TWI885245B - Resin sealing device and resin sealing method - Google Patents

Abstract

The present invention provides a resin sealing device and a resin sealing method, which can realize the solution of the problem of the structure with a cavity in the lower mold, and the damage to the workpiece is small during the resin sealing, and the molding quality can be improved. The resin sealing device 1 of the present invention uses a sealing mold 202 including an upper mold 204 and a lower mold 206, and uses resin R to seal a workpiece W with an electronic component Wb mounted on a substrate Wa to process it into a molded product Wp, and includes: a heating mechanism that heats the upper mold 204 to a predetermined temperature; an adsorption mechanism that sucks and holds a film F in a cavity 208 arranged on the lower surface side of the upper mold 204; an extrusion member 214 that carries the resin R on the upper surface 214a; and a moving and attaching mechanism 215 that moves the extrusion member 214 upward to extrude and attach the carried resin R to the lower surface of the film F in the cavity 208 of the upper mold 204 that has been heated to a predetermined temperature.

Description

Resin sealing device and resin sealing method

The present invention relates to a resin sealing device and a resin sealing method.

As an example of a resin sealing device and a resin sealing method for sealing a workpiece having electronic components mounted on a substrate with a sealing resin (hereinafter sometimes referred to as "resin") to form a molded product, there is known a method using compression molding.

The compression molding method is a technology that supplies a predetermined amount of resin to a sealed area (cavity) provided in a sealed mold including an upper mold and a lower mold, and arranges a workpiece in the sealed area, and performs resin sealing by clamping the upper mold and the lower mold. As an example, when using a sealed mold having a cavity provided in the upper mold, there is a known technology that supplies resin to the center position on the workpiece for molding. On the other hand, when using a sealed mold having a cavity provided in the lower mold, there is a known technology that covers the mold surface including the cavity with a film and supplies resin with uniform thickness for molding (refer to Patent Document 1: Japanese Patent Publication No. 2019-145550). [Prior Technical Document] [Patent Document]

[Patent Document 1] Japanese Patent Publication No. 2019-145550

[Problems to be solved by the invention] In the previous compression molding method, it is considered that the structure in which the lower mold has a cavity and the resin is liquefied in the cavity to perform resin sealing is less prone to damage, especially for workpieces equipped with electronic parts with leads. On the other hand, in the structure in which the lower mold has a cavity, there are problems such as difficulty in evenly supplying (distributing) the resin to the outermost position in the cavity, resulting in deterioration of molding quality. In addition, there is a problem that in order to ensure good molding quality, it is important not to leak (drip) the resin from the cavity, but when granular resin is dispersed, the air contained in the gaps between the particles foams due to heating or decompression, so it is easy to cause resin leakage. [Methods to solve the problem]

The present invention is made in view of the above situation, and its purpose is to provide a resin sealing device and a resin sealing method, which adopts a structure with a mold cavity in the upper mold to achieve a solution to the above problem of a structure with a mold cavity in the lower mold, and reduces damage to the workpiece during resin sealing, and can improve the molding quality.

The present invention solves the above-mentioned problem by means of the solution described below as one embodiment.

The resin sealing device of the present invention uses a sealing mold including an upper mold and a lower mold, and uses resin to seal a workpiece having electronic components mounted on a substrate to process it into a molded product, and its essential elements include: a heating mechanism for heating the upper mold to a predetermined temperature; an adsorption mechanism for sucking and retaining a film in a mold cavity arranged on the lower surface side of the upper mold; an extrusion member for placing the resin on the upper surface; and a moving and attaching mechanism for moving the extrusion member upward to extrude the placed resin in the mold cavity of the upper mold heated to a predetermined temperature and attach it to the lower surface of the film.

Therefore, in the conventional structure with a cavity in the lower mold, there are the following problems in particular, namely, it is difficult to prevent the granular resin from leaking from the cavity, and it is difficult to spread the resin to the outermost peripheral position in the cavity, which easily deteriorates the molding quality, and further, the granular resin is accumulated in a state where there are gaps between the particles, and the resulting volume expansion causes air foaming (defoaming) in the gaps between the resin during molding, which easily causes the resin to leak, etc. However, by adopting a structure with a cavity in the upper mold, it is possible to solve these problems. Furthermore, during resin sealing, damage to workpieces, especially those equipped with electronic components with leads, is not worse than in a structure in which the lower mold has a cavity, and the resin can be evenly spread to the outermost position in the cavity, thereby improving molding quality.

Furthermore, it is preferred that the device further comprises: a shield having a peripheral wall portion, the peripheral wall portion surrounding the entire periphery to a position higher than the upper surface of the extrusion member; and a shield moving mechanism, which moves the shield upward along with the extrusion member, and is configured in the following manner: when the peripheral wall portion of the shield abuts against the upper mold, the extrusion member can move upward relative to the shield. Thus, the resin placed on the extrusion member can be transported into the mold cavity without leakage (drip). Furthermore, when the shield abuts against the upper mold, the extrusion member can be further moved upward to enter the mold cavity, and the resin can be attached to the film without leakage (drip) from the mold cavity.

Furthermore, it is preferable to further include a vibration mechanism for vibrating the extrusion member on which the resin is placed. Thus, when the granular, crushed, or powdered resin is placed on the extrusion member, the extrusion member is vibrated in the shield during attachment, so that the resin placed on the upper surface of the extrusion member can be attached to the film with a uniform thickness. Therefore, it is possible to prevent the occurrence of poor forming and stabilize the forming quality.

Furthermore, it is preferred that the method further comprises: a preheating mechanism for heating the resin before being attached to the lower surface of the film. Thus, the resin particles can be fused and integrated with each other, thereby making the resin attached to the lower surface of the film in a short time, and preventing the resin particles from being retained in the extrusion member.

Furthermore, it is preferred that the extrusion member is subjected to a surface treatment on the upper surface to prevent the resin from adhering. Thus, after the resin is extruded and attached to the film, when the extrusion member is moved downward (descended), the following undesirable situation can be prevented from occurring, i.e., the resin adheres to the extrusion member and cannot be set on the upper mold.

