TWI880506B - A method of positioning on a medium, device for soldering an electronic componentcomputer readable rerording medium with stored program - Google Patents

Abstract

A method of positioning on a media object, which includes determining a first-level selection area on a media object with multiple positioning points, selecting two positioning points among the positioning points, calculating the average position of each positioning point, and randomly selecting another positioning point whose actual position is confirmed. A difference value is obtained by comparing the average position and the actual position of the positioning point. When the difference value = 1, giving a confirmation signal. If the difference value = 0, determining a secondary selected area within the first-level selected area. The secondary selected area includes part of positioning points within the first-level selection area. Repeat the above steps within the secondary selected area. If the difference value = 0, continuing to determine the next step within the secondary selected area. A device configured to bond an electronic component, a computer program, and a computer readable storage medium storing a program inside are also provided.

Description

Method for positioning on a medium, device for soldering an electronic component, computer-readable recording medium storing a program

The present invention relates to a positioning method, a welding device, a computer program and a computer-readable recording medium, and in particular to a positioning method on a medium, a device for welding an electronic component, a computer program and a computer-readable recording medium storing the program.

In the manufacturing process of electronic products, there are often related electronic component welding steps. For example, in the manufacturing process of LED display panels, the LED is often placed on the thin film transistor array substrate by a pick-and-place device, and then the LED on the thin film transistor array substrate is fixed and electrically connected to the thin film transistor array substrate. However, in the above process, if the position of the LED on the thin film transistor array substrate is not accurate, it may cause the LED to be unable to be electrically connected to the thin film transistor array substrate, resulting in a decrease in productivity (throughput).

The present invention provides a method for positioning on a medium, which can accurately determine the position of the positioning point on the medium.

The present invention provides a device for soldering an electronic component, which can improve the accuracy of soldering the electronic component on the carrier.

The present invention provides a computer program that can accurately determine the position of a positioning point on a medium after being loaded and executed by a computer.

The present invention provides a computer-readable recording medium with a stored program. After the program is loaded and executed by the computer, the location of the positioning point on the medium can be accurately determined.

An embodiment of the present invention provides a method for positioning on a medium, wherein the medium has a plurality of positioning points, the method comprising: (a) determining a first-level selected area on the medium, wherein the first-level selected area includes at least a portion of the above-mentioned positioning points; (b) selecting at least two positioning points from the positioning points in the first-level selected area; (c) calculating the average position of each positioning point in the first-level selected area based on the at least two selected positioning points; (d) arbitrarily selecting a positioning point other than the at least two selected positioning points in the first-level selected area as a comparison positioning point, and confirming the actual position of the positioning point; (e) Compare the average position and the actual position of the positioning point to obtain a difference value; (f) If the difference value = 1, give a confirmation signal; (g) If the difference value = 0, determine a secondary selected area within the primary selected area, and the secondary selected area includes part of the positioning points within the primary selected area; (h) Repeat the above steps (b)-(f) within the secondary selected area; and (i) If the difference value = 0, continue to determine the next secondary selected area within the secondary selected area, and repeat the above steps (b)-(e) within the next secondary selected area until the difference value = 1, and give the above confirmation signal.

An embodiment of the present invention provides a device for welding an electronic component, which includes a first carrier, a medium, a pushing mechanism, an energy generating mechanism and a control unit. The first carrier is used to carry a flexible carrier having an electronic component to be welded, the second carrier is used to carry the medium, the pushing mechanism includes a pushing element, the pushing element can be driven to push in the direction of the first carrier, and the energy generating mechanism is used to generate an energy beam to the direction of the first carrier and/or the medium. The control unit executes the above-mentioned positioning method on a medium, and positions the pushing element and the energy beam generated by the energy generating mechanism to the desired position to perform pushing and welding.

An embodiment of the present invention provides a computer program, which, after being loaded and executed by a computer, can complete the above-mentioned method of positioning on a medium.

An embodiment of the present invention provides a computer-readable recording medium storing a program. After the program is loaded and executed by a computer, the above-mentioned method of positioning on a medium can be completed.

