TWI800003B - Chip peeling apparatus and chip pre-peeling device - Google Patents
Chip peeling apparatus and chip pre-peeling device Download PDFInfo
- Publication number
- TWI800003B TWI800003B TW110135220A TW110135220A TWI800003B TW I800003 B TWI800003 B TW I800003B TW 110135220 A TW110135220 A TW 110135220A TW 110135220 A TW110135220 A TW 110135220A TW I800003 B TWI800003 B TW I800003B
- Authority
- TW
- Taiwan
- Prior art keywords
- chip
- peeling
- peeling device
- peeling apparatus
- chip pre
- Prior art date
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110135220A TWI800003B (en) | 2021-09-23 | 2021-09-23 | Chip peeling apparatus and chip pre-peeling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110135220A TWI800003B (en) | 2021-09-23 | 2021-09-23 | Chip peeling apparatus and chip pre-peeling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202314895A TW202314895A (en) | 2023-04-01 |
| TWI800003B true TWI800003B (en) | 2023-04-21 |
Family
ID=86943417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110135220A TWI800003B (en) | 2021-09-23 | 2021-09-23 | Chip peeling apparatus and chip pre-peeling device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI800003B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2590571B2 (en) * | 1988-12-21 | 1997-03-12 | 富士電機株式会社 | Wafer holding mechanism of semiconductor wafer processing equipment |
| TW200524059A (en) * | 2004-01-05 | 2005-07-16 | Shibaura Mechatronics Corp | Apparatus for picking up semiconductor chips and method of picking up semiconductor chips |
| CN103258749A (en) * | 2012-02-15 | 2013-08-21 | 细美事有限公司 | Die ejecting method and unit, die pickup method and pickup device |
| TW201701388A (en) * | 2015-06-16 | 2017-01-01 | 日本先鋒公司 | Pickup device |
-
2021
- 2021-09-23 TW TW110135220A patent/TWI800003B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2590571B2 (en) * | 1988-12-21 | 1997-03-12 | 富士電機株式会社 | Wafer holding mechanism of semiconductor wafer processing equipment |
| TW200524059A (en) * | 2004-01-05 | 2005-07-16 | Shibaura Mechatronics Corp | Apparatus for picking up semiconductor chips and method of picking up semiconductor chips |
| CN103258749A (en) * | 2012-02-15 | 2013-08-21 | 细美事有限公司 | Die ejecting method and unit, die pickup method and pickup device |
| TW201701388A (en) * | 2015-06-16 | 2017-01-01 | 日本先鋒公司 | Pickup device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202314895A (en) | 2023-04-01 |
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