TWI883895B - Testing device and processing machine - Google Patents

Abstract

The testing device includes a testing mechanism, a pressing mechanism, and an evenly-pressing mechanism. The testing mechanism has a base plate with plural testing seats to test plural electronic components. The pressing mechanism has a supporter with plural pressing members to press plural electronic components. The evenly-pressing mechanism has a receiving area and a connecting area at the base plate and the supporter respectively. The receiving area has a pushing member. When the action force from the electronic components pressed by the pressing members is exerted onto the supporter, the pushing member abuts against the connecting area to form a virtual action force so as to balance the force on the supporter to make the supporter horizontal. Thus, the plural pressing members can evenly press the electronic components so as to improve the performance of testing.

Description

Test equipment and operating machines

The present invention provides a testing device which can make a plurality of crimpers uniformly apply force to press down electronic components to improve the testing quality.

At present, please refer to Figures 1 to 3. The test device 10 has a receiving hole 111 opened on the machine 11 for assembling the substrate 12 of the test mechanism. The substrate 12 is provided with four test sockets 13 for testing the electronic component 14. In order to ensure that the contact of the electronic component 14 is in contact with the probe of the test socket 13, the test device 10 is configured with a crimping mechanism above the test mechanism. The crimping mechanism is equipped with a plurality of crimpers 16 on a carrier 151 of a transfer arm 15. The number and position of the plurality of crimpers 16 are relative to the number and position of the plurality of test sockets 13 on the substrate 12. The transfer arm 15 drives the four crimpers 16 to move. 6 is displaced downward in the Z direction to a preset crimping position, so that the four crimpers 16 respectively crimp the electronic components 14 in the test sockets 13 at the corresponding positions with a lower pressure to perform a test operation. After being pressed, the electronic components 14 will generate a reaction force on the crimpers 16, and the reaction force is transmitted to the carrier 151 through the crimpers 16. Since the four crimpers 16 are evenly arranged at the bottom of the carrier 151, the carrier 15 receives a uniform reaction force without sideways deformation affecting the horizontality and excessive or insufficient downward pressure, so that the four crimpers 16 press the four electronic components 14 with a uniform downward pressure to perform a test operation.

However, according to the test operation requirements, when the test mechanism replaces another substrate 12A with three test sockets 13A in the receiving hole 111 of the machine 11, the crimping mechanism must also remove a crimper from the carrier 151 and use three crimpers 16 to crimp the electronic components 14 in the corresponding three test sockets 13A. However, in this test state, the three crimpers 16 are located on one side of the carrier 151, resulting in the three reaction forces borne by the carrier 151 being heavier on one side, causing lateral deformation and affecting the horizontality, resulting in uneven downward pressure of the three crimpers 16 at the bottom of the carrier 151, causing the electronic components 14 in the three test sockets 13A to be unevenly stressed and affecting the test quality.

The first object of the present invention is to provide a testing device, comprising a testing mechanism, a crimping mechanism and a pressure equalizing mechanism; the testing mechanism is provided with a substrate and a plurality of test sockets, the substrate is provided with a first working area for assembling a plurality of test sockets, and the plurality of test sockets are used to test a plurality of electronic components; the crimping mechanism is provided with a mounting fixture and a plurality of crimpers, the mounting fixture is provided with a second working area for assembling a plurality of crimpers, and the plurality of crimpers can crimp a plurality of the test sockets with a pressure below Electronic components; the pressure-equalizing mechanism is provided with a receiving area and a joint area corresponding to each other on the substrate and the mounting device, and at least one top abutment is installed on the receiving area for bonding to the joint area; when the crimping mechanism removes the unused crimping device from the mounting device and crimps the multiple electronic components of the multiple test sockets of the testing mechanism with the multiple crimping devices required, the top abutment of the pressure-equalizing mechanism is used to abut the corresponding joint area to construct a simulated reaction force, which is matched with the reaction force of the multiple crimping devices , thereby ensuring the horizontality of the mounting device, so that the multiple crimping devices of the mounting device apply an average force to crimp the multiple electronic components to perform the test operation, so that the multiple electronic components are evenly pressed, thereby improving the test quality.

