TWI910579B - Compression forming apparatus and compression forming method - Google Patents

Abstract

This invention provides a compression molding apparatus and a compression molding method capable of preventing molding defects. The compression molding apparatus 1 of this invention is a compression molding apparatus that uses a sealing mold 202 including an upper mold 204 and a lower mold 206, and uses a sealing resin R to seal a workpiece W having a structure on a substrate Wa with electronic components Wb mounted thereon, thereby processing it into a molded article Wp. In this compression molding apparatus, a first sealing resin R1 is used as the sealing resin R. The first sealing resin R1 is a solid/semi-solid resin whose integral shape is formed to correspond to the shape of the workpiece W, and has a first component. The compression molding apparatus includes a control calculation unit 30, which calculates the total amount of resin required based on data obtained by measuring the number of electronic components Wb mounted on a substrate Wa for each workpiece W, and compares the total amount with a first component. If the first component is insufficient relative to the total amount, the control calculation unit 30 performs the following control: it supplies a second sealing resin R2 with a second component equivalent to the insufficient amount as sealing resin R.

Description

Compression forming apparatus and compression forming method

This invention relates to a compression molding apparatus and a compression molding method.

As an example of a resin sealing device and method for sealing a workpiece with electronic components mounted on a substrate using a sealing resin to form a molded article, one method utilizing compression molding is known.

The compression molding method involves supplying a predetermined amount of sealing resin to a sealing area (mold cavity) of a sealing mold comprising an upper mold and a lower mold, placing a workpiece in the sealing area, and sealing the resin by clamping it with the upper and lower molds. For example, when using a sealing mold with a mold cavity in the upper mold, it is known to supply sealing resin to the center of the workpiece for molding. On the other hand, when using a sealing mold with a mold cavity in the lower mold, it is known to supply a release film (hereinafter sometimes simply referred to as "film") covering the mold surface including the mold cavity and sealing resin for molding (see Patent Document 1: Japanese Patent Application Publication No. 2019-145550).

[Existing technical literature] [Patent Documents]

[Patent Document 1] Japanese Patent Application Publication No. 2019-145550

For example, in the case of resin sealing of a strip-shaped electronic component (semiconductor chip) connected by wires, in compression molding with a cavity in the upper die, the wire portion of the workpiece held in the lower die deforms upon contact with the sealing resin pre-supplied to the cavity or the sealing resin supplied to the workpiece, thus presenting a problem of resin sealing difficulty. Therefore, a compression molding method is generally adopted in which the workpiece is held in the upper die, a cavity is provided in the lower die, and sealing resin (for example, granular resin) is supplied into the cavity.

However, in structures where the upper mold holds the workpiece and the lower mold has a cavity, there is a problem that it is difficult to hold the thin or large workpiece in the upper mold, and it is easy for it to fall. In addition, in structures that usually serve as a diaphragm to supply sealing resin to the cavity of the lower mold, if it is necessary to form a thick molded article with a thickness (here, the thickness of the resin portion after molding) exceeding 1 mm, there is a problem that the molding stroke becomes larger, the film bites into the molded article, and it is easy to produce poor forming. Furthermore, when using granular resin as a sealing resin, film biting is prone to occur. In addition, there are problems not only with the generation of dust during molding or the difficulty in handling it, but also with the difficulty in evenly supplying (distributing) the sealing resin to the entire area within the mold cavity of the lower mold, easily resulting in uneven distribution. Furthermore, there is the problem that when distributing the sealing resin, air contained in the gaps between the particles and gas components generated during the degassing of the sealing resin during melting cannot escape and remain in the molded article, easily leading to poor molding. Especially in cases where workpieces containing electronic components are connected via wires, wire flow (deformation or breakage) may occur due to resin movement within the mold cavity during resin sealing.

On the other hand, regardless of the mold cavity configuration, when electronic components are missing from the workpiece being sealed (e.g., components not properly mounted or falling off after mounting), the total amount of resin required for sealing increases, thus leading to insufficient resin and poor forming.

