TWI892551B - Via detection device and method for tgv (through glass via) substrate - Google Patents

Abstract

A TGV glass substrate perforation detection device comprises a first depth-of-field camera and a first collimated light source disposed above the glass substrate, facing the upper surface of the glass substrate. A second depth-of-field camera and a second collimated light source disposed below the glass substrate, facing the lower surface of the glass substrate. The first collimated light source and the second collimated light source respectively emit a first collimated light beam and a second collimated light beam toward the glass substrate. The first collimated light beam has a different wavelength than the second collimated light beam. The first depth-of-field camera and the second depth-of-field camera are respectively used to capture a first image and a second image. A microcontroller unit of the TGV glass substrate perforation detection device is used to obtain at least one detection result of at least one perforation in the glass substrate based on the first and second images.

Description

TGV glass substrate perforation detection device and method

A TGV (Through Glass Via) glass substrate perforation detection device and method, particularly a TGV glass substrate perforation detection device and method that uses two depth-of-field cameras and two collimated light sources located above and below the glass substrate to obtain glass substrate perforation detection results.

Previous two-dimensional (2D) chip packaging technology can no longer meet current demands for chip speed, performance, and thinness. Therefore, two-and-a-half-dimensional (2.5D) and three-dimensional (3D) chip packaging technologies have been proposed. Both 2.5D and 3D chip packaging technologies require the use of an interposer with perforations to electrically connect different chips. Traditionally, silicon substrates with through-silicon vias (TSVs) (Note: Silicon substrates with TSVs are also called TSV silicon substrates) have been used as interposers. However, silicon is a Group IV-A semiconductor material, so surrounding carriers can move freely under the influence of electric or magnetic fields, affecting nearby circuits or signals, potentially severely impacting chip performance. However, glass materials do not have freely moving charges, have excellent dielectric properties, and have a coefficient of thermal expansion (CTE) close to that of silicon. Therefore, glass substrates with through-glass vias (TGVs) (Note: glass substrates with TGVs are also called TGV glass substrates) have been proposed to replace silicon substrates as interposers.

The manufacturing method for a glass substrate having glass substrate through-holes is to first modify the glass substrate by irradiating it with a laser at a predetermined location where the glass substrate through-holes are to be formed, and then using immersion etching to form the glass substrate through-holes at the predetermined location. Referring to Figures 1 and 2, Figure 1 is a schematic plan view of the glass substrate having glass substrate through-holes from above, and Figure 2 is a schematic perspective view of the cross-section of Figure 1 from the side, wherein the cross-section of Figure 2 is a cross-section taken along section line AA of Figure 1. The glass substrate 1 has a plurality of glass substrate through-holes 12 extending through the upper surface 10 and lower surface 12 of the glass substrate 1. Each glass substrate through-hole 12 has an upper opening 121 on the upper surface 10 and a lower opening 123 on the lower surface 11, and a waistline between the upper surface 10 and the lower surface 11, with the waistline forming a through-hole 122. The upper opening 121 and the lower opening 123 have opening sizes Rt and Rb respectively, and the waist through hole 122 forms a through hole size Rm.

Parameters such as the opening dimensions Rt, Rb, and the perforation dimension Rm must be inspected to assess whether the glass substrate 1 meets the requirements. One existing approach is to use X-rays for inspection, but X-ray inspection is too slow (even slower than inspection with a microscope) and is not cost-effective. Another existing approach is to use a microscope for inspection, but this is still very time-consuming and difficult to achieve cost-effectiveness. Another existing approach is to first fill the glass substrate through-hole 12 with a non-destructive plastic material and then remove the non-destructive plastic material to measure the aforementioned information. However, this approach requires filling the glass substrate through-hole 12 with the non-destructive plastic material, which not only increases cost and testing time, but also may cause the non-destructive plastic material to remain in the glass substrate through-hole 12. Therefore, there is a need for a novel glass substrate through-hole detection technology that can avoid the aforementioned technical issues.

