[go: up one dir, main page]

TWI874175B - Fan frame with passageway - Google Patents

Fan frame with passageway Download PDF

Info

Publication number
TWI874175B
TWI874175B TW113111935A TW113111935A TWI874175B TW I874175 B TWI874175 B TW I874175B TW 113111935 A TW113111935 A TW 113111935A TW 113111935 A TW113111935 A TW 113111935A TW I874175 B TWI874175 B TW I874175B
Authority
TW
Taiwan
Prior art keywords
side wall
heat sink
fan
guide grooves
bottom plate
Prior art date
Application number
TW113111935A
Other languages
Chinese (zh)
Other versions
TW202538474A (en
Inventor
王郁方
Original Assignee
英業達股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 英業達股份有限公司 filed Critical 英業達股份有限公司
Priority to TW113111935A priority Critical patent/TWI874175B/en
Application granted granted Critical
Publication of TWI874175B publication Critical patent/TWI874175B/en
Publication of TW202538474A publication Critical patent/TW202538474A/en

Links

Images

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)

Abstract

A fan frame with passageway includes a base plate, a first side wall, a second side wall, and a cover plate. The first side wall and the second side wall extend along an axis direction from opposite sides of the base plate, and the first side wall has a plurality of first inclined passageway. The cover plate is connected to the first side wall and the second side wall, enclosing a guide space with the base plate, and opening at least one inlet in the cover plate. The cover plate, the base plate, the first side wall, and the second side wall enclose a first outlet. When a first heat sink is disposed on the first outlet, a centrifugal airflow generated by a fan within the guide space is directed towards a plurality of first heat fins of the first radiator by the first inclined passageway.

Description

具有氣流導槽之風扇框架Fan frame with air flow guide grooves

本發明係關於一種風扇框架,尤其是指一種具有氣流導槽之風扇框架。The present invention relates to a fan frame, and more particularly to a fan frame with air flow guide grooves.

在現有的電腦或伺服器等電子裝置中,由於CPU或GPU等高發熱的電子元件在運作時往往會產生大量的熱量,因此通常都會設置一些散熱模組來幫助電子元件散熱。In existing electronic devices such as computers or servers, since high-heat-generating electronic components such as CPUs or GPUs often generate a large amount of heat during operation, some heat dissipation modules are usually provided to help the electronic components dissipate heat.

一般來說,在散熱技術的領域中,以傳統的風冷散熱最為常見,而風冷散熱主要是利用風扇來強制帶動氣流通過熱連結於電子元件的散熱器,藉以加速電子元件的散熱效率。Generally speaking, in the field of heat dissipation technology, traditional air cooling is the most common, and air cooling mainly uses fans to force air flow through the heat sink that is thermally connected to the electronic components to accelerate the heat dissipation efficiency of the electronic components.

當風冷散熱應用於家用主機的處理器散熱時,大部分的設計都是將風扇直接組裝於散熱器上,而散熱器則是直接透過散熱膏熱連結於電子元件;然而,當風冷散熱應用於伺服器之散熱時,由於伺服器內部的空間有限,通常不會將散熱器直接安裝在處理器上面,而是透過熱管來將處理器的熱量引導至風扇的出風口。When air cooling is used to cool the processor of a home host, most designs directly assemble the fan on the heat sink, and the heat sink is directly thermally connected to the electronic components through thermal paste; however, when air cooling is used to cool the server, due to the limited space inside the server, the heat sink is usually not installed directly on the processor, but a heat pipe is used to guide the heat of the processor to the air outlet of the fan.

請參閱第一圖與第二圖,第一圖係顯示先前技術之散熱模組用於對電子元件進行散熱之平面示意圖;第二圖係顯示先前技術之散熱模組之立體示意圖。如第一圖與第二圖所示,在伺服器內部中,為了對一中央處理器(CPU)PA1與一圖形處理器(GPU)PA2進行散熱,現有技術例如是在中央處理器PA1之一側設置一風扇模組PA3,並在圖形處理器PA2之一側設置一風扇模組PA4,藉以利用風扇模組PA3與PA4分別對中央處理器PA1與圖形處理器PA2進行散熱。Please refer to the first and second figures. The first figure is a plane diagram showing a heat dissipation module of the prior art for dissipating heat from electronic components; the second figure is a three-dimensional diagram showing a heat dissipation module of the prior art. As shown in the first and second figures, in order to dissipate heat from a central processing unit (CPU) PA1 and a graphics processing unit (GPU) PA2 inside a server, the prior art, for example, sets a fan module PA3 on one side of the central processing unit PA1 and sets a fan module PA4 on one side of the graphics processing unit PA2, so as to use the fan modules PA3 and PA4 to dissipate heat from the central processing unit PA1 and the graphics processing unit PA2 respectively.