This invention was made in view of the aforementioned circumstances, and its purpose is to provide a compression molding apparatus and compression molding method, which is preferably applicable to structures with a mold cavity in the upper mold, and can prevent molding defects caused by the flow and uneven distribution of sealing resin, residual gas, or insufficient resin amount. Furthermore, it can form molded articles with large thickness dimensions, and allows for easy treatment of the sealing resin, preventing dust generation during molding.

This invention solves the aforementioned problem through a solution method as described below as one embodiment.

An embodiment of the compression molding apparatus is a compression molding apparatus that uses a sealing mold including an upper mold and a lower mold, and uses a sealing resin to seal a workpiece having a structure on a substrate to process it into a molded article. A necessary condition for the compression molding apparatus is that, as the sealing resin, a first sealing resin is used. The first sealing resin is a solid/semi-solid resin whose integral shape is formed to correspond to the shape of the workpiece and has a first component. The compression molding apparatus includes a control... The control calculation unit calculates the total amount of resin required based on data obtained by measuring the number of electronic components mounted on a substrate for each workpiece. The total amount is compared with a first component. If the first component is insufficient relative to the total amount, the control calculation unit controls the supply by adding a second sealant of a second component, equal to the insufficient amount.

According to the described embodiment, molding defects caused by the flow, uneven distribution, or residual gas of the sealing resin can be prevented. In particular, even when the total amount of resin required increases due to a lack of electronic components in the workpiece, the required total amount of resin can be easily and quickly ensured, thus preventing molding defects caused by insufficient resin. Furthermore, when forming molded articles with a thickness exceeding 1 mm, film biting can be prevented. Additionally, the handling of the sealing resin is simplified, and the generation of dust during molding caused by particulate resin is prevented. Moreover, by adapting to a structure with a cavity in the upper mold and the workpiece held in the lower mold, defects such as workpiece falling can be resolved.

Furthermore, it is preferable that the first sealant is a solid/semi-solid resin formed by pressing powdered resin into the predetermined shape. Additionally, the predetermined shape is preferably one that does not come into contact with the electronic component when the first sealant is placed on the substrate.

Furthermore, it is preferable to use powdered resin, granular resin, crushed resin, solid resin, or liquid resin as the second sealing resin.

Furthermore, the compression molding apparatus preferably includes a resin supply unit that supplies the second sealing resin. The resin supply unit includes any one of the following: a structure for supplying the resin to the first sealing resin or the workpiece in its state before being loaded into the sealing mold; a structure for supplying the resin to the first sealing resin or the workpiece in its state after being loaded into the sealing mold; or a structure for supplying the resin to a cavity of the sealing mold disposed in the upper mold or the lower mold.

Furthermore, it is preferable that the first sealing resin is a resin temporarily formed from a base resin, and the second sealing resin is a powdered resin, granular resin, crushed resin, solid resin, or liquid resin, formed by temporarily forming the first sealing resin with the second sealing resin added to it.

Another embodiment of the compression molding method is a compression molding method that uses a sealing mold including an upper mold and a lower mold, and uses a sealing resin to seal a workpiece having an electronic component mounted on a substrate to process it into a molded article. A necessary condition for this compression molding method is that it includes: a resin preparation step, preparing a first sealing resin as the sealing resin, wherein the first sealing resin is a solid/semi-solid whose integral shape is formed into a predetermined shape corresponding to the shape of the workpiece. The resin comprises a first component; a calculation step, based on data obtained by measuring the number of electronic components mounted on a substrate for each workpiece, to estimate the total amount of resin required, and comparing the total amount with the first component; and an additional resin preparation step, in which, if the first component is insufficient relative to the total amount, a second sealing resin having a second component equivalent to the insufficient amount is prepared as the sealing resin.

Furthermore, the compression molding method preferably includes an additional resin supply step, which supplies the second sealing resin prepared in the additional resin preparation step to a predetermined position. This additional resin supply step includes any of the following steps: supplying the resin to the first sealing resin or the workpiece in a state before it is moved into the sealing mold; supplying the resin to the first sealing resin or the workpiece in a state after it is moved into the sealing mold; or supplying the resin to a cavity of the sealing mold disposed in the upper or lower mold.

