TWI467275B - Display apparatus and assembling/disassembling method thereof - Google Patents
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- 238000000034 method Methods 0.000 title claims description 48
- 239000003292 glue Substances 0.000 claims description 76
- 239000000084 colloidal system Substances 0.000 claims description 33
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 12
- 239000004973 liquid crystal related substance Substances 0.000 description 8
- 239000010409 thin film Substances 0.000 description 6
- 230000002950 deficient Effects 0.000 description 5
- 238000000926 separation method Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 239000012788 optical film Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
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Description
本發明是有關於一種顯示裝置、顯示裝置組裝方法及顯示裝置拆卸方法,特別是有關於一種可於組裝過程中方便重工的顯示裝置。The present invention relates to a display device, a display device assembly method, and a display device removal method, and more particularly to a display device that can be easily reworked during assembly.
近年來,由於電子、資訊工業的迅速發展,其相關之產品亦日益精密。就目前個人電腦領域觀之,除了尋求更高速、運算能力更強之計算功能之運算單元和各式各樣週邊設備之配合來滿足使用者需求外,針對輕薄短小之可攜式電腦亦為業界發展之重點領域。以液晶顯示器為例,其具有高畫質、體積小、重量輕、低電壓驅動、低消耗功率及應用範圍廣等優點,故廣泛地應用於可攜式電視、行動電話、攝錄放影機、筆記型電腦、桌上型顯示器等消費性電子產品中,成為顯示器的主流。In recent years, due to the rapid development of electronics and information industry, its related products have become increasingly sophisticated. In the current field of the personal computer, in addition to the search for a higher-speed, more computationally-computing computing unit and a wide range of peripheral devices to meet the needs of users, the portable computer for thin and light is also the industry. Key areas of development. Taking liquid crystal display as an example, it has the advantages of high image quality, small size, light weight, low voltage driving, low power consumption and wide application range, so it is widely used in portable TVs, mobile phones, video recorders. In consumer electronics such as notebook computers and desktop monitors, it has become the mainstream of displays.
背光模組為液晶顯示器的關鍵零組件之一。由於液晶顯示器的面板模組本身不具發光的能力,背光模組之功能即在於供應充足的亮度與分佈均勻的光源,使液晶顯示器能正常顯示影像。目前液晶顯示器已廣泛應用於監視器、筆記型電腦、數位相機及投影機等具成長潛力之電子產品,因此帶動背光模組及其相關零組件的需求持續成長。The backlight module is one of the key components of the liquid crystal display. Since the panel module of the liquid crystal display itself does not have the ability to emit light, the function of the backlight module is to supply a sufficient light source with uniform brightness and uniform distribution, so that the liquid crystal display can display images normally. At present, liquid crystal displays have been widely used in electronic products with potential for growth such as monitors, notebook computers, digital cameras and projectors, so the demand for backlight modules and related components continues to grow.
一般來說,以往在組裝液晶顯示器的面板模組與背光模組時,會藉由雙面皆具有黏性的襯帶(rim tape)貼附於面板模組底部的下偏光片與背光模組的膠框之間,藉以使面板模組與背光模組相互黏合。而對於於中小尺寸的液晶顯示器來說,由於其具有較寬的面板模組以及邊框較窄的背光模組,並且為了提升兩模組之間抵抗落摔試驗時的剝離力(peeling force)的能力,面板模組與背光模組之間相互固定的設計會由襯帶黏合方式改為以膠體(glue)直接膠合的方式。In general, in the past, when assembling the panel module and the backlight module of the liquid crystal display, the lower polarizer and the backlight module attached to the bottom of the panel module are adhered by a rim tape having a double-sided adhesive layer. Between the plastic frames, the panel module and the backlight module are bonded to each other. For a small and medium size liquid crystal display, it has a wider panel module and a backlight module with a narrow frame, and in order to improve the peeling force between the two modules against the fall test. Capability, the design of the panel module and the backlight module to be fixed to each other will be changed from the bonding method of the lining to the direct bonding of the glue.
然而,當組裝人員在組裝面板模組與背光模組的過程中發生失誤,或者組裝後的產品於後續品管階段被判定為不良品時,則在膠體已經凝固的情況下硬將面板模組與背光模組分離,往往會使面板模組及/或背光模組產生損壞的問題而面臨無法重工的問題,進而導致液晶顯示器的製造成本無法降低。因此,發展出可於重工階段不會造成面板模組及/或背光模組損壞的技術,是此業界必須刻不容緩投入探討與研究的課題。However, when the assembler makes a mistake in assembling the panel module and the backlight module, or the assembled product is judged to be defective in the subsequent quality control stage, the panel module is hardened when the colloid has solidified. Separation from the backlight module often causes the panel module and/or the backlight module to be damaged, and faces the problem of being unable to rework, thereby causing the manufacturing cost of the liquid crystal display to be reduced. Therefore, the development of a technology that does not cause damage to the panel module and/or the backlight module during the rework phase is a problem that the industry must invest in research and research.
