TWI854661B - Mold die, resin molding apparatus, and method for producing resin molded product - Google Patents

Abstract

The molding die (C) comprises a lower mold (LM) including a lower mold cavity block (53) and a barrel section (54) forming a material cylinder (54b); an upper mold (UM) including an upper mold cavity block (64) and a waste material section (65) positioned above the barrel section (54) and capable of independent vertical movement relative to the upper mold cavity block (64); a first elastic member (55) for pushing the lower mold cavity block (53) towards the upper mold (UM); a plurality of elastically deformable support members (63) for pushing the upper mold cavity block (64) and the waste material section (65); and a second elastic member (66) for pushing the waste material section (65) to protrude downward more than the lower surface of the upper mold cavity block (64).

Description

Forming mold, resin forming device and method for manufacturing resin formed product

The present invention relates to a forming mold, a resin forming device and a method for manufacturing a resin formed product.

Substrates, etc., on which semiconductor chips are fixed, are usually used as electronic parts by resin sealing. In the past, as a resin molding device for resin sealing of substrates, etc., there is a known device having a metal mold for transfer molding for manufacturing semiconductor packages such as MAP (molded array packaging) (for example, refer to Patent Document 1).

In the forming mold disclosed in Patent Document 1, when a transfer forming metal mold is used to perform resin forming of a high-fluidity resin material, an air hole block is used to close the air hole groove. This prevents the residual air in the mold cavity from becoming unfilled with the resin material, and prevents the resin material from flowing out of the metal mold. In addition, as a countermeasure for uneven thickness of the substrate, it is recorded that an elastic member is used in the lower mold cavity block, and a floating pin is used in the upper mold cavity block, making the mold cavity block a floating mechanism.

Prior art literature

Patent Literature

Patent document 1: Japanese Patent Publication No. 2015-226014

In order to stably manufacture resin molded products, it is preferable that the pushing force applied to the substrate during resin molding is small. However, in the molding mold disclosed in Patent Document 1, in order to deal with burrs, it is necessary to maximize the elastic force of the elastic member and the pushing force of the floating pin before the resin material flows in the mold cavity, thereby suppressing the floating of the lower mold cavity block and the upper mold cavity block. As a result, a large pressure is required during resin molding, and in order to apply an excessively large pushing force to the substrate during resin molding, the air pores collapse, the air is not fully discharged, and remains in the mold cavity to generate voids, and the entire mold cavity is not filled with resin material.

Therefore, a molding die, a resin molding device, and a method for manufacturing a resin molded product are desired that can stably manufacture a resin molded product by reducing the pushing force acting on a substrate during resin molding.

The forming mold of the present invention is characterized in that it comprises: a lower mold, including a lower mold cavity block carrying a forming object, and a barrel block forming a barrel filled with resin material; an upper mold, including an upper mold cavity block having a mold cavity and an air hole groove; and a waste material block arranged above the barrel block and capable of rising and falling independently of the upper mold cavity block; a first elastic member, which pushes the lower mold cavity block toward the upper mold; a plurality of elastically deformable supporting members, which push the upper mold cavity block and the waste material block; and a second elastic member, which can push the waste material block so that the waste material block protrudes further downward than the lower surface of the upper mold cavity block.

The resin molding device of the present invention is characterized in that it has: the molding mold described above; and a mold clamping mechanism for clamping the molding mold.

The manufacturing method of the resin molded product of the present invention is characterized in that it is a manufacturing method of the resin molded product using the resin molding device described above, wherein the method comprises the following steps: a supply step, supplying the molding object and the resin material to the molding mold; a clamping step, elastically deforming the second elastic member by a first clamping force, so that the waste block contacts the barrel block, and the lower surface of the upper mold cavity block contacts the upper surface of the molding object, supplying the resin material filled in the barrel to the mold cavity, and closing the air hole groove by a second clamping force; and a molding step, performing resin molding of the molding object.

According to the present invention, a forming mold, a resin forming device and a method for manufacturing a resin formed product can be provided, which can stably manufacture a resin formed product by reducing the pushing force acting on a substrate during resin molding.

1:CPU

2: Forming mechanism

7: Input box

8: Memory Department

9: Touch panel

10: Control Department

31: Lower fixed plate

32: Pull rod

33: Upper fixed plate

34: Movable platform

35: Mold clamping mechanism

36: Lower mold heater

37: Upper mold heater

38: Download template

39: Transfer institution

40: Loader

40a: Loader pickup unit

40b: Actuator

42: Substrate supply unit

42b: Actuator

44: Unloader

44a: Unloader Pick-up Unit

44b: Actuator

51: Base block

52: Side block

53: Lower mold cavity block

54: Barrel block

54a: plunger

54b: Barrel

55: First elastic component

56: Upper surface

57: Upper surface

58: Upper surface

61: Cage base

62: Pin retainer

63: Floating pin

64: Upper mold cavity block

64a: air hole groove

65: Waste area

65a: Runner

65b: Watering the mouth

66: Second elastic member

67: Porous block

68: Lower surface

69: Lower surface

70: Arrangement mechanism

70a: Rotating disc

71: Water outlet disconnection mechanism

72: Output box

79: Resin supply device

100: Resin forming device

C: Forming die

G:Guide rail

LM: Lower mold

M1: Supply module

M2: Forming module

M3: Containment Module

MC: mold cavity

Ma: Electric motor

Mb: Electric motor

Sa: Substrate before resin molding

Sb: Resin forming completed substrate

Sc: semiconductor chip

T: Resin sheet

Ta: Molten resin

UM: Upper mold

Wa: Load sensor

Wb: Load sensor

Figure 1 is a schematic diagram of the resin molding device of this embodiment.

Figure 2 is a schematic diagram showing the mold clamping mechanism of the resin molding device.

Figure 3 is a schematic diagram showing the forming step including the mold closing step.

