CN203118919U - Wafer heating unit - Google Patents
Wafer heating unit Download PDFInfo
- Publication number
- CN203118919U CN203118919U CN 201320158739 CN201320158739U CN203118919U CN 203118919 U CN203118919 U CN 203118919U CN 201320158739 CN201320158739 CN 201320158739 CN 201320158739 U CN201320158739 U CN 201320158739U CN 203118919 U CN203118919 U CN 203118919U
- Authority
- CN
- China
- Prior art keywords
- heating
- central siphon
- lower cover
- heating base
- disk lower
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 48
- 238000003466 welding Methods 0.000 claims abstract description 17
- 210000001364 upper extremity Anatomy 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a wafer heating unit which comprises a heating base, a disc lower cover, a support shaft pipe, at least one thermocouple tube, and at least one heating element. The heating base is used for holding and heating a wafer. The disc lower cover is tightly welded to the bottom of the heating base. The support shaft pipe is located below the disc lower cover. The thermocouple tubes are connected to the heating base through at least one reserved welding pipe and the support shaft pipe. The heating elements are connected to the heating base through at least one reserved welding pipe and the support shaft pipe so that heating of the heating elements is controlled; and the reserved welding pipes are tightly welded to part of the heating elements by butt welding. The wafer heating unit is designed integrally, so that cost is lowered, and assembly time is shortened; and vacuum air leakage is improved through the design of the circularly tightly welded reserved welding pipes.
Description
Technical field
The utility model relates to a kind of heater, particularly a kind of wafer heater.
Background technology
The wafer manufacturing is the part of the most basic and most critical of whole scientific and technological industry, and wherein, heat treatment is an important ring.In the known wafer heater, the assembly of its multi-piece type has more solder joint, and its solder joint is after through the reciprocal operation of heating board, and structural strength weakens easily, the vacuum degree susceptible to.When vacuum degree is affected, need spend many times to leak hunting, board thereby can't operate is incured loss through delay production process.
Summary of the invention
In order to overcome defective of the prior art, the utility model provides a kind of wafer heater, particularly a kind of wafer heater that has one-body molded element and can improve vacuum degree.
The technical scheme that its technical problem that solves the utility model adopts is: the utility model provides a kind of wafer heater, particularly a kind of wafer heater that has one-body molded element and can improve vacuum degree.Comprise a heating base, a disk lower cover, support central siphon, at least one thermocouple well and at least one heating element.Heating base is used for carrying and heat a wafer; The disk lower cover, the bottom welding driving fit of itself and heating base; Support central siphon, it is positioned at the below of disk lower cover, wherein supporting central siphon is one-body molded one-tenth hollow tubular, the upper end of supporting central siphon is that the open upper limb that arranges and support central siphon is upward through the bottom of disk lower cover and welds driving fit with the disk lower cover, support central siphon and also have a closed bottom, and have several perforation downwards of reservation welded tubes and outstanding closed bottoms that supports central siphon; At least one thermocouple well, it is reserved welded tube and is connected to heating base by supporting central siphon via at least one, and utilizes at least one to reserve welded tube and part thermocouple well butt welding driving fit; And at least one heating element, it is reserved welded tube and is connected to heating base by supporting central siphon via at least one, with the heating of control heating element, and utilizes at least one to reserve welded tube and part heating element butt welding driving fit.
The beneficial effects of the utility model are: one-body molded design, not only reduced cost, and also saved built-up time, and the reservation welded tube design of ring-type welding driving fit can improve the gas leakage situation of vacuum.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is design principle figure of the present utility model.
Fig. 2 is support central siphon longitudinal sectional view of the present utility model.
1. heating bases among the figure, 2. disk lower cover 3. supports central siphon, 4. thermocouple well, 5. heating element, 6. solder joint, 7. void layer, 8. solder joint is 9. reserved welded tube, 10. solder joint, 11. solder joints.
Embodiment
As shown in Figure 1, the utility model provides a kind of wafer heater, comprises a heating base 1, a disk lower cover 2, support central siphon 3, at least one thermocouple well 4 and at least one heating element 5.Heating base 1 is used for carrying and heat a wafer; Disk lower cover 2, the bottom solder joint 6 places welding driving fit of itself and heating base 2, and form a void layer 7 therein; Support central siphon 3, it is positioned at the below of disk lower cover 2, wherein supporting central siphon 3 is one-body molded and the one-tenth hollow tubular, the upper end of supporting central siphon 3 is that the open upper limb that arranges and support central siphon 3 is upward through the bottom of disk lower cover 2 and welds driving fit with disk lower cover 2 solder joints 8 places, support central siphon 3 and also have a closed bottom, and have several and reserve the closed bottom that welded tube 9 connected and gave prominence to support central siphon 3 downwards, as shown in Figure 2; At least one thermocouple well 4, it is reserved welded tube 9 and is connected to heating base 2 by supporting central siphon 3 via at least one, and utilize at least one to reserve welded tube 9 and the 4 butt welding driving fits of part thermocouple well, and form a ring-type and have the welded seal structure of depth, namely solder joint 10; And at least one heating element 5, it is reserved welded tube 9 and is connected to heating base 1 by supporting central siphon 3 via at least one, with 5 heating of control heating element, heating element 5 is fixing at solder joint 11 places and heating base 1 welding, and utilize at least one to reserve welded tube 9 and the 5 butt welding driving fits of part heating element, the same welded seal structure that forms a ring-type and have depth, namely solder joint 10.