Furthermore, preferably, the first sealant is a resin temporarily formed from a base resin, and the compression molding method further includes a step of temporarily molding the first sealant while the second sealant is added to it to form the sealant.

According to this invention, molding defects caused by the flow and uneven distribution of the sealing resin, residual gas, or insufficient resin amount can be prevented. Furthermore, molded articles with a thickness exceeding 1 mm can be formed. Additionally, the handling of the sealing resin is simplified, and dust generation during molding is prevented. Moreover, by adapting to a structure with a cavity in the upper mold, the aforementioned problems in a structure with a cavity in the lower mold can be solved.

1: Compression molding device

10A: Supply Unit

10B: Pressing Unit

10C: Storage Unit

10D: Base Resin Supply Unit

10E: Resin-forming unit

12: Feed box

14: Storage Box

20: Guide rail

22: Conveying device (first loader)

24: Conveying device (second loader)

30: Control and Computing Department

40: Base Resin Supply Department

50: Resin-forming part

60: Measurement Department

70: Resin sealing part

80: Resin Supply Department

102: Plate Making Die (First Die)

104: First upper mold

104a, 106a, 204a, 206a, 304a, 306a: Mold surface

106: First lower mold

108: Mold Cavity (First Mold Cavity)

110: Lower mold slot (first lower mold slot)

111: Lower mold film supply unit (first lower mold film supply unit)

112: Support column (first support column)

113: Upper mold film supply unit (first upper mold film supply unit)

114: Support Board (First Support Board)

122: Push Selling (First Push Selling)

124: Clamping Spring (First Clamping Spring)

126: Mold Cavity Component (First Mold Cavity Component)

128: Clamping Device (First Clamping Device)

140: Upper mold slot (first upper mold slot)

142: Pressure Plate (First Plate)

143: Groove formed at the foot

150: Pressing device (first pressing device)

152, 252, 352: Tie rods

154, 254, 354: Pressure plate (fixed pressure plate)

156, 256, 356: Pressure plate (movable pressure plate)

160, 260, 360: Drive source (electric motor)

162, 262, 362: Drive transmission mechanism (ball screw, toggle lever mechanism)

202: Sealing mold (second mold)

204: Second upper mold (upper mold)

205: Workpiece Holding Part

206: Second lower mold (lower mold)

208: Mold Cavity (Second Mold Cavity)

210: Upper mold groove (second upper mold groove)

211: Membrane Supply Unit (Second Upper Mold Membrane Supply Unit)

212: Support Column (Second Support Column)

214: Support Board (Second Support Board)

222: Push Selling (Second Push Selling)

224: Clamping Spring (Second Clamping Spring)

226: Mold Cavity Component (Second Mold Cavity Component)

228: Clamping device (second clamping device)

240: Lower mold slot (second lower mold slot)

242: Lower board (second board)

250: Pressing device (second pressing device)

302: Sealing mold (third mold)

304: Third upper mold

305: Workpiece Holding Part

306: Third lower mold

308: Mold Cavity (Third Mold Cavity)

310: Lower mold slot (third lower mold slot)

311: Membrane Supply Unit (Third Lower Mold Membrane Supply Unit)

312: Support column (third support column)

314: Support Board (Third Support Board)

322: Push Selling (Third Push Selling)

324: Clamping Spring (Third Clamping Spring)

326: Mold Cavity Component (Third Mold Cavity Component)

328: Clamping Device (Third Clamping Device)

340: Upper mold slot (third upper mold slot)

342: Upper board (third board)

350: Pressing device (third pressing device)

H: Altitude

F: Membrane

L1, L2: Length

L3: Gap

R: Sealing resin

R1: First sealing resin

R2: Second sealing resin

Ra: Main body

Rb: Feet

Rb1, Rb2, Rb3: Convex body

Rg: Groove section

Rm: Base resin

W: Workpiece (the part to be formed)

W1, W2: Width

Wa: Base material (glass or metal pallet)

Wb: Electronic components (semiconductor chips)

Wp: Molded product Molded product

X, Y, Z: Direction (X, Y, Z: Direction)

Figure 1 is a plan view showing an example of a compression molding apparatus according to an embodiment of the present invention.

