TWI880821B - Via detection device and method for tgv (through glass via) substrate - Google Patents

Abstract

A TGV glass substrate perforation detection device, wherein a first depth of field camera and a first collimated light source disposed on the glass substrate face the upper surface of the glass substrate, a second depth of field camera and a second collimated light source disposed below the glass substrate face the lower surface of the glass substrate, a spectroscopic prism assembly is disposed between the upper surface of the glass substrate and the first collimated light source, and a third depth of field camera is disposed on one side of the spectroscopic prism assembly. The first collimated light source and the second collimated light source emit a first collimated light beam and a second collimated light beam to the glass substrate, respectively, the first to third depth of field cameras are used to obtain first to third images, respectively, and a microcontroller unit of the TGV glass substrate perforation detection device is used to obtain at least one detection result of at least one glass substrate perforation of the glass substrate according to the first to third images.

Description

TGV glass substrate perforation detection device and method

A TGV (Through Glass Via) glass substrate perforation detection device and method, particularly a TGV glass substrate perforation detection device and method that uses two depth of field cameras and two collimated light sources located above and below the glass substrate to obtain the detection result of the glass substrate perforation.

The previous two-dimensional (2D) chip packaging technology can no longer meet the current demand for chip speed, performance and thinness, so two-and-a-half-dimensional (2.5D) and three-dimensional (3D) chip packaging technologies have also been proposed. The two-and-a-half-dimensional (2.5D) and three-dimensional (3D) chip packaging technologies require the use of an interposer with perforations to electrically connect different chips. In the past, silicon substrates with through silicon vias (TSV) (Note: silicon substrates with TSV are also called TSV silicon substrates) were used as interposers. However, silicon is a semiconductor material of the IV-A group, so the surrounding carriers can move freely under the action of electric or magnetic fields and affect the adjacent circuits or signals, which may seriously affect the performance of the chip. However, glass materials do not have freely moving charges, have excellent dielectric properties, and have a coefficient of thermal expansion (CTE) close to that of silicon. Therefore, a glass substrate with through glass vias (TGV) (Note: a glass substrate with TGV is also called a TGV glass substrate) is proposed to replace the silicon substrate as an interposer.

The manufacturing method of the glass substrate with glass substrate through-holes is to first irradiate the predetermined position of the glass substrate where the glass substrate through-holes are to be formed with laser for modification, and then use immersion etching to form the glass substrate through-holes at the predetermined position. Please refer to Figures 1 and 2, Figure 1 is a plan view schematically showing the glass substrate with glass substrate through-holes from above, and Figure 2 is a three-dimensional schematic view of the cross-section of Figure 1 from the side, wherein the cross-section of Figure 2 is the cross-section of Figure 1 along the section line AA. The glass substrate 1 has a plurality of glass substrate through-holes 12 penetrating the upper surface 10 and the lower surface 12 of the glass substrate 1, each of the glass substrate through-holes 12 has an upper opening 121 on the upper surface 10 and a lower opening 123 on the lower surface 11, and has a waist between the upper surface 10 and the lower surface 11, and the waist forms a through-hole 122. The upper opening 121 and the lower opening 123 have opening diameters Rt and Rb respectively, and the waist through hole 122 forms a through hole diameter Rm.

The opening diameters Rt, Rb, and the perforation diameter Rm and other parameter information must be tested to evaluate whether the glass substrate 1 meets the requirements. One of the existing technologies is to use X-rays for testing, but the speed of X-ray testing is too slow (even slower than using a microscope), which is not in line with production efficiency. Another existing technology is to use a microscope for testing, but using a microscope for testing is still very time-consuming and difficult to meet economic benefits. Another method in the prior art is to first fill the glass substrate through-hole 12 with a non-destructive plastic material and then take out the non-destructive plastic material to measure the above information. However, this method requires filling the glass substrate through-hole 12 with a non-destructive plastic material. In addition to the cost and detection time issues, there may also be a problem that the non-destructive plastic material remains in the glass substrate through-hole 12. In view of this, there is still a need to propose a novel glass substrate through-hole detection technology to avoid the above technical problems.

According to any of the above purposes, the present invention provides a TGV glass substrate perforation detection device, the TGV glass substrate perforation detection device comprising a first depth of field camera, a first collimated light source, a second depth of field camera, a second collimated light source and a microcontroller unit. The first depth of field camera and the first collimated light source are arranged on a glass substrate having at least one glass substrate perforation, and face the upper surface of the glass substrate. The second depth of field camera and the second collimated light source are arranged under the glass substrate, and face the lower surface of the glass substrate. The microcontroller unit is electrically connected to the first depth of field camera, the first collimated light source, the second depth of field camera and the second collimated light source. The first collimated light source and the second collimated light source respectively emit a first collimated light beam and a second collimated light beam to the glass substrate, the light band of the first collimated light beam is the same as or different from the light band of the second collimated light beam, the first depth of field camera and the second depth of field camera are respectively used to obtain a first image and a second image, and the microcontroller unit is used to obtain at least one detection result of at least one glass substrate perforation according to the first image and the second image.