以風扇模組PA3為例,由於風扇模組PA3是設置在中央處理器PA1之一側,且風扇模組PA3具有二出風口PA31與PA32,因此還會在出風口PA31處設有一散熱器PA5,並利用熱管PA6來熱連結散熱器PA5與中央處理器PA1。以此類推,在出風口PA32處也會設有一散熱器PA7,且散熱器PA7也會透過一熱管PA8熱連結於中央處理器PA1。Taking the fan module PA3 as an example, since the fan module PA3 is disposed on one side of the CPU PA1 and has two air outlets PA31 and PA32, a heat sink PA5 is also disposed at the air outlet PA31, and a heat pipe PA6 is used to thermally connect the heat sink PA5 and the CPU PA1. Similarly, a heat sink PA7 is also disposed at the air outlet PA32, and the heat sink PA7 is also thermally connected to the CPU PA1 through a heat pipe PA8.

承上所述,熱管PA7與PA8傳熱之原理是透過管內的相變式冷媒在熱端(例如中央處理器PA1處)吸熱汽化成氣態冷媒,然後流動至冷端(例如出風口PA32處)散熱降溫凝結成液態冷媒,接著再透過管內的毛細結構回流至熱端吸熱,藉以循環的傳遞熱能。As mentioned above, the heat transfer principle of heat pipes PA7 and PA8 is that the phase change refrigerant in the pipe absorbs heat at the hot end (such as the central processing unit PA1) and vaporizes into a gaseous refrigerant, then flows to the cold end (such as the air outlet PA32) to dissipate heat and cool down to condense into a liquid refrigerant, and then flows back to the hot end through the capillary structure in the pipe to absorb heat, thereby transferring heat energy in a cycle.

以熱管PA7為例,由於出風口PA31具有一定的長度,因此熱管PA7內部之氣態冷媒往往在接近出風口PA31時逐漸被降溫冷凝而回流,進而無法流動到熱管PA7的末端,導致熱管PA7在出風口PA31處會有一段無效的熱交換區域。另一方面,熱管PA7主要是熱連結於散熱器PA5,以透過設置在出風口PA31的散熱器PA5來與風扇模組PA3所產生的散熱氣流進行熱交換,但由於散熱器PA5與散熱氣流進行熱交換的有效區域取決於鰭片的面積,而非散熱器PA5與熱管PA7連結的本體,因此很容易會因為散熱器PA5之本體遮擋住部份的出風口PA31而影響到整體的熱交換效率。Taking the heat pipe PA7 as an example, since the air outlet PA31 has a certain length, the gaseous refrigerant inside the heat pipe PA7 is often gradually cooled and condensed and refluxed when approaching the air outlet PA31, and thus cannot flow to the end of the heat pipe PA7, resulting in an ineffective heat exchange area of the heat pipe PA7 at the air outlet PA31. On the other hand, the heat pipe PA7 is mainly thermally connected to the radiator PA5, so as to exchange heat with the heat dissipation airflow generated by the fan module PA3 through the radiator PA5 disposed at the air outlet PA31. However, since the effective area for heat exchange between the radiator PA5 and the heat dissipation airflow depends on the area of the fins, rather than the body of the radiator PA5 connected to the heat pipe PA7, it is easy for the body of the radiator PA5 to block part of the air outlet PA31 and affect the overall heat exchange efficiency.

有鑒於在先前技術中,現有的風冷散熱技術往往因為熱管與散熱器的配置問題而有散熱效率不佳的問題產生;緣此,本發明的主要目的在於提供一種具有氣流導槽之風扇框架,可以在不改變現有的熱管與散熱器之配置關係而提高整體的散熱效率。In view of the fact that in the prior art, the existing air cooling technology often has poor heat dissipation efficiency due to the configuration problem of heat pipes and heat sinks; therefore, the main purpose of the present invention is to provide a fan frame with airflow guide grooves, which can improve the overall heat dissipation efficiency without changing the existing configuration relationship between heat pipes and heat sinks.

本發明為解決先前技術之問題,所採用的必要技術手段是提供一種具有氣流導槽之風扇框架,用以供一風扇安裝設置,並與一第一散熱器配合使用,該第一散熱器包含一第一散熱板與複數個第一散熱鰭片,該具有氣流導槽之風扇框架包含一底板、一第一側壁、一第二側壁以及一蓋板。The present invention solves the problems of the prior art by adopting a necessary technical means of providing a fan frame with an airflow guide groove for mounting a fan and used in conjunction with a first heat sink. The first heat sink includes a first heat sink plate and a plurality of first heat sink fins. The fan frame with the airflow guide groove includes a bottom plate, a first side wall, a second side wall and a cover plate.

