TWI801284B - 顯示面板 - Google Patents
顯示面板 Download PDFInfo
- Publication number
- TWI801284B TWI801284B TW111125762A TW111125762A TWI801284B TW I801284 B TWI801284 B TW I801284B TW 111125762 A TW111125762 A TW 111125762A TW 111125762 A TW111125762 A TW 111125762A TW I801284 B TWI801284 B TW I801284B
- Authority
- TW
- Taiwan
- Prior art keywords
- display panel
- panel
- display
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
- H10D86/443—Interconnections, e.g. scanning lines adapted for preventing breakage, peeling or short circuiting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US18/172,592 US12532542B2 (en) | 2022-02-25 | 2023-02-22 | Display panel and display device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202263313744P | 2022-02-25 | 2022-02-25 | |
| US63/313,744 | 2022-02-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI801284B true TWI801284B (zh) | 2023-05-01 |
| TW202334925A TW202334925A (zh) | 2023-09-01 |
Family
ID=87424312
Family Applications (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111124607A TWI843136B (zh) | 2022-02-25 | 2022-06-30 | 顯示面板與其製作方法 |
| TW111124813A TWI840860B (zh) | 2022-02-25 | 2022-07-01 | 基板結構 |
| TW111125762A TWI801284B (zh) | 2022-02-25 | 2022-07-08 | 顯示面板 |
| TW111128197A TWI818646B (zh) | 2022-02-25 | 2022-07-27 | 顯示面板和其製造方法 |
| TW111128198A TWI835223B (zh) | 2022-02-25 | 2022-07-27 | 用於顯示裝置的電路板結構 |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111124607A TWI843136B (zh) | 2022-02-25 | 2022-06-30 | 顯示面板與其製作方法 |
| TW111124813A TWI840860B (zh) | 2022-02-25 | 2022-07-01 | 基板結構 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111128197A TWI818646B (zh) | 2022-02-25 | 2022-07-27 | 顯示面板和其製造方法 |
| TW111128198A TWI835223B (zh) | 2022-02-25 | 2022-07-27 | 用於顯示裝置的電路板結構 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US12532542B2 (zh) |
| TW (5) | TWI843136B (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12086941B2 (en) * | 2022-08-29 | 2024-09-10 | Streem, Llc | Surface partition with plane and line constraints |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101009309A (zh) * | 2006-01-23 | 2007-08-01 | 三星Sdi株式会社 | 有机发光显示装置及其制造方法 |
| US20190393202A1 (en) * | 2018-06-26 | 2019-12-26 | Boe Technology Group Co., Ltd. | Display substrate and fabrication method thereof, display panel and display device |
| CN110649042A (zh) * | 2019-09-30 | 2020-01-03 | 厦门天马微电子有限公司 | 显示面板和显示装置 |
| TW202101414A (zh) * | 2019-05-10 | 2021-01-01 | 日商日亞化學工業股份有限公司 | 圖像顯示裝置之製造方法及圖像顯示裝置 |
| CN113611724A (zh) * | 2020-05-04 | 2021-11-05 | 三星显示有限公司 | 显示装置 |
| US20210358963A1 (en) * | 2021-02-09 | 2021-11-18 | Hubei Yangtze Industrial Innovation Center of Advanced Display Co., Ltd. | Display panel and display device |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6507100B1 (en) * | 2000-06-28 | 2003-01-14 | Advanced Micro Devices, Inc. | Cu-balanced substrate |
| JP2004200265A (ja) * | 2002-12-17 | 2004-07-15 | Nikon Corp | プリント配線板 |
