TWI885682B - Laser processing device, semiconductor chip and method for manufacturing semiconductor chip - Google Patents

Abstract

The laser processing device of the present invention comprises: an inner door which is opened when a wafer is taken out and stored by a conveying unit; an outer door which is opened when an operator takes out and stores a wafer; and a control unit which controls the inner door to be closed when the outer door is in an openable state.

Description

Laser processing device, semiconductor chip and method for manufacturing semiconductor chip

The present invention relates to a laser processing device, a semiconductor chip and a method for manufacturing a semiconductor chip, and more particularly to a laser processing device having a laser light irradiation unit for irradiating laser light, a semiconductor chip and a method for manufacturing a semiconductor chip.

Previously, a laser processing device having a laser light irradiation unit for irradiating laser light was known. For example, the laser processing device is disclosed in Japanese Patent Publication No. 2017-64743.

The laser processing device disclosed in the above-mentioned Japanese Patent Publication No. 2017-64743 has a laser irradiation unit (laser irradiation section) for irradiating laser light. The laser processing device is configured to form a modified area consisting of cracks or pores inside the wafer by the laser light irradiated from the laser irradiation unit, or to cut the wafer by the laser light irradiated from the laser irradiation unit. In this way, the wafer is divided into a plurality of semiconductor chips.

The laser light irradiation unit in the above-mentioned Japanese Patent Publication No. 2017-64743 is configured to irradiate the first laser light and the second laser light as laser light by branching the laser light. Furthermore, the configurations of irradiating the first laser light and the second laser light are the same, so the following only describes the configuration of irradiating the first laser light.

The laser processing device in the above-mentioned Japanese Patent Publication No. 2017-64743 is equipped with a first cassette stage, a first loading mechanism and a first opening and closing door. The first cassette stage is used to load a cassette containing wafers to be processed by a first laser beam. The first loading mechanism is configured to transport the wafers contained in the cassette on the first cassette stage in order to supply the wafers to the laser beam irradiation unit. The first opening and closing door is a door opened by an operator when replacing the cassette placed on the first cassette stage.

In the laser processing device of the Japanese Patent Publication No. 2017-64743, the operator opens the first switch door to replace the cassette on the first cassette table while stopping the laser light from the laser light source of the laser light irradiation unit.

However, although it is not clearly stated in the laser processing device of the above-mentioned Japanese Patent Publication No. 2017-64743, in the previous laser processing device described in the above-mentioned Japanese Patent Publication No. 2017-64743, when the operator opens the first opening and closing door to replace the cassette on the first cassette table, not only the laser light irradiation unit will stop operating, but also the first loading mechanism will stop operating. In this way, unless the laser light irradiation unit stops irradiating laser light and the first loading mechanism stops operating, the operator cannot replace the cassette on the first cassette table. Therefore, the replacement operation of the operator to replace the wafer to be supplied to the laser light irradiation unit will increase the processing time of the laser processing device to process the wafer by laser light, thereby deteriorating the production efficiency of semiconductor chips. Therefore, it is hoped to suppress the reduction in semiconductor chip production efficiency caused by workers replacing wafers.

The present invention is completed to solve the above-mentioned problems. One purpose of the present invention is to provide a laser processing device and a semiconductor chip that can suppress the reduction in the production efficiency of semiconductor chips caused by the replacement work of the operator to replace the wafer.

The laser processing device of the first aspect of the present invention comprises: a wafer storage part for storing wafers; a conveying part for taking out and storing wafers relative to the wafer storage part; a laser light irradiation part for irradiating laser light along each of a plurality of cutting paths of the wafer taken out and supplied from the wafer storage part by the conveying part; a device shield part for accommodating the wafer storage part, the conveying part and the laser light irradiation part inside; an inner door provided at the position where the wafer storage part, the conveying part and the laser light irradiation part are placed; The inner wall of the device shielding part separating the wafer storage part and the laser light irradiation part is opened when the wafer is taken out and stored by the conveying part; the outer door is arranged on the outer wall of the device shielding part on the opposite side of the inner wall and the laser light irradiation part, and is opened when the operator takes out and stores the wafer; and the control part controls the inner door to be closed when the outer door is in an openable state.

In the laser processing device of the first aspect of the present invention, as described above, there are provided: an inner door that is opened when the conveyor unit takes out and stores the wafer, an outer door that is opened when the operator takes out and stores the wafer, and a control unit that performs control to keep the inner door closed when the outer door is in the openable state. In this way, by performing control to keep the inner door closed when the operator opens the outer door to replace the wafer in the wafer storage unit, the inner door is already securely closed, so that the laser light irradiated from the conveyor unit and the laser light irradiation unit is securely blocked by the inner door. Therefore, in any of the cases where the transport unit is transporting wafers or the laser irradiation unit is irradiating laser light, the operator can open the outer door to perform wafer replacement operations. As a result, compared with the case where the transport unit and the laser irradiation unit are stopped before performing the wafer replacement operation, the reduction in semiconductor chip production efficiency caused by the operator's replacement of wafers can be suppressed.

In the laser processing device of the first aspect, it is preferred that the control unit is configured to control the inner door to be closed when the outer door is in an openable state while the laser light is irradiated by the laser light irradiation unit. If so configured, the laser light irradiated from the laser light irradiation unit will be effectively shielded by the inner door, so that even during the period when the laser light irradiation unit irradiates the laser light, the operator can open the outer door to replace the wafer. As a result, compared with the case where the wafer replacement operation is performed after the conveyor unit and the laser light irradiation unit are stopped, the reduction in the production efficiency of the semiconductor chip caused by the replacement operation of the wafer by the operator can be suppressed, and by suppressing the increase in the processing time of the wafer in the laser processing device, the deterioration of the production efficiency of the semiconductor chip can be suppressed.

In the laser processing device of the first aspect, it is preferable that the control unit is configured to perform the following control: when the inner door is opened due to the wafer removal and storage by the conveying unit, the outer door is made to be openable after detecting that the inner door is closed. If configured in this way, the operator can open the outer door only after the control unit confirms that the inner door is closed, so the laser light irradiated from the conveying unit and the laser light irradiation unit can be more effectively shielded for the operator.

In this case, it is preferable to further provide a moving part for moving the inner door in the opening and closing direction, and the control part is configured to perform the following control: when the inner door is already opened, the moving part moves the inner door in the closing direction, and after detecting that the inner door is closed, the outer door becomes openable. If configured in this way, the inner door can be automatically closed by the control of the control part, so compared with the case where the inner door is closed based on the operation of the operator, the increase in the operator's work burden can be suppressed.

In the laser processing device of the first aspect, it is preferable that the control unit is configured to perform the following control: when the operator removes and stores the wafer and the outer door is opened, the inner door is opened after detecting that the outer door is closed. If configured in this way, the inner door can be opened only after the control unit confirms that the outer door is closed, thereby effectively preventing the laser light irradiated from the laser light irradiation unit from leaking out of the device.

In this case, it is preferred that the outer door is configured to be manually moved in the opening and closing direction by the operator, and the control unit is configured to perform the following control: when the outer door is already opened, the inner door is opened after it is detected that the outer door has been closed by the operator. If so, the inner door can be opened only after the control unit confirms that the outer door has been closed, so that the laser light irradiated from the laser light irradiation unit can be effectively prevented from leaking to the outside of the device.

In the laser processing device in which the control unit is configured to control the outer door to be openable after detecting that the inner door is closed, it is preferred to further provide an inner door locking unit for locking the inner door, and the control unit is configured to start processing to make the outer door openable based on the inner door being closed in a state locked by the inner door locking unit. If so configured, the inner door can only be opened after the inner door locking unit is unlocked, thereby preventing the operator from opening the inner door after opening the outer door.

In the laser processing device having the above-mentioned inner door locking unit, it is preferred to further have an outer door locking unit for locking the outer door, and the control unit is configured to perform the following control: based on the inner door being closed by the inner door locking unit and the outer door being closed by the outer door locking unit, the cassette in the wafer storage unit carrying the wafer is moved to a replaceable position, and the above-mentioned wafer has been accepted by the operator for replacement. If so configured, when the cassette is moved to the replaceable position, both the inner door and the outer door are closed, so that the transport unit and the operator can avoid interference with the cassette.

In the laser processing device in which the control unit is configured to control the movement of the cassette to the replaceable position, it is preferred that the control unit is configured to perform the following control: based on the cassette having been moved to the replaceable position, a setting is performed to not accept a signal to open the inner door, and the upper lock of the outer door by the upper lock unit for the outer door is made releasable. If configured in this way, even if a signal to open the inner door is sent to the control unit from the wafer storage unit, the conveying unit, and the laser irradiation unit, the control unit does not accept the above signal, so that the inner door can be more effectively prevented from being opened after the upper lock of the outer door by the upper lock unit for the outer door is released.

In the laser processing device in which the control unit is configured to control the outer door upper lock to be in a releasable state, it is preferred to further include an unlocking operation accepting unit, the unlocking operation accepting unit being configured to accept the operation of the operator, and based on the accepted operation of the operator, sending a signal to the control unit to release the outer door upper lock by the outer door upper lock; and the control unit is configured to perform the following control: when the outer door upper lock is in a releasable state, based on the signal to unlock the outer door obtained from the unlocking operation accepting unit, the outer door is unlocked and the outer door becomes openable. If constructed in this way, the operator can unlock the outside door, so the outside door can be opened at the operator's planned timing.

In the laser processing device having the above-mentioned inner door locking unit, it is preferable to further have an outer door locking unit for locking the outer door, and the control unit is configured to not perform the process of making the outer door openable except when the inner door is closed in a state locked by the inner door locking unit and the outer door is closed in a state locked by the outer door locking unit. If so configured, the process of making the outer door openable will only be started when both the inner door and the outer door are locked, thereby preventing the operator from accidentally opening the outer door before the process of making the outer door openable is completed.

In the laser processing device in which the control unit is configured to control the movement of the cassette to a replaceable position, it is preferred to further include a locking operation receiving unit, which is configured to receive the operation of the operator and send a signal to the control unit to lock the outer door by the outer door locking unit based on the accepted operation of the operator. If configured in this way, the operator can lock the outer door, so the operator can recognize that the outer door has been locked.

In the laser processing device, the control unit is configured to perform the following control, that is, the inner door is moved in the closing direction by the moving unit, and after the inner door is detected to be closed, the outer door is made to be openable. It is preferable to further provide an inner door locking unit for locking the inner door, and the control unit is configured to perform the following control: when the wafer is taken out and stored by the conveying unit, the inner door locking unit releases the inner door lock and opens the inner door. If configured in this way, the inner door can be opened automatically, so that the wafer can be taken out and stored smoothly by the conveying unit.

In the laser processing device in which the control unit is configured to release the inner door upper lock by the inner door upper lock unit and control the inner door to open, it is preferred to further provide an outer door upper lock unit for locking the outer door, and the control unit is configured to perform the following control: after detecting that the outer door has been closed in a state locked by the outer door upper lock unit and the inner door has been closed in a state locked by the inner door upper lock unit, the inner door upper lock unit releases the inner door upper lock and opens the inner door. If constructed in this way, the upper lock of the inner door can be released by the upper locking part of the inner door only when both the inner door and the outer door are locked, so the inner door can be opened when the risk of the outer door being opened is reduced.

In the laser processing device provided with the inner door locking part for locking the inner door, it is preferred that the inner door locking part includes: an inner door locking engaging part, which is arranged on the inner door; and an inner door locking engaged part, which is engaged with the inner door locking engaging part only when the inner door is closed to lock the inner door. If so configured, the inner door locking engaged part will engage with the inner door locking engaging part when the inner door is slightly opened, which can prevent the control part from mistaking the inner door for being locked in a closed state, thereby preventing the laser light from being irradiated from the laser light irradiation part when the inner door is slightly opened.

In the laser processing device having the outer door locking part for locking the outer door, the outer door locking part preferably includes: an outer door locking engaging part, which is arranged on the outer door; and an outer door locking engaged part, which engages with the outer door locking engaging part only when the outer door is closed to lock the outer door. If so configured, the outer door locking engaged part will engage with the outer door locking engaging part when the outer door is slightly opened, which can prevent the control part from mistakenly thinking that the outer door is locked in a closed state, thereby preventing the inner door from opening when the outer door is slightly opened.

The semiconductor chip of the second aspect of the present invention is manufactured by a laser processing device, which comprises: a wafer storage part for storing wafers; a conveying part for taking out and storing wafers relative to the wafer storage part; a laser light irradiation part for irradiating laser light along each of a plurality of cutting paths of the wafer taken out and supplied from the wafer storage part by the conveying part; and a device shield part for accommodating the wafer storage part, the conveying part and the laser light irradiation part inside. ; an inner door, which is provided on the inner wall of the device shield part that separates the wafer storage part from the laser light irradiation part, and is opened when the wafer is taken out and stored by the conveyor part; an outer door, which is provided on the outer wall of the device shield part on the opposite side of the inner wall part and the laser light irradiation part, and is opened when the operator takes out and stores the wafer; and a control part, which controls the inner door to be closed when the outer door becomes openable.

In the second aspect of the present invention, as described above, the semiconductor chip is manufactured by a laser processing device provided with the following components: an inner door that is opened when the wafer is taken out and stored by the conveying unit, an outer door that is opened when the wafer is taken out and stored by the operator, and a control unit that controls the inner door to be closed when the outer door is in the openable state. In this way, by controlling the inner door to be closed when the outer door is in the openable state, when the operator opens the outer door to replace the wafer in the wafer storage unit, the inner door is already effectively closed, so that the laser light irradiated from the conveying unit and the laser light irradiation unit is effectively blocked by the inner door. Therefore, in any of the cases where the transport unit is transporting the wafer and the laser irradiation unit is irradiating the laser light, the operator can open the outer door to perform the wafer replacement operation. As a result, compared with the case where the wafer replacement operation is performed after the transport unit and the laser irradiation unit are stopped, a semiconductor chip manufactured by a laser processing device that can suppress the reduction in the production efficiency of semiconductor chips caused by the replacement operation of the operator to replace the wafer can be provided.

