TWI741693B - Connecting apparatus and handler having the same - Google Patents

Abstract

The present invention reveals a connecting apparatus, including a connector and a seam eliminator. The connector has at least one connecting component for pressing on an electronic component. The seam eliminator has a buffer layer and a seam eliminating layer. The buffer layer is located between the connecting component and the seam eliminating layer. The seam eliminating layer has a pressing surface for smoothly laying on a surface of the electronic component. As the connecting component presses on the electronic component, the seam eliminating layer fills and absorbs the seam above the electronic component, and the buffer layer deforms and absorbs the force and uneven protrusion above the seam eliminating layer and the electronic component. Therefore, the abrasion caused to the seam eliminating layer is reduced, prolonging lifetime of the seam eliminating layer and lowering the cost.

Description

Jointing mechanism and operating equipment for its application

The invention provides a joining mechanism that saves costs and improves use efficiency.

Since electronic products are used in different temperature environments, in order to ensure that the internal electronic components can operate normally in various temperature environments, it is necessary to perform preset thermal or cold test operations after the production of electronic components to eliminate defective products.

Please refer to Fig. 1, the joint mechanism of the test device is provided with a joint 12 which is driven and displaced by the moving arm 11. The joint 12 is provided with a heating element 13, and the crimping part 121 is used to crimp the electronic component 15 in the test base 14 , And conduct the high temperature of the heating element 13 to the electronic component 15 so that the electronic component 15 performs the thermal test operation in the preset high temperature test environment.

However, there is a small gap between the surface of the electronic component 15 and the crimping surface of the crimping portion 121, which affects the high-temperature conductivity of the heating element 13. How to make The electronic component 15 performs a test operation at an accurate test temperature, which is the target of the industry's research and development.

The first object of the present invention is to provide a joining mechanism including a joint and a caulking device. The joint is provided with at least one joint component for pressing against electronic components, and the caulking device is provided with a buffer layer and a caulking layer , The buffer layer is located between the joint part and the caulking layer, and the caulking layer has a crimping surface for bonding the surface of the electronic component; so that when the joint part and the electronic component are crimped, the buffer layer of the caulking device is elastic Deformation buffers the stress of the caulking layer to effectively reduce the wear of the caulking layer, thereby extending the service life of the caulking device and saving costs.

The second objective of the present invention is to provide a bonding mechanism in which a temperature controller is arranged inside the adapter. When the bonding part and the electronic component are crimped, the gap between the surface of the electronic component is filled with the caulking layer of the caulking device. Improve the temperature conduction performance, so that the electronic components can be tested in a more accurate preset temperature test environment, thereby improving the test quality.

The third object of the present invention is to provide a joining mechanism in which the adaptor is provided with a nozzle part, the buffer layer of the caulk is assembled on the joining part and is located on the periphery of the nozzle part, and the caulk layer covers the buffer layer and is located in the suction part. On the peripheral side of the nozzle part, when the suction nozzle part absorbs the electronic component to perform the test operation, the electronic component is laminated with the sealing joint, and the elastic deformation of the buffer layer is used to buffer the stress of the sealing layer, thereby improving the use efficiency.

The fourth object of the present invention is to provide a working equipment, including a machine, a feeding device, The receiving device, the working device with the joining mechanism of the present invention, the conveying device and the central control device; the feeding device is arranged in the machine, and is provided with at least one feeding holder for holding the electronic components to be operated; the receiving device is arranged in The machine is provided with at least one receiving holder for accommodating the electronic components that have been operated; the working device is arranged on the machine, and is provided with at least one working device and the joining mechanism of the present invention, and the working device is used to perform presets on the electronic components Operation, the joining mechanism of the present invention is used for crimping electronic components; the conveying device is arranged on the machine and is provided with at least one conveyor for conveying electronic components; the central control device is used to control and integrate the actions of various devices to perform automated operations , To achieve the practical benefits of improving the operating efficiency.

In order to enable your reviewer to have a better understanding of the present invention, a preferred embodiment is given with the accompanying drawings. The details are as follows:

Please refer to FIGS. 2, 3, and 4, the first embodiment of the joining mechanism of the present invention includes an adaptor 21 and a caulk 22, and a carrier and a thermostat can be configured according to operation requirements.

