showing an aspect of the partition-walled substrate of the present invention having a light-shielding partition wall. There are patterned isolation walls 2 and light-shielding isolation walls 10 on the base substrate 1 , and pixels 3 are arranged in areas separated by the isolation walls 2 and the light-shielding isolation walls 10 .

The OD value per 1.0 μm of thickness of the light-shielding partition wall (A-2) is 0.5 or more. Here, as described later, the thickness of the light-shielding partition wall (A-2) is preferably 0.5 μm to 10 μm. Therefore, in the present invention, 1.0 μm is selected as a representative value of the thickness of the light-shielding partition wall (A-2), and attention is paid to the OD value per 1.0 μm of thickness. By setting the OD value per 1.0 μm of thickness to 0.5 or more, the light-shielding property can be further improved and a higher-contrast, clear image can be obtained. The OD value per 1.0 μm of thickness is more preferably 1.0 or more. On the other hand, the OD value per 1.0 μm of thickness is preferably 4.0 or less, so that pattern processability can be improved. The OD value per 1.0 μm of thickness is more preferably 3.0 or less. OD of light-shielding partition wall (A-2) The value can be measured in the same manner as the OD value of the partition wall (A-1). Furthermore, as a method for making the OD value fall within the above range, for example, the light-shielding partition wall (A-2) has a preferable composition described below.

From the viewpoint of improving light-shielding properties, the thickness of the light-shielding partition wall (A-2) is preferably 0.5 μm or more, more preferably 1.0 μm or more. On the other hand, from the viewpoint of improving flatness, the thickness of the light-shielding partition wall (A-2) is preferably 10 μm or less, more preferably 5 μm or less. In addition, the width of the light-shielding partition wall (A-2) is preferably the same as that of the partition wall (A-1).

The light-shielding partition wall (A-2) preferably contains resin and black pigment. Resin has the function of improving the crack resistance and light resistance of the partition wall. Black pigment has the function of absorbing incident light and reducing emitted light.

Examples of the resin include epoxy resin, (meth)acrylic polymer, polyurethane, polyester, polyimide, polyolefin, polysiloxane, and the like. Two or more of these compounds may be contained. Among these, polyimide is preferred in terms of excellent heat resistance and solvent resistance.

Examples of the black pigment include the pigments exemplified as the black pigment in the resin composition, palladium oxide, platinum oxide, gold oxide, silver oxide, and the like. In terms of having high light-shielding properties, a black pigment selected from the group consisting of titanium nitride, zirconium nitride, carbon black, palladium oxide, platinum oxide, gold oxide and silver oxide is preferred.

As a method of patterning the light-shielding partitions (A-2) on the base substrate, a method is preferably as follows: for example, using the photosensitive material described in Japanese Patent Application Laid-Open No. 2015-1654, and combining the partitioning walls ( A-1) Similarly with photosensitive paste method for pattern formation.

The substrate with partitions of the present invention preferably further includes (B) pixels containing a color-converting luminescent material (hereinafter, sometimes described as "pixels (B)") arranged separated by the partitions (A-1). )"). The pixel (B) has a function of enabling color display by converting at least part of the wavelength range of incident light and emitting outgoing light in a wavelength range different from that of the incident light.

2 shows a cross-sectional view of an aspect of a substrate with isolation walls of the present invention having patterned isolation walls (A-1) and pixels (B) containing a color-changing luminescent material. There is a patterned isolation wall 2 on the base substrate 1 , and the pixels 3 are arranged in the areas separated by the isolation wall 2 .

The color conversion material preferably contains a phosphor selected from inorganic phosphors and organic phosphors.

The substrate with partition walls of the present invention can be used as a display device by combining a backlight that emits blue light with a liquid crystal and a pixel (B) formed on a thin film transistor (TFT). In this case, it is preferable to include a red phosphor that is excited by blue excitation light and emits red fluorescence in a region corresponding to the red pixel. Similarly, it is preferable to include a green phosphor that is excited by blue excitation light and emits green fluorescence in a region corresponding to the green pixel. It is preferable that the area corresponding to the blue pixel does not contain phosphor.

The substrate with partition walls of the present invention can also be used in a display device in which a plurality of blue LEDs corresponding to each pixel are arranged on the substrate separated by white partition walls. The blue micro-LED is used as a backlight use. The ON/OFF of each pixel can be realized by the ON/OFF of the blue micro-LED, and no liquid crystal is required. The substrate with isolation walls of the present invention may also use either isolation walls that separate pixels or isolation walls that separate blue micro-LEDs in the backlight.

The inorganic phosphor is preferably one that emits various colors such as green or red by blue excitation light, that is, one that is excited by excitation light with a wavelength of 400 nm to 500 nm and has an emission spectrum of 500 nm to 700 nm. Inorganic phosphor with peak area. Examples of the inorganic phosphor include: yttrium aluminum garnet (YAG) based phosphor, terbium aluminum garnet (TAG) based phosphor, silicon aluminum oxynitride ( Sialon) based phosphor, Mn ⁴⁺ active fluoride complex phosphor, inorganic phosphor called quantum dots, etc. Two or more of these compounds may also be used. Among these, quantum dots are preferred. Compared with other phosphors, the average particle size of quantum dots is small, so the surface of the (B) pixel can be smoothed and light scattering on the surface can be suppressed, so the light extraction efficiency can be further improved and the brightness can be further improved.

Examples of quantum dots include particles including Group II-IV, Group III-V, Group IV-VI, and Group IV semiconductors. Examples of these inorganic semiconductors include: Si, Ge, Sn, Se, Te, B, C (including diamond), P, BN, BP, BAs, AlN, AlP, AlAs, AlSb, GaN, GaP, GaAs, GaSb, InN, InP, InAs, InSb, ZnO, ZnS, ZnSe, ZnTe, CdS, CdSe, CdSeZn, CdTe, HgS, HgSe, HgTe, BeS, BeSe, BeTe, MgS, MgSe, GeS, GeSe, GeTe, SnS, SnSe, SnTe, PbO, PbS, PbSe, PbTe, CuF, CuCl, CuBr, CuI, Si ₃ N ₄ , Ge ₃ N ₄ , Al ₂ O ₃ , etc. Two or more of these compounds may also be used.

Quantum dots may also contain p-type dopants or n-type dopants. In addition, quantum dots may also have a core-shell structure. In the core-shell structure, any appropriate functional layer (single layer or multiple layers) can be formed around the shell according to the purpose, and the surface of the shell can also be surface treated and/or chemically modified.

Examples of the shape of quantum dots include spherical, columnar, scaly, plate-shaped, amorphous, and the like. The average particle size of the quantum dots can be selected arbitrarily according to the required emission wavelength, preferably 1nm~30nm. If the average particle diameter of the quantum dots is 1nm~10nm, the peaks in the luminescence spectrum can be sharper in each of blue, green and red. The average particle diameter of the quantum dots is preferably 2 nm or more, and more preferably 8 nm or less. For example, when the average particle diameter of a quantum dot is about 2 nm, it emits blue light, when it emits green light, when it is about 3 nm, and when it emits red light, it emits red light. The average particle size of quantum dots can be measured by dynamic light scattering. Examples of a measuring device for the average particle diameter include dynamic light scattering photometer DLS-8000 (manufactured by Otsuka Electronics Co., Ltd.).

As the organic phosphor, a phosphor that emits various colors such as green or red by blue excitation light is preferred. Examples of phosphors that emit red fluorescence include pyrromethene derivatives having a basic skeleton represented by the following structural formula (8), and examples of phosphors that emit green fluorescence include the following compounds: Pyrromethene derivatives with a basic skeleton represented by structural formula (9), etc. In addition, perylene-based derivatives, porphyrin-based derivatives, oxazine-based derivatives, pyrazine-based derivatives, etc. that emit red or green fluorescence depending on the selection of substituents can be cited. Two or more of these compounds may be contained. Among these, pyrromethene derivatives are also preferred because of their high quantum yield. Pyrroia The methyl derivative can be obtained, for example, by the method described in Japanese Patent Application Laid-Open No. 2011-241160.

The organic phosphor is soluble in the solvent, so the pixel (B) can be easily formed to a desired thickness.

From the viewpoint of improving color characteristics, the thickness of the pixel (B) is preferably 0.5 μm or more, more preferably 1 μm or more. On the other hand, from the viewpoint of thinning the display device or curved surface workability, the thickness of the pixel (B) is preferably 30 μm or less, more preferably 20 μm or less.

The size of each pixel (B) is usually about 20 μm to 200 μm.

The pixels (B) are preferably separated and arranged by the partition wall (A-1). By providing isolation walls between pixels, the diffusion or color mixing of the emitted light can be further suppressed.

An example of a method of forming the pixel (B) is a method of filling a space separated by the partition wall (A-1) with a coating liquid containing a color-converting luminescent material (hereinafter referred to as a color-converting luminescent material coating liquid). The color-changing luminescent material coating liquid may further contain resin or solvent.

As a filling method of the color-converting luminescent material coating liquid, from the viewpoint of easily distributing different types of color-converting luminescent materials to each pixel, an inkjet coating method or the like is preferred.

The obtained coating film may also be dried under reduced pressure and/or heated. When performing vacuum drying, in order to prevent the drying solvent from condensing again on the wall of the vacuum chamber, the vacuum drying temperature is preferably 80°C or lower. The pressure of reduced pressure drying is preferably below the vapor pressure of the solvent contained in the coating film, more preferably 1 Pa to 1000 Pa. The preferred reduced pressure drying time is 10 seconds to 600 seconds. When heat drying is performed, examples of the heat drying device include an oven, a hot plate, and the like. The preferred heating and drying temperature is 60℃~200℃. The preferred heating and drying time is 1 minute to 60 minutes.

The substrate with partitions of the present invention preferably further has (C) a low refractive index layer (hereinafter, sometimes described as "low refractive index layer") with a refractive index of 1.20 to 1.35 at a wavelength of 550 nm on the pixel (B). (C)"). By having the low refractive index layer (C), the light extraction efficiency can be further improved and the brightness of the display device can be further improved.

3 is a cross-sectional view showing an aspect of the substrate with partition walls of the present invention having a low refractive index layer. There are patterned isolation walls 2 and pixels 3 on the base substrate 1, and a low refractive index layer 4 on these.

In the display device, from the viewpoint of appropriately suppressing light reflection of the backlight and efficiently allowing light to enter the pixel (B), the refractive index of the low refractive index layer (C) is preferably 1.20 or more, more preferably 1.23 and above. On the other hand, from the viewpoint of improving brightness, the refractive index of the low refractive index layer (C) is preferably 1.35 or less, more preferably 1.30 or less. Here, with respect to the refractive index of the low refractive index layer (C), a coupler can be used, Measurement was performed by irradiating light with a wavelength of 550 nm from the direction perpendicular to the cured film surface under atmospheric pressure and 20° C. conditions.

