TWI892221B - Heat dissipating system and manufacturing method thereof - Google Patents

Abstract

The invention relates to a heat dissipating system and manufacturing method thereof. The heat dissipating system includes a vapor chamber and a heat pipe. The vapor chamber includes an upper plate, a lower plate and a first chamber. The edge faces the first chamber, and the inner wall of the first chamber includes a first capillary structure; the heat pipe includes a tube body, and the tube body includes a closed end and a flared end, and the inner wall of the heat pipe includes a second capillary structure; wherein, the flared end and the flange pass through the interference fit forms a tight fit connection, and the first chamber communicates with the second chamber.

Description

Heat dissipation system and manufacturing method thereof

This case relates to a heat dissipation system and its manufacturing method, particularly a heat dissipation system and its manufacturing method that can improve heat dissipation efficiency.

With the advancement of technology, the heat dissipation standards for electronic devices are becoming increasingly stringent. Common electronic devices such as personal computers, servers, and gaming laptops have significantly different cooling requirements than before. Conventional cooling systems, such as traditional vapor chambers (2D vapor chambers), are no longer able to meet the cooling requirements of these advanced devices. Therefore, 3D vapor chambers have been developed to improve heat dissipation efficiency.

Conventional 3D vapor chambers typically consist of heat pipes and a vapor chamber. Simply punching holes in the vapor chamber allows the heat pipes and the vapor chamber to be joined together via welding. This traditional welding method, combining two metal parts, lacks structural strength and provides an inadequate fit, which can impact the yield and durability of the overall cooling system. Inaccurate welding techniques can further compromise the efficient circulation of the working fluid within the 3D vapor chamber. The authors of this project believe this approach warrants improvement.

In view of the shortcomings of the prior art, this application proposes a solution, which relates to a heat dissipation system comprising a vapor chamber and a heat pipe. The vapor chamber comprises an upper plate, a lower plate, and a first chamber. The upper plate has a first inner wall, and the lower plate has a second inner wall. The first chamber is formed by the upper and lower plates, and the first and second inner walls within the first chamber include a first capillary structure. The upper plate includes an opening with a flange facing the first chamber.

The heat pipe includes a body having a third inner wall, a closed end, and a flared end. The heat pipe is hollow, and the third inner wall and the closed end define a second chamber. The third inner wall within the second chamber includes a second capillary structure. The flared end and the flange form an interference fit to form a tight connection, and the first chamber communicates with the second chamber.

When the heat pipe is joined to the vapor chamber, the flange of the upper plate's opening creates an interference fit with the expanded end of the heat pipe, creating a tight connection between the first and second chambers. This provides a strong tight fit, high product yield, excellent durability, low processing costs, and light weight. The interference fit is superior to welding, while maintaining a smooth inner surface, further enhancing the circulation efficiency of the working fluid in the two chambers.

In one embodiment, the closed end has a first diameter, the expanded end has a second diameter, and the first diameter is smaller than the second diameter.

In one embodiment, the opening has an inner diameter that is greater than or equal to the first tube diameter.

In one embodiment, the inner diameter is equal to the first tube diameter.

In one embodiment, the first capillary structure and the second capillary structure are powder sintered bodies.

This case also proposes a method for manufacturing a heat dissipation system, comprising: providing an upper plate, forming a first capillary structure on a first surface of the upper plate; performing a punching process on the upper plate to form an opening, and extending from the first surface to form a flange surrounding the opening; providing a heat pipe, comprising a tube body with one end closed and a flared end, and a tube cavity formed by the tube body and the flared end; forming a second capillary structure on the tube body and the flared end in the tube cavity; the tube body is closed at one end and the flared end is closed at one end. Pass the flange through the opening until the expanded end is stopped by the flange; provide a support template below the first surface of the upper plate to support the outer side of the flange in the tightening direction, wherein the tightening direction is parallel to the upper plate; apply pressure to the flange to create an interference fit between the expanded end and the flange, forming a tight connection in the tightening direction; provide a lower plate, and form a first capillary structure on the second surface of the lower plate; align the first surface with the second surface, and then join the upper and lower plates.

