TWI878140B - Backlight module and assembly method thereof - Google Patents

Abstract

A backlight module includes a back plate, a conductive colloid and a lighting board. The back plate includes a positioning portion. The conductive colloid is disposed on a surface of the back plate. The lighting board includes a substrate and a plurality of light-emitting elements. The substrate includes a first side and a second side opposite to each other, a first surface and a second surface opposite to each other. The first surface of the substrate is divided into a light-emitting region and a peripheral region. The light-emitting region is adjacent to the first side, the peripheral region is adjacent to the second side. The peripheral region includes a slot, the slot penetrates the first surface and second surface and extends into the second side. The substrate is sleeved on the positioning portion. The positioning portion abuts against the peripheral region. The substrate faces the back plate by the second surface and glued to the conductive colloid. A position of the conductive colloid corresponds to a position of the light-emitting region. The light-emitting elements are disposed on the light-emitting region. An assembly method of the backlight module is provided, too.

Description

Backlight module and assembly method thereof

The present invention relates to a backlight module and an assembly method thereof.

The backlight module mainly includes a back panel and a lamp panel, and the lamp panel is fixedly mounted on the back panel. Currently, for the sake of structural stability, most manufacturers usually use double-sided adhesive material between the lamp panel and the back panel to attach the lamp panel to the back panel. Thus, although the structural stability of the backlight module meets the requirements, when some components between the back panel and the light panel or some components of the light panel are damaged, since the light panel and the back panel are completely adhered with double-sided adhesive, there is no force point between the light panel and the back panel for the user to apply force when disassembling the light panel and the back panel, making it difficult for the user to disassemble the backlight module by themselves for maintenance, repair or replacement of parts. Therefore, although most of the components of the backlight module are not damaged, it is still discarded, resulting in the generation of unwanted waste and waste of resources.

The present application provides a backlight module, comprising a back plate, a conductive glue and a light plate. The back plate comprises a positioning portion. The conductive glue is disposed on one side of the back plate. The light plate comprises a substrate and a plurality of light-emitting elements. The substrate comprises a first side and a second side opposite to each other and a first surface and a second surface opposite to each other. The first surface of the substrate is divided into a light-emitting area and a peripheral area. The light-emitting area is adjacent to the first side, and the peripheral area is adjacent to the second side. The peripheral area has a groove, and the groove passes through the first surface and the second surface and extends to the second side. The substrate is positioned on the positioning portion by means of a groove sleeve, and the positioning portion abuts against the peripheral area. The substrate faces the back plate with its second surface and is bonded to the conductive glue, and the position of the conductive glue corresponds to the position of the light-emitting area. The light-emitting elements are disposed in the light-emitting area.

Thereby, the light board can be positioned at the correct position on the back panel through the slots and the positioning parts, and the conductive glue can provide bonding force after the light board is positioned at the correct position on the back panel. Thereby, the light board and the back panel are provided with a partially disassembled relative structure and a partially fixed connection, thereby reducing the difficulty of disassembling the light board and the back panel, facilitating the disassembly of the light board, thereby facilitating the maintenance and repair of the light board, and enabling it to be reused, remanufactured or refurbished, thereby achieving the effect of circular economy.

In some embodiments, the aforementioned light panel further includes a chip-on-chip layer covering the first surface of the substrate and corresponding to the light-emitting area.

In some embodiments, the positioning portion includes an anchoring section and a supporting section that are connected to each other, the anchoring section is vertically connected to the back plate, the supporting section is vertically connected to the anchoring section, and an extending direction of the supporting section is parallel to the first side and the second side.

In some embodiments, the direction perpendicular to the first surface and the second surface is the first direction, the connecting section has a first thickness in the first direction, the first surface and the second surface of the substrate have a second thickness in the first direction, and the first thickness is equal to the second thickness.

In some embodiments, the back plate has a third thickness in the first direction, the chip-on-cover layer has a fourth thickness in the first direction, and the sum of the first thickness and the third thickness is less than or equal to the sum of the second thickness and the fourth thickness.