第一側壁係自該底板之一側沿一軸向延伸所形成,並具有複數個第一斜向導槽,每一該些第一斜向導槽係沿一傾斜方向延伸,且該傾斜方向係傾斜於該軸向。The first side wall is formed by extending from one side of the bottom plate along an axial direction and has a plurality of first oblique guide grooves. Each of the first oblique guide grooves extends along an inclined direction, and the inclined direction is inclined to the axial direction.

第二側壁係自該底板相對於該第一側壁之另一側沿該軸向延伸所形成。The second side wall is formed by extending along the axial direction from the other side of the bottom plate opposite to the first side wall.

蓋板係連結於該第一側壁與該第二側壁,與該底板圍構出一導流空間,並開設有連通於該導流空間之至少一蓋板進風口,且該蓋板更與該底板、該第一側壁以及該第二側壁圍構出一第一出風口,該第一散熱器係設置於該第一出風口處,且每一該些第一斜向導槽係自該蓋板沿該傾斜方向朝該第一出風口延伸至該底板。The cover plate is connected to the first side wall and the second side wall, and forms a guide space with the bottom plate, and is provided with at least one cover plate air inlet connected to the guide space, and the cover plate further forms a first air outlet with the bottom plate, the first side wall and the second side wall, the first heat sink is arranged at the first air outlet, and each of the first inclined guide grooves extends from the cover plate along the inclined direction toward the first air outlet to the bottom plate.

其中,該第一散熱板係鄰近於該蓋板,該些第一散熱鰭片係自該第一散熱板一體成型地朝該底板延伸而分布於該第一出風口,該風扇係可轉動地設置於該導流空間,用以產生一離心氣流,藉以透過該些第一斜向導槽導引該離心氣流沿該傾斜方向朝向該些第一散熱鰭片流動。The first heat sink is adjacent to the cover plate, the first heat sink fins are integrally formed from the first heat sink and extend toward the bottom plate and are distributed at the first air outlet, and the fan is rotatably disposed in the flow guide space to generate a centrifugal airflow, thereby guiding the centrifugal airflow to flow toward the first heat sink fins along the inclined direction through the first oblique guide grooves.

在上述必要技術手段所衍生之一附屬技術手段中,該底板包含一第一端邊、一第二端邊、一第一側邊以及一第二側邊,該第一端邊係沿一第一方向延伸,該第二端邊係沿垂直於該第一方向之一第二方向延伸,該第一側邊與該第二側邊係分別自該第一端邊之兩端彎折延伸至該第二端邊之兩端,且該軸向係垂直於該第一方向與該第二方向。In an auxiliary technical means derived from the above-mentioned necessary technical means, the base plate includes a first end edge, a second end edge, a first side edge and a second side edge, the first end edge extends along a first direction, the second end edge extends along a second direction perpendicular to the first direction, the first side edge and the second side edge are respectively bent from two ends of the first end edge to two ends of the second end edge, and the axial direction is perpendicular to the first direction and the second direction.

在上述必要技術手段所衍生之一附屬技術手段中,該底板具有一風扇組接結構,該風扇組接結構是沿該軸向延伸,用以供該風扇進行安裝設置。較佳者,該底板更開設有複數個底板進風口,該些底板進風口係以該風扇組接結構為中心而環繞地排列設置。In an auxiliary technical means derived from the above necessary technical means, the bottom plate has a fan assembly structure, which extends along the axial direction for the fan to be installed. Preferably, the bottom plate is further provided with a plurality of bottom plate air inlets, which are arranged around the fan assembly structure.

如上所述,由於本發明之具有氣流導槽之風扇框架是在第一側壁設有複數個第一斜向導槽,因此當風扇在導流空間內產生離心氣流時,離心氣流會受到第一斜向導槽之引導而朝著底板與第一出風口流動,藉以提升通過第一散熱鰭片的流量,有效的增加整體的散熱效率。As described above, since the fan frame with airflow guide grooves of the present invention is provided with a plurality of first oblique guide grooves on the first side wall, when the fan generates centrifugal airflow in the guide space, the centrifugal airflow will be guided by the first oblique guide grooves and flow toward the bottom plate and the first air outlet, thereby increasing the flow rate passing through the first heat sink fin and effectively increasing the overall heat dissipation efficiency.

本發明所採用的具體實施例,將藉由以下之實施例及圖式作進一步之說明。The specific embodiments of the present invention will be further described by the following embodiments and drawings.

請參閱第三圖與第四圖,第三圖係顯示本發明第一較佳實施例所提供之具有氣流導槽之風扇框架之立體示意圖;第四圖係顯示本發明第一較佳實施例所提供之具有氣流導槽之風扇框架部分截面之立體示意圖。Please refer to the third and fourth figures, the third figure is a three-dimensional schematic diagram showing the fan frame with airflow guide grooves provided by the first preferred embodiment of the present invention; the fourth figure is a three-dimensional schematic diagram showing a partial cross-section of the fan frame with airflow guide grooves provided by the first preferred embodiment of the present invention.