Moreover, the resin sealing method of the present invention uses a sealing mold including an upper mold and a lower mold, and processes a workpiece having electronic components mounted on a substrate into a molded product by sealing the workpiece with a resin, and its essential elements include: a heating step of heating the upper mold to a predetermined temperature; a first adsorption step of sucking and holding a film in the mold cavity of the upper mold; a loading step of loading the resin on the upper surface of an extrusion member; and a moving and attaching step of moving the extrusion member with the resin mounted on the upper surface upward to extrude the resin and attach it to the film. [Effect of the invention]

According to the present invention, a resin sealing device and a resin sealing method can be provided, which can solve the above-mentioned problem by adopting a structure with a cavity in the upper mold, thereby realizing a structure with a cavity in the lower mold. Moreover, the damage to the workpiece during resin sealing is small, and the molding quality can be improved.

[First embodiment] (Overall structure) The first embodiment of the present invention is described in detail below with reference to the drawings. FIG. 1 is a plan view (schematic view) showing an example of a resin sealing device 1 of the present embodiment. FIG. 2 is a side sectional view (schematic view) showing an example of a sealing mold 202 of the resin sealing device 1, and FIG. 3 is a side sectional view (schematic view) showing an example of an extrusion member 214 and a shield 216 of the resin sealing device 1. In addition, for the convenience of explanation, arrows are sometimes used in the figure to illustrate the front and rear, left and right, and up and down directions of the resin sealing device 1. In addition, in all the figures used to illustrate each embodiment, the same symbols are sometimes marked on components with the same function, and their repeated descriptions are omitted.

The resin sealing device 1 of the present embodiment is a device for resin-sealing a workpiece (molded product) W using a sealing mold 202 including an upper mold 204 and a lower mold 206. Hereinafter, as the resin sealing device 1, a compression molding device is described as an example, wherein the compression molding device holds the workpiece W using the lower mold 206, covers a mold cavity 208 (including a portion of the mold surface 204a) provided in the upper mold 204 with a release film (hereinafter sometimes referred to as "film") F, supplies resin R, performs a clamping action between the upper mold 204 and the lower mold 206, and resin-seales the workpiece W using the resin R.

First, the workpiece W as the forming object has the following structure, that is, a plurality of electronic components Wb are mounted in a matrix on a substrate Wa. More specifically, examples of the substrate Wa include: a resin substrate, a ceramic substrate, a metal substrate, a carrier plate, a lead frame, a wafer and other plate-shaped components (so-called short workpieces) formed in a short strip shape. Also, examples of electronic components Wb include semiconductor chips, micro-electromechanical systems (MEMS) chips, passive components, heat sinks, conductive components, spacers, etc. Furthermore, as other examples of the substrate Wa, the following structure can also be used, that is, using the components (not shown) formed in a circular shape, a square shape, etc.

As an example of a method of mounting the electronic component Wb on the substrate Wa, there is a mounting method using wire bonding packaging, flip chip packaging, etc. Alternatively, in the case of a structure in which the substrate (glass or metal pallet) Wa is peeled off from the molded product after resin sealing, there is also a method of attaching the electronic component Wb using a heat-peelable adhesive tape or a UV-curable resin that is cured by UV irradiation.

On the other hand, examples of the resin R include thermosetting resins in granular (including cylindrical, etc.), crushed, or powdered form (sometimes collectively referred to as "granular" in this application) (e.g., epoxy resins containing fillers, etc.). The resin R is not limited to the above-mentioned states, but may be in other states (shapes) such as liquid, plate, or sheet, and may be a resin other than epoxy thermosetting resins.

Moreover, as an example of the membrane F, a membrane material having excellent heat resistance, ease of peeling, softness, and stretchability can be preferably used, such as polytetrafluoroethylene (PTFE), ethylene-tetrafluoroethylene copolymer (ETFE) (polytetrafluoroethylene polymer), polyethylene terephthalate (PET), fluorinated ethylene propylene (FEP), fluorine-impregnated glass cloth, polypropylene, polyvinylidene chloride, etc. In this embodiment, a rolled membrane can be used as the membrane F. Furthermore, as a variation, a structure using a short strip of membrane can also be set (not shown). Moreover, as the membrane F, a dense membrane that does not allow air to pass through can be used, and a porous membrane that allows air to pass through can also be used.

Next, the resin sealing device 1 of the present embodiment is described in general terms. As shown in FIG1 , the resin sealing device 1 includes the following parts as main structures: a workpiece processing unit 100A, which mainly supplies the workpiece W and stores the molded product Wp after resin sealing; a pressing unit 100B, which mainly supplies and stores (discards) the film F, and processes the workpiece W into a molded product Wp by resin sealing; and a dispensing unit 100C, which mainly supplies the resin R. Furthermore, in the present embodiment, the following structure is cited as an example for description, namely: two cavities 208 are provided in an upper mold 204, and two workpieces W (e.g., short strip-shaped workpieces) are arranged in a lower mold 206 and resin sealing is performed together, and two molded products Wp are obtained at the same time. However, the present invention is not limited thereto, and the following structure may be adopted, namely, a cavity is provided in an upper mold 204, and a workpiece W (for example, a circular or square workpiece) is disposed in a lower mold 206 and resin-sealed to obtain a molded product Wp (not shown).

In this embodiment, the workpiece processing unit 100A, the pressing unit 100B and the dispensing unit 100C are arranged side by side in order from right to left along the left-right direction. Furthermore, an arbitrary number of guide rails (not shown) are arranged in a straight line across each unit, and the first loader 210 for conveying the workpiece W and the molded product Wp and the second loader 212 for conveying the resin R are arranged so as to be movable along an arbitrary guide rail between predetermined units.

Furthermore, the overall structural state of the resin sealing device 1 can be changed by changing the structure of the unit. For example, the structure shown in FIG. 1 is an example in which three pressing units 100B are provided, but it can also be a structure in which only one pressing unit 100B is provided, or two or more pressing units 100B are provided. Moreover, it can also be a structure in which other units are provided (all not shown).

