TWI882270B - Parts screening device - Google Patents
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- TWI882270B TWI882270B TW111146964A TW111146964A TWI882270B TW I882270 B TWI882270 B TW I882270B TW 111146964 A TW111146964 A TW 111146964A TW 111146964 A TW111146964 A TW 111146964A TW I882270 B TWI882270 B TW I882270B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
- B07C5/3422—Sorting according to other particular properties according to optical properties, e.g. colour using video scanning devices, e.g. TV-cameras
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/80—Turntables carrying articles or materials to be transferred, e.g. combined with ploughs or scrapers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/85—Investigating moving fluids or granular solids
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/10—Scanning
- G01N2201/104—Mechano-optical scan, i.e. object and beam moving
- G01N2201/1042—X, Y scan, i.e. object moving in X, beam in Y
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Biochemistry (AREA)
- Pathology (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Immunology (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
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- Computer Vision & Pattern Recognition (AREA)
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Abstract
本發明之課題在於提供一種抑制電子零件對於盒之收容性之下降之零件篩選裝置。 零件篩選裝置1包含:搬送機構10、20,其等搬送零件;攝像器件30或測定器件40,該攝像器件30拍攝搬送機構20上之零件之外觀,該測定器件40測定搬送機構10上之零件之電氣特性;檢査篩選控制器80,其基於根據來自攝像器件30之攝像結果的零件之外觀檢査之結果、或根據來自測定器件40之測定結果的零件之電氣特性檢査之結果而篩選良品;及排出機構50,其將篩選出之良品自搬送機構20排出且收容於盒。排出機構50包含:管狀構件52,其將自搬送機構20排出之良品之零件引導至盒之出入口;空氣供給機構53,其配置於管狀構件52之上游側,供給用於增大零件之搬送力之空氣;及空氣排出機構55,其配置於管狀構件52之下游側,排出空氣。 The subject of the present invention is to provide a component screening device that suppresses the decrease in the accommodation of electronic components in a box. The component screening device 1 includes: conveying mechanisms 10 and 20, which convey components; an imaging device 30 or a measuring device 40, wherein the imaging device 30 photographs the appearance of the components on the conveying mechanism 20, and the measuring device 40 measures the electrical characteristics of the components on the conveying mechanism 10; an inspection and screening controller 80, which screens good products based on the results of the component appearance inspection based on the imaging results from the imaging device 30, or the results of the component electrical characteristics inspection based on the measurement results from the measuring device 40; and an ejection mechanism 50, which ejects the screened good products from the conveying mechanism 20 and accommodates them in a box. The discharge mechanism 50 includes: a tubular member 52, which guides the good parts discharged from the conveying mechanism 20 to the entrance and exit of the box; an air supply mechanism 53, which is arranged on the upstream side of the tubular member 52 and supplies air for increasing the conveying force of the parts; and an air discharge mechanism 55, which is arranged on the downstream side of the tubular member 52 and discharges the air.
Description
本發明係關於一種零件篩選裝置。The present invention relates to a parts screening device.
有對積層陶瓷電容等表面安裝型之電子零件(亦稱為晶片零件)之良品及不良品進行篩選之裝置。在專利文獻1中,作為如此之零件篩選裝置而揭示一種外觀檢査裝置。專利文獻1揭示之外觀檢査裝置包含:線性供料器(搬送機構),其搬送電子零件;轉台(搬送機構),其搬送藉由線性供料器搬送之電子零件;及攝像器件,其拍攝轉台上之電子零件;且一面搬送電子零件一面進行電子零件之外觀檢査。藉此,可篩選良品及不良品且排出。There is a device for screening good and defective surface-mount electronic components (also called chip components) such as multilayer ceramic capacitors. In Patent Document 1, a visual inspection device is disclosed as such a component screening device. The visual inspection device disclosed in Patent Document 1 includes: a linear feeder (transport mechanism) that transports electronic components; a turntable (transport mechanism) that transports electronic components transported by the linear feeder; and a camera that photographs the electronic components on the turntable; and the electronic components are transported while visually inspecting the electronic components. In this way, good and defective products can be screened and discharged.
又,專利文獻1揭示之外觀檢査裝置在線性供料器中,藉由利用振動來搬送電子零件,而使電子零件帶電,在轉台中,藉由靜電對電子零件進行靜電吸附而搬送。 [先前技術文獻] [專利文獻] Furthermore, Patent Document 1 discloses an external inspection device in which electronic components are charged by using vibration to transport electronic components in a linear feeder, and the electronic components are transported by electrostatic adsorption by static electricity in a turntable. [Prior Technical Document] [Patent Document]
[專利文獻1]日本特開2017-44579號公報[Patent Document 1] Japanese Patent Application Publication No. 2017-44579
[發明所欲解決之課題][The problem that the invention wants to solve]
在如此之零件篩選裝置中,有將排出之良品之電子零件藉由管狀構件引導至盒之入口、且收容於盒之情形。該情形下,有基於例如防止電子零件殘留於管狀構件內之目的,為了增大電子零件之搬送力,而在管狀構件之上游側設置供給空氣之空氣供給機構之情形。In such a parts screening device, the discharged good electronic parts are sometimes guided to the entrance of a box by a tubular member and stored in the box. In this case, an air supply mechanism for supplying air is sometimes provided on the upstream side of the tubular member in order to increase the conveying force of the electronic parts, for example, to prevent the electronic parts from being left in the tubular member.
又,盒為箱狀之盒,且為僅具有1個出入口之盒。在將如此之盒與具有上述之空氣供給機構之管狀構件組合時,因向盒之出入口持續供給空氣,而無進入盒之空氣之出口,故電子零件無法進入盒內。其結果,電子零件對於盒之收容性下降。Furthermore, the box is a box-shaped box with only one inlet and outlet. When such a box is combined with the tubular member having the above-mentioned air supply mechanism, since air is continuously supplied to the inlet and outlet of the box, and there is no outlet for air to enter the box, the electronic components cannot enter the box. As a result, the accommodation of the electronic components in the box is reduced.
