KR102819502B1 - Resin composition, light-shielding film, and substrate having a partition formed thereon - Google Patents

Abstract

A resin composition useful for forming a partition on a substrate of a display device, which has excellent weather resistance and can form a partition having both high reflectivity for all visible light and high light-shielding property for blue light. A relatively inexpensive resin composition is disclosed. The resin composition contains a resin, a photopolymerization initiator or a quinonediazide compound, a white pigment, an organic silver compound, and a reducing agent. Examples of the reducing agent include a compound containing two or more phenolic hydroxyl groups in a molecule or a compound containing an enediol group.

Description

Resin composition, light-shielding film, and substrate having a partition formed thereon

The present invention relates to a resin composition, a light-shielding film formed from the resin composition, and a substrate having a barrier rib formed with a patterned barrier rib.

Recently, as a color display device with high light utilization efficiency, a color display device has been proposed, which comprises a wavelength conversion section made of a fluorescent substance for wavelength conversion, and a polarization separation means and a polarization conversion means (see, for example, patent document 1). For example, a color display device has been proposed, which includes a wavelength conversion section having a blue light source, a liquid crystal element, a fluorescent substance that emits red fluorescence when excited by blue light, a fluorescent substance that emits green fluorescence when excited by blue light, and a light-scattering layer that scatters blue light (see, for example, patent document 2).

However, color filters including color conversion fluorescent materials as described in Patent Documents 1 and 2 have low light extraction efficiency and insufficient brightness because fluorescence occurs in all directions. In particular, in high-definition display devices such as 4K and 8K, pixel sizes are reduced, so brightness becomes a significant issue, and thus higher brightness is demanded.

Japanese Patent Publication No. 2000-131683 Japanese Patent Publication No. 2009-244383 Japanese Patent Publication No. 2000-347394 Japanese Patent Publication No. 2006-259421 WO2020/008969

In general, in these display devices, color conversion phosphors are partitioned by partition walls to prevent color mixing of adjacent pixels. In particular, if the excitation light of the color conversion phosphor leaks to an adjacent pixel, it will emit light within the adjacent pixel and cause color mixing, so in many cases, the light-blocking property of the partition walls for blue light (wavelength 450 nm) becomes very important. In addition, in order to improve the brightness of the display device, it is effective to partition the color conversion phosphors by partition walls with high reflectivity. From the above, a partition material that achieves both high light-blocking property of blue light and high reflectivity of the entire visible light is desired.

In order to form a barrier wall that has both high light-shielding properties for blue light and high reflectivity for all visible light, the inventors first examined a method of using a material in which a yellow pigment, which is a complementary color of blue, is added to a white barrier wall material using a titanium oxide white pigment that exhibits high reflectivity. However, this method revealed a problem in that the entire exposure light was absorbed by the white pigment and the yellow pigment, and the light did not reach the bottom of the film during exposure, resulting in poor pattern processability.

Therefore, the inventors devised a design to transmit exposure light during a pattern exposure process after film formation and to increase light-shielding properties after heating the exposed film at a temperature of 120°C or higher and 250°C or lower. Furthermore, this was achieved by using a resin composition containing a resin, an organometallic compound containing at least one metal selected from the group consisting of silver, gold, platinum, and palladium, a photopolymerization initiator or a quinonediazide compound, and a solvent (see Patent Document 5). In particular, it was found that when an organosilver compound was used, the film turned yellow after heating due to the generation of silver nanoparticles, and the light-shielding properties for blue light increased.

However, this technology has been newly found to have a problem in terms of weather resistance, since if unreacted organic silver compounds remain in the film after heating, they are decomposed by light or heat, and the color of the film changes. In addition, since it is necessary to use a large amount of expensive organic silver compounds (more than 1% of the solid content), there is also a problem in terms of cost. In addition, in order to sufficiently increase the light-blocking properties of the film, heating at 150°C or higher is necessary, and this technology cannot be applied when heating conditions at low temperatures of about 100 to 120°C are required.

Therefore, the purpose of the present invention is to provide, relatively inexpensively, a resin composition capable of forming a barrier wall having excellent weather resistance and high light-shielding properties for blue light and high reflectivity for all visible light, even under heating conditions of about 100 to 120°C.

The inventors of the present invention have found, as a result of prior research, that a partition wall having excellent weather resistance and high reflectivity for all visible light and high light-shielding properties for blue light can be formed by a resin composition containing a resin, a photopolymerization initiator or a quinonediazide compound, a white pigment and/or a light-shielding pigment, an organic silver compound, and a reducing agent, thereby arriving at the present invention.

That is, the present invention provides the following.

(1) A resin composition containing a resin, a photopolymerization initiator or a quinonediazide compound, a white pigment and/or a light-blocking pigment, an organic silver compound, and a reducing agent.

(2) A resin composition according to (1), wherein the reducing agent is a compound containing two or more phenolic hydroxyl groups or a compound containing an enediol group in the molecule.

(3) A resin composition according to (1) or (2), wherein the organic silver compound is a compound represented by the following general formula (1).

(In general formula (1), R ₁ represents hydrogen or an organic group having 1 to 30 carbon atoms.)

(4) A resin composition according to (1) or (2), wherein the organic silver compound is a polymer compound having a structure represented by at least the following general formula (2).

(In general formula (2), R ² and R ³ each independently represent hydrogen or an organic group having 1 to 30 carbon atoms).

A resin composition according to any one of claims (1) to (4), wherein the reducing agent is a hydroquinone compound represented by the following general formula (3).

(In general formula (3), R ₄ , R ₅ , R ₆ , and R ₇ each independently represent hydrogen, a hydroxy group, or an organic group having 1 to 30 carbon atoms.)

(6) A resin composition according to any one of claims (1) to (5), wherein the resin is a polysiloxane having a styryl group.

(7) A resin composition according to any one of (1) to (6), further containing a lyotropic compound having a photoradical polymerizable group.

(8) A light shielding film formed by curing the resin composition described in any one of (1) to (7).

(9) A substrate having a partition wall formed with a pattern (A-1) by a resin composition described in any one of (1) to (7) on a substrate, wherein the substrate has a partition wall having a reflectivity of 10% to 60% per 10 ㎛ of thickness at a wavelength of 450 nm and an OD value of 1.5 to 5.0 per 10 ㎛ of thickness at a wavelength of 450 nm.

(10) A substrate having a partition wall formed on a substrate having a pattern formed on (A-1), wherein the pattern formed partition wall contains a resin, a white pigment and/or a light-blocking pigment, silver oxide and/or silver particles, and a quinone compound.

(11) A substrate having a partition wall formed on the (A-1) pattern, comprising a resin, a white pigment, silver oxide and/or silver particles, as in (9).

(12) A substrate having a partition formed thereon as described in any one of (9) to (11), wherein the pattern-formed partition (A-1) further contains a liquid-repellent compound, and the content of the liquid-repellent compound in the pattern-formed partition (A-1) is 0.01 wt% to 10 wt%.

(13) A substrate having a barrier rib formed according to any one of (9) to (12), further comprising a patterned light-shielding barrier rib having an OD value of 0.5 or more per 1.0 ㎛ of thickness (A-2) between the above substrate and the patterned barrier rib (A-1).

(14) A substrate having a partition wall formed according to any one of (9) to (13) further comprising a pixel layer containing a color conversion luminescent material (B) arranged and partitioned by the partition wall formed with the pattern (A-1).

(15) A substrate having a partition wall formed thereon, wherein the color conversion luminescent material comprises a phosphor selected from quantum dots and pyrromethene derivatives.

(16) A substrate having a partition wall formed between the substrate and the pixel layer containing the color conversion luminescent material (B) and further including a color filter having a thickness of 1 to 5 μm as in (14) or (15).

(17) A display device having a substrate having a partition wall formed as described in any one of (9) to (16), and a light-emitting light source selected from a liquid crystal cell, an organic EL cell, a mini LED cell, and a micro LED cell.

The resin composition of the present invention allows exposure light to pass through during a pattern exposure process after film formation, but when the exposed film is heated at a temperature of 100°C or higher and 250°C or lower, the organic silver compound in the film is reduced by a reducing agent, efficiently generating yellow particles and improving the light-blocking property of blue light, thereby enabling the formation of a fine thick film barrier pattern having excellent weather resistance and high reflectivity of all visible light and high light-blocking property of blue light.

FIG. 1 is a cross-sectional view showing one embodiment of a substrate having a partition wall formed thereon according to the present invention having patterned partition walls.
FIG. 2 is a cross-sectional view showing one embodiment of a substrate having a barrier rib formed thereon according to the present invention, having pixels containing patterned barrier ribs and color conversion luminescent materials.
FIG. 3 is a cross-sectional view showing one embodiment of a substrate having a barrier rib formed thereon according to the present invention, which has a patterned barrier rib, a color conversion luminescent material, and a light-shielding barrier rib.
FIG. 4 is a cross-sectional view showing one embodiment of a substrate having a partition formed thereon according to the present invention, having a patterned partition, a color conversion luminescent material, and a color filter.
FIG. 5 is a cross-sectional view showing one embodiment of a substrate having a barrier rib formed thereon according to the present invention, which has a patterned barrier rib, a color conversion luminescent material, a light-shielding barrier rib, and a color filter.
FIG. 6 is a cross-sectional view showing one embodiment of a substrate having a barrier rib formed thereon according to the present invention, having a patterned barrier rib, a color conversion luminescent material, and a low refractive index layer.
FIG. 7 is a cross-sectional view showing one embodiment of a substrate having a barrier rib formed thereon according to the present invention, having a patterned barrier rib, a color conversion luminescent material, a low refractive index layer, and an inorganic protective layer (I).
FIG. 8 is a cross-sectional view showing one embodiment of a substrate having a barrier rib formed thereon according to the present invention, having a patterned barrier rib, a color conversion luminescent material, a low refractive index layer, and an inorganic protective layer (I).
FIG. 9 is a cross-sectional view showing one embodiment of a substrate having a barrier rib formed thereon according to the present invention, which has a patterned barrier rib, a color conversion luminescent material, a light-shielding barrier rib, a color filter, a low-refractive-index layer, and an inorganic protective layer (I).
FIG. 10 is a cross-sectional view showing one embodiment of a substrate having a barrier rib formed thereon according to the present invention, having a patterned barrier rib, a color conversion luminescent material, a low refractive index layer, and an inorganic protective layer (II).
FIG. 11 is a cross-sectional view showing one embodiment of a substrate having a barrier rib formed thereon according to the present invention, having a patterned barrier rib, a color conversion luminescent material, a color filter, an inorganic protective layer (III), and/or a yellow organic protective layer.
FIG. 12 is a cross-sectional view showing one embodiment of a substrate having a barrier rib formed thereon of the present invention having a patterned barrier rib and a color conversion luminescent material and an inorganic protective layer (IV) and/or a yellow organic protective layer.
FIG. 13 is a cross-sectional view showing one embodiment of a substrate having a barrier rib formed thereon according to the present invention, having a patterned barrier rib and pixels containing light-emitting light sources selected from organic EL cells, mini LED cells, and micro LED cells.
FIG. 14 is a cross-sectional view showing one embodiment of a substrate having a barrier rib formed thereon of the present invention, having pixels containing patterned barrier ribs, color conversion luminescent materials, and light-emitting light sources selected from organic EL cells, mini LED cells, and micro LED cells.
Figure 15 is a cross-sectional view showing the configuration of a display device used for color mixing evaluation in an embodiment.

Hereinafter, suitable embodiments of the resin composition according to the present invention, the light-shielding film formed by the resin composition, and the substrate having the partition formed thereon will be specifically described, but the present invention is not limited to the embodiments below, and can be implemented by making various changes depending on the purpose or use.

The resin composition of the present invention can be suitably used as a material for forming a partition wall that partitions a color conversion fluorescent substance, a light-emitting light source selected from an organic EL cell, a mini LED cell, a micro LED cell, etc. The resin composition of the present invention contains a resin, a photopolymerization initiator or a quinonediazide compound, a white pigment and/or a light-blocking pigment, an organic silver compound, and a reducing agent.

The resin has the function of improving the crack resistance and light resistance of the bulkhead. The content of the resin in the solid content of the resin composition is preferably 10 wt% or more, and more preferably 20 wt% or more, from the viewpoint of improving the crack resistance of the bulkhead in heat treatment. On the other hand, the content of the resin in the solid content of the resin composition is preferably 60 wt% or less, and more preferably 50 wt% or less, from the viewpoint of improving light resistance. Here, the solid content means all components excluding volatile components such as a solvent, among the components included in the resin composition. The amount of the solid content can be obtained by measuring the residue obtained by heating the resin composition and evaporating the volatile components.

Examples of the resin include polysiloxane, polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, (meth)acrylic polymer, etc. Here, (meth)acrylic polymer means a polymer of methacrylic acid ester and/or acrylic acid ester. Two or more of these may be contained. Among these, polysiloxane is preferable in terms of excellent heat resistance and light resistance.

Polysiloxane is a hydrolysis-dehydration condensation product of organosilane. When the resin composition of the present invention has negative photosensitivity, it is preferable that the polysiloxane contains at least a repeating unit represented by the following general formula (4). It may also contain another repeating unit. By containing a repeating unit derived from a bifunctional alkoxysilane compound represented by the general formula (4), excessive thermal polymerization (condensation) of the polysiloxane due to heating can be suppressed, and the crack resistance of the partition wall can be improved. It is preferable that the repeating unit represented by the general formula (4) is contained in an amount of 10 to 80 mol% among the total repeating units in the polysiloxane. By containing 10 mol% or more of the repeating unit represented by the general formula (4), the crack resistance can be further improved. The content of the repeating unit represented by the general formula (4) is more preferably 15 mol% or more, and even more preferably 20 mol% or more. Meanwhile, by including 80 mol% or less of the repeating unit represented by general formula (4), the molecular weight of polysiloxane can be sufficiently increased during polymerization to improve the coating property. The content of the repeating unit represented by general formula (4) is more preferably 70 mol% or less.

In the above general formula (4), R ⁸ and R ⁹ may be the same or different, and represent a monovalent organic group having 1 to 20 carbon atoms. From the viewpoint of facilitating the adjustment of the molecular weight of polysiloxane during polymerization, R ⁸ and R ⁹ are preferably groups selected from an alkyl group having 1 to 6 carbon atoms and an aryl group having 6 to 12 carbon atoms. However, the alkyl group and the aryl group may have at least a portion of their hydrogens replaced by a radical polymerizable group. In this case, in the cured product of the negative photosensitive resin composition, the radical polymerizable group may be radically polymerized.

It is also preferable that the polysiloxane contains a repeating unit represented by the following general formula (5). By containing a repeating unit derived from a trifunctional alkoxysilane compound represented by the general formula (5), the crosslinking density of the polysiloxane is increased after film formation, thereby improving the hardness and chemical resistance of the film. It is preferable that the polysiloxane contains 10 to 80 mol% of the repeating unit represented by the general formula (5) among the total repeating units. The content of the repeating unit represented by the general formula (5) is more preferably 15 mol% or more, and even more preferably 20 mol% or more. On the other hand, by containing 80 mol% or less of the repeating unit represented by the general formula (5), excessive thermal polymerization (condensation) of the polysiloxane due to heating can be suppressed, thereby improving the crack resistance of the bulkhead. The content of the repeating unit represented by the general formula (5) is more preferably 70 mol% or less.

In the above general formula (5), R ¹⁰ represents a monovalent organic group having 1 to 20 carbon atoms. From the viewpoint of facilitating the adjustment of the molecular weight of the polysiloxane during polymerization, R ¹⁰ is preferably a group selected from an alkyl group having 1 to 6 carbon atoms and an aryl group having 6 to 12 carbon atoms. However, the alkyl group and the aryl group may have at least a part of their hydrogens substituted by a radical polymerizable group. In this case, in the cured product of the negative photosensitive resin composition, the radical polymerizable group may be radically polymerized. Furthermore, the polysiloxane may contain two or more types of repeating units represented by the general formula (5) having different R ¹⁰ . In the general formula (5), it is preferable that R ¹⁰ contains a repeating unit containing a styryl group. By including a repeating unit derived from a trifunctional alkoxysilane compound containing a styryl group, the crosslinking density of the polysiloxane is increased after film formation even under low-temperature heating conditions of approximately 100 to 120°C, thereby improving the hardness and chemical resistance of the film.

The repeating units represented by the above general formulae (4) and (5) are derived from alkoxysilane compounds represented by the following general formulae (6) and (7), respectively. That is, the polysiloxane including the repeating units represented by the above general formulae (4) and (5) can be obtained by hydrolyzing and polycondensing an alkoxysilane compound including the alkoxysilane compounds represented by the following general formulae (6) and (7). Another alkoxysilane compound may also be used. In addition, in the general formulae (6) and (7), the notations "-(OR ¹¹ ) ₂ " and "-(OR ¹¹ ) ₃ " mean that two and three "-(OR ¹¹ )" are bonded to Si atoms, respectively.

In the above general formulas (6) and (7), R ⁸ to ^{R 10} represent the same groups as R ⁸ to R ¹⁰ in general formulas (4) and (5), respectively. R ¹¹ may be the same or different, and represents a monovalent organic group having 1 to 20 carbon atoms, and is preferably an alkyl group having 1 to 6 carbon atoms.

As the alkoxysilane compound represented by the general formula (6), for example, dimethyldimethoxysilane, dimethyldiethoxysilane, ethylmethyldimethoxysilane, ethylmethyldiethoxysilane, methylpropyldimethoxysilane, methylpropyldiethoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, styrylmethyldimethoxysilane, styrylmethyldiethoxysilane, γ-methacryloylpropylmethyldimethoxysilane, γ-methacryloylpropylmethyldiethoxysilane, γ-acryloylpropylmethyldimethoxysilane, γ-acryloylpropylmethyldiethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 2-(3,4-epoxycyclohexyl)ethylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethylethyldimethoxysilane, methylphenyldimethoxysilane, methylphenyldiethoxysilane, 3-dimethylmethoxysilylpropyl succinic anhydride, 3-dimethylethoxysilylpropyl succinic anhydride, 3-dimethylmethoxysilylpropionic acid, 3-dimethylethoxysilylpropionic acid, 3-dimethylmethoxysilylpropylcyclohexyldicarboxylic acid anhydride, 3-dimethylethoxysilylpropylcyclohexyldicarboxylic acid anhydride, bis(trifluoromethyl)dimethoxysilane, bis(trifluoropropyl)dimethoxysilane, bis(trifluoropropyl)diethoxysilane, trifluoropropylmethyldimethoxysilane, Examples thereof include trifluoropropylmethyldiethoxysilane, trifluoropropylethyldimethoxysilane, trifluoropropylethyldiethoxysilane, and heptadecafluorodecylmethyldimethoxysilane. Two or more of these may be used.

As the alkoxysilane compound represented by the general formula (7), for example, trifunctional alkoxysilane compounds such as methyl trimethoxysilane, methyl triethoxysilane, ethyl trimethoxysilane, ethyl triethoxysilane, propyl trimethoxysilane, propyl triethoxysilane, isobutyl trimethoxysilane, isobutyl triethoxysilane, cyclohexyl trimethoxysilane, cyclohexyl triethoxysilane, 3-isocyanatepropyl trimethoxysilane, 3-isocyanatepropyl triethoxysilane, 3-aminopropyl trimethoxysilane, 3-aminopropyl triethoxysilane, 3-ureidopropyl trimethoxysilane, and 3-ureidopropyl triethoxysilane; Alkoxysilane compounds containing epoxy groups or oxetane groups, such as 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltriethoxysilane, 3-ethyl-3-{[3-(trimethoxysilyl)propoxy]methyl}oxetane, 3-ethyl-3-{[3-(triethoxysilyl)propoxy]methyl}oxetane: Phenyltrimethoxysilane, Phenyltriethoxysilane, 1-naphthyltrimethoxysilane, 2-naphthyltrimethoxysilane, 2-naphthyltrimethoxysilane, 2-naphthyltrimethoxysilane, tolyltrimethoxysilane, tolyltriethoxysilane, Aromatic ring-containing alkoxysilane compounds such as 1-phenylethyltrimethoxysilane, 1-phenylethyltriethoxysilane, 2-phenylethyltrimethoxysilane, 2-phenylethyltriethoxysilane, 3-trimethoxysilylpropylphthalic anhydride, and 3-triethoxysilylpropylphthalic anhydride; Alkoxysilane compounds containing radical polymerizable groups such as styryltrimethoxysilane, styryltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, allyltrimethoxysilane, allyltriethoxysilane, γ-acryloylpropyltrimethoxysilane, γ-acryloylpropyltriethoxysilane, γ-methacryloylpropyltrimethoxysilane, and γ-methacryloylpropyltriethoxysilane; Carboxyl group-containing alkoxysilane compounds such as 3-trimethoxysilylpropionic acid, 3-triethoxysilylpropionic acid, 4-trimethoxysilylbutyric acid, 4-triethoxysilylbutyric acid, 5-trimethoxysilylvaleric acid, 5-triethoxysilylvaleric acid, 3-trimethoxysilylpropyl succinic anhydride, 3-triethoxysilylpropyl succinic anhydride, 3-trimethoxysilylpropylcyclohexyldicarboxylic acid anhydride, 3-triethoxysilylpropylcyclohexyldicarboxylic acid anhydride, 3-trimethoxysilylpropylphthalic anhydride, and 3-triethoxysilylpropylphthalic anhydride; Examples thereof include fluorine-containing alkoxysilane compounds such as trifluoropropyltrimethoxysilane, trifluoropropyltriethoxysilane, perfluoropentyltrimethoxysilane, perfluoropentyltriethoxysilane, tridecafluorooctyltrimethoxysilane, tridecafluorooctyltriethoxysilane, tridecafluorooctyltripropoxysilane, tridecafluorooctyltriisopropoxysilane, heptadecafluorodecyltrimethoxysilane, and heptadecafluorodecyltriethoxysilane. Two or more of these may be used.

When the resin composition of the present invention has negative photosensitivity, it is preferable to contain at least one radical polymerizable group-containing alkoxysilane compound as the alkoxysilane compound represented by the general formula (6) and/or (7). By containing the radical polymerizable group-containing alkoxysilane compound, a crosslinking reaction can proceed with radicals generated in the exposed portion, thereby increasing the degree of curing of the exposed portion. Furthermore, when the resin composition of the present invention has negative photosensitivity, it is preferable to contain at least one carboxyl group-containing alkoxysilane compound as the alkoxysilane compound represented by the general formula (6) and/or (7). By containing the carboxyl group-containing alkoxysilane compound, the solubility of the unexposed portion is improved, thereby improving the resolution during pattern processing.

