200524059 玖、發明說明： 【發明戶斤屬之技術領域3 技術領域 本發明係有關於一種將被貼著於黏著片上之半導體晶 5 片以吸嘴拾取之拾取裝置及拾取方法。 t先前技術3 技術背景 將半導體晶圓網目狀切割而形成之半導體晶片係被黏 貼於黏著片上，欲與基板銲接時，則會以吸嘴由上述黏著 10 片上一片片拾取該半導體晶片。 以吸嘴由黏著片上拾取半導體晶片時’在過去係如專 利文獻1 (日本特開2002-100644號公報）中所示，要一面 以支持體吸著保持黏著片的欲以喷嘴拾取之半導體晶片的 周緣部，同時以前端尖銳的頂出針由下面將該半導體晶片 15 頂起，一面使該半導體晶片與上述黏著片分離，一面以吸 嘴進行拾取。 【發明内容】 發明之揭示 發明欲解決之問題 20 但是，最近半導體晶片的厚度有薄至1〇〇μηΐ以下。以 頂出針的尖銳的前端頂起如此薄的半導體晶片時，前端所 接觸到的地方會有應力集中的現象。因此，半導體晶片有 因頂出針所帶來的應力而破損之情形。 為了防止因應力集中造成半導體晶片的破損，雖然可 200524059 以考慮減緩頂出針頂起半導體晶片時的速度，但是由於一 將頂出針的頂出速度減慢，拾起的速度也會變慢，而使生 產性降低，又，即使減緩頂出的速度，於半導體晶片的厚 度很薄時，也很難確實地防止半導體晶體不會損傷。 5 本發明之目的係提供一種可以讓半導體晶片不會破損 地由黏著片剝離的拾取裝置及拾取方法。 解決問題所採用的方法 本發明係一種半導體晶片之拾取裝置，該拾取裝置係 以吸嘴拾取被貼付於黏著片上之半導體晶片者，具備有： 10 支持體，係形成有用以吸著保持上述黏著片之欲以上述吸 嘴拾取之半導體晶片的周邊部份之吸引孔者；及剝離裝 置，係接觸於上述黏著片的欲以上述吸嘴拾取之半導體晶 片的下面側，且可由上述半導體晶片的端部朝中央部一面 水平移動一面上昇者。 15 本發明係一種半導體晶片之拾取裝置，該拾取裝置係 以吸嘴拾取被貼付於黏者片上之半導體晶片者’具備有· 支持體，係形成有用以吸著保持上述黏著片的欲以上述吸 嘴拾取之半導體晶片的周邊部份之吸引孔者；及剝離裝 置，係具有細長板狀的剝離元件者，該細長板狀的剝離元 20 件可上昇至上述黏著片的欲以上述吸嘴拾取之半導體晶片 的一端部的下面側後，與上述黏著片相接觸，然後由上述 半導體晶片的一端部朝另一端部移動，又，其係延伸於與 該移動方向相垂直的方向。 本發明係一種半導體晶片之拾取裝置，該拾取裝置係 200524059 以吸嘴拾取被貼付於黏著片上之半導體晶片者，具備有. 支持體’係形成有用以吸著保持上述黏著片的欲以上. 嘴拾取之半導體晶片的周邊部份之吸5丨孔者；及剥離= 置’係具有-棒狀的剝離元件者，該剝離元件可—面、 5上述黏著片的下面側，一面由該黏著片的欲以上述= 取之上述半導體晶片的周緣部朝中央呈螺旋狀的回轉，: 上述黏著片將上述半導體晶片剝離。 本發明係一種半導體晶片之拾取方法，該拾取方 以吸嘴拾取被貼付於黏著片上之半導體晶片者具備有 10用以吸著保持上述黏著片的欲以上述吸嘴拾取之半導體曰曰 片的周邊部份之步驟；用以藉著上述吸嘴吸著上述半= 晶片之步驟；及用以將上述黏著片的經貼著被上述吸嘴吸 住之半導體晶片的部份由半導體晶片的相對的兩端側朝中 央部剝離之步驟。 15 發明之效果 依本發明，由於以吸嘴由黏著片拾取半導體晶片時， 可不使半導體晶片破損地由黏著片上剝離，故可以把半導 體晶片輕易且確實地由黏著片上拾取。 【實施方式】 20發明之最佳實施形態 x下 面芩照圖面一面說明本發明之實施形態。 一第1圖至第5圖係顯示本發明之第丄實施形態。第工圖所 丁勺才口取衣置具備有支持單元10。此支持單元W設置於被 張貼於圖中未示的晶圓環的黏著片2的下面，可以圖中未示 200524059 的Z驅動源被驅動於Z方向，而於後述之支持體1的上面接觸 於黏著片2的位置與由黏著片2離開的位置之間移動。 5 10 15 於上述黏者片2的上面貼有由半導體晶圓網目狀分割 而成的複數的半導體晶片3。上述晶圓環可藉圖中未示的X 及Y驅動源被驅動於水平方向。藉此，貼於黏著片2的半導 體晶片3可相對於支持單元10定位於X及γ方向。又，取代 支持單元10，讓晶圓環能被驅動於Z方向亦可，只要晶圓環 與支持單元10能相對地被驅動於X、Y及Z方向即可。 於上述黏著片2的上方，即上述支持單元10的上方係設 有吸嘴4。此吸嘴4可以圖中未示的χ、丫及2驅動源被驅動 於X、Y及Z方向。又，宜使用音圈馬達等作為z驅動源，可 將吸嘴4的加壓重量控制於一定量。 回^述支持單元10具有支持體1。此支持體1如第2A、B 圖斤不為下端開放，上端形成矩形狀的開口部6的圓筒狀。 汗口 #6與作為拾取對象的半導體晶片3為相似形， /、面積叹定為與半導體晶片3大約相同。 述支持體1的内周面形成有一對相對向且沿著軸 ,〇申的、通長的長溝9，於此長溝9中可滑動地嵌合有支 釉8的兩端部。 此，支軸8可一面被導引於長溝9，於長溝 9的範圍内上下移動。 ;上述支轴8的中間部份可轉動地支持有-對搖動元 且八的中間部份，該-對搖動元件11係用以構成剝離元 j別呈<字狀地彎曲。又，該-對搖動元件11係相對於 支持體1的中心轴線，朝相反方向彎曲。 20 200524059 藉此’ 一對搖動元件11的上端側及下端側係以支轴8為 支點開放，下端側的基端部則接觸於後述的圓盤25的上 面。又，一對搖動元件11藉著使下端側如後所述地進 開放’可使上端側被驅動於關閉方向。 5 一對搖動元件11係藉著寬度比上述開口部6的寬声略 小，又以與預定拾取的半導體晶片3的一邊等長，或著比它 短一點點為佳的板狀部形成，它們的前端部如第3圖所示地 形成梳齒狀，即以複數的凹部12a與複數的凸部12b沿著寬 度方向形成凹凸狀。然後，一對搖動元件11的前端部緊閉 10 時，相對的凹部12a及凸部12b會嚙合。 如第3A、B圖所示，於上述支持體1的上面，同心地形 成有3個包圍上述開口部6的環狀溝14a〜14c。3個環狀溝 14a〜14c藉著沿著支持體1的徑方向形成的2個連通溝15相 連通。連通溝15與預定拾取的半導體晶片3的相對的二邊 15 (端部）平行，且位於該二邊外側的位置。 又’於支持體1的上面，進一步將連通溝15形成於半導 體晶片3的其他相對的二邊亦可。形成時同時與該二邊平行 且位於外側的位置。 於位於最内側的環狀溝14a中，有4個於周方向間隔90 20 度的吸引孔16a貫通厚度方向地被形成。進而，此環狀溝14a 的直徑比欲拾取的半導體晶體3的對角線長度大。於第二條 的環狀溝14b於周方向間隔180度形成有2個吸引孔16b。於 各環狀溝14a〜14c與連通溝15可以上述吸引孔16&、16b為中 介，如後所述地產生吸引力。又，於第3圖以外的圖，皆省 200524059 略了環狀溝14a〜14c、吸引孔16a、i6b的圖示。 如第2A、B圖所示，於上述支持體丨的下端開口處氣密 地肷合有圓柱狀的封閉元件21的一端部。於此封閉元件21 的中心部份穿設有貫通軸方向的插通部22。於此插通孔22 5設置有一可滑動的作為驅動元件的驅動軸23，該驅動軸23 藉著設置於插通孔22下端部的Ο形環24呈氣密地設置。 上述驅動軸23由上述封閉元件21的上端面突出的上部 一體設置有可變位的圓盤25。進而，於此圓盤25的上面的 中央部設有圓柱狀的卡止元件26。此卡止元件26突入以預 10定角度張開的一對的搖動元件11的基端部間，用以規制搖 動元件11的基端部與基端部之間被驅動於後述的第2彈簧 28而相互接近之移動。因此，即使一對的搖動元件^以支 軸8為支點，前端部打開至最大時，亦被限制於開口部6内。 如第2B圖所示，上述圓盤25與支軸8之間張設有第1彈 15簧27。此第1彈簧27把上述圓盤25彈性地連結於上述支軸 8。進而’於一對的搖動元件π之間，設有用以將支軸8上 方的前端部朝張開的方向賦予勢能的上述第2彈簧28。於 此，第2彈簧28的拉伸力設定成比第1彈簧27大。 第4A圖係顯示一對的搖動元件11的前端部位於未由支 20持體1的上面突出的位置的狀態，此狀態為待機狀態。於待 機狀態，支軸8的兩端部如第2B圖所示地位於比長溝9的上 端低預定距離的位置，同時，一對的搖動元件^的基端部 藉著第2彈簧28的勢能與卡止元件26相接觸，前端部呈開至 最大的狀態。 200524059 然後，將卡止元件26的寬度設定成於此狀態下，使一 對的搖動元件11的各前端部恰與預定拾取的半導體晶片3 的相對的兩端部或該兩端部稍微偏中間的部份相對。 由待機狀態驅動上述驅動軸23上昇時，搖動元件11會 5 一面保持第4A圖的狀態一面上昇。 隨著驅動軸23的上昇，支軸8的兩端部會沿著長溝9上 昇，上昇至預定位置時，則與該長溝9的上端接觸。上述支 軸8的兩端部一接觸長溝9的上端時，搖動元件11的上昇即 停止。此時，一對的搖動元件11的前端部如第4B圖所示， 10 由支持體1的上面突出一點點。此狀態為上昇狀態。於此上 昇狀態，一對的搖動元件11的前端部設定成由開口部6突出 例如0.5mm的預定尺寸。 驅動軸23由上昇狀態進一步被朝上昇方向驅動時，一 對的搖動元件11的基端部會因圓盤25而被朝打開的方向加 15 壓。因此，一對的搖動元件11的前端部會對抗第2彈簧28的 勢能而以支軸8為中心朝關閉起來的方向作圓弧運動。 驅動軸23—上昇至最高點時，如第4C圖所示，一對的 搖動元件11的前端部會呈相互嚙合的關閉狀態。此狀態為 關閉狀態。 20 由上昇狀態至關閉狀態時，一對的搖動元件11的前端 部會做圓弧運動朝開口部6的預定方向的中央部移動。由於 搖動元件11的前端部是做圓弧運動，故一對搖動元件11的 前端部會由上昇狀態進一步朝更高的位置上昇移動。即， 因為圓弧運動的緣故，搖動元件11的前端部會一面做水平 200524059 移動一面上昇。 於關閉狀態的搖動元件Π的前端部的高度被設定成比 上昇狀態例如高1.0mm。因此，一對搖動元件11的前端部最 後會由支持體1的上面朝上突起1.5mm。 5 又，於上昇狀態及關閉狀態的一對搖動元件11由支持 體1的上面突起的高度，可依照例如半導體晶片3的厚度等 拾取條件設定。例如，於上述上昇狀態中，將搖動元件11 的前端部設定成與支持體1的上面大約等高亦可。 由關閉狀態將驅動軸23朝下降方向驅動時，由於圓盤 10 25對一對搖動元件11的基端部的加壓狀態被解除，故一對 的搖動元件11的前端部會因第2彈簧的回復力而朝打開方 向回轉。一對的搖動元件11的基端部一接觸到卡止元件26 時，搖動元件11的前端部的朝打開方向的回轉即被停止。 進而，驅動軸23—下降，支軸8因第1彈簧27的緣故會連動 15 於驅動軸23的下降。藉此，一對的搖動元件11回復至第4A 圖所示的待機狀態。 如第2A圖所示，上述封閉元件21的由上述支持體1的下 端側突出的部份，有一連通孔31的一端開口於此。此連通 孔31的另一端則與上述封閉元件21與支持體1所形成的内 20 部空間7相連通，於上述的一端則如第1圖所示地與一吸引 幫浦32相連接。 吸引幫浦32—作動，其吸引力即會作用於支持體1的内 部空間7，由此内部空間7經由吸引孔16a、16b作用於環狀 溝14a〜14c、連通溝15及開口部6。 200524059 如第1圖所不，上述驅動軸23的由封閉元件训下端面 突出的下部設有-凸輪從動者33。凸輪從動者珊著圖中 未示的驅動源與被旋轉驅動於箭頭方向的凸輪別的外周面 相接觸。因此，凸輪34若被驅動旋轉，上述驅動轴^會被 5驅動於上下方向，故連動於此上下方向動作的一對搖動元 件11的上部會以支軸為支點而被驅動開閉。 又，吸嘴4、支持單元10等的驅動控制係藉著未圖示的 控制裝置如後所述地被控制動作。 以下，說明上述構造的拾取裝置的作用。 10 如第1圖所示，以圖中未示的晶圓環驅動黏著片2於\、 γ方向’將欲拾取的半導體晶片3定位於支持體工的開口部6 的上方。然後，使支持體i上昇至其上面接觸黏著片2的位 置。此時，藉著支持體1上面的環狀溝14a〜14c、連通溝15 會吸著保持住欲拾取的半導體晶片3的周邊的黏著片2。 15又，一對的搖動元件11的經形成凹凸部12a、12b的前端部 會如第4A圖所示位於比支持體1的上面低的位置，成為待機 狀態。 疋位欲拾取的半導體晶片3的位置的同時，會使吸嘴4 下降，讓吸嘴4的前端吸著欲拾取的半導體晶片3。此時， 20吸嘴4會以預定的重量壓住半導體晶片3。然後，讓連接於 支持體1的吸引幫浦32作動，對該支持體1的内部空間7進行 減壓。藉此，於環狀溝14a〜14c、連通溝15產生吸引力，將 黏著片2的欲拾取的半導體晶片3的周邊部份吸著保持於上 述支持體1的上面。 13 200524059 然後，驅動凸輪34旋轉。此凸輪34經由凸輪從動者33 會驅動驅動軸23上昇。連動於驅動軸23的上昇，搖動元件 11會上昇。於驅動軸23的上昇過程中，到支軸8接觸到長溝 9的上端為止，一對的搖動元件11會不回轉地上昇至第4B 5 圖所示的上昇狀態。即，搖動元件11的前端部會上昇至由 開口部6突出0.5mm的位置。 由於一對的搖動元件11朝上昇位置上昇，被吸嘴4吸住 的半導體晶片3之預定方向的兩端部（此時為半導體晶片3 的相對的一對兩端部）會經由黏著片2被一對搖動元件11的 10 前端推起。此時，吸嘴4僅上昇半導體晶片3上昇的程度。 又，半導體晶片3周邊部份的黏著片2會隨著半導體晶片3的 上昇而被拉伸。於此階段，半導體晶片3的兩端部已經成為 由黏著片2剝離的狀態。 上述驅動軸23由上昇狀態進一步被朝上昇方向驅動 15 時，由於支軸8的兩端部碰到長溝9的上端，支軸8本身無法 上昇，因此，僅有驅動軸23上昇。藉此，一對搖動元件11 的基端部會因為設置於上述驅動轴23上端的圓盤25而被朝 張開方向驅動，故一對搖動元件11的前端部會對抗第2彈簧 28的勢能而朝關閉方向回轉。 