TWI702371B - Composite siphon temperature plate - Google Patents

Abstract

A composite siphon temperature equalizing plate includes: an inflatable plate body, which is formed by attaching two plate bodies along the edges, and the inflatable plate body has a plurality of positions where the two plate bodies are attached to each other. A plurality of bonding parts formed, and an expanded pipeline formed on the part that is not bonded, and the expanded pipeline is located around the plurality of bonding parts, wherein the part of the expanded pipeline is defined as A powder-filling pipeline, the powder-filling pipeline is elongated and located on the most side of one of the left and right sides of the expanded pipeline, and adjacent to one side of the two plates, the powder-filling pipeline The bottom end is located at the bottom end of the expansion pipeline; an actuating fluid is filled into the expansion pipeline; a capillary structure composed of powdery particles is filled into the powder filling pipeline; and a fixing means ( means) for fixing the capillary structure in the powder filling pipeline without moving.

Description

Composite siphon temperature plate

The present invention relates to a heat dissipation device, and particularly refers to a composite siphon temperature equalizing plate.

my country's M568350 patent discloses a double-sided inflation board, which is a kind of uniform temperature board, also known as siphon uniform temperature board, which is mainly used to change the traditional single-sided inflation board into double-sided inflation board. Increasing the internal working fluid capacity can meet the heat dissipation requirements of high-power devices.

The aforementioned known inflatable board is generally made into a long shape, and the production is mainly to attach two elongated board bodies relative to each other, and make the four edges of the two board bodies fit together to leave a working opening, and The opposite surfaces of the two plates are attached at multiple positions, and then high-pressure gas is blown into the operation port to expand the unattached positions of the two plates to form a pipeline, and finally, the working fluid is filled and Closing the working port forms the currently known inflation plate. When the aforementioned known inflatable plate is used upright, its elongated ends are generally set up and down, and one of the left and right sides of the inflatable plate is embedded in a base, and the base is embedded After installing a plurality of inflatable plates, the base can be attached to a heat source to provide heat dissipation effect.

In the aforementioned known inflatable plate, when working upright, the working fluid inside it needs to rely on gravity to lower the liquid working fluid, and after the working fluid is heated and vaporized, it rises inside the inflatable plate. After the vapor working fluid is cold and condensed into a liquid working fluid, it drops to the bottom of the expansion plate due to gravity to form a circulating state. However, since the side of the inflatable plate that works upright is not limited to the heat source at the bottom, there may be a heat source located in the middle or close to the top of the inflatable plate due to actual needs, and the liquid working fluid will be affected by The action of gravity flows to the bottom, and there is no mechanism that can hold the liquid working fluid in the middle or top position to absorb heat and vaporize the heat source at the middle or top position. Therefore, the currently known inflatable plates have their The use position is restricted, that is, the heat source must be located at the bottom of the inflation plate to effectively dissipate heat.

It can be seen from the above that the current working fluid inside the inflatable plate only relies solely on gravity and the principle of thermal vapor expansion to diffuse and flow to a low temperature to carry out the circulation action, and cannot make the liquid working fluid anti-gravity cycle rise above the liquid level. Therefore, its use position is limited and cannot meet the heat dissipation demand of the heat source located at the higher position of the inflatable plate.

In addition, since the currently known inflatable plates are made of two-plate bodies made of aluminum, although the heat pipes, which are currently widely known in the heat dissipation industry, have been exposed to sintered copper powder as the capillary structure technology, however, limited by the low melting point of aluminum material properties, can not be activated copper powder is sintered in an aluminum plate material blow, so there is not yet provided on the technical concept of the blow plate capillary structure.

From the above description of the prior art, it can be seen that the flow of the working fluid of the prior art inflatable plate only relies on gravity when it is liquid, and relies on the principle of thermal vapor expansion to diffuse and flow to a low temperature when it is in a liquid state. It is impossible for the working fluid to rise to a height exceeding the liquid level of the working fluid against gravity, and it can be seen that the installation position of the heat source is restricted.

In order to increase the heat dissipation effect provided by the inflatable plate, the present invention proposes a composite siphon temperature equalizing plate, which is provided with a capillary structure inside the inflatable plate, so that the liquid operating fluid can be contained in the capillary due to the capillary phenomenon. The structure allows the liquid operating fluid to rise above the liquid level of the liquid operating fluid, so that the inflatable plate can be equipped with a heat source whether it is at the bottom, middle or top side. In addition, it can also increase the liquid The circulation efficiency of the operating fluid improves the heat dissipation effect.