Examples of other alkoxysilane compounds include tetrafunctional alkoxysilane compounds such as tetramethoxysilane, tetraethoxysilane, and silicate 51 (tetraethoxysilane oligomer); and monofunctional alkoxysilane compounds such as trimethylmethoxysilane and triphenylmethoxysilane. Two or more of these may be used.

Among the alkoxysilane compounds that are raw materials for polysiloxane, the content of the alkoxysilane compound represented by the general formula (6) is preferably 10 mol% or more, more preferably 15 mol% or more, and even more preferably 20 mol% or more, from the viewpoint of making the content of the repeating unit represented by the general formula (4) among all repeating units of the polysiloxane within the above-mentioned range. On the other hand, the content of the alkoxysilane compound represented by the general formula (7) is preferably 80 mol% or less, and more preferably 70 mol% or less, from the same viewpoint.

The weight average molecular weight (Mw) of the polysiloxane is preferably 1,000 or more from the viewpoint of coatability, and more preferably 2,000 or more. On the other hand, from the viewpoint of developability, the Mw of the polysiloxane is preferably 500,000 or less, and more preferably 300,000 or less. Here, the Mw of the polysiloxane in the present invention refers to a polystyrene conversion value measured by gel permeation chromatography (GPC). The measurement method is as described in the examples described below.

Polysiloxane can be obtained by hydrolyzing the aforementioned organosilane compound and then subjecting the hydrolyzate to a dehydration condensation reaction in the presence or absence of a solvent.

Various conditions for hydrolysis can be set according to the properties suitable for the intended use by considering the reaction scale, the size and shape of the reaction vessel, etc. Various conditions include, for example, acid concentration, reaction temperature, and reaction time.

For the hydrolysis reaction, an acid catalyst such as hydrochloric acid, acetic acid, formic acid, nitric acid, oxalic acid, hydrochloric acid, sulfuric acid, phosphoric acid, polycarboxylic acid or anhydride thereof, or ion exchange resin can be used. Among these, an acidic aqueous solution containing an acid selected from formic acid, acetic acid, and phosphoric acid is preferable.

When an acid catalyst is used in the hydrolysis reaction, the amount of the acid catalyst added is preferably 0.05 parts by weight or more, and more preferably 0.1 parts by weight or more, relative to 100 parts by weight of the total alkoxysilane compound used in the hydrolysis reaction, from the viewpoint of making the hydrolysis proceed more rapidly. On the other hand, from the viewpoint of appropriately adjusting the progress of the hydrolysis reaction, the amount of the acid catalyst added is preferably 20 parts by weight or less, and more preferably 10 parts by weight or less, relative to 100 parts by weight of the total alkoxysilane compound. Here, the total amount of the alkoxysilane compound refers to the amount including all of the alkoxysilane compound, its hydrolyzate, and its condensate. The same shall apply hereinafter.

The hydrolysis reaction can be carried out in a solvent. The solvent can be appropriately selected considering the stability, hygroscopicity, volatility, etc. of the resin composition.

When a solvent is generated by a hydrolysis reaction, it is also possible to perform hydrolysis without a solvent. When used in a resin composition, it is also preferable to adjust the resin composition to an appropriate concentration by adding more solvent after the hydrolysis reaction is completed. In addition, it is also possible to distill and remove all or part of the generated alcohol, etc. by heating and/or under reduced pressure after hydrolysis, and then add a suitable solvent.

As a method for the dehydration condensation reaction, for example, a method of directly heating a silanol compound solution obtained by a hydrolysis reaction of an organosilane compound, etc. is exemplified. The heating temperature is preferably 50°C or higher and the boiling point of the solvent or lower, and the heating time is preferably 1 to 100 hours. In addition, in order to increase the degree of polymerization of the polysiloxane, reheating or addition of a base catalyst may be performed. In addition, depending on the purpose, an appropriate amount of the generated alcohol, etc. may be distilled and removed by heating and/or under reduced pressure after the dehydration condensation reaction, and then a suitable solvent may be added.

When the resin composition of the present invention is used to form a pattern of the partition wall (A-1) described later, it is preferable that it has negative or positive photosensitivity. When imparting negative photosensitivity, it is preferable that it contains a photopolymerization initiator, and it is possible to form a partition wall having a high-detailed pattern shape. The negative photosensitive resin composition also preferably contains a photopolymerizable compound. On the other hand, when imparting positive photosensitivity, it is preferable that it contains a quinonediazide compound.

Any photopolymerization initiator may be used as long as it decomposes and/or reacts upon irradiation with light (including ultraviolet rays and electron beams) to generate radicals. Examples thereof include α-aminoalkylphenone compounds such as 2-methyl-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, and 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1; acylphosphine oxide compounds such as 2,4,6-trimethylbenzoylphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, and bis(2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl)-phosphine oxide; Oxime ester compounds, such as 1-phenyl-1,2-propanedione-2-(O-ethoxycarbonyl)oxime, 1,2-octanedione-1-[4-(phenylthio)-2-(O-benzoyloxime)], 1-phenyl-1,2-butadione-2-(O-methoxycarbonyl)oxime, 1,3-diphenylpropanetrione-2-(O-ethoxycarbonyl)oxime, and ethanone-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-1-(O-acetyloxime); α-Hydroxyketone compounds, such as 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 4-(2-hydroxyethoxy)phenyl-(2-hydroxy-2-propyl)ketone, and 1-hydroxycyclohexyl-phenyl ketone; acetophenone compounds, such as 2,2-diethoxyacetophenone, 2,3-diethoxyacetophenone, 4-t-butyldichloroacetophenone, benzalacetophenone, and 4-azidebenzalacetophenone; and the like. Two or more of these may be contained.

In the resin composition of the present invention, the content of the photopolymerization initiator is preferably 0.01 wt% or more, more preferably 1 wt% or more, based on the solid content, from the viewpoint of effectively promoting radical curing. On the other hand, in the viewpoint of suppressing elution of the remaining photopolymerization initiator, etc., the content of the photopolymerization initiator is preferably 20 wt% or less, more preferably 10 wt% or less, based on the solid content.

The photopolymerizable compound in the present invention refers to a compound having two or more ethylenically unsaturated double bonds in the molecule. Considering the ease of radical polymerization, it is preferable that the photopolymerizable compound have a (meth)acrylic group.

As photopolymerizable compounds, for example, diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, trimethylol propane diacrylate, trimethylol propane triacrylate, trimethylol propane dimethacrylate, trimethylol propane trimethacrylate, 1,3-butanediol diacrylate, 1,3-butanediol dimethacrylate, neopentyl glycol diacrylate, 1,4-butanediol diacrylate, 1,4-butanediol dimethacrylate, 1,6-hexanediol diacrylate, 1,9-nonanediol dimethacrylate, 1,10-decanediol dimethacrylate, Dimethylol-tricyclodecane diacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, pentaerythritol trimethacrylate, pentaerythritol tetramethacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, tripentaerythritol heptaacrylate, tripentaerythritol octaacrylate, tetrapentaerythritol nonaacrylate, tetrapentaerythritol decaacrylate, pentapentaerythritol undecaacrylate, pentapentaerythritol dodecaacrylate, tripentaerythritol heptamethacrylate, tripentaerythritol octamethacrylate, tetrapentaerythritol nonamethacrylate, tetrapentaerythritol decamethacrylate, Examples thereof include pentapentaerythritol undecamethacrylate, pentapentaerythritol dodecamethacrylate, and dimethylol-tricyclodecane diacrylate. Two or more of these may be contained.

The content of the photopolymerizable compound in the resin composition of the present invention is preferably 1 wt% or more in terms of the solid content from the viewpoint of effectively promoting radical curing. On the other hand, the content of the photopolymerizable compound is preferably 50 wt% or less in terms of the solid content from the viewpoint of suppressing excessive radical reaction and improving resolution.

As the quinonediazide compound, a compound in which a sulfonic acid of naphthoquinonediazide is bonded as an ester to a compound having a phenolic hydroxyl group is preferable. Examples of the compound having a phenolic hydroxyl group used here include BIs-Z, TekP-4HBPA (Tetrakis P-DO-BPA), TrIsP-HAP, TrIsP-PA, BIsRS-2P, BIsRS-3P (all, trade names, manufactured by Honshu Kagaku Kogyo Co., Ltd.), BIR-PC, BIR-PTBP, BIR-BIPC-F (all, trade names, manufactured by Asahi Yukizai Kogyo Co., Ltd.), 4,4'-Sulphonyldiphenol, BPFL (trade name, manufactured by JFE Chemical Co., Ltd.). As the quinonediazide compound, those in which 4-naphthoquinonediazide sulfonic acid or 5-naphthoquinonediazide sulfonic acid is introduced via an ester bond into a compound having a phenolic hydroxyl group are preferable, and examples thereof include THP-17, TDF-517 (trade name, manufactured by Toyo Gosei Kogyo Co., Ltd.), and SBF-525 (trade name, manufactured by AZ Electronic Materials Co., Ltd.).

In terms of improving sensitivity, the content of the quinonediazide compound in the resin composition of the present invention is preferably 0.5 wt% or more, more preferably 1 wt% or more, based on the solid content. On the other hand, in terms of improving resolution, the content of the quinonediazide compound is preferably 25 wt% or less, more preferably 20 wt% or less, based on the solid content.

The resin composition of the present invention also preferably contains a white pigment and/or a light-blocking pigment. The white pigment has a function of further improving the reflectivity of the partition wall. The light-blocking pigment has a function of further improving the light-blocking property of the partition wall of a specific wavelength.

As a pigment, when only a white pigment is contained in the resin composition, and when both a white pigment and a light-blocking pigment are contained, a barrier wall having both high reflectivity and high light-blocking properties can be obtained. On the other hand, when only a light-blocking pigment is contained in the resin composition as a pigment, a barrier wall having high light-blocking properties for a specific wavelength can be obtained.

Examples of white pigments include titanium dioxide, zirconium oxide, zinc oxide, barium sulfate, and complex compounds thereof. Two or more of these may be included. Among these, titanium dioxide is preferable because it has a high reflectivity and is easy to use industrially.

The crystal structure of titanium dioxide is classified into anatase type, rutile type, and brookite type. Among these, rutile type titanium dioxide is preferable because of its low photocatalytic activity.

The white pigment may be surface treated. Surface treatment with a metal selected from Al, Si and Zr is preferable, and can improve the light resistance and heat resistance of the formed partition wall.

The average primary particle diameter of the white pigment is preferably 100 to 500 nm, more preferably 150 to 350 nm, from the viewpoint of further improving the reflectivity of the partition wall. Here, the average primary particle diameter of the white pigment can be measured by laser diffraction using a particle size distribution measuring device (N4-PLUS; manufactured by Baekman Coulter Co., Ltd.).

As titanium dioxide pigments preferably used as white pigments, there are, for example, R960; manufactured by DuPont Co., Ltd. (rutile type, SiO ₂ /Al ₂ O ₃ treatment, average primary particle diameter of 210 nm), CR-97; manufactured by Ishihara Sangyo Co., Ltd. (rutile type, Al ₂ O ₃ /ZrO ₂ treatment, average primary particle diameter of 250 nm), JR-301; manufactured by Teika Co., Ltd. (rutile type, Al ₂ O ₃ treatment, average primary particle diameter of 300 nm), JR-405; manufactured by Teika Co., Ltd. (rutile type, Al ₂ O ₃ treatment, average primary particle diameter of 210 nm), JR-600A; manufactured by Teika Co., Ltd. (rutile type, Al ₂ O ₃ treatment, average primary particle diameter of 250 nm), JR-603; Examples include Teika Co., Ltd. (rutile type, Al ₂ O ₃ /ZrO ₂ treatment, average primary particle diameter 280 nm). It is also acceptable to contain two or more of these.

From the viewpoint of further improving the reflectivity, the content of the white pigment in the resin composition is preferably 10 wt% or more of the solid content, more preferably 15 wt% or more. On the other hand, from the viewpoint of improving the surface smoothness of the partition, the content of the white pigment is preferably 60 wt% or less of the solid content, more preferably 55 wt% or less.

The shading pigment may be any pigment that improves the shading properties of light of a given wavelength, but examples include red pigment, blue pigment, black pigment, green pigment, and yellow pigment.

Examples of red pigments include Pigment Red (hereinafter abbreviated as PR)9, PR177, PR179, PR180, PR192, PR209, PR215, PR216, PR217, PR220, PR223, PR224, PR226, PR227, PR228, PR240, PR254, etc. Two or more of these may be contained.

Examples of blue pigments include Pigment Blue (hereinafter abbreviated as PB) 15, PB15:3, PB15:4, PB15:6, etc. Two or more of these may be contained.

Examples of black pigments include black organic pigments, mixed color organic pigments, and black inorganic pigments.

Examples of black organic pigments include carbon black, perylene black, aniline black, and benzofuranone pigments. These may be coated with resin.

As a mixed color organic pigment, for example, a pseudo-black pigment obtained by mixing two or more pigments selected from red, blue, green, purple, yellow, magenta, and cyan is exemplified. Among these, a mixed pigment of a red pigment and a blue pigment is preferable from the viewpoint of achieving both a moderately high OD value and pattern processability. The weight ratio of the red pigment to the blue pigment in the mixed pigment is preferably 20/80 to 80/20, and more preferably 30/70 to 70/30.

Examples of black inorganic pigments include graphite; fine particles of metals such as titanium, copper, iron, manganese, cobalt, chromium, nickel, zirconium, zinc, calcium, silver, gold, platinum, and palladium; metal oxides; metal composite oxides; metal sulfides; metal nitrides; metal oxynitrides; and metal carbides. Two or more of these may be contained.

Examples of green pigments include C.I. Pigment Green (hereinafter abbreviated as PG) 7, PG36, PG58, PG37, and PG59. Two or more of these may be included.

Examples of yellow pigments include Pigment Yellow (hereinafter abbreviated as PY) PY137, PY138, PY139, PY147, PY148, PY150, PY153, PY154, PY166, PY168, PY185, etc. Two or more of these may be contained.

The content of the light-shielding pigment in the solid content of the resin composition is preferably 0.005 wt% or more, more preferably 0.05 wt% or more, from the viewpoint of improving the light-shielding property of light of a specific wavelength. On the other hand, from the viewpoint of pattern processability, it is preferably 30 wt% or less, more preferably 15 wt% or less. The average primary particle diameter of the light-shielding pigment is preferably 1 to 300 nm, more preferably 2 to 50 nm, from the viewpoint of achieving both light-shielding property of the partition and pattern processability. Here, the average primary particle diameter of the light-shielding pigment can be measured by a laser diffraction method using a particle size distribution measuring device (N4-PLUS; manufactured by Beckman Coulter Co., Ltd.) or the like.

The resin composition of the present invention also preferably contains an organic silver compound. The organic silver compound can improve the light-blocking properties of the film by generating yellow particles such as silver nanoparticles by decomposition and aggregation in the exposure process and/or the heating process. Any compound that generates yellow particles in the exposure process and/or the heating process may be used as the organic silver compound. As conventionally known organic silver compounds, for example, Japanese Patent Application Laid-Open No. 10-62899, paragraphs "0048" to "0049", European Patent Application Laid-Open No. 803,764A1, page 18, line 24 to page 19, line 37, European Patent Application Laid-Open No. 962,812A1, Japanese Patent Application Laid-Open No. 11-349591, Japanese Patent Application Laid-Open No. 2000-7683, Japanese Patent Application Laid-Open No. 2000-72711, Japanese Patent Application Laid-Open No. 2002-23301, Japanese Patent Application Laid-Open No. 2002-23303, Japanese Patent Application Laid-Open No. 2002-49119, Japanese Patent Application Laid-Open No. 196446, European Patent Application Laid-Open No. 1246001A1, European Patent Application Laid-Open Examples thereof include organic silver compounds, silver salts of aliphatic carboxylic acids, etc., which are described in Japanese Patent Application Laid-Open No. 1258775A1, Japanese Patent Application Laid-Open No. 2003-140290, Japanese Patent Application Laid-Open No. 2003-195445, Japanese Patent Application Laid-Open No. 2003-295378, Japanese Patent Application Laid-Open No. 2003-295379, Japanese Patent Application Laid-Open No. 2003-295380, Japanese Patent Application Laid-Open No. 2003-295381, Japanese Patent Application Laid-Open No. 2003-270755, etc.

Among these, from the viewpoint of further yellowing, a compound represented by the following general formula (1) and/or a polymer compound having a structure represented by the following general formula (2) are preferable.

In general formula (1), R ₁ represents hydrogen or an organic group having 1 to 30 carbon atoms. Here, the “organic group having 1 to 30 carbon atoms” is preferably an alkyl group having 1 to 30 carbon atoms (including linear and branched alkyl groups) and/or an aromatic hydrocarbon group having 6 to 30 carbon atoms. Preferred specific examples thereof include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, an n-pentyl group, an isopentyl group, an n-hexyl group, an isohexyl group, an n-heptyl group, an isoheptyl group, an n-octyl group, an isooctyl group, an n-nonyl group, an isononyl group, a decyl group, an undecyl group, a dodecyl group, a tridecyl group, a tetradecyl group, a pentadecyl group, a hexadecyl group, a heptadecyl group, an octadecyl group, a nonadecyl group, an eicosyl group, a phenyl group, a benzyl group, a tolyl group, a biphenyl group, and a naphthyl group.

In general formula (2), R ² and R ³ each independently represent hydrogen or an organic group having 1 to 30 carbon atoms. Here, as the “organic group having 1 to 30 carbon atoms,” an alkyl group having 1 to 30 carbon atoms (including linear and branched alkyl groups) and/or an aromatic hydrocarbon group having 6 to 30 carbon atoms is preferable. As preferred specific examples thereof, there may be mentioned a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, an isobutyl group, a n-pentyl group, an isopentyl group, a n-hexyl group, an isohexyl group, a n-heptyl group, an isoheptyl group, a n-octyl group, an isooctyl group, a n-nonyl group, an isononyl group, a decyl group, an undecyl group, a dodecyl group, a tridecyl group, a tetradecyl group, a pentadecyl group, a hexadecyl group, a heptadecyl group, an octadecyl group, a nonadecyl group, an eicosyl group, a phenyl group, a benzyl group, a tolyl group, a biphenyl group, and a naphthyl group. In addition, a is an integer of 1 or more, preferably 1 to 10000, more preferably 5 to 1000.

Examples of the organic silver compound represented by the general formula (1) include silver acetate, silver propionate, silver butyrate, silver valerate, silver hexanoate, silver enanthate, silver octylate, silver pelargonic acid, silver caprate, silver neodecanoate, silver salicylate, silver carbonate, silver paratoluenesulfonate, silver trifluoroacetate, silver 2-ethylhexanoate, silver diethyldithiocarbamate, silver benzoate, silver pyridine-2-carboxylic acid, silver behenate, silver arachidate, silver stearate, silver oleate, silver laurate, silver caproate, silver myristate, and silver palmitate. Two or more of these may be contained. Among these, silver neodecanoate, silver octylate, and silver salicylate are preferable from the viewpoint of solubility in organic solvents and yellowing.

The organic silver compound represented by general formula (2) has a structure in which the carboxyl group in the (meth)acrylic polymer having a carboxyl group becomes a silver salt. The organic silver compound represented by general formula (2) is obtained, for example, by stirring a (meth)acrylic polymer having a carboxyl group and silver nitrate in an organic solvent in the presence of an amine catalyst, as in the preparation example described below.

The (meth)acrylic polymer having the above carboxyl group is obtained by polymerizing an unsaturated carboxylic acid. Examples of the unsaturated carboxylic acid include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinylacetic acid, or acid anhydrides. These may be used alone, but may also be used in combination with other copolymerizable ethylenically unsaturated compounds. Specific examples of copolymerizable ethylenically unsaturated compounds include unsaturated carboxylic acid alkyl esters such as methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, isopropyl acrylate, n-propyl methacrylate, isopropyl methacrylate, n-butyl acrylate, n-butyl methacrylate, sec-butyl acrylate, sec-butyl methacrylate, iso-butyl acrylate, iso-butyl methacrylate, tert-butyl acrylate, tert-butyl methacrylate, n-pentyl acrylate, n-pentyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, benzyl acrylate, and benzyl methacrylate; aromatic vinyl compounds such as styrene, p-methylstyrene, o-methylstyrene, m-methylstyrene, and α-methylstyrene; Examples thereof include, but are not limited to, unsaturated carboxylic acid aminoalkyl esters such as aminoethyl acrylate, unsaturated carboxylic acid glycidyl esters such as glycidyl acrylate and glycidyl methacrylate, carboxylic acid vinyl esters such as vinyl acetate and vinyl propionate, cyanide vinyl compounds such as acrylonitrile, methacrylonitrile and α-chloroacrylonitrile, aliphatic conjugated dienes such as 1,3-butadiene and isoprene, and macromonomers such as polystyrene, polymethyl acrylate, polymethyl methacrylate, polybutylacrylate, polybutyl methacrylate and polysilicon, each having an acryloyl group or a methacryloyl group at the terminal. There are no particular limitations with respect to (meth)acrylic polymers.

The (meth)acrylic polymer having the above carboxyl group may be a commercially available product. Examples of commercially available (meth)acrylic polymers having a carboxyl group include AX3-BX-TR-101, AX3-BX-TR-102, AX3-BX-TR-106, AX3-BX-TR-107, AX3-BX-TR-108, AX3-BX-TR-109, AX3-BX-TR-110, AX3-RD-TR-501, AX3-RD-TR-502, AX3-RD-TR-503, AX3-RD-TR-504, AX3-RD-TR-103, AX3-RD-TR-104 (trade name, manufactured by Nihon Shokubai Co., Ltd.), SPCR-10X, SPCR-10P, SPCR-24X, SPCR-18X, SPCR-215X (trade name, Showa Denko). Examples thereof include SPCR-10X, SPCR-10P, SPCR-24X, SPCR-18X, and SPCR-215X (brand name, manufactured by Nichiyu Corporation). Two or more of these may be used.

In addition, there is no particular limitation on the weight average molecular weight (Mw) of the polymer compound represented by general formula (2), but it is preferably 5,000 to 50,000, more preferably 8,000 to 35,000, in terms of polystyrene as measured by GPC. If Mw is less than 5,000, pattern stretching occurs during heat curing, resulting in a decrease in resolution. On the other hand, if Mw is greater than 50,000, silver is difficult to be reduced, making it difficult to form yellow particles.