Figure 4 is a diagram showing the relationship between the molding time in the molding step and the position of the transfer mechanism, the mold clamping force, and the supply pressure of the molten resin.

The following is an explanation of the embodiments of the molding die, resin molding device, and method for manufacturing a resin molded product of the present invention based on the drawings. However, the present invention is not limited to the following embodiments, and various changes can be made within the scope of the purpose of the present invention.

[Overall structure of the device]

The molding object such as a substrate with a semiconductor chip (hereinafter simply referred to as a "chip") fixed thereon is used as an electronic component by resin sealing. The electronic component is used, for example, as a high-frequency module substrate for mobile communication terminals, a module substrate for power control, a substrate for machine control, etc. As one of the technologies for resin sealing the molding object, there is a transfer method of manufacturing a semiconductor package by resin sealing a BGA (Ball Grid Array) substrate, etc. This transfer method is to place a substrate with a chip fixed thereon in the mold cavity of a forming mold, then supply a resin sheet formed by solidifying a powdered resin into the barrel of the forming mold and heat and melt it, then supply the molten resin formed by melting the resin sheet into the mold cavity while the forming mold is closed and harden it, and then open the mold to produce a resin molded product.

In addition, the powdered resin includes not only the powdered resin but also the resin sheet formed by compacting and consolidating the powdered resin, either of which is a molten resin that melts into a liquid state by heating. The powdered resin may be a thermoplastic resin or a thermosetting resin. As for the thermosetting resin, its viscosity decreases once heated, and if further heated, it polymerizes and hardens to become a hardened resin. The powdered resin in this embodiment is preferably a resin sheet formed by a solid resin based on the ease of use, and in order to reliably fill the molten resin between the chip and the substrate, it is more preferably a highly fluid thermosetting resin containing a micronized filler.

FIG1 shows a schematic structure of a resin molding device 100 of this embodiment. The resin molding device 100 is a device for molding a pre-resin molding substrate Sa (an example of a molding object) with resin using a molding mold C. In this embodiment, the pre-resin molding substrate Sa is rectangular and has a semiconductor chip fixed in advance.

The resin molding device 100 is provided with: a CPU 1 as a central control device; a memory unit 8 storing control information such as a control program; a molding mechanism 2 having a molding mold C; a driving mechanism driving each part described later; and a touch panel 9 receiving an action command from a user or input of abnormal processing-related information and displaying various output information of the resin molding device 100. The CPU 1 constitutes a control unit 10, which controls the actions of each part of the resin molding device 100 by executing a program stored in the memory unit 8.

The actions of the resin molding device 100 described below are all based on the action instructions of the control unit 10 unless otherwise specified. In the following description, the action instructions of the control unit 10 are omitted in principle, and the action instructions of the control unit 10 are only described when necessary.

The resin forming device 100 is a device that sequentially connects the supply module M1, the forming module M2, and the receiving module M3 into an integrated device. The supply module M1 has an input box 7 for receiving a plurality of pre-resin forming substrates Sa, the forming module M2 has a forming mold C, and the receiving module M3 has an output box 72 for resin forming completed substrates Sb (an example of a resin formed product), and the resin forming completed substrate Sb is the pre-resin forming substrate Sa formed using resin. The supply module M1, the forming module M2, and the receiving module M3 are provided with a guide rail G that crosses each of these modules and is arranged in a straight line. The guide rail G is a track-shaped component that allows the loader 40 and the unloader 44 described later to move. The guide rail G is provided on the back side of each module.

Each module is configured to be increased or decreased by being mutually detachable. The resin molding device 100 of this embodiment has two molding modules M2. The resin molding device 100 may have only one molding module M2 or may have three or more molding modules.

[Drive mechanism]

The driving mechanism includes a loader 40, a substrate supply unit 42, an unloader 44, a mold clamping mechanism 35, and a transfer mechanism 39 described later (see Figure 2).

The loader 40 is a conveying mechanism for carrying the pre-resin forming substrate Sa into the forming mold C. The substrate supply unit 42 is a conveying mechanism for pushing the pre-resin forming substrate Sa from the cassette 7 (in-magazine) and delivering it to the arrangement mechanism 70. The unloader 44 is a conveying mechanism for carrying the resin forming substrate Sb out of the forming mold C. The transfer mechanism is a mechanism for supplying the melted resin sheet T (an example of resin material) from the barrel to the mold cavity in the forming mold C. The clamping mechanism 35 is a mechanism for clamping the forming mold C. The transfer mechanism 39 is driven independently of the clamping mechanism 35.

The loader 40, substrate supply unit 42, and unloader 44 have actuators 40b, 42b, and 44b, respectively. The actuators 40b, 42b, and 44b are air cylinders corresponding to the respective installation locations or the distances to drive each part.

[Substrate supply unit]

The substrate supply unit 42 is a mechanism that pushes out the pre-resin forming substrates Sa one at a time from a cassette 7 of a storage container that stores a plurality of pre-resin forming substrates Sa at intervals in the vertical direction, and transports them to an arrangement mechanism 70. The substrate supply unit 42 has an actuator 42b. In the present embodiment, the substrate supply unit 42 pushes out the pre-resin forming substrates Sa from the cassette 7 by the actuator 42b, and moves it to the arrangement mechanism 70 adjacently arranged in the cassette 7. The arrangement mechanism 70 has a rotating disk 70a, and if the pre-resin forming substrates Sa are placed, the rotating disk 70a is rotated to arrange the pre-resin forming substrates Sa in a state suitable for the loader 40 to pick up the pre-resin forming substrates Sa. The substrate supply unit 42, the cassette 7, and the arrangement mechanism 70 are arranged in the supply module M1. The substrate supply unit 42, the cassette 7 and the arrangement mechanism 70 are arranged in the supply module M1, closer to the front side than the guide G.