The semiconductor chip manufacturing method of the third aspect of the present invention includes the following steps: when the outer door is made to be openable, the inner door is kept closed, the outer door is opened when the operator takes out and stores the wafer, and the inner door is opened when the wafer is taken out and stored by the conveying part relative to the wafer storage part; irradiating laser light along each of the multiple cutting lanes of the wafer on which the multiple semiconductor chips are arranged; and using the expansion part to expand the thin film member, thereby dividing the wafer into multiple semiconductor chips along each of the multiple cutting lanes.

In the semiconductor chip manufacturing method of the third aspect of the present invention, as described above, the following steps are provided: when the outer door is made to be openable, the inner door is kept closed, the outer door is opened when the operator takes out and stores the wafer, and the inner door is opened when the conveyor unit that takes out and stores the wafer relative to the wafer storage unit takes out and stores the wafer. In this way, by performing control to maintain the inner door closed when the outer door is made to be openable, when the operator opens the outer door to replace the wafer in the wafer storage unit, the inner door is already effectively closed, so that the laser light irradiated from the conveyor unit and the laser light irradiation unit is effectively blocked by the inner door. Therefore, in any of the cases where the transport unit is transporting the wafer and the laser irradiation unit is irradiating the laser light, the operator can open the outer door to perform the wafer replacement operation. As a result, compared with the case where the wafer replacement operation is performed after the transport unit and the laser irradiation unit are stopped, a semiconductor chip manufacturing method can be provided that can suppress the reduction in semiconductor chip production efficiency caused by the operator's replacement operation of the wafer.

1: Slotting device

2: Tape attachment device

3: Cutting device

4: Grinding device

5: Tape changing device

6: Expansion device

11: Box section

12: Laser irradiation unit

13: Electrical surface coating cleaning section

14: Installation shield part

14a: Inner wall

14b: Outer wall part

15: Inner door

16:External door

17: Control Department

21: Box storage area

22:Manipulator

23:Transportation mechanism

24: Protective tape attachment area

30: Cutting section

30a: Laser light irradiation unit

30b: Clamping table

30c: Camera Department

30d: Photography Department

31: Box section

31a: First cassette loading unit

31b: Second cassette loading unit

31c: The third cassette loading section

31d: Z-direction moving mechanism

32:Wafer transfer department

32a: Clamping the hand

32b: Y-direction moving mechanism

32c:Track section

32d:Track Department

32e: Attach hands

32f: Z-direction moving mechanism

33: Base part

34: Installation shield part

34a: Inner wall

34b: Opening for inner door

34c: Outer wall

34d: Opening for exterior door

35: Inner door

35a: Door panel

35b: Mobile part

35c: Switch detection sensor

35d: Wafer detection sensor

36: Upper lock for inner door

36a: Locking part for inner door

36b: The locking part for the inner door

37:External door

37a: Door panel

37b: Handle

37c: Switch detection sensor

37d: Operation acceptance department

38: Upper lock for outer door

38a: Locking part for outer door

38b: Locking part for outer door

39: Control Department

41: First box section

42:Manipulator

43: Adsorption and holding part

44:Grinding Department

44a: Rough grinding section

44b: Lapping and cutting section

44c: Fine grinding department

45: Fine grinding department

46: Crystal defect formation part

47: Second box section

48: Rotating table

51: Box storage area

52:Manipulator

53:Transportation mechanism

54: Expansion tape attachment part

55:Ultraviolet irradiation part

100: Semiconductor wafer processing system

301b: Rotating part

302b: Y-direction moving part

303b: X-direction moving part

321a: Clamping part

351b: Solenoid

351c: Magnetic field generating unit

351d:Light projection department

352b:Guide rails

352c: Magnetic field detection unit

353d: Light receiving part

361a: Containment Department

361b: Containment Department

362a: Protruding rod

362b: Protruding rod

363a:Through hole

371c: Magnetic field generating unit

371d: Unlocking operation acceptance department

372c: Magnetic field detection unit

372d: 3rd box replacement request department

373d: 1st cartridge replacement request department

374d: Second cassette replacement request department

375d: Locking operation acceptance department

381a: Containment Department

381b: Containment Department

382a: Protruding rod

382b: Protruding rod

383a:Through hole

601: Box section

602: Lifting the hands

603: Adsorption of hands

604: Air conditioning supply department

605: Cooling unit

606: Expansion Department

607: Expansion and maintenance components

608: Heat shrinkage part

609: Ultraviolet irradiation department

610: Extrusion unit

611: Clamping part

700:Semiconductor wafer processing system

703: Cutting device

732:Wafer transfer department

732e: Transfer head

732f: Transfer head

732g: Z-direction moving mechanism

Ch:Semiconductor chip

Ci: Direction

Co: Direction

Fri:Framework

Fro: Framework

Ld: Laser light

Lg: Laser light

Op:operator

Pd: Location

Rf:Framework

S1: Steps

S2: Step

S3: Step

S4: Step

S5: Step

S6: Step

S101: Step

S102: Step

S103: Step

S104: Step

S105: Step

S106: Step

S107: Step

S108: Step

S109: Step

S110: Step

S111: Steps

S112: Step

S201: Step

S202: Step

S203: Step

S204: Step

S205: Step

S206: Step

S207: Step

S208: Step

S209: Step

S210: Step

S211: Step

S212: Step

S213: Step

Tb: Protective tape

Te: expansion tape

W: Wafer ring structure

Wc: Box

We: Wafer

Ws: cutting path

X: Direction

X1: Direction

X2: Direction

Y: direction

Y1: Direction

Y2: Direction

Z: Direction

Z1: Direction

Z2: Direction

FIG. 1 is a schematic diagram showing an overview of a semiconductor wafer processing system provided with a cutting device and an expanding device according to the first embodiment.

FIG2 is a top view of a slotting device of a semiconductor wafer processing system according to the first embodiment.

FIG3 is a top view of a tape attaching device of a semiconductor wafer processing system according to the first embodiment.

FIG. 4 is a top view of a cutting device of a semiconductor wafer processing system according to the first embodiment.

FIG5 is a top view of a polishing device of a semiconductor wafer processing system according to the first embodiment.

FIG6 is a top view of the tape replacement device of the semiconductor wafer processing system of the first embodiment.

FIG. 7 is a side view of the tape replacement device of the semiconductor wafer processing system of the first embodiment.

FIG8 is a top view showing an expansion device of a semiconductor wafer processing system according to the first embodiment.

FIG. 9 is a side view showing an expansion device of a semiconductor wafer processing system according to the first embodiment.

FIG. 10 is a flow chart showing the semiconductor chip manufacturing process of the semiconductor wafer processing system of the first embodiment.

FIG11 is a three-dimensional diagram showing the appearance of the slotting device of the first embodiment.

FIG12 is a three-dimensional diagram showing the appearance of the cutting device of the first embodiment.

Figure 13 is a top view of the cutting device of the first embodiment.

Figure 14 is a side view of the inner door of the cutting device of the first embodiment viewed from the Y1 direction.

Figure 15 is a side view of the inner door of the cutting device of the first embodiment viewed from the Y2 direction.

Figure 16 is a portion of the Y1 direction side of the cross section along the XIV-XIV line of Figure 13.

Figure 17 is a side view of the inner door of the cutting device of the first embodiment viewed from the Y2 direction.

Figure 18 is a side view of the inner door of the cutting device of the first embodiment viewed from the Y1 direction.

Figure 19 is a portion of the Y2 direction side of the cross section along the XIV-XIV line of Figure 13.

FIG. 20 is a schematic diagram showing the outer door being openable when the laser light irradiation unit irradiates laser light in the cutting device of the first embodiment when the cassette is replaced.

FIG. 21 is a schematic diagram showing a state in which an operator is operating the operation receiving unit when the laser light irradiation unit irradiates laser light when replacing the cassette in the cutting device of the first embodiment.

FIG. 22 is a schematic diagram showing the state in which the inner door is closed and locked when the laser light irradiation unit irradiates laser light when the cassette is replaced in the cutting device of the first embodiment.

FIG. 23 is a schematic diagram showing the state in which the cassette section has moved the cassette to a replaceable position when the laser light irradiation section irradiates the laser light in the cutting device of the first embodiment when the cassette is replaced.

FIG. 24 is a schematic diagram showing a state in which an operator is operating the unlocking operation receiving unit when the laser light irradiation unit irradiates laser light when replacing the cassette in the cutting device of the first embodiment.

FIG. 25 is a schematic diagram showing a state in which the operator has opened the outer door when the laser light irradiation unit irradiates laser light when replacing the cassette in the cutting device of the first embodiment.

FIG. 26 is a schematic diagram showing the state in which the operator is operating the locking operation receiving unit when replacing the cassette in the cutting device of the first embodiment, when the laser light irradiation unit irradiates the laser light.

FIG. 27 is a schematic diagram showing a state in which an operator is operating the locking operation receiving unit when the laser irradiation unit is transporting the wafer via the wafer transport unit in the cutting device of the first embodiment when the cassette is replaced.

FIG. 28 is a schematic diagram showing a state in which the outer door is closed and locked when the laser irradiation unit irradiates laser light when the wafer is taken out by the wafer transport unit in the cutting device of the first embodiment.

FIG. 29 is a schematic diagram showing a state in which the cassette section has moved to a position where the wafer can be taken out when the laser irradiation section irradiates the laser light in the cutting device of the first embodiment when the wafer is taken out by the wafer transport section.

FIG. 30 is a schematic diagram showing a state in which the inner door is opened when the laser irradiation unit irradiates laser light when the wafer is taken out by the wafer transport unit in the cutting device of the first embodiment.

FIG31 is a schematic diagram showing the state in which the holding hand has taken out the wafer when the laser light irradiation unit irradiates the laser light when the wafer is taken out by the wafer transport unit in the cutting device of the first embodiment.

FIG32 is a flow chart showing the external door switch processing in the control unit of the cutting device of the first embodiment.

FIG. 33 is a flow chart showing the inner door switch processing in the control unit of the cutting device of the first embodiment.

FIG. 34 is a schematic diagram showing an overview of a semiconductor wafer processing system provided with a cutting device and an expanding device according to the second embodiment.

Figure 35 is a top view of the cutting device of the second embodiment.

FIG. 36 is a schematic diagram showing the state in which the operator has opened the outer door when the transfer head holds the wafer when replacing the cassette in the cutting device of the second embodiment.

The following is an explanation of the implementation method for embodying the present invention based on the drawings.

[First implementation method]

Referring to FIG. 1 to FIG. 33, the structure of the semiconductor wafer processing system 100 of the first embodiment of the present invention is described.

(Semiconductor wafer processing system)

As shown in FIG. 1 , the semiconductor wafer processing system 100 is a device for processing a wafer We. The semiconductor wafer processing system 100 is configured to form a modified portion on the wafer We, and to divide the wafer We along the modified portion to form a plurality of semiconductor chips Ch. Here, the wafer We is a circular thin plate formed by a crystal of a semiconductor substance that is a material for a semiconductor integrated circuit. A modified portion is formed inside the wafer We, and the modified portion is formed by modifying the inside along a dividing line by processing in the semiconductor wafer processing system 100. That is, the wafer We is processed to be divisible along a dividing line. Here, the so-called modified portion refers to cracks and pores formed inside the wafer We by laser light Ld.

Specifically, the semiconductor wafer processing system 100 has a slotting device 1, a tape attaching device 2, a cutting device 3, a grinding device 4, a tape replacing device 5, and an expanding device 6. Furthermore, the slotting device 1 and the cutting device 3 are both examples of "laser processing devices" within the scope of the patent application.

As shown in FIG. 1 , in the semiconductor wafer processing system 100, the wafer We is processed in the order of the slotting device 1, the tape attaching device 2, the cutting device 3, the grinding device 4, the tape replacing device 5 and the expanding device 6.

<Slotting device>

The slotting device 1 is configured to irradiate the cutting path Ws between the semiconductor chips Ch on the electrical path of the wafer We without the frame Rf and the protective tape Tb installed by the cutting device 3, thereby separating the insulating film and the inspection pattern. Here, the laser light Lg is light with a wavelength shorter than the infrared region. Furthermore, the so-called insulating film refers to the interlayer insulating film of the wafer We. The insulating film is formed of a Low-k material having a relatively low dielectric constant as an interlayer insulating film material. Furthermore, the so-called inspection pattern refers to a test conductive pattern used for functional testing of the semiconductor chip Ch of the wafer We. The inspection pattern is the so-called Teg (Test Element Group).

Specifically, as shown in FIG. 2 , the slotting device 1 includes a cassette section 11, a laser light irradiation section 12, and a circuit surface film cleaning section 13. The cassette section 11 is configured to accommodate a wafer We without a frame Rf and a protective tape Tb. The laser light irradiation section 12 is configured to irradiate a laser light Lg for separating the insulating film and the inspection pattern of the wafer We. The circuit surface film cleaning section 13 is configured to cover the circuit surface of the wafer We before separating the insulating film and the inspection pattern, and to clean the circuit surface of the wafer We after separating the insulating film and the inspection pattern. Furthermore, the cassette section 11 is an example of a "wafer storage section" in the scope of the patent application.

<Tape attachment device>

The tape attaching device 2 is configured to attach the protective tape Tb to the electrical path of the wafer We (refer to FIG. 1 ).

Specifically, as shown in FIG3 , the tape attaching device 2 includes a cassette storage portion 21, a robot 22, a conveying mechanism 23, and a protective tape attaching portion 24. The cassette storage portion 21 is configured to accommodate a frame Rf, a wafer We, and a wafer We attached to the frame Rf. The robot 22 is configured to transport the frame Rf and the wafer We from the cassette storage portion 21 to the conveying mechanism 23, respectively. The robot 22 is configured to transport the wafer We attached to the frame Rf from the conveying mechanism 23 to the cassette storage portion 21. The conveying mechanism 23 is configured to transport the wafer We to a position where the protective tape attaching portion 24 can attach the protective tape Tb. The protective tape attaching unit 24 is configured to attach the protective tape Tb to the wafer We transported by the transport mechanism 23, and to attach the frame Rf to the protective tape Tb.

<Cutting device>

The cutting device 3 is configured to form a modified portion inside the wafer We for dividing the wafer We (refer to FIG. 1 ).

