TWI853274B - Compression molding device - Google Patents

Abstract

The present invention provides a compression molding device, which can achieve improved productivity and prevent the occurrence of poor molding due to the adhesion of foreign matter, thereby improving the molding quality. The compression molding device 1 of the present invention uses a sealing mold 202 to seal three or less workpieces W together with a resin R. The sealing mold 202 is provided with three sets of cavities 208 in one of the upper mold 204 or the lower mold 206, and is provided with three corresponding sets of workpiece holding parts 205 in the other. In the compression molding device, along a predetermined X direction, the workpiece supply unit 100A, the pressing unit 100B, the resin supply unit 100C, and the molded product storage unit 100D are arranged in the order of the workpiece supply unit 100A, the pressing unit 100B, the resin supply unit 100C, the pressing unit 100B, and the molded product storage unit 100D.

Description

Compression molding device

The present invention relates to a compression molding device.

As examples of resin sealing devices and resin sealing methods that process a workpiece (work) having electronic components mounted on a substrate into a molded product by sealing it with a sealing resin (hereinafter sometimes referred to as "resin"), there are known methods that utilize transfer molding or compression molding.

The transfer molding method is a technology for performing resin sealing by the following operation, namely: a pot is provided, and the pot supplies a predetermined amount of resin to two sealing areas (cavities) provided in a sealing mold composed of an upper mold and a lower mold, and workpieces are arranged at positions corresponding to the respective sealing areas, and the resin flows from the pot into the cavity by clamping the upper mold and the lower mold. In addition, the compression molding method is a technology for supplying a predetermined amount of resin to a sealing area (cavity) provided in a sealing mold composed of an upper mold and a lower mold, and the workpiece is arranged in the sealing area, and the resin is sealed by clamping the upper mold and the lower mold. As an example, there is a known technology for performing molding by supplying resin to the center position of the workpiece when using a sealing mold having a cavity provided in the upper mold. On the other hand, it is known that when a sealed mold having a cavity in the lower mold is used, a film and resin are supplied to cover the surface of the mold including the cavity for molding (see Patent Document 1: Japanese Patent Publication No. 2019-145550).

[Prior art literature]

[Patent Literature]

[Patent document 1] Japanese Patent Publication No. 2019-145550

In the previous compression molding method as exemplified in Patent Document 1, multiple (for example, two to four, etc.) compression units including sealed molds are configured, and the number of molded products operated (number of molds) for each set of sealed molds is set to two, thereby achieving improved productivity.

However, for example, as the number of pressing units increases to three or four, it takes more time to supply the material to the sealing mold (especially when using granular resin), and there is a problem that productivity cannot be improved in accordance with the increase in the number of units. In addition, there is a problem that not only the overall size of the device becomes larger, but also the cost increases due to the increase in the number of parts or the complexity of the structure.

Furthermore, in the compression molding method, if a unit configuration suitable for the required material supply step and molded product storage step is adopted, it is difficult to separate the workpiece supply unit from the molded product storage unit, and it is also difficult to separate the workpiece conveying unit from the resin conveying unit. As a result, there is a problem that foreign matter (burrs, etc.) generated by the molded product or foreign matter (dust, etc.) generated by the resin during the conveying process adheres to the workpiece or the sealing mold, causing poor molding.

The present invention is made in view of the above situation, and its purpose is to provide a compression molding device that can achieve improved productivity without adopting the previous method of increasing the number of compression units to three or more, and can prevent the occurrence of poor molding due to the adhesion of foreign matter, thereby improving the molding quality.

The present invention solves the above-mentioned problem by the solution described below as an implementation method.

The compression molding device of the present invention uses a sealing mold to seal three or less workpieces together with resin, wherein the sealing mold is provided with three sets of mold cavities in one of the upper mold or the lower mold, and is provided with three corresponding sets of workpiece holding parts in the other mold, and the necessary conditions of the compression molding device are that it includes: a workpiece supply unit for supplying the workpieces; a resin supply unit for supplying the resin; a compression unit equipped with the sealing mold and supplying the workpieces; The workpiece is processed into a molded product by resin sealing; and a molded product storage unit is used to store the molded product, and the compression molding device is arranged in the order of the workpiece supply unit, the pressing unit, the resin supply unit, and the molded product storage unit, or the workpiece supply unit, the pressing unit, the resin supply unit, the pressing unit, and the molded product storage unit along a predetermined X direction.

Thus, the number of operations for each set of sealed molds can be limited to three at most, and the number of pressing units can be suppressed to less than two. Therefore, compared with the previous device with the same number of operations (specifically, the number of operations for each set of sealed molds is two and the number of pressing units is three), the number of times the material (workpiece, sealing resin, release film) is supplied to the sealed mold can be reduced, thereby improving productivity. In addition, since the number of pressing times (i.e., the number of times the resin sealing step is performed) can be reduced, the manufacturing cost can be reduced. In addition, the overall miniaturization of the device and the simplification of the structure can achieve a reduction in device cost.

In addition, it is easy to achieve a structure that separates the workpiece supply unit from the molded product storage unit, and a structure that separates the workpiece conveying unit from the resin conveying unit. Therefore, it is possible to prevent the occurrence of molding defects caused by foreign matter (burrs, etc.) generated by the molded product or foreign matter (dust, etc.) generated by the resin during the conveying process, thereby improving the molding quality.

Furthermore, as an expansion unit relative to the basic unit, it is easy to add a workpiece volume measurement unit, a molded product appearance inspection unit, a heat sink supply unit, a sheet resin supply unit, etc., thereby achieving a highly expandable device.

In addition, it is preferred to further include: a workpiece conveying unit for conveying the workpiece between the workpiece supply unit and the pressing unit; a molded product conveying unit for conveying the molded product between the pressing unit and the molded product storage unit; and a resin conveying unit for conveying the resin between the resin supply unit and the pressing unit, and a partition is provided between the workpiece conveying unit and the molded product conveying unit and the resin conveying unit. It is further preferred that the workpiece supply unit, the pressing unit, the resin supply unit, and the molded product storage unit are also separated from each other. Thereby, the separation of the workpiece conveying unit and the resin conveying unit, and the separation of the molded product conveying unit and the resin conveying unit can be more reliably performed.

In addition, it is preferred that the workpiece conveying unit has a workpiece loader for conveying the workpiece into the sealing mold along the Y direction orthogonal to the X direction, and the resin conveying unit has a resin loader for conveying the resin into the sealing mold along the X direction. In this way, the workpiece conveying path and the molded product conveying path relative to the sealing mold can be made to not overlap with the resin conveying path as much as possible, and the workpiece conveying unit and the molded product conveying unit can be separated from the resin conveying unit more reliably.