The content of the organic silver compound in the solid content of the resin composition is preferably 0.1 wt% or more, and more preferably 0.4 wt% or more. By setting the content of the organic silver compound to 0.4 wt% or more, the obtained barrier rib can be made more yellow, and the blue light-shielding property of the barrier rib is improved. On the other hand, if the content of the organic silver compound is too high, an excessive reaction occurs due to radicals partially generated by the decomposition of the organic silver compound, making pattern formation difficult. In addition, since the organic silver compound is expensive, if the content is too high, the cost of the resin composition increases. Therefore, the content of the organic silver compound in the solid content of the resin composition is preferably 10 wt% or less, and more preferably 5.0 wt% or less.

The resin composition of the present invention also preferably contains a reducing agent. The reducing agent promotes the reduction of the organic silver compound, thereby more efficiently generating yellow particles, and can improve the light-shielding properties of the film even under low-temperature heating conditions of about 100 to 120°C. As a result, the present technology can be applied even in applications where, for example, a material whose heat resistance is a concern, such as an organic EL material, is underlying the film and where low-temperature heating conditions are essential. In addition, since the content of the organic silver compound in the resin composition can be reduced, it becomes possible to provide the resin composition at a lower cost. In addition, if an unreacted organic silver compound remains in the film after heating, it will be decomposed by light or heat and the film color will change, resulting in a film with poor weather resistance, but by containing a reducing agent, the amount of the organic silver compound remaining in the film after curing is reduced, thereby improving the weather resistance.

The reducing agent may be any compound that promotes the reduction of an organic silver compound, but from the viewpoint of reducing the organic silver compound more efficiently, a compound containing two or more phenolic hydroxyl groups or a compound containing an enediol group is preferable.

Examples of compounds containing two or more phenolic hydroxyl groups in the molecule include dihydric phenol compounds such as catechol compounds, hydroquinone compounds, resorcinol compounds, and anthrahydroquinone compounds, and polyphenol compounds containing three or more phenolic hydroxyl groups. Among these, from the viewpoint of reducibility, a hydroquinone compound represented by the following general formula (3) is more preferable.

In general formula (3), R ₄ , R ₅ , R ₆ and R ₇ each independently represent hydrogen, a hydroxy group, or an organic group having 1 to 30 carbon atoms. Here, the “organic group having 1 to 30 carbon atoms” is preferably an alkyl group having 1 to 30 carbon atoms (including linear and branched alkyl groups) and/or an aromatic hydrocarbon group having 6 to 30 carbon atoms. Preferred specific examples thereof include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, an n-pentyl group, an isopentyl group, an n-hexyl group, an isohexyl group, an n-heptyl group, an isoheptyl group, an n-octyl group, an isooctyl group, an n-nonyl group, an isononyl group, a decyl group, an undecyl group, a dodecyl group, a tridecyl group, a tetradecyl group, a pentadecyl group, a hexadecyl group, a heptadecyl group, an octadecyl group, a nonadecyl group, an eicosyl group, a phenyl group, a benzyl group, a tolyl group, a biphenyl group, and a naphthyl group.

Examples of the hydroquinone compounds represented by the following general formula (3) include hydroquinone, methylhydroquinone, ethylhydroquinone, propylhydroquinone, butylhydroquinone, t-butylhydroquinone, 2,3-dimethylhydroquinone, 2,3-diethylhydroquinone, 2,3-dipropylhydroquinone, 2,3-dibutylhydroquinone, 2,3-dit-butylhydroquinone, 2,5-dimethylhydroquinone, 2,5-diethylhydroquinone, 2,5-dipropylhydroquinone, 2,5-dibutylhydroquinone, 2,5-dit-butylhydroquinone, hydroquinone dimethyl ether, hydroquinone diethyl ether, 1,2,4-benzenetriol, 2,5-dihydroxyacetophenone, Examples thereof include 2,5-dihydroxybenzoic acid, phenylhydroquinone, 2,6-dimethylhydroquinone, 2,6-diethylhydroquinone, 2,6-dipropylhydroquinone, 2,6-dibutylhydroquinone, 2,6-di-t-butylhydroquinone, 2,6-dihydroxyacetophenone, 2,6-dihydroxybenzoic acid, phenylhydroquinone, phenylhydroquinone, 2,5-t-amylhydroquinone, etc. Among these, t-butylhydroquinone, 2,3-dimethylhydroquinone, 2,6-dimethylhydroquinone, 2,5-t-amylhydroquinone, 2,3-dipropylhydroquinone, 2,3-dibutylhydroquinone, 2,3-di-t-butylhydroquinone, 2,5-dipropylhydroquinone, 2,5-dibutylhydroquinone, and 2,5-di-t-butylhydroquinone are preferable from the viewpoints of reducing property, solubility in organic solvents, and storage stability.

Examples of compounds containing an endo group include ascorbic acid, α-pyridoin, fructose, xylose, glucose, deoxyacetone, glycolaldehyde, benzoin, monooxyacetone, and benzoylcarbinol. Among these, glycolaldehyde is preferable from the viewpoints of reducing property and solubility in organic solvents.

The content of the reducing agent in the solid content of the resin composition is preferably 0.01 wt% or more, and more preferably 0.1 wt% or more. By setting the content of the reducing agent to 0.1 wt% or more, the organic silver compound can be reduced more effectively, and the obtained barrier rib can be made more yellow, thereby improving the blue light-shielding property of the barrier rib. In addition, the amount of the organic silver compound remaining in the film after curing is reduced, thereby improving the weather resistance.

On the other hand, if the resin composition is a negative photosensitive resin composition, if the content of the reducing agent is too high, the reducing agent traps radicals generated by the decomposition of the photopolymerization initiator during exposure, thereby lowering the exposure sensitivity. Therefore, the content of the reducing agent in the solid content of the resin composition is preferably 3.0 wt% or less, and more preferably 1.5 wt% or less.

The resin composition of the present invention also preferably contains a lyophobic compound. A lyophobic compound is a compound that imparts to the resin composition a property of repelling water or an organic solvent (lyophobic performance). The compound having such a property is not particularly limited, but specifically, a compound having a fluoroalkyl group is preferably used. By containing a lyophobic compound, after forming a partition (A-1) described later, lyophobic performance can be imparted to the top of the partition. As a result, for example, when forming a pixel containing a color conversion luminescent material (B) described later, a color conversion luminescent material having a different composition can be easily and separately applied to each pixel.

It is preferable that the lyophilic compound be a lyophilic compound having a photo-radical polymerizable group. By having a photo-radical polymerizable group, it can form a strong bond with the resin, so that lyophilic performance can be more easily imparted to the top of the partition wall.

Examples of the lyophilic compounds include compounds having a fluoroalkyl or fluoroalkylene group at the terminal, main chain, and/or side chain, such as 1,1,2,2-tetrafluorooctyl(1,1,2,2-tetrafluoropropyl) ether, 1,1,2,2-tetrafluorooctylhexyl ether, octaethylene glycol di(1,1,2,2-tetrafluorobutyl) ether, perfluoroalkyl-N-ethylsulfonylglycine salt, bis(N-perfluorooctylsulfonyl-N-ethylaminoethyl) phosphate, and monoperfluoroalkylethyl phosphate ester. In addition, as commercially available liquid-repellent compounds, "Megapack" (registered trademark) F142D, F172, F173, F183, F444, F477 (all manufactured by Dainippon Ink & Kagaku Kogyo Co., Ltd.), F-Top EF301, 303, 352 (manufactured by Shin-Akita Kasei Co., Ltd.), Fluorad FC-430, FC-431 (manufactured by Sumitomo 3M Co., Ltd.)), "Asahi Guard" (registered trademark) AG710, "Surfron" (registered trademark) S-382, SC-101, SC-102, SC-103, SC-104, SC-105, SC-106 (manufactured by Asahi Glass Co., Ltd.), BM-1000, BM-1100 (manufactured by Yusho Co., Ltd.), NBX-15, FTX-218, Examples include DFX-18 (Neos Corporation). It is acceptable to contain two or more of these.

As a lyophilic compound having a photo-radical polymerizable group, examples thereof include "Megapack" (registered trademark) RS-72-A, RS-75-A, RS-76-E, RS-56, RS-72-K, RS-75, RS-76-E, RS-76-NS, RS-76, RS-90 (all, product names, manufactured by DIC Co., Ltd.). In this case, the photo-polymerizable group in the partition wall (A-1) formed of a photocured negative photosensitive resin composition may be photopolymerized.

From the viewpoint of improving the liquid repellent performance of the bulkhead and improving the inkjet coating property, the content of the liquid repellent compound in the resin composition is preferably 0.01 wt% or more, and more preferably 0.1 wt% or more, based on the solid content. On the other hand, from the viewpoint of improving the compatibility with the resin or white pigment, the content of the liquid repellent compound is preferably 10 wt% or less, and more preferably 5 wt% or less based on the solid content.

The resin composition of the present invention may also contain an organometallic compound other than an organosilver compound. As the organometallic compound other than an organosilver compound, it is preferable that it is an organometallic compound containing at least one metal selected from the group consisting of gold, platinum, and palladium. The organometallic compound containing at least one metal selected from the group consisting of gold, platinum, and palladium becomes black particles by decomposition and agglomeration in the exposure process and/or the heating process, and thus the light-shielding properties of the film can be further improved without deteriorating the pattern processability.

Examples of organometallic compounds other than organic silver compounds include organic gold compounds such as chloro(triphenylphosphine)gold, gold resinate MR7901-P, and tetrachloroauric acid tetrahydrate; organic platinum compounds such as bis(acetylacetonato)platinum, dichlorobis(triphenylphosphine)platinum, and dichlorobis(benzonitrile)platinum; and organic palladium compounds such as bis(acetylacetonato)palladium, dichlorobis(triphenylphosphine)palladium, dichlorobis(benzonitrile)palladium, tetrakis(triphenylphosphine)palladium, and dibenzylideneacetonepalladium. Two or more of these may be contained.

Among these, from the viewpoint of further improving light-shielding properties, organometallic compounds selected from bis(acetylacetonato)palladium, dichlorobis(triphenylphosphine)palladium, dichlorobis(benzonitrile)palladium and tetrakis(triphenylphosphine)palladium are preferable.

In the resin composition of the present invention, the content of the organometallic compound other than the organosilver compound in the solid content is preferably 0.2 to 5 wt%. By setting it to 0.2 wt% or more, the light-shielding property of the resulting film can be further improved. It is more preferably 0.5 wt% or more. On the other hand, by setting the content of the organometallic compound other than the organosilver compound to 5 wt% or less, the reflectivity can be further improved. It is more preferably 3 wt% or less.

The resin composition of the present invention may also contain a coordinating compound having a phosphorus atom (hereinafter, sometimes referred to as a "coordinating compound"). The coordinating compound coordinates to the organometallic compound in the resin composition, improves the solubility of the organometallic compound in a solvent, promotes the decomposition of the organometallic compound, and can further improve the light-shielding properties of the resulting film. Examples of the coordinating compound include triphenylphosphine, tri-t-butylphosphine, trimethylphosphine, tricyclohexylphosphine, tri-t-butylphosphine tetrafluoroborate, tri(2-pyryl)phosphine, tris(1-adamantyl)phosphine, tris(diethylamino)phosphine, tris(4-methoxyphenyl)phosphine, tris(O-tolyl)phosphine, and the like. Two or more of these may be contained. The content of the coordinating compound in the solid content of the resin composition of the present invention is preferably 0.5 to 3.0 molar equivalents with respect to the organometallic compound.

In addition, the resin composition of the present invention may contain, as necessary, a polymerization inhibitor, a surfactant, an adhesion improver, etc.

By containing a surfactant in the resin composition of the present invention, the flowability at the time of application can be improved. As the surfactant, examples thereof include fluorine-based surfactants such as "Megapack" (registered trademark) F142D, F172, F173, F183, F445, F470, F475, F477 (trade names, manufactured by Dainippon Ink & Kagaku Kogyo Co., Ltd.), NBX-15, FTX-218 (trade names, manufactured by Neos Co., Ltd.); silicone-based surfactants such as "BYK" (registered trademark)-333, 301, 331, 345, 307 (trade names, manufactured by Big Chemie Japan Co., Ltd.); polyalkylene oxide-based surfactants; and poly(meth)acrylate-based surfactants. Two or more of these may be contained.

By containing an adhesion improving agent in the resin composition of the present invention, adhesion to the substrate is improved, and a highly reliable barrier rib can be obtained. Examples of the adhesion improving agent include an alicyclic epoxy compound and a silane coupling agent. Among these, an alicyclic epoxy compound is preferable from the viewpoint of heat resistance.

Examples of the alicyclic epoxy compound include 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 1,2-epoxy-4-(2-oxiranyl)cyclohexane adduct of 2,2-bis(hydroxymethyl)-1-butanol, ε-caprolactone-modified 3',4'-epoxycyclohexylmethyl 3',4'-epoxycyclohexanecarboxylate, 1,2-epoxy-4-vinylcyclohexane, butanetetracarboxylic acid tetra(3,4-epoxycyclohexylmethyl)-modified ε-caprolactone, 3,4-epoxycyclohexylmethyl methacrylate, etc. Two or more of these may be contained.

The content of the adhesion improving agent in the resin composition of the present invention is preferably 0.1 wt% or more, more preferably 1 wt% or more, based on the solid content, from the viewpoint of further improving the adhesion to the substrate. On the other hand, the content of the adhesion improving agent is preferably 20 wt% or less, more preferably 10 wt% or less, based on the solid content, from the viewpoint of pattern processability.

It is preferable that the resin composition of the present invention further contains a solvent. The solvent has the function of adjusting the viscosity of the resin composition to a range suitable for application, thereby improving the uniformity of the partition wall. As the solvent, it is preferable to combine a solvent having a boiling point under atmospheric pressure exceeding 150°C but not exceeding 250°C, and a solvent having a boiling point not exceeding 150°C.

Examples of the solvent include alcohols such as isopropanol and diacetone alcohol; glycols such as ethylene glycol and propylene glycol; ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, and propylene glycol monobutyl ether; ketones such as methyl ethyl ketone, acetylacetone, methyl propyl ketone, methyl butyl ketone, methyl isobutyl ketone, diisobutyl ketone, and cyclopentanone; amides such as dimethylformamide and dimethylacetamide; Acetates such as ethyl acetate, propyl acetate, butyl acetate, isobutyl acetate, ethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, methyl lactate, ethyl lactate, butyl lactate, etc.; aromatic or aliphatic hydrocarbons such as toluene, xylene, hexane, cyclohexane, γ-butyrolactone, N-methyl-2-pyrrolidone, dimethyl sulfoxide, etc. may be included. Two or more of these may be contained. Among these, from the viewpoint of coatability, it is preferable to combine diacetone alcohol as a solvent having a boiling point under atmospheric pressure exceeding 150°C and 250°C or lower, and propylene glycol monomethyl ether as a solvent having a boiling point of 150°C or lower.

The solvent content can be arbitrarily set depending on the application method, etc. For example, when forming a film by spin coating, the solvent content is generally set to 50 wt% or more and 95 wt% or less of the resin composition.

The resin composition of the present invention can be produced by mixing, for example, the above-described resin, a photopolymerization initiator or a quinonediazide compound, a white pigment and/or a light-blocking pigment, an organic silver compound, a reducing agent, and other components as needed.

Next, the light-shielding film of the present invention will be described. The light-shielding film of the present invention is obtained by curing the resin composition of the present invention described above. The light-shielding film of the present invention can be suitably used as a light-shielding pattern in an OGS type touch panel, such as a decorative pattern for a cover substrate, in addition to the partition wall (A-1) described below. The film thickness of the light-shielding film is preferably 10 ㎛ or more.

Next, a method for manufacturing a light-shielding film of the present invention will be described by way of example. The method for manufacturing a light-shielding film of the present invention preferably has a film forming step of applying the resin composition of the present invention onto a substrate and drying it to obtain a dry film, an exposure step of pattern-exposing the obtained dry film, a developing step of dissolving and removing a portion soluble in a developer in the dry film after exposure, and a heating step of curing the dry film after development by heating it.

The method for manufacturing a shade film of the present invention is characterized in that, in the heating step, the film after development is heated at a temperature of 100°C or higher and 250°C or lower, thereby increasing the OD value per 10 μm of film thickness at a wavelength of 450 nm by 1.0 or higher. The heating temperature in the heating step is preferably 150°C or higher, and more preferably 180°C or higher, from the viewpoint of further improving the OD value.

The heating temperature during the heating process is preferably 250°C or lower, more preferably 240°C or lower, from the viewpoint of suppressing cracking in the film to be heated. The heating time is preferably 15 minutes to 2 hours. Since the film formed from the resin composition of the present invention has a low OD value at the time of exposure and, furthermore, since the OD value increases after pattern formation, the film can be sufficiently photocured to the bottom in the exposure process to obtain a barrier rib having a preferable taper angle as described later. In addition, since the OD value at a wavelength of 450 nm after pattern formation is high, a barrier rib having both high reflectivity of the entire visible light and high light-shielding property of blue light can be obtained.

Examples of methods for applying the resin composition in the above-mentioned film forming process include a slit coat method, a spin coat method, etc. Examples of drying devices include a hot air oven or a hot plate. The drying time is preferably 80 to 120°C, and the drying time is preferably 1 to 15 minutes.

The exposure process is a process in which a desired portion of a dry film is photocured by exposure, or an unnecessary portion of the dry film is photodecomposed, thereby making an arbitrary portion of the dry film available to a developer. In the exposure process, exposure may be performed through a photomask having a predetermined opening, or an arbitrary pattern may be directly drawn using a laser beam or the like without using a photomask.

As the exposure device, a proximity exposure device can be mentioned, for example. As the active light to be irradiated in the exposure process, examples thereof include near-infrared rays, visible rays, and ultraviolet rays, with ultraviolet rays being preferable. In addition, as the light source, examples thereof include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, halogen lamps, and sterilizing lamps, with ultra-high-pressure mercury lamps being preferable.

Exposure conditions can be appropriately selected depending on the thickness of the dry film to be exposed. In general, it is desirable to expose at an exposure dose of 1 to 10,000 mJ/cm2 using an ultra-high pressure mercury lamp with an output of 1 to 100 mW/cm2.

The development process is a process in which the portion soluble in the developer in the dry film after exposure is dissolved and removed by the developer, and a dry film formed into a pattern in an arbitrary pattern shape (hereinafter referred to as a pre-heating pattern) is obtained in which only the portion insoluble in the developer remains. Examples of the pattern shape include a grid shape, a stripe shape, and a hole shape.

Examples of developing methods include immersion, spraying, and brushing.

As the developer, a solvent capable of dissolving unnecessary parts in the dried film after exposure can be suitably selected, and an aqueous solution containing water as a main component is preferable. For example, when the resin composition contains a polymer having a carboxyl group, an alkaline aqueous solution is preferable as the developer. Examples of the alkaline aqueous solution include inorganic alkaline aqueous solutions such as sodium hydroxide, potassium hydroxide, sodium carbonate, and calcium hydroxide; organic alkaline aqueous solutions such as tetramethylammonium hydroxide and trimethylbenzylammonium hydroxide, and the like. Among these, from the viewpoint of improving the resolution, a potassium hydroxide aqueous solution or a tetramethylammonium hydroxide aqueous solution is preferable. The concentration of the alkaline aqueous solution is preferably 0.05 wt% or more, and more preferably 0.1 wt% or more, from the viewpoint of improving the developability. On the other hand, the concentration of the alkaline aqueous solution is preferably 5 wt% or less, and more preferably 1 wt% or less, from the viewpoint of suppressing peeling or corrosion of the pattern before heating. Furthermore, the developer may contain a surfactant from the viewpoint of improving the resolution. The development temperature is preferably 20 to 50°C to facilitate process management.

The heating process is a process of heat-hardening the pre-heat pattern formed in the development process. Examples of heating devices include a hot plate, an oven, etc. The preferable heating temperature and heating time are as described above.

Next, a substrate having a partition wall of the present invention will be described. The substrate having a partition wall of the present invention has a partition wall (hereinafter, sometimes referred to as “partition wall (A-1)”) formed in a pattern (A-1) on a substrate. The substrate has a function as a support for the substrate having a partition wall. When the substrate has pixels containing a color conversion luminescent material described below, the partition wall has a function of suppressing color mixing of light between adjacent pixels.

In the substrate on which the partition wall of the present invention is formed, the partition wall (A-1) is characterized by having a reflectivity of 10% to 60% per 10 ㎛ thickness at a wavelength of 450 nm and an OD value of 1.5 to 5.0 per 10 ㎛ thickness at a wavelength of 450 nm. By setting the reflectivity to 10% or more and the OD value to 5.0 or less, the brightness of the display device can be improved by utilizing reflection on the side surface of the (A-1) partition wall. On the other hand, by setting the reflectivity to 60% or less and the OD value to 1.5 or more at a wavelength of 450 nm, blue light transmitting through the partition wall (A-1) can be suppressed, thereby suppressing color mixing of light between adjacent pixels.

A cross-sectional view of one embodiment of a substrate having a partition formed with a pattern in Fig. 1 of the present invention is shown. It has a partition (2) formed with a pattern on a substrate (1).

<not a substrate>

As the substrate, examples thereof include a glass plate, a resin plate, and a resin film. As the material of the glass plate, alkali-free glass is preferable. As the material of the resin plate and the resin film, polyester, (meth)acrylic polymer, transparent polyimide, polyethersulfone, etc. are preferable. The thickness of the glass plate and the resin plate is preferably 1 mm or less, and preferably 0.8 mm or less. The thickness of the resin film is preferably 100 ㎛ or less.

<Bulkhead (A-1)>

The partition wall (A-1) is characterized by having a reflectivity of 10% to 60% per 10 ㎛ thickness at a wavelength of 450 nm and an OD value of 1.5 to 5.0 per 10 ㎛ thickness at a wavelength of 450 nm. Here, the thickness of the partition wall (A-1) refers to the height of the partition wall (A-1) and/or the width of the partition wall (A-1). The height of the partition wall (A-1) refers to the length in the direction perpendicular to the underlying substrate (height direction) of the partition wall (A-1). In the case of the substrate on which the partition wall is formed as shown in Fig. 1, the height of the partition wall (2) is represented by the symbol H. In addition, the width of the partition wall (A-1) refers to the length in the direction horizontal to the underlying substrate of the partition wall (A-1). In the case of the substrate on which the partition wall is formed as shown in Fig. 1, the width of the partition wall (2) is represented by the symbol L. Also, in this specification, “height” is also called “thickness.”