本發明之目的在於提供一種抑制電子零件對於盒之收容性之下降之零件篩選裝置。 [解決課題之技術手段] The purpose of the present invention is to provide a component screening device that suppresses the decrease in the containment of electronic components in a box. [Technical means to solve the problem]
本發明之零件篩選裝置係一面搬送零件一面進行檢査、篩選良品且收容於盒之零件篩選裝置。前述盒為箱狀,僅具有1個出入口。前述零件篩選裝置包含:搬送機構,其搬送前述零件;攝像器件或測定器件,該攝像器件拍攝前述搬送機構上之前述零件之外觀,該測定器件測定前述搬送機構上之前述零件之電氣特性;檢査篩選控制器,其基於來自前述攝像器件之攝像結果進行前述零件之外觀檢査,或基於來自前述測定器件之測定結果進行前述零件之電氣特性檢査,且基於前述外觀檢査之結果或前述電氣特性檢査之結果而篩選良品;及排出機構,其將藉由前述檢査篩選控制器篩選出之良品自前述搬送機構排出且收容於前述盒。前述排出機構包含:管狀構件,其將自前述搬送機構排出之良品之前述零件引導至前述盒之前述出入口;空氣供給機構,其配置於前述管狀構件之上游側,供給用於增大前述零件之搬送力之空氣;及空氣排出機構,其配置於前述管狀構件之下游側,排出前述空氣。 [發明之效果] The parts screening device of the present invention is a parts screening device that inspects and screens good parts while conveying the parts and stores the parts in a box. The box is box-shaped and has only one entrance and exit. The aforementioned parts screening device includes: a conveying mechanism, which conveys the aforementioned parts; an imaging device or a measuring device, wherein the imaging device photographs the appearance of the aforementioned parts on the aforementioned conveying mechanism, and the measuring device measures the electrical characteristics of the aforementioned parts on the aforementioned conveying mechanism; an inspection and screening controller, which performs an appearance inspection of the aforementioned parts based on the imaging result from the aforementioned imaging device, or performs an electrical characteristics inspection of the aforementioned parts based on the measurement result from the aforementioned measuring device, and screens good products based on the result of the aforementioned appearance inspection or the result of the aforementioned electrical characteristics inspection; and a discharge mechanism, which discharges the good products screened by the aforementioned inspection and screening controller from the aforementioned conveying mechanism and accommodates them in the aforementioned box. The aforementioned discharge mechanism includes: a tubular member, which guides the aforementioned parts of the good products discharged from the aforementioned conveying mechanism to the aforementioned inlet and outlet of the aforementioned box; an air supply mechanism, which is arranged on the upstream side of the aforementioned tubular member and supplies air for increasing the conveying force of the aforementioned parts; and an air discharge mechanism, which is arranged on the downstream side of the aforementioned tubular member and discharges the aforementioned air. [Effects of the invention]
根據本發明,可抑制零件篩選裝置之電子零件對於盒之收容性之下降。According to the present invention, it is possible to suppress the decrease in the accommodation capacity of the box for the electronic components of the component screening device.
以下,參照附圖對於本發明之實施方式之一例進行說明。再者,在各圖式中,對於同一或相當之部分賦予同一符號。Hereinafter, an example of an embodiment of the present invention will be described with reference to the accompanying drawings. In addition, in each of the drawings, the same or corresponding parts are given the same symbols.
圖1A係自上方觀察本實施方式之零件篩選裝置之一例之概略平面圖,圖1B係自上方觀察本實施方式之零件篩選裝置之又一例之概略平面圖。圖2係將圖1A或圖1B所示之零件篩選裝置之II部分放大之概略平面圖。圖3A係自側方觀察圖1A所示之零件篩選裝置之概略側視圖,且係將II部分放大之概略側視圖,圖3B係自側方觀察圖1B所示之零件篩選裝置之概略側視圖,且係將II部分放大之概略側視圖。圖4係圖1A或圖1B所示之零件篩選裝置之IV-IV線剖視圖。再者,在圖1A~圖4中,顯示XY正交座標系。FIG1A is a schematic plan view of an example of a part screening device of the present embodiment as viewed from above, and FIG1B is a schematic plan view of another example of a part screening device of the present embodiment as viewed from above. FIG2 is a schematic plan view of an enlarged portion II of the part screening device shown in FIG1A or FIG1B. FIG3A is a schematic side view of the part screening device shown in FIG1A as viewed from the side, and is a schematic side view of an enlarged portion II, and FIG3B is a schematic side view of the part screening device shown in FIG1B as viewed from the side, and is a schematic side view of an enlarged portion II. FIG4 is a cross-sectional view of the part screening device shown in FIG1A or FIG1B taken along line IV-IV. Furthermore, in FIGS. 1A to 4, an XY orthogonal coordinate system is shown.
圖1A、圖2、圖3A及圖4所示之零件篩選裝置1一面依次搬送複數個電子零件3一面進行檢査,篩選良品且收容於盒5之裝置。零件篩選裝置1包含:線性供料器10、轉台20、複數個攝像器件30、測定器件40、第1排出機構50、第2排出機構60、第1計數器71、第2計數器72、及檢査篩選控制器80。再者,線性供料器10及轉台20構成本發明之搬送機構,第1排出機構50構成本發明之排出機構。又,亦可為僅包含攝像器件30及測定器件40任一者之形態。The parts screening device 1 shown in Fig. 1A, Fig. 2, Fig. 3A and Fig. 4 is a device that sequentially transports a plurality of electronic parts 3 while inspecting them, and screens good products and stores them in a box 5. The parts screening device 1 includes: a linear feeder 10, a turntable 20, a plurality of imaging devices 30, a measuring device 40, a first discharge mechanism 50, a second discharge mechanism 60, a first counter 71, a second counter 72, and an inspection and screening controller 80. Furthermore, the linear feeder 10 and the turntable 20 constitute the transport mechanism of the present invention, and the first discharge mechanism 50 constitutes the discharge mechanism of the present invention. In addition, it may be a form that only includes either the imaging device 30 or the measuring device 40.
電子零件3係積層陶瓷電容等表面安裝型之電子零件(亦稱為晶片零件)。電子零件3例如如圖5所示般,包含:積層體3a,其積層有包含陶瓷材料之複數個介電層與1個或複數個導體層;及2個外部電極3b,其等配置於積層體3a之2個端面各者。積層體3a、即電子零件3為長方體形狀,具有在積層方向上相對之2個主面TS1及TS2、在與積層方向交叉之寬度方向上相對之2個側面WS1及WS2、及在與積層方向及寬度方向交叉之長度方向上相對之2個端面LS1及LS2。The electronic component 3 is a surface-mount electronic component such as a multilayer ceramic capacitor (also called a chip component). The electronic component 3, for example, as shown in FIG. 5, includes: a multilayer body 3a, which is laminated with a plurality of dielectric layers and one or more conductive layers including ceramic materials; and two external electrodes 3b, which are arranged on each of the two end faces of the multilayer body 3a. The multilayer body 3a, that is, the electronic component 3, is in the shape of a rectangular parallelepiped, and has two main surfaces TS1 and TS2 opposite to each other in the stacking direction, two side surfaces WS1 and WS2 opposite to each other in the width direction intersecting the stacking direction, and two end surfaces LS1 and LS2 opposite to each other in the length direction intersecting the stacking direction and the width direction.