為解決習知技術的問題,本發明的一技術樣態是一種顯示裝置,其主要是在組裝顯示裝置的面板模組與背光模組的過程中,先於背光模組的膠框與框架之間置入一條線材,再塗佈膠體以黏合面板模組、膠框與框架,並同時使膠體包覆部份線材。因此,當顯示裝置因組裝失誤或不良品因素而需要重工時,可直接拉扯線材以破壞膠體結構,使得面板模組與背光模組容易分離。換言之,本發明的顯示裝置可避免於分離面板模組與背光模組的重工過程中毀損面板模組及/或背光模組。並且,若顯示裝置不需重工,則可將裸露於面板模組與背光模組之間的膠合部位以外的多餘線材除去,並不會影響顯示裝置組裝後應有的結構強度。In order to solve the problems of the prior art, a technical aspect of the present invention is a display device, which is mainly used in the process of assembling the panel module and the backlight module of the display device, before the plastic frame and the frame of the backlight module. A wire is placed between them, and then a glue is applied to bond the panel module, the frame and the frame, and at the same time, the glue is coated with a part of the wire. Therefore, when the display device needs to be reworked due to assembly errors or defective factors, the wire can be directly pulled to break the colloidal structure, so that the panel module and the backlight module are easily separated. In other words, the display device of the present invention can avoid damaging the panel module and/or the backlight module during the rework of the separation panel module and the backlight module. Moreover, if the display device does not need to be reworked, the excess wire other than the glued portion exposed between the panel module and the backlight module can be removed without affecting the structural strength of the display device after assembly.
根據本發明一實施例,上述的顯示裝置包含背光模組、面板模組、膠體以及線材。面板模組承載於背光模組上。膠體用以黏合背光模組與面板模組。線材部份地受膠體包覆。According to an embodiment of the invention, the display device includes a backlight module, a panel module, a colloid, and a wire. The panel module is carried on the backlight module. The glue is used to bond the backlight module and the panel module. The wire is partially covered with a gel.
於本發明的一實施例中,上述的背光模組進一步包含框架以及膠框。框架環繞於面板模組外。膠框的外緣與框架組裝。面板模組的邊緣承載於膠框上,致使膠合通道形成於膠框、框架與面板模組之間。膠體於膠合通道中黏合膠框、框架與面板模組。線材沿膠合通道設置並部份地受膠體包覆。In an embodiment of the invention, the backlight module further includes a frame and a plastic frame. The frame surrounds the panel module. The outer edge of the frame is assembled with the frame. The edge of the panel module is carried on the plastic frame, so that the glue channel is formed between the plastic frame, the frame and the panel module. The glue adheres to the plastic frame, frame and panel module in the glue channel. The wire is placed along the glue channel and partially covered by the glue.
於本發明的一實施例中,上述的膠合通道包含第一側通道、第二側通道以及連接通道。第一側通道與第二側通道分別位於面板模組的兩相對側。連接通道連通於第一側通道與第二側通道之間。In an embodiment of the invention, the glue channel includes a first side channel, a second side channel, and a connection channel. The first side channel and the second side channel are respectively located on opposite sides of the panel module. The connecting passage is connected between the first side passage and the second side passage.
於本發明的一實施例中,上述的第一側通道的末端具有第一開口。第二側通道的末端具有第二開口。線材的兩端分別露出於第一開口與第二開口之外。In an embodiment of the invention, the end of the first side channel has a first opening. The end of the second side channel has a second opening. Both ends of the wire are exposed outside the first opening and the second opening, respectively.
於本發明的一實施例中,上述的線材的兩端分別與第一側通道的末端以及第二側通道的末端切齊。In an embodiment of the invention, the two ends of the wire are respectively aligned with the end of the first side channel and the end of the second side channel.
於本發明的一實施例中,上述的膠體係分段地黏合於第一側通道以及第二側通道中。In an embodiment of the invention, the glue system is segmentally bonded to the first side channel and the second side channel.
於本發明的一實施例中,上述的膠體係連續地或分段地黏合於第一側通道、連接通道以及第二側通道中。In an embodiment of the invention, the glue system is adhered continuously or in sections to the first side channel, the connecting channel and the second side channel.
於本發明的一實施例中,上述的膠合通道大體上呈U字型。In an embodiment of the invention, the glue passage is substantially U-shaped.
於本發明的一實施例中,上述的膠合通道的末端具有第一開口。線材的一端露出於第一開口之外。In an embodiment of the invention, the end of the glue channel has a first opening. One end of the wire is exposed outside the first opening.
於本發明的一實施例中,上述的線材的一端與膠合通道的末端切齊。In an embodiment of the invention, one end of the wire is aligned with the end of the glue channel.
於本發明的一實施例中,上述的線材的機械強度大於膠體的機械強度。In an embodiment of the invention, the mechanical strength of the wire is greater than the mechanical strength of the gel.
於本發明的一實施例中,上述的線材的線徑為0.01公釐至1.0公釐。In an embodiment of the invention, the wire has a wire diameter of 0.01 mm to 1.0 mm.
本發明的另一技術樣態是一種顯示裝置組裝方法。根據本發明一實施例,上述的顯示裝置組裝方法包含下列步驟。提供背光模組。放置線材於背光模組上。塗佈膠體至背光模組。放置面板模組於背光模組上,致使膠體黏合背光模組與面板模組,並包覆部份線材。Another aspect of the present invention is a display device assembly method. According to an embodiment of the invention, the above display device assembly method comprises the following steps. A backlight module is provided. Place the wire on the backlight module. Apply the gel to the backlight module. The panel module is placed on the backlight module, so that the glue body is bonded to the backlight module and the panel module, and a part of the wire is covered.
於本發明的一實施例中,上述放置線材的步驟進一步包含放置線材於膠框上並鄰近框架的步驟。In an embodiment of the invention, the step of placing the wire further comprises the step of placing the wire on the frame and adjacent to the frame.
