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TWI883896B - Height-calibration mechanism, height-calibration method, and processing machine - Google Patents

Height-calibration mechanism, height-calibration method, and processing machine Download PDF

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TWI883896B
TWI883896B TW113112739A TW113112739A TWI883896B TW I883896 B TWI883896 B TW I883896B TW 113112739 A TW113112739 A TW 113112739A TW 113112739 A TW113112739 A TW 113112739A TW I883896 B TWI883896 B TW I883896B
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pressure
height
height position
calibration
inspected
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TW113112739A
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TW202540607A (en
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陳振元
劉睿靖
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鴻勁精密股份有限公司
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  • Measuring Arrangements Characterized By The Use Of Fluids (AREA)

Abstract

The height-calibration mechanism includes a height-calibration member, a target member, and a detection unit. The height-calibration member has a pressure-receiving area. The target member is at a first height position and pushes the fluid toward the pressure-receiving area via a pressure-providing channel. The detection unit acquires a first pressure by a pressure-detecting member when the target member is at the first height. The target member is movable to the second height along a calibration axis, and the fluid is pushed toward the pressure-receiving area via the pressure-providing channel. The detection unit acquires a second pressure by the pressure-detecting member. A comparison unit receives the amounts of the first pressure and the second pressure sent from the pressure-detecting member to further determine whether the first height and the second height are abnormal or not.

Description

校高機構、校高方法及作業機Height calibration mechanism, height calibration method and operating machine

本發明提供一種準確地校位待檢器之高度位置的校高機構及校高方法。The present invention provides a height calibration mechanism and a height calibration method for accurately calibrating the height position of a device to be inspected.

在現今,電子元件作業裝置可為輸送裝置、外觀檢知裝置或打印裝置等,並以作業器(例如輸送器、取像器或打印器等)於預設作業高度位置而對電子元件執行移料輸送作業、外觀檢知作業或打印作業等。然在電子元件日趨精密微小之設計下,對於作業器之作業高度位置的精準度要求相當高。以輸送裝置為例,其作業器為一入料輸送器,並由驅動結構驅動作Z方向位移而取放電子元件,驅動結構包含馬達、皮帶輪組、轉接件及螺桿螺座組等複數個構件,於輸送作業上,入料輸送器易因驅動結構之複數個構件的作動偏差或組裝偏差等因素,而無法準確位移至預設作業高度位置,以致影響取放電子元件之精準性,會發生過壓電子元件受損或者未取放電子元件等問題,進而影響電子元件良率及作業順暢性。Nowadays, electronic component processing devices can be conveying devices, appearance inspection devices or printing devices, etc., and use operators (such as conveyors, imagers or printers, etc.) to perform material transfer, appearance inspection or printing operations on electronic components at a preset operating height. However, as electronic components are increasingly designed to be more precise and smaller, the accuracy of the operating height position of the operator is required to be quite high. Taking the conveying device as an example, its operator is an infeed conveyor, and is driven by a driving structure to move in the Z direction to pick up and place electronic components. The driving structure includes multiple components such as a motor, a pulley assembly, an adapter, and a screw seat assembly. In the conveying operation, the infeed conveyor is prone to being unable to accurately move to the preset operating height position due to factors such as the actuation deviation or assembly deviation of multiple components of the driving structure, thereby affecting the accuracy of picking up and placing electronic components, causing problems such as overpressure and damage to electronic components or failure to pick up and place electronic components, thereby affecting the yield rate of electronic components and the smoothness of the operation.

本發明之目的一,提供一種校高機構,包含校高件、待檢器及檢知單元,校高件設有至少一承壓區域,待檢器能夠相對校高件且沿校位軸線位移至第一高度位置及第二高度位置,並設有給壓流道,以分別於第一高度位置及第二高度位置對校高件之承壓區域吹送流體,檢知單元設置檢壓器及比較器 ,檢壓器配置於流體裝置與給壓流道間界定之流體輸送路徑,以取得待檢器位於第一高度位置時之第一壓力值以及位於第二高度位置時之第二壓力值,比較器能夠接收檢壓器傳輸之第一壓力值及第二壓力值,而判別待檢器之第一高度位置或/及第二高度位置是否異常,以確保待檢器作為作業器或裝配作業器時,可精準於預設作業高度位置執行預設作業,進而提高作業精準度及良率。 The first object of the present invention is to provide a height calibration mechanism, comprising a height calibration component, a device to be detected and a detection unit. The height calibration component is provided with at least one pressure-bearing area. The device to be detected can be displaced relative to the height calibration component and along the calibration axis to a first height position and a second height position. A pressure supply channel is provided to blow fluid to the pressure-bearing area of the height calibration component at the first height position and the second height position respectively. The detection unit is provided with a pressure detector and a comparator. The pressure detector is arranged in the fluid delivery path defined between the fluid device and the pressure supply channel to obtain the first pressure value when the device to be inspected is at the first height position and the second pressure value when it is at the second height position. The comparator can receive the first pressure value and the second pressure value transmitted by the pressure detector and judge whether the first height position or/and the second height position of the device to be inspected is abnormal, so as to ensure that the device to be inspected can accurately perform the preset operation at the preset operation height position when used as a processing device or an assembly processing device, thereby improving the operation accuracy and yield.