In some embodiments, the positioning portion further includes a turning portion located at the connection between the connecting section and the abutting section, and the mechanical strength of the turning portion is less than that of the connecting section and the abutting section.

In some embodiments, the aforementioned turning portion is a cut or a groove.

In some embodiments, the vertical connection between the first side and the second side is a second direction, the peripheral area has a first width in the second direction, the slot has a second width in the second direction, and the second width is smaller than the first width.

In some embodiments, the second surface of the substrate has a plurality of copper exposed areas, and the conductive glue is disposed in the copper exposed areas.

The present invention also provides a method for assembling a backlight module, comprising the following steps: providing a back plate, the back plate comprising a positioning portion; providing a plurality of conductive adhesives, arranged on one side of the back plate; providing a lamp plate, the lamp plate comprising a slot, the lamp plate being sleeved on the positioning portion through the slot in a direction parallel to the back plate and being attached to the conductive adhesive.

Referring to Fig. 1 to Fig. 3, Fig. 1 is a schematic diagram of the structure decomposition of an embodiment of the backlight module of the present invention; Fig. 2 is a schematic diagram of the assembled plane of an embodiment of the backlight module of the present invention; Fig. 3 is a partial three-dimensional schematic diagram of the circled area 3 in Fig. 2. The present application provides a backlight module, which mainly includes a back plate 10, a conductive glue 20 and a light plate 30. The back plate 10 includes a positioning portion 111. The conductive glue 20 is disposed on one side of the back plate 10. The light plate 30 includes a substrate 31 and a plurality of light-emitting elements 32. The substrate 31 includes a first side 311 and a second side 312 opposite to each other and a first surface 315 and a second surface 316 opposite to each other. The first surface 315 of the substrate 31 is divided into a light-emitting area A1 and a peripheral area A2. The light-emitting area A1 is adjacent to the first side 311, and the peripheral area A2 is adjacent to the second side 312. The peripheral area A2 has a groove 3121, and the groove 3121 penetrates the first surface 315 and the second surface 316 and extends to the second side 312. The substrate 31 is positioned on the positioning portion 111 with the groove 3121, and the positioning portion 111 is against the peripheral area A2. The substrate 31 faces the back plate 10 with the second surface 316 and is bonded to the conductive glue 20, and the position of the conductive glue 20 corresponds to the position of the light-emitting area A1.

Thus, the lamp panel 30 can be arranged at the correct position on the back panel 10 through the slot 3121 in cooperation with the positioning portion 111 of the back panel 10, and the conductive adhesive 20 can provide a bonding force after the lamp panel 30 is positioned at the correct position on the back panel 10. In this way, the lamp panel 30 and the back panel 10 are connected by a detachable relative structure and a local fixed connection, which reduces the difficulty of disassembling the lamp panel 30 and the back panel 10, facilitates the disassembly of the lamp panel 30, and further facilitates the maintenance and repair of the lamp panel 30, and can be reused, remanufactured or refurbished, thereby achieving a circular economy effect.

Referring to FIG. 1 and FIG. 3 , the back panel 10 is used to carry and position the light panel 30 at the correct assembly position. In some embodiments, the back panel 10 may be a flat plate structure having a front side 11 and a back side 12 opposite to each other, and the positioning portion 111 protrudes from the front side 11 of the back panel 10, where the joint between the positioning portion 111 and the front side 11 of the back panel 10 is a vertical joint. In some embodiments, the back panel 10 is made of a material having strength and plastic deformation capability, such as but not limited to a metal material. In these embodiments, the positioning portion 111 may be a sheet structure formed by stamping and then bending.

1 , in some embodiments, the direction perpendicular to the front side 11 and the back side 12 of the back plate 10 is a first direction D1 , and the main plane of the back plate 10 is constructed along a second direction D2 and a third direction D3 perpendicular to the first direction D1 and perpendicular to each other.