20 即，一對搖動元件11的各前端部會朝著開口部6的上述 預定方向的中央部做圓弧運動，藉著此圓弧運動，一對的 搖動元件11的各前端部會讓半導體晶片3的背面的相對於 黏著片2的接觸點由半導體晶片3的上述預定方向的兩端部 緩緩地沿著水平方向及上方向變化至中央部，劃過黏著片2 200524059 般地把黏著片2頂起來。 如此一來，於驅動軸23的上昇狀態，半導體晶片3的兩 端部由黏著片2剝離，接著，一對搖動元件11的前端部一面 做圓弧運動一面劃過半導體晶片3的背面的黏著片2，將黏 5 著片頂起，因此半導體晶片3會由其兩端部朝中央部依次地 由黏著片2剝起來。 如此，由於以搖動元件11的前端部劃過半導體晶片3的 背面的黏著片2,故不會有過去以頂出針頂出而於半導體晶 片3產生應力集中之情形。因此，可將半導體晶片3不會破 10 損地由黏著片2上拾取。 進而，一對的搖動元件11的前端部作圓孤運動時，由 於各前端部與半導體晶片3背面的黏著片2的接觸點會由半 導體晶片3的上述預定方向的兩端部緩緩地沿著水平方向 及上方向變化至中央部，故亦可防止已經與半導體晶片3剝 15 離的黏著片2再次黏付於半導體晶片3的下面之情形。 一對的搖動元件11，其前端部形成相互嚙合的梳齒狀 的凹部12a及凸部12b。因此，一對的搖動元件11可如第5圖 的放大圖所示地，其等前端部可回轉至嚙合的狀態，故可 將半導體晶片3背面的黏著片2全體都頂起來。即，相較於 20 搖動元件11的前端部未嚙合的情形，可以擴大可頂起的面 積。換言之，可擴大由半導體晶片3剝離黏著片2的領域R。 又，由於一對的搖動元件11的各前端部由半導體晶片3 的相對的兩端部移至中央部的同時，係分別一面水平方向 移動一面上昇，故具有將半導體晶片3由黏著片2剝離的作 200524059 用。因此，相較於將半導體晶片3由—端側剝離至相對的另 一端側時，可以一半的時間完成剝離動作，可提高拾取效 率。 又，僅藉著驅動軸23的上昇，就可進行一對搖動元件 5 11的對半導體晶片3的兩端部的頂出動作及接續於該頂出 動作的因一對搖動元件11的圓弧運動而朝半導體晶片3的 中央部的頂出動作。因此，可簡化拾取裝置的構造。 又，搖動元件11由上昇狀怨移動至關閉狀態時，由於 半導體晶片3係被以吸嘴4吸著保持，故於剝離過程中半導 10體晶片3不會產生位置偏移’可防止銲接精度不佳。 進而，吸嘴4的Z驅動源使用音圈馬達時，即使半導體 晶片3被搖動元件11頂起，對半導體晶片3的加壓力亦不會 改變。因此，可更確實地防止拾取時的半導體晶片3的破損。 因此，由以上作用可知，可將半導體晶片3以吸嘴4由 15 黏著片2確實地拾取。 又，經剝離的半導體晶片藉著吸嘴4吸著保持，搬送至 銲接位置。另一方面，吸引幫浦32的作動被停止，同時使 驅動軸23下降，支持體1下降。然後，使黏著片2移動於適 當的X、Y方向，將下一個欲拾取的新的半導體晶片3定位 20於支持體1的開口部6的上方後，進行上述相同的動作。 第6圖與第7圖係第1實施形態的變形例之第2實施形 態。此第2實祕態係把-輕元件41的下侧定設=於^ 有可回轉的—對搖動元件11的W此支持元件仙一對 搖動元件11相同地，藉著具有預定寬度，例如與搖動元件 16 200524059 11相同尺寸的板狀元件而形成。 上述支持元件41的上端被設定成，於上述支轴8的兩蠕 部被驅動上昇至碰到長溝9的上端的位置之上昇狀態時，比 搖動元件11的前端高預定尺寸，例如高1.0mm。 5 藉此’於上昇狀態時，半導體晶片3會如第7圖所示地， 藉著突出支持體；[上面0.5mm的一對搖動元件^的前端支持 預定方向的兩端部，而以突出1.0mm的支持元件41支持預 定方向的中間部。 然後’由此與第1實施形態相同地，驅動軸23一上昇， 10 一對搖動元件11的前端部會朝開口部6的預定方向的中失 部’即朝支持元件41做圓弧運動，將半導體晶片3背面的點 著片2摩擦頂起。 因此，於此第2實施形態亦與第1實施形態相同，一對 搖動疋件11的前端由第7圖所示的張開狀態如箭頭所示朝 15關閉方向做圓弧運動，滑過半導體晶片3的下面將其頂起 時半導體晶片3的下面與黏著片2之間的剝離領域R會隨著 搖動元件11的圓弧運動而變大，故可不會破損地將半導體 晶片3由黏著片2剝起。 而且’由於半導體晶片3的預定方向的中央部份被支持 凡件41支持，故即使吸引力作用於開口部6，亦可防止半導 體晶片3因吸弓丨力而朝開口部6内彎曲，因此，可減少作用 於半導體晶片3的彎曲應力，亦可防止半導體晶片3的破 員又’可防止半導體晶片3的電路被切斷或短路，而可保 持製品的高品質。 17 200524059 又，由於支持元件41為板狀，故以其支持半導體晶片3 時，可有效的減少彎曲應力，亦不會有讓半導體晶片3破損 之情形。 又，關於其他作用及效果則如同第1實施形態所述。 5 第8A〜C圖與第9圖係顯示本發明之第3實施形態。本實 施形態中，設置於支持體1内的剝離元件11A係如第9圖所 示，為沿著開口部6的預定方向（此時，為半導體晶片3的 一邊的方向）之細長板狀。此剝離元件11A可藉著圖中未示 的驅動源被驅動於上下方向及沿著與上述預定方向交叉的 10 方向水平地被驅動。又，剝離元件11A的前端宜為圓弧狀。 又，剝離元件11A的於上述預定方向的長度宜與半導體晶片 3的上述一邊等長。 將半導體晶片3由黏著片2剝離時，將吸嘴4由第8A圖所 示的上昇位置如第8B圖所示地下降，吸著半導體晶片3，同 15 時使剝離元件11A上昇，經由黏著片2以預定壓力接觸半導 體晶片3的一端部的下面，使半導體晶片3上昇例如約 0.5mm 〇 於此狀態，驅動剝離元件11A於第9圖箭頭所示的方 向，如第8C圖所示，由與上述開口部7的預定方向交叉的一 20 端移動至他端。藉此，可將半導晶片3的下面的黏著片2由 半導體晶片的一端部至相對的另一端部依次地剝離。因 此，與第1實施形態相同地，可將半導體晶片3由黏著片2輕 易且不會破損地拾取。 又，以剝離元件11A將半導體晶片3依次由黏著片2剝離 18 200524059 起來的過程中，由於該半導體晶片3被吸著保持於吸嘴4, 故於剝離過程中，半導體晶片3不會產生位移，可防止銲接 精度不佳，又，使用音圈馬達作為吸嘴4的Z驅動源時，gp 使半導體晶片3被剝離元件11A頂起，亦具有對半導體晶片3 5 的加壓力不變的優點。以上二個優點與第1實施形態相同。 第10圖係顯示本發明之第4實施形態。本實施形態的制 離元件11B由前端為半球形之棒體所構成，可藉著圖中未示 的驅動源驅動於Z方向及於水平方向沿著螺旋狀回轉的軌 跡移動。 10 上述剝離元件11B，開始時位於開口部6内半導體晶片3 的角落下方，被驅動上昇時，前端會經由黏著片2與半導體 晶片3的一角下面相接觸，將該角部頂起約lmm。然後，上 述剝離元件11B如第10圖箭頭所示地呈矩形螺旋狀般旋轉 驅動，—面將半導體晶片3的下面的黏著片2頂起，-面摩 15 擦，由周緣部向中心部移動。 因此，此時亦可藉著剝離元件11B的頂起將半導體晶片 3由黏著片2輕易地拾取。 於上述第1實施形態中，藉著使用以構成剝離元件的搖 動元件似昇至上昇狀態，使其前端由支持體的上面突起 預定高度’然後讓一對的剝離元件u的前端朝關閉方向作 圓弧運動，但於待機狀態令—對的搖動元件的前端與支持 體的上面幾乎等高，即接觸於黏著片的高度，並於此狀態 使-對搖動元件的前端側朝關閉方向作圓弧運動亦可。 於此構造，在開始圓弧運動的同時，由於一對搖動元 19 200524059 件的前端會由開口部突出至支持體的上面，將半導體晶片 背面的黏著片頂起，故與第1實施形態相同地，可良好地拾 取半導體晶片。 又，於上述第1、第2實施形態中，搖動元件11、剝離 5 元件11A係同時朝上述預定方向，即朝垂直於半導體晶片3 的一邊的方向移動，但不是垂直方向亦可。 又，於上述第1、第2實施形態中，係令用以構成剝離 元件的搖動元件11由上述預定方向朝中央部作圓弧運動， 但如第3實施形態說明般地，將一對的剝離元件朝相反方向 10 平行移動亦可。 又，於上述第1、第2實施形態中，係令一對的搖動元 件11的寬度尺寸相同，但寬度尺寸不同，例如一邊較另一 邊小等亦可。 又，使用凸輪34讓驅動軸23上下移動，但使用氣缸等 15 其他驅動源亦可。 又，於各實施形態中，於剝離元件設置加熱器等的加 熱機構，將黏著片一面加熱一面剝離半導體晶片亦可。 【圈式簡單說明】 第1圖係顯示本發明之第1實施形態之拾取裝置的概略 20 的構造圖。 第2A、B圖係分別顯示拾取裝置於周方向間隔90度位 置的縱截面圖。 第3A、B圖係顯示一對的搖動元件的前端打開的狀態 與關閉的狀態之拾取裝置的平面圖。 200524059 第4A〜C圖係用以說明拾取時的一對搖動元件的動作 之圖。 第5圖係顯示因一對的搖動元件做圓弧運動，黏著片由 半導體晶片剝離之狀態之說明圖。 5 第6圖係顯示本發明之第2實施形態之拾取裝置之一部 份之截面圖。 第7圖係顯示以第6圖所示的拾取裝置的搖動元件與支 持元件使半導體晶片上昇之狀態之放大截面圖。 第8A〜C圖係顯示本發明之第3實施形態之拾取裝置之 10 動作說明圖。 第9圖係顯示第8圖所示之搖動元件之動作之說明圖。 第10圖係顯示本發明之第4實施形態之搖動元件之動 作之說明圖。 【圖式之主要元件代表符號表】 1.. .支持體 2.. .黏者片 3.. .半導體晶片 4.··吸嘴 6.. .開口部 7.. .内部空間 8…支轴 9…長溝 10…支持單元 11…搖動元件 200524059 IIA. ..剝離元件 IIB. ..剝離元件 12a···凹部 12b...凸部 14a、14b、14c…環狀溝 15.. .連通溝 16a、16b···吸引孔 21…封閉元件 22.. .插通孔 23.··驅動軸（驅動元件） 24.. .0.環 25.. .圓盤 26…卡止元件 27…第1彈簧 28…第2彈簧 31.. .連通孔 32·.·吸引幫浦 33.. .凸輪從動者 34…凸輪 41…支持元件 R...領域200524059 (1) Description of the invention: [Technical Field 3 of the Invention] The present invention relates to a pickup device and a pickup method for picking up 5 semiconductor crystals adhered to an adhesive sheet by a nozzle. Prior art 3 Technical background A semiconductor wafer formed by mesh-cutting a semiconductor wafer is adhered to an adhesive sheet. When soldering to a substrate, the semiconductor wafer is picked up by the above-mentioned 10 pieces of adhesive with a nozzle. When picking up a semiconductor wafer from an adhesive sheet with a suction nozzle, as described in Patent Document 1 (Japanese Patent Application Laid-Open No. 2002-100644), a semiconductor wafer to be picked up by a nozzle that is held by a support while holding the adhesive sheet is conventionally used. At the same time, the semiconductor wafer 15 is pushed up from below by a sharp ejection pin at the front end, while the semiconductor wafer is separated from the adhesive sheet while being picked up by a suction nozzle. [Disclosure of the Invention] Disclosure of the Invention Problems to be Solved by the Invention 20 However, recently, the thickness of semiconductor wafers has been as thin as 100 μηΐ or less. When such a thin semiconductor wafer is lifted with the sharp tip of the ejector pin, there will be a stress concentration in the place where the tip contacts. Therefore, the semiconductor wafer may be damaged due to the stress caused by the ejector pins. In order to prevent damage to the semiconductor wafer due to stress concentration, although 200524059 can be considered to slow