The second object of the present invention is to provide an operating machine, including a machine, a feeding device, a receiving device, a testing device of the present invention, a conveying device and a central control device. The feeding device is arranged on the machine and is provided with at least one feeder for accommodating at least one electronic component to be tested; the receiving device is arranged on the machine and is provided with at least one receiver for accommodating at least one tested electronic component; the testing device of the present invention is arranged on the machine and includes a testing mechanism, a crimping mechanism and a pressure-equalizing mechanism for crimping and testing a plurality of electronic components; the conveying device is arranged on the machine and is provided with at least one conveyor for conveying electronic components; the central control device is used to control and integrate the actions of each device to perform automated operations.

In order to enable you to have a further understanding of the present invention, a preferred embodiment is given below with accompanying drawings:

Please refer to Figures 4 and 5. The testing device 20 of the present invention includes a testing mechanism, a crimping mechanism and a pressure equalizing mechanism. The first embodiment is as follows.

The testing mechanism includes a substrate 21 and a plurality of testing sockets 221 . The substrate 21 is provided with a first operating area 211 for assembling the plurality of testing sockets 221 . The plurality of testing sockets 221 are used for testing a plurality of electronic components (not shown).

According to the operation requirements, the substrate 21 can be an independent panel or a machine board. The substrate 21 has a plurality of through holes for assembling a plurality of test sockets 221. For example, the substrate 21 is an independent panel with a plurality of through holes and can be assembled or disassembled on the machine. For example, the substrate 12 is a machine board with a plurality of through holes

According to the operation requirements, the testing mechanism can replace the substrate 21 with a different number of test sockets 221, such as a substrate with four test sockets or another substrate with three test sockets.

In this embodiment, the substrate 21 of the test mechanism is an independent panel and can be assembled or disassembled in the receiving hole 31 of the machine 30. The substrate 21 defines a first operating area 211 for configuring a plurality of test sockets 221. In this embodiment, the first operating area 211 is provided with three through holes 212 for accommodating three test sockets 221. The three test sockets 221 are electrically connected to a circuit board 222 and a test machine for testing three electronic components (not shown). Since the size of the receiving hole 31 of the machine 30 is fixed and the positions of the three test sockets 221 are relative to the positions of the three crimpers (to be described later) of the crimping mechanism, a first axis L1 is defined on the substrate 21. The positions of the three test sockets 221 are offset to one side of the first axis L1, and the other side of the first axis L1 has a plane.

The crimping mechanism includes at least one mounting device 23 and a plurality of crimpers 24. The mounting device 23 is provided with a second working area 231 for assembling the plurality of crimpers 24. The plurality of crimpers 24 can crimp the plurality of electronic components of the plurality of test sockets 221 with a low pressure.

The mounting device 23 can be a fixed configuration or a mobile configuration; for example, the mounting device 23 is a fixed frame, so that the test seat can be relatively displaced toward the mounting device 23; for example, the mounting device 23 is a transfer arm, and is driven by a transfer driver to move in at least one direction, so that the mounting device 23 can be relatively displaced toward the test seat. Furthermore, the transfer driver can be a cylinder, a linear motor, or a motor and at least one transmission group, and the transmission group is a belt pulley group or a screw seat group.

According to the operation requirements, the crimping device 24 further includes a floater for floating displacement.

According to the operation requirements, the crimper 24 may not have a suction nozzle and only use a pressing fixture to perform the operation of crimping electronic components; or the crimper 24 may have a pressing fixture and a suction nozzle and perform the operation of crimping and picking up and placing electronic components.

