TWI866911B - Photosensitive resin composition, spacer, protective film and liquid crystal display element - Google Patents

Abstract

A photosensitive resin composition including an alkali-soluble resin (A), a compound having an ethylenically unsaturated group (B), a photoinitiator (C), and a solvent (D) is provided. The alkali-soluble resin (A) includes an alkali-soluble resin (A-1) which is obtained by copolymerization of a mixture, and the mixture includes an ethylenically unsaturated monomer (a-1-1) containing a carboxylic acid or a carboxylic anhydride group, and an oxyalkylene-containing ethylenically unsaturated monomer (a-1-2) represented by formula (I). The photoinitiator (C) includes a photoinitiator (C-1) which is a compound represented by formula (II).

Description

Photosensitive resin composition, spacer, protective film and liquid crystal display element

The present invention relates to a photosensitive resin composition, in particular to a photosensitive resin composition suitable for a spacer and a protective film, and a liquid crystal display element using the spacer and the protective film.

Generally speaking, the color-printed pixels and the black matrix on the surface of the color filter layer are uneven, so a protective film is usually formed on the surface of the color filter layer to hide the unevenness and achieve the flatness requirement.

However, in the manufacture of optical components such as liquid crystal display components or solid-state imaging devices, it is often necessary to process them under harsh conditions. For example, when the substrate surface is immersed in an acidic solvent or alkaline solution or the wiring electrode layer is formed by sputtering, local corrosion or high temperature may occur. Therefore, a protective film needs to be laid on the surface of these components to prevent damage to the components during manufacturing. In order for the protective film to have the characteristics of withstanding the above-mentioned treatments, the protective film needs to have excellent adhesion to the substrate, high transparency, high surface hardness and a smooth surface. In addition, the protective film also needs to have high heat resistance and light resistance to avoid deterioration such as discoloration, yellowing or whitening during long-term use. In addition, the protective film also needs to have good water resistance, chemical resistance, solvent resistance, acid resistance and alkali resistance.

On the other hand, in the known technology, in order to maintain a fixed layer spacing between two substrates in a color liquid crystal display element, beads such as polystyrene beads or silicon beads are randomly sprayed on the entire substrate, wherein the diameter of the beads is the spacing between the two substrates. However, this known method causes the light from the backlight source to be scattered by the beads due to the uneven position and density distribution of the beads, further reducing the contrast of the display element. Therefore, the photosensitive composition for the spacer developed by the photolithography process has become the mainstream in the industry. The spacer is formed by first applying the photosensitive composition for the spacer to the substrate, and then placing a mask of a specified shape between the substrate and the exposure source. After the exposure step, the spacer can be formed by development. According to this method, a spacer can be formed at a designated position outside the red, green, blue, etc. pixels to solve the problem of the known technology; the layer spacing can also be controlled by the thickness of the coating formed by the photosensitive component, making the distance of the layer spacing easy to control and having the advantage of high precision.

Since the protective film or spacer is formed on the color filter or substrate, the transparency requirement is extremely high. If the transparency of the protective film or spacer is not good, when applied to the liquid crystal display element, it will cause the brightness of the liquid crystal display element to be insufficient, thus affecting the display quality of the liquid crystal display element.

In order to improve the transparency of the protective film or the interstitial body, Japanese Patent Laid-Open No. 2010-054561 discloses a photosensitive composition for a protective film, which includes (A) an adhesive resin (which is an alkali-soluble resin), (B) a compound having an ethylenically unsaturated group, (C) a photoinitiator, and (D) a solvent, wherein the equivalent weight of the unsaturated bond in the compound having an ethylenically unsaturated group (B) is between 90 and 450 g/eq. In the compound having an ethylenically unsaturated group (B), the number of unsaturated double bonds in a single compound is between 2 and 4. The weight average molecular weight of the adhesive resin (A) is between 10,000 and 20,000. On the other hand, Japanese Patent Application Laid-Open No. 2004-240241 discloses a photosensitive composition comprising (A) a copolymer formed of an ethylenically unsaturated carboxylic acid (anhydride), a compound having an ethylenically unsaturated group having an epoxide group, and a compound having another ethylenically unsaturated group, (B) a polymerizable compound having an ethylenically unsaturated group, and (C) a photopolymerization initiator such as 2-butanedione-(4-(methylthio)phenyl)-2-(O-oxime acetate), 1,2-butanedione-1-(4-morpholinylphenyl)-2-(O-benzoyl oxime), and 1,2-octanedione-1-(4-(phenylthio)phenyl)-2-[O-(4-methylbenzoyl)oxime]. However, the above-mentioned photosensitive resin compositions still have the disadvantage of poor sensitivity, and the spacers formed therefrom also still have the disadvantage of poor step difference.

Therefore, how to improve the sensitivity of the photosensitive resin composition and improve the step difference of the spacer is a problem that technicians in this field are eager to solve.

In view of this, the present invention provides a photosensitive resin composition having excellent sensitivity and capable of forming a spacer with excellent step difference, which can be applied to a spacer and a protective film.

The present invention provides a photosensitive resin composition, which includes an alkali-soluble resin (A), a compound containing an ethylenically unsaturated group (B), a photoinitiator (C) and a solvent (D). Specifically, the alkali-soluble resin (A) includes an alkali-soluble resin (A-1), wherein the alkali-soluble resin (A-1) is obtained by copolymerizing a mixture. In addition, the mixture includes an ethylenically unsaturated monomer (a-1-1) containing a carboxylic acid group or a carboxylic anhydride group and an ethylenically unsaturated monomer (a-1-2) containing an oxyalkylene group represented by the following formula (I). Formula (I) In formula (I), R ¹ , R ² and R ³ each independently represent hydrogen or methyl; R ⁴ represents a substituted or unsubstituted C ₁ -C ₂₀ straight or branched alkyl group, a substituted or unsubstituted C ₂ -C ₂₀ straight or branched alkenyl group, or a substituted or unsubstituted C ₆ -C ₂₀ aromatic hydrocarbon group; AO represents a C ₂ -C ₂₀ oxyalkylene group; x represents an integer from 0 to 2; y represents 0 or 1; and n represents 2 or more. In addition, the photoinitiator (C) includes the photoinitiator (C-1), wherein the photoinitiator (C-1) is a compound represented by the following formula (II). Formula (II): In formula (II), A represents hydrogen, halogen, nitro, C ₁ -C ₂₀ straight or branched alkyl, C ₃ -C ₁₀ alkylcycloalkyl, C ₄ -C ₁₀ alkylcycloalkyl, C ₄ -C ₁₀ cycloalkylalkyl, , or , wherein C ₁ -C ₂₀ straight or branched alkyl, C ₃ -C ₁₀ alkylcycloalkyl, C ₄ -C ₁₀ alkylcycloalkyl, C ₄ -C ₁₀ cycloalkylalkyl, , or any -CH ₂ - contained in it may be substituted by O, N, S or a carbonyl group; R ⁵ represents hydrogen, a halogen, a C ₁ -C ₂₀ straight chain or branched chain alkyl, a C ₄ -C ₂₀ cycloalkylalkyl or a C ₂ -C ₂₀ alkenyl group, wherein the -CH ₂ - contained in the C ₁ -C ₂₀ straight chain or branched chain alkyl, a C ₄ -C ₂₀ cycloalkylalkyl and a C ₂ -C ₂₀ alkenyl group may be substituted by O, N, S or a carbonyl group, and two R ^5s may form a cyclic structure; R ⁶ represents a C ₁ -C ₂₀ straight chain or branched chain alkyl, a C ₂ -C ₂₀ alkenyl, a C ₃ -C ₂₀ cycloalkyl, a C ₄ -C ₂₀ cycloalkylalkyl, a C ₄ -C 20 wherein one or more hydrogens in these groups may be independently substituted by an alkyl group, a halogen group, a hydroxyl group or a nitro _group , and the _-CH2- in _R6 may be substituted by O, _N , _S or a carbonyl group; R7 represents a _C1 - _C20 straight or branched alkyl group, a _C3 - _C20 cycloalkyl group, a C4-C20 cycloalkylalkyl group, a C4-C20 alkylcycloalkyl group, a ^C6 - ^C20 aryl group, a _C6 - _C20 alkylaryl group, a group represented by the following formula (II-A), a group represented by the following formula (II-B) or a group represented by the following formula (II-C); when _R7 represents a C1-C20 straight or branched alkyl group, a C3-C20 cycloalkyl group, a _C4 - _C20 cycloalkylalkyl group, a _C4 - _C20 alkylcycloalkyl group, a _C6 - _C20 aryl group, a ^C6 - _C20 alkylaryl group, a group represented by the following formula (II-A), a group represented by the following formula (II-B) or a group represented by the following formula (II-C), _{When it is a C 20-50} linear or branched alkyl group, a C ₃ -C ₂₀ cycloalkyl group, a C ₄ -C ₂₀ cycloalkylalkyl group, a C ₄ -C ₂₀ alkylcycloalkyl group, a C ₆ -C ₂₀ aryl group or a C ₆ -C ₂₀ alkylaryl group, one or more hydrogen groups in these groups may be independently substituted by an alkyl group, a halogen group, a hydroxyl group or a nitro group, and the -CH ₂ - in R ⁷ may be substituted by an O, a N, a S or a carbonyl group; R ⁶ and R ⁷ may form a ring structure; Formula (II-A) In formula (II-A), m represents an integer of 0 or 1, R ¹¹ represents hydrogen, a C ₁ -C ₈ alkyl group, or a phenyl group, and R ¹² , R ¹³ and R ¹⁴ each independently represent hydrogen or a C ₁ -C ₄ alkyl group; Formula (II-B) In formula (II-B), p is an integer from 0 to 3; Formula (II-C) In formula (II-C), ^{R15 represents} hydrogen, _C1 - _C8 alkyl, or phenyl, Ar is substituted or unsubstituted phenyl, naphthyl, furanyl, thienyl, or pyridyl; ^R8 represents N-morpholinyl, N-piperidinyl, N-pyrrolyl, or N-dialkyl, wherein one or more hydrogens in these groups may be substituted by halogen or hydroxyl; ^R9 , ^R9 ' each independently represents _C1 - _C20 straight or branched alkyl, _C4 - _C20 cycloalkyl, _C2 - _C20 alkenyl, C6 _{- C20} aryl, or _C6 -C ₂₀ alkylaryl groups, wherein one or more hydrogens in these groups may be independently substituted by alkyl, halogen, hydroxyl or nitro groups, and _-CH2- in these groups may be substituted by -O-; or ^R9 and ^R9 ' may be linked to each other or form a five-membered ring or a six-membered ring via -O-, -S- or -NH-; ^R10 represents a _C1 - _C20 straight or branched alkyl group, a _C4 - _C20 cycloalkyl group, a _C4 - _C20 alkylcycloalkyl group, a _C2 - _C20 alkenyl group, a _C6 - _C20 aryl group or a _C6 - _C20 alkylaryl group, wherein _-CH2 in these groups may be substituted by -O-, -S- or -NH-; - may be substituted by -O- or -S-, and one or more hydrogen groups of these groups may be independently substituted by alkyl, halogen, nitro, cyano, SR ¹⁶ or OR ¹⁷ ; R ¹⁶ and R ¹⁷ each independently represent hydrogen, or a C ₁ -C ₂₀ linear or branched alkyl group.

In one embodiment of the present invention, the above mixture further comprises an ethylenically unsaturated monomer (a-1-3) containing a maleimide group or two alkenyl groups.

In one embodiment of the present invention, the above-mentioned ethylenically unsaturated monomer (a-1-3) containing a maleimide group or two alkenyl groups includes at least one monomer selected from the following formulas (1) to (5). Formula (1) Formula (2) Formula (3) Formula (4) Formula (5) In formula (4) and formula (5), R ¹⁸ , R ¹⁹ and R ²⁰ each independently represent hydrogen or a C ₁ -C ₃₀ linear or branched alkyl group.

In one embodiment of the present invention, the alkali-soluble resin (A-1) contains an ethylenically unsaturated group.

In one embodiment of the present invention, the photoinitiator (C) further comprises a photoinitiator (C-2), wherein the photoinitiator (C-2) is a compound represented by the following formula (III). Formula (III) In formula (III), Ar ₁ represents an azimuthal aryl group or an azimuthal heteroaryl group, wherein the azimuthal aryl group or the azimuthal heteroaryl group is a ring structure formed by two adjacent atoms with Y ₁ and the carbonyl group, and the substituents on the remaining atoms are independently selected from hydrogen; halogen; C ₁ -C ₁₂ alkyl; C ₅ -C ₇ cycloalkyl; C ₁ -C ₄ alkyl substituted with C ₅ -C ₇ cycloalkyl; phenyl; phenyl substituted with one or more C ₁ -C ₄ alkyl, carboxyl, C ₁ -C ₁₂ alkyl acyl, C ₁ -C ₁₂ aryl acyl, heteroaryl acyl, JT ₄ , phenyl, halogen or CN; C ₁ -C ₄ alkylbenzyloxy; Substituted C ₁ -C ₄ alkoxy, C ₁ -C ₃ alkylenedioxy; ; C ₁ -C ₁₂ alkylthio; C ₁ -C ₄ alkylphenylthio; a substituted C ₁ -C ₄ alkylthio group; CN; a carboxyl group; a C ₁ -C ₁₂ alkoxymethyl group; an aryl acyl group; a heteroaryl acyl group and a group consisting of JT ₅ ; or two adjacent substituents in the above substituents of Ar ₁ or between the substituent and Ar ₁ form a cyclic structure via a single bond, a carbon atom, or a carbonyl group; wherein, in JT ₄ and JT ₅ , J is selected from the group consisting of O, S, and NT ₆ ; Y ₁ is selected from the group consisting of O, S, NT ₇ , BT ₇ , CT ₂ T ₃ , SiT ₂ T ₃ , S=O, and C=O; T ₁ represents hydrogen, a C ₁ -C ₁₈ alkyl group, or a C 1 -C 18 alkoxy group; or T ₁ represents a C 1 -C ₁₈ alkyl group, or a C _{1 -C} 18 alkoxy group; _C2 -C18 alkyl group substituted with a _C5 - _C7 cycloalkyl group, a heterocycloalkyl group, a phenyl group, a heteroaryl group, CN, a _C1 - _C4 alkanoyloxy group or an aryloxy group and/or inserted with a _C5 - _C7 cycloalkylene group, a phenylene group, O, S or _NT4 ; _{C2 - C18} alkenyl group; C2- _C18 alkenyl group substituted with one or more halogens, a _C1 - _C4 alkyl group, a _C5 - _C7 cycloalkyl group, a heterocycloalkyl group, a phenyl group, a heteroaryl group, CN, a _C1 - _C4 alkanoyloxy group or an _aryloxy group and/or inserted with a _{C5 - C7} cycloalkylene group, a phenylene group, O, S or _NT4 , or both of the above; or _T1 represents _C5 -C or _T1 represents a _phenyl group, or a phenyl group substituted by one or more _C1 - _C4 alkyl groups, _{C1 - C4} alkoxy groups, phenyl groups, halogen _groups or CN; or T1 represents a naphthyl group, a benzoyl group or a phenoxycarbonyl group, wherein the phenyl group of the benzoyl group and the phenoxycarbonyl group is arbitrarily substituted by one or more halogen groups, _T4 , a _C5 - _C6 cycloalkyl group, CN, OH or _JT4 ; _T2 and _T3 each independently represent hydrogen, a C1 _{- C18} alkyl group, a C1- _C5 alkyl group substituted by a carboxyl group, a _{C1 -C5 alkyl group substituted by a C1-C4 alkoxyacyl group or a C1-C5 alkyl group substituted by} a _C1 - _C4 alkoxyacyl group or a or _T2 and _T3 each independently represent a C2- _C18 alkyl group substituted by one or more halogens, _C1 - _C4 alkyl groups, _C5 - _C7 cycloalkyl groups, heterocycloalkyl groups, phenyl groups, heteroaryl groups, CN, _{C1 - C4} alkanoyloxy groups, aryloxy groups, or a _C2 - _C18 alkyl group inserted by a _C5 - _C7 cycloalkylene group, a phenylene group, O, S or NT4, or both of the above; or _T2 and _T3 each independently represent a C5 _- C7 cycloalkyl group, or a _C5 - _C7 cycloalkyl group substituted by one or more C1- _C4 alkyl groups, phenyl groups, halogens or _CN ; or T2 and T3 _each independently represent a C5- _C7 cycloalkyl group, or a _C5 - _C7 cycloalkyl group substituted by one or more C1- _C4 alkyl groups, phenyl groups, halogens or CN; _{T2 and T3} each independently represent a phenyl group, or a _C2 - _C4 alkyl group, a _C1 - _C4 alkoxy group, a carboxyl group, a _C1 - _C12 alkylacyl group, a _C5 - _C6 cycloalkylcarbonyl group or a _C5 -C6 cycloalkyl group, a _C2 - _C4 alkylacyl group, an arylacyl group, a phenyl _group , a halogen or a CN-substituted phenyl group; or ... or a _C2 -C4 alkylacyl group, a C5- _C6 cycloalkylcarbonyl group or a C5- _C6 cycloalkyl group, a C2-C4 alkylacyl group, an arylacyl group, a phenyl group, a halogen or a CN-substituted phenyl group; or _{T2 and T3} each independently represent a phenyl group, or a _C2 - _C4 alkyl group, or a C2- _C4 alkylacyl group, a _C1 - _C18 alkylacyl group, a C1- _C18 cycloalkyl -C ₄ alkoxy acyl substituted C ₁ -C ₅ alkyl or or _T5 represents a C2 _{- C18 alkyl} group substituted by one or more halogen, _C1 - _C4 alkyl, _C5 - _C7 cycloalkyl, heterocycloalkyl, phenyl, heteroaryl, CN, _C1 - _C4 alkanoyloxy or aryloxy groups, or a _{C2 - C18} alkyl group inserted by a C5 _{- C7} cycloalkylene, phenylene, O, S or _NT4 , or both of the above; or _T5 represents a _C5 - _C7 cycloalkyl group, or a C5- _C7 cycloalkyl group substituted by one or more _C1 - _C4 alkyl, phenyl, halogen or CN; or _T5 represents a phenyl group, or a C2- _{C18 alkyl group inserted by one or more C1-C12 alkyl ,} carboxyl, _C1 -C or T 5 represents a C 1 -C ₄ alkylacyl group, a C _{1 -C 4 conjugated olefinic acyl group, a phenyl group substituted with an alkylene group, an O, S or NT 4 inserted C 2 -C 12 alkylacyl group, a C 5 -C 6 cycloalkylcarbonyl group, a C 2 -C 4 alkylacyl group substituted with a C 5 -C 6 cycloalkyl group , an arylacyl group ,} a heteroarylacyl group, JT ₄ , a phenyl group, a halogen, a CN or a NO ₂ substituted phenyl group; or T ₅ represents a C ₁ -C ₄ alkylacyl group, a C ₁ -C ₄ conjugated olefinic acyl group, a benzoyl group or a phenoxycarbonyl group, wherein the phenyl group in the benzoyl group and the phenoxycarbonyl group may be arbitrarily substituted with one or more halogens, T ₄ , a cyclopentyl group, a cyclohexyl group, CN, OH or JT ₄ ; or T ₅ is bonded to Ar via a single bond, a carbon atom or a carbonyl group. The aromatic ring in ₁ forms a ring structure; _T6 and _T7 each independently represent hydrogen, a _C1 - _C18 alkyl group, a C1- _C5 alkyl group substituted with _{a C1} - _C4 alkoxyacyl group, or or T ₆ and T ₇ each independently represent a C ₅ -C ₇ cycloalkyl group, or a C 5 -C 7 cycloalkyl group substituted with one or more halogens, C ₁ -C ₄ alkyl groups, C ₅ -C ₇ cycloalkyl groups, heterocycloalkyl groups, phenyl groups, heteroaryl groups, CN, C ₁ -C ₄ alkanoyloxy groups or aryloxy groups, or a C ₂ -C ₁₈ alkyl group inserted with a C ₅ -C ₇ cycloalkylene group, phenylene group, O, S or NT ₄ , or both of the above; or T ₆ and T ₇ each independently represent a C ₅ -C ₇ cycloalkyl group, or a C ₅ -C ₇ cycloalkyl group substituted with one or more C ₁ -C ₄ alkyl groups, phenyl groups, halogens or CN; or T ₆ and T ₇ each independently represent a phenyl group, or a C ₅ -C ₇ cycloalkyl group inserted with one or more C 1 -C 4 alkyl groups, phenyl groups, halogens or CN; wherein Y 1 is a _{C 1} -C ₄ alkyl group, a carboxyl group, a C ₁ -C ₁₂ alkylacyl group, a C ₅ -C ₆ cycloalkylcarbonyl group, or a C ₅ -C ₆ cycloalkyl-substituted C ₂ -C ₄ alkylacyl group, an arylacyl group, J T ₄ , a phenyl group, a halogen group, or a phenyl group substituted with CN; or T ₆ each forms a cyclic structure with the aromatic ring in Ar ₁ via a single bond, a carbon atom, or a carbonyl group; wherein when Ar ₁ is a substituted carbazolyl group, Y ₁ is not C, O, S, or N T ₇ .

