TWI874082B - Methods of manufacture three-dimensional vapor chamber - Google Patents

Abstract

Methods of manufacture a three-dimensional vapor chamber are provided, which utilizes the solid phase diffusion bonding method to join the radial flange of the hollow tube to the bottom surface of the upper cover plate, ensuring a completely sealed and void-free joint. Additionally, capillary structures extend from the interior of the hollow tube to the bottom surface of the upper cover plate, allowing the liquid working medium to flow smoothly from the condenser section to the cavity without interruption.

Description

Three-dimensional temperature balancing plate manufacturing method

The present invention relates to a method for manufacturing a three-dimensional heat absorbing plate, and in particular to a method for manufacturing a three-dimensional heat absorbing plate that combines a heat pipe with a flat heat absorbing plate.

In the traditional manufacturing method of three-dimensional temperature balancing board, most of them use manual welding to connect the heat pipe to the flat temperature balancing board, and the heat pipe is directly overlapped on the upper surface of the flat temperature balancing board. However, this welding method is very difficult and relies heavily on the skills of the welder. Once there is insufficient solder or poor construction at a certain welding part, it is easy to cause the part to crack or have pores, resulting in failure of the entire device. In addition, during the welding process, whether it is the flux, solder or the high temperature during the welding process, it is easy to cause the internal capillary structure to be contaminated or deteriorated.

In view of this, the embodiment of the present invention provides a three-dimensional temperature balancing plate with a simple structure, reliability, and excellent heat transfer efficiency. Furthermore, the embodiment of the present invention also provides a manufacturing method with simple steps and high manufacturing efficiency.

The manufacturing method of a three-dimensional temperature equalizing plate of an embodiment of the present invention includes (but is not limited to) the following steps: first, a hollow tube, an upper cover plate and a lower bottom plate are provided; the hollow tube includes a closed end and an open end, the open end includes a radial flange; and the upper cover plate includes a through hole; then, the hollow tube passes through the through hole of the upper cover plate, and the radial flange and the upper cover plate are subjected to solid phase diffusion bonding; further, a capillary structure is formed in the hollow tube and the upper cover plate; finally, the upper cover plate and the lower bottom plate are bonded to form a cavity, and after the cavity is filled with a working medium, it is evacuated and sealed.

The three-dimensional temperature-averaging plate of one embodiment of the present invention includes (but is not limited to) at least one hollow tube, an upper cover, a lower bottom plate, at least one capillary structure and a working medium; the hollow tube includes a closed end and an open end, and the open end includes a radial flange; the upper cover includes at least one through hole; the at least one hollow tube is penetrated through the at least one through hole, and the radial flange of the at least one hollow tube is bonded to the bottom surface of the upper cover through solid phase diffusion bonding; the lower bottom plate is bonded to the upper cover, and a cavity is formed between the upper cover and the lower bottom plate; at least one capillary structure covers the inner wall surface of the hollow tube and the inner wall surface of the cavity; the working medium is contained in the cavity.

In summary, according to some embodiments of the three-dimensional temperature equalizing plate manufacturing method, the solid phase diffusion bonding technology is used to make the radial flange of the hollow tube body bonded to the bottom surface of the upper cover plate. The joint is completely tight without forming pores, and the bonding strength is high. It also adopts automated bonding, and the process efficiency and reliability are quite high. In addition, since no flux and solder are used, there will be no problems such as flux and solder contaminating the capillary structure and contaminating the internal chamber of the temperature equalizing plate in the general welding process. In addition, the capillary structure extends from the inside of the hollow tube body to at least a portion of the bottom surface of the upper cover plate, so the liquid working medium can smoothly return to the cavity (evaporation end) from the hollow tube body (condensation end) without interruption, which can increase the speed of the liquid working medium returning to the cavity, thereby improving the heat dissipation efficiency.

2: Hollow tube

3: Upper cover plate

4: Lower base plate

5: Copper mesh installation device

6: Opening holes

21: Closed end

22: Open end

31:Through hole

41: Outer frame edge

51:Standing pole

52: Coil spring

53: Turntable

221: Radial flange

Cs: capillary structure

Cs1: First metal braided mesh

Cs2: Second metal braided mesh

Cs3: Metal woven mesh

Cs4: Copper powder sintered body

Cs5: Copper powder sintered body

R: Rod body

S: cavity

Sp: Inner cavity

Figure 1A is a three-dimensional diagram of an embodiment of the three-dimensional temperature equalizing plate of the present invention.

Figure 1B is a cross-sectional view of an embodiment of the three-dimensional temperature equalizing plate of the present invention.

Figure 1C is a disassembled diagram of an embodiment of the three-dimensional temperature equalizing plate of the present invention.

Figure 2 is a schematic diagram of installing the first metal braided mesh in an embodiment of the present invention.