如第三圖與第四圖所示,一種具有氣流導槽之風扇框架100包含一底板1、一第一側壁2、一第二側壁3以及一蓋板4。As shown in the third and fourth figures, a fan frame 100 with airflow guide grooves includes a bottom plate 1, a first side wall 2, a second side wall 3 and a cover plate 4.

底板1包含一第一端邊11、一第二端邊12、一第一側邊13以及一第二側邊14。第一端邊11是沿一第一方向D1延伸,第二端邊12是沿垂直於第一方向D1之一第二方向D2延伸,而第一側邊13與第二側邊14則是分別自第一端邊11之兩端彎折延伸至第二端邊12之兩端。The bottom plate 1 includes a first end 11, a second end 12, a first side 13 and a second side 14. The first end 11 extends along a first direction D1, the second end 12 extends along a second direction D2 perpendicular to the first direction D1, and the first side 13 and the second side 14 bend from two ends of the first end 11 to two ends of the second end 12, respectively.

承上所述,底板1還具有一風扇組接結構15,風扇組接結構15是沿垂直於第一方向D1與第二方向D2之一軸向D3延伸,用以供一風扇200進行安裝設置。此外,底板1還開設有複數個底板進風口16(圖中僅標示一個),複數個底板進風口16是以風扇組接結構15為中心而環繞地排列設置。As mentioned above, the bottom plate 1 also has a fan assembly structure 15, which extends along an axial direction D3 perpendicular to the first direction D1 and the second direction D2, for installing a fan 200. In addition, the bottom plate 1 is also provided with a plurality of bottom plate air inlets 16 (only one is marked in the figure), and the plurality of bottom plate air inlets 16 are arranged around the fan assembly structure 15 as the center.

第一側壁2是自底板1之第一側邊13沿軸向D3延伸所形成,並具有複數個第一斜向導槽21(圖中僅標示一個),每個第一斜向導槽21係沿傾斜於軸向D3之一傾斜方向D4延伸。The first side wall 2 is formed by extending from the first side edge 13 of the bottom plate 1 along the axial direction D3 and has a plurality of first oblique guide grooves 21 (only one is marked in the figure). Each first oblique guide groove 21 extends along an oblique direction D4 inclined to the axial direction D3.

第二側壁3是自底板1相對於第一側壁2之另一側沿軸向D3延伸所形成。此外,在本實施例中,雖然只有第一側壁2具有複數個第一斜向導槽21,但在其他實施例中,第二側壁3也可以有複數個與第一斜向導槽21延伸方向一致的第二斜向導槽(圖未示)。The second side wall 3 is formed by extending from the other side of the bottom plate 1 relative to the first side wall 2 along the axial direction D3. In addition, in this embodiment, although only the first side wall 2 has a plurality of first oblique guide grooves 21, in other embodiments, the second side wall 3 may also have a plurality of second oblique guide grooves (not shown) extending in the same direction as the first oblique guide grooves 21.

蓋板4是連結於第一側壁2與第二側壁3,並與底板1圍構出一導流空間S1,且蓋板4開設有連通於導流空間S1之一蓋板進風口41;此外,蓋板4更與底板1、第一側壁2以及第二側壁3圍構出一第一出風口F1與一第二出風口F2。The cover plate 4 is connected to the first side wall 2 and the second side wall 3, and forms a guide space S1 with the bottom plate 1, and the cover plate 4 is provided with a cover plate air inlet 41 connected to the guide space S1; in addition, the cover plate 4 further forms a first air outlet F1 and a second air outlet F2 with the bottom plate 1, the first side wall 2 and the second side wall 3.

承上所述,由於風扇200是藉由風扇組接結構15可轉動地設置於導流空間S1內,因此當風扇200運轉時,風扇200會從蓋板進風口41與底板進風口16吸入氣流,進而在導流空間S1內產生一離心氣流(圖未示),而由於離心氣流是由內向外螺旋的流動,因此離心氣流在導流空間S1會全方位的流向第一側壁2、第二側壁3、第一出風口F1與第二出風口F2,而流向第一側壁2之離心氣流會受到第一斜向導槽21之引導而朝著第一出風口F1處的底板1流動。As mentioned above, since the fan 200 is rotatably disposed in the guide space S1 via the fan assembly structure 15, when the fan 200 is running, the fan 200 will inhale airflow from the cover plate air inlet 41 and the bottom plate air inlet 16, thereby generating a centrifugal airflow (not shown) in the guide space S1, and since the centrifugal airflow flows in a spiral from the inside to the outside, the centrifugal airflow will flow in all directions in the guide space S1 toward the first side wall 2, the second side wall 3, the first air outlet F1 and the second air outlet F2, and the centrifugal airflow flowing toward the first side wall 2 will be guided by the first oblique guide groove 21 and flow toward the bottom plate 1 at the first air outlet F1.