The low refractive index layer (C) preferably contains polysiloxane and silicon dioxide particles without a hollow structure. Polysiloxane has high compatibility with inorganic particles such as silica particles and functions as a binder that can form a transparent layer. In addition, by containing silica particles, minute voids can be efficiently formed in the low refractive index layer (C) to reduce the refractive index, and the refractive index can be easily adjusted to fall within the above range. Furthermore, by using silica particles that do not have a hollow structure, they do not have a hollow structure that easily causes cracks during hardening shrinkage, so cracks can be suppressed. Furthermore, in the low refractive index layer (C), polysiloxane and silicon dioxide particles without a hollow structure may be contained independently, or polysiloxane and silicon dioxide particles without a hollow structure may be contained. Contained in a combined state. From the viewpoint of the uniformity of the low refractive index layer (C), it is preferable to contain polysiloxane in a state where it is bonded to silicon dioxide particles that do not have a hollow structure.

The polysiloxane contained in the low refractive index layer (C) preferably contains fluorine. By containing fluorine, the refractive index of the low refractive index layer (C) can be easily adjusted to 1.20 to 1.35. Fluorine-containing polysiloxane can be obtained by hydrolyzing and condensing a plurality of alkoxysilane compounds including at least a fluorine-containing alkoxysilane compound represented by the following general formula (10). Furthermore, other alkoxysilane compounds can also be used.

[Chemical 5]R ⁷ _m Si(OR ⁶ ) _4-m (10)

In the general formula (10), R ⁷ represents a fluoroalkyl group with a fluorine number of 3 to 17. R ⁶ represents the same group as R ⁶ in general formulas (5) to (7). m represents 1 or 2. 4-m R ^6s and m R ^7s may be the same or different respectively.

Examples of the fluorine-containing alkoxysilane compound represented by the general formula (10) include trifluoroethyltrimethoxysilane, trifluoroethyltriethoxysilane, and trifluoroethyltriisopropoxysilane. , trifluoropropyltrimethoxysilane, trifluoropropyltriethoxysilane, trifluoropropyltriisopropoxysilane, heptadecafluorodecyltrimethoxysilane, heptadecafluorodecyltriethoxysilane Silane, heptadecafluorodecyltriisopropoxysilane, tridecafluorooctyltriethoxysilane, tridecafluorooctyltrimethoxysilane, tridecafluorooctyltriisopropoxysilane, trifluoroethyl Methyldimethoxysilane, trifluoroethylmethyldiethoxysilane, trifluoroethylmethyldiisopropoxysilane, trifluoropropylmethyldimethoxysilane, trifluoropropyl Methyldiethoxysilane, trifluoropropylmethyldiisopropoxysilane, heptadecafluorodecylmethyldimethoxysilane, heptadecafluorodecylmethyldiethoxysilane, heptadecafluoride Decylmethyldiisopropoxysilane, tridecafluorooctylmethyldimethoxysilane, tridecafluorooctylmethyldiethoxysilane, tridecafluorooctylmethyldiisopropoxysilane , trifluoroethylethyldimethoxysilane, trifluoroethylethyldiethoxysilane, trifluoroethylethyldiisopropoxysilane, trifluoropropylethyldimethoxysilane, Trifluoropropyl ethyl diethoxysilane, trifluoropropyl ethyl diisopropoxysilane, heptadecafluorodecyl ethyl dimethoxysilane, heptadecafluorodecyl ethyl diethoxysilane , Heptadecafluorodecyl ethyl diisopropoxysilane, tridecafluorooctylethyl diethoxysilane, tridecafluorooctylethyl dimethoxysilane, tridecafluorooctylethyl diisopropoxysilane Propoxysilane, etc. Two or more of these compounds may also be used.

From the viewpoint of suppressing cracks, the polysiloxane in the low refractive index layer (C) The content is preferably more than 4% by weight. On the other hand, from the viewpoint of ensuring thixotropy of the network between silica particles, appropriately maintaining an air layer in the low refractive index layer (C), and further reducing the refractive index, the content of polysiloxane is preferably 32% by weight or less.

Examples of silica particles that do not have a hollow structure in the low refractive index layer (C) include "SNOWTEX" (registered trademark) manufactured by Nissan Chemical Industry Co., Ltd. or "organic silica gel" "(registered trademark) series (isopropyl alcohol dispersion, ethylene glycol dispersion, methyl ethyl ketone dispersion, dimethyl acetamide dispersion, methyl isobutyl ketone dispersion, propylene glycol monomethyl ethyl Acid ester dispersion, propylene glycol monomethyl ether dispersion, methanol dispersion, ethyl acetate dispersion, butyl acetate dispersion, xylene-n-butanol dispersion, toluene dispersion, etc. Product numbers PGM-ST, PMA-ST, IPA-ST, IPA-ST-L, IPA-ST-ZL, IPA-ST-UP, etc. Two or more of these compounds may also be contained.

From the viewpoint of ensuring thixotropy of the network between silica particles, appropriately maintaining an air layer in the low refractive index layer (C), and further reducing the refractive index, the low refractive index layer (C) does not have a hollow structure. The content of silica particles is preferably 68% by weight or more. On the other hand, from the viewpoint of suppressing cracks, the content of silica particles not having a hollow structure is preferably 96% by weight or less.

From the viewpoint of covering the step difference of the pixel (B) and suppressing the occurrence of defects, the thickness of the low refractive index layer (C) is preferably 0.1 μm or more, more preferably 0.5 μm or more. On the other hand, from the viewpoint of reducing stress that causes cracks in the low refractive index layer (C), the thickness of the low refractive index layer (C) is preferably 20 μm or less, more preferably 10 μm or less.

As a method for forming the low refractive index layer (C), a coating method is preferred in terms of ease of formation. For example, a low refractive index layer (C) can be formed by coating a low refractive index resin composition containing polysiloxane and silica particles on the pixel (B), drying it, and then heating it. .

In addition, the substrate with isolation walls of the present invention preferably further has an inorganic protective layer I with a thickness of 50 nm to 1,000 nm on the low refractive index layer (C). By having the inorganic protective layer I, it is difficult for moisture in the atmosphere to reach the low refractive index layer (C). Therefore, the refractive index variation of the low refractive index layer (C) can be suppressed and brightness degradation can be suppressed.

FIG. 4 is a cross-sectional view showing an aspect of the substrate with partition walls of the present invention having a low refractive index layer and an inorganic protective layer I. There are patterned isolation walls 2 and pixels 3 on the base substrate 1, and there are further a low refractive index layer 4 and an inorganic protective layer I5 on these.

In addition, the substrate with isolation walls of the present invention preferably further has an inorganic protective layer II with a thickness of 50 nm to 1,000 nm between the pixel (B) and the low refractive index layer (C). By having the inorganic protective layer II, the material forming the pixel (B) is difficult to move from the pixel (B) to the low refractive index layer, so the refractive index change of the low refractive index layer (C) can be suppressed and brightness degradation can be suppressed.

FIG. 5 is a cross-sectional view showing an aspect of the substrate with partition walls of the present invention having a low refractive index layer and an inorganic protective layer II. There are patterned isolation walls 2 and pixels 3 on the base substrate 1, and there are further an inorganic protective layer II6 and a low refractive index layer 4 on these.

In addition, the substrate with isolation walls of the present invention is preferably a base substrate and the above-mentioned A color filter (hereinafter, sometimes described as a "color filter") with a thickness of 1 μm to 5 μm is further provided between the pixels (B). Color filters have the function of transmitting visible light in a specific wavelength range and setting the transmitted light to a desired hue. By having a color filter, the color purity of the display device can be improved. By setting the thickness of the color filter to 1 μm or more, color purity can be further improved. On the other hand, by setting the thickness of the color filter to 5 μm or less, the brightness can be further improved.

FIG. 6 is a cross-sectional view showing an aspect of the substrate with partition walls of the present invention having a color filter. The base substrate 1 has a patterned partition wall 2 and a color filter 7 , and the color filter 7 has a pixel 3 .

Examples of the color filter include color filters that are used in flat-panel displays such as liquid crystal displays and use a pigment-dispersed material in which a pigment is dispersed in a photoresist. More specifically, examples include: a blue color filter that selectively transmits a wavelength of 400 nm to 550 nm, a green color filter that selectively transmits a wavelength of 500 nm to 600 nm, and a filter that selectively transmits a wavelength of 500 nm or more. Yellow color filter, red color filter that selectively transmits wavelengths above 600 nm, etc. In addition, the color filter may be laminated separately from the pixel (B) containing the color-changing luminescent material, or may be integrally laminated.

In addition, the substrate with isolation walls of the present invention preferably further has an inorganic protective layer III and/or a yellow organic protective layer with a thickness of 50 nm to 1,000 nm between the color filter and the pixel (B). By having the inorganic protective layer III, it is difficult for the color filter forming material to reach the pixel (B) containing the color-converting luminescent material from the color filter, so the brightness of the pixel (B) containing the color-converting luminescent material can be suppressed. Deterioration. In addition, by having a yellow organic protective layer, blue leakage light that is not completely converted by the pixel (B) containing the color-converting luminescent material can be cut off, thereby improving color reproducibility.

7 shows a cross-sectional view of one aspect of the substrate with partition walls of the present invention having a color filter, an inorganic protective layer III and/or a yellow organic protective layer. There are patterned isolation walls 2 and color filters 7 on the base substrate 1, and there are inorganic protective layers III and/or yellow organic protective layers 8 on them. The isolation wall 2 covered by the protective layer 8 separates the arranged pixels 3 .

In addition, the substrate with isolation walls of the present invention preferably further has an inorganic protective layer IV and/or a yellow organic protective layer with a thickness of 50 nm to 1,000 nm on the base substrate. The inorganic protective layer IV and/or the yellow organic protective layer functions as a refractive index adjustment layer, which can more efficiently extract the light emerging from the pixel (B), further improving the brightness of the display device. In addition, the yellow organic protective layer blocks blue leakage light that is not completely converted due to the pixel (B) containing the color-converting luminescent material, thereby improving color reproducibility. The inorganic protective layer IV and/or the yellow organic protective layer is preferably disposed between the base substrate, the isolation wall (A) and the pixel (B).

8 shows a cross-sectional view of one aspect of the substrate with partition walls of the present invention having an inorganic protective layer IV and/or a yellow organic protective layer. There is an inorganic protective layer IV and/or a yellow organic protective layer 9 on the base substrate 1, and there are patterned isolation walls 2 and color filters 7 on them, and there are patterned isolation walls 2 on them. and pixel 3.

