TWI856845B - Pressing mechanism with temperature conduction device and application in test classification equipment. - Google Patents

Abstract

A pressing mechanism having a temperature conduction device which installed in a testing classification equipment. The pressing mechanism comprises a pressing device of a pressing part, a temperature conduction device and a driving rod, which is connected with pressing device. The temperature conduction device has a thickness of heat conduction block, which is located between the pressure device and the electronic components. Through the transmission rod drives the lower part along the first axial displacement relative to the electronic component, the lower part pressed against the heat conduction block and then pressed against the electronic component. The heat conduction block is deformed by compression to fill the uneven surface of electronic components, in order to increase the contact area between the heat components, shorten the time for the electronic components to reach the preset temperature, and effectively improve the production efficiency of the test classification equipment.

Description

Crimp mechanism with temperature transfer device and test classification equipment using the crimp mechanism

A temperature transfer device used in electronic component testing and sorting equipment, especially a device that transfers temperature to electronic components during testing and sorting operations.

In order to ensure that electronic components (such as IC chips) are good products when they leave the factory, they must be given a temperature test by test sorting equipment before shipment. That is, the electronic components are tested at a predetermined temperature to detect good and defective products.

However, in the process of manufacturing electronic components, multiple layers of material structures are stacked through package-on-package (PoP), but because each layer of material has a different thermal expansion coefficient, the expansion changes of each layer of material are unequal at the same temperature, which can easily cause the electronic component to warp, and the temperature transfer area is small, resulting in poor temperature conductivity. In addition, in addition to the warping phenomenon, the surface of the electronic component is not flat. The traditional method uses liquid (such as water) to fill the gap to increase the temperature transfer area, but because the thermal conductivity of the liquid is not high, it cannot actually improve the temperature conductivity.

The larger the size of the electronic component, the greater the variation in its warp and surface flatness. The test sorting equipment transmits temperature to the electronic component, which significantly prolongs the time it takes for the electronic component to reach the predetermined temperature, and further reduces the productivity of the test sorting equipment, resulting in a low production volume (units per hour, UPH) of the test sorting equipment, which seriously leads to insufficient competitiveness of the test sorting equipment.

The first object of the present invention is to provide a crimping mechanism of a temperature-conducting device for pressing an electronic component. The crimping mechanism includes a lower pressing device, a temperature-conducting device and a transmission rod. The lower pressing device has a base with a storage space, a heating element and a pressing element arranged under the base. The heating element is arranged in the storage space. The temperature-conducting device has at least one heat-conducting block that can be deformed by pressure. The heat-conducting block has a pressing surface for pressing against the electronic component. Thus, when the temperature-conducting device is pressed against the surface of the electronic component, the temperature-conducting device is deformed by pressure to fill the uneven surface of the electronic component, thereby increasing the heat exchange area, improving the heat conduction performance, and shortening the time for the electronic component to reach the predetermined temperature.

The second purpose of the present invention is that the area of the pressing surface of the heat conductive block is greater than or equal to the area of the surface of the electronic component. The pressing piece presses against the heat conductive block to deform under pressure, and the area of the pressing surface becomes larger, and the contact area with the surface of the electronic component also increases, which greatly reduces the warping phenomenon of the electronic component.

The third purpose of the present invention is to provide a temperature conduction device for resisting an electronic component. At the same time, the temperature conduction device can prevent itself from being damaged and achieve durable use due to its one-piece closed state, which can produce elastic deformation after repeated pressure, and the performance of temperature conduction is not affected.

The fourth object of the present invention is to provide a test classification equipment, including a machine, a feeding device, a transfer device, a testing device, a discharging device and a central control device. The feeding device is arranged on the machine and is provided with at least one feeding module for accommodating the electronic components to be tested; the transfer device is arranged on the machine and is provided with at least one transfer module for transferring the electronic components; the testing device is arranged on the machine and is provided with at least one tester for testing the electronic components and the present invention's crimping mechanism for pressing against the electronic components; the discharging device is arranged on the machine and is provided with at least one discharging module for accommodating the electronic components after testing; the central control device controls and integrates the actions of each device to achieve automatic operation of the equipment and substantially improve the operation efficiency.