於本發明的一實施例中,上述塗佈膠體的步驟進一步包含塗佈膠體至框架的步驟。In an embodiment of the invention, the step of applying the colloid further comprises the step of applying a colloid to the frame.
於本發明的一實施例中,上述放置面板模組的步驟進一步包含朝向膠框放置面板模組,致使面板模組的邊緣刮動膠體朝向線材移動的步驟,以及承載面板模組的邊緣於膠框上,致使膠體黏合膠框、框架與面板模組,並包覆部份線材的步驟。In an embodiment of the present invention, the step of placing the panel module further comprises: placing the panel module toward the plastic frame, causing the edge of the panel module to scrape the colloid toward the wire, and the edge of the carrying panel module to be glued On the frame, the step of bonding the glue frame, the frame and the panel module, and covering part of the wire.
於本發明的一實施例中,上述承載面板模組的步驟進一步包含承載面板模組的邊緣於膠框上,致使膠體於膠框、框架與面板模組之間形成的膠合通道中黏合膠框、框架與面板模組,並包覆部份線材的步驟。In an embodiment of the present invention, the step of carrying the panel module further includes: carrying the edge of the panel module on the plastic frame, so that the glue body is glued to the plastic frame in the glue channel formed between the plastic frame, the frame and the panel module; , the frame and the panel module, and the steps of covering part of the wire.
於本發明的一實施例中,上述的顯示裝置組裝方法進一步包含將線材的兩端分別切齊第一開口以及第二開口的步驟。In an embodiment of the invention, the display device assembly method further includes the step of cutting the two ends of the wire into the first opening and the second opening, respectively.
於本發明的一實施例中,上述的顯示裝置組裝方法進一步包含將線材的該端切齊第一開口。In an embodiment of the invention, the display device assembly method further includes cutting the end of the wire into the first opening.
本發明的另一技術樣態是一種顯示裝置拆卸方法。根據本發明一實施例,上述的顯示裝置拆卸方法包含下列步驟。提供顯示裝置,其中顯示裝置包含背光模組及面板模組,面板模組承載於背光模組上,膠體黏合背光模組與面板模組,且線材貫穿膠體。拉扯線材以破壞膠體的結構。分離面板模組與背光模組。Another aspect of the present invention is a method of disassembling a display device. According to an embodiment of the invention, the above method for removing a display device comprises the following steps. A display device is provided, wherein the display device comprises a backlight module and a panel module, the panel module is carried on the backlight module, the glue body is bonded to the backlight module and the panel module, and the wire material penetrates the colloid. Pull the wire to break the structure of the gel. Separate the panel module and the backlight module.
於本發明的一實施例中,上述拉扯線材的步驟進一步包含拉扯線材分別外露於第一開口以及第二開口的兩端以破壞膠體的結構的步驟。In an embodiment of the invention, the step of pulling the wire further comprises the steps of exposing the wire to the first opening and the second opening to break the structure of the colloid.
於本發明的一實施例中,上述拉扯線材的步驟進一步包含拉扯線材外露於第一開口的該端以破壞膠體的結構的步驟。In an embodiment of the invention, the step of pulling the wire further comprises the step of pulling the wire exposed to the end of the first opening to break the structure of the colloid.
以下將以圖式揭露本發明的複數個實施例,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本發明。也就是說,在本發明部分實施例中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示。The embodiments of the present invention are disclosed in the following drawings, and for the purpose of illustration However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic representation.
本發明的一技術態樣是一種背光模組。更具體地說,其主要是在組裝顯示裝置的面板模組與背光模組的過程中,先於背光模組的膠框與框架之間置入一條線材,再塗佈膠體以黏合面板模組、膠框與框架,並同時使膠體包覆部份線材。因此,當顯示裝置因組裝失誤或不良品因素而需要重工時,可直接拉扯線材以破壞膠體結構,使得面板模組與背光模組容易分離。換言之,本發明的顯示裝置可避免於分離面板模組與背光模組的重工過程中毀損面板模組及/或背光模組。並且,若顯示裝置不需重工,則可將裸露於面板模組與背光模組之間的膠合部位以外的多餘線材除去。One aspect of the present invention is a backlight module. More specifically, in the process of assembling the panel module and the backlight module of the display device, a wire is placed between the plastic frame of the backlight module and the frame, and then the glue is applied to bond the panel module. , plastic frame and frame, and at the same time make the gel cover part of the wire. Therefore, when the display device needs to be reworked due to assembly errors or defective factors, the wire can be directly pulled to break the colloidal structure, so that the panel module and the backlight module are easily separated. In other words, the display device of the present invention can avoid damaging the panel module and/or the backlight module during the rework of the separation panel module and the backlight module. Moreover, if the display device does not need to be reworked, excess wires other than the glued portion exposed between the panel module and the backlight module can be removed.
請參照第1圖。第1圖為繪示依照本發明一實施例之顯示裝置1的局部剖視圖。Please refer to Figure 1. 1 is a partial cross-sectional view showing a display device 1 in accordance with an embodiment of the present invention.