In the present invention, it is thought that the reflectance on the side of the partition contributes to the improvement of the brightness of the display device, and the light-shielding property contributes to the suppression of color mixing. On the other hand, since the reflectance and the OD value per thickness are thought to be the same regardless of the height direction and the width direction, the present invention focuses on the reflectance and the OD value per thickness of the partition. In addition, as described later, the thickness of the partition (A-1) is preferably 0.5 to 100 µm, and the width is preferably 1 to 100 µm. Therefore, in the present invention, 10 µm was selected as a representative value of the thickness of the partition (A-1), and the reflectance and OD value per 10 µm were focused on.

When the reflectivity per 10 ㎛ of thickness at a wavelength of 450 nm is less than 10%, the reflection on the side of the barrier rib becomes small, and the brightness of the display device becomes insufficient. The reflectivity per 10 ㎛ of thickness at a wavelength of 450 nm is preferably 10% or more, more preferably 20% or more, and even more preferably 30% or more. The higher the reflectivity per 10 ㎛ of thickness at a wavelength of 450 nm, the greater the reflection of blue excitation light on the side of the barrier rib. Therefore, when a pixel containing the (B) color conversion luminescent material described later is included between the barrier ribs, the color conversion efficiency is improved, and the brightness of the display device can be improved.

In addition, the reflectivity per 10 ㎛ of the barrier rib (A-1) at a wavelength of 550 nm is preferably 30% or more, more preferably 40% or more, and even more preferably 50% or more. The higher the reflectivity per 10 ㎛ of the barrier rib at a wavelength of 550 nm, the greater the reflection of green light on the side surface of the barrier rib. Therefore, when a pixel containing the (B) color conversion luminescent material described later is included between the barrier ribs, the green light emitted within the pixel can be efficiently reflected to improve the brightness of the display device.

In addition, the reflectivity per 10 ㎛ of the barrier rib (A-1) at a wavelength of 630 nm is preferably 30% or more, more preferably 40% or more, and even more preferably 50% or more. The higher the reflectivity per 10 ㎛ of the barrier rib at a wavelength of 630 nm, the greater the reflection of red light on the side surface of the barrier rib. Therefore, when a pixel containing the (B) color conversion luminescent material described later is included between the barrier ribs, the red light emitted within the pixel can be efficiently reflected to improve the brightness of the display device.

In addition, if the OD value per 10 ㎛ of the thickness of the partition (A-1) at a wavelength of 450 nm is less than 1.5, blue excitation light leaks to adjacent pixels, causing color mixing of light. The OD value per 10 ㎛ of the thickness of the partition (A-1) at a wavelength of 450 nm is preferably 1.5 or more, more preferably 2.0 or more, and still more preferably 2.5 or more.

In addition, the OD value per 10 ㎛ of the thickness of the partition (A-1) at a wavelength of 550 nm is preferably 1.0 or higher, more preferably 1.5 or higher, and even more preferably 2.0 or higher. The higher the OD value per 10 ㎛ of the thickness at a wavelength of 550 nm, the greater the green light-shielding property on the side of the partition. Therefore, when a pixel containing the (B) color conversion luminescent material described later is included between the partitions, green light emitted within the pixel can be efficiently shielded to prevent color mixing, thereby improving the contrast of the display device.

In addition, the OD value per 10 ㎛ of the thickness of the partition (A-1) at a wavelength of 630 nm is preferably 1.0 or higher, more preferably 1.5 or higher, and even more preferably 2.0 or higher. The higher the OD value per 10 ㎛ of the thickness at a wavelength of 630 nm, the greater the red light-shielding ability on the side of the partition. Therefore, when a pixel containing the (B) color conversion luminescent material described later is included between the partitions, the red light emitted within the pixel can be efficiently shielded to prevent color mixing, thereby improving the contrast of the display device.

The reflectance per 10 ㎛ of the barrier wall (A-1) at wavelengths of 450 nm, 550 nm, and 630 nm can be measured from the top surface of the 10 ㎛ thick barrier wall (A-1) using a spectrophotometer (e.g., CM-2600d manufactured by Konica Minolta Co., Ltd.) in SCI mode. However, if a sufficient area for measurement cannot be secured or a 10 ㎛ thick measurement sample cannot be collected, if the composition of the barrier wall (A-1) is known, a 10 ㎛ thick solid film having the same composition as that of the barrier wall (A-1) may be produced, and the reflectance of the solid film may be measured in the same manner as that of the barrier wall (A-1), thereby obtaining the reflectance per 10 ㎛. For example, a solid film may be produced using the material that formed the partition wall (A-1) under the same processing conditions as those for forming the partition wall (A-1), except that the thickness is 10 ㎛ and no pattern is formed. The reflectance of the obtained solid film may be measured from the upper surface in the same manner.

The OD value per 10 ㎛ of the barrier wall (A-1) at wavelengths of 450 nm, 550 nm, and 630 nm can be calculated by measuring the intensities of incident light and transmitted light from the upper surface of the 10 ㎛ thick barrier wall (A-1) using an optical densitometer (for example, U-4100 manufactured by Hitachi High-Tech Science) and using the following equation (1). However, in cases where a sufficient area for measurement cannot be secured or a 10 ㎛ thick measurement sample cannot be collected, if the composition of the barrier wall (A-1) is known, similar to the measurement of reflectance, a 10 ㎛ thick solid film having the same composition as the barrier wall (A-1) is produced and the OD value is measured in the same manner for the solid film instead of the barrier wall (A-1), thereby obtaining the OD value per 10 ㎛.

OD value = log10(I ₀ /I) ···(1)

I ₀ : Incident light intensity

I: Transmitted light intensity.

In addition, as a means for making the reflectance and OD values within the above ranges, examples thereof include making the partition (A-1) have the preferable composition described below.

The taper angle of the partition wall (A-1) is preferably 45° to 110°. The taper angle of the partition wall (A-1) refers to the angle formed by the side and bottom of the partition wall section. In the case of the substrate on which the partition wall is formed as shown in Fig. 1, the taper angle of the partition wall (2) is represented by the symbol θ. By setting the taper angle to 45° or more, the difference in width between the upper and lower parts of the partition wall (A-1) becomes small, and the width of the partition wall (A-1) can be easily formed within the preferable range described later. The taper angle is more preferably 70° or more. On the other hand, by setting the taper angle to 110° or less, when forming a pixel containing the (B) color conversion luminescent material described later by inkjet coating, ink agglomeration can be suppressed, thereby improving inkjet coating properties. Here, ink agglomeration refers to a phenomenon in which ink goes over the partition wall and mixes into an adjacent pixel portion. The taper angle is preferably 95° or less. The taper angle of the bulkhead (A-1) can be obtained by observing an arbitrary cross-section of the bulkhead (A-1) using an optical microscope (FE-SEM (e.g., Hitachi, Ltd. S-4800)) at an acceleration voltage of 3.0 kV and a magnification of 2,500 times, and measuring the angle formed by the side and bottom of the cross-section of the bulkhead (A-1).

In addition, as means for setting the taper angle of the bulkhead (A-1) within the above range, examples thereof include forming the bulkhead (A-1) with a preferable composition described below, or using the resin composition of the present invention described above.

The thickness of the partition wall (A-1) is preferably larger than the thickness of the pixel when the substrate on which the partition wall is formed has a pixel containing the (B) color conversion luminescent material described later. Specifically, the thickness of the partition wall (A-1) is preferably 0.5 µm or more, and more preferably 10 µm or more. On the other hand, from the viewpoint of more efficiently extracting light emission at the bottom of the pixel, the thickness of the partition wall (A-1) is preferably 100 µm or less, and more preferably 50 µm or less. In addition, the width of the partition wall (A-1) is preferably sufficient to further improve brightness by utilizing light reflection on the side surface of the partition wall and further suppress color mixing of light in adjacent pixels due to light leakage. Specifically, the width of the partition wall is preferably 1 µm or more, and more preferably 5 µm or more. On the other hand, from the viewpoint of securing a large luminescent area of the pixel and further improving brightness, the width of the partition wall (A-1) is preferably 100 µm or less, and more preferably 50 µm or less.

The partition (A-1) has a repeating pattern of a predetermined number of pixels according to the screen size of the image display device. The number of pixels of the image display device may be, for example, 4,000 horizontally and 2,000 vertically. The number of pixels affects the resolution (detail and density) of the displayed image. Therefore, it is necessary to form a number of pixels according to the required image resolution and the screen size of the image display device, and it is desirable to determine the pattern formation dimensions of the partition accordingly.

The partition (A-1) preferably contains a resin, a white pigment and/or a light-blocking pigment, silver oxide and/or silver particles, and a quinone compound. The resin has a function of improving the crack resistance and light resistance of the partition. The white pigment has a function of further improving the reflectivity of the partition. The light-blocking pigment has a function of improving the light-blocking property of the partition of a specific wavelength of light. The silver oxide and/or silver particles have a function of suppressing color mixing of light in adjacent pixels by adjusting the OD value. When the resin composition contains a hydroquinone compound as a reducing agent, the quinone compound is generated in the partition by itself being oxidized when the hydroquinone compound promotes reduction of the organic silver compound.

The resin, white pigment, and light-blocking pigment are materials constituting the resin composition as described above. The content of the resin in the partition (A-1) is preferably 10 wt% or more, and more preferably 20 wt% or more, from the viewpoint of improving the crack resistance of the partition in heat treatment. On the other hand, the content of the resin in the partition (A-1) is preferably 60 wt% or less, and more preferably 50 wt% or less, from the viewpoint of improving light resistance.

From the viewpoint of further improving the reflectivity, the content of the white pigment in the partition (A-1) is preferably 20 wt% or more, and more preferably 30 wt% or more. On the other hand, from the viewpoint of improving the surface smoothness of the partition, the content of the white pigment in the partition (A-1) is preferably 60 wt% or less, and more preferably 55 wt% or less.

The content of the light-blocking pigment in the bulkhead (A-1) is preferably 0.005 wt% or more of the solid content, and more preferably 0.05 wt% or more, from the viewpoint of improving the light-blocking property of light of a specific wavelength. On the other hand, from the viewpoint of not impairing the reflectivity of the bulkhead, it is preferably 30 wt% or less, and more preferably 15 wt% or less.

The silver oxide and/or silver particles refer to yellow particles or black particles generated when the organic silver compound in the above-mentioned resin composition decomposes or aggregates during the exposure process and/or heating process. The content of the silver oxide and/or silver particles in the partition wall (A-1) is preferably 0.1 wt% or more, and more preferably 0.4 wt% or more, from the viewpoint of adjusting the reflectance and OD within the above-mentioned range to further suppress color mixing of light in adjacent pixels. On the other hand, from the viewpoint of adjusting the reflectance and OD within the above-mentioned range, the content of the silver oxide and/or silver particles in the partition wall (A-1) is preferably 10 wt% or less, and more preferably 3.0 wt% or less.

It is also preferable that the partition (A-1) contain a liquid-repellent compound. By containing the liquid-repellent compound, liquid-repellent performance can be imparted to the partition (A-1), and for example, when forming pixels containing the (B) color conversion luminescent material described later, color conversion luminescent materials having different compositions can be easily and separately applied to each pixel. The liquid-repellent compound is as described above as a material constituting the resin composition.

From the viewpoint of improving the liquid repellent performance of the partition and improving the inkjet coating property, the content of the liquid repellent compound in the partition (A-1) is preferably 0.01 wt% or more, and more preferably 0.1 wt% or more. On the other hand, from the viewpoint of improving the compatibility with a resin or a white pigment, the content of the liquid repellent compound in the partition (A-1) is preferably 10 wt% or less, and more preferably 5 wt% or less.

The surface contact angle of the partition (A-1) with respect to propylene glycol monomethyl ether acetate is preferably 10° or more, more preferably 20° or more, and even more preferably 40° or more, from the viewpoint of improving inkjet coating properties and facilitating separate coating of the color conversion luminescent material. On the other hand, from the viewpoint of improving the adhesion between the partition and the underlying substrate, the surface contact angle of the partition (A-1) is preferably 70° or less, and more preferably 60° or less. Here, the surface contact angle of the partition (A-1) can be measured in accordance with the wettability test method for a substrate glass surface specified in JIS R3257 (enactment date = 1999/04/20) for the upper part of the partition. In addition, as a method for making the surface contact angle of the partition (A-1) within the above range, a method using the above-described lyophobic compound can be exemplified.

As a method for forming a pattern of a partition (A-1) on a substrate, a photosensitive paste method is preferable because the pattern shape can be easily adjusted. As a method for forming a pattern of a partition by a photosensitive paste method, a method having a coating step of applying the above-mentioned resin composition on a substrate and drying it to obtain a dry film, an exposure step of pattern-exposing the obtained dry film according to a desired pattern shape, a development step of dissolving and removing a portion soluble in a developer in the dry film after exposure, and a heating step of curing the developed partition is preferable. It is preferable that the resin composition has positive or negative photosensitivity. The pattern exposure may be performed through a photomask having a predetermined opening, or an arbitrary pattern may be directly drawn using a laser beam or the like without using a photomask. In addition, when the substrate on which the partition is formed has a color filter and/or a light-shielding partition (A-2) described later, the partition (A-1) can be pattern-formed in the same manner on the color filter and/or the light-shielding partition (A-2). For each process, the manufacturing method of the shade film is as described above.

It is also preferable that the substrate on which the partition walls of the present invention are formed have pixels (hereinafter, sometimes referred to as “pixels (B)”) containing a (B) color conversion luminescent material arranged and partitioned by the partition walls (A-1).

A pixel (B) has the function of converting at least part of the wavelength range of incident light and emitting light of a wavelength range different from that of the incident light, thereby enabling color display.

Fig. 2 shows a cross-sectional view of one embodiment of a substrate having a partition wall (A-1) formed with a pattern and pixels (B) of the present invention. A patterned partition wall (2) is formed on a substrate (1), and pixels (3) are arranged in an area partitioned by the partition wall (2).

It is preferable that the color conversion material contain a phosphor selected from an inorganic phosphor and an organic phosphor.

The substrate on which the partition walls of the present invention are formed can be used as a display device, for example, by combining a backlight that emits blue light, a liquid crystal formed on a TFT, and a pixel (B). In this case, it is preferable that a region corresponding to a red pixel contains a red phosphor that is excited by blue excitation light and emits red fluorescence. Similarly, it is preferable that a region corresponding to a green pixel contains a green phosphor that is excited by blue excitation light and emits green fluorescence. It is preferable that no phosphor is contained in a region corresponding to a blue pixel.

As the inorganic phosphor, it is preferable that it emits various colors such as green or red by blue excitation light, that is, that it is excited by excitation light having a wavelength of 400 to 500 nm and has an emission spectrum having a peak in a region of 500 to 700 nm. Examples of such inorganic phosphors include YAG phosphors, TAG phosphors, sialon phosphors, Mn ⁴⁺ -activated fluoride complex phosphors, and inorganic semiconductors called quantum dots. Two or more of these may be used. Of these, quantum dots are preferable. Since quantum dots have a smaller average particle diameter than other phosphors, they can smooth the surface of the (B) pixel and suppress light scattering on the surface, and therefore the light extraction efficiency can be further improved, thereby further improving the brightness.

Examples of quantum dot materials include semiconductors of group II-IV, group III-V, group IV-VI, and group IV. Examples of these inorganic semiconductors include Si, Ge, Sn, Se, Te, B, C (including diamond), P, BN, BP, BAs, AlN, AlP, AlAs, AlSb, GaN, GaP, GaAs, GaSb, InN, InP, InAs, InSb, ZnO, ZnS, ZnSe, ZnTe, CdS, CdSe, CdSeZn, CdTe, HgS, HgSe, HgTe, BeS, BeSe, BeTe, MgS, MgSe, GeS, GeSe, GeTe, SnS, SnSe, SnTe, PbO, PbS, PbSe, PbTe, CuF, CuCl, CuBr, CuI, SI ₃ N ₄ , Ge ₃ N ₄ , Al ₂ O ₃ . Two or more of these may be used.

As the organic fluorescent substance, one that emits various colors such as green or red by blue excitation light is preferable. As a fluorescent substance that emits red fluorescence, a pyrromethene derivative having a basic skeleton represented by the following structural formula (8) can be mentioned, and as a fluorescent substance that emits green fluorescence, a pyrromethene derivative having a basic skeleton represented by the following structural formula (9) can be mentioned. In addition, perylene derivatives, porphyrin derivatives, oxazine derivatives, pyrazine derivatives, etc. that emit red or green fluorescence depending on the selection of a substituent can be mentioned. Two or more of these may be contained. Among these, a pyrromethene derivative is preferable in that it has a high quantum yield. A pyrromethene derivative can be obtained, for example, by the method described in Japanese Patent Application Laid-Open No. 2011-241160.

Since the organic fluorescent substance is soluble in a solvent, a pixel (B) of a desired thickness can be easily formed.

From the viewpoint of improving color characteristics, the thickness of the pixel (B) is preferably 0.5 ㎛ or more, and more preferably 1 ㎛ or more. On the other hand, from the viewpoint of thinning of the display device and curved processability, the thickness of the pixel (B) is preferably 30 ㎛ or less, and more preferably 20 ㎛ or less.

The size of each pixel (B) is typically about 20 to 200 μm.

It is preferable that the pixels (B) are arranged so as to be partitioned by partitions (A-1). By forming partitions between pixels, diffusion or color mixing of the emitted light can be further suppressed.

As a method for forming a pixel (B), an example of which may be mentioned is a method of filling a coating solution containing a color conversion luminescent material (hereinafter, “color conversion luminescent material coating solution”) into a space partitioned by a partition (A-1). The color conversion luminescent material coating solution may also contain a resin or a solvent.

Methods for filling the color conversion luminescent material coating solution include photolithography and inkjet methods, but the inkjet coating method is preferable from the viewpoint of easily separating and applying different types of color conversion luminescent materials to each pixel.

The obtained coating film may be dried under reduced pressure and/or dried under heat. In case of drying under reduced pressure, the temperature of drying under reduced pressure is preferably 80°C or lower in order to prevent the drying solvent from recondensing on the inner wall of the reduced pressure chamber. The pressure of drying under reduced pressure is preferably lower than the vapor pressure of the solvent contained in the coating film, and is preferably 1 to 1000 Pa. The drying time under reduced pressure is preferably 10 to 600 seconds. In case of drying under heat, examples of the drying device include an oven or a hot plate. The temperature of drying under heat is preferably 60 to 200°C. The drying time is preferably 1 to 60 minutes.

<Shading Barrier (A-2)>

It is preferable that the substrate on which the barrier rib of the present invention is formed further have, between the substrate and the (A-1) patterned barrier rib, a patterned barrier rib (hereinafter, sometimes referred to as a "light-shielding barrier rib (A-2)") having an OD value of 0.5 or more per 1.0 ㎛ of thickness (A-2). By having the light-shielding barrier rib (A-2), light-shielding properties are improved, and light leakage from the backlight in the display device is suppressed, thereby obtaining a high-contrast and clear image.

A cross-sectional view showing one embodiment of a substrate having a barrier rib formed thereon according to the present invention having a light-shielding barrier rib is shown in Fig. 3. A pattern-formed barrier rib (2) and a light-shielding barrier rib (4) are provided on a substrate (1), and pixels (3) are arranged in an area partitioned by the barrier rib (2) and the light-shielding barrier rib (4).

The light-shielding partition (A-2) has an OD value of 0.5 or more per 1.0 ㎛ thickness. Here, the thickness of the light-shielding partition (A-2) is preferably 0.5 to 10 ㎛, as described later. In the present invention, 1.0 ㎛ was selected as a representative value of the thickness of the light-shielding partition (A-2), and the OD value per 1.0 ㎛ thickness was taken into account. By setting the OD value per 1.0 ㎛ thickness to 0.5 or more, the light-shielding property can be further improved, and a higher contrast and clearer image can be obtained. The OD value per 1.0 ㎛ thickness is more preferably 1.0 or more. On the other hand, the OD value per 1.0 ㎛ thickness is preferably 4.0 or less, and pattern processability can be improved. The OD value per 1.0 ㎛ thickness is more preferably 3.0 or less. The OD value of the light-shielding partition (A-2) can be measured in the same manner as the OD value of the partition (A-1) described above. In addition, as a means for keeping the OD value within the above range, examples thereof include making the light-shielding partition (A-2) have the preferable composition described below.

From the viewpoint of improving light-shielding properties, the thickness of the light-shielding partition (A-2) is preferably 0.5 ㎛ or more, and more preferably 1.0 ㎛ or more. On the other hand, from the viewpoint of improving flatness, the thickness of the light-shielding partition (A-2) is preferably 10 ㎛ or less, and more preferably 5 ㎛ or less. In addition, the width of the light-shielding partition (A-2) is preferably the same as that of the aforementioned partition (A-1).

It is preferable that the light-shielding partition (A-2) contain resin and black pigment. The resin has the function of improving the crack resistance and light resistance of the partition. The black pigment has the function of absorbing incident light and reducing emitted light.

Examples of the resin include epoxy resin, (meth)acrylic polymer, polyurethane, polyester, polyimide, polyolefin, and polysiloxane. Two or more of these may be contained. Among these, polyimide is preferable because of its excellent heat resistance and solvent resistance.

As black pigments, examples thereof include those black pigments exemplified in the aforementioned resin compositions, as well as palladium oxide, platinum oxide, gold oxide, and silver oxide. In terms of having high light-blocking properties, black pigments selected from titanium nitride, zirconium nitride, carbon black, palladium oxide, platinum oxide, gold oxide, and silver oxide are preferable.

As a method for forming a pattern of a light-shielding barrier (A-2) on a substrate, a method of forming a pattern by a photosensitive paste method, similar to the above-mentioned barrier (A-1), using a photosensitive material as described in Japanese Patent Application Laid-Open No. 2015-1654, is preferable.

In addition, it is preferable that the substrate on which the partition wall of the present invention is formed further have a color filter (hereinafter, sometimes referred to as a "color filter") having a thickness of 1 to 5 μm between the substrate and the pixel (B). The color filter has a function of transmitting visible light of a specific wavelength range and changing the transmitted light to a desired color. By having the color filter, the color purity of the display device can be improved. By setting the thickness of the color filter to 1 μm or more, the color purity can be further improved. On the other hand, by setting the thickness of the color filter to 5 μm or less, the brightness can be further improved.

Fig. 4 shows a cross-sectional view of one embodiment of a substrate having a partition wall formed with a color filter of the present invention. It has a partition wall (2) and a color filter (5) formed in a pattern on a substrate (1), and has a pixel (3) on the color filter (5).