According to the above, in the method for positioning on a medium, the computer program and the computer-readable recording medium storing the program, a positioning point other than the two selected positioning points is randomly selected in the primary selected area as a comparison positioning point and its actual position is confirmed. The average position of the positioning points is compared with the actual position to obtain a difference value. If the difference value = 1, a confirmation signal is given. If the difference value = 0, a secondary selected area is determined in the primary selected area, and the above judgment steps are repeated in the secondary selected area until the difference value = 1 and a confirmation signal is given. In this way, through the above positioning method, the positions of all positioning points on the medium can be accurately determined, the positioning accuracy is improved, and the productivity is increased at the same time. In addition, through the device for welding an electronic component, the control unit executes a positioning method on a medium to position the energy beam generated by the pushing component and the energy generating mechanism to the desired position to perform the pushing and welding actions. In this way, the position of all electronic components to be welded can be accurately determined on the flexible carrier, thereby improving the accuracy of welding electronic components on the flexible carrier and increasing productivity.

10: Methods of positioning on media

1a: First level selected area

1b: Secondary selected areas

1-1, 1-3, 1-5, 3-3, 5-5: Positioning points

100: Device for soldering an electronic component

110: First carrier

120: Second carrier

130: Pushing mechanism

140:Energy generating mechanism

150: Control unit

151: Input unit

152: Output unit

153: Arithmetic unit

154: Storage unit

155:Camera

159:Signal line

160: Cloud system

200: Pushing element

220, 230: Ends

300: Flexible carrier board

300a, 300b: surface

310: Carrier frame

400, 401: Electronic components

430: Grain

450: Conductive connector

500: medium

540:Pad

D1: Top direction

L1, L2: beam

S110~S170: Steps

FIG1A is a schematic diagram of a medium viewed from above according to an embodiment of the present invention.

FIG. 1B is a flow chart of a method for positioning on a medium according to an embodiment of the present invention.

Figures 2 to 6 are partial side views of a partial operation mode of a device for welding electronic components according to an embodiment of the present invention.

The contents of the following embodiments are for illustrative purposes only and are not intended to be limiting. Furthermore, descriptions of well-known devices, methods, and materials may be omitted to avoid obscuring the description of the various principles of the present invention. Directional terms used herein (e.g., upper, lower, top, bottom) are only used with reference to the customary terms used or corresponding to the drawings, and are not intended to imply an absolute orientation. In addition, unless the content clearly indicates otherwise, the singular form "one", "one", "the", or forms not specifically indicating quantity may include one or more forms, that is, including "at least one".

In some of the accompanying drawings, for the sake of clarity, some elements or film layers may be enlarged, reduced or omitted. Similar components are represented by the same reference numerals and have similar functions, materials or formation methods, and the description is omitted. It will be obvious to those with ordinary knowledge in the technical field to which the present invention belongs that the present invention can be implemented in other embodiments that deviate from the specific details disclosed herein through the contents of the embodiments and the corresponding illustrations.

Please refer to FIG. 1A and FIG. 1B simultaneously, a method 10 for positioning on a medium, wherein the medium 500 has a plurality of positioning points. Each positioning point includes, for example, a pad 540. The method for positioning on the medium 500 includes the following steps. First, execute step S110 to determine a first-level selected area 1a on the medium 500, and the first-level selected area 1a includes at least part of the above-mentioned positioning points. Then, execute step S120 to select at least two positioning points from the positioning points in the first-level selected area 1a, such as positioning point 1-1 and positioning point 5-5. Next, execute step S130 to calculate the average position of each positioning point in the first-level selected area 1a based on the at least two selected positioning points (positioning point 1-1 and positioning point 5-5). Then, step S140 is executed to arbitrarily select a positioning point (e.g., positioning point 1-5) other than the at least two positioning points (positioning point 1-1 and positioning point 5-5) selected above as a comparison positioning point in the primary selected area 1a, and confirm its actual position. Then, step S150 is executed to compare the average position of the positioning point (e.g., positioning point 1-5) with the actual position to obtain a difference value, which can be 0 or 1. When the difference value is 1, execute step S170. If the difference value = 1, give a confirmation signal. When the difference value is 0, execute step S160. If the difference value = 0, determine a secondary selected area 1b in the primary selected area 1a. The secondary selected area includes part of the positioning points in the primary selected area. Repeat the above steps S120~S150 until step S170. If the difference value = 1, give a confirmation signal.

