[go: up one dir, main page]

TWI867682B - 覆金屬積層板的製造方法 - Google Patents

覆金屬積層板的製造方法 Download PDF

Info

Publication number
TWI867682B
TWI867682B TW112130365A TW112130365A TWI867682B TW I867682 B TWI867682 B TW I867682B TW 112130365 A TW112130365 A TW 112130365A TW 112130365 A TW112130365 A TW 112130365A TW I867682 B TWI867682 B TW I867682B
Authority
TW
Taiwan
Prior art keywords
metal
layer
clad laminate
insulating resin
diamine
Prior art date
Application number
TW112130365A
Other languages
English (en)
Chinese (zh)
Other versions
TW202346095A (zh
Inventor
安藤智典
西山哲平
實森詠司
Original Assignee
日商日鐵化學材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日鐵化學材料股份有限公司 filed Critical 日商日鐵化學材料股份有限公司
Publication of TW202346095A publication Critical patent/TW202346095A/zh
Application granted granted Critical
Publication of TWI867682B publication Critical patent/TWI867682B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Non-Insulated Conductors (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
TW112130365A 2018-09-28 2019-09-26 覆金屬積層板的製造方法 TWI867682B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018185878 2018-09-28
JP2018-185878 2018-09-28

Publications (2)

Publication Number Publication Date
TW202346095A TW202346095A (zh) 2023-12-01
TWI867682B true TWI867682B (zh) 2024-12-21

Family

ID=70028545

Family Applications (2)

Application Number Title Priority Date Filing Date
TW112130365A TWI867682B (zh) 2018-09-28 2019-09-26 覆金屬積層板的製造方法
TW108134893A TWI814908B (zh) 2018-09-28 2019-09-26 覆金屬積層板和電路基板

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW108134893A TWI814908B (zh) 2018-09-28 2019-09-26 覆金屬積層板和電路基板

Country Status (4)

Country Link
JP (2) JP7446741B2 (ja)
KR (2) KR102694527B1 (ja)
CN (3) CN117048152A (ja)
TW (2) TWI867682B (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021132148A1 (ja) 2019-12-25 2021-07-01
WO2021206087A1 (ja) * 2020-04-10 2021-10-14 株式会社巴川製紙所 接着剤組成物
TWI807216B (zh) * 2020-09-01 2023-07-01 佳勝科技股份有限公司 複合基板及其製造方法
JP7598756B2 (ja) * 2020-12-24 2024-12-12 日鉄ケミカル＆マテリアル株式会社 樹脂フィルム、金属張積層板及び回路基板
JP7644611B2 (ja) * 2021-02-04 2025-03-12 旭化成株式会社 金属張積層体及びプリント配線板
JP7621161B2 (ja) * 2021-03-31 2025-01-24 日鉄ケミカル＆マテリアル株式会社 樹脂フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板、回路基板及び多層回路基板
JP2022158993A (ja) * 2021-03-31 2022-10-17 日鉄ケミカル＆マテリアル株式会社 ボンドプライ、これを用いる回路基板及びストリップライン
KR20230000671A (ko) * 2021-06-25 2023-01-03 피아이첨단소재 주식회사 반투명 저유전 폴리이미드 필름 및 그 제조방법
US11596066B1 (en) * 2022-03-22 2023-02-28 Thintronics. Inc. Materials for printed circuit boards
JP2024000978A (ja) 2022-06-21 2024-01-09 日鉄ケミカル＆マテリアル株式会社 金属張積層板、回路基板、電子デバイス及び電子機器
JP2024050431A (ja) 2022-09-29 2024-04-10 日鉄ケミカル＆マテリアル株式会社 金属張積層板、回路基板、電子デバイス及び電子機器
CN117087208B (zh) * 2023-07-21 2024-08-20 江门建滔积层板有限公司 一种耐热的柔性覆铜板及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102361753A (zh) * 2009-01-23 2012-02-22 株式会社斗山 一种新型挠性金属箔层叠板及其制造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5553108U (ja) 1978-10-06 1980-04-09
JPS6238237Y2 (ja) 1984-11-20 1987-09-30
CN1206259C (zh) * 2000-02-01 2005-06-15 新日铁化学株式会社 粘结用聚酰亚胺树脂及粘合性层压板
TWI332024B (en) * 2000-03-31 2010-10-21 Hitachi Chemical Co Ltd Method for making a semiconductor device
JP4619860B2 (ja) * 2004-07-13 2011-01-26 新日鐵化学株式会社 フレキシブル積層板及びその製造方法
JP2007049036A (ja) 2005-08-11 2007-02-22 Nitto Denko Corp 配線回路基板
JP2007115723A (ja) 2005-10-17 2007-05-10 Tdk Corp 金属箔積層体及び電子部品
JP5095142B2 (ja) 2006-07-05 2012-12-12 ユニチカ株式会社 フレキシブルプリント配線板用基板及びその製造方法
JP5886027B2 (ja) * 2011-12-21 2016-03-16 新日鉄住金化学株式会社 両面金属張積層板およびその製造方法
JP6031396B2 (ja) * 2013-03-29 2016-11-24 新日鉄住金化学株式会社 両面フレキシブル金属張積層板の製造方法
JP6403503B2 (ja) * 2013-09-30 2018-10-10 新日鉄住金化学株式会社 銅張積層板、プリント配線板及びその使用方法
JP2015127117A (ja) * 2013-12-27 2015-07-09 新日鉄住金化学株式会社 金属張積層体及び回路基板
JP6590568B2 (ja) 2015-07-22 2019-10-16 株式会社カネカ 絶縁性フィルム、絶縁性フィルムの製造方法、および金属張積層板の製造方法
JP6839594B2 (ja) * 2016-04-27 2021-03-10 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルム及び銅張積層板
KR20240172240A (ko) * 2016-09-26 2024-12-09 가부시끼가이샤 레조낙 수지 조성물, 반도체용 배선층 적층체 및 반도체 장치
CN114716707B (zh) * 2016-09-29 2024-10-11 日铁化学材料株式会社 聚酰亚胺膜、铜张层叠板及电路基板
JP7479781B2 (ja) * 2017-02-28 2024-05-09 日鉄ケミカル＆マテリアル株式会社 金属張積層板、接着シート、接着性ポリイミド樹脂組成物及び回路基板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102361753A (zh) * 2009-01-23 2012-02-22 株式会社斗山 一种新型挠性金属箔层叠板及其制造方法