(Workpiece processing unit) Next, the workpiece processing unit 100A included in the resin sealing device 1 is described in detail.

The workpiece processing unit 100A includes a supply magazine 102 for storing a plurality of workpieces W and a storage magazine 112 for storing a plurality of molded products Wp. Here, the supply magazine 102 and the storage magazine 112 may be a known stack magazine, slit magazine, or the like.

Next, the workpiece processing unit 100A includes: a supply rail 104, which is arranged at the rear of the supply cassette 102 and carries the workpiece W taken out from the supply cassette 102. In this embodiment, the workpiece W is supplied from the supply cassette 102 to the supply rail 104 via the relay rail 106 using a known pusher or the like (not shown). Similarly, the workpiece processing unit 100A includes: a storage rail (not shown), which is arranged at the rear of the storage cassette 112 and carries the molded product Wp taken out from the sealing mold 202. In this embodiment, the molded product Wp is stored from the storage rail (not shown) to the storage cassette 112 via the relay rail (not shown) using a known pusher or the like (not shown).

Next, the workpiece processing unit 100A includes a first loader 210 for transporting the workpiece W and the molded product Wp. Specifically, the first loader 210 includes: a first holding portion 210A, which has a holding mechanism on its lower surface to hold the workpiece W on the supply rail 104 and transport it to a predetermined holding position of the lower mold 206. In addition, the first loader 210 includes: a second holding portion 210B, which has a holding mechanism on its lower surface to hold the resin-sealed molded product Wp on the lower mold 206 and transport it to a predetermined position outside the sealed mold 202 (for example, on the storage rail, etc.). Here, the holding mechanism of the workpiece W in the first holding portion 210A becomes the following structure: two rows are arranged side by side in the left-right direction in a manner that can hold two workpieces W on the supply rail 104. Furthermore, the holding mechanism of the molded product Wp in the second holding portion 210B is a structure in which two rows are arranged side by side in the left-right direction so as to hold two molded products Wp on the lower mold 206. By including these structures, the first loader 210 can hold and transport two workpieces W and molded products Wp in parallel with their long sides parallel to each other. In addition, as for the holding mechanism, a known holding mechanism (for example, a clamping structure having holding claws, a structure having a suction hole connected to a suction device and adsorbing, etc.) (not shown) can be used.

Furthermore, the workpiece processing unit 100A includes a workpiece heater 116 for heating the workpiece W conveyed by the first loader 210 from the lower surface side (substrate Wa side). As an example, a known heating mechanism (such as an electric heating wire heater, an infrared heater, etc.) can be used for the workpiece heater 116. Thus, the workpiece W can be preheated before being conveyed into the sealing mold 202 for heating. Furthermore, a structure without the workpiece heater 116 may be used.

(Pressure unit) Next, the pressure unit 100B included in the resin sealing device 1 is described in detail.

The pressing unit 100B includes: a sealed mold 202, a pair of molds that can be opened and closed (for example, a plurality of mold blocks, mold plates, mold columns, etc. or other components made of alloy tool steel are assembled). In this embodiment, one of the molds on the upper side of the pair of molds in the vertical direction is set as the upper mold 204, and the other mold on the other side is set as the lower mold 206. The sealed mold 202 is closed and opened by the upper mold 204 and the lower mold 206 approaching and moving away from each other. That is, the vertical direction (up and down direction) becomes the mold opening and closing direction.

Furthermore, the sealed mold 202 is opened and closed by a known mold opening and closing mechanism (not shown). For example, the mold opening and closing mechanism includes the following parts: a pair of platens, a plurality of connection mechanisms (tie bars or columns) for mounting the pair of platens, a drive source (e.g., an electric motor) for making the platens movable (lifting), and a drive transmission mechanism (e.g., a toggle link), etc. (all not shown).

Here, the sealing mold 202 is disposed between a pair of mold plates of the mold opening and closing mechanism. In this embodiment, the upper mold 204, which is a fixed mold, is assembled to the fixed mold plate (a mold plate fixed to the connecting mechanism), and the lower mold 206, which is a movable mold, is assembled to the movable mold plate (a mold plate that rises and falls along the connecting mechanism). However, the present invention is not limited to this structure, and the upper mold 204 may be set as a movable mold and the lower mold 206 may be set as a fixed mold, or both the upper mold 204 and the lower mold 206 may be set as movable molds.

Next, the upper mold 204 of the sealing mold 202 is described in detail. As shown in FIG2 , the upper mold 204 includes an upper plate 222, a cavity insert 226, and a clamp 228, etc., which are assembled and constituted. In this embodiment, a cavity 208 is provided on the lower surface of the upper mold 204 (the surface on the side of the lower mold 206).

More specifically, the cavity insert 226 is fixedly assembled relative to the lower surface of the upper plate 222. On the other hand, the clamp 228 is formed in a ring shape so as to surround the cavity insert 226, and is assembled so as to be separated (floating) from the lower surface of the upper plate 222 and movable up and down via a pressure member 232. The cavity insert 226 constitutes the inner part (bottom) of the cavity 208, and the clamp 228 constitutes the side of the cavity 208. Furthermore, in this embodiment, as shown in FIG. 1, the following structure is obtained, namely: two cavities 208 are arranged side by side in the left-right direction in one upper mold 204, and resin sealing is performed simultaneously on two workpieces W as a unit. However, it is not limited to this structure.

Here, a suction groove (not shown) is provided on the mold surface 206a of the lower mold 206 facing the clamp 228, which is connected to a suction device (not shown). Moreover, by providing a sealing structure surrounding these parts, the suction device can be driven to reduce pressure, and the cavity 208 can be degassed in a closed mold state.

Furthermore, in this embodiment, a suction mechanism is provided to suck and hold the film F supplied from the film supply mechanism 250 (described later) to the upper mold 204. As an example, the suction mechanism is connected to a suction device (not shown) via a suction path 230a and a suction path 230b provided through the clamp 228 and a suction path 230c provided through the upper plate 222 and the cavity insert 226. Specifically, one end of the suction path 230a, the suction path 230b, and the suction path 230c is connected to the mold surface 204a of the upper mold 204, and the other end is connected to a suction device provided outside the upper mold 204. Thus, the suction device can be driven to suck the film F from the suction passages 230 a , 230 b , and 230 c , so that the film F is adsorbed and held on the mold surface 204 a including the inner surface of the cavity 208 .

