TWI895229B - Glass substrate inspection system - Google Patents

Abstract

The present invention provides a glass substrate inspection system suitable for inspecting glass substrates before perforation. The technical features of the various subcomponents disclosed in this glass substrate inspection system significantly improve the reliability of subsequent processes for inspecting glass substrates before perforation, unlike conventional microscope inspection methods previously used.

Description

Glass substrate inspection system

This invention relates to glass inspection technology, and in particular to a system suitable for inspecting glass substrates before perforation.

Current inspection methods for pre-TGV (Through Glass Via) glass substrates prior to perforation (pre-TGV) typically involve laser-modifying the substrates before the perforation process. However, this conventional inspection method uses a traditional microscope. This significantly reduces measurement reliability, impacting the yield of subsequent processes, and often results in incomplete perforation, causing significant inconvenience for inspection personnel.

Therefore, how to effectively improve the inspection yield of glass substrates before the perforation process (Pre-TGV, Through Glass Via) is actually the urgent goal of this invention.

To address the issues described in prior art, the present invention provides a glass substrate inspection system suitable for inspecting pre-TGV (Through Glass Via) glass substrates before the perforation process. By utilizing the technical features of the various sub-components disclosed in this glass substrate inspection system, the system significantly improves the reliability of subsequent processes for inspecting pre-TGV glass substrates, unlike conventional microscope inspection methods used in prior art.

To achieve the above-mentioned purpose, the present invention provides a glass substrate detection system, which includes a microprocessor unit, a carrier unit, a first detection device and a second detection device; the microprocessor unit, the first detection device and the second detection device are respectively assembled in the carrier unit, and the carrier unit is provided with a backlight module and a backlight module polarizing plate matching the backlight module; wherein the microprocessor unit is respectively electrically connected to the first detection device and the second detection device. The carrier unit, the first detection device, and the second detection device are electrically controlled so that the first detection device and the second detection device correspond to a DUT placed on the carrier unit. The microprocessor unit includes a unit area pre-perforation detection logic for analyzing and calculating the image recognition of the DUT placed on the carrier unit and generating pre-perforation identification information for a unit area that has not undergone the perforation process.

The glass substrate inspection system disclosed in this invention, featuring the microprocessor's per-area pre-drilling inspection logic, the first inspection device, and the second inspection device, not only significantly improves the reliability of subsequent processes for glass substrates that have not undergone perforation, compared to conventional microscope inspection methods in prior art. Furthermore, if a pre-drilling process is detected, such as one that has not completed a specific process, this system allows inspection personnel to conduct a physical inspection, significantly improving yield.

1A: Glass Substrate Inspection System

2A: Glass substrate

10A: Microprocessor Unit

11A: Pre-punched roundness calculation logic

15A: Unit Area Pre-Punch Detection Logic

20A: Carrier unit

21A: Carrier

212A: Top

213A: Bottom

214A: Convex Wall

215A: Backlight module

216A: Backlight module polarizer

23A: Carrier slide rail assembly

25A: Support Arm

251A: First slide rail assembly

253A: Second slide rail assembly

255A: Base

30A: First detection device

31A: Camera Module

33A: First detection polarizer

40A: Second detection device

41A: Camera Module

43A: Second detection polarizer

50A: Power supply module

2r, 2s, 2t: Pre-punched

Figure 1 is a system architecture diagram of a preferred embodiment of the present invention, primarily illustrating a glass substrate inspection system suitable for glass substrates before undergoing a perforation process.

Figure 2 is a schematic three-dimensional diagram of some components of the glass substrate inspection system disclosed in Figure 1, primarily illustrating a glass substrate before being placed in front of the glass substrate inspection system and undergoing a perforation process.

Figure 3 is a schematic 3D diagram of some components similar to Figure 2, primarily illustrating the glass substrate before perforation, placed on a carrier unit of the glass substrate inspection system.

Figure 4 is a schematic three-dimensional diagram of some components similar to Figure 3, primarily showing the glass substrate before the perforation process and the carrier unit being advanced to a position to be inspected.

Figure 5 is a schematic three-dimensional diagram of some components similar to Figure 4 , primarily illustrating a first inspection device and a second inspection device of the glass substrate inspection system moving downward and approaching the top of the glass substrate before the perforation process.

FIG6 is a schematic front view similar to FIG5 , primarily illustrating the inspection status of the first inspection device and the second inspection device of the glass substrate inspection system after being lifted and moved away from the glass substrate before the perforation process.

Figure 7 is a schematic diagram of the glass substrate inspection system shown in Figure 6 , after the first and second inspection devices capture a plurality of pre-perforation image data of a portion of the glass substrate before the perforation process, and the microprocessor unit executes a unit area pre-perforation inspection logic operation.