As a color filter, examples thereof include a color filter using a pigment-dispersed material in which pigments are dispersed in a photoresist, which is used in flat panel displays such as liquid crystal displays. More specifically, examples thereof include a blue color filter that selectively transmits wavelengths of 400 nm to 550 nm, a green color filter that selectively transmits wavelengths of 500 nm to 600 nm, a yellow color filter that selectively transmits wavelengths of 500 nm or longer, and a red color filter that selectively transmits wavelengths of 600 nm or longer.

In addition, the color filter may be laminated separately from the pixel (B) containing the color conversion luminescent material, or may be laminated integrally.

It is preferable that the substrate on which the barrier rib of the present invention is formed further have a color filter with a thickness of 1 to 5 μm partitioned as a light-shielding barrier rib between the substrate and the pixel (B).

Fig. 5 shows a cross-sectional view of one embodiment of a substrate having a barrier wall formed thereon, which has a color filter partitioned by a light-shielding barrier wall. It has a color filter (5) partitioned by a light-shielding barrier wall (4) pattern-formed on a substrate (1), and has a barrier wall (2) and a pixel (3) thereon.

It is preferable that the substrate on which the partition walls of the present invention are formed further have a low refractive index layer (hereinafter, sometimes referred to as “low refractive index layer (C)”) having a refractive index of 1.20 to 1.35 at a wavelength of 550 nm, above or below the pixel (B). By having the low refractive index layer (C), the light extraction efficiency can be further improved, thereby further improving the brightness of the display device.

Fig. 6 shows a cross-sectional view of one embodiment of a substrate having a barrier rib formed thereon with a low refractive index layer of the present invention. It has barrier ribs (2) and pixels (3) formed in a pattern on a substrate (1), and further has a low refractive index layer (6) thereon.

In the display device, from the viewpoint of appropriately suppressing reflection of backlight light and efficiently allowing light to be incident on the pixel (B), the refractive index of the low-refractive-index layer (C) is preferably 1.20 or higher, and more preferably 1.23 or higher. On the other hand, from the viewpoint of improving brightness, the refractive index of the low-refractive-index layer (C) is preferably 1.35 or lower, and more preferably 1.30 or lower. Here, the refractive index of the low-refractive-index layer (C) can be measured by irradiating light having a wavelength of 550 nm from a direction perpendicular to the cured film surface under the conditions of 20°C and atmospheric pressure using a prism coupler.

The low-refractive-index layer (C) preferably contains polysiloxane and silica particles that do not have a hollow structure. Polysiloxane has high compatibility with inorganic particles such as silica particles, and functions as a binder capable of forming a transparent layer. In addition, by containing silica particles, microscopic pores can be efficiently formed in the low-refractive-index layer (C) to reduce the refractive index, so that the refractive index can be easily adjusted within the above-mentioned range. In addition, by using silica particles that do not have a hollow structure, cracks can be suppressed since there is no hollow structure that easily causes cracks during curing shrinkage.

The polysiloxane included in the low-refractive-index layer (C) preferably contains fluorine. By containing fluorine, the refractive index of the low-refractive-index layer (C) can be easily adjusted to 1.20 to 1.35. The fluorine-containing polysiloxane can be obtained by hydrolyzing and polycondensing a plurality of alkoxysilane compounds including at least a fluorine-containing alkoxysilane compound represented by the following general formula (10). Another alkoxysilane compound may also be used. In addition, in the general formula (10), the notation "-(OR ¹² ) _4-m " means that (4-m) "-(OR ¹² )" is bonded to a Si atom.

In the above general formula (10), R ¹³ represents a fluoroalkyl group having 3 to 17 fluorine atoms. The fluoroalkyl group preferably has 1 to 20 carbon atoms. R ¹² represents the same group as R ¹¹ in general formulas (6) to (7). m represents 1 or 2. 4-m R ^12s and m R ^13s may be the same or different.

As the fluorine-containing alkoxysilane compound represented by the general formula (10), examples thereof include trifluoroethyltrimethoxysilane, trifluoroethyltriethoxysilane, trifluoropropyltrimethoxysilane, trifluoropropyltriethoxysilanetrifluoroethylethyldimethoxysilane, trifluoroethylethyldiethoxysilane, and trifluoroethylethyldiisopropoxysilane. Two or more of these may be used.

The content of polysiloxane in the low refractive index layer (C) is preferably 4 wt% or more from the viewpoint of suppressing cracks. On the other hand, the content of polysiloxane is preferably 32 wt% or less from the viewpoints of securing thixotropic properties by a network between silica particles, appropriately maintaining an air layer in the low refractive index layer (C), and further reducing the refractive index.

As silica particles having no hollow structure in the low refractive index layer (C), examples thereof include Nissan Kagaku Kogyo Co., Ltd.'s "Snowtex" (registered trademark) and "Organosilica Sol" (registered trademark) series (isopropyl alcohol dispersion, methyl ethyl ketone dispersion, propylene glycol monomethyl ether dispersion, methanol dispersion, etc.; product numbers PGM-ST, PMA-ST, IPA-ST, IPA-ST-L, IPA-ST-ZL, IPA-ST-UP, MEK-ST-UP, etc.). Two or more of these may be contained.

The content of silica particles having no hollow structure in the low refractive index layer (C) is preferably 68 wt% or more from the viewpoint of securing thixotropic properties through a network between silica particles and maintaining an appropriate air layer in the low refractive index layer (C) to further reduce the refractive index. On the other hand, the content of silica particles having no hollow structure is preferably 96 wt% or less from the viewpoint of suppressing cracks.

From the viewpoint of covering the step of the pixel (B) and suppressing the occurrence of defects, the thickness of the low-refractive-index layer (C) is preferably 0.1 ㎛ or more, and more preferably 0.5 ㎛ or more. On the other hand, from the viewpoint of reducing stress that causes cracks in the low-refractive-index layer (C), the thickness of the low-refractive-index layer (C) is preferably 20 ㎛ or less, and more preferably 10 ㎛ or less.

As a method for forming the low-refractive index layer (C), a coating method is preferable because the forming method is easy. For example, a low-refractive index resin composition containing polysiloxane and silica particles is applied onto the pixel (B), dried, and then heated to form the low-refractive index layer (C).

In addition, it is preferable that the substrate on which the barrier rib of the present invention is formed further has an inorganic protective layer (I) having a thickness of 50 to 1,000 nm on the low refractive index layer (C). By having the inorganic protective layer (I), it becomes difficult for moisture in the air to reach the low refractive index layer (C), so that fluctuations in the refractive index of the low refractive index layer (C) can be suppressed, thereby suppressing deterioration in brightness.

Figures 7 and 8 show cross-sectional views of one embodiment of a substrate having a barrier rib formed thereon and a low-refractive-index layer and an inorganic protective layer (I) of the present invention. The substrate (1) has a barrier rib (2) and a pixel (3) patterned on it, and above or below these, a low-refractive-index layer (6) and an inorganic protective layer (I) (7).

The substrate on which the partition walls of the present invention are formed preferably has the low refractive index layer (C) between the pixel (B) and the color filter, and further preferably has an inorganic protective layer (I) having a thickness of 50 to 1,000 nm on the low refractive index layer (C). By having the low refractive index layer (C) between the pixel (B) and the color filter, the light extraction improvement effect of the emitted light is enhanced, thereby improving the brightness of the display.

Fig. 9 shows a cross-sectional view of one embodiment of a substrate having a barrier rib formed between a pixel (B) and a color filter and having a low refractive index layer and an inorganic protective layer (I). The substrate has a color filter (5) partitioned by a light-shielding barrier rib (4) on a lower substrate (1), and has a low refractive index layer (6) and an inorganic protective layer (I) (7) thereon, and further has a barrier rib (2) and a pixel (3) formed in a pattern thereon.

In addition, it is preferable that the substrate on which the partition wall of the present invention is formed further has an inorganic protective layer (II) having a thickness of 50 to 1,000 nm between the pixel (B) and the low-refractive-index layer (C). By having the inorganic protective layer (II), it becomes difficult for the raw material forming the pixel (B) to move from the pixel (B) to the low-refractive-index layer, so that fluctuations in the refractive index of the low-refractive-index layer (C) can be suppressed, thereby suppressing deterioration in brightness.

Fig. 10 shows a cross-sectional view of one embodiment of a substrate having a barrier rib formed thereon and a low-refractive-index layer and an inorganic protective layer (II) of the present invention. It has a barrier rib (2) and a pixel (3) formed in a pattern on a substrate (1), and further has an inorganic protective layer (II) (8) and a low-refractive-index layer (6) thereon.

In addition, it is preferable that the substrate on which the partition wall of the present invention is formed further have an inorganic protective layer (III) and/or a yellow organic protective layer having a thickness of 50 to 1,000 nm between the color filter and the pixel (B). By having the inorganic protective layer (III), it becomes difficult for the forming raw material of the color filter to reach the pixel (B) containing the color conversion luminescent material from the color filter, so that deterioration of the brightness of the pixel (B) containing the color conversion luminescent material can be suppressed. In addition, by having the yellow organic protective layer, blue leakage light that could not be completely converted by the pixel (B) containing the color conversion luminescent material can be cut, so that color reproducibility can be improved.

Fig. 11 shows a cross-sectional view of one embodiment of a substrate having a barrier rib formed thereon and a color filter and an inorganic protective layer (III) and/or a yellow organic protective layer. It has a barrier rib (2) and a color filter (5) patterned on a substrate (1), an inorganic protective layer (III) and/or a yellow organic protective layer (9) thereon, and further has pixels (3) arranged on these while being partitioned by the barrier rib (2).

In addition, it is preferable that the substrate on which the barrier rib of the present invention is formed further have an inorganic protective layer (IV) and/or a yellow organic protective layer having a thickness of 50 to 1,000 nm on the underlying substrate. The inorganic protective layer (IV) and/or the yellow organic protective layer functions as a refractive index adjustment layer to more efficiently extract light from the pixel (B), thereby further improving the brightness of the display device. In addition, the yellow organic protective layer can cut blue leakage light that could not be completely converted by the pixel (B) containing the color conversion luminescent material, thereby improving color reproducibility. It is more preferable that the inorganic protective layer (IV) and/or the yellow organic protective layer is formed between the underlying substrate, the barrier rib (A), and the pixel (B).

Fig. 12 shows a cross-sectional view of one embodiment of a substrate having a barrier rib formed thereon and having an inorganic protective layer (IV) and/or a yellow organic protective layer. The substrate (1) has an inorganic protective layer (IV) and/or a yellow organic protective layer (10), and has barrier ribs (2) and pixels (3) patterned thereon.

As materials constituting the inorganic protective layers (I) to (IV), examples thereof include metal oxides such as silicon oxide, indium tin oxide, and gallium zinc oxide; metal nitrides such as silicon nitride; and fluorides such as magnesium fluoride. Two or more of these may be contained. Among these, silicon nitride or silicon oxide is more preferable because of low water vapor permeability and high permeability.

From the viewpoint of sufficiently suppressing the penetration of substances such as water vapor, the thickness of the inorganic protective layers (I) to (IV) is preferably 50 nm or more, and more preferably 100 nm or more. On the other hand, from the viewpoint of suppressing the decrease in transmittance, the thickness of the inorganic protective layers (I) to (IV) is preferably 800 nm or less, and more preferably 500 nm or less.

The thickness of the protective layer (I) to (IV) of the weapon can be measured by exposing a cross-section perpendicular to the substrate using a polishing device such as a cross-section polisher, and observing the cross-section under magnification using a scanning electron microscope or a transmission electron microscope.

Examples of methods for forming the inorganic protective layer (I) to (IV) include sputtering. It is preferable that the inorganic protective layer be colorless and transparent or yellowish and transparent.

The yellow organic protective layer is obtained by pattern processing of a resin composition containing, for example, the organic silver compound described above. As described above, the organic silver compound has a function of turning the protective layer yellow by decomposing and coagulating in the heating process during pattern formation to form yellow particles. In the resin composition for the yellow organic protective layer, the content of the organic silver compound is preferably 0.2 to 5 wt% in the solid content. By setting the content of the organic silver compound to 0.2 wt% or more, further yellowing can be achieved. The content of the organic silver compound is more preferably 1.5 wt% or more in the solid content. On the other hand, by setting the content of the organic silver compound to 5 wt% or less in the solid content, the transmittance can be further improved.

The resin composition forming the yellow organic protective layer may contain a yellow pigment. As the yellow pigment, examples thereof include Pigment Yellow (hereinafter abbreviated as PY) PY137, PY138, PY139, PY147, PY148, PY150, PY153, PY154, PY166, PY168, PY185, etc. Among them, from the viewpoint of selectively blocking blue light, a yellow pigment selected from PY139, PY147, PY148, and PY150 is preferable.

As a method for forming a pattern of a yellow organic protective layer, a method of forming a pattern using a photosensitive paste method, similar to the aforementioned barrier (A-1), is preferable.

As shown in Fig. 7, when a yellow organic protective layer (8) is formed on a color filter (7), the yellow organic protective layer (8) may serve as an overcoat layer that flattens each pixel of the color filter.

The thickness of the yellow organic protective layer is preferably 100 nm or more, and more preferably 500 nm or more, from the viewpoint of sufficiently blocking blue leakage light. On the other hand, from the viewpoint of suppressing a decrease in light extraction efficiency, the thickness of the yellow organic protective layer is preferably 3000 nm or less, and more preferably 2000 nm or less.

The substrate having the partition walls of the present invention can also be used in a display device using mini or micro LEDs, in which a plurality of LEDs corresponding to each pixel are arranged by the partition walls formed on the substrate. Turning on/off of each pixel is possible by turning on/off the mini or micro LEDs, so that liquid crystals are not necessary. That is, the substrate having the partition walls of the present invention can be used not only for the partition walls that separate each pixel, but also for the partition walls that separate mini or micro LEDs in a backlight.

For example, it is preferable that the substrate on which the partition walls of the present invention are formed further have a light-emitting source selected from organic EL cells, mini LED cells, and micro LED cells on the substrate. By partitioning the light-emitting sources selected from organic EL cells, mini LED cells, and micro LED cells with the partition walls, color mixing between each pixel can be prevented, thereby improving the display color purity of the display.

Fig. 13 shows a cross-sectional view of one embodiment of a substrate having a partition wall formed thereon, having a light-emitting light source selected from organic EL cells, mini LED cells and micro LED cells. The substrate (1) has a light-emitting light source (11) selected from organic EL cells, mini LED cells and micro LED cells between partition walls (2) patterned on the substrate (1).

In addition, it is preferable that the substrate on which the partition walls of the present invention are formed also have pixels (B) on light-emitting light sources selected from organic EL cells, mini LED cells, and micro LED cells.

Fig. 14 shows a cross-sectional view of one embodiment of a substrate having a partition wall formed thereon, having light-emitting light sources and pixels selected from organic EL cells, mini LED cells and micro LED cells. The substrate (1) has light-emitting light sources (11) selected from organic EL cells, mini LED cells and micro LED cells between pattern-formed partition walls (2), and further has pixels (3) thereon.

Next, the display device of the present invention will be described. The display device of the present invention has a substrate on which the above-described partition walls are formed, and a light-emitting light source. As the light-emitting light source, a light-emitting light source selected from a liquid crystal cell, an organic EL cell, a mini LED cell, and a micro LED cell is preferable. An organic EL cell is more preferable as the light-emitting light source in that it has excellent light-emitting characteristics. A mini LED cell refers to a cell in which a plurality of LEDs having a longitudinal and transverse length of about 100 ㎛ to 10 mm are arranged. A micro LED cell refers to a cell in which a plurality of LEDs having a longitudinal and transverse length of less than 100 ㎛ are arranged.

Regarding the manufacturing method of the display device of the present invention, an example of a display device having a substrate on which a partition wall of the present invention is formed and an organic EL cell is described. A photosensitive polyimide resin is applied on a glass substrate, and an insulating film having an opening is formed using a photolithography method. Aluminum is sputtered thereon, and then the aluminum is patterned using a photolithography method, and a back electrode layer in which the opening without the insulating film is made of aluminum is formed. Subsequently, tris(8-quinolinolato)aluminum (hereinafter, abbreviated as Alq3) is formed as an electron transport layer thereon using a vacuum deposition method, and then a white emitting layer is formed as a emitting layer by doping Alq3 with dicyanomethylenepyran, quinacridone, and 4,4'-bis(2,2-diphenylvinyl)biphenyl. Next, N,N'-diphenyl-N,N'-bis(α-naphthyl)-1,1'-biphenyl-4,4'-diamine is formed as a hole transport layer by vacuum deposition. Finally, ITO is formed as a transparent electrode by sputtering, and an organic EL cell having a white light-emitting layer is manufactured. A display device can be manufactured by facing the substrate on which the aforementioned barrier ribs are formed and bonding the organic EL cell thus obtained with a sealant.

Example

The present invention is further explained below by way of examples and comparative examples, but the present invention is not limited to the scope thereof. In addition, for compounds used that are abbreviated, the names are indicated below.

PGMEA: Propylene glycol monomethyl ether acetate

EDM: Diethylene glycol ethyl methyl ether

DAA: Diacetone Alcohol

BHT: Dibutylhydroxytoluene.

The solid concentration of the polysiloxane solution in Synthetic Examples 1 to 6 was obtained by the following method. 1.5 g of the polysiloxane solution was weighed into an aluminum cup, and the solution was heated at 250°C for 30 minutes using a hot plate to evaporate the liquid. The weight of the solid remaining in the aluminum cup after heating was weighed, and the solid concentration was obtained from the ratio to the weight before heating.

The weight average molecular weight of the polysiloxane solutions in Synthesis Examples 1 to 6 was measured as the weight average molecular weight in polystyrene conversion by the following method.

Device: GPC measurement device with Waters RI detector (2695)

Column: PLgel MIXED-C column (Polymer Laboratories, 300 mm) × 2 (series connection)

Measurement temperature: 40℃

Flow rate: 1mL/min

Solvent: Tetrahydrofuran (THF) 0.5 mass% solution

Standard material: polystyrene

Detection Mode:RI

The content ratio of each repeating unit in the polysiloxane in Synthetic Examples 1 to 6 was obtained by the following method. The polysiloxane solution was injected into a 10 mm diameter "Teflon" (registered trademark) NMR sample tube, and ²⁹ Si-NMR measurement was performed. The content ratio of each repeating unit was calculated from the ratio of the integral value of Si derived from a specific organosilane to the integral value of all Si derived from the organosilane. The ²⁹ Si-NMR measurement conditions are shown below.

Device: Nuclear magnetic resonance device (JNM-GX270; manufactured by Nippon Denshi Co., Ltd.)

Measurement method: Gated decoupling method

Measurement core frequency: 53.6693MHz ( ²⁹ Si core)

Spectral width: 20000Hz

Pulse width: 12μs (45° pulse)

Pulse repetition time: 30.0 sec

Solvent: Acetone-d6

Reference material: Tetramethylsilane

Measurement temperature: 23℃

Sample rotation speed: 0.0Hz.

Synthesis Example 1 Polysiloxane (PSL-1) solution

In a 1000 ml three-necked flask, 203.13 g (0.831 mol) of diphenyldimethoxysilane, 76.06 g (0.306 mol) of 3-methacryloxypropyltrimethoxysilane, 21.56 g (0.088 mol) of 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, 42.08 g (0.350 mol) of dimethyldimethoxysilane, 45.91 g (0.175 mol) of 3-trimethoxysilylpropyl succinic anhydride, 1.475 g of BHT, and 308.45 g of PGMEA were added, and while stirring at 40°C, a phosphoric acid aqueous solution containing 3.887 g (1.0 wt% with respect to the added monomer) of phosphoric acid dissolved in 76.39 g of water was added over 30 minutes. was added. After that, the flask was immersed in a 70°C oil bath and stirred for 60 minutes, and then the oil bath was heated to 115°C over 30 minutes. The solution temperature (internal temperature) reached 100°C 1 hour after the start of the heating, and then heated and stirred for 2 hours (the internal temperature was 100 to 110°C) to obtain a polysiloxane solution. In addition, during the heating and heating stirring, a mixed gas of 95 vol% nitrogen and 5 vol% oxygen was flowed at a rate of 0.05 liters/minute. During the reaction, a total of 173.99 g of by-products, methanol and water, were distilled off. PGMEA was added to the obtained polysiloxane solution so that the solid concentration became 40 wt%, and a polysiloxane (PSL-1) solution was obtained. In addition, the weight average molecular weight of the obtained polysiloxane (PSL-1) was 6,000. Additionally, the molar ratios of each repeating unit derived from diphenyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, dimethyldimethoxysilane, and 3-trimethoxysilylpropyl succinic anhydride in polysiloxane (PSL-1) were 47.5 mol%, 17.5 mol%, 5 mol%, 20 mol%, and 10 mol%, respectively.

Synthesis Example 2 Polysiloxane (PSL-2) solution

In a 1000 ml three-necked flask, 164.83 g (0.831 mol) of phenyltrimethoxysilane, 76.06 g (0.306 mol) of 3-methacryloxypropylmethyldimethoxysilane, 21.56 g (0.088 mol) of 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, 42.08 g (0.350 mol) of dimethyldimethoxysilane, 45.91 g (0.175 mol) of 3-trimethoxysilylpropyl succinic anhydride, 1.186 g of BHT, and 255.58 g of PGMEA were added, and while stirring at 40°C, a phosphoric acid aqueous solution containing 3.504 g (1.0 wt% with respect to the added monomer) of phosphoric acid dissolved in 91.35 g of water was added over 30 minutes. was added. After that, the flask was immersed in a 70°C oil bath and stirred for 60 minutes, and then the oil bath was heated to 115°C over 30 minutes. The solution temperature (internal temperature) reached 100°C 1 hour after the start of the heating, and then heated and stirred for 2 hours (the internal temperature was 100 to 110°C) to obtain a polysiloxane solution. In addition, during the heating and heating stirring, a mixed gas of 95 vol% nitrogen and 5 vol% oxygen was flowed at a rate of 0.05 liters/minute. During the reaction, a total of 208.08 g of by-products, methanol and water, were distilled off. PGMEA was added to the obtained polysiloxane solution so that the solid concentration became 40 wt%, and a polysiloxane (PSL-2) solution was obtained. In addition, the weight average molecular weight of the obtained polysiloxane (PSL-2) was 5,500. Additionally, in polysiloxane (PSL-2), the molar ratios of each repeating unit derived from phenyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, dimethyldimethoxysilane, and 3-trimethoxysilylpropyl succinic anhydride were 47.5 mol%, 17.5 mol%, 5 mol%, 20 mol%, and 10 mol%, respectively.

