TWI864437B - Resin sealing device and sealing mold - Google Patents

Abstract

The present invention provides a sealing mold and a resin sealing device which can absorb the thickness deviation of a workpiece and can form a molded product with a constant total thickness. The sealing mold 202 of the present invention has a tank 240 in the lower mold 206, and a pick pool block 244 with a pick pool 246 penetrating therethrough in the upper mold 204; one of the lower mold 206 and the upper mold 204 has a first workpiece holding portion 205A and a second workpiece holding portion 205B; the other has one or more first mold cavities 208A and one or more second mold cavities 208B; a first mold cavity insert 226A and a first clamper 228A constituting the first mold cavity 208A; a first clamper spring 232A applying force to the first clamper 228A; a second mold cavity insert 226B and a second clamper 228B constituting the second mold cavity 208B; and a second clamper spring 232B applying force to the second clamper 228B.

Description

Resin sealing device and sealing mold

The present invention relates to a resin sealing device and a sealing mold.

As an example of a resin sealing device in which a workpiece having electronic components mounted on a substrate is sealed with a sealing resin (hereinafter sometimes simply referred to as "resin") to be processed into a molded product, there is known a resin sealing device using a transfer molding method.

The transfer molding method is the following technology (refer to patent document 1: Japanese Patent No. 5906528, patent document 2: Japanese Patent No. 4778751): a tank is provided to supply a predetermined amount of resin to a pair of sealing areas (cavities) provided in a sealing mold including an upper mold and a lower mold, and workpieces are arranged at positions corresponding to the respective sealing areas, and resin sealing is performed by clamping the upper mold and the lower mold and injecting the resin from the tank into the cavity. [Prior art document] [Patent document]

[Patent document 1] Japanese Patent No. 5906528 [Patent document 2] Japanese Patent No. 4778751

[The problem that the invention wants to solve]

Workpieces that are the objects of resin sealing have individual differences, and it is impossible to make the thickness deviation (dimensional difference) 0 (zero) in reality. Therefore, in the conventional resin sealing device using transfer molding, there are problems such as failure to absorb the thickness deviation, resulting in damage to the workpiece during clamping (crack damage, etc.), positional deviation of the workpiece during resin sealing, resin leakage, etc.

Here, in the resin sealing device using the transfer molding method in the past, the following technologies are known as a mechanism for absorbing the thickness deviation of the workpiece (specifically, the base material), but each of them has problems. 1) Automatic plate thickness mechanism: In the case of the above mechanism, there is the following problem: the base material thickness can be adjusted on the left and right sides of the tank (absorbing the thickness deviation), but on the other hand, a cylinder and a plug (cotter) and other structures are required, and maintenance is time-consuming. 2) Variable cavity height (Variable Cavity Hight, VCH) mechanism: In the case of the above mechanism, there is a problem that dedicated equipment is required, the device cost increases, and maintenance is time-consuming. 3) Center floating mechanism: In the case of the above mechanism, there is a problem that the base material thickness cannot be adjusted on the left and right sides of the tank (absorbing the thickness deviation). The above 1) to 3) all have the following problem: due to the change in the thickness of the workpiece (specifically, the base material), the total thickness of the molded product after molding (that is, the thickness of the workpiece and the sealing resin as a whole) changes. [Means for solving the problem]

The present invention is made in view of the above situation, and its purpose is to provide a sealing mold using transfer molding and a resin sealing device including the sealing mold, wherein the sealing mold includes a structure for performing resin sealing on multiple workpieces together, which can absorb the thickness deviation of the workpieces and can form the total thickness of the molded product to be constant, and can also achieve easy maintenance and suppress equipment costs.

The present invention solves the above-mentioned problem by the following solution described as one embodiment.

The sealing mold of the present invention is a sealing mold that includes an upper mold and a lower mold, and is processed into a molded product by sealing a workpiece with resin. The necessary condition is that the lower mold is provided with a tank for putting the sheet-shaped resin, and the upper mold is provided with a material removal pool block. The material removal pool block is fixed to the upper mold groove sleeve block in an immovable manner directly above the tank, and the material removal pool is provided through the lower surface. Among the upper mold and the lower mold, one is provided with a first workpiece holding part and a second workpiece holding part for holding one or more of the workpieces respectively, and the other is provided with: one or more first mold cavities arranged corresponding to the first workpiece holding part and one or more first mold cavities arranged corresponding to the second workpiece holding part A second mold cavity; a first mold cavity insert, constituting the bottom of the first mold cavity; a first clamper, movably disposed around the first mold cavity insert and constituting a side of the first mold cavity, or constituting a plurality of sides of the first mold cavity, for clamping the workpiece; a first clamper spring, applying force to the first clamper toward the first workpiece holding portion; a second mold cavity insert, constituting the bottom of the second mold cavity; a second clamper, movably disposed around the second mold cavity insert and constituting a side of the second mold cavity, or constituting a plurality of sides of the second mold cavity, for clamping the workpiece; and a second clamper spring, applying force to the second clamper toward the second workpiece holding portion.