In this embodiment, the difference value = 1 indicates that there is no difference between the average position of the comparison positioning point and the actual position, or the difference is less than or equal to the error range. The difference value = 0 indicates that there is a difference between the average position of the comparison positioning point and the actual position, or the difference between the average position and the actual position is greater than the error range. In one embodiment, the difference value is a relative value that changes according to the positioning point size of the medium.

The actual position of the comparison positioning point can be obtained by, for example, a camera shooting the medium 500 to generate the actual position of the comparison positioning point (that is, the actual coordinates of the comparison positioning point on the medium 500). The average position of the comparison positioning point can be obtained by, for example, knowing the number of positioning points from the database content in the storage unit (such as the storage unit 154 in FIG. 2 described later), and then calculating (including interpolation calculation) the average position of the comparison positioning point by selecting at least two positioning points, such as positioning point 1-1 and positioning point 5-5. In one embodiment, the average position is the positioning point position stored in the database content in the storage unit.

In the repeated steps S120-S150, first, it is determined that the secondary selected area 1b includes some of the positioning points in the primary selected area 1a, such as positioning point 1-1, and at least two positioning points are selected in the secondary selected area 1b, such as positioning point 1-1 and positioning point 3-3. Then, based on the at least two selected positioning points (such as positioning point 1-1 and positioning point 3-3), the positioning points of each position in the secondary selected area 1b are calculated. The average position of the positioning points, Next, in the secondary selected area 1b, arbitrarily select a positioning point (e.g., positioning point 1-3) other than the at least two positioning points selected above (e.g., positioning point 1-1 and positioning point 3-3) as a comparison positioning point, and confirm its actual position, and then compare the average position of the positioning point (e.g., positioning point 1-3) with the actual position to obtain a difference value, which can be 0 or 1. When the difference value is 1, execute step S170. If the difference value = 1, give a confirmation signal. When the difference value is 0, execute step S160. If the difference value = 0, determine the next sub-selected area in the sub-selected area 1b. The next sub-selected area includes the positioning points in part of the sub-selected area, and repeat steps S120~S150 until step S170. If the difference value = 1, give a confirmation signal.

The shape of the primary selected area 1a and/or the secondary selected area 1b is, for example, a rectangle. In the primary selected area 1a and/or the secondary selected area 1b, the distance between at least two selected positioning points is greater than the distance between other positioning points in the selected area, for example, the distance between at least two selected positioning points is the diagonal distance of the rectangle. Thus, through the above positioning method, the positions of all positioning points on the medium 500 can be accurately determined, thereby improving the positioning accuracy on the medium 500 and increasing productivity at the same time.

Referring to FIG. 2 , a device 100 suitable for soldering electronic components is provided. In this embodiment, the device 100 for soldering an electronic component can solder an electronic component 400 from a flexible carrier 300 to a medium 500 (described in detail below). In other words, the device 100 for soldering an electronic component can be referred to as a soldering device.

The device 100 for soldering an electronic component includes a first carrier 110, a second carrier 120, a push mechanism 130, and an energy generating mechanism 140. The first carrier 110 is used to support a flexible carrier 300 having an electronic component 400 to be soldered. The second carrier 120 is used to support a medium 500. Moreover, after the medium 500 is supported on the second carrier 120, the medium 500 on the second carrier 120 can be arranged opposite to the flexible carrier 300.

In this embodiment, the flexible carrier 300 may include ultraviolet tape or blue film, the medium 500 is, for example, a thin film transistor substrate, and the electronic component 400 is, for example, a light-emitting diode chip. The energy generating mechanism 140 is, for example, a laser generating mechanism.

The pushing mechanism 130 includes a pushing element 200, and the pushing element 200 can be driven toward the first supporting frame 110 to perform a pushing action.

The pushing mechanism 130 is suitable for directly or indirectly driving the pushing element 200. The pushing element 200 can be disposed adjacent to the flexible carrier 300. Furthermore, the pushing element 200 can be driven directly or indirectly by the pushing mechanism 130 to move relatively in the direction of the flexible carrier 300.

In addition, the top end 230 of the pushing component 200 can push against the flexible carrier 300, and push the electronic component 400 on the flexible carrier 300 onto the medium 500.

The energy generating mechanism 140 can project one or more energy beams. The aforementioned multiple energy beams may refer to different energy beams having different dominant wavelengths; or different energy beams having the same dominant wavelength but different total energies or energy densities; or different energy beams having different dominant wavelengths and different total energies or energy densities.