Figure 2 is a side view showing an example of a first pressing device of a compression molding apparatus according to a first embodiment of the present invention.

Figure 3 is a front cross-sectional view of an example of the first mold of the compression molding apparatus of the first embodiment of the present invention.

Figure 4 is a side view showing an example of a second pressing device of the compression molding apparatus of the first embodiment of the present invention.

Figure 5 is a front cross-sectional view of an example of the second mold of the compression molding apparatus of the first embodiment of the present invention.

Figure 6 is an illustration of the compression molding method of the first embodiment of the present invention.

Figure 7 is an explanatory diagram that follows Figure 6.

Figure 8 is an explanatory diagram that follows Figure 7.

Figure 9 is an explanatory diagram that follows Figure 8.

Figure 10 is an explanatory diagram that continues from Figure 9.

Figure 11.11A is an enlarged view of part XI in Figure 10. Figure 11.11B is an explanatory diagram continuing from Figure 11.11A.

Figure 12 is an explanatory diagram following 11B in Figure 11.

Figure 13 is an explanatory diagram that follows Figure 12.

Figure 14 is a front cross-sectional view of another example of the first mold of the compression molding apparatus of the first embodiment of the present invention.

Figure 15 is a perspective view showing an example of a compression molding apparatus and a compression molding method according to an embodiment of the present invention, and an example of a sealing resin used in such an apparatus.

Figure 16 is a perspective view showing yet another example of the sealing resin used in the compression molding apparatus and compression molding method according to an embodiment of the present invention.

Figure 17 is a perspective view showing another example of the sealing resin used in the compression molding apparatus and compression molding method according to an embodiment of the present invention.

Figure 18 is a perspective view showing yet another example of the sealing resin used in the compression molding apparatus and compression molding method according to an embodiment of the present invention.

Figure 19 is a side view showing an example of a third pressing device in a compression molding apparatus of a second embodiment of the present invention.

Figure 20 is a side view showing an example of the third mold of the compression molding apparatus of the second embodiment of the present invention.

Figure 21 is an illustration of the compression molding method of the second embodiment of the present invention.

Figure 22 is an explanatory diagram that follows Figure 21.

Figure 23 is an explanatory diagram that follows Figure 22.

Figure 24 is an explanatory diagram that follows Figure 23.

Figure 25 is an explanatory diagram of the compression molding apparatus and compression molding method of a previous embodiment.

Figure 26 is an explanatory diagram of the compression molding apparatus and compression molding method of the previous embodiment.

[First Implementation Form]

(Overall structure)

The first embodiment of the present invention will now be described in detail with reference to the accompanying drawings. Figure 1 is a plan view (schematic view) showing an example of the compression molding apparatus 1 of the present embodiment (a structural diagram shared with the second embodiment). Furthermore, for ease of explanation, arrows are used in the figure to indicate the left-right direction (X direction), front-back direction (Y direction), and up-down direction (Z direction) of the compression molding apparatus 1. Additionally, in all the drawings used to explain each embodiment, components with the same function are labeled with the same symbols, and sometimes repeated descriptions are omitted.

The compression molding apparatus 1 of this embodiment includes a sealing mold and uses a sealing resin R to perform resin sealing (compression molding) of a workpiece (formed article) W. Furthermore, in this embodiment, a first sealing resin R1 and a second sealing resin R2 are used as the sealing resin R, as detailed below.

First, the workpiece W, the object of forming, includes a structure in which electronic components Wb are mounted on a substrate Wa. More specifically, examples of the substrate Wa include plate-shaped components such as resin substrates, ceramic substrates, metal substrates, transport plates, lead frames, and wafers. Examples of electronic components Wb include semiconductor chips, microelectromechanical system (MEMS) chips, passive components, heat sinks, conductive components, and gaskets. Furthermore, the substrate Wa can be rectangular (strip-shaped), square, or circular. Additionally, the number of electronic components Wb mounted on a substrate Wa is set to one or more (e.g., in a matrix shape).