down the speed of the ejection pin when lifting the semiconductor wafer, as the ejection speed of the ejection pin is slowed down, the picking up speed will also be slower As a result, productivity is reduced, and even if the ejection speed is slowed down, it is difficult to reliably prevent the semiconductor crystal from being damaged when the thickness of the semiconductor wafer is thin. 5 An object of the present invention is to provide a pick-up device and a pick-up method which can peel a semiconductor wafer from an adhesive sheet without damage. Method for solving the problem The present invention is a pick-up device for a semiconductor wafer. The pick-up device picks up a semiconductor wafer attached to an adhesive sheet with a suction nozzle. The pick-up device is provided with: Those who want to attract holes in the peripheral portion of the semiconductor wafer to be picked up by the nozzle; and a peeling device, which is in contact with the lower side of the semiconductor wafer to be picked up by the nozzle, and can be used by the semiconductor wafer. The end part rises while moving horizontally toward the central part. 15 The present invention is a semiconductor wafer pick-up device. The pick-up device picks up a semiconductor wafer attached to an adhesive sheet with a suction nozzle. The pick-up device is provided with a support and is formed to hold and hold the adhesive sheet. Those who suck holes in the peripheral portion of the semiconductor wafer picked up by the nozzle; and the peeling device, which has a strip-shaped strip-shaped peeling element, 20 strip-shaped strip-shaped stripping elements can be raised to the above-mentioned adhesive sheet. After picking up the lower side of one end of the semiconductor wafer, it comes into contact with the adhesive sheet, and then moves from one end of the semiconductor wafer to the other end, and extends in a direction perpendicular to the moving direction. The present invention relates to a pick-up device for a semiconductor wafer. The pick-up device is 200524059 for picking up a semiconductor wafer attached to an adhesive sheet with a suction nozzle. The support is provided to support the above-mentioned adhesive sheet by suction. The peripheral part of the picked-up semiconductor wafer sucks 5 丨 holes; and peeling = set is a person with a-rod-shaped peeling element, the peeling element can be-side, 5 the lower side of the above-mentioned adhesive sheet, one side is from the adhesive sheet If you want to use the above = take the peripheral edge of the semiconductor wafer to spirally rotate toward the center, the adhesive sheet peels the semiconductor wafer. The present invention relates to a method for picking up a semiconductor wafer. The picking side picks up the semiconductor wafer attached to the adhesive sheet with a suction nozzle, and has 10 semiconductor wafers for holding and holding the above-mentioned adhesive sheet with a suction nozzle. The steps of the peripheral part; the step of sucking the above half = wafer by the above-mentioned suction nozzle; and the part of the semiconductor wafer that is attached to the semiconductor wafer sucked by the above-mentioned suction nozzle by the above-mentioned suction nozzle. The step of peeling both end sides toward the center. 15 Effects of the Invention According to the present invention, when a semiconductor wafer is picked up from the adhesive sheet by a suction nozzle, the semiconductor wafer can be peeled from the adhesive sheet without damage, so that the semiconductor wafer can be easily and surely picked up from the adhesive sheet. [Embodiment] The best embodiment of the 20th invention x The following describes the embodiment of the present invention with reference to the drawings. Figures 1 to 5 show the third embodiment of the present invention. The drawing unit is equipped with a support unit 10. This support unit W is disposed below the adhesive sheet 2 of a wafer ring not shown in the figure, and can be driven in the Z direction by a Z drive source not shown in 200524059, and is in contact with the upper surface of a support 1 described later. Move between the position of the adhesive sheet 2 and the position separated from the adhesive sheet 2. 5 10 15 A plurality of semiconductor wafers 3 divided into a mesh shape of a semiconductor wafer are affixed to the upper surface of the adhesive sheet 2. The above-mentioned wafer ring can be driven in a horizontal direction by X and Y driving sources (not shown). Thereby, the semiconductor wafer 3 attached to the adhesive sheet 2 can be positioned in the X and γ directions with respect to the support unit 10. Also, instead of the support unit 10, the wafer ring can be driven in the Z direction, as long as the wafer ring and the support unit 10 can be driven in the X, Y, and Z directions relatively. A suction nozzle 4 is provided above the adhesive sheet 2, that is, above the support unit 10. This nozzle 4 can be driven in the X, Y, and Z directions by driving sources not shown in the figure, x, y, and 2. In addition, it is preferable to use a voice coil motor or the like as the z drive source to control the pressurized weight of the suction nozzle 4 to a certain amount. The support unit 10 includes a support 1. As shown in Figs. 2A and 2B, the support 1 is not cylindrical, and its upper end forms a cylindrical shape with a rectangular opening 6 at its upper end. Khankou # 6 is similar in shape to the semiconductor wafer 3 as the object to be picked up, and the area is estimated to be approximately the same as the semiconductor wafer 3. The support body 1 has a pair of long grooves 9 formed on the inner peripheral surface of the support body 1 facing each other and extending along the axis, and both ends of the support 8 are slidably fitted in the long grooves 9. Thus, the support shaft 8 can be guided to the long groove 9 on one side and move up and down within the range of the long groove 9. The middle part of the above-mentioned support shaft 8 is rotatably supported by a pair of rocking elements and a middle part of the eight, the-pair of rocking elements 11 are used to constitute the peeling element j and do not bend in the shape of <. The pair of rocking elements 11 are bent in opposite directions with respect to the center axis of the support 1. 