In addition, it is preferred to include: a workpiece storage for accommodating the workpiece; a molded product storage for accommodating the molded product; and a resin storage for accommodating the resin, wherein the workpiece storage and the molded product storage are relatively arranged on the upper side of the device, and the resin storage is relatively arranged on the lower side of the device. Thereby, a device structure can be achieved in which the moving paths of the moving device based on the workpiece and the moving device based on the molded product are orthogonal to the moving path of the moving device based on the resin. Therefore, the width and depth of the device can be compacted. In addition, a device structure can be achieved in which a reliable partition is provided between the workpiece conveying part and the molded product conveying part and the resin conveying part. Furthermore, since the operator can replace the workpiece storage and the molded product storage without bending over, the workability can be improved.

According to the present invention, compared with the previous device with the same number of molded products, the number of times the material is supplied to the sealing mold and the number of times the pressing is performed can be reduced, thereby achieving improved productivity and reduced manufacturing costs. In addition, since the overall device can be miniaturized and the structure can be simplified, the device cost can be reduced. Furthermore, since foreign matter such as burrs or dust of the resin can be prevented from adhering to the workpiece or the sealing mold, the molding quality can be improved.

1: Compression molding device

100A: Workpiece supply unit

100B: Pressing unit

100C: Resin supply unit

100D: Molded product storage unit

100E: Volume measurement unit

100F: Appearance inspection unit

104: Workpiece transport unit

106: Molded product conveying section

108: Resin transport department

110: Workpiece storage

112: Molded product storage device

116: Sliding piece

116A, 116B, 116C: Workpiece holding part

117:Guide piece

118: Sliding part

118A, 118B, 118C: Molded product holding part

119:Guide piece

120: Supply Pickup

122: Storage Picker

130, 132, 134: Mobile devices

202: Sealing mold

204: Upper mold

204a: Mold surface

205, 205A, 205B, 205C: Workpiece holding part

206: Lower mold

206a: Mold surface

208, 208A, 208B, 208C: mold cavity

210: Workpiece loader

210A, 210B, 210C: Workpiece holding part

212: Molded product loader

212A, 212B, 212C: Molded product holding part

214a: Rolling out section

214b: Rolling section

214A, 214B, 214C: membrane supply mechanism

222: Go up

224: Lower board

226: Cavity insert

228: Clamp

230a, 230b, 230c, 240a: Suction path

232: Force-applying component

234: Sealing component

236:Holding board

250:Mold opening and closing mechanism

252: Template (fixed template)

254: Template (movable template)

256: Linking mechanism

260: Driving source

262: Drive transmission mechanism

300:Separator

302: Resin storage device

304: Resin loader

305:Guide piece

306: Resin heater

312: Allocator

312a: Nozzle

314: Extrusion plate

314a: Upper surface

315: Mobile attachment mechanism

316: Shield

316a: Peripheral wall

502: Workpiece table

504: Measurement Department

506: Workpiece Picker

602: Molding workbench

604: Inspection Department

606: Molded product picker

W: Workpiece (formed product)

Wa: base material

Wb:Electronic parts

Wp: Molded product

F: Membrane (release membrane)

R: Resin (sealing resin)

FIG1 is a plan view showing an example of a compression molding device according to the first embodiment of the present invention.

Figure 2 is a side view taken along line II-II in Figure 1.

Figure 3 is a side view taken along line III-III in Figure 1.

Figure 4 is a side view taken along line IV-IV in Figure 1.

FIG5 is a cross-sectional view showing an example of a mold opening and closing mechanism of the compression molding device of FIG1.

FIG6 is a cross-sectional view showing an example of a sealing mold of the compression molding device of FIG1.

FIG. 7 is a cross-sectional view showing an example of a resin loader of the compression molding device of FIG. 1 .

Figure 8 is a diagram illustrating the operation of the compression molding device of Figure 1.

Figure 9 is a diagram illustrating the operation of the compression molding device of Figure 1.

Figure 10 is a diagram illustrating the operation of the compression molding device of Figure 1.

Figure 11 is a diagram illustrating the operation of the compression molding device of Figure 1.

FIG12 is a plan view showing an example of a compression molding device according to the second embodiment of the present invention.

FIG13 is a plan view showing an example of a compression molding device according to the third embodiment of the present invention.

[First implementation method]

(Overall structure)

Hereinafter, the first embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view (schematic view) showing an example of a compression molding device 1 of the present embodiment. In addition, FIG. 2 is a side view at the position of the II-II line of FIG. 1 , FIG. 3 is a side view at the position of the III-III line of FIG. 1 , and FIG. 4 is an explanatory diagram of the configuration structure observed by side view at the position of the IV-IV line of FIG. 1 . Furthermore, for the convenience of explanation, arrows are used in the figure to indicate the left and right direction (X direction), the front and rear direction (Y direction), and the up and down direction (Z direction) of the compression molding device 1. In addition, in all the figures used to illustrate each embodiment, the same symbols are sometimes used to mark components with the same function, and their repeated explanations are omitted.

The compression molding device 1 of the present embodiment is a device that uses a sealing mold 202 including an upper mold 204 and a lower mold 206 to perform resin sealing of a workpiece (molded product) W. Hereinafter, as the compression molding device 1, the following compression molding device is cited as an example for explanation, wherein the compression molding device uses a sealing mold 202 to seal a plurality of workpieces W (for example, a maximum of three workpieces W when one workpiece W is sealed by a set of cavities 208) together with a resin R, wherein the sealing mold 202 has three sets of cavities 208 (208A, 208B, 208C) in the upper mold 204 and corresponding three sets of workpiece holding portions 205 (205A, 205B, 205C) in the lower mold 206. However, the structure is not limited to the above, and the number of workpieces W can also be set to three or less.

First, the workpiece W as the forming object has the following structure, that is, a plurality of electronic components Wb are mounted in a matrix on the substrate Wa. More specifically, examples of the substrate Wa include: resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, wafers and other plate-shaped components (so-called long workpieces) formed in a long strip shape. In addition, examples of electronic components Wb include semiconductor chips, micro electromechanical system (MEMS) chips, passive components, heat sinks, conductive components, spacers, etc. Furthermore, as other examples of the substrate Wa, the following structure can also be set, that is, using the components formed in a circular shape, a square shape, etc. (not shown).

As an example of a method of mounting electronic components Wb on substrate Wa, there are mounting methods using wire bonding packaging, flip chip packaging, etc. Alternatively, in the case of a structure in which the substrate (glass or metal pallet) Wa is peeled off from the molded product Wp after resin sealing, there is also a method of attaching electronic components Wb using a heat-peelable adhesive tape or a UV-curable resin that is cured by UV irradiation.

On the other hand, as an example of resin R, a thermosetting resin (e.g., epoxy resin containing filler, etc.) in a granular (including cylindrical, etc.), crushed, or powdered form (sometimes collectively referred to as "granular" in this application) can be used. Furthermore, resin R is not limited to the above state, and may be in other states (shapes) such as liquid, plate, sheet, etc., and may be a resin other than epoxy thermosetting resin.

In addition, as an example of the film F, it is preferable to use a film material with excellent heat resistance, easy peeling, softness, and stretchability, such as polytetrafluoroethylene (PTFE), ethylene-tetrafluoroethylene copolymer (ETFE) (polytetrafluoroethylene polymer), polyethylene terephthalate (PET), fluorinated ethylene propylene (FEP), fluorine-impregnated glass cloth, polypropylene, polyvinylidene chloride, etc. In this embodiment, a rolled film can be used as the film F. Furthermore, as a variation, a structure using a long strip of film can also be used (not shown).