Specifically, as shown in FIG. 4 , the cutting device 3 includes a cutting section 30, a cassette section 31, and a wafer conveying section 32. The cutting section 30 is configured to form a modified section by irradiating a wafer We with a laser light Ld (see FIG. 1 ) having a wavelength that is transparent along a cutting path Ws (dividing line). Here, the laser light Ld is a light with a wavelength in the near-infrared region. The cassette section 31 is configured to accommodate a plurality of wafers We attached to a protective tape Tb together with a frame Rf. The wafer conveying section 32 is configured to convey the wafer We attached to a protective tape Tb together with a frame Rf between the cassette section 31 and the cutting section 30. Furthermore, the cassette section 31 is an example of a "wafer accommodating section" in the scope of the patent application. In addition, the wafer transport unit 32 is an example of a "transport unit" within the scope of the patent application.

<Grinding device>

The polishing device 4 is configured to remove the modified portion of the wafer We formed by the cutting device 3 by grinding the wafer We from the surface opposite to the electrical path surface side (see FIG. 1 ).

Specifically, as shown in FIG5 , the polishing device 4 includes a first cassette section 41, a robot 42, a plurality of adsorption holding sections 43, a plurality of grinding sections 44, a fine polishing section 45, a crystal defect forming section 46, a second cassette section 47, and a single rotary table section 48.

The first cassette section 41 is configured to accommodate the wafer We having the modified portion formed by the cutting device 3. The robot 42 is configured to transport the wafer We with the frame Rf attached thereto from the first cassette section 41 to the adsorption holding section 43 at the position closest to the first cassette section 41 among the plurality of adsorption holding sections 43. Furthermore, the robot 42 is configured to transport the wafer We with the frame Rf attached to the protective tape Tb after the modified portion is removed from the adsorption holding section 43 at the position closest to the second cassette section 47 to the second cassette section 47. The plurality of adsorption holding sections 43 are configured to adsorb and hold the wafer We attached to the protective tape Tb together with the frame Rf.

The plurality of grinding parts 44 are configured to grind the back side of the wafer We opposite to the electrical path surface in stages. The plurality of grinding parts 44 have a rough grinding part 44a, a fine grinding part 44b and a fine grinding part 44c. The rough grinding part 44a is configured to grind the back side of the wafer We by a first grinding material of a first particle size. The fine grinding part 44b is configured to grind the back side of the wafer We by a second grinding material of a second particle size smaller than the first particle size. The fine grinding part 44c is configured to grind the back side of the wafer We by a third grinding material of a third particle size smaller than the second particle size.

The fine grinding section 45 is configured to grind the back of the wafer We after being ground by the plurality of grinding sections 44. The crystal defect forming section 46 is configured to form tiny crystal defects on the back of the wafer We after being ground by the fine grinding section 45. The crystal defect forming section 46 is configured to perform a so-called gettering operation. The second cassette section 47 is configured to accommodate the wafer We with crystal defects formed by the crystal defect forming section 46. The single rotating table section 48 is configured to rotate and move the plurality of adsorption holding sections 43 to positions corresponding to the plurality of grinding sections 44, the fine grinding section 45 and the crystal defect forming section 46, respectively.

<Tape changing device>

The tape replacement device 5 is configured to attach the expansion tape Te to the surface of the wafer We opposite to the electrical path surface after the modified portion is removed from the wafer We by the polishing device 4, and to tear off the protective tape Tb attached to the electrical path surface of the wafer We (refer to FIG. 1 ). Furthermore, the expansion tape Te is an example of a "thin sheet member" in the scope of the patent application.

Specifically, as shown in FIG6 , the tape replacement device 5 includes a cassette storage unit 51, a robot 52, a conveying mechanism 53, an expansion tape attachment unit 54, an ultraviolet irradiation unit 55 (see FIG7 ) and a protective tape stripping unit (not shown).

The cassette storage section 51 is configured to store a wafer We attached to the protective tape Tb together with the frame Rf, and a wafer We attached to the expansion tape Te together with the frame Rf.

The robot 52 is configured to transport the wafer We attached to the protective tape Tb together with the frame Rf from the cassette storage section 51 to the transport mechanism 53. The transport mechanism 53 is configured to transport the wafer We attached to the protective tape Tb together with the frame Rf to the expansion tape attachment section 54. The expansion tape attachment section 54 is configured to attach the frame Rf and the wafer We to both the protective tape Tb and the expansion tape Te by attaching the expansion tape Te to the surface of the frame Rf opposite to the surface to which the protective tape Tb is attached.

The robot 52 is configured to transport the wafer We attached to both the protective tape Tb and the expansion tape Te together with the frame Rf from the transport mechanism 53 to the ultraviolet irradiation unit 55. The ultraviolet irradiation unit 55 is configured to be located inside a closed structure with a door at the entrance and exit. After nitrogen is blown to remove oxygen in the ambient gas and the interior is filled with nitrogen (nitrogen is supplied to the interior, while oxygen is discharged and nitrogen is filled), ultraviolet rays are irradiated to the surface of the frame Rf attached with the protective tape Tb. In this way, the adhesive layer of the protective tape Tb is hardened. The robot 52 is configured to return the wafer We attached to both the protective tape Tb and the expansion tape Te together with the frame Rf from the ultraviolet irradiation unit 55 to the conveying mechanism 53.

The conveying mechanism 53 is configured to convey the wafer We attached to both the protective tape Tb and the expansion tape Te together with the frame Rf to the protective tape peeling section. The protective tape peeling section is configured to tear off the protective tape Tb (refer to FIG. 1 ). The robot 52 is configured to store the wafer We attached to the expansion tape Te together with the frame Rf in the cassette storage section 51 from the conveying mechanism 53.

<Expansion device>

The expansion device 6 is configured to adhere the expansion tape Te to the surface of the wafer We opposite to the electrical path surface, and then expand the expansion tape Te to divide the wafer We into a plurality of semiconductor chips Ch (see FIG. 1 ).

Specifically, as shown in FIG8 and FIG9, the expansion device 6 includes a box portion 601, a lifting hand portion 602, an adsorption hand portion 603, a cold air supply portion 604 (refer to FIG9), a cooling unit 605, an expansion portion 606, an expansion holding member 607, a heat shrinking portion 608 (refer to FIG9), an ultraviolet irradiation portion 609 (refer to FIG9), a squeezing portion 610 and a clamping portion 611.

The cassette section 601 is configured to accommodate a wafer ring structure W formed by attaching a frame Rf and a wafer We to an expansion tape Te. The lifting hand 602 is configured to take out the wafer ring structure W from the cassette section 601. The lifting hand 602 is configured to accommodate the wafer ring structure W in the cassette section 601. The suction hand 603 is configured to suction the frame Rf of the wafer ring structure W from above. The cold air supply section 604 is configured to supply cold air to the expansion tape Te from above when the expansion tape Te is expanded by the expansion section 606.

The cooling unit 605 is configured to cool the expansion tape Te from below. The expansion portion 606 is configured to divide the wafer We along the dicing line Ws (refer to FIG. 1 ) by expanding the expansion tape Te of the wafer ring structure W. The expansion holding member 607 is configured to press the expansion tape Te from above to prevent the expansion tape Te near the wafer We from shrinking due to the heating of the heat shrinking portion 608. The heat shrinking portion 608 is configured to shrink the expansion tape Te expanded by the expansion portion 606 by heating in a state where the gaps between the plurality of semiconductor chips Ch are maintained. The ultraviolet irradiation part 609 is configured to irradiate the expansion tape Te with ultraviolet rays so as to reduce the adhesive force of the adhesive layer of the expansion tape Te.

The squeezing part 610 is configured to further divide the wafer We along the modified part by squeezing the wafer We partially from the bottom side after the expansion tape Te is expanded. The clamping part 611 is configured to move the wafer ring structure W in the up and down directions while holding the frame Rf holding the wafer ring structure W. The clamping part 611 is configured to move the wafer ring structure W in the direction from the cooling unit 605 to the expansion part 606 and in the direction from the expansion part 606 to the cooling unit 605 while holding the frame Rf holding the wafer ring structure W.

(Semiconductor chip manufacturing process)

Below, referring to FIG. 10 , the overall operation of the semiconductor wafer processing system 100 is described.

In step S1, the insulating film and the inspection pattern are separated by the groove opening device 1. That is, the laser light irradiation unit 12 irradiates the laser light Lg along the cutting line Ws between the semiconductor chips Ch of the electrical path of the wafer We that is not attached to the protective tape Tb together with the frame Rf, and separates the insulating film and the inspection pattern. In step S2, the wafer We and the frame Rf are attached to the protective tape Tb by the tape attaching device 2. That is, the protective tape attaching unit 24 attaches the protective tape Tb to the wafer We transported by the transport mechanism 23, and attaches the frame Rf to the protective tape Tb.

In step S3, a modified portion is formed on the wafer We by the cutting device 3. That is, the cutting unit 30 forms the modified portion by irradiating the wafer We with laser light Ld (refer to FIG. 1 ) along the cutting path Ws. In step S4, the modified portion is removed from the wafer We by the grinding device 4. That is, the back side of the wafer We opposite to the electrical path surface is ground in stages by a plurality of grinding units 44, thereby removing the modified portion of the wafer We. In step S5, the protective tape Tb is torn off by the tape changing device 5, and the wafer We and the frame Rf are attached to the expansion tape Te. That is, after the protective tape Tb is torn off from the wafer We with the frame Rf attached, the expansion tape attaching unit 54 attaches the expansion tape Te to the wafer We from which the protective tape Tb has been torn off, and attaches the frame Rf to the expansion tape Te.

In step S6, the expansion tape Te is expanded by the expansion device 6 to divide the wafer We into a plurality of semiconductor chips Ch. That is, the expansion tape Te abutting against the expansion part 606 is stretched downward by lowering the clamping part 611 while maintaining the frame Rf, thereby expanding the expansion tape Te. In this way, the wafer We is divided along the tortoise crack formed on the cutting path Ws of the wafer We by the tensile force generated by the expansion tape Te due to the expansion, thereby dividing a plurality of semiconductor chips Ch.

After step S6, the semiconductor chip manufacturing process is completed.

(Overview of the control of the two doors of the slotting device and the cutting device respectively)

As shown in FIG. 11 , in the slotting device 1 , the wafer We is processed by the laser light Lg irradiated from the laser light irradiation unit 12 . Therefore, the operator Op performs the replacement operation of supplying the wafer We before processing and taking out the wafer We after processing. Here, the so-called supplying the wafer We before processing refers to the operation of the operator Op transporting the cassette Wc carrying a plurality of wafers We and setting it at a specified position in the cassette unit 11 . In addition, the so-called taking out the processed wafer We refers to the operation of the operator Op taking out the cassette Wc set at a specified position in the cassette unit 11 from the outside of the device and transporting it to another location.

The slotting device 1 of the first embodiment is provided with a device shielding part 14, an inner door 15, an outer door 16 and a control part 17 in order to suppress the leakage of the laser light Lg. The device shielding part 14 is configured to accommodate the cassette part 11, the conveying part (not shown) and the laser light irradiation part 12 inside. The inner door 15 is provided on the inner wall part 14a of the cassette part 11 of the device shielding part 14 on the side of the laser light irradiation part 12, and is configured to be opened when the wafer We is taken out and stored by the conveying part. The outer door 16 is provided on the outer wall part 14b of the device shielding part 14 on the opposite side to the laser light irradiation part 12 of the cassette part 11, and is configured to be opened when the operator Op takes out and stores the wafer We.

The control unit 17 is configured to control the inner door 15 to be closed when the outer door 16 is in an openable state. Thus, when the operator Op opens the outer door 16 to perform a replacement operation, the inner door 15 is already closed, so the laser light Lg irradiated from the laser light irradiation unit 12 will not leak out of the device.

Furthermore, as shown in FIG. 12 , in the cutting device 3 of the first embodiment, the wafer We is processed by the laser light Ld irradiated from the laser light irradiation unit 30a. Therefore, the operator Op performs the replacement operation of supplying the wafer We before processing and taking out the wafer We after processing.

The cutting device 3 of the first embodiment is provided with a device shielding part 34, an inner door 35, an outer door 37 and a control part 39 in order to suppress the leakage of the laser light Ld. The device shielding part 34 is configured to house the cutting part 30, the cassette part 31, the wafer conveying part 32 and the control part 39 inside. The inner door 35 is provided on the inner wall part 34a on the side of the laser light irradiation part 30a of the cassette part 31 of the device shielding part 34, and is configured to be opened when the wafer We is taken out and stored by the wafer conveying part 32. The outer door 37 is provided on the outer wall part 34c on the opposite side of the laser light irradiation part 30a of the cassette part 31 of the device shielding part 34, and is configured to be opened when the operator Op takes out and stores the wafer We.

The control unit 39 is configured to control the inner door 35 to be closed when the outer door 37 is in an openable state. Thus, when the operator Op opens the outer door 37 to perform a replacement operation, the inner door 35 is already closed, so the laser light Ld irradiated from the laser light irradiation unit 30a will not leak out of the device.

The control of the two doors of the slotting device 1 of the first embodiment and the cutting device 3 of the first embodiment are the same, so only the structure of the cutting device 3 is described in detail below.

(Composition of cutting device)

As shown in FIG. 12 and FIG. 13 , the cutting device 3 includes a cutting unit 30, a cassette unit 31, a wafer conveying unit 32, a base unit 33, a device shield unit 34, an inner door 35, an inner door upper locking unit 36, an outer door 37, an outer door upper locking unit 38, and a control unit 39.

Here, the up-down direction is set as the Z direction, the up direction is set as the Z1 direction, and the down direction is set as the Z2 direction. The horizontal direction perpendicular to the Z direction is set as the X direction, one direction of the X direction is set as the X1 direction, and the other direction of the X direction is set as the X2 direction. In addition, the horizontal direction perpendicular to the X direction is set as the Y direction, one direction of the Y direction is set as the Y1 direction, and the other direction of the Y direction is set as the Y2 direction.

As shown in FIG13 , the cutting unit 30 includes a laser irradiation unit 30a, a fixture table unit 30b, an imaging unit 30c, and an imaging unit 30d.

The laser irradiation unit 30a is configured to irradiate laser light Ld along each of the plurality of cutting lanes Ws of the wafer We taken out and supplied from the cassette unit 31 by the wafer conveying unit 32. Specifically, the laser irradiation unit 30a is configured to irradiate laser light Ld along each of the plurality of cutting lanes Ws of the wafer We while moving the wafer We relative to the laser irradiation unit 30a via the fixture table unit 30b. The direction extending along each of the plurality of cutting lanes Ws of the wafer We is the processing direction. Here, the processing direction is the X1 direction or the X2 direction.