In this way, by providing the film F covering the inner surface of the cavity 208 and the mold surface 204a (a portion) of the upper mold 204, the resin R portion on the upper surface of the molded product Wp can be easily peeled off, so that the molded product Wp can be easily removed from the sealed mold 202 (upper mold 204).

Furthermore, a gap of a predetermined size between the inner circumference of the clamp 228 and the outer circumference of the cavity insert 226 constitutes a part of the suction path 230a. Therefore, a sealing member 234 (such as an O-ring) is arranged at a predetermined position of the gap to perform a sealing function when the film F is sucked.

Moreover, in this embodiment, an upper mold heating mechanism is provided to heat the upper mold 204 to a predetermined temperature. The upper mold heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a control unit, a power source, etc. (all not shown), and performs heating and control. As an example, the heater is a structure as follows: it is built into the upper plate 222 or the mold base (not shown) that accommodates these parts, and mainly applies heat to the upper mold 204 as a whole and the resin R (described later). In this way, the upper mold 204 is adjusted and heated to a predetermined temperature (e.g., 100°C to 200°C).

In addition, in the present embodiment, a film supply mechanism 250 is provided, and the film supply mechanism 250 conveys (supplies) a rolled film F having no opening (hole) on the sheet surface to the inside of the sealing mold 202. The film supply mechanism 250 has the following structure: it includes a roll-out section 252 and a winding section 254, and conveys the film F from the roll-out section 252 to the winding section 254. In this way, the film F is supplied to the sealing mold 202 disposed between the roll-out section 252 and the winding section 254. That is, as shown in FIG. 1, the unused film F sent out from the roll-out section 252 is supplied to the sealing mold 202 after the mold is opened, and is used for resin sealing in the sealing mold 202, and the used film F is wound by the winding section 254. Furthermore, a series of steps are controlled by a control unit (not shown) provided in the resin sealing device 1.

Next, the lower mold 206 of the sealing mold 202 is described in detail. As shown in FIG2 , the lower mold 206 includes a lower plate 224 and a cavity plate 236, and these parts are assembled and constituted. Here, the cavity plate 236 is fixedly assembled relative to the upper surface of the lower plate 224 (the surface on the side of the upper mold 204).

Moreover, in the present embodiment, a workpiece holding mechanism is provided, which holds the workpiece W at a predetermined position on the lower surface of the cavity plate 236. As an example, the workpiece holding mechanism is connected to a suction device (not shown) via a suction path 240a provided through the cavity plate 236 and the lower plate 224. Specifically, one end of the suction path 240a is connected to the mold surface 206a of the lower mold 206, and the other end is connected to a suction device provided outside the lower mold 206. Thus, the suction device can be driven to suck the workpiece W from the suction path 240a, so that the workpiece W is adsorbed and held on the mold surface 206a (here, the upper surface of the cavity plate 236). Furthermore, a structure including holding claws (not shown) for clamping the outer periphery of the workpiece W may be provided together with the structure including the suction path 240a.

Furthermore, in this embodiment, the following structure is adopted: corresponding to the structure of the upper mold 204 (a structure in which two mold cavities 208 are arranged side by side in the left-right direction), two workpiece holding mechanisms are arranged side by side in the left-right direction in one lower mold 206, and resin sealing is performed simultaneously with two workpieces W as a unit. However, the present invention is not limited to this structure.

Moreover, in this embodiment, a lower mold heating mechanism is provided to heat the lower mold 206 to a predetermined temperature. The lower mold heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a control unit, a power source, etc. (all not shown), and performs heating and control. As an example, the heater is a structure as follows: it is built into the lower plate 224 or the mold base (not shown) that accommodates these parts, and mainly applies heat to the lower mold 206 as a whole and the workpiece W. Thereby, the lower mold 206 is adjusted and heated to a predetermined temperature (e.g., 100°C to 200°C).

(Dispensing unit) Next, the dispensing unit 100C included in the resin sealing device 1 is described in detail.

The dispensing unit 100C includes a dispenser 312 for supplying resin R and a second loader 212 for conveying the supplied resin into the sealed mold 202. In the present embodiment, two dispensers 312 are provided so as to simultaneously supply resin R to two extrusion members 214 (described later) provided corresponding to the two cavities 208.

Furthermore, the dispensing unit 100C includes a resin heater 314, which heats the resin R conveyed by the second loader 212 at a position adjacent to the dispenser 312. As an example, a known heating mechanism (such as an electric heating wire heater, an infrared heater, etc.) can be used for the resin heater 314. In this way, the surface of the granular resin R placed on the extrusion member 214 can be heated and set to a molten or softened state, and dust (fine powder of the resin, etc.) can be prevented from being generated during conveyance, and poor molding of the product or poor operation of the device can be prevented. Furthermore, a structure that does not include the resin heater 314 can also be set.

Here, the second loader 212 is provided with: an extrusion member 214 for placing the resin R dropped from the dispenser 312 on the upper surface 214a; and a shield 216 having a peripheral wall portion 216a, and the peripheral wall portion 216a surrounds the entire periphery until a position higher than the upper surface 214a of the extrusion member 214. This embodiment is a structure in which two cavities 208 are provided in one upper mold 204, and two workpieces W (e.g., short strip-shaped workpieces) are arranged in one lower mold 206 to perform resin sealing together, and two molded products Wp are obtained at the same time, so two extrusion members 214 corresponding to the positions of the cavities 208 and a shield 216 surrounding the entire periphery of the extrusion members 214 are provided. That is, the shield 216 is configured as a frame provided around each extrusion member 214. Furthermore, as an example, a structure in which one shield 216 surrounds two extrusion members 214 is provided, but as a modified example, a structure in which two shields 216 (not shown) are provided to surround two extrusion members 214, respectively, may be provided.