如第1圖所示,應用本發明的顯示裝置1的電子裝置可以是可攜式電腦裝置(例如,筆記型電腦、平板電腦...等)或是手持式電子裝置(例如,PDA、手機、遊戲機...等),但並不以此為限。換言之,應用本發明的顯示裝置1的電子裝置可以是任何具有顯示功能的電子產品,只要顯示裝置1於組裝過程中有降低重工成本的需求,皆可應用本發明的概念導入顯示裝置1的組裝製程中。As shown in FIG. 1, the electronic device to which the display device 1 of the present invention is applied may be a portable computer device (for example, a notebook computer, a tablet computer, etc.) or a handheld electronic device (for example, a PDA or a mobile phone). , game consoles, etc.), but not limited to this. In other words, the electronic device to which the display device 1 of the present invention is applied may be any electronic product having a display function, and the assembly of the concept introduction display device 1 of the present invention can be applied as long as the display device 1 has a need to reduce the cost of rework in the assembly process. In the process.
如第1圖所示,於本實施例中,本發明的顯示裝置1主要包含有面板模組12以及背光模組10。顯示裝置1的背光模組10至少包含框架100、膠框102、導光板104、反射片106、以及光學膜片108。背光模組10的發光源(圖未示)可以採用冷陰極管(CCFL)或發光二極體(LED)。背光模組10的框架100環繞於面板模組12外。背光模組10的膠框102外緣與框架100組裝。背光模組10的反射片106設置於框架100上。背光模組10的導光板104設置於反射片106上。背光模組10的光學膜片108設置於導光板104上。顯示裝置1的面板模組12的邊緣承載於膠框102上。顯示裝置1的面板模組12包含彩色濾光片基板120、薄膜電晶體基板122、上偏光片124以及下偏光片126。面板模組12的彩色濾光片基板120與薄膜電晶體基板122相互黏合。面板模組12的上偏光片124黏合至彩色濾光片基板120上方。面板模組12的下偏光片126黏合至薄膜電晶體基板122的下方。藉此,背光模組10的發光源即可發射光線進入導光板104,並受反射片106反射以依序通過光學膜片108、下偏光片126、薄膜電晶體基板122、彩色濾光片基板120以及上偏光片124而離開面板模組12,進而可達到供使用者觀賞的功能。As shown in FIG. 1 , in the present embodiment, the display device 1 of the present invention mainly includes a panel module 12 and a backlight module 10 . The backlight module 10 of the display device 1 includes at least a frame 100, a plastic frame 102, a light guide plate 104, a reflection sheet 106, and an optical film 108. The light source (not shown) of the backlight module 10 may be a cold cathode tube (CCFL) or a light emitting diode (LED). The frame 100 of the backlight module 10 surrounds the panel module 12 . The outer edge of the plastic frame 102 of the backlight module 10 is assembled with the frame 100. The reflection sheet 106 of the backlight module 10 is disposed on the frame 100. The light guide plate 104 of the backlight module 10 is disposed on the reflective sheet 106. The optical film 108 of the backlight module 10 is disposed on the light guide plate 104. The edge of the panel module 12 of the display device 1 is carried on the plastic frame 102. The panel module 12 of the display device 1 includes a color filter substrate 120, a thin film transistor substrate 122, an upper polarizer 124, and a lower polarizer 126. The color filter substrate 120 of the panel module 12 and the thin film transistor substrate 122 are bonded to each other. The upper polarizer 124 of the panel module 12 is bonded to the color filter substrate 120. The lower polarizer 126 of the panel module 12 is bonded to the lower side of the thin film transistor substrate 122. Thereby, the illumination source of the backlight module 10 can emit light into the light guide plate 104, and is reflected by the reflection sheet 106 to sequentially pass through the optical film 108, the lower polarizer 126, the thin film transistor substrate 122, and the color filter substrate. The 120 and the upper polarizer 124 are separated from the panel module 12, thereby achieving the function for the user to view.
同樣示於第1圖,於本實施例中,顯示裝置1的面板模組12與背光模組10之間的固定方式,係藉由膠體2黏合於面板模組12與背光模組10之間。進一步來說,當顯示裝置1的面板模組12承載於背光模組10的膠框102上時,背光模組10的膠框102及框架100與面板模組12之間即形成膠合通道14。換言之,膠體2於膠合通道14中黏合膠框102、框架100與面板模組12。於本實施例中,顯示裝置1還包含有線材3,線材3係沿膠合通道14設置並部份地受膠體2包覆。Also shown in FIG. 1 , in this embodiment, the fixing manner between the panel module 12 of the display device 1 and the backlight module 10 is adhered between the panel module 12 and the backlight module 10 by the glue 2 . . Further, when the panel module 12 of the display device 1 is carried on the plastic frame 102 of the backlight module 10, the glue frame 102 of the backlight module 10 and the frame 100 and the panel module 12 form a glue channel 14 . In other words, the glue 2 bonds the plastic frame 102 , the frame 100 and the panel module 12 in the glue channel 14 . In the present embodiment, the display device 1 further includes a wire 3 which is disposed along the glue channel 14 and partially covered by the glue 2.
請參照第2圖以及第3圖。第2圖為繪示第1圖中之線材3相對背光模組10的框架100與膠框102的立體分解圖。第3圖為繪示第1圖中之顯示裝置1的立體組合圖。Please refer to Figure 2 and Figure 3. FIG. 2 is an exploded perspective view showing the frame 3 and the frame 102 of the backlight module 10 in FIG. 1 . Fig. 3 is a perspective assembled view of the display device 1 in Fig. 1.