In one embodiment of the present invention, based on 100 parts by weight of the alkali-soluble resin (A), the amount of the alkali-soluble resin (A-1) is 50 to 100 parts by weight, the amount of the compound containing an ethylenically unsaturated group (B) is 50 to 600 parts by weight, the amount of the photoinitiator (C) is 10 to 140 parts by weight, the amount of the photoinitiator (C-1) is 10 to 90 parts by weight, and the amount of the solvent (D) is 500 to 5000 parts by weight.

In one embodiment of the present invention, the amount of the ethylenically unsaturated monomer (a-1-2) containing an oxyalkylene group is 1 to 55 parts by weight, based on 100 parts by weight of the total amount of the mixture.

In one embodiment of the present invention, the amount of the ethylenically unsaturated monomer (a-1-3) containing a maleimide group or two alkenyl groups is 5 to 50 parts by weight, based on 100 parts by weight of the total amount of the mixture.

In one embodiment of the present invention, based on 100 parts by weight of the alkali-soluble resin (A), the amount of the photoinitiator (C-2) used is 5 parts by weight to 50 parts by weight.

The present invention also provides a spacer formed by the photosensitive resin composition.

The present invention also provides a protective film formed from the above-mentioned photosensitive resin composition.

The present invention also provides a liquid crystal display element, which includes the above-mentioned spacer.

The present invention also provides a liquid crystal display element, which includes the above-mentioned protective film.

Based on the above, the present invention improves the sensitivity of the photosensitive resin composition and forms a spacer with excellent step difference by combining a specific alkali-soluble resin (A-1) and a specific photoinitiator (C-1) in the photosensitive resin composition, and is therefore suitable for spacers, protective films and liquid crystal display elements.

In order to make the above features and advantages of the present invention more clearly understood, embodiments are given below and described in detail as follows.

Hereinafter, (meth)acrylic acid refers to acrylic acid and/or methacrylic acid, and (meth)acrylate refers to acrylate and/or methacrylate; similarly, (meth)acryl refers to acryl and/or methacryl; and (meth)acrylamide refers to acrylamide and/or methacrylamide. < Photosensitive resin composition >

The present invention provides a photosensitive resin composition, which includes an alkali-soluble resin (A), a compound containing an ethylenically unsaturated group (B), a photoinitiator (C) and a solvent (D). In addition, if necessary, the photosensitive resin composition may optionally include an additive (E). The following will describe in detail the various components of the photosensitive resin composition used in the present invention: Alkaline soluble resin (A)

The alkali-soluble resin (A) of the present invention includes an alkali-soluble resin (A-1) and may further include other alkali-soluble resins (A-2). Alkali-soluble resin (A-1)

The alkali-soluble resin (A-1) is obtained by copolymerization of a mixture, wherein the mixture (also referred to as "monomer mixture" in the synthesis example of the alkali-soluble resin (A-1) described below) includes an ethylenically unsaturated monomer (a-1-1) containing a carboxylic acid group or a carboxylic anhydride group and an ethylenically unsaturated monomer (a-1-2) containing an oxyalkylene group.

In addition, the above mixture may further include an ethylenically unsaturated monomer (a-1-3) containing a maleimide group or two alkenyl groups, and may optionally further include other ethylenically unsaturated monomers (a-1-4).

The alkali-soluble resin (A-1) may further contain an ethylenically unsaturated group. Specifically, the alkali-soluble resin (A-1) containing an ethylenically unsaturated group can be obtained by further subjecting the polymer obtained from the above mixture to a condensation reaction with an ethylenically unsaturated monomer (a-1-5).

The monomers forming the alkali-soluble resin (A-1) are described in detail below: Ethylenically unsaturated monomers containing carboxylic acid groups or carboxylic acid anhydride groups (a-1-1)

Since the ethylenically unsaturated monomer (a-1-1) containing a carboxylic acid group or a carboxylic acid anhydride group has a carboxylic acid group or a carboxylic acid anhydride group (hereinafter referred to as "acid group"), the synthesized polymer has an acid group on the side chain and has alkaline solubility. Specific examples of the ethylenically unsaturated monomer (a-1-1) containing a carboxylic acid group or a carboxylic acid anhydride group include ethylenically unsaturated monomers containing carboxylic acid groups such as acrylic acid, methacrylic acid, 2-acryloylethoxysuccinate, 2-methacryloylethoxysuccinate (HOMS), itaconic acid, ω-carboxy-polycaprolactone monoacrylate, etc.; ethylenically unsaturated monomers containing carboxylic acid anhydride groups such as maleic anhydride and itaconic anhydride, etc., or a combination of the above monomers. Specific examples of the ethylenically unsaturated monomer (a-1-1) containing a carboxylic acid group or a carboxylic anhydride group preferably include acrylic acid, methacrylic acid, 2-methacryloylethoxysuccinate, or a combination thereof.

Based on 100 parts by weight of the total amount of the mixture, the amount of the ethylenically unsaturated monomer ( a-1-1) containing a carboxylic acid group or a carboxylic anhydride group can be 10 to 90 parts by weight, preferably 15 to 85 parts by weight, and more preferably 20 to 80 parts by weight.

The oxyalkylene-containing ethylenically unsaturated monomer (a-1-2) is a monomer having two or more oxyalkylene groups. Specifically, the oxyalkylene-containing ethylenically unsaturated monomer (a-1-2) has a structure represented by formula (I). Formula (I) In formula (I), ^R1 , ^R2 and ^R3 each independently represent hydrogen or methyl , preferably each independently represents hydrogen; ^R4 represents a substituted or unsubstituted _C1 - _C20 straight or branched alkyl group, a substituted or unsubstituted _C2 - _C20 straight or branched alkenyl group, or a substituted or unsubstituted _C6 - _C20 aromatic hydrocarbon group, preferably a _C1 - _C20 straight alkyl group, an unsubstituted C6- _C20 aromatic hydrocarbon group, a _C6 - _C20 aromatic hydrocarbon group substituted with an aromatic hydrocarbon group, or a _C6 - _C20 substituted _C1 - _C10 alkyl group. ₂₀ , preferably methyl, phenyl, 4-nonylphenyl or biphenyl. AO represents a C ₂ -C ₂₀ oxyalkylene group, preferably a C ₂ -C ₁₀ oxyalkylene group, more preferably a C ₂ -C ₅ oxyalkylene group, and more preferably an oxyethylene group; x represents an integer from 0 to 2; y represents 0 or 1; n represents 2 or more, preferably 2 to 200, more preferably 2 to 50, and more preferably 2 to 15. It is worth noting that the ethylenically unsaturated monomer containing an oxyalkylene group (a-1-2) may contain one or more oxyalkylene groups.

Specific examples of the ethylenically unsaturated monomer (a-1-2) containing an oxyalkylene group include a mixture of o-phenylphenoxyethylene glycol acrylate (EO1 mol)/o-phenylphenoxydiethylene glycol acrylate (EO2 mol) (the molar ratio between o-phenylphenoxyethylene glycol acrylate and o-phenylphenoxydiethylene glycol acrylate is 1:1), o-phenylphenoxydiethylene glycol (meth) acrylate (EO2 mol), phenoxydiethylene glycol (meth) acrylate (EO2 mol), phenoxypolyethylene glycol (meth) acrylate (EO4 mol), methoxypolyethylene glycol (meth) acrylate (EO9 mol), methoxypolyethylene glycol (meth) acrylate (EO12 to 1 3 mol), methoxytriethylene glycol (meth)acrylate (EO3 mol), ethoxydiethylene glycol (meth)acrylate (EO2 mol), butoxydiethylene glycol (meth)acrylate (EO2 mol), 2-ethylhexyloxydiethylene glycol (meth)acrylate (EO2 mol), methoxydipropylene glycol (meth)acrylate (PO2 mol), methoxypolypropylene glycol (meth)acrylate (PO4 mol), nonylphenoxypolyethylene glycol (meth)acrylate (EO4 to 17 mol), nonylphenoxypolypropylene glycol (meth)acrylate (PO5 mol), ethylene oxide (EO) modified cresol (meth)acrylate (EO2 mol), or a combination of the above monomers.

Specific examples of the ethylenically unsaturated monomer (a-1-2) containing an oxyalkylene group preferably include o-phenylphenoxyethylene glycol acrylate/o-phenylphenoxydiethylene glycol acrylate (the molar ratio between phenylphenoxyethylene glycol acrylate and phenylphenoxydiethylene glycol acrylate is 1:1), phenoxydiethylene glycol acrylate, methoxypolyethylene glycol acrylate (EO9 mole), methoxypolyethylene glycol acrylate (EO12 to 13 moles), nonylphenoxypolyethylene glycol acrylate (EO4 to 17 moles), nonylphenoxypolypropylene glycol acrylate (PO5 moles), or a combination of the above monomers.

In the above text, "EO" and "PO" represent oxyethylene groups and oxypropylene groups, respectively. The molar number after "EO" and "PO" is the average molar number of oxyethylene groups or oxypropylene groups contained in each unit mole of the compound. For example, "methoxy polyethylene glycol acrylate (EO9 mole)" means that there are an average of 9 moles of oxyethylene groups in each unit mole of the compound.

If the ethylenically unsaturated monomer (a-1-2) containing an oxyalkylene group is not used, the sensitivity of the photosensitive resin composition is poor.

Based on the total amount of the mixture used being 100 parts by weight, the amount of the ethylene unsaturated monomer (a-1-2) containing an oxyalkylene group can be 1 to 55 parts by weight, preferably 1 to 50 parts by weight, and more preferably 1 to 45 parts by weight. The ethylene unsaturated monomer (a-1-3) containing a maleimide group or two alkenyl groups

The ethylenically unsaturated monomer (a-1-3) containing a maleimide group or two alkenyl groups includes an ethylenically unsaturated monomer containing a maleimide group (also referred to as a "monomer having a ring structure"), an ethylenically unsaturated monomer containing two alkenyl groups (also referred to as a "monomer that can form a ring structure after polymerization"), or a combination thereof. It is worth noting that the above-mentioned monomers can form a structural unit having a ring structure when forming a polymer.

Specific examples of the maleimide-containing ethylenic unsaturated monomer include maleimide, benzylmaleimide, phenylmaleimide, naphthylmaleimide, N-o-hydroxyphenylmaleimide, N-m-hydroxyphenylmaleimide, N-p-hydroxyphenylmaleimide, N-o-chlorophenylmaleimide, N-m-chlorophenylmaleimide, N-p-chlorophenylmaleimide, N-o-methylphenylmaleimide, N- Aromatically substituted maleimides such as m-methylphenylmaleimide, N-p-methylphenylmaleimide, N-o-methoxyphenylmaleimide, N-m-methoxyphenylmaleimide, N-p-methoxyphenylmaleimide; alkyl-substituted maleimides such as cyclohexylmaleimide, methylmaleimide, ethylmaleimide, propylmaleimide, isopropylmaleimide, or a combination of the above monomers.

In one embodiment, the maleimide-containing ethylenically unsaturated monomer includes a compound represented by formula (1), a compound represented by formula (2), a compound represented by formula (3), or a combination thereof. Formula (1) Formula (2) Formula (3)

The ethylenically unsaturated monomer containing two alkenyl groups may be, for example, 1,6-diene. The 1,6-diene includes the 1,6-diene represented by formula (4), the 1,6-diene represented by formula (5), or a combination thereof. Formula (4) Formula (5) In formula (4) and formula (5), ^R18 , ^R19 and ^R20 each independently represent hydrogen or a _C1 - _C30 linear or branched alkyl group, preferably hydrogen or a _C1 - _C10 linear or branched alkyl group, more preferably hydrogen or a C1 _{- C5} linear or branched alkyl group, and even more preferably methyl group.

Specific examples of 1,6-diene hydrocarbons include dimethyl-2,2'-[oxybis(ethylenemethyl)]bis-2-acrylate, methyl α-(allyloxymethyl)acrylate, or a combination thereof.

Specific examples of the ethylenically unsaturated monomer (a-1-3) containing a maleimide group or two alkenyl groups preferably include benzylmaleimide, phenylmaleimide, cyclohexylmaleimide, dimethyl-2,2'-[oxybis(ethylenemethyl)]bis-2-acrylate, α-(allyloxymethyl)acrylate, or a combination thereof.