請繼續參閱第五圖,第五圖係顯示本發明第一較佳實施例所提供之具有氣流導槽之風扇框架與第一散熱器配合使用之立體示意圖。Please continue to refer to the fifth figure, which is a three-dimensional schematic diagram showing the use of the fan frame with airflow guide grooves provided by the first preferred embodiment of the present invention in conjunction with the first heat sink.

如第三圖至第五圖所示,在實際運用時,使用者可以將組裝有一第一散熱器300之一熱管400安裝於本發明之具有氣流導槽之風扇框架100的第一出風口F1處,使第一散熱器300可以在第一出風口F1處承接風扇200所提供之離心氣流。其中,雖然在本實施例中僅針對第一出風口F1進行舉例說明,但實務上第二出風口F2也可以設置一第二散熱器300'(標示於第七圖)。As shown in the third to fifth figures, in actual use, the user can install a heat pipe 400 assembled with a first heat sink 300 at the first air outlet F1 of the fan frame 100 with airflow guide grooves of the present invention, so that the first heat sink 300 can receive the centrifugal airflow provided by the fan 200 at the first air outlet F1. Although only the first air outlet F1 is used as an example in this embodiment, in practice, a second heat sink 300' (marked in the seventh figure) can also be set at the second air outlet F2.

承上所述,第一散熱器300包含一第一散熱板301與複數個第一散熱鰭片302(圖中僅標示一個),第一散熱板301是貼合於蓋板4,而複數個第一散熱鰭片302是分別自第一散熱板301一體成型地朝底板1延伸而分布於第一出風口F1,藉此,當導流空間S1內的離心氣流受到第一斜向導槽21引導時,會朝著第一散熱鰭片302流動,藉以提升第一散熱器300對熱管400散熱之效率。As mentioned above, the first heat sink 300 includes a first heat sink 301 and a plurality of first heat sink fins 302 (only one is marked in the figure). The first heat sink 301 is attached to the cover plate 4, and the plurality of first heat sink fins 302 are integrally formed from the first heat sink 301 and extend toward the base plate 1 and are distributed at the first air outlet F1. Thereby, when the centrifugal airflow in the guide space S1 is guided by the first oblique guide groove 21, it will flow toward the first heat sink fins 302, so as to improve the efficiency of the first heat sink 300 in cooling the heat pipe 400.

請繼續參閱第六圖,第六圖係顯示本發明第二較佳實施例所提供之具有氣流導槽之風扇框架之立體示意圖。如第三圖至第六圖所示,一種具有氣流導槽之風扇框架100a包含一底板1a、一第一側壁2a、一第二側壁3a以及一蓋板4a;其中,具有氣流導槽之風扇框架100a與上述之具有氣流導槽之風扇框架100為左右相反的相似結構,且第一側壁2a內同樣設有複數個第一斜向導槽21a(圖中僅標示一個)。Please continue to refer to the sixth figure, which is a three-dimensional schematic diagram of a fan frame with airflow guide grooves provided by the second preferred embodiment of the present invention. As shown in the third to sixth figures, a fan frame 100a with airflow guide grooves includes a bottom plate 1a, a first side wall 2a, a second side wall 3a and a cover plate 4a; wherein, the fan frame 100a with airflow guide grooves is a similar structure with the fan frame 100 with airflow guide grooves described above being opposite in left and right, and a plurality of first oblique guide grooves 21a (only one is marked in the figure) are also provided in the first side wall 2a.

請繼續參閱第七圖,第七圖係顯示本發明之具有氣流導槽之風扇框架實際應用時之平面示意圖。如第三圖至第七圖所示,在實際運用時,使用者可以將具有氣流導槽之風扇框架100與100a分別設置於二電子元件500與600之兩側,然後再利用熱管400將電子元件500熱連結至設置於第一出風口F1之第一散熱器300以及設置於第二出風口F2之第二散熱器300';另一方面,電子元件600也可以利用熱管400熱連結至設置於具有氣流導槽之風扇框架100a之第一出風口F1a與第二出風口F2a處的第一散熱器300a與第二散熱器300a'。Please continue to refer to FIG. 7, which is a schematic plan view of the fan frame with airflow guide grooves of the present invention when it is actually used. As shown in FIG. 3 to FIG. 7, in actual use, the user can respectively set the fan frames 100 and 100a with airflow guide grooves on both sides of the two electronic components 500 and 600, and then use the heat pipe 400 to thermally connect the electronic component 500 to the first heat sink 300 set at the first air outlet F1 and the second heat sink 300' set at the second air outlet F2; on the other hand, the electronic component 600 can also use the heat pipe 400 to thermally connect to the first heat sink 300a and the second heat sink 300a' set at the first air outlet F1a and the second air outlet F2a of the fan frame 100a with airflow guide grooves.