The energy generating mechanism 140 is used to generate an energy beam L1 directed toward the first carrier 110 and/or the medium 500.

The energy beam L1 projected by the energy generating mechanism 140 can be injected into the pushing element 200 from the other end 220 relative to the pushing end 230, and emitted from the pushing end 230 of the pushing element 200. In other words, the energy beam can pass through at least a portion of the pushing element 200, and be emitted from the pushing end 230 of the pushing element 200 toward the flexible carrier 300.

In this embodiment, the device 100 for welding an electronic component may further include a control unit 150. The control unit 150 may execute the above-mentioned method of positioning on a medium to position the energy beam L1 generated by the pushing element 200 and the energy generating mechanism 140 to a desired position to perform pushing and welding operations.

The pushing element 200 is light-transmissive, and the energy beam L1 is emitted toward the first carrier 110 through the pushing element 200.

When the control unit 150 executes the above-mentioned method of positioning on a medium, it drives the first carrier 110 and the second carrier 120 to move relative to each other so as to position them at the desired position.

The control unit 150 can be connected to the corresponding components, elements or units (such as the first carrier 110, the second carrier 120, the pushing mechanism 130 and/or the energy generating mechanism 140) by wired signal transmission via the corresponding signal line 159, but the present invention is not limited thereto.

In one embodiment, the control unit 150 can be connected to the corresponding components, elements or units by wireless signal transmission. The control unit 150 and the first support frame 110, the second support frame 120, the pushing mechanism 130 and the energy generating mechanism 140 connected thereto can belong to the same device or machine. In addition, the signal connection mentioned in the present invention can generally refer to the connection method of wired signal transmission or wireless signal transmission. In addition, the present invention does not limit all signal connection methods to be the same or different.

In this embodiment, the control unit 150 may include corresponding hardware or software. For example, the control unit 150 may have a camera 155, and the camera 155 generates the actual position of the comparison positioning point. In this embodiment, the camera 155 may be a charge coupled device (CCD) camera or a complementary metal oxide semiconductor (CMOS) camera.

In one embodiment, the control unit 150 includes, for example, an input unit 151, an output unit 152, a computing unit 153 and/or a storage unit 154. The input unit 151 includes, for example, a keyboard, a mouse, a touch screen, a signal receiving end and/or other similar units suitable for data input. The output unit 152 includes, for example, a screen, a printer, a signal output end and/or other similar units suitable for data output. The computing unit 153 includes, for example, a central processing unit, a graphics processing unit, a physical processor or other similar units suitable for performing calculations, logical judgments and/or data processing. The storage unit 154 includes, for example, a memory, a hard disk, a disk array, a database, and/or other similar units suitable for permanent or temporary data storage.

In one embodiment, the control unit 150 can also be connected to the cloud system 160 by signal. The cloud system 160 can perform input, output, calculation, storage, monitoring, data collection, statistics and/or other appropriate operations through the control unit 150 by remote control. The aforementioned cloud system 160 includes, for example, an advanced planning and scheduling system, a factory monitoring system or other appropriate industrial control unit, but the present invention is not limited thereto.

The above-mentioned method of positioning on a medium can be implemented by using a computer program or a computer-readable recording medium storing a program. The computer program of this embodiment is, for example, a computer program product, which can complete the steps of the above-mentioned method of positioning on a medium after being loaded and executed by a computer, such as completing the above-mentioned steps S110 to S170. The computer-readable recording medium storing a program of this embodiment can complete the steps of the above-mentioned method of positioning after being loaded and executed by a computer, such as completing the above-mentioned steps S110 to S170. Computer-readable recording media include, for example, hard disks, solid-state drives, memory cards, flash drives, other non-volatile memories, optical disks, random access memories, or any other form of storage. The aforementioned "loading via a computer" may be loading the program in the computer-readable recording medium into the control unit, and then executing the various functions of the program via the control unit.

In this embodiment, the computer is, for example, a desktop computer, a laptop computer, various personal computers, a supercomputer, a tablet computer, a server, a work platform, a smart phone, a personal digital assistant, or any other form of computer. Here, the computer refers to a computer in a broad sense, and all computers (or computers) including the above-mentioned control unit 150 can be the computers referred to in this embodiment.