Thus, by setting a movable structure in which a plurality of workpieces or a plurality of electronic components on a workpiece are clamped by different clamps, and each clamp is urged by a different clamp spring, it is possible to absorb the thickness deviation of the workpiece (including the thickness deviation of the electronic components). On the other hand, by setting a structure in which each cavity insert is fixed to a common upper mold groove sleeve block, it is possible to form a molded product with a constant total thickness independent of the thickness of the workpiece. In addition, compared with the previous device, these requirements can be achieved by a simple structure, so that maintenance can be facilitated and the device cost can be suppressed.

In addition, it is preferred that the first clamp and the second clamp are respectively provided with a gutter, which is connected to the ejection pool at least in the mold closed state. Thereby, even if the first clamp and the second clamp are movable, a resin flow path with the ejection pool and the gutter can be constructed, so that transfer molding can be performed.

In addition, it is preferred that the first clamp spring and the second clamp spring are respectively configured as follows: a plurality of springs having different spring constants are provided, and one spring corresponding to the resin sealing condition is selected and detachably fixed to the upper mold or the lower mold. In this way, the setting/adjustment can be performed for each workpiece to form an appropriate workpiece clamping force. In addition, since the clamp spring can be changed, it is easy to perform settings that can reduce the damage of the workpiece (substrate) or resin leakage in the resin sealing step.

In addition, it is preferred that the first clamp spring and the second clamp spring are respectively a plurality of coil springs arranged at intervals. In this way, the workpiece can be clamped with an even clamping force along the outer edge of the workpiece. Therefore, the effect of suppressing damage to the workpiece (substrate) or resin leakage can be further improved.

In addition, the resin sealing device of the present invention is required to include the sealing mold. [Effect of the invention]

According to the present invention, in a resin sealing device using transfer molding for performing resin sealing on a plurality of workpieces at once, thickness deviation of the workpieces can be absorbed, and damage to the workpieces due to excessive clamping force, positional deviation of the workpieces due to insufficient clamping force, resin leakage, etc. can be prevented. In addition, molding with a constant total thickness of the molded product can be performed. Furthermore, maintenance can be facilitated and the cost of the device can be suppressed.

Hereinafter, the embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view (schematic view) showing an example of a sealing mold 202 and a resin sealing device 1 including the sealing mold 202 according to the embodiment of the present invention. In addition, FIG. 2 is a side view at the position of the II-II line of FIG. 1 (part of the mechanism is not shown). Furthermore, for the convenience of explanation, the front and rear, left and right, and up and down directions of the resin sealing device 1 are sometimes indicated by arrows in the drawings. In addition, in all the drawings used to illustrate each embodiment, the same symbols are sometimes used to mark components with the same function, and their repeated descriptions are omitted.

The resin sealing device 1 of the present embodiment is a device for performing resin sealing on a workpiece (molded product) W using a sealing mold 202 including an upper mold 204 and a lower mold 206. Hereinafter, as the resin sealing device 1, a resin sealing device using a transfer molding method is cited as an example for explanation, wherein the resin sealing device holds the workpiece W using the lower mold 206, covers a mold cavity 208 (including a portion of the mold surface 204a) provided in the upper mold 204 in a corresponding configuration with a release film (hereinafter, sometimes referred to as a "film") F, performs a clamping action between the upper mold 204 and the lower mold 206, and seals the workpiece W with a resin R. Furthermore, in this embodiment, the following structure is cited as an example for explanation, that is, two cavities 208 are provided in one upper mold 204, and two workpieces W (e.g., long strip-shaped workpieces) are arranged in one lower mold 206 and resin-sealed together to obtain two molded products Wp at the same time. However, it is not limited to this, and multiple sets of the above structures can also be arranged side by side (not shown). The film F is also not necessary, and the cavity 208 can also be provided in either or both of the upper mold 204 and the lower mold 206.

First, the workpiece W as the forming object includes the following structure: one or more electronic components Wb are mounted on the substrate Wa in a prescribed configuration. More specifically, examples of the substrate Wa include: a resin substrate, a ceramic substrate, a metal substrate, a carrier plate, a lead frame, a wafer and other plate-shaped components formed in a rectangular shape, a circular shape, etc. In addition, examples of the electronic components Wb include semiconductor chips, micro-electromechanical system (MEMS) chips, passive components, heat sinks, conductive components, spacers and combinations thereof. However, it is not limited to these.

As an example of a method of mounting the electronic component Wb on the substrate Wa, there are mounting methods using wire bonding packaging, flip chip packaging, etc. Alternatively, in the case of a structure in which the substrate (glass or metal pallet) Wa is peeled off from the molded product Wp after resin sealing, there is also a method of attaching the electronic component Wb using an adhesive tape having heat-peeling properties or an ultraviolet curing resin that is cured by ultraviolet irradiation.

On the other hand, a sheet-shaped (for example, a cylindrical shape) thermosetting resin (for example, an epoxy resin containing a filler) can be used as an example of the resin R. The resin R is not limited to the above state, and may be a shape other than a cylindrical shape, and may be a resin other than an epoxy thermosetting resin.

