TWI857383B - Heat dissipation module - Google Patents

Abstract

A heat dissipation module including an air-cooling unit and a water-cooling unit is provided. The air-cooling unit includes a fan and a heat pipe. The heat pipe includes an evaporating part and a condensing part. The evaporating part is thermally coupled to a heat source, and the condensing part is disposed corresponding to the fan of the air-cooling unit. The water-cooling unit includes a water block thermally coupled to the evaporating part of the heat pipe. The evaporating part of the heat pipe is located between the water block and the heat source.

Description

Heat dissipation module

The present invention relates to a heat dissipation module, and in particular to a heat dissipation module integrating a water cooling heat dissipation mechanism and an air cooling heat dissipation mechanism.

In order to quickly discharge the heat inside the electronic device to the outside, the electronic device is usually equipped with a forced heat dissipation mechanism, which can be roughly divided into air cooling and water cooling. With the improvement of the computing performance of electronic devices, the electronic components inside the electronic device (such as the central processing unit or the graphics processing unit) generate a lot of heat during operation. Therefore, it is difficult to discharge a large amount of heat to the outside in a short time using a single air cooling mechanism or a single water cooling mechanism, which is gradually not in line with current needs.

The present invention provides a heat dissipation module, which has good heat dissipation efficiency.

The present invention provides a heat dissipation module, which is suitable for conducting heat generated by a heat source. The heat dissipation module includes an air cooling unit and a water cooling unit. The air cooling unit includes a fan and a heat pipe, wherein the heat pipe has an evaporation section thermally coupled to the heat source and a condensation section configured corresponding to the fan of the air cooling unit. The water cooling unit includes a water cooling head thermally coupled to the evaporation section of the heat pipe, wherein the evaporation section of the heat pipe is located between the water cooling head and the heat source.

Based on the above, the heat dissipation module of the present invention integrates the air-cooling heat dissipation mechanism and the water-cooling heat dissipation mechanism, so that the heat generated by the heat source can be discharged to the outside through the air-cooling heat dissipation mechanism and the water-cooling heat dissipation mechanism at the same time, thereby greatly accelerating the heat dissipation efficiency.

In order to make the above features and advantages of the present invention more clearly understood, embodiments are specifically cited below and described in detail with reference to the accompanying drawings.

FIG. 1 is a schematic diagram of a heat dissipation module according to an embodiment of the present invention. FIG. 2 is a side view schematic diagram of the heat dissipation module of FIG. 1. Referring to FIG. 1 and FIG. 2, in this embodiment, the heat dissipation module 100 can be applied to electronic devices such as desktop computers, laptop computers, and servers to discharge heat generated by a heat source 10 to the outside. For example, the heat source 10 can be a central processing unit or a graphics processing unit, or other electronic components that generate heat during operation.

In detail, the heat dissipation module 100 includes an air cooling unit 110 and a water cooling unit 120. That is, the heat dissipation module 100 integrates an air cooling mechanism and a water cooling mechanism, so that the heat generated by the heat source 10 can be discharged to the outside through the air cooling mechanism and the water cooling mechanism at the same time, thereby greatly accelerating the heat dissipation efficiency.

As shown in FIG. 1 and FIG. 2 , in this embodiment, the air cooling unit 110 includes a fan 111 and a heat pipe 112, wherein the fan 111 may be an axial flow fan, and the heat pipe 112 has an evaporation section 1121 and a condensation section 1122. Specifically, the evaporation section 1121 of the heat pipe 112 is thermally coupled to the heat source 10 and the water cooling unit 120, and the condensation section 1122 is configured to correspond to the fan 111 of the air cooling unit 110. For example, there may be a plurality of heat pipes 112, and they may be configured in parallel or in parallel.

As shown in FIG2 , the water cooling unit 120 is thermally coupled to the heat source 10 through the evaporation section 1121 of the heat pipe 112. Specifically, the water cooling unit 120 includes a water cooling head 121, wherein the water cooling head 121 is thermally coupled to the evaporation section 1121 of the heat pipe 112, and is thermally coupled to the heat source 10 through the evaporation section 1121. In other words, the evaporation section 1121 of the heat pipe 112 is located between the water cooling head 121 and the heat source 10, or in other words, the water cooling head 121 and the heat source 10 are located on opposite sides of the evaporation section 1121, respectively. Therefore, the heat generated by the heat source 10 can be first transferred to the evaporation section 1121 of the heat pipe 112 , and part of the heat is conducted outward through the heat pipe 112 , while the other part of the heat is transferred from the evaporation section 1121 to the water cooling head 121 and then conducted outward through the water cooling head 121 .