Refer to FIG4 , which is a partial enlarged view of the circled area 4 in FIG1 . In some embodiments, the back plate 10 further includes a cutout 13, the cutout 13 includes a first cut edge 131, a second cut edge 132, and a third cut edge 133, the first cut edge 131, the second cut edge 132, and the third cut edge 133 respectively penetrate the front surface 11 and the back surface 12 and are connected in sequence, the first cut edge 131 and the third cut edge 133 are parallel to each other and spaced apart, the second cut edge 132 is vertically connected between one end of the first cut edge 131 and the third cut edge 133, and the range surrounded by the first cut edge 131, the second cut edge 132, and the third cut edge 133 of the cutout 13 defines a positioning portion 111 in a cantilever structure state. In these embodiments, the second cutting edge 132 extends along the second direction D2, and the first cutting edge 131 and the third cutting edge 133 extend along the third direction D3.

Referring to FIG. 4 , in some embodiments, the positioning portion 111 has a first end 1111 and a second end 1112 opposite to each other, the first end 1111 is located between the first cutting edge 131 and the other end of the third cutting edge 133, and the second end 1112 is a free end away from the first end 1111. Here, based on the selection of a plastically deformable material for the back plate 10 and the configuration of the first cutting edge 131, the second cutting edge 132, and the third cutting edge 133, the first end 1111 of the positioning portion 111 is in a bendable and deformable state. Specifically, when the first end 1111 of the positioning portion 111 is not bent, the positioning portion 111 may be located in the cutout 13; and when the first end 1111 of the positioning portion 111 is bent, the positioning portion 111 can be separated from the cutout 13.

The conductive glue 20 is an adhesive material with conductivity, and is used to conductively bond the light board 30. In some embodiments, the conductive glue 20 can be, but is not limited to, conductive silver glue, conductive copper glue, and conductive graphite glue.

Referring to FIG. 1 and FIG. 5 , FIG. 5 is a partially enlarged schematic diagram of an embodiment of a lamp panel of the backlight module of the present invention. The substrate 31 of the lamp panel 30 is used to carry the light-emitting element 32 and is coupled to the back panel 10. In some embodiments, the size of the substrate 31 is slightly smaller than the back panel 10, and the substrate 31 is a flat plate structure that extends in thickness along the first direction D1 and forms a plane along the second direction D2 and the third direction D3. In these embodiments, the substrate 31 is a rectangular plate and includes a first side 311, a second side 312, a third side 313, and a fourth side 314. The first side 311 is parallel to the second side 312, the third side 313 is parallel to the fourth side 314, and the third side 313 and the fourth side 314 are vertically connected between the two ends of the first side 311 and the second side 312.

Referring to Figure 2, in these embodiments, the first surface 315 of the substrate 31 is divided into a light-emitting area A1 and a peripheral area A2 in the second direction D2. That is, the local area of the first surface 315 of the substrate 31 adjacent to the first side 311 in the second direction D2 is the light-emitting area A1, and the light-emitting area A1 extends within the local area of the first surface 315 of the substrate 31 in the second direction D2 to the entire range of the third direction D3.

Referring to FIG. 2 , the remaining range of the first surface 315 of the substrate 31 adjacent to the second side 312 in the second direction D2 is the peripheral area A2, and the peripheral area A2 extends throughout the third direction D3 in the remaining range of the first surface 315 of the substrate 31 in the second direction D2. In some embodiments, the length of the light-emitting area A1 of the substrate 31 in the second direction D2 accounts for 97% to 98.5% of the total length of the substrate 31 in the second direction D2, and the length of the peripheral area A2 of the substrate 31 in the second direction D2 accounts for 1.5 to 3% of the total length of the substrate 31 in the second direction D2. In this way, the area of the light-emitting area A1 of the light panel 30 is maximized, ensuring that the resources used can fully exert their benefits.

2 and 5 , in some embodiments, the slot 3121 of the substrate 31 opens from the second side 312 and extends along the second direction D2 , so that the substrate 31 can be assembled along the first direction D1 in a straight up and down displacement path.