According to any of the above purposes, the present invention provides a perforation detection device for a TGV glass substrate, the perforation detection device for a TGV glass substrate comprising a first depth of field camera, a first collimated light source, a second depth of field camera, a second collimated light source, a spectroscopic prism assembly, a third depth of field camera and a microcontroller unit. The first depth of field camera and the first collimated light source are arranged on a glass substrate having at least one glass substrate perforation, and face the upper surface of the glass substrate. The second depth of field camera and the second collimated light source are arranged under the glass substrate, and face the lower surface of the glass substrate. The microcontroller unit is electrically connected to the first depth of field camera, the first collimated light source, the second depth of field camera, the second collimated light source and the third depth of field camera. The spectroscopic prism module is arranged between the upper surface of the glass substrate and the first collimated light source. The third depth of field camera is arranged on one side of the spectroscopic prism module. The first collimated light source and the second collimated light source respectively emit a first collimated light beam and a second collimated light beam to the glass substrate. The beam splitting prism module is used to split the first collimated light beam directed to the glass substrate, the first collimated light beam reflected by the glass substrate, and the second collimated light beam penetrating the glass substrate. A portion of the second collimated light beam penetrating the hole of the glass substrate after the beam splitting, a portion of the first collimated light beam directed to the glass substrate after the beam splitting, and a portion of the first collimated light beam reflected by the glass substrate after the beam splitting are received by the third depth-of-field camera. The second collimated light beam penetrating the hole of the glass substrate after the beam splitting Another part of the first collimated light beam after the light is reflected by the glass substrate and another part of the first collimated light beam after the light is split is received by the first depth-of-field camera, and another part of the first collimated light beam after the light is split is irradiated onto the glass substrate, and the light band of the first collimated light beam is different from or the same as the light band of the second collimated light beam. The first depth-of-field camera, the second depth-of-field camera and the third depth-of-field camera are respectively used to obtain a first image, a second image and a third image, and the microcontroller unit is used to obtain at least one detection result of at least one glass substrate perforation according to the first image, the second image and the third image.

Based on the above purpose, the present invention also provides a TGV glass substrate perforation detection method, the TGV glass substrate perforation detection method is executed in a TGV glass substrate perforation detection device, the TGV glass substrate perforation detection device includes a first depth of field camera, a first collimated light source, a second depth of field camera and a second collimated light source, wherein the first depth of field camera and the first collimated light source are arranged on a glass substrate having at least one glass substrate perforation and facing the upper surface of the glass substrate, the second depth of field camera and the second collimated light source are arranged under the glass substrate and facing the lower surface of the glass substrate, and the perforation detection method includes the following steps ：The microcontroller unit of the perforation detection device using TGV glass substrate controls a first depth of field camera, a first collimated light source, a second depth of field camera and a second collimated light source, so that the first collimated light source and the second collimated light source respectively emit a first collimated light beam and a second collimated light beam to the glass substrate, and the first depth of field camera and the second depth of field camera are respectively used to obtain a first image and a second image, wherein the light band of the first collimated light beam is the same as or different from the light band of the second collimated light beam; and the microcontroller unit of the perforation detection device using TGV glass substrate obtains at least one detection result of perforation of at least one glass substrate according to the first image and the second image.

In summary, the present invention provides an optical TGV glass substrate perforation detection device and method that does not require filling with non-destructive plastic material, which can not only reduce the detection time and cost, but also avoid damaging the glass substrate.

In order to help the examiner understand the technical features, contents and advantages of the present invention and the effects that can be achieved, the present invention is described in detail as follows with the accompanying drawings and in the form of embodiments. The drawings used therein are only for illustration and auxiliary description, and may not be the true proportions and precise configurations after the implementation of the present invention. Therefore, it should not be interpreted based on the proportions and configurations of the attached drawings to limit the scope of rights of the present invention in actual implementation.