本發明之目的二,提供一種校高方法,包含第一給壓手段、第一檢壓手段、第二給壓手段、第二檢壓手段及校位手段;第一給壓手段將待檢器位於第一高度位置,並以給壓流道朝向校高件之承壓區域吹送流體;第一檢壓手段以檢知單元之檢壓器取得待檢器位於第一高度位置時之第一壓力值;第二給壓手段將待檢器沿校位軸線由第一高度位置位移至第二高度位置,並以給壓流道朝向校高件之承壓區域吹送流體;第二檢壓手段以檢知單元之檢壓器取得待檢器位於第二高度位置時之第二壓力值;校位手段以檢知單元之比較器接收檢壓器傳輸之第一壓力值及第二壓力值,而判別待檢器之第一高度位置或/及第二高度位置是否異常;因此,即可精準校位待檢器之作業高度位置,進而提高作業精準度及作業良率。The second object of the present invention is to provide a height calibration method, comprising a first pressure supplying means, a first pressure checking means, a second pressure supplying means, a second pressure checking means and a calibration means; the first pressure supplying means places the device to be detected at a first height position, and blows a fluid toward a pressure-bearing area of the height calibration member through a pressure supplying flow channel; the first pressure checking means obtains a first pressure value when the device to be detected is at the first height position through a pressure checking means of a detection unit; the second pressure supplying means moves the device to be detected from the first height position to the second height position along the calibration axis. The second pressure detecting means uses the pressure detector of the detecting unit to obtain the second pressure value when the device to be inspected is at the second height position; the calibration means uses the comparator of the detecting unit to receive the first pressure value and the second pressure value transmitted by the pressure detector to determine whether the first height position or/and the second height position of the device to be inspected is abnormal; therefore, the operating height position of the device to be inspected can be accurately calibrated, thereby improving the operating accuracy and the operating yield.

本發明之目的三,提供一種作業機,包含機台、供料裝置、收料裝置、作業裝置及中央控制裝置,供料裝置配置於機台,並設有至少一供料器 ,以供容置至少一待作業電子元件;收料裝置配置於機台,並設有至少一收料器,以供容置至少一已作業電子元件;作業裝置配置於機台,並設置至少一承置具、至少一作業器及至少一本發明之校高機構,至少一承置具以供承置電子元件,至少一作業器以供於供料裝置、收料裝置或/及承置具對電子元件執行預設作業,校高機構以供校位至少一待檢器之第一高度位置或第二高度位置;中央控制裝置以供控制及整合各裝置作動而執行自動化作業。 The third object of the present invention is to provide a work machine, including a machine, a feeding device, a receiving device, a working device and a central control device. The feeding device is arranged on the machine and is provided with at least one feeder for accommodating at least one electronic component to be processed; the receiving device is arranged on the machine and is provided with at least one receiving device for accommodating at least one processed electronic component; the working device is arranged on the machine and is provided with at least one holder, at least one working device and at least one height adjustment mechanism of the present invention. At least one holder is used to hold electronic components, at least one working device is used for the feeding device, the receiving device or/and the holder to perform a preset operation on the electronic components, and the height adjustment mechanism is used to adjust the first height position or the second height position of at least one device to be inspected; the central control device is used to control and integrate the actions of each device to perform automated operations.

為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:In order to enable you to have a further understanding of the present invention, a preferred embodiment is given below with accompanying drawings:

請參閱圖1,本發明校高機構包含至少一校高件、至少一待檢器及檢知單元。Please refer to FIG. 1 , the height calibration mechanism of the present invention includes at least one height calibration component, at least one device to be detected and a detection unit.

至少一校高件設有至少一承壓區域。依作業需求,校高件可為電子元件、近接開關、承置具或校正塊等;承置具可為料盤、測試座、預溫盤;例如待檢器為入料輸送器,校高件可為近接開關或料盤;例如待檢器為壓移器 ,校高件可為近接開關或測試座。 At least one height adjustment component is provided with at least one pressure-bearing area. According to the operation requirements, the height adjustment component can be an electronic component, a proximity switch, a holder or a calibration block, etc.; the holder can be a material tray, a test seat, or a pre-heating plate; for example, if the device to be inspected is a material feed conveyor, the height adjustment component can be a proximity switch or a material tray; for example, if the device to be inspected is a pressure shifter, the height adjustment component can be a proximity switch or a test seat.

承上述,校高件沿校位軸線界定一相對待檢器之平面作為承壓區域;更進一步,承壓區域之高度位置可為日後應用之作業器的預設作業高度位置。例如待檢器日後為入料輸送器,預設作業高度位置為入料輸送器取出電子元件的作業高度位置,亦即校高件之承壓區域的高度位置為入料輸送器取料的作業高度位置。於本實施例,校高件為近接開關11,並配置於機台上,近接開關11沿校位軸線A界定一呈水平狀之頂面作為承壓區域111,承壓區域111之高度位置為入料輸送器取料的作業高度位置(例如第二高度位置,容後再述)。Based on the above, the height calibration component defines a plane relative to the device to be inspected along the calibration axis as a pressure-bearing area; further, the height position of the pressure-bearing area can be a default operating height position of an operator to be used in the future. For example, if the device to be inspected is a feed conveyor in the future, the default operating height position is the operating height position for the feed conveyor to take out electronic components, that is, the height position of the pressure-bearing area of the height calibration component is the operating height position for the feed conveyor to take out materials. In this embodiment, the height calibration component is a proximity switch 11, and is disposed on the machine. The proximity switch 11 defines a horizontal top surface along the calibration axis A as a pressure-bearing area 111. The height position of the pressure-bearing area 111 is the operating height position for the feed conveyor to take out materials (for example, the second height position, which will be described later).

承上述,校高件能夠配置至少一高度調整器(圖未示出),以利調整承壓區域111之高度位置。Based on the above, the height adjustment member can be equipped with at least one height adjuster (not shown) to facilitate adjusting the height position of the pressure-bearing area 111.