20 200524059 In this way, the upper end side and the lower end side of the pair of rocking elements 11 are opened with the support shaft 8 as a fulcrum, and the base end portion on the lower end side is in contact with the upper surface of the disk 25 described later. The pair of rocking elements 11 can drive the upper end side in the closing direction by opening the lower end side as described later. 5 The pair of rocking elements 11 is formed by a plate-like portion having a width slightly smaller than the wide sound of the opening portion 6 and a length equal to or slightly shorter than the side of the semiconductor wafer 3 to be picked up. As shown in FIG. 3, the front ends of these are formed in a comb-tooth shape, that is, a concave-convex shape is formed along the width direction with a plurality of concave portions 12a and a plurality of convex portions 12b. Then, when the front end portions of the pair of rocking elements 11 are tightly closed 10, the opposed concave portions 12a and convex portions 12b are engaged. As shown in Figs. 3A and B, three annular grooves 14a to 14c are formed concentrically on the upper surface of the support 1 to surround the opening portion 6. The three annular grooves 14a to 14c communicate with each other through two communication grooves 15 formed along the radial direction of the support 1. The communication groove 15 is parallel to two opposite sides 15 (end portions) of the semiconductor wafer 3 to be picked up, and is located outside the two sides. Further, the communication groove 15 may be formed on the upper surface of the support 1 on the other opposite sides of the semiconductor wafer 3. At the same time, it is parallel to the two sides and located on the outside. In the innermost annular groove 14a, four suction holes 16a spaced 90 to 20 degrees in the circumferential direction are formed through the thickness direction. Furthermore, the diameter of this annular groove 14a is larger than the diagonal length of the semiconductor crystal 3 to be picked up. Two suction holes 16b are formed in the second annular groove 14b at intervals of 180 degrees in the circumferential direction. Each of the annular grooves 14a to 14c and the communication groove 15 may be mediated by the suction holes 16 & 16b as described above, and generate an attractive force as described later. In the figures other than the third figure, the figures 200524059 have omitted the illustrations of the annular grooves 14a to 14c, the suction holes 16a, and i6b. As shown in Figs. 2A and B, one end of a cylindrical closing element 21 is air-tightly coupled to the lower end opening of the support 丨. An insertion portion 22 is formed in the central portion of the closing element 21 so as to penetrate in the axial direction. A drive shaft 23 as a driving element is slidably provided in the insertion hole 22 5. The drive shaft 23 is air-tightly provided by an O-ring 24 provided at a lower end portion of the insertion hole 22. The drive shaft 23 is integrally provided with a variable disk 25 from an upper portion protruding from an upper end surface of the closing element 21. Further, a cylindrical locking element 26 is provided at the center of the upper surface of the disk 25. This locking element 26 protrudes between the base end portions of a pair of rocking elements 11 opened at a predetermined angle of 10, and regulates the space between the base end portion and the base end portion of the rocking element 11 to be driven by a second spring described later. 28 while moving close to each other. Therefore, even if the pair of rocking elements ^ are supported by the support shaft 8 as the fulcrum, the front end portion is restricted to the opening portion 6 when it is opened to the maximum. As shown in FIG. 2B, a first spring 15 is stretched between the disk 25 and the support shaft 8. This first spring 27 elastically connects the disk 25 to the support shaft 8. Furthermore, between the pair of rocking elements π, the second spring 28 is provided to impart potential energy to the front end portion above the support shaft 8 in the direction of opening. Here, the tensile force of the second spring 28 is set to be larger than that of the first spring 27. Fig. 4A shows a state where the front end portions of the pair of rocking elements 11 are located at positions not protruding from the upper surface of the support 20, and this state is a standby state. In the standby state, as shown in FIG. 2B, both ends of the support shaft 8 are located at a predetermined distance lower than the upper end of the long groove 9. At the same time, the base end portions of the pair of rocking elements ^ rely on the potential energy of the second spring 28. In contact with the locking element 26, the front end portion is opened to the maximum state. 