In addition, as an example of the film F, it is preferable to use a film material having excellent heat resistance, easy peeling, softness, and stretchability, such as polytetrafluoroethylene (PTFE), ethylene-tetrafluoroethylene copolymer (ETFE) (polytetrafluoroethylene polymer), polyethylene terephthalate (PET), fluorinated ethylene propylene (FEP), fluorine-impregnated glass cloth, polypropylene, polyvinylidene chloride, etc. In this embodiment, a roll-shaped film can be used as the film F. Furthermore, as another example, a structure using a long strip of film can also be used (not shown).

Next, the resin sealing device 1 of the present embodiment is briefly described. As shown in FIG1 , the resin sealing device 1 includes the following components as main structures: a supply unit 100A, which mainly supplies a workpiece W and a resin R as a resin sealing target; a pressing unit 100B, which mainly performs resin sealing on the workpiece W and processes it into a molded product Wp; and a storage unit 100C, which mainly performs storage of the molded product Wp after the resin sealing.

In addition, the resin sealing device 1 includes a conveying mechanism 100D, which moves between the units to convey the workpiece W, the resin R, and the molded product Wp. As an example, the conveying mechanism 100D includes: an inloader 122, which carries the workpiece W and the resin R into the pressing unit 100B; an outloader 124, which carries the molded product Wp out of the pressing unit 100B; and a guide rail 126, which is shared by the inloader 122 and the outloader 124. Furthermore, the conveying mechanism 100D is not limited to the above structure, and can also be appropriately set to a structure that uses a known picker, etc. (not shown). In addition, it is also possible to replace the structure including the loader with a structure including a multi-joint robot (not shown).

Here, the loader 122 plays the role of receiving the workpiece W and the resin R in the supply unit 100A and conveying them to the pressing unit 100B. As a structural example of the loader 122, there are provided two rows of workpiece holding parts 122A and 122B arranged side by side in the left-right direction and capable of holding one workpiece W respectively. In addition, a resin holding part 122C is provided between the two rows of workpiece holding parts 122A and 122B, and the resin holding part 122C can hold a plurality of (as an example, four are listed as an example, but it is not limited to this, or it can be a single number) resins R in the front-back direction. Furthermore, regarding the workpiece holding portion 122A, the workpiece holding portion 122B and the resin holding portion 122C, a known holding mechanism (for example, a structure having holding claws for clamping, a structure having a suction hole connected to a suction device for adsorption, etc.) (not shown) can be used.

The loader 122 of the present embodiment is configured to move in the left-right direction and the front-back direction, carry the workpiece W and the resin R into the sealing mold 202, and place them at a predetermined position of the lower mold 206. However, the present invention is not limited thereto, and may be configured to include a loader that moves in the left-right direction to carry the workpieces between the units and a loader that moves in the front-back direction to carry the workpieces into the sealing mold 202 (not shown).

In addition, the unloader 124 receives the molded product Wp (including the unneeded resin parts such as the pick-up tank and the gutter) in the pressing unit 100B and transports it to the storage unit 100C. As a structural example of the unloader 124, there are provided two rows of molded product holding parts 124A and 124B arranged side by side in the left-right direction and capable of holding one molded product Wp respectively. Furthermore, for the molded product holding parts 124A and 124B, a known holding mechanism (for example, a structure having a holding claw for clamping, a structure having a suction hole connected to a suction device for adsorption, etc.) (not shown) can be used.

The unloader 124 of the present embodiment is configured to move in the left-right direction and the front-back direction to unload the molded product Wp from the sealing mold 202 and place it on the molded product worktable 114. However, the present invention is not limited thereto, and may be configured to include a loader that moves in the front-back direction to unload from the sealing mold 202 and a loader that moves in the left-right direction to transport between units (not shown).

Furthermore, the resin sealing device 1 can change the overall structural form by changing the structure of the unit. For example, the structure shown in FIG1 is an example in which two pressing units 100B are provided, but it is also possible to have only one pressing unit 100B or to have three or more pressing units 100B. In addition, it is also possible to have a structure in which other units are additionally provided (not shown).

(Supply unit) Next, the supply unit 100A included in the resin sealing device 1 will be described.

As an example, the supply unit 100A includes a work stocker 102 for accommodating workpieces W and a work table 104 for placing the workpieces W. Furthermore, as for the work stocker 102, a known stack magazine, a slit magazine, etc. can be used, which can accommodate a plurality of workpieces W together. With the above structure, the workpieces W are taken out from the work stocker 102 using a known pusher, etc. (not shown), and placed on the work table 104 (as an example, two workpieces W are placed in a group in parallel). Then, the workpieces W placed on the work table 104 are held by the loader 122 and transported to the pressing unit 100B.

In addition, the supply unit 100A (or other units) includes a resin supply mechanism 140, which supplies resin R at a side position of the workpiece table 104. As an example, the resin supply mechanism 140 includes: a supply part 142 having a hopper, a feeder, etc. to supply the resin R; and a delivery part 144 having a transfer mechanism such as an elevator to hold the plurality of resins R supplied from the supply part 142 at a predetermined position. With the above structure, the plurality of resins R held by the delivery part 144 are held by the loader 122 and transported to the pressing unit 100B.