In this embodiment, the heat dissipation module 100 further includes a heat conductive plate 130, a first heat conductive bonding layer 140 and a second heat conductive bonding layer 150, wherein the heat conductive plate 130 is disposed between the evaporation section 1121 of the heat pipe 112 and the heat source 10, and the evaporation section 1121 of the heat pipe 112 is thermally coupled to the heat source 10 through the heat conductive plate 130. On the other hand, the evaporation section 1121 of the heat pipe 112 is located between the water cooling head 121 and the heat conductive plate 130. Furthermore, the first heat conductive bonding layer 140 can be a heat conductive paste or a heat conductive adhesive, and is disposed between the water cooling head 121 and the evaporation section 1121 of the heat pipe 112. Therefore, the water-cooling head 121 can be thermally coupled to the evaporation section 1121 of the heat pipe 112 through the first thermally conductive bonding layer 140, and can be firmly bonded to the evaporation section 1121 of the heat pipe 112. On the other hand, the second thermally conductive bonding layer 150 can be a thermally conductive paste or a thermally conductive adhesive, and is disposed between the evaporation section 1121 of the heat pipe 112 and the thermally conductive plate 130. Therefore, the evaporation section 1121 of the heat pipe 112 can be thermally coupled to the thermally conductive plate 130 through the second thermally conductive bonding layer 150, and can be firmly bonded to the thermally conductive plate 130.

The first heat conductive bonding layer 140 and the second heat conductive bonding layer 150 are respectively disposed on opposite sides of the evaporation section 1121 of the heat pipe 112, and the evaporation section 1121 of the heat pipe 112 can be fixed between the water cooling head 121 and the heat conductive plate 130 through the first heat conductive bonding layer 140 and the second heat conductive bonding layer 150, so as to help improve the structural reliability and ensure the thermal coupling relationship between the heat pipe 112, the water cooling head 121 and the heat conductive plate 130. In other embodiments, the heat conductive plate 130 can be fastened to the water cooling head 121 through a plurality of fasteners (such as screws) to clamp and fix the heat pipe 112 between the water cooling head 121 and the heat conductive plate 130.

As shown in FIG. 2 , the heat generated by the heat source 10 is first transferred to the heat conducting plate 130, then transferred from the heat conducting plate 130 to the second heat conducting joint layer 150, and then transferred from the second heat conducting joint layer 150 to the evaporation section 1121 of the heat pipe 112. A portion of the heat transferred to the evaporation section 1121 of the heat pipe 112 is conducted outwardly through the heat pipe 112, while another portion of the heat is transferred from the evaporation section 1121 of the heat pipe 112 to the first heat conducting joint layer 140, then transferred from the first heat conducting joint layer 140 to the water cooling head 121, and finally conducted outwardly through the water cooling head 121. In other words, the heat generated by the heat source 10 can be conducted outwardly through two heat dissipation paths.

In this embodiment, the evaporation section 1121 of the heat pipe 112 is perpendicular to the condensation section 1122, and the condensation section 1122 is parallel to the gravity direction g. Once the liquid working fluid in the evaporation section 1121 is heated and evaporated into a gaseous working fluid, the gaseous working fluid rises and quickly flows to the condensation section 1122. Conversely, once the gaseous working fluid in the condensation section 1122 releases heat and condenses into a liquid working fluid, the liquid working fluid sinks and quickly flows back to the evaporation section 1121. In other words, the structural design of the heat pipe 112 not only helps to improve the circulation efficiency of the working fluid, but also helps to improve the heat dissipation efficiency.

FIG3 is a schematic top view of the heat dissipation module of FIG1. Referring to FIG2 and FIG3, the air cooling unit 110 further includes a heat dissipation fin assembly 113, wherein the heat dissipation fin assembly 113 is located on the flow path of the airflow 111a caused by the fan 111 of the air cooling unit 110, and the condensation section 1122 of the heat pipe 112 is penetrated through the heat dissipation fin assembly 113. In other words, the condensation section 1122 is configured corresponding to the fan 111 of the air cooling unit 110, and is located on the flow path of the airflow 111a caused by the fan 111 of the air cooling unit 110.

The water cooling head 121 is located between the fan 111 of the air cooling unit 110 and the evaporation section 1121 of the heat pipe 112. In other words, the fan 111 of the air cooling unit 110 and the evaporation section 1121 of the heat pipe 112 are located on opposite sides of the water cooling head 121. On the other hand, the fan 111 of the air cooling unit 110 is against the water cooling head 121, and the heat sink fin assembly 113 is close to one side of the fan 111, so as to reduce the volume of the heat dissipation module 100 to meet the design requirements of thin and light products.