In order to achieve the above object, the present invention provides a composite siphon temperature equalizing plate, which includes: an inflatable plate body, which is formed by bonding two plate bodies along the edges, and the inflatable plate is elongated and has two ends. Respectively facing upwards and downwards, and defining that one of the plates faces forwards, the inflation plate body has a plurality of bonding parts formed by affixing multiple positions on the opposite surfaces of the two plates, and has an expansion pipeline It is formed on the part that is not bonded, and the expanded pipeline is located around the plurality of bonded parts, wherein the part of the expanded pipeline is defined as a powder filling pipeline, and the powder filling pipeline is long It is located on the most side of one of the left and right sides of the expanded pipeline and is adjacent to one side of the two plates. The bottom end of the powder filling pipeline is located at the bottom end of the expanded pipeline; an actuation Fill the swelling pipeline; a capillary structure composed of powder particles and fill the powder filling pipeline; and a fixing means (means) for fixing the capillary structure to the powder filling pipeline In the pipeline without moving.

It can be seen from the above that, by arranging a capillary structure inside the inflation plate in the present invention, the liquid operating fluid can be contained in the capillary structure due to the capillary phenomenon. As a result, the capillary phenomenon can be used to raise the operating fluid to a position higher than the level of the liquid operating fluid. Therefore, the inflatable plate can be equipped with a heat source whether it is at the bottom, middle position or the side of the top. Compared with the known inflatable plate, the invention also has a better circulation efficiency of the working fluid, thereby improving the heat dissipation effect.

In order to explain in detail the technical features of the present invention, the following preferred embodiments are described in conjunction with the drawings, in which:

As shown in Figures 1 to 2, the present invention proposes a first preferred embodiment of a composite siphon temperature equalizing plate 10, which is mainly composed of an inflatable plate body 11, an actuating fluid 99, a capillary structure 21 and a Consists of fixed means, of which:

The inflatable board body 11 is formed by attaching two aluminum board bodies 111 along the edges. The inflatable board body 11 is elongated with both ends facing upward and downward respectively, and defines one of the board faces facing Previously, the inflation board body 11 has a plurality of bonding portions 12 formed by bonding multiple positions on the opposite surfaces of the two board bodies 111, and has an expansion pipe 16 formed in the unbonded portion, and The expanded pipeline 16 is located around the plurality of bonding portions 12, wherein the portion of the expanded pipeline 16 is defined as a powder filling pipeline 161, and the powder filling pipeline 161 is elongated and located in the expansion Starting from one of the left and right sides of the pipeline 16 and adjacent to one side of the two plates 111, the bottom end of the powder filling pipeline 161 is located at the bottom end of the expanding pipeline 16. In actual implementation, the powder-filling pipeline 161 extends from the bottom up to a predetermined length. If the design meets the situation of multiple heat sources 91, the multiple heat sources 91 are distributed at the bottom, middle, and bottom on the side of the inflatable plate body 11. When there are more than three areas, the powder filling pipe 161 will extend from the bottom to the top of the expanded pipe 16. If it is expected that the distribution of the multi-heat source 91 is only at the bottom and the middle section of the inflation plate body 11, the powder filling pipe 161 can also only extend from the bottom to the middle section of the expansion pipe 16. It corresponds to the heat source 91. That is, the best design of the powder filling pipe 161 is to extend from the bottom to the top corresponding to the position of the heat source 91.

The actuating fluid 99 is filled into the expansion pipeline 16. The operating fluid can be refrigerant or water or other known operating fluids.

The capillary structure 21 is composed of powder particles, such as copper powder, aluminum powder or non-metallic powder particles with capillary phenomenon, and is filled into the powder filling pipeline 161.

The fixing means is used to fix the capillary structure 21 in the powder filling pipe 161 without moving. In this embodiment, the fixing means refers to bonding and fixing the powder particles of the capillary structure 21 with a binder. It is difficult to graphically represent the state of the binder applied to the powder particles, and this The technology of is directly understandable by those in the technical field, so it cannot be represented in a diagram. This binder can actually use phenol resin, and the powder particles can be copper or aluminum particles. After filling the powder particles with the binder on the surface into the powder filling pipeline 161, proceed as necessary. Vibration powder. The powder vibration procedure is to place the powder-filled inflation plate body 11 on a vibrating device and place the powder-filling pipe 161 at the bottom, and vibrate, so that the powdered particles fall to the powder-filling pipe due to the vibration. 161 location. After baking, the powder particles of the capillary structure 21 can be bonded to each other and fixed in the powder filling pipe 161, so as to serve as the capillary structure 21.