Examples of materials constituting the inorganic protective layers I to IV include metal oxides such as silicon oxide, indium tin oxide, and gallium zinc oxide; and metal nitrogen such as silicon nitride. Chemicals; fluorides such as magnesium fluoride, etc. Two or more of these compounds may be contained. Among these, silicon nitride or silicon oxide is more preferred in terms of low water vapor permeability and high permeability.

From the viewpoint of fully suppressing the penetration of substances such as water vapor, the thickness of the inorganic protective layer I to the inorganic protective layer IV is preferably 50 nm or more, more preferably 100 nm or more. On the other hand, from the viewpoint of suppressing a decrease in transmittance, the thickness of the inorganic protective layers I to IV is preferably 800 nm or less, more preferably 500 nm or less.

The thickness of the inorganic protective layer I to the inorganic protective layer IV can be measured by using a grinding device such as a cross-section polisher to expose the cross-section perpendicular to the base substrate, and using a scanning electron microscope or a transmission electron microscope to enlarge the cross-section. observe.

Examples of methods for forming the inorganic protective layers I to IV include a sputtering method and the like. The inorganic protective layer is preferably colorless and transparent or yellow and transparent.

The yellow organic protective layer can be obtained, for example, by subjecting the resin composition of the present invention containing an organometallic compound containing silver as an organometallic compound to pattern processing. As mentioned above, the organometallic compound containing silver is decomposed in the heating step during pattern formation. Aggregates to form yellow particles and has the function of yellowing the protective layer. Examples of the organometallic compound containing silver include silver neodecanoate, silver octoate, silver salicylate, and the like. Among these, from the viewpoint of further yellowing, silver neodecanoate is preferred. In the resin composition for the yellow organic protective layer, the content of the organic metal compound containing silver is preferably 0.2% by weight to 5% by weight of the solid content. By setting the content of the silver-containing organometallic compound to 0.2% by weight or more, further yellowing can be achieved. The content of the silver-containing organometallic compound in the solid component is more preferably 1.5% by weight or more. On the other hand, by setting the content of the organometallic compound containing silver to 5% by weight or less of the solid content, the transmittance can be further improved.

The resin composition forming the yellow organic protective layer may contain a yellow pigment. Examples of the yellow pigment include: Pigment yellow (hereinafter referred to as PY) PY12, PY13, PY17, PY20, PY24, PY83, PY86, PY93, PY95, PY109, PY110, PY117, PY125, PY129, PY137, PY138, PY139, PY147, PY148, PY150, PY153, PY154, PY166, PY168, PY185, etc. Among them, from the viewpoint of selectively blocking blue light, a yellow pigment selected from PY139, PY147, PY148 and PY150 is preferred.

As a method of patterning the yellow organic protective layer, a method of patterning by a photosensitive paste method in the same manner as the partition wall (A-1) is preferred.

As shown in FIG. 7 , when the yellow organic protective layer 8 is formed on the color filter 7 , the yellow organic protective layer 8 may also function as an overcoat layer that flattens each pixel of the color filter. .

From the viewpoint of fully blocking blue leakage light, the thickness of the yellow organic protective layer is preferably 100 nm or more, and more preferably 500 nm or more. On the other hand, from the viewpoint of suppressing a decrease in light extraction efficiency, the thickness of the yellow organic protective layer is preferably 3000 nm or less, more preferably 2000 nm or less.

Next, the display device of the present invention will be described. The display device of the present invention includes the substrate with the partition wall and a light emitting source. As the luminescent light source, a luminescent light source selected from a liquid crystal unit, an organic EL unit, a micro LED unit, and a micro LED unit is preferred. In terms of excellent luminescence characteristics, as a luminescent light source, it is more preferable to machine EL unit. Here, the so-called micro LED unit refers to a unit in which a plurality of LEDs with a vertical and horizontal length of about 100 μm to 10 mm are arranged. The so-called micro LED unit refers to a unit in which multiple LEDs with a vertical and horizontal length of less than 100 μm are arranged.

The manufacturing method of the display device of the present invention will be described with reference to an example of a display device including the substrate with partition walls of the present invention and an organic EL unit. Photosensitive polyimide resin is coated on the glass substrate, and an insulating film with openings is formed using photolithography. After aluminum is sputtered thereon, the aluminum is patterned by photolithography, and a back electrode layer containing aluminum is formed in the opening without the insulating film. Next, as an electron transport layer, a film of tris(8-hydroxyquinoline)aluminum (hereinafter referred to as Alq ₃ ) was formed by a vacuum evaporation method, and then as a light-emitting layer, a film doped in Alq ₃ was formed. A white luminescent layer mixed with diaminomethylenepyran, quinacridone and 4,4'-bis(2,2-diphenylvinyl)biphenyl. Secondly, as the hole transport layer, N,N'-diphenyl-N,N'-bis(α-naphthyl)-1,1'-biphenyl-4,4'-di Amine films. Finally, as a transparent electrode, ITO was formed into a film by sputtering, and an organic EL unit with a white light-emitting layer was produced. A display device can be produced by arranging the organic EL unit obtained in the above manner to face the substrate with the partition wall and bonding them together with a sealant.

[Example]

Hereinafter, the present invention will be described more specifically with reference to Examples and Comparative Examples, but the present invention is not limited to these scopes. In addition, among the compounds used, the names of the compounds whose abbreviations are used are shown below.

PGMEA: propylene glycol monomethyl ether acetate

DAA: diacetone alcohol

BHT: Dibutylhydroxytoluene.

The solid content concentration of the polysiloxane solution in Synthesis Examples 1 to 4 was determined by the following method. Weigh 1.5g of the polysiloxane solution into an aluminum cup, and heat it at 250°C for 30 minutes using a heating plate to evaporate the liquid component. The weight of the solid content remaining in the aluminum cup after heating was weighed, and the solid content concentration of the polysiloxane solution was determined based on the ratio to the weight before heating.

The weight average molecular weight of the polysiloxane in Synthesis Examples 1 to 4 was determined by the following method. Using a GPC analysis device (HLC-8220; manufactured by Tosoh Co., Ltd.) and using tetrahydrofuran as the mobile phase, GPC analysis was performed based on "JIS K7252-3 (date of establishment = 2008/03/20)" to measure polystyrene. Converted weight average molecular weight.

The content ratio of each repeating unit in the polysiloxane in Synthesis Examples 1 to 4 was determined by the following method. The polysiloxane solution was poured into a nuclear magnetic resonance (NMR) sample tube made of "Teflon" (registered trademark) with a diameter of 10 mm, and ²⁹ Si-NMR measurement was performed. The content ratio of each repeating unit was calculated from the ratio of the integrated value of Si in the organosilane to the integrated value of the entire Si derived from the organosilane. ²⁹ Si-NMR measurement conditions are shown below.

Device: Nuclear magnetic resonance device (JNM-GX270; manufactured by JEOL Ltd.)

Determination method: gated decoupling method

Determined core frequency: 53.6693MHz ( ²⁹ Si core)

Spectral width: 20000Hz

Pulse width: 12μs (45° pulse)

Pulse wave repetition time: 30.0 seconds

Solvent: acetone-d6

Standard material: tetramethylsilane

Measuring temperature: 23℃

Sample rotation speed: 0.0Hz.

Synthesis Example 1 Polysiloxane (PSL-1) Solution

Put 147.32g (0.675mol) of trifluoropropyltrimethoxysilane, 40.66g (0.175mol) of 3-methacryloxypropylmethyldimethoxysilane, and 3-trimethoxysilane into a 1000ml three-necked flask. Oxysilylpropylsuccinic anhydride 26.23g (0.10mol), 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane 12.32g (0.05mol), BHT 0.808g and PGMEA 171.62g, A phosphoric acid aqueous solution in which 2.265 g of phosphoric acid (1.0% by weight relative to the charged monomer) was dissolved in 52.65 g of water was added over 30 minutes while stirring at room temperature. Thereafter, the flask was immersed in an oil bath at 70°C and stirred for 90 minutes, and then the oil bath was heated up to 115°C over 30 minutes. One hour after the temperature rise started, the solution temperature (internal temperature) reached 100°C, and then heating and stirring were performed for 2 hours (internal temperature was 100°C ~ 110°C) to obtain a polysiloxane solution. Furthermore, during temperature rise and heating stirring, a mixed gas of 95 volume % nitrogen and 5 volume % oxygen was circulated at 0.05 liter/minute. During the reaction, a total of 131.35 g of methanol and water were distilled off as by-products. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration became 40% by weight, and a polysiloxane (PSL-1) solution was obtained. Furthermore, the weight average molecular weight of the obtained polysiloxane (PSL-1) was 4,000. In addition, polysiloxane (PSL-1) in, derived from trifluoropropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-trimethoxysilylpropylsuccinic anhydride and 3-(3, The molar ratios of each repeating unit of 4-epoxycyclohexyl)propyltrimethoxysilane are 67.5 mol%, 17.5 mol%, 10 mol% and 5 mol% respectively.

Synthesis Example 2 Polysiloxane (PSL-2) Solution

Put 116.07g of diphenyldimethoxysilane (0.475mol), dimethyldimethoxysilane (0.20mol), and 3-methacryloxypropyltrimethoxysilane into a 1000ml three-necked flask. 43.46g (0.175mol), 3-trimethoxysilylpropylsuccinic anhydride 26.23g (0.10mol), 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane 12.32g (0.05mol) ), 0.843g of BHT and 176.26g of PGMEA, and a phosphoric acid aqueous solution in which 2.221g of phosphoric acid (1.0% by weight relative to the charged monomer) was dissolved in 43.65g of water was added over 30 minutes while stirring at room temperature. Thereafter, a polysiloxane solution was obtained in the same manner as in Synthesis Example 1. During the reaction, a total of 136.90 g of methanol and water were distilled off as by-products. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration became 40% by weight, and a polysiloxane (PSL-2) solution was obtained. Furthermore, the weight average molecular weight of the obtained polysiloxane (PSL-2) was 2,800. In addition, polysiloxane (PSL-2) is derived from diphenyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, and 3-trimethoxysilylpropylbutanol. The molar ratios of each repeating unit of dianhydride and 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane are 47.5 mol%, 20 mol%, 17.5 mol%, 10 mol% and 5 mol% respectively.