According to the operation requirements, the crimper 24 further includes a temperature control unit (not shown), which can be arranged above the float of the crimper 24, between the float and the pressing fixture, or on the pressing fixture. The temperature control unit is provided with at least one temperature control part for the electronic components to perform the test operation in the simulated temperature environment of the future application. Furthermore, the temperature control part can be a heating part, a cooling chip or a seat with a fluid.

In this embodiment, the crimping mechanism is provided with a transfer driver (not shown) to drive a mounting device 23 which is a transfer arm to move in the Y-Z direction. A second working area 231 is provided at the bottom of the mounting device 23 to be provided with a plurality of crimping devices 24 with suction nozzles (not shown). The crimping devices 24 can pick up and crimp electronic components. In this embodiment, a second axis L2 is defined on the mounting device 23. The second working area 231 of the mounting device 23 is originally provided with four crimping devices 24 to be used with a crimping device 24 originally installed on the machine 30 by the test mechanism. For a substrate with four test sockets (not shown in the figure), according to the working requirements, when the testing mechanism replaces another substrate 21 with three test sockets 221 on the machine 30, the staff directly removes a crimper in the second working area 231 of the mounting device 23, so that the number of three crimpers 24 of the mounting device 23 corresponds to the number of three test sockets 221 of the substrate 21, and the testing operation of three electronic components (not shown in the figure) can be performed; therefore, the position of the three crimpers 24 in the second working area 231 of the mounting device 23 is offset to one side of the second axis L2.

The pressure-equalizing mechanism is provided with a receiving area 251 and a joint area 252 opposite to each other on the substrate 21 and the mounting device 23. The receiving area 251 is provided for assembling at least one top abutment 253. The abutment surface 2531 of the top abutment 253 can be attached to the joint area 252 when a plurality of crimpers 24 crimp a plurality of electronic components to construct at least one simulated reaction force, so that the mounting device 23 is subjected to an even force and maintains a horizontal degree, so as to facilitate uniform pressure on a plurality of electronic components.

Based on the above, if the pressure equalizing mechanism defines at least one receiving area 251 on the substrate 21 for assembling the top abutment 253, further, the receiving area 251 can be located on the side of the first working area 211, or the receiving area 251 can overlap the first working area 211 of the substrate 21 and avoid the assembly range of the test seat 221, so as to facilitate the assembly of the top abutment 253. The pressure equalizing mechanism defines at least one joining area 252 on the mounting device 23, the joining area 252 is relative to the receiving area 251, the joining area 252 can be located on the side of the second working area 231, or the joining area 252 can overlap the second working area 231 of the mounting device 23 and avoid the assembly range of the pressure connector 24.

Similarly, if the pressure equalizing mechanism defines at least one receiving area 251 on the mounting device 23 for assembling the top abutment 253; further, the receiving area 251 can be located on the side of the second working area 231, or the receiving area 251 can overlap the second working area 231 of the mounting device 23 and avoid the assembly range of the pressure connector 24, so that the top abutment 253 can be easily assembled. The pressure equalizing mechanism defines at least one bonding area 252 on the substrate 21, and the bonding area 252 is relative to the receiving area 251. The bonding area 252 can be located on the side of the first working area 211, or the bonding area 252 can overlap the first working area 211 of the substrate 21 and avoid the assembly range of the test seat 221.

As described above, the top abutment 253 of the pressure equalizing mechanism and the plurality of crimping devices 24 or the plurality of test sockets 221 are located in the same row.

According to the above, the pressure equalizing mechanism is provided with a coupling unit between the receiving area 251 and the top abutment 253, and the coupling unit is provided with a first coupling component and a second coupling component that cooperate with each other in the receiving area 251 and the top abutment 253. The positions of the first coupling component and the second coupling component can be different from the assembly position of the crimper 24 or the test seat 221. Furthermore, the first coupling component and the second coupling component can be mutually cooperating positioning pins and positioning holes, or mutually cooperating bolts and screw holes, etc., which are not limited to this embodiment.