In this embodiment, the first carrier 110 may include corresponding fixing members (such as clamps and/or clamps, but not limited thereto), and may be suitable for directly and/or indirectly fixing the flexible carrier 300.

In one embodiment, the first carrier 110 can be fixed or mounted on the movable unit. In this way, the first carrier 110 can move and/or rotate in the corresponding direction according to the design requirements, which can more accurately assist in positioning the electronic component 400. In one embodiment, the flexible carrier 300 can be a composite material. For example, the flexible carrier 300 can have a polymer film or ultra-thin glass covered with a glue layer thereon.

In this embodiment, the pushing mechanism 130 may include a movable module commonly used in the design of a movable mechanism (such as a horizontal moving module, a vertical moving module, a rotation moving module or a combination thereof), which may include corresponding hardware or software, or further be combined with auxiliary parts. In this way, the pushing element 200 directly or indirectly fixed to the pushing mechanism 130 can move and/or rotate in the corresponding direction according to the design requirements.

In this embodiment, the material of the pushing element 200 may be suitable for allowing the energy beam projected by the energy generating mechanism 140 to penetrate. The penetration rate of the energy beam projected by the energy generating mechanism 140 into the material of the pushing element 200 is, for example, greater than or equal to 75%.

In one embodiment, the material of the push element 200 may be quartz, but the present invention is not limited thereto. In one embodiment, the material of the push element 200 may include glass, sapphire (Sapphire; such as artificial sapphire) or diamond (such as artificial diamond).

In this embodiment, the push element 200 may be a homogeneous material, and the aforementioned homogeneous material cannot be separated into different single materials by mechanical methods (such as crushing, shearing, cutting, sawing, grinding, etc.). In other words, the inside of the push element 200 may not have an interface formed by different materials, different processes (such as adhesion) and/or different objects (such as embedded objects). In one embodiment, the push element 200 has a through hole, and the energy beam projected by the energy generating mechanism 140 can enter the through hole through the end 220, and after passing through the through hole, it is emitted from the push end 230 and emitted toward the flexible carrier 300.

In this embodiment, the energy beam projected by the energy generating mechanism 140 can further penetrate the flexible carrier 300. For example, the flexible carrier 300 can have a first surface 300a and a second surface 300b. The second surface 300b is opposite to the first surface 300a. The electronic component 400 is located on the second surface 300b. The energy beam projected by the energy generating mechanism 140 can penetrate the flexible carrier 300 from the first surface 300a to the second surface 300b.

In one embodiment, the energy beam projected by the energy generating mechanism 140 may be a laser energy beam. In one embodiment, the energy beam projected by the energy generating mechanism 140 may be an infrared energy beam or an ultraviolet energy beam. For example, the energy beam projected by the energy generating mechanism 140 may be an infrared laser energy beam or an ultraviolet laser energy beam.

In one embodiment, the second support frame 120 can be fixed or mounted on the movable unit. In this way, the second support frame 120 can move and/or rotate in the corresponding direction according to the design requirements, which can more accurately assist in positioning the pad 540 on the medium 500.

In this embodiment, the medium 500 may include a corresponding circuit, wherein the circuit may include a corresponding pad 540 exposed to the outside. In one embodiment, the medium 500 may include a hard circuit board or a soft circuit board, but the present invention is not limited thereto. In one embodiment, the medium 500 may be a circuit board further including active components.

In this embodiment, the electronic element 400 may include a die 430 and a conductive connector 450 disposed on the die 430, but the present invention is not limited thereto. The die 430 may include a light-emitting die (such as a light-emitting diode die) or an integrated circuit, but the present invention is not limited thereto.

At least one energy beam projected by the energy generating mechanism 140 may be suitable for melting at least a portion of the conductive connector 450. In one embodiment, the conductive connector 450 includes solder, for example, but the present invention is not limited thereto.

In an embodiment not shown, electronic component 400 may include a die similar to die 430, and medium 500 may have a corresponding conductive connector similar to conductive connector 450.

The method of transferring the electronic component 400 from the flexible carrier 300 to the medium 500 by welding an electronic component device 100 can be described as follows. However, it is worth noting that the present invention is not limited to the method described below.