至少一待檢器能夠相對校高件且沿校位軸線位移至第一高度位置及第二高度位置,並設有至少一給壓流道,以供對校高件之承壓區域吹送流體 。依作業需求,待檢器可為單純檢高用之器具或為具作業部件之作業器,例如待檢器為作業器,作業器可為輸送器、壓接器、外觀檢知器或打印器等,作業部件可為吸嘴、取像器或打印件等,作業部件可位於給壓流道之一端部或周側 ,能夠對電子元件執行預設作業。例如待檢器為入料輸送器,並以給壓流道之一端部作為作業部件,作業部件為吸嘴,以供對校高件之承壓區域吹送流體,並可吸取或釋放電子元件。例如待檢器為打印器,可於座體之周側設有至少一為打印件之作業部件,以供打印電子元件。 At least one device to be inspected can be displaced to a first height position and a second height position along the calibration axis relative to the height calibration component, and is provided with at least one pressure supply channel for blowing fluid to the pressure bearing area of the height calibration component. According to the operation requirements, the device to be inspected can be a simple height inspection tool or a workpiece with an operation component. For example, the device to be inspected is a workpiece, and the workpiece can be a conveyor, a crimper, an appearance detector or a printer, etc. The operation component can be a nozzle, an imager or a printer, etc. The operation component can be located at one end or around the pressure supply channel, and can perform a preset operation on the electronic component. For example, the device to be inspected is a feed conveyor, and one end of the pressure supply channel is used as a working part, and the working part is a suction nozzle, which is used to blow fluid to the pressure-bearing area of the alignment height part, and can absorb or release electronic components. For example, the device to be inspected is a printer, and at least one working part for printing can be provided around the base body for printing electronic components.

更進一步,待檢器包含移載具及具有至少一給壓流道之座體,移載具能夠帶動座體沿校位軸線作至少一Z方向位移。Furthermore, the device to be inspected includes a transfer carrier and a base body having at least one pressure supply channel, and the transfer carrier can drive the base body to move in at least one Z direction along the calibration axis.

於本實施例,待檢器為作業器,作業器為一入料輸送器12,包含移載具121、具有至少一給壓流道123之座體122及至少一作業部件。移載具121由移載驅動源(圖未示出)驅動沿移動路徑作X-Y-Z方向位移,移載驅動源為壓缸 、線性馬達或包含馬達及至少一傳動組,傳動組為皮帶輪組或螺桿螺座組等。移載具121之移動路徑以供配置一為近接開關11之校高件。座體122裝配於移載具121,並由移載具121帶動作X-Y方向位移,且可沿校位軸線A作Z方向位移至第一高度位置及第二高度位置,座體122之內部配置一可作Z方向浮動位移之活動件124,活動件124之內部設有給壓流道123,給壓流道123與流體裝置(圖未示出)間界定有流體輸送路徑,給壓流道123以輸送管125連通流體裝置,流體裝置為氣體裝置(圖未示出),以供應為氣體之流體,氣體裝置能夠經由輸送管125輸送氣體至給壓流道123。依作業需求,輸送管125可連接一切換器(圖未示出),切換器以供切換給壓流道123吹送或抽吸氣體。入料輸送器12以給壓流道123之一端部作為作業部件,作業部件為吸嘴126,以供對近接開關11之承壓區域111吹送氣體,並使給壓流道123未吹送氣體校高時,而可抽氣吸取或釋放電子元件。 In this embodiment, the device to be inspected is a workpiece, and the workpiece is a feed conveyor 12, which includes a transfer carrier 121, a base 122 having at least one pressure supply channel 123, and at least one workpiece. The transfer carrier 121 is driven by a transfer drive source (not shown) to move along a moving path in the X-Y-Z direction. The transfer drive source is a pressure cylinder, a linear motor, or includes a motor and at least one transmission group, and the transmission group is a belt pulley group or a screw seat group. The moving path of the transfer carrier 121 is provided for configuring a height adjustment component for the proximity switch 11. The base 122 is assembled on the transfer carrier 121, and is driven by the transfer carrier 121 to move in the X-Y direction, and can move in the Z direction along the calibration axis A to a first height position and a second height position. A movable part 124 capable of floating displacement in the Z direction is arranged inside the base 122. A pressure supply channel 123 is provided inside the movable part 124. A fluid delivery path is defined between the pressure supply channel 123 and a fluid device (not shown in the figure). The pressure supply channel 123 is connected to the fluid device through a delivery pipe 125. The fluid device is a gas device (not shown in the figure) to supply a fluid that is a gas. The gas device can deliver gas to the pressure supply channel 123 via the delivery pipe 125. According to the working requirements, the conveying pipe 125 can be connected to a switch (not shown), and the switch is used to switch the pressure channel 123 to blow or suck gas. The feed conveyor 12 uses one end of the pressure channel 123 as a working part, and the working part is a suction nozzle 126, which is used to blow gas to the pressure-bearing area 111 of the proximity switch 11, and when the pressure channel 123 is not blown, it can suck or release electronic components.

檢知單元包含至少一檢壓器131及至少一比較器132,檢壓器131能夠取得待檢器位於第一高度位置時之第一壓力值以及位於第二高度位置時之第二壓力值,比較器132能夠接收檢壓器131傳輸之第一壓力值及第二壓力值,以判別待檢器之第一高度位置或/及第二高度位置是否異常。The detection unit includes at least one pressure detector 131 and at least one comparator 132. The pressure detector 131 can obtain a first pressure value when the device to be detected is at a first height position and a second pressure value when the device to be detected is at a second height position. The comparator 132 can receive the first pressure value and the second pressure value transmitted by the pressure detector 131 to determine whether the first height position and/or the second height position of the device to be detected is abnormal.

依作業需求,檢壓器131配置於流體輸送路徑而檢知流體之壓力值。比較器132能夠以第一壓力值及第二壓力值的壓差值判別待檢器之第一高度位置或第二高度位置是否異常。According to the operation requirements, the pressure detector 131 is arranged in the fluid conveying path to detect the pressure value of the fluid. The comparator 132 can judge whether the first height position or the second height position of the device to be inspected is abnormal based on the pressure difference between the first pressure value and the second pressure value.

更進一步,比較器132可將檢壓器131之壓力值轉換成電壓值作一判別,亦無不可。Furthermore, the comparator 132 can convert the pressure value of the voltage detector 131 into a voltage value for determination.