盒5例如如圖6所示般係箱狀之盒,在其內部收容複數個電子零件3。盒5具有1個出入口5a,其可在電子零件3之接收及取出時打開,且可在電子零件3之收容時關閉。The box 5 is a box-shaped box, for example, as shown in Fig. 6, and contains a plurality of electronic components 3. The box 5 has an entrance 5a, which can be opened when the electronic components 3 are received and taken out, and can be closed when the electronic components 3 are stored.
如圖1A、圖2及圖3A所示般,線性供料器10依次直線地搬送複數個電子零件3。線性供料器10可在上游側包含帶電部分、在下游側包含靜電吸附部分。1A, 2 and 3A, the linear feeder 10 sequentially and linearly transports a plurality of electronic components 3. The linear feeder 10 may include a charging portion on the upstream side and an electrostatic adsorption portion on the downstream side.
線性供料器10較佳的是包含SUS等材料。又,線性供料器10較佳的是相對於水平面傾斜。藉此,在線性供料器10之上游側之帶電部分,藉由利用振動而搬送電子零件3,而可使電子零件3帶電。The linear feeder 10 is preferably made of a material such as SUS. Furthermore, the linear feeder 10 is preferably tilted relative to a horizontal plane. Thus, the electronic component 3 can be charged by conveying the electronic component 3 by utilizing vibration at the charged portion on the upstream side of the linear feeder 10.
如圖1A及圖3A所示般,較佳的是在線性供料器10之下游側之靜電吸附部分之下側設置靜電吸附機構12。藉此,可在線性供料器10之下游側之靜電吸附部分,靜電吸附電子零件3且進行搬送。As shown in Fig. 1A and Fig. 3A, it is preferable to provide an electrostatic adsorption mechanism 12 below the electrostatic adsorption portion on the downstream side of the linear feeder 10. Thus, the electronic component 3 can be electrostatically adsorbed and transported at the electrostatic adsorption portion on the downstream side of the linear feeder 10.
再者,如圖1B及圖3B所示般,亦可不在線性供料器10設置靜電吸附機構12。即,線性供料器10亦可自上游側至下游側之整體,為上述之帶電部分。1B and 3B, the electrostatic adsorption mechanism 12 may not be provided on the linear feeder 10. That is, the entire linear feeder 10 from the upstream side to the downstream side may be the above-mentioned charged portion.
轉台20將藉由線性供料器10搬送之複數個電子零件3依次旋轉搬送。如圖1A及圖2所示般,轉台20在上游側具有導引機構22,藉由導引機構22將來自線性供料器10之電子零件3向旋轉搬送軌跡21引導。轉台20沿著旋轉搬送軌跡21搬送電子零件3。The turntable 20 sequentially rotates and transports the plurality of electronic components 3 transported by the linear feeder 10. As shown in FIG. 1A and FIG. 2, the turntable 20 has a guide mechanism 22 on the upstream side, and the guide mechanism 22 guides the electronic components 3 from the linear feeder 10 to the rotation transport track 21. The turntable 20 transports the electronic components 3 along the rotation transport track 21.
如圖3A所示般,較佳的是在轉台20之下側設置靜電吸附機構24。藉此,可靜電吸附電子零件3且進行搬送。As shown in Fig. 3A, it is preferable to provide an electrostatic adsorption mechanism 24 under the turntable 20. Thereby, the electronic component 3 can be electrostatically adsorbed and transported.
轉台20之搬送速度較線性供料器10之搬送速度快。轉台20之旋轉速度較佳為10000轉/分鐘以上之轉速。藉此,如圖2及圖3A所示般,可空開電子零件3之間隔,而可進行電子零件3之端面側之外觀檢査。再者,也可非為10000轉/分鐘以上,可為9000轉/分鐘以上,亦可為8000轉/分鐘以上。此時,電子零件3之尺寸之長度方向尺寸為0.25 mm±10%,寬度方向尺寸及厚度方向尺寸為0.125 mm±13%左右。The conveying speed of the turntable 20 is faster than the conveying speed of the linear feeder 10. The rotation speed of the turntable 20 is preferably 10,000 rpm or more. In this way, as shown in FIG. 2 and FIG. 3A, the spacing of the electronic component 3 can be spaced, and the end surface side of the electronic component 3 can be inspected. Furthermore, it can be not more than 10,000 rpm, but more than 9,000 rpm, and can also be more than 8,000 rpm. At this time, the length dimension of the electronic component 3 is 0.25 mm ± 10%, and the width dimension and thickness dimension are about 0.125 mm ± 13%.
轉台20包含玻璃或樹脂等材料,具有透明性。藉此,可進行電子零件3之背面側之外觀檢査。The turntable 20 is made of materials such as glass or resin and has transparency, so that the back side of the electronic component 3 can be inspected.
如圖1A所示般,攝像器件30例如為相機。沿著轉台20之旋轉搬送軌跡21設置6個攝像器件30。6個攝像器件30分別拍攝轉台20上之電子零件3之6個外表面、即2個主面TS1及TS2、2個側面WS1及WS2及2個端面LS1及LS2。As shown in FIG1A , the imaging device 30 is, for example, a camera. Six imaging devices 30 are arranged along the rotation conveying track 21 of the turntable 20 . The six imaging devices 30 respectively photograph the six outer surfaces of the electronic component 3 on the turntable 20 , namely, the two main surfaces TS1 and TS2 , the two side surfaces WS1 and WS2 , and the two end surfaces LS1 and LS2 .