In accordance with any of the aforementioned objectives, the present invention provides a device for detecting perforations in TGV glass substrates. The device comprises a first depth-of-field camera, a first collimated light source, a second depth-of-field camera, a second collimated light source, and a microcontroller unit. The first depth-of-field camera and the first collimated light source are disposed on a glass substrate having at least one perforation in the glass substrate and face the upper surface of the glass substrate. The second depth-of-field camera and the second collimated light source are disposed below the glass substrate and face the lower surface of the glass substrate. The microcontroller unit is electrically connected to the first depth-of-field camera, the first collimated light source, the second depth-of-field camera, and the second collimated light source. A first collimated light source and a second collimated light source emit a first collimated light beam and a second collimated light beam, respectively, toward a glass substrate. The first collimated light beam has a different wavelength than the second collimated light beam. A first depth-of-field camera and a second depth-of-field camera are used to capture a first image and a second image, respectively. A microcontroller unit is used to obtain at least one detection result of a perforation in at least one glass substrate based on the first image and the second image.

Based on the above-mentioned purpose, the present invention further provides a method for detecting a hole in a TGV glass substrate. The method is performed in a TGV glass substrate perforation detection device. The TGV glass substrate perforation detection device includes a first depth-of-field camera, a first collimated light source, a second depth-of-field camera, and a second collimated light source. The first depth-of-field camera and the first collimated light source are disposed on a glass substrate having at least one glass substrate perforation and facing the upper surface of the glass substrate. The second depth-of-field camera and the second collimated light source are disposed below the glass substrate and facing the lower surface of the glass substrate. The method includes the following steps: A microcontroller unit of a TGV glass substrate perforation detection device controls a first depth-of-field camera, a first collimated light source, a second depth-of-field camera, and a second collimated light source, such that the first collimated light source and the second collimated light source respectively emit a first collimated light beam and a second collimated light beam toward the glass substrate, and the first depth-of-field camera and the second depth-of-field camera respectively acquire a first image and a second image, wherein the first collimated light beam has a different wavelength than the second collimated light beam. The microcontroller unit of the TGV glass substrate perforation detection device obtains at least one detection result of a perforation in at least one glass substrate based on the first image and the second image.

In summary, the present invention provides an optical device and method for detecting perforations in TGV glass substrates that does not require filling with a non-destructive plastic material. This device and method not only reduces detection time and cost, but also avoids damaging the glass substrate.

To help the examiner understand the technical features, content, advantages, and achievable effects of the present invention, the present invention is described below in detail with accompanying drawings and in the form of embodiments. The drawings used herein are for illustrative purposes only and to assist in the description, and may not reflect the actual proportions and precise configurations of the present invention after implementation. Therefore, the proportions and configurations of the attached drawings should not be interpreted to limit the scope of the present invention in actual implementation.

Please refer to Figures 3 and 4. Figure 3 is a top plan view schematic diagram of the TGV glass substrate perforation detection device detecting a glass substrate according to an embodiment of the present invention, and Figure 4 is a side cross-sectional schematic diagram of the TGV glass substrate perforation detection device detecting a glass substrate according to an embodiment of the present invention. The cross-sectional view of the glass substrate 1 in Figure 4 is a cross-sectional view obtained by cutting along the section line BB in Figure 3. The TGV glass substrate perforation detection device includes a first depth-of-field camera 211, a first collimated light source 212, a second depth-of-field camera 221, a second collimated light source 222, and a microcontroller unit 23. The first depth-of-field camera 211 and the first collimated light source 212 can be integrated into a first telecentric camera 21, and the second depth-of-field camera 221 and the second collimated light source 222 can be integrated into a second telecentric camera 22. However, the present invention is not limited to this.