The adaptor 21 is provided with at least one joining part for crimping electronic components; the joining part can be formed on a base, or formed on a joining jig, and the joining jig is then assembled on the base; in this embodiment , The adapter 21 is provided with a base 211, the bottom of the base 211 is assembled with a joining fixture 212, the joining fixture 212 is made of rigid material, and a joining component 213 is provided at the bottom, and the joining component 213 is provided with at least one bearing surface. The mounting surface can be a flat surface, a curved surface, or a concave surface of a groove or a convex surface of a bump. In this embodiment, the engaging member 213 is provided with a groove 214 on the bottom surface, and the concave surface of the groove 214 is used as the mounting surface 215.

The caulking device 22 is provided with a buffer layer 221 and a caulking layer 222. The buffer layer 222 is located between the joining member 213 and the caulking layer 222; the buffer layer 221 is made of soft material, which can also be made of flexible soft material. Preferably, the buffer layer 221 has high conductivity to effectively conduct temperature; the buffer layer 221 is fixedly or movably assembled on the joining member 213, for example, the buffer layer 221 is adhered to the mounting surface 215 of the joining member 213 For example, the buffer layer 221 is buckled on the mounting surface 215 of the joining member 213, which is not limited to this embodiment; in this embodiment, the buffer layer 221 is a high-performance thermal conductive sheet made of soft material, and its bottom surface is used as the first attachment The surface 2211 and the top surface are used as the connecting surface 2212. The connecting surface 2212 of the buffer layer 221 is adhered to the receiving surface 215 of the connecting member 213 and is limited to the groove 214 of the connecting member 213.

The caulking layer 222 is assembled on the first bonding surface 2211 of the buffer layer 221, and is provided with a crimping surface for crimping electronic components, so that when the bonding part 213 and the electronic components (not shown) are crimped to each other, The gap filling layer 222 fills the surface gaps of the electronic component, and the buffer layer 221 is elastically deformed to buffer the stress of the gap filling layer 222; the gap filling layer 222 is a soft metal, such as indium sheet, and the gap filling layer 222 is provided with a second bonding The second bonding surface can be bonded to the first bonding surface 2211 of the buffer layer 221 or covered with the buffer layer 221; in this embodiment, the gap-filling layer 222 is an indium sheet, which is opposite to The top surface of the first attaching surface 2211 is provided with a receiving portion 2221, and the receiving portion 2221 is for receiving the buffer layer 221, and the inner bottom surface of the receiving portion 2221 is used as the second attaching surface 2222 to be attached to the buffer layer The first bonding surface 2211 of 221 makes the caulking layer 222 cover the buffer layer 221; and the crimping surface 2223 of the caulking layer 222 may be flat or include a plurality of protrusions, and is not limited to this embodiment, as long as It can be filled in the surface gaps of electronic components; in this embodiment, the thickness of the gap-filling layer 222 is 0.35mm, and a plurality of convex posts are formed in a single body, and the plural convex posts form the crimping surface 2223, and the gap of the gap-filling layer 222 After being compressed and deformed, a plurality of protrusions can be filled in the surface gaps of the electronic components.

The carrier is used for assembling the adapter 21. The carrier can be a rack or a mobile arm. For example, the carrier can be a rack. The adapter 21 is fixedly configured for the relative crimping displacement of the electronic components toward the adapter 21 For example, the carrier can be a movable arm, and the adaptor 21 can be movably configured to allow the adaptor 21 to move toward the electronic component for relative crimping displacement. Of course, the adaptor 21 and the electronic component can also be used for movable relative crimping. Displacement; in this embodiment, the carrier is a moving arm 23 to be assembled on the base 211 of the adapter 21, and the adapter 21 is driven to move in the Z direction for the bonding component 213 and the caulking layer 222 to perform crimping electronic components Operation.

The thermostat is assembled on the adapter 21 so that the electronic components are located in a simulated pre-heating test environment; the thermostat can be a refrigerating chip, a heating element or a base with a pre-heating fluid, and the thermostat can be assembled on the base 211 or Bonding fixture 212; in this embodiment, the thermostat is the heating element 24, and is assembled on the base 211 of the adapter 21 , So that the electronic components are located in a simulated high-temperature test environment to perform thermal test operations.