Next, the outline of the compression molding device 1 of this embodiment is described. As shown in FIG1 , the compression molding device 1 includes the following parts as the main structure: a workpiece supply unit 100A, which mainly supplies the workpiece W; a compression unit 100B, which mainly performs resin sealing on the workpiece W to process it into a molded product Wp; a resin supply unit 100C, which mainly performs resin supply; and a molded product storage unit 100D, which mainly performs storage of the molded product Wp after resin sealing.

In this embodiment, along a predetermined direction (for example, the X direction in FIG. 1 ), the workpiece supply unit 100A, the pressing unit 100B, the resin supply unit 100C, the pressing unit 100B, and the molded product storage unit 100D are arranged in the order. Here, a workpiece conveying unit 104 is provided to convey the workpiece W between the workpiece supply unit 100A and the pressing unit 100B; and a molded product conveying unit 106 is provided to convey the molded product Wp between the pressing unit 100B and the molded product storage unit 100D. In addition, a resin conveying unit 108 is provided to convey the resin R between the resin supply unit 100C and the pressing unit 100B.

According to the structure, the workpiece supply unit 100A and the molded product storage unit 100D can be reliably separated. Therefore, it is possible to prevent foreign matter (burrs, etc.) generated by the molded product Wp from adhering to the workpiece W or the sealing mold 202 and causing molding defects. Furthermore, as shown in the third embodiment described later, as an expansion unit, for example, a workpiece volume measurement unit, a molded product appearance inspection unit, a heat sink supply unit, a sheet resin supply unit, etc. can be easily added, thereby achieving a highly expandable device.

In addition, in the present embodiment, the workpiece conveying section 104 is configured to include a moving device 130, and the moving device 130 has a workpiece loader 210, a slider 116, a guide 117, etc. In addition, the molded product conveying section 106 is configured to include a moving device 132, and the moving device 132 has a molded product loader 212, a slider 118, a guide 119, etc. In addition, the resin conveying section 108 is configured to include a moving device 134, and the moving device 134 has a resin loader 304 and a guide 305, etc. For example, regarding the moving device 130 and the moving device 132, a linear conveyor or other direct-acting mechanism can be used. In addition, the moving device 134 can be used in combination with a linear conveyor or other direct-acting mechanism and a lift mechanism such as a lift. However, it is not limited to these structures.

Here, as shown in FIG. 2 , a partition 300 is provided between the workpiece conveying section 104 and the molded product conveying section 106 and the resin conveying section 108. Thus, the workpiece conveying section 104 and the resin conveying section 108 can be reliably separated, and the molded product conveying section 106 and the resin conveying section 108 can be separated. Therefore, it is possible to prevent foreign matter (dust, etc.) generated by the resin R during the conveying process from adhering to the workpiece W or the sealing mold 202 and causing molding defects.

Furthermore, the compression molding device 1 can change the overall structural form by changing the structure of the unit. For example, the structure shown in FIG1 is an example of two compression units 100B, but it can also be a structure with only one compression unit 100B (the second embodiment described later). In addition, it can also be a structure with additional units (the third embodiment described later).

(Workpiece supply unit)

Next, the workpiece supply unit 100A included in the compression molding device 1 is described in detail.

The workpiece supply unit 100A includes: a workpiece storage 110 for accommodating the workpiece W; a workpiece conveying unit 104 for conveying the workpiece W into the sealing mold 202; and a supply picker 120 for delivering the workpiece W from the workpiece storage 110 to the workpiece conveying unit 104. Here, as shown in FIG. 3, the workpiece storage 110 is arranged on the upper side of the device relative to the resin storage 302 described later. In addition, the workpiece storage 110 can use a known stack magazine, a slit magazine, etc.

The slider 116 of the workpiece conveying unit 104 plays the role of receiving the workpiece W from the supply picker 120 and conveying it to the workpiece loader 210. As a structural example, there are three rows of workpiece holding parts 116A, 116B, and 116C arranged side by side in the X direction and capable of holding one workpiece W respectively. In addition, it is configured to be able to move in the X direction between the workpiece supply unit 100A and the pressing unit 100B along the guide 117. In addition, for the workpiece holding parts 116A, 116B, and 116C, a known holding mechanism (for example, a structure with a holding claw for clamping, a structure with a suction hole connected to a suction device for adsorption, etc.) (not shown) can be used.

The workpiece loader 210 of the workpiece conveying unit 104 receives the workpiece W from the slider 116, conveys it, and delivers it to the sealing mold 202. As a structural example, there are three rows of workpiece holding parts 210A, 210B, and 210C arranged side by side in the X direction and capable of holding one workpiece W respectively. In addition, it is configured to be movable in the Y direction (a direction orthogonal to the X direction in the horizontal plane) within the pressing unit 100B. Furthermore, for the workpiece holding parts 210A, 210B, and 210C, a known holding mechanism (for example, a structure having a holding claw for clamping, a structure having a suction hole connected to a suction device for adsorption, etc.) (not shown) can be used.

According to the structure, the workpiece conveying unit 104 can be used to carry up to three workpieces W into the sealing mold 202 at a time and hold them in the workpiece holding unit 205 (205A, 205B, 205C) of the lower mold 206.

In this embodiment, the workpiece conveying unit 104 is provided with the following structure, namely: the slider 116 moves in the X direction, the workpiece loader 210 moves in the Y direction, and the workpiece W is carried into the sealing mold 202. In this way, by fixing the X axis of the workpiece loader 210 of the workpiece conveying unit 104, making the slider 116 movable in the X axis direction, and setting the workpiece loader 210 in the pressing unit 100B, the garbage accumulated on the workpiece loader 210 will not be scattered. However, it is not limited to this, and the workpiece conveying unit 104 may also be provided with the following structure, namely: one workpiece loader moves in the X direction and the Y direction to carry the workpiece W into the sealing mold 202 (not shown).

In addition, the slider 116 includes a heater (not shown) for heating the workpiece W from the lower surface side (substrate Wa side). As an example, a known heating mechanism (such as an electric heating wire heater, an infrared heater, etc.) can be used for the heater. In this way, the workpiece W can be preheated before being moved into the sealing mold 202 for heating. Furthermore, a structure that does not include a heater can also be used.

(Pressure unit)

Next, the compression unit 100B included in the compression molding device 1 is described in detail. Here, FIG5 shows a front cross-sectional view (schematic view) of the mold opening and closing mechanism 250 of the compression molding device 1. In addition, FIG6 shows a side cross-sectional view (schematic view) of the sealing mold 202 of the compression molding device 1.