Synthesis Example 3 Polysiloxane (PSL-3) solution

Into a 1000 ml three-necked flask, 71.16 g (0.306 mol) of 3-methacryloxypropylmethyldimethoxysilane, 78.52 g (0.35 mol) of styryltrimethoxysilane, 21.56 g (0.088 mol) of 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, 113.22 g (0.83 mol) of methyltrimethoxysilane, 45.91 g (0.175 mol) of 3-trimethoxysilylpropyl succinic anhydride, 1.080 g of BHT, and 234.92 g of PGMEA were added, and while stirring at 40°C, a phosphoric acid aqueous solution containing 3.304 g (1.0 wt% with respect to the added monomer) of phosphoric acid dissolved in 92.14 g of water was added over 30 minutes. was added. After that, the flask was immersed in a 70°C oil bath and stirred for 60 minutes, and then the oil bath was heated to 115°C over 30 minutes. One hour after the start of the heating, the solution temperature (internal temperature) reached 100°C, and then heated and stirred for 2 hours (the internal temperature was 100 to 110°C) to obtain a polysiloxane solution. In addition, during the heating and heating stirring, a mixed gas of 95 vol% nitrogen and 5 vol% oxygen was flowed at a rate of 0.05 liters/minute. During the reaction, a total of 209 g of by-products, methanol and water, were distilled off. PGMEA was added to the obtained polysiloxane solution so that the solid concentration became 40 wt%, and a polysiloxane (PSL-3) solution was obtained. In addition, the weight average molecular weight of the obtained polysiloxane (PSL-3) was 12,000. In addition, the molar ratios of each repeating unit derived from 3-methacryloxypropylmethyldimethoxysilane, styryltrimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, methyltrimethoxysilane, and 3-trimethoxysilylpropyl succinic anhydride in polysiloxane (PSL-3) were 17.5 mol%, 20 mol%, 5 mol%, 47.5 mol%, and 10 mol%, respectively.

Synthesis Example 4 Polysiloxane (PSL-4) solution

Into a 1000 ml three-necked flask, 71.16 g (0.306 mol) of 3-methacryloxypropylmethyldimethoxysilane, 19.63 g (0.088 mol) of styryltrimethoxysilane, 21.56 g (0.088 mol) of 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, 148.97 g (1.09 mol) of methyltrimethoxysilane, 45.91 g (0.175 mol) of 3-trimethoxysilylpropyl succinic anhydride, 0.963 g of BHT, and 212.01 g of PGMEA were added, and while stirring at 40°C, a phosphoric acid aqueous solution containing 3.072 g (1.0 wt% with respect to the added monomer) of phosphoric acid dissolved in 92.14 g of water was added over 30 minutes. was added. After that, the flask was immersed in a 70°C oil bath and stirred for 60 minutes, and then the oil bath was heated to 115°C over 30 minutes. The solution temperature (internal temperature) reached 100°C 1 hour after the start of the heating, and then heated and stirred for 2 hours (the internal temperature was 100 to 110°C) to obtain a polysiloxane solution. In addition, during the heating and heating stirring, a mixed gas of 95 vol% nitrogen and 5 vol% oxygen was flowed at a rate of 0.05 liters/minute. During the reaction, a total of 209 g of by-products, methanol and water, were distilled off. PGMEA was added to the obtained polysiloxane solution so that the solid concentration became 40 wt%, and a polysiloxane (PSL-4) solution was obtained. In addition, the weight average molecular weight of the obtained polysiloxane (PSL-4) was 10,000. In addition, the molar ratios of each repeating unit derived from 3-methacryloxypropylmethyldimethoxysilane, styryltrimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, methyltrimethoxysilane, and 3-trimethoxysilylpropyl succinic anhydride in polysiloxane (PSL-4) were 17.5 mol%, 5 mol%, 5 mol%, 62.5 mol%, and 10 mol%, respectively.

Synthesis Example 5 Polysiloxane (PSL-5) solution

In a 1000 ml three-necked flask, 71.16 g (0.306 mol) of 3-methacryloxypropylmethyldimethoxysilane, 157.03 g (0.70 mol) of styryltrimethoxysilane, 21.56 g (0.088 mol) of 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, 65.55 g (0.481 mol) of methyltrimethoxysilane, 45.91 g (0.175 mol) of 3-trimethoxysilylpropyl succinic anhydride, 1.235 g of BHT, and 265.45 g of PGMEA were added, and while stirring at 40°C, a phosphoric acid aqueous solution containing 3.072 g (1.0 wt% with respect to the added monomer) of phosphoric acid dissolved in 92.14 g of water was added over 30 minutes. was added. After that, the flask was immersed in a 70°C oil bath and stirred for 60 minutes, and then the oil bath was heated to 115°C over 30 minutes. The solution temperature (internal temperature) reached 100°C 1 hour after the start of the heating, and then heated and stirred for 2 hours (the internal temperature was 100 to 110°C) to obtain a polysiloxane solution. In addition, during the heating and heating stirring, a mixed gas of 95 vol% nitrogen and 5 vol% oxygen was flowed at a rate of 0.05 liters/minute. During the reaction, a total of 209 g of by-products, methanol and water, were distilled off. PGMEA was added to the obtained polysiloxane solution so that the solid concentration became 40 wt%, and a polysiloxane (PSL-5) solution was obtained. In addition, the weight average molecular weight of the obtained polysiloxane (PSL-5) was 10,000. In addition, the molar ratios of each repeating unit derived from 3-methacryloxypropylmethyldimethoxysilane, styryltrimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, methyltrimethoxysilane, and 3-trimethoxysilylpropyl succinic anhydride in polysiloxane (PSL-5) were 17.5 mol%, 40 mol%, 5 mol%, 27.5 mol%, and 10 mol%, respectively.

Synthesis Example 6 Polysiloxane (PSL-6) solution

In a 1000 ml three-necked flask, 213.82 g (0.875 mol) of diphenyldimethoxysilane, 43.12 g (0.175 mol) of 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, 68.86 g (0.263 mol) of tetraethoxysilane, 59.59 g (0.438 mol) of methyltrimethoxysilane, 1.413 g of BHT, and 298.06 g of PGMEA were charged, and an aqueous phosphoric acid solution containing 3.854 g (1.0 wt% based on the charged monomer) of phosphoric acid dissolved in 83.48 g of water was added over 30 minutes while stirring at 40°C. Thereafter, the flask was immersed in a 70°C oil bath and stirred for 60 minutes, and then the oil bath was heated to 115°C over 30 minutes. The solution temperature (internal temperature) reached 100°C 1 hour after the start of the heating, and then heated and stirred for 2 hours (the internal temperature was 100 to 110°C) to obtain a polysiloxane solution. In addition, during the temperature elevation and heating and stirring, a mixed gas of 95 vol% nitrogen and 5 vol% oxygen was flowed at a rate of 0.05 liters/minute. A total of 282.58 g of by-products, methanol and water, were distilled off during the reaction. PGMEA was added to the obtained polysiloxane solution so that the solid concentration became 40 wt%, and a polysiloxane (PSL-6) solution was obtained. In addition, the weight average molecular weight of the obtained polysiloxane (PSL-6) was 5,500. Additionally, in polysiloxane (PSL-6), the molar ratios of each repeating unit derived from diphenyldimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, tetraethoxysilane, and methyltrimethoxysilane were 50 mol%, 10 mol%, 15 mol%, and 25 mol%, respectively.

The compositions of synthetic examples 1 to 6 are summarized in Table 1.

[Table 1]

Synthesis Example 7 Green Organic Phosphor

3,5-Dibromobenzaldehyde (3.0 g), 4-t-butylphenylboronic acid (5.3 g), tetrakis(triphenylphosphine)palladium(0) (0.4 g), and potassium carbonate (2.0 g) were placed in a flask and replaced with nitrogen. Degassed toluene (30 mL) and degassed water (10 mL) were added, and refluxed for 4 hours. The reaction solution was cooled to room temperature, and after separation, the organic layer was washed with saturated brine. The organic layer was dried over magnesium sulfate, filtered, and the solvent was distilled off. The obtained reaction product was purified by silica gel column chromatography, and 3,5-bis(4-t-butylphenyl)benzaldehyde (3.5 g) was obtained as a white solid. Next, 3,5-bis(4-t-butylphenyl)benzaldehyde (1.5 g) and 2,4-dimethylpyrrole (0.7 g) were placed in a flask, dehydrated dichloromethane (200 mL) and trifluoroacetic acid (1 drop) were added, and the mixture was stirred for 4 hours under a nitrogen atmosphere. A dehydrated dichloromethane solution of 2,3-dichloro-5,6-dicyano-1,4-benzoquinone (0.85 g) was added to the reaction mixture, and the mixture was stirred for another 1 hour. After completion of the reaction, boron trifluoride diethyl ether complex (7.0 mL) and diisopropylethylamine (7.0 mL) were added, and the mixture was stirred for 4 hours, then water (100 mL) was added, stirred, and the organic layer was separated. The organic layer was dried over magnesium sulfate, filtered, and the solvent was distilled off. The obtained reaction product was purified by silica gel column chromatography, and 0.4 g of a green powder was obtained (yield 17%). The results of ¹ H-NMR analysis of the obtained green powder were as follows, and it was confirmed that the green powder obtained above was [G-1] represented by the following structural formula.

¹ H-NMR (CDCl ₃ (d=ppm)):7.95(s,1H), 7.63-7.48(m,10H), 6.00(s,2H), 2.58(s,6H), 1.50(s,6H), 1.37(s,18H).

Synthesis Example 8 Red Organic Phosphor

A mixed solution of 300 mg of 4-(4-t-butylphenyl)-2-(4-methoxyphenyl)pyrrole, 201 mg of 2-methoxybenzoyl chloride and 10 ml of toluene was heated at 120°C for 6 hours under a nitrogen stream. After cooling to room temperature, the solvent was evaporated. The obtained residue was washed with 20 ml of ethanol and dried in vacuum, thereby obtaining 260 mg of 2-(2-methoxybenzoyl)-3-(4-t-butylphenyl)-5-(4-methoxyphenyl)pyrrole. Next, a mixed solution of 260 mg of 2-(2-methoxybenzoyl)-3-(4-t-butylphenyl)-5-(4-methoxyphenyl)pyrrole, 180 mg of 4-(4-t-butylphenyl)-2-(4-methoxyphenyl)pyrrole, 206 mg of methanesulfonic anhydride and 10 ml of degassed toluene was heated at 125°C for 7 hours under a nitrogen stream. After the reaction mixture was cooled to room temperature, 20 ml of water was injected, and extracted with 30 ml of dichloromethane. The organic layer was washed twice with 20 ml of water, evaporated and dried under vacuum to obtain pyrromethene as a residue. Next, to a mixed solution of the obtained pyrromethene and 10 ml of toluene, 305 mg of diisopropylethylamine and 670 mg of boron trifluoride diethyl ether complex were added under a nitrogen stream, and the mixture was stirred at room temperature for 3 hours. 20 ml of water was injected into the reaction mixture, and extraction was performed with 30 ml of dichloromethane. The organic layer was washed twice with 20 ml of water, dried over magnesium sulfate, and evaporated. The residue was purified by silica gel column chromatography and dried in vacuo, to obtain 0.27 g of a reddish purple powder (yield: 70%). The results of ^1H -NMR analysis of the obtained reddish purple powder were as follows, and it was confirmed that the obtained reddish purple powder was [R-1] represented by the following structural formula.

¹ H-NMR (CDCl ₃ (d=ppm)): 1.19(s,18H), 3.42(s,3H), 3.85(s,6H), 5.72(d,1H), 6.20(t,1H), 6.42-6.97(m,16H), 7.89(d,4H).

Synthesis Example 9 Polysiloxane solution containing silica particles (LS-1)

In a 500-mL three-necked flask were placed 0.05 g (0.4 mmol) of methyltrimethoxysilane, 0.66 g (3.0 mmol) of trifluoropropyltrimethoxysilane, 0.10 g (0.4 mmol) of trimethoxysilylpropyl succinic anhydride, 7.97 g (34 mmol) of γ-acryloxypropyltrimethoxysilane, and 224.37 g of an isopropyl alcohol dispersion of 15.6 wt% silica particles (IPA-ST-UP: manufactured by Nissan Chemical Industries, Ltd.), and 163.93 g of ethylene glycol mono-t-butyl ether was added. While stirring at room temperature, an aqueous phosphoric acid solution, in which 0.088 g of phosphoric acid was dissolved in 4.09 g of water, was added over 3 minutes. Thereafter, the flask was immersed in a 40°C oil bath and stirred for 60 minutes, and then the oil bath was heated to 115°C over 30 minutes. The internal temperature of the solution reached 100°C 1 hour after the start of the heating, and then by heating and stirring for another 2 hours (the internal temperature was 100 to 110°C), a polysiloxane solution (LS-1) containing silica particles was obtained. In addition, nitrogen was flowed at a rate of 0.05 l/min during the temperature elevation and heating and stirring. A total of 194.01 g of by-products, methanol and water, were distilled out during the reaction. The solid content concentration of the obtained polysiloxane solution (LS-1) containing silica particles was 24.3 wt%, and the contents of polysiloxane and silica particles in the solid content were 15 wt% and 85 wt%, respectively. The molar ratios of the repeating units derived from methyltrimethoxysilane, trifluoropropyltrimethoxysilane, 3-trimethoxysilylpropyl succinic anhydride, and γ-acryloxypropyltrimethoxysilane in the obtained silica particle-containing polysiloxane (LS-1) were 1.0 mol%, 8.0 mol%, 1.0 mol%, and 90.0 mol%, respectively.

Example 1 Resin composition for bulkhead (P-1)

As a white pigment, 5.00 g of titanium dioxide pigment (R-960; manufactured by BASF Japan Co., Ltd. (hereinafter referred to as “R-960”)) and as a resin, 5.00 g of a polysiloxane (PSL-1) solution obtained by Synthesis Example 1 were mixed and dispersed using a mill disperser filled with zirconia beads to obtain a pigment dispersion (MW-1). In addition, as an organic silver compound, 0.50 g of silver neodecanoate was dissolved in 4.50 g of EDM to obtain an organic silver compound solution (OA-1).

Next, 8.25 g of the pigment dispersion (MW-1), 7.025 g of the polysiloxane (PSL-1) solution, 1.031 g of the organic silver compound solution (OA-1), 0.026 g of t-butylhydroquinone as a reducing agent, 0.155 g of ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-,1-(O-acetyloxime) ("Ilgacure" (registered trademark) OXE-02, manufactured by BASF Japan Co., Ltd. (hereinafter referred to as "OXE-02")) as a photopolymerization initiator, 0.258 g of bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide ("Ilgacure" 819, manufactured by BASF Japan Co., Ltd. (hereinafter referred to as "IC-819")) and a photopolymerizable agent. As a compound, dipentaerythritol hexaacrylate ("KAYARAD" (registered trademark) DPHA, manufactured by Shinnippon Yakugyo Co., Ltd. (hereinafter referred to as "DPHA")) 2.063 g, as a lyophobic compound, a photopolymerizable fluorine-containing compound ("Megapack" (registered trademark) RS-72A, 20 wt% PGMEA diluted solution, manufactured by DIC Corporation (hereinafter referred to as "RS-72A")) 0.258 g, 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate ("Celoxide" (registered trademark) 2021P, manufactured by Daicel Co., Ltd. (hereinafter referred to as "Celoxide (registered trademark) 2021P")) 0.021 g, 0.031 g of ethylene bis(oxyethylene)bis[3-(5-tert-butyl-4-hydroxy-m-tolyl)propionate] (“IRGANOX” (registered trademark) 1010, manufactured by BASF Japan Co., Ltd. (hereinafter referred to as “IRGANOX (registered trademark) 1010”) and 0.103 g (equivalent to a concentration of 500 ppm) of a 10 wt% diluted solution of PGMEA with an acrylic surfactant (“BYK” (registered trademark) 352, manufactured by Big Chemie Japan Co., Ltd. (hereinafter referred to as “BYK-352”)) were dissolved in 1.405 g of PGMEA solvent, and the mixture was stirred. The obtained mixture was filtered through a 5.0 μm filter, and a resin composition for a partition wall (P-1) was obtained.

Example 2 Resin composition for bulkhead (P-2)

A resin composition for a partition wall (P-2) was obtained in the same manner as in Example 1, except that the amount of the organic silver compound solution (OA-1) added was 0.722 g, the amount of the polysiloxane (PSL-1) solution added was 7.10 g, and the amount of PGMEA added was 1.64 g.

Example 3 Resin composition for bulkhead (P-3)

A resin composition for a partition wall (P-3) was obtained in the same manner as in Example 1, except that the amount of the organic silver compound solution (OA-1) added was 0.516 g, the amount of the polysiloxane (PSL-1) solution added was 7.15 g, and the amount of PGMEA added was 1.79 g.

Example 4 Resin composition for bulkhead (P-4)

A resin composition for a partition wall (P-4) was obtained in the same manner as in Example 1, except that the amount of the organic silver compound solution (OA-1) added was 0.206 g, the amount of the polysiloxane (PSL-1) solution added was 7.32 g, and the amount of PGMEA added was 2.02 g.

Example 5 Resin composition for bulkhead (P-5)

6.59 g of the pigment dispersion (MW-1), 4.78 g of the polysiloxane (PSL-1) solution, 4.12 g of the organic silver compound solution (OA-1), 0.021 g of t-butylhydroquinone as a reducing agent, 0.124 g of OXE-02 as a photopolymerization initiator, 0.206 g of IC-819, 1.648 g of DPHA as a photopolymerizable compound, 0.206 g of RS-72A as a lyotropic compound, 0.016 g of cellulose 2021P, 0.025 g of IRGANOX1010, and 0.103 g of a 10 wt% diluted solution of BYK-352 in PGMEA were dissolved in 2.76 g of the solvent PGMEA, and stirred. The obtained mixture was filtered through a 5.0 μm filter, and a resin composition for a partition wall (P-5) was obtained.

Example 6 Resin composition for bulkhead (P-6)

A resin composition for a partition wall (P-6) was obtained in the same manner as in Example 1, except that the amount of the organic silver compound solution (OA-1) added was 0.516 g, the amount of the polysiloxane (PSL-1) solution added was 7.19 g, the amount of t-butylhydroquinone added was 0.010 g, and the amount of PGMEA added was 1.77 g.

Example 7 Resin composition for bulkhead (P-7)

As an organic silver compound, 0.50 g of silver salicylate was dissolved in 4.50 g of EDM to obtain an organic silver compound solution (OA-2). A resin composition for a partition wall (P-7) was obtained in the same manner as in Example 2, except that the organic silver compound solution (OA-2) was used instead of the organic silver compound solution (OA-1).

Example 8 Resin composition for bulkhead (P-8)

As an organic silver compound, 0.50 g of silver octylate was dissolved in 4.50 g of EDM to obtain an organic silver compound solution (OA-3). A resin composition for a partition wall (P-8) was obtained in the same manner as in Example 2, except that the organic silver compound solution (OA-3) was used instead of the organic silver compound solution (OA-1).

Example 9 Resin composition for bulkhead (P-9)

As an organic silver compound, 2.50 g of the organic silver compound (APAG-1) obtained in Preparation Example 8 described below was dissolved in 2.50 g of EDM to obtain an organic silver compound solution (OA-4). A resin composition for a partition wall (P-9) was obtained in the same manner as in Example 2, except that the organic silver compound solution (OA-4) was used instead of the organic silver compound solution (OA-1).

Example 10 Resin composition for bulkhead (P-10)

A resin composition for a partition wall (P-10) was obtained in the same manner as in Example 2, except that 2,3-dimethylhydroquinone was used instead of t-butylhydroquinone as a reducing agent.

Example 11 Resin composition for bulkhead (P-11)

A resin composition for a partition wall (P-11) was obtained in the same manner as in Example 2, except that trimethylhydroquinone was used instead of t-butylhydroquinone as a reducing agent.

Example 12 Resin composition for bulkhead (P-12)

A resin composition for a partition wall (P-12) was obtained in the same manner as in Example 2, except that 2,6-dimethylhydroquinone was used instead of t-butylhydroquinone as a reducing agent.

Example 13 Resin composition for bulkhead (P-13)

A resin composition for a partition wall (P-13) was obtained in the same manner as in Example 2, except that phenylhydroquinone was used instead of t-butylhydroquinone as a reducing agent.

Example 14 Resin composition for bulkhead (P-14)

A resin composition for a partition wall (P-14) was obtained in the same manner as in Example 2, except that 2,5-t-amylhydroquinone was used instead of t-butylhydroquinone as a reducing agent.

Example 15 Resin composition for bulkhead (P-15)

A resin composition for a partition wall (P-15) was obtained in the same manner as in Example 2, except that hydroquinone was used instead of t-butylhydroquinone as a reducing agent.

Example 16 Resin composition for bulkhead (P-16)

A resin composition for a partition wall (P-16) was obtained in the same manner as in Example 2, except that glycolaldehyde was used instead of t-butylhydroquinone as a reducing agent.

Example 17 Resin composition for bulkhead (P-17)

A resin composition for a partition wall (P-17) was obtained in the same manner as in Example 2, except that the amount of t-butylhydroquinone added was 0.005 g, the amount of polysiloxane (PSL-1) solution added was 7.15 g, and the amount of PGMEA added was 1.61 g.

Example 18 Resin composition for bulkhead (P-18)

A resin composition for a partition wall (P-18) was obtained in the same manner as in Example 2, except that the amount of t-butylhydroquinone added was 0.413 g, the amount of polysiloxane (PSL-1) solution added was 6.14 g, and the amount of PGMEA added was 2.22 g.

Example 19 Resin composition for bulkhead (P-19)

As a white pigment, 5.00 g of R-960 and 5.00 g of a polysiloxane (PSL-2) solution were mixed as a resin and dispersed using a mill disperser filled with zirconia beads to obtain a pigment dispersion (MW-2). 8.25 g of the pigment dispersion (MW-2) was added instead of the pigment dispersion (MW-1), 7.10 g of the polysiloxane (PSL-2) solution was added instead of the polysiloxane (PSL-1) solution, and 1.64 g of PGMEA were added, except that the procedure of Example 2 was repeated to obtain a resin composition for a partition (P-19).

Example 20 Resin composition for bulkhead (P-20)

As a white pigment, 5.00 g of R-960 and 5.00 g of a polysiloxane (PSL-3) solution were mixed as a resin and dispersed using a mill disperser filled with zirconia beads to obtain a pigment dispersion (MW-3). 8.25 g of the pigment dispersion (MW-3) was added instead of the pigment dispersion (MW-1), 7.10 g of the polysiloxane (PSL-3) solution was added instead of the polysiloxane (PSL-1) solution, and 1.64 g of PGMEA were added, except that the procedure of Example 2 was the same as that for obtaining a resin composition for a partition (P-20).