The fixture table 30b is configured to hold the wafer We by adsorbing the frame Rf attached to the protective tape Tb. The fixture table 30b is configured to rotate or move in the horizontal direction while adsorbing the frame Rf. The fixture table 30b has a rotating portion 301b, a Y-direction moving portion 302b, and an X-direction moving portion 303b.

The imaging unit 30c and the imaging unit 30d are respectively configured to photograph the wafer We held on the fixture table 30b. The imaging unit 30c and the imaging unit 30d are both near-infrared imaging cameras. The imaging unit 30c and the imaging unit 30d can move in the Z1 direction or the Z2 direction, respectively.

As shown in FIG. 12 and FIG. 13 , the cassette section 31 is configured to accommodate a plurality of cassettes Wc carrying a plurality of wafer ring structures W, and the wafer ring structures W are formed by wafers We attached to protective tape Tb and frames Rf. Specifically, the cassette section 31 includes a first cassette loading section 31a, a second cassette loading section 31b, a third cassette loading section 31c, and a Z-direction moving mechanism 31d.

The cassettes Wc containing a plurality of wafers We before processing by the operator Op are placed on the first cassette loading section 31a and the second cassette loading section 31b, respectively. Furthermore, the cassettes Wc containing a plurality of wafers We after processing by the wafer conveying section 32 are placed on the first cassette loading section 31a and the second cassette loading section 31b, respectively. The operator Op takes out the cassettes Wc containing a plurality of wafers We after processing from the first cassette loading section 31a and the second cassette loading section 31b, respectively. The cassettes Wc containing a plurality of wafers We after processing by the wafer conveying section 32 are placed on the third cassette loading section 31c. The quality manager takes out the cassettes Wc containing a plurality of wafers We after processing from the third cassette loading section 31c. That is, the processed wafer We placed in the cassette Wc of the third cassette placement section 31c is the wafer We used for periodic inspection. Furthermore, the quality manager is an example of "operator" within the scope of the patent application.

The Z-direction moving mechanism 31d is configured to move the first cassette mounting portion 31a, the second cassette mounting portion 31b, and the third cassette mounting portion 31c in a single body in the Z1 direction or the Z2 direction. The Z-direction moving mechanism 31d has, for example, a linear conveyor module or a drive portion, and the drive portion has a ball screw and a motor with an encoder.

The wafer conveying unit 32 is configured to convey the wafer ring structure W between the cassette unit 31 and the cutting unit 30. Specifically, the wafer conveying unit 32 has a clamping hand 32a, a Y-direction moving mechanism 32b, a rail unit 32c, a rail unit 32d, a suction hand 32e, and a Z-direction moving mechanism 32f.

The clamping hand 32a is configured as a frame Rf for clamping the wafer ring structure W to take the wafer ring structure W out of the cassette part 31 or to accommodate it in the cassette part 31.

The clamping hand 32a has a clamping portion 321a at the front end for clamping the frame Rf of the wafer ring structure W. The clamping portion 321a is configured to clamp the end of the frame Rf of the wafer ring structure W on the Y1 direction side in the up-down direction.

The clamping hand 32a moves in the Y1 direction or the Y2 direction by the Y-direction moving mechanism 32b. The clamping hand 32a transports the wafer ring structure W by moving by utilizing the Y-direction moving mechanism 32b. The Y-direction moving mechanism 32b has, for example, a linear conveyor module or a drive unit, and the drive unit has a ball screw and a motor with an encoder.

The clamping hand 32a transports the wafer ring structure W taken out from the cassette part 31 to the rail part 32c by the Y-direction moving mechanism 32b. The clamping hand 32a transports the wafer ring structure W that has been transported to the rail part 32c to the rail part 32d by the Y-direction moving mechanism 32b. The clamping hand 32a accommodates the processed wafer ring structure W placed on the rail part 32d in the cassette part 31 by the Y-direction moving mechanism 32b.

The rail portion 32c is configured to support the wafer ring structure W placed by the clamping hand 32a from the Z2 direction side. The rail portion 32d is configured to support the wafer ring structure W placed by either the clamping hand 32a or the adsorption hand 32e from the Z2 direction side. The rail portion 32c and the rail portion 32d are arranged in sequence from the Y2 direction side toward the Y1 direction side. The rail portion 32c is arranged near the cassette portion 31. The rail portion 32d is arranged near the rail portion 32c.

The suction hand 32e is configured to suction the frame Rf of the wafer ring structure W. The suction hand 32e is provided with a suction hole for suctioning the frame Rf of the wafer ring structure W. The Z-direction moving mechanism 32f is configured to move the suction hand 32e in the Z1 direction or the Z2 direction. The Z-direction moving mechanism 32f has, for example, a linear conveyor module or a drive unit, and the drive unit has a ball screw and a motor with an encoder.

The cutting unit 30 and the wafer conveying unit 32 are disposed on the base unit 33.

(Device shield)

As shown in Figures 12 and 13, the device shielding part 34 covers the cutting part 30, the cassette part 31, the wafer conveying part 32, the base part 33 and the control part 39. Such a device shielding part 34 has an inner wall part 34a, an inner door opening 34b, an outer wall part 34c and an outer door opening 34d.

The inner wall portion 34a is a partition wall of the device shield portion 34 that separates the box portion 31 from the laser light irradiation portion 30a. That is, the inner wall portion 34a separates the box portion 31 from the laser light irradiation portion 30a in the space inside the device shield portion 34. The inner door opening 34b connects the space on the box portion 31 side with the space of the laser light irradiation portion 30a in the space inside the device shield portion 34. The inner door opening 34b is a through hole that penetrates the inner wall portion 34a in the Y direction, and the inner door opening 34b is arranged at a height position closer to the Z1 direction side than the outer door opening 34d.

The outer wall portion 34c is a wall of the device shield portion 34 on the opposite side (Y2 direction side) to the laser light irradiation portion 30a side relative to the inner wall portion 34a. The outer wall portion 34c is one of the partition walls of the device shield portion 34 disposed between the space inside the device shield portion 34 and the external space. The outer door opening 34d connects the space on the box portion 31 side in the space inside the device shield portion 34 with the external space of the device shield portion 34. The outer door opening 34d is a through hole that penetrates the outer wall portion 34c in the Y direction, and the outer door opening 34d is arranged at a height position closer to the Z2 direction side than the inner door opening 34b.

(Inside door)

As shown in FIG. 14 , the inner door 35 is the inner door of the two doors provided to shield the laser light Ld irradiated from the laser light irradiation unit 30a. Furthermore, FIG. 14 is a view of the inner wall portion 34a provided with the inner door 35 as viewed from the Y1 direction side. The inner door 35 is configured to be opened when the wafer ring structure W (wafer We) is taken out and stored by the wafer conveying unit 32, respectively.

Specifically, the inner door 35 has a door panel 35a, a moving part 35b, a switch detection sensor 35c and a wafer detection sensor 35d (see FIG. 15 ).

The door panel 35a is configured to close the inner door opening 34b. The size of the door panel 35a is larger than the size of the inner door opening 34b in each of the X direction and the Z direction. The moving portion 35b is configured to move the door panel 35a in the switching direction. The moving portion 35b is configured by a linear moving mechanism that moves in the Ci direction (closing direction) or the Oi direction (opening direction). Here, the Oi direction is a direction parallel to the Z1 direction, and the Ci direction is a direction parallel to the Z2 direction. The moving portion 35b has a solenoid 351b, a guide rail 352b, and a movement detection sensor (not shown). Furthermore, the movement detection sensor is a sensor that detects the movement of the plunger of the solenoid 351b in either the Z1 direction or the Z2 direction.

The switch detection sensor 35c is a sensor that detects whether the door panel 35a of the inner door 35 is opened or closed with respect to the inner door opening 34b. The switch detection sensor 35c is a magnetic sensor having a magnetic field generating part 351c and a magnetic field detecting part 352c. Furthermore, the switch detection sensor 35c may also be a sensor using other detection methods.

When the door panel 35a of the inner door 35 closes the inner door opening 34b, the switch detection sensor 35c brings the magnetic field generating unit 351c and the magnetic field detecting unit 352c into close contact, so that the magnetic field detecting unit 352c detects the magnetic field generated by the magnetic field generating unit 351c. Thus, the switch detection sensor 35c detects that the door panel 35a of the inner door 35 has closed the inner door opening 34b. When the door panel 35a of the inner door 35 opens the inner door opening 34b, the switch detection sensor 35c separates the magnetic field generating unit 351c from the magnetic field detecting unit 352c, so that the magnetic field detecting unit 352c cannot detect the magnetic field generated by the magnetic field generating unit 351c. In this way, the switch detection sensor 35c detects that the door panel 35a of the inner door 35 has opened the inner door opening 34b.

As shown in FIG. 15 , the wafer detection sensor 35d is a sensor for detecting whether the wafer ring structure W transported by the gripping hand 32a passes through the inner door opening 34b. The wafer detection sensor 35d is a transmissive sensor having a light projecting portion 351d and a light receiving portion 353d. Furthermore, the wafer detection sensor 35d may also be a sensor using other detection methods.

(Inside upper lock)

As shown in FIG. 16 , the inner door locking portion 36 is configured to lock the inner door 35. The inner door locking portion 36 has an inner door locking engaging portion 36a and an inner door locking engaged portion 36b.

The inner door upper locking engaging portion 36a is configured to engage with the inner door upper locking engaged portion 36b. The inner door upper locking engaging portion 36a is mounted on the Y2 direction side surface of the door panel 35a of the inner door 35. The inner door upper locking engaging portion 36a has a receiving portion 361a and a protruding rod portion 362a. The receiving portion 361a receives the protruding rod portion 362a in a retractable manner. The protruding rod portion 362a protrudes from the receiving portion 361a by moving in the Y2 direction. The protruding rod portion 362a is received in the receiving portion 361a by moving in the Y1 direction. A through hole 363a is formed in the protruding rod portion 362a that passes through in the X direction.

The engaged portion 36b for locking the inner door is configured to be engaged with the engaged portion 36a for locking the inner door. The engaged portion 36b for locking the inner door is mounted on the frame Fri of the support device shield portion 34. The engaged portion 36b for locking the inner door has a receiving portion 361b and a protruding rod portion 362b. The receiving portion 361b receives the protruding rod portion 362b in a retractable manner. The protruding rod portion 362b protrudes from the receiving portion 361b by moving in the X1 direction. The protruding rod portion 362b is received in the receiving portion 361b by moving in the X2 direction.

According to the above structure, the inner door locking part 36 locks the inner door 35 by inserting the protruding rod part 362b into the through hole 363a of the protruding rod part 362a.

(External door)

As shown in FIG. 17 , the outer door 37 is the outer door of the two doors provided to shield the laser light Ld irradiated from the laser light irradiation section 30a. Furthermore, FIG. 17 is a view of the outer wall portion 34c provided with the outer door 37 as viewed from the Y2 direction side. The outer door 37 is configured to be manually moved in the switching direction by the operator Op. The opening direction in the switching direction is set as the Oo direction, and the closing direction in the switching direction is set as the Co direction.

Specifically, the outer door 37 has a door panel 37a, a handle 37b, a switch detection sensor 37c and an operation receiving portion 37d.

The door panel 37a is configured to close the outer door opening 34d. The dimensions of the door panel 37a and the outer door opening 34d are substantially the same in both the X direction and the Z direction. The handle portion 37b is configured to move the door panel 37a in the opening and closing direction. The handle portion 37b is a component for the operator Op to pull in the Y2 direction to rotate the door panel 37a in the Oo direction (opening direction). The handle portion 37b is a component for the operator Op to push in the Y1 direction to rotate the door panel 37a in the Co direction (closing direction).

When the door panel 37a of the outside door 37 closes the outside door opening 34d, the switch detection sensor 37c brings the magnetic field generating unit 371c and the magnetic field detecting unit 372c into close contact, so that the magnetic field detecting unit 372c detects the magnetic field generated by the magnetic field generating unit 371c. Thus, the switch detection sensor 37c detects that the door panel 37a of the outside door 37 has closed the outside door opening 34d. When the door panel 37a of the outer door 37 opens the outer door opening 34d, the switch detection sensor 37c separates the magnetic field generating unit 371c from the magnetic field detecting unit 372c, so that the magnetic field detecting unit 372c cannot detect the magnetic field generated by the magnetic field generating unit 371c. In this way, the switch detection sensor 37c detects that the door panel 37a of the outer door 37 has opened the outer door opening 34d.

The operation accepting unit 37d is configured to accept the operation of the operator Op. The operation accepting unit 37d has an unlocking operation accepting unit 371d, a third cassette replacement request unit 372d, a first cassette replacement request unit 373d, a second cassette replacement request unit 374d, and a locking operation accepting unit 375d. The unlocking operation accepting unit 371d, the third cassette replacement request unit 372d, the first cassette replacement request unit 373d, the second cassette replacement request unit 374d, and the locking operation accepting unit 375d are respectively arranged from the Z1 direction side to the Z2 direction side and are arranged in a plurality of (5) buttons. Furthermore, the number of buttons can also be 1 to 4 or more than 6.

The unlocking operation accepting unit 371d is configured to accept the operation (pressing operation) of the operator Op. The unlocking operation accepting unit 371d is configured to send a signal to the control unit 39 to release the outer door 37 by the outer door locking unit 38 based on the accepted operation of the operator Op. The unlocking operation accepting unit 371d is always lit. The unlocking operation accepting unit 371d is configured to flash when the preparation for opening the outer door 37 is completed after any one of the first cassette replacement request unit 373d, the second cassette replacement request unit 374d, and the third cassette replacement request unit 372d accepts the operation of the operator Op. If the operator Op opens the outer door 37, the unlocking operation receiving unit 371d turns off. The unlocking operation receiving unit 371d turns on when the operator Op operates the locking operation receiving unit 375d and the outer door 37 is locked.