測定器件40例如包含用於與電子零件3之外部電極接觸之一對探針,測定電子零件3之電氣特性。如圖1A所示般,測定器件40可設置於線性供料器10之下游側之靜電吸附部分。或者,如圖1B所示般,測定器件40亦可沿著轉台20之旋轉搬送軌跡21設置。該情形下,如上述般,且如圖3B所示般,可不在線性供料器10設置靜電吸附機構12。測定器件40測定線性供料器10上或轉台20上之電子零件3之電氣特性。例如,在電子零件3為積層陶瓷電容時,測定器件40測定電子零件3之電容。The measuring device 40, for example, includes a pair of probes for contacting the external electrodes of the electronic component 3 to measure the electrical characteristics of the electronic component 3. As shown in FIG1A, the measuring device 40 can be disposed in the electrostatic adsorption portion on the downstream side of the linear feeder 10. Alternatively, as shown in FIG1B, the measuring device 40 can also be disposed along the rotating conveying track 21 of the turntable 20. In this case, as described above and as shown in FIG3B, the electrostatic adsorption mechanism 12 may not be disposed on the linear feeder 10. The measuring device 40 measures the electrical characteristics of the electronic component 3 on the linear feeder 10 or on the turntable 20. For example, when the electronic component 3 is a multilayer ceramic capacitor, the measuring device 40 measures the capacitance of the electronic component 3.
如上述般,進行藉由測定器件40而實現之電氣特性之測定的線性供料器10之下游側之靜電吸附部分或轉台20,一面靜電吸附電子零件3一面進行搬送。藉此,可提高電氣特性之測定精度。As described above, the electrostatic adsorption part or the turntable 20 on the downstream side of the linear feeder 10 that performs the measurement of the electrical characteristics by the measuring device 40 transports the electronic components 3 while electrostatically adsorbing them. This can improve the accuracy of the measurement of the electrical characteristics.
如圖1A及圖4所示般,第1排出機構50將藉由後述之檢査篩選控制器80基於外觀檢査之結果或電氣特性檢査之結果而篩選出之良品自轉台20排出且收容於盒5。第1排出機構50對良品之排出方法並無特別限定,可舉出空氣吹拂、空氣吸引、實體接觸推出等。例如,第1排出機構50在良品被搬送來時,藉由依照來自檢査篩選控制器80之指令,對轉台20上之良品吹拂空氣,而將良品自轉台20取入於內部。As shown in FIG. 1A and FIG. 4 , the first discharge mechanism 50 discharges the good products selected by the inspection and screening controller 80 described later based on the results of the appearance inspection or the results of the electrical characteristics inspection from the turntable 20 and stores them in the box 5. The first discharge mechanism 50 is not particularly limited to the method of discharging the good products, and air blowing, air suction, physical contact and pushing, etc. can be cited. For example, when the good products are conveyed, the first discharge mechanism 50 blows air to the good products on the turntable 20 according to the instructions from the inspection and screening controller 80, and takes the good products from the turntable 20 into the interior.
第1排出機構50包含:管狀構件52、空氣供給機構53、漏斗狀構件54、及空氣排出機構55。The first exhaust mechanism 50 includes a tubular member 52 , an air supply mechanism 53 , a funnel-shaped member 54 , and an air exhaust mechanism 55 .
管狀構件52為剖面圓形或剖面多角形之管狀之構件,自轉台20延伸至盒5之出入口。藉此,管狀構件52將自轉台20排出之良品之電子零件3引導至盒5之出入口5a。The tubular member 52 is a tubular member with a circular or polygonal cross section, and extends from the turntable 20 to the entrance and exit of the box 5. Thus, the tubular member 52 guides the good electronic components 3 discharged from the turntable 20 to the entrance and exit 5a of the box 5.
管狀構件52自上游側向下游側以位置逐漸變低之方式延伸。藉此,電子零件3藉由重力而被引導至盒5。例如,管狀構件52具有相對於鉛直方向傾斜地延伸之部分。該情形下,電子零件3在管狀構件52之內壁滾動而被引導至盒5。又,管狀構件52具有沿著鉛直方向延伸之部分。該情形下,電子零件3自由落下而被引導至盒5。The tubular member 52 extends from the upstream side to the downstream side in a gradually lowered position. Thus, the electronic component 3 is guided to the box 5 by gravity. For example, the tubular member 52 has a portion extending obliquely relative to the vertical direction. In this case, the electronic component 3 rolls on the inner wall of the tubular member 52 and is guided to the box 5. Alternatively, the tubular member 52 has a portion extending along the vertical direction. In this case, the electronic component 3 falls freely and is guided to the box 5.
空氣供給機構53配置於管狀構件52之上游側,供給用於增大電子零件3之搬送力之空氣。例如,空氣供給機構53自管狀構件52之側面向下方供給空氣。The air supply mechanism 53 is disposed on the upstream side of the tubular member 52, and supplies air for increasing the conveying force of the electronic components 3. For example, the air supply mechanism 53 supplies air from the side surface of the tubular member 52 downward.
漏斗狀構件54係剖面圓形或剖面多角形之漏斗狀之構件,配置於管狀構件52與盒5之出入口之間。The funnel-shaped member 54 is a funnel-shaped member with a circular cross section or a polygonal cross section, and is disposed between the tubular member 52 and the inlet and outlet of the box 5 .
空氣排出機構55配置於漏斗狀構件54,換言之配置於管狀構件52之下游側。藉此,空氣排出機構55將空氣排出。The air discharge mechanism 55 is disposed on the funnel-shaped member 54, in other words, on the downstream side of the tubular member 52. Thus, the air discharge mechanism 55 discharges the air.
例如,空氣排出機構55係在漏斗狀構件54之上表面配置於管狀構件52之周緣之開口。開口較佳的是小於電子零件3之外形尺寸。或者,在開口大於電子零件3之外形尺寸時,較佳的是在開口設置較電子零件3之外形尺寸小之網眼之網狀之構件。藉此,可防止電子零件3自開口排出,且僅將空氣排出。For example, the air exhaust mechanism 55 is an opening disposed on the upper surface of the funnel-shaped member 54 at the periphery of the tubular member 52. The opening is preferably smaller than the outer dimensions of the electronic component 3. Alternatively, when the opening is larger than the outer dimensions of the electronic component 3, it is preferred to provide a mesh-like member having a mesh smaller than the outer dimensions of the electronic component 3 at the opening. In this way, the electronic component 3 can be prevented from being discharged from the opening, and only air can be discharged.