A first depth-of-field camera 211 and a first collimated light source 212 are disposed on a glass substrate 1 having at least one glass substrate through-hole 12, and face the upper surface 10 of the glass substrate 1. Here, "the first depth-of-field camera 211 and the first collimated light source 212 face the upper surface 10 of the glass substrate 1" means that the imaging end of the first depth-of-field camera 211 and the emission end of the first collimated light source 212 extend perpendicularly to the upper surface 10 of the glass substrate 1. A second depth-of-field camera 221 and a second collimated light source 222 are disposed below the glass substrate 1 and face the lower surface 11 of the glass substrate 1. Here, "the second depth-of-field camera 221 and the second collimated light source 222 face the lower surface 11 of the glass substrate 1" means that the imaging end of the second depth-of-field camera 221 and the emission end of the second collimated light source 222 extend perpendicularly to the lower surface 11 of the glass substrate 1.

The microcontroller unit 23 is electrically connected to the first depth-of-field camera 211, the first collimated light source 212, the second depth-of-field camera 221, and the second collimated light source 222. The microcontroller unit 23 controls the first collimated light source 212 and the second collimated light source 222 to emit a first collimated light beam L1 and a second collimated light beam L2, respectively, toward the glass substrate 1. The wavelength range of the first collimated light beam L1 is different from the wavelength range of the second collimated light beam L2. This difference in wavelength also means that the beam color of the first collimated light beam L1 is different from the beam color of the second collimated light beam L2. For example, the beam colors of the first collimated light beam L1 and the second collimated light beam L2 are selected from red, green, and blue. It should be noted that the collimation of the first collimated light beam L1 and the second collimated light beam L2 is related to the depth of the through hole 12 in the glass substrate, that is, the thickness of the glass substrate 1 .

After the first collimated beam L1 and the second collimated beam L2 illuminate the glass substrate 1, they generate a second sensing beam and a first sensing beam, respectively, for the first depth-of-field camera 211 and the second depth-of-field camera 221. These cameras then capture a first image and a second image. The microcontroller unit 23 then obtains at least one detection result of at least one glass substrate through-hole 12 based on the first and second images. It should be noted that the maximum detection depth of the first and second depth-of-field cameras 211 and 221 is related to the depth of the glass substrate through-hole 12, i.e., the thickness of the glass substrate 1.

3, 4, and 7, the inspection results include at least one of the upper and lower opening dimensions Rt and Rb of the upper opening 121 and the lower opening 123 of the glass substrate through-hole 12 (which can be used to determine whether there is an aperture abnormality), the opening coordinates, the true roundness of the opening (which can be used to determine whether there is a true roundness abnormality), the crack inspection results, the dirt inspection results, the spot inspection results, the scratch inspection results, the impurity inspection results, the chipping inspection results, the hole dimension Rm of the glass substrate through-hole 12, the hole plug inspection results of the glass substrate through-hole 12 (which can be used to determine whether there is a hole plug abnormality), and the upper and lower opening misalignment (which can be used to determine whether there is an offset abnormality).

Please refer to FIG5, which is a schematic diagram of the first depth of field camera and the first collimated light source of the embodiment of the present invention implemented with the first telecentric lens imaging module. The first telecentric lens imaging module 21 includes a light receiving lens module 213, a telecentric lens module 214 and an imaging module 215. The first telecentric lens imaging module 21 has a T-shaped appearance, wherein the imaging module 215 is arranged at the top of the first telecentric lens imaging module 21, the light receiving lens module 213 is arranged at the side of the first telecentric lens imaging module 21, and the telecentric lens module 21 is arranged at the side of the first telecentric lens imaging module 21. Disposed at the bottom end of the first telecentric lens imaging module 21, the light receiving lens module 213 receives the light beam L0 of the initial light source, the telecentric lens module 214 is used to emit the first collimated light beam L1 and receive the first sensing light beam L2' (generated by the second collimated light beam L2 irradiating the glass substrate 1), and the imaging module 215 is used to generate a first image based on the first sensing light beam L2'.