When an ethylenically unsaturated monomer (a-1-3) containing a maleimide group or two alkenyl groups is used, a spacer having a further excellent step difference can be formed.

Based on 100 parts by weight of the total amount of the mixture, the amount of the maleimide group or two alkenyl groups-containing ethylenically unsaturated monomer (a-1-3) can be 5 to 50 parts by weight, preferably 8 to 45 parts by weight, and more preferably 10 to 40 parts by weight. Other ethylenically unsaturated monomers (a-1-4)

The mixture constituting the alkali-soluble resin (A-1) may further include other ethylenically unsaturated monomers (a-1-4). Other ethylenically unsaturated monomers (a-1-4) are ethylenically unsaturated monomers other than the ethylenically unsaturated monomers (a-1-1) containing a carboxylic acid group or a carboxylic anhydride group, the ethylenically unsaturated monomers (a-1-2) containing an oxyalkylene group, the ethylenically unsaturated monomers (a-1-3) containing a maleimide group or two alkenyl groups, and the ethylenically unsaturated monomers (a-1-5) described below.

Specific examples of other ethylenically unsaturated monomers (a-1-4) include methyl acrylate, methyl methacrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, t-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, cyclohexyl (meth)acrylate, lauryl (meth)acrylate, stearic (meth)acrylate, phenyl (meth)acrylate, biphenyl (meth)acrylate, methoxyethyl (meth)acrylate, ethoxyethyl (meth)acrylate, butoxyethylene glycol (meth)acrylate, 2-ethylhexyl glycol di(meth)acrylate, methoxypropylene glycol (meth)acrylate, phenoxyethyl (meth)acrylate, biphenoxyethyl (meth)acrylate, acrylate), dicyclopentanyl (meth)acrylate, tricyclodecyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, tricyclodecyl oxyethyl (meth)acrylate acrylate), nonylphenoxyethylene glycol (meth)acrylate, nonylphenoxypropylene glycol (meth)acrylate, benzyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, etc. (meth)acrylates; (meth)acryloyl morpholine (morpholine (meth)acrylate), (meth)acrylamide, N-methyl (meth)acrylamide, N-isopropyl (meth)acrylamide, N-butyl (meth)acrylamide, N-isobutyl (meth)acrylamide, N-tert-butyl (meth)acrylamide, N-tert-octyl (meth)acrylamide, diacetone (meth)acrylamide (diacetone (meth)acrylamide (Meth)acrylic amides such as acrylamide, N-hydroxymethyl (meth)acrylamide, N-hydroxyethyl (meth)acrylamide, N-cyclohexyl (meth)acrylamide, N-phenyl (meth)acrylamide, N-benzyl (meth)acrylamide, N-triphenylmethyl (meth)acrylamide, and N,N-dimethyl (meth)acrylamide; aromatic vinyl compounds such as styrene, vinyltoluene, and α-methylstyrene; butadiene or substituted butadiene compounds such as butadiene and isoprene; ethylene or substituted ethylene compounds such as ethylene, propylene, vinyl chloride, and acrylonitrile; and vinyl esters such as vinyl acetate (vinyl acetate). These monomers can be used alone or in combination.

Specific examples of other ethylenically unsaturated monomers (a-1-4) preferably include 2-hydroxyethyl methacrylate, methyl methacrylate, dicyclopentyl methacrylate, benzyl methacrylate, styrene, or a combination thereof.

Based on 100 parts by weight of the total amount of the mixture, the amount of the other ethylenically unsaturated monomer (a-1-4) can be 0 to 55 parts by weight, preferably 5 to 50 parts by weight, and more preferably 10 to 45 parts by weight. Ethylenically unsaturated monomer (a-1-5)

The alkali-soluble resin (A-1) may further contain an ethylenically unsaturated group. Such an alkali-soluble resin (A-1) is a polymer formed from monomers such as an ethylenically unsaturated monomer (a-1-1) containing a carboxylic acid group or a carboxylic anhydride group, an ethylenically unsaturated monomer (a-1-2) containing an oxyalkylene group, an ethylenically unsaturated monomer (a-1-3) containing a maleimide group or two alkenyl groups, and other ethylenically unsaturated monomers (a-1-4), and is further obtained by a condensation reaction with an ethylenically unsaturated monomer (a-1-5).

The ethylenically unsaturated monomer (a-1-5) includes an epoxy group-containing ethylenically unsaturated monomer, an isocyanate group-containing ethylenically unsaturated monomer, a hydroxyl group-containing ethylenically unsaturated monomer, or a combination thereof.

When the ethylenic unsaturated monomer (a-1-1) containing a carboxylic acid group or a carboxylic anhydride group is a carboxylic acid group-containing ethylenic unsaturated monomer, an epoxy group-containing ethylenic unsaturated monomer and an isocyanate group-containing ethylenic unsaturated monomer can be used as the ethylenic unsaturated monomer (a-1-5). Specific examples of the epoxy group-containing ethylenic unsaturated monomer include glycidyl (meth)acrylate (glycidyl methacrylate), 3,4-epoxyhexylmethyl (meth)acrylate, o-vinylbenzyl glycidyl ether (o-vinylbenzyl glycidyl ether), m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, 4-hydroxybutyl acrylate glycidyl ether, or a combination thereof. Specific examples of the isocyanato (-N=C=O)-containing ethylenically unsaturated monomer include 2-isocyanatoethyl (meth)acrylate.

When the ethylenically unsaturated monomer (a-1-1) containing a carboxylic acid group or a carboxylic acid anhydride group is a ethylenically unsaturated monomer containing a carboxylic acid anhydride group, a hydroxyl group-containing ethylenically unsaturated monomer can be used as the ethylenically unsaturated monomer (a-1-5). Specific examples of the hydroxyl group-containing ethylenically unsaturated monomer include 2-hydroxyethyl (meth)acrylate and the like.

Specific examples of the ethylenically unsaturated monomer (a-1-5) preferably include glycidyl methacrylate (glycidyl methacrylate), 3,4-epoxyhexylmethyl methacrylate, o-vinylbenzyl glycidyl ether (o-vinylbenzyl glycidyl ether), or a combination thereof.

When the alkali-soluble resin (A-1) contains an ethylenically unsaturated group, the photosensitive resin composition has excellent sensitivity.

Based on 100 parts by weight of the total amount of the mixture, the amount of the ethylenically unsaturated monomer (a-1-5) can be 10 to 180 parts by weight, preferably 15 to 160 parts by weight, and more preferably 20 to 140 parts by weight.

The following is a detailed description of the preparation method of the alkali-soluble resin (A-1):

The alkali-soluble resin (A-1) can be prepared by polymerization of the above-mentioned ethylenically unsaturated monomers (a-1-1) containing carboxylic acid groups or carboxylic anhydride groups, ethylenically unsaturated monomers (a-1-2) containing oxyalkylene groups, ethylenically unsaturated monomers (a-1-3) containing maleimide groups or two alkenyl groups, and other ethylenically unsaturated monomers (a-1-4). There is no particular limitation, and an appropriate polymerization method can be selected according to the requirements. The polymerization method is, for example, solution polymerization.

The mixture constituting the alkali-soluble resin (A-1) may include a solvent. The type of solvent is not particularly limited. Specifically, specific examples of the solvent include ethers such as tetrahydrofuran, dioxane, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, and propylene glycol monomethyl ether; ketones such as acetone and methyl ethyl ketone; esters such as ethyl acetate (ethyl acetate), butyl acetate (butyl acetate), propylene glycol monomethyl ether acetate, and 3-methoxybutyl acetate; alcohols such as methanol and ethanol; aromatic hydrocarbons such as toluene, xylene, and ethylbenzene; chloroform; dimethyl sulfoxide, etc. The above-mentioned solvents can be used alone or in combination. The solvent is preferably propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, or a combination thereof.

The polymerization concentration of the above mixture during polymerization is 5 wt % to 90 wt %, preferably 5 wt % to 50 wt %, and more preferably 10 wt % to 50 wt %.

The mixture constituting the alkali-soluble resin (A-1) may include a polymerization initiator. The type of the polymerization initiator is not particularly limited. Specifically, specific examples of the polymerization initiator include cumene hydroperoxide (CHP), diisopropylbenzene hydroperoxide, di-t-butyl peroxide, lauroyl peroxide, benzoyl peroxide, t-butylperoxyisopropyl carbonate, and t-butylperoxyisopropyl carbonate. Organic peroxides such as 2,2'-azobis(isobutyronitrile), 1,1'-azobis(cyclohexanecarbonitrile), 2,2'-azobis(2,4-dimethylvaleronitrile), and dimethyl 2,2'-azobis(2-methyl propionate). The polymerization initiator is preferably t-butylperoxy-2-ethylhexanoate. The amount of the polymerization initiator used is 0.1 to 15 parts by weight, preferably 0.5 to 10 parts by weight, relative to 100 parts by weight of all monomers in the mixture.

The polymerization temperature of the alkali-soluble resin (A-1) when polymerized by a solution polymerization method may be 40°C to 150°C, preferably 60°C to 130°C.

The polymer formed by the above mixture can be further subjected to an addition reaction with an ethylenically unsaturated monomer (a-1-5) to obtain a polymer containing an ethylenically unsaturated group (carbon double bond). The method for reacting the polymer with the ethylenically unsaturated monomer (a-1-5) is not particularly limited. For example, in the presence of a polymerization inhibitor and a catalyst described later, an addition reaction is performed by reacting the ethylenically unsaturated monomer (a-1-5) with part or all of the acid groups (preferably part of the acid groups) of the polymer formed by the above mixture.

In addition, a chain transfer agent may be added during the solution polymerization process to control the molecular weight of the polymer. The chain transfer agent is not particularly limited as long as it is a compound that can function as a chain transfer agent in a free radical polymerization reaction. The chain transfer agent is, for example, an alkylthiol such as n-dodecyl mercaptan (1-dodecanethiol, nDM). The amount of the chain transfer agent used can be 0.1 to 15 parts by weight, preferably 1.2 to 5.0 parts by weight, relative to 100 parts by weight of all monomers in the mixture.

Finally, the solution polymerization method can use a polymerization inhibitor to terminate the free radical polymerization reaction. The type of polymerization inhibitor is not particularly limited, and an alkylphenol compound such as 6-tert-butyl-2,4-dimethylphenol can be used. In addition, the solution polymerization method can also use a catalyst. The type of catalyst is not particularly limited, and an tertiary amine such as dimethylbenzylamine and triethylamine can be used.

The alkali-soluble resin (A-1) may be a random copolymer or a block copolymer.

The weight average molecular weight of the alkali-soluble resin (A-1) can be measured by gel permeation chromatography (GPC) using tetrahydrofuran (THF) solvent. The weight average molecular weight of the alkali-soluble resin (A-1) can be 3,000 to 200,000, preferably 4,000 to 100,000, and more preferably 5,000 to 50,000.

The acid value of the alkali-soluble resin (A-1) may be 20 mg KOH/g to 300 mg KOH/g, preferably 25 mg KOH/g to 200 mg KOH/g, and more preferably 30 mg KOH/g to 150 mg KOH/g.

When the alkali-soluble resin (A-1) is used, the photosensitive resin composition has excellent sensitivity. On the contrary, if the alkali-soluble resin (A-1) is not used, the sensitivity of the photosensitive resin composition is poor.

Based on 100 parts by weight of the alkali-soluble resin (A), the amount of the alkali-soluble resin (A-1) used may be 50 parts by weight to 100 parts by weight, preferably 60 parts by weight to 100 parts by weight, and more preferably 70 parts by weight to 100 parts by weight. Other alkali-soluble resins (A-2)

The alkali-soluble resin (A) may include other alkali-soluble resins (A-2) other than the alkali-soluble resin (A-1).

There is no particular limitation on the other alkali-soluble resin (A-2), as long as the other alkali-soluble resin (A-2) is different from the alkali-soluble resin (A-1). In addition, there is no particular limitation on the production method of the other alkali-soluble resin (A-2), for example, it can be similar to the alkali-soluble resin (A-1), so it will not be described in detail.

Based on 100 parts by weight of the alkali-soluble resin (A), the amount of the other alkali-soluble resin (A-2) used may be 0 to 50 parts by weight, preferably 0 to 40 parts by weight, and more preferably 0 to 30 parts by weight. Compound containing ethylenically unsaturated groups (B)

The ethylenically unsaturated group-containing compound (B) includes a compound having one ethylenically unsaturated group, a compound having two or more (including two) ethylenically unsaturated groups, or a combination thereof.

Specific examples of the compound having one ethylenically unsaturated group may include, but are not limited to, (meth)acrylamide, (meth)acryloyl morpholine, 7-amino-3,7-dimethyloctyl (meth)acrylate, isobutoxymethyl (meth)acrylamide, isobornyloxyethyl (meth)acrylate, isobornyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, ethylene glycol di(meth)acrylate, ethoxydiethylene glycol (meth)acrylate, tert-octyl (meth)acrylamide, diacetone (meth)acrylamide, dimethylaminoethyl (meth)acrylate, dodecyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, dicyclopentenyl (meth)acrylate, N,N-dimethyl (meth)acrylamide, Compounds such as amide, tetrachlorophenyl (meth)acrylate, 2-tetrachlorophenoxyethyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, tetrabromophenyl (meth)acrylate, 2-tetrabromophenoxyethyl (meth)acrylate, 2-trichlorophenoxyethyl (meth)acrylate, tribromophenyl (meth)acrylate, 2-tribromophenoxyethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, vinyl caprolactam, N-vinylpyrrolidone, phenoxyethyl (meth)acrylate, pentachlorophenyl (meth)acrylate, pentabromophenyl (meth)acrylate, polyethylene mono(meth)acrylate, propylene mono(meth)acrylate, or bornyl (meth)acrylate may be used. These compounds having one ethylenically unsaturated group may be used alone or in combination.

Specific examples of compounds having two or more (including two) ethylenically unsaturated groups may include, but are not limited to, ethylene glycol diacrylate, ethylene glycol dimethacrylate, dicyclopentene di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, tri(2-hydroxyethyl)isocyanate di(meth)acrylate, tri(2-hydroxyethyl)isocyanate tri(meth)acrylate, caprolactone-modified tri(2-hydroxyethyl)isocyanate tri(meth)acrylate, ) isocyanate tri(meth)acrylate, trihydroxymethylpropyl triacrylate, trihydroxymethylpropyl trimethacrylate, trihydroxymethylpropyl tri(meth)acrylate modified with ethylene oxide (abbreviated as "EO"), trihydroxymethylpropyl tri(meth)acrylate modified with propylene oxide (abbreviated as "PO"), tripropylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol Di(meth)acrylate, polyester di(meth)acrylate, polyethylene glycol di(meth)acrylate, dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol tetra(meth)acrylate, caprolactone-modified dipentaerythritol hexa(meth)acrylate, caprolactone-modified dipentaerythritol penta(meth)acrylate, tetra(meth)acrylate ditrihydroxymethylpropyl, epoxyethylene The present invention can be used as a compound of bisphenol A di(meth)acrylate modified with ethylene oxide, bisphenol A di(meth)acrylate modified with propylene oxide, hydrogenated bisphenol A di(meth)acrylate modified with ethylene oxide, hydrogenated bisphenol A di(meth)acrylate modified with propylene oxide, bisphenol F di(meth)acrylate pentaerythritol triacrylate modified with ethylene oxide, glycerol triacrylate modified with propylene oxide, or novolac polyglycidyl ether (meth)acrylate. Compounds having two or more (including two) ethylenically unsaturated groups can be used alone or in combination of two or more.

Specific examples of the ethylenically unsaturated group-containing compound (B) may preferably include but are not limited to ethylene glycol dimethacrylate, trihydroxymethylpropyl triacrylate, trihydroxymethylpropyl triacrylate modified with ethylene oxide, trihydroxymethylpropyl triacrylate modified with propylene oxide, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate, dipentaerythritol pentaacrylate, dipentaerythritol tetraacrylate, dipentaerythritol hexaacrylate modified with caprolactone, ditrihydroxymethylpropyl tetraacrylate, glycerol triacrylate modified with propylene oxide, or a combination of the above compounds.

The ethylenically unsaturated group-containing compound (B) is more preferably ethylene glycol dimethacrylate, trihydroxymethylpropyl triacrylate, dipentaerythritol hexaacrylate, or a combination thereof.