Refer to FIG. 6 , which is a flow chart of the steps of one embodiment of the backlight module assembly method of the present invention. The present application also provides a backlight module assembly method, which mainly includes the following steps:

Step S01: Referring to FIG. 1 , FIG. 6 and FIG. 7 , FIG. 7 is a schematic diagram of the assembly process of one embodiment of the assembly method of the backlight module of the present invention. Provide a back plate 10, which includes a positioning portion 111. In some embodiments, in step S01, the positioning portion 111 protrudes from the front surface 11, and the connection direction between the first end 1111 and the second end 1112 of the positioning portion 111 extends along the first direction D1, that is, the positioning portion 111 protrudes vertically from the front surface 11 of the back plate 10 in this state. It is worth noting that before step S01, the positioning portion 111 on the back plate 10 can be in a planar state coplanar with the front surface 11 and the back surface 12. When step S01 is to be started, the positioning portion 111 is bent again so that the positioning portion 111 becomes a state protruding from the front surface 11. Here, the positioning portion 111 can be bent into a state perpendicular to the front surface 11 as shown in FIG. 7 , so as to facilitate the subsequent assembly of the light panel 30 .

Step S02: Provide a plurality of conductive adhesives 20, which are disposed on one side of the back plate 10. In some embodiments, in step S02, the conductive adhesive 20 is disposed between the back plate 10 and the lamp board 30 and corresponds to the position of the copper exposed area of the lamp board 30. Thus, when the lamp board 30 is bonded to the back plate 10 through the conductive adhesive 20, it can also be electrically connected to the peripheral electronic components (such as a flexible circuit board) at the same time. In some embodiments, the copper exposed area of the lamp board 30 is located on the second surface 316 and corresponds to the position of the light emitting area A1. It is worth noting that the conductive glue 20 can be first glued to the back plate 10, and then the light board 30 is attached to the conductive glue 20 on the back plate 10; the conductive glue 20 can also be first glued to the light board 30, and then the light board 30 and the conductive glue 20 are attached to the back plate 10. The present invention is not limited to this.

Step S03: Referring to FIG. 6 and FIG. 7 , a lamp board 30 is provided. The lamp board 30 includes a slot 3121 . The lamp board 30 is sleeved on the positioning portion 111 through the slot 3121 in a direction parallel to the back plate 10 and adhered to the conductive adhesive 20 . In some embodiments, in step S03, the lamp panel 30 is parallel to one side of the back panel 10 with the second side 316 of the substrate 31 facing the front side 11 of the back panel 10, and then the position of the groove 3121 on the second side 312 of the substrate 31 corresponds to the position of the positioning portion 111, and then the substrate 31 is moved along the first direction D1 so that the open position of the groove 3121 of the substrate 31 is engaged with the positioning portion 111. After the groove 3121 of the substrate 31 is engaged with the positioning portion 111, the substrate 31 is continuously moved so that the second side 316 of the substrate 31 is attached to the front side 11 of the back panel 10.

Step S04: bend the positioning portion 111 so that the positioning portion 111 abuts against the light board 30. Referring to FIG. 6 and FIG. 3, in some embodiments, in step S04, the positioning portion 111 is bent so that the second end 1112 of the positioning portion 111 is close to the first surface 315 of the substrate 31, and finally the positioning portion 111 abuts against the first surface 315 of the substrate 31 (as shown in FIG. 3). In this way, the positioning portion 111 can limit the displacement of the light board 30 in the first direction D1.

As can be seen from the above, during the assembly process of the backlight module, the slot 3121 is first positioned to the correct position through the cooperation with the positioning portion 111, and then the conductive glue 20 is relatively close to the lamp board 30 and the back plate 10. After the backlight module is assembled, the local area of the lamp board 30 close to the first side 311 is glued through the conductive glue 20, and the second side 312 of the lamp board 30 is positioned with the positioning portion 111. The back plate 10 and the lamp board 30 do not need to be fully glued to provide a good quality structural stability.