綜上所述,相較於先前技術之風冷散熱技術往往因為熱管與散熱器的配置問題而有散熱效率不佳的問題產生,本發明所提供之具有氣流導槽之風扇框架透過第一側壁所設有的複數個第一斜向導槽,可以引導風扇所產生的離心氣流朝著底板與第一出風口流動,藉以使大部分的離心氣流直接通過在第一出風口處朝底板延伸的第一散熱鰭片,避免離心氣流因為直接撞擊在第一出風口處鄰近蓋板的第一散熱板而造成亂流,故本發明之具有氣流導槽之風扇框架確實可以透過複數個第一斜向導槽引導大部分的離心氣流直接吹向第一散熱鰭片而提升整體的散熱效率。In summary, compared to the prior art air cooling heat dissipation technology which often has the problem of poor heat dissipation efficiency due to the configuration problem of heat pipes and heat sinks, the fan frame with airflow guide grooves provided by the present invention can guide the centrifugal airflow generated by the fan to flow toward the bottom plate and the first air outlet through a plurality of first oblique guide grooves provided on the first side wall, so that most of the centrifugal airflow directly passes through the first heat sink fin extending toward the bottom plate at the first air outlet, thereby avoiding the centrifugal airflow from directly hitting the first heat sink adjacent to the cover plate at the first air outlet and causing turbulence. Therefore, the fan frame with airflow guide grooves of the present invention can indeed guide most of the centrifugal airflow to blow directly toward the first heat sink fin through a plurality of first oblique guide grooves to improve the overall heat dissipation efficiency.

本發明較佳實施例所提供之具有氣流導槽之風扇框架可裝設於例如伺服器主機中,該伺服器主機係可用於人工智慧(Artificial Intelligence,簡稱AI)運算、邊緣運算(edge computing)等,亦可當作5G伺服器、雲端伺服器或車聯網伺服器等使用。The fan frame with airflow guide grooves provided in the preferred embodiment of the present invention can be installed in, for example, a server host, which can be used for artificial intelligence (AI) computing, edge computing, etc., and can also be used as a 5G server, cloud server, or car networking server.

藉由以上較佳具體實施例之詳述,係希望能更加清楚描述本發明之特徵與精神,而並非以上述所揭露的較佳具體實施例來對本發明之範疇加以限制。相反地,其目的是希望能涵蓋各種改變及具相等性的安排於本發明所欲申請之專利範圍的範疇內。The above detailed description of the preferred specific embodiments is intended to more clearly describe the features and spirit of the present invention, but is not intended to limit the scope of the present invention by the preferred specific embodiments disclosed above. On the contrary, the purpose is to cover various changes and arrangements with equivalents within the scope of the patent application for the present invention.