The applicant first clarifies that throughout this specification, including the embodiments described below and the various claims in the patent application, directional terms are based on the orientation of the various figures listed in the [Simplified Description of the Figures] of this application. Furthermore, in the embodiments and figures described below, identical component numbers represent identical or similar components or structural features. Furthermore, the detailed structure, features, assembly, use, and manufacturing methods of the present invention will be described in the subsequent detailed description of the embodiments. However, those skilled in the art will understand that such detailed description and the embodiments listed herein are intended solely to support and illustrate that the present invention can be implemented and are not intended to limit the scope of the patent application.

Please refer to FIG. 1 and FIG. 2 , which are a glass substrate inspection system 1A disclosed in a preferred embodiment of the present invention, which is suitable for inspecting a glass substrate 2A before a perforation process (Pre-TGV, Through Glass Via). The glass substrate inspection system 1A includes a microprocessor unit 10A, a carrier unit 20A, a first inspection device 30A, a second inspection device 40A, and a power supply module 50A. The microprocessor unit 10A, the first inspection device 30A, the second inspection device 40A, and the power supply module 50A are respectively assembled on the carrier unit 20A; and the microprocessor unit 10A is respectively electrically connected and electrically controlled. The carrier unit 20A, the first detection device 30A, and the second detection device 40A are configured so that the first detection device 30A and the second detection device 40A correspond to the object to be tested placed on the carrier unit 20A, i.e., the glass substrate 2A after the perforation process in this embodiment. The power supply module 50A is electrically connected to and supplies the power required by the microprocessor 10A, the carrier unit 20A, the first detection device 30A, and the second detection device 40A.

Please refer to FIG1 again. The microprocessor 10A has a pre-punching true roundness calculation logic 11A and a unit area pre-punching detection operation logic 15A. The unit area pre-punching detection operation logic 15A is used to combine the operation of the pre-punching true roundness calculation logic 11A and analyze the image recognition operation logic of the object to be tested placed on the carrier unit 20A to generate a unit area of pre-punching discrimination information without the punching process. It is worth mentioning that the microprocessor of the preferred embodiment of the present invention The pre-drilled hole true circularity calculation logic 11A of the processing unit 10A is defined by the radial offset of the laser-modified pre-drilled hole profile relative to the ideal hole, that is, the difference between the maximum radius and the minimum radius relative to the same center of the circle. It is also worth mentioning that the unit area pre-drilled hole detection calculation logic 15A of the microprocessor unit 10A of the preferred embodiment of the present invention includes, but is not limited to, calculation logic using Fourier transform algorithms, sweep-line algorithms, kernel methods, or combinations thereof.

Please refer to Figures 1 to 5 together. The supporting unit 20A includes a plate-shaped carrier 21A, a carrier rail assembly 23A, and a support arm 25A that is substantially vertical and adjacent to the carrier rail assembly 23A. The plate-shaped carrier 21A has a light-transmissive top 212A and a bottom 213A corresponding to the top 212A. The top 212A of the carrier 21A is used to support the glass substrate 2A after the perforation process. Preferably, the top 212A of the carrier 21A has a plurality of spaced-apart arrangements. The protruding walls 214A allow the perforated glass substrate 2A to be supported on these walls. The bottom 213A of the carrier 21A is pivoted on the carrier rail assembly 23A, allowing the carrier 21A and the glass substrate 2A to slide back and forth along the track of the carrier rail assembly 23A. Furthermore, the carrier 21A is embedded with a backlight module 215A and a backlight module polarizer 216A that matches the backlight module 215A. Preferably, the backlight module 215A is closer to the bottom of the carrier 21A. 213A, the backlight module polarizer 216A is closer to the top 212A of the carrier 21A and transmits light in the direction of the top 212A of the carrier 21A; and the support arm 25A includes a first slide rail group 251A, a second slide rail group 253A and a base 255A. The first slide rail group 251A of the support arm 25A is arranged on the same side of the support arm 25A corresponding to the carrier slide rail group 23A, and the extension direction of the slide rail of the first slide rail group 251A is basically the same as the extension direction of the slide rail of the carrier slide rail group 23A. The second slide group 253A of the support arm 25A is pivoted on the first slide group 251A, and the slide extension direction of the second slide group 253A is basically cross-arranged with the slide extension direction of the first slide group 251A. The base 255A is pivoted on the second slide group 253A and can slide back and forth according to the track extension direction of the second slide group 253A. Preferably, the second slide group 253A and the base 255A can slide back and forth according to the track extension direction of the first slide group 251A. It is worth mentioning that the adjustable light source generated by the backlight module 215A of the carrier 21A of the carrier unit 20A is 1,000-20,000 cd/m², while the adjustable light source generated by the backlight module polarizer 216A is 500-10,000 cd/m².