Please refer to Figures 3 and 4, Figure 3 is a top view schematic diagram of the TGV glass substrate perforation detection device of the embodiment of the present invention detecting a glass substrate, and Figure 4 is a side view schematic diagram of the TGV glass substrate perforation detection device of the embodiment of the present invention detecting a glass substrate, wherein the cross-sectional view of the glass substrate 1 in Figure 4 is a cross-sectional view obtained by cutting along the section line BB in Figure 3. The perforation detection device for the TGV glass substrate includes a first depth of field camera 211, a first collimated light source 212, a second depth of field camera 221, a second collimated light source 222, and a microcontroller unit 23, wherein the first depth of field camera 211 and the first collimated light source 212 can be integrated into a first telecentric lens imaging module (telecentric camera) 21 for implementation, and the second depth of field camera 221 and the second collimated light source 222 can be integrated into a second telecentric lens imaging module 22 for implementation, but the present invention is not limited thereto.

The first depth-of-field camera 211 and the first collimated light source 212 are disposed on the glass substrate 1 having at least one glass substrate through-hole 12, and face the upper surface 10 of the glass substrate 1. Here, the first depth-of-field camera 211 and the first collimated light source 212 face the upper surface 10 of the glass substrate 1, which means that the extending directions of the imaging end of the first depth-of-field camera 211 and the emitting end of the first collimated light source 212 are perpendicular to the upper surface 10 of the glass substrate 1. The second depth-of-field camera 221 and the second collimated light source 222 are disposed under the glass substrate 1, and face the lower surface 11 of the glass substrate 1. Here, the second depth-of-field camera 221 and the second collimated light source 222 face the lower surface 11 of the glass substrate 1, which means that the extending directions of the imaging end of the second depth-of-field camera 221 and the emitting end of the second collimated light source 222 are perpendicular to the lower surface 11 of the glass substrate 1.

The microcontroller unit 23 is electrically connected to the first depth-of-field camera 211, the first collimated light source 212, the second depth-of-field camera 221, and the second collimated light source 222, and the first depth-of-field camera 211, the first collimated light source 212, the second depth-of-field camera 221, and the second collimated light source 222 are controlled by the microcontroller unit 23. The microcontroller unit 23 controls the first collimated light source 212 and the second collimated light source 222 to emit the first collimated light beam L1 and the second collimated light beam L2 to the glass substrate 1, respectively, wherein the light band of the first collimated light beam L1 is different from or the same as the light band of the second collimated light beam L2. The light band of the first collimated light beam L1 is different from or the same as the light band of the second collimated light beam L2, which means that the light beam color of the first collimated light beam L1 is different from or the same as the light beam color of the second collimated light beam L2. For example, each of the beam colors of the first collimated light beam L1 and the second collimated light beam L2 is selected from one of red, green, blue and white. It should be noted that the collimation of the first collimated light beam L1 and the second collimated light beam L2 is related to the depth of the glass substrate through hole 12, that is, the thickness of the glass substrate 1. The first depth of field camera 211 and the second depth of field camera 221 can be black and white or color cameras according to actual use.

After the first collimated light beam L1 and the second collimated light beam L2 irradiate the glass substrate 1, the second sensing light beam and the first sensing light beam are generated respectively to the first depth of field camera 211 and the second depth of field camera 221, so that the first depth of field camera 211 and the second depth of field camera 221 obtain the first image and the second image accordingly. Then, the microcontroller unit 23 is used to obtain at least one detection result of at least one glass substrate through hole 12 according to the first image and the second image. It is to be noted that the maximum discrimination depth of the first depth of field camera 211 and the second depth of field camera 221 is related to the depth of the glass substrate through hole 12, that is, the thickness of the glass substrate 1.

Further, referring to FIGS. 3, 4 and 7, the detection results include at least one of the upper and lower opening sizes Rt and Rb of the upper opening 121 and the lower opening 123 of the glass substrate through hole 12 (which can be used to determine whether there is an aperture abnormality), opening coordinates, opening true roundness (which can be used to determine whether there is a true roundness abnormality), crack detection results, dirt detection results, spot detection results, scratch detection results, impurity detection results and edge collapse detection results, the hole size Rm of the glass substrate through hole 12, the hole plug detection result of the glass substrate through hole 12 (which can be used to determine whether there is a hole plug abnormality) and the upper and lower opening misalignment (which can be used to determine whether there is an offset abnormality).

Please refer to FIG. 5, which is a schematic diagram of the first depth of field camera and the first collimated light source of the embodiment of the present invention implemented with the first telecentric lens imaging module. The first telecentric lens imaging module 21 includes a light receiving lens module 213, a telecentric lens module 214 and an imaging module 215. The first telecentric lens imaging module 21 is T-shaped, wherein the imaging module 215 is arranged at the top of the first telecentric lens imaging module 21, the light receiving lens module 213 is arranged at the side of the first telecentric lens imaging module 21, and the telecentric lens module 214 is arranged at the side of the first telecentric lens imaging module 21. 4 is arranged at the bottom end of the first telecentric lens imaging module 21, the light receiving lens module 213 receives the light beam L0 of the initial light source, the telecentric lens module 214 is used to emit the first collimated light beam L1 and receive the first sensing light beam L2' (generated by the second collimated light beam L2 irradiating the glass substrate 1), and the imaging module 215 is used to generate a first image according to the first sensing light beam L2'.