Based on 100 parts by weight of the alkali-soluble resin (A), the amount of the compound (B) containing an ethylenically unsaturated group can be 50 parts by weight to 600 parts by weight, preferably 70 parts by weight to 580 parts by weight, and more preferably 90 parts by weight to 550 parts by weight. Photoinitiator (C)

The photoinitiator (C) may include the photoinitiator (C-1) and may further include the photoinitiator (C-2). In addition, the photoinitiator (C) may optionally include another photoinitiator (C-3). Photoinitiator (C-1)

The photoinitiator (C-1) is a compound represented by the following formula (II). Formula (II): In formula (II), A represents hydrogen, halogen, nitro, C ₁ -C ₂₀ straight or branched alkyl, C ₃ -C ₁₀ alkylcycloalkyl, C ₄ -C ₁₀ alkylcycloalkyl, C ₄ -C ₁₀ cycloalkylalkyl, , or , wherein C ₁ -C ₂₀ straight or branched alkyl, C ₃ -C ₁₀ alkylcycloalkyl, C ₄ -C ₁₀ alkylcycloalkyl, C ₄ -C ₁₀ cycloalkylalkyl, , or any -CH ₂ - contained in it may be substituted by O, N, S or a carbonyl group; R ⁵ represents hydrogen, a halogen, a C ₁ -C ₂₀ straight chain or branched chain alkyl, a C ₄ -C ₂₀ cycloalkylalkyl or a C ₂ -C ₂₀ alkenyl group, wherein the -CH ₂ - contained in the C ₁ -C ₂₀ straight chain or branched chain alkyl, a C ₄ -C ₂₀ cycloalkylalkyl and a C ₂ -C ₂₀ alkenyl group may be substituted by O, N, S or a carbonyl group, and two R ^5s may form a cyclic structure; R ⁶ represents a C ₁ -C ₂₀ straight chain or branched chain alkyl, a C ₂ -C ₂₀ alkenyl, a C ₃ -C ₂₀ cycloalkyl, a C ₄ -C ₂₀ cycloalkylalkyl, a C ₄ -C 20 wherein one or more hydrogens in these groups may be independently substituted by an alkyl group, a halogen group, a hydroxyl group or a nitro _group , and the _-CH2- in _R6 may be substituted by O, _N , _S or a carbonyl group; R7 represents a _C1 - _C20 straight or branched alkyl group, a _C3 - _C20 cycloalkyl group, a C4-C20 cycloalkylalkyl group, a C4-C20 alkylcycloalkyl group, a ^C6 - ^C20 aryl group, a _C6 - _C20 alkylaryl group, a group represented by the following formula (II-A), a group represented by the following formula (II-B) or a group represented by the following formula (II-C); when _R7 represents a C1-C20 straight or branched alkyl group, a C3-C20 cycloalkyl group, a _C4 - _C20 cycloalkylalkyl group, a _C4 - _C20 alkylcycloalkyl group, a _C6 - _C20 aryl group, a ^C6 - _C20 alkylaryl group, a group represented by the following formula (II-A), a group represented by the following formula (II-B) or a group represented by the following formula (II-C), When it is a _{C 20} -C straight-chain or branched alkyl group, a C ₃ -C ₂₀ cycloalkyl group, a C ₄ -C ₂₀ cycloalkylalkyl group, a C ₄ -C ₂₀ alkylcycloalkyl group, a C ₆ -C ₂₀ aryl group or a C ₆ -C ₂₀ alkylaryl group, one or more hydrogen groups in these groups may be independently substituted by an alkyl group, a halogen group, a hydroxyl group or a nitro group, and the -CH ₂ - in R ⁷ may be substituted by an O, a N, a S or a carbonyl group; R ⁶ and R ⁷ may form a ring structure; Formula (II-A) In formula (II-A), m represents an integer of 0 or 1, R ¹¹ represents hydrogen, a C ₁ -C ₈ alkyl group, or a phenyl group, and R ¹² , R ¹³ and R ¹⁴ each independently represent hydrogen or a C ₁ -C ₄ alkyl group; Formula (II-B) In formula (II-B), p is an integer from 0 to 3; Formula (II-C) In formula (II-C), R ^{1 5} represents hydrogen, C ₁ -C ₈ alkyl, or phenyl, Ar is substituted or unsubstituted phenyl, naphthyl, furyl, thienyl, or pyridyl; R ⁸ represents N-morpholinyl ( ）、N-piperidinyl( ), N-pyrrolyl ( ) or N-dialkyl (N(R ²¹ ) ₂ , wherein R ²¹ represents an alkyl group), wherein one or more hydrogen atoms in these groups may be substituted by a halogen or a hydroxyl group; R ⁹ and R ⁹ ' each independently represent a C ₁ -C ₂₀ straight or branched chain alkyl group, a C ₄ -C ₂₀ cycloalkyl group, a C ₂ -C ₂₀ alkenyl group, a C ₆ -C ₂₀ aryl group or a C ₆ -C ₂₀ alkylaryl group, wherein one or more hydrogen atoms in these groups may be substituted by an alkyl group, a halogen, a hydroxyl group or a nitro group, and -CH ₂ - in these groups may be substituted by -O-; or R ⁹ and R ⁹ ' may be connected to each other or form a five-membered ring or a six-membered ring via -O-, -S- or -NH-; R ¹⁰ represents a C _{1 -C20} straight or branched alkyl, _C4 - _C20 cycloalkyl, C4 _{-C20 alkylcycloalkyl, C2-C20 alkenyl, C6-C20 aryl or C6-C20 alkylaryl , wherein the -CH2- in these} groups may be substituted by -O- or _-S- , and one or more hydrogen in these groups may be independently substituted by alkyl, halogen, nitro, cyano, ^SR16 or ^OR17 ; ^R16 and ^R17 each independently represent hydrogen, or _C1 - _C20 straight or branched alkyl.

In formula (II), A preferably represents hydrogen, methyl, methoxy, chlorine, nitro, or N-morpholinyl, wherein R ¹⁰ is preferably phenyl, phenyl substituted with one or more methyl groups, phenyl substituted with nitro, or , more preferably represents hydrogen, methyl, nitro, phenyl substituted by one or more methyl groups, or N-morpholinyl, wherein * represents the bonding position.

In formula (II), R ⁵ preferably represents hydrogen, methyl, propyl, butyl or allyl (-CH ₂ CH=CH ₂ ) and more preferably represents hydrogen, methyl, butyl or allyl.

In formula (II), ^R6 preferably represents a methyl group or an ethyl group.

In formula (II), ^R7 is preferably a methyl group, an ethyl group or a benzyl group, and more preferably a methyl group or a benzyl group.

In formula (II), ^R8 is preferably N-morpholinyl, N-piperidinyl, -N( _{CH3 ) 2} , -N( _CH2CH2CH3 ) ₂ or N- _pyrrolyl , more preferably N-morpholinyl, -N( _CH3 ) ₂ , N-pyrrolyl or N-piperidinyl, wherein * indicates a bonding position.

Specific examples of the photoinitiator (C-1) include compounds represented by the following formula (II-1) to formula (II-35), or combinations of these compounds. Formula (II-1) Formula (II-2) Formula (II-3) Formula (II-4) Formula (II-5) Formula (II-6) Formula (II-7) Formula (II-8) Formula (II-9) Formula (II-10) Formula (II-11) Formula (II-12) Formula (II-13) Formula (II-14) Formula (II-15) Formula (II-16) Formula (II-17) Formula (II-18) Formula (II-19) Formula (II-20) Formula (II-21) Formula (II-22) Formula (II-23) Formula (II-24) Formula (II-25) Formula (II-26) Formula (II-27) Formula (II-28) Formula (II-29) Formula (II-30) Formula (II-31) Formula (II-32) Formula (II-33) Formula (II-34) Formula (II-35)

Specific examples of the photoinitiator (C-1) preferably include a compound represented by formula (II-1), a compound represented by formula (II-5), a compound represented by formula (II-11), a compound represented by formula (II-14), a compound represented by formula (II-17), a compound represented by formula (II-19), a compound represented by formula (II-28), a compound represented by formula (II-35), or a combination of these compounds.

By using the photoinitiator (C-1), a spacer with good step difference can be formed. On the contrary, if the photoinitiator (C-1) is not used, the step difference of the formed spacer is poor.

Based on 100 parts by weight of the alkali-soluble resin (A), the amount of the photoinitiator (C-1) used can be 10 parts by weight to 90 parts by weight, preferably 12 parts by weight to 85 parts by weight, and more preferably 15 parts by weight to 80 parts by weight. Photoinitiator (C-2)

The photoinitiator (C-2) is a compound represented by the following formula (III). Formula (III) In formula (III), Ar ₁ represents an azimuthal aryl group or an azimuthal heteroaryl group, wherein the azimuthal aryl group or the azimuthal heteroaryl group is a ring structure formed by two adjacent atoms with Y ₁ and the carbonyl group, and the substituents on the remaining atoms are independently selected from hydrogen; halogen; C ₁ -C ₁₂ alkyl; C ₅ -C ₇ cycloalkyl; C ₁ -C ₄ alkyl substituted with C ₅ -C ₇ cycloalkyl; phenyl; phenyl substituted with one or more C ₁ -C ₄ alkyl, carboxyl, C ₁ -C ₁₂ alkyl acyl, C ₁ -C ₁₂ aryl acyl, heteroaryl acyl, JT ₄ , phenyl, halogen or CN; C ₁ -C ₄ alkylbenzyloxy; Substituted C ₁ -C ₄ alkoxy, C ₁ -C ₃ alkylenedioxy; ; C ₁ -C ₁₂ alkylthio; C ₁ -C ₄ alkylphenylthio; a substituted C ₁ -C ₄ alkylthio group; CN; a carboxyl group; a C ₁ -C ₁₂ alkoxymethyl group; an aryl acyl group; a heteroaryl acyl group and a group consisting of JT ₅ ; or two adjacent substituents in the above substituents of Ar ₁ or between the substituent and Ar ₁ form a cyclic structure via a single bond, a carbon atom, or a carbonyl group; wherein, in JT ₄ and JT ₅ , J is selected from the group consisting of O, S, and NT ₆ ; Y ₁ is selected from the group consisting of O, S, NT ₇ , BT ₇ , CT ₂ T ₃ , SiT ₂ T ₃ , S=O, and C=O; T ₁ represents hydrogen, a C ₁ -C ₁₈ alkyl group, or a C 1 -C 18 alkoxy group; or T ₁ represents a C 1 -C ₁₈ alkyl group, or a C _{1 -C} 18 alkoxy group; _C2 -C18 alkyl group substituted with a _C5 - _C7 cycloalkyl group, a heterocycloalkyl group, a phenyl group, a heteroaryl group, CN, a _C1 - _C4 alkanoyloxy group or an aryloxy group and/or inserted with a _C5 - _C7 cycloalkylene group, a phenylene group, O, S or _NT4 ; _{C2 - C18} alkenyl group; C2- _C18 alkenyl group substituted with one or more halogens, a _C1 - _C4 alkyl group, a _C5 - _C7 cycloalkyl group, a heterocycloalkyl group, a phenyl group, a heteroaryl group, CN, a _C1 - _C4 alkanoyloxy group or an _aryloxy group and/or inserted with a _{C5 - C7} cycloalkylene group, a phenylene group, O, S or _NT4 , or both of the above; or _T1 represents _C5 -C or _T1 represents a _phenyl group, or a phenyl group substituted by one or more _C1 - _C4 alkyl groups, _{C1 - C4} alkoxy groups, phenyl groups, halogen _groups or CN; or T1 represents a naphthyl group, a benzoyl group or a phenoxycarbonyl group, wherein the phenyl group of the benzoyl group and the phenoxycarbonyl group is arbitrarily substituted by one or more halogen groups, _T4 , a _C5 - _C6 cycloalkyl group, CN, OH or _JT4 ; _T2 and _T3 each independently represent hydrogen, a C1 _{- C18} alkyl group, a C1- _C5 alkyl group substituted by a carboxyl group, a _{C1 -C5 alkyl group substituted by a C1-C4 alkoxyacyl group or a C1-C5 alkyl group substituted by} a _C1 - _C4 alkoxyacyl group or a or _T2 and _T3 each independently represent a C2- _C18 alkyl group substituted by one or more halogens, _C1 - _C4 alkyl groups, _C5 - _C7 cycloalkyl groups, heterocycloalkyl groups, phenyl groups, heteroaryl groups, CN, _{C1 - C4} alkanoyloxy groups, aryloxy groups, or a _C2 - _C18 alkyl group inserted by a _C5 - _C7 cycloalkylene group, a phenylene group, O, S or NT4, or both of the above; or _T2 and _T3 each independently represent a C5 _- C7 cycloalkyl group, or a _C5 - _C7 cycloalkyl group substituted by one or more C1- _C4 alkyl groups, phenyl groups, halogens or _CN ; or T2 and T3 _each independently represent a C5- _C7 cycloalkyl group, or a _C5 - _C7 cycloalkyl group substituted by one or more C1- _C4 alkyl groups, phenyl groups, halogens or CN; _{T2 and T3} each independently represent a phenyl group, or a _C2 - _C4 alkyl group, a _C1 - _C4 alkoxy group, a carboxyl group, a _C1 - _C12 alkylacyl group, a _C5 - _C6 cycloalkylcarbonyl group or a _C5 -C6 cycloalkyl group, a _C2 - _C4 alkylacyl group, an arylacyl group, a phenyl _group , a halogen or a CN-substituted phenyl group; or ... or a _C2 -C4 alkylacyl group, a C5- _C6 cycloalkylcarbonyl group or a C5- _C6 cycloalkyl group, a C2-C4 alkylacyl group, an arylacyl group, a phenyl group, a halogen or a CN-substituted phenyl group; or _{T2 and T3} each independently represent a phenyl group, or a _C2 - _C4 alkyl group, or a C2- _C4 alkylacyl group, a _C1 - _C18 alkylacyl group, a C1- _C18 cycloalkyl -C ₄ alkoxy acyl substituted C ₁ -C ₅ alkyl or or _T5 represents a C2 _{- C18 alkyl} group substituted by one or more halogen, _C1 - _C4 alkyl, _C5 - _C7 cycloalkyl, heterocycloalkyl, phenyl, heteroaryl, CN, _C1 - _C4 alkanoyloxy or aryloxy groups, or a _{C2 - C18} alkyl group inserted by a C5 _{- C7} cycloalkylene, phenylene, O, S or _NT4 , or both of the above; or _T5 represents a _C5 - _C7 cycloalkyl group, or a C5- _C7 cycloalkyl group substituted by one or more _C1 - _C4 alkyl, phenyl, halogen or CN; or _T5 represents a phenyl group, or a C2- _{C18 alkyl group inserted by one or more C1-C12 alkyl ,} carboxyl, _C1 -C or N4; wherein T5 represents a C1- _C4 alkylacyl group, a C2 _{- C12} alkylacyl group inserted by a phenylene group, O, S or _NT4, a _C5 - _C6 cycloalkylcarbonyl group, a C2-C4 alkylacyl group substituted by a _C5 - _C6 cycloalkyl group, an arylacyl group, a heteroarylacyl group, a phenyl group substituted by the above substituents such as _JT4 , phenyl, halogen, CN or _NO2 , wherein the arylacyl group is a benzoyl group, or a benzoyl group substituted by one or more halogens, C1-C4 alkyl groups or C1- _C4 alkoxy groups; or T5 represents a _C1 - _C4 alkylacyl group, a C1-C4 alkylacyl group, a _C1 -C4 cycloalkyl group, a C2-C4 alkylacyl group, an arylacyl group, a heteroarylacyl group, JT4, phenyl, halogen, CN or NO2, wherein the arylacyl group is a benzoyl group, or a benzoyl group substituted by one or more halogens, C1- _C4 alkyl groups or _C1 - _{C4 alkoxy groups; or T5 represents a C1-C4 alkylacyl group} , a _C1 -C ₄ , a conjugated alkylene group, a benzoyl group or a phenoxycarbonyl group, wherein the phenyl group in the benzoyl group and the phenoxycarbonyl group may be arbitrarily substituted by one or more halogens, _T4 , cyclopentyl, cyclohexyl, CN, OH or _JT4 ; or _T5 forms a cyclic structure with the aromatic ring in _Ar1 via a single bond, a carbon atom or a carbonyl group; _T6 and _T7 each independently represent hydrogen, a _C1 - _C18 alkyl group, a C1-C5 alkyl group substituted by a C1 _- C4 alkoxyacyl group or a _C1 - _C5 alkyl group substituted by a C1- _C4 alkoxyacyl group. or T ₆ and T ₇ each independently represent a C ₅ -C ₇ cycloalkyl group, or a C 5 -C 7 cycloalkyl group substituted with one or more halogens, C ₁ -C ₄ alkyl groups, C ₅ -C ₇ cycloalkyl groups, heterocycloalkyl groups, phenyl groups, heteroaryl groups, CN, C ₁ -C ₄ alkanoyloxy groups or aryloxy groups, or a C ₂ -C ₁₈ alkyl group inserted with a C ₅ -C ₇ cycloalkylene group, phenylene group, O, S or NT ₄ , or both of the above; or T ₆ and T ₇ each independently represent a C ₅ -C ₇ cycloalkyl group, or a C ₅ -C ₇ cycloalkyl group substituted with one or more C ₁ -C ₄ alkyl groups, phenyl groups, halogens or CN; or T ₆ and T ₇ each independently represent a phenyl group, or a C ₅ -C ₇ cycloalkyl group inserted with one or more C 1 -C 4 alkyl groups, phenyl groups, halogens or CN; wherein Y 1 is a _{C 1} -C ₄ alkyl group, a carboxyl group, a C ₁ -C ₁₂ alkylacyl group, a C ₅ -C ₆ cycloalkylcarbonyl group, or a C ₅ -C ₆ cycloalkyl-substituted C ₂ -C ₄ alkylacyl group, an arylacyl group, J T ₄ , a phenyl group, a halogen group, or a phenyl group substituted with CN; or T ₆ each forms a cyclic structure with the aromatic ring in Ar ₁ via a single bond, a carbon atom, or a carbonyl group; wherein when Ar ₁ is a substituted carbazolyl group, Y ₁ is not C, O, S, or N T ₇ .