Synthesis Example 3 Polysiloxane (PSL-3) Solution

Put trifluoropropyltrimethoxysilane 147.32 into a 1000ml three-necked flask. g (0.675mol), 3-methacryloxypropyltrimethoxysilane 43.46g (0.175mol), 3-trimethoxysilylpropylsuccinic anhydride 26.23g (0.10mol), 3-(3 , 12.32g (0.05mol) of 4-epoxycyclohexyl)propyltrimethoxysilane, 0.810g of BHT and 172.59g of PGMEA were added over 30 minutes while stirring at room temperature. 2.293% of phosphoric acid was dissolved in 54.45g of water. g (1.0% by weight relative to the charged monomer) of phosphoric acid aqueous solution. Thereafter, a polysiloxane solution was obtained in the same manner as in Synthesis Example 1. During the reaction, a total of 140.05 g of methanol and water were distilled off as by-products. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration became 40% by weight, and a polysiloxane (PSL-3) solution was obtained. Furthermore, the weight average molecular weight of the obtained polysiloxane (PSL-3) was 4,100. In addition, polysiloxane (PSL-3) is derived from trifluoropropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, and 3-trimethoxysilylpropylbutanol. The molar ratios of each repeating unit of dianhydride and 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane are 67.5 mol%, 17.5 mol%, 10 mol% and 5 mol% respectively.

Synthesis Example 4 Polysiloxane (PSL-4) Solution

Put 34.05g (0.250mol) of methyltrimethoxysilane, 99.15g (0.500mol) of phenyltrimethoxysilane, 31.25g (0.150mol) of tetraethoxysilane, and 3-(3 , 24.64g (0.100mol) of 4-epoxycyclohexyl)propyltrimethoxysilane and 174.95g of PGMEA were added over 30 minutes while stirring at room temperature. 0.945g of phosphoric acid was dissolved in 56.70g of water (relative to A phosphoric acid aqueous solution containing 0.50% by weight of monomer was added. Thereafter, a polysiloxane solution was obtained in the same manner as in Synthesis Example 1. The total amount of methanol and water distilled out as by-products during the reaction 129.15g. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration became 40% by weight, and a polysiloxane (PSL-4) solution was obtained. Furthermore, the weight average molecular weight of the obtained polysiloxane (PSL-4) was 4,200. In addition, polysiloxane (PSL-4) is derived from methyltrimethoxysilane, phenyltrimethoxysilane, tetraethoxysilane and 3-(3,4-epoxycyclohexyl)propane. The molar ratios of each repeating unit of trimethoxysilane are 25 mol%, 50 mol%, 15 mol% and 10 mol% respectively.

The compositions of Synthesis Examples 1 to 4 are summarized in Table 1.

Synthesis Example 5 Green Organic Phosphor

Combine 3,5-dibromobenzaldehyde (3.0g), 4-tert-butylphenylboronic acid (5.3g), tetrakis(triphenylphosphine)palladium (0) (0.4g) and potassium carbonate (2.0g) Place it in a flask and replace it with nitrogen. Degassed toluene (30 mL) and degassed water (10 mL) were added thereto, and the mixture was refluxed for 4 hours. The reaction solution was cooled to room temperature, and after liquid separation, the organic layer was washed with saturated brine. The organic layer was dried over magnesium sulfate and filtered, and then the solvent was distilled off. The obtained reaction product was purified by silica gel column chromatography to obtain 3,5-bis(4-tert-butylphenyl)benzaldehyde (3.5 g) as a white solid. Secondly, put 3,5-bis(4-tert-butylphenyl)benzaldehyde (1.5g) and 2,4-dimethylpyrrole (0.7g) into the flask, and add dehydrated dichloromethane (200mL) and trifluoroacetic acid (1 drop), and stirred for 4 hours under nitrogen atmosphere. A dehydrated methylene chloride solution of 2,3-dichloro-5,6-dicyano-1,4-benzoquinone (0.85 g) was added to the reaction mixture, and the mixture was further stirred for 1 hour. After the reaction, boron trifluoride diethyl ether complex (7.0 mL) and diisopropylethylamine (7.0 mL) were added, and after stirring for 4 hours, water (100 mL) was added and stirred, and the organic layer was Liquid separation. The organic layer was dried over magnesium sulfate and filtered, and then the solvent was distilled off. The obtained reaction product was purified by silica gel column chromatography to obtain 0.4 g of green powder (yield 17%). The ¹ H-NMR analysis results of the obtained green powder were as follows, confirming that the obtained green powder was [G-1] represented by the following structural formula.

¹ H-NMR (CDCl ₃ (d=ppm)): 7.95 (s, 1H), 7.63-7.48 (m, 10H), 6.00 (s, 2H), 2.58 (s, 6H), 1.50 (s, 6H) ,1.37(s,18H).

Synthesis Example 6 Red Organic Phosphor

Under nitrogen flow, add a mixed solution of 300 mg of 4-(4-tert-butylphenyl)-2-(4-methoxyphenyl)pyrrole, 201 mg of 2-methoxybenzoyl chloride and 10 ml of toluene at 120 ℃ for 6 hours. After cooling to room temperature, the solvent is evaporated. The obtained residue was washed with 20 ml of ethanol and dried under vacuum to obtain 2-(2-methoxybenzoyl)-3-(4-tert-butylphenyl)-5-(4 -Methoxyphenyl)pyrrole 260 mg. Next, under nitrogen flow, 260 mg of 2-(2-methoxybenzyl)-3-(4-tert-butylphenyl)-5-(4-methoxyphenyl)pyrrole, 4- A mixed solution of 180 mg of (4-tert-butylphenyl)-2-(4-methoxyphenyl)pyrrole, 206 mg of methanesulfonic anhydride and 10 ml of degassed toluene was heated at 125°C for 7 hours. After the reaction mixture was cooled to room temperature, 20 ml of water was injected, and extraction was performed with 30 ml of methylene chloride. The organic layer was washed twice with 20 ml of water, evaporated, and dried under vacuum to obtain the pyrrromethylene form as a residue. Next, under nitrogen flow, 305 mg of diisopropylethylamine and 670 mg of boron trifluoride diethyl ether complex were added to the obtained mixed solution of 10 ml of pyrromethene and toluene, and the mixture was stirred at room temperature for 3 hours. 20 ml of water was added to the reaction mixture, and the mixture was extracted with 30 ml of methylene chloride. The organic layer was washed twice with 20 ml of water, dried over magnesium sulfate, and then evaporated. After purification by silica column chromatography and vacuum drying, 0.27g of purple-red powder was obtained (yield 70%). The results of ¹ H-NMR analysis of the obtained purple-red powder are as follows, confirming that the above-obtained purple-red powder is [R-1] represented by the following structural formula.

¹ H-NMR (CDCl ₃ (d=ppm)): 1.19 (s, 18H), 3.42 (s, 3H), 3.85 (s, 6H), 5.72 (d, 1H), 6.20 (t, 1H), 6.42 -6.97(m,16H),7.89(d,4H).

Synthesis Example 7 Polysiloxane solution containing silica particles (LS-1)

In a 500ml three-necked flask, add 0.05g (0.4mmol) of methyltrimethoxysilane, 0.66g (3.0mmol) of trifluoropropyltrimethoxysilane, and 0.10g (0.4mmol) of trimethoxysilylpropylsuccinic anhydride. ), 7.97 g (34 mmol) of γ-acryloxypropyltrimethoxysilane and 15.6% by weight of silica particles in isopropyl alcohol dispersion (IPA-ST-UP: manufactured by Nissan Chemical Industry Co., Ltd.) 224.37 g, add 163.93g of ethylene glycol mono-tert-butyl ether. While stirring at room temperature, a phosphoric acid aqueous solution containing 0.088 g of phosphoric acid dissolved in 4.09 g of water was added over 3 minutes. Thereafter, the flask was immersed in a 40°C oil bath and stirred for 60 minutes, and then the oil bath was heated to 115°C over 30 minutes. One hour after the temperature rise starts, the internal temperature of the solution reaches 100°C, and then the solution is further heated and stirred for 2 hours (the internal temperature is 100°C ~ 110°C), thereby obtaining a solution containing silica particles. Polysiloxane solution (LS-1). Furthermore, during the temperature rise and heating stirring, nitrogen gas was circulated at 0.05 l (liter)/minute. During the reaction, a total of 194.01 g of methanol and water were distilled off as by-products. The obtained polysiloxane solution (LS-1) containing silicon dioxide particles had a solid content concentration of 24.3% by weight, and the contents of polysiloxane and silicon dioxide particles in the solid content were 15% by weight and 85% respectively. weight%. The polysiloxane in the obtained silicon dioxide particle-containing polysiloxane solution (LS-1) is derived from methyltrimethoxysilane, trifluoropropyltrimethoxysilane, and 3-trimethoxysilane. The molar ratios of each repeating unit of silylpropylsuccinic anhydride and γ-acryloxypropyltrimethoxysilane are 1.0 mol%, 8.0 mol%, 1.0 mol% and 90.0 mol% respectively.

Example 1 Resin composition for partition walls (P-1)

The polysiloxane obtained by Synthesis Example 1 as a resin was mixed with 5.00 g of titanium dioxide pigment (R-960; manufactured by Japan BASF Co., Ltd. (hereinafter "R-960")) as a white pigment. 5.00 g of the (PSL-1) solution was dispersed using a mill-type disperser filled with zirconia beads to obtain a pigment dispersion liquid (MW-1). In addition, 1.00 g of bis(acetylacetone)palladium as an organometallic compound and 0.861g of triphenylphosphine as a coordination compound having a phosphorus atom (equimolar amounts relative to the organometallic compound) were dissolved in DAA8. In 139 g, an organic metal compound solution (OM-1) was obtained.

Next, 9.98g of the pigment dispersion liquid (MW-1), 1.86g of the organic metal compound solution (OM-1), 0.98g of polysiloxane (PSL-1) solution, and as a photopolymerization initiator were prepared. Ethyl ketone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-,1-(O-acetyl oxime) ("Yanjiagu( Irgacure" (registered trademark) OXE-02, Japan (hereinafter "OXE-2")) manufactured by Japan BASF Co., Ltd.) 0.050 g, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide ("Irgacure )" 819, manufactured by Japan BASF Co., Ltd. (hereinafter "IC-819")) 0.400g, 2-(3-benzylphenyl)propionic acid 1,2- as a photobase generator Diisopropyl-3-[bis(dimethylamino)methylene]guanidine (WPBG-266 (trade name), manufactured by Fujifilm and Wako Pure Chemical Industries, Ltd. (hereinafter "WPBG-266")) 0.100 g , 1.20 g of dipentaerythritol hexaacrylate ("KAYARAD" (registered trademark) DPHA, manufactured by Shin Nippon Pharmaceutical Co., Ltd. (hereinafter "DPHA")) as a photopolymerizable compound, as a liquid-proof compound 40% by weight PGMEA dilute solution 1.00 of a photopolymerizable fluorine-containing compound ("Megafac" (registered trademark) RS-76-E, manufactured by DIC Co., Ltd. (hereinafter "RS-76-E")) g, 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate ("Celloxide" (registered trademark) 2021P, Daicel) Co., Ltd. (hereinafter "Celloxide (registered trademark) 2021P")) 0.100g, ethylene bis(oxyethylene)bis[3-(5-tert-butyl-4-hydroxy-m-toluene) Propionate] ("IRGANOX" (registered trademark) 1010, manufactured by Japan BASF Co., Ltd. (hereinafter "IRGANOX (registered trademark) 1010")) 0.030g and PGMEA 10 of acrylic surfactant ("BYK" (registered trademark) 352, manufactured by BYK-Chemie Japan Co., Ltd. (hereinafter "BYK-352")) Dissolve 0.100g of the weight% diluted solution (equivalent to a concentration of 500ppm) in 4.20g of the solvent PGMEA and stir. The obtained mixture was filtered with a 5.0 μm filter to obtain a resin composition (P-1) for partition walls.