Furthermore, similar to FIG. 5 , the second telecentric lens imaging module 22 of FIG. 4 includes another light receiving lens module, another telecentric lens module and another imaging module. The second telecentric lens imaging module 22 has a T-shaped appearance, wherein the other imaging module is disposed at the top of the second telecentric lens imaging module 22, and the other light receiving lens module is disposed at the side of the second telecentric lens imaging module 22. , another telecentric lens module is arranged at the bottom end of the second telecentric lens imaging module 22, another light receiving lens module receives the light beam of another initial light source, another telecentric lens module is used to emit a second collimated light beam L2 and receive a second sensing light beam (generated by the first collimated light beam L1 irradiating the glass substrate 1), and another imaging module is used to generate a second image according to the second sensing light beam.

Please refer to FIG6 , which is a schematic diagram of a first image and a second image of an embodiment of the present invention, wherein the left side of FIG6 is the first image, and the right side of FIG6 is the second image. The first image presents an upper opening 121 of at least one glass substrate through hole 12 of the glass substrate 1, a through hole 122 of the waist, and an image of a portion of the upper surface 10 of the glass substrate 1 near the upper opening 121, wherein the color of the through hole is the beam color of the second collimated light beam L2, the color from the upper opening 121 to the through hole 122 is black, and the color of a portion of the upper surface 10 of the glass substrate 1 near the upper opening 121 is a mixture of the beam color of the first collimated light beam L1 and the beam color of the second collimated light beam L2.

The second image presents the image of the lower opening 123 of at least one glass substrate through hole 12 of the glass substrate 1, the through hole 122 of the waist, and the portion of the lower surface 11 of the glass substrate 1 near the lower opening 123, wherein the color of the through hole 122 is the beam color of the first collimated light beam L1, the color from the lower opening 123 to the through hole 122 is black, and the color of the portion of the lower surface 11 of the glass substrate 1 near the lower opening 123 is a mixture of the beam color of the first collimated light beam L1 and the beam color of the second collimated light beam L2.

Furthermore, the perforation detection device for TGV glass substrate further includes a main frame (not shown) and a glass substrate supporting structure (not shown). The glass substrate supporting structure is disposed in the main frame and is used to contact at least a portion (e.g., four corners, but not limited thereto) of the glass substrate 1 to support the glass substrate 1. In addition, please refer to FIGS. 8A to 8C, FIG. 8A is a three-dimensional schematic diagram of a partial structure of the perforation detection device for TGV glass substrate of an embodiment of the present invention, FIG. 8B is a front view schematic diagram of a partial structure of the perforation detection device for TGV glass substrate of an embodiment of the present invention, and FIG. 8C is a side view schematic diagram of a partial structure of the perforation detection device for TGV glass substrate of an embodiment of the present invention. In addition to the main frame (not shown) and the glass substrate supporting structure (not shown), the TGV glass substrate perforation detection device further includes a base structure 24 for supporting and fixing the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22, wherein the base structure 24 includes a common base 240 and a first base 241a and a second base 241b, and the first base 241a and the second base 241b are arranged on two opposite sides of the common base 240, and are respectively used to support and fix the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22.

In one embodiment, if the size of the glass substrate 1 is not large, the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22 can obtain the first image and the second image of the complete glass substrate 1 without moving, then the common base 240 is fixed in the main frame, the glass substrate supporting structure is also fixed in the main frame, and the glass substrate 1 will not move relative to the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22. If the size of the glass substrate 1 is too large, the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22 must be moved to obtain the first image and the second image of the complete glass substrate 1. In this case, it is necessary to design the glass substrate 1 to be able to move relative to the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22. In this case, the common base 240 can be designed to be fixed in the main frame, and the glass substrate supporting structure can be movably arranged in the main frame, or the common base 240 can be designed to be movably arranged in the main frame, and the glass substrate supporting structure can be fixed in the main frame. Furthermore, the TGV glass substrate perforation detection device further includes a transmission mechanism for connecting and moving the common base 240 or one of the glass substrate supporting structures, so that the glass substrate 1 can move relative to the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22.