(Pressure unit) Next, the pressure unit 100B included in the resin sealing device 1 is described. Here, FIG. 3 is a front cross-sectional view (outline) of the sealing mold 202 of the resin sealing device 1, FIG. 4 is a schematic view of the upper surface (i.e., mold surface 206a) of the lower mold 206 of the sealing mold 202, and FIG. 5 is a schematic view of the lower surface (i.e., mold surface 204a) of the upper mold 204 of the sealing mold 202.

The pressing unit 100B includes a pressing device 250 that clamps the workpiece W and performs resin sealing by opening and closing a sealing mold 202 described later.

As shown in FIG. 2 , the pressing device 250 includes: a sealed mold 202 having a lower mold 206 and an upper mold 204 and disposed between a pair of platens 252, 254; a plurality of connecting mechanisms 256 for mounting the pair of platens 252, 254; a driving source (e.g., an electric motor) 260 for moving (lifting) the platen 254; and a driving transmission mechanism (e.g., a ball screw or a toggle link mechanism) 262. Furthermore, in this embodiment, the upper mold 204 is assembled to the fixed platen 252 and the lower mold 206 is assembled to the movable platen 254. However, the present invention is not limited to the above structure, and the upper mold 204 may be assembled to the movable mold plate and the lower mold 206 may be assembled to the fixed mold plate, or both the upper mold 204 and the lower mold 206 may be assembled to the movable mold plate.

In addition, the pressing unit 100B includes a film supply mechanism 201, which conveys (supplies) a rolled film F without an opening (hole) on the sheet surface to the inside of the sealing mold 202. The film supply mechanism 201 is configured such that an unused film F is delivered from a roll-out section 201A and supplied to the opened sealing mold 202, and after being used for resin sealing in the sealing mold 202, the film F is rolled up by a take-up section 201B as a used film F. Furthermore, the roll-out section 201A and the take-up section 201B may be arranged oppositely in the front-rear direction, or may be arranged in a manner of supplying a sheet of film F in the left-right direction (both not shown). In addition, as described above, a structure in which a strip-shaped film is used instead of a rolled film may also be configured (not shown).

Next, the lower mold 206 of the sealing mold 202 is described in detail. As shown in FIG. 2 and FIG. 3, the lower mold 206 includes a lower mold base 212, a lower mold groove sleeve block 216, a lower mold clamping block 220, etc., and these are assembled to form a structure. As an example, the lower mold groove sleeve block 216 is fixed to the lower mold base 212, and the lower mold base 212 is fixed to the movable mold plate 254.

Here, multiple (four are listed as an example, but not limited to this, or a single number) cylindrical tanks 240 for accommodating resin (resin sheet in this case) R are provided in the lower mold 206 along the front-rear direction. The tank 240 is formed as a through hole continuous with the lower mold groove sleeve block 216 and the lower mold clamping block 220. In addition, a plunger 242 pushed by a known transmission drive mechanism (not shown) is provided in the tank 240. By the above structure, the plunger 242 is pushed to supply the resin R in the tank 240 into the mold cavity 208 (described later).

In addition, in the present embodiment, a workpiece holding portion 205 for holding one or more workpieces W is provided in a configuration surrounded by a lower mold clamping block 220 fixed to a lower mold groove sleeve block 216. More specifically, as shown in FIG. 4 , two workpiece holding portions 205 (a first workpiece holding portion 205A and a second workpiece holding portion 205B) are provided in a configuration along the left-right direction of the clamping tank 240. As an example, the workpiece holding portion 205 is a structure that includes a suction path (not shown) connected to a suction device and adsorbs and holds the workpiece W. Furthermore, a structure including a suction path or a structure including a holding claw for clamping the periphery of the workpiece W may be provided in place of the structure including the suction path or in combination with the structure (not shown).

In addition, a lower mold heater (not shown) is provided on the lower mold base 212. Thus, heat can be conducted to the vicinity of the tank 240 via the lower mold groove sleeve block 216 and the like, and the resin R in the tank 240 can be efficiently heated to a predetermined temperature (about 180° C. in this embodiment) in a short time to be melted. As an example, a known electric heating wire heater, armored heater, etc. can be used for the lower mold heater.

Next, the upper mold 204 of the sealing mold 202 is described in detail. As shown in FIG. 2 and FIG. 3, the upper mold 204 includes an upper mold base 210, an upper mold groove sleeve block 214, an upper mold clamping block 218, etc., and these are assembled to form a structure. As an example, the upper mold groove sleeve block 214 is fixed to the lower surface of the upper mold base 210, and the upper mold base 210 is fixed to the lower surface of the fixed mold plate 252.

Here, a material removal pool block 244 is provided on the upper mold 204, and the material removal pool block 244 is fixed to the upper mold groove sleeve block 214 (including a component fixed to the upper mold groove sleeve block 214) in an immovable manner at a position directly above the tank 240 of the lower mold 206 (here, it refers to an area of a specified width directly above), and a material removal pool 246 is provided through the lower surface. In addition, a mold cavity 208 is provided for accommodating a specified portion of the workpiece W (a portion where the electronic component Wb is mounted).