Furthermore, similar to FIG5, the second telecentric lens imaging module 22 of FIG4 includes another light receiving lens module, another telecentric lens module and another imaging module. The second telecentric lens imaging module 22 has a T-shaped appearance, wherein the other imaging module is arranged at the top of the second telecentric lens imaging module 22, and the other light receiving lens module is arranged at the side of the second telecentric lens imaging module 22. , another telecentric lens module is arranged at the bottom end of the second telecentric lens imaging module 22, another light receiving lens module receives the light beam of another initial light source, another telecentric lens module is used to emit a second collimated light beam L2 and receive a second sensing light beam (generated by the first collimated light beam L1 irradiating the glass substrate 1), and another imaging module is used to generate a second image according to the second sensing light beam.

Please refer to Figure 6, which is a schematic diagram of a first image and a second image according to an embodiment of the present invention. The first image is shown on the left side of Figure 6, and the second image is shown on the right side of Figure 6. The first image shows an upper opening 121 of at least one glass substrate through-hole 12 of the glass substrate 1, a through-hole 122 in the waist, and a portion of the upper surface 10 of the glass substrate 1 near the upper opening 121. The through-holes are colored by the second collimated light beam L2, the area from the upper opening 121 to the through-hole 122 is black, and the portion of the upper surface 10 of the glass substrate 1 near the upper opening 121 is a mixture of the beam colors of the first collimated light beam L1 and the second collimated light beam L2.

The second image presents images of the lower opening 123 of at least one glass substrate through-hole 12 of the glass substrate 1, the through-hole 122 in the waist, and a portion of the lower surface 11 of the glass substrate 1 near the lower opening 123. The color of the through-hole 122 is the beam color of the first collimated light beam L1, the color from the lower opening 123 to the through-hole 122 is black, and the color of the portion of the lower surface 11 of the glass substrate 1 near the lower opening 123 is a mixture of the beam colors of the first collimated light beam L1 and the beam colors of the second collimated light beam L2.

Furthermore, the TGV glass substrate perforation detection device further includes a main frame (not shown) and a glass substrate supporting structure (not shown). The glass substrate supporting structure is disposed within the main frame and is configured to contact at least a portion (e.g., but not limited to, the four corners) of the glass substrate 1 to support the glass substrate 1. In addition, please refer to Figures 8A to 8C. Figure 8A is a perspective schematic diagram of a portion of the structure of the TGV glass substrate perforation detection device according to an embodiment of the present invention, Figure 8B is a front view schematic diagram of a portion of the structure of the TGV glass substrate perforation detection device according to an embodiment of the present invention, and Figure 8C is a side view schematic diagram of a portion of the structure of the TGV glass substrate perforation detection device according to an embodiment of the present invention. In addition to the main frame (not shown) and the glass substrate support structure (not shown), the TGV glass substrate perforation detection device further includes a base structure 24 for supporting and securing the first telecentric imaging module 21 and the second telecentric imaging module 22. The base structure 24 includes a common base 240, a first base 241a, and a second base 241b. The first base 241a and the second base 241b are disposed on opposite sides of the common base 240 and are used to support and secure the first telecentric imaging module 21 and the second telecentric imaging module 22, respectively.

In one embodiment, if the glass substrate 1 is not large in size, the first telecentric imaging module 21 and the second telecentric imaging module 22 can obtain the first image and the second image of the entire glass substrate 1 without moving. In this case, the common base 240 is fixed in the main frame, the glass substrate supporting structure is also fixed in the main frame, and the glass substrate 1 will not move relative to the first telecentric imaging module 21 and the second telecentric imaging module 22. If the size of the glass substrate 1 is too large, the first telecentric imaging module 21 and the second telecentric imaging module 22 must be moved to obtain the first image and the second image of the complete glass substrate 1. In this case, it is necessary to design the glass substrate 1 to be able to move relative to the first telecentric imaging module 21 and the second telecentric imaging module 22. In this case, the common base 240 can be designed to be fixed in the main frame, and the glass substrate supporting structure can be movably arranged in the main frame, or the common base 240 can be designed to be movably arranged in the main frame, and the glass substrate supporting structure can be fixed in the main frame. Furthermore, the TGV glass substrate perforation detection device further includes a transmission mechanism for connecting and moving the common base 240 or one of the glass substrate supporting structures, so that the glass substrate 1 can move relative to the first telecentric imaging module 21 and the second telecentric imaging module 22.