Please refer to Figures 1 to 5 together. The first detection device 30A and the second detection device 40A are respectively mounted on the base 255A of the support arm 25A of the support unit 20A. In this way, the first detection device 30A and the second detection device 40A can slide back and forth according to the extension direction of the first slide rail assembly 251A of the support arm 25A of the support unit 20A, or The second slide rail assembly 253A of the support arm 25A of the carrier unit 20A can be reciprocated and slid in the extending direction of the rail. The first detection device 30A includes a camera module 31A and a first detection polarizer 33A mounted on the camera module 31A. The camera module 31A and the first detection polarizer 33A are both electrically connected and electrically controlled by the microprocessor unit 10A. The camera module 31A and the first detection polarizer 33A are substantially perpendicular and correspond to the direction of the platform slide assembly 23A of the carrier unit 20A. Preferably, the first detection polarizer 33A is arranged in front of the lens of the camera module 31A; and the second detection device 40A includes a camera module 41A and a second detection polarizer 43A arranged in the camera module 41A, and The camera module 41A and the second detection polarizer 43A are both electrically connected and electrically controlled by the microprocessor unit 10A. The camera module 41A and the second detection polarizer 43A are basically arranged at a predetermined tilt angle that is the same as the direction of the stage slide assembly 23A of the supporting unit 20A. Preferably, the second detection polarizer 43A is assembled in front of the lens of the camera module 41A. It is worth mentioning that the camera module 31A of the first detection device 30A and the camera module 41A of the second detection device 40A are basically an industrial camera (its model includes but is not limited to MBS2041POE [5m 5472 x 3648 pixels, 5.5fps], GigE [6M black and white 1/1.8"/5m 3072 x 2048 pixels], etc.) and an industrial camera lens (models including but not limited to FA lenses [LM12FC24M] and 1X telecentric lenses). The aforementioned technical features are readily apparent to those skilled in the art after considering the preferred embodiments of the present invention, and may simply involve simple substitutions and variations in model, quantity, or size. Therefore, they are not intended to limit the technical features claimed by the present invention and should be noted in advance.

The above describes the technical features of the glass substrate inspection system 1A and its various subcomponents disclosed in a preferred embodiment of the present invention. The following describes how the glass substrate inspection system 1A is used to inspect glass substrates 2A that have not undergone a through-glass via (TGV) process, and the desired effects achieved:

First, please refer to Figures 1 to 4. First, before the glass substrate detection system 1A is about to perform a detection operation, the microprocessor 10A of the glass substrate detection system 1A first generates an initial signal and transmits it electrically to the carrier unit 20A, the first detection device 30A, and the second detection device 40A. In this way, the carrier slide rail assembly 23A of the carrier unit 20A can push the carrier 21A according to the initial signal. When the first rail assembly 251A of the support arm 25A of the carrier unit 20A moves to a predetermined horizontal initial position away from the support arm 25A, the first rail assembly 251A of the support arm 25A will, based on the initial signal, simultaneously lift the second rail assembly 253A, the base 255A, the first detection device 30A, and the second detection device 40A to a predetermined vertical initial position away from the carrier rail assembly 23A. This allows the inspector to achieve a preliminary reset of the mechanism before conducting an inspection.

Secondly, please refer to Figures 1 to 5 together. Next, when the pre-TGV (Through Glass Via) glass substrate 2A is stably placed on the ridges 214A of the top 212A of the carrier 21A of the carrier unit 20A, the microprocessor 10A of the glass substrate inspection system 1A generates a test signal and electrically transmits it to the carrier unit 20A, the first inspection device 30A, and the second inspection device 40A. This allows the carrier rail assembly 20A of the carrier unit 20A to be tested. 3A can slide the carrier 21A, the backlight module 215A and the backlight module polarizer 216A embedded in the carrier 21A, and the glass substrate 2A placed on the ridges 214A of the carrier 21A steadily from the predetermined horizontal initial position to a predetermined position to be tested near the bottom of the support arm 25A according to the test signal. At the same time, the support arm 25A of the carrier unit 20A will also be The first slide rail assembly 251A can simultaneously lower the second slide rail assembly 253A, the base 255A, the first detection device 30A, and the second detection device 40A from the predetermined vertical initial position to a predetermined height to be measured from the glass substrate 2A placed on the ridges 214A of the carrier 21A according to the signal to be measured. Preferably, the camera lens of the camera module 31A of the first detection device 30A is The predetermined vertical distance between the first detection polarizer 33A in front of the camera lens and the glass substrate 2A is between 10 mm and 220 mm. This also ensures that the predetermined vertical distance between the second detection polarizer 43A in front of the camera lens of the second detection device 40A and the glass substrate 2A is between 10 mm and 220 mm. This allows the entire glass substrate inspection system 1A to achieve pre-inspection alignment.