In addition, each of the first base 241a and the second base 241b includes an adjustment structure, such as but not limited to an adjustment gasket, an adjustment screw, an adjustment bearing or other adjustment components. The adjustment structure of the first base 241a and the second base 241b can be used to adjust the offset of the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22, respectively. The offset can be, for example, the offset of the X-axis and the Y-axis, or it can be the offset of the X-axis, the Y-axis and the Z-axis. In short, the present invention is not limited to the implementation method of the adjustment structure. In addition, it can be seen from the above that in the present invention, when the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22 need to move relative to the glass substrate 1, the movement of the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22 relative to the glass substrate 1 is designed to be a jointly linked movement. The advantage is that once the offset is adjusted, there is no need to readjust the offset caused by the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22 due to a single movement. Therefore, the measurement accuracy can be increased, or the time and labor cost of adjusting the offset can be reduced.

Furthermore, according to the above content, the present invention also provides a TGV glass substrate perforation detection method, the TGV glass substrate perforation detection method is performed in a TGV glass substrate perforation detection device, the perforation detection device includes a first depth of field camera, a first collimated light source, a second depth of field camera and a second collimated light source, the first depth of field camera and the first collimated light source are arranged on a glass substrate having at least one glass substrate perforation and facing the upper surface of the glass substrate, the second depth of field camera and the second collimated light source are arranged under the glass substrate and facing the lower surface of the glass substrate, and the perforation detection method includes the following steps: using a T The microcontroller unit of the perforation detection device for the GV glass substrate controls the first depth of field camera, the first collimated light source, the second depth of field camera and the second collimated light source, so that the first collimated light source and the second collimated light source respectively emit a first collimated light beam and a second collimated light beam to the glass substrate, and the first depth of field camera and the second depth of field camera are respectively used to obtain a first image and a second image, wherein the beam color of the first collimated light beam is different from the beam color of the second collimated light beam; and the microcontroller unit of the perforation detection device for the TGV glass substrate obtains at least one detection result of the perforation of at least one glass substrate according to the first image and the second image. In addition, when the size of the glass substrate is relatively large, the first telecentric lens imaging module and the second telecentric lens imaging module must be moved to obtain the first image and the second image of the complete glass substrate, and the above-mentioned perforation detection method further includes: making the first depth of field camera, the first collimated light source, the second depth of field camera and the second collimated light source of the perforation detection device of the TGV glass substrate move relative to the glass substrate (that is, the first depth of field camera, the first collimated light source, the second depth of field camera and the second collimated light source move together, but the glass substrate does not move; or, the first depth of field camera, the first collimated light source, the second depth of field camera and the second collimated light source do not move, but the glass substrate moves).

Please refer to FIG. 9 , which is a side cross-sectional schematic diagram of another embodiment of the present invention of the perforation detection device for TGV glass substrates detecting a glass substrate. Different from the embodiment of FIG. 4 , in this embodiment, the perforation detection device further includes a spectroscopic prism module 25 disposed on the upper surface 10 of the glass substrate 1 and the first telecentric imaging module 21, and a third telecentric imaging module 26 located on one side (e.g., the right side) of the spectroscopic prism module 25. The third telecentric imaging module 26 includes a third depth of field camera 261 and a third collimated light source 262, but the third collimated light source 262 is disabled here, that is, it does not emit a third collimated light beam, and the third depth of field camera 261 is electrically connected to the microcontroller unit 23. The second collimated light beam L2 will penetrate the glass substrate 1 in a collimated manner, wherein the second collimated light beam penetrates the portion of the glass substrate 1 outside the through hole 122 and the upper opening 121 (if the upper opening size Rt is greater than or equal to the lower opening size Rb), or the second collimated light beam penetrates the portion of the glass substrate 1 outside the through hole 122 and the lower opening 123 (if the upper opening size Rt is smaller than the lower opening size Rb). The beam splitting prism module 25 is used to split the second collimated light beam L2 that penetrates the glass substrate 1, and is also used to split the first collimated light beam L1 that is emitted to the glass substrate 1 and the first collimated light beam L1 that is reflected by the glass substrate 1.

A portion of the second collimated light beam L2 that penetrates the glass substrate 1, a portion of the first collimated light beam L1 that is emitted toward the glass substrate 1, and a portion of the first collimated light beam L1 that is reflected by the glass substrate 1 are received by the third depth-of-field camera 261 to form a third image. Another portion of the second collimated light beam L2 that penetrates the glass substrate 1 and another portion of the first collimated light beam L1 that is reflected by the glass substrate 1 are received by the first depth-of-field camera 211 to form a first image. Therefore, compared with the first image, the brightness of the third image may be relatively large, and the color of the beam is relatively biased toward the first collimated light beam L1. Another portion of the first collimated light beam L1 that is emitted toward the glass substrate 1 partially penetrates the glass substrate 1 and is partially reflected by the glass substrate 1. Therefore, the second depth-of-field camera 221 receives the first collimated light beam L1 that penetrates the glass substrate 1 and the second collimated light beam L2 that is reflected by the glass substrate 1 to form a second image.