In addition, each of the first base 241a and the second base 241b includes an adjustment structure, such as but not limited to an adjustment gasket, an adjustment screw, an adjustment bearing or other adjustment components. The adjustment structure of the first base 241a and the second base 241b can be used to adjust the offset of the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22, respectively. The offset can be, for example, an offset between the X-axis and the Y-axis, or an offset between the X-axis, the Y-axis and the Z-axis. In short, the present invention is not limited by the implementation method of the adjustment structure. In addition, as can be seen from the above, in the present invention, when the first telecentric imaging module 21 and the second telecentric imaging module 22 need to move relative to the glass substrate 1, the movement of the first telecentric imaging module 21 and the second telecentric imaging module 22 relative to the glass substrate 1 is designed to be a jointly linked movement. The advantage is that once the offset is adjusted, there is no need to readjust the offset caused by the first telecentric imaging module 21 and the second telecentric imaging module 22 due to individual movement. Therefore, the measurement accuracy can be increased, or the time and labor cost of adjusting the offset can be reduced.

Furthermore, according to the above content, the present invention also provides a method for detecting a perforation of a TGV glass substrate. The method for detecting a perforation of a TGV glass substrate is performed in a perforation detection device for a TGV glass substrate. The perforation detection device includes a first depth-of-field camera, a first collimated light source, a second depth-of-field camera, and a second collimated light source. The first depth-of-field camera and the first collimated light source are disposed on a glass substrate having at least one perforation in the glass substrate and facing the upper surface of the glass substrate. The second depth-of-field camera and the second collimated light source are disposed below the glass substrate and facing the lower surface of the glass substrate. The method for detecting a perforation of a TGV glass substrate includes the following steps: using a T The microcontroller unit of the GV glass substrate perforation detection device controls a first depth-of-field camera, a first collimated light source, a second depth-of-field camera, and a second collimated light source, so that the first collimated light source and the second collimated light source respectively emit a first collimated light beam and a second collimated light beam toward the glass substrate, and the first depth-of-field camera and the second depth-of-field camera are used to obtain a first image and a second image, respectively, wherein the beam color of the first collimated light beam is different from the beam color of the second collimated light beam. The microcontroller unit of the TGV glass substrate perforation detection device obtains at least one detection result of a perforation in at least one glass substrate based on the first image and the second image. Furthermore, when the glass substrate is relatively large and the first telecentric lens imaging module and the second telecentric lens imaging module must be moved to capture the first and second images of the entire glass substrate, the above-mentioned perforation detection method further includes causing the first depth-of-field camera, the first collimated light source, the second depth-of-field camera, and the second collimated light source of the TGV glass substrate perforation detection device to move relative to the glass substrate (i.e., the first depth-of-field camera, the first collimated light source, the second depth-of-field camera, and the second collimated light source move together, but the glass substrate does not move; alternatively, the first depth-of-field camera, the first collimated light source, the second depth-of-field camera, and the second collimated light source do not move, but the glass substrate moves).

In summary, the present invention provides an optical device and method for detecting perforations in TGV glass substrates that does not require filling with a non-destructive plastic material. These devices can detect the opening dimensions, opening coordinates, roundness, crack detection, impurity detection, and chipping detection of the upper and lower openings of the glass substrate, as well as at least one of the perforation dimensions, hole plug detection, and upper and lower opening misalignment. Furthermore, the device and method for detecting perforations in TGV glass substrates of the present invention not only reduces detection time and costs, but also avoids damage to the glass substrate.

The embodiments described above are merely illustrative of the technical concepts and features of the present invention. Their purpose is to enable those skilled in the art to understand the contents of the present invention and implement them accordingly. They are not intended to limit the patent scope of the present invention. In other words, any equivalent changes or modifications made in accordance with the spirit disclosed in the present invention should still be included in the patent scope of the present invention.