如第2圖與第3圖所示,於本實施例中,背光模組10的膠框102及框架100與面板模組12之間所形成的膠合通道14包含第一側通道140、第二側通道144以及連接通道142。膠合通道14的第一側通道140與第二側通道144分別位於面板模組12的兩相對側。膠合通道14的連接通道142連通於第一側通道140與第二側通道144之間。於本實施例中,膠合通道14大體上呈U字型。並且,膠合通道14的第一側通道140的末端具有第一開口140a,第二側通道144的末端具有第二開口144a。As shown in FIG. 2 and FIG. 3 , in the embodiment, the glue frame 102 formed between the plastic frame 102 of the backlight module 10 and the frame 100 and the panel module 12 includes a first side channel 140 and a second portion. Side channel 144 and connection channel 142. The first side channel 140 and the second side channel 144 of the glue channel 14 are respectively located on opposite sides of the panel module 12. The connecting passage 142 of the glue channel 14 is in communication with the first side channel 140 and the second side channel 144. In the present embodiment, the glue channel 14 is substantially U-shaped. Also, the end of the first side channel 140 of the glue channel 14 has a first opening 140a, and the end of the second side channel 144 has a second opening 144a.
如第2圖所示,本實施例僅採用單一線材3,並使線材3彎折呈如U字型的膠合通道14。因此,當面板模組12與背光模組10相互黏合時,線材3的兩端分別露出於第一側通道140的第一開口140a與第二側通道144的第二開口144a之外,如第3圖所示。As shown in Fig. 2, this embodiment uses only a single wire 3, and the wire 3 is bent into a U-shaped glue channel 14. Therefore, when the panel module 12 and the backlight module 10 are bonded to each other, the two ends of the wire 3 are exposed outside the first opening 140a of the first side channel 140 and the second opening 144a of the second side channel 144, respectively. Figure 3 shows.
於一實施例中,膠體2係連續地黏合於膠合通道14的第一側通道140、連接通道142以及第二側通道144中。由於膠體2塗佈於膠合通道14中的長度較長,因此在面板模組12與背光模組10相互黏合之後,可加強顯示裝置1組裝後的結構強度。然而,若顯示裝置1組裝後的結構強度在可接受的範圍內,則於另一實施例中,膠體2亦可分段地黏合於膠合通道14的第一側通道140、連接通道142以及第二側通道144中,此舉還可因節省膠體2的使用量而節省成本。In one embodiment, the colloid 2 is continuously bonded to the first side channel 140, the connecting channel 142, and the second side channel 144 of the glue channel 14. Since the length of the glue 2 applied to the glue channel 14 is long, the structural strength of the display device 1 after assembly can be enhanced after the panel module 12 and the backlight module 10 are bonded to each other. However, if the structural strength of the display device 1 after assembly is within an acceptable range, in another embodiment, the colloid 2 may also be bonded to the first side channel 140, the connection channel 142, and the first portion of the glue channel 14 in sections. In the two-sided channel 144, this can also save costs by saving the amount of use of the colloid 2.
請參照第4圖。第4圖為繪示第1圖中之線材3相對背光模組10的框架100與膠框102於另一實施例的立體分解圖。Please refer to Figure 4. FIG. 4 is an exploded perspective view showing another embodiment of the frame 3 and the frame 102 of the wire 3 in FIG. 1 with respect to the backlight module 10.
如第4圖所示,本實施例採用兩條線材3,並使線材3分別沿膠合通道14的第一側通道140與第二側通道144設置。因此,當面板模組12與背光模組10相互黏合時,線材3的兩端分別露出於第一側通道140的第一開口140a與第二側通道144的第二開口144a之外,同樣如第3圖所示。As shown in FIG. 4, the present embodiment employs two wires 3, and the wires 3 are disposed along the first side passage 140 and the second side passage 144 of the gluing passage 14, respectively. Therefore, when the panel module 12 and the backlight module 10 are bonded to each other, the two ends of the wire 3 are exposed outside the first opening 140a of the first side channel 140 and the second opening 144a of the second side channel 144, respectively. Figure 3 shows.
於一實施例中,若顯示裝置1組裝後的結構強度在可接受的範圍內,膠體2亦可僅分段地黏合於膠合通道14的第一側通道140以及第二側通道144中。於實際應用中,由於僅於膠合通道14的第一側通道140以及第二側通道144中塗佈膠體2,因此若為了再進一步節省線材3的使用量,則此實施例可搭配第4圖採用兩條線材3的實施例一起應用。同樣地,膠體2亦可分別連續地或分段地黏合於膠合通道14的第一側通道140以及第二側通道144中。In one embodiment, if the structural strength of the display device 1 after assembly is within an acceptable range, the colloid 2 may also be bonded to the first side channel 140 and the second side channel 144 of the glue channel 14 only in sections. In practical applications, since the colloid 2 is only applied to the first side channel 140 and the second side channel 144 of the glue channel 14, the embodiment can be matched with the fourth figure in order to further save the amount of the wire 3 used. The embodiment using two wires 3 is applied together. Likewise, the colloid 2 can also be bonded to the first side channel 140 and the second side channel 144 of the glue channel 14 continuously or in sections, respectively.