200524059 Then, set the width of the locking element 26 in this state so that each front end portion of the pair of rocking elements 11 is just slightly opposite to the opposite end portions of the semiconductor wafer 3 to be picked up or the both end portions are slightly in the middle. The relative part. When the drive shaft 23 is driven to rise from the standby state, the rocking element 11 rises while maintaining the state shown in FIG. 4A. As the drive shaft 23 rises, both ends of the support shaft 8 rise along the long groove 9 and, when it reaches a predetermined position, it comes into contact with the upper end of the long groove 9. When both ends of the support shaft 8 contact the upper end of the long groove 9, the lifting of the rocking element 11 stops. At this time, as shown in FIG. 4B, the front ends of the pair of rocking elements 11 protrude a little from the upper surface of the support 1. This state is a rising state. In this raised state, the front end portions of the pair of rocking elements 11 are set to a predetermined size protruding from the opening portion 6, for example, 0.5 mm. When the driving shaft 23 is further driven in the ascending direction from the ascending state, the base end portions of the pair of rocking elements 11 are pressed by the disc 25 in the opening direction. Therefore, the front end portions of the pair of rocking elements 11 make a circular arc movement with the support shaft 8 as the center against the potential energy of the second spring 28. When the drive shaft 23 is raised to the highest point, as shown in Fig. 4C, the front end portions of the pair of rocking elements 11 are in a closed state in which they are engaged with each other. This state is off. 20 From the raised state to the closed state, the front end portions of the pair of rocking elements 11 move in a circular arc toward the central portion of the opening portion 6 in a predetermined direction. Since the front end portions of the rocking element 11 perform an arc motion, the front end portions of the pair of rocking elements 11 will move upward from the raised state to a higher position. That is, because of the arc movement, the front end portion of the rocking element 11 will rise while moving horizontally 200524059. The height of the front end portion of the rocking element Π in the closed state is set to be 1.0 mm higher than that in the raised state, for example. Therefore, the front end portions of the pair of rocking elements 11 will finally protrude upward by 1.5 mm from the upper surface of the support 1. 5. The height of the pair of rocking elements 11 protruding from the upper surface of the support 1 in the raised state and the closed state can be set in accordance with the pickup conditions such as the thickness of the semiconductor wafer 3. For example, in the above-mentioned raised state, the front end portion of the rocking element 11 may be set to approximately the same height as the upper surface of the support 1. When the drive shaft 23 is driven in the downward direction from the closed state, the discs 10 and 25 pressurize the base end portions of the pair of rocking elements 11, so the front ends of the pair of rocking elements 11 are affected by the second spring. The restoring force turns toward the opening direction. As soon as the base end portions of the pair of rocking elements 11 contact the locking element 26, the turning of the front end portions of the rocking elements 11 in the opening direction is stopped. Further, the drive shaft 23 is lowered, and the support shaft 8 is linked to the lowering of the drive shaft 23 due to the first spring 27. Thereby, the pair of rocking elements 11 returns to the standby state shown in FIG. 4A. As shown in Fig. 2A, an end of a part of the closing member 21 protruding from the lower end side of the support 1 has a communication hole 31 opened therein. The other end of the communication hole 31 is in communication with the inner space 7 formed by the above-mentioned closing element 21 and the support 1, and the above one end is connected with a suction pump 32 as shown in FIG. The suction pump 32 is actuated, and its attraction force acts on the inner space 7 of the support 1, whereby the inner space 7 acts on the annular grooves 14a to 14c, the communication groove 15 and the opening 6 through the suction holes 16a and 16b. 200524059 As shown in FIG. 1, the lower part of the drive shaft 23 protruding from the lower end face of the closed element is provided with a cam follower 33. The cam follower looks at a drive source (not shown) in contact with the outer peripheral surface of the cam that is rotationally driven in the direction of the arrow. Therefore, if the cam 34 is driven to rotate, the above-mentioned drive shaft ^ will be driven in the up-down direction, so the upper part of the pair of rocking elements 11 that are operated in conjunction with this up-down direction will be driven to open and close with the support shaft as a fulcrum. The drive control of the suction nozzle 4, the support unit 10, and the like is controlled by a control device (not shown) as described later. The operation of the pickup device having the above-mentioned structure will be described below. 10 As shown in FIG. 1, a wafer ring (not shown) is used to drive the adhesive sheet 2 in the \, γ directions' to position the semiconductor wafer 3 to be picked up above the opening 6 of the support body. Then, the support i is raised to a position where the support i comes into contact with the adhesive sheet 2. At this time, the ring-shaped grooves 14 a to 14 c and the communication groove 15 on the support 1 attract the adhesive sheet 2 that holds the periphery of the semiconductor wafer 3 to be picked up. 15. Furthermore, as shown in Fig. 4A, the front end portions of the pair of rocking elements 11 formed with the concave-convex portions 12a and 12b are positioned lower than the upper surface of the support 1 and placed in a standby state. When the position of the semiconductor wafer 3 to be picked up is set, the suction nozzle 4 is lowered, and the front end of the suction nozzle 4 sucks the semiconductor wafer 3 to be picked up. At this time, the 20 suction nozzle 4 presses the semiconductor wafer 3 with a predetermined weight. Then, the suction pump 32 connected to the support 1 is operated to decompress the internal space 7 of the support 1. This attracts the annular grooves 14a to 14c and the communication grooves 15 to suck and hold the peripheral portion of the semiconductor wafer 3 to be picked up on the adhesive sheet 2 on the support 1 above. 