In this embodiment, the pressure equalizing mechanism defines a receiving area 251 on the side of the first working area 211 of the substrate 21 for assembling a top abutment 253 having an abutting surface 2531. A coupling unit is provided between the top abutment 253 and the receiving area 251. The coupling unit is provided with a plurality of first coupling parts, which are positioning holes 2541, in the receiving area 251, and a plurality of second coupling parts, which are positioning pins 2542, in the top abutment 253. The top abutment 253 is inserted into the positioning holes 2541 of the receiving area 251 with the positioning pins 2542, so that the top abutment 253 is assembled on the substrate 21 and located on the side of the test seat 221 and the other side of the first axis L1; the abutting surface 2531 of the top abutment 253 faces upward , the height dimension from the abutting surface 2531 to the receiving area 251 is the height dimension from the crimping device 24 to the electronic component, and the height dimension from the bonding area 252 to the receiving area 251; the distance between the top abutment 253 and the adjacent test seat 221 can be equal to the distance between two adjacent test seats 221; and the pressure balancing mechanism defines a bonding area 252 on the mounting device 23, the bonding area 252 overlaps the second working area 231 of the mounting device 23, and is located on the other side of the second axis L2, and the bonding area 252 is opposite to the receiving area 251.

Please refer to Figures 6 and 7. The crimping mechanism uses three crimpers 24 to pick up three electronic components 40 to be tested. The transfer driver (not shown) drives the mounting device 23, the three crimpers 24 and the three electronic components 40 to move in the Y direction to the top of the substrate 21 of the test mechanism, so that the three crimpers 24 are opposite to the three test seats 221, and the joint area 252 of the pressure equalizing mechanism is opposite to the top of the receiving area 251. The transfer driver then drives the mounting device 23, the three crimping devices 24 and the three electronic components 40 to move downward in the Z direction to the preset crimping position. The three crimping devices 24 move the three electronic components 40 into the three test seats 221 of the test mechanism and press the electronic components 40 with a preset downward pressure. The joint area 252 of the pressure-equalizing mechanism is pressed and attached to the abutment surface 2531 of the top abutment 253. The three electronic components 40 and the top abutment 253 are respectively arranged on both sides of the first axis L1. The three electronic components 40 transmit the reaction force to the second working area 231 of the mounting device 23 through the three crimpers 24, and the simulated reaction force constructed by the top abutment 253 of the pressure equalizing mechanism is transmitted to the joint area 252 of the mounting device 23, so that the mounting device 23 utilizes the second working area 231 and the joint area 252. The reaction forces of the three electronic components 40 and the simulated reaction forces of the abutment 253 are evenly borne, that is, the mounting device 23 is evenly borne by two reaction forces on both sides of the second axis L2 to ensure the horizontality of the mounting device 23, so that the three crimpers 24 apply force evenly to crimp the three electronic components 40. When the three electronic components 40 are evenly borne, the test quality of the electronic components is further improved.

Please refer to Figures 8 and 9. The second embodiment of the test device 20 of the present invention is substantially similar in design to the first embodiment. The difference between the second embodiment and the first embodiment is that the pressure equalizing mechanism defines a receiving area 251 on the mounting device 23. The receiving area 251 overlaps the second working area 231 of the mounting device 23 and avoids the assembly range of the pressure connector 24, so that a top abutment 253 with an abutment surface 2531 can be conveniently assembled. A coupling unit is provided between the top abutment 253 and the receiving area 251. The coupling unit is provided with a first coupling component for a positioning hole 2541 in the receiving area 251, and a second coupling component for a positioning pin 2542 is provided on the top abutment 253. , the top abutment 253 is inserted into the positioning hole 2541 of the receiving area 251 with the positioning pin 2542, so that the top abutment 253 is assembled on the mounting device 23 and is located on the side of the crimper 24 and the other side of the second axis L2; the abutment surface 2531 of the top abutment 253 faces downward, and the height dimension from the abutment surface 2531 to the receiving area 251 is the height dimension from the crimper 24 to the receiving area 251; the distance between the top abutment 253 and the adjacent crimper 24 can be equal to the distance between the two adjacent crimpers 24; and the pressure balancing mechanism defines a bonding area 252 on the substrate 21, and the bonding area 252 is relative to the receiving area 251 , the junction area 252 is located on the other side of the first axis L1.