Please refer to FIG. 1 and FIG. 3 . In this embodiment, the water cooling unit 120 further includes a circulation pipe 122, a water cooling radiator 123 and a fan 124, wherein the circulation pipe 122 is used to connect the water cooling head 121 and the water cooling radiator 123, and the fan 124 is configured corresponding to the water cooling radiator 123. The fan 124 may be an axial flow fan and is located between the water cooling head 121 and the water cooling radiator 123. In detail, the fan 111 and the fan 124 may be two axial flow fans arranged vertically, and the rotation axis A of the fan 111 of the air cooling unit 110 is perpendicular to the rotation axis B of the fan 124 of the water cooling unit 120, so as to avoid the hot air pushed outward by the fan 111 and the hot air pushed outward by the fan 124 to generate mixed flow. In other embodiments, the fan 111 and the fan 124 may be two centrifugal fans, or a combination of a centrifugal fan and an axial flow fan.

In summary, the heat dissipation module of the present invention integrates the air-cooled heat dissipation mechanism and the water-cooled heat dissipation mechanism, so that the heat generated by the heat source can be discharged to the outside through the air-cooled heat dissipation mechanism and the water-cooled heat dissipation mechanism at the same time, so as to greatly accelerate the heat dissipation efficiency. In detail, in the air-cooled heat dissipation mechanism, the evaporation section of the heat pipe is perpendicular to the condensation section, and the condensation section is parallel to the gravity direction. Therefore, once the liquid working fluid in the evaporation section is heated and evaporated into a gaseous working fluid, the gaseous working fluid can quickly flow to the condensation section. Conversely, once the gaseous working fluid in the condensation section releases heat and condenses into a liquid working fluid, the liquid working fluid can quickly flow back to the evaporation section. In other words, the structural design of the heat pipe in the air-cooled heat dissipation mechanism not only helps to improve the circulation efficiency of the working fluid, but also helps to improve the heat dissipation efficiency.

Although the present invention has been disclosed as above by the embodiments, they are not intended to limit the present invention. Any person with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be defined by the scope of the attached patent application.

10: heat source 100: heat dissipation module 110: air cooling unit 111: fan 111a: air flow 112: heat pipe 1121: evaporation section 1122: condensation section 113: heat dissipation fin assembly 120: water cooling unit 121: water cooling head 122: circulation pipe 123: water cooling radiator 124: fan 124a: air flow 130: heat conduction plate 140: first heat conduction joint layer 150: second heat conduction joint layer A, B: rotation axis g: gravity direction

FIG. 1 is a schematic diagram of a heat dissipation module of an embodiment of the present invention. FIG. 2 is a schematic diagram of a side view of the heat dissipation module of FIG. 1 . FIG. 3 is a schematic diagram of a top view of the heat dissipation module of FIG. 1 .

100: heat dissipation module 110: air cooling unit 111: fan 112: heat pipe 113: heat sink fin assembly 120: water cooling unit 121: water cooling head 122: circulation pipe 123: water cooling radiator 124: fan

Claims (7)

A heat dissipation module is suitable for conducting heat generated by a heat source, wherein the heat dissipation module includes: an air cooling unit, including a fan and a heat pipe, wherein the heat pipe has an evaporation section and a condensation section, the evaporation section is thermally coupled to the heat source, and the condensation section is configured corresponding to the fan of the air cooling unit; and a water cooling unit, including a water cooling head thermally coupled to the evaporation section of the heat pipe, a circulation pipe connected to the water cooling head, a water cooling radiator connected to the circulation pipe, and a fan configured corresponding to the water cooling radiator, and the fan of the water cooling unit is located between the water cooling head and the water cooling radiator, wherein the evaporation section of the heat pipe is located between the water cooling head and the heat source, and the rotation axis of the fan of the air cooling unit is perpendicular to the rotation axis of the fan of the water cooling unit. The heat dissipation module as described in claim 1 further includes: a heat conducting plate disposed between the evaporation section of the heat pipe and the heat source, and the evaporation section of the heat pipe is thermally coupled to the heat source through the heat conducting plate. The heat dissipation module as described in claim 2 further comprises: a first heat-conductive bonding layer, disposed between the water-cooling head and the evaporation section of the heat pipe, and the water-cooling head is thermally coupled to the evaporation section of the heat pipe through the first heat-conductive bonding layer; and a second heat-conductive bonding layer, disposed between the evaporation section of the heat pipe and the heat-conducting plate, and the evaporation section of the heat pipe is thermally coupled to the heat-conducting plate through the second heat-conductive bonding layer. A heat dissipation module as described in claim 1, wherein the water cooling row is located on the flow path of the airflow caused by the fan of the water cooling unit. The heat dissipation module as described in claim 1, wherein the condensation section of the heat pipe is located on the flow path of the airflow caused by the fan of the air cooling unit. The heat dissipation module as described in claim 1, wherein the air cooling unit further comprises: a heat dissipation fin assembly located on the flow path of the airflow caused by the fan of the air cooling unit, and the condensation section of the heat pipe is disposed through the heat dissipation fin assembly. A heat dissipation module as described in claim 1, wherein the evaporation section of the heat pipe is perpendicular to the condensation section.

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