In this embodiment, the first image, the second image, and the third image are used to more accurately obtain the detection result of the glass substrate through hole 12. Furthermore, in this embodiment, the beam color of the first collimated light beam L1 and the beam color of the second collimated light beam L2 can be the same or different from each other. For example, each of the beam color of the first collimated light beam L1 and the beam color of the second collimated light beam L2 is selected from one of white, red, green, and blue. In addition, according to actual conditions, the first depth of field camera 211, the second depth of field camera 221, and the third depth of field camera 261 can be color or black and white cameras.

In summary, the present invention provides an optical TGV glass substrate perforation detection device and method that does not require filling with non-destructive plastic material. The items that can be detected include the opening size of the upper opening and the lower opening of the glass substrate perforation, the opening coordinates, the opening roundness, the crack detection result, the impurity detection result and the edge collapse detection result, the perforation size of the glass substrate perforation, the hole plug detection result of the glass substrate perforation and at least one of the upper and lower opening misalignment. Furthermore, the TGV glass substrate perforation detection device and method of the present invention can not only reduce the detection time and cost, but also avoid damaging the glass substrate.

The embodiments described above are only for illustrating the technical ideas and features of the present invention, and their purpose is to enable people familiar with this technology to understand the content of the present invention and implement it accordingly. They cannot be used to limit the patent scope of the present invention. In other words, all equivalent changes or modifications made according to the spirit disclosed by the present invention should still be included in the patent scope of the present invention.

1: Glass substrate 10: Upper surface 11: Lower surface 12: Glass substrate perforation 121: Upper opening 122: Perforation 123: Lower opening 21: First telecentric lens imaging module 211: First depth of field camera 212: First collimated light source 213: Light receiving lens module 214: Telecentric lens module 215: Imaging module 22: Second telecentric lens imaging module 221: Second depth of field camera 222: Second collimated light source 23: Microcontroller unit 24: Base structure 240: Common base 241a: First base 241b: Second base 25: Spectral prism module 26: Second telecentric imaging module 261: Third depth of field camera 262: Third collimated light source Rt: Upper opening diameter Rb: Lower opening diameter Rm: Perforation diameter AA, BB: Section line L0: Light beam L1: First collimated light beam L2: Second collimated light beam L2': First sensing light beam

The accompanying drawings are provided to enable those having ordinary knowledge in the technical field to which the present invention belongs to further understand the present invention, and are incorporated into and constitute a part of the specification of the present invention. The accompanying drawings show exemplary embodiments of the present invention and are used together with the specification of the present invention to explain the principles of the present invention, and are not used to limit the present invention. A brief description of the attached drawings of the present invention is as follows: Figure 1 is a schematic plan view of a glass substrate having a glass substrate perforation; Figure 2 is a schematic three-dimensional view of a side view of the cross section of Figure 1; Figure 3 is a schematic plan view of a glass substrate detected by a perforation detection device for a TGV glass substrate according to an embodiment of the present invention; Figure 4 is a schematic side cross-sectional view of a glass substrate detected by a perforation detection device for a TGV glass substrate according to an embodiment of the present invention; Figure 5 is a schematic diagram of the first depth of field camera and the first collimated light source of the embodiment of the present invention implemented by a first telecentric lens imaging module; Figure 6 is a schematic diagram of the first image and the second image of the embodiment of the present invention; Figure 7 is a diagram of the types of defects that can be detected by the perforation detection device for a TGV glass substrate according to an embodiment of the present invention; FIG8A is a three-dimensional schematic diagram of a partial structure of a perforation detection device for a TGV glass substrate according to an embodiment of the present invention; FIG8B is a front view schematic diagram of a partial structure of a perforation detection device for a TGV glass substrate according to an embodiment of the present invention; FIG8C is a side view schematic diagram of a partial structure of a perforation detection device for a TGV glass substrate according to an embodiment of the present invention; and FIG9 is a side view cross-sectional schematic diagram of a perforation detection device for a TGV glass substrate detecting a glass substrate according to another embodiment of the present invention.