Example 2~Example 3 Resin composition (P-2) for partition walls~Isolation Wall resin composition (P-3)

A resin composition for partition walls (P- 2) and (P-3).

Example 4 Resin composition for partition walls (P-4)

The same procedure as Example 1 was used except that a 40% by weight PGMEA diluted solution of "Megafac" (registered trademark) F477 (manufactured by Dainippon Ink Chemical Industry Co., Ltd.) was used instead of the 40% by weight PGMEA diluted solution of RS-76-E. A resin composition (P-4) for partition walls was obtained in the same manner.

Example 5 Resin composition for partition walls (P-5)

5.00g of R-960 as a white pigment and 5.00g of a polysiloxane (PSL-4) solution as a resin were mixed and dispersed using a mill-type disperser filled with zirconia beads to obtain a pigment dispersion (MW -4). 9.98g of the pigment dispersion (MW-4), 1.86g of the organometallic compound solution (OM-1), 1.16g of the polysiloxane (PSL-4) solution, and WPBG as a photobase generator -266 0.10g, 1.00g of 40% by weight PGMEA diluted solution of F477 as a liquid repellent compound, Celloxide (registered trademark) 2021P 0.100g, THP-17 (trade name, 1.60 g of Toyo Gosei Industry Co., Ltd.), 0.100 g of a 10% by weight PGMEA diluted solution of the surfactant BYK-352, and 4.10 g of PGMEA were mixed and stirred. The obtained mixture was filtered with a 5.0 μm filter to obtain a resin composition (P-5) for partition walls.

Example 6 Resin composition for partition walls (P-6)

An organometallic compound solution (OM-2) was prepared in the same manner as the organometallic compound solution (OM-1), except that silver neodecanoate was used instead of bis(acetylacetone)palladium as the organometallic compound. A resin composition (P-6) for partition walls was obtained in the same manner as in Example 1, except that an organic metal compound solution (OM-2) was used instead of an organic metal compound solution (OM-1).

Example 7 Resin composition for partition walls (P-7)

An organic metal compound solution (OM-3) was prepared in the same manner as the organic metal compound solution (OM-1), except that gold chlorotriphenylphosphine was used instead of bis(acetyl acetonate)palladium as the organic metal compound. A resin composition (P-7) for partition walls was obtained in the same manner as in Example 1, except that the organic metal compound solution (OM-3) was used instead of the organic metal compound solution (OM-1).

Example 8 Resin composition for partition walls (P-8)

An organic metal compound solution (OM-4) was prepared in the same manner as the organic metal compound solution (OM-1) except that bis(acetylacetone)platinum was used instead of bis(acetylacetone)palladium as the organic metal compound. A resin composition (P-8) for partition walls was obtained in the same manner as in Example 1, except that the organic metal compound solution (OM-4) was used instead of the organic metal compound solution (OM-1).

Example 9 Resin composition for partition walls (P-9)

In addition to changing the added amount of the organometallic compound solution (OM-1) to 0.929g, the added amount of the polysiloxane (PSL-1) solution to 1.41g, and the PGMEA 4.20g as the solvent to PGMEA 4.70g, A resin composition (P-9) for partition walls was obtained in the same manner as in Example 1.

Example 10 Resin composition for partition walls (P-10)

In addition to changing the added amount of the organometallic compound solution (OM-1) to 0.400g, the added amount of the polysiloxane (PSL-1) solution to 1.940g, and the PGMEA 4.20g as the solvent to PGMEA 6.27g, A resin composition (P-10) for partition walls was obtained in the same manner as in Example 1.

Example 11 Resin composition for partition walls (P-11)

In addition to changing the added amount of the organometallic compound solution (OM-1) to 4.595g, the added amount of the polysiloxane (PSL-1) solution to 0.010g, and the PGMEA 4.20g as the solvent to PGMEA 2.92g, A resin composition (P-11) for partition walls was obtained in the same manner as in Example 1.

Example 12 Resin composition for partition walls (P-12)

Mix 5.00g of R-960 as a white pigment, 5.00g of polysiloxane (PSL-1) solution as a resin, and 0.01g of titanium nitride as a black pigment, and use a mill-type disperser filled with zirconia beads. Dispersion was performed to obtain a pigment dispersion liquid (MW-2). In addition to adding 9.99g of pigment dispersion (MW-2) instead of pigment dispersion (MW-1), changing the amount of polysiloxane (PSL-1) solution to 1.38g, and using 4.72g of PGMEA as a solvent, A resin composition (P-12) for partition walls was obtained in the same manner as in Example 9.

Example 13 Resin composition for partition walls (P-13)

10.0 g of a polysiloxane (PSL-1) solution as a resin and 0.15 g of titanium nitride as a black pigment were mixed and dispersed using a mill-type disperser filled with zirconia beads to obtain a pigment dispersion (MW -3). In addition to adding 9.99g of pigment dispersion (MW-3) Instead of the pigment dispersion (MW-1), the addition amount of the polysiloxane (PSL-1) solution was changed to 15.16g, and the addition amount of PGMEA was changed from 4.20g to 0.11g. 1A resin composition for partition walls (P-13) was obtained in the same manner.

Example 14 Resin composition for partition walls (P-14)

In addition to using 1.85 g of a 10% DAA solution of bis(acetylacetone)palladium as an organometallic compound instead of the organometallic compound solution (OM-1), the added amount of the polysiloxane (PSL-1) solution was changed to 1.34g. , except that 4.20 g of PGMEA as the solvent was changed to 3.85 g of PGMEA, and a resin composition (P-14) for partition walls was obtained in the same manner as in Example 1.

Example 15 Resin composition for partition walls (P-15)

Obtained in the same manner as in Example 1 except that the photobase generator WPBG-266 was not added, the added amount of the polysiloxane (PSL-1) solution was changed to 1.21g, and the PGMEA 4.20g as the solvent was changed to PGMEA 4.07g. Resin composition for partition walls (P-15).

Example 16 Resin composition for partition wall (P-16)

In addition to not adding the 40% by weight PGMEA dilute solution of the liquid repellent compound RS-76-E, the addition amount of the polysiloxane (PSL-1) solution was changed to 2.01g, and the PGMEA 4.20g as the solvent was changed to PGMEA 4.17g. , a resin composition (P-16) for partition walls was obtained in the same manner as in Example 1.

Comparative Example 1 Resin composition for partition wall (P-17)

In addition to adding 0.867g of the organometallic compound solution (OM-5) instead of the organometallic compound solution (OM-1), the organometallic compound solution (OM-5) was used 1.861 g of triphenylphosphine and 8.139 g of DAA were obtained as a coordination compound having a phosphorus atom, and the added amount of the polysiloxane (PSL-1) solution was changed to 1.41 g, and the added amount of PGMEA was changed from 4.20 g. A resin composition (P-17) for partition walls was obtained in the same manner as in Example 1 except that the weight was 4.76 g.

Comparative Example 2 Resin composition for partition wall (P-18)

Mix 5.00g of R-960 as a white pigment, 5.00g of polysiloxane (PSL-1) solution as a resin, and 0.10g of titanium nitride as a black pigment, and use a mill-type disperser filled with zirconia beads. Dispersion was performed to obtain a pigment dispersion liquid (MW-4). Next, 10.02g of the pigment dispersion (MW-4), 1.73g of the polysiloxane (PSL-1) solution, 0.050g of OXE-02 as a photopolymerization initiator, 0.400g of IC-819, 0.10g of WPBG-266 as a photobase generator, 1.20g of DPHA as a photopolymerizable compound, 1.00g of a 40% by weight PGMEA diluted solution of RS-76-E as a liquid-proof compound, Celloxide ( Registered trademark) 2021P 0.100g, IRGANOX (registered trademark) 1010 0.030g, BYK-352 as surfactant PGMEA 10% dilute solution 0.100g, and PGMEA as solvent 5.31g Mix and stir. The obtained mixture was filtered with a 5.0 μm filter to obtain a resin composition for partition walls (P-18).

Comparative Example 3 Resin composition for partition walls (P-19)

Mix 5.00g of R-960 as a white pigment, 5.00g of polysiloxane (PSL-1) solution as a resin, and 0.10g of zirconium nitride as a black pigment, and use a mill-type disperser filled with zirconia beads. Dispersion was carried out to obtain a pigment dispersion liquid (MW-5). In addition to using pigment dispersion (MW-5) instead of pigment dispersion (MW-4), it is the same as In Comparative Example 2, a resin composition (P-19) for partition walls was obtained in the same manner.

Comparative Example 4 Resin composition for partition walls (P-20)

5.00g of R-960 as the white pigment, 5.00g of the polysiloxane (PSL-1) solution as the resin, and 0.05 of the mixed pigment as the black pigment, with a weight ratio of 60/40 of the red pigment PR254 and the blue pigment PB64. g, and dispersed using a mill-type disperser filled with zirconia beads to obtain a pigment dispersion liquid (MW-6). A resin composition (P-20) for partition walls was obtained in the same manner as in Comparative Example 2, except that the pigment dispersion liquid (MW-6) was used instead of the pigment dispersion liquid (MW-4).

Comparative Example 5 Resin composition for partition walls (P-21)

An organic metal compound solution (OM-5) was prepared in the same manner as the organic metal compound solution (OM-1) except that tris(acetylacetonate)iron was used instead of bis(acetylacetylacetonate)platinum as the organic metal compound. A resin composition (P-21) for partition walls was obtained in the same manner as in Example 1, except that the organic metal compound solution (OM-5) was used instead of the organic metal compound solution (OM-1).

Comparative Example 6 Resin composition for partition walls (P-22)

An organic metal compound solution (OM-6) was prepared in the same manner as the organic metal compound solution (OM-1), except that bis(acetylacetone)nickel was used instead of bis(acetylacetone)platinum as the organic metal compound. A resin composition (P-22) for partition walls was obtained in the same manner as in Example 1, except that the organic metal compound solution (OM-6) was used instead of the organic metal compound solution (OM-1).