Example 21 Resin composition for bulkhead (P-21)

As a white pigment, 5.00 g of R-960 and 5.00 g of a polysiloxane (PSL-4) solution were mixed as a resin and dispersed using a mill disperser filled with zirconia beads to obtain a pigment dispersion (MW-4). 8.25 g of the pigment dispersion (MW-4) was added instead of the pigment dispersion (MW-1), 7.10 g of the polysiloxane (PSL-4) solution was added instead of the polysiloxane (PSL-1) solution, and 1.64 g of PGMEA were added, except that the procedure of Example 2 was the same as that for obtaining a resin composition for a partition (P-21).

Example 22 Resin composition for bulkhead (P-22)

As a white pigment, 5.00 g of R-960 and 5.00 g of a polysiloxane (PSL-5) solution were mixed as a resin and dispersed using a mill disperser filled with zirconia beads to obtain a pigment dispersion (MW-5). 8.25 g of the pigment dispersion (MW-5) was added instead of the pigment dispersion (MW-1), 7.10 g of the polysiloxane (PSL-5) solution was added instead of the polysiloxane (PSL-1) solution, and 1.64 g of PGMEA were added, except that the procedure of Example 2 was the same as that for obtaining a resin composition for a partition (P-22).

Example 23 Resin composition for bulkhead (P-23)

As a white pigment, 5.00 g of R-960 and 5.00 g of a polysiloxane (PSL-6) solution as a resin were mixed and dispersed using a mill disperser filled with zirconia beads to obtain a pigment dispersion (MW-6). 8.25 g of a pigment dispersion (MW-6), 7.941 g of a polysiloxane (PSL-6) solution, 0.722 g of the above organic silver compound solution (OA-1), 0.026 g of t-butylhydroquinone as a reducing agent, 2.063 g of THP-17 (trade name, manufactured by Toyo Gosei Kogyo Co., Ltd.) as a quinonediazide compound, 0.258 g of RS-72A as a lyophobic compound, 0.021 g of Celoxide 2021P, 0.031 g of IRGANOX1010, and 0.103 g of a 10 wt% diluted solution of BYK-352 in PGMEA were dissolved in 1.018 g of a solvent, PGMEA, and stirred. The obtained mixture was filtered through a 5.0 μm filter, and a resin composition for a partition wall (P-23) was obtained.

Example 24 Resin composition for bulkhead (P-24)

A resin composition for a partition wall (P-24) was obtained in the same manner as in Example 2, except that the repellent compound RS-72A was not added, the amount of polysiloxane (PSL-1) solution added was 7.23 g, and the amount of PGMEA added was 1.77 g.

Example 25 Resin composition for bulkhead (P-25)

As a white pigment, R-960 (5.00 g), as a resin, polysiloxane (PSL-1) solution (5.00 g), and as a light-shielding pigment, 0.0188 g of titanium nitride were mixed and dispersed using a mill disperser filled with zirconia beads to obtain a pigment dispersion (MW-7). A resin composition for a partition wall (P-25) was obtained in the same manner as in Example 2, except that 8.27 g of the pigment dispersion (MW-7) was added instead of the pigment dispersion (MW-1), the amount of the polysiloxane (PSL-1) solution added was 7.06 g, and the amount of PGMEA added was 2.31 g.

Example 26 Resin composition for bulkhead (P-26)

As a white pigment, R-960 (5.00 g), as a resin, polysiloxane (PSL-1) solution (5.00 g), as a light-shielding pigment, Pigment Red 254 (PR254) (0.0113 g), and Pigment Blue 15:6N (PB15:6N) (0.0075 g) were mixed and dispersed using a mill disperser filled with zirconia beads to obtain a pigment dispersion (MW-8). A resin composition for a partition (P-26) was obtained in the same manner as in Example 2, except that 8.27 g of the pigment dispersion (MW-8) was added instead of the pigment dispersion (MW-1), the amount of the polysiloxane (PSL-1) solution added was 7.06 g, and the amount of PGMEA added was 2.31 g.

Example 27 Resin composition for bulkhead (P-27)

As an organometallic compound, 0.103 g of bis(acetylacetonato)palladium and as a coordination compound having a phosphorus atom, 0.089 g (equimolar amounts with respect to the organometallic compound) of triphenylphosphine were dissolved in 1.726 g of DAA to obtain an organometallic compound solution (OM-1). A resin composition for a partition wall (P-27) was obtained in the same manner as in Example 2, except that 1.17 g of the organometallic compound solution (OM-1) was added, the amount of the polysiloxane (PSL-1) solution added was 6.86 g, and the amount of PGMEA added was 0.92 g.

Example 28 Resin composition for bulkhead (P-28)

5.00 g of titanium nitride as a shade pigment and 5.00 g of a polysiloxane (PSL-1) solution as a resin were mixed and dispersed using a mill disperser filled with zirconia beads to obtain a pigment dispersion (MW-9). 0.164 g of the pigment dispersion (MW-9), 14.51 g of a polysiloxane (PSL-1) solution, 0.021 g of t-butylhydroquinone as a reducing agent, 0.164 g of OXE-02 as a photopolymerization initiator, 0.328 g of IC-819, 1.640 g of DPHA as a photopolymerizable compound, 0.205 g of RS-72A as a lyophobic compound, 0.016 g of Celoxide 2021P, 0.025 g of IRGANOX1010, and 0.103 g of a 10 wt% diluted solution of BYK-352 in PGMEA were dissolved in 2.75 g of a solvent PGMEA, and the mixture was stirred. The obtained mixture was filtered through a 5.0 μm filter, and a resin composition for a partition wall (P-28) was obtained.

Example 29 Resin composition for bulkhead (P-29)

As a shade pigment, 3.00 g of PR254, 2.00 g of PB15:6N, and 5.00 g of a polysiloxane (PSL-1) solution as a resin were mixed and dispersed using a mill disperser filled with zirconia beads to obtain a pigment dispersion (MW-10). A resin composition for a partition wall (P-29) was obtained in the same manner as in Example 28, except that 0.574 g of the pigment dispersion (MW-10) was added, the amount of the polysiloxane (PSL-1) solution added was 13.49 g, and the amount of PGMEA added was 3.37 g.

Comparative Example 1 Resin composition for bulkhead (P-30)

13.40 g of a polysiloxane (PSL-1) solution, 0.574 gg of the organic silver compound solution (OA-1), 0.021 g of t-butylhydroquinone as a reducing agent, 0.123 g of OXE-02 as a photopolymerization initiator, 0.246 g of IC-819, 1.640 g of DPHA as a photopolymerizable compound, 0.205 g of RS-72A as a lyotropic compound, 0.016 g of Celoxide 2021P, 0.025 g of IRGANOX1010, and 0.103 g of a 10 wt% diluted solution of BYK-352 in PGMEA were dissolved in 0.02 g of a solvent, PGMEA, and stirred. The obtained mixture was filtered through a 5.0 μm filter, and a resin composition for a partition wall (P-30) was obtained.

Comparative Example 2 Resin composition for bulkhead (P-31)

A resin composition for a partition wall (P-31) was obtained in the same manner as in Example 2, except that the organic silver compound solution (OA-1) was not added, the amount of polysiloxane (PSL-1) solution added was 7.28 g, and the amount of PGMEA added was 2.18 g.

Comparative Example 3 Resin composition for bulkhead (P-32)

A resin composition for a partition wall (P-32) was obtained in the same manner as in Example 1, except that the reducing agent t-butylhydroquinone was not added, the amount of polysiloxane (PSL-1) solution added was 7.09 g, and the amount of PGMEA added was 1.37 g.

The compositions of Examples 1 to 29 and Comparative Examples 1 to 3 are summarized in Table 2.

[Table 2-1]

[Table 2-2]

[Table 2-3]

[Table 2-4]

Preparation Example 1 Color conversion luminescent material composition (CL-1)

20 parts by weight of a 0.5 wt% toluene solution of green quantum dot material (Lumidot 640 CdSe/ZnS, average particle diameter 6.3 nm: manufactured by Aldrich), 45 parts by weight of DPHA, 5 parts by weight of "Ilgacure" (registered trademark) 907 (manufactured by BASF Japan Co., Ltd.), 166 parts by weight of a 30 wt% PGMEA solution of acrylic resin (SPCR-18 (trade name), manufactured by Showa Denko Co., Ltd.), and 97 parts by weight of toluene were mixed, stirred, and uniformly dissolved. The obtained mixture was filtered through a 0.45 μm syringe filter, and a color conversion luminescent material composition (CL-1) was prepared.

Preparation Example 2 Color Conversion Luminescent Material Composition (CL-2)

A color conversion luminescent material composition (CL-2) was prepared in the same manner as Preparation Example 1, except that 0.4 parts by weight of the green phosphor G-1 obtained by Synthesis Example 10 was used instead of the green quantum dot material, and the amount of toluene added was changed to 117 parts by weight.

Preparation Example 3 Color Conversion Luminescent Material Composition (CL-3)

A color conversion luminescent material composition (CL-3) was prepared in the same manner as Preparation Example 1, except that 0.4 parts by weight of the red phosphor R-1 obtained by Synthesis Example 11 was used instead of the green quantum dot material, and the amount of toluene added was changed to 117 parts by weight.

Preparation Example 4 Color Filter Forming Material (CF-1)

A slurry was prepared by mixing 90 g of C.I. Pigment Green 59, 60 g of C.I. Pigment Yellow 150, 75 g of a polymer dispersant (“BYK” (registered trademark)-6919 (trade name) manufactured by Big Chemie (hereinafter referred to as “BYK-6919”)), 100 g of a binder resin (“Adeka Acruz” (registered trademark) WR301 (trade name) manufactured by ADEKA Co., Ltd.), and 675 g of PGMEA. The beaker containing the slurry was connected to a dynomill with a tube, and zirconia beads having a diameter of 0.5 mm were used as media, and dispersion treatment was performed at a speed of 14 m/s for 8 hours, to prepare a Pigment Green 59 dispersion (GD-1).

Pigment Green 59 dispersion (GD-1) 56.54 g, acrylic resin ("Cychroma" (registered trademark) P(ACA)Z250 (trade name) manufactured by Daicel Ornex Co., Ltd. (hereinafter referred to as "P(ACA)Z250")), DPHA 2.64 g, photopolymerization initiator ("Optomer" (registered trademark) NCI-831 (trade name) manufactured by ADEKA Co., Ltd. (hereinafter referred to as "NCI-831")) 0.330 g, surfactant (BYK" (registered trademark)-333 (trade name) manufactured by Big Chemie Co., Ltd. (hereinafter referred to as "BYK-333")) 0.04 g, BHT 0.01 g as a polymerization inhibitor, and PGMEA 37.30 g as a solvent were mixed to produce a color filter forming material (CF-1).

Example 5 Resin composition for light-shielding barrier

A slurry was prepared by mixing 150 g of carbon black (MA100 (trade name) manufactured by Mitsubishi Chemical Corporation), 75 g of polymer dispersant BYK-6919, 100 g of P(ACA)Z250, and 675 g of PGMEA. The beaker containing the slurry was connected to a dynomill with a tube, and zirconia beads with a diameter of 0.5 mm were used as media, and dispersion treatment was performed at a speed of 14 m/s for 8 hours to prepare a pigment dispersion (MB-1).

56.54 g of pigment dispersion (MB-1), 3.14 g of P(ACA)Z250, 2.64 g of DPHA, 0.330 g of NCI-831, 0.04 g of BYK-333, 0.01 g of tert-butylcatechol as a polymerization inhibitor, and 37.30 g of PGMEA were mixed to produce a resin composition for a light-shielding barrier.

Example 6 Low refractive index layer forming material

5.350 g of the polysiloxane solution (LS-1) containing silica particles obtained by Synthesis Example 7, 1.170 g of ethylene glycol mono-t-butyl ether, and 3.48 g of DAA were mixed, and then filtered through a 0.45 μm syringe filter to prepare a low-refractive-index layer-forming material.

Preparation Example 7 Yellow organic protective layer forming material (YL-1)

A slurry was prepared by mixing 150 g of C.I. Pigment Yellow 150, 75 g of a polymer dispersant (“BYK” (registered trademark)-6919 (trade name) manufactured by Big Chemie (hereinafter referred to as “BYK-6919”)), 100 g of a binder resin (“Adeka Acruz” (registered trademark) WR301 (trade name) manufactured by ADEKA Co., Ltd.), and 675 g of PGMEA. The beaker containing the slurry was connected to a dynomill with a tube, and zirconia beads having a diameter of 0.5 mm were used as media, and dispersion treatment was performed at a speed of 14 m/s for 8 hours, to prepare a Pigment Yellow 150 dispersion (YD-1).

3.09 g of Pigment Yellow 150 dispersion (YD-1), 23.54 g of a polysiloxane (PSL-1) solution as a resin, 6.02 g of DPHA as a photopolymerizable compound, 6.02 g of an organometallic compound solution (OM-2) prepared using silver neodecanoate as an organometallic compound, 0.20 g of OXE-02 as a photopolymerization initiator, 0.40 g of IC-819, 0.060 g of IRGANOX (registered trademark) 1010, and 0.050 g of a 10 wt% diluted solution of BYK-352 in PGMEA (equivalent to a concentration of 500 ppm) were dissolved in 61.15 g of PGMEA solvent, and the mixture was stirred. The obtained mixture was filtered through a 5.0 μm filter, and a yellow organic protective layer forming material (YL-1) was obtained.

Preparation Example 8 Organic Silver Compound (APAG-1)

As a (meth)acrylic polymer solution, 5.0 g of a 30 wt% PGMEA solution of SPCR-10P ((trade name), manufactured by Showa Denko Co., Ltd.) was dissolved in 5.0 g of acetone, 0.0555 g of diethanolamine (1.5 molar equivalents with respect to (meth)acrylic polymer) was added dropwise, and the mixture was stirred at room temperature for 1 hour to generate an amine salt of the (meth)acrylic polymer solution. Next, 0.0287 g of silver (I) nitrate was added to the solution, and the mixture was stirred at room temperature for 1 hour, resulting in precipitation. After filtration through a 5.0 ㎛ filter, PGMEA was added so that the solid content became 20%, and an organic silver compound (APAG-1) was obtained.

Examples 30 to 52, Examples 54 to 59, Comparative Examples 4 to 6

A 10 cm × 10 cm alkali-free glass substrate (AGC Techno Glass Co., Ltd., thickness 0.7 mm) was used as a substrate. The resin compositions for the barrier ribs shown in Tables 2 to 5 were spin-coated thereon, and dried at a temperature of 100°C for 3 minutes using a hot plate (trade name SCW-636, Dainippon Screen Seizo Co., Ltd.) to produce a dry film. The produced dry film was exposed at an exposure dose of 300 mJ/cm2 (g, h, i lines) through a photomask using a parallel light mask aligner (trade name PLA-501F, Canon Co., Ltd.) with an ultra-high pressure mercury lamp as a light source. After that, using an automatic developing device ("AD-2000 (trade name)" manufactured by Takizawa Sangyo Co., Ltd.), shower developing was performed for 100 seconds using a 0.045 wt% potassium hydroxide aqueous solution, followed by rinsing with water for 30 seconds. In addition, using an oven (trade name IHPS-222, manufactured by Espec Co., Ltd.), heating was performed at 230°C in air for 30 minutes, and barrier walls having a height of 10 μm and a width of 20 μm were formed on a glass substrate in a lattice pattern with a pitch of 80 μm for the short side and 280 μm for the long side.

In a nitrogen atmosphere, a color conversion luminescent material composition shown in Tables 3 to 5 was applied to the area partitioned by the partition walls of the obtained substrate using an inkjet method, dried at 100° C. for 30 minutes, and pixels having a thickness of 5.0 μm were formed, thereby obtaining a substrate having the partition walls formed having the configuration shown in Fig. 2.

Example 53

A 10 cm × 10 cm alkali-free glass substrate (AGC Techno Glass Co., Ltd., thickness 0.7 mm) was used as a substrate. A resin composition for a partition wall (P-23) was spin-coated thereon, and dried at a temperature of 100°C for 3 minutes using a hot plate (trade name SCW-636, Dainippon Screen Seijo Co., Ltd.) to produce a dry film. The produced dry film was exposed at an exposure dose of 300 mJ/cm2 (g, h, i lines) through a photomask using a parallel light mask aligner (trade name PLA-501F, Canon Co., Ltd.) with an ultra-high pressure mercury lamp as a light source. After that, using an automatic developing device ("AD-2000 (trade name)" manufactured by Takizawa Sangyo Co., Ltd.), shower development was performed for 90 seconds with a 2.38 wt% tetramethylammonium hydroxide aqueous solution, and then rinsing with water for 30 seconds. After that, in the same manner as before, exposure was performed with an exposure dose of 500 mJ/cm2 (g, h, i lines) without passing through a photomask, and bleaching was performed. In addition, using an oven (trade name IHPS-222, manufactured by Espec Co., Ltd.), heating was performed at 230°C in air for 30 minutes, and barrier ribs having a height of 10 µm and a width of 20 µm were formed on a glass substrate in a lattice pattern with a pitch of 80 µm for the short side and 280 µm for the long side.

A color conversion luminescent material composition (CL-2) was applied to the area partitioned by the partition walls of the obtained substrate using an inkjet method under a nitrogen atmosphere, dried at 100°C for 30 minutes, and pixels having a thickness of 5.0 μm were formed, thereby obtaining a substrate having the partition walls formed as shown in Fig. 2.

Example 60

A 10 cm × 10 cm alkali-free glass substrate (AGC Techno Glass Co., Ltd., thickness 0.7 mm) was used as a substrate. The light-shielding barrier rib forming material obtained by Preparation Example 5 was spin-coated thereon, and dried at 90°C for 2 minutes using a hot plate (trade name SCW-636, Dainippon Screen Seizo Co., Ltd.) to produce a dry film. The produced dry film was exposed at an exposure dose of 40 mJ/cm2 (g, h, i lines) through a photomask using a parallel light mask aligner (trade name PLA-501F, Canon Co., Ltd.) with an ultra-high pressure mercury lamp as a light source. Thereafter, using an automatic developing device ("AD-2000 (trade name)" manufactured by Takizawa Sangyo Co., Ltd.), development was performed for 50 seconds with a 0.3 wt% tetramethylammonium aqueous solution, and then rinsed with water for 30 seconds. In addition, using an oven (trade name IHPS-222, manufactured by Espec Co., Ltd.), heating was performed in air at a temperature of 230°C for 30 minutes, and a substrate was obtained on which light-shielding barriers were formed in a lattice pattern with a pitch of 40 μm for the short side and 280 μm for the long side, with a height of 2.0 μm, a width of 20 μm, and an OD value of 2.0 per 1.0 μm of thickness on a glass substrate.

Thereafter, by the same method as in Example 32, a substrate having barrier walls formed in a lattice pattern, such as barrier walls having a height of 10 µm and a width of 20 µm and a pitch of 40 µm for the short side and 280 µm for the long side, was obtained. The color conversion luminescent material composition (CL-2) obtained by Preparation Example 2 was applied to the region partitioned by the barrier walls of the obtained substrate having barrier walls using an inkjet method under a nitrogen atmosphere, dried at 100° C. for 30 minutes, and pixels having a thickness of 5.0 µm were formed, thereby obtaining a substrate having barrier walls having a configuration shown in Fig. 3.

Example 61

By the same method as Example 32, the color filter-forming material (CF-1) obtained by Preparation Example 4 was applied to the area partitioned by the partition walls of the substrate before pixel formation so that the film thickness after curing became 2.5 µm, and vacuum-dried. Exposure was performed at an exposure dose of 40 mJ/cm2 (g, h, i lines) through a photomask designed to expose the area of the opening of the substrate where the partition walls were formed. After development was performed for 50 seconds with a 0.3 wt% tetramethylammonium aqueous solution, heat curing was performed at 230°C for 30 minutes, and a color filter layer having a height of 2.5 µm, a short side of 40 µm, and a long side of 280 µm was formed in the area partitioned by the partition walls. Thereafter, a color conversion luminescent material composition (CL-2) obtained by Preparation Example 2 was applied onto a color filter using an inkjet method under a nitrogen atmosphere, dried at 100°C for 30 minutes, and pixels having a thickness of 5.0 μm were formed, thereby obtaining a substrate having a partition wall having the configuration shown in Fig. 4.

Example 62

A 10 cm × 10 cm alkali-free glass substrate (AGC Techno Glass Co., Ltd., thickness 0.7 mm) was used as a substrate. The light-shielding barrier rib forming material obtained by Preparation Example 5 was spin-coated thereon, and dried at 90°C for 2 minutes using a hot plate (trade name SCW-636, Dainippon Screen Seizo Co., Ltd.) to produce a dry film. The produced dry film was exposed at an exposure dose of 40 mJ/cm2 (g, h, i lines) through a photomask using a parallel light mask aligner (trade name PLA-501F, Canon Co., Ltd.) with an ultra-high pressure mercury lamp as a light source. Thereafter, development was performed for 50 seconds with a 0.3 wt% tetramethylammonium aqueous solution using an automatic developing device ("AD-2000 (trade name)" manufactured by Takizawa Sangyo Co., Ltd.), and then rinsing was performed with water for 30 seconds. In addition, an oven (trade name IHPS-222, manufactured by Espec Co., Ltd.) was used, and heating was performed in air at a temperature of 230°C for 30 minutes, to obtain a substrate on which light-shielding barriers were formed in a lattice pattern with a pitch of 40 μm for the short side and 280 μm for the long side, with a height of 2.0 μm, a width of 20 μm, and an OD value of 2.0 per 1.0 μm of thickness.

Thereafter, the color filter forming material (CF-1) obtained by Preparation Example 4 was applied to the area partitioned by the shading partition so that the film thickness after curing would be 2.5 ㎛, and vacuum dried. Exposure was performed at an exposure dose of 40 mJ/cm2 (g, h, i lines) through a photomask designed to expose the area of the opening of the substrate where the partitions were formed. After development was performed for 50 seconds with a 0.3 wt% tetramethylammonium aqueous solution, heat curing was performed at 230°C for 30 minutes, and a color filter layer having a height of 2.5 ㎛, a short side of 40 ㎛, and a long side of 280 ㎛ was formed in the area partitioned by the partitions.