〔Loader〕

The loader 40 is a conveying mechanism for carrying the pre-resin forming substrate Sa into the forming mold C. The loader 40 can move along the guide G from the supply module M1 across the forming module M2. The loader 40 has a loader pickup section 40a for picking up the pre-resin forming substrate Sa and the resin sheet T.

The loader pickup unit 40a has a plurality of pairs of claws extending downward (not shown). The loader pickup unit 40a drives the pair of claws by an actuator (not shown) to pick up the pre-resin molding substrate Sa from the arrangement mechanism 70, transport it to the lower mold LM of the molding mold C, and load (carry) it into the lower mold LM. Hereinafter, the picking action of the loader pickup unit 40a is simply recorded as picking.

Furthermore, the loader pickup section 40a drives the claws for holding the resin material by other actuators not shown in the figure to pick up the resin sheet T from the resin supply device 79. The picking up of the resin sheet T is also carried out in the same way as the picking up of the substrate Sa before resin molding. However, in this embodiment, each claw picks up one resin sheet T.

The loader pickup part 40a can move forward and backward from the back side to the front side of Figure 1 by means of the actuator 40b. The loader 40 moves the loader pickup part 40a forward and backward, picks up the pre-resin molding substrate Sa from the arrangement mechanism 70, moves across the molding module M2 from the supply module M1, and carries the pre-resin molding substrate Sa into the molding mold C. In addition, the loader 40 moves the loader pickup part 40a forward and backward, picks up the resin sheet T from the resin supply device 79, moves across the molding module M2 from the supply module M1, and carries the resin sheet T into the molding mold C.

[Unloader]

The unloader 44 is a conveying mechanism for carrying out the resin formed substrate Sb from the forming mold C. The unloader 44 can move along the guide G from the forming module M2 across the receiving module M3. The unloader 44 has an unloader picking-up portion 44a for picking up the resin formed substrate Sb and the like. The unloader picking-up portion 44a can move forward and backward from the back side toward the front side of Figure 1 by means of an actuator 44b. The unloader 44 moves the unloader picking-up portion 44a forward and backward, picks up the resin formed substrate Sb from the lower mold LM of the forming mold C, moves from the forming module M2 across the receiving module M3, and carries the resin formed substrate Sb into the gutter breaking mechanism 71 of the receiving module M3. The unloader 44 transports the resin-formed substrate Sb after the unnecessary resin portion is removed by the gutter breaking mechanism 71 and stores it in the output box 72.

In addition, the unloader pickup part 44a has a plurality of pairs of claws (not shown) extending downward, similarly to the loader pickup part 40a. The unloader pickup part 44a picks up in the same manner as the loader pickup part 40a.

Next, the forming module M2 is described in detail.

As shown in FIG2 , the forming module M2 has tie rods 32 erected at the four corners of the lower fixed plate 31 in a rectangular shape when viewed from above, and an upper fixed plate 33 in a rectangular shape when viewed from above is provided near the upper end of the tie rod 32. A movable platform 34 in a rectangular shape when viewed from above is provided between the lower fixed plate 31 and the upper fixed plate 33. The movable platform 34 has holes at the four corners through which the tie rods 32 pass, and can move up and down along the tie rods 32. On the lower fixed plate 31, there is provided a device (i.e., a mold clamping mechanism 35) for moving the movable platform 34 up and down. The mold clamping mechanism 35 includes: an electric motor Ma composed of a servo motor as a driving source, and a load sensor Wa composed of a strain gauge or a weighing sensor for calculating the clamping force (hereinafter referred to as "clamping force") of the forming mold C. The mold clamping mechanism 35 can close the mold of the forming mold C by moving the movable platform 34 upward, and can open the mold of the forming mold C by moving the movable platform 34 downward.

The forming mold C is composed of a lower mold LM and an upper mold UM. The lower mold LM and the upper mold UM are composed of metal molds arranged opposite to each other.

The lower mold LM is mounted on the lower mold plate 38, and the lower mold plate 38 is mounted on the movable platform 34. The lower mold LM includes a base block 51, a side block 52 and a lower mold cavity block 53 mounted on the base block 51, and a barrel block 54. The side block 52 is mounted on the base block 51. A first elastic member 55 is disposed between the base block 51 and the lower mold cavity block 53, and the first elastic member 55 presses the lower mold cavity block 53 toward the upper side of the upper mold UM relative to the base block 51. As an example of the first elastic member 55, for example, a plurality of disc springs are stacked. The lower mold cavity block 53 is configured to be able to move relative to the base block 51 and the side block 52 in the up and down directions by elastically deforming the first elastic member 55. That is, the lower mold LM has a floating mechanism that allows the lower mold cavity block 53 to move in the up and down directions. In addition, the first elastic member 55 sets the elastic force in a manner that starts elastic deformation before the floating pin 63 described later when the mold is closed.

In the state before the forming mold C is closed, in the lower mold LM, the upper surface of the lower mold cavity block 53 is flush with the upper surface 58 of the side block 52. The pre-resin molding substrate Sa is placed on the upper surface of the lower mold cavity block 53 with the surface on which the semiconductor chip Sc, etc. is fixed facing upward. In addition, a lower mold heater 36 for heating the pre-resin molding substrate Sa and the resin sheet T is placed in the lower mold cavity block 53. In the present embodiment, the lower mold LM has two lower mold cavity blocks 53, 53, and a barrel block 54 is arranged at a position sandwiched by the two lower mold cavity blocks 53, 53. A barrel 54b having a cylindrical recess is formed in the barrel block 54, and the interior of the barrel 54b is filled with a resin sheet T (resin melted by heating). Below the barrel block 54, a plunger 54a driven by an electric motor Mb such as a servo motor is inserted so as to be movable up and down. An elastic member (not shown) is provided at the support portion of the plunger 54a. The plunger 54a is slightly displaced by the elastic force of the elastic member to release the excess pushing force, and can adapt to the deviation of the resin amount when the resin sheet T is melted during pressure maintenance. In addition, the lower mold LM has a load sensor Wb composed of a strain gauge or a weighing sensor for calculating the amount of molten resin Ta (an example of resin material) pushed out by the plunger 54a.