PA1:中央處理器 PA1: Central Processing Unit

PA2:圖形處理器 PA2: Graphics Processor

PA3:風扇模組 PA3: Fan module

PA31,PA32:出風口 PA31,PA32: air outlet

PA4:風扇模組 PA4: Fan module

PA5:散熱器 PA5: Radiator

PA6:熱管 PA6: Heat pipe

PA7:散熱器 PA7: Radiator

PA8:熱管 PA8: Heat pipe

100,100a:具有氣流導槽之風扇框架 100,100a: Fan frame with airflow guide grooves

1,1a:底板 1,1a: Bottom plate

11:第一端邊 11: First end edge

12:第二端邊 12: Second end edge

13:第一側邊 13: First side

14:第二側邊 14: Second side

15:風扇組接結構 15: Fan assembly structure

16:底板進風口 16: Bottom plate air inlet

2,2a:第一側壁 2,2a: First side wall

21,21a:第一斜向導槽 21,21a: First oblique guide groove

3,3a:第二側壁 3,3a: Second side wall

4,4a:蓋板 4,4a: Cover plate

41:蓋板進風口 41: Cover air inlet

200:風扇 200: Fan

300,300a:第一散熱器 300,300a: First radiator

300',300a':第二散熱器 300',300a': Second radiator

301:第一散熱板 301: First heat sink

302:第一散熱鰭片 302: First heat sink fin

400:熱管 400: Heat pipe

D1:第一方向 D1: First direction

D2:第二方向 D2: Second direction

D3:軸向 D3: Axial

D4:傾斜方向 D4: Tilt direction

S1:導流空間 S1: diversion space

F1,F1a:第一出風口 F1, F1a: First air outlet

F2,F2a:第二出風口 F2, F2a: Second air outlet

第一圖係顯示先前技術之散熱模組用於對電子元件進行散熱之平面示意圖; 第二圖係顯示先前技術之散熱模組之立體示意圖; 第三圖係顯示本發明第一較佳實施例所提供之具有氣流導槽之風扇框架之立體示意圖; 第四圖係顯示本發明第一較佳實施例所提供之具有氣流導槽之風扇框架部分截面之立體示意圖; 第五圖係顯示本發明第一較佳實施例所提供之具有氣流導槽之風扇框架與第一散熱器配合使用之立體示意圖; 第六圖係顯示本發明第二較佳實施例所提供之具有氣流導槽之風扇框架之立體示意圖;以及 第七圖係顯示本發明之具有氣流導槽之風扇框架實際應用時之平面示意圖。 The first figure is a plane diagram showing a heat dissipation module of the prior art used for heat dissipation of electronic components; The second figure is a three-dimensional diagram showing a heat dissipation module of the prior art; The third figure is a three-dimensional diagram showing a fan frame with airflow guide grooves provided by the first preferred embodiment of the present invention; The fourth figure is a three-dimensional diagram showing a partial cross-section of the fan frame with airflow guide grooves provided by the first preferred embodiment of the present invention; The fifth figure is a three-dimensional diagram showing the fan frame with airflow guide grooves provided by the first preferred embodiment of the present invention used in conjunction with the first heat sink; The sixth figure is a three-dimensional diagram showing the fan frame with airflow guide grooves provided by the second preferred embodiment of the present invention; and The seventh figure is a plane diagram showing the fan frame with airflow guide grooves of the present invention in actual application.

100:具有氣流導槽之風扇框架 100: Fan frame with airflow guide grooves

1:底板 1: Base plate

2:第一側壁 2: First side wall

21:第一斜向導槽 21: First oblique guide groove

3:第二側壁 3: Second side wall

4:蓋板 4: Cover plate

41:蓋板進風口 41: Cover air inlet

200:風扇 200: Fan

S1:導流空間 S1: diversion space

F1:第一出風口 F1: First air outlet

F2:第二出風口 F2: Second air outlet

Claims (4)

一種具有氣流導槽之風扇框架,用以供一風扇安裝設置,並與一第一散熱器配合使用,該第一散熱器包含一第一散熱板與複數個第一散熱鰭片,該具有氣流導槽之風扇框架包含: 一底板; 一第一側壁,係自該底板之一側沿一軸向延伸所形成,並具有複數個第一斜向導槽,每一該些第一斜向導槽係沿一傾斜方向延伸,且該傾斜方向係傾斜於該軸向; 一第二側壁,係自該底板相對於該第一側壁之另一側沿該軸向延伸所形成;以及 一蓋板,係連結於該第一側壁與該第二側壁,與該底板圍構出一導流空間,並開設有連通於該導流空間之至少一蓋板進風口,且該蓋板更與該底板、該第一側壁以及該第二側壁圍構出一第一出風口,該第一散熱器係設置於該第一出風口處,且每一該些第一斜向導槽係自該蓋板沿該傾斜方向朝該第一出風口延伸至該底板; 其中,該第一散熱板係鄰近於該蓋板,該些第一散熱鰭片係自該第一散熱板一體成型地朝該底板延伸而分布於該第一出風口,該風扇係可轉動地設置於該導流空間,用以產生一離心氣流,藉以透過該些第一斜向導槽導引該離心氣流沿該傾斜方向朝向該些第一散熱鰭片流動。 A fan frame with airflow guide grooves is used for mounting a fan and is used in conjunction with a first heat sink, the first heat sink comprising a first heat sink and a plurality of first heat sink fins. The fan frame with airflow guide grooves comprises: a bottom plate; a first side wall, formed by extending from one side of the bottom plate along an axial direction and having a plurality of first oblique guide grooves, each of which extends along an inclined direction, and the inclined direction is inclined to the axial direction; a second side wall, formed by extending from the other side of the bottom plate relative to the first side wall along the axial direction; and A cover plate is connected to the first side wall and the second side wall, and forms a flow guide space with the bottom plate, and is provided with at least one cover plate air inlet connected to the flow guide space, and the cover plate further forms a first air outlet with the bottom plate, the first side wall and the second side wall, the first heat sink is arranged at the first air outlet, and each of the first oblique guide grooves extends from the cover plate along the oblique direction toward the first air outlet to the bottom plate; The first heat sink is adjacent to the cover plate, the first heat sink fins are integrally formed from the first heat sink and extend toward the bottom plate and are distributed at the first air outlet, and the fan is rotatably disposed in the flow guide space to generate a centrifugal airflow, thereby guiding the centrifugal airflow to flow toward the first heat sink fins along the inclined direction through the first oblique guide grooves. 如請求項1所述之具有氣流導槽之風扇框架,其中,該底板包含一第一端邊、一第二端邊、一第一側邊以及一第二側邊,該第一端邊係沿一第一方向延伸,該第二端邊係沿垂直於該第一方向之一第二方向延伸,該第一側邊與該第二側邊係分別自該第一端邊之兩端彎折延伸至該第二端邊之兩端,且該軸向係垂直於該第一方向與該第二方向。A fan frame with airflow guide grooves as described in claim 1, wherein the base plate includes a first end edge, a second end edge, a first side edge and a second side edge, the first end edge extends along a first direction, the second end edge extends along a second direction perpendicular to the first direction, the first side edge and the second side edge are respectively bent from two ends of the first end edge to two ends of the second end edge and extend, and the axial direction is perpendicular to the first direction and the second direction. 如請求項1所述之具有氣流導槽之風扇框架,其中,該底板具有一風扇組接結構,該風扇組接結構是沿該軸向延伸,用以供該風扇進行安裝設置。A fan frame with airflow guide grooves as described in claim 1, wherein the base plate has a fan assembly structure, and the fan assembly structure extends along the axial direction for the fan to be installed. 如請求項3所述之具有氣流導槽之風扇框架,其中,該底板更開設有複數個底板進風口,該些底板進風口係以該風扇組接結構為中心而環繞地排列設置。As described in claim 3, the fan frame with airflow guide grooves, wherein the base plate is further provided with a plurality of base plate air inlets, and the base plate air inlets are arranged in a circumferential manner with the fan assembly structure as the center.
TW113111935A 2024-03-29 2024-03-29 Fan frame with passageway TWI874175B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW113111935A TWI874175B (en) 2024-03-29 2024-03-29 Fan frame with passageway