The third cassette replacement request unit 372d is configured to accept the operation (pressing operation) of the quality manager. The quality manager operates the third cassette replacement request unit 372d to visually inspect the wafer We regularly. The third cassette replacement request unit 372d is configured to send a signal to the control unit 39 requesting the third cassette placement unit 31c to move to the removal position (Pd position in Figure 23) based on the operation accepted by the quality manager.

When the third cassette loading section 31c can accommodate cassettes Wc, the third cassette replacement request section 372d lights up. When there is no cassette Wc in the third cassette loading section 31c, the third cassette replacement request section 372d turns off. When the third cassette loading section 31c is full of cassettes Wc, the third cassette replacement request section 372d flashes to inform that the cassettes Wc need to be taken out. The third cassette replacement request section 372d starts flashing at high speed based on the operation of the accepted quality manager, and sends a signal to the control section 39 requesting the third cassette loading section 31c to move to the removal position. The third cassette replacement request unit 372d is configured to terminate the high-speed flashing and return to normal lighting based on the quality manager operating the locking operation receiving unit 375d, and the outer door 37 has been locked.

The first cassette replacement request unit 373d is configured to accept the operation of the operator Op. The operator Op operates the first cassette replacement request unit 373d to replace the cassette Wc loaded on the first cassette loading unit 31a. The first cassette replacement request unit 373d is configured to send a signal to the control unit 39 requesting the first cassette loading unit 31a to move to the removal position (Pd position in Figure 23) based on the operation of the operator Op that has been accepted.

When the first cassette loading section 31a can accommodate cassettes Wc, the first cassette replacement request section 373d lights up. When there is no cassette Wc in the first cassette loading section 31a, the first cassette replacement request section 373d turns off. When the first cassette loading section 31a is full of processed cassettes Wc, the first cassette replacement request section 373d flashes to inform that the cassettes Wc need to be taken out. The first cassette replacement request section 373d starts flashing at high speed based on the operation of the operator Op, and sends a signal to the control section 39 requesting the first cassette loading section 31a to move to the take-out position. The first cassette replacement request unit 373d is configured to terminate the high-speed flashing and return to normal lighting based on the operator Op operating the locking operation receiving unit 375d, the outer door 37 has been locked, and the light is restored to normal lighting.

The second cassette replacement request unit 374d is configured to accept the operation of the operator Op. The operator Op operates the second cassette replacement request unit 374d to replace the cassette Wc loaded on the second cassette loading unit 31b. The second cassette replacement request unit 374d is configured to send a signal to the control unit 39 requesting the second cassette loading unit 31b to move to the removal position (Pd position in Figure 23) based on the operation of the operator Op that has been accepted.

When the second cassette loading section 31b can accommodate cassettes Wc, the second cassette replacement request section 374d lights up. When there is no cassette Wc in the second cassette loading section 31b, the second cassette replacement request section 374d turns off. When the second cassette loading section 31b is fully loaded with processed cassettes Wc, the second cassette replacement request section 374d flashes to inform that the cassettes Wc need to be taken out. Based on the operation of the operator Op, the second cassette replacement request section 374d starts flashing at high speed and sends a signal to the control section 39 requesting the second cassette loading section 31b to move to the removal position. The second cassette replacement request unit 374d is configured to terminate the high-speed flashing and return to normal lighting based on the operator Op operating the locking operation receiving unit 375d, and the outer door 37 has been locked.

The locking accepting unit 365d is configured to accept the operation of the operator Op. The locking accepting unit 365d is configured to send a signal to the control unit 39 to lock the outer door 37 by the outer door locking unit 38 based on the operation of the operator Op being accepted. The locking operation accepting unit 375d is always lit. If the operator Op opens the outer door 37, the locking operation accepting unit 375d flashes. The locking operation accepting unit 375d is configured to send a signal to the control unit 39 to lock the outer door 37 based on the operator Op operating the locking operation accepting unit 375d after the outer door 37 is closed by the operator Op. The locking operation receiving unit 375d is configured to restore the light to the normal state after the operator Op locks the outer door 37.

(Top lock for outside door)

As shown in FIG. 19 , the outer door locking portion 38 is configured to lock the outer door 37. The outer door locking portion 38 has an outer door locking engaging portion 38a and an outer door locking engaged portion 38b.

The outer door upper locking engaging portion 38a is configured to engage with the outer door upper locking engaged portion 38b. The outer door upper locking engaging portion 38a is mounted on the surface of the door panel 37a of the outer door 37 on the Y1 direction side. The outer door upper locking engaging portion 38a has a receiving portion 381a and a protruding rod portion 382a. The receiving portion 381a receives the protruding rod portion 382a in a retractable manner. The protruding rod portion 382a protrudes from the receiving portion 381a by moving in the Y1 direction. The protruding rod portion 382a is received in the receiving portion 381a by moving in the Y1 direction. A through hole 383a that passes through in the Z direction is formed in the protruding rod portion 382a.

The outer door upper locking engaging portion 38b is configured to engage with the outer door upper locking engaging portion 38a. The outer door upper locking engaging portion 38b is mounted on the frame Fro of the support device shield portion 34. The outer door upper locking engaging portion 38b has a receiving portion 381b and a protruding rod portion 382b. The receiving portion 381b receives the protruding rod portion 382b in a retractable manner. The protruding rod portion 382b protrudes from the receiving portion 381b by moving in the Z1 direction. The protruding rod portion 382b is received in the receiving portion 381b by moving in the Z2 direction.

According to the above structure, the outer door locking portion 38 locks the outer door 37 by inserting the protruding rod portion 382b into the through hole 383a of the protruding rod portion 382a.

(Control Department)

The control unit 39 is configured to control the cutting unit 30, the cassette unit 31, the wafer conveying unit 32, the inner door 35, the inner door upper lock 36, and the outer door upper lock 38, respectively, so as to process the wafer We by the cutting device 3. The control unit 39 is electrically connected to the cutting unit 30, the cassette unit 31, the wafer conveying unit 32, the inner door 35, the inner door upper lock 36, the outer door 37, and the outer door upper lock 38, respectively.

Specifically, the control unit 39 includes a CPU (Central Processing Unit), and a memory unit having ROM (Read Only Memory), RAM (Random Access Memory), and SSD (Solid State Drive). The memory unit stores a control program for controlling the cutting device 3.

<Case replacement performed by operators>

As shown in FIG. 20 , the control unit 39 of the first embodiment is configured to control the switches of the two doors, so that during the period of irradiating the laser light Ld from the laser light irradiation unit 30a, the operator Op (quality assurance personnel) can also perform at least one of the operations of taking out the cassette Wc from the cassette unit 31 and storing a new cassette Wc in the cassette unit 31. Furthermore, FIG. 20 to FIG. 26 schematically show an example of the case where the operator Op replaces the cassette. Here, the so-called cassette replacement means storing a new cassette Wc in the cassette unit 31 after taking out the cassette Wc from the cassette unit 31.

That is, the control unit 39 is configured to control the inner door 35 to be closed when the outer door 37 is in an openable state. Specifically, the control unit 39 is configured to control the inner door 35 to be closed when the laser light Ld is irradiated by the laser light irradiation unit 30a. At this time, the control unit 39 is configured to control as follows: when the inner door 35 is opened by taking out and storing the wafer We by the wafer conveying unit 32, the outer door 37 is made to be openable after detecting that the inner door 35 is closed.

The following describes the control structure for making the outer door 37 openable by showing an example of replacing the cassette Wc by the operator Op. Here, the following situation is shown as an example: when processing the wafer We by the laser light Ld irradiated from the laser light irradiation unit 30a, the operator Op replaces the cassette Wc placed on the first cassette placement unit 31a. Furthermore, when the operator Op replaces the cassette Wc placed on the second cassette placement unit 31b, and when the quality manager replaces the cassette Wc placed on the third cassette placement unit 31c, etc., the control for making the outer door 37 openable is also performed.

<Determination of whether to start processing to make the outer door openable>

First, in the control unit 39, a determination is made as to whether or not the process of making the outer door 37 openable can be started. This determination is described below.

As shown in FIG. 21 , the control unit 39 is configured to perform the following control: based on the signal obtained (received) from the operator Op operating the first cassette replacement request unit 373d, it is determined whether there is a wafer We currently being processed by the laser light irradiation unit 30a (wafer We being processed) among the corresponding plurality of wafers We in the cassette Wc placed in the first cassette placement unit 31a. Here, the first cassette replacement request unit 373d designated by the operator Op is the target cassette Wc designated by the operator Op. In addition, the so-called wafer We being processed refers to the wafer We that is transported from the target cassette Wc, transported to the laser light irradiation unit 30a, and is being processed by the laser light Ld. In addition, the information such as the positions of the multiple wafers We in the cassette Wc has been pre-stored in an external server, etc.

The control unit 39 is configured to perform the following control: when it is determined that there is no wafer We currently being processed by the laser light irradiation unit 30a in the target cassette Wc, it is determined whether there is a wafer We (unprocessed wafer We) that has not been processed by the laser light irradiation unit 30a among the corresponding plurality of wafers We in the cassette Wc (target cassette Wc) placed on the first cassette placement unit 31a. The control unit 39 is configured to perform the following control: when it is determined that there is a wafer We that has not been processed by the laser light irradiation unit 30a, a screen for accepting a judgment on whether to perform cassette replacement is displayed to the operator Op. The control unit 39 is configured to terminate the control when the operator Op accepts a judgment on not to perform cassette replacement. The control unit 39 is configured to perform the following control: when the operator Op receives a decision to replace the cassette, it determines whether there are wafers We that have not been stored in the cassette unit 31 as described below.

The control unit 39 is configured to perform the following control: when it is determined that there is no wafer We that has not been processed by the laser irradiation unit 30a, it is determined whether there is a wafer We being transported by the wafer transport unit 32 among the corresponding multiple wafers We in the cassette Wc (target cassette Wc) loaded on the first cassette loading unit 31a. The control unit 39 is configured to perform the following control: when there is no wafer We being transported, it is determined whether the inner door 35 and the outer door 37 are each locked. The control unit 39 is configured to perform the following control: when there is a wafer We being transported, it waits until the wafer We being transported is received by the gripping hand 32a of the wafer transport unit 32 into the cassette Wc loaded on the first cassette loading unit 31a.

By the control as described above, the control unit 39 determines whether the process of making the outer door 37 openable can be started. When the result of the determination is that the process of making the outer door 37 openable can be started, the control unit 39 starts the process of making the outer door 37 openable. When the result of the determination is that the process cannot be started, the control of the control unit 39 ends.

<Processing to make the outer door openable>

Next, the following describes the process of making the outer door 37 openable in the control unit 39 with reference to Figures 21 to 26.

As shown in FIG. 21 and FIG. 22, the control unit 39 is configured to start processing to make the outer door 37 openable based on the fact that the inner door 35 has been closed in a state locked by the inner door locking unit 36.

Here, the control unit 39 is configured to perform the following control: when the inner door 35 is opened, the inner door 35 is moved in the Ci direction (closing direction) by the moving unit 35b, and after detecting that the inner door 35 is closed, the outer door 37 is made to be openable. Specifically, the control unit 39 is configured to perform the following control: when the switch detection sensor 35c detects that the door panel 35a is opened, the door panel 35a is moved in the Ci direction by the moving unit 35b. Furthermore, the control unit 39 is configured to perform the following control: based on the switch detection sensor 35c detecting that the door panel 35a is closed, the inner door 35 is locked by the inner door locking unit 36. The control unit 39 is configured to perform the following control: after detecting that the inner door 35 is locked by the inner door upper locking unit 36, the outer door 37 becomes openable.

Furthermore, the control unit 39 is configured to perform the following control: based on the fact that the outer door 37 has been closed in a state locked by the outer door locking unit 38, the process of making the outer door 37 openable is started.

Here, the control unit 39 is configured to perform the following control: when the outer door 37 is already opened, after detecting that the outer door 37 has been closed by the operator Op, the outer door 37 is made to be openable. Specifically, the control unit 39 is configured to perform the following control: based on the switch detection sensor 37c detecting that the door panel 37a has been closed, the outer door 37 is locked by the outer door locking unit 38. The control unit 39 is configured to perform the following control: after detecting that the outer door locking unit 38 has locked the outer door 37, the outer door 37 is made to be openable.

As shown in FIG. 23 , the control unit 39 is configured to perform the following control: based on the inner door 35 being closed by the inner door locking unit 36 and the outer door 37 being closed by the outer door locking unit 38 , the cassette Wc in the cassette unit 31 carrying the wafer We that has been replaced by the operator Op is moved to the replaceable Pd position by the Z-direction moving mechanism 31d. Furthermore, although this is only an example, FIG. 23 moves the cassette Wc placed on the first cassette placement unit 31a to the Pd position.

Here, the control unit 39 is configured not to process the outer door 37 to be openable except when the inner door 35 is closed by the inner door locking unit 36 and the outer door 37 is closed by the outer door locking unit 38. In this case, the control of the control unit 39 ends.

The control unit 39 is configured to perform the following control: based on the fact that the cassette Wc has been moved to the replaceable Pd position, a setting is performed to not accept the signal to open the inner door 35, and the outer door upper lock unit 38 makes the upper lock of the outer door 37 releasable. Here, the setting of not accepting the signal to open the inner door 35 means the following setting: in the control unit 39, the signal requesting to open the inner door 35 sent from the cutting unit 30, the cassette unit 31 and the wafer conveying unit 32 is not accepted.

As shown in FIG. 24 , the control unit 39 is configured to perform the following control: when the outer door 37 is locked and can be unlocked, the outer door 37 is unlocked based on the signal received from the unlocking operation receiving unit 371d to unlock the outer door 37, so that the outer door 37 can be opened. Here, the unlocking state of the outer door 37 is notified to the operator Op by flashing the unlocking operation receiving unit 371d based on the signal from the control unit 39.

Specifically, the control unit 39 is configured to control the flashing of the unlocking operation receiving unit 371d when the lock on the outer door 37 is in a releasable state. The control unit 39 is configured to control the following: based on the signal for unlocking the outer door 37 sent from the unlocking operation receiving unit 371d by the operation of the operator Op, the outer door 37 is unlocked and the outer door 37 becomes openable.