1: Glass substrate 10: Upper surface 11: Lower surface 12: Glass substrate perforation 121: Upper opening 122: Perforation 123: Lower opening 21: First telecentric imaging module 211: First depth-of-field camera 212: First collimated light source 213: Light receiving lens module 214: Telecentric lens module 215: Imaging module 22: Second telecentric imaging module 221: Second depth-of-field camera 222: Second collimated light source 23: Microcontroller unit 24: Base structure 240: Common base 241a: First base 241b: Second base Rt: Upper opening diameter Rb: Lower opening diameter Rm: Perforation diameter AA, BB: Section lines L0: Light beam L1: First collimated beam L2: Second collimated beam L2': First sensing beam

The accompanying drawings are provided to enable a person having ordinary knowledge in the technical field to which the present invention belongs to further understand the present invention, and are incorporated into and constitute a part of the description of the present invention. The accompanying drawings illustrate exemplary embodiments of the present invention and are used together with the description of the present invention to explain the principles of the present invention, and are not used to limit the present invention. A brief description of the accompanying drawings of the present invention is as follows: Figure 1 is a schematic plan view of a glass substrate having a perforation in the glass substrate from above; Figure 2 is a schematic perspective view of the cross-section of Figure 1 from a side view; Figure 3 is a schematic plan view of a glass substrate being inspected by a TGV glass substrate perforation detection device according to an embodiment of the present invention from above; Figure 4 is a schematic side cross-sectional view of a glass substrate being inspected by a TGV glass substrate perforation detection device according to an embodiment of the present invention; Figure 5 is a schematic diagram of a first depth of field camera and a first collimated light source implemented with a first telecentric lens imaging module according to an embodiment of the present invention; Figure 6 is a schematic diagram of a first image and a second image according to an embodiment of the present invention; Figure 7 illustrates the types of defects that can be detected by the TGV glass substrate perforation detection device according to an embodiment of the present invention; Figure 8A is a schematic perspective view of a portion of the structure of a TGV glass substrate perforation detection device according to an embodiment of the present invention; Figure 8B is a schematic front view of a portion of the structure of a TGV glass substrate perforation detection device according to an embodiment of the present invention; and Figure 8C is a schematic side view of a portion of the structure of a TGV glass substrate perforation detection device according to an embodiment of the present invention.

1: Glass substrate

10: Top surface

11: Lower surface

12: Glass substrate perforation

121:Open the top

122: Perforation

123: Lower opening

21: First telecentric imaging module

211: First Depth of Field Camera

212: First collimated light source

22: Second telecentric lens imaging module

221: Second Depth of Field Camera

222: Second collimated light source

23: Microcontroller unit

Rt: Upper opening diameter

Rb: Bottom opening diameter

Rm: Punch diameter

L1: First collimated beam

L2: Second collimated beam

Claims (13)