The pressing unit 100B includes: a sealed mold 202, a pair of molds that can be opened and closed (for example, a plurality of mold blocks, mold plates, mold columns, etc. or other components made of alloy tool steel are assembled). In this embodiment, one of the molds on the upper side of the pair of molds in the vertical direction of the lead is set as the upper mold 204, and the other mold on the lower side is set as the lower mold 206. The sealed mold 202 is closed and opened by the upper mold 204 and the lower mold 206 approaching and moving away from each other. That is, the vertical direction of the lead (up and down direction) becomes the mold opening and closing direction.

The sealed mold 202 is opened and closed by a known mold opening and closing mechanism 250. As an example, as shown in FIG5 , the mold opening and closing mechanism 250 includes the following parts: a pair of templates 252, 254; a plurality of connecting mechanisms 256 for mounting a pair of templates 252, 254; and a driving source (such as an electric motor) 260 and a driving transmission mechanism (such as a ball screw or a toggle link mechanism) 262, so that the template 254 can move (lift and lower).

Here, the sealing mold 202 is arranged between a pair of templates 252 and 254 of the mold opening and closing mechanism 250. In this embodiment, the upper mold 204 is assembled to the fixed template (the template fixed to the connecting mechanism 256) 252, and the lower mold 206 is assembled to the movable template (the template that rises and falls along the connecting mechanism 256) 254. However, it is not limited to the above structure, and the upper mold 204 can be assembled to the movable template and the lower mold 206 can be assembled to the fixed template, or both the upper mold 204 and the lower mold 206 can be assembled to the movable template.

Next, the upper mold 204 of the sealing mold 202 is described in detail. As shown in FIG6 , the upper mold 204 includes an upper plate 222, a cavity insert 226, a clamp 228, etc., and is composed of these parts assembled. In this embodiment, a cavity 208 is provided on the lower surface of the upper mold 204 (the surface on the side of the lower mold 206).

More specifically, the cavity insert 226 is fixedly assembled relative to the lower surface of the upper plate 222. On the other hand, the clamp 228 is formed in a ring shape to surround the cavity insert 226, and is assembled in a manner that it is far away (floating) from the lower surface of the upper plate 222 and can move up and down through the force member 232. The cavity insert 226 constitutes the inner part (bottom) of the cavity 208, and the clamp 228 constitutes the side of the cavity 208. Here, in this embodiment, as shown in Figure 1, it becomes the following structure, that is, three groups of cavities 208 (208A, 208B, 208C in the figure) are arranged side by side in the X direction on an upper mold 204, and less than three workpieces W are resin-sealed together.

Here, a suction groove (not shown) is provided on the mold surface 206a of the lower mold 206 facing the clamp 228, which is connected to a suction device (not shown). In addition, by providing a sealing structure surrounding these parts, the suction device can be driven to reduce pressure, and the cavity 208 can be degassed in a closed mold state.

In addition, in this embodiment, a suction mechanism is provided to suck and hold the film F supplied from the film supply mechanism (described later) on the upper mold 204. As an example, the suction mechanism is connected to a suction device (not shown) via a suction path 230a and a suction path 230b provided through the clamp 228 and a suction path 230c provided through the upper plate 222 and the cavity insert 226. Specifically, one end of the suction path 230a, the suction path 230b, and the suction path 230c passes through the mold surface 204a of the upper mold 204, and the other end is connected to a suction device provided outside the upper mold 204. In this way, the suction device can be driven to suck the film F from the suction passages 230a, 230b, and 230c, so that the film F is adsorbed and held on the mold surface 204a including the inner surface of the cavity 208.

In this way, by providing the film F covering the inner surface of the cavity 208 and the mold surface 204a (a portion) of the upper mold 204, the resin R portion on the upper surface of the molded product Wp can be easily peeled off, so that the molded product Wp can be easily removed from the sealed mold 202 (in this case, the upper mold 204).

Furthermore, a gap of a predetermined size between the inner circumference of the clamp 228 and the outer circumference of the cavity insert 226 constitutes a part of the suction path 230a. Therefore, a sealing member 234 (such as an O-ring) is provided at a predetermined position of the gap to perform a sealing function when the film F is sucked.

In addition, in this embodiment, an upper mold heating mechanism is provided to heat the upper mold 204 to a predetermined temperature. The upper mold heating mechanism includes a heater (e.g., an electric heating wire heater), a temperature sensor, a power source, etc., and the heating is controlled by a control unit (all not shown). As an example, the heater is a structure as follows: it is built into the upper plate 222 or the mold base (not shown) that accommodates these parts, and mainly applies heat to the upper mold 204 as a whole and the resin R (described later). In this way, the upper mold 204 is adjusted and heated to a predetermined temperature (e.g., 100°C~200°C).

In addition, in this embodiment, there are provided a film supply mechanism 214A, a film supply mechanism 214B, and a film supply mechanism 214C, which convey (supply) a rolled film F having no opening (hole) on the sheet surface to the inside of the sealing mold 202. The film supply mechanism 214A, the film supply mechanism 214B, and the film supply mechanism 214C are configured such that an unused film F is delivered from the unwinding section 214a and supplied to the opened sealing mold 202, and after being used for resin sealing in the sealing mold 202, the film F is wound up by the winding section 214b as a used film F. Furthermore, the unwinding portion 214a and the winding portion 214b may be arranged oppositely in the Y direction, or may be arranged in the X direction in a manner of supplying a film F (neither of which is shown in the figure).

Next, the lower mold 206 of the sealing mold 202 is described in detail. As shown in FIG. 6 , the lower mold 206 includes a lower plate 224, a retaining plate 236, etc., and these parts are assembled to form a structure. Here, the retaining plate 236 is fixedly assembled relative to the upper surface of the lower plate 224 (the surface on the side of the upper mold 204).

In addition, in the present embodiment, a workpiece holding portion 205 is provided, and the workpiece holding portion 205 holds the workpiece W at a predetermined position on the upper surface of the holding plate 236. As an example, the workpiece holding portion 205 has a suction path 240a that passes through the holding plate 236 and the lower plate 224 and is connected to a suction device (not shown). Specifically, one end of the suction path 240a passes through the mold surface 206a of the lower mold 206, and the other end is connected to the suction device arranged outside the lower mold 206. Thereby, the suction device can be driven to suck the workpiece W from the suction path 240a, so that the workpiece W is adsorbed and held on the mold surface 206a (here, the upper surface of the holding plate 236). Furthermore, it can also be set as the following structure, that is, it is set together with the structure including the suction path 240a, and includes a holding claw (not shown) that clamps the outer periphery of the workpiece W.

In addition, in this embodiment, a lower mold heating mechanism is provided to heat the lower mold 206 to a predetermined temperature. The lower mold heating mechanism includes a heater (e.g., an electric heating wire heater), a temperature sensor, a power source, etc., and the heating is controlled by a control unit (all not shown). As an example, the heater is a structure as follows: it is built into the lower plate 224 or the mold base (not shown) that accommodates these parts, and mainly applies heat to the lower mold 206 as a whole and the workpiece W. In this way, the lower mold 206 is adjusted and heated to a predetermined temperature (e.g., 100°C~200°C).