The upper mold UM is arranged opposite to the lower mold LM. The upper mold UM has a retainer base 61 fixed to the lower surface of the upper fixed plate 33, a pin retainer 62 fixed to the lower surface of the retainer base 61, an upper mold cavity block 64 and a waste block 65 supported by the pin retainer 62 via a plurality of floating pins 63 (an example of a supporting member). The plurality of floating pins 63 are respectively inserted into a plurality of through holes formed in the pin retainer 62, and the upper and lower ends are not fixed to the retainer base 61, the upper mold cavity block 64, and the waste block 65. The length of the floating pin 63 arranged above the waste block 65 is the same as the length of the floating pin 63 arranged above the upper mold cavity block 64. As described later, since the waste block 65 is further supported on the retainer base 61 through the second elastic member 66 in a manner that its lower surface 69 protrudes downward further than the lower surface 68 of the upper mold cavity block 64, the other end of the floating pin 63 disposed on the waste block 65 and retained on the pin retainer 62 is separated from the retainer base 61. In the state before the mold C is closed, the upper mold cavity block 64 and the waste block 65 are separated from the pin retainer 62.

A cavity MC having a concave portion for supplying molten resin Ta is formed on the lower surface 68 of the upper cavity block 64, and an upper mold heater 37 for heating the cavity MC is installed in the upper cavity block 64. The upper cavity block 64 is opposite to the lower cavity block 53 and the side block 52.

In the present embodiment, the upper mold UM has two upper mold cavity blocks 64, 64, and a waste block 65 is arranged at a position sandwiched by the two upper mold cavity blocks 64, 64. The waste block 65 has a flow channel 65a for allowing the molten resin Ta to flow from the barrel 54b of the barrel block 54 toward the mold cavity MC. That is, the waste block 65 is arranged above the barrel block 54. The upper mold cavity block 64 and the waste block 65 are composed of separate components, and the waste block 65 is configured to be able to rise and fall independently of the upper mold cavity block 64 (movable in the up and down directions). In the waste block 65, a gate 65b is provided as an inlet for the molten resin Ta to flow from the flow channel 65a toward the mold cavity MC. One end of the waste block 65 is supported on the retainer base 61 via a second elastic member 66 fixed to the retainer base 61. The waste block 65 is configured in a state before the mold C is closed by the second elastic member 66 so that the lower surface 69 of the waste block 65 protrudes further downward than the lower surface 68 of the upper cavity block 64. An example of the second elastic member 66 is a laminated plurality of disc springs. In addition, the second elastic member 66 is configured to set the elastic force in a manner that the elastic deformation starts earlier than the first elastic member 55 during mold closing.

An air hole groove 64a for discharging air from the mold cavity MC to the outside of the upper mold UM is formed on the lower surface 68 of the upper mold cavity block 64 and away from the outlet 65b. The air hole groove 64a is configured to be opened and closed by the air hole block 67. One end of the air hole block 67 is mounted on the pin holder 62, and is inserted into the through hole formed in the upper mold cavity block 64 in a manner of being located in the middle of the air hole groove 64a when advancing. The lower end of the air hole block 67 is set in a state before the forming mold C is closed, so as to be higher than the lower surface 68 of the upper mold cavity block 64. That is, when the air hole block 67 is arranged to be flush with or above the bottom surface of the air hole groove 64a in the state of the mold C being closed, the air in the mold cavity MC can be discharged to the outside of the upper mold UM by operating the pump not shown in the figure. When the air hole block 67 advances (moves downward) to close the air hole groove 64a, the air (and the molten resin Ta) in the mold cavity MC cannot be discharged to the outside of the upper mold UM. Since one end of the air hole block 67 of this embodiment is mounted on the pin holder 62, if the floating pin 63 is compressed by the mold closing of the mold closing mechanism 35, the air hole block 67 can be relatively advanced (moved downward) relative to the upper mold cavity block 64. Therefore, a special driving mechanism for moving the air hole block 67 forward and backward is not required, the structure of the forming mold C can be simplified, and the forming mold C can be constructed at a lower price.

[Manufacturing method of resin molded products]

Next, the manufacturing method of the resin molded product is described using Figures 1 to 4. The manufacturing method of the resin molded product (resin molded substrate Sb) includes: a supply step of supplying the pre-resin molded substrate Sa and the resin sheet T to the molding mold C; a mold clamping step of clamping the molding mold C; and a molding step of performing resin molding of the pre-resin molded substrate Sa by filling the mold cavity MC with the molten resin Ta supplied from the self-gushing port 65b. The molding step is a step in which the pre-resin molded substrate Sa is resin molded by the molding module M2 from the time when the pre-resin molded substrate Sa is moved into the molding module M2 to the time when the resin molded substrate Sb is moved out of the molding module M2, and the molding step includes a mold clamping step. The movement of the forming mold C and the clamping mechanism 35 in the forming step is controlled by the control unit 10.