When the backlight module is to be disassembled, the positioning portion 111 is bent to separate the second end 1112 of the positioning portion 111 from the substrate 31, thereby releasing the positioning of the substrate 31 of the light board 30 between the second side 312 and the back plate 10. Here, the positioning portion 111 is preferably bent to a state perpendicular to the front surface 11 of the back plate 10 (as shown in FIG. 7 ). In this state, the second side 312 of the substrate 31 of the light board 30 can be separated from the back plate 10 by simply moving along the first direction D1. When the second side 312 of the substrate 31 of the lamp panel 30 is separated from the back panel 10, the operator can hold the substrate 31 and apply force to the local position where the substrate 31 is separated from the back panel 10, so that the substrate 31 of the lamp panel 30 is completely separated from the conductive glue 20 and the back panel 10, thereby facilitating the disassembly of the lamp panel 30 and the back panel 10. When damaged, the light panel 30 can be disassembled for repair without discarding or replacing the entire backlight module, thereby extending the service life of the backlight module and avoiding the waste of undamaged resources. In addition to reducing the generation of waste, it can also reduce resource consumption and extend the use time of resources, further complying with the benefits of a sustainable circular economy.

Referring to FIG. 1 and FIG. 7 , in some embodiments, the thickness of the back plate 10 from the front surface 11 to the back surface 12 in the first direction D1 is roughly equal to the width of the slot 3121 in the third direction D3. Thus, after step S03 (as shown in FIG. 7 ), the lamp board 30 is sleeved to the positioning portion 111 with the slot 3121 of the substrate 31, and the assembly between the slot 3121 and the positioning portion 111 can limit the displacement of the substrate 31 in the third direction D3, thereby obtaining a preliminary positioning. In this way, when the lamp board 30 is first sleeved to the positioning portion 111 with the substrate 31 and then continuously attached to the conductive adhesive 20, since the position of the lamp board 30 is limited, it is determined that the lamp board 30 can be attached to the conductive adhesive 20 with the exposed copper area in contact. The assembler does not need to bother to observe the relative position of the back panel 10 and the light panel 30. As long as the light panel 30 is inserted into the positioning portion 111 through the slot 3121, it can be determined that the light panel 30 can be assembled in the correct position, thereby reducing the difficulty of assembly and improving the efficiency of assembly.

Referring to FIG. 5 , in some embodiments, the light board 30 is a flip chip packaged light board 30 . In these embodiments, the light emitting element 32 is a light emitting diode (LED), and the light board 30 further includes a flip chip layer 33 . The flip chip layer 33 is disposed in the light emitting area A1 of the first surface 315 of the substrate 31 and covers each light emitting element 32 .

Referring to FIG. 1 , FIG. 3 and FIG. 4 , in some embodiments, the positioning portion 111 of the back plate 10 includes a connecting section 111A and a supporting section 111B connected to each other, the first end 1111 is located at one end of the connecting section 111A away from the supporting section 111B, and the second end 1112 is located at one end of the supporting section 111B away from the connecting section 111A. After step S04, the positioning portion 111 is divided into the connecting section 111A and the supporting section 111B by the bend. In some embodiments, the connecting section 111A is vertically connected to the front surface of the back plate 10, the abutting section 111B is vertically connected to the connecting section 111A, and the extending direction of the abutting section 111B is parallel to the extending direction of the first side 311 and the second side 312 of the substrate 31. That is, after the positioning portion 111 is bent in step S04, the connecting section 111A extends along the first direction D1, and the abutting section 111B extends along the third direction D3. In this way, the positioning portion 111 can be abutted against the first surface 315 of the substrate 31 in a face-to-face manner through the abutting section 111B, ensuring the stability of the positioning of the light board 30.

Refer to FIG8 , which is a cross-sectional schematic diagram drawn along the 8-8 section line in FIG2 . In some embodiments where the positioning portion 111 includes a connecting section 111A and a supporting section 111B, the connecting section 111A has a first thickness H1 in the first direction D1, and the first surface 315 and the second surface 316 of the substrate 31 of the light board 30 have a second thickness H2 in the first direction D1, and the first thickness H1 is equal to the second thickness H2. In this way, the supporting section 111B of the positioning portion 111 is completely attached to the first surface 315 of the substrate 31, so that the contact area between the supporting section 111B of the positioning portion 111 and the substrate 31 is maximized, ensuring full utilization of resources.