Referring to FIG. 2 , a device 100 for soldering an electronic component is provided. Then, the following steps are performed in any order: a medium 500 is arranged on the second carrier 120 of the device 100 for soldering an electronic component, and a flexible carrier 300 having at least one electronic component 400 arranged thereon is arranged on the first carrier 110. Furthermore, the electronic component 400 arranged on the flexible carrier 300 is arranged in a manner that the electronic component 400 and the medium 500 are opposite to each other and have a corresponding distance therebetween.

It is worth noting that in FIG. 1 , the number and/or configuration of the electronic components 400 disposed on the flexible carrier 300 are only shown for example and are not limited in the present invention. It is worth noting that in FIG. 1 , the configuration of the medium 500 on the second carrier 120 of the device 100 for soldering an electronic component and/or the configuration of the flexible carrier 300 on the first carrier 110 are only shown for example and are not limited in the present invention.

In one embodiment, after the flexible carrier 300 having at least one electronic component 400 disposed thereon and the medium 500 are disposed at corresponding positions, the energy beam L1 can be selectively projected to the electronic component 400 on the flexible carrier 300 by the energy generating mechanism 140 of the device 100 for welding an electronic component. The energy beam L1 can be a preheating energy beam, but the present invention is not limited thereto. In one embodiment, the energy beam L1 can be an alignment energy beam or a scanning energy beam.

In addition, in FIG. 2 or other similar figures, the optical diameter of the energy beam is only schematically illustrated. In an embodiment not shown, a suitable optical element (such as a light reflecting element, a lens, a filter, an aperture, etc.) can be set on the optical diameter of the energy beam. In one embodiment, the energy generating mechanism 140 and the pushing element 200 are separately arranged, that is, there is a space between the energy generating mechanism 140 and the pushing element 200, and the energy beam passes through the space after leaving the energy generating mechanism 140 and is injected into the pushing element 200. There can be at least one medium in the space, such as air or an optical element. The medium can adjust the energy beam according to the needs, such as reducing or expanding the area irradiated by the energy beam, and efficiently welding the electronic component 400.

Please refer to FIG. 2 and FIG. 3 , the pushing component 200 of the device 100 for soldering an electronic component is brought close to the flexible carrier 300 in the pushing direction D1, so that the pushing end portion 230 of the pushing component 200 is further pressed against a surface of the flexible carrier 300 that does not carry the electronic component 400 (e.g., the first surface 300a).

Referring to FIG. 3 and FIG. 4 , the pushing element 200 can be further pushed against the flexible carrier 300 to cause the flexible carrier 300 to produce a corresponding deformation (i.e., the flexible carrier 300 is bent toward the medium 500). In addition, the pushing element 200 can be brought close to the medium 500 so that an electronic component 401 (one of the electronic components 400) corresponding to the pushing element 200 is brought close to the medium 500. In this way, as shown in FIG. 5 , the electronic component 401 corresponding to the pushing element 200 at the location where the pushing element 200 pushes against the flexible carrier 300 can contact the medium 500.

5 , when and/or after the pushing component 200 pushes the corresponding electronic component 401 to contact the medium 500, the energy generating mechanism 140 of the device 100 for soldering an electronic component projects a heating energy beam L2 on the electronic component 401 on the flexible carrier 300. The heating energy beam L2 can pass through at least a portion of the pushing component 200 and be emitted from the pushing end portion 230 of the pushing component 200, so that the conductive connector 450 of the electronic component 401 corresponding to the pushing component 200 is at least partially melted, and the melted at least a portion of the conductive connector 450 can contact the corresponding pad 540 on the medium 500. Then, the projection of the heating energy beam L2 can be stopped, and the heat can be dissipated in an appropriate manner so that the electronic component 401 is soldered to the medium 500 and electrically connected to the corresponding circuit on the medium 500.

Please refer to Figures 5 and 6, the pushing component 200 is moved away from the medium 500 so that the flexible carrier 300 with appropriate elasticity/flexibility can return to its original state. In addition, after the electronic component 401 is soldered to the medium 500, the bonding force between the electronic component 401 and the medium 500 is greater than the bonding force between the electronic component 401 and the flexible carrier 300, so that the electronic component 401 soldered to the medium 500 can be separated from the carrier. In this way, the transfer action and welding action of the electronic component 401 can be completed through the above steps.