Third, please refer to Figures 1 to 7 together. When the microprocessor 10A of the glass substrate detection system 1A generates a glass substrate detection signal and transmits it electrically to the carrier unit 20A, the first detection device 30A, and the second detection device 40A, the first slide rail assembly 251A and the second slide rail assembly 253A of the support arm 25A of the carrier unit 20A both move the first detection device 30A again according to the glass substrate detection signal until the camera lens of the camera module 31A of the first detection device 30A and the first detection polarizer 33A arranged in front of the camera lens and the camera lens of the camera module 41A of the second detection device 40A are aligned. The vertical detection distance between the lens and the second detection polarizer 43A assembled in front of the lens and the glass substrate 2A is between 30mm and 200mm. The lens of the camera module 41A of the second detection device 40A and the second detection polarizer 43A assembled in front of the lens form a predetermined detection angle between 20 degrees and 70 degrees with the glass substrate 2A. At this time, the camera module 31A of the first detection device 30A and the camera module 41A of the second detection device 40A respectively capture a plurality of pre-punched image data on the glass substrate 2A (in this embodiment, the data is basically The above is composed of text, images, multimedia videos or their combination) and is electrically transmitted to the microprocessor 10A, so that the microprocessor 10A executes the technical features of the pre-punching true roundness calculation logic 11A and the unit area pre-punching detection calculation logic 15A at the same time. In this way, the unit of the microprocessor 10A is The area pre-perforation detection operation logic 15A may be based on the image data of the plurality of non-perforated image data on the glass substrate 2A captured by the camera module 31A of the first detection device 30A, the first detection polarizer 33A and the camera module 41A of the second detection device 40A, and the second detection polarizer 43A. After the calculation, pre-hole discrimination information for a unit area that has not undergone a perforation process is generated (including but not limited to relevant information of any pre-hole on the glass substrate 2A after the laser modification process) and displayed by a display device electrically connected to an external device. As shown in FIG7 , for the local pre-holes 2r, 2s, and 2t on the glass substrate 2A, the microprocessor 10A of the glass substrate inspection system 1A executes the pre-hole true roundness calculation logic 11A and the unit area pre-hole detection operation logic 15A to obtain the following relevant discrimination information: (a) the pre-hole 2r is determined to have been successfully processed; and (b) the pre-holes 2s and 2t are determined to have been unsuccessful. In summary, the glass substrate inspection system 1A not only significantly improves the reliability of subsequent processes for glass substrates that have not undergone perforation processing, unlike previous inspection methods, but also effectively enables inspection personnel to detect if pre-perforation 2s or 2t, for example, has not completed a specific process, thereby significantly improving yield.

Fourthly, please refer to FIG. 1 to FIG. 6 . Finally, when the glass substrate detection system 1A completes the aforementioned detection operations, the microprocessor 10A of the glass substrate detection system 1A first generates a reset signal and transmits it electrically to the carrier unit 20A, the first detection device 30A, and the second detection device 40A. In this way, the carrier slide rail assembly 23A of the carrier unit 20A can move the carrier 21 according to the reset signal. A is pushed forward again to the predetermined horizontal initial position away from the support arm 25A. This also causes the first rail assembly 251A of the support arm 25A of the carrier unit 20A to simultaneously lift the second rail assembly 253A, the base 255A, the first detection device 30A, and the second detection device 40A to the predetermined vertical initial position away from the carrier rail assembly 23A based on the reset signal. This allows the inspector to reset the mechanism after performing the inspection.