In one embodiment, the closed end of the tube body has a first diameter, the expanded end has a second diameter, and the first diameter is smaller than the second diameter.

In one embodiment, the opening has an inner diameter that is greater than or equal to the first tube diameter.

In one embodiment, the inner diameter is equal to the first tube diameter.

In one embodiment, the first capillary structure and the second capillary structure are powder sintered bodies.

1: Heat dissipation system

10: Vapor chamber

100:on board

1000: First inner wall

1002: Opening

1004: Flange

102: Lower the board

1020: Second inner wall

104: First Chamber

11: First capillary structure

12: Heat pipe

120: Tube body

1200: Third inner wall

1202: Closed end

1204: Expansion port

122: Second Chamber

13: Second capillary structure

D1: First diameter

D2: Second diameter

d1: Inner diameter

A~I: steps

Figure 1 is a partial schematic diagram of an embodiment of the heat dissipation system of this case.

Figure 2 is a schematic diagram of an embodiment of the heat pipe in this case.

Figure 3 is a schematic diagram of an embodiment of the heat dissipation system of this case.

Figure 4 is a schematic diagram of the manufacturing process of the heat dissipation system according to an embodiment of the present invention.

Please refer to FIG. 1 and FIG. 3 . As shown in the figures, the present invention relates to a heat dissipation system 1 , which includes a temperature vapor chamber 10 and at least one heat pipe 12 . The number of the heat pipe 12 can be single or multiple. The temperature distribution plate 10 includes an upper plate 100 and a lower plate 102. The upper plate 100 and the lower plate 102 can be combined to form a space, which is a first chamber 104. The upper plate 100 has two sides, one of which is a first inner wall 1000. The lower plate 102 also has two sides, one of which is a second inner wall 1020. When the upper plate 100 and the lower plate 102 form the first chamber 104, the first inner wall 1000 is partially opposite to and partially connected to the second inner wall 1020. The first inner wall 1000 and the second inner wall 1020 in the first chamber 104 include a first capillary structure 11. More specifically, the first capillary structure 11 is attached to the first inner wall 1000 and the second inner wall 1020. The upper plate 100 further includes at least one opening 1002. The number of openings 1002 can range from one to several, and each opening 1002 has a flange 1004. In this embodiment, the shape of the openings 1002 is not particularly limited; for example, they can be circular or square. Each flange 1004 extends from each opening 1002 and faces the first chamber 104. In other words, the flange 1004 of the opening 1002 extends inward (toward the first chamber 104).

Please refer to Figures 1 and 3. As shown in the figures, each heat pipe 12 includes a tube body 120 having a third inner wall 1200. More specifically, the third inner wall 1200 exists within the tube body 120. The tube body 120 is a long hollow tube with a closed end 1202 and an expanded end 1204. The closed end 1202 and the expanded end 1204 are opposite to each other. Because each heat pipe 12 is hollow, a second chamber 122 is formed by the third inner wall 1200 and the closed end 1202. In other words, the second chamber 122 is the hollow portion of the heat pipe 12. The third inner wall 1200 within the second chamber 122 contains the second capillary structure 13. Specifically, the second capillary structure 13 exists on the third inner wall 1200 within the hollow portion of the heat pipe 12. When the vapor chamber 10 is combined with each heat pipe 12, a tight connection is achieved through an interference fit between the expanded end 1204 of each heat pipe 12 and the flange 1004 of each opening 1002 of the upper plate 100. Furthermore, the first chamber 104 is connected to the second chamber 122, creating a larger fluid space.

Please refer to Figure 2, which is a schematic diagram of an embodiment of the heat pipe 12 of this invention. As shown in the figure, the closed end 1202 has a first diameter D1, and the expanded end 1204 has a second diameter D2. The first diameter D1 is smaller than the second diameter D2. In other words, the heat pipe 12 forms a tube body 120 with one side thicker and the other side thinner. In some embodiments, as shown in Figure 2, the diameter of the tube body 120 can change linearly or gradually.