Referring to FIG. 8 , in some embodiments where the light board 30 includes a flip chip layer 33, the back plate 10 has a third thickness H3 in the first direction D1, the flip chip layer 33 has a fourth thickness H4 in the first direction D1, and the sum of the first thickness H1 and the third thickness H3 is less than or equal to the sum of the second thickness H2 and the fourth thickness H4. In this way, it is ensured that the positioning portion 111 does not exceed the height of the flip chip layer 33 after being bent and pressed against the substrate 31, so as to avoid affecting the stacking configuration of other film layer components on the light board 30.

Refer to FIG. 9 , which is a partial schematic diagram of an embodiment of the back plate of the backlight module of the present invention. In some embodiments, the positioning portion 111 of the back plate 10 further includes a turning portion 111C, and the turning portion 111C is located at the connection between the connecting section 111A and the abutting section 111B. The mechanical strength of the turning portion 111C is less than the mechanical strength of the connecting section 111A and the abutting section 111B. Thereby, when step S04 is to be performed, the force applied by the operator can ensure that the positioning portion 111 is bent by the turning portion 111C, and ensure that the bent positioning portion 111 can be stably attached to the substrate 31. In some embodiments in which the positioning portion 111 includes the turning portion 111C, the turning portion 111C can be, but is not limited to, a dent or a groove.

Refer to FIG. 10 , which is a partial schematic diagram of one embodiment of the lamp panel of the backlight module of the present invention. In some embodiments, the peripheral area A2 of the substrate 31 of the lamp panel 30 has a first width W1 in the second direction D2, and the slot 3121 of the back panel 10 has a second width W2 in the second direction D2, and the second width W2 is smaller than the first width W1. Thus, when the lamp panel 30 is sleeved to the positioning portion 111 of the back panel 10 with the slot 3121, even if the positioning portion 111 is accommodated in the bottom of the slot 3121, the positioning portion 111 of the back panel 10 and the flip chip layer 33 can still maintain a gap in the second direction D2, so as to avoid the flip chip layer 33 being damaged due to inadvertent contact with the flip chip layer 33 when the positioning portion 111 is bent.

Referring to FIG. 1 , FIG. 3 , and FIG. 4 , in some embodiments, the number of the positioning portions 111 on the back panel 10 is two, and the number of the slots 3121 on the substrate 31 of the lamp panel 30 is two. In these embodiments, the positions of the two positioning portions 111 on the back panel 10 are symmetrically arranged, and the shapes of the two positioning portions 111 are also symmetrically arranged. Specifically, the two positioning portions 111 respectively penetrate the back panel 10, the two positioning portions 111 are respectively close to the opposite sides of the back panel 10 in the third direction D3, and the distances between the two positioning portions 111 and the opposite sides of the back panel 10 in the third direction D3 are the same, thereby making the positions of the two positioning portions 111 on the back panel 10 symmetrically arranged. In addition, the second ends 1112 of the two positioning portions 111 face each other, thereby making the shapes of the two positioning portions 111 on the back panel 10 symmetrically arranged.

Referring to FIG. 1 and FIG. 8 , in some embodiments, the back plate 10 further includes a plurality of baffles 14 disposed at the periphery of the back plate 10, and each baffle 14 protrudes from the front surface 11. In these embodiments, the baffle 14 has a fifth thickness H5 in the first direction D1, and the fifth thickness H5 is greater than the sum of the second thickness H2 and the fourth thickness H4. Thus, the baffle 14 can prevent the lamp baffle 30 or other components from falling off the periphery of the back plate 10 during the assembly process or the use process, thereby improving the assembly convenience and structural stability.

10: back plate 11: front 111: positioning part 111A: joint section 111B: abutment section 111C: turning section 1111: first end 1112: second end 12: back 13: cutout 131: first cutting edge 132: second cutting edge 133: third cutting edge 14: baffle 20: conductive adhesive 30: light board 31: substrate 311: first side 312: second side 3121: slot 313: third side 314: fourth side 315: first side 316: second side 32: light emitting element 33: flip chip adhesive layer D1: first direction D2: second direction D3: third direction A1: luminous area A2: peripheral area H1: first thickness H2: second thickness H3: third thickness H4: fourth thickness H5: fifth thickness W1: first width W2: second width S01~S04: steps