Here, in this embodiment, the following structure is formed, that is, corresponding to the structure of the upper mold 204, that is, the structure in which three sets of mold cavities 208 are arranged side by side in the X direction (208A, 208B, 208C in the figure), three sets of workpiece holding parts 205 (205A, 205B, 205C in the figure) are arranged side by side in the X direction in a lower mold 206. Furthermore, it is not limited to the above structure, and it can also be set to the following structure, that is, three sets of mold cavities 208 and corresponding workpiece holding parts 205 are arranged side by side in the Y direction (not shown).

According to the structure, the number of operations of the molded product Wp of each set of sealing molds 202 can be limited to three at most, and the number of pressing units 100B can be suppressed to less than two (this embodiment is an example in which two pressing units 100B are provided). That is, compared with the previous device with the same number of operations (specifically, the number of operations of the molded product of each set of sealing molds is two and the number of pressing units is three), the number of times the material (workpiece W, sealing resin R, release film F) is supplied to the sealing mold 202 can be reduced, thereby improving productivity. In addition, since the number of pressing times (that is, the number of times the resin sealing step is performed) can be reduced, the manufacturing cost can be reduced. In addition, the overall miniaturization of the device and the reduction in device cost due to the simplification of the structure can be achieved.

(Resin supply unit)

Next, the resin supply unit 100C included in the compression molding device 1 is described in detail. Here, FIG. 7 shows a side cross-sectional view (schematic view) of the resin loader 304 of the compression molding device 1.

The resin supply unit 100C includes: a resin storage 302 for storing resin R; a distributor 312 for supplying resin R from the resin storage 302; and a resin loader 304 for conveying the supplied resin R into the sealed mold 202. Here, as shown in FIG. 3 and FIG. 4, the resin storage 302 is arranged on the lower side of the device relative to the workpiece storage 110 and the molded product storage 112 described later. In addition, three distributors 312 are provided in a manner that can simultaneously supply resin R to three extrusion plates 314 (described later) provided corresponding to three sets of mold cavities 208. However, it is not limited to the above structure. Furthermore, as a modification, the following structure may be adopted, namely, a mechanism for vibrating the extrusion plate 314 may be provided on the resin loader 304 to make the thickness of the resin R supplied to the extrusion plate 314 uniform (not shown).

In addition, the resin supply unit 100C includes a resin heater 306, which heats the resin R transported by the resin loader 304 at a position adjacent to the distributor 312. As an example, a known heating mechanism (e.g., an electric heating wire heater, an infrared heater, etc.) can be used for the resin heater 306. In this way, the surface of the granular resin R placed on the extrusion plate 314 can be heated and set to a molten or softened state, and dust (fine powder of the resin, etc.) can be prevented from being generated by the resin R during the transport process, thereby preventing the product from being poorly formed or the device from malfunctioning. Furthermore, a structure that does not include the resin heater 306 can also be used.

Here, as shown in FIG. 7 , the resin loader 304 is provided with: an extrusion plate 314 for placing the resin R dropped from the dispenser 312 on the upper surface 314a; and a shield 316 having a peripheral wall portion 316a, and the peripheral wall portion 316a surrounds the entire periphery until a position higher than the upper surface 314a of the extrusion plate 314. This embodiment is a structure in which three sets of cavities 208 are provided in an upper mold 204, and three workpieces W (e.g., long strip-shaped workpieces) are arranged in a lower mold 206 and resin sealing is performed together to obtain three molded products Wp at the same time. Therefore, three extrusion plates 314 are provided corresponding to the positions of the cavities 208. In addition, the shield 316 is configured such that the peripheral wall portion 316a surrounds the entire periphery of the three extrusion plates 314. That is, the shield 316 is configured as a frame provided around each extrusion plate 314. Furthermore, the number of operations of the molded product Wp can also be set to three or less.

The resin loader 304 of this embodiment is configured to be able to rise and fall (i.e., to be able to reciprocate in the Z direction). In addition, the resin loader 304 is provided with a moving attachment mechanism 315, which moves the extrusion plate 314 upward to extrude the loaded resin R toward the film F in the mold cavity 208. In this way, the resin loader 304 can be raised, and the peripheral wall portion 316a of the shield 316 can be brought into contact with the upper mold 204 (for example, the mold surface 204a of the clamp 228). Furthermore, in this state, the extrusion plate 314 can be moved upward by the moving attachment mechanism 315, and the resin R placed on the extrusion plate 314 is extruded toward the film F in the mold cavity 208 of the upper mold 204 heated to a predetermined temperature. Therefore, the heat of the upper mold 204 can be transferred to the resin R through the film F, so that the resin R becomes softened (melted) to generate adhesion force, and can be attached to the lower surface of the film F. Furthermore, as a modified example, the following structure can also be set, that is, the mechanism for raising and lowering the shield 316 is set on the resin loader 304, and the shield 316 is raised and lowered relative to the resin loader 304 (not shown).

The extrusion plate 314 is preferably a structure in which a surface treatment is applied on the upper surface 314a to prevent the resin R from attaching. Thus, after the resin R is extruded and attached to the film F, when the extrusion plate 314 is moved downward (descended), the resin R can be prevented from attaching to the extrusion plate 314 and being unable to be set on the upper mold 204.

In this embodiment, the resin loader 304 is a structure for moving the resin R into the sealing mold 202 along the X direction.

(Molded product storage unit)

Next, the molded product storage unit 100D included in the compression molding device 1 is described in detail.

The molded product storage unit 100D includes: a molded product storage 112 for storing molded products Wp; a molded product conveying unit 106 for conveying molded products Wp to the outside of the sealing mold 202; and a storage picker 122 for delivering molded products Wp from the molded product conveying unit 106 to the molded product storage 112. Here, as shown in FIG. 4, the molded product storage 112 is arranged on the upper side of the device relative to the resin storage 302. In addition, the molded product storage 112 can use a known stacking box, a slit box, etc.

The molded product loader 212 of the molded product conveying section 106 plays the role of receiving the molded product Wp from the sealing mold 202, conveying it, and delivering it to the slider 118. As a structural example, there are molded product holding sections 212A, 212B, and 212C arranged in three rows in the X direction and capable of holding one molded product Wp respectively. In addition, it is configured to be movable in the Y direction within the pressing unit 100B. Furthermore, for the molded product holding section 212A, 212B, and 212C, a known holding mechanism (for example, a structure having a holding claw for clamping, a structure having a suction hole connected to a suction device for adsorption, etc.) (not shown) can be used.

The slider 118 of the molded product conveying section 106 plays the role of receiving the molded product Wp from the molded product loader 212, conveying it, and delivering it to the storage picker 122. As a structural example, there are molded product holding sections 118A, 118B, and 118C arranged in three rows in the X direction and capable of holding one molded product Wp respectively. In addition, it is configured to be able to move between the pressing unit 100B and the molded product storage unit 100D along the guide 119. In addition, for the molded product holding section 118A, the molded product holding section 118B, and the molded product holding section 118C, a known holding mechanism (for example, a structure having a holding claw for clamping, a structure having a suction hole connected to a suction device for adsorption, etc.) (not shown) can be used.

