TWM638398U - 3D vapor chamber - Google Patents

Abstract

The invention creates a 3D uniform temperature plate, which includes a uniform temperature plate and at least one pipe body. The uniform temperature plate has an upper plate cover and a lower plate. The upper plate is provided with at least one opening through the upper plate. The upper plate It is covered with the lower plate and jointly defines a plate-shaped chamber communicating with openings. A working fluid and a capillary structure are arranged in the plate-shaped chamber inside the upper plate and the lower plate. The two ends of the tube are respectively It has a closed end and an open end, and the open end expands outward to form a trumpet-shaped lip connected to the inner side of the upper plate, the closed end penetrates the opening on the inner side of the upper plate and protrudes outward, and The closed end and the open end jointly define a tubular chamber that communicates with the open end and the plate-shaped chamber, and a plurality of grooves are arranged on the inside of the tubular chamber and the lip, and the grooves of the lip are connected with the lip. The capillary structure inside the upper plate is in contact with each other, so as to increase the return flow rate of the working fluid and improve the heat dissipation performance.

Description

3D vapor chamber

This creation relates to a 3D uniform temperature plate, especially a 3D uniform temperature plate that can increase the return flow rate of working fluid and improve the heat dissipation performance.

With the improvement of customers' heat dissipation requirements for electronic equipment (such as computers or servers), a 3D uniform temperature panel (3D VC) has been developed, which is more integrated than the traditional two-dimensional uniform temperature panel. Higher efficiency, higher vapor diffusion efficiency, smaller thermal resistance and higher heat dissipation limit. However, as the integration of electronic devices such as chips increases, the demand for heat dissipation increases. The heating power of high-power CPUs can reach at least 300W, so that conventional heat pipes and/or vapor chambers can no longer meet the heat dissipation requirements of such high heat flux. 3D vapor chamber gradually replaces single heat pipe and/or vapor chamber, and is widely used in the field of electronic heat dissipation. Please refer to Fig. 1, the existing 3D vapor chamber 1 is assembled by a plurality of heat pipes 11 and a vapor chamber 12 composed of an upper plate 121 and a lower plate 122, wherein the vapor chamber 12 has a uniform temperature A plate chamber 123, the chamber 123 is provided with a working fluid and a capillary structure 124 is located on the inner wall of the chamber 123, and the upper plate 121 is provided with a plurality of openings 1211 through the upper Plate 121, the openings 1211 are connected to the chamber 123 of the chamber, and a plurality of protrusions 1213 protrude from the outside of the upper plate 121, each protrusion 1213 is located along the periphery of each opening 1211 of the upper plate 121 Protrude upward. Each heat pipe 11 has a closed end 111 and an upright open end 112, the open end 112 and the closed end 111 jointly define a heat pipe chamber 113, the inner wall of the heat pipe chamber 113 forms a heat pipe capillary structure 114, and the opening end 112 of the heat pipe 11 is inserted into the opening 1211 of the upper plate 121, so that the outside of the opening end 112 is combined with the inside of the convex body 1213 to be fixed. Although the existing 3D vapor chamber 1 can meet the demand for high heat flux, another problem arises, that is, whether the heat pipe capillary structure 114 installed in the heat pipe chamber 113 of the commonly used heat pipe 11 is sintered powder or braided mesh The thickness of the capillary structure will compress the space in the heat pipe chamber 113 due to being too thick (that is, the vapor space is reduced), causing the vapor working fluid in the chamber 123 to flow into the heat pipe chamber 113 The resistance to vapor flow increases, causing slowing of the vapor-liquid cycle efficiency. In addition, when the open end 112 of each heat pipe 11 is plugged into the opening 1211 of the upper plate 121, it mainly connects with the outer side of the corresponding heat pipe 11 through the inner side of the convex body 1213 of the upper plate 121, but because each The joint area between the heat pipe 11 and the convex body 1213 of the upper plate 121 is small and insufficient, resulting in insufficient and unstable joint strength between the heat pipe 11 and the upper plate 121 of the vapor chamber 12, making it easy to manufacture and assemble the heat pipe 11. The collision caused the heat pipe to fall off and damage the vapor chamber, which in turn caused the failure of the overall heat dissipation performance of the 3D vapor chamber. Moreover, the capillary structure 114 of the heat pipe close to the opening 112 is blocked (blocked) by the wall of the heat pipe 11 itself and the bottom surface of the opening 112 is not provided with any capillary structure, so that the capillary structure 114 of the heat pipe and the capillary inside the upper plate 121 The structures 124 are disconnected and not in contact with each other, so that the working fluid condensed in the heat pipe chamber 113 cannot circulate and diffuse to the capillary structure 124 inside the upper plate 121, resulting in the opening end of the heat pipe 11 The condensed working fluid 16 condensed at 112 can only drip back slowly, and then flow back to the evaporation zone 14 of the vapor chamber 12. However, due to the slow return speed of the working fluid, it is easy to cause insufficient working fluid in the evaporation zone, resulting in dry burning and Problems such as poor cooling performance or failure.