First, the supply step will be described. As shown in FIG1 , the loader 40 is preheated in the state of the storage space of the heat-insulating resin sheet T. In addition, the heaters 36 and 37 are powered on to preheat the forming mold C (also refer to FIG2 ). Then, a plurality of pre-resin forming substrates Sa taken out from the cassette 7 are placed on the arranging mechanism 70. The arranging mechanism 70 has a rotating disk 70a. If the pre-resin forming substrates Sa are placed, the rotating disk 70a is rotated to arrange the pre-resin forming substrates Sa in a manner that makes it suitable for the loader 40 to pick up the pre-resin forming substrates Sa. The loader pickup unit 40a picks up the pre-resin molding substrate Sa from the arrangement mechanism 70 through the actuator 40b, and places it on the loader 40, and picks up the resin sheet T from the resin supply device 79, and stores it in the storage space of the resin sheet T of the loader 40. Then, the loader 40 transports the pre-resin molding substrate Sa to the molding module M2, places the pre-resin molding substrate Sa with the semiconductor chip Sc fixed on the upper side on the substrate setting part of the lower mold LM, and stores the resin sheet T in the barrel 54b of the barrel block 54 (refer to FIG. 2). By storing the resin sheet T in the barrel 54b of the barrel block 54, the lower mold heater 36 built in the lower mold LM heats the resin sheet T to make it a molten resin Ta. In addition, before the movable platform 34 of the mold clamping mechanism 35 described later is raised, the mold release film (not shown) is preliminarily made to be adsorbed on the lower surface 68 of the upper cavity block 64 of the upper mold UM.

Next, the molding step including the mold clamping step is explained. First, from the state shown in FIG2 , the movable platform 34 is moved upward by the mold clamping mechanism 35, and the lower mold LM is moved relatively toward the upper mold UM, as shown in FIG3 (A), so that the barrel block 54 and the waste block 65 are in contact. At this point in time, the upper surface 56 of the pre-resin molding substrate Sa placed on the lower mold LM and the lower surface 68 of the upper mold cavity block 64 are not in contact.

FIG4 shows: a graph (A) with the molding time of the manufactured resin molded product on the horizontal axis and the position of the transfer mechanism on the vertical axis; a graph (B) with the same molding time on the horizontal axis and the clamping force on the vertical axis; and a graph (C) with the same molding time on the horizontal axis and the supply pressure of the molten resin Ta to the mold cavity MC on the vertical axis. That is, the items on the horizontal axis of the graphs (A), (B), and (C) of FIG4 are common, and the items on the vertical axis are different. The position of the transfer mechanism takes the state of FIG3 (A) as zero (reference position). The state shown in FIG3 (A) is shown in FIG4 (A), (B), and (C) as time (a). That is, it can be seen that at time (a), the transfer mechanism of figure (A) has not moved upward from the reference position, the elastic force of the second elastic member 66 of figure (B) has not yet occurred, and the supply of the molten resin Ta of figure (C) has not yet started, so the supply pressure is zero. After that, the mold clamping state at Figure 3 (A) is called the first mold clamping state. In addition, each time (timing) from time (a) to time (e) shown in Figure 4 is preset by the control unit.

After time (a), if the movable platform is moved upward from the first mold clamping state by the mold clamping mechanism, and the lower mold LM is moved relatively toward the upper mold UM, the second elastic member 66 begins to deform elastically, and the mold clamping force shown in the diagram (B) of FIG. 4 (hereinafter referred to as the "first mold clamping force") is generated. Then, as shown in FIG. 3 (B), the barrel block 54 and the waste block 65 are kept in close contact and the second elastic member 66 is deformed elastically, and the upper surface 56 of the pre-resin molding substrate Sa contacts the lower surface 68 of the upper mold cavity block 64. At this time, the first elastic member 55 and the floating pin 63 have no elastic force at all on the pre-resin molding substrate Sa and the upper mold cavity block 64, or only slightly. Therefore, the pushing force of the first elastic member 55 and the floating pin 63 on the substrate Sa before resin molding is very small. As a result, the upper surface of the lower mold cavity block 53 and the upper surface 58 of the side block 52 are maintained in a flush state. Hereinafter, the mold clamping state in FIG. 3 (B) is referred to as the second mold clamping state. In addition, FIG. 3 (B) shows the state of supplying molten resin Ta with the positional relationship between the lower mold LM and the upper mold UM as described above.

In the second mold clamping state, the air in the mold cavity MC is discharged to the outside of the upper mold UM from the air hole groove 64a by a pump (not shown), and the plunger 54a is moved upward by the electric motor Mb, so that the molten resin Ta flows from the barrel 54b through the flow channel 65a of the waste block 65 to the gate 65b. In this way, the supply of the molten resin Ta to the mold cavity MC begins. The start of the supply is indicated by time (b) in the graphs (A), (B), and (C) of FIG. 4. That is, at time (b), it can be seen that the transfer mechanism including the plunger 54a of pattern (A) begins to move upward, the first clamping force of pattern (B) after time (a) is maintained, and the supply of molten resin Ta of pattern (C) begins and supply pressure occurs, but the pressure is small. Thus, even if the pushing force acting on the substrate Sa before resin molding is small, the molten resin Ta will not leak out of the molding mold C.

In the diagrams (A), (B), and (C) of FIG. 4, after a time (b), the second state is maintained, the transfer mechanism including the plunger rises (refer to the diagram (A) of FIG. 4), and the molten resin Ta in the barrel 54b is filled into the mold cavity MC. At this time, the first clamping force shown in the diagram (B) of FIG. 4 is maintained, and as shown in the diagram (C) of FIG. 4, the supply pressure of the molten resin Ta is maintained at a small state. Then, before the molten resin Ta is completely filled into the mold cavity MC, the time (c) when the molding mold C does not leak the resin to the outside occurs, and the clamping mechanism moves the movable platform upward to increase the clamping force (refer to the diagram (B) of FIG. 4). As a result, the first elastic member 55 is elastically deformed, and as shown in FIG3(C), the side block 52 of the lower mold LM contacts the upper cavity block 64 of the upper mold UM, and the upper surface 56 of the substrate Sa before resin molding is flush with the upper surface 58 of the side block 52 and the upper surface 57 of the barrel block 54. After the compression amount (elastic deformation amount) of the elastic deformation of the first elastic member 55 becomes maximum, the floating pin 63 is elastically deformed, and when the compression amount becomes maximum, the pin holder 62 contacts the upper cavity block 64. As a result, as shown in FIG3(C), the air hole block 67 closes the air hole groove 64a. Thus, the air in the mold cavity MC cannot be discharged to the outside, but the molten resin Ta is almost completely filled in the mold cavity MC, and there is almost no air left, so there is almost no void after the molten resin Ta is hardened. Hereinafter, the mold clamping state at this time is referred to as the third mold clamping state, and the mold clamping force is referred to as the second mold clamping force. In addition, the compression of the elastic deformation of the floating pin 63 from Figure 3 (B) to Figure 3 (C) is exaggerated. The actual compression of the floating pin 63 is very small.