A TGV A glass substrate perforation detection device comprises: a first depth-of-field camera (211) and a first collimated light source (212), which are arranged on a glass substrate (1) having at least one glass substrate perforation (12) and facing an upper surface (10) of the glass substrate (1); a second depth-of-field camera (221) and a second collimated light source (222), which are arranged below the glass substrate (1) and facing a lower surface (11) of the glass substrate (1); and a microcontroller unit (23), which is electrically connected to the first depth-of-field camera (211), the first collimated light source (212), the second depth-of-field camera (221) and the second collimated light source (222); wherein the first collimated light source (212) and the second collimated light source (222) respectively emit a first collimated light beam (L1) and a second collimated light beam (L2) to the glass substrate (1), the first collimated light beam The optical band of the first collimated light beam (L1) is different from the optical band of the second collimated light beam (L2), the first depth-of-field camera (211) and the second depth-of-field camera (221) are used to obtain a first image and a second image respectively, and the microcontroller unit (23) is used to obtain at least one detection result of the at least one glass substrate through-hole (12) according to the first image and the second image; wherein the detection result includes an upper portion of the glass substrate through-hole (12) An opening size (Rt, Rb) of the opening (121) and the lower opening (123), an opening coordinate, an opening true roundness, a crack detection result, a dirt detection result, a spot damage detection result, a scratch detection result, an impurity detection result and a chipping detection result, a hole size (Rm) of the glass substrate through hole (12), a hole plug detection result of the glass substrate through hole (12) and at least one of an upper and lower opening misalignment amount. The perforation detection device for TGV glass substrate as claimed in claim 1, wherein the first depth of field camera (211) and the first collimated light source (212) are integrated into a first telecentric lens imaging module (21), the first telecentric lens imaging module (21) includes a light receiving lens module (213), a telecentric lens module (214) and an imaging module (215), and the appearance of the first telecentric lens imaging module (21) is a T The invention relates to a telecentric lens module (215) for imaging a first telecentric lens. The imaging module (215) is arranged at a top end of the first telecentric lens imaging module (21), the light receiving lens module (213) is arranged at a side end of the first telecentric lens imaging module (21), the telecentric lens module (214) is arranged at a bottom end of the first telecentric lens imaging module (21), the light receiving lens module (213) receives a light beam (L0) from an initial light source, the telecentric lens module (214) is used to emit the first collimated light beam (L1) and receive a first sensing light beam (L2'), and the imaging module (215) is used to generate the first image according to the first sensing light beam (L2'). The perforation detection device for TGV glass substrate as described in claim 2, wherein the second depth of field camera (221) and the second collimated light source (222) are integrated into a second telecentric lens imaging module (22), the second telecentric lens imaging module (22) includes another light receiving lens module, another telecentric lens module and another imaging module, and the appearance of the second telecentric lens imaging module (22) is a T The invention relates to a character shape, wherein the other imaging module is arranged at a top end of the second telecentric lens imaging module (22), the other light receiving lens module is arranged at a side end of the second telecentric lens imaging module (22), the other telecentric lens module is arranged at a bottom end of the second telecentric lens imaging module (22), the other light receiving lens module receives a light beam from another initial light source, the other telecentric lens module is used to emit the second collimated light beam (L2) and receive a second sensing light beam, and the other imaging module is used to generate the second image according to the second sensing light beam. The TGV glass substrate perforation detection device as described in claim 3 further includes: a main frame; and a glass substrate supporting structure disposed in the main frame for contacting at least a portion of the glass substrate (1) to support the glass substrate (1). The perforation detection device for the TGV glass substrate as described in claim 4 further includes: a base structure (24), including a common base (240), a first base (241a) and a second base (241b), wherein the first base (241a) and the second base (241b) are formed on opposite sides of the common base (240) and are respectively used to support and fix the first telecentric lens imaging module (21) and the second telecentric lens imaging module (22), and the common base (240) is arranged in the main frame. A perforation detection device for a TGV glass substrate as described in claim 5, wherein the common base (240) is fixed in the main frame, and the glass substrate supporting structure is movably arranged in the main frame, so that the glass substrate (1) moves relative to the first telecentric mirror imaging module (21) and the second telecentric mirror imaging module (22) through the movement of the glass substrate supporting structure; or, the common base (240) is movably arranged in the main frame, and the glass substrate supporting structure is fixed in the main frame, so that the glass substrate (1) moves relative to the first telecentric mirror imaging module (21) and the second telecentric mirror imaging module (22) through the movement of