Please continue to refer to Figures 1 to 3. As shown in the figures, each opening 1002 has an inner diameter d1, and the length of the inner diameter d1 is greater than or equal to the first diameter D1 of the heat pipe 12. That is, when the inner diameter d1 is greater than the first diameter D1, the closed end 1202 of the heat pipe 12 can pass through the opening 1002; when the inner diameter d1 is equal to the first diameter D1, the closed end 1202 of the heat pipe 12 will interfere with the flange 1004. However, by applying an external force, the heat pipe 12 can still pass through the opening 1002. In addition, since the second tube diameter D2 is larger than the first tube diameter D1, when the heat pipe 12 passes through the opening 1002, the expansion end 1204 will interfere with the flange 1004, forming a stop. Furthermore, at this time, the first tube diameter D1 is smaller than the second tube diameter D2, and the second tube diameter D2 is greater than or equal to the inner hole diameter d1, forming the first tube diameter D1 < second tube diameter D2 Inner diameter d1.

Please refer to Figures 1 to 3 . As shown, the first capillary structure 11 and the second capillary structure 13 are powder sintered bodies, preferably metal powder sintered bodies, with copper powder sintered bodies being the most preferred. In another embodiment, the first capillary structure 11 and the second capillary structure 13 may also be metal woven mesh, composite metal mesh (powder sintered body plus metal woven mesh), etc.

In summary, when the heat pipe 12 is joined to the vapor chamber 10, the flange 1004 of the opening 1002 of the upper plate 100 and the expanded end 1204 of the heat pipe 12 form an interference fit, thereby connecting the first chamber 104 and the second chamber 122. This provides a good tight fit, high product yield, excellent durability, low processing cost, and light weight. The interference fit is superior to welding, and the inner surface remains smooth, further enhancing the circulation efficiency of the working fluid in the two chambers.

Please refer to FIG4, which is a schematic flow chart of an embodiment of a manufacturing method of a heat dissipation system of the present invention. As shown in the figure, the manufacturing method of a heat dissipation system proposed in the present invention includes the following steps A to I: Step A: providing an upper plate, forming a first capillary structure on a first surface of the upper plate; Step B: performing a punching process on the upper plate to form at least one opening, and extending from the first surface to form a flange surrounding the opening; Step C: providing at least one heat pipe, each heat pipe including a tube body with one end closed, a flared end, and a tube cavity formed by the tube body and the flared end; Step D: the tube body and the tube cavity are formed in the tube cavity. A second capillary structure is formed at the flared end; Step E: The tube body is passed through the opening from one sealed end until the flared end is stopped by the flange; Step F: A support template is provided below the first surface of the upper plate to support an outer side of the flange in a tightening direction, wherein the tightening direction is parallel to the upper plate; Step G: Pressurizing the flange to create an interference fit between the flared end and the flange, forming a tight connection in the tightening direction; Step H: A lower plate is provided, and the first capillary structure is formed on a second surface of the lower plate; Step I: Aligning the first surface with the second surface and joining the upper and lower plates.

The closed end of the tube body has a first tube diameter, and the expanded end of the tube body has a second tube diameter, and the first tube diameter is smaller than the second tube diameter. The opening has an inner diameter, and the inner diameter is greater than or equal to the first tube diameter. Since the expanded end will have an interference fit with the flange, each inner diameter is preferably equal to the first tube diameter. Further explaining, each opening has an inner diameter, and the length of the inner diameter is greater than or equal to the first tube diameter of the heat pipe, that is, when the inner diameter is greater than the first tube diameter, the closed end of the heat pipe can pass through the opening; when the inner diameter is equal to the first tube diameter, the closed end of the heat pipe will interfere with the flange, but the heat pipe can still pass through the opening by applying an external force. In addition, since the second tube diameter is larger than the first tube diameter, when the heat pipe passes through the opening, the expansion end will interfere with the flange and form a stop. Furthermore, at this time, the first tube diameter is smaller than the second tube diameter, and the second tube diameter is greater than or equal to the inner hole diameter, forming the first tube diameter < second tube diameter. inner pore diameter.