1: Press-fit mechanism

10: Pressing device

11: Base

111: Storage space

12: Heating element

13, 28: Pressing parts

131: Bump

1311: convex part

20: Temperature transmission device

21, 22, 27: Heat conducting block

211, 231: Pressure-bearing surface

212, 241: Pressed surface

23: First metal layer

24: Second metal layer

25: Transmitter

26: Storage space

30: Drive rod

40: Electronic components

2: Test classification equipment

50: Machine

60: Feeding device

61: Feeding tray

62: Electronic components to be tested

70: Discharging device

71: Discharge tray

72: Complete testing of electronic components

80:Testing equipment

81: Test socket

90:Transfer device

91: First carrier

92: Second carrier

93: The third carrier

94: The fourth carrier

F: axial force

d, d2, d3: thickness

A, A2: Area

h, h2: height difference

Figure 1 is a schematic diagram of the crimping mechanism of the present invention.

Figure 2 is a partial schematic diagram of the crimping mechanism of the present invention.

Figure 3 is a partial schematic diagram of the crimping mechanism of the present invention.

Figure 4 is a partially enlarged schematic diagram of the crimping mechanism of the present invention.

Figure 5 is an enlarged schematic diagram of the surface of the electronic component of the present invention.

Figure 6 is an enlarged view of the heat conductive block of the present invention pressing against the surface of the electronic component.

Figure 7 is a schematic diagram of the heat conductive block of the present invention pressing against the curved electronic components.

Figure 8 is a partial enlarged view of the heat conductive block of the present invention pressing against the warped electronic component.

Figure 9 is a schematic diagram of the electronic component flattened by pressure according to the present invention.

Figure 10 is a cross-sectional view of the heat conducting block of the present invention.

Figure 11 is a partial schematic diagram of the crimping mechanism of another preferred embodiment of the present invention.

Figure 12 is a partial schematic diagram of the crimping mechanism of the above-mentioned preferred embodiment of the present invention.

Figure 13 is a schematic diagram of the crimping mechanism of the present invention being applied to test classification equipment.

In order to fully understand the purpose, features and effects of the present invention, the present invention is described in detail through the following specific embodiments and the attached drawings. The description is as follows.

For ease of explanation, in this embodiment, three mutually orthogonal axes are set as the X-axis, Y-axis, and Z-axis. In addition, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. The direction parallel to the X-axis is called the "first direction", the direction parallel to the Y-axis is called the "second direction", and the direction parallel to the Z-axis is called the "third direction".

Please refer to FIG. 1 . The present invention provides a crimping mechanism 1 of a temperature conducting device. The crimping mechanism 1 of the present embodiment has two lower crimping devices with corresponding structures. Therefore, the structure of the lower crimping device is described with reference to one of the lower crimping devices, but the invention is not limited thereto. The crimping mechanism 1 includes a lower crimping device 10, a temperature conducting device 20 and a transmission rod 30, wherein: The lower crimping device 10 further includes a base 11, at least one heating element 12 and a lower crimping element 13. One end of the base 11 is connected to the transmission rod 30. The base 11 has a receiving space 111 for receiving the heating element 12. The lower crimping element 13 is disposed at the other end of the base 11. In this embodiment, the pressing member 13 is a bump 131, the bump 131 has a convex portion 1311, and the bump 131 is connected to the heating element 12, so that the temperature of the heating element 12 is transferred to the bump 131. Preferably, the heating element 12 and the bump 131 are arranged correspondingly, which has a better heat transfer efficiency. However, in other possible embodiments of the present invention, the position and quantity of the bump and the heating element are not limited to this.

Please refer to Figures 2 and 3, the temperature transfer device 20 has a pressing surface for pressing against the electronic component. In this embodiment, the temperature transfer device 20 is an open heat conductive block 21, and the heat conductive block 21 is detachably arranged on the protrusion 1311 on one side (for example, by adhesion), and the other side of the heat conductive block 21 is a pressing surface 212 for pressing against the electronic component 40. The heat conductive block 21 can also be integrally formed in a closed state (as shown in Figure 3), and has a pressure-bearing surface 211 and a pressing surface 212, the pressure-bearing surface 211 is pressed by the protrusion 1311 of the lower pressing member 13, and the pressing surface 212 presses against the surface of the electronic component 40.

Referring to FIGS. 4 to 6 , the heat conductive block 21 has a thickness d. In this embodiment, the thickness d of the heat conductive block 21 is between 0.4 mm and 1.0 mm. Referring to FIG. 5 , in more detail, the driving rod 30 is connected to the pressing device 10 to drive the pressing device 10 to move closer to or farther from the electronic component along a first axial direction for corresponding compression. In this embodiment, the first axial direction is the third direction. The pressing member 13 of the pressing device 10 is displaced toward the third direction. As shown in the figure, the pressing member 13 is displaced toward the electronic component 40. More specifically, when the convex portion 1311 of the bump 131 presses against the heat conductive block 21, the pressing surface 212 of the heat conductive block 21 presses against the surface of the electronic component 40. Then, the convex portion 1311 of the bump 131 continues to press down the heat conductive block 21, and the heat conductive block 21 is deformed under pressure to fill the uneven surface of the electronic component 40, so that the contact area between the heat conductive block 21 and the electronic component 40 is increased, thereby improving the heat conduction efficiency.