Figure 3 is a cross-sectional view of another embodiment of the three-dimensional temperature equalizing plate of the present invention.

FIG4A is a schematic diagram of laying copper powder in another embodiment of the three-dimensional temperature equalizing plate of the present invention.

Figure 4B is a cross-sectional view of another embodiment of the three-dimensional temperature equalizing plate of the present invention where copper powder is laid.

Various embodiments are presented below for detailed description, and the embodiments are only used as examples and do not limit the scope of the invention to be protected. In addition, some elements are omitted in the drawings in the embodiments to clearly show the technical features of the invention. Furthermore, the same reference numerals will be used in all drawings to represent the same or similar elements, and the drawings of the invention are only for schematic illustration, which may not be drawn to scale, and not all details may be presented in the drawings.

Please refer to Figures 1A, 1B and 1C. Figure 1A is a three-dimensional diagram of an embodiment of the three-dimensional temperature balancing plate of the present invention, Figure 1B is a cross-sectional diagram of an embodiment of the three-dimensional temperature balancing plate of the present invention, and Figure 1C is an exploded diagram of an embodiment of the three-dimensional temperature balancing plate of the present invention. As shown in the figure, in an embodiment of the three-dimensional temperature balancing plate, it includes three hollow tubes 2, but the number of hollow tubes 2 is not limited to three, and it can also be a single or other number, depending on actual needs.

Furthermore, each hollow tube 2 includes a closed end 21 and an open end 22, and a radial flange 221 is provided at the open end 22. In addition, the upper cover plate 3 includes three through holes 31, and the closed ends 21 of the three hollow tubes 2 pass through the three through holes 31 respectively, and the radial flange 221 of each hollow tube 2 is joined to the bottom surface of the upper cover plate 3. In some embodiments, solid phase diffusion bonding technology is used to allow the radial flange 221 of the hollow tube 2 to be completely and closely joined to the bottom surface of the upper cover plate 3.

Diffusion bonding used in this embodiment is a solid-state bonding technology that mainly uses pressure (force) to be applied to the joint in a high temperature environment to make the distance between the contact surfaces of the two workpieces reach the atomic distance, so that the atoms are embedded in each other and diffusely bonded, thereby bonding the metals. In some embodiments, diffusion bonding can make the atoms between the surfaces of the joints diffuse with each other to achieve metallurgical bonding of the surface. However, since solid-phase diffusion bonding technology does not require solder or flux, the joint surface has no stress effect and is stronger, and the strength and corrosion resistance are the same as the raw materials. After bonding, the two workpieces are almost integrated, and no pores will be formed at the joint.

In addition, the outer frame edge 41 of the lower bottom plate 4 is also joined to the bottom surface of the upper cover plate 3. In some embodiments, the joining here can also adopt solid phase diffusion joining technology; and after the upper cover plate 3 and the lower bottom plate 4 are joined, a cavity S is formed between the two. In addition, as shown in the figure, a capillary structure Cs is provided in the cavity S. In some embodiments, the capillary structure Cs covers the inner wall surface of the hollow tube 2 and the inner wall surface of the cavity S.

In addition, the cavity S contains a working medium, which may be water, acetone, ammonia, freon, alcohol or other organic substances. In other embodiments, such as the embodiment of a large-area lower bottom plate 4 and upper cover plate 3, a plurality of supporting columns (not shown in the figure) may be provided in the cavity S, which may be connected to the bottom surface of the upper cover plate 3 and the top surface of the lower bottom plate 4, thereby supporting between the lower bottom plate 4 and the upper cover plate 3 to maintain the space of the cavity S.

To further explain, in some embodiments, the capillary structure Cs can be a copper mesh structure, a copper powder sintered structure, a microgroove structure, a fiber structure, a whisker structure, or a combination of the above structures. In this embodiment, the capillary structure Cs includes a first metal braided mesh Cs1 and a second metal braided mesh Cs2; the first metal braided mesh Cs1 covers the inner wall surface of the hollow tube 2 and extends to the bottom surface of the upper cover plate 3.

In some embodiments, the first metal braided mesh Cs1 extends from the hollow tube 2 to a range beyond the outer edge of the radial flange 221, that is, the first metal braided mesh Cs1 not only covers the radial flange 221, but also further extends outward from the radial flange 221. In some embodiments, the first metal braided mesh Cs1 and the second metal braided mesh Cs2 can be fixed to the radial flange 221 and the bottom surface of the upper cover plate 3 in a semi-welded form.