After the time (c) in the diagrams (A), (B), and (C) of FIG4 , the transfer mechanism including the plunger rises, and molten resin Ta is supplied to the mold cavity MC. At time (d), the plunger 54a reaches the top dead center. After the time (d), the plunger 54a does not move, but as shown in the diagram (A) of FIG4 , the transfer mechanism continues to rise. This is due to the elastic deformation of the elastic member (not shown) provided in the support portion of the plunger 54a. As a result, the molten resin Ta remaining in the barrel 54b is filled in the mold cavity MC, and the air hole groove 64a is closed, so the supply pressure of the molten resin Ta rises rapidly (refer to the diagram (C) of FIG4 ). Then, if the supply pressure of the molten resin Ta reaches the specified value, the transfer mechanism stops (refer to the time (e) of the graphs (A) and (C) in Figure 4). In this way, the supply of the molten resin Ta is terminated. In addition, as shown in the graph (B) of Figure 4, the third clamping state and the second clamping force are maintained after time (c).

As shown in the diagrams (A), (B), and (C) of FIG4 , after a time (e), the position of the transfer mechanism, the clamping force, and the supply pressure of the molten resin maintain this state, so that the molten resin Ta hardens. Then, after a specified time, the control unit 10 moves the movable platform downward by reducing the clamping force of the clamping mechanism to open the forming mold C. Then, the resin-molded substrate Sb is demolded from the mold cavity MC to terminate the resin molding. Thereafter, the resin-molded substrate Sb is picked up by the unloader picking portion 44a of the unloader 44, and the unloader 44 moves the resin-molded substrate Sb from the forming module M2 across the receiving module M3. Next, the resin-formed substrate Sb is removed from the unwanted resin portion by the guttering and breaking mechanism 71 and then stored in the output box 72 (see Figure 1).

In this embodiment, by elastically deforming the second elastic member 66, the upper surface 56 of the substrate Sa before resin molding contacts the lower surface 68 of the upper mold cavity block 64, and the first elastic member 55 and the floating pin 63 start supplying resin when there is no elastic force at all or only a slight effect on the substrate Sa before resin molding and the upper mold cavity block 64, thereby enabling resin supply. In the previous device, the resin must be supplied by elastically deforming the first elastic member 55 of the lower mold so that the upper surface 56 of the substrate Sa before resin molding contacts the lower surface 68 of the upper mold cavity block 64. When the resin is injected, a clamping force (pushing force) of a magnitude that only causes the first elastic member 55 to elastically deform is applied to the substrate before resin molding. In this embodiment, the second elastic member 66 is set in a manner that starts to elastically deform before the first elastic member 55, that is, because the elastic coefficient of the second elastic member 66 is set to be smaller than the elastic coefficient of the first elastic member 55, the pushing force acting on the substrate can be reduced during resin molding.

Furthermore, in the present embodiment, before the molten resin Ta is completely filled into the mold cavity MC, the first elastic member 55 and the floating pin 63 are elastically deformed. First, the upper surface 56 of the pre-resin molding substrate Sa is aligned with the upper surface 58 of the side block 52 and the upper surface 57 of the barrel block 54, and then the floating pin 63 is completely elastically deformed immediately, and the pore groove 64a is closed by the pore block 67. In the conventional device, before the molten resin Ta is completely filled into the mold cavity MC, the elastic force of the floating pin 63 at the beginning of the elastic deformation must be preset to be much larger than the elastic force of the elastic deformation of the first elastic member 55 in such a way that the pore groove is not closed. In this embodiment, the resin can be almost filled into the mold cavity MC with a smaller clamping force (in this embodiment, the first clamping force) than in the past, so the floating pin 63 does not need to set the initial elastic deformation elastic force to the same size as in the past by not closing the air hole groove 64a, and the final clamping force (in this embodiment, the second clamping force) can also be set to be smaller than in the past. As a result, the pushing force acting on the substrate during the resin molding can be reduced.

[Other implementation forms]

The following describes other embodiments of the above-mentioned embodiments. In addition, for components that are the same as those in the above-mentioned embodiments, the same terms and symbols are used to explain them for easy understanding.

<1> In the above-mentioned embodiment, the powdery resin of the resin sheet T is a high-fluidity thermosetting resin containing a filler, but it does not have to be a high-fluidity resin. Furthermore, it is not necessary to contain a filler.

<2> In the above embodiment, although the first elastic member 55 and the second elastic member 66 are both exemplified as laminated disc springs, they are not limited to this. For example, a compression coil spring or any other elastic member can be used.

<3> In the above embodiment, the substrate Sa before resin molding is rectangular, but it is not limited to this. For example, a circular substrate or any other substrate can be used. In addition, the size of the substrate is not limited.

If the size of the substrate Sa before resin molding increases, the cavity MC of the upper mold cavity block 64 increases, and the area of the upper mold cavity block 64 other than the cavity MC that contacts the upper surface 56 of the substrate Sa before resin molding becomes relatively smaller. In this case, the pressure exerted by the clamping force on the upper surface 56 of the substrate Sa before resin molding becomes larger than the case of using the upper mold cavity block 64 with a small cavity MC. However, if the resin molding device 100 using the molding mold C of this embodiment is used, since the clamping force when supplying the molten resin Ta becomes the first clamping force in which only the second elastic member 66 exerts elastic force, even if the size of the substrate Sa before resin molding is large, it is possible to prevent excessive pressure from acting on the substrate Sa before resin molding.