依作業需求,檢知單元配置一資料庫,資料庫內建有待檢器位於第一高度位置之正確第一壓力值資料及位於第二高度位置之正確第二壓力值資料,以供與實際之第一壓力值及第二壓力值比對判別,不受限於本實施例。According to the operation requirements, the detection unit is configured with a database, which has built-in correct first pressure value data when the detector is located at a first height position and correct second pressure value data when it is located at a second height position, for comparison and identification with the actual first pressure value and second pressure value, which is not limited to this embodiment.

承上述,檢知單元能夠檢知待檢器位於其他高度位置是否異常,例如檢知單元能夠檢知待檢器位於下壓校高件(如電子元件)的第三高度位置,亦無不可。Based on the above, the detection unit can detect whether the device to be inspected is abnormal when it is located at other height positions. For example, the detection unit can detect whether the device to be inspected is located at the third height position of the lower pressure calibration component (such as an electronic component).

於本實施例,檢壓器131為氣壓感測器,並配置於流體輸送路徑的氣體裝置與輸送管125之間,檢壓器131可感測入料輸送器12位於第一高度位置時之第一壓力值,以及感測入料輸送器12位於第二高度位置時之第二壓力值 。比較器132能夠接收檢壓器131傳輸之第一壓力值及第二壓力值作一比對分析 ,並以壓力差而判別入料輸送器12之第一高度位置或第二高度位置是否異常。 In this embodiment, the pressure detector 131 is a pressure sensor and is disposed between the gas device of the fluid delivery path and the delivery pipe 125. The pressure detector 131 can sense the first pressure value when the feed conveyor 12 is at the first height position, and sense the second pressure value when the feed conveyor 12 is at the second height position. The comparator 132 can receive the first pressure value and the second pressure value transmitted by the pressure detector 131 for comparison analysis, and determine whether the first height position or the second height position of the feed conveyor 12 is abnormal based on the pressure difference.

請參閱圖2至圖4,本發明之校高方法包含第一給壓手段、第一檢壓手段、第二給壓手段、第二檢壓手段及校位手段。更包含前置手段。本發明之校高方法搭配校高機構的第一使用實施例如后。Please refer to Figures 2 to 4. The height calibration method of the present invention includes a first pressure supply means, a first pressure detection means, a second pressure supply means, a second pressure detection means and a position calibration means. It also includes a pre-position means. The first use example of the height calibration method of the present invention in combination with the height calibration mechanism is as follows.

前置手段將校高件設置於待檢器之移動路徑,待檢器沿移動路徑位移且相對校高件之承壓區域,並將流體輸送至待檢器之給壓流道。於本實施例,待檢器為可作X-Y-Z方向位移之入料輸送器12,校高件為近接開關11,且配置於入料輸送器12之移動路徑,入料輸送器12以移載具121帶動一具有給壓流道123之座體122及一為吸嘴126之作業部件沿移動路徑作X-Y方向位移至近接開關11之上方,由於吸嘴126為給壓流道123之一端部,而可令吸嘴126相對近接開關11之承壓區域111。入料輸送器12之給壓流道123連通一流體裝置,流體裝置為氣體裝置,氣體裝置以輸送管125沿流體輸送路徑將可為氣體之流體輸送至入料輸送器12之給壓流道123。The front means sets the height adjustment component in the moving path of the device to be inspected, and the device to be inspected is displaced along the moving path and is relatively to the pressure-bearing area of the height adjustment component, and the fluid is transported to the pressure-supplying channel of the device to be inspected. In this embodiment, the device to be inspected is a feed conveyor 12 that can be displaced in the X-Y-Z direction, and the height adjustment component is a proximity switch 11, and is arranged in the moving path of the feed conveyor 12. The feed conveyor 12 uses a transfer carrier 121 to drive a seat 122 with a pressure-supplying channel 123 and a working component that is a suction nozzle 126 to be displaced in the X-Y direction along the moving path to the top of the proximity switch 11. Since the suction nozzle 126 is one end of the pressure-supplying channel 123, the suction nozzle 126 can be relatively to the pressure-bearing area 111 of the proximity switch 11. The pressure supply channel 123 of the feed conveyor 12 is connected to a fluid device, which is a gas device. The gas device uses a delivery pipe 125 to deliver the fluid, which may be gas, to the pressure supply channel 123 of the feed conveyor 12 along the fluid delivery path.

第一給壓手段以待檢器位於第一高度位置,並以給壓流道朝向校高件之承壓區域吹送流體。更進一步,第一給壓手段以待檢器位於第一高度位置時未貼合校高件之承壓區域。於本實施例,待檢器為入料輸送器12,入料輸送器12以移載具121帶動一具有給壓流道123之座體122及吸嘴126沿校位軸線A作Z方向位移至第一高度位置L1,由於吸嘴126相通且位於給壓流道123之一端部 ,而可使吸嘴126相對且未貼合近接開關11之承壓區域111,氣體裝置經由輸送管125及入料輸送器12之給壓流道123輸送氣體,使入料輸送器12之給壓流道123的吸嘴126於第一高度位置L1朝向近接開關11之承壓區域111吹送氣體。 The first pressure supply means is used to wait for the detector to be located at a first height position, and to blow fluid toward the pressure-bearing area of the height adjustment member through the pressure supply flow channel. Furthermore, the first pressure supply means is used to wait for the detector to be located at the first height position, and the pressure-bearing area of the height adjustment member is not attached. In this embodiment, the device to be inspected is the feed conveyor 12. The feed conveyor 12 uses a transfer carrier 121 to drive a base 122 having a pressure supply channel 123 and a suction nozzle 126 to move along the calibration axis A in the Z direction to the first height position L1. Since the suction nozzle 126 is connected and located at one end of the pressure supply channel 123, the suction nozzle 126 can be opposite to and not in contact with the pressure-bearing area 111 of the proximity switch 11. The gas device delivers gas through the delivery pipe 125 and the pressure supply channel 123 of the feed conveyor 12, so that the suction nozzle 126 of the pressure supply channel 123 of the feed conveyor 12 blows gas toward the pressure-bearing area 111 of the proximity switch 11 at the first height position L1.