By the above control, as shown in FIG. 25 , the operator Op can open the outer door 37. At this time, the inner door 35 has been locked by the inner door locking unit 36. After opening the outer door 37, the operator Op takes out the cassette Wc from the first cassette loading unit 31a, and then loads the new cassette Wc on the first cassette loading unit 31a. Then, after closing the outer door 37, the operator Op performs the operation of pressing the locking operation receiving unit 375d.

Here, the control unit 39 is configured to perform the following control: based on the switch detection sensor 37c detecting that the outer door 37 has been opened by the operator Op, the unlocking operation receiving unit 371d is turned off, and the locking operation receiving unit 375d is flashing. The control unit 39 is configured to perform the following control: based on the switch detection sensor 37c detecting that the outer door 37 has been closed by the operator Op, the unlocking operation receiving unit 371d is always lit, and the locking operation receiving unit 375d is always lit. In addition, the control unit 39 is configured to perform control to return the cassette unit 31 to its original position.

Through the above control, the outer door 37 is processed to be openable.

As an example of such processing to make the outer door 37 openable, the following situation is shown: during the period of irradiating the laser light Ld from the laser light irradiation unit 30a, the operator Op (quality assurance personnel) performs at least one of the operations of taking out the cassette Wc from the cassette unit 31 and storing a new cassette Wc in the cassette unit 31. Here, as another example of processing to make the outer door 37 openable, as shown in FIG. 27, the following situation is shown: during the period of transporting the wafer We by the gripping hand 32a of the wafer transport unit 32, the operator Op (quality assurance personnel) performs at least one of the operations of taking out the cassette Wc from the cassette unit 31 and storing a new cassette Wc in the cassette unit 31.

<Taking out and storing wafers by the wafer transport unit>

As shown in FIG. 28 , the control unit 39 of the first embodiment is configured to perform the following control: when the operator Op (quality assurance personnel) does not perform at least one of the operations of taking out the cassette Wc from the cassette unit 31 and storing a new cassette Wc in the cassette unit 31, the wafer We is taken out and stored by the gripping hand 32a of the wafer conveying unit 32. Furthermore, FIG. 28 to FIG. 31 schematically show an example of taking out the wafer We from the cassette Wc by the gripping hand 32a.

That is, the control unit 39 is configured to control the outer door 37 to be closed when the inner door 35 is opened. At this time, the control unit 39 is configured to control as follows: when the operator Op takes out and stores the wafer We and the outer door 37 is opened, the inner door 35 is opened after detecting that the outer door 37 is closed.

The following is an example of the control structure for opening the inner door 35, in which the wafer We is taken out by the clamping hand 32a. In addition, when the wafer We is stored by the clamping hand 32a, the same control for opening the inner door 35 is also performed.

As shown in FIG. 28 , the control unit 39 is configured to perform the following control: based on the information related to the wafer We taken out from the wafer conveying unit 32, it is determined whether the inner door 35 and the outer door 37 are opened. The control unit 39 is configured to perform the following control: when the outer door 37 is opened, after detecting that the outer door 37 has been closed by the operator Op, the inner door 35 is opened. In addition, the control unit 39 is configured to perform the following control: when the inner door 35 is opened, after detecting that the inner door 35 has been closed, the inner door 35 is opened. Here, the information related to the wafer We taken out from the wafer conveying unit 32 includes the position information (address information) of the wafer We, etc.

That is, the control unit 39 is configured to perform the following control: when the inner door 35 is opened, the wafer detection sensor 35d is used to determine whether there is a wafer We in the inner door opening 34b. The control unit 39 is configured to perform the following control: based on the determination that there is no wafer We, the inner door 35 is closed. The control unit 39 is configured to perform the following control: based on the switch detection sensor 35c detecting that the inner door 35 is closed, the inner door 35 is locked by the inner door locking unit 36. The control unit 39 is configured to perform the following control: based on the detection that the inner door 35 has been locked by the inner door locking unit 36, the inner door 35 is opened.

Thus, the control unit 39 is configured to perform the following control: after detecting that the outer door 37 has been closed in a state locked by the outer door locking unit 38 and the inner door 35 has been closed in a state locked by the inner door locking unit 36, the inner door 35 is unlocked by the inner door locking unit 36 and the inner door 35 is opened.

Specifically, as shown in FIG. 28 , the control unit 39 is configured to perform the following control: based on the detection that the outer door 37 has been closed by the outer door locking unit 38 and the inner door 35 has been closed by the inner door locking unit 36 , the cassette Wc in the cassette unit 31 carrying the wafer We corresponding to the information from the wafer conveying unit 32 is moved to the replaceable Pt position by the Z-direction moving mechanism 31d. Furthermore, although it is only an example, FIG. 28 moves the cassette Wc placed on the first cassette placement unit 31a to the Pt position.

The control unit 39 is configured to perform the following control: based on the fact that the cassette Wc has been moved to the replaceable Pt position, a setting is made to not accept a signal to release the upper lock of the outer door 37, and the upper lock of the inner door 35 is released by the inner door upper lock unit 36. Here, the setting of not accepting a signal to release the upper lock of the outer door 37 means the following setting: in the control unit 39, a signal requesting to release the upper lock of the outer door 37 sent from the cutting unit 30, the cassette unit 31, and the wafer conveying unit 32 is not accepted.

As shown in FIG30 , the control unit 39 is configured to perform the following control: based on the detection that the inner door 35 upper lock has been released by the inner door upper lock unit 36, the inner door 35 is opened. The control unit 39 is configured to perform the following control: based on the detection that the inner door 35 has been opened by the switch detection sensor 35c, information indicating that the wafer We can be taken out is sent to the wafer conveying unit 32. In this way, the control unit 39 is configured to perform the following control: when the wafer We is taken out (or stored) by the wafer conveying unit 32, the inner door upper lock unit 36 releases the inner door 35 upper lock and opens the inner door 35.

As shown in FIG31 , the control unit 39 is configured to perform the following control: based on receiving information related to completion of the removal of the wafer We from the wafer transport unit 32, the inner door 35 is closed. The control unit 39 is configured to perform the following control: based on detecting that the inner door 35 is closed by the switch detection sensor 35c, the inner door 35 is locked by the inner door locking unit 36. The control unit 39 is configured to terminate the control based on detecting that the inner door 35 is locked by the inner door locking unit 36.

Through the above control, the inner door 35 is opened.

(External door switch processing)

Here, referring to Figure 32, the external door opening and closing process performed by the operator Op when taking out and storing the box Wc is explained.

As shown in FIG. 32 , in step S101, the control unit 39 determines whether a signal from the operation receiving unit 37d (any one of the third cassette replacement request unit 372d, the first cassette replacement request unit 373d, and the second cassette replacement request unit 374d) has been received (refer to FIG. 21 ). When a signal from the operation receiving unit 37d has been received, the process proceeds to step S102. When a signal from the operation receiving unit 37d has not been received, the outer door opening and closing process is terminated. In step S102, the control unit 39 determines whether the laser light irradiation unit 30a is currently processing the wafer We corresponding to the cassette Wc of the target. That is, the control unit 39 determines whether there is a wafer We currently being processed by the laser irradiation unit 30a among the corresponding plurality of wafers We in the target cassette Wc. When there is no wafer We being processed, the process proceeds to step S103. When there is a wafer We being processed, the outer door switch process is terminated.

In step S103, the control unit 39 determines whether there is an unprocessed wafer We in the target cassette Wc. That is, the control unit 39 determines whether there is a wafer We (unprocessed wafer We) that has not been processed by the laser light irradiation unit 30a among the corresponding plurality of wafers We in the target cassette Wc. When there is no unprocessed wafer We, the process proceeds to step S104, and when there is an unprocessed wafer We, the process proceeds to step S112. In step S112, the control unit 39 determines whether the operator Op has been accepted to continue the processing operation in order to open and close the outer door 37 even when there is an unprocessed wafer We. When the operator Op continues to execute the processing operation, enter step S104. When the operator Op does not continue to execute the processing operation, the external door opening and closing processing is terminated.

In step S104, the control unit 39 determines whether the wafer We corresponding to the target cassette Wc is being transported. That is, the control unit 39 determines whether there is a wafer We being transported by the wafer transport unit 32 among the corresponding multiple wafers We in the target cassette Wc. When there is no wafer We being transported, step S105 is entered. When there is a wafer We being transported, step S104 is repeated.

In step S105, the control unit 39 determines whether both the outer door 37 and the inner door 35 are locked (refer to Figure 22). When both the outer door 37 and the inner door 35 are locked, the process proceeds to step S106. When at least one of the outer door 37 and the inner door 35 is not locked, the outer door opening and closing process is terminated.

In step S106, the control unit 39 moves the box Wc to a predetermined position (Pd position) aligned with the outer door opening 34d (refer to FIG. 23). In step S107, the control unit 39 sets a signal not to be accepted to open the inner door 35. In step S108, the control unit 39 makes the upper lock of the outer door upper lock unit 38 releasable. In step S109, the control unit 39 determines whether the operation of the operator Op on the unlocking operation accepting unit 371d has been accepted (refer to FIG. 24). When the operation of the operator Op on the unlocking operation accepting unit 371d has been accepted, the upper lock of the outer door upper lock unit 38 is released, and then the process proceeds to step S110. When the operator Op's operation on the unlocking operation accepting unit 371d is not accepted, step S109 is repeated.

In step S110, the control unit 39 determines whether the operation of the operator Op on the locking operation receiving unit 375d has been accepted (refer to Figures 25 and 26). When the operation of the operator Op on the locking operation receiving unit 375d has been accepted, step S111 is entered. When the operation of the operator Op on the locking operation receiving unit 375d has not been accepted, step S110 is repeated. In step S111, the control unit 39 ends the outer door opening and closing processing after locking the outer door 37 by the outer door locking unit 38.

(Inner door switch processing)

Here, referring to FIG. 33, the inner door opening and closing process performed when the wafer We is taken out and stored by the wafer transfer unit 32 is described.

In step S201, the control unit 39 determines whether the information related to the wafer We (information on the removal or storage of the wafer We) has been received from the wafer transport unit 32. When the information related to the wafer We has been received, the process proceeds to step S202. When the information related to the wafer We has not been received, the inner door switch processing is terminated. In step S202, the control unit 39 determines whether the outer door 37 has been locked. When the outer door 37 has been locked, the process proceeds to step S203. When the outer door 37 is not locked, step S202 is repeated.

In step S203, the control unit 39 determines whether the inner door 35 is locked. When the inner door 35 is locked, it proceeds to step S204. When the inner door 35 is not locked, it proceeds to step S212. In step S212, the control unit 39 determines whether the wafer We is detected in the inner door opening 34b by the wafer detection sensor 35d. When the wafer We is detected, step S212 is repeated. When the wafer We is not detected, it proceeds to step S213. In step S213, the control unit 39 locks the inner door 35 after closing it.

In step S204, the control unit 39 moves the cassette Wc designated by the wafer transport unit 32 to the Pt position aligned with the inner door opening 34b (see FIG. 29). In step S205, the control unit 39 sets a signal that does not accept the release of the upper lock of the outer door 37. In step S206, the control unit 39 unlocks the inner door upper lock 36. In step S207, the control unit 39 determines whether the unlocking of the inner door upper lock 36 is detected. When the unlocking of the inner door upper locking part 36 is detected, the process proceeds to step S208. When the unlocking of the inner door upper locking part 36 is not detected, the process repeats step S207.

In step S208, the control unit 39 opens the inner door 35. In step S209, the control unit 39 determines whether the inner door 35 is opened based on the detection result of the switch detection sensor 35c. When the inner door 35 is opened, the process proceeds to step S210. When the inner door 35 is not opened, the process repeats step S209. In step S210, the control unit 39 determines whether the information related to the completion of (removal and storage of wafer We) has been received from the wafer transport unit 32. When the information related to the completion has been received, the process proceeds to step S211. When the information related to the completion has not been received, the process repeats step S210. In step S211, after closing the inner door 35, the control unit 39 locks the inner door 35, thus completing the inner door opening and closing process.

Thus, the semiconductor chip Ch manufactured by the semiconductor chip manufacturing process is manufactured by the cutting device 3, which includes: a cassette part 31; a wafer conveying part 32; a laser light irradiation part 30a; a device shield part 34; an inner door 35, which is provided on the inner wall part 34a and is opened when the wafer We is taken out and stored by the wafer conveying part 32; an outer door 37, which is provided on the outer wall part 34c and is opened when the operator Op takes out and stores the wafer We; and a control part 39, which controls the inner door 35 to be closed when the outer door 37 becomes openable.

Furthermore, the method for manufacturing the semiconductor chip Ch includes step S3, i.e., maintaining the inner door 35 in a closed state when the outer door 37 is made to be openable, the outer door 37 is opened when the operator Op takes out and stores the wafer We, and the inner door 35 is opened when the wafer We is taken out and stored by the wafer transfer unit 32 that takes out and stores the wafer We relative to the cassette unit 31. The method for manufacturing the semiconductor chip Ch includes step S3, i.e., irradiating the laser light Ld along each of the plurality of dicing streets Ws of the wafer We on which the plurality of semiconductor chips Ch are arranged. The manufacturing method of the semiconductor chip Ch includes step S6, that is, using the expansion part 606 to expand the expansion tape Te, thereby dividing the wafer We into a plurality of semiconductor chips Ch along each of a plurality of cutting streets Ws.

(Effect of the first implementation method)

In the first implementation method, the following effects can be obtained.

In the first embodiment, as described above, the cutting device 3 includes: an inner door 35, which is opened when the wafer We is taken out and stored by the wafer conveying unit 32; an outer door 37, which is opened when the operator Op takes out and stores the wafer We; and a control unit 39, which controls the inner door 35 to maintain the closed state when the outer door 37 becomes openable. Thus, by controlling the inner door 35 to be closed when the outer door 37 is in an openable state, when the operator Op opens the outer door 37 to replace the wafer We in the cassette section 31, the inner door 35 is already securely closed, so that the laser light Ld irradiated from the wafer conveying section 32 and the laser light irradiation section 30a is securely blocked by the inner door 35. Therefore, in any of the cases where the wafer We is conveyed by the wafer conveying section 32 and the laser light Ld is irradiated from the laser light irradiation section 30a, the operator Op can open the outer door 37 to perform the wafer We replacement operation. As a result, compared with the case where the wafer We is replaced after the wafer transport unit 32 and the laser light irradiation unit 30a are stopped, the reduction in the production efficiency of the semiconductor chip Ch caused by the replacement operation of the wafer We by the operator Op can be suppressed.