The compositions of Examples 1 to 16 and Comparative Examples 1 to 6 are collectively shown in Tables 2 to 3.

Preparation Example 1 Color-changing luminescent material composition (CL-1)

20 parts by weight of a 0.5% by weight toluene solution of a green quantum dot material (Lumidot 640 CdSe/ZnS, average particle diameter 6.3nm: manufactured by Aldrich), 45 parts by weight of DPHA, and "Yanjia" A 30% by weight PGMEA solution of 5 parts by weight of "Irgacure" (registered trademark) 907 (manufactured by Japan BASF Co., Ltd.) and acrylic resin (SPCR-18 (trade name), manufactured by Showa Denko Co., Ltd.) 166 parts by weight and 97 parts by weight of toluene were mixed and stirred to dissolve uniformly. The obtained mixture was filtered using a 0.45 μm syringe filter to prepare a color-changing luminescent material composition (CL-1).

Preparation Example 2 Color-changing luminescent material composition (CL-2)

A color conversion luminescent material was prepared in the same manner as in Preparation Example 1, except that 0.4 parts by weight of the green phosphor G-1 obtained in Synthesis Example 5 was used instead of the green quantum dot material and the amount of toluene added was changed to 117 parts by weight. Composition (CL-2).

Preparation Example 3 Color-changing luminescent material composition (CL-3)

A color conversion luminescent material was prepared in the same manner as in Preparation Example 1, except that 0.4 parts by weight of the red phosphor R-1 obtained in Synthesis Example 6 was used instead of the green quantum dot material and the amount of toluene added was changed to 117 parts by weight. Composition (CL-3).

Preparation Example 4 Color filter forming material (CF-1)

Mix C.I. Pigment Green (Pigment Green) 5990g, C.I. Pigment Yellow (Pigment Yellow) 150-60g, polymer dispersant ("BYK" (registered trademark)-6919 (trade name) BYK-Chemie) Made by the company (hereinafter "BYK-6919")) 75g, adhesive resin ("ADEKA ARKLS" (registered trademark) WR301 (trade name) manufactured by ADEKA Co., Ltd.) 100g and PGMEA 675g were mixed to prepare a slurry. Connect the beaker containing the slurry to the Dyno-Mill with a tube, use zirconia beads with a diameter of 0.5mm as the medium, and conduct dispersion processing at a peripheral speed of 14m/s for 8 hours to produce pigments. Green 59 dispersion (GD-1).

56.54g of Pigment Green 59 dispersion (GD-1), acrylic resin ("Cyclomer" (registered trademark) P (ACA) Z250 (trade name) manufactured by Daicel-allnex Co., Ltd. (hereinafter "P(ACA)Z250")) 3.14g, DPHA 2.64g, photopolymerization initiator ("Optomer" (registered trademark) NCI-831 (trade name) ADEKA Co., Ltd. (hereinafter "NCI-831")) 0.330g, surfactant ("BYK" (registered trademark)-333 (trade name) manufactured by BYK-Chemie Co., Ltd. (hereinafter " 0.04g of BYK-333), 0.01g of BHT as a polymerization inhibitor, and 37.30g of PGMEA as a solvent were mixed to prepare a color filter forming material (CF-1).

Preparation Example 5 Resin composition for light-shielding partition walls

150g of carbon black (MA100 (trade name) manufactured by Mitsubishi Chemical Co., Ltd.), 75g of polymer dispersant BYK-6919, 100g of P(ACA)Z250, and 675g of PGMEA were mixed to prepare a slurry. Connect the beaker containing the slurry to the Dyno mill with a tube, use zirconia beads with a diameter of 0.5mm as the medium, and conduct dispersion processing at a peripheral speed of 14m/s for 8 hours to prepare a pigment dispersion (MB- 1).

Pigment dispersion (MB-1) 56.54g, P(ACA)Z250 3.14g, DPHA 2.64g, NCI-831 0.330g, BYK-333 0.04g, as poly 0.01g of tert-butylcatechol, which is a compound inhibitor, and 37.30g of PGMEA were mixed to prepare a resin composition for light-shielding partition walls.

Preparation Example 6 Low refractive index layer forming material

After mixing 5.350 g of the silica particle-containing polysiloxane solution (LS-1) obtained in Synthesis Example 6, 1.170 g of ethylene glycol mono-tert-butyl ether, and 3.48 g of DAA, use a 0.45 μm Filtration was performed with a syringe filter to prepare a low refractive index layer forming material.

Preparation Example 7 Yellow organic protective layer forming material (YL-1)

Mix C.I. Pigment Yellow 150 150g, polymer dispersant ("BYK" (registered trademark)-6919 (trade name) manufactured by BYK-Chemie Co., Ltd. (hereinafter "BYK-6919") )) 75g, 100g of binder resin ("ADEKA ARKLS" (registered trademark) WR301 (trade name) manufactured by ADEKA Co., Ltd.) and 675g of PGMEA were mixed to prepare a slurry. Connect the beaker containing the slurry to the Dyno mill with a tube, use zirconia beads with a diameter of 0.5mm as the medium, and conduct dispersion processing at a peripheral speed of 14m/s for 8 hours to prepare Pigment Yellow 150 dispersion (YD-1 ).

3.09g of Pigment Yellow 150 dispersion (YD-1), 23.54g of polysiloxane (PSL-1) solution as resin, 6.02g of DPHA as photopolymerizable compound, and silver neodecanoate as organic metal compound were used. The prepared organometallic compound solution (OM-2) 6.02g, OXE-02 0.20g as photopolymerization initiator, IC-819 0.40g, IRGANOX (registered trademark) 1010 0.060g and BYK (BYK)352 PGMEA 10% by weight dilute solution 0.050g (equivalent to a concentration of 500ppm) Dissolve in 61.15g of solvent PGMEA and stir. The obtained mixture was filtered with a 5.0 μm filter to obtain a yellow organic protective layer forming material (YL-1).

(Examples 17 to 20, Examples 22 to 28, Examples 38 to 45, Comparative Examples 7 to 9)

A 10 cm square alkali-free glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness 0.7 mm) was used as the base substrate. The resin composition for partition walls shown in Table 4 to Table 5 was spin-coated thereon, and dried at a temperature of 90° C. for 2 minutes using a hot plate (trade name SCW-636, manufactured by Dainippon Screen Manufacturing Co., Ltd.). Make a dry film. For the produced dry film, a parallel light mask was used to align the exposure machine (trade name PLA-501F, manufactured by Cannon Co., Ltd.), an ultra-high-pressure mercury lamp was used as the light source, and the mask was used to expose the film at an exposure dose of 200 mJ/ cm ² (i-ray) for exposure. Thereafter, an automatic developing device ("AD-2000 (trade name)" manufactured by Takizawa Sangyo Co., Ltd.) was used to perform spray development using a 0.045% by weight potassium hydroxide aqueous solution for 100 seconds, followed by rinsing with water for 30 seconds. Furthermore, using an oven (trade name: IHPS-222, manufactured by Espec Co., Ltd.), it was heated in the air at a temperature of 230° C. for 30 minutes to form a partition wall having a height of 10 μm and a width of 20 μm on the glass substrate. The partition walls were formed in a grid-like pattern with a pitch interval of 30 μm on the short side and 150 μm on the long side.

The color-changing luminescent material composition shown in Table 4 to Table 5 was applied to the area separated by the partition walls of the obtained substrate with partition walls using the inkjet method in a nitrogen atmosphere, and dried at 100° C. for 30 minutes. , forming a pixel with a thickness of 5.0 μm, and obtaining a substrate with partition walls having the structure shown in Figure 2 .

(Example 21)

A 10 cm square alkali-free glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness 0.7 mm) was used as the base substrate. The resin composition for partition walls shown in Table 4 was spin-coated thereon, and dried at a temperature of 90° C. for 2 minutes using a hot plate (trade name SCW-636, manufactured by Dainippon Screen Manufacturing Co., Ltd.) to prepare a dry film. . For the produced dry film, a parallel light mask was used to align the exposure machine (trade name PLA-501F, manufactured by Cannon Co., Ltd.), an ultra-high-pressure mercury lamp was used as the light source, and the mask was used to expose the film at an exposure dose of 200 mJ/ cm ² (i-ray) for exposure. Thereafter, an automatic developing device ("AD-2000 (trade name)" manufactured by Takizawa Sangyo Co., Ltd.) was used to perform spray development using a 2.38% by weight tetramethylammonium hydroxide aqueous solution for 90 seconds, and then using water for 30 seconds. Rinse. Thereafter, in the same manner as before, exposure was performed with an exposure dose of 500 mJ/cm ² (i-ray) without interposing a light shield, and rinsing was performed. Furthermore, using an oven (trade name: IHPS-222, manufactured by Espec Co., Ltd.), it was heated in the air at a temperature of 230° C. for 30 minutes to form a partition wall having a height of 10 μm and a width of 20 μm on the glass substrate. The partition walls were formed in a grid-like pattern with a pitch interval of 30 μm on the short side and 150 μm on the long side.

The color-changing luminescent material composition shown in Table 4 to Table 5 was applied to the area separated by the partition walls of the obtained substrate with partition walls using the inkjet method in a nitrogen atmosphere, and dried at 100° C. for 30 minutes. , forming a pixel with a thickness of 5.0 μm, and obtaining a substrate with partition walls having the structure shown in Figure 2 .

(Example 29)

After the pixels were formed by the same method as in Example 18, the base with the isolation walls was The low refractive index layer forming material was spin-coated on a plate, using a hot plate (trade name SCW-636, manufactured by Dainippon Screen Manufacturing Co., Ltd.), and dried at a temperature of 90° C. for 2 minutes to prepare a dry film. Furthermore, using an oven (trade name IHPS-222, manufactured by Espec Co., Ltd.), it was heated in the air at a temperature of 90° C. for 30 minutes to form a low refractive index layer, and the structure shown in FIG. 3 was obtained. Baseboard with dividing walls.

(Example 30)

On the low refractive index layer of the partitioned substrate having the low refractive index layer obtained in Example 29, a plasma CVD device (PD-220NL, manufactured by Samco) was used to form a layer equivalent to The inorganic protective layer I having a thickness of 50 nm to 1,000 nm and the silicon nitride film having a thickness of 300 nm were used to obtain a substrate with partition walls having the structure shown in FIG. 4 .