1A: Glass Substrate Inspection System

10A: Microprocessor Unit

11A: Pre-punched roundness calculation logic

15A: Unit Area Pre-Punch Detection Logic

20A: Carrier unit

30A: First detection device

40A: Second detection device

50A: Power supply module

Claims (10)

A glass substrate detection system comprises: a microprocessing unit (10A), a carrier unit (20A), a first detection device (30A) and a second detection device (40A); wherein the microprocessing unit (10A), the first detection device (30A) and the second detection device (40A) are respectively assembled in the carrier unit (20A), and the carrier unit (20A) is provided with a backlight module (215A) and a backlight module polarizing plate (216A) matching the backlight module (215A); wherein the microprocessing unit (10A) is respectively electrically connected to and electrically controls the carrier unit (20A), the first detection device (30A) and the second detection device (40A); 0A) and the second detection device (40A), so that the first detection device (30A) and the second detection device (40A) respectively correspond to an object to be detected placed on the carrier unit (20A); wherein the microprocessor unit (10A) has a pre-punching true roundness calculation logic (11A) and a unit area pre-punching detection operation logic (15A), and the unit area pre-punching detection operation logic (15A) is used to combine and calculate the pre-punching true roundness calculation logic (11A) and to analyze and calculate the image recognition generated by the object to be detected placed on the carrier unit (20A) and generate pre-punching identification information within a unit area that has not undergone a punching process. A glass substrate inspection system as described in claim 1, wherein the supporting unit (20A) includes a plate-shaped carrier (21A), a carrier slide assembly (23A), and a support arm (25A) that is substantially vertical and adjacent to the carrier slide assembly (23A), and the carrier (21A) is pivoted on the carrier slide assembly (23A) so that the object to be inspected placed on the carrier (21A) can slide back and forth according to the track direction of the carrier slide assembly (23A). A glass substrate inspection system as described in claim 2, wherein the carrier (21A) of the supporting unit (20A) has a top (212A) and a bottom (213A) corresponding to the top (212A); wherein the top (212A) of the carrier (21A) is provided with a plurality of spaced-apart protrusions (214A) so that the object to be tested can be carried on the protrusions (214A); and the bottom (213A) of the carrier (21A) is used to pivot on the carrier slide assembly (23A) so that the object to be tested placed on the carrier (21A) can slide back and forth according to the track direction of the carrier slide assembly (23A). The glass substrate inspection system as described in claim 3, wherein the support arm (25A) of the supporting unit (20A) includes a first slide rail group (251A), a second slide rail group (253A) and a base (255A), the first slide rail group (251A) is arranged on the same side of the support arm (25A) as the carrier slide rail group (23A), the second slide rail group (253A) is pivotally mounted on the first slide rail group (251A), and the slide rail extension direction of the second slide rail group (253A) is arranged crosswise with the first slide rail group (251A), and the base (255A) is pivotally mounted on the second slide rail group (253A); wherein, The second slide rail assembly (253A) and the base (255A) can perform reciprocating sliding motion according to the track extension direction of the first slide rail assembly (251A). A glass substrate inspection system as described in claim 4, wherein the first inspection device (30A) and the second inspection device (40A) are respectively installed on the base (255A) of the supporting arm (25A) of the supporting unit (20A). A glass substrate inspection system as described in claim 2, wherein the support arm (25A) of the supporting unit (20A) comprises a first slide rail group (251A), a second slide rail group (253A) and a base (255A), wherein the first slide rail group (251A) is arranged on the same side of the support arm (25A) as the carrier slide rail group (23A), the second slide rail group (253A) is pivotally mounted on the first slide rail group (251A), and the slide rail extension direction of the second slide rail group (253A) is arranged crosswise with the first slide rail group (251A), and the base (255A) is pivotally mounted on the second slide rail group (253A); wherein, The second slide rail assembly (253A) and the base (255A) can perform reciprocating sliding motion according to the track extension direction of the first slide rail assembly (251A). A glass substrate inspection system as described in claim 6, wherein the first inspection device (30A) and the second inspection device (40A) are respectively installed on the base (255A) of the supporting arm (25A) of the supporting unit (20A). A glass substrate inspection system as described in any one of claims 1 to 7, wherein the pre-punching discrimination information within a unit area that has not undergone a punching process, generated by the unit area pre-punching detection logic (15A) of the microprocessor unit (10A) in combination with the pre-punching true roundness calculation logic (11A), includes the pre-punching state of any pre-punching after a laser modification process. A glass substrate inspection system as described in any one of claims 1 to 7, wherein the first inspection device (30A) includes a camera module (31A) and a first detection polarizer (33A) arranged in front of the camera module (31A), both of which are electrically connected to and electrically controlled by the microprocessor unit (10A), and the camera module (31A) and the first detection polarizer (33A) are perpendicular and correspond to the object to be inspected placed on the supporting unit (20A). A glass substrate inspection system as described in any one of claims 1 to 7, wherein the second inspection device (40A) includes a camera module (41A) and a second detection polarizer (43A) arranged in front of the camera module (41A), both of which are electrically connected and electrically controlled by the microprocessor unit (10A), and the camera module (41A), the second detection polarizer (43A) and the object to be inspected placed on the supporting unit (20A) are all arranged at a predetermined tilt angle in the same direction.