Furthermore, in the first embodiment, as described above, the control unit 39 is configured to control the inner door 35 to be closed when the outer door 37 is in an openable state when the laser light Ld is irradiated by the laser light irradiation unit 30a. In this way, the laser light Ld irradiated from the laser light irradiation unit 30a is effectively blocked by the inner door 35, so that even during the period when the laser light irradiation unit 30a irradiates the laser light Ld, the operator Op can open the outer door 37 to replace the wafer We. As a result, compared with the case where the wafer We is replaced after the wafer transport unit 32 and the laser light irradiation unit 30a are stopped, the reduction in the production efficiency of the semiconductor chip Ch caused by the replacement operation of the operator Op replacing the wafer We can be suppressed.

Furthermore, in the first embodiment, as described above, the control unit 39 is configured to perform the following control: when the inner door 35 is opened by the wafer conveying unit 32 to remove and store the wafer We, the outer door 37 is made to be openable after detecting that the inner door 35 is closed. In this way, the operator Op can open the outer door 37 only after the control unit 39 confirms that the inner door 35 is closed, so the operator Op can more effectively shield the laser light Ld irradiated from the wafer conveying unit 32 and the laser light irradiation unit 30a.

In the first embodiment, as described above, the cutting device 3 is provided with a moving part 35b for moving the inner door 35 in the opening and closing direction. The control part 39 is configured to perform the following control: when the inner door 35 is already opened, the inner door 35 is moved in the Ci direction by the moving part 35b, and after detecting that the inner door 35 is closed, the outer door 37 is made to be openable. In this way, the inner door 35 can be automatically closed by the control of the control part 39, so compared with the case where the inner door 35 is closed based on the operation of the operator Op, the increase in the work burden of the operator Op can be suppressed.

Furthermore, in the first embodiment, as described above, the control unit 39 is configured to perform the following control: when the operator Op performs the removal and storage of the wafer We and the outer door 37 is opened, the inner door 35 is opened after detecting that the outer door 37 is closed. In this way, the inner door 35 can be opened only after the control unit 39 confirms that the outer door 37 is closed, so that the laser light Ld irradiated from the laser light irradiation unit 30a can be effectively prevented from leaking to the outside of the device.

Furthermore, in the first embodiment, as described above, the outer door 37 is configured to be manually moved in the opening and closing directions (Oo direction and Co direction) by the operator Op. The control unit 39 is configured to perform the following control: when the outer door 37 is already opened, after detecting that the outer door 37 has been closed by the operator Op, the inner door 35 is opened. In this way, the inner door 35 can be opened only after the control unit 39 confirms that the outer door 37 has been closed, so that the laser light Ld irradiated from the laser light irradiation unit 30a can be effectively prevented from leaking to the outside of the device.

Furthermore, in the first embodiment, as described above, the cutting device 3 is provided with an inner door locking unit 36 for locking the inner door 35. The control unit 39 is configured to start processing to make the outer door 37 openable based on the inner door 35 being closed in a state locked by the inner door locking unit 36. In this way, the inner door 35 can be opened only after the inner door locking unit 36 is unlocked, thereby preventing the operator Op from opening the inner door 35 after opening the outer door 37.

Furthermore, in the first embodiment, as described above, the cutting device 3 is provided with the outer door locking portion 38 for locking the outer door 37. The control portion 39 is configured to perform the following control: based on the inner door 35 being closed in a state locked by the inner door locking portion 36 and the outer door 37 being closed in a state locked by the outer door locking portion 38, the cassette Wc in the cassette portion 31 carrying the wafer We is moved to the replaceable position Pd, and the wafer We has been replaced by the operator Op. In this way, when the cassette Wc is moved to the replaceable Pd position, both the inner door 35 and the outer door 37 are closed, so that the wafer transport unit 32 and the operator Op can avoid interference with the cassette Wc.

Furthermore, in the first embodiment, as described above, the control unit 39 is configured to perform the following control: based on the fact that the cassette Wc has been moved to the replaceable position, a setting is performed to not accept a signal to open the inner door 35, and the outer door upper lock unit 38 is made to release the upper lock of the outer door 37. In this way, even if a signal to open the inner door 35 is sent to the control unit 39 from the cassette unit 31, the wafer transport unit 32, and the laser irradiation unit 30a, the control unit 39 does not accept the above signal, so that the inner door 35 can be more effectively prevented from being opened after the outer door upper lock unit 38 releases the upper lock of the outer door 37.

In the first embodiment, as described above, the cutting device 3 includes the unlocking operation accepting unit 371d, and the unlocking operation accepting unit 371d is configured to accept the operation of the operator Op, and based on the operation of the operator Op being accepted, sends a signal to the control unit 39 to release the upper lock of the outer door 37 by the outer door upper lock unit 38. The control unit 39 is configured to perform the following control: when the upper lock of the outer door 37 is in the unlockable state, based on the signal to unlock the outer door 37 received from the unlocking operation accepting unit 371d, the outer door 37 is unlocked and the outer door 37 is made to be openable. In this way, the operator Op can unlock the outer door 37, so the outer door 37 can be opened at the operator Op's planned timing.

Furthermore, in the first embodiment, as described above, the cutting device 3 is provided with the outer door locking unit 38 for locking the outer door 37. The control unit 39 is configured not to perform the process of making the outer door 37 openable unless the inner door 35 is closed in a state locked by the inner door locking unit 36 and the outer door 37 is closed in a state locked by the outer door locking unit 38. Thus, the process of making the outer door 37 openable is started only when both the inner door 35 and the outer door 37 are locked, thereby preventing the operator Op from mistakenly opening the outer door 37 before the process of making the outer door 37 openable is completed.

Furthermore, in the first embodiment, as described above, the cutting device 3 is provided with a locking operation accepting unit 375d, which is configured to accept the operation of the operator Op, and based on the operation of the operator Op being accepted, sends a signal to the control unit 39 to lock the outer door 37 by the outer door locking unit 38. In this way, the operator Op can lock the outer door 37, so that the operator Op can recognize that the outer door 37 has been locked.

In the first embodiment, as described above, the cutting device 3 is provided with an inner door locking unit 36 for locking the inner door 35. The control unit 39 is configured to perform the following control: when the wafer We is taken out and stored by the wafer conveying unit 32, the inner door locking unit 36 releases the lock on the inner door 35 and opens the inner door 35. In this way, the inner door 35 can be opened automatically, so that the wafer We can be taken out and stored smoothly by the wafer conveying unit 32.

In the first embodiment, as described above, the cutting device 3 is provided with the outer door locking portion 38 for locking the outer door 37. The control portion 39 is configured to perform the following control: after detecting that the outer door 37 is closed in a state locked by the outer door locking portion 38 and the inner door 35 is closed in a state locked by the inner door locking portion 36, the inner door 35 is unlocked by the inner door locking portion 36 and the inner door 35 is opened. In this way, only when both the inner door 35 and the outer door 37 are locked can the inner door 35 be unlocked by the inner door locking part 36, so the inner door 35 can be opened with the risk of the outer door 37 being opened reduced.

Furthermore, in the first embodiment, as described above, the inner door locking portion 36 includes: an inner door locking engaging portion 36a, which is provided on the inner door 35; and an inner door locking engaged portion 36b, which engages with the inner door locking engaging portion 36a to lock the inner door 35 only when the inner door 35 is closed. In this way, the inner door locking engaging portion 36b will engage with the inner door locking engaging portion 36a when the inner door 35 is slightly opened, which can prevent the control unit 39 from mistakenly thinking that the inner door 35 is locked in a closed state, thereby preventing the laser light Ld from being irradiated from the laser light irradiation unit 30a when the inner door 35 is slightly opened.

In the first embodiment, as described above, the outer door locking portion 38 includes: an outer door locking engaging portion 38a, which is provided on the outer door 37; and an outer door locking engaged portion 38b, which engages with the outer door locking engaging portion 38a only when the outer door 37 is closed to lock the outer door 37. In this way, the outer door locking engaged portion 38b engages with the outer door locking engaging portion 38a when the outer door 37 is slightly opened, which can prevent the control unit 39 from mistakenly thinking that the outer door 37 is locked in a closed state, and thus can prevent the inner door 35 from being opened when the outer door 37 is slightly opened.

Furthermore, in the first embodiment, as described above, the semiconductor chip Ch is manufactured by a cutting device 3 provided with the following components: an inner door 35, which is opened when the wafer We is taken out and stored by the wafer transfer unit 32; an outer door 37, which is opened when the operator Op takes out and stores the wafer We; and a control unit 39, which controls the inner door 35 to maintain the closed state when the outer door 37 becomes openable. Thus, by controlling the inner door 35 to be closed when the outer door 37 is in the openable state, when the operator Op opens the outer door 37 to replace the wafer We in the cassette section 31, the inner door 35 is already securely closed, so that the laser light Ld irradiated from the wafer conveying section 32 and the laser light irradiation section 30a is securely blocked by the inner door 35. Therefore, in any of the cases where the wafer conveying section 32 is conveying the wafer We or the laser light irradiation section 30a is irradiating the laser light Ld, the operator Op can open the outer door 37 to perform the wafer We replacement operation. As a result, compared with the case where the wafer We is replaced after the wafer conveying unit 32 and the laser light irradiation unit 30a are stopped, a semiconductor chip Ch manufactured by the cutting device 3 can be provided which can suppress the reduction in the production efficiency of the semiconductor chip Ch caused by the replacement operation of the wafer We by the operator Op.

Furthermore, in the first embodiment, as described above, the method for manufacturing the semiconductor chip Ch includes step S3, that is, when the outer door 37 is made to be openable, the inner door 35 is maintained in a closed state, the outer door 37 is opened when the operator Op takes out and stores the wafer We, and the inner door 35 is opened when the wafer We is taken out and stored by the wafer conveying part 32 relative to the cassette part 31. In this way, by controlling the inner door 35 to be closed when the outer door 37 is in the openable state, when the operator Op opens the outer door 37 to replace the wafer We in the cassette section 31, the inner door 35 is already securely closed, so that the laser light Ld irradiated from the wafer conveying section 32 and the laser light irradiation section 30a is securely blocked by the inner door 35. Therefore, in any of the cases where the wafer We is conveyed by the wafer conveying section 32 and the laser light Ld is irradiated from the laser light irradiation section 30a, the operator Op can open the outer door 37 to perform the wafer We replacement operation. As a result, compared with the case where the wafer We is replaced after the wafer transport unit 32 and the laser light irradiation unit 30a are stopped, a method for manufacturing semiconductor chips Ch can be provided that can suppress the reduction in the production efficiency of semiconductor chips Ch caused by the replacement operation of the wafer We by the operator Op.

[Second implementation method]

Referring to FIG. 34 to FIG. 36 , the structure of the semiconductor wafer processing system 100 of the second embodiment is described. In the second embodiment, unlike the first embodiment, the wafer conveying unit 732 of the cutting device 703 has a transfer head 732e and a transfer head 732f. In addition, in the second embodiment, the detailed description of the same structure as the first embodiment is omitted.

(Semiconductor wafer processing system)

As shown in FIG. 34 , the semiconductor wafer processing system 700 is a device for processing the wafer We.

Specifically, the semiconductor wafer processing system 700 has a slotting device 1, a tape attaching device 2, a cutting device 703, a grinding device 4, a tape replacing device 5, and an expanding device 6. Furthermore, the slotting device 1 and the cutting device 703 are both examples of "laser processing devices" within the scope of the patent application.

(Overview of the control of the two doors of the slotting device and the cutting device respectively)

In each of the slotting device 1 of the second embodiment and the cutting device 703 of the second embodiment, two doors are controlled in the same manner as the slotting device 1 of the first embodiment and the cutting device 3 of the first embodiment. Hereinafter, only the components of the cutting device 703 that are different from the cutting device 3 of the first embodiment will be described in detail.

(Composition of cutting device)

As shown in FIG35 , the cutting device 703 includes a cutting unit 30, a cassette unit 31, a wafer transfer unit 732, a base unit 33, a device shield unit 34, an inner door 35, an inner door upper locking unit 36, an outer door 37, an outer door upper locking unit 38, and a control unit 39.

The wafer transport unit 732 is configured to transport the wafer ring structure W between the cassette unit 31 and the cutting unit 30. Specifically, the wafer transport unit 732 has a clamping hand 32a, a Y-direction moving mechanism 32b, a rail unit 32c, a rail unit 32d, a transfer head 732e, a transfer head 732f, and a Z-direction moving mechanism 732g.

The transfer head 732e and the transfer head 732f are respectively configured to adsorb the frame Rf of the wafer ring structure W. The transfer head 732e and the transfer head 732f are respectively provided with an adsorption portion, and the adsorption portion is provided with a suction hole for adsorbing the frame Rf of the wafer ring structure W. The Z-direction moving mechanism 732g is configured to make the transfer head 732e and the transfer head 732f move independently in the Z1 direction or the Z2 direction. The Z-direction moving mechanism 732g has, for example, a linear conveyor module or a drive unit, and the drive unit has a ball screw and a motor with an encoder.

(Control Department)

The control unit 39 is configured to control the cutting unit 30, the cassette unit 31, the wafer conveying unit 32, the inner door 35, the inner door upper lock 36, and the outer door upper lock 38, respectively, so as to process the wafer We by the cutting device 3. The control unit 39 is electrically connected to the cutting unit 30, the cassette unit 31, the wafer conveying unit 32, the inner door 35, the inner door upper lock 36, the outer door 37, and the outer door upper lock 38, respectively.

Specifically, the control unit 39 includes a CPU (Central Processing Unit), and a memory unit having ROM (Read Only Memory), RAM (Random Access Memory) and SSD (Solid State Drive). The memory unit stores a control program for controlling the cutting device 3.

<Case replacement performed by operators>

The control unit 39 of the second embodiment is configured to control the opening and closing of the two doors, so that during the period of irradiating the laser light Ld from the laser light irradiation unit 30a, the operator Op (quality assurance personnel) can also perform at least one of the operations of taking out the cassette Wc from the cassette unit 31 and storing a new cassette Wc in the cassette unit 31. That is, the control unit 39 is configured to control the inner door 35 to be closed when the outer door 37 is in an openable state. Specifically, the control unit 39 is configured to control the inner door 35 to be closed when the laser light Ld is irradiated by the laser light irradiation unit 30a.