It is particularly noted that the first and second capillary structures are powder sintered bodies, preferably metal powder sintered bodies, with copper powder sintered bodies being the most preferred. In another embodiment, the first and second capillary structures may also be metal woven meshes, composite metal meshes (powder sintered body plus metal woven mesh), etc.

To further clarify, the openings formed by the aforementioned punching process can be circular, square, or any other shape. Furthermore, the heat pipes to be coupled should also have corresponding shapes.

In summary, when the heat pipe and vapor chamber are joined, the flanged opening on the upper plate creates an interference fit with the expanded end of the heat pipe, creating a tight connection between the first and second chambers. This provides a strong tight fit, high product yield, excellent durability, low processing costs, and light weight. The interference fit is superior to welding, while maintaining a smooth inner surface, further enhancing the circulation efficiency of the working fluid in the two chambers.

In summary, this case does meet the requirements for industrial applicability. Furthermore, the invention had not appeared in publications or been publicly used prior to the application, nor was it known to the public. Furthermore, it possesses non-obviousness, thus meeting the patent eligibility requirements. Therefore, a patent application has been filed in accordance with the law. However, the above description serves as a preferred embodiment of the industry in this case. Any equivalent variations based on the scope of the patent application in this case fall within the scope of the claimed subject matter.

100: Upper plate 1000: First inner wall 1002: Opening 1004: Flange 12: Heat pipe 120: Pipe body 1200: Third inner wall 1202: Closed end 1204: Expanded end 122: Second chamber

Claims (9)

A heat dissipation system comprises: A heat spreader plate comprising an upper plate, a lower plate, and a first chamber, the upper plate having a first inner wall, the lower plate having a second inner wall, the first chamber being formed by the upper and lower plates, and the first and second inner walls within the first chamber comprising a first capillary structure. The upper plate comprises at least one opening, each opening comprising a flange, each flange facing the first chamber; At least one heat pipe, each heat pipe comprising a tube body having a third inner wall, a closed end, and a flared end. The heat pipe is hollow, and a second chamber is formed by the third inner wall and the closed end. The third inner wall within the second chamber comprises a second capillary structure. The flared end and the flange form an interference fit to form a tight connection, and the first chamber communicates with the second chamber. The closed end has a first diameter, and the flared end has a second diameter, with the first diameter being smaller than the second diameter. A heat dissipation system as described in claim 1, wherein each of the openings has an inner pore diameter, and the inner pore diameter is greater than or equal to the first tube diameter. A heat dissipation system as described in claim 2, wherein the inner diameter of each hole is equal to the first tube diameter. The heat dissipation system as described in claim 1, wherein the first capillary structure and the second capillary structure are powder sintered bodies. A method for manufacturing a heat dissipation system comprises: Providing a top plate, forming a first capillary structure on a first surface of the top plate; Perforating the top plate to form at least one opening, and extending from the first surface to form a flange surrounding the opening; Providing at least one heat pipe, each heat pipe comprising a tube body with one closed end, a flared end, and a tube cavity formed by the tube body and the flared end; Forming a second capillary structure within the tube cavity between the tube body and the flared end; Passing the tube body from the closed end through the opening until the flared end is stopped by the flange; A supporting template is provided below the first surface of the upper plate to support an outer side of the flange in a tightening direction, wherein the tightening direction is parallel to the upper plate. Pressure is applied to the flange to create an interference fit between the flared end and the flange, forming a tight connection in the tightening direction. A lower plate is provided, and the first capillary structure is formed on a second surface of the lower plate. The upper and lower plates are then joined together with the first surface facing the second surface. The manufacturing method of the heat dissipation system as described in claim 5, wherein the closed end of the tube body has a first tube diameter, the expanded end has a second tube diameter, and the first tube diameter is smaller than the second tube diameter. A method for manufacturing a heat dissipation system as described in claim 6, wherein each of the openings has an inner pore diameter, and the inner pore diameter is greater than or equal to the first tube diameter. A method for manufacturing a heat dissipation system as described in claim 7, wherein the diameter of each inner hole is equal to the first tube diameter. The manufacturing method of the heat dissipation system as described in claim 8, wherein the first capillary structure and the second capillary structure are powder sintered bodies.