In addition, three openings 6 are provided on the second metal braided mesh Cs2, and the size and position of the openings 6 correspond to the opening end 22 of the hollow tube 2. The second metal braided mesh Cs2 covers the inner wall surface of the cavity S and covers the first metal braided mesh Cs1, and the cavity S and the inner cavity Sp of the hollow tube 2 can be maintained unobstructed through the openings 6. In this way, the working medium in the vapor state can flow freely between the cavity S and the inner cavity Sp of the hollow tube 2, and the working medium in the liquid state can also flow freely between the first metal braided mesh Cs1 and the second metal braided mesh Cs2.

In some embodiments, the metal woven mesh may be a woven copper mesh, a woven stainless steel mesh, or other metal woven mesh that can provide liquid capillary action. On the other hand, in some embodiments, the second metal woven mesh Cs2 may not be provided with openings 6, and the working medium in a vapor state may also be allowed to penetrate by adjusting the density of the woven mesh.

Please continue to refer to Figure 1B. When the bottom plate 4 acts as the heat absorbing end, the working medium is heated and evaporated to form steam, and flows into the inner cavity Sp of the hollow tube 2. Furthermore, the hollow tube 2 acts as the heat dissipating end, and the working medium in the vapor state cools down in the hollow tube 2 and condenses into liquid and adheres to the first metal braided mesh Cs1. Then, the liquid is affected by the capillary force and flows out of the inner cavity Sp of the hollow tube 2 through the first metal braided mesh Cs1, and then penetrates into the second metal braided mesh Cs2, and then flows back into the cavity S.

Please continue to refer to Figure 1C, and the manufacturing method of the above embodiment is described below; first, three hollow tubes 2, an upper cover plate 3 and a lower bottom plate 4 are provided; then, the three hollow tubes 2 pass through the three through holes 31 on the upper cover plate 3 respectively, and the radial flanges 221 of the three hollow tubes 2 are flatly attached to the bottom surface of the upper cover plate 3, and then the radial flanges 221 and the upper cover plate 3 are subjected to solid phase diffusion bonding; further, a capillary structure Cs is formed in the hollow tube 2 and on the bottom surface of the upper cover plate 3 respectively; finally, the upper cover plate 3 and the lower bottom plate 4 are bonded to form a cavity S, and after the cavity S is filled with a working medium, the cavity S is evacuated and sealed.

In addition, in some embodiments, capillary structures Cs may be provided on all inner walls of the entire cavity S to enhance the reflux capability of the condensed liquid; and the capillary structures Cs on the inner walls of the cavity S may be a copper mesh structure, a copper powder sintered structure, a microgroove structure, a fiber structure, a crystal whisker structure, or a composite capillary structure of any two or three of the above capillary structures Cs.

Please refer to Figure 1C and Figure 2 together, wherein Figure 2 is a schematic diagram of installing the first metal braided mesh Cs1 in an embodiment of the present invention. The following describes a method for forming a capillary structure Cs in a hollow tube 2, that is, a step of installing the first metal braided mesh Cs1. First, the first metal braided mesh Cs1 is sleeved on a copper mesh installation device 5 and then inserted into the hollow tube 2. The first metal braided mesh Cs1 has been pre-made according to the shape of the hollow tube 2 by a braiding technique.

In some embodiments, the copper net installation device 5 may include a vertical rod 51, a coil spring 52 and a turntable 53; the turntable 53 is pivoted to the vertical rod 51, and the coil spring 52 is sleeved on the vertical rod 51, and one end is connected to the top of the vertical rod 51, and the other end is connected to the turntable 53; when the turntable 53 is rotated, the coil spring 52 can further entangle to reduce the outer diameter or untie to expand the outer diameter.

Accordingly, after the first metal braided net Cs1 is sleeved on the coil spring 52 and inserted into the hollow tube 2, the turntable 53 can be rotated to untangle the coil spring 52, for example, by rotating the turntable 53 clockwise, thereby stretching the first metal braided net Cs1, so that the first metal braided net Cs1 is stretched and adhered to the inner wall surface of the hollow tube 2. At this time, in some embodiments, a fixing means can be applied to the first metal braided net Cs1 and the inner wall surface of the hollow tube 2, such as applying semi-fusion, fusion or welding to a part of the first metal braided net Cs1.

To further explain, in some embodiments, the material of the first metal braided mesh Cs1 can be copper, and the material of the coil spring 52 can be stainless steel; and since the melting point of stainless steel is higher than that of copper, the coil spring 52 can be heated to allow the first metal braided mesh Cs1 to be fused or semi-fused to the inner wall of the hollow tube 2 at the contacting part with the coil spring 52, so that the first metal braided mesh Cs1 can be attached to the inner wall of the hollow tube 2. In addition, in other embodiments, the hollow tube 2 can also be heated to allow the first metal braided mesh Cs1 to be semi-fused to the inner wall of the hollow tube 2, thereby fixing the first metal braided mesh Cs1 to the inner wall of the hollow tube 2.