According to the above structure, the molded product conveying unit 106 can be used to carry out at a time up to three molded products Wp sealed with resin and held in the mold cavity 208 (208A, 208B, 208C) of the upper mold 204 to the outside of the sealed mold 202.

In this embodiment, the molded product conveying unit 106 has the following structure: the molded product loader 212 moves in the Y direction, and the slider 118 moves in the X direction to carry the molded product Wp out of the sealing mold 202. In this way, by fixing the X axis of the molded product loader 212 of the molded product conveying unit 106, making the slider 118 movable in the X axis direction, and setting the molded product loader 212 in the pressing unit 100B, the garbage accumulated on the molded product loader 212 will not be scattered. However, it is not limited to this, and the molded product conveying unit 106 may also be set to the following structure: one molded product loader moves in the X direction and the Y direction to carry the molded product Wp out of the sealing mold 202 (not shown).

In the compression molding device 1 having the above structure, the workpiece loader 210 is a structure for carrying the workpiece W into the sealing mold 202 along the Y direction, and the molded product loader 212 is a structure for carrying the molded product Wp out of the sealing mold 202 along the Y direction. On the other hand, the resin loader 304 is a structure for carrying the resin R into the sealing mold 202 along the X direction. Thereby, the carrying path of the workpiece W and the carrying path of the molded product Wp relative to the sealing mold 202 can be made substantially non-overlapping with the carrying path of the resin R, and the workpiece conveying section 104 and the molded product conveying section 106 can be reliably separated from the resin conveying section 108. Therefore, foreign matter (burrs, etc.) generated by the molded product Wp or foreign matter (dust, etc.) generated by the resin R during the conveying process can be prevented from adhering to the workpiece W or the sealing mold 202, thereby improving the molding quality.

In addition, the workpiece storage 110 and the molded product storage 112 are arranged on the upper side of the device opposite to each other, and the resin storage 302 is arranged on the lower side of the device opposite to each other. Furthermore, the moving device 130 and the moving device 132 are arranged with the moving device 134 in a configuration orthogonal to each other in the moving direction. In this way, the overall size of the device can be compacted. In addition, these structures also contribute to the reliability of the separation of the workpiece conveying part 104 and the molded product conveying part 106 from the resin conveying part 108. Furthermore, since the operator can replace the workpiece storage 110 and the molded product storage 112 without bending over, the workability can be improved.

(Resin sealing action)

Next, with reference to FIGS. 8 to 11 , the operation of performing resin sealing using the compression molding device 1 of the present embodiment (i.e., the compression molding method of the present embodiment) is described. Here, the following structure is cited as an example, namely, three sets of mold cavities 208 are provided in an upper mold 204, and three workpieces W (e.g., long strip-shaped workpieces) are arranged in a lower mold 206 and resin sealed together, and three molded products Wp are obtained at the same time. However, the present invention is not limited to the above structure, and a structure for performing resin sealing on one or two workpieces W may also be provided.

First, a heating step (upper mold heating step) is performed by adjusting and heating the upper mold 204 to a predetermined temperature (e.g., 100°C to 200°C) by the upper mold heating mechanism. In addition, a heating step (lower mold heating step) is performed by adjusting and heating the lower mold 206 to a predetermined temperature (e.g., 100°C to 200°C) by the lower mold heating mechanism.

Next, as shown in FIG8 , the resin loader 304 conveys the three extrusion plates 314 together with the shield 316 surrounding the periphery of the extrusion plates 314 in such a manner that the three extrusion plates 314 are respectively located directly below the nozzles 312a of the three dispensers 312. At this time, the shield 316 (peripheral wall portion 316a) surrounds the entire periphery until it reaches a position higher than the upper surface 314a of the extrusion plates 314. In this state, a placing step is performed in which a predetermined amount of resin R is dropped (supplied) from the three nozzles 312a onto the upper surface 314a of each extrusion plate 314 and placed. As described above, the shield 316 is a frame that surrounds the entire periphery of the extrusion plate 314. Therefore, when the resin R is dropped, the resin R can be prevented from dripping from the extrusion plate 314. Furthermore, in this embodiment, the resin R is supplied in a more flat manner, but as a variation, the following step can also be performed after the loading step, that is, the extrusion plate 314 is vibrated, and the resin R loaded on the upper surface 314a of the extrusion plate 314 is spread to the outermost peripheral position and flattened (the thickness is made uniform).

Next, the following step is performed, namely: the resin R being transported by the resin loader 304 is heated (preheated) by the resin heater 306. For example, the resin R is preheated to a temperature (e.g., 60°C to 80°C) at which the resin R is not completely melted or dissolved by pressing or radiating heat of the heating portion, so that the particles of the resin R are fused (or softened) to each other and integrated. In this way, the surface of the granular resin R placed on the extrusion plate 314 can be fused (or softened), and dust (fine powder of the resin, etc.) can be prevented from being generated during the transport process, thereby preventing the product from being poorly formed or the device from being poorly operated. Furthermore, a structure that does not include the preheating step can also be used.

Next, the following step (film supply step) is performed, namely: the film supply mechanism 214A, the film supply mechanism 214B, and the film supply mechanism 214C convey (send) the film F from the unwinding section 214a to the winding section 214b, and the film F is supplied to the predetermined position of the sealing mold 202 (the position between the upper mold 204 and the lower mold 206).

Next, as shown in FIG9 , the following adsorption step (first adsorption step) is performed, that is, the film F is adsorbed and held on the mold surface 204a including the inner surface of the mold cavity 208 by the adsorption mechanism. Next, the following step is performed, that is, the resin R placed on the extrusion plate 314 is transported into the sealed mold 202 (between the upper mold and the lower mold) by the resin carrier 304. In this step, the resin carrier 304 is set to a state where it is arranged at a predetermined position in the sealed mold 202 (between the upper mold and the lower mold), and the resin carrier 304 is started to rise from this state. Furthermore, when the peripheral wall portion 316a of the shield 316 abuts against the upper mold 204 (in this case, the mold surface 204a of the clamp 228), the rise of the resin loader 304 is stopped.

Then, as shown in FIG. 10 , the moving attachment mechanism 315 is driven to start the rise of the extrusion plate 314. At this time, the following steps are performed, namely, only the extrusion plate 314 is moved upward (i.e., into the mold cavity 208) to extrude and attach the resin R placed on the upper surface 314a to the lower surface of the film F.

In this way, the resin R placed on the extrusion plate 314 can be extruded toward the film F in the mold cavity 208 of the upper mold 204 heated to a predetermined temperature. Therefore, the heat of the upper mold 204 can be transferred to the resin R through the film F, so that the resin R becomes softened (melted) and generates adhesion, and can be attached to the lower surface of the film F. Furthermore, the attachment step is preferably performed in a short time so that the movable attachment mechanism 315 is not heated by radiant heat or heat transfer through the resin R. In this regard, the resin R can be integrated in advance by performing the preheating step, and the attachment step of the resin R to the lower surface of the film F can be performed efficiently. Specifically, by integrating the resin R, the resin R can be attached to the lower surface of the film F in a short time. In addition, by integrating the resin R, the resin R particles can be prevented from remaining on the extrusion plate 314.