In order to improve the above problems, the main purpose of this creation is to provide a 3D vapor chamber that can increase the return flow rate of the working fluid, improve the heat dissipation efficiency and stabilize the overall structure. In order to achieve the above purpose, the invention provides a 3D uniform temperature plate, including: a uniform temperature plate has an upper plate and a lower plate, the upper plate is provided with at least one opening that runs through the upper plate, and the upper plate and the lower plate The lower plates cover each other and jointly define a plate-shaped chamber that communicates with the opening. A working fluid and a capillary structure are arranged in the plate-shaped chamber on the inner side of the upper plate and the lower plate; at least one pipe body and two Each end has a closed end and an open end, and the open end expands outwards to form a trumpet-shaped lip that connects with the inner side of the upper plate, and the closed end passes through the opening on the inner side of the upper plate and Extending outward, and the closed end and the open end jointly define a tubular chamber that communicates with the open end and the plate-shaped chamber, and a plurality of grooves are provided on the inner side of the tubular chamber and the lip, the The groove of the lip is in contact with the capillary structure inside the upper plate. In this invention, the groove of the lip of the pipe body is in contact with the capillary structure inside the upper plate or overlapped (overlapped), which not only accelerates the return flow rate of the working fluid and increases the space (vapor space) of the tubular chamber , thereby improving the cooling performance. In addition, due to the trumpet-shaped (funnel-shaped) design of the lip at the opening end of the tube body, it has a larger bonding area and can be more closely combined with the inner side of the upper plate, thereby enhancing the connection between the tube body and the vapor chamber. Combine strength.