13 200524059 Then, the driving cam 34 rotates. This cam 34 drives the drive shaft 23 upward via the cam follower 33. In conjunction with the rising of the drive shaft 23, the rocking element 11 rises. During the ascent of the drive shaft 23, until the support shaft 8 contacts the upper end of the long groove 9, the pair of rocking elements 11 will rise to the ascending state shown in Fig. 4B 5 without rotation. That is, the tip end portion of the rocking element 11 rises to a position protruding from the opening 6 by 0.5 mm. As the pair of rocking elements 11 rises to the raised position, both ends of the semiconductor wafer 3 held in the predetermined direction by the suction nozzle 4 (in this case, the opposite ends of the semiconductor wafer 3 are opposite) will pass through the adhesive sheet 2 It is pushed up by the 10 front ends of a pair of rocking elements 11. At this time, the suction nozzle 4 only rises to the extent that the semiconductor wafer 3 rises. Further, the adhesive sheet 2 in the peripheral portion of the semiconductor wafer 3 is stretched as the semiconductor wafer 3 rises. At this stage, both ends of the semiconductor wafer 3 have been peeled from the adhesive sheet 2. When the drive shaft 23 is further driven in the ascending direction 15 from the raised state, since both ends of the support shaft 8 hit the upper end of the long groove 9, the support shaft 8 itself cannot rise, so only the drive shaft 23 rises. As a result, the base end portions of the pair of rocking elements 11 are driven in the opening direction due to the disc 25 provided at the upper end of the drive shaft 23, so the front end portions of the pair of rocking elements 11 will oppose the potential energy of the second spring 28 Instead, turn in the closing direction. 20 That is, each front end portion of the pair of rocking elements 11 performs an arc movement toward the central portion in the predetermined direction of the opening portion 6, and by this circular motion, each front end portion of the pair of rocking elements 11 makes the semiconductor The contact point of the back surface of the wafer 3 with respect to the adhesive sheet 2 is gradually changed from the two ends of the semiconductor wafer 3 in the predetermined direction along the horizontal direction and the upward direction to the central part, and the adhesive sheet 2 is pasted across the adhesive sheet 2 200524059 to stick. Slice 2 tops up. In this way, in the ascending state of the driving shaft 23, both ends of the semiconductor wafer 3 are peeled off by the adhesive sheet 2. Then, the front ends of the pair of rocking elements 11 make circular motion while passing across the back of the semiconductor wafer 3 for adhesion. In the sheet 2, the adhesive sheet 5 is pushed up against the sheet, so the semiconductor wafer 3 is peeled off from the adhesive sheet 2 in order from its both ends to the center. In this way, since the front end portion of the rocking element 11 is drawn across the adhesive sheet 2 on the back surface of the semiconductor wafer 3, there is no case where stress is concentrated in the semiconductor wafer 3 by ejecting with an ejector pin in the past. Therefore, the semiconductor wafer 3 can be picked up from the adhesive sheet 2 without damage. Furthermore, when the front end portions of the pair of rocking elements 11 perform circular solitary movement, the contact points between the front end portions and the adhesive sheet 2 on the back surface of the semiconductor wafer 3 will gradually follow the two ends of the semiconductor wafer 3 in the predetermined direction. The horizontal direction and the upward direction are changed to the center, so that it is possible to prevent the adhesive sheet 2 which has been peeled off from the semiconductor wafer 3 from sticking to the lower surface of the semiconductor wafer 3 again. A pair of rocking elements 11 have comb-shaped recessed portions 12a and convex portions 12b formed at the front ends thereof. Therefore, as shown in the enlarged view in Fig. 5, the pair of rocking elements 11 can be turned to the engaged state, so that the entire adhesive sheet 2 on the back surface of the semiconductor wafer 3 can be pushed up. That is, compared with the case where the front end portion of the rocking element 11 is not meshed, the area that can be lifted can be enlarged. In other words, the area R in which the adhesive sheet 2 is peeled from the semiconductor wafer 3 can be expanded. In addition, since each front end portion of the pair of rocking elements 11 is moved from the opposite end portions of the semiconductor wafer 3 to the center portion, and each of them is moved in a horizontal direction while rising, the semiconductor wafer 3 is peeled from the adhesive sheet 2 Used as 200524059. Therefore, as compared with the case where the semiconductor wafer 3 is peeled from the one end side to the opposite end side, the peeling operation can be completed in half the time, and the pickup efficiency can be improved. Moreover, the ejection operation of the pair of rocking elements 5 to 11 at both ends of the semiconductor wafer 3 and the arc of the pair of rocking elements 11 continued to the ejection operation can be performed only by raising the driving shaft 23. It is moved and pushed out toward the center of the semiconductor wafer 3. Therefore, the configuration of the pickup device can be simplified. In addition, when the rocking