Next, as shown in FIG11 , the step of driving the movable attachment mechanism 315 to start the descent of the extrusion plate 314 and the step of starting the descent of the resin carrier 304 are implemented. Next, the step of moving the resin carrier 304 outside the sealing mold 202 is implemented (not shown).

Next, the step of conveying the workpiece W into the sealed mold 202 by the workpiece conveying unit 104 is implemented. The workpiece W is preheated by the heater of the slider 116 in advance, and then the workpiece W conveyed into the sealed mold 202 by the workpiece loader 210 is held at a predetermined position (not shown) of the lower mold 206. In this embodiment, three workpieces W are held in a side-by-side arrangement. Furthermore, the step of conveying the workpiece W into the sealed mold 202 by the workpiece conveying unit 104 can also be implemented before the step of attaching the resin R.

The subsequent steps are the same as the previous resin sealing method, and the following steps (resin sealing steps) are implemented, namely: the sealing mold 202 is closed, and the three workpieces W are clamped by the upper mold 204 and the lower mold 206 to perform resin sealing. At this time, in the three sets of mold cavities 208, each mold cavity insert 226 descends relatively, and the resin R is heated and pressurized for the three workpieces W. Thereby, the resin R is thermally hardened to complete the resin sealing (compression molding). Then, the following steps (molded product transporting step) are implemented, namely: the sealing mold 202 is opened, and the molded product Wp is taken out of the sealing mold 202 by the molded product transporting unit 106 and transported to the molded product storage unit 100D. In addition, the following step (film discharge step) is performed, namely: the film F is transported from the unwinding section 214a to the winding section 214b by the film supply mechanism 214A, the film supply mechanism 214B, and the film supply mechanism 214C, thereby delivering the used film F.

The above are the main actions of resin sealing using the compression molding device 1. However, the above step sequence is an example, and as long as there is no obstacle, the sequence can be changed or implemented in parallel. For example, in this embodiment, since it is a structure including two compression units 100B, the above actions can be implemented in parallel to efficiently form a molded product.

[Second implementation method]

Next, the second embodiment of the present invention is described. Compared with the first embodiment, this embodiment has a difference in the structure of the unit. The following description will focus on this difference. Here, FIG. 12 shows a plan view (schematic view) of the compression molding device 1 of the second embodiment.

The first embodiment is a structural example in which two pressing units 100B are provided, whereas the present embodiment is a structural example in which only one pressing unit 100B is provided. Specifically, along a predetermined direction (for example, the X direction in FIG. 12 ), the workpiece supply unit 100A, the pressing unit 100B, the resin supply unit 100C, and the molded product storage unit 100D are arranged in this order. Furthermore, the basic structure of the workpiece conveying unit 104, the molded product conveying unit 106, and the resin conveying unit 108 is the same as that of the first embodiment.

According to this embodiment, the number of press units 100B installed can be reduced compared to the first embodiment, so that the width dimension (X-direction dimension) of the device can be miniaturized and the device cost can be reduced due to the simplification of the structure. In addition, similar to the first embodiment, the X-axis of the workpiece carrier 210 of the workpiece conveying section 104 and the molded product carrier 212 of the molded product conveying section 106 is fixed, and the slider 116 and the slider 118 are movable in the X-axis direction, and the workpiece carrier 210 and the molded product carrier 212 are installed in the press unit 100B, so that the number of axes of the Y-axis can be reduced. In addition, garbage accumulated on the workpiece carrier 210 and the molded product carrier 212 will not be scattered. However, it is not limited to this, and a structure in which a loader moves in the X direction and the Y direction may also be provided (not shown). Furthermore, the above-mentioned unit configuration is effective in dust countermeasures because it can shorten the conveying distance of the workpiece W, but a structure in which the configuration of the pressing unit 100B and the resin supply unit 100C is replaced may also be adopted.

On the other hand, regarding the operation of performing resin sealing using the compression molding device 1 of this embodiment (i.e., the compression molding method of this embodiment), since the basic steps are the same as those of the first embodiment, repeated descriptions are omitted.

[Third implementation method]

Next, the third embodiment of the present invention is described. Compared with the first embodiment, this embodiment has a difference in the structure of the unit. The following description will focus on this difference. Here, FIG13 shows a plan view (schematic view) of the compression molding device 1 of the third embodiment.

This embodiment is a structural example in which other units are further added to the unit structure of the first embodiment. As an example of other units, it includes: a structure in which a volume measurement unit 100E for measuring the volume of the workpiece W is set in the workpiece supply unit 100A (or a structure in which it is set adjacent to the workpiece supply unit 100A), or a structure in which an appearance inspection unit 100F for inspecting the appearance of the molded product Wp is set in the molded product storage unit 100D (or a structure in which it is set adjacent to the molded product storage unit 100D).

As a specific structure, the volume measurement unit 100E of the workpiece W includes a workpiece table 502, a measuring unit 504, and a workpiece picker 506 that delivers the workpiece W from the workpiece table 502 to the slider 116. In addition, the appearance inspection unit 100F of the molded product Wp includes a molded product table 602, an inspection unit 604, and a molded product picker 606 that delivers the molded product Wp from the slider 118 to the molded product table 602.

The workpiece table 502 is provided with a workpiece holding portion, which is arranged in three rows in the X direction and can hold one workpiece W respectively. In addition, a known holding mechanism (for example, a structure having a holding claw for clamping, a structure having a suction hole connected to a suction device for adsorption, etc.) (not shown) can be used for the workpiece holding portion.

In addition, the measuring unit 504 is provided with one to three sets of laser measuring devices or image measuring units (not shown).

In addition, the workpiece picker 506 is provided with a workpiece holding portion, which is arranged in three rows in the X direction and can hold one workpiece W respectively. Furthermore, for the workpiece holding portion, a known holding mechanism (for example, a structure with a holding claw for clamping, a structure with a suction hole connected to a suction device for adsorption, etc.) (not shown) can be used. The workpiece picker 506 can also be set at a position adjacent to the slider 116 in the X direction in the workpiece supply unit 100A (not shown).

The molded product workbench 602 is provided with a molded product holding part, which is arranged in three rows in the X direction and can hold one molded product Wp respectively. In addition, a known holding mechanism (for example, a structure with holding claws for clamping, a structure with suction holes connected to a suction device for adsorption, etc.) can be used for the molded product holding part (not shown).

In addition, one to three sets of image units are provided in the inspection unit 604 (not shown).

In addition, the molded product picker 606 is provided with a molded product holding portion, which is arranged in three rows in the X direction and can hold one molded product Wp respectively. Furthermore, for the molded product holding portion, a known holding mechanism (for example, a structure having a holding claw for clamping, a structure having a suction hole connected to a suction device for adsorption, etc.) (not shown) can be used. The molded product picker 606 can also be set at a position adjacent to the slider 118 in the X direction in the molded product storage unit 100D (not shown).