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW113111935A TWI874175B (en) 2024-03-29 2024-03-29 Fan frame with passageway

Publications (2)

Publication Number Publication Date
TWI874175B true TWI874175B (en) 2025-02-21
TW202538474A TW202538474A (en) 2025-10-01

Family

ID=95557579

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113111935A TWI874175B (en) 2024-03-29 2024-03-29 Fan frame with passageway

Country Status (1)

Country Link
TW (1) TWI874175B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102996516A (en) * 2011-09-19 2013-03-27 台达电子工业股份有限公司 Electronic device and its cooling module and its centrifugal fan
TWM479990U (en) * 2013-12-26 2014-06-11 Kipo Technology Ltd Centrifugal fan
US20160369811A1 (en) * 2015-06-16 2016-12-22 Delta Electronics, Inc. Centrifugal fan with dual outlets in the same direction and fan frame thereof
CN208380905U (en) * 2018-01-15 2019-01-15 青岛顺威精密塑料有限公司 A kind of centrifugal fan preventing airflow reflux

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102996516A (en) * 2011-09-19 2013-03-27 台达电子工业股份有限公司 Electronic device and its cooling module and its centrifugal fan
TWM479990U (en) * 2013-12-26 2014-06-11 Kipo Technology Ltd Centrifugal fan
US20160369811A1 (en) * 2015-06-16 2016-12-22 Delta Electronics, Inc. Centrifugal fan with dual outlets in the same direction and fan frame thereof
CN208380905U (en) * 2018-01-15 2019-01-15 青岛顺威精密塑料有限公司 A kind of centrifugal fan preventing airflow reflux

Also Published As

Publication number Publication date
TW202538474A (en) 2025-10-01

Similar Documents

Publication Publication Date Title
TWI496992B (en) Heat dissipation device
CN101351109A (en) heat sink
CN101466240B (en) Radiating device
JP3068892U (en) CPU heat dissipation device
TWI874175B (en) Fan frame with passageway
CN109860134B (en) A kind of strengthening heat dissipation guide device and heat dissipation module
TWI882750B (en) Fan frame with stair guiding structure
CN101001514A (en) Liquid-cooled radiating device and radiating unit
CN207381387U (en) One-piece aluminum radiator with fan
CN101472445B (en) Radiating device
TW202544347A (en) Fan frame with improved inlet
CN101287348B (en) Heat sink assembly
CN2664189Y (en) Heat sink for heat pipe
US20130014921A1 (en) Air flow guiding structure
JP4682858B2 (en) Cooling device for electronic equipment
CN112543581B (en) A heat dissipation device
CN114727548A (en) Air-guiding structure and electronic equipment with such air-guiding structure
TWI849431B (en) Heat dissipating system
CN207704389U (en) A kind of finned liquid cooling heat radiator
CN222619073U (en) Composite heat dissipation module and electronic device
TWI885889B (en) Portable electronic device
TWI904967B (en) A memory cooling element based on the tesla valve principle
TWI898940B (en) Display card
KR20030014008A (en) Air-cooling apparatus for semiconductor element
TWI857383B (en) Heat dissipation module