Please refer to FIG. 10 , the third embodiment of the test device 20 of the present invention is designed in a substantially similar manner to the first embodiment. The difference between the third embodiment and the first embodiment is that the pressure-equalizing mechanism is provided with a positioner 255 in the receiving area 251 for adjusting the use height of the top abutment 253. According to the operation requirements, if the preset crimping position of the crimping device 24 of the crimping mechanism changes, the pressure-equalizing mechanism can use the positioner 255 to adjust the use height of the top abutment 253, so that the abutting surface 2531 of the top abutment 253 is surely attached to the joint area 252, thereby improving the use efficiency.

4-7 and 11 , the testing device 20 of the present invention is applied to an electronic component processing machine, which includes a machine 30 , a feeding device 50 , a receiving device 60 , the testing device 20 of the present invention, a conveying device 70 and a central control device (not shown). The feeding device 50 is mounted on the machine 30 and is provided with at least one feeder to accommodate at least one electronic component to be tested; the receiving device 60 is mounted on the machine 30 and is provided with at least one receiver to accommodate at least one electronic component that has been tested; the testing device 20 of the present invention is arranged on the machine 30 and is provided with a testing mechanism, a crimping mechanism and a pressure equalizing mechanism for crimping and testing electronic components. In this embodiment, the testing device 20 is provided with a substrate 21 and a plurality of test sockets 221. The substrate 21 is provided with a first working area 211 for assembling a plurality of test sockets 221. The plurality of test sockets 221 are provided with a first working area 211. The circuit board 222 is electrically connected to the circuit board 222 for receiving and testing electronic components; the crimping mechanism is provided with a mounting device 23 and a plurality of crimpers 24, the mounting device 23 is provided with a second working area 231 for assembling a plurality of crimpers 24, and the plurality of crimpers 24 can crimp a plurality of electronic components of a plurality of test sockets 221 under a lower pressure; the pressure balancing mechanism is provided with a corresponding receiving area 251 and a joint area 252 on the substrate 21 and the mounting device 23, the receiving area 251 is provided for assembling at least one top abutment 253, and the abutting surface 2531 of the top abutment 253 can crimp a plurality of crimpers 24 to crimp a plurality of electronic components. The electronic components are sometimes attached to the joint area 252 to construct at least one simulated reaction force so that the mounting device 23 is evenly stressed and keeps the horizontality; the conveying device 70 is mounted on the machine 30 and is provided with at least one conveyor to convey the electronic components. In this embodiment, the conveying device 70 uses a first conveyor 71 to take out the electronic components to be tested from the feeder of the feeding device 50 and transfer them to the second conveyor 72. The second conveyor 72 transports the plurality of electronic components to one side of the testing device 20. The crimping mechanism uses the mounting device 23 to drive the plurality of crimpers 24 to take out the electronic components to be tested from the second conveyor 72. The electronic components are taken out and moved into a plurality of test sockets 221 to perform the test operation. The pressure equalizing mechanism is used to make the plurality of electronic components evenly stressed. After the test is completed, the crimping mechanism transfers the tested electronic components to the third conveyor 73 for unloading. The fourth conveyor 74 takes out the plurality of tested electronic components from the third conveyor 73, and according to the test results, the tested electronic components are transported to the receiver of the receiving device 60 for classification and storage. The central control device (not shown) is used to control and integrate the actions of each device to perform automated operations to achieve the practical benefit of improving the operating efficiency.