或者,空氣排出機構55例如可具有真空吸引等之吸引機構。該情形下,例如,空氣排出機構55自漏斗狀構件54之上表面或側面吸引空氣。吸引機構之吸引口較佳的是小於電子零件3之外形尺寸。或者,在吸引機構之吸引口大於電子零件3之外形尺寸時,較佳的是在吸引機構之吸引口設置較電子零件3之外形尺寸小之網眼之網狀之構件。藉此,可防止電子零件3自吸引機構之吸引口排出,且可僅將空氣排出。Alternatively, the air exhaust mechanism 55 may have a suction mechanism such as vacuum suction. In this case, for example, the air exhaust mechanism 55 sucks air from the upper surface or side of the funnel-shaped member 54. The suction port of the suction mechanism is preferably smaller than the outer dimensions of the electronic component 3. Alternatively, when the suction port of the suction mechanism is larger than the outer dimensions of the electronic component 3, it is preferred to provide a mesh member having a smaller mesh than the outer dimensions of the electronic component 3 at the suction port of the suction mechanism. In this way, the electronic component 3 can be prevented from being discharged from the suction port of the suction mechanism, and only air can be discharged.
第2排出機構60將藉由後述之檢査篩選控制器80基於外觀檢査之結果或電氣特性檢査之結果而篩選出之不良品自轉台20排出且回收於回收盒(省略圖示)。藉由第2排出機構60實現之不良品之排出方法只要與藉由第1排出機構50實現之良品之排出方法相同即可。例如,第2排出機構60在不良品被搬送而來時,藉由依照來自檢査篩選控制器80之指令,對轉台20上之不良品吹拂空氣,而將不良品自轉台20取入於內部。The second discharge mechanism 60 discharges the defective products screened out by the inspection and screening controller 80 described later based on the results of the appearance inspection or the results of the electrical characteristics inspection from the turntable 20 and collects them in a collection box (not shown). The method of discharging defective products by the second discharge mechanism 60 can be the same as the method of discharging good products by the first discharge mechanism 50. For example, when defective products are transported, the second discharge mechanism 60 blows air on the defective products on the turntable 20 according to the instructions from the inspection and screening controller 80, and takes the defective products from the turntable 20 into the interior.
又,第2排出機構60與第1排出機構50相同地具有管狀構件,藉由管狀構件將自轉台20排出之不良品引導至回收盒(省略圖示)。第2排出機構60較佳的是設置於第1排出機構50之上游側。The second discharge mechanism 60 has a tubular member similar to the first discharge mechanism 50 , and guides the defective products discharged from the turntable 20 to a collection box (not shown). The second discharge mechanism 60 is preferably disposed upstream of the first discharge mechanism 50 .
如圖1A及圖4所示般,第1計數器71對藉由第1排出機構50自轉台20排出之良品進行計數。第1計數器71設置於第1排出機構50之下游側、即緊鄰於盒5之前。藉此,可準確地計數收容於盒5之良品。再者,第1計數器71亦可進一步設置於第1排出機構50之上游側。藉此,在2個第1計數器71之計數數目不同時,可確認在第1排出機構50內殘留有電子零件3。As shown in FIG. 1A and FIG. 4 , the first counter 71 counts the good products discharged from the turntable 20 by the first discharge mechanism 50. The first counter 71 is disposed on the downstream side of the first discharge mechanism 50, that is, immediately before the box 5. In this way, the good products contained in the box 5 can be accurately counted. Furthermore, the first counter 71 can also be further disposed on the upstream side of the first discharge mechanism 50. In this way, when the count numbers of the two first counters 71 are different, it can be confirmed that the electronic components 3 are left in the first discharge mechanism 50.
作為第1計數器71並無特別限定,可舉出相機、光感測器、渦電流感測器等。渦電流感測器只要為周知之渦電流感測器、渦電流式變位感測器即可。例如,自諧振電路向感測器線圈供給高頻信號,自感測器線圈產生高頻磁場。若包含金屬之電子零件靠近該磁場內,則在電子零件之金屬產生渦電流,而感測器線圈之阻抗變化。如是,諧振電路之電壓變化。藉由利用檢波電路檢測該電壓變化,而可計數電子零件之通過。The first counter 71 is not particularly limited, and a camera, a photo sensor, an eddy current sensor, etc. can be cited. The eddy current sensor can be any well-known eddy current sensor or eddy current displacement sensor. For example, a high-frequency signal is supplied to the sensor coil from the self-resonance circuit, and a high-frequency magnetic field is generated from the sensor coil. If an electronic component containing metal approaches the magnetic field, eddy current is generated in the metal of the electronic component, and the impedance of the sensor coil changes. In this way, the voltage of the resonant circuit changes. By using a detection circuit to detect the voltage change, the passage of the electronic component can be counted.
第2計數器72對藉由第2排出機構60自轉台20排出之不良品進行計數(省略圖示)。第2計數器72只要與第1計數器71相同即可。The second counter 72 counts the number of defective products discharged from the turntable 20 by the second discharge mechanism 60 (not shown). The second counter 72 may be the same as the first counter 71 .
檢査篩選控制器80控制零件篩選裝置1整體。具體而言,檢査篩選控制器80基於來自攝像器件30之攝像結果進行電子零件3之外觀檢査,且基於外觀檢査之結果而篩選良品及不良品。或者,或進而,檢査篩選控制器80基於來自測定器件40之測定結果進行電子零件3之電氣特性檢査(亦稱為驗證),且基於電氣特性檢査之結果而篩選良品及不良品。The inspection and screening controller 80 controls the entire component screening device 1. Specifically, the inspection and screening controller 80 performs an appearance inspection of the electronic component 3 based on the imaging result from the imaging device 30, and screens good and defective products based on the result of the appearance inspection. Alternatively, or further, the inspection and screening controller 80 performs an electrical characteristic inspection (also called verification) of the electronic component 3 based on the measurement result from the measuring device 40, and screens good and defective products based on the result of the electrical characteristic inspection.
又,檢査篩選控制器80控制藉由第1排出機構50進行之良品之排出。例如,檢査篩選控制器80根據線性供料器10之搬送速度、轉台20之搬送速度(或者旋轉速度、及旋轉搬送軌跡長度或半徑)、線性供料器10或轉台20中之測定器件40之位置、轉台20中之攝像器件30之位置等資訊,算出將良品自第1排出機構50排出之時序,且指令至第1排出機構50。Furthermore, the inspection and screening controller 80 controls the discharge of good products by the first discharge mechanism 50. For example, the inspection and screening controller 80 calculates the timing of discharging good products from the first discharge mechanism 50 based on information such as the transport speed of the linear feeder 10, the transport speed (or rotation speed, and the length or radius of the rotation transport track) of the turntable 20, the position of the measuring device 40 in the linear feeder 10 or the turntable 20, and the position of the imaging device 30 in the turntable 20, and issues a command to the first discharge mechanism 50.