(Example 31)

On the substrate with partitions obtained in Example 18, a plasma CVD device (PD-220NL, manufactured by Samco) was used to deposit an inorganic protective layer II with a thickness of 50 nm to 1,000 nm. A silicon nitride film with a thickness of 300 nm is formed on the upper layer of the pixel. Thereafter, on the inorganic protective layer II, using the low refractive index layer forming material obtained in Preparation Example 6, a low refractive index layer with a thickness of 1.0 μm was formed by the same method as in Example 29, to obtain the layer shown in Figure 5 A base plate with partition walls.

(Example 32)

In the area separated by the partition walls of the substrate with partition walls before pixel formation, which was obtained by the same method as Example 17, the coating prepared in Preparation Example 4 was applied so that the film thickness after curing became 2.5 μm. The obtained color filter forming material (CF-1) was vacuum dried. Exposure was performed at an exposure dose of 40 mJ/cm ² (i-ray) through a photomask designed so that the opening area of the substrate with partition walls was exposed. After developing with a 0.3% by weight tetramethylammonium aqueous solution for 50 seconds, it was heated and hardened at 230° C. for 30 minutes to form a color filter with a thickness of 2.5 μm and a width of 50 μm in the area separated by the partition wall. Thereafter, the color-changing luminescent material composition (CL-2) obtained in Preparation Example 2 was coated on the color filter using an inkjet method under a nitrogen atmosphere, and dried at 100° C. for 30 minutes to form A pixel with a thickness of 5.0 μm was used to obtain a substrate with partition walls having the structure shown in FIG. 6 .

(Example 33)

On the color filter of the substrate with the partition wall before pixel formation, a color filter with a thickness of 2.5 μm and a width of 50 μm was formed by the same method as in Example 32, using a plasma CVD apparatus ( PD-220NL, manufactured by Samco Corporation), forms a silicon nitride film with a thickness of 300 nm equivalent to an inorganic protective layer III with a thickness of 50 nm to 1,000 nm. Furthermore, the color-converting luminescent material composition (CL-2) obtained in Preparation Example 2 was coated on the inorganic protective layer III using an inkjet method under a nitrogen atmosphere, and dried at 100° C. for 30 minutes to form a thickness of With a pixel of 5.0 μm, a substrate with isolation walls having the structure shown in Figure 7 was obtained.

(Example 34)

A 10 cm square alkali-free glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness 0.7 mm) was used as the base substrate. On top of it, a plasma CVD device (PD-220NL, manufactured by Samco) is used to form a 300 nm thick nitride film corresponding to an inorganic protective layer IV with a thickness of 50 nm to 1,000 nm. Silicon film. A substrate with partition walls having the structure shown in FIG. 8 was obtained in the same manner as in Example 31, except that the above substrate was used instead of the 10 cm square alkali-free glass substrate.

(Example 35)

On the color filter of the substrate with partition walls before pixel formation, in which a color filter with a thickness of 2.5 μm and a width of 50 μm was formed in the same manner as in Example 32, coating was made by Preparation Example The yellow organic protective layer forming material (YL-1) obtained in 7. was vacuum dried. Exposure was performed at an exposure dose of 40 mJ/cm ² (i-ray) through a photomask designed so that the opening area of the substrate with partition walls was exposed. After developing with a 0.3% by weight tetramethylammonium aqueous solution for 50 seconds, it was heated and hardened at 230° C. for 30 minutes to form a yellow organic protective layer with a thickness of 1.0 μm and a width of 50 μm. Furthermore, the color-changing luminescent material composition (CL-2) obtained in Preparation Example 2 was coated on the yellow organic protective layer using an inkjet method under a nitrogen atmosphere, and dried at 100° C. for 30 minutes to form a thickness of With a pixel of 5.0 μm, a substrate with isolation walls having the structure shown in Figure 7 was obtained.

(Example 36)

A 10 cm square alkali-free glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness 0.7 mm) was used as the base substrate. The yellow organic protective layer-forming material (YL-1) obtained in Preparation Example 7 was applied thereon and dried in vacuum. After exposing the dry film to an exposure dose of 40mJ/cm ² (i-ray) without a light shield, it was developed with a 0.3% by weight tetramethylammonium aqueous solution for 50 seconds, and then heated and hardened at 230°C for 30 minutes. , forming a yellow organic protective layer with a thickness of 1.0 μm. A substrate with partition walls having the structure shown in FIG. 8 was obtained in the same manner as in Example 31, except that the above substrate was used instead of the 10 cm square alkali-free glass substrate.

(Example 37)

A 10 cm square alkali-free glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness 0.7 mm) was used as the base substrate. The light-shielding partition wall-forming material obtained in Preparation Example 5 was spin-coated thereon, and dried using a hot plate (trade name SCW-636, manufactured by Dainippon Screen Manufacturing Co., Ltd.) at a temperature of 90° C. for 2 minutes to produce a dry membrane. For the produced dry film, a parallel light mask was used to align the exposure machine (trade name PLA-501F, manufactured by Cannon Co., Ltd.), an ultra-high-pressure mercury lamp was used as the light source, and the mask was used to expose the film at an exposure dose of 40 mJ/ cm ² (i-ray) for exposure. Thereafter, an automatic developing device ("AD-2000 (trade name)" manufactured by Takizawa Sangyo Co., Ltd.) was used to perform development with a 0.3% by weight tetramethylammonium aqueous solution for 50 seconds, and then rinsed with water for 30 seconds. Furthermore, using an oven (trade name IHPS-222, manufactured by Espec Co., Ltd.), it was heated in the air at a temperature of 230° C. for 30 minutes to obtain a substrate with light-shielding partition walls as follows: The isolation walls have a height of 2.0 μm, a width of 20 μm, and an OD value of 2.0 per 1.0 μm of thickness. They are formed into a grid-like pattern with pitch intervals of 30 μm on the short side and 150 μm on the long side. Thereafter, in the same manner as in Example 17, a substrate with partition walls was obtained in which partition walls with a height of 10 μm and a width of 20 μm were formed on the light-shielding partition walls at intervals of 30 μm on the short side and 150 μm on the long side. The same lattice pattern as the dividing wall. The color-converting luminescent material composition (CL-2) obtained in Preparation Example 22 was applied to the area separated by the partition walls of the obtained substrate with partition walls using an inkjet method in a nitrogen atmosphere. It was dried at 100° C. for 30 minutes to form pixels with a thickness of 5.0 μm, and a substrate with partition walls having the structure shown in Figure 9 was obtained.

The structures of each Example and Comparative Example are shown in Tables 4 to 5.

The evaluation methods in each Example and Comparative Example are shown below.

<Refractive index of white pigment>

Regarding the white pigment used in each example and comparative example, among the refractive index measurement methods for plastics specified in JIS K7142-2014 (enactment date = 2014/04/20), method B (liquid immersion using a microscope) The refractive index was measured using the Becke's line method. The measurement wavelength was set to 550 nm. A "contact liquid" manufactured by Shimadzu Instruments Co., Ltd. was used instead of the immersion liquid used in JIS K7142-2014. Immersion temperature: Measured at 20°C. As a microscope, a polarizing microscope "OPTIPHOTO" (manufactured by Nikon Co., Ltd.) was used. 30 white pigment samples were prepared each, and each refractive index was measured. The average value is used as the refractive index.

<Refractive index of polysiloxane and low refractive index layer>

Polysiloxane, which is the raw material of the partition-forming resin composition used in each Example and Comparative Example, and the low-refractive index layer-forming material obtained in Preparation Example 26 were applied to the silicon wafer using a spinner, respectively. Using a hot plate (trade name SCW-636, manufactured by Dainippon Screen Manufacturing Co., Ltd.), it was dried at a temperature of 90° C. for 2 minutes. Thereafter, an oven (IHPS-222; manufactured by Espec Co., Ltd.) was used to heat the film at 230° C. for 30 minutes in the air to produce a cured film. Using a chromium coupler (PC-2000 (manufactured by Metricon Co., Ltd.)), under atmospheric pressure and 20°C, light with a wavelength of 550 nm is irradiated from a direction perpendicular to the cured film surface, and the refractive index is measured. , rounded to the third decimal place.

<resolution>

Use a spin coater (trade name 1H-360S, manufactured by Mikasa Co., Ltd.), The resin composition for partition walls used in each Example and Comparative Example was spin-coated on a 10 cm square alkali-free glass substrate so that the film thickness after heating became 10 μm, using a hot plate (trade name: SCW-636, Dainippon Screen Manufacturing Co., Ltd.), dried at a temperature of 90°C for 2 minutes to produce a dry film with a film thickness of 10 μm.

For the produced dry film, a parallel light mask alignment exposure machine (trade name PLA-501F, manufactured by Cannon Co., Ltd.) was used, and an ultrahigh-pressure mercury lamp was used as a light source, with intervals of 100 μm, 80 μm, 60 μm, and 50 μm. , 40 μm, 30 μm, and 20 μm width line & space pattern masks were exposed with an exposure dose of 200 mJ/cm ² (i-ray) and a gap of 100 μm. Thereafter, an automatic developing device ("AD-2000 (trade name)" manufactured by Takizawa Sangyo Co., Ltd.) was used to perform spray development using a 0.045% by weight potassium hydroxide aqueous solution for 100 seconds, followed by rinsing with water for 30 seconds.

Using a microscope adjusted to a magnification of 100 times, the developed pattern was magnified and observed, and the resolution was defined as the narrowest line width in the pattern where no residue was found in the unexposed portion. Among them, the case where there are residues even in the unexposed parts near the pattern with a width of 100 μm is set as ">100 μm".

<Reflectivity>

The partition wall-forming resin composition used in each of the Examples and Comparative Examples was processed under the same conditions as in each of the Examples and Comparative Examples, except that the whole was exposed without a light shield during exposure. A monolithic film is produced on a glass substrate. The obtained monolithic film was used as a model of the partition wall of the substrate with partition walls obtained in each of the Examples and Comparative Examples. Regarding the glass substrate with the monolithic film, a spectrophotometer (trade name: CM-2600d, Konica) was used. Manufactured by Konica Minolta (Co., Ltd.), since the whole On the film side, the reflectance at a wavelength of 550 nm was measured using SCI mode. However, when cracks occur in the entire film, accurate values cannot be obtained due to cracks or the like, and therefore the reflectance is not measured.

<Crack resistance>

The partition wall-forming resin composition used in each Example and Comparative Example was spin-coated so that the film thickness after heating became 5 μm, 10 μm, 15 μm, and 20 μm, respectively. Regarding the subsequent steps, except that the entire film was exposed without a light shield during exposure, processing was performed under the same conditions as in each of the examples and comparative examples to produce an integral film on the glass substrate. The obtained integral film was used as a model of the partition wall of the substrate with partition walls obtained in each of the Examples and Comparative Examples, and the glass substrate with the integral film was visually observed to evaluate the occurrence of cracks in the integral film. When even one crack is confirmed, it is judged that the film thickness does not have crack resistance. For example, when there are no cracks in the film thickness of 15 μm and cracks in the film thickness of 20 μm, the crack-resistant film thickness is determined to be “≧15 μm”. In addition, the crack-resistant film thickness when there are no cracks even at 20 μm is judged as "≧20 μm", and the crack-resistant film thickness when there are cracks even at 5 μm is judged as "<5 μm", and these are regarded as crack resistance.