第一檢壓手段以檢知單元之檢壓器取得待檢器位於第一高度位置時之第一壓力值。更進一步,第一檢壓手段以檢壓器能夠取得流體裝置、給壓流道或者流體裝置與給壓流道間之流體供應路徑的第一壓力值。於本實施例,第一檢壓手段以檢壓器131配置於氣體裝置與輸送管125間之流體輸送路徑,且相通入料輸送器12之給壓流道123,於給壓流道123之吸嘴126朝向近接開關11之承壓區域111吹送氣體時,檢壓器131取得入料輸送器12位於第一高度位置L1時的第一壓力值。The first pressure detecting means uses the pressure detector of the detection unit to obtain the first pressure value when the device to be detected is at the first height position. Furthermore, the first pressure detecting means can obtain the first pressure value of the fluid device, the pressure supply channel, or the fluid supply path between the fluid device and the pressure supply channel by the pressure detector. In this embodiment, the first pressure detecting means uses the pressure detector 131 to be arranged in the fluid delivery path between the gas device and the delivery pipe 125, and communicates with the pressure supply channel 123 of the feed conveyor 12. When the suction nozzle 126 of the pressure supply channel 123 blows gas toward the pressure-bearing area 111 of the proximity switch 11, the pressure detector 131 obtains the first pressure value when the feed conveyor 12 is at the first height position L1.

第二給壓手段以待檢器沿校位軸線A由第一高度位置L1位移至第二高度位置L2,並以給壓流道朝向校高件之承壓區域吹送流體。更進一步,待檢器於正常狀態下,第二給壓手段以待檢器位於第二高度位置L2時已貼合校高件。於本實施例,入料輸送器12以移載具121帶動座體122及吸嘴126沿校位軸線A由第一高度位置L1位移至第二高度位置L2,第二高度位置L2為預設吸嘴126貼合電子元件之作業高度位置,入料輸送器12以給壓流道123一端之吸嘴126對近接開關11之承壓區域111吹送氣體。The second pressure-supplying means is used to displace the device to be inspected from the first height position L1 to the second height position L2 along the calibration axis A, and to blow fluid toward the pressure-bearing area of the height calibration component through the pressure-supplying channel. Furthermore, when the device to be inspected is in a normal state, the second pressure-supplying means is used to fit the height calibration component when the device to be inspected is at the second height position L2. In this embodiment, the feed conveyor 12 uses the transfer carrier 121 to drive the base 122 and the suction nozzle 126 to displace from the first height position L1 to the second height position L2 along the calibration axis A. The second height position L2 is the operating height position where the suction nozzle 126 is preset to fit the electronic component. The feed conveyor 12 uses the suction nozzle 126 at one end of the pressure-supplying channel 123 to blow gas to the pressure-bearing area 111 of the proximity switch 11.

第二檢壓手段以檢知單元之檢壓器取得待檢器位於第二高度位置L2時之第二壓力值。更進一步,第二檢壓手段以檢壓器能夠取得流體裝置、給壓流道或者流體裝置與給壓流道間之流體供應路徑的第二壓力值。於本實施例 ,第二檢壓手段於入料輸送器12之吸嘴126對近接開關11之承壓區域111吹送氣體時,檢壓器131取得入料輸送器12位於第二高度位置L2時的第二壓力值。 The second pressure detection means uses the pressure detector of the detection unit to obtain the second pressure value when the device to be detected is at the second height position L2. Furthermore, the second pressure detection means can obtain the second pressure value of the fluid device, the pressure supply channel, or the fluid supply path between the fluid device and the pressure supply channel by the pressure detector. In this embodiment, when the suction nozzle 126 of the feed conveyor 12 blows gas to the pressure-bearing area 111 of the proximity switch 11, the pressure detector 131 obtains the second pressure value when the feed conveyor 12 is at the second height position L2.

校位手段以檢知單元之比較器132接收檢壓器131傳輸之第一壓力值及第二壓力值,而判別待檢器之第一高度位置L1或第二高度位置L2是否異常 。依作業需求,校位手段之比較器132能夠以第一壓力值與第二壓力值的壓差值變化,而判別待檢器之第一高度位置或第二高度位置是否異常。當然,檢知單元可配置一資料庫,資料庫內建有待檢器位於第一高度位置L1之正確第一壓力值及位於第二高度位置L2之正確第二壓力值以供比對判別,不受限於本實施例。 The calibration means uses the comparator 132 of the detection unit to receive the first pressure value and the second pressure value transmitted by the pressure detector 131 to determine whether the first height position L1 or the second height position L2 of the device to be detected is abnormal. According to the operation requirements, the comparator 132 of the calibration means can determine whether the first height position or the second height position of the device to be detected is abnormal by the change of the pressure difference between the first pressure value and the second pressure value. Of course, the detection unit can be configured with a database, and the database has built-in correct first pressure values of the device to be detected at the first height position L1 and correct second pressure values at the second height position L2 for comparison and determination, which is not limited to this embodiment.