In this embodiment, the heat conductive block 21 is a metal material, but it is not limited to this. For example, it is preferred to use a material containing indium, whereby the heat conductive block 21 undergoes elastic deformation or plastic deformation under pressure to fill the uneven surface of the electronic component 40.

7 and 9, it is particularly noted that the area of the pressing surface 212 of the heat conductive block 21 is greater than or equal to the area of the surface of the electronic component 40, which can reduce the height difference of the warp of the electronic component 40. As mentioned above, the heat conductive block 21 has a thickness d and an area A, and the electronic component 40 has a warp height difference h. When the heat conductive block 21 is subjected to the axial force F, it undergoes elastic deformation or plastic deformation. The area A2 of the pressed surface 212 of the heat conductive block 21 subjected to pressure is larger than the area A of the pressed surface 212 of the heat conductive block 21 not subjected to pressure. The surface of the electronic component 40 also undergoes elastic deformation or plastic deformation due to the pressure, which greatly reduces the height difference h2 of the warp of the electronic component 40, and even makes the height difference h2 zero. That is, the electronic component 40 is more flat and level, and the pressing area between the pressed surface 212 of the heat conductive block 21 and the surface of the electronic component 40 becomes larger. Thus, the contact area between the pressing surface 212 and the surface of the electronic component 40 is also increased, the heat transfer efficiency is significantly improved, and the time for the electronic component 40 to reach a preset temperature is shortened. In this embodiment, the height difference h of the warp of the electronic component 40 is between 0.3mm and 0.9mm, and the large area of the pressing surface 212 of the heat conductive block 21 can be used to press against the electronic component 40 to reduce the warp height difference.

Please refer to FIG. 10 , another embodiment of the heat conducting block 22 has at least one metal layer and a conductive member, and the metal layer surrounds the conductive member. In this embodiment, the heat conducting block 22 has a first metal layer 23, a second metal layer 24 and the conductive member 25, the first metal layer 23 has a pressure-bearing surface 231 for the lower pressing member 13 to press against, the second metal layer 24 has a pressing surface 241 for pressing against the electronic component, the first metal layer 23 and the second metal layer 24 are arranged correspondingly to form a receiving space 26, and the receiving space 26 accommodates the conductive member 25.

More specifically, in this embodiment, the heat conducting block 22 is formed in an integral and closed shape, and is provided with a first metal layer 23, a conductive member 25, and a second metal layer 24 stacked in sequence from the pressure-bearing surface 231 toward the press-fitting surface 241, and forms a thickness d3. More specifically, the thickness d3 is between 0.7 mm and 1.2 mm. Looking at the preferred embodiment, the ratio of the thickness of the first metal layer 23, the thickness of the conductive member 25, and the thickness of the second metal layer 24 is 1:2:1, and the thickness of the conductive member 25 is greater than the thickness of the first metal layer. In this embodiment, the thickness of the conductive member 25 is between 0.4 mm and 0.8 mm, and the thickness of the first metal layer is between 0.2 mm and 0.4 mm. The conductive element 25 has a high conductivity coefficient, such as heat dissipation paste, composite metal, fluid thermal grease, etc. In this embodiment, the conductive element 25 is a composite metal material, but it is not limited to this. It is worth mentioning that the heat conductive block 22 is formed in a closed shape due to its one-piece molding. Although it is repeatedly compressed and elastically deformed, it can also prevent itself from being damaged and achieve durability.

Please refer to Figures 11 and 12. The crimping mechanism 1 of the temperature transfer device further includes an outer cover 110 for setting the heat conductive block 27. The outer cover 110 is detachably fixed to the lower pressing member 28 so that the outer cover presses against the electronic component. In this embodiment, the position of the outer cover 110 corresponding to the heating block 27 can be bare. More specifically, the heat conductive block 27 passes through the outer cover 110 and protrudes outward and presses against the electronic component.