element 11 is moved from the rising state to the closed state, since the semiconductor wafer 3 is held by the suction nozzle 4, the semiconductor 10-body wafer 3 will not be displaced during the peeling process. Poor accuracy. Furthermore, when the voice coil motor is used as the Z drive source of the suction nozzle 4, even if the semiconductor wafer 3 is lifted up by the rocking element 11, the pressure applied to the semiconductor wafer 3 will not change. Therefore, breakage of the semiconductor wafer 3 at the time of pickup can be prevented more reliably. Therefore, it can be seen from the above effects that the semiconductor wafer 3 can be reliably picked up by the adhesive sheet 2 with the suction nozzle 4 from 15. The separated semiconductor wafer is sucked and held by the suction nozzle 4 and transferred to a soldering position. On the other hand, the operation of the suction pump 32 is stopped, the drive shaft 23 is lowered, and the support 1 is lowered. Then, the adhesive sheet 2 is moved in the appropriate X and Y directions, the next new semiconductor wafer 3 to be picked up is positioned 20 above the opening 6 of the support 1, and then the same operation as described above is performed. 6 and 7 show a second embodiment of the modification of the first embodiment. The second real state is that the lower side of the light element 41 is set to ^ is rotatable—the support element of the swing element 11 is the same as the pair of swing elements 11 by having a predetermined width, for example, with Shaking element 16 200524059 11 is formed by a plate-like element of the same size. The upper end of the support element 41 is set to be higher than the front end of the rocking element 11 by a predetermined size, for example, 1.0 mm higher, when the two worms of the support shaft 8 are driven to rise to a position where they touch the upper end of the long groove 9. . 5 In this way, when the semiconductor wafer 3 is raised, as shown in FIG. 7, by protruding the supporting body; [the front ends of the pair of rocking elements ^ on the top of 0.5 mm support both ends in a predetermined direction to protrude. The support element 41 of 1.0 mm supports a middle portion in a predetermined direction. Then, 'as with the first embodiment, as soon as the drive shaft 23 is raised, 10 the front end portions of the pair of rocking elements 11 will be directed toward the missing portion in the predetermined direction of the opening portion 6', that is, the arc will be moved toward the support element 41. The dots 2 on the back surface of the semiconductor wafer 3 are frictionally pushed up. Therefore, here, the second embodiment is also the same as the first embodiment. The front ends of the pair of rocking claws 11 move from the open state shown in FIG. 7 to the closing direction of 15 as shown by the arrow, and slide over the semiconductor. When the lower surface of the wafer 3 is pushed up, the peeling area R between the lower surface of the semiconductor wafer 3 and the adhesive sheet 2 becomes larger as the arc of the rocking element 11 moves, so the semiconductor wafer 3 can be removed from the adhesive sheet without damage. 2 peel off. Furthermore, since the central portion of the semiconductor wafer 3 in the predetermined direction is supported by the support member 41, even if the attractive force acts on the opening 6, the semiconductor wafer 3 can be prevented from being bent into the opening 6 by the suction force, so It can reduce the bending stress acting on the semiconductor wafer 3, and it can also prevent the breakage of the semiconductor wafer 3, and can prevent the circuit of the semiconductor wafer 3 from being cut or short-circuited, and can maintain the high quality of the product. 17 200524059 In addition, since the supporting element 41 is plate-shaped, when it supports the semiconductor wafer 3, bending stress can be effectively reduced, and the semiconductor wafer 3 may not be damaged. The other actions and effects are as described in the first embodiment. 5 Figures 8A to C and Figure 9 show a third embodiment of the present invention. In this embodiment, as shown in Fig. 9, the release element 11A provided in the support 1 has an elongated plate shape along a predetermined direction of the opening 6 (in this case, the direction of one side of the semiconductor wafer 3). This peeling element 11A can be driven in a vertical direction by a driving source (not shown) and horizontally driven in a direction 10 crossing the predetermined direction. The tip of the peeling element 11A is preferably circular. The length of the peeling element 11A in the predetermined direction is preferably equal to the length of the one side of the semiconductor wafer 3. When the semiconductor wafer 3 is peeled from the adhesive sheet 2, the suction nozzle 4 is lowered from the raised position shown in FIG. 8A as shown in FIG. 8B, and the semiconductor wafer 3 is sucked, and the peeling element 11A is raised at the same time as 15, and is adhered through The sheet 2 contacts the lower surface of one end portion of the semiconductor wafer 3 with a predetermined pressure, and raises the semiconductor wafer 3 by, for example, about 0.5 mm. In this state, the peeling element 11A is driven in the direction shown by the arrow in FIG. 9 as shown in FIG. 8C. It moves from the 20th end which cross | intersects the predetermined direction of the said opening part 7 to the other end. Thereby, the adhesive sheet 2 on the lower surface of the semiconductor wafer 3 can be sequentially peeled from one end portion of the semiconductor wafer to the opposite end portion. Therefore, as in the first embodiment, the semiconductor wafer 3 can be easily picked up from the adhesive sheet 2 without damage. In addition, during the process of