The above-mentioned purpose of this creation and its structural and functional characteristics will be described according to the preferred embodiments of the accompanying drawings. This creation provides a 3D vapor chamber 2, please refer to Figures 2A, 2B, and 2C. The 3D vapor chamber 2 includes a vapor chamber 21 and at least one pipe body 22. The vapor chamber 21 has an upper plate 211 and a lower plate 212. The upper plate 211 is provided with at least one opening 2111. In this embodiment The opening 2111 is a plurality of openings 2111 arranged at intervals on the upper plate 211, each opening 2111 penetrates from the outer side of the upper plate 211 to the inner side of the upper plate 211, and is on the inner side of the upper plate 211 corresponding to each opening 2111 A groove 2112 is provided on the periphery of the opening 2111, and a protruding body 2113 protrudes upward (one side) from the periphery of the opening 2111 on the outer side of the upper plate 211 corresponding to each opening 2111. The upper plate 211 and the lower plate 212 cover each other to define a plate-shaped cavity 213 communicating with the openings 2111 . A working fluid and a capillary structure 214 are provided inside the plate-shaped chamber 213, and are provided on the inner sides of the upper plate 211 and the lower plate 212, and the capillary structure 214 inside the upper plate 211 is provided with at least one through hole corresponding to the opening 2111. 2141 communicates with the opening 2111 of the upper plate 211 and the plate-shaped cavity 213 . And the capillary structure 214 inside the upper and lower plates 211, 212 of the plate-shaped chamber 213 is a different capillary structure, that is, the capillary structure 214 inside the upper plate 211 is a metal braided mesh (such as a copper mesh), and the lower The capillary structure 214 inside the plate 212 is a powder sintered body. But not limited thereto, the capillary structure 214 inside the upper and lower plates 211, 212 of the plate-shaped chamber 213 can also be selected as the same capillary structure (such as metal braided mesh (such as copper mesh), groove, powder sintered body, or any combination of the foregoing). In this embodiment, the pipe body 22 is a plurality of heat pipes, which are set in accordance with the number of openings 2111 of the upper plate 211 . Each tube body 22 has a closed end 221 and an open end 222, which are respectively located at the two ends of the tube body 22, and the open end 222 expands outward to form a lip 223 in a trumpet shape (or funnel shape), and The closed end 221 of the tubular body 22 and the open end 222 jointly define a tubular chamber 224 which communicates with the open end 222, and a plurality of grooves 225 are arranged inside the tubular chamber 224 and the lip 223, the tubular The grooves 225 of the chamber 224 and the lip 223 are arranged on non-colinear lines and connected to each other, that is, the grooves 225 arranged axially on the inner side of the tubular chamber 224 are in contact with the inner radial direction of the lip 223. The grooves 225 are set. Referring back to Figures 2A, 2B, and 2C, the lip 223 of each pipe body 22 is in contact with the inner side of the upper plate 211 of the uniform temperature plate 21, that is, the closed end 221 of each pipe body 22 runs through the inner side of the upper plate 211 The opening 2111 of the upper plate 211 protrudes and extends to the outside of the upper plate 211, so that the outer convex body 2113 of the upper plate 211 is connected with the outside of the tube body 22 and the lip 223 of each tube body 22 is accommodated and combined on each corresponding upper plate 211. In the groove 2112 inside the plate 211, the inner side of the lip 223 is flush with or higher than the inner side of the upper plate 211, and the tubular cavity 224 of each tube body 22 communicates with the plate-shaped cavity through the open end 222 213. And the grooves 225 of the lip 223 are in contact with the capillary structure 214 on the inside of the upper plate 211 (such as butt joint or overlapping connection). In this embodiment, the grooves 225 of the lip 223 are covered by The capillary structure 214 (that is, the copper mesh) inside the upper plate 211 is covered and superimposed (butted) connected, that is, the groove 225 of the lip 223 of the pipe body 22 overlaps (superimposes) the capillary structure of the upper plate 211. The structure 214 can be connected together by high temperature sintering to form a capillary connection. This capillary connection means that the groove 225 of the lip 223 communicates with the capillary structure 214 inside the upper plate 211, so that the capillary force can be transmitted or extended from the groove 225 to the Capillary structure 214 inside the upper plate 211 . Such arrangement makes the groove 225 of each pipe body 22 have small flow resistance (low condensation thermal resistance), so that the adsorbed and condensed working fluid can be quickly circulated and diffused to the capillary structure inside the upper plate 211 of the chamber 21 214, to effectively accelerate the condensed working fluid to flow back to the capillary structure 214 of the lower plate 212 of the vapor chamber 21, so as to improve the vapor-liquid circulation efficiency and keep the working fluid in the evaporation area 24 sufficient to avoid dry burning. In addition, the grooves 225 are designed through the inner sides of the tubular chamber 224 and the lip 223 of the tubular body 22, so that the space of the tubular chamber 224 (that is, the vapor space) can be increased, and the gas flowing into the tubular chamber 224 can be increased. The vapor flow resistance is reduced, thereby improving the vapor-liquid circulation efficiency. Moreover, since the open ends 222 of the tubes 22 are only close to the inner side of the upper plate 211, but do not extend into the plate-shaped chamber 213 to the lower plate 212, so that they can be inserted into the plate-shaped chamber 213. The working fluid in vapor state flows smoothly to effectively improve the efficiency of vapor-liquid circulation. Furthermore, the combination between the uniform temperature plate 21 and the pipe body 22 is not only connected to the outside of the corresponding pipe body 22 by the convex body 2113 of the upper plate 211, but also through each pipe body 22 to form a trumpet shape (funnel shape). Moreover, the lip portion 223 with a larger area increases the joint area with the upper plate 211 to achieve a tighter joint and stability, thereby further enhancing the joint strength between each tube body 22 and the upper plate 211 . 2A, 2B, and 2C, the outer side of the lower plate 212 of the chamber 21 is attached to a heating element (such as a central processing unit or a graphics processing unit; not shown in the figure) and the contact point is set as an evaporation zone 24 , and the place not in contact with the heating element (that is, the upper plate 211 of the vapor chamber 21 and the tubes 22 ) is a condensation zone 25 . Therefore, when the evaporating region 24 of the vapor chamber 21 (that is, the outside of the lower plate 212) contacts and absorbs the heat of the heating element, the working fluid in the evaporating region 24 is heated and transformed into a working fluid in a vapor state, and respectively flows towards condensation Zone 25 (that is, the upper plate 211 and the pipe body 22 ) flows until the working fluid in the vapor state is condensed in the upper plate 211 and the tubular chamber 224 and then converted into condensed working fluid, then in the tubular chamber 224 The grooves 225 of the lip 223 will flow the adsorbed condensed working fluid toward the opening 222, and then the capillary force of the grooves 225 of the lip 223 will condense the condensed working fluid condensed at the open end 222. The fast adsorption flows to the capillary structure 214 inside the upper plate 211, and finally the condensed working fluid flows back to the evaporation area 24 by gravity/capillary force, and the vapor-liquid circulation continues to dissipate heat. In other alternative embodiments, please refer to FIG. 2D , the grooves 225 of the lip 223 of each tube body 22 are in contact with the capillary structure 214 inside the upper plate 211 . In another feasible embodiment, please refer to FIG. 2E, a trumpet-shaped (or funnel-shaped) bonding area 2114 matching the shape of the lip 223 is formed on the outer adjacent area of the opening 2111 of the upper plate 211, through which The combination area 2114 of the opening 2111 and the lip 223 are connected to each other in a trumpet shape (or funnel shape), so as to effectively increase the connection area between the tube body 22 and the upper plate 211, and further improve Effectively increase the bonding strength of the two, and effectively increase the area (space) in the plate-shaped chamber 213 . Therefore, the groove 225 of the lip 223 of the tube body 22 and the capillary structure 214 of the upper plate 211 of the vapor chamber 21 are overlapped (overlaid) by the design of the present invention, so that the air in the tube body 22 can be effectively increased. The return speed of the working fluid and the improvement of the vapor-liquid circulation efficiency can further improve the heat dissipation performance.