於本實施例,校位手段以比較器132接收檢壓器131傳輸之第一壓力值及第二壓力值,並將第一壓力值及第二壓力值轉換為電壓值加以分析,若第一壓力值及第二壓力值的壓差值符合預設之數值,即表示入料輸送器12之吸嘴126貼合近接開關11之承壓區域111,換言之,入料輸送器12之第二高度位置L2正確,吸嘴126能夠準確於預設取料作業高度位置執行取料作業;反之,若第一壓力值及第二壓力值的壓差值不符合預設之數值,即表示入料輸送器12之吸嘴126未貼合近接開關11之承壓區域111,換言之,入料輸送器12之第二高度位置L2異常,吸嘴126無法準確於預設取料作業高度位置執行取料作業;因此 ,本發明校高方法可迅速且精確地檢知待檢器之高度位置是否異常,甚至可以直接使用具有吸嘴之輸送器搭配近接開關,於執行輸送電子元件前而預先檢知吸嘴之作業高度位置是否異常,以節省檢知作業時序及檢知元件成本。 In this embodiment, the calibration means uses a comparator 132 to receive the first pressure value and the second pressure value transmitted by the pressure detector 131, and converts the first pressure value and the second pressure value into voltage values for analysis. If the pressure difference between the first pressure value and the second pressure value meets the preset value, it means that the suction nozzle 126 of the feed conveyor 12 is in contact with the pressure-bearing area 111 of the proximity switch 11. In other words, the second height position L2 of the feed conveyor 12 is correct. , the suction nozzle 126 can accurately perform the material picking operation at the preset material picking operation height position; on the contrary, if the pressure difference between the first pressure value and the second pressure value does not meet the preset value, it means that the suction nozzle 126 of the feed conveyor 12 is not in contact with the pressure-bearing area 111 of the proximity switch 11. In other words, the second height position L2 of the feed conveyor 12 is abnormal, and the suction nozzle 126 cannot accurately perform the material picking operation at the preset material picking operation height position; therefore, the height calibration method of the present invention can quickly and accurately detect whether the height position of the device to be inspected is abnormal, and can even directly use the conveyor with a suction nozzle in combination with the proximity switch to pre-detect whether the operating height position of the suction nozzle is abnormal before executing the conveying of electronic components, so as to save the detection operation sequence and the detection component cost.

當然,校位手段亦可根據第一壓力值及第二壓力值的壓差值而分析判別待檢器之位移量,以取得或/及調整待檢器之高度位置,亦無不可。Of course, the calibration means can also analyze and determine the displacement of the device to be inspected based on the pressure difference between the first pressure value and the second pressure value, so as to obtain or/and adjust the height position of the device to be inspected.

請參閱圖5至圖6,本發明之校高方法搭配校高機構的第二使用實施例,其與第一使用實施例之差異在於校位一出料輸送器14之高度位置,校高方法之前置手段以出料輸送器14之移載具141帶動一具有給壓流道143之座體142及吸嘴146沿移動路徑作X-Y方向位移至近接開關11之上方,氣體裝置以輸送管145將氣體輸送至出料輸送器14之給壓流道143。第一給壓手段之待檢器位於第一高度位置L3時已貼合校高件之承壓區域;於本實施例,第一高度位置L3為吸嘴146已貼合承壓區域111的高度位置,第一給壓手段之出料輸送器14以移載具141帶動座體142及吸嘴146沿校位軸線A位移至第一高度位置L3,且令給壓流道143之吸嘴146已貼合近接開關11之承壓區域111,出料輸送器14之給壓流道143以吸嘴146朝向近接開關11之承壓區域111吹送氣體。第一檢壓手段以檢壓器131取得出料輸送器14位於第一高度位置L3時的第一壓力值。第二給壓手段之待檢器位於第二高度位置L4時未貼合校高件之承壓區域;於本實施例,第二高度位置L4為吸嘴146未貼合承壓區域111的高度位置,第二給壓手段之出料輸送器14以移載具141帶動座體142及吸嘴146沿校位軸線A由第一高度位置L3向上位移至第二高度位置L4,出料輸送器14之吸嘴146未貼合近接開關11之校位區域111,給壓流道143經吸嘴146朝向近接開關11之承壓區域111吹送氣體。第二檢壓手段以檢壓器131取得出料輸送器14位於第二高度位置L4時的第二壓力值。校位手段之檢知單元以比較器132接收檢壓器131傳輸之第一壓力值及第二壓力值,並以第一壓力值及第二壓力值的壓差值分析判別出料輸送器14之第一高度位置L3或第二高度位置L4是否異常。Please refer to Figures 5 and 6, the second use embodiment of the height calibration method of the present invention is combined with the height calibration mechanism. The difference from the first use embodiment is that the height position of a discharge conveyor 14 is calibrated. The pre-measurement of the height calibration method uses a transfer carrier 141 of the discharge conveyor 14 to drive a base 142 and a suction nozzle 146 having a pressure supply channel 143 to move along the moving path in the X-Y direction to the top of the proximity switch 11, and the gas device uses a delivery pipe 145 to deliver gas to the pressure supply channel 143 of the discharge conveyor 14. When the device to be inspected of the first pressure supply means is located at the first height position L3, it has been attached to the pressure-bearing area of the height calibration member; in this embodiment, the first height position L3 is the height position at which the suction nozzle 146 has been attached to the pressure-bearing area 111. The discharging conveyor 14 of the first pressure supply means uses the transfer carrier 141 to drive the base 142 and the suction nozzle 146 to move along the calibration axis A to the first height position L3, and the suction nozzle 146 of the pressure supply channel 143 has been attached to the pressure-bearing area 111 of the proximity switch 11. The pressure supply channel 143 of the discharging conveyor 14 uses the suction nozzle 146 to blow gas toward the pressure-bearing area 111 of the proximity switch 11. The first pressure detection means uses the pressure detector 131 to obtain the first pressure value when the discharging conveyor 14 is located at the first height position L3. When the device to be inspected of the second pressure supply means is located at the second height position L4, it does not fit the pressure bearing area of the height calibration member; in this embodiment, the second height position L4 is the height position where the suction nozzle 146 does not fit the pressure bearing area 111. The discharging conveyor 14 of the second pressure supply means uses the transfer carrier 141 to drive the base 142 and the suction nozzle 146 to move upward from the first height position L3 to the second height position L4 along the calibration axis A. The suction nozzle 146 of the discharging conveyor 14 does not fit the calibration area 111 of the proximity switch 11, and the pressure supply channel 143 blows gas toward the pressure bearing area 111 of the proximity switch 11 through the suction nozzle 146. The second pressure detection means uses the pressure detector 131 to obtain the second pressure value when the discharging conveyor 14 is located at the second height position L4. The detection unit of the calibration means receives the first pressure value and the second pressure value transmitted by the pressure detector 131 with the comparator 132, and analyzes the pressure difference between the first pressure value and the second pressure value to determine whether the first height position L3 or the second height position L4 of the discharge conveyor 14 is abnormal.