In formula (III), Ar ₁ preferably represents a group represented by the following formula (III-A). In formula (III-A), T ₈ , T ₉ , T ₁₀ and T ₁₁ each independently represent hydrogen; or T ₈ , T ₉ , T ₁₀ and T ₁₁ each independently represent a C _{1 -C 4 alkoxy group substituted with one or more C 1 -C 12 alkoxy} groups or C _{1 -C 4} alkylbenzyloxy groups; substituted C ₁ -C ₄ alkoxy; or T ₈ , T ₉ , T ₁₀ and T ₁₁ each independently represent a phenoxy group substituted with one or more C ₁ -C ₄ alkyl groups; a phenoxy group substituted with a C ₁ -C ₈ alkylacyl group, a C ₅ -C ₆ cycloalkylacyl group, an arylacyl group or a heteroarylacyl group; a C ₁ -C ₄ alkylacylphenoxy group substituted with a C ₅ -C ₆ cycloalkyl group; a C ₁ -C ₃ alkylenedioxy group; ; C ₁ -C ₁₂ alkylthio; Substituted C ₁ -C ₄ alkylthio; C ₁ -C ₄ alkylphenylthio; substituted C ₁ -C ₄ alkylphenylthio; or T ₈ , T ₉ , T ₁₀ and T ₁₁ each independently represent a phenylthio group substituted by a C ₁ -C ₈ alkylacyl group, a C ₅ -C ₆ cycloalkylacyl group, an arylacyl group, a heteroarylacyl group, or a C ₁ -C ₄ alkylacylphenylthio group substituted by a C ₅ -C ₆ cycloalkyl group; Y ₁ preferably represents CH ₂ , CHCH ₃ or C(CH ₃ ) ₂ ; T ₁ preferably represents methyl, ethyl, phenyl, 2-methylphenyl, 3-methylphenyl, 2,4,6-trimethylphenyl or 2,6-dimethoxyphenyl; * represents a bonding position.

It is worth noting that among the substituents of Ar ₁ , it is preferred that at least one substituent is located at the para position to the carbonyl group connected to Ar ₁ .

Specific examples of the photoinitiator (C-1) include compounds represented by the following formula (III-1) to formula (III-28), or combinations of these compounds. Formula (III-1) Formula (III-2) Formula (III-3) Formula (III-4) Formula (III-5) Formula (III-6) Formula (III-7) Formula (III-8) Formula (III-9) Formula (III-10) Formula (III-11) Formula (III-12) Formula (III-13) Formula (III-14) Formula (III-15) Formula (III-16) Formula (III-17) Formula (III-18) Formula (III-19) Formula (III-20) Formula (III-21) Formula (III-22) Formula (III-23) Formula (III-24) Formula (III-25) Formula (III-26) Formula (III-27) Formula (III-28)

Specific examples of the photoinitiator (C-2) preferably include a compound represented by formula (III-2), a compound represented by formula (III-6), a compound represented by formula (III-11), a compound represented by formula (III-17), a compound represented by formula (III-24), a compound represented by formula (III-28), or a combination of these compounds.

The photosensitive resin composition contains a photoinitiator (C-2), and the photosensitive resin composition has excellent sensitivity.

Based on 100 parts by weight of the alkali-soluble resin (A), the amount of the photoinitiator (C-2) used can be 5 parts by weight to 50 parts by weight, preferably 6 parts by weight to 45 parts by weight, and more preferably 7 parts by weight to 40 parts by weight. Other photoinitiators (C-3)

The present invention may optionally add other photoinitiators (C-3) as needed. Specific examples of other photoinitiators (C-3) include but are not limited to O-acyl oxime compounds, triazine compounds, phenyl acetonide compounds, diimidazole compounds, benzophenone compounds, α-diketone compounds, ketoalcohol compounds, ketoalcohol ether compounds, acylphosphine oxide compounds, quinone compounds, halogen compounds, peroxides, or combinations thereof.

Specific examples of the above-mentioned O-acyl oxime compounds include 1-[4-(phenylthio)phenyl]-propane-3-cyclopentane-1,2-dione 2-(O-phenylyl oxime), 1-[4-(phenylthio)phenyl]-heptane-1,2-dione 2-(O-phenylyl oxime), 1-[4-(phenylthio)phenyl]-octane-1,2-dione 2-(O-phenylyl oxime), ethane ketone, 1-[9-ethyl-6-(2-methylbenzoyl)-9-hydro-oxazole-3-substituted]-, 1-(oxy-acetyl oxime), 1,2-butanedione-1-[4-(methylthio)phenyl] 2-(O-acetyl oxime), or a combination thereof.

Specific examples of O-acyl oxime compounds preferably include 1-[4-(phenylthio)phenyl]-heptane-1,2-dione 2-(O-phenylacyl oxime), 1-[4-(phenylthio)phenyl]-octane-1,2-dione 2-(O-phenylacyl oxime), or a combination thereof. The above O-acyl oxime compounds can be used alone or in combination, depending on actual needs.

Specific examples of triazine compounds may include but are not limited to vinyl-halogenated methyl-s-triazine compounds, 2-(naphtho-1-substituted)-4,6-bis-halogenated methyl-s-triazine compounds, 4-(p-aminophenyl)-2,6-bis-halogenated methyl-s-triazine compounds, or combinations thereof.

Specific examples of the above-mentioned vinyl-halogenated methyl-s-triazine compounds include 2,4-bis(trichloromethyl)-6-p-methoxyphenyl-s-triazine, 2,4-bis(trichloromethyl)-3-(1-p-dimethylaminophenyl-1,3-butene)-s-triazine, 2-trichloromethyl-3-amino-6-p-methoxyphenyl-s-triazine, or a combination thereof.

Specific examples of the above-mentioned 2-(naphtho-1-substituted)-4,6-bis-halogenated methyl-s-triazine compounds include 2-(naphtho-1-substituted)-4,6-bis-trichloromethyl-s-triazine, 2-(4-methoxy-naphtho-1-substituted)-4,6-bis-trichloromethyl-s-triazine, 2-(4-ethoxy-naphtho-1-substituted)-4,6-bis-trichloromethyl-s-triazine, 2-(4-Butoxy-naphtho-1-substituted)-4,6-bis-trichloromethyl-s-triazine, 2-[4-(2-methoxyethyl)-naphtho-1-substituted]-4,6-bis-trichloromethyl-s-triazine, 2-[4-(2-ethoxyethyl)-naphtho-1-substituted]-4,6-bis-trichloromethyl-s-triazine, 2-[4-(2-butoxyethyl)-naphtho-1-substituted] -4,6-bis-trichloromethyl-s-triazine, 2-(2-methoxy-naphtho-1-substituted)-4,6-bis-trichloromethyl-s-triazine, 2-(6-methoxy-5-methyl-naphtho-2-substituted)-4,6-bis-trichloromethyl-s-triazine, 2-(6-methoxy-naphtho-2-substituted)-4,6-bis-trichloromethyl-s-triazine, 2-(5-methoxy-naphtho- 1-substituted)-4,6-bis-trichloromethyl-s-triazine, 2-(4,7-dimethoxy-naphtho-1-substituted)-4,6-bis-trichloromethyl-s-triazine, 2-(6-ethoxy-naphtho-2-substituted)-4,6-bis-trichloromethyl-s-triazine, 2-(4,5-dimethoxy-naphtho-1-substituted)-4,6-bis-trichloromethyl-s-triazine, or a combination thereof.

Specific examples of the aforementioned 4-(p-aminophenyl)-2,6-di-halogenated methyl-s-triazine compounds include 4-[p-N,N-bis(ethoxycarbonylmethyl)aminophenyl]-2,6-bis(trichloromethyl)-s-triazine, 4-[o-methyl-p-N,N-bis(ethoxycarbonylmethyl)aminophenyl]-2,6-bis(trichloromethyl)-s-triazine, 4-[p-N,N-bis(chloroethyl)aminophenyl]-2,6-bis(trichloromethyl)-s-triazine, 4-[o-methyl-p-N,N-bis(chloroethyl)aminophenyl]-2,6-bis(trichloromethyl)-s-triazine, phenyl]-2,6-bis(trichloromethyl)-s-triazine, 4-(p-N-chloroethylaminophenyl)-2,6-bis(trichloromethyl)-s-triazine, 4-(p-N-ethoxycarbonylmethylaminophenyl)-2,6-bis(trichloromethyl)-s-triazine, 4-[p-N,N-di(phenyl)aminophenyl]-2,6-bis(trichloromethyl)-s-triazine, 4-(p-N-chloroethylcarbonylaminophenyl)-2,6-bis(trichloromethyl)-s-triazine, 4-[p-N,N-di(phenyl)aminophenyl]-2,6-bis(trichloromethyl)-s-triazine, 4-(p-N-chloroethylcarbonylaminophenyl)-2,6-bis(trichloromethyl)-s-triazine, 4-[p-N-(p-methoxyphenyl)carbonylaminophenyl] 4-[m-bromo-p-N,N-bis(ethoxycarbonylmethyl)aminophenyl]-2,6-bis(trichloromethyl)-s-triazine, 4-[m-chloro-p-N,N-bis(ethoxycarbonylmethyl)aminophenyl]-2,6-bis(trichloromethyl)-s-triazine, 4-[m-chloro-p-N,N-bis(ethoxycarbonylmethyl)aminophenyl]-2,6-bis(trichloromethyl)-s-triazine, 4-[m-fluoro-p-N,N-bis(ethoxycarbonylmethyl)aminophenyl]-2,6 -Bis(trichloromethyl)-s-triazine, 4-[o-bromo-p-N,N-bis(ethoxycarbonylmethyl)aminophenyl]-2,6-bis(trichloromethyl)-s-triazine, 4-[o-chloro-p-N,N-bis(ethoxycarbonylmethyl)aminophenyl-2,6-bis(trichloromethyl)-s-triazine, 4-[o-fluoro-p-N,N-bis(ethoxycarbonylmethyl)aminophenyl]-2,6-bis(trichloromethyl)-s-triazine, 4-[o-bromo-p-N,N-bis(chloroethyl)aminophenyl]-2,6-bis(trichloromethyl) -s-Triazine, 4-[o-chloro-p-N,N-di(chloroethyl)aminophenyl]-2,6-bis(trichloromethyl)-s-triazine, 4-[o-fluoro-p-N,N-di(chloroethyl)aminophenyl]-2,6-bis(trichloromethyl)-s-triazine, 4-[m-bromo-p-N,N-di(chloroethyl)aminophenyl]-2,6-bis(trichloromethyl)-s-triazine, 4-[m-chloro-p-N,N-di(chloroethyl)aminophenyl]-2,6-bis(trichloromethyl)-s-triazine, 4-[m-fluoro-p-N ,N-bis(chloroethyl)aminophenyl]-2,6-bis(trichloromethyl)-s-triazine, 4-(m-bromo-p-N-ethoxycarbonylmethylaminophenyl)-2,6-bis(trichloromethyl)-s-triazine, 4-(m-chloro-p-N-ethoxycarbonylmethylaminophenyl)-2,6-bis(trichloromethyl)-s-triazine, 4-(m-fluoro-p-N-ethoxycarbonylmethylaminophenyl)-2,6-bis(trichloromethyl)-s-triazine, 4-(o-bromo-p-N-ethoxycarbonylmethylaminophenyl)-2,6-bis(trichloromethyl)-s-triazine methyl)-s-triazine, 4-(o-chloro-p-N-ethoxycarbonylmethylaminophenyl)-2,6-bis(trichloromethyl)-s-triazine, 4-(o-fluoro-p-N-ethoxycarbonylmethylaminophenyl)-2,6-bis(trichloromethyl)-s-triazine, 4-(m-bromo-p-N-chloroethylaminophenyl)-2,6-bis(trichloromethyl)-s-triazine, 4-(m-chloro-p-N-chloroethylaminophenyl)-2,6-bis(trichloromethyl)-s-triazine, 4-(m-fluoro-p-N-chloroethylaminophenyl)- 2,6-bis(trichloromethyl)-s-triazine, 4-(o-bromo-p-N-chloroethylaminophenyl)-2,6-bis(trichloromethyl)-s-triazine, 4-(o-chloro-p-N-chloroethylaminophenyl)-2,6-bis(trichloromethyl)-s-triazine, 4-(o-fluoro-p-N-chloroethylaminophenyl)-2,6-bis(trichloromethyl)-s-triazine, 2,4-bis(trichloromethyl)-6-[3-bromo-4-[N,N-bis(ethoxycarbonylmethyl)amino]phenyl]-1,3,5-triazine, or a combination thereof.

Specific examples of the aforementioned triazine compounds preferably include 4-[m-bromo-p-N,N-bis(ethoxycarbonylmethyl)aminophenyl]-2,6-bis(trichloromethyl)-s-triazine, 2,4-bis(trichloromethyl)-6-p-methoxyphenylvinyl-s-triazine, or a combination thereof. The aforementioned triazine compounds may be used alone or in combination.

Specific examples of the above-mentioned phenethyl ketone compounds include p-dimethylamino phenethyl ketone, α,α'-dimethoxy azoxy phenethyl ketone, 2,2'-dimethyl-2-phenyl phenethyl ketone, p-methoxy phenethyl ketone, 2-methyl-1-(4-methylthiophenyl)-2-morpholino-1-propanone, 2-benzyl-2-N,N-dimethylamine-1-(4-morpholinophenyl)-1-butanone, or a combination thereof. The above-mentioned phenethyl ketone compounds are preferably 2-methyl-1-(4-methylthiophenyl)-2-morpholino-1-propanone, 2-benzyl-2-N,N-dimethylamine-1-(4-morpholinophenyl)-1-butanone, or a combination thereof. The above-mentioned phenethyl ketone compounds can be used alone or in combination.

Specific examples of the above-mentioned diimidazole compounds include 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetraphenyldiimidazole, 2,2'-bis(o-fluorophenyl)-4,4',5,5'-tetraphenyldiimidazole, 2,2'-bis(o-methylphenyl)-4,4',5,5'-tetraphenyldiimidazole, 2,2'-bis(o-methoxyphenyl)-4,4',5,5'-tetraphenyldiimidazole, 2,2'-bis(o-ethylphenyl) -4,4',5,5'-tetraphenyldiimidazole, 2,2'-bis(p-methoxyphenyl)-4,4',5,5'-tetraphenyldiimidazole, 2,2'-bis(2,2',4,4'-tetramethoxyphenyl)-4,4',5,5'-tetraphenyldiimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyldiimidazole, 2,2'-bis(2,4-dichlorophenyl)-4,4',5,5'-tetraphenyldiimidazole. The aforementioned diimidazole compound is preferably 2,2'-bis(2,4-dichlorophenyl)-4,4',5,5'-tetraphenyldiimidazole, or a combination thereof. The aforementioned diimidazole compounds can be used alone or in combination, depending on actual needs.

Specific examples of the above-mentioned benzophenone compounds include thiothione, 2,4-diethylthiothione, thiothione-4-sulfone, benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, or a combination thereof. The above-mentioned benzophenone compound is preferably 4,4'-bis(diethylamino)benzophenone. The above-mentioned benzophenone compounds can be used alone or in combination, depending on actual needs.

Specific examples of the α-diketone compounds include benzoyl, acetyl, or a combination thereof.

Specific examples of the above-mentioned ketone alcohol compounds include benzoyl ketone. Specific examples of the above-mentioned ketone alcohol ether compounds include benzoyl ketone methyl ether, benzoyl ketone ethyl ether, benzoyl ketone isopropyl ether, or a combination thereof.