Finally, the turntable 53 is rotated again to wind the coil spring 52, for example, the turntable 53 is rotated counterclockwise, and the number of turns of the coil spring 52 around the vertical rod 51 increases, and the outer diameter of the coil spring 52 is reduced, so that the copper mesh mounting device 5 can be withdrawn from the hollow tube 2 without hindrance.

Please refer to FIG. 3, which is a cross-sectional view of another embodiment of the three-dimensional temperature equalizing plate of the present invention; the main difference between this embodiment and the aforementioned embodiment is that this embodiment adopts a composite capillary structure Cs, which includes a metal braided mesh Cs3 and a copper powder sintered body Cs4. As in the aforementioned embodiment, the metal braided mesh Cs3 is disposed in the hollow tube 2, and the metal braided mesh Cs3 also extends to the bottom surface of the upper cover plate 3. Next, a copper powder sintered body Cs4 is formed on the bottom surface of the upper cover plate 3, and the copper powder sintered body Cs4 covers the metal woven mesh Cs3; and the main steps of forming the copper powder sintered body Cs4 include first laying a layer of copper powder on the bottom surface of the upper cover plate 3, and then heating the copper powder to sinter it to form the copper powder sintered body Cs4.

Please refer to Figure 4A and Figure 4B at the same time. Figure 4A is a schematic diagram of copper powder being laid in another embodiment of the three-dimensional temperature balancing plate of the present invention. Figure 4B is a cross-sectional view of copper powder being laid in another embodiment of the three-dimensional temperature balancing plate of the present invention. The main difference between this embodiment and the aforementioned embodiment is that the capillary structure Cs of this embodiment is a single structure of copper powder sintered body Cs5, which is integrally formed on the inner wall surface of the hollow tube 2 and the bottom surface of the upper cover plate 3.

The steps of forming the copper powder sintered body Cs5 may include: inserting a rod R in each hollow tube 2, and then spreading copper powder in the hollow tube 2 and on the bottom surface of the upper cover plate 3; at this time, in order to allow the copper powder to be evenly spread on the bottom surface of the upper cover plate 3 and fill the inside of the hollow tube 2, vibration may be applied to the hollow tube 2 and the upper cover plate 3. Then, the copper powder is heated and sintered to form the copper powder sintered body Cs5; finally, the rod R is removed. Through the above steps, a copper powder sintered body Cs5 with uniform thickness and precise positioning can be obtained, and it is important that the copper powder sintered body Cs5 is formed in one piece, the capillary action will not be interrupted, and the liquid reflux effect is good.

Although the present invention has been disclosed as above by the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the attached patent application.

2: Hollow tube

3: Upper cover plate

4: Lower base plate

6: Opening holes

21: Closed end

22: Open end

31:Through hole

41: Outer frame edge

221: Radial flange

Cs: capillary structure

Cs1: First metal braided mesh

Cs2: Second metal braided mesh

S: cavity

Sp: Inner cavity

Claims (2)

A method for manufacturing a three-dimensional temperature-averaging plate comprises the following steps: (A) providing at least one hollow tube, an upper cover plate and a lower bottom plate; the at least one hollow tube comprises a closed end and an open end, the open end comprises a radial flange; the upper cover plate comprises at least one through hole; (B) the at least one hollow tube passes through the at least one through hole of the upper cover plate, and solid phase diffusion bonding is applied to the radial flange and the upper cover plate. bonding); (C) forming at least one capillary structure in the at least one hollow tube and the upper cover; and (D) bonding the upper cover and the lower base to form a cavity, filling the cavity with a working medium, and then evacuating and sealing the cavity; wherein the at least one capillary structure includes a first metal braided mesh and a second metal braided mesh; the step (C) includes a step (C1) and a step (C2); in the step (C1), the first A metal braided mesh is sleeved on a copper mesh installation device and then inserted into the at least one hollow tube. After the copper mesh installation device props up the first metal braided mesh and makes it fit the inner wall surface of the at least one hollow tube, the copper mesh installation device withdraws from the at least one hollow tube, and the first metal braided mesh extends to the bottom surface of the upper cover plate; in the step (C2), the second metal braided mesh is formed on the bottom surface of the upper cover plate, and the second metal braided mesh covers the first metal braided mesh. The manufacturing method of the three-dimensional temperature equalizing plate as described in claim 1, wherein the copper mesh installation device comprises a vertical rod, a coil spring, and a turntable; the turntable is hinged to the vertical rod, one end of the coil spring is connected to the vertical rod, and the other end is connected to the turntable; in the step (C1), after the first metal braided mesh is sleeved on the coil spring and inserted into the at least one hollow tube, the turntable is rotated to allow the coil spring to open the first metal braided mesh, and the turntable is rotated again to allow the coil spring to contract and exit the at least one hollow tube.

Images