請參閱圖1~4,本發明校高機構及校高方法應用於電子元件作業機,作業機包含機台20、供料裝置30、收料裝置40、作業裝置10及中央控制裝置(圖未示出)。供料裝置30裝配於機台20,並設有至少一供料器,以容納至少一待作業之電子元件。收料裝置40裝配於機台20,並設有至少一收料器,以容納至少一已作業之電子元件。作業裝置10配置於機台20,並設置至少一承置具、至少一作業器及至少一本發明校高機構,至少一承置具以供承置電子元件 ,至少一作業器以供於供料裝置30、收料裝置40或/及承置具對電子元件執行預設作業,校高機構以供校位至少一待檢器之第一高度位置或第二高度位置。於本實施例,承置具為測試座15,以供測試電子元件,至少一作業器包含複數個作業器,複數個作業器可為入料輸送器12、出料輸送器14、壓移器16、入料載台17及出料載台18;於初機狀態,入料輸送器12、出料輸送器14及壓移器16可為待檢器,本發明校高機構包含至少一校高件、至少一待檢器及檢知單元,於本實施例,校高件為近接開關11,校高機構配合校高方法而可校位及判別入料輸送器12、出料輸送器14及壓移器16之作業高度位置是否異常,以提高作業精準性及良率;於正式作業,作業裝置10以入料輸送器12於供料裝置30取出待測之電子元件,並將待測電子元件移載入料載台17,入料載台17將待測之電子元件載送至測試座15之側方,壓移器16將入料載台17之待測電子元件移載至測試座15而執行測試作業,以及將已測電子元件移入至出料載台18,出料載台18載出已測之電子元件,出料輸送器14於出料載台18取出已測之電子元件,並依據測試結果,將已測之電子元件輸送至收料裝置40之收料器處而分類收置。中央控制裝置(圖未示出)用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。 Please refer to Figures 1 to 4. The height adjustment mechanism and height adjustment method of the present invention are applied to an electronic component processing machine, which includes a machine 20, a feeding device 30, a receiving device 40, a processing device 10, and a central control device (not shown). The feeding device 30 is mounted on the machine 20 and is provided with at least one feeder to accommodate at least one electronic component to be processed. The receiving device 40 is mounted on the machine 20 and is provided with at least one receiving device to accommodate at least one processed electronic component. The operating device 10 is arranged on the machine 20, and is provided with at least one supporting device, at least one operating device and at least one height adjustment mechanism of the present invention. The at least one supporting device is used to support the electronic component. The at least one operating device is used for the feeding device 30, the receiving device 40 or/and the supporting device to perform a preset operation on the electronic component. The height adjustment mechanism is used to adjust the first height position or the second height position of at least one device to be inspected. In this embodiment, the holder is a test seat 15 for testing electronic components. At least one operator includes a plurality of operators. The plurality of operators can be an infeed conveyor 12, an outfeed conveyor 14, a pressure shifter 16, an infeed platform 17, and an outfeed platform 18. In the initial state, the infeed conveyor 12, the outfeed conveyor 14, and the pressure shifter 16 can be devices to be inspected. The height adjustment mechanism of the present invention includes at least one height adjustment component, at least one device to be inspected, and a detection unit. In this embodiment, the height adjustment component is a proximity switch 11. The height adjustment mechanism cooperates with the height adjustment method to adjust and determine whether the operating height position of the infeed conveyor 12, the outfeed conveyor 14, and the pressure shifter 16 is abnormal, so as to improve the operation efficiency. Accuracy and yield rate; in the formal operation, the operating device 10 uses the feed conveyor 12 to take out the electronic components to be tested from the feeding device 30, and transfers the electronic components to be tested to the feed carrier 17, the feed carrier 17 carries the electronic components to be tested to the side of the test seat 15, the pressure shifter 16 transfers the electronic components to be tested on the feed carrier 17 to the test seat 15 to perform the test operation, and moves the tested electronic components to the unloading carrier 18, the unloading carrier 18 carries out the tested electronic components, the unloading conveyor 14 takes out the tested electronic components from the unloading carrier 18, and according to the test results, transports the tested electronic components to the receiver of the receiving device 40 for classification and storage. The central control device (not shown) is used to control and integrate the actions of various devices to perform automated operations and achieve the practical benefit of improving operational efficiency.

作業裝置10 近接開關11 承壓區域111 入料輸送器12 移載具121 座體122 給壓流道123 活動件124 輸送管125 吸嘴126 檢壓器131 比較器132 出料輸送器14 移載具141 座體142 給壓流道143 輸送管145 吸嘴146 測試座15 壓移器16 入料載台17 出料載台18 校位軸線A 第一高度位置L1、L3 第二高度位置L2、L4 機台20 供料裝置30 收料裝置40 Working device 10 Proximity switch 11 Pressure bearing area 111 Infeed conveyor 12 Transfer carrier 121 Base 122 Pressure supply channel 123 Movable part 124 Delivery pipe 125 Suction nozzle 126 Pressure detector 131 Comparator 132 Outfeed conveyor 14 Transfer carrier 141 Base 142 Pressure supply channel 143 Delivery pipe 145 Suction nozzle 146 Test base 15 Pressure shifter 16 Infeed platform 17 Outfeed platform 18 Calibration axis A First height position L1, L3 Second height position L2, L4 Machine 20 Feeding device 30 Receiving device 40

圖1:本發明校高機構之配置圖。 圖2:本發明校高方法之流程圖。 圖3至圖4:本發明校高機構及校高方法之第一實施例使用示意圖。 圖5至圖6:本發明校高機構及校高方法之第二實施例使用示意圖。 圖7:本發明校高機構應用於作業機之示意圖。 Figure 1: Configuration diagram of the height adjustment mechanism of the present invention. Figure 2: Flow chart of the height adjustment method of the present invention. Figures 3 to 4: Schematic diagrams of the first embodiment of the height adjustment mechanism and the height adjustment method of the present invention. Figures 5 to 6: Schematic diagrams of the second embodiment of the height adjustment mechanism and the height adjustment method of the present invention. Figure 7: Schematic diagram of the height adjustment mechanism of the present invention applied to a work machine.