[Knowledge] Test device 10 Machine 11 Accommodation hole 111 Substrate 12, 12A Test seat 13, 13A Electronic component 14 Transfer arm 15 Carrier 151 Crimper 16 [Invention] Test device 20 Substrate 21 First working area 211 Through hole 212 Test seat 221 Circuit board 222 Mounting device 23 Second working area 231 Crimper 24 Receiving area 251 Joint area 252 Abutment 253 Abutment surface 2531 Positioning hole 2541 Positioning pin 2542 Positioner 255 First axis L1 Second axis L2 Machine 30 Accommodation hole 31 Electronic component 40 Feeding device 50 Receiving device 60 Conveying device 70 First conveyor 71 Second conveyor 72 Third conveyor 73 Fourth conveyor 74

Figures 1 to 3: Schematic diagrams of the use of the known test device. Figures 4 to 5: Schematic diagrams of the first embodiment of the present invention. Figures 6 to 7: Schematic diagrams of the use of the first embodiment of the present invention. Figures 8 to 9: Schematic diagrams of the second embodiment of the present invention. Figure 10: Schematic diagram of the third embodiment of the present invention. Figure 11: Schematic diagram of the test device of the present invention applied to a work machine.

20:Testing equipment

21:Substrate

221: Test seat

23: Mounting device

24: Crimper

251: Receiving area

252: Junction area

253: Top contact piece

40: Electronic components

Claims (10)

A test device, comprising: A test mechanism: a substrate and a plurality of test sockets are provided, the substrate is provided with a first working area, at least one side of the first axis of the first working area is used to assemble the plurality of test sockets, and the plurality of test sockets are used to test a plurality of electronic components; A crimping mechanism: a mounting device and a plurality of crimpers are provided, the mounting device is provided with a second working area, at least one side of the second axis of the second working area is used to assemble the plurality of crimpers, and the plurality of crimpers can crimp the plurality of electronic components of the plurality of test sockets with a lower pressure; A pressure equalization mechanism: the substrate and the mounting device are provided with a corresponding receiving area and a joint area, the receiving area is provided with a At least one top abutment is provided for assembly. The abutment surface of the top abutment can be attached to the joint area when the plurality of crimpers crimp the plurality of electronic components, so as to construct at least one simulated reaction force on at least one side of the first axis or the second axis, and can compensate for the reaction force on at least one side of the second axis of the mounting device, so that the two sides of the second axis of the mounting device are evenly stressed and maintain horizontality. As described in claim 1, the pressure equalizing mechanism is provided with a coupling unit between the receiving area and the top abutment, and the coupling unit is provided with a first coupling component and a second coupling component that cooperate with each other in the receiving area and the top abutment. In the test device as described in claim 2, the positions of the first coupling component and the second coupling component can be different from the assembly positions of the crimper or the test socket. In the testing device as described in claim 1, the receiving area or the joining area of the pressure equalizing mechanism can overlap with the first operating area of the substrate. In the test device as described in claim 1, the receiving area or the connecting area of the pressure equalizing mechanism can overlap with the second working area of the mounting device. In the testing device as described in claim 1, the receiving area or the joining area of the pressure equalizing mechanism can be located on the side of the first working area of the substrate or the second working area of the mounting device. In the test device as described in claim 1, the top abutment of the pressure-equalizing mechanism is located in the same row as the plurality of crimpers or the plurality of test seats. As for the test device described in claim 1, the pressure equalizing mechanism is provided with a positioner in the receiving area to adjust the height of the top abutment. In the test device as described in claim 1, the crimping mechanism is provided with a transfer driver for driving the mounting device to move in at least one direction. A work machine, comprising: a machine; a feeding device: arranged on the machine and provided with at least one feeder for accommodating at least one electronic component to be tested; a receiving device: arranged on the machine and provided with at least one receiver for accommodating at least one electronic component that has been tested; at least one testing device as described in claim 1: arranged on the machine for testing a plurality of electronic components; a conveying device: arranged on the machine and provided with at least one conveyor for conveying the electronic components; a central control device: for controlling and integrating the actions of various devices to perform automated operations.

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