2:3D uniform temperature plate 21: vapor chamber 211: upper board 2111: opening 2112: Groove 2113: extruded body 2114: binding area 212: lower board 213: plate chamber 214: capillary structure 2141: through hole 22: tube body 221: closed end 222: Open end 223: lips 224: tubular chamber 225: Groove 24: Evaporation area 25: Condensation zone

Figure 1 is a schematic cross-sectional view of a conventional 3D uniform temperature panel. Figure 2A is a three-dimensional exploded view of a 3D vapor chamber of an embodiment of the invention. Fig. 2B is another perspective view of the three-dimensional decomposition of the 3D vapor chamber of an embodiment of the invention. Fig. 2C is a schematic cross-sectional view of the combination of the 3D uniform temperature plate of an embodiment of the invention. Figure 2D is a combined cross-sectional schematic diagram of a 3D uniform temperature plate in another alternative embodiment of the present creation. Fig. 2E is a schematic cross-sectional view of a 3D vapor chamber in another possible embodiment of the invention.

2:3D uniform temperature plate

21: vapor chamber

211: upper board

2111: opening

2112: Groove

212: lower board

214: capillary structure

2141: through hole

22: tube body

221: closed end

222: Open end

223: lips

224: tubular chamber

225: Groove

Claims (6)

A 3D vapor chamber, comprising: A uniform temperature plate has an upper plate and a lower plate, the upper plate is provided with at least one through hole, the upper plate and the lower plate are covered together to define a plate-shaped cavity, and the plate-shaped cavity is connected The opening, and a working fluid and a capillary structure are arranged in the plate-shaped chamber; At least one pipe body, the two ends of which respectively have a closed end and an open end, the open end forms a trumpet-shaped lip outwardly to connect with the inner side of the upper plate, and the closed end passes through the upper plate The closed end and the open end jointly define a tubular chamber that communicates with the open end and the plate-shaped chamber, the inner side of the tubular chamber and the lip are provided with a plurality of grooves, the The grooves on the lip are in contact with the capillary structure inside the upper plate, so as to increase the return speed of the working fluid and improve the heat dissipation performance. The 3D vapor chamber as described in item 1 of the scope of the patent application, wherein the grooves of the tubular chamber and the lip are arranged on non-colinear lines and connected to each other. The 3D uniform temperature plate as described in item 1 of the scope of the patent application, wherein the inner side of the lip is equal to or higher than the inner side of the upper plate. The 3D vapor chamber as described in item 1 of the scope of the patent application, wherein the capillary structure is powder sintered body, metal braided mesh, groove or any combination of the foregoing. The 3D vapor chamber described in item 1 of the scope of the patent application, wherein the capillary structures inside the upper and lower plates of the plate-shaped chamber are the same or different capillary structures. The 3D uniform temperature plate as described in item 1 of the scope of the patent application, wherein the grooves of the lip are covered and connected by the capillary structure inside the upper plate.

Images