As shown in FIG5 , the mold cavity 208 of the present embodiment is arranged to be surrounded by the upper mold clamping block 218 fixed under the upper mold groove sleeve block 214. More specifically, two mold cavities 208 (the first mold cavity 208A and the second mold cavity 208B) are arranged to correspond to the positions of the two workpiece holding portions 205 (the first workpiece holding portion 205A and the second workpiece holding portion 205B) of the lower mold 206 and to clamp the pick pool block 244 in the left and right directions when viewed from above.

Here, as a structural example of the mold cavity 208 (the first mold cavity 208A and the second mold cavity 208B), there are provided: a first mold cavity insert 226A, which is fixed to the upper mold groove sleeve block 214 and constitutes the bottom of the first mold cavity 208A; a first clamper 228A, which is arranged around the first mold cavity insert 226A so as to be movable up and down when viewed from above, constitutes the side of the first mold cavity 208A and clamps the workpiece W; and a first clamper spring 232A, which applies force to the first clamper 228A toward the first workpiece holding portion 205A. In a left-right symmetrical arrangement, there are provided: a second cavity insert 226B fixed to the upper die groove sleeve block 214 and constituting the bottom of the second cavity 208B; a second clamper 228B, which is disposed around the second cavity insert 226B so as to be movable up and down in a plan view and constituting the side of the second cavity 208B and clamping the workpiece W; and a second clamper spring 232B, which applies force to the second clamper 228B toward the second workpiece holding portion 205B. In addition, the suction path for degassing or film adsorption in the cavity 208 is omitted from the drawing.

According to the above structure, the above problem can be solved. Specifically, in the resin sealing device 1 using the transfer molding method, a plurality of (two in the present embodiment) workpieces W are held by the lower mold 206, each workpiece W is clamped by each clamper 228A, 228B, and the corresponding clamper springs 232A, 232B are used to apply force to the clamper 228A, 228B respectively so that the clamper 228A, 228B can be moved, thereby absorbing the thickness deviation of the workpiece W (specifically, the base material Wa). In addition, the cavity inserts 226A, 226B themselves are fixed to a common upper mold groove sleeve block 214, so that the total thickness of the molded product Wp can be formed to be constant regardless of the thickness of the workpiece W. That is, it is possible to provide products (molded products Wp) with a constant total thickness with uniform quality without deviation. Furthermore, it is not necessary to set up special equipment or dedicated equipment like in the prior art, and it can be handled only by the structure of the upper mold 204 of the sealing mold 202, so that it is possible to suppress manufacturing costs and facilitate maintenance.

On the other hand, as described above, the first clamp 228A and the second clamp 228B are movable structures. Therefore, in the first clamp 228A and the second clamp 228B, it is preferable to set the following structure, that is, to set a channel 248 through the lower surface or the vicinity of the lower surface of each, and the channel 248 is connected to the material removal pool 246, the first mold cavity 208A and the second mold cavity 208B at least in the closed mold state. Thereby, even if the first clamp 228A and the second clamp 228B are movable structures, a flow path of the resin having the material removal pool 246 and the channel 248 can be constructed, so that transfer molding can be performed.

In addition, in the present embodiment, the first clamper spring 232A and the second clamper spring 232B are configured such that a plurality of springs (for example, coil springs) having different spring constants are provided, and one spring corresponding to the resin sealing condition is selected and detachably fixed to the upper mold 204. In this way, the workpiece clamping force can be individually set/adjusted, so that the condition can be changed very easily to form an appropriate workpiece clamping force for each workpiece W. That is, the setting can be easily made to reduce the damage of the workpiece W (substrate Wa) or the resin leakage in the resin sealing step.

As an example, the first clamper spring 232A and the second clamper spring 232B are respectively configured such that a plurality of springs (for example, coil springs) are arranged at intervals so as to surround the corresponding cavity inserts (i.e., the first cavity insert 226A and the second cavity insert 226B). This allows the workpiece W to be clamped with an even clamping force along the outer edge. Therefore, the effect of suppressing damage to the workpiece W (base material Wa) or resin leakage can be further improved.

In addition, an upper mold heater (not shown) is provided on the upper mold base 210. Thus, heat can be transferred to the cavity 208 and the surrounding of the resin flow path (the material removal pool 246, the channel 248, etc.) through the upper mold groove sleeve block 214, etc., and the resin R in a molten state filled into the cavity 208 and the resin flow path 246 and the resin flow path 248 can be heated to a predetermined temperature. As an example, the upper mold heater can use a known electric heating wire heater, a armored heater, etc.

Here, other structural examples of the upper mold 204 are described. First, in the case where the first workpiece holding portion 205A holds one (or more) workpieces W having multiple electronic components Wb mounted on a substrate Wa, the structure shown in FIG. 9 can be applied. Specifically, multiple first mold cavities 208A are arranged at corresponding positions of the first workpiece holding portion 205A. At this time, as shown in FIG. 9, the side of one first mold cavity 208A can be constituted by one first clamper 228A, or as shown in FIG. 10, the side of multiple first mold cavities 208A can be constituted by one first clamper 228A. On the other hand, in the case where the first workpiece holding portion 205A holds multiple workpieces W, the structure shown in FIG. 9 can be applied. Furthermore, regarding FIGS. 9 and 10 , the first cavity 208A and the second cavity 208B are shown as having the same structure, but they may also be different structures.