FIG1 is a schematic diagram of the structural decomposition of an embodiment of the backlight module of the present invention. FIG2 is a schematic diagram of the combined plane of an embodiment of the backlight module of the present invention. FIG3 is a partial three-dimensional schematic diagram of the circled area 3 in FIG2. FIG4 is a partial enlarged diagram of the circled area 4 in FIG1. FIG5 is a partial enlarged schematic diagram of an embodiment of the light panel of the backlight module of the present invention. FIG6 is a step flow chart of an embodiment of the assembly method of the backlight module of the present invention. FIG7 is a schematic diagram of the assembly process of an embodiment of the assembly method of the backlight module of the present invention. FIG8 is a schematic diagram of a cross-section drawn along the 8-8 cutting line in FIG2. FIG9 is a partial schematic diagram of an embodiment of the back panel of the backlight module of the present invention. FIG10 is a partial schematic diagram of an embodiment of the light panel of the backlight module of the present invention.

10: Back panel

11: Front

111: Positioning unit

20: Conductive glue

30: Light board

31: Substrate

311: First side

312: Second side

3121: Slotting

313: Third side

314: Fourth side

315: First page

32: Light-emitting element

33: Chip-on-chip adhesive layer

D2: Second direction

D3: Third direction

A1: Luminous area

A2: Peripheral area

Claims (10)

A backlight module comprises: A back plate comprising a positioning portion; A plurality of conductive glues disposed on one side of the back plate; and A light panel comprising: A substrate comprising a first side, a second side and a first surface, a second surface, the first surface of the substrate being divided into a light-emitting area and a peripheral area, the light-emitting area being adjacent to the first side, the peripheral area being adjacent to the second side, the peripheral area having a slot, the slot penetrating the first surface and the second surface and extending to the second side, the substrate being positioned on the positioning portion by means of the slot sleeve, and the positioning portion abutting against the peripheral area, the substrate facing the back plate with the second surface and being bonded to the conductive glues, and the positions of the conductive glues corresponding to the positions of the light-emitting area; and A plurality of light-emitting elements disposed in the light-emitting area. The backlight module as described in claim 1, wherein the light panel further includes a chip-on-chip layer covering the first surface of the substrate and corresponding to the light-emitting area. A backlight module as described in claim 1, wherein the positioning portion includes an anchoring section and a supporting section that are connected to each other, the anchoring section is vertically anchored to the back plate, the supporting section is vertically anchored to the anchoring section, and the extending direction of the supporting section is parallel to the first side and the second side. A backlight module as described in claim 3, wherein the direction perpendicular to the first surface and the second surface is a first direction, the connecting section has a first thickness in the first direction, the first surface and the second surface of the substrate have a second thickness in the first direction, and the first thickness is equal to the second thickness. A backlight module as described in claim 4, wherein the light panel further includes a chip-on-chip layer covering the first surface of the substrate and corresponding to the light-emitting area, the back panel has a third thickness in the first direction, the chip-on-chip layer has a fourth thickness in the first direction, and the sum of the first thickness and the third thickness is less than or equal to the sum of the second thickness and the fourth thickness. The backlight module as described in claim 3, wherein the positioning portion further includes a turning portion located at the connection between the connecting section and the abutting section, and the mechanical strength of the turning portion is less than the mechanical strength of the connecting section and the abutting section, respectively. The backlight module as described in claim 6, wherein the turning portion is a cut or a groove. A backlight module as described in claim 1, wherein the vertical connection between the first side and the second side is a second direction, the peripheral area has a first width in the second direction, the groove has a second width in the second direction, and the second width is smaller than the first width. The backlight module as described in claim 1, wherein the second surface of the substrate has a plurality of copper exposed areas, and the copper exposed areas are adhered to the positions of the conductive glues. A method for assembling a backlight module comprises: providing a back plate, the back plate comprising a positioning portion; providing a plurality of conductive adhesives disposed on one side of the back plate; providing a light board, the light board comprising a slot, the light board being sleeved on the positioning portion through the slot in a direction parallel to the back plate and being attached to the conductive adhesives; and bending the positioning portion so that the positioning portion abuts against the light board.