又,檢査篩選控制器80控制藉由第2排出機構60進行之不良品之排出。例如,檢査篩選控制器80根據線性供料器10之搬送速度、轉台20之搬送速度(或者旋轉速度、及旋轉搬送軌跡長度或半徑)、線性供料器10或轉台20中之測定器件40之位置、轉台20中之攝像器件30之位置等資訊,算出將不良品自第2排出機構60排出之時序,且指令至第2排出機構60。Furthermore, the inspection and screening controller 80 controls the discharge of defective products by the second discharge mechanism 60. For example, the inspection and screening controller 80 calculates the timing of discharging defective products from the second discharge mechanism 60 based on information such as the conveying speed of the linear feeder 10, the conveying speed (or rotation speed, and the length or radius of the rotation conveying track) of the turntable 20, the position of the measuring device 40 in the linear feeder 10 or the turntable 20, and the position of the imaging device 30 in the turntable 20, and issues an instruction to the second discharge mechanism 60.
檢査篩選控制器80例如由DSP(Digital Signal Processor,數位信號處理器)、FPGA(Field-Programmable Gate Array,現場可程式閘陣列)等運算處理器構成。檢査篩選控制器80之各種功能藉由執行例如儲存於記憶部之特定之軟體(程式)而實現。檢査篩選控制器80之各種功能可藉由硬體與軟體之協同而實現,亦可僅藉由硬體(電子電路)而實現。The inspection and screening controller 80 is composed of a computing processor such as a DSP (Digital Signal Processor) or an FPGA (Field-Programmable Gate Array). The various functions of the inspection and screening controller 80 are realized by executing specific software (program) stored in a memory unit, for example. The various functions of the inspection and screening controller 80 can be realized by the cooperation of hardware and software, or by hardware (electronic circuit) alone.
檢査篩選控制器80中之記憶部為例如EEPROM等可覆寫之記憶體。記憶部儲存用於執行篩選控制器之各種功能之特定之軟體(程式)。又,記憶部儲存例如自外部輸入之各種設定值。各種設定值包含:與線性供料器10之搬送速度、轉台20之搬送速度(或者旋轉速度、及旋轉搬送軌跡長度或半徑)、攝像器件30之位置、測定器件40之位置、第1排出機構50之位置、及第2排出機構60之位置相關之資訊、及良品/不良品之判定基準等。The memory unit in the inspection and screening controller 80 is an overwritable memory such as an EEPROM. The memory unit stores specific software (programs) used to execute various functions of the screening controller. In addition, the memory unit stores various setting values input from the outside. The various setting values include: information related to the transport speed of the linear feeder 10, the transport speed of the turntable 20 (or the rotation speed, and the length or radius of the rotation transport track), the position of the imaging device 30, the position of the measuring device 40, the position of the first discharge mechanism 50, and the position of the second discharge mechanism 60, and the criteria for determining good/defective products, etc.
如以上說明般,根據本實施方式之零件篩選裝置1,包含:線性供料器10及轉台20(搬送機構),其等搬送電子零件3;6個攝像器件30,其等分別拍攝轉台20上之電子零件3之6個外觀;或測定器件40,其測定線性供料器10上或轉台20上之電子零件3之電氣特性;檢査篩選控制器80,其基於來自攝像器件30之攝像結果進行電子零件3之外觀檢査,或基於來自測定器件40之測定結果進行電子零件3之電氣特性檢査,且基於外觀檢査之結果或電氣特性檢査之結果而篩選良品;及第1排出機構50,其將藉由檢査篩選控制器80篩選出之良品自轉台20排出且收容於盒5。藉此,可一面搬送複數個電子零件3一面進行外觀檢査或電氣特性檢査,篩選良品且收容於盒5。As described above, the parts screening device 1 according to the present embodiment includes: a linear feeder 10 and a turntable 20 (transport mechanism), which transport electronic parts 3; 6 imaging devices 30, which respectively photograph 6 appearances of the electronic parts 3 on the turntable 20; or a measuring device 40, which measures the electrical characteristics of the electronic parts 3 on the linear feeder 10 or the turntable 20; an inspection and screening controller 80, which performs an appearance inspection of the electronic component 3 based on the image pickup result from the image pickup device 30, or performs an electrical characteristic inspection of the electronic component 3 based on the measurement result from the measurement device 40, and selects good products based on the appearance inspection result or the electrical characteristic inspection result; and a first discharge mechanism 50, which discharges the good products selected by the inspection and screening controller 80 from the turntable 20 and stores them in the box 5. In this way, the appearance inspection or the electrical characteristic inspection can be performed while conveying a plurality of electronic components 3, and good products can be selected and stored in the box 5.
此處,在如此之零件篩選裝置中,有將排出之良品之電子零件3藉由管狀構件52引導至盒5之入口、且收容於盒5之情形。該情形下,有基於例如防止電子零件3殘留於管狀構件52內之目的,為了增大電子零件3之搬送力,而在管狀構件52之上游側設置供給空氣之空氣供給機構53之情形。Here, in such a parts screening device, the discharged good electronic parts 3 are guided to the entrance of the box 5 through the tubular member 52 and stored in the box 5. In this case, for example, in order to prevent the electronic parts 3 from remaining in the tubular member 52, an air supply mechanism 53 for supplying air is provided on the upstream side of the tubular member 52 in order to increase the conveying force of the electronic parts 3.
又,盒5為箱狀之盒,且為僅具有1個出入口5a之盒。在將如此之盒5與具有上述之空氣供給機構53之管狀構件52組合時,因向盒5之出入口5a持續供給空氣,而無進入盒5之空氣之出口,故電子零件3無法進入盒5內。其結果,電子零件3向盒5之收容性下降。Furthermore, the box 5 is a box-shaped box having only one inlet and outlet 5a. When such a box 5 is combined with the tubular member 52 having the above-mentioned air supply mechanism 53, since air is continuously supplied to the inlet and outlet 5a of the box 5, and there is no outlet for air to enter the box 5, the electronic component 3 cannot enter the box 5. As a result, the accommodation of the electronic component 3 in the box 5 is reduced.