The structure of the first embodiment has been described above, and the operation state will be described next.

Please refer to Figure 3, before use, the side of the inflatable plate body 11 of the present invention with the capillary structure 21 is embedded in the substrate 90 of a heat source 91, and is arranged upright, whereby the capillary The structure 21 is adjacent to the heat source 91. At this time, the actuating fluid 99 flows to the bottom of the expansion pipe 16 due to gravity, and flows to the capillary structure 21 to be absorbed and contained by the capillary phenomenon. In actual implementation, the total amount of actuating fluid 99 will be greater than the amount that the capillary structure 21 can contain. Therefore, in addition to being adsorbed by the capillary structure 21, some of the actuating fluid 99 will exist in the swelling as a liquid. Lift up the bottom of pipe 16.

As shown in Figures 2 to 4, when in use, the heat source 91 generates heat, and the heat energy is transferred to the side of the inflation plate body 11 and then transferred to the capillary structure 21 to heat the operating fluid 99. The liquid 99 is heated and evaporates into a vapor state and flows in the expansion pipeline 16 based on the principle of diffusion and flow of hot vapor to a low temperature, and then diffuses and moves to a colder area. In a part of the vapor state, the operating liquid rises to the expansion. When the colder area in the pipeline 16 is condensed into liquid operating fluid 99 due to the cold, and flows downward, some liquid operating fluid 99 will contact the capillary structure 21 and be adsorbed during the downward flow process. Most of the remaining liquid operating fluid 99 flows down to the bottom of the expansion pipe 16, and then is adsorbed by the capillary structure 21 at the bottom of the powder-filling pipe 161 and contained in the capillary structure 21. The capillary phenomenon provided by the capillary structure 21 guides the liquid operating fluid 99 upwards from the bottom to the entire section contained in the capillary structure 21, thus forming a cycle in which the operating fluid 99 changes from liquid to vapor and then to liquid. .

It can be seen from the above that no matter the heat source 91 is arranged at any position on the bottom, middle or top of the inflatable plate body 11, the capillary phenomenon of the capillary structure 21 can allow the liquid operating fluid 99 to easily rise above the operating position. The liquid level of the liquid 99 reaches a position near the heat source 91 to absorb heat, achieving the effect that the position of the heat source 91 is not restricted. In addition, the circulation efficiency of the liquid operating fluid 99 can also be improved, thereby enhancing the heat dissipation effect.

In addition, in the first embodiment, although the fixing means is described with a binder as an example, if aluminum powder particles are used, since the two-plate body 111 is also an aluminum plate, sintered The method is to make the powder particles fuse and fix on the contact surface as a fixing means. It must be mentioned here that if the powder particles are copper and the two-plate body 111 is aluminum, since the melting point of copper is much higher than that of aluminum, sintering cannot be used as a fixing means.

Please refer to FIGS. 5 to 9 again. The composite siphon temperature equalizing plate 30 proposed in the second preferred embodiment of the present invention is basically the same as the first embodiment disclosed above, except that:

Among the plurality of bonding parts 32, a part of the bonding part 32 is elongated and is the long bonding part 321, which is inclined, parallel to each other and separated by a predetermined distance, and the inclined direction is close to the end of the capillary structure 41. The end away from the capillary structure 41 is taller, and the remaining bonding portion 32 is shorter than the aforementioned long bonding portion 321 and is defined as the short bonding portion 325. In addition, a plurality of short bonding portions 325 may be further provided between the two parallel long bonding portions 321, or short bonding portions 325 may not be provided. In the second embodiment, a plurality of short bonding portions are provided. 325 as an example.

The space of the expanded pipe 36 located around the bottom part of each of the long fitting parts 321 is filled with the capillary structure 41, whereby the capillary structure 41 surrounds the bottom part of each of the long fitting parts 321, That is, a part of the powder filling pipe 361 surrounds the bottom end of each of the long bonding portions 321. Since the expanded pipeline 36 is located around each of the bonding portions 32, the expanded pipeline 36 remains around the top end of each of the long bonding portions 321, whereby the long bonding portions 321 are not The expanded pipeline 36 will be divided into two pipelines that are not connected to each other.