peeling the semiconductor wafer 3 from the adhesive sheet 2 in sequence by the peeling element 11A, 18 200524059, the semiconductor wafer 3 will not be displaced during the peeling process because the semiconductor wafer 3 is held by the suction nozzle 4. It can prevent poor welding accuracy. When using a voice coil motor as the Z drive source of the suction nozzle 4, gp lifts the semiconductor wafer 3 by the peeling element 11A, and also has the advantage that the pressure on the semiconductor wafer 3 5 does not change. . The above two advantages are the same as those of the first embodiment. Fig. 10 shows a fourth embodiment of the present invention. The separating element 11B of this embodiment is composed of a rod with a hemispherical tip, and can be driven by a driving source (not shown) in the Z direction and moving along a spirally rotating track in the horizontal direction. 10 The above-mentioned peeling element 11B is initially located below the corner of the semiconductor wafer 3 in the opening 6. When driven upward, the front end contacts the corner of the semiconductor wafer 3 through the adhesive sheet 2, and the corner is raised by about 1 mm. Then, the peeling element 11B is rotationally driven like a rectangular spiral as shown by the arrow in FIG. 10,-the surface lifts the adhesive sheet 2 on the lower surface of the semiconductor wafer 3, and the surface rubs 15 and moves from the peripheral portion to the center portion . Therefore, at this time, the semiconductor wafer 3 can be easily picked up from the adhesive sheet 2 by lifting up the release element 11B. In the above-mentioned first embodiment, by using the rocking element constituting the peeling element as if raised to a raised state, the front ends of the rocking elements project from the upper surface of the support by a predetermined height, and then the front ends of the pair of peeling elements u are moved in the closing direction The arc moves, but in the standby state, the front end of the pair of rocking elements is almost the same height as the upper surface of the support, that is, the height of the contact with the adhesive sheet. In this state, the front side of the pair of rocking elements is rounded in the closing direction. Arc motion is also possible. With this structure, at the same time as the arc movement is started, the front end of the pair of rocking elements 19 200524059 will protrude from the opening to the upper surface of the support and lift up the adhesive sheet on the back of the semiconductor wafer, which is the same as the first embodiment. Ground, semiconductor wafers can be picked up well. In the first and second embodiments, the shaking element 11 and the peeling element 11A are simultaneously moved in the predetermined direction, that is, in a direction perpendicular to one side of the semiconductor wafer 3, but they may not be perpendicular. In the first and second embodiments described above, the swinging element 11 for forming the peeling element is caused to perform an arc movement from the predetermined direction toward the center. However, as described in the third embodiment, a pair of The peeling element may be moved in parallel in the opposite direction 10. In the first and second embodiments described above, the width dimensions of the pair of rocking elements 11 are the same, but the width dimensions are different. For example, one side may be smaller than the other. The cam shaft 34 is used to move the drive shaft 23 up and down, but other driving sources such as an air cylinder may be used. In each embodiment, a heating mechanism such as a heater is provided on the peeling element, and the semiconductor wafer may be peeled off while heating the adhesive sheet. [Circumferential brief description] Fig. 1 is a structural diagram showing an outline 20 of a pickup device according to the first embodiment of the present invention. Figures 2A and B are longitudinal sectional views showing the pick-up device at 90-degree intervals in the circumferential direction. Figures 3A and B are plan views of the pick-up device showing the open state and the closed state of the front ends of a pair of rocking elements. 200524059 Figures 4A to C are diagrams for explaining the actions of a pair of shaking elements during picking. Fig. 5 is an explanatory diagram showing a state in which the adhesive sheet is peeled from the semiconductor wafer by a circular motion of a pair of rocking elements. 5 Fig. 6 is a sectional view showing a part of a pickup device according to a second embodiment of the present invention. Fig. 7 is an enlarged cross-sectional view showing a state where the semiconductor wafer is raised by the swinging element and the supporting element of the pickup device shown in Fig. 6. 8A to 8C are explanatory diagrams showing the operation of the pickup device according to the third embodiment of the present invention. FIG. 9 is an explanatory diagram showing the operation of the rocking element shown in FIG. 8. FIG. Fig. 10 is an explanatory diagram showing the operation of a swinging element according to a fourth embodiment of the present invention. [Representative symbol table of the main components of the figure] 1... 2. support 2.... Stick piece 3... Semiconductor wafer 4.... 6. nozzle 6.... Shaft 9 ... Long groove 10 ... Support unit 11 ... Swing element 200524059 IIA .. Peel element IIB ... Peel element 12a ... Recess 12b ... Protrusion 14a, 14b, 14c ... Ring groove 15 ... Connect Grooves 16a, 16b ... Suction holes 21 ... Closure elements 22 .... Insertion holes 23. Drive shafts (drive elements) 24 .. 0. Rings 25 .. Disks 26 ... Locking elements 27 ... 1st spring 28 ... 2nd spring 31 ... communication hole 32 ... suction pump 33 ... cam follower 34 ... cam 41 ... support element R ... area