Please refer to Figure 13, which is a schematic diagram of the above-mentioned crimping mechanism 1 applied to the test classification equipment 2. The test classification equipment 2 is configured on the machine 50 with a feeding device 60, a discharging device 70, a testing device 80, a transfer device 90 and a central control device (not shown). The feeding device 60 is configured on the machine 50 and is provided with at least one feeding tray 61 for accommodating the electronic components to be tested 62; the discharging device 70 is configured on the machine 50 and has at least one discharging tray 71 for accommodating the electronic components 72 that have been tested; the testing device 80 is configured on the machine 50 and has the crimping mechanism 1 of the present invention and at least one tester, and the tester includes a test socket 81 electrically connected to the circuit board (not shown). In this embodiment, when the electronic component 62 to be tested is placed in the test seat 81, the actuator 30 drives the pressing device 10 to move closer to the direction (first axial direction) of the electronic component 62 to be tested, and the pressing device 10 presses against the surface of the electronic component 62 to be tested. When the electronic component 62 to be tested reaches a preset temperature, the test seat 81 performs a preset test operation on the electronic component 62 to be tested.

The transfer device 90 is disposed on the machine 50 and has at least one transfer device for transferring electronic components. In this embodiment, the transfer device 90 has a first transfer device 91 and a second transfer device 92 that can be displaced in the first, second, and third directions. The transfer device 90 further includes a third transfer device 93 and a fourth transfer device 94 that can be displaced in the first direction. The operation method of this embodiment is that the first transfer device 91 takes out the electronic component 62 to be tested from the feed tray 61 and transfers it to the third transfer device 93 and the fourth transfer device 94. The third transfer device 93 and the fourth transfer device 94 then transfer the electronic component 62 to be tested to the test device 80 to perform a preset test operation. After the test is completed, the tested electronic components 72 are transferred to the side of the testing device 80 by the third transfer device 93 and the fourth transfer device 94, so that the second transfer device 92 can take out the tested electronic components 72, and place the tested electronic components 72 in the discharge tray 71 of the discharge device 70 for classification according to the test results. The central control device is used to control and integrate the actions of each device, so that the test classification equipment 2 performs automated operations, which substantially improves production efficiency.

13: Pressing parts

131: Bump

1311: convex part

21: Heat conducting block

40: Electronic components

Claims (8)

A crimping mechanism with a temperature conducting device is used to press against an electronic component. The crimping mechanism comprises: a lower pressing device having a base, at least one heating element and a lower pressing element, the base having a receiving space for receiving the heating element, and the lower pressing element is arranged on the base; a temperature conducting device having a heat conducting block that can be deformed by pressure, a first metal layer, a second The heat conducting block has a pressing surface, the pressing surface is pressed against the electronic component, the first metal layer, the conductive component and the second metal layer are sequentially stacked toward the pressing surface and form a thickness; a driving rod is connected to the pressing device to drive the pressing device to move closer to or farther from the electronic component along a first axis to achieve corresponding pressing. As described in Item 1 of the patent application, the crimping mechanism with a temperature conduction device has a thickness of the heat conductive block between 0.4 mm and 1.0 mm. As described in item 1 of the patent application scope, the pressing mechanism with a temperature conduction device, the area of the pressing surface of the heat conductive block is greater than or equal to the area of the surface of the electronic component. As described in the first item of the patent application, the pressing surface of the heat conductive block is pressed against the surface of the electronic component, thereby reducing the warping height difference of the electronic component and increasing the contact area between the pressing surface of the heat conductive block and the surface of the electronic component. As described in item 1 of the patent application scope, the ratio of the thickness of the first metal layer, the thickness of the conductive element and the thickness of the second metal layer is 1:2:1. As described in Item 1 of the patent application, the crimping mechanism with a temperature conducting device has a thickness of 0.4 mm to 0.8 mm. The crimping mechanism with a temperature transfer device as described in Item 1 of the patent application further comprises an outer cover, which is used to accommodate the heat conductive block and is detachably fixed to the lower pressing member so that the heat conductive block is pressed against the electronic component. A test and classification device is used for testing and classifying electronic components. The test and classification device comprises: a machine; a feeding device, which is arranged on the machine, and the feeding device is provided with at least one feeding tray for accommodating an electronic component; a transfer device, which is arranged on the machine, and the transfer device is provided with at least one transfer device for transferring the electronic component; a testing device, which is arranged on the machine, and the testing device There is at least one tester and at least one crimping mechanism as described in claim 1, the tester is used to perform a test operation on the electronic component, and the crimping mechanism is used to press against the electronic component; a discharging device is arranged on the machine, and the discharging device is provided with at least one discharging tray for accommodating an electronic component; a central control device is used to control and integrate the actions of various devices to perform automated operations.

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