在面板模組12與背光模組10的組裝過程中若發生失誤,或者組裝後的顯示裝置1於後續剝離測試階段被判定為不良品時,則本發明的顯示裝置1即必須進行重工的程序。為了使面板模組12與背光模組10容易分離而不會受到損壞,可先拉扯線材3以破壞膠體2結構。相對地,若顯示裝置1不需重工,則可將第3圖所示的線材3分別露出於第一側通道140的末端以及第二側通道144的末端的多餘部份切除,並不會影響顯示裝置1組裝後應有的結構強度。When a mistake occurs in the assembly process of the panel module 12 and the backlight module 10, or the assembled display device 1 is judged to be defective in the subsequent peeling test stage, the display device 1 of the present invention must be reworked. . In order to easily separate the panel module 12 from the backlight module 10 without being damaged, the wire 3 may be pulled first to break the structure of the colloid 2. In contrast, if the display device 1 does not need to be reworked, the wire 3 shown in FIG. 3 can be exposed at the end of the first side channel 140 and the excess portion of the end of the second side channel 144 can be removed without affecting. The structural strength of the display device 1 after assembly.
於一實施例中,為了達到藉由線材3破壞膠體2結構的目的,線材3的機械強度必須大於膠體2的機械強度。In one embodiment, in order to achieve the purpose of breaking the structure of the colloid 2 by the wire 3, the mechanical strength of the wire 3 must be greater than the mechanical strength of the colloid 2.
於一實施例中,為了適於沿膠合通道14進行設置,線材3的線徑為0.01公釐至1.0公釐。In one embodiment, the wire 3 has a wire diameter of from 0.01 mm to 1.0 mm in order to be suitable for placement along the gluing channel 14.
請參照第5A圖、第5B圖、第5C圖以及第6圖。第5A圖為繪示第1圖中之面板模組12與背光模組10的分解示意圖,其中線材3放置於膠框102上並鄰近框架100。第5B圖為繪示第1圖中之面板模組12與背光模組10的分解示意圖,其中膠體2係塗佈至框架100。第5C圖為繪示第1圖中之面板模組12與背光模組10的分解示意圖,其中面板模組12的邊緣刮動膠體2朝向線材3移動。第6圖為繪示依照本發明一實施例之顯示裝置組裝方法的流程圖。Please refer to FIG. 5A, FIG. 5B, FIG. 5C, and FIG. FIG. 5A is an exploded perspective view of the panel module 12 and the backlight module 10 in FIG. 1 , wherein the wire 3 is placed on the plastic frame 102 and adjacent to the frame 100 . FIG. 5B is an exploded perspective view of the panel module 12 and the backlight module 10 in FIG. 1 , wherein the colloid 2 is applied to the frame 100 . FIG. 5C is an exploded perspective view of the panel module 12 and the backlight module 10 in FIG. 1 , wherein the edge of the panel module 12 scrapes the colloid 2 toward the wire 3 . FIG. 6 is a flow chart showing a method of assembling a display device according to an embodiment of the invention.
如第5A圖與第6圖所示,於本實施例中,顯示裝置組裝方法可應用於如第1圖所示之顯示裝置1,因此顯示裝置1內所含的元件及其結構在此不再贅述。首先,可依照顯示裝置組裝方法係進行下列步驟:As shown in FIGS. 5A and 6 , in the present embodiment, the display device assembly method can be applied to the display device 1 as shown in FIG. 1 , and therefore the components and structures contained in the display device 1 are not here. Let me repeat. First, the following steps can be performed in accordance with the display device assembly method:
S100:提供背光模組10。S100: providing a backlight module 10.
S102:放置線材3於膠框102上並鄰近框架100。S102: Place the wire 3 on the plastic frame 102 and adjacent to the frame 100.
將線材3放置於膠框102上並鄰近框架100的步驟中,可選擇性地採用如第2圖所示的單一線材3,或者可採用如第4圖所示的兩條線材3。In the step of placing the wire 3 on the plastic frame 102 and adjacent to the frame 100, a single wire 3 as shown in Fig. 2 may be selectively employed, or two wires 3 as shown in Fig. 4 may be employed.
如第5B圖與第6圖所示,於本實施例中,可依照顯示裝置組裝方法接著進行下列步驟:As shown in FIG. 5B and FIG. 6, in the embodiment, the following steps may be followed in accordance with the display device assembly method:
S104:塗佈膠體2至框架100。S104: Coating the colloid 2 to the frame 100.
如第5C圖與第6圖所示,於本實施例中,為了達到使線材3包覆於膠體2中的目的,可依照顯示裝置組裝方法接著進行下列步驟:As shown in FIG. 5C and FIG. 6, in the present embodiment, in order to achieve the purpose of coating the wire 3 in the colloid 2, the following steps may be followed in accordance with the display device assembly method:
S106:朝向膠框102放置面板模組12,致使面板模組12的邊緣刮動膠體2朝向線材3移動。S106: The panel module 12 is placed toward the plastic frame 102, so that the edge of the panel module 12 scrapes the colloid 2 toward the wire 3.
如第1圖與第6圖所示,於本實施例中,顯示裝置組裝方法接著進行下列步驟:As shown in FIGS. 1 and 6, in the present embodiment, the display device assembly method proceeds to the following steps:
S108:承載面板模組12的邊緣於膠框102上,致使膠體2於膠框102、框架100與面板模組12之間形成的膠合通道14中黏合膠框102、框架100與面板模組12,並包覆部份線材3。S108: The edge of the carrying panel module 12 is on the plastic frame 102, so that the glue 2 is bonded to the plastic frame 102, the frame 100 and the panel module 12 in the glue channel 14 formed between the plastic frame 102 and the frame 100 and the panel module 12. And covering part of the wire 3 .
在黏合膠框102、框架100與面板模組12之後,若顯示裝置1不需重工,則顯示裝置組裝方法最後可進行下列步驟:After the adhesive frame 102, the frame 100 and the panel module 12 are applied, if the display device 1 does not need to be reworked, the display device assembly method can finally perform the following steps:
S110:將線材3的兩端分別切齊第一開口140a以及第二開口144a。S110: The two ends of the wire 3 are respectively cut into the first opening 140a and the second opening 144a.