Examples of methods for mounting electronic components Wb on a substrate Wa include wire bonding packaging and flip chip packaging. Alternatively, in cases where the self-molded part Wp is peeled off from the substrate (glass or metal pallet) Wa after resin sealing, methods using heat-peelable adhesive tape or UV-curable resin that hardens under ultraviolet light can be used to attach the electronic components Wb.

In this embodiment, thermosetting resins (such as epoxy resins containing fillers, but not limited to) are used as the base resin Rm and the sealing resin R (first sealing resin R1, second sealing resin R2). Furthermore, the base resin Rm is preferably a powdered resin (powdered resin) that is a thermosetting resin (details will be described later). However, it is not limited to this; it may also be configured to use granular resin, crushed resin, solid resin, liquid resin, or a combination of several of these.

Furthermore, as an example of membrane F, membrane materials with excellent heat resistance, ease of peeling, flexibility, and extensibility are preferable, such as polytetrafluoroethylene (PTFE), ethylene-tetrafluoroethylene (ETFE) (a polytetrafluoroethylene polymer), polyethylene terephthalate (PET), fluorinated ethylene propylene (FEP), fluorinated glass cloth, polypropylene, and polyvinylidene chloride. Moreover, membrane F can also be used when forming the sealing resin R in the resin forming section 50 described later.

Next, an overview of the compression molding apparatus 1 of this embodiment will be described. As shown in FIG1, the compression molding apparatus 1 includes the following parts as its main structure: a base resin supply unit 10D for supplying base resin Rm, etc.; a resin forming unit 10E for forming a first sealing resin R1 using base resin Rm, etc.; a supply unit 10A for supplying workpiece W and a second sealing resin R2, etc.; a pressing unit 10B for sealing workpiece W with resin and processing it into a molded article Wp, etc.; and a storage unit 10C for storing the molded article Wp, etc. As an example, along the X direction in Figure 1, a base resin supply unit 10D, a resin forming unit 10E, a supply unit 10A, a pressing unit 10B, and a receiving unit 10C are arranged sequentially. However, the structure is not limited to this; the equipment structure within the unit, the number of units, and the arrangement order of the units can be changed. For example, the supply unit 10A and the receiving unit 10C can be arranged opposite to each other in the X direction, or they can be arranged concentrated at the location of either one (not shown). Alternatively, a structure including units other than those described above can also be used (not shown).

Furthermore, in the compression molding apparatus 1, the guide rail 20 is arranged in a straight line spanning between each unit. A conveying device (first loader) 22 for conveying the workpiece W (and also for conveying the sealant R, etc.) and a conveying device (second loader) 24 for conveying the molded product Wp (and also for conveying the sealant R, etc.) are arranged to move along the guide rail 20 between predetermined units. However, the apparatus is not limited to this structure; it may also be configured as a single, shared conveying device (loader) for conveying the workpiece W, the sealant R, and the molded product Wp (not shown). Alternatively, the conveying device may be configured to include a robotic arm or the like instead of a loader.

Furthermore, in the compression molding apparatus 1, the control calculation unit 30, which performs the operation control of each mechanism in each unit, is located in the supply unit 10A (or it can be configured to be located in another unit).

(Base resin supply unit)

Next, the base resin supply unit 10D included in the compression molding apparatus 1 will be described.

The base resin supply unit 10D includes a base resin supply section 40 for supplying base resin Rm. As an example, the base resin supply section 40 includes a distributor, a conveying device, etc., for supplying base resin Rm. Furthermore, when conveying base resin Rm from the base resin supply unit 10D to the resin forming unit 10E, the conveying device may be a first loader 22, or other conveying devices (not shown).

(Resin-forming unit)

Next, the resin forming unit 10E included in the compression molding apparatus 1 will be described.