Also Published As

Publication number Publication date
CN117048152A (zh) 2023-11-14
KR102694527B1 (ko) 2024-08-13
CN110962410B (zh) 2023-09-05
JP2024059887A (ja) 2024-05-01
CN110962410A9 (zh) 2023-06-23
CN117067718A (zh) 2023-11-17
KR20200036770A (ko) 2020-04-07
TW202012167A (zh) 2020-04-01
TW202346095A (zh) 2023-12-01
TWI814908B (zh) 2023-09-11
KR20240124264A (ko) 2024-08-16
JP7730941B2 (ja) 2025-08-28
CN117067718B (zh) 2026-01-02
JP7446741B2 (ja) 2024-03-11
CN110962410A (zh) 2020-04-07
JP2020055299A (ja) 2020-04-09

Similar Documents

Publication Publication Date Title
TWI867682B (zh) 覆金屬積層板的製造方法
CN110964319B (zh) 树脂膜、聚酰亚胺、粘接剂树脂组合物及其利用
TWI859161B (zh) 覆金屬積層板、電路基板及多層電路基板
JP7301495B2 (ja) 金属張積層板及び回路基板
TWI845787B (zh) 樹脂組成物、樹脂膜、積層體、覆蓋膜、帶樹脂的銅箔、覆金屬積層板及電路基板
TWI864246B (zh) 樹脂膜、覆金屬層疊板及電路基板
JP2025089343A (ja) ポリイミド組成物、樹脂フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板及び回路基板
TWI865703B (zh) 覆金屬層疊板及電路基板
JP7465058B2 (ja) 金属張積層板及び回路基板
TWI895381B (zh) 聚醯亞胺、交聯聚醯亞胺、接著劑膜及其應用
JP7636149B2 (ja) ポリイミド、ポリイミド溶液、ポリイミドフィルム、接着剤フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板、回路基板及び多層回路基板
TWI762725B (zh) 覆金屬層疊板及電路基板
JP7598756B2 (ja) 樹脂フィルム、金属張積層板及び回路基板
TW202413090A (zh) 覆金屬層疊板、電路基板、電子元件及電子設備
TW202400413A (zh) 覆金屬層疊板、電路基板、電子元件及電子設備