11:近接開關 11: Proximity switch

111:承壓區域 111: Pressure-bearing area

12:入料輸送器 12: Feed conveyor

121:移載具 121:Move vehicle

122:座體 122: Seat

123:給壓流道 123: Pressure channel

125:輸送管 125:Transmission pipe

126:吸嘴 126: Suction nozzle

131:檢壓器 131: Voltage detector

132:比較器 132: Comparator

A:校位軸線 A: Calibration axis

L1:第一高度位置 L1: First height position

Claims (5)

一種校高方法,包含: 第一給壓手段:待檢器位於第一高度位置,並以給壓流道朝向校高件之承 壓區域吹送流體; 第一檢壓手段:檢知單元以檢壓器取得該待檢器位於該第一高度位置時之 第一壓力值; 第二給壓手段:該待檢器沿校位軸線由該第一高度位置位移至第二高度位 置,並以該給壓流道朝向該校高件之該承壓區域吹送該流體; 第二檢壓手段:該檢知單元以該檢壓器取得該待檢器位於該第二高度位置 時之第二壓力值; 校位手段:該檢知單元以比較器接收該檢壓器傳輸之該第一壓力值及該第二壓力值,而判別該待檢器之該第一高度位置或該第二高度位置是否異常。 A height calibration method, comprising: First pressure supply means: the device to be tested is located at a first height position, and a pressure supply flow channel is used to blow a fluid toward the pressure-bearing area of the height calibration component; First pressure detection means: the detection unit uses a pressure detector to obtain a first pressure value when the device to be tested is located at the first height position; Second pressure supply means: the device to be tested is displaced from the first height position to the second height position along the calibration axis, and the pressure supply flow channel is used to blow the fluid toward the pressure-bearing area of the height calibration component; Second pressure detection means: the detection unit uses the pressure detector to obtain a second pressure value when the device to be tested is located at the second height position; Calibration means: The detection unit receives the first pressure value and the second pressure value transmitted by the pressure detector through a comparator, and determines whether the first height position or the second height position of the device to be detected is abnormal. 如請求項1所述之校高方法,其該第一給壓手段之該待檢器位於該第一高度位置時未貼合該校高件之該承壓區域,該第二給壓手段之該待檢器位於該第二高度位置時已貼合該校高件之該承壓區域。In the height calibration method as described in claim 1, when the device to be inspected of the first pressure-applying means is located at the first height position, it is not in contact with the pressure-bearing area of the height calibration component, and when the device to be inspected of the second pressure-applying means is located at the second height position, it is in contact with the pressure-bearing area of the height calibration component. 如請求項1所述之校高方法,其該第一給壓手段之該待檢器位於該第一高度位置時已貼合該校高件之該承壓區域,該第二給壓手段之該待檢器位於該第二高度位置時未貼合該校高件之該承壓區域。In the height calibration method as described in claim 1, when the device to be inspected of the first pressure-applying means is located at the first height position, it is already in contact with the pressure-bearing area of the height calibration component, and when the device to be inspected of the second pressure-applying means is located at the second height position, it is not in contact with the pressure-bearing area of the height calibration component. 如請求項1所述之校高方法,更包含前置手段,該前置手段將該校高件設置於該待檢器之移動路徑,該待檢器沿該移動路徑位移且相對該校高件之該承壓區域,並將該流體輸送至該待檢器之該給壓流道。The height calibration method as described in claim 1 further includes a pre-positioning means, which sets the height calibration component in the moving path of the device to be tested, and the device to be tested is displaced along the moving path and relative to the pressure-bearing area of the height calibration component, and the fluid is transported to the pressure supply channel of the device to be tested. 如請求項1所述之校高方法,其該校位手段之該比較器能夠以該第一壓力值與該第二壓力值的壓差值變化,而判別該待檢器之該第一高度位置或該第二高度位置是否異常。In the height calibration method as described in claim 1, the comparator of the calibration means can determine whether the first height position or the second height position of the device to be inspected is abnormal based on the change in the pressure difference between the first pressure value and the second pressure value.
TW113112739A 2024-04-03 2024-04-03 Height-calibration mechanism, height-calibration method, and processing machine TWI883896B (en)

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TW202104905A (en) * 2019-01-08 2021-02-01 美商弗姆費特比佛頓公司 Probe systems and methods for calibrating capacitive height sensing measurements
CN115435718A (en) * 2021-06-03 2022-12-06 鸿劲精密股份有限公司 Calibration device, calibration method and working machine for its application

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150049346A1 (en) * 2013-02-18 2015-02-19 Nordson Corporation Automated position locator for a height sensor in a dispensing system
US20140320832A1 (en) * 2013-04-25 2014-10-30 Nikon Corporation Position-measurement systems
TW202104905A (en) * 2019-01-08 2021-02-01 美商弗姆費特比佛頓公司 Probe systems and methods for calibrating capacitive height sensing measurements
CN115435718A (en) * 2021-06-03 2022-12-06 鸿劲精密股份有限公司 Calibration device, calibration method and working machine for its application

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