(Storage unit) Next, the storage unit 100C included in the resin sealing device 1 is described.

As an example, the storage unit 100C includes: a molded product workbench 114 for placing molded products Wp; a gutter cutting section 116 for removing unnecessary resin parts such as a pick-up pool, a gutter, and a gutter from the molded product Wp; and a molded product storage 112 for storing molded products Wp from which unnecessary resin parts have been removed. Furthermore, with respect to the molded product storage 112, a known stacking box, a slit box, etc. can be used, so that a plurality of molded products Wp can be stored together. With the above structure, the molded product Wp (connected via unnecessary resin parts) transported from the pressing unit 100B using a loader 124 or the like is placed on the molded product workbench 114. Then, it is transferred to the gutter cutting section 116 using a known picker or the like (not shown) and after the unnecessary resin portion is removed, it is stored in the molded product storage 112 using a known pusher or the like (not shown).

(Resin sealing action) Next, the action of performing resin sealing using the sealing mold 202 of the present embodiment and the resin sealing device 1 including the sealing mold 202 is described. Here, the following structure is cited as an example, that is, two sets of mold cavities 208 are set in an upper mold 204, and two workpieces W (for example, long strip-shaped workpieces) are arranged in parallel in a lower mold 206 to perform resin sealing together, and two molded products Wp are obtained at the same time. However, it is not limited to the above structure, and it can also be set as a structure in which one workpiece W is arranged or multiple workpieces W are arranged in parallel along the front, back, left and right directions to perform resin sealing.

As a preparation step, a heating step (upper mold heating step) is performed in which the upper mold 204 is adjusted and heated to a predetermined temperature (e.g., 100°C to 200°C) by the upper mold heater. In addition, a heating step (lower mold heating step) is performed in which the lower mold 206 is adjusted and heated to a predetermined temperature (e.g., 100°C to 200°C) by the lower mold heater. Furthermore, the following step (film supply step) is performed, that is, the film F is conveyed (sent out) from the unwinding section 201A to the winding section 201B by the film supply mechanism 201 to supply the film F to a predetermined position (a position between the upper mold 204 and the lower mold 206) in the sealing mold 202.

Then, the steps of carrying out the workpieces W one by one from the workpiece storage 102 by a known pusher or the like (not shown) and placing them on the upper surface of the workpiece table 104 are performed (a known pickup mechanism or the like may also be used in combination). In addition, the steps of carrying out the sheet-shaped resin R one by one from the supply section 142 by a known feeder, elevator or the like (not shown) and holding a plurality of (four, for example) sheets of resin R at a predetermined position of the delivery section 144 are performed.

Then, the loader 122 is moved to the position directly above the workpiece table 104 (it may also be placed in the same position in advance). At the position, the workpiece table 104 is raised (or the loader 122 is lowered) and the workpiece holding portion 122A and the workpiece holding portion 122B are used to hold the workpiece W (in this embodiment, the workpiece holding portion 122A and the workpiece holding portion 122B each hold one workpiece W).

Then, the loader 122 is moved to the position directly above the interface 144. At the position, the interface 144 is raised (or the loader 122 is lowered) and the resin holding portion 122C holds the resin R (in the present embodiment, the resin holding portion 122C holds four resins R).

Next, the following steps are performed: a plurality of (two in this embodiment) workpieces W and a plurality of (four in this embodiment) resins R are transported into the sealed mold 202 of the pressing unit 100B in one step by the loader 122, and the workpieces W are respectively placed on each workpiece holding portion 205 (the workpiece holding portion 205A and the workpiece holding portion 205B in this embodiment) of the lower mold 206; and the resins R are respectively contained in a plurality of (four in this embodiment) tanks 240 of the lower mold 206. Furthermore, a step of preheating the workpieces W or the resin R by a heater (not shown) provided in the loader 122 during the transport (preheating step) may also be performed.

Next, a step of forming a molded product Wp by closing the sealing mold 202 and clamping the workpiece W with the upper mold 204 and the lower mold 206 to perform resin sealing (resin sealing step) is performed.

In more detail, first, as shown in FIG6 , the drive source 260 and the drive transmission mechanism 262 are driven to move the movable die plate 254 upward. Thereby, the lower die 206 moves toward the upper die 204 (i.e., upward). If the lower die 206 is further moved upward, as shown in FIG7 , the first clamp 228A of the upper die 204 abuts against the workpiece W held by the first workpiece holding portion 205A of the lower die 206, and is in a state of clamping the workpiece W. Similarly, the second clamp 228B of the upper die 204 abuts against the workpiece W held by the second workpiece holding portion 205B of the lower die 206, and is in a state of clamping the workpiece W. If the lower mold 206 is further moved upward, as shown in FIG8 , the first clamp 228A abutting against the workpiece W of the first workpiece holding portion 205A overcomes the force of the first clamp spring 232A and moves upward, and the first cavity insert 226A moves downward. Similarly, the second clamp 228B abutting against the workpiece W of the second workpiece holding portion 205B overcomes the force of the second clamp spring 232B and moves upward, and the second cavity insert 226B moves downward. In the above state, the transmission drive mechanism is operated to push the plunger 242 toward the upper mold 204, and the molten sealing resin is pressed into the cavity 208 through the ejection pool 246 and the channel 248 of the upper mold 204. 6 to 8 , in order to make the structure clear, the release film is omitted.