Specific examples of the acylphosphine oxide compounds include 2,4,6-trimethylphenyldiphenylphosphine oxide, bis-(2,6-dimethoxyphenyl)-2,4,4-trimethylphenylphosphine oxide, or a combination thereof.

Specific examples of the quinone compounds include anthraquinone, 1,4-naphthoquinone, or a combination thereof.

Specific examples of the halogen-containing compounds include phenylmethyl chloride, tribromomethylbenzenesulfonate, tris(trichloromethyl)-s-triazine, or a combination thereof.

Specific examples of the peroxide include di-t-butyl peroxide, or a combination thereof.

The above-mentioned α-diketone compounds, ketoalcohol compounds, ketoalcohol ether compounds, acylphosphine oxide compounds, quinone compounds, halogen compounds, peroxides, etc. can be used alone or in combination, depending on actual needs.

Specific examples of other photoinitiators (C-3) preferably include 1-[4-(phenylthio)phenyl]-octane-1,2-dione 2-(O-phenylyl oxime) (e.g., trade name OXE-01, manufactured by Ciba Specialty Chemicals Co., Ltd., with a structure shown in formula (IV)), 2-methyl-1-(4-methylthiophenyl)-2-morpholino-1-propanone (trade name Irgacure 907, manufactured by Ciba Specialty Chemicals Co., Ltd.), or a combination thereof. Formula (IV)

Based on 100 parts by weight of the alkali-soluble resin (A), the amount of the photoinitiator (C) used is 10 parts by weight to 140 parts by weight, preferably 15 parts by weight to 130 parts by weight, and more preferably 20 parts by weight to 120 parts by weight. Solvent (D)

The solvent (D) is a solvent that can dissolve the alkali-soluble resin (A), the ethylenically unsaturated group-containing compound (B) and the photoinitiator (C) but does not react with the above components and has appropriate volatility.

Specific examples of the solvent (D) include alkyl glycol monoalkyl ether compounds, alkyl glycol monoalkyl ether acetate compounds, diethylene glycol alkyl ether compounds, other ether compounds, ketone compounds, lactic acid alkyl ester compounds, other ester compounds, aromatic hydrocarbon compounds, carboxylic acid amide compounds, or combinations thereof.

Specific examples of the alkyl glycol monoalkyl ether compounds include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-propyl ether, diethylene glycol mono-n-butyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol mono-n-propyl ether, dipropylene glycol mono-n-butyl ether, tripropylene glycol monomethyl ether, tripropylene glycol monoethyl ether or the like, or a combination of the above compounds.

Specific examples of alkyl glycol monoalkyl ether acetate compounds include ethylene glycol methyl ether acetate, ethylene glycol ethyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol ethyl ether acetate or the like, or a combination of the above compounds.

Specific examples of diethylene glycol alkyl ethers include diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether or the like, or a combination thereof.

Specific examples of other ether compounds include tetrahydrofuran or its analogs.

Specific examples of ketone compounds include methyl ethyl ketone, cyclohexanone, 2-heptanone, 3-heptanone, diacetone alcohol or the like, or a combination of the above compounds.

Specific examples of lactic acid alkyl ester compounds include methyl lactate, ethyl lactate or their analogs, or a combination of the above compounds.

Specific examples of other ester compounds include methyl 2-hydroxy-2-methylpropionate, ethyl 2-hydroxy-2-methylpropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl ethoxyacetate, ethyl hydroxyacetate, methyl 2-hydroxy-3-methylbutyrate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-eth ... Oxybutyl propionate, ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, isobutyl acetate, n-amyl acetate, isoamyl acetate, n-butyl propionate, ethyl butyrate, n-propyl butyrate, isopropyl butyrate, n-butyl butyrate, methyl pyruvate, ethyl pyruvate, n-propyl pyruvate, methyl acetylacetate, ethyl acetylacetate, ethyl 2-oxybutyrate or the like, or a combination of the foregoing compounds.

Specific examples of aromatic hydrocarbon compounds include toluene, xylene or the like, or a combination of the above compounds.

Carboxylic acid amide compounds N-methylpyrrolidone, N,N-dimethylformamide, N,N-dimethylacetamide or the like, or a combination of the above compounds. The above solvent (D) can be used alone or in combination of multiple types.

Specific examples of the solvent (D) preferably include propylene glycol monomethyl ether acetate, diethylene glycol dimethyl ether, ethyl 3-ethoxypropionate, or a combination thereof.

Based on 100 parts by weight of the alkali-soluble resin (A), the amount of the solvent (D) used can be 500 parts by weight to 5000 parts by weight, preferably 600 parts by weight to 4500 parts by weight, and more preferably 700 parts by weight to 4000 parts by weight. Additive (E)

Under the premise of not affecting the efficacy of the present invention, the photosensitive resin composition of the present invention may optionally include an additive (E). The additive (E) may include a filler, a polymer other than the aforementioned alkali-soluble resin (A), an adhesion promoter, an antioxidant, an ultraviolet absorber, a surfactant, an anti-agglomeration agent or a combination thereof.

Specific examples of fillers may include but are not limited to glass or aluminum.

Specific examples of the polymer may include but are not limited to polyvinyl alcohol, polyethylene glycol monoalkyl ether, polyfluoroalkyl acrylate, or any combination thereof.

Specific examples of adhesion promoters may include but are not limited to vinyl trimethoxy silane, vinyl triethoxy silane, vinyl tri(2-methoxyethoxy) silane, nitrogen-(2-aminoethyl)-3-aminopropyl methyl dimethoxy silane, nitrogen-(2-aminoethyl)-3-aminopropyl trimethoxy silane, 3-aminopropyl triethoxy silane, 3-glycidoxypropyl trimethoxy Silane, 3-epoxypropylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-chloropropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-thiolpropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, or any combination thereof.

Specific examples of antioxidants may include, but are not limited to, 2,2-thiobis(4-methyl-6-tert-butylphenol), 2,6-di-tert-butylphenol, or any combination thereof.

Specific examples of the UV absorber may include, but are not limited to, 2-(3-tert-butyl-5-methyl-2-hydroxyphenyl)-5-chlorophenylhydrazine, alkoxyphenone, or any combination thereof.

Specific examples of commercially available products of surfactants include KP (manufactured by Shin-Etsu Chemical Co., Ltd.), SF-8427 (manufactured by Dow Corning Toray Silicone Co., Ltd.), Polyflow (manufactured by Kyoeisha Oil & Fat Chemical Co., Ltd.), F-Top (manufactured by Tochem Products Co., Ltd.), Megafac (manufactured by Dainippon Ink Chemical Co., Ltd. (DIC)), Fluorade (manufactured by Sumitomo 3M Ltd.), Asahi Guard or Surflon (manufactured by Asahi Glass Co., Ltd.), SINOPOL E8008 (manufactured by Chu-Nippon Synthetic Chemical Co., Ltd.), F-475 (manufactured by Dainippon Ink Chemical Co., Ltd.), or a combination thereof.

Specific examples of anti-agglomeration agents may include but are not limited to sodium polyacrylate and the like.

Specific examples of the additive (E) preferably include SF-8427 (manufactured by Dow Corning Toray Co., Ltd., a surfactant), 3-glycidoxypropyltrimethoxysilane (KBM-403, manufactured by Shin-Etsu Chemical), or a combination thereof.

Based on 100 parts by weight of the alkali-soluble resin (A), the amount of the additive (E) used can be 0 to 10 parts by weight, preferably 1 to 9 parts by weight, and more preferably 3 to 8 parts by weight. Preparation method of photosensitive resin composition

The method for preparing the photosensitive resin composition is, for example, placing an alkali-soluble resin (A), a compound containing an ethylenically unsaturated group (B), a photoinitiator (C) and a solvent (D) in a stirrer and stirring them to uniformly mix them into a solution state. In addition, an additive (E) may be added if necessary, and after uniform mixing, a photosensitive resin composition in a solution state can be obtained.

Furthermore, there is no particular limitation on the method for preparing the photosensitive resin composition. The method for preparing the photosensitive resin composition is, for example, to first disperse a portion of the alkali-soluble resin (A) and the compound (B) containing an ethylenically unsaturated group in a portion of the solvent (D) to form a dispersed solution; and then mix the remaining alkali-soluble resin (A), the compound (B) containing an ethylenically unsaturated group, the photoinitiator (C), and the solvent (D). In addition, an additive (E) may be added if necessary. < Protective film and spacer >

The present invention provides a protective film and a spacer, which are formed by the above-mentioned photosensitive resin composition. The preparation method of the protective film and the spacer is described in detail below.

In one embodiment, the step of forming the protective film includes: first forming a pixel layer composed of red, green and blue coloring layers on a transparent substrate, then coating a photosensitive resin composition on the pixel layer, and then pre-baking, exposing, developing and post-baking the photosensitive resin composition.

In one embodiment, the step of forming the spacer includes: forming a transparent conductive film on a transparent substrate having a protective film and a pixel layer formed thereon, coating a photosensitive resin composition on the transparent conductive film, and then performing pre-baking, exposure, development, and post-baking steps.

In other words, if a protective film is to be formed, a photosensitive resin composition is applied on the pixel layer on the substrate; and if a spacer is to be formed, a photosensitive resin composition is applied on the transparent conductive film on the substrate.

Of course, the protective film and spacer of the present invention are not limited to being formed on the pixel layer or the transparent conductive film, but can be formed on the substrate or on various components on the substrate. Hereinafter, the component coated with the photosensitive resin composition is also referred to as the "coated object".

Specifically, the method for forming the spacer or protective film comprises the following steps in sequence: (a) a film forming step; (b) an exposure step; (c) a development step; and (d) a post-baking step to form the protective film or spacer. a. Film forming step :

A photosensitive resin composition is applied to a substrate (object to be coated) on which a pixel layer or a transparent conductive film is formed by a coating method to form a film.

The substrate may be a transparent substrate or a transparent conductive substrate. The material of the substrate is not particularly limited, and may be a glass substrate such as sodium calcium glass or alkali-free glass; or a resin substrate such as polyethylene terephthalate, polybutylene terephthalate, polyether sulfide, polycarbonate or polyimide. The substrate is preferably made of a glass substrate.

The transparent conductive substrate may be a NESA film (registered trademark of PPG, USA) formed of tin oxide (SnO ₂ ) or an indium tin oxide (ITO) film formed of indium oxide-tin oxide (In ₂ O ₃ -SnO ₂ ) on the entire surface of the transparent substrate.

The method of forming a film by coating is to coat a solution of a photosensitive resin composition on a coated object. The solid concentration of the photosensitive resin composition solution used in the coating method is 5 wt % to 50 wt %, preferably 10 wt % to 40 wt %, and more preferably 15 wt % to 35 wt %. The coating method includes but is not limited to spray coating, roller coating, spin coating (rotary coating), slot coating, rod coating or inkjet coating. In addition, before the coating method, the coating surface of the substrate is preferably subjected to a heating step.

In addition, it is preferred to further pre-bake the film. The pre-bake conditions may vary depending on the ingredients and the mixing ratio, preferably heating at 70°C to 90°C for 1 minute to 15 minutes. After the pre-bake, the film has a thickness of 0.15 μm to 8.5 μm, preferably 0.15 μm to 6.5 μm, and more preferably 0.15 μm to 4.5 μm. In addition, the above thickness is the thickness after the solvent is removed. b. Exposure step:

The film is exposed using a photomask having a specific pattern. The light used in the exposure step may be, for example, visible light, ultraviolet light, far ultraviolet light, electron beam, or X-ray, preferably ultraviolet light with a wavelength of 190 nm to 450 nm. The exposure amount in the exposure step is preferably 100 J/m ² to 20,000 J/m ² , preferably 150 J/m ² to 10,000 J/m ^2. c. Development step:

After the exposure step, a development process is performed to remove unnecessary parts by alkaline development and form a specific pattern.

Specific examples of the developer include inorganic bases such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate or ammonia; primary aliphatic amines such as ethylamine or n-propylamine; secondary aliphatic amines such as diethylamine or n-propylamine; tertiary aliphatic amines such as trimethylamine, diethylaminemethyl, dimethylethylamine or triethylamine; pyrrole, piperidine, N-methylpiperidine, N-methyl 1, a tertiary aliphatic cyclic acid such as 8-diazabicyclo[5.4.0]-7-undecene or 1,5-diazabicyclo[4.3.0]-5-nonene; a tertiary aromatic amine such as pyridine, methylpyrimidine, lutidine or quinoline; a quaternary ammonium salt alkaline compound such as an aqueous solution of tetramethylammonium hydroxide or tetraethylammonium hydroxide; or a combination of the above compounds. A water-soluble organic solvent or surfactant, such as methanol or ethanol, may also be added to the developer as needed.

The developing method is, for example, a dipping method, an impregnation method or a shower method. The developing is preferably performed at room temperature to 180° C. for about 10 seconds.

After developing, the substrate with the predetermined pattern is steam cleaned for 30 to 90 seconds and air-dried with compressed air or nitrogen. d. Post-baking step:

The substrate formed with a predetermined pattern is post-baked by a heating device such as a heating plate or an oven to form a spacer or a protective film. The heating temperature is set between 150°C and 250°C, wherein the heating time is 5 minutes to 30 minutes when using a heating plate, and the heating time is 30 minutes to 90 minutes when using an oven.

After the above processing steps, a protective film and a spacer can be formed.

The protective film and spacer of the present invention are not limited to being formed on the pixel layer or the transparent conductive film, but can be formed on the substrate or on various components on the substrate. < Method for Manufacturing Color Filter Substrate >

The manufacturing method of the color filter substrate is, for example, to sputter the surface of the protective film in the transparent substrate formed with the red, green, blue and other pixel coloring layers and the protective film in a vacuum environment at a temperature between 220°C and 250°C to form an indium tin oxide (ITO) protective film. In addition, if necessary, the ITO protective film can be etched and wired, and then a liquid crystal alignment film can be coated on the surface of the ITO protective film. In this way, a color filter comprising a cured product formed by curing the photosensitive resin composition of the present invention can be manufactured. < Liquid crystal display element and its manufacturing method >

The present invention further provides a liquid crystal display element, which includes at least one of a spacer and a protective film formed by the photosensitive resin composition of the present invention. Specifically, the liquid crystal display element of the present invention includes a color filter substrate, an active element substrate, and a liquid crystal layer located between the color filter substrate and the active element substrate. The active element substrate is a substrate on which a thin film transistor is provided. At least one of the color filter substrate and the active element substrate may include a protective film formed by the photosensitive resin composition of the present invention. In addition, the spacer can be dispersed in the liquid crystal layer in a manner of being clamped between the color filter substrate and the active element substrate, so that a gap exists between the color filter substrate and the active element substrate.

The manufacturing method of the liquid crystal display element of the present invention is not particularly limited, and can be manufactured by the following method, for example.

First, the color filter substrate and the active element substrate are arranged opposite to each other with a spacer in between. Then, the color filter substrate and the active element substrate are bonded to each other with a sealant, and an injection hole is left. Then, liquid crystal is injected into the space between the color filter substrate and the active element substrate and into the space divided by the sealant through the injection hole. Finally, after the injection hole is closed, a liquid crystal layer is formed between the color filter substrate and the active element substrate. There is no particular limitation on the liquid crystal compound or liquid crystal composition contained in the liquid crystal layer, and it depends on actual needs.

In addition, the liquid crystal compound and the liquid crystal composition can be aligned through the liquid crystal alignment film under the condition of applying voltage and irradiating light. The type of liquid crystal alignment film is not particularly limited and depends on actual needs.

The present invention will be further described with reference to the following examples, but it should be understood that these examples are for illustration only and should not be construed as limiting the implementation of the present invention. Synthesis Example of Alkali-Soluble Resin (A-1)

The amounts of the various reaction reagents used in the synthesis examples A-1-1 to A-1-11 and A-2-1 to A-2-2 of the alkali-soluble resin ( A -1) of the present invention are listed in Table 1 below, and the names of the various reaction reagents are listed in Table 2 below.

First, prepare two instillators, one for the monomer instillator and the other for the chain transfer agent instillator.