In the second embodiment, in addition to the adhesive or sintering method exemplified in the first embodiment, the fixing means may also be the following method: at the bottom end of the plurality of long bonding portions 321 The expanded pipeline 36 between the short bonding portions 325 and the partial number of the short bonding portions 325 in the plurality of short bonding portions 325 forms a plurality of flattened portions 365, and each flattened portion 365 is two of the expanded pipeline 36 compressed between the retention plate 311 and a slit formed, the pitch of the slits is smaller than the powder particle size of the capillary structure 41, the plurality of flattened portion 365 and the portion of the short number of bonding portion 325 and the plurality of long The bottom end of the fitting portion 321 is combined to form a limit boundary 37, so that the powder particles of the capillary structure 41 cannot pass through, the capillary structure 41 is fixed in the powder filling pipe 361, and the capillary structure 41 is filled The powder filling pipeline 361 is filled. Since the capillary structure 41 fills the powder-filling pipe 361, and the capillary structure 41 is also restricted in the powder-filling pipe 361 and cannot move, therefore, under such a fixing means, there is no need to use adhesive Or a fixed means of sintering.

When the second embodiment is used, in addition to the state in which the actuating fluid 99 is adsorbed, vaporized, and condensed and liquefied by the capillary structure 41 described in the first embodiment, the plurality of long bonding portions 321 can react to the condensed liquid The operating fluid 99 provides a guiding effect, so that the liquid operating fluid 99 flowing in the expansion pipe 36 and located on each of the long affixing parts 321 will not flow directly to the bottom end, but along each of the long The bonding part 321 flows downward and is guided to the capillary structure 41 at the bottom end of each long bonding part 321, and then is adsorbed, thereby forming the effect of circulating the liquid operating fluid 99 more quickly.

In addition, as shown in Figure 9, in the plurality of long bonding portions 321, some of the long bonding portions 321 may be formed by two or more sub-long bonding portions 322 combined together. In this embodiment, two sub-long bonding portions 322 As an example, the bonding portion 322 constitutes a long bonding portion 321. The secondary long bonding portions 322 pass through the expansion pipe 36, and the secondary long bonding portions 322 are aligned on the same line in the direction of the long axis. A long bonding portion 321 is formed.

Each of the aforementioned long bonding portions 321 is composed of two or more sub-long bonding portions 322. In fact, it can also provide a diversion effect to the liquid operating fluid 99. However, the liquid operating fluid 99 flows to the two sub-long stickers. When the pipe 36 between the joints 322 expands, it will directly fall into the long joint 321 below, and continue to be guided to flow to the capillary structure 41. The reason for providing this sub-long bonding portion 322 is that it can be appropriately configured according to the position of the heat source 91, so that the liquid operating fluid 99 relatively located above the heat source 91 can flow more concentratedly to the long bonding portion corresponding to the heat source 91 Guided by the 321, the actuating fluid 99 can get closer to the heat source 91 to absorb heat faster.

The rest of the structure and achievable effects of the second embodiment are the same as those of the first embodiment disclosed above, and will not be repeated here.

It should be added that the aforementioned three fixing means of the present invention can also be fixed in plural ways, for example, using the limiting boundary 37 and adhesive as a dual fixing means, or using the limiting boundary 37 and sintering as Double fixing means.

In addition, in the foregoing second embodiment, although the fixing means is described in that the flattening portion 365 cooperates with each of the bonding portions 32, and the plurality of long bonding portions 321 are combined to divert the operating fluid 99, however, this It does not mean that the fixing means must be limited to the flattening part 365 to match the plurality of long fitting parts 321. As shown in Figure 10, the fixing means (bonding or sintering) of the first embodiment can also be used to fix the capillary structure 21 and cooperate with the plurality of long affixing parts 321 of the second embodiment. It rises above the liquid level of the operating fluid 99 and reaches a position near the heat source 91 (shown in FIG. 4) to absorb heat, achieving the effect that the position of the heat source 91 is not restricted. In addition, the circulation efficiency of the liquid operating fluid 99 can also be improved, and the operating fluid 99 can be diverted, thereby enhancing the heat dissipation effect.