換言之,可將第3圖所示的線材3分別露出於第一側通道140的末端以及第二側通道144的末端的多餘部份切除,並不會影響顯示裝置1組裝後應有的結構強度,也可恢復原本的外觀。In other words, the wire 3 shown in FIG. 3 can be exposed at the end of the first side channel 140 and the excess portion of the end of the second side channel 144, respectively, without affecting the structural strength of the display device 1 after assembly. It can also restore the original appearance.
請參照第7圖。第7圖為繪示依照本發明一實施例之顯示裝置拆卸方法的流程圖。Please refer to Figure 7. FIG. 7 is a flow chart showing a method of disassembling a display device according to an embodiment of the invention.
如第3圖與第7圖所示,於本實施例中,在黏合膠框102、框架100與面板模組12之後,若顯示裝置1需要重工,則可依照本發明的顯示裝置拆卸方法進行下列步驟:S300:提供顯示裝置1,其中顯示裝置1包含背光模組10及面板模組12,面板模組12承載於背光模組10上,膠體2黏合背光模組10與面板模組12,且線材3貫穿膠體2。As shown in FIG. 3 and FIG. 7 , in the present embodiment, after the adhesive frame 102 , the frame 100 , and the panel module 12 , if the display device 1 needs to be reworked, the display device removal method according to the present invention may be performed. The following steps: S300: providing a display device 1 , wherein the display device 1 includes a backlight module 10 and a panel module 12 , the panel module 12 is carried on the backlight module 10 , and the glue 2 is bonded to the backlight module 10 and the panel module 12 . And the wire 3 penetrates the colloid 2.
S302:拉扯線材3分別外露於第一開口140a以及第二開口144a的兩端以破壞膠體2的結構。S302: The pull wires 3 are exposed at both ends of the first opening 140a and the second opening 144a, respectively, to break the structure of the colloid 2.
S304:分離面板模組12與背光模組10。S304: The panel module 12 and the backlight module 10 are separated.
由以上對於本發明的具體實施例的詳述,可以明顯地看出,本發明的顯示裝置主要是在組裝顯示裝置的面板模組與背光模組的過程中,先於背光模組的膠框與框架之間置入一條線材,再塗佈膠體以黏合面板模組、膠框與框架,並同時使膠體包覆部份線材。因此,當顯示裝置因組裝失誤或不良品因素而需要重工時,可直接拉扯線材以破壞膠體結構,使得面板模組與背光模組容易分離。換言之,本發明的顯示裝置可避免於分離面板模組與背光模組的重工過程中毀損面板模組及/或背光模組。並且,若顯示裝置不需重工,則可將裸露於面板模組與背光模組之間的膠合部位以外的多餘線材除去,並不會影響顯示裝置組裝後應有的結構強度。From the above detailed description of the specific embodiments of the present invention, it can be clearly seen that the display device of the present invention is mainly used in the process of assembling the panel module and the backlight module of the display device, before the plastic frame of the backlight module. A wire is placed between the frame and the glue is applied to bond the panel module, the plastic frame and the frame, and at the same time, the glue is coated with a part of the wire. Therefore, when the display device needs to be reworked due to assembly errors or defective factors, the wire can be directly pulled to break the colloidal structure, so that the panel module and the backlight module are easily separated. In other words, the display device of the present invention can avoid damaging the panel module and/or the backlight module during the rework of the separation panel module and the backlight module. Moreover, if the display device does not need to be reworked, the excess wire other than the glued portion exposed between the panel module and the backlight module can be removed without affecting the structural strength of the display device after assembly.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明的精神和範圍內,當可作各種的更動與潤飾,因此本發明的保護範圍當視後附的申請專利範圍所界定者為準。While the present invention has been described above by way of example only, it is not intended to limit the invention, and the invention may be modified and modified in various ways without departing from the spirit and scope of the invention. The scope is subject to the definition of the scope of the patent application.
1...顯示裝置1. . . Display device
10...背光模組10. . . Backlight module
100...框架100. . . frame
102...膠框102. . . Plastic frame
104...導光板104. . . Light guide
106...反射片106. . . A reflective sheet
108...光學膜片108. . . Optical diaphragm
12...面板模組12. . . Panel module
120...彩色濾光片基板120. . . Color filter substrate
122...薄膜電晶體基板122. . . Thin film transistor substrate
124...上偏光片124. . . Upper polarizer
126...下偏光片126. . . Lower polarizer
14...膠合通道14. . . Glue channel
140...第一側通道140. . . First side channel
140a...第一開口140a. . . First opening
142...連接通道142. . . Connection channel
144...第二側通道144. . . Second side channel
144a...第二開口144a. . . Second opening
2...膠體2. . . colloid
3...線材3. . . Wire
S100~S304...步驟S100~S304. . . step
第1圖為繪示依照本發明一實施例之顯示裝置的局部剖視圖。1 is a partial cross-sectional view showing a display device in accordance with an embodiment of the present invention.
第2圖為繪示第1圖中之線材相對背光模組的框架與膠框的立體分解圖。FIG. 2 is an exploded perspective view showing the frame of the first embodiment and the frame of the backlight module and the plastic frame.
第3圖為繪示第1圖中之顯示裝置的立體組合圖。Fig. 3 is a perspective assembled view showing the display device of Fig. 1.