Thereafter, the low-refractive-index layer-forming material obtained by Preparation Example 6 was spin-coated, and dried at 90°C for 2 minutes using a hot plate (trade name SCW-636, manufactured by Dainippon Screen Seizo Co., Ltd.) to produce a dry film. In addition, the film was heated in the air at 90°C for 30 minutes using an oven (trade name IHPS-222, manufactured by Espec Co., Ltd.) to form a low-refractive-index layer having a height of 1.0 μm and a refractive index of 1.25.

In addition, a silicon nitride film with a thickness of 300 nm corresponding to an inorganic protective layer (I) with a height of 50 to 1,000 nm was formed on the low refractive index layer using a plasma CVD device (PD-220NL, manufactured by Samuko Corporation).

On these, a substrate having partitions formed in a lattice pattern, such as light-shielding partitions with a pitch of 40 µm for the short side and 280 µm for the long side, with a height of 10 µm and a width of 20 µm, was obtained in the same manner as in Example 32. The color conversion luminescent material composition (CL-2) obtained by Preparation Example 2 was applied to the region partitioned by the partitions of the obtained substrate having the partitions formed thereon using an inkjet method under a nitrogen atmosphere, and dried at 100°C for 30 minutes to form pixels with a thickness of 5.0 µm, thereby obtaining a substrate having partitions formed thereon having a configuration shown in Fig. 9.

Example 63

By using a plasma CVD device (PD-220NL, manufactured by Samuko Corporation), a silicon nitride film having a thickness of 300 nm corresponding to an inorganic protective layer (III) having a thickness of 50 to 1,000 nm was formed on the color filter of a substrate on which a color filter layer having a thickness of 2.5 μm, a short side of 40 μm, and a long side of 280 μm was formed, obtained by the same method as in Example 61, before pixel formation, and the film was formed. Furthermore, in a nitrogen atmosphere, using an inkjet method, a color conversion luminescent material composition (CL-2) obtained by Preparation Example 2 was applied onto the inorganic protective layer (III), and dried at 100° C. for 30 minutes, and a pixel having a thickness of 5.0 μm was formed, thereby obtaining a substrate on which a barrier wall having the configuration shown in Fig. 11 was formed.

Example 64

The yellow organic protective layer-forming material (YL-1) obtained by Preparation Example 7 was applied onto the color filter of the substrate on which the partition walls were formed before the pixel formation, on which a color filter layer having a thickness of 2.5 µm, a short side of 40 µm, and a long side of 280 µm was formed by the same method as in Example 61, and the coating was vacuum dried. Exposure was performed at an exposure dose of 300 mJ/cm2 (g, h, i lines) through a photomask designed to expose the area of the opening of the substrate on which the partition walls were formed. After development was performed for 50 seconds with a 0.3 wt% tetramethylammonium aqueous solution, heat curing was performed at 230°C for 30 minutes, and a yellow organic protective layer having a thickness of 1.0 µm, a short side of 40 µm, and a long side of 280 µm was formed. In addition, a color conversion luminescent material composition (CL-2) obtained by Preparation Example 2 was applied using an inkjet method under a nitrogen atmosphere on a yellow organic protective layer, dried at 100° C. for 30 minutes, and pixels having a thickness of 5.0 μm were formed, thereby obtaining a substrate having a partition wall having a configuration shown in Fig. 11.

The compositions of each example and comparative example are shown in Tables 3 to 5.

[Table 3]

[Table 4]

[Table 5]

The evaluation methods for each example and comparative example are shown below.

<Refractive index of low refractive index layer>

In each example, the low-refractive-index layer-forming material used was applied onto a silicon wafer by a spinner, and dried at a temperature of 90°C for 2 minutes using a hot plate (product name: SCW-636, manufactured by Dainippon Screen Seizo Co., Ltd.). Thereafter, the material was heated in air at 90°C for 30 minutes using an oven (IHPS-222; manufactured by ESPEC Co., Ltd.), and a cured film was produced. Using a prism coupler (PC-2000 (manufactured by Metricon Co., Ltd.)), light having a wavelength of 550 nm was irradiated perpendicular to the surface of the cured film under atmospheric pressure and conditions of 20°C, and the refractive index was measured and rounded off to the third decimal place.

<Crack resistance>

In each example and comparative example, the resin composition for forming the partition wall used was spin-coated so that the film thickness after heating was 10 µm, 15 µm, 20 µm, and 25 µm, respectively. Regarding the subsequent steps of the resin composition for forming the partition wall used in Examples 36 to 60, Examples 62 to 71, and Comparative Examples 5 to 8, except that the entire composition was exposed without passing through a photomask during exposure, processing was performed under the same conditions as in each example and comparative example, and a solid film was produced on a glass substrate. Regarding the subsequent steps of the resin composition for forming the partition wall used in Example 61, except that bleaching was performed after development without exposure, processing was performed under the same conditions as in Example 62, and a solid film was produced on a glass substrate. The obtained solid film was used as a model of the partition wall of the substrate having the partition wall formed obtained in each example and comparative example, and the glass substrate having the solid film was visually observed to evaluate the presence or absence of cracks in the solid film. If even one crack was confirmed, it was judged that there was no crack resistance for that film thickness. For example, if there were no cracks at a film thickness of 15 ㎛ and there were cracks at a film thickness of 20 ㎛, the crack resistance film thickness was judged as "≥15 ㎛". In addition, the crack resistance film thickness when there were no cracks at 25 ㎛ was judged as "≥25 ㎛", and the crack resistance film thickness when there were cracks at 10 ㎛ was judged as "<10 ㎛", respectively, and these were considered crack resistance.

<Resolution>

Using a spin coater (trade name 1H-360S, manufactured by Mikasa Co., Ltd.), the resin composition for the partition wall used in each example and comparative example was spin-coated on a 10 cm × 10 cm non-alkali glass substrate so that the film thickness after heating became 10 µm, and using a hot plate (trade name SCW-636, manufactured by Dainippon Screen Seizo Co., Ltd.), it was dried at a temperature of 100°C for 3 minutes to produce a dry film with a film thickness of 10 µm.

The fabricated dry film was exposed to light at a dose of 300 mJ/cm2 (g, h, i lines) with a gap of 100 μm through masks having line and space patterns with widths of 100 μm, 80 μm, 60 μm, 50 μm, 40 μm, 30 μm, and 20 μm using a parallel light mask aligner (product name: PLA-501F, manufactured by Canon Co., Ltd.) using an ultra-high pressure mercury lamp as a light source. Thereafter, the film was shower developed using a 0.045 wt% potassium hydroxide aqueous solution for 100 seconds, and then rinsed with water for 30 seconds.

Using a microscope adjusted to 100x magnification, the pattern after development was magnified and observed, and the narrowest line width among the patterns in which no residue was observed in the unexposed area was set as the resolution. However, if residue was also found in the unexposed area near the pattern with a width of 100 μm, it was set as “> 100 μm.”

<Reflectivity>

In Examples 30 to 52, Examples 54 to 59, and Comparative Examples 4 to 6, the resin compositions for forming partition walls were processed under the same conditions as in each Example and Comparative Example, except that the entire composition was exposed without passing through a photomask during exposure, and a solid film having a height of 10 μm was produced on a glass substrate. In Example 53, the resin compositions for forming partition walls were processed under the same conditions as in Example 53, except that bleaching was performed after development without exposure, and a solid film having a height of 10 μm was produced on a glass substrate. For the glass substrate having the obtained solid film, the reflectance at wavelengths of 450 nm, 550 nm, and 630 nm was measured from the solid film side in SCI mode using a spectrophotometer (trade name: CM-2600d, manufactured by Konica Minolta Co., Ltd.). However, when cracks or wrinkles occurred in the solid film, the reflectance was not measured because an accurate value could not be obtained due to cracks or the like.

<OD value>

As a model of the partition wall of the substrate on which the partition walls were formed obtained by each example and comparative example, a solid film having a height of 10 μm was produced on a glass substrate in the same manner as in the evaluation of reflectivity. For the glass substrate having the obtained solid film, the intensities of incident light and transmitted light were measured using an optical densitometer (U-4100 manufactured by Hitachi High-Tech Science), and the OD values at wavelengths of 450 nm, 550 nm, and 630 nm were calculated by the above-described equation (1). In addition, regarding the OD values, the OD values of the solid film before the heating process and after the heating process were each measured, and the differences thereof were included and shown in Tables 6 to 8.

Also, for Examples 60 and 62, as a model of the light-shielding partition (A-2), a solid film was similarly produced on a glass substrate. For the glass substrate having the obtained solid film, the intensities of incident light and transmitted light were measured using an optical densitometer (U-4100 manufactured by Hitachi High-Tech Science), and calculated by the above-described formula (1).

<Weather resistance>

As a model of the partition walls of the substrates on which the partition walls were formed obtained by each of the examples and comparative examples, a solid film having a height of 10 μm was produced on a glass substrate in the same manner as in the evaluation of reflectivity. For the glass substrates having the obtained solid films, the chromaticity (L* value, a*, and b* values) was measured from the solid film side in SCI mode using a spectrophotometer (trade name CM-2600d, manufactured by Konica Minolta Co., Ltd.). Thereafter, each glass substrate having a solid film was set in a table-top xenon accelerated weathering tester (trade name Q-SUNXe-1, manufactured by Q-Lab), and a weathering test was performed for 100 h under the conditions of light having a wavelength of 340 nm, an irradiance of 0.42 W/㎡, and a chamber temperature of 45°C. After that, the chromaticity (L* value, a* and b* values) of the glass substrate having each solid film was measured again from the solid film side in SCI mode, and the change in the reflection chromaticity coordinate ΔE was obtained by the following equation (2).

ΔE={(ΔL*) ² +(Δa*) ² +(Δb*) ² } ^1/2 ···(2)

For the calculated ΔE, the weather resistance was evaluated according to the following criteria. A smaller ΔE indicates higher weather resistance.

A:Δe<3.0

B:3.0≤ΔE≤6.0

C:6.0≤ΔE

<Taper angle>

In each example and comparative example, an arbitrary cross-section of the substrate on which the partition walls were formed before pixel formation was observed using an optical microscope (FE-SEM (S-4800); manufactured by Hitachi, Ltd.) at an acceleration voltage of 3.0 kV, and the taper angle was measured.

<Surface contact angle>

As a model of the partition wall in the substrate on which the partition walls were formed obtained by each example and comparative example, a solid film having a height of 10 μm was produced on a glass substrate in the same manner as in the evaluation of reflectivity. For the surface of the obtained solid film, the surface contact angle was measured at 25°C in the air using DM-700 (manufactured by Kyowa Keimen Kagaku Co., Ltd.), a micro syringe: a Teflon (registered trademark) coated needle 22G for contact angle measurement (manufactured by Kyowa Keimen Kagaku Co., Ltd.), in accordance with the wettability test method for a substrate glass surface specified in JIS R3257 (establishment date = 1999/04/20). However, propylene glycol monomethyl ether acetate was used instead of water, and the contact angle between the surface of the solid film and propylene glycol monomethyl ether acetate was measured.

<Inkjet application>

In each of the examples and comparative examples, on the substrates in which the partition walls were formed before forming the pixels, inkjet coating was performed on the pixel portions surrounded by the lattice-shaped partition walls using PGMEA as ink using an inkjet coating device (InkjetLabo, manufactured by Cluster Technology Co., Ltd.). 160 pL of PGMEA was applied per lattice-shaped pattern, and the presence or absence of agglomerates (a phenomenon in which ink goes over the partition walls and mixes into the adjacent pixel portion) was observed, and the inkjet coating properties were evaluated according to the following criteria. The fewer the agglomerates, the higher the liquid repellency, indicating excellent inkjet coating properties.

A: The ink did not overflow from within the pixels.

B: In some cases, ink overflowed from within the pixels onto the upper surface of the barrier.

C: In the front, ink overflowed from within the pixels onto the upper surface of the partition.

<height>

For each layer of the substrate on which the partition walls were formed according to each example and comparative example, the film thickness before and after each layer was formed was measured using a surfcom stylus-type film thickness measuring device, and the difference was calculated to measure the height.

In addition, for Examples 62 to 63, a cross-section polisher or the like was used to expose a cross-section perpendicular to the substrate, and the height of each inorganic protective layer was measured by magnifying and observing the cross-section using a scanning electron microscope or a transmission electron microscope.

<OD value change after low temperature heating>

In each example and comparative example, using the resin composition for forming a partition wall, a solid film having a height of 10 μm was produced on a glass substrate in the same manner as in the evaluation of the OD value described above, except that the final heating condition was changed to 100° C. in air for 60 minutes. For the obtained solid film, in the same manner as in the evaluation of the OD value described above, the intensities of incident light and transmitted light were measured using an optical densitometer (U-4100 manufactured by Hitachi High-Tech Science), and the OD value was calculated. The OD values at a wavelength of 450 nm of the solid film before the heating process and after the heating process were each measured, and the difference between them was calculated to evaluate the change in the OD value during low-temperature heating according to the following criteria.

A:ΔOD value>1.5

B:0.5≤ΔOD value≤1.5

C:ΔOD value<0.5

<Low temperature curing>

In each example and comparative example, the resin composition for forming a partition wall was used, and the partition wall was formed in the same manner except that the final heating condition was changed to 100° C. in air for 60 minutes. For the obtained substrate on which the partition wall was formed, 1,6-hexanediol diacrylate was applied as ink by inkjet to the inside of the partition wall in the same manner as in the evaluation of the inkjet coating property described above. Thereafter, the inside of the pixel was observed after 1 hour and after 3 hours, and the low-temperature curing property of the partition wall was evaluated according to the following criteria. The less the seepage into the adjacent pixel, the better the low-temperature curing property of the partition wall.

A: Even after 3 hours from inkjet application, no ink bleeding into adjacent pixels is observed.

B: No ink bleed into adjacent pixels was observed after 1 hour from inkjet application, but bleed was observed after 3 hours.

C: Immediately after inkjet application, ink bleeds into adjacent pixels.

<Preservation stability>

For the resin compositions for forming partition walls used in each example and comparative example, the preservation stability was evaluated by the following criteria by conducting an evaluation similar to the evaluation of resolution described above immediately after preparation, after 3 days of storage at 25°C from preparation, and after 7 days of storage.

A: In the evaluations conducted immediately after preparation, after 3 days of storage at 25℃, and after 7 days of storage at 25℃, there was no change in the processable resolution.

B: In the evaluations immediately after preparation and after 3 days of storage at 25°C, there was no change in the processable resolution, but in the evaluations after 7 days of storage at 25°C, the processable resolution deteriorated.

C: Compared to immediately after preparation, the processable resolution was worse in the evaluation after 3 days of storage at 25℃.

<Brightness>

A surface light-emitting device equipped with a commercially available LED backlight (peak wavelength 465 nm) was used as a light source, and a substrate in which the partition walls obtained by each example and comparative example were formed so that the pixel portion was on the light source side was installed. A current of 30 mA was passed through the surface light-emitting device to light the LED element, and the luminance (unit: cd/㎡) based on the CIE1931 standard was measured using a spectroradiometer (CS-1000, manufactured by Konica Minolta), which was used as the initial luminance. However, the luminance was evaluated based on a relative value that set the initial luminance of Example 69 as 100 as the standard.

In addition, after lighting the LED element for 48 hours at room temperature (23°C), the luminance was similarly measured and the change in luminance over time was evaluated. However, the evaluation of luminance was performed by a relative value with the initial luminance of Example 69 set as the standard 100.

<Color characteristics>

The substrates on which the partition walls were formed according to each example and comparative example were installed on a commercially available white reflector so that the pixels were arranged on the white reflector side. Using a spectrophotometer (CM-2600d, manufactured by Konica Minolta, measuring diameter φ8 mm), light was irradiated from the lower substrate side of the substrate on which the partition walls were formed, and the spectrum of incident regular reflected light was measured.

The color gamut in which the color standard BT. 2020, which can almost reproduce the colors of the natural world, is determined is stipulated based on the three primary colors of red, green, and blue on the spectrum locus shown in the chromaticity diagram, and the wavelengths of red, green, and blue correspond to 630 nm, 532 nm, and 467 nm, respectively. The reflection indices (R) of the three wavelengths of 470 nm, 530 nm, and 630 nm of the obtained reflection spectrum were evaluated according to the following criteria for the emission color of the pixel.

A:R ₅₃₀ /(R ₆₃₀ +R ₅₃₀ +R ₄₇₀ )≥0.55

B:R ₅₃₀ /(R ₆₃₀ +R ₅₃₀ +R ₄₇₀ )<0.55.

<Display characteristics>

The display characteristics of a display device manufactured by combining a substrate formed with a partition wall and an organic EL element obtained by each example and comparative example were evaluated based on the following criteria.

A: The green display is very vivid and the display is sharp and has excellent contrast.

B: The display device appears to be slightly unnatural in color, but there are no problems.

<Mixed Colors>

In each of the examples and comparative examples, a color conversion luminescent material composition (CL-2) was applied to a part of a pixel portion surrounded by the lattice-shaped partition walls on a substrate formed before forming pixels, using an inkjet method, and dried at 100° C. for 30 minutes, to form a pixel having a thickness of 5.0 μm. Thereafter, a color conversion luminescent material composition (CL-3) was applied to an area adjacent to the area where the color conversion luminescent material composition (CL-2) was applied, among the pixel portions surrounded by the lattice-shaped partition walls, using an inkjet method, and dried at 100° C. for 30 minutes, to form a pixel having a thickness of 5.0 μm.

Meanwhile, a blue organic EL cell having the same width as the pixel portion surrounded by lattice-like partitions was manufactured, and the substrate on which the aforementioned partitions were formed and the blue organic EL cell were joined facing each other using a sealant to obtain a display device having the configuration shown in Fig. 15.

In Fig. 15, only the blue organic EL cell (11) bonded directly below the pixel (3) (CL-2) formed of the color conversion light-emitting material composition (CL-2) was turned on, and the absorption intensity A (630 nm) at a wavelength of 630 nm was measured for the pixel (3) (CL-3) formed of the color conversion light-emitting material composition (CL-3) using a microscopic spectrophotometer LVmicro-V (manufactured by Lambda Vision Co., Ltd.). A smaller value of the absorption intensity A (630 nm) indicates that it is difficult to cause color mixing. Color mixing was determined by the following judgment criteria.

A:A(630nm)<0.01

B:0.01≤A(630nm)≤0.5

C:0.5<A(630nm).

The evaluation results of each example and comparative example are shown in Tables 6 to 8.

[Table 6]

[Table 7]

[Table 8]

1. Not a substrate
2 bulkheads
3 pixels
3(CL-2) Pixel formed with color conversion luminescent material composition (CL-2)
3(CL-3) Pixel formed with color conversion luminescent material composition (CL-3)
4-shade bulkhead
5 color filters
6 low refractive index layer
7 Weapon Protection Layer (I)
8 Weapon Protection Layer (II)
9. Weapon protective layer (III) and/or yellow organic protective layer
10 Weapon protection layer (IV) and/or yellow organic protection layer
11 Light-emitting light sources selected from organic EL cells, mini LED cells and micro LED cells
12 Blue Organic EL Cells
Thickness of H bulkhead
Width of L bulkhead
θ taper angle

Claims (17)

Containing a resin, a photopolymerization initiator or a quinonediazide compound, a white pigment and/or a light-blocking pigment, an organic silver compound, and a reducing agent,
The above white pigment is surface-treated with at least one selected from SiO ₂ , Al ₂ O ₃ and ZrO ₂ .
A resin composition wherein the above-mentioned light-shielding pigment contains at least one of a red pigment, a blue pigment, a black pigment, a green pigment, and a yellow pigment. Containing a resin, a photopolymerization initiator or a quinonediazide compound, a white pigment and/or a light-blocking pigment, an organic silver compound, and a reducing agent,
A resin composition wherein the reducing agent is a compound containing two or more phenolic hydroxyl groups or a compound containing an enediol group in the molecule. In paragraph 1,
A resin composition wherein the organic silver compound is a compound represented by the following general formula (1).

(In general formula (1), R ₁ represents hydrogen or an organic group having 1 to 30 carbon atoms.) In paragraph 1,
A resin composition wherein the organic silver compound is a polymer compound having a structure represented by at least the following general formula (2).

(In general formula (2), R ² and R ³ each independently represent hydrogen or an organic group having 1 to 30 carbon atoms, and a is an integer greater than or equal to 1.) In the second paragraph,
A resin composition in which the reducing agent is a hydroquinone compound represented by the following general formula (3).

(In general formula (3), R ₄ , R ₅ , R ₆ , and R ₇ each independently represent hydrogen, a hydroxy group, or an organic group having 1 to 30 carbon atoms.) In paragraph 1,
A resin composition wherein the above resin is a polysiloxane having a styryl group. In paragraph 1,
A resin composition further containing a lyophilic compound having a photoradical polymerizable group. A light shielding film formed by curing the resin composition described in any one of claims 1 to 7. A substrate having a partition wall formed in a pattern (A-1) by a resin composition according to any one of claims 1 to 7 on a substrate, wherein the substrate having a partition wall having a reflectivity of 10% to 60% per 10 ㎛ thickness at a wavelength of 450 nm and an OD value of 1.5 to 5.0 per 10 ㎛ thickness at a wavelength of 450 nm is formed. A substrate having a partition wall formed on a substrate having a pattern formed on (A-1), wherein the pattern formed partition wall contains a resin, a white pigment and/or a light-blocking pigment, silver oxide and/or silver particles, and a quinone compound. In Article 9,
A substrate having a partition formed with the above (A-1) pattern, wherein the partition contains a resin, a white pigment, silver oxide and/or silver particles. In Article 9,
A substrate having a partition formed thereon, wherein the partition formed in the above (A-1) pattern further contains a liquid-repellent compound, and the content of the liquid-repellent compound in the partition formed in the (A-1) pattern is 0.01 wt% to 10 wt%. In Article 9,
A substrate having a barrier rib formed thereon, further comprising a patterned light-shielding barrier rib having an OD value of 0.5 or more per 1.0 ㎛ of thickness (A-2) between the above substrate and the patterned barrier rib (A-1). In Article 9,
A substrate having a partition wall formed thereon, further comprising a pixel layer containing a (B) color conversion luminescent material arranged and partitioned by the partition walls formed with the above (A-1) pattern. In Article 14,
A substrate having a partition wall formed thereon, wherein the color conversion luminescent material contains a phosphor selected from quantum dots and pyrromethene derivatives. In Article 14,
A substrate having a barrier wall formed between the above substrate and the pixel layer containing the (B) color conversion luminescent material, which further has a color filter with a thickness of 1 to 5 μm. A display device having a substrate having a partition wall formed thereon as described in claim 9, and a light-emitting light source selected from a liquid crystal cell, an organic EL cell, a mini LED cell, and a micro LED cell.