1: Glass substrate

10: Upper surface

11: Lower surface

12: Perforation of glass substrate

121: Upper opening

122:Piercing

123: Lower opening

21: First telecentric lens imaging module

211: The first depth of field camera

212: First collimated light source

22: Second telecentric lens imaging module

221: Second Depth of Field Camera

222: Second collimated light source

23: Microcontroller unit

25: Spectroscopic prism module

26: Second telecentric lens imaging module

261: The third depth of field camera

262: The third collimated light source

Rt: Upper opening diameter

Rb: Bottom opening diameter

Rm: Punch diameter

L1: first collimated beam

L2: Second collimated beam

Claims (13)

A TGV glass substrate perforation detection device comprises: A first depth of field camera (211) and a first collimated light source (212), which are arranged on a glass substrate (1) having at least one glass substrate perforation (12) and facing an upper surface (10) of the glass substrate (1); A second depth of field camera (221) and a second collimated light source (222), which are arranged below the glass substrate (1) and facing a lower surface (11) of the glass substrate (1); A microcontroller unit (23), which is electrically connected to the first depth of field camera (211), the first collimated light source (212), the second depth of field camera (221) and the second collimated light source (222); and The first collimated light source (212) and the second collimated light source (222) respectively emit a first collimated light beam (L1) and a second collimated light beam (L2) to the glass substrate (1), a light band of the first collimated light beam (L1) is the same as or different from a light band of the second collimated light beam (L2), the first depth-of-field camera (211) and the second depth-of-field camera (221) are respectively used to obtain a first image and a second image, and the microcontroller unit (23) is used to obtain the at least one glass substrate penetration according to the first image and the second image. At least one detection result of the hole (12), wherein the detection result includes an opening size (Rt, Rb) of an upper opening (121) and a lower opening (123) of the glass substrate through hole (12), an opening coordinate, an opening roundness, a crack detection result, a dirt detection result, a spot detection result, a scratch detection result, an impurity detection result and a chipping detection result, a hole size (Rm) of the glass substrate through hole (12), a hole plug detection result of the glass substrate through hole (12) and at least one of an upper and lower opening misalignment amount. The perforation detection device for a TGV glass substrate as described in claim 1, wherein the first depth of field camera (211) and the first collimated light source (212) are integrated into a first telecentric imaging module (21), the first telecentric imaging module (21) comprises a light receiving lens module (213), a telecentric lens module (214) and an imaging module (215), the first telecentric imaging module (21) has a T-shaped appearance, wherein the imaging module (215) is arranged at a top of the first telecentric imaging module (21). The optical receiving lens module (213) is arranged at a side end of the first telecentric lens imaging module (21), the telecentric lens module (214) is arranged at a bottom end of the first telecentric lens imaging module (21), the optical receiving lens module (213) receives a light beam (L0) from an initial light source, the telecentric lens module (214) is used to emit the first collimated light beam (L1) and receive a first sensing light beam (L2'), and the imaging module (215) is used to generate the first image according to the first sensing light beam (L2'). The perforation detection device for a TGV glass substrate as described in claim 2, wherein the second depth-of-field camera (221) and the second collimated light source (222) are integrated into a second telecentric imaging module (22), the second telecentric imaging module (22) comprising another light receiving lens module, another telecentric lens module and another imaging module, the second telecentric imaging module (22) has a T-shaped appearance, wherein the other imaging module is arranged on the second telecentric imaging module. The other light receiving lens module is arranged at a top end of the second telecentric lens imaging module (22), the other light receiving lens module is arranged at a side end of the second telecentric lens imaging module (22), the other telecentric lens module is arranged at a bottom end of the second telecentric lens imaging module (22), the other light receiving lens module receives a light beam from another initial light source, the other telecentric lens module is used to emit the second collimated light beam (L2) and receive a second sensing light beam, and the other imaging module is used to generate the second image according to the second sensing light beam. The TGV glass substrate perforation detection device as described in claim 3 further comprises: a main frame; and a glass substrate supporting structure disposed in the main frame and used to contact at least a portion of the glass substrate (1) to support the glass substrate (1). The perforation detection device for the TGV glass substrate as described in claim 4 further comprises: A base structure (24), comprising a common base (240), a first base (241a) and a second base (241b), wherein the first base (241a) and the second base (241b) are formed on opposite sides of the common base (240) and are used to carry and fix the first telecentric lens imaging module (21) and the second telecentric lens imaging module (22), respectively, and the common base (240) is disposed in the main frame. A TGV glass substrate perforation detection device as described in claim 5, wherein the common base (240) is fixed in the main frame, and the glass substrate supporting structure is movably arranged in the main frame, so that the glass substrate (1) moves relative to the first telecentric lens imaging module (21) and the second telecentric lens imaging module (22) through the movement of the glass substrate supporting structure; or, the