<4> In the above-mentioned embodiment, the time (c) (the time elapsed from time (b)) at which the clamping force shown in the graph (B) of FIG. 4 is changed from the first clamping force to the second clamping force is set in advance by the control unit 10, but it is not limited to this. For example, the clamping force can also be controlled by changing the resin pressure of the molten resin Ta calculated by the load sensor Wb. In addition, the clamping force can also be controlled by changing the position of the transfer mechanism 39 (the position of the plunger 54a) shown in the graph (A) of FIG. 4.

<5> In the above embodiment, although the waste block 65 is only arranged in the upper mold UM, it is not limited to this. The waste block can also be configured in a manner of being separately arranged in the upper mold UM and the lower mold LM.

[Overview of the above implementation form]

The following is an overview of the manufacturing method of the molding die C, the resin molding device 100, and the resin molded product (resin molded substrate Sb) described in the above-mentioned embodiment.

(1) The molding die C is characterized in that it comprises: a lower mold LM, comprising: a lower mold cavity block 53 on which a molding object (a substrate Sa before resin molding) is placed, and a barrel block 54 having a barrel 54b filled with a resin material (resin sheet T, molten resin Ta); an upper mold UM, comprising: an upper mold cavity block 64 having a mold cavity MC and an air hole groove 64a, and a The waste block 65 is located above and can be raised and lowered independently of the upper mold cavity block 64; the first elastic member 55 pushes the lower mold cavity block 53 toward the upper mold UM; multiple elastically deformable supporting members (floating pins 63) push the upper mold cavity block 64 and the waste block 65; the second elastic member 66 can push the waste block 65 so that the waste block 65 protrudes further downward than the lower surface of the upper mold cavity block 64.

In the forming mold C of this characteristic structure, before the mold is closed, that is, in the state of not closing the mold, the second elastic member 66 pushes the waste block 65 in a manner that the waste block 65 protrudes further downward than the lower surface 68 of the upper mold cavity block 64. In this way, when the mold is closed, the waste block 65 contacts the barrel block 54 of the lower mold LM before the upper mold cavity block 64. After that, the upper mold cavity block 64 of the second elastic member 66 is deformed to contact the upper surface 56 of the molding object (the substrate Sa before resin molding), and the resin material (molten resin Ta) can be supplied to the mold cavity MC, so that excessive pressure on the molding object (the substrate Sa before resin molding) can be prevented during mold closing (during resin molding).

(2) In the forming mold C described in (1) above, the elastic force of the first elastic member 55 can also be set in such a way that the first elastic member 55 begins to elastically deform before the plurality of supporting members (floating pins 63) when the mold is closed.

In this structure, the molding object (pre-resin molding substrate Sa) is held by the elastic force of the first elastic member 55, so it is possible to prevent excessive pressure from being applied to the molding object (pre-resin molding substrate Sa) during mold closing (during resin molding).

(3) In the molding mold C described in (1) or (2) above, the elastic force of the second elastic member 66 can also be set in such a way that the second elastic member 66 begins to elastically deform before the first elastic member 55 when the mold is closed.

In this structure, the molding object (the substrate Sa before resin molding) is held by the elastic force of the second elastic member 66, so it is possible to prevent excessive pressure from being applied to the molding object (the substrate Sa before resin molding) during mold closing (during resin molding).

(4) The characteristic structure of the resin molding device 100 is that it has: a molding mold C described in any one of (1) to (3) above; and a clamping mechanism 35, which clamps the molding mold C.

The resin molding device 100 of this characteristic structure can manufacture a resin molded product (resin molded substrate Sb) using the molding mold C described in any one of (1) to (3) above.

(5) The method for manufacturing a resin molded product (resin molded substrate Sb) using the resin molding device 100 described in (4) above is characterized in that it includes the following steps: a supply step of supplying a molding object (pre-resin molding substrate Sa) and a resin material (resin sheet T) to a molding mold C; a clamping step of elastically deforming the second elastic member 66 by a first clamping force so that the waste block 65 is in contact with the waste block 65. The barrel block 54 contacts the upper mold cavity block 64, and the lower surface 68 of the upper mold cavity block 64 contacts the upper surface 56 of the molding object (the substrate Sa before resin molding), and the resin material (resin sheet T, molten resin Ta) filled in the barrel 54b is supplied to the mold cavity MC, and the air hole groove 64a is closed by the second mold clamping force; and the molding step is performed to perform the resin molding of the molding object (the substrate Sa before resin molding).

In the manufacturing method of the resin molded product (resin molded substrate Sb) having the present feature, after the molding object (pre-resin molding substrate Sa) and the resin material (resin sheet T) are supplied to the molding mold C in the supply step, the waste block 65 is brought into contact with the barrel block 54 by the first clamping force of the elastically deformed second elastic member 66 in the clamping step, and the lower surface 68 of the upper mold cavity block 64 is brought into contact with the upper surface 56 of the molding object (pre-resin molding substrate Sa). Then, in this state, the resin material (molten resin Ta) is supplied to the mold cavity MC, and thereafter, the air hole groove 64a is closed by the second clamping force, and the mold-clamped resin molded product (resin molded substrate Sb) is manufactured (molding step). In this way, the resin material (molten resin Ta) is supplied with the first clamping force until the air hole groove 64a is closed with the second clamping force to manufacture the resin molded product (resin molded substrate Sb), so that the resin molded product (resin molded substrate Sb) can be manufactured without applying excessive pressure to the molding object (pre-resin molding substrate Sa).