As described above, the resin R is heated and pressurized for the workpiece W, and the resin R is thermally hardened to perform resin sealing (compression molding), thereby forming a molded product Wp. At this time, since each workpiece W held on each workpiece holding portion 205A, 205B is clamped by different clampers 228A, 228B, and each clamper 228A, 228B is forced by different clamper springs 232A, 232B, it is possible to absorb the thickness deviation of the workpiece W (specifically, the base material Wa). Therefore, it is possible to prevent the occurrence of defects such as damage to the workpiece W due to excessive clamping force, positional deviation of the workpiece W due to insufficient clamping force, and resin leakage. In addition, since the cavity inserts 226A and 226B are fixed to a common upper die sleeve block 214, the total thickness of the molded product Wp can be constantly formed regardless of the thickness of the workpiece W.

Next, the following steps are performed, namely, the sealing mold 202 is opened, and a plurality of (two in the present embodiment) molded products Wp (including the parts that do not require resin, such as the removal pool part and the gutter part, through the state of these connections) are taken out from the sealing mold 202 in one step by the ejector 124.

In parallel with (or after) this, the following step is performed, namely, the film supply mechanism 201 conveys the film F from the unwinding section 201A to the winding section 201B, thereby delivering the used film F.

Next, a step of placing the molded product Wp (including the pick-up pool, the gutter, etc.) on the molded product workbench 114 is performed by the unloader 124 (in addition, a known pickup mechanism, etc. may also be used in combination). Next, a step of removing the unnecessary resin parts such as the pick-up pool and the gutter from the molded product Wp is performed at the gutter cutting section 116. Next, a step of moving the molded products Wp (with the unnecessary resin parts removed) one by one into the molded product storage 112 is performed by a known pusher, etc. (not shown). In addition, before these steps, a step of post-curing the molded product Wp may also be performed.

The above is the main operation of resin sealing using the resin sealing device 1. However, the above step sequence is an example, and the sequence can be changed or performed in parallel as long as there is no problem. For example, in this embodiment, since it is a structure including two pressing units 100B, the above operation can be performed in parallel to efficiently form a molded product.

As described above, according to the sealing mold and the resin sealing device including the sealing mold of the present invention, in the resin sealing device of the transfer molding method for performing resin sealing on a plurality of workpieces at the same time, the thickness deviation of the workpieces can be absorbed, thereby preventing the damage of the workpieces due to excessive clamping force, the positional displacement of the workpieces due to insufficient clamping force, the occurrence of resin leakage, etc. In addition, the total thickness of the molded product can be molded to be constant. Furthermore, compared with the previous device, it is possible to achieve facilitation of maintenance and suppression of device costs.

Furthermore, the present invention is not limited to the above-mentioned embodiments, and various changes can be made without departing from the scope of the present invention. Specifically, in the above-mentioned embodiments, the following structure is cited as an example for explanation, that is, the upper mold includes an upper mold resin sealing part equipped with two mold cavities, and the lower mold includes a lower mold resin sealing part equipped with two workpiece holding parts that respectively hold a workpiece, and resin sealing is performed together to obtain two molded products at the same time, but it is not limited to this. For example, as a modified example, it can also be set as the following structure, that is, a plurality of sets of the upper mold resin sealing parts are included in the front-to-back direction (or the left-to-right direction) of the upper mold, and a plurality of sets of the lower mold resin sealing parts are included in the front-to-back direction (or the left-to-right direction) of the corresponding lower mold. According to the structure, even when there is a deviation in the thickness of the workpiece, products (ie, formed products) with a constant total thickness can be mass-produced.

In addition, the mold cavity may be provided in the lower mold. In this case, a structure may be adopted in which the resin passes up and down through the upper and lower holes of the workpiece such as the lead frame. Furthermore, in the case of changing from a structure in which the mold cavity is provided in the upper mold to a structure in which the mold cavity is provided in the lower mold, it is sufficient to change from a structure in which the movable clamp mechanism (a mechanism composed of a clamp, a clamp spring, etc.) is provided in the upper mold to a structure in which it is provided in the lower mold. In this case, since the tank is provided on the lower side, a structure in which a gutter is connected from the upper mold pick-up pool to the lower mold may be adopted.