<OD value>

As a model of the partition wall of the partition wall-equipped substrate obtained in each of the Examples and Comparative Examples, a monolithic film was produced on a glass substrate in the same manner as in the evaluation of reflectance. Regarding the obtained glass substrate with the integral film, the intensity of incident light and transmitted light was measured using an optical densitometer (361T (Visual); manufactured by X-rite Corporation). According to the above Equation (1) calculates the OD value. Furthermore, regarding the OD value, points The OD values of the entire film before the heating step and after the heating step were separately measured, including the difference, and are listed in Tables 6 to 7.

In addition, regarding Example 37, as a model of the light-shielding partition wall (A-2), a monolithic film was produced on a glass substrate in the same manner. Regarding the obtained glass substrate with the integral film, the intensity of incident light and transmitted light was measured using an optical densitometer (361T (Visual); manufactured by X-rite Corporation). According to the above Calculated by formula (1).

<Taper angle>

In each of the Examples and Comparative Examples, an optical microscope (FE-SEM (S-4800); manufactured by Hitachi, Ltd.) was used to observe any cross-section of the substrate with the partition wall before pixel formation at an acceleration voltage of 3.0 kV. , determine the cone angle.

<Surface contact angle>

As a model of the partition wall in the substrate with partition walls obtained in each of the Examples and Comparative Examples, a monolithic film was produced on a glass substrate in the same manner as in the evaluation of reflectance. Regarding the surface of the obtained monolithic film, DM-700 manufactured by Kyowa Interface Science Co., Ltd. and a microsyringe were used: Teflon (registered trademark) coating needle for contact angle meter manufactured by Kyowa Interface Science Co., Ltd. 22G, at 25℃ in the atmosphere, measure the surface contact angle according to the wettability test method of the substrate glass surface specified in JIS R3257 (date of establishment = 1999/04/20). Among them, propylene glycol monomethyl ether acetate was used instead of water, and the contact angle between the surface of the entire film and propylene glycol monomethyl ether acetate was measured.

<Inkjet coating properties>

Band isolation before forming pixels obtained by each of the Examples and Comparative Examples In the wall substrate, an inkjet coating device (manufactured by InkjetLabo and Cluster Technology Co., Ltd.) was used using PGMEA as the ink for the pixel portion surrounded by the lattice-shaped partition walls. , for inkjet coating. 160 pL of PGMEA was applied to each grid pattern, and the presence or absence of collapse (a phenomenon in which ink crosses the partition walls and mixes into adjacent pixel portions) was observed, and the inkjet coating properties were evaluated according to the following criteria. The fewer breakouts, the higher the liquid-repellent performance and the better the inkjet coating properties.

A: Ink does not overflow from the pixel.

B: The ink overflows from the pixel to the upper surface of the partition wall in part.

C: The ink overflows from the pixels to the upper surface of the partition wall on the entire surface.

<Thickness>

Regarding the substrates with partitions obtained in each of the Examples and Comparative Examples, a SURFCOM stylus type film thickness measuring device was used to measure the height of the structure before and after the pixel (B) was formed, and the difference was calculated. , thereby measuring the thickness of pixel (B). For Examples 29 to 31, the film thickness of the low refractive index layer (C) was further measured in the same manner. For Examples 32 to 36, the film thickness of the color filter was further measured in the same manner. For Example 37, the film thickness was further measured in the same manner. Measure the thickness (height) of the light-shielding partition wall.

In addition, regarding Examples 30 to 31 and Examples 33 to 34, a polishing device such as a cross-section polisher was used to expose a cross section perpendicular to the base substrate, and the cross section was analyzed using a scanning electron microscope or a transmission electron microscope. Magnify and observe to measure the thickness of the inorganic protective layer I to the inorganic protective layer IV respectively.

<Brightness>

A planar light-emitting device equipped with a commercially available LED backlight (peak wavelength 465 nm) was used as a light source, and the substrate with partition walls obtained in each of the Examples and Comparative Examples was installed so that the pixel portion became the light source side. A current of 30 mA was passed through the planar light-emitting device to light up the LED element, and a spectroradiometer (CS-1000, manufactured by Konica Minolta) was used to measure the luminance (unit: cd/cm ² ) and set as the initial brightness. The evaluation of brightness was performed by setting the initial brightness of Example 45 as a relative value of a standard 100.

In addition, 48 hours after the LED element was lit at room temperature (23° C.), the brightness was measured in the same manner to evaluate changes in brightness over time. The evaluation of brightness was performed by setting the initial brightness of Example 45 to a relative value of 100 as a standard.

<Color characteristics>

The substrate with partition walls obtained in each of the Examples and Comparative Examples was placed on a commercially available white reflective plate such that the pixels were arranged on the side of the white reflective plate. Using a spectrophotometer (CM-2600d, manufactured by Konica Minolta, measuring diameter Φ8 mm), light was irradiated from the base substrate side of the substrate with the partition wall, and a spectrum including regular reflected light was measured.

The color gamut defined by the color standard BT.2020, which can almost reproduce the colors of nature, stipulates that red, green and blue on the spectral locus shown in the chromaticity diagram are the three primary colors. The wavelengths of red, green and blue are respectively equivalent to 630nm. , 532nm and 467nm. Based on the reflectance (R) of the three wavelengths of 470 nm, 530 nm, and 630 nm of the obtained reflection spectrum, the luminescent color of the pixel was evaluated according to the following criteria.

A：R ₅₃₀ /(R ₆₃₀ +R ₅₃₀ +R ₄₇₀ )≧0.55

B: R ₅₃₀ /(R ₆₃₀ +R ₅₃₀ +R ₄₇₀ )<0.55.

<Display characteristics>

The display characteristics of the display device produced by combining the substrate with partitions obtained in each Example and Comparative Example and the organic EL element were evaluated based on the following standards.

A: The green display is very bright, and it is a display device with sharp and excellent contrast.

B: Although the color is slightly unnatural, it is a display device with no problems.

<Color Mix>

In the substrate with partition walls before forming the pixels obtained in each of the Examples and Comparative Examples, a color-changing luminescent material is applied to a part of the pixel portion surrounded by the grid-shaped partition walls using an inkjet method. Material (CL-2) was dried at 100°C for 30 minutes to form a pixel with a thickness of 5.0 μm. Thereafter, in the pixel portion surrounded by the grid-like partition walls, the color-converting luminescent material composition (CL-2) was applied using an inkjet method in an area adjacent to the area where the color-converting luminescent material composition (CL-2) was applied. CL-3), dried at 100°C for 30 minutes to form a pixel with a thickness of 5.0 μm.

On the other hand, a blue organic EL unit having the same width as the pixel portion surrounded by lattice-shaped partition walls is produced, and the substrate with the partition walls faces the blue organic EL unit, and is attached with a sealant. Combined, a display device having the structure shown in Fig. 10 is obtained.

In the blue organic EL unit 11 in FIG. 10 , the blue organic EL unit is bonded only directly below the pixel 3 (CL-2) formed of the color conversion luminescent material composition (CL-2). In the lit state, a microspectrophotometer LVmicro-V (Lambda Vision) is used for the pixel 3 (CL-3) portion formed of the color-changing luminescent material composition (CL-3). (manufactured by Co., Ltd.), measuring wavelength 630nm Absorption intensity A (630nm). The smaller the value of the light absorption intensity A (630nm), the more difficult it is to cause color mixing. Mixed colors are judged based on the following criteria.

A：A(630nm)<0.01

B: 0.01≦A(630nm)≦0.5

C: 0.5<A(630nm).

The evaluation results of each Example and Comparative Example are shown in Tables 6 to 7.

Claims (11)

A substrate with an isolation wall, having (A-1) a patterned isolation wall on a base substrate, the (A-1) patterned isolation wall containing resin, white pigment, and black particles or yellow particles, Among them, the reflectance per 10 μm of thickness at a wavelength of 550 nm is 20% to 60%, and the optical density value per 10 μm of thickness is 1.0 to 3.0. The substrate with isolation walls according to claim 1, wherein the black particles or yellow particles are selected from the group consisting of palladium oxide, platinum oxide, gold oxide, silver oxide, palladium, platinum, gold and silver. particles composed of at least one metal oxide or metal. The substrate with partition walls according to claim 1 or 2, wherein the (A-1) patterned partition wall further contains a liquid-proof compound, and (A-1) the liquid-proof compound in the patterned partition wall The content of the compound is 0.01% by weight to 10% by weight. The substrate with isolation walls as described in claim 1 or 2, wherein the surface contact angle of the patterned isolation walls (A-1) relative to propylene glycol monomethyl ether acetate is 10° to 70°. The substrate with isolation walls according to claim 1 or 2, wherein the cross section of the patterned isolation walls of (A-1) is measured using an FE-SEM with an accelerating voltage of 3.0 kV and a magnification of 2,500 times. The cone angle calculated from the angle between the side and the bottom of the section is 45°~110°. The substrate with partition walls as described in claim 1 or 2, wherein There is further provided (A-2) a patterned light-shielding isolation wall having an optical density value per 1.0 μm of thickness of 0.5 or more between the base substrate and (A-1) the patterned isolation wall. The substrate with isolation walls according to claim 1 or 2, further having (B) pixels containing a color-changing luminescent material arranged and separated by the (A-1) patterned isolation walls. The substrate with isolation walls as claimed in claim 7, wherein the color-changing luminescent material contains a phosphor selected from the group consisting of quantum dots and pyrrromethylene derivatives. The substrate with isolation walls according to claim 7, wherein a color filter with a thickness of 1 μm to 5 μm is further provided between the base substrate and (B) the pixel containing the color-changing luminescent material. The substrate with isolation walls according to claim 9, wherein on the base substrate or between the color filter with a thickness of 1 μm to 5 μm and (B) the pixel containing the color conversion luminescent material, there is further a thickness 50nm~1,000nm inorganic protective layer and/or yellow organic protective layer. A display device having a substrate with an isolation wall as described in any one of claims 1 to 10; and a plurality of light-emitting diodes selected from the group consisting of liquid crystal units and organic electroluminescence units arranged with a vertical and horizontal length of 100 μm to 10 mm. A micro-LED unit of a body unit and a micro-LED unit in which a plurality of LED units with a vertical and horizontal length of less than 100 μm are arranged.

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