Furthermore, the second carrier 212 is provided with a moving attachment mechanism 215 for moving the extrusion member 214 upward to extrude the resin R placed therein toward the film F in the cavity 208, and a shield moving mechanism 217 for moving the shield 216 upward along with the extrusion member 214. At this time, the extrusion member 214 is configured such that the extrusion member 214 can move upward relative to the shield 216 in a state where the peripheral wall portion 216a of the shield 216 abuts against the upper mold 204 (for example, the mold surface 204a of the clamp 228).

According to the above structure, the extrusion member 214 can be moved upward by the moving attachment mechanism 215, and the shield 216 can be moved upward by the shield moving mechanism 217 at the same time. Then, the movement of the shield 216 can be stopped in a state where the peripheral wall portion 216a of the shield 216 abuts against the upper mold 204, and the extrusion member 214 can be moved upward by the moving attachment mechanism 215. Then, in the mold cavity 208 of the upper mold 204 heated to a predetermined temperature, the resin R placed on the extrusion member 214 can be extruded toward the film F, so that the resin R is attached to the lower surface of the film F (the surface on the lower mold 206 side).

Furthermore, the extrusion member 214 is preferably a structure in which the upper surface 214a is subjected to a surface treatment to prevent the adhesion of the resin R. This is because after the resin R is extruded and attached to the film F, when the extrusion member 214 is moved downward (descended), the following undesirable situation can be prevented, that is, the resin R adheres to the extrusion member 214 and cannot be set on the upper mold 204.

(Resin sealing action) Next, with reference to FIGS. 4 to 10 , the action of performing resin sealing using the resin sealing device 1 of the present embodiment (i.e., the resin sealing method of the present embodiment) is described. Here, the following structure is cited as an example, namely, two cavities 208 are provided in an upper mold 204, and two workpieces W (e.g., short strip-shaped workpieces) are arranged in a lower mold 206 and resin sealing is performed together, and two molded products Wp are obtained at the same time.

First, a heating step (upper mold heating step) is performed by adjusting and heating the upper mold 204 to a predetermined temperature (e.g., 100°C to 200°C) by the upper mold heating mechanism. Furthermore, a heating step (lower mold heating step) is performed by adjusting and heating the lower mold 206 to a predetermined temperature (e.g., 100°C to 200°C) by the lower mold heating mechanism.

Next, as shown in FIG. 4 , the second carrier 212 conveys the two extrusion members 214 together with the shield 216 surrounding the periphery of the extrusion members 214 so that the two extrusion members 214 are respectively located directly below the nozzles 312a of the two dispensers 312. At this time, the shield 216 (peripheral wall 216a) surrounds the entire periphery of the extrusion members 214 until a position higher than the upper surface 214a of the extrusion members 214. In this state, a placement step is performed in which a predetermined amount of resin R is dropped (supplied) from the two nozzles 312a onto the upper surface 214a of each extrusion member 214 and placed. As described above, the shield 216 is a frame body provided to surround the entire periphery of the outer periphery of the extrusion member 214. Therefore, when the resin R is cast, the resin R can be prevented from dripping from the extrusion member 214.

After the placing step, as shown in Fig. 5, it is preferred to perform the following step, that is, vibrate the extrusion member 214 and the shield 216 to spread the resin R placed on the upper surface 214a of the extrusion member 214 to the outermost peripheral position and to make the thickness uniform. In addition, the resin R may be supplied evenly from the beginning.

Then, the resin R being transported by the second loader 212 may be heated (preheated) by the resin heater 314. For example, the resin R may be preheated to a temperature (e.g., 60° C.) at which the resin R is completely melted or dissolved by pressing or radiating heat of the heated portion, so that the particles of the resin R are fused and integrated.

Next, the following step (film supply step) is performed, namely: the film supply mechanism 250 conveys (delivers) the film F from the unwinding section 252 to the winding section 254, and supplies the film F to a predetermined position of the sealing mold 202 (a position between the upper mold 204 and the lower mold 206).

Next, as shown in FIG6 , the following adsorption step (first adsorption step) is performed, that is, the film F is adsorbed and held on the mold surface 204a including the inner surface of the mold cavity 208 by the adsorption mechanism. At the same time (or before and after), the extrusion member 214 and the shield 216 are transported into the sealing mold 202 (between the upper mold and the lower mold) by the second loader 212.

From this state, the following moving and attaching steps are performed. Specifically, as shown in FIG7 , the extrusion member 214 is moved upward by the moving and attaching mechanism 215, and the shield 216 is moved upward by the shield moving mechanism 217. Here, when the peripheral wall portion 216a of the shield 216 abuts against the upper mold 204 (in this case, the mold surface 204a of the clamp 228), the movement of the shield 216 stops.

From this state, as shown in FIG. 8 , the following steps are performed, namely: by moving the attaching mechanism 215, the extruding member 214 is moved further upward (i.e., into the mold cavity 208), and the resin R placed on the upper surface 214a is extruded and attached to the lower surface of the film F.

According to this structure, the resin R placed on the extrusion member 214 can be extruded toward the film F in the mold cavity 208 of the upper mold 204 heated to a predetermined temperature. Therefore, the heat of the upper mold 204 can be transferred to the resin R through the film F, so that the resin R becomes softened (melted) and generates adhesion, and the effect of adhering to the lower surface of the film F can be obtained. Furthermore, the attachment step is preferably performed in a short time so that the moving attachment mechanism 215 is not heated by radiant heat or heat transfer through the resin R. In this regard, the step of attaching the resin R to the lower surface of the film F can be efficiently performed by performing the step of integrating the resin R in advance as described above. Specifically, the resin R can be attached to the lower surface of the film F in a short time by integrating the resin R. Furthermore, the resin R can be prevented from being retained in the extrusion member 214 by integrating the resin R.

From this state, as shown in FIG. 9 , the following steps are performed, namely, the pressing member 214 is moved downward by the moving attachment mechanism 215 , and the shield 216 is moved downward by the shield moving mechanism 217 .