Please refer to Figures 5 and 6, the bonding mechanism of the present invention is applied to a test device. The test device is equipped with a circuit board 41 and a test base 42 electrically connected to the machine 30. The test base 42 has a plurality of probes 421 for testing electronics. Component 43; however, in order for the contact 431 of the electronic component 43 to actually contact the probe 421, a preset crimping force must be applied to the electronic component 43; during the test, the moving arm 23 drives the adapter 21, the heating element 24 and the caulking The device 22 and the like are moved downward in the Z direction, so that the bonding member 213 presses down the electronic component 43, and the crimping surface 2223 of the caulking layer 222 of the caulk 22 is attached to the surface 432 of the electronic component 43; The surface 432 is rough, undulating and uneven in the microscopic view, forming a plurality of small air chambers. Therefore, when the bonding part 213 of the adapter 21 presses the electronic component 43 with a preset crimping force, the gap of the caulking layer 222 is used. The plurality of protrusions of the crimping surface 2223 are compressed and deformed to fill the small air chambers on the surface 432 of the electronic component 43 to reduce high-temperature conduction losses and thereby increase high-temperature conductivity.

However, the caulking layer 222 of the caulking device 22 will bear the reaction force of the electronic component 43 when the electronic component 43 is crimped. Since the buffer layer 221 has appropriate elasticity and can be deformed by force, when the caulking layer 222 is compressed, That is, the buffer layer 221 is pressed along the force path, and the buffer layer 221 is deformed under the force, so that the caulking layer 222 can move from the first position A before compression to the second position B after compression. Buffer, so as to reduce the abrasion of the protrusions of the crimping surface 2223 of the caulking layer 222, thereby extending the service life of the caulking layer 222; therefore, after crimping the crimping surface 2223 of the caulking layer 222 to the surface 432 of the electronic component 43, Since the buffer layer 221 has good temperature conductivity, the high temperature of the heating element 24 is quickly transmitted to the electronic component 43 via the bonding jig 212 and the buffer layer 221 and the caulking layer 222 of the caulking device 22, so that the electronic component 43 is positioned accurately. Preset high temperature test environment to perform thermal test operation, thereby improving test quality.

Please refer to FIG. 7, the second embodiment of the joining mechanism of the present invention is different from the first embodiment in that the joining part 213 is provided with a nozzle part 216, and the buffer layer 221 of the caulk 22 is assembled on the joining part 213 and is located On the peripheral side of the nozzle part 216, the caulking layer 222 covers the buffer layer 221 and is located on the peripheral side of the nozzle part 216, and a through hole 2224 is opened at a position opposite to the nozzle part 216; therefore, the nozzle part of the adapter 21 216 can absorb electronic components through the through holes 2224 of the caulking layer 222. When performing a test operation, the caulking layer 222 is pressed against the electronic components, and the buffer layer 221 is elastically deformed to buffer the force of the caulking layer 222, so as to effectively reduce the filling The abrasion of the seam layer 222 further improves the use efficiency.

Please refer to Figures 2 to 4 and 8, a schematic diagram of the joining mechanism of the present invention applied to working equipment. The working equipment includes a machine 30, a working device 40, a feeding device 50, a receiving device 60, a conveying device 70 and a central control device (Figure Not shown); In this embodiment, the working equipment is a test equipment; the feeding device 50 is arranged on the machine 30, and is provided with at least one feeding holder 51 for holding electronic components to be operated; the receiving device 60 is arranged on The machine 30 is provided with at least one receiving holder 61 for accommodating electronic components that have been operated; the working device 40 is disposed on the machine 30 and includes at least one working device and the joining mechanism of the present invention. The working device performs pre-processing on the electronic components. Set up operation, the bonding mechanism of the present invention is used for crimping electronic components. In this embodiment, the first side and the second side of the machine 30 are respectively equipped with a working device 40, the working device is a tester, and the tester includes electrical connections. The circuit board 41 and the test socket 42 are used for testing electronic components. The bonding mechanism of the present invention includes a connector 21 and a caulk 22 for crimping electronic components; the conveying device 70 is disposed on the machine 30 and is provided with at least one Conveyor for conveying electronic components. In this embodiment, the conveying device 70 is provided with a first conveyor 71 that is displaced in the XYZ direction. The second is the second conveyor 72 of the carrier, the third conveyor 73 of the conveyor 70 and the test base 42 of the working device 40 pick and place in the second conveyor 72 to exchange the electronic components to be tested and the tested electronic components, the test base 42 Perform electrical testing operations on the electronic components to be tested; the first conveyor 71 then takes out the tested electronic components from the second conveyor 72, and according to the test results, transfers the tested electronic components to the receiving device 60 for sorting and storage; The central control device is used to control and integrate the actions of various devices to perform automated operations to achieve practical benefits of enhancing operational performance.