關於此點,根據本實施方式之零件篩選裝置1,第1排出機構50具有配置於管狀構件52之下游側、排出空氣之空氣排出機構55。藉此,可將自空氣供給機構53供給之空氣排出,而可抑制電子零件3之向盒5之收容性之下降。In this regard, according to the component selection device 1 of this embodiment, the first discharge mechanism 50 has an air discharge mechanism 55 disposed on the downstream side of the tubular member 52 for discharging air. Thus, the air supplied from the air supply mechanism 53 can be discharged, and the decrease in the accommodation of the electronic component 3 in the box 5 can be suppressed.
又,根據本實施方式之零件篩選裝置1,空氣排出機構55可為開口。開口較佳的是小於電子零件3之外形尺寸。或者,在開口大於電子零件3之外形尺寸時,較佳的是在開口設置較電子零件3之外形尺寸小之網眼之網狀之構件。藉此,可防止電子零件3自開口排出,且僅將空氣排出。Furthermore, according to the component screening device 1 of the present embodiment, the air exhaust mechanism 55 can be an opening. The opening is preferably smaller than the external dimensions of the electronic component 3. Alternatively, when the opening is larger than the external dimensions of the electronic component 3, it is preferred to set a mesh-like component with a mesh smaller than the external dimensions of the electronic component 3 at the opening. In this way, the electronic component 3 can be prevented from being discharged from the opening, and only air can be discharged.
又,根據本實施方式之零件篩選裝置1,空氣排出機構55可具有吸引機構。吸引機構之吸引口較佳的是小於電子零件3之外形尺寸。或者,在吸引機構之吸引口大於電子零件3之外形尺寸時,較佳的是在吸引機構之吸引口設置較電子零件3之外形尺寸小之網眼之網狀之構件。藉此,可防止電子零件3自吸引機構之吸引口排出,且可僅將空氣排出。Furthermore, according to the component screening device 1 of the present embodiment, the air exhaust mechanism 55 may have a suction mechanism. The suction port of the suction mechanism is preferably smaller than the external dimensions of the electronic component 3. Alternatively, when the suction port of the suction mechanism is larger than the external dimensions of the electronic component 3, it is preferred to provide a mesh-like component having a smaller mesh than the external dimensions of the electronic component 3 at the suction port of the suction mechanism. In this way, the electronic component 3 can be prevented from being discharged from the suction port of the suction mechanism, and only air can be discharged.
以上,對於本發明之實施方式進行了說明,但本發明並不限定於上述之實施方式,而可進行各種變更及變化。在上述實施方式中,例示了包含將不良品自轉台20排出之第2排出機構60之形態。然而,本發明並不限定於此,例如亦可為不包含第2排出機構60之形態。該情形下,零件篩選裝置1可在藉由攝像器件30實現之攝像及外觀檢査後,立即將不良品自轉台20排出。又,零件篩選裝置1亦可在藉由測定器件40進行之測定及電氣特性檢査後,立即將不良品自線性供料器10或轉台20排出。該情形下,可在轉台20之外周整體、及/或線性供料器10之側方整體配置不良品回收功能。The above is a description of the implementation of the present invention, but the present invention is not limited to the above implementation, and various changes and modifications can be made. In the above implementation, an example is given of a form including a second discharge mechanism 60 for discharging defective products from the turntable 20. However, the present invention is not limited thereto, and for example, it may be a form that does not include the second discharge mechanism 60. In this case, the parts screening device 1 can immediately discharge defective products from the turntable 20 after the photography and appearance inspection are realized by the imaging device 30. In addition, the parts screening device 1 can also immediately discharge defective products from the linear feeder 10 or the turntable 20 after the measurement and electrical characteristic inspection are performed by the measuring device 40. In this case, a defective product recovery function may be configured on the entire periphery of the turntable 20 and/or the entire side of the linear feeder 10.
又,在上述實施方式中,例示了檢査篩選控制器80具有基於來自攝像器件30之攝像結果進行電子零件之外觀檢査之功能之形態。然而,本發明並不限定於此,攝像器件30各者亦可具有外觀檢査功能。又,攝像器件30各者亦可如上述之變化例般,具有在外觀檢査後立即將不良品自轉台20排出之功能。In the above embodiment, the inspection and screening controller 80 has the function of performing an appearance inspection of electronic components based on the imaging result from the imaging device 30. However, the present invention is not limited thereto, and each imaging device 30 may also have an appearance inspection function. In addition, each imaging device 30 may also have a function of immediately discharging defective products from the turntable 20 after the appearance inspection, as in the above variation.
又,在上述實施方式中,例示了檢査篩選控制器80具有基於來自測定器件40之測定結果進行電子零件之電氣特性檢査之功能之形態。然而,本發明並不限定於此,測定器件40各者亦可具有電氣特性檢査功能。又,測定器件40各者亦可如上述之變形例般,具有在電氣特性檢査後立即將不良品自線性供料器10或轉台20排出之功能。In the above-mentioned embodiment, the inspection and screening controller 80 has the function of inspecting the electrical characteristics of the electronic parts based on the measurement results from the measuring device 40. However, the present invention is not limited to this, and each of the measuring devices 40 may also have the function of inspecting the electrical characteristics. In addition, each of the measuring devices 40 may also have the function of discharging defective products from the linear feeder 10 or the turntable 20 immediately after the electrical characteristics inspection, as in the above-mentioned variation.