In a monomer dropper, 45 g of acrylic acid (as a monomer, hereinafter referred to as AA), 40 g of a mixture of phenylphenoxyethylene glycol acrylate and phenylphenoxydiethylene glycol acrylate (molar ratio of 1:1, this mixture as a monomer, hereinafter referred to as PGAPDGA), 15 g of benzylmaleimide (as a monomer, hereinafter referred to as BzMI), 2 g of tert-butyl peroxy 2-ethylhexanoate (as a polymerization initiator, (trade name PERBUTYL O, manufactured by NOF Corporation, hereinafter referred to as PBO)), 42 g of propylene glycol monomethyl ether acetate (as a solvent, hereinafter referred to as PGMEA), and 18 g of propylene glycol monomethyl ether (as a solvent, hereinafter referred to as PGME) were added and stirred to prepare a monomer mixture. Next, 2 g of n-dodecyl mercaptan (nDM), 18 g of PGMEA and 8 g of PGME were added to a chain transfer agent dropper and stirred to mix.

Prepare a separation flask equipped with a condenser as a reaction tank. Add 98g of PGMEA and 42g of PGME to the reaction tank. Then, in a nitrogen environment, heat the reaction tank to 90°C with an oil bath while stirring. When the temperature of the reaction tank stabilizes at 90°C, drip the monomer mixture and the chain transfer agent into the reaction tank using a monomer dripper and a chain transfer agent dripper, respectively. Keep the monomer dripper and the chain transfer agent dripper at 90°C, and drip the monomer mixture and the chain transfer agent within 180 minutes. After the addition is completed, wait for the reaction to continue for 30 minutes, then add 0.5g of PBO. Then, after another 30 minutes of reaction, heat the reaction tank to 115°C. After the temperature of the reaction tank was stabilized at 115°C for 1.5 hours, the gas in the separation flask was replaced with a mixed gas of oxygen/nitrogen = 5/95 (v/v). Then, 70 g of glycidyl methacrylate (as a monomer, GMA), 0.3 g of 6-tert-butyl-2,4-dimethylphenol (as a polymerization inhibitor, trade name "Topanol", manufactured by Tokyo Chemical Industry Co., Ltd.), 0.5 g of dimethylbenzylamine (as a catalyst, DMBA), 16 g of PGMEA, and 6 g of PGME were added to the reaction tank. Then, the reaction was carried out at a temperature of 110°C for 1 hour, and then at a temperature of 115°C for 8 hours. Then, the reaction solution was cooled to room temperature to obtain an alkali-soluble resin A-1-1. The weight average molecular weight (Mw) of the alkali-soluble resin A-1-1 is 17200. Synthesis Examples A-1-2 to A-1-9 and Synthesis Examples A-2-1 to A-2-2

The alkali-soluble resins (A-1) of Synthesis Examples A-1-2 to A-1-9 and Synthesis Examples A-2-1 to A-2-2 are prepared by the same steps as Synthesis Example A-1-1, and the difference lies in that the monomers and their amounts used in synthesizing the alkali-soluble resin (A-1) and the amount of the chain transfer agent used are changed (as shown in Table 1). Table 1 Synthesis Example A-1-1 A-1-2 A-1-3 A-1-4 A-1-5 A-1-6 A-1-7 A-1-8 A-1-9 A-2-1 A-2-2 Monomer mixture Monomer (g) (a-1-1) AA 45 30 45 10 45 MAA 55 15 75 90 40 HOMS 40 25 (a-1-2) PGAPDGA 40 5 40 55 P2HA 30 10 130A 10 20 CD550 5 NPEGA 10 NPPGA 1 (a-1-3) BZ 15 40 20 CHMI 10 PhMI 25 EMA 45 MD 5 10 AMA 15 (a-1-4) HEMA 10 10 15 MMA 5 9 10 30 FA-513M 10 20 20 BYZGR 5 5 15 SM 5 5 (a-1-5) GMA 70 10 70 125 70 o-VBG 60 70 EC-MAA 70 140 70 Chain transfer agent (g) n-DM 2.0 2.0 2.0 1.2 5.0 1.5 2.0 2.0 2.0 2.0 2.0 Molecular weight (Mw) 17200 18000 18200 25200 10400 19300 16500 18500 16800 18000 18300 Table 2 Abbreviation Chinese name Ethylenically unsaturated monomer containing carboxylic acid group or carboxylic anhydride group (a-1-1) AA Acrylic acid MAA Methacrylic acid HOMS 2-Methacryloyloxyethyl succinate monoester Ethylenically unsaturated monomer containing an oxyalkylene group (a-1-2) PGAPDGA Phenylphenoxyethylene glycol acrylate/phenylphenoxy diethylene glycol acrylate(mole ratio 1:1) P2HA Phenoxydiethyleneglycol acrylate (EO2 mol) 130A Methoxy polyethylene glycol acrylate (EO9 mol) CD550 Methoxy polyethylene glycol acrylate (EO12 to 13 mol) NPEGA Nonylphenoxy polyethylene glycol acrylate (EO4 to 17 mol) NPPGA Nonylphenoxy polypropylene glycol acrylate (PO5 mol) Ethylenically unsaturated monomer containing maleimide group or two alkenyl groups (a-1-3) BZ Benzyl maleimide (i.e., the compound represented by formula (1)) CHMI Cyclohexylmaleimide (i.e., the compound represented by formula (3)) PhMI Phenyl maleimide (i.e. the compound represented by formula (2)) EMA Ethyl maleimide MD Dimethyl 2,2'-[oxybis(methylene)]bis(2-propenoate) AMA Methyl α-(allyloxymethyl)acrylate Other ethylenically unsaturated monomers (a-1-4) HEMA 2-Hydroxyethyl methacrylate MMA Methacrylate FA-513M Dicyclopentanyl methacrylate BYZGR Benzyl methacrylate SM Styrene Ethylenically unsaturated monomers (a-1-5) GMA Glycidyl methacylate o-VBG o-Vinylbenzylglycidylether EC-MAA 3,4-Epoxycyclohexylmethyl methacrylate Polymerization initiator PBO t-Butyl peroxy-2-ethylhexanoate Polymerization inhibitor 2-(t-butyl)-4,6-dimethylphenol Chain transfer agents n-DM n-Dodecyl mercaptan Catalyst DMBA N,N-dimethylaniline Solvent PGMEA Propylene glycol monomethyl ether acetate PGME Proprylene glycol monomethyl ether Examples 1 to 11 and Comparative Examples 1 to 4

The following describes Examples 1 to 11 and Comparative Examples 1 to 4 of the photosensitive resin composition: Example 1

100 parts by weight of the alkali-soluble resin of Synthesis Example A-1-1 (hereinafter referred to as A-1-1), 50 parts by weight of ethylene glycol dimethacrylate (hereinafter referred to as B-1), and 10 parts by weight of the compound represented by formula (II-1) (hereinafter referred to as C-1-1) were added to 500 parts by weight of propylene glycol monomethyl ether acetate (hereinafter referred to as D-1), and stirred evenly with a shaking type stirrer to prepare the photosensitive resin composition of Example 1. The prepared photosensitive resin composition was evaluated by the evaluation method described below, and the results are shown in Table 3. Examples 2 to 11 , Comparative Examples 1 to 4

The photosensitive resin compositions of Examples 2 to 11 and Comparative Examples 1 to 4 were prepared in the same steps as Example 1, except that the types of components and the amounts used of the photosensitive resin compositions were changed (as shown in Table 3), wherein the components corresponding to the numbers in Table 3 are shown in Table 4. The prepared photosensitive resin compositions were evaluated in the evaluation method described below, and the results are shown in Table 3.

Table 3 Ingredients Embodiment Comparison Example 1 2 3 4 5 6 7 8 9 10 11 1 2 3 4 Alkaline soluble resin (A) (parts by weight) A-1-1 100 70 100 A-1-2 100 A-1-3 100 A-1-4 100 A-1-5 100 A-1-6 100 A-1-7 100 A-1-8 100 A-1-9 100 50 A-2-1 50 30 100 100 A-2-2 100 Compound having ethylenically unsaturated groups (B) (parts by weight) B-1 50 300 400 350 200 100 B-2 100 240 500 280 300 B-3 160 200 100 320 200 Photoinitiator (C) (parts by weight) C-1-1 10 10 90 50 C-1-2 15 35 40 C-1-3 10 60 C-1-4 30 C-1-5 25 C-1-6 40 C-1-7 50 C-1-8 80 C-2-1 5 20 C-2-2 30 C-2-3 50 C-2-4 15 C-2-5 10 C-2-6 5 C-3-1 5 10 C-3-2 5 30 Solvent (D) (parts by weight) D-1 500 500 1500 2250 4000 2000 2500 D-2 1250 3250 4000 1250 2000 D-3 2000 4000 1000 2500 2500 Additive (E) (parts by weight) E-1 0.5 E-2 5 Evaluation items Sensitivity ◎ ◎ ◎ ◎ ◎ ◎ ○ ◎ ○ ◎ ◎ ╳ ╳ ○ ╳ Step Difference ◎ ◎ ◎ ◎ ◎ ◎ ◎ ○ ○ ○ ◎ ○ ○ ╳ ╳ Table 4 Abbreviation Element A-1-1 Alkali-soluble resin A-1-1 synthesized in Synthesis Example A-1-1 A-1-2 Alkali-soluble resin A-1-2 synthesized in Synthesis Example A-1-2 A-1-3 Alkali-soluble resin A-1-3 synthesized in Synthesis Example A-1-3 A-1-4 Alkali-soluble resin A-1-4 synthesized in Synthesis Example A-1-4 A-1-5 Alkali-soluble resin A-1-5 synthesized in Synthesis Example A-1-5 A-1-6 Alkali-soluble resin A-1-6 synthesized in Synthesis Example A-1-6 A-1-7 Alkali-soluble resin A-1-7 synthesized in Synthesis Example A-1-7 A-1-8 Alkali-soluble resin A-1-8 synthesized in Synthesis Example A-1-8 A-1-9 Alkali-soluble resin A-1-9 synthesized in Synthesis Example A-1-9 A-2-1 Alkali-soluble resin A-2-1 synthesized in Synthesis Example A-2-1 A-2-2 Alkali-soluble resin A-2-2 synthesized in Synthesis Example A-2-2 B-1 Ethylene glycol dimethacrylate B-2 Trihydroxymethylpropyl triacrylate B-3 Dipentaerythritol hexaacrylate C-1-1 The compound represented by formula (II-1) C-1-2 The compound represented by formula (II-5) C-1-3 The compound represented by formula (II-11) C-1-4 The compound represented by formula (II-14) C-1-5 The compound represented by formula (II-17) C-1-6 The compound represented by formula (II-19) C-1-7 The compound represented by formula (II-28) C-1-8 The compound represented by formula (II-35) C-2-1 The compound represented by formula (III-2) C-2-2 The compound represented by formula (III-6) C-2-3 The compound represented by formula (III-11) C-2-4 The compound represented by formula (III-17) C-2-5 The compound represented by formula (III-24) C-2-6 The compound represented by formula (III-28) C-3-1 1-[4-(Phenylthio)phenyl]-octane-1,2-dione 2-(O-phenylyl oxime) (trade name OXE-01, manufactured by Ciba Specialty Chemicals Co., Ltd.) C-3-2 2-Methyl-1-(4-methylthiophenyl)-2-morpholino-1-propanone (trade name Irgacure 907, manufactured by Ciba Specialty Chemicals Co., Ltd.) D-1 Propylene glycol monomethyl ether acetate D-2 Diethylene glycol dimethyl ether D-3 Ethyl 3-ethoxypropionate F-1 SF-8427 (manufactured by Dow Corning Toray Silicone Co., Ltd., surfactant) F-2 3-Glycyrrhizic acid propyltrimethoxysilane (KBM-403, manufactured by Shin-Etsu Chemical) ＜ Evaluation method ＞ Sensitivity

The photosensitive resin composition prepared in the above-mentioned embodiment and comparative example is respectively coated on a plain glass substrate of 100 mm×100 mm×0.7 mm by a rotation coating method, and pre-baked at 90°C for 150 seconds to obtain a pre-baked coating film with a thickness of about 4 μm. Then, the prepared pre-baked coating film is exposed. Specifically, a photomask with a specific pattern is placed between the pre-baked coating film and an exposure machine (model AG500-4N; manufactured by M&R Nano Technology), and the pre-baked coating film is irradiated with ultraviolet rays of different exposure amounts. Then, after measuring the film thickness (δ) at a random measuring point on the coating, the coating is immersed in a 0.0438 wt% potassium hydroxide (KOH) aqueous solution for 70 seconds, and another film thickness (δd) is measured at the same measuring point. Finally, the residual film rate can be calculated by the following formula (V). Residual film rate (%) = [(δd)/(δ)] × 100 (V) The exposure when the residual film rate is 90% or more is called sensitivity, and is evaluated according to the following standards: ◎: Exposure ≤ 70 mJ/ ^cm2 ; ○: 70 mJ/ ^cm2 < Exposure ≤ 90 mJ/ ^cm2 ; △: 90 mJ/ ^cm2 < Exposure ≤ 110 mJ/ ^cm2 ; ╳: Exposure > 110 mJ/ ^cm2 . Step difference

The photosensitive resin compositions prepared in the above-mentioned examples and comparative examples were respectively coated on a plain glass substrate of 100 mm×100 mm×0.7 mm by spin coating, and pre-baked at 90°C for 150 seconds to obtain a pre-baked coating film of about 4 μm. Then, the pre-baked coating film was placed under a specified mask pattern (partially half-tone, transmittance 30%), and irradiated with ultraviolet light with an energy of 60 mJ/ ^cm2 (the exposure machine model was AG500-4N, and it was manufactured by M&R Nano Technology Co., Ltd.) to perform an exposure step. Then, the exposed coating film was immersed in a potassium hydroxide (KOH) aqueous solution with a concentration of 0.0438 wt% for 70 seconds to remove the unexposed portion. Then, wash with pure water and post-bake at 235℃ for 30 minutes to obtain the interstitial body. The height of the main interstitial body is Hm, the height of the secondary interstitial body (half-tone part) is Hs, and Hm-Hs is the step difference. ◎: 0.1μm ≦ step difference ≦ 0.3μm; ○: 0.3μm < step difference ≦ 0.4μm; △: 0.4μm < step difference ≦ 0.5μm; ╳: step difference > 0.5μm or step difference < 0.1μm. < Evaluation results >

As shown in Table 3, compared with the photosensitive resin composition not containing the alkali-soluble resin (A-1) (Comparative Examples 1 and 2), the photosensitive resin composition not containing the photoinitiator (C-1) (Comparative Example 3), and the photosensitive resin composition not containing both the alkali-soluble resin (A-1) and the photoinitiator (C-1) (Comparative Example 4), the photosensitive resin composition containing both the alkali-soluble resin (A-1) and the photoinitiator (C-1) (Examples 1 to 11) has excellent sensitivity and can form a spacer with excellent step difference. Specifically, the photosensitive resin composition not containing the alkali-soluble resin (A-1) (Comparative Examples 1 and 2) has poor sensitivity; the photosensitive resin composition not containing the photoinitiator (C-1) (Comparative Example 3) has poor step difference of the spacer formed; and the photosensitive resin composition not containing both the alkali-soluble resin (A-1) and the photoinitiator (C-1) (Comparative Example 4) has poor sensitivity and poor step difference of the spacer formed.

When the monomer mixture of the synthetic alkali-soluble resin (A-1) contains an ethylenically unsaturated monomer (a-1-3) containing a maleimide group or two alkenyl groups (Examples 1 to 7, 11), the photosensitive resin composition can form a spacer with excellent step difference.

When the synthetic alkali-soluble resin (A-1) contains an ethylenically unsaturated group (Examples 1 to 6, 8, and 11), the photosensitive resin composition has excellent sensitivity.

When the photosensitive resin composition contains the photoinitiator (C-2) (Examples 2 to 6, 10), the photosensitive resin composition has excellent sensitivity.

In summary, the photosensitive resin composition of the present invention includes an alkali-soluble resin (A-1) with a specific structure and a photoinitiator (C-1) with a specific structure, which can effectively improve the problem of poor sensitivity and poor step difference of the spacer. Thus, the present invention provides a photosensitive resin composition with excellent sensitivity and capable of forming a spacer with excellent step difference, which can be applied to a spacer and a protective film.

Although the present invention has been disclosed as above by the embodiments, they are not intended to limit the present invention. Any person with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be defined by the scope of the attached patent application.

without.

without.