According to the structure, the self-supply picker 120 can use the workpiece table 502 to hold up to three workpieces W at a time, and after the workpieces are moved in the X and Y directions and passed through the measuring unit 504 for volume measurement, the workpiece picker 506 is used to place the workpieces W on the slide 116.

In addition, the molded product picker 606 can be used to load the molded product from the slider 118, and the molded product workbench 602 can hold up to three molded products Wp at a time. After the molded products Wp are inspected by the inspection unit 604 through movement in the X and Y directions, they are delivered to the storage picker 122.

As described above, according to the present embodiment, expansion units (for example, the volume measuring unit 100E of the workpiece W (especially the mounting object) or the appearance inspection unit 100F of the molded product Wp in the third embodiment) can be easily added relative to the basic units (for example, the workpiece supply unit 100A, the pressing unit 100B, the resin supply unit 100C, and the molded product storage unit 100D in the first embodiment), thereby achieving a highly expandable device. Furthermore, the expansion unit is not limited to the volume measurement unit 100E of the workpiece W (especially the installation object) or the appearance inspection unit 100F of the molded product Wp. In addition, the installation position is not limited to the workpiece supply unit 100A or the molded product storage unit 100D. The volume measurement unit 100E can be installed adjacent to the workpiece supply unit 100A in the Y direction or the X direction. The appearance inspection unit 100F can also be installed adjacent to the molded product storage unit 100D in the Y direction or the X direction.

As other structural examples of the expansion unit, a volume measuring unit for the workpiece W (particularly a mounting object) may be disposed adjacent to the workpiece supply unit 100A (or disposed within the workpiece supply unit 100A), or an appearance inspection unit for the molded product Wp may be disposed adjacent to the molded product storage unit 100D (or disposed within the molded product storage unit 100D).

As described above, the compression molding device of the present invention can reduce the number of times the material is supplied to the sealing mold and the number of times the compression is performed compared to the previous device with the same number of molded products, thereby achieving improved productivity and reduced manufacturing costs. In addition, since the overall miniaturization of the device and the simplification of the structure can be achieved, the device cost can be reduced. Furthermore, since foreign matter such as burrs or dust of the resin can be prevented from adhering to the workpiece or the sealing mold, the molding quality can be improved.

Furthermore, the present invention is not limited to the above-mentioned implementation mode, and various changes can be made within the scope of the present invention. In particular, as a sealing resin, a granular, crushed, and powdered thermosetting resin is listed as an example for explanation, but it is not limited to this, and it can also be applied to a structure using a liquid, plate, sheet, etc. resin. For example, in the case of a structure using a sheet-like resin, it is sufficient to attach the originally flat and integrated sheet-like resin R to the lower surface of the film, and the resin sealing can be easily prepared.

In addition, in the above-mentioned embodiment, the following structure is described, namely: the heat of the upper mold is transferred to the resin through the film, the resin is set to a softened (melted) state to generate an adhesive force, thereby adhering the resin to the lower surface of the film, but the following structure can also be adopted, namely: a porous film is used, and the suction device is driven to suck the film from the suction path, thereby adsorbing the resin R and adhering it to the lower surface of the film F.

In addition, in the above-mentioned embodiment, a compression molding device is described as an example in which a sealing mold having three sets of cavities in the upper mold and three corresponding workpiece holding parts in the lower mold is used to seal three or less workpieces together with resin, but it is not limited to this, and the maximum number can also be set to four or more.

In addition, in the above-mentioned embodiment, a compression molding device including a cavity in the upper mold is cited as an example for explanation, but it can also be applied to a compression molding device including a cavity in the lower mold. In this case, regarding the supply of resin, a structure can be considered in which a resin shield (not shown) is used as a conveying clamp to convey the resin to the sealing mold in a state where the resin is placed on a film (e.g., a long film).

1: Compression molding device

100A: Workpiece supply unit

100B: Pressing unit

100C: Resin supply unit

100D: Molded product storage unit

100F: Appearance inspection unit

104: Workpiece transport unit

106: Molded product conveying section

108: Resin transport department

110: Workpiece storage

112: Molded product storage device

116: Sliding piece

116A, 116B, 116C: Workpiece holding part

117:Guide piece

118: Sliding part

118A, 118B, 118C: Molded product holding part

119:Guide piece

120: Supply Pickup

122: Storage Picker

130, 132, 134: Mobile devices

202: Sealing mold

205A, 205B, 205C: Workpiece holding part

208A, 208B, 208C: mold cavity

210: Workpiece loader

210A, 210B, 210C: Workpiece holding part

212: Molded product loader

212A, 212B, 212C: Molded product holding part

214a: Rolling out section

214b: Rolling section

214A, 214B, 214C: membrane supply mechanism

250:Mold opening and closing mechanism

300:Separator

302: Resin storage device

304: Resin loader

305:Guide piece

306: Resin heater

312: Allocator

314: Extrusion plate

316: Shield

W: Workpiece (formed product)

Wp: Molded product

F: Membrane (release membrane)

R: Resin (sealing resin)

Claims (5)

A compression molding device uses a sealing mold to seal three or less workpieces together with resin, wherein the sealing mold is provided with three sets of mold cavities in one of the upper mold or the lower mold, and is provided with three sets of corresponding workpiece holding parts in the other mold, and the compression molding device is characterized in that it includes: a workpiece supply unit for supplying the workpieces; a resin supply unit for supplying the resin; a pressing unit equipped with the sealing mold and performing resin sealing on the workpieces to process them into molded products; and a molded product storage unit for storing the molded products, and storing the molded products along a predetermined X direction according to the workpiece supply unit, the pressing unit, and the resin supply unit. The compression molding device further comprises: a workpiece conveying unit for conveying the workpiece between the workpiece supply unit and the pressing unit; a molded product conveying unit for conveying the molded product between the pressing unit and the molded product storage unit; and a resin conveying unit for conveying the resin between the resin supply unit and the pressing unit, and a partition is provided between the workpiece conveying unit and the molded product conveying unit and the resin conveying unit. The compression molding device as described in claim 1 is characterized in that the workpiece conveying unit has a workpiece loader, and the workpiece loader carries the workpiece into the sealing mold along the Y direction orthogonal to the X direction, and the resin conveying unit has a resin loader that carries the resin into the sealing mold along the X direction. The compression molding device as described in claim 1 is characterized in that it includes: a workpiece storage for accommodating the workpiece; a molded product storage for accommodating the molded product; and a resin storage for accommodating the resin, wherein the workpiece storage and the molded product storage are arranged on the upper side of the device opposite to each other, and the resin storage is arranged on the lower side of the device opposite to each other. The compression forming device as described in claim 1 is characterized in that it further includes a volume measuring unit for measuring the volume of the workpiece, and the volume measuring unit is arranged in the workpiece supply unit or at a position adjacent to the workpiece supply unit. The compression molding device as described in claim 1 is characterized in that it further includes an appearance inspection unit for performing appearance inspection of the molded product, and the appearance inspection unit is arranged in the molded product storage unit or at a position adjacent to the molded product storage unit.

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