10: Compound siphon temperature equalizing plate 11: Inflation board body 111: Board 12: Fitting department 16: Expand the pipeline 161: Powder filling pipeline 21: Capillary structure 90: substrate 91: heat source 99: Actuating fluid 30: Composite siphon temperature equalizing plate 311: Board 32: Fitting Department 321: Long Fitting Department 322: Deputy Chief Fitting Department 325: Short fit part 36: Expand the pipeline 361: Powder filling pipeline 365: Flattening part 37: limit boundary 41: Capillary structure

Figure 1 is a perspective view of the first preferred embodiment of the present invention. Figure 2 is a cut-away schematic view of the first preferred embodiment of the present invention, showing the internal capillary structure and operating fluid. Figure 3 is a three-dimensional schematic diagram of the first preferred embodiment of the present invention in use. Figure 4 is a cut-away schematic view of the first preferred embodiment of the present invention in use. Figure 5 is a perspective view of the second preferred embodiment of the present invention. Figure 6 is a cut-away schematic view of the second preferred embodiment of the present invention, showing the internal capillary structure and operating fluid. Figure 7 is a cross-sectional view taken along line 7-7 in Figure 5. Figure 8 is a partial enlarged view of Figure 7, showing the relationship between the gaps in the squashed part and the size of the powder particles. Fig. 9 is a front view of another implementation aspect of the second preferred embodiment of the present invention, showing the arrangement state of the sub-long bonding portion. Figure 10 is a cut-away schematic view of another implementation state of the present invention, showing the internal capillary structure and the installation state of the long bonding part.

10: Compound siphon temperature equalizing plate

11: Inflation board body

111: Board

12: Fitting department

16: Expand the pipeline

161: Powder filling pipeline

21: Capillary structure

99: Actuating fluid

Claims (8)

A composite siphon temperature equalizing plate, comprising: an inflatable plate body, which is formed by bonding two plate bodies along the edges. The inflatable plate has a long system with both ends facing up and down, and It is defined that one of the plates faces forward, and the inflatable plate body has a plurality of bonding parts formed by bonding the opposite surfaces of the two plates to a plurality of positions, and has an expansion pipe formed in the unbonded part , And the expanded pipeline is located around the plurality of bonding parts, wherein the portion of the expanded pipeline is defined as a powder filling pipeline, and the powder filling pipeline is elongated and located in the expanded pipeline The bottom end of the powder-filling pipeline is located at the bottom end of the expansion pipeline; the bottom end of the powder filling pipeline is located at the bottom end of the expansion pipeline; an actuating fluid is filled into the expansion tube In the road; a capillary structure, which is composed of powdery particles, is filled in the powder filling pipeline; and a fixing means (means) is used to fix the capillary structure in the powder filling pipeline without moving. The composite siphon temperature equalizing plate according to item 1 of the scope of patent application, wherein: in the plurality of bonding parts, some of the bonding parts are elongated and are long bonding parts, which are inclined, parallel to each other and predetermined apart The distance and the oblique direction are that the end close to the capillary structure is low and the end far away from the capillary structure is high, and the remaining bonding parts are shorter than the aforementioned long bonding parts and are defined as short bonding parts. The composite siphon temperature equalizing plate according to item 2 of the scope of patent application, wherein: there are a plurality of short bonding parts between the two parallel long bonding parts. The composite siphon temperature equalizing plate according to item 2 of the scope of patent application, wherein: the space around the bottom end of each of the long affixing parts is filled with the capillary structure so that the capillary structure surrounds each of the The bottom part of the long fitting part. The composite siphon temperature equalizing plate according to item 2 of the scope of patent application, wherein: in the plural long bonding parts, some of the long bonding parts are formed by the joint formation of two or more sub-long bonding parts. The expansion pipeline passes between the bonding parts, and the two or more sub-long bonding parts are aligned and arranged on the same line in the long axis direction to form the long bonding part. The composite siphon temperature equalizing plate according to item 2 of the scope of patent application, wherein: the fixing means is: the expansion pipe between the part of the plurality of short bonding parts and the bottom end of the plurality of long bonding parts forming a plurality of flattened portions, the flattened portions of each line between the two plates a slot reserved for the configuration, the pitch of the slit is smaller than the diameter of the powder particles of the capillary structure, the plurality of flattened portions and the plurality of short paste The part of the joint part and the bottom end of the plurality of long joint parts jointly form a restricted boundary so that the powder particles of the capillary structure cannot pass through, the capillary structure is fixed to the powder filling pipeline, and the capillary structure is Fill up the powder filling pipeline. The composite siphon temperature equalizing plate according to item 1 of the scope of patent application, wherein: the fixing means is: the powder particles of the capillary structure are sintered and fixed by fusing together on the contacting surfaces. According to the composite siphon temperature equalizing plate of the first item of the scope of patent application, the fixing means is: bonding the powdery particles of the capillary structure together with a binder to fix.

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