In summary, the method for positioning on a medium and the computer program and the computer-readable recording medium storing the program of the present invention select two positioning points in a primary selected area, then select a comparison positioning point and confirm its actual position, analyze the average position and the actual position of the comparison positioning point according to the database and obtain a difference value, if the difference value = 1, then a confirmation signal is given, that is, there is no difference between the average position and the actual position, if the difference value = 0, then a secondary selected area is determined in the primary selected area, and the above judgment steps are repeated in the secondary selected area until the difference value = 1 is obtained and a confirmation signal is given. In this way, the positions of all positioning points on the medium can be accurately determined, the positioning accuracy is improved, and the productivity is increased at the same time. In addition, through the device for welding an electronic component, the control unit executes a positioning method on a medium to position the energy beam generated by the pushing component and the energy generating mechanism to the desired position. At the same time, the pushing component and the energy generating mechanism perform pushing and welding operations. In this way, the position of all electronic components to be welded can be accurately determined on the flexible carrier, thereby improving the accuracy of welding electronic components on the flexible carrier and increasing productivity.

10: Methods of positioning on media

500: medium

540:Pad

1a: First level selected area

1b: Secondary selected areas

1-1, 1-3, 1-5, 3-3, 5-5: Positioning points

Claims (14)

A method for positioning on a medium, wherein the medium has a plurality of positioning points, the method comprising: (a) determining a first-level selected area on the medium, wherein the first-level selected area includes at least part of the above-mentioned positioning points; (b) selecting at least two positioning points from the positioning points in the first-level selected area; (c) calculating the average position of each positioning point in the first-level selected area based on the at least two selected positioning points; (d) arbitrarily selecting a positioning point other than the at least two selected positioning points in the first-level selected area as a comparison positioning point, and confirming the actual position of the positioning point; (e) Compare the average position and the actual position of the comparison positioning point to obtain a difference value; (f) if the difference value = 1, give a confirmation signal; (g) if the difference value = 0, determine a secondary selected area within the primary selected area, and the secondary selected area includes part of the positioning points within the primary selected area; (h) repeat the above steps (b)-(f) within the secondary selected area; and (i) if the difference value = 0, continue to determine the next secondary selected area within the secondary selected area, and repeat the above steps (b)-(e) within the next secondary selected area until the difference value = 1, and give the above confirmation signal. A method for positioning on a medium as described in claim 1, wherein the shape of the primary selected area and/or the secondary selected area is a rectangle. A method for positioning on a medium as described in claim 1, wherein the distance between the at least two positioning points selected in the primary selected area and/or the secondary selected area is greater than the distance between other positioning points in the selected area. A device for welding an electronic component, comprising: a first carrier for carrying a flexible carrier having the electronic component to be welded; a second carrier for carrying a medium; a pushing mechanism, comprising a pushing element, which can be driven to push in the direction of the first carrier; an energy generating mechanism, which generates an energy beam to be emitted in the direction of the first carrier and/or the second carrier; and a control unit, which executes the method of positioning on a medium as in any one of claims 1 to 3, and positions the pushing element and the energy beam generated by the energy generating mechanism to a desired position, so as to perform pushing and welding. A device for soldering an electronic component as described in claim 4, wherein the control unit executes a method for positioning on a medium as described in any one of claims 1 to 3, driving the first carrier and the second carrier to move relative to each other so as to be positioned at a desired position. A device for soldering an electronic component as described in claim 4, wherein the push element is light-transmissive. A device for welding an electronic component as described in claim 6, wherein the energy beam is emitted toward the direction of the first carrier through the pushing element. A device for soldering an electronic component as described in claim 4, wherein the medium is a thin film transistor substrate. A device for soldering an electronic component as described in claim 4, wherein the flexible carrier is a blue film. A device for soldering an electronic component as described in claim 4, wherein the electronic component is a light-emitting diode chip. A device for welding an electronic component as described in claim 4, wherein the energy generating mechanism is a laser generating mechanism. A device for soldering an electronic component as described in claim 4, wherein the control unit has a camera, and the actual position of the comparison positioning point is generated by the camera. A computer program, which, after being loaded and executed by a computer, can complete the method of positioning on a medium as described in any one of claims 1 to 3. A computer-readable recording medium with a stored program, after the program is loaded into the computer and executed, can complete the method of positioning on a medium as described in any one of claims 1 to 3.

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