Furthermore, compared with the clamping force in the second clamping step of the resin sealing device disclosed in Patent Document 1, the second clamping force can be greatly reduced, and the clamping press can be miniaturized. Furthermore, the pushing force acting on the pore groove 64a contacting the upper surface 56 of the molding object (resin pre-molding substrate Sa) can also be reduced, so the collapse of the pore groove 64a can be prevented.

(6) The method for manufacturing the resin molded product (resin molded substrate Sb) described in (5) above may also include the following steps: in the mold closing step, after the waste block 65 is brought into contact with the barrel block 54 by the elastic force of the second elastic member 66, the second elastic member 66 is compressed to bring the lower surface 68 of the upper mold cavity block 64 into contact with the upper surface 56 of the molding object (resin molded substrate Sa).

According to this method, by elastic deformation of the second elastic member 66, the waste block 65 contacts the barrel block 54, and the lower surface 68 of the upper mold cavity block 64 contacts the upper surface 56 of the molding object (pre-resin molding substrate Sa), so that the resin molding product (resin molding completed substrate Sb) can be manufactured without applying excessive pressure to the molding object (pre-resin molding substrate Sa).

(7) In the method for manufacturing the resin molded product (resin molded substrate Sb) described in (5) or (6) above, the air hole groove 64a may be closed when the compression amount of the supporting member (floating pin 63) is maximized by the second mold clamping force in the mold clamping step.

Normally, the air in the mold cavity MC is discharged from the air vent groove 64a, so the air vent groove 64a will not be closed before the mold cavity MC is filled with the resin material (molten resin Ta). Therefore, according to this method, when the compression amount of the support member (floating pin 63) becomes the maximum by the second clamping force, the air vent groove 64a is closed, so that the second clamping force can be applied to the molding object (pre-resin molding substrate Sa) before the resin material (molten resin Ta) is filled, and the resin molding product (resin molding completed substrate Sb) can be manufactured.

(8) In the method for manufacturing a resin molded product (resin molded substrate Sb) described in any one of (5) to (7) above, when the elastic deformation of the first elastic member 55 reaches a maximum, the upper surface 56 of the molded object (resin molded substrate Sa) and the upper surface 57 of the barrel block 54 become flush.

According to this method, the timing of the push force of the elastic force of the first elastic member 55 acting on the forming object (the substrate Sa before resin forming) can be delayed, so the time for the push force to act on the forming object (the substrate Sa before resin forming) can be shortened.

Industrial availability

The present invention can utilize a forming mold, a resin forming device, and a method for manufacturing a resin formed product.

31: Lower fixed plate

32: Pull rod

33: Upper fixed plate

34: Movable platform

35: Mold clamping mechanism

36: Lower mold heater

37: Upper mold heater

38: Download template

39: Transfer institution

51: Base block

52: Side block

53: Lower mold cavity block

54: Barrel block

54a: plunger

54b: Barrel

55: First elastic component

56: Upper surface

57: Upper surface

58: Upper surface

61: Cage base

62: Pin retainer

63: Floating pin

64: Upper mold cavity block

64a: air hole groove

65: Waste area

65a: Runner

65b: Watering the mouth

66: Second elastic member

67: Porous block

68: Lower surface

69: Lower surface

C: Forming die

LM: Lower mold

Ma: Electric motor

Mb: Electric motor

MC: mold cavity

Sa: Substrate before resin molding

Sc: semiconductor chip

T: Resin sheet

UM: Upper mold

Wa: Load sensor

Wb: Load sensor

Claims (9)

A forming mold, wherein the mold comprises: a lower mold, including: a lower mold cavity block carrying a forming object, and a barrel block forming a barrel filled with a resin material; an upper mold, including: an upper mold cavity block having a mold cavity and an air hole groove, and a waste material block arranged above the barrel block and capable of rising and falling independently of the upper mold cavity block; a first elastic member, which pushes the lower mold cavity block toward the upper mold; a plurality of elastically deformable supporting members, which push the upper mold cavity block and the waste material block; a second elastic member, which can push the waste material block so that the waste material block protrudes further downward than the lower surface of the upper mold cavity block. The forming mold as described in claim 1, wherein, when the mold is closed, the elastic force of the first elastic member is set in such a way that the first elastic member begins to elastically deform before the plurality of supporting members. A forming mold as described in claim 1 or 2, wherein, when the mold is closed, the elastic force of the second elastic member is set in such a way that the second elastic member begins to elastically deform before the first elastic member. A resin molding device, comprising: a molding die as described in any one of claims 1 to 3; and a mold clamping mechanism for clamping the molding die. A method for manufacturing a resin molded product, which is a method for manufacturing a resin molded product using a resin molding device as described in claim 4, wherein the method comprises the following steps: a supply step, supplying the molding object and the resin material to the molding mold; a clamping step, elastically deforming the second elastic member by a first clamping force, so that the waste block contacts the barrel block, and the lower surface of the upper mold cavity block contacts the upper surface of the molding object, supplying the resin material filled in the barrel to the mold cavity, and closing the air hole groove by a second clamping force; and a molding step, performing resin molding of the molding object. The manufacturing method of the resin molded product as described in claim 5, wherein in the mold closing step, after the waste block is brought into contact with the barrel block by the elastic force of the second elastic member, the second elastic member is compressed to bring the lower surface of the upper mold cavity block into contact with the upper surface of the molding object. A method for manufacturing a resin molded product as described in claim 5 or 6, wherein in the mold clamping step, when the compression amount of the support member is maximized by the second mold clamping force, the air hole groove is closed. A method for manufacturing a resin molded product as described in claim 5 or 6, wherein when the elastic deformation of the first elastic member reaches a maximum, the upper surface of the molded object becomes flush with the upper surface of the barrel block. A method for manufacturing a resin molded product as described in claim 7, wherein when the elastic deformation of the first elastic member reaches a maximum, the upper surface of the molded object becomes flush with the upper surface of the barrel block.