Claims (3)
1. wafer heater comprises that a heating base, disk lower cover, one support central siphon, at least one thermocouple well and at least one heating element, is characterized in that: described heating base is used for carrying and heat a wafer; The disk lower cover, the bottom welding driving fit of itself and heating base; Support central siphon, it is positioned at the below of disk lower cover, and wherein supporting central siphon is one-body molded one-tenth hollow tubular; At least one thermocouple well, it is reserved welded tube and is connected to heating base by supporting central siphon via at least one, and utilizes at least one to reserve welded tube and part thermocouple well butt welding driving fit; And at least one heating element, it is reserved welded tube and is connected to heating base by supporting central siphon via at least one, and utilizes at least one to reserve welded tube and part heating element butt welding driving fit.
2. device according to claim 1 is characterized in that: the upper end of described support central siphon be the open upper limb that arranges and support central siphon be upward through the disk lower cover the bottom and with disk lower cover welding driving fit.
3. device according to claim 1, it is characterized in that: described support central siphon also has a closed bottom, and has several and reserve that welded tubes connect and the outstanding closed bottom that supports central siphon downwards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320158739 CN203118919U (en) | 2013-04-02 | 2013-04-02 | Wafer heating unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320158739 CN203118919U (en) | 2013-04-02 | 2013-04-02 | Wafer heating unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203118919U true CN203118919U (en) | 2013-08-07 |
Family
ID=48899239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320158739 Expired - Fee Related CN203118919U (en) | 2013-04-02 | 2013-04-02 | Wafer heating unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203118919U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103619083B (en) * | 2013-12-03 | 2016-01-20 | 靖江先锋半导体科技有限公司 | A kind of processing method with the heater of two temperature control function |
| CN107460451A (en) * | 2016-06-06 | 2017-12-12 | 应用材料公司 | Pose as center base heater |
-
2013
- 2013-04-02 CN CN 201320158739 patent/CN203118919U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103619083B (en) * | 2013-12-03 | 2016-01-20 | 靖江先锋半导体科技有限公司 | A kind of processing method with the heater of two temperature control function |
| CN107460451A (en) * | 2016-06-06 | 2017-12-12 | 应用材料公司 | Pose as center base heater |
| CN107460451B (en) * | 2016-06-06 | 2021-07-06 | 应用材料公司 | Self-Centering Pedestal Heater |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203118919U (en) | Wafer heating unit | |
| JP2015194298A5 (en) | Method for manufacturing solar thermal collector | |
| EP3184702B1 (en) | Connection structure for plastic water channel main body of temperature regulating faucet and method of implementing the same | |
| CN204135525U (en) | A kind of sealing seat assembly soldering positioning fixture | |
| CN101920416A (en) | Thin walled tube welding method | |
| CN206965158U (en) | A kind of liquid guide flow distribution head | |
| CN209541513U (en) | Accumulation of heat module and regenerative apparatus | |
| CN104001259A (en) | Balloon and balloon catheter installing method | |
| CN202493849U (en) | Sealing sheet used for welding | |
| CN111912270B (en) | Liquid suction core structure of cold gathering pipe, assembly auxiliary tool and assembly method thereof | |
| CN202656480U (en) | Capillary network welding equipment | |
| CN203558971U (en) | Optical fiber preform tail end matching device | |
| CN202675754U (en) | Collecting tube for capillary network | |
| CN201398845Y (en) | Electric heating ceramic kettle | |
| CN205987432U (en) | Heating pipe | |
| JP2015090220A (en) | Solar heat collector tube and method for manufacturing the same | |
| CN206072549U (en) | Liftable Thermal insulative pipe carrier | |
| CN206398155U (en) | One kind welding tap | |
| CN107308670A (en) | A kind of liquid guide flow distribution head | |
| CN206572056U (en) | A high-strength water supply pipe laying structure | |
| CN204820335U (en) | Stopcock in PE electric smelting | |
| CN202963882U (en) | Circular tube folding deformation-prevention support device | |
| JP2016140546A (en) | Heat insulation container | |
| TWI874082B (en) | Methods of manufacture three-dimensional vapor chamber | |
| CN204366324U (en) | A kind of H type pipe fitting welder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130807 Termination date: 20140402 |