| JPWO2015102107A1 (ja) * | 2014-01-06 | 2017-03-23 | 株式会社村田製作所 | 積層配線基板およびこれを備える検査装置 |
| WO2015178059A1 (ja) * | 2014-05-22 | 2015-11-26 | シャープ株式会社 | 接続配線 |
| KR102003390B1 (ko) * | 2016-06-20 | 2019-07-24 | 삼성전자주식회사 | 팬-아웃 반도체 패키지 |
| CN206148473U (zh) | 2016-11-10 | 2017-05-03 | 上海天马微电子有限公司 | 一种柔性显示装置 |
| KR102410809B1 (ko) * | 2017-08-25 | 2022-06-20 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 반도체 소자 |
| KR102460550B1 (ko) * | 2017-12-04 | 2022-10-31 | 삼성디스플레이 주식회사 | 표시 패널 |
| TWI669816B (zh) * | 2018-04-18 | 2019-08-21 | 友達光電股份有限公司 | 拼接用顯示面板及其製造方法 |
| CN108899326A (zh) | 2018-06-28 | 2018-11-27 | 武汉华星光电技术有限公司 | 一种阵列基板及其制作方法、显示面板 |
| TWI662288B (zh) * | 2018-07-04 | 2019-06-11 | 友達光電股份有限公司 | 顯示面板及發光元件基板的檢測方法 |
| CN109119329A (zh) | 2018-07-16 | 2019-01-01 | 华天慧创科技（西安）有限公司 | 一种降低晶圆翘曲度的镀膜方法 |
| KR102621591B1 (ko) * | 2018-09-11 | 2024-01-08 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
| KR20210050106A (ko) * | 2019-10-28 | 2021-05-07 | 삼성전기주식회사 | 인쇄회로기판 |
| CN113437087A (zh) * | 2020-03-23 | 2021-09-24 | 京东方科技集团股份有限公司 | 显示基板、显示基板母板及其制作方法、显示装置 |
| KR102840732B1 (ko) * | 2020-06-03 | 2025-07-31 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
| TWI823332B (zh) * | 2020-08-24 | 2023-11-21 | 錼創顯示科技股份有限公司 | 拼接式微型發光二極體顯示面板 |
| WO2022141643A1 (zh) * | 2021-01-04 | 2022-07-07 | 京东方科技集团股份有限公司 | 显示面板及其制作方法和显示装置 |
| CN113380779A (zh) * | 2021-06-08 | 2021-09-10 | 京东方科技集团股份有限公司 | 驱动基板、发光装置及其制备方法 |
| CN114141810A (zh) | 2021-11-30 | 2022-03-04 | 深圳市华星光电半导体显示技术有限公司 | 显示基板的制备方法、显示面板 |
-
2022
- 2022-06-30 TW TW111124607A patent/TWI843136B/zh active
- 2022-07-01 TW TW111124813A patent/TWI840860B/zh active
- 2022-07-08 TW TW111125762A patent/TWI801284B/zh active
- 2022-07-27 TW TW111128197A patent/TWI818646B/zh active
- 2022-07-27 TW TW111128198A patent/TWI835223B/zh active
-
2023
- 2023-02-22 US US18/172,592 patent/US12532542B2/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101009309A (zh) * | 2006-01-23 | 2007-08-01 | 三星Sdi株式会社 | 有机发光显示装置及其制造方法 |
| US20190393202A1 (en) * | 2018-06-26 | 2019-12-26 | Boe Technology Group Co., Ltd. | Display substrate and fabrication method thereof, display panel and display device |
| TW202101414A (zh) * | 2019-05-10 | 2021-01-01 | 日商日亞化學工業股份有限公司 | 圖像顯示裝置之製造方法及圖像顯示裝置 |
| CN110649042A (zh) * | 2019-09-30 | 2020-01-03 | 厦门天马微电子有限公司 | 显示面板和显示装置 |
| CN113611724A (zh) * | 2020-05-04 | 2021-11-05 | 三星显示有限公司 | 显示装置 |
| US20210358963A1 (en) * | 2021-02-09 | 2021-11-18 | Hubei Yangtze Industrial Innovation Center of Advanced Display Co., Ltd. | Display panel and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI835223B (zh) | 2024-03-11 |
| TW202335326A (zh) | 2023-09-01 |
| TW202334928A (zh) | 2023-09-01 |
| TW202334925A (zh) | 2023-09-01 |
| US20230275100A1 (en) | 2023-08-31 |
| TWI818646B (zh) | 2023-10-11 |
| TWI840860B (zh) | 2024-05-01 |
| TW202335327A (zh) | 2023-09-01 |
| TWI843136B (zh) | 2024-05-21 |
| US12532542B2 (en) | 2026-01-20 |
| TW202334716A (zh) | 2023-09-01 |
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