Next, a step of conveying the workpiece W into the sealed mold 202 by the first carrier 210 is performed. After preheating the workpiece W being conveyed by the first carrier 210 by the workpiece heater 116, the workpiece W conveyed by the first carrier 210 into the sealed mold 202 is held at a predetermined position of the lower mold 206 as shown in FIG. 10 . In this embodiment, two workpieces W are held in a side-by-side arrangement. Furthermore, the step of conveying the workpiece W into the sealed mold 202 by the first carrier 210 may also be performed before the step of attaching the resin R.

As for the subsequent steps, similarly to the previous resin sealing method, the sealing mold 202 is closed and the two workpieces W are clamped by the upper mold 204 and the lower mold 206. At this time, in the two mold cavities 208, the cavity inserts 226 are lowered relative to each other, and the resin R is heated and pressurized for the two workpieces W. Thereby, the resin R is thermally hardened and the resin sealing (compression molding) is completed. Then, the sealing mold 202 is opened and the two molded products Wp are separated from the used film F. Then, the two molded products Wp are transported from the sealing mold 202 by the first loader 210. Then, a step of conveying the film F from the unwinding section 252 to the winding section 254 by the film supply mechanism 250 to thereby deliver the used film F (film discharging step) is implemented.

The above is the main operation of resin sealing using the resin sealing device 1. However, the above step sequence is an example, and as long as there is no problem, the sequence can be changed or implemented in parallel. For example, in this embodiment, a resin sealing device including a plurality of (three as an example) pressing units is used, so the molded product can be efficiently formed by implementing the above operations in parallel.

Furthermore, in this embodiment, the following structure is set, that is, after the film F is previously set to be adsorbed and held on the mold surface 204a including the inner surface of the mold cavity 208 by the adsorption mechanism, the extrusion member 214 is moved upward by the moving attachment mechanism 215, so that the resin R is extruded toward the film F and attached to the lower surface of the film F. However, it is not limited to this structure, and as a modified example, it can also be set to the following structure. Specifically, the following structure is prepared in a predetermined position between the upper mold 204 and the lower mold 206 (specifically, the position between the upper surface 214a of the extrusion member 214 and the inner surface of the mold cavity 208) without adsorbing the film F to the mold surface 204a including the inner surface of the mold cavity 208. Then, the extrusion member 214 is moved upward by the moving attachment mechanism 215, so that the extrusion member 214 abuts against the film F and the film F is moved upward. Then, while the film F is adsorbed on the mold surface 204a including the inner surface of the cavity 208, the resin R placed on the extrusion member 214 (upper surface 214a) is squeezed toward the film F and attached to the lower surface of the film F.

Furthermore, as another modification, a vibration mechanism (not shown) for vibrating the extrusion member 214 may be provided on the second carrier 212, and a vibration step for vibrating the extrusion member 214 may be performed in the above-mentioned moving and attaching step, that is, when the resin R placed on the extrusion member 214 (upper surface 214a) is extruded and attached to the film F. Thus, in a state where the resin R is placed on the extrusion member 214, the extrusion member 214 is vibrated in the shield 216 during attachment, so that the resin R can be attached to the film F with a more uniform thickness. Therefore, it is more effective from the viewpoint of preventing the occurrence of defective molding and stabilizing the quality.

As described above, it can be considered that the previous method of setting a cavity in the lower mold and performing resin sealing in a state where the resin is liquefied in the cavity is superior in that the damage to the lead is small, especially in the resin sealing of products with leads. In contrast, the inventors of this application conducted intensive research and invented a method of setting a cavity 208 in the upper mold 204 and performing resin sealing in a state where the resin R is softened and adhered in the cavity 208, realizing a resin sealing device and method that is not inferior to the method of setting a cavity in the lower mold.

As a result, the method of providing the cavity 208 in the upper mold 204 can be adopted without being inferior, and the problem of the method of providing the cavity in the lower mold can be solved. Specifically, in the method of providing the cavity in the lower mold, there are problems such as it is difficult to prevent the granular resin from leaking out of the cavity, it is difficult to spread the resin to the outermost peripheral position in the cavity, and the molding quality is easily deteriorated, and further, the granular resin is accumulated in a state where there are gaps between the particles, and the volume expansion caused by this causes air foaming (defoaming) in the gaps between the resin during molding, which easily causes the resin to leak, etc., but these problems can be solved. Moreover, during resin sealing, damage to workpieces, especially those carrying electronic components with leads, is not worse than the method of setting a cavity in the lower mold, and the resin can be evenly spread to the outermost position in the cavity 208, thereby achieving further improvement in molding quality.

Furthermore, the resin R placed on the extrusion member 214 can be transported into the sealed mold 202 in a state surrounded by the shield 216, so that the resin does not leak (drip) from the extrusion member 214 (upper surface 214a) during transport. Furthermore, the extrusion member 214 can be moved further upward and enter the cavity 208 while the shield 216 is in contact with the upper mold 204, so that the resin R does not leak (drip) from the cavity 208. Therefore, the deterioration of the molding quality due to the leakage (drip) of the resin R can be prevented, and the molding quality can be stabilized (high quality can be maintained).

[Second embodiment] Next, the second embodiment of the present invention will be described. This embodiment is a structural example of the following situation, that is, a workpiece W that becomes a product (molded product Wp) provided with a heat spreader (heat spreader) H is resin-sealed. Specifically, the molded product Wp becomes a molded product Wp in which the heat spreader H is exposed on one side (the side opposite to the side provided with the substrate Wa). The following description will focus on the differences from the first embodiment. Here, FIG. 11 is a side sectional view (schematic view) equivalent to FIG. 3 of the first embodiment.

In the resin sealing device 1 of the present embodiment, a roll-shaped film having a plurality of holes (suction holes) Fa formed on the sheet surface is used as the release film F. Furthermore, the upper mold 204 is configured in the following manner: the heat sink H can be sucked and held by the suction mechanism in a state where the film F is interposed in the cavity 208. Specifically, the holes Fa can be formed first using a needle-shaped opening member, as shown in FIG. 11, and the suction device is driven to suck the film F from the suction paths 230a, 230b, and 230c, so that the film F is sucked and held on the mold surface 204a including the inner surface of the cavity 208. Furthermore, with the film F adsorbed on the mold surface 204a, the suction force based on the suction path 230c is applied through the suction holes Fa of the film F, so that the heat sink H can be adsorbed and held with the film F interposed in the mold cavity 208.