the common base (240). The TGV glass substrate perforation detection device as described in claim 1, wherein a beam color of the first collimated light beam (L1) and the beam color of the second collimated light beam (L2) are selected from red, green and blue. A TGV glass substrate perforation detection device as described in claim 1, wherein the first image presents an upper opening (121) of at least one glass substrate perforation (12) of the glass substrate (1), a perforation (122) in a waist, and an image of a portion of the upper surface (10) of the glass substrate (1) near the upper opening (121), wherein the color of the perforation is a beam color of the second collimated light beam (L2), the color from the upper opening (121) to the perforation (122) is black, and the color of the portion of the upper surface (10) of the glass substrate (1) near the upper opening (121) is a mixture of a beam color of the first collimated light beam (L1) and the beam color of the second collimated light beam (L2). A TGV glass substrate perforation detection device as described in claim 1, wherein the second image presents an image of a lower opening (123) of at least one glass substrate perforation (12) of the glass substrate (1), a perforation (122) on a waist, and a portion of the lower surface (11) of the glass substrate (1) near the lower opening (123), wherein the color of the perforation (122) is a beam color of the first collimated light beam (L1), the color from the lower opening (123) to the perforation (122) is black, and the color of the portion of the lower surface (11) of the glass substrate (1) near the lower opening (123) is a mixture of the beam color of the first collimated light beam (L1) and a beam color of the second collimated light beam (L2). A TGV glass substrate perforation detection method is implemented in a TGV glass substrate perforation detection device. The perforation detection device comprises a first depth-of-field camera (211), a first collimated light source (212), a second depth-of-field camera (221) and a second collimated light source (222). The first depth-of-field camera (211) and the first collimated light source (212) are arranged on a glass substrate (1) having at least one glass substrate perforation (12) and facing an upper surface (10) of the glass substrate (1). The second depth-of-field camera (221) and the second collimated light source (222) are arranged below the glass substrate (1) and facing a lower surface (11) of the glass substrate (1). The perforation detection method comprises: using the TGV A microcontroller unit (23) of a glass substrate perforation detection device controls the first depth-of-field camera (211), the first collimated light source (212), the second depth-of-field camera (221), and the second collimated light source (222), so that the first collimated light source (212) and the second collimated light source (222) respectively emit a first collimated light beam (L1) and a second collimated light beam (L2) to the glass substrate (1), and the first depth-of-field camera (211) and the second depth-of-field camera (221) are used to obtain a first image and a second image, respectively, wherein a light band of the first collimated light beam (L1) is different from a light band of the second collimated light beam (L2); and the TGV is used to detect the perforation of the glass substrate. The microcontroller unit (23) of the glass substrate perforation detection device obtains at least one detection result of the at least one glass substrate perforation (12) according to the first image and the second image; wherein the detection result includes an opening size (Rt, Rb) of an upper opening (121) and a lower opening (123) of the glass substrate perforation (12), an opening coordinate, an opening true roundness, a crack detection result, a dirt detection result, a spot detection result, a scratch detection result, an impurity detection result and a chipping detection result, a perforation size (Rm) of the glass substrate perforation (12), a hole plug detection result of the glass substrate perforation (12) and at least one of an upper and lower opening misalignment amount. The method for detecting a perforation of a TGV glass substrate as claimed in claim 10, wherein a beam color of the first collimated light beam (L1) and a beam color of the second collimated light beam (L2) are selected from red, green and blue. A method for detecting perforations of a TGV glass substrate as described in claim 10, wherein the first image presents an upper opening (121) of at least one glass substrate perforation (12) of the glass substrate (1), a perforation (122) in a waist, and an image of a portion of the upper surface (10) of the glass substrate (1) near the upper opening (121), wherein the color of the perforation is a beam color of the second collimated light beam (L2), the color from the upper opening (121) to the perforation (122) is black, and the color of the portion of the upper surface (10) of the glass substrate (1) near the upper opening (121) is a mixture of a beam color of the first collimated light beam (L1) and the beam color of the second collimated light beam (L2). A method for detecting a perforation of a TGV glass substrate as described in claim 10, wherein the second image presents an image of a lower opening (123) of at least one glass substrate perforation (12) of the glass substrate (1), a perforation (122) on a waist, and a portion of the lower surface (11) of the glass substrate (1) near the lower opening (123), wherein the color of the perforation (122) is a beam color of the first collimated light beam (L1), the color from the lower opening (123) to the perforation (122) is black, and the color of the portion of the lower surface (11) of the glass substrate (1) near the lower opening (123) is a mixture of the beam color of the first collimated light beam (L1) and a beam color of the second collimated light beam (L2).