第4圖為繪示第1圖中之線材相對背光模組的框架與膠框於另一實施例的立體分解圖。4 is an exploded perspective view showing another embodiment of the frame and the plastic frame of the wire member in FIG. 1 with respect to the backlight module.
第5A圖為繪示第1圖中之面板模組與背光模組的分解示意圖,其中線材放置於膠框上並鄰近框架。FIG. 5A is an exploded perspective view showing the panel module and the backlight module in FIG. 1 , wherein the wire is placed on the plastic frame and adjacent to the frame.
第5B圖為繪示第1圖中之面板模組與背光模組的分解示意圖,其中膠體係塗佈至框架。FIG. 5B is an exploded perspective view showing the panel module and the backlight module in FIG. 1 , wherein the glue system is applied to the frame.
第5C圖為繪示第1圖中之面板模組與背光模組的分解示意圖,其中面板模組的邊緣刮動膠體朝向線材移動。FIG. 5C is an exploded perspective view of the panel module and the backlight module in FIG. 1 , wherein the edge of the panel module scrapes the colloid toward the wire.
第6圖為繪示依照本發明一實施例之顯示裝置組裝方法的流程圖。FIG. 6 is a flow chart showing a method of assembling a display device according to an embodiment of the invention.
第7圖為繪示依照本發明一實施例之顯示裝置拆卸方法的流程圖。FIG. 7 is a flow chart showing a method of disassembling a display device according to an embodiment of the invention.
1...顯示裝置1. . . Display device
10...背光模組10. . . Backlight module
100...框架100. . . frame
102...膠框102. . . Plastic frame
104...導光板104. . . Light guide
106...反射片106. . . A reflective sheet
108...顯示裝置108. . . Display device
12...面板模組12. . . Panel module
120...彩色濾光片基板120. . . Color filter substrate
122...薄膜電晶體基板122. . . Thin film transistor substrate
124...上偏光片124. . . Upper polarizer
126...下偏光片126. . . Lower polarizer
14...膠合通道14. . . Glue channel
2...膠體2. . . colloid
3...線材3. . . Wire
Claims (31)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100133401A TWI467275B (en) | 2011-09-16 | 2011-09-16 | Display apparatus and assembling/disassembling method thereof |
| CN2011103704972A CN102509522A (en) | 2011-09-16 | 2011-11-14 | Display device, display device assembling method and display device disassembling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100133401A TWI467275B (en) | 2011-09-16 | 2011-09-16 | Display apparatus and assembling/disassembling method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201314299A TW201314299A (en) | 2013-04-01 |
| TWI467275B true TWI467275B (en) | 2015-01-01 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100133401A TWI467275B (en) | 2011-09-16 | 2011-09-16 | Display apparatus and assembling/disassembling method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102509522A (en) |
| TW (1) | TWI467275B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI878140B (en) * | 2024-06-05 | 2025-03-21 | 友達光電股份有限公司 | Backlight module and assembly method thereof |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI487984B (en) * | 2012-08-31 | 2015-06-11 | Au Optronics Corp | Backlight module |
| CN103921531B (en) * | 2013-01-14 | 2016-03-02 | 元太科技工业股份有限公司 | Separation apparatus |
| CN103745663B (en) * | 2014-01-20 | 2016-06-08 | 昆山龙腾光电有限公司 | Easily-disassembled display device |
| CN111176008B (en) * | 2020-02-24 | 2023-02-17 | 成都天马微电子有限公司 | Display device and electronic apparatus |
| TWI869772B (en) | 2023-02-10 | 2025-01-11 | 瑞軒科技股份有限公司 | Display device |
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|---|---|---|---|---|
| TW200722826A (en) * | 2005-12-14 | 2007-06-16 | Toppoly Optoelectronics Corp | Display apparatus |
| CN101073102A (en) * | 2005-07-11 | 2007-11-14 | 富士通日立等离子显示器股份有限公司 | flat panel display device |
| US20110126989A1 (en) * | 2007-12-28 | 2011-06-02 | Hassan Mohamed Farah | Method for Reworking Adhesively Bonded Liquid Crystal Displays |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100487536C (en) * | 2004-01-30 | 2009-05-13 | 友达光电股份有限公司 | Liquid crystal display device having a plurality of pixel electrodes |
| CN100573257C (en) * | 2005-12-20 | 2009-12-23 | 统宝光电股份有限公司 | monitor |
| CN101183285A (en) * | 2007-12-25 | 2008-05-21 | 友达光电股份有限公司 | Touch display device and rework method thereof |
-
2011
- 2011-09-16 TW TW100133401A patent/TWI467275B/en not_active IP Right Cessation
- 2011-11-14 CN CN2011103704972A patent/CN102509522A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101073102A (en) * | 2005-07-11 | 2007-11-14 | 富士通日立等离子显示器股份有限公司 | flat panel display device |
| TW200722826A (en) * | 2005-12-14 | 2007-06-16 | Toppoly Optoelectronics Corp | Display apparatus |
| US20110126989A1 (en) * | 2007-12-28 | 2011-06-02 | Hassan Mohamed Farah | Method for Reworking Adhesively Bonded Liquid Crystal Displays |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI878140B (en) * | 2024-06-05 | 2025-03-21 | 友達光電股份有限公司 | Backlight module and assembly method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102509522A (en) | 2012-06-20 |
| TW201314299A (en) | 2013-04-01 |
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