As an example of such processing to make the outer door 37 openable, the first embodiment shows the following situation: during the period of irradiating the laser light Ld from the laser light irradiation unit 30a, the operator Op (quality assurance personnel) performs at least one of the operations of taking out the cassette Wc from the cassette unit 31 and storing a new cassette Wc in the cassette unit 31. In addition, in the first embodiment, as another example of processing to make the outer door 37 openable, the following situation is shown: during the period of the wafer We being transported by the gripping hand 32a of the wafer transport unit 32, the operator Op (quality assurance personnel) performs at least one of the operations of taking out the cassette Wc from the cassette unit 31 and storing a new cassette Wc in the cassette unit 31.

Here, in the second embodiment, in addition to the above example, as another example of processing to make the outer door 37 openable, as shown in FIG. 36, while at least one of the transfer head 732e and the transfer head 732f of the wafer conveying unit 732 holds the wafer We, the operator Op (quality assurance personnel) can perform at least one of the operations of taking out the cassette Wc from the cassette unit 31 and storing a new cassette Wc in the cassette unit 31. In addition, the other configurations of the second embodiment are the same as those of the first embodiment, so the description is omitted.

(Effect of the second implementation method)

In the second implementation method, the following effects can be obtained.

In the second embodiment, as described above, the cutting device 703 is equipped with: an inner door 35, which is opened when the wafer We is taken out and stored by the wafer conveying unit 32; an outer door 37, which is opened when the operator Op takes out and stores the wafer We; and a control unit 39, which controls the inner door 35 to be closed when the outer door 37 becomes openable. In this way, the reduction in the production efficiency of the semiconductor chip Ch caused by the replacement operation of the operator Op to replace the wafer We can be suppressed. In addition, the other effects of the second embodiment are the same as those of the first embodiment, so the description is omitted.

[Example of changes]

Furthermore, the embodiments disclosed this time should be regarded as illustrative in all aspects and not restrictive. The scope of the present invention is indicated by the scope of the patent application, not by the description of the above embodiments, and includes all changes (variations) within the meaning and scope equivalent to the scope of the patent application.

For example, in the first and second embodiments described above, the slotting device 1 and the cutting device 3 (703) both have two doors, but the present invention is not limited thereto. In the present invention, either the slotting device or the cutting device may have two doors.

In addition, in the above-mentioned first and second embodiments, for the convenience of explanation, an example of using a process-driven flowchart that performs processing in sequence according to the processing flow is shown to illustrate the control processing of the control unit 39, but the present invention is not limited to this. In the present invention, the control processing of the control unit can also be performed by event-driven (event-driven) processing that performs processing in units of events. In this case, a complete event-driven type can be used, or a combination of event-driven and process-driven can be used.

3: Cutting device

30: Cutting section

30a: Laser light irradiation unit

31: Box section

31a: First cassette loading unit

31c: The third cassette loading section

31d: Z-direction moving mechanism

34: Installation shield part

34a: Inner wall

34b: Opening for inner door

34c: Outer wall

34d: Opening for exterior door

35: Inner door

37:External door

39: Control Department

Ld: Laser light

Op:operator

Wc: Box

We: Wafer

X: Direction

X1: Direction

X2: Direction

Y: direction

Y1: Direction

Y2: Direction

Z: Direction

Z1: Direction

Z2: Direction

Claims (18)

A laser processing device comprises: a wafer storage part for storing wafers; a conveying part for taking out and storing the wafers relative to the wafer storage part; a laser light irradiation part for irradiating laser light along each of a plurality of cutting paths of the wafer taken out and supplied from the wafer storage part by the conveying part; a device shield part for accommodating the wafer storage part, the conveying part and the laser light irradiation part; an inner side door provided on the inner wall of the device shield part for separating the wafer storage part from the laser light irradiation part, The outer door is opened when the wafer is taken out and stored by the conveying part; the outer door is provided on the outer wall of the device shield part on the opposite side of the inner wall part and the laser light irradiation part, and is opened when the operator takes out and stores the wafer; and the control part controls the inner door to be closed when the outer door is in an openable state; and the device shield part and the inner door are each configured so that the laser light irradiated by the laser light irradiation part will not leak when the inner door is closed. As in claim 1, the control unit is configured to control the inner door to be closed when the outer door is in an openable state when the laser light is irradiated by the laser light irradiation unit. The laser processing device of claim 1, wherein the control unit is configured to perform the following control: when the inner door is opened due to the wafer being taken out and stored by the conveying unit, the outer door is made to be openable after detecting that the inner door is closed. The laser processing device of claim 3 is further provided with a moving part for moving the inner door in the opening and closing direction, and the control part is configured to perform the following control: when the inner door is opened, the inner door is moved in the closing direction by the moving part, and after detecting that the inner door is closed, the outer door is made to be openable. As in the laser processing device of claim 1, the control unit is configured to perform the following control: when the operator takes out and stores the wafer and the outer door is opened, the inner door is opened after detecting that the outer door is closed. As in claim 5, the outer door is configured to be manually moved in the opening and closing direction by the operator, and the control unit is configured to perform the following control: when the outer door is already opened, after detecting that the outer door has been closed by the operator, the inner door is opened. The laser processing device of claim 3 is further provided with an inner door locking unit for locking the inner door, and the control unit is configured to start processing to make the outer door openable based on the inner door being closed in a state locked by the inner door locking unit. The laser processing device of claim 4 is further provided with an inner door locking unit for locking the inner door, and the control unit is configured to perform the following control: when the wafer is taken out and stored by the conveyor unit, the inner door locking unit releases the inner door lock and opens the inner door. A laser processing device, comprising: a wafer storage part for storing wafers; a conveying part for taking out and storing the wafers relative to the wafer storage part; a laser light irradiation part for irradiating laser light along each of a plurality of cutting paths of the wafer taken out and supplied from the wafer storage part by the conveying part; a device shield part for accommodating the wafer storage part, the conveying part and the laser light irradiation part inside; an inner door provided at the wafer storage part The inner wall of the device shielding part separated from the laser light irradiation part is opened when the wafer is taken out and stored by the conveying part; the outer door is provided on the outer wall of the device shielding part on the opposite side of the laser light irradiation part relative to the inner wall, and is opened when the wafer is taken out and stored by the operator; and the control part controls the inner door to be closed when the outer door is in an openable state; and The control unit is configured to perform the following control: when the inner door is opened due to the wafer being taken out and stored by the conveying unit, the outer door is made to be openable after detecting that the inner door is closed; and the laser processing device is further provided with an inner door locking unit for locking the inner door, and the control unit is configured to start making the outer door openable based on the inner door being closed in a state locked by the inner door locking unit. The laser processing device is further provided with an outer door locking unit for locking the outer door, and the control unit is configured to perform the following control: based on the inner door being closed by the inner door locking unit and the outer door being closed by the outer door locking unit, the cassette in the wafer storage unit carrying the wafer is moved to a replaceable position, and the wafer has been accepted for replacement by the operator. As in claim 9, the control unit is configured to perform the following control: based on the fact that the cassette has been moved to a replaceable position, a setting is performed to not accept a signal to open the inner door, and the outer door is locked by the upper locking unit so that the upper lock of the outer door can be released. The laser processing device of claim 10 is further provided with an unlocking operation receiving unit, the unlocking operation receiving unit is configured to receive the operation of the operator, and based on the operation of the operator being received, sends a signal to the control unit to release the upper lock of the outer door by the upper lock unit of the outer door; and the control unit is configured to perform the following control: when the upper lock of the outer door is in a releasable state, based on the signal to unlock the outer door received from the unlocking operation receiving unit, the outer door is unlocked, so that the outer door becomes openable. The laser processing device of claim 9 is further provided with a locking operation receiving unit, which is configured to receive the operation of the operator, and based on the received operation of the operator, sends a signal to the control unit to lock the outer door by the outer door locking unit. As in claim 9, the outer door locking part comprises: an outer door locking engaging part, which is arranged on the outer door; and an outer door locking engaging part, which engages with the outer door locking engaging part to lock the outer door only when the outer door is closed. A laser processing device, comprising: a wafer storage part for storing wafers; a conveying part for taking out and storing the wafers relative to the wafer storage part; a laser light irradiation part for irradiating laser light along each of the plurality of cutting paths of the wafer taken out and supplied from the wafer storage part by the conveying part; a device shield part for accommodating the wafer storage part, the conveying part and the laser light irradiation part inside; an inner door, which is provided an inner wall portion of the device shield portion that separates the wafer storage portion from the laser light irradiation portion, and is opened when the wafer is taken out and stored by the conveying portion; an outer door that is provided on the outer wall portion of the device shield portion that is opposite to the inner wall portion and the laser light irradiation portion, and is opened when the wafer is taken out and stored by the operator; and a control portion that is configured to make the outer door openable when the outer door is opened. , maintaining the closed state of the inner door; and the control unit is configured to perform the following control: when the inner door is opened due to the removal and storage of the wafer by the conveying unit, after detecting that the inner door is closed, the outer door is made to be openable; and the laser processing device is further provided with an inner door locking unit for locking the inner door, and the control unit is configured to perform the following control based on the inner door being opened by the inner door. The side door is closed in a locked state by the locking part, and the process of making the outer door openable is started; the laser processing device further has an outer door locking part for locking the outer door, and the control part is configured not to make the outer door openable except when the inner door is closed in a locked state by the inner door locking part and the outer door is closed in a locked state by the outer door locking part. A laser processing device comprises: a wafer storage part for storing wafers; a conveying part for taking out and storing the wafers relative to the wafer storage part; a laser light irradiation part for irradiating laser light along each of a plurality of cutting paths of the wafer taken out and supplied from the wafer storage part by the conveying part; a device shield part for accommodating the wafer storage part, the conveying part and the laser light irradiation part; an inner side door provided on an inner wall part of the device shield part for separating the wafer storage part from the laser light irradiation part, The outer door is opened when the wafer is taken out and stored by the conveying unit; the outer door is arranged on the outer wall of the device shielding unit on the opposite side of the inner wall and the laser light irradiation unit, and is opened when the wafer is taken out and stored by the operator; and the control unit controls the inner door to be closed when the outer door is in an openable state; the control unit is configured to perform the following control: when the wafer is taken out and stored by the conveying unit and the inner door is opened, the control unit detects the situation that the inner door is opened. After the inner door is closed, the outer door is made to be openable; and the laser processing device further includes a moving part for moving the inner door in the opening and closing direction, and the control part is configured to perform the following control: when the inner door is opened, the inner door is moved in the closing direction by the moving part, and after detecting that the inner door is closed, the outer door is made to be openable; and the laser processing device further includes an inner door locking part for locking the inner door, and the control part is configured to perform the following control: when the inner door is opened, the inner door is moved in the closing direction by the moving part, and after detecting that the inner door is closed, the outer door is made to be openable. When the conveying unit takes out and stores the wafer, the inner door lock is released by the inner door lock unit and the inner door is opened; and the laser processing device is further provided with an outer door lock unit for locking the outer door, and the control unit is configured to perform the following control: after detecting that the outer door has been closed in a state locked by the outer door lock unit and the inner door has been closed in a state locked by the inner door lock unit, the inner door lock unit releases the inner door lock and the inner door is opened. A laser processing device comprises: a wafer storage part for storing wafers; a conveying part for taking out and storing the wafers relative to the wafer storage part; a laser light irradiation part for irradiating laser light along each of a plurality of cutting paths of the wafer taken out and supplied from the wafer storage part by the conveying part; and a device shield part for accommodating the wafer storage part, the conveying part and the laser light irradiation part inside. an inner door, which is provided on the inner wall of the device shield part separating the wafer storage part from the laser light irradiation part, and is opened when the wafer is taken out and stored by the conveying part; an outer door, which is provided on the outer wall of the device shield part on the opposite side of the inner wall part and the laser light irradiation part, and is opened when the wafer is taken out and stored by the operator; and a control part, which is used to control the above When the outer door becomes openable, the inner door is kept closed; and the control unit is configured to perform the following control: when the inner door is opened by taking out and storing the wafer by the conveying unit, after detecting that the inner door is closed, the outer door becomes openable; and the laser processing device further has an inner door locking unit for locking the inner door. , and the control unit is configured to start processing to make the outer door openable based on the fact that the inner door has been locked by the inner door locking unit; and the inner door locking unit includes: an inner door locking engaging unit, which is arranged on the inner door; and an inner door locking engaged unit, which engages with the inner door locking engaging unit to lock the inner door only when the inner door is closed. A semiconductor chip is manufactured by a laser processing device, wherein the laser processing device comprises: a wafer storage portion for storing wafers; a conveying portion for taking out and storing the wafers relative to the wafer storage portion; a laser light irradiation portion for irradiating laser light along each of a plurality of cutting paths of the wafer taken out and supplied from the wafer storage portion by the conveying portion; a device shield portion for accommodating the wafer storage portion, the conveying portion and the laser light irradiation portion inside; and an inner door provided on the partition between the wafer storage portion and the laser light irradiation portion. The inner wall of the device shield is opened when the wafer is taken out and stored by the conveyor; the outer door is provided on the outer wall of the device shield on the opposite side of the inner wall and the laser light irradiation part, and is opened when the operator takes out and stores the wafer; and the control part controls the inner door to be closed when the outer door is in an openable state; and each of the device shield and the inner door is configured so that the laser light irradiated by the laser light irradiation part does not leak when the inner door is closed. A method for manufacturing a semiconductor chip comprises the following steps: when an outer door is in an openable state, an inner door is kept closed, the outer door is opened when a worker takes out and stores a wafer, and the inner door is opened when a conveyor for taking out and storing the wafer relative to a wafer storage unit takes out and stores the wafer; and a plurality of semiconductor chips are arranged along a semiconductor chip storage unit. Each of the plurality of cutting paths of the wafer is irradiated with laser light; and the wafer is divided into the plurality of semiconductor chips along each of the plurality of cutting paths by expanding the thin-sheet member using the expansion part; and the wafer storage part and the conveying part are stored inside the device shield part; and the device shield part and the inner door are each configured so that the irradiated laser light will not leak when the inner door is closed.