common base (240) is movably arranged in the main frame, and the glass substrate supporting structure is fixed in the main frame, so that the glass substrate (1) moves relative to the first telecentric lens imaging module (21) and the second telecentric lens imaging module (22) through the movement of the common base (240). The perforation detection device for a TGV glass substrate as described in claim 1, wherein a beam color of the first collimated light beam (L1) and the beam color of the second collimated light beam (L2) are each selected from one of white, red, green and blue. A TGV glass substrate perforation detection device as described in claim 1, wherein the first image presents an upper opening (121) of at least one glass substrate perforation (12) of the glass substrate (1), a perforation (122) of a waist, and a portion of the upper surface (10) of the glass substrate (1) near the upper opening (121), wherein the color of the perforation is a beam color of the second collimated light beam (L2), the color from the upper opening (121) to the perforation (122) is black, and the color of the portion of the upper surface (10) of the glass substrate (1) near the upper opening (121) is a mixture of a beam color of the first collimated light beam (L1) and the beam color of the second collimated light beam (L2). A TGV glass substrate perforation detection device as described in claim 1, wherein the second image presents an image of a lower opening (123) of at least one glass substrate perforation (12) of the glass substrate (1), a perforation (122) of a waist, and a portion of the lower surface (11) of the glass substrate (1) near the lower opening (123), wherein the color of the perforation (122) is a beam color of the first collimated light beam (L1), the color from the lower opening (123) to the perforation (122) is black, and the color of the portion of the lower surface (11) of the glass substrate (1) near the lower opening (123) is a mixture of the beam color of the first collimated light beam (L1) and a beam color of the second collimated light beam (L2). A TGV glass substrate perforation detection method is implemented in a TGV glass substrate perforation detection device. The perforation detection device comprises a first depth of field camera (211), a first collimated light source (212), a second depth of field camera (221) and a second collimated light source (222). The first depth of field camera (211) and the first collimated light source (212) are arranged on a glass substrate (1) having at least one glass substrate perforation (12) and facing an upper surface (10) of the glass substrate (1). The second depth of field camera (221) and the second collimated light source (222) are arranged below the glass substrate (1) and facing a lower surface (11) of the glass substrate (1). The perforation detection method comprises: A microcontroller unit (23) of the TGV glass substrate perforation detection device is used to control the first depth-of-field camera (211), the first collimated light source (212), the second depth-of-field camera (221) and the second collimated light source (222), so that the first collimated light source (212) and the second collimated light source (222) respectively emit a first collimated light beam (L1) and a second collimated light beam (L2) to the glass substrate (1), and the first depth-of-field camera (211) and the second depth-of-field camera (221) are respectively used to obtain a first image and a second image, wherein a light band of the first collimated light beam (L1) is the same as or different from a light band of the second collimated light beam (L2); and The microcontroller unit (23) of the TGV glass substrate perforation detection device obtains at least one detection result of the at least one glass substrate perforation (12) according to the first image and the second image, wherein the detection result includes an opening size (Rt, Rb) of an upper opening (121) and a lower opening (123) of the glass substrate perforation (12), an opening coordinate, an opening roundness, a crack detection result, a dirt detection result, a spot detection result, a scratch detection result, an impurity detection result, a chipping detection result, a perforation size (Rm) of the glass substrate perforation (12), a hole plug detection result of the glass substrate perforation (12), and at least one of an upper and lower opening misalignment amount. A method for detecting a perforation of a TGV glass substrate as described in claim 10, wherein each of a beam color of the first collimated light beam (L1) and a beam color of the second collimated light beam (L2) is selected from one of red, green, blue and white. A method for detecting perforations of a TGV glass substrate as described in claim 10, wherein the first image presents an upper opening (121) of at least one glass substrate perforation (12) of the glass substrate (1), a perforation (122) of a waist, and an image of a portion of the upper surface (10) of the glass substrate (1) near the upper opening (121), wherein the color of the perforation is a beam color of the second collimated light beam (L2), the color from the upper opening (121) to the perforation (122) is black, and the color of the portion of the upper surface (10) of the glass substrate (1) near the upper opening (121) is a mixture of a beam color of the first collimated light beam (L1) and the beam color of the second collimated light beam (L2). A method for detecting perforations of a TGV glass substrate as described in claim 10, wherein the second image presents an image of a lower opening (123) of at least one glass substrate perforation (12) of the glass substrate (1), a perforation (122) of a waist, and a portion of the lower surface (11) of the glass substrate (1) near the lower opening (123), wherein the color of the perforation (122) is a beam color of the first collimated light beam (L1), the color from the lower opening (123) to the perforation (122) is black, and the color of the portion of the lower surface (11) of the glass substrate (1) near the lower opening (123) is a mixture of the beam color of the first collimated light beam (L1) and a beam color of the second collimated light beam (L2).