The resin forming unit 10E includes a resin forming section 50, which forms a first sealing resin R1 using a base resin Rm. In this embodiment, one resin forming unit 10E includes one (or more) resin forming sections 50 (see FIG. 1). Alternatively, two (or more than three, or one) resin forming units 10E may be included.

The resin forming section 50 includes a tableting mold (first mold) 102, which has a pair of molds for opening and closing (e.g., a mold assembled from multiple mold blocks, mold plates, mold pillars, or other components made of alloy tool steel). It also includes a pressing device (first pressing device) 150 that drives the opening and closing of the first mold 102. As an example, the structure may include two first pressing devices 150, or it may include one, or it may include multiple (three or more) devices (not shown). A side view (schematic view) of the first pressing device 150 is shown in FIG2, and a front cross-sectional view (schematic view) of the first mold 102 is shown in FIG3.

Here, as shown in Figure 2, the first pressing device 150 includes a pair of pressing plates 154 and 156, multiple pull rods 152 supporting the pair of pressing plates 154 and 156, and a drive device for moving (lifting) the pressing plate 156. Specifically, the drive device includes a drive source (e.g., an electric motor) 160 and a drive transmission mechanism (e.g., a ball screw or toggle mechanism) 162, etc. (however, it is not limited to this). In this embodiment, the pressure plate 154 on the upper side in the vertical direction is designated as a fixed pressure plate (fixed to the pull rod 152), and the pressure plate 156 on the lower side is designated as a movable pressure plate (a pressure plate that can slide and remain on the pull rod 152 while rising and falling). However, this is not a limitation; the configuration can be reversed, i.e., the upper side can be designated as a movable pressure plate and the lower side as a fixed pressure plate, or both the upper and lower sides can be designated as movable pressure plates (neither shown in the figures).

On the other hand, as shown in FIG3, the first mold 102 includes a first upper mold 104 on the upper side and a first lower mold 106 on the lower side in the vertical direction, serving as a pair of molds disposed between the pair of pressure plates 154 and 156 in the first pressing device 150. The first upper mold 104 is assembled to the upper pressure plate (a fixed pressure plate 154 in this embodiment), and the first lower mold 106 is assembled to the lower pressure plate (a movable pressure plate 156 in this embodiment). Mold closing/opening is performed by the first upper mold 104 and the first lower mold 106 approaching/moving away from each other (the vertical direction (up and down direction) becomes the mold opening and closing direction). In the first mold 102 of this embodiment, the first upper mold 104 forms a so-called "pestle shape," and the first lower mold 106 forms a so-called "mortar shape."

Next, the first lower mold 106 of the first mold 102 will be described in detail. As shown in FIG3, the first lower mold 106 includes a lower mold groove (first lower mold groove) 110, a mold cavity component (first mold cavity component) 126 held therein, a clamping device (first clamping device) 128, etc. The first lower mold groove 110 is fixed to the upper surface of the support plate (first support plate) 114 by a support post (first support post) 112. A mold cavity (first mold cavity) 108 is provided on the upper surface of the first lower mold 106 (the side of the first upper mold 104). A prescribed amount of base resin Rm is contained in the first mold cavity 108.

The first clamp 128 is configured in an annular shape to surround the first mold cavity module 126, and is assembled in a manner that allows it to move vertically (separately and buoyantly) relative to the upper surface of the first support plate 114 via a push pin (first push pin) 122 and a clamping spring (first clamping spring) 124 (e.g., a force-applying component exemplified by a coil spring). (However, this assembly structure is not limited.) The first mold cavity module 126 forms the interior (bottom) of the first mold cavity 108, and the first clamp 128 forms the side of the first mold cavity 108. Furthermore, the shape or number of first mold cavities 108 disposed in a first lower mold 106 is suitably configured (one or more).

Here, the first pressing apparatus 150 is provided with a lower mold film supply unit (first lower mold film supply unit) 111, which supplies a film F for covering the mold surface 106a (a defined area) in the first lower mold 106, including the inner surface of the first mold cavity 108. Furthermore, as an example, the film F is roller-shaped, but it can also be elongated.