Claims (10)

A photosensitive resin composition comprises: an alkali-soluble resin (A); a compound containing an ethylenically unsaturated group (B); a photoinitiator (C); and a solvent (D); wherein the alkali-soluble resin (A) comprises an alkali-soluble resin (A-1), wherein the alkali-soluble resin (A-1) is obtained by copolymerizing a mixture and then further reacting the mixture with an ethylenically unsaturated monomer (a-1-5) through a condensation reaction. The mixture comprises an ethylenically unsaturated monomer (a-1-1) containing a carboxylic acid group or a carboxylic anhydride group, an ethylenically unsaturated monomer (a-1-2) containing an oxyalkylene group represented by the following formula (I), and an ethylenically unsaturated monomer (a-1-3) and an ethylenically unsaturated monomer (a-1-4) containing a maleimide group or two alkenyl groups, wherein the ethylenically unsaturated monomer (a-1-5) comprises a cyclic unsaturated monomer (a-1-6) containing a The ethylenic unsaturated monomer (a-1-4) is the ethylenic unsaturated monomer (a-1-1) containing a carboxylic acid group or a carboxylic anhydride group, the ethylenic unsaturated monomer (a-1-2) containing an oxyalkylene group, the ethylenic unsaturated monomer (a-1-3) containing a maleimide group or two alkenyl groups, or a combination thereof. The ethylenic unsaturated monomer (a-1-3) and the ethylenic unsaturated monomer (a-1-5), when the total amount of the mixture is 100 parts by weight, the amount of the ethylenic unsaturated monomer (a-1-1) containing a carboxylic acid group or a carboxylic anhydride group is 10 to 90 parts by weight, the amount of the ethylenic unsaturated monomer (a-1-2) containing an oxyalkylene group is 1 to 45 parts by weight, the amount of the ethylenic unsaturated monomer (a-1-3) containing a maleimide group or two alkenyl groups is 10 to 40 parts by weight, the amount of the ethylenic unsaturated monomer (a-1-4) is 0 to 55 parts by weight, and the amount of the ethylenic unsaturated monomer (a-1-5) is 10 to 180 parts by weight,

In formula (I), R ¹ , R ² and R ³ each independently represent hydrogen or methyl; R ⁴ represents a substituted or unsubstituted C ₁ -C ₂₀ straight chain or branched alkyl group, a substituted or unsubstituted C ₂ -C ₂₀ straight chain or branched alkenyl group, or a substituted or unsubstituted C ₆ -C ₂₀ aromatic hydrocarbon group; AO represents a C ₂ -C ₂₀ oxyalkylene group; x represents an integer from 0 to 2; y represents 0 or 1; and n represents 2 to 200; the photoinitiator (C) includes a photoinitiator (C-1), and the photoinitiator (C-1) is a compound represented by the following formula (II),

In formula (II), A represents hydrogen, halogen, nitro, C ₁ -C ₂₀ straight or branched alkyl, C ₄ -C ₁₀ alkylcycloalkyl, C ₄ -C ₁₀ cycloalkylalkyl,

,

or

, wherein C ₁ -C ₂₀ straight or branched alkyl, C ₄ -C ₁₀ alkylcycloalkyl, C ₄ -C ₁₀ cycloalkylalkyl,

,

or

any -CH ₂ - contained in it may be substituted by O, N, S or a carbonyl group; R ⁵ represents hydrogen, a halogen, a C ₁ -C ₂₀ straight chain or branched chain alkyl, a C ₄ -C ₂₀ cycloalkylalkyl or a C ₂ -C ₂₀ alkenyl group, wherein the -CH ₂ - contained in the C ₁ -C ₂₀ straight chain or branched chain alkyl, a C ₄ -C ₂₀ cycloalkylalkyl and a C ₂ -C ₂₀ alkenyl group may be substituted by O, N, S or a carbonyl group, and two R ^5s may form a cyclic structure; R ⁶ represents a C ₁ -C ₂₀ straight chain or branched chain alkyl, a C ₂ -C ₂₀ alkenyl, a C ₃ -C ₂₀ cycloalkyl, a C ₄ -C ₂₀ cycloalkylalkyl, a C ₄ -C 20 wherein one or more hydrogens in these _groups may be independently substituted by an alkyl group, a halogen group, a hydroxyl group or a nitro group, and the _-CH2- ⁱⁿ _R6 may be substituted by O, N, _S or a carbonyl group; ^R7 represents a _C1 - _C20 straight-chain or branched-chain alkyl group, a _C3 - _C20 cycloalkyl group, a _C4 - _C20 cycloalkylalkyl group, a C4-C20 alkylcycloalkyl group, a _C6 - _C20 aryl group, a group represented by the following formula (II-A), a group represented by the following formula (II-B) or a group represented by the following formula (II-C); when ^R7 represents a _C1 - _C20 straight-chain or branched-chain alkyl group, a _C3 - _C20 cycloalkyl group, a _{C4 - C20} When R 7 is C ₂₀ -C cycloalkylalkyl, C ₄ -C ₂₀ alkylcycloalkyl, or C ₆ -C ₂₀ aryl, one or more hydrogens in these groups may be independently substituted by alkyl, halogen, hydroxyl or nitro, and the -CH ₂ - in R ⁷ may be substituted by O, N, S or carbonyl; R ⁶ and R ⁷ may form a ring structure;

In formula (II-A), m represents an integer of 0 or 1, R ¹¹ represents hydrogen, a C ₁ -C ₈ alkyl group, or a phenyl group, and R ¹² , R ¹³ and R ¹⁴ each independently represent hydrogen or a C ₁ -C ₄ alkyl group;

In formula (II-B), p is an integer from 0 to 3;

In formula (II-C), R ¹⁵ represents hydrogen, C ₁ -C ₈ alkyl, or phenyl; Ar is substituted or unsubstituted phenyl, naphthyl, furanyl, thienyl, or pyridyl; R ⁸ represents N-morpholinyl, N-piperidinyl, N-pyrrolyl, or N-dialkyl, wherein one or more hydrogens in these groups may be substituted by halogen or hydroxyl; R ⁹ and R ⁹ ' each independently represents C ₁ -C ₂₀ straight or branched alkyl, C ₄ -C ₂₀ cycloalkyl, C ₂ -C ₂₀ alkenyl, or C ₆ -C ₂₀ aryl, wherein one or more hydrogens in these groups may be substituted by alkyl, halogen, hydroxyl, or nitro, and -CH ₂ - in these groups may be substituted by -O-; or R ^{R 9} and R ⁹ ' may be connected to each other or form a five-membered or six-membered ring via -O-, -S- or -NH-; R ¹⁰ represents a C ₁ -C ₂₀ straight or branched alkyl group, a C ₄ -C ₂₀ cycloalkyl group, a C ₄ -C ₂₀ alkylcycloalkyl group, a C ₂ -C ₂₀ alkenyl group, or a C ₆ -C ₂₀ aryl group, wherein the -CH ₂ - in these groups may be substituted by -O- or -S-, and one or more hydrogen groups in these groups may be independently substituted by an alkyl group, a halogen, a nitro group, a cyano group, SR ¹⁶ or OR ¹⁷ ; R ¹⁶ and R ¹⁷ each independently represent hydrogen, or a C ₁ -C ₂₀ straight or branched alkyl group. The photosensitive resin composition as described in claim 1, wherein the ethylenically unsaturated monomer (a-1-3) containing a maleimide group or two alkenyl groups comprises at least one monomer selected from the following formulas (1) to (5),

In formula (4) and formula (5), R ¹⁸ , R ¹⁹ and R ²⁰ each independently represent hydrogen or a C ₁ -C ₃₀ linear or branched alkyl group. The photosensitive resin composition as described in item 1 of the patent application, wherein the alkali-soluble resin (A-1) contains ethylenically unsaturated groups. The photosensitive resin composition as described in claim 1, wherein the photoinitiator (C) further comprises a photoinitiator (C-2), wherein the photoinitiator (C-2) is a compound represented by the following formula (III):

In formula (III), Ar ₁ represents an azimuthal aryl group or an azimuthal heteroaryl group, wherein the azimuthal aryl group or the azimuthal heteroaryl group forms a ring structure with two adjacent atoms, Y ₁ and a carbonyl group, and the substituents on the remaining atoms are independently selected from hydrogen; halogen; C ₁ -C ₁₂ alkyl; C ₅ -C ₇ cycloalkyl; C ₁ -C ₄ alkyl substituted with a C ₅ -C ₇ cycloalkyl; phenyl; phenyl substituted with one or more C ₁ -C ₄ alkyl, carboxyl, C ₁ -C ₁₂ alkyl acyl, C ₁ -C ₁₂ aryl acyl, heteroaryl acyl, JT ₄ , phenyl, halogen or CN; C ₁ -C ₄ alkylbenzyloxy;

Substituted C ₁ -C ₄ alkoxy, C ₁ -C ₃ alkylenedioxy;

; C ₁ -C ₁₂ alkylthio; C ₁ -C ₄ alkylphenylthio;

a substituted C ₁ -C ₄ alkylthio group; CN; a carboxyl group; a C ₁ -C ₁₂ alkoxymethyl group; an aryl acyl group; a heteroaryl acyl group and a group consisting of JT ₅ ; or a cyclic structure is formed between two adjacent substituents in the substituent of Ar ₁ or between the substituent and Ar ₁ via a single bond, a carbon atom, or a carbonyl group; wherein in JT ₄ and JT ₅ , J is selected from the group consisting of O, S, and NT ₆ ; Y ₁ is selected from the group consisting of O, S, NT ₇ , BT ₇ , CT ₂ T ₃ , SiT ₂ T ₃ , S=O, and C=O; T ₁ represents hydrogen, a C ₁ -C ₁₈ alkyl group, or a C 1 -C 18 alkoxy group; or T ₁ represents a C 1 -C 18 alkyl group, or a C ₁ -C ₁₈ alkoxy group via one or more halogens, C ₁ -C _C2 -C18 alkyl group substituted with a _C5 - _C7 cycloalkyl group, a heterocycloalkyl group, a phenyl group, a heteroaryl group, CN, a _C1 - _C4 alkanoyloxy group or an aryloxy group and/or inserted with a _C5 - _C7 cycloalkylene group, a phenylene group, O, S or _NT4 ; _{C2 - C18} alkenyl group; C2- _C18 alkenyl group substituted with one or more halogens, a _C1 - _C4 alkyl group, a _C5 - _C7 cycloalkyl group, a heterocycloalkyl group, a phenyl group, a heteroaryl group, CN, a _C1 - _C4 alkanoyloxy group or an _aryloxy group and/or inserted with a _{C5 - C7} cycloalkylene group, a phenylene group, O, S or _NT4 , or both of the above; or _T1 represents _C5 -C or _T1 represents a _phenyl group, or a phenyl group substituted by one or more _C1 - _C4 alkyl groups, _{C1 - C4} alkoxy groups, phenyl groups, halogen _groups or CN; or T1 represents a naphthyl group, a benzoyl group or a phenoxycarbonyl group, wherein the phenyl group of the benzoyl group and the phenoxycarbonyl group is arbitrarily substituted by one or more halogen groups, _T4 , a _C5 - _C6 cycloalkyl group, CN, OH or _JT4 ; _T2 and _T3 each independently represent hydrogen, a C1 _{- C18} alkyl group, a C1- _C5 alkyl group substituted by a carboxyl group, a _{C1 -C5 alkyl group substituted by a C1-C4 alkoxyacyl group or a C1-C5 alkyl group substituted by} a _C1 - _C4 alkoxyacyl group or a

or _T2 and _T3 each independently represent a C2- _C18 alkyl group substituted by one or more halogens, _C1 - _C4 alkyl groups, _C5 - _C7 cycloalkyl groups, heterocycloalkyl groups, phenyl groups, heteroaryl groups, CN, _{C1 - C4} alkanoyloxy groups, aryloxy groups, or a _C2 - _C18 alkyl group inserted by a _C5 - _C7 cycloalkylene group, a phenylene group, O, S or NT4, or both of the above; or _T2 and _T3 each independently represent a C5 _- C7 cycloalkyl group, or a _C5 - _C7 cycloalkyl group substituted by one or more C1- _C4 alkyl groups, phenyl groups, halogens or _CN ; or T2 and T3 _each independently represent a C5- _C7 cycloalkyl group, or a _C5 - _C7 cycloalkyl group substituted by one or more C1- _C4 alkyl groups, phenyl groups, halogens or CN; _{T2 and T3} each independently represent phenyl, or phenyl substituted with one or more _C1 - _C4 alkyl, _C1 - _C4 alkoxy, carboxyl, _C1 - _C12 alkylacyl, _C5 - _C6 cycloalkylformyl or C5-C6 cycloalkyl, C2- _C4 alkylacyl, arylacyl, _JT4 , phenyl, halogen or CN; or _T2 and _T3 each independently represent phenyl, or phenyl substituted with one or more C1 _- C4 alkyl, C1- _C4 alkoxy, carboxyl, C1-C12 alkylacyl, C5- _C6 cycloalkylformyl or C5- _C6 cycloalkyl; or _T2 and _T3 each independently represent phenyl, or phenyl substituted with one or more _C1 -C4 alkyl, _C1 -C4 alkoxy, carboxyl, C1-C12 alkylacyl, C5- _{C6 cycloalkylformyl or C5-C6 cycloalkyl , C2} -C4 alkylacyl, arylacyl, JT4, phenyl, halogen or CN ... -C ₄ alkoxy acyl substituted C ₁ -C ₅ alkyl or

or _T5 represents a C2 _{- C18 alkyl} group substituted by one or more halogen, _C1 - _C4 alkyl, _C5 - _C7 cycloalkyl, heterocycloalkyl, phenyl, heteroaryl, CN, _C1 - _C4 alkanoyloxy or aryloxy groups, or a _{C2 - C18} alkyl group inserted by a C5 _{- C7} cycloalkylene, phenylene, O, S or _NT4 , or both of the above; or _T5 represents a _C5 - _C7 cycloalkyl group, or a C5- _C7 cycloalkyl group substituted by one or more _C1 - _C4 alkyl, phenyl, halogen or CN; or _T5 represents a phenyl group, or a C2- _{C18 alkyl group inserted by one or more C1-C12 alkyl ,} carboxyl, _C1 -C or _{T 5} represents _a C _{1 -C 4 alkylacyl} group _{, a C 1 -C 4 conjugated} olefinic _{acyl group , a phenyl ...} The aromatic ring in ₁ forms a ring structure; _T6 and _T7 each independently represent hydrogen, a _C1 - _C18 alkyl group, a C1- _C5 alkyl group substituted with _{a C1} - _C4 alkoxyacyl group, or

or T ₆ and T ₇ each independently represent a C ₅ -C ₇ cycloalkyl group, or a C 5 -C 7 cycloalkyl group substituted with one or more halogens, C ₁ -C ₄ alkyl groups, C ₅ -C ₇ cycloalkyl groups, heterocycloalkyl groups, phenyl groups, heteroaryl groups, CN, C ₁ -C ₄ alkanoyloxy groups or aryloxy groups, or a C ₂ -C ₁₈ alkyl group inserted with a C ₅ -C ₇ cycloalkylene group, phenylene group, O, S or NT ₄ , or both of the above; or T ₆ and T ₇ each independently represent a C ₅ -C ₇ cycloalkyl group, or a C ₅ -C ₇ cycloalkyl group substituted with one or more C ₁ -C ₄ alkyl groups, phenyl groups, halogens or CN; or T ₆ and T ₇ each independently represent a phenyl group, or a C ₅ -C ₇ cycloalkyl group inserted with one or more C 1 -C 4 alkyl groups, phenyl groups, halogens or CN; wherein Y 1 is a _{C 1} -C ₄ alkyl group, a carboxyl group, a C ₁ -C ₁₂ alkylacyl group, a C ₅ -C ₆ cycloalkylcarbonyl group, or a C ₅ -C ₆ cycloalkyl-substituted C ₂ -C ₄ alkylacyl group, an arylacyl group, J T ₄ , a phenyl group, a halogen group, or a phenyl group substituted with CN; or T ₆ each forms a cyclic structure with the aromatic ring in Ar ₁ via a single bond, a carbon atom, or a carbonyl group; wherein when Ar ₁ is a substituted carbazolyl group, Y ₁ is not C, O, S, or N T ₇ . The photosensitive resin composition as described in item 1 of the patent application, wherein, based on 100 parts by weight of the alkali-soluble resin (A), the amount of the alkali-soluble resin (A-1) used is 50 to 100 parts by weight, the amount of the ethylenically unsaturated group-containing compound (B) used is 50 to 600 parts by weight, the amount of the photoinitiator (C) used is 10 to 140 parts by weight, the amount of the photoinitiator (C-1) used is 10 to 90 parts by weight, and the amount of the solvent (D) used is 500 to 5000 parts by weight. The photosensitive resin composition as described in item 4 of the patent application, wherein the amount of the photoinitiator (C-2) used is 5 to 50 parts by weight based on 100 parts by weight of the alkali-soluble resin (A). A spacer formed by a photosensitive resin composition as described in any one of items 1 to 6 of the patent application scope. A protective film formed by a photosensitive resin composition as described in any one of items 1 to 6 of the patent application scope. A liquid crystal display element, comprising a spacer as described in item 7 of the patent application scope. A liquid crystal display element, comprising a protective film as described in item 8 of the patent application scope.