Next, the operation of performing resin sealing using the resin sealing device 1 of this embodiment (i.e., the resin sealing method of this embodiment) is described. The basic steps are the same as those of the first embodiment, but this embodiment further includes an adsorption step (second adsorption step) of sucking and holding the heat sink H in a state where a film F is interposed in the mold cavity 208 of the upper mold 204 after the first adsorption step. Then, the resin R can be attached to the lower surface of the heat sink H as described above while the heat sink H is fully heated, and the resin sealing step can be performed.

As described above, according to the present embodiment, even when the workpiece W, which is a molded product Wp provided with a heat sink H, is to be resin-sealed, the resin sealing can be performed using the device having the same basic structure as that of the first embodiment.

[Third embodiment] Next, the third embodiment of the present invention is described. Compared with the first embodiment, this embodiment is different in that the resin R is supplied and transported into the sealing mold 202 (specifically, into the cavity 208 of the upper mold 204). The resin sealing device 1 and the resin sealing method of this embodiment are described below with reference to FIGS. 12 to 17 , centering on this difference.

As a structural example of the present embodiment, similarly to the first embodiment, the following structure is cited as an example: for one sealing mold 202, two workpieces W are sealed with resin together to obtain two molded products Wp at the same time.

First, as shown in FIG. 12 , a conveying member 400 is prepared in a state where a film F is held on the lower surface side, and is conveyed by a conveying mechanism (not shown) to a position directly below the nozzle 312a of the dispenser 312. As an example, the conveying member 400 is formed as a frame having a holding mechanism (not shown) for holding the film F on the lower surface, and two rows of resin injection holes (through holes) 400a. Here, regarding the film F of this embodiment, a single-piece release film is used instead of the roll-shaped release film of the first embodiment.

Next, as shown in FIG. 13 , the resin R is dropped (supplied) from the nozzles 312 a of the two dispensers 312 into the two resin insertion holes 400 a of the conveying member 400 .

Next, as shown in FIG14 , the conveying member 400 holding the film F and the resin R is conveyed by the conveying mechanism and placed on the heater stage 310 to heat the resin R via the film F. As a result, the resin R is melted or softened. Therefore, the resin R is fused as a whole to form a block and is in close contact with the film F.

Next, as shown in FIG. 15 , the extrusion members 214 are respectively inserted into the two resin injection holes 400 a , so that the plate surface 214 a (the lower surface in this state) is in close contact with the resin R in a molten or softened state.

Next, as shown in Fig. 16, the conveying member 400 and the extruding member 214 are reversed upside down by a reversing mechanism (not shown). At this time, the resin R is in close contact with the film F.

From this state, the same steps as the adsorption step (first adsorption step) and the moving and attaching step of the first embodiment are performed. That is, the following step is performed, namely, the extrusion member 214 with the resin R placed on the upper surface 214a (corresponding to the lower surface before inversion) (in a state where the film F is in close contact with the upper surface side of the resin R) is moved upward (specifically, to the cavity 208 of the upper mold 204) by the moving and attaching mechanism 215. At this time, the following step is performed, namely, the film F is adsorbed and held on the mold surface 204a including the inner surface of the cavity 208 by the adsorption mechanism. In this state, the following steps are performed, namely, the extrusion member 214 is further moved upward by the moving attachment mechanism 215, and the resin R placed on the upper surface 214a is extruded and attached to the lower surface of the film F. In this way, the film F is adsorbed in the cavity 208, and the resin R is attached to the film F.

The subsequent steps are the same as those of the first embodiment, and the following steps are performed, namely: transferring the workpiece W into the sealing mold 202, closing the sealing mold 202 to perform resin sealing on the workpiece W, and opening the sealing mold 202 to take out the molded product Wp.

As described above, according to the present invention, the above-mentioned problem can be solved by adopting a structure in which the upper mold has a cavity, thereby realizing a structure in which the lower mold has a cavity. In addition, a resin sealing device and a resin sealing method can be realized which can reduce damage to the workpiece during resin sealing and improve molding quality.

Furthermore, the present invention is not limited to the above-mentioned embodiments, and various modifications can be made within the scope of the present invention. In particular, as the sealing resin, a granular, crushed, or powdered thermosetting resin is cited as an example for explanation, but it is not limited to this, and it can also be applied to a structure using a liquid, plate, sheet, or other resin. For example, in the case of a structure using a sheet-like resin, it is sufficient to simply attach the originally flat and integrated sheet-like resin R to the lower surface of the film F, and the resin sealing can be easily prepared.

Moreover, in the embodiment described above, the following structure is described, namely: the heat of the upper mold 204 is transferred to the resin R through the membrane F, the resin R is set to a softened (molten) state and an adhesive force is generated, thereby the resin R is adhered to the lower surface of the membrane F. However, the following structure may also be adopted, namely: a porous membrane F is used, the suction device is driven to suck the membrane F from the suction path 230b and the suction path 230c, thereby the resin R is adsorbed and adhered to the lower surface of the membrane F.

Furthermore, the following structure is cited for explanation, namely, two cavities are provided in the upper mold, and two workpieces W are arranged in the lower mold and resin-sealed together to obtain two molded products Wp at the same time, but the present invention is not limited to this and may also be applied to the following structure, namely, one (or more than three) cavities are provided in the upper mold, and one (or more than three) workpieces are arranged in the lower mold and resin-sealed together to obtain one (or more than three) molded products.