1: Resin sealing device 100A: Supply unit 100B: Pressing unit 100C: Storage unit 100D: Transport mechanism 102: Workpiece storage 104: Workpiece table 112: Molded product storage 114: Molded product table 116: Slotting and cutting section 122: Loader 122A: Workpiece holding section 122B: Workpiece holding section 122C: Resin holding section 124: Unloader 124A: Molded product holding section 124B: Molded product holding section 126: Guide rail 140: Resin supply mechanism 142: Supply section 144: Handover section 201: Film supply mechanism 201A: Rolling section 201B: Rolling section 202: Sealing mold 204: Upper mold 204a: Mold surface 205: Workpiece holding section 205A: First workpiece holding section 205B: Second workpiece holding section 206: Lower mold 206a: Mold surface 208: Mold cavity 208A: First mold cavity 208B: Second mold cavity 210: Upper mold seat 212: Lower mold seat 214: Upper mold groove sleeve block 216: Lower mold groove sleeve block 218: Upper mold clamping block 220: Lower mold clamping block 226A: First mold cavity insert (mold cavity insert) 226B: Second mold cavity insert (mold cavity insert) 228A: First clamp (clamp) 228B: Second clamp (clamp) 232A: First clamp spring (clamp spring) 232B: Second clamp spring (clamp spring) 240: Tank 242: Plunger 244: Pick-up pool block 246: Pick-up pool (resin flow path) 248: Gutter (resin flow path) 250: Pressing device 252: Template (fixed template) 254: Template (movable template) 256: Connecting mechanism 260: Driving source (electric motor) 262: Drive transmission mechanism (ball screw or toggle link mechanism) F: Release film (film) R: Resin W: Workpiece (molded product) Wa: Base material Wb: Electronic parts Wp: Molded product II-II: Wire

FIG. 1 is a plan view showing an example of a sealing mold and a resin sealing device according to an embodiment of the present invention. FIG. 2 is a side view taken along the II-II line of FIG. 1 . FIG. 3 is a front cross-sectional view showing an example of a sealing mold of the resin sealing device of FIG. 1 . FIG. 4 is a top view showing an example of a lower mold of the sealing mold of FIG. 3 . FIG. 5 is a bottom view showing an example of an upper mold of the sealing mold of FIG. 3 . FIG. 6 is an action explanation diagram (front cross-sectional view) of the resin sealing device of FIG. 1 . FIG. 7 is an action explanation diagram (front cross-sectional view) following FIG. 6 . FIG. 8 is an action explanation diagram (front cross-sectional view) following FIG. 7 . FIG. 9 is a bottom view showing another example of an upper mold of the sealing mold of FIG. 3 . FIG. 10 is a bottom view showing another example of an upper mold of the sealing mold of FIG. 3 .

202: Sealing mold

204: Upper mold

204a: Mold surface

205: Workpiece holding part

205A: First workpiece holding part

205B: Second workpiece holding unit

206: Lower mold

206a: Mold surface

208:Mold cavity

208A: First cavity

208B: Second cavity

214: Upper die groove sleeve block

216: Lower die groove sleeve block

218: Upper die clamping block

220: Lower mold clamping block

226A: First cavity insert (cavity insert)

226B: Second cavity insert (cavity insert)

228A: First clamp

228B: First clamp

232A: First clamp spring

232B: Second clamp spring

240:Cans

242: Plunger

244: Material removal pool area

246: Material removal pool (resin flow path)

248: Watering channel (resin flow path)

R: Resin

W: Workpiece (formed product)

Wa: base material

Wb:Electronic parts

Claims (5)

A sealing mold comprises an upper mold and a lower mold, and a workpiece is sealed with resin to be processed into a molded product. The sealing mold is characterized in that the lower mold is provided with a tank for the resin in sheet form to be put into, and the upper mold is provided with a material removal pool block, and the material removal pool block is fixed to the upper mold groove sleeve block at a position directly above the tank so as to be unable to move, and a material removal pool is provided through the lower surface, and one of the upper mold and the lower mold is provided with a first workpiece holding part and a second workpiece holding part for holding one or more workpieces respectively, and the other is provided with: one or more first mold cavities arranged corresponding to the first workpiece holding part and one or more second mold cavities arranged corresponding to the second workpiece holding part; a first mold cavity insert constituting the bottom of the first mold cavity; a first clamper arranged on the first mold so as to be movable up and down The first mold cavity insert is surrounded by the first mold cavity insert and constitutes a side of the first mold cavity, or constitutes a plurality of sides of the first mold cavity to clamp the workpiece; a first clamper spring applies force to the first clamper toward the first workpiece holding portion; a second mold cavity insert constitutes the bottom of the second mold cavity; a second clamper is separated from the first clamper through the ejection pool block and is disposed on the second mold cavity insert so as to be movable up and down The second mold cavity is surrounded by a side portion, or a plurality of side portions of the second mold cavity are formed to clamp the workpiece; and a second clamp spring is used to apply force to the second clamp toward the second workpiece holding portion, wherein the configuration for clamping the pick pool block in the left and right directions when viewed from above is provided with the first clamp surrounding the first mold cavity insert and the second clamp surrounding the second mold cavity insert. As described in claim 1, the first clamp and the second clamp are respectively provided with a gutter, and the gutter is connected to the ejection pool at least in the closed mold state. As described in claim 1, the first clamp spring and the second clamp spring are respectively of the following structure: a plurality of springs with different spring constants are provided, and one corresponding to the resin sealing condition is selected, and can be detachably fixed to the upper mold or the lower mold. The sealing mold as described in claim 1, wherein the first clamp spring and the second clamp spring are structures in which a plurality of coil springs are arranged at intervals. A resin sealing device, comprising a sealing mold as described in any one of claim 1 to claim 4.