[Learning] 11: Moving arm 12: Adapter 121: crimping part 13: heating element 14: Test seat 15: Electronic components 16: indium sheet [this invention] 21: Adapter 211: Pedestal 212: Joining Fixture 213: Joining Parts 214: Groove 215: loading surface 216: Nozzle parts 22: caulk 221: buffer layer 2211: The first bonding surface 2212: connecting surface 222: caulking layer 2221: Housing Department 2222: Second bonding surface 2223: crimping surface 2224: Through hole 23: mobile arm 24: heating element A: First position B: second position 30: Machine 40: operating device 41: circuit board 42: Test Block 421: Probe 43: electronic components 431: Contact 432: Surface 50: Feeding device 51: Feeder 60: Receiving device 61: Receiving holder 70: Conveying device 71: The first conveyor 72: second conveyor 73: Third Conveyor

Figure 1: Schematic diagram of the use of the conventional joining mechanism. Figure 2: An exploded view of the first embodiment of the joining mechanism of the present invention. Figure 3: The assembly diagram of the first embodiment of the joining mechanism of the present invention. Figure 4: is an enlarged schematic diagram of Figure 3. Figure 5: A schematic diagram of the use of the first embodiment of the joining mechanism of the present invention. Figure 6: is an enlarged schematic diagram of Figure 5. Fig. 7: A schematic diagram of the second embodiment of the joining mechanism of the present invention. Figure 8: A schematic diagram of the joining mechanism of the present invention applied to work equipment.

21: Adapter

212: Joining Fixture

213: Joining Parts

22: caulk

221: buffer layer

222: caulking layer

2223: crimping surface

23: mobile arm

24: heating element

30: Machine

41: circuit board

42: Test Block

421: Probe

43: electronic components

431: Contact

432: Surface

Claims (10)

A joining mechanism, including: Coupling device: at least one coupling part is provided for crimping electronic components; Caulk: It is provided with a buffer layer and a caulking layer. The buffer layer is located between the joint part and the caulking Between the layers, the gap-filling layer covers the buffer layer so that the joint part and the When the electronic components are crimped to each other, the caulk fills the electronic components with the caulking layer. The surface gap of the device, and the buffer layer is used to buffer the force of the gap filling layer. The joining mechanism according to claim 1, wherein the joining member can be formed on a base, or a joining jig with the joining member can be assembled on the base. The joining mechanism according to claim 1, wherein the mounting surface of the joining component can be a flat surface , Curved surface or concave surface of groove or convex surface of bump. The joining mechanism according to claim 1, wherein the buffer layer of the caulk has a first attaching surface and a connecting surface, and the joining surface is assembled to the joining component, and the caulking layer is provided with a second attaching surface. A bonding surface and a crimping surface, the second bonding surface is bonded to the first bonding surface of the buffer layer, and the crimping surface is used for crimping the electronic component. The joining mechanism according to claim 4, wherein the seam-filling layer is provided with an accommodation portion on a surface opposite to the first bonding surface, and the accommodation portion is configured to accommodate the buffer layer, and the accommodating portion The inner bottom surface serves as the second bonding surface. The joining mechanism according to claim 1, wherein the joining member is provided with a nozzle member, the buffer layer of the caulk is assembled on the joining member and is located on the peripheral side of the nozzle member, and the caulking layer covers the The buffer layer is located on the peripheral side of the nozzle part. The joining mechanism according to any one of claims 1 to 6, wherein the buffer layer of the caulk is made of a soft and highly conductive material. The joining mechanism according to any one of claims 1 to 6, further comprising a carrier for assembling the adaptor. The bonding mechanism according to any one of claims 1 to 6, further comprising a temperature controller, the temperature controller is assembled to the adapter, so that the caulking layer conducts a preset temperature to the electronic component. A kind of work equipment, including: Machine; Feeding device: It is arranged on the machine and is provided with at least one supply for holding electronic components to be operated Material holder Receiving device: It is arranged on the machine and is equipped with at least one receiving device that contains the electronic components that have been operated. Material holder Operating device: configured on the machine, and equipped with at least one operating device and at least as requested item 1 The joining mechanism, the working device is used to perform preset operations on electronic components Industry, the joining mechanism is used for crimping electronic components; Conveying device: It is arranged on the machine and is equipped with at least one conveyor for conveying electronic elements Pieces Central control device: to control and integrate the actions of various devices to perform automated operations.

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