1: Resin sealing device 100A: Workpiece handling unit 100B: Pressing unit 100C: Dispensing unit 102: Supply cassette 104: Supply track 106: Relay track 112: Storage cassette 116: Workpiece heater 202: Sealing mold 204: Upper mold 204a, 206a: Mold surface 206: Lower mold 208: Mold cavity 210: First loader 210A: First holding part 210B: Second holding part 212: Second loader 214: Extrusion member 214a: Upper surface 215: Moving attachment mechanism 216: Shield 216a: Peripheral wall 217: Shield moving mechanism 222: Upper plate 224: Lower plate 226: Cavity insert 228: Clamp 230a, 230b, 230c, 240a: Suction path 232: Pressure member 234: Sealing member 236: Cavity plate 250: Film supply mechanism 252: Unwinding unit 254: Winding unit 310: Heater station 312: Dispenser 312a: Nozzle 314: Resin heater 400: Conveyor 400a: Resin injection hole F: Film Fa: Hole (suction hole) H: Heat sink R: Resin W: Workpiece Wa: Substrate Wb: Electronic component Wp: Molded product

FIG. 1 is a plan view showing an example of a resin sealing device according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view showing an example of a sealing mold of the resin sealing device of FIG. 1 . FIG. 3 is a cross-sectional view showing an example of an extrusion member and a shield of the resin sealing device of FIG. 1 . FIG. 4 is an action explanation diagram of the resin sealing device according to the first embodiment of the present invention. FIG. 5 is an action explanation diagram following FIG. 4 . FIG. 6 is an action explanation diagram following FIG. 5 . FIG. 7 is an action explanation diagram following FIG. 6 . FIG. 8 is an action explanation diagram following FIG. 7 . FIG. 9 is an action explanation diagram following FIG. 8 . FIG. 10 is an action explanation diagram following FIG. 9 . FIG. 11 is a cross-sectional view showing an example of a resin sealing device according to the second embodiment of the present invention. FIG. 12 is an operation explanation diagram showing a resin sealing device according to the third embodiment of the present invention. FIG. 13 is an operation explanation diagram following FIG. 12. FIG. 14 is an operation explanation diagram following FIG. 13. FIG. 15 is an operation explanation diagram following FIG. 14. FIG. 16 is an operation explanation diagram following FIG. 15. FIG. 17 is an operation explanation diagram following FIG. 16.

202: Sealing mold

204: Upper mold

204a: Mold surface

208:Mold cavity

214: Extrusion components

214a: Upper surface

215: Mobile attachment mechanism

216: Shield

216a: Peripheral wall

217: Shield moving mechanism

222:On the board

226: Cavity insert

228: Clamp

230a, 230b, 230c: Suction path

232: Pressure-applying components

234: Sealing component

F: Membrane

Claims (12)

A resin sealing device uses a sealing mold including an upper mold and a lower mold to seal a workpiece having an electronic component mounted on a substrate with a resin to form a molded product, and the resin sealing device is characterized in that it includes: a heating mechanism to heat the upper mold to a predetermined temperature; a suction mechanism to suck and hold a film in a mold cavity arranged on the lower surface side of the upper mold; an extrusion member having the resin mounted on the upper surface; and a moving attachment mechanism to move the extrusion member. The pressing member moves upward to move the resin to the lower surface of the film below the concave portion of the cavity of the upper mold, and squeezes the resin in the cavity of the upper mold heated to a predetermined temperature. The heat of the upper mold partially melts the resin through the film and adheres to the lower surface of the film, wherein even if the moving and attaching mechanism is lowered, the resin still adheres to the lower surface of the film. The resin sealing device as described in claim 1 further comprises: a shield having a peripheral wall portion, the peripheral wall portion surrounding the entire periphery until a position higher than the upper surface of the extrusion member; and a shield moving mechanism, which moves the shield upward along with the extrusion member, and is configured such that: when the peripheral wall portion of the shield abuts against the upper mold, the extrusion member can move upward relative to the shield. A resin sealing device as described in claim 1 or claim 2, wherein the resin is in a granular, crushed or powdered form when placed on the extrusion member. The resin sealing device as described in claim 3 further includes: a vibration mechanism to vibrate the extrusion component carrying the resin. The resin sealing device as described in claim 1 or claim 2 further includes: a preheating mechanism to heat the resin before it is attached to the lower surface of the film. A resin sealing device as described in claim 1 or claim 2, wherein the extrusion member has a surface treatment on the upper surface to prevent the resin from adhering. The resin sealing device as described in claim 1 or claim 2, wherein the film is provided with a plurality of suction holes, and the upper mold structure is configured to be able to suck and hold the heat sink in the mold cavity with the film interposed therein by means of the adsorption mechanism. A resin sealing method uses a sealing mold including an upper mold and a lower mold to seal a workpiece having an electronic component mounted on a substrate with a resin to form a molded product, and the resin sealing method is characterized in that it includes: a heating step of heating the upper mold to a predetermined temperature; a first adsorption step of sucking a retaining film in a mold cavity of the upper mold; a placing step of placing the resin on the upper surface of an extruded component; and a moving attachment step of moving the resin to the upper surface of the extruded component. The moving attachment mechanism moves the extrusion member carrying the resin on the upper surface upward to move the resin to the lower surface of the film below the concave portion of the cavity of the upper mold and extrude the resin. The heat of the upper mold partially melts the resin through the film and attaches it to the lower surface of the film. Even if the moving attachment mechanism is lowered, the resin still adheres to the lower surface of the film. The resin sealing method as described in claim 8, wherein the placing step comprises the following steps: placing the resin on the upper surface of the extruded member in a state where the outer periphery is surrounded by the shield until the position is higher than the upper surface of the extruded member, and the moving and attaching step comprises the following steps: moving the extruded member surrounded by the shield upward simultaneously with the shield, and after the shield abuts against the upper mold, only the extruded member is further moved upward and moved into the mold cavity of the upper mold. A resin sealing method as described in claim 8 or claim 9, wherein the resin is in a granular, crushed or powdered form when placed on the extrusion component. The resin sealing method as described in claim 8 or claim 9 further includes: a vibration step, in which the extrusion member carrying the resin is vibrated when the resin is extruded and attached to the film in the moving and attaching step. The resin sealing method as described in claim 8 or claim 9, wherein the film is provided with a plurality of suction holes, and after the first adsorption step, further comprises: a second adsorption step, in which the heat sink is sucked and held in the mold cavity of the upper mold with the film interposed therein.