1:零件篩選裝置 3:電子零件 3a:積層體 3b:外部電極 5:盒 5a:出入口 10:線性供料器(搬送機構) 12:靜電吸附機構 20:轉台(搬送機構) 21:旋轉搬送軌跡 22:導引機構 24:靜電吸附機構 30:攝像器件 40:測定器件 50:第1排出機構(排出機構) 52:管狀構件 53:空氣供給機構 54:漏斗狀構件 55:空氣排出機構 60:第2排出機構 71:第1計數器 72:第2計數器 80:檢査篩選控制器 II:部分 IV-IV:線 LS1,LS2:端面 TS1,TS2:主面 WS1,WS2:側面 1: Parts screening device 3: Electronic parts 3a: Laminated body 3b: External electrode 5: Box 5a: Inlet and outlet 10: Linear feeder (transport mechanism) 12: Electrostatic adsorption mechanism 20: Turntable (transport mechanism) 21: Rotary transport track 22: Guide mechanism 24: Electrostatic adsorption mechanism 30: Imaging device 40: Measuring device 50: First discharge mechanism (discharge mechanism) 52: Tubular component 53: Air supply mechanism 54: Funnel-shaped component 55: Air discharge mechanism 60: Second discharge mechanism 71: First counter 72: Second counter 80: Inspection and screening controller II: part IV-IV: line LS1, LS2: end surface TS1, TS2: main surface WS1, WS2: side surface
圖1A係自上方觀察本實施方式之零件篩選裝置之一例之概略平面圖。 圖1B係自上方觀察本實施方式之零件篩選裝置之又一例之概略平面圖。 圖2係將圖1A或圖1B所示之零件篩選裝置之II部分放大之概略平面圖。 圖3A係自側方觀察圖1A所示之零件篩選裝置之概略側視圖,且係將II部分放大之概略側視圖。 圖3B係自側方觀察圖1B所示之零件篩選裝置之概略側視圖,且係將II部分放大之概略側視圖。 圖4係圖1A或圖1B所示之零件篩選裝置之IV-IV線剖視圖。 圖5係零件之外觀之概略立體圖。 圖6係盒之外觀之概略立體圖。 FIG. 1A is a schematic plan view of an example of a part screening device of the present embodiment as viewed from above. FIG. 1B is a schematic plan view of another example of a part screening device of the present embodiment as viewed from above. FIG. 2 is a schematic plan view of a part II of the part screening device shown in FIG. 1A or FIG. 1B, which is an enlarged schematic plan view. FIG. 3A is a schematic side view of the part screening device shown in FIG. 1A as viewed from the side, and is an enlarged schematic side view of part II. FIG. 3B is a schematic side view of the part screening device shown in FIG. 1B as viewed from the side, and is an enlarged schematic side view of part II. FIG. 4 is a cross-sectional view of the part screening device shown in FIG. 1A or FIG. 1B, taken along line IV-IV. FIG. 5 is a schematic three-dimensional view of the appearance of the part. Figure 6 is a schematic three-dimensional diagram of the box's exterior.
1:零件篩選裝置 1: Parts screening device
5:盒 5: Box
10:線性供料器(搬送機構) 10: Linear feeder (conveying mechanism)
12:靜電吸附機構 12: Electrostatic adsorption mechanism
20:轉台(搬送機構) 20: Turntable (transportation mechanism)
21:旋轉搬送軌跡 21: Rotating conveying track
22:導引機構 22: Guidance mechanism
24:靜電吸附機構 24: Electrostatic adsorption mechanism
30:攝像器件 30: Imaging devices
40:測定器件 40: Measurement device
50:第1排出機構(排出機構) 50: 1st discharge mechanism (discharge mechanism)
52:管狀構件 52: Tubular components
53:空氣供給機構 53: Air supply mechanism
54:漏斗狀構件 54: Funnel-shaped component
55:空氣排出機構 55: Air exhaust mechanism
60:第2排出機構 60: Second discharge mechanism
71:第1計數器 71: 1st counter
72:第2計數器 72: 2nd counter
80:檢査篩選控制器 80: Check filter controller
II:部分 II: Part
IV-IV:線 IV-IV: Line
Claims (10)
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| JP2021-211966 | 2021-12-27 | ||
| JP2021211966 | 2021-12-27 |
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| TW202336428A TW202336428A (en) | 2023-09-16 |
| TWI882270B true TWI882270B (en) | 2025-05-01 |
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| JP (1) | JPWO2023127316A1 (en) |
| KR (1) | KR20240089335A (en) |
| CN (1) | CN118140135A (en) |
| TW (1) | TWI882270B (en) |
| WO (1) | WO2023127316A1 (en) |
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| JPH0295581U (en) * | 1989-01-12 | 1990-07-30 | ||
| TWI276592B (en) * | 2002-06-27 | 2007-03-21 | Lintec Corp | Feeder and polyhedral inspection instrument for polyhedral inspection |
| TWM442194U (en) * | 2012-08-15 | 2012-12-01 | Lee King Technology Co Ltd | Object screening machine for elongated object inspection |
| JP2024146818A (en) * | 2023-03-31 | 2024-10-15 | 日鉄環境株式会社 | Method for draining and concentrating sediment-mixed water or muddy water, and draining and concentrating device for sediment-mixed water or muddy water |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62146818A (en) * | 1985-12-18 | 1987-06-30 | Nec Corp | Transfer method for taping parts |
| JPH0734026B2 (en) * | 1989-01-24 | 1995-04-12 | 株式会社村田製作所 | Terminal device for measuring the characteristics of chip parts |
| JP2003177150A (en) * | 2001-12-11 | 2003-06-27 | Murata Mfg Co Ltd | Conveyance and discharge device for electronic parts |
| JP2007003342A (en) * | 2005-06-23 | 2007-01-11 | Ueno Seiki Kk | Test classification system of electronic component |
| JP2007246214A (en) * | 2006-03-15 | 2007-09-27 | Hamamura Yuatsu Kk | Visual inspection device |
| JP5655279B2 (en) * | 2009-06-01 | 2015-01-21 | 株式会社村田製作所 | Chip component transfer device |
| KR101591242B1 (en) * | 2014-04-07 | 2016-02-03 | 나승옥 | Work discharge device |
| JP6529170B2 (en) | 2015-08-26 | 2019-06-12 | 株式会社 東京ウエルズ | Work appearance inspection apparatus and work appearance inspection method |
| JP7142210B2 (en) * | 2018-10-15 | 2022-09-27 | パナソニックIpマネジメント株式会社 | Characteristic measuring device, component mounting device, characteristic measuring method, and component mounting method |
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2022
- 2022-11-08 WO PCT/JP2022/041502 patent/WO2023127316A1/en not_active Ceased
- 2022-11-08 JP JP2023570716A patent/JPWO2023127316A1/ja active Pending
- 2022-11-08 KR KR1020247014931A patent/KR20240089335A/en active Pending
- 2022-11-08 CN CN202280071263.4A patent/CN118140135A/en active Pending
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH0295581U (en) * | 1989-01-12 | 1990-07-30 | ||
| TWI276592B (en) * | 2002-06-27 | 2007-03-21 | Lintec Corp | Feeder and polyhedral inspection instrument for polyhedral inspection |
| TWM442194U (en) * | 2012-08-15 | 2012-12-01 | Lee King Technology Co Ltd | Object screening machine for elongated object inspection |
| JP2024146818A (en) * | 2023-03-31 | 2024-10-15 | 日鉄環境株式会社 | Method for draining and concentrating sediment-mixed water or muddy water, and draining and concentrating device for sediment-mixed water or muddy water |
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| WO2023127316A1 (en) | 2023-07-06 |
| KR20240089335A (en) | 2024-06-20 |
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| TW202336428A (en) | 2023-09-16 |
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