Furthermore, the first lower mold 106 is provided with a suction path (hole or groove, etc.) (not shown) communicating with the suction device at the first clamping member 128 or at the boundary of the first mold cavity member 126. This allows the film F supplied from the first lower mold film supply unit 111 to be adsorbed and held on the mold surface 106a, which includes the inner surface of the first mold cavity 108.

Furthermore, in this embodiment, a first lower mold heating mechanism (not shown) is provided to heat the first lower mold 106 to a predetermined temperature. This first lower mold heating mechanism includes a heater (e.g., an electric heating wire heater), a temperature sensor, a power supply, etc., and the heating is controlled by a control calculation unit 30. As an example, the heater is a structure built into the first lower mold groove 110 and applies heat to the entire first lower mold 106 and the base resin Rm housed within the first mold cavity 108. At this time, the first lower mold 106 is heated so that the base resin Rm reaches a predetermined temperature (e.g., 50°C to 80°C) to a level that prevents heat curing (formal curing).

Next, the first upper mold 104 of the first mold 102 will be described in detail. As shown in FIG3, the first upper mold 104 includes a pressing plate (first plate) 142, which is formed (pressed) by pressing a predetermined amount of base resin Rm housed in the first mold cavity 108 of the first lower mold 106 to form a first sealing resin R1 having a predetermined shape corresponding to the shape of the workpiece W (details of the forming method will be described later). The first plate 142 is held (fixed) in the upper mold groove (first upper mold groove) 140. As an example, a foot forming groove (including a recess) 143 for forming the foot Rb of the first sealing resin R1 is provided on the lower surface of the first plate 142 (the surface on the side of the first lower mold 106). Additionally, the foot forming groove 143 is disposed on the first plate 142, but it can also be disposed on the first mold cavity module 126, or both.

Here, the first pressing apparatus 150 is provided with an upper mold film supply unit (first upper mold film supply unit) 113, which supplies a film F for covering the mold surface 104a (defined area) of the first upper mold 104. Furthermore, as an example, the film F is roller-shaped, but it can also be elongated.

Furthermore, the first upper mold 104 is provided with a suction path (hole or groove, etc.) (not shown) communicating with the suction device on the first plate 142, etc. This allows the film F supplied from the first upper mold film supply unit 113 to be adsorbed and held on the mold surface 104a.

Furthermore, in this embodiment, a first upper mold heating mechanism (not shown) is provided to heat the first upper mold 104 to a predetermined temperature. This first upper mold heating mechanism includes a heater (e.g., an electric heating wire heater), a temperature sensor, a power supply, etc., and the heating is controlled by a control calculation unit 30. As an example, the heater is built into the first upper mold groove 140 and applies heat to the entire first upper mold 104. At this time, the first upper mold 104 is heated so that the base resin Rm held (received) in the first lower mold 106 reaches a predetermined temperature (e.g., 50°C to 80°C) to a level that prevents heat curing (formal curing).

Furthermore, as one example, the first mold 102 has a structure with a movable clamp (first clamp 128); as another example, as shown in Figure 14, it can also have a structure without a movable clamp.

(Supply Unit)

Next, the feeding unit 10A included in the compression molding apparatus 1 will be described.

The supply unit 10A includes a supply box 12 that holds multiple workpieces W. Here, the supply box 12 uses a known stackable box, slotted box, or the like. Additionally, it includes a measurement unit 60 that measures and outputs measurement data for each workpiece W that is to be sealed, specifically measuring the presence or absence of electronic components Wb mounted on a substrate Wa (the number of components mounted or missing, and possibly including measurements of the height or weight of the electronic components Wb). For example, the measurement unit 60 is configured to calculate the presence or absence of electronic components Wb by measuring the weight of the workpiece W. However, the structure is not limited to the described one; it can also be configured to photograph the mounting surface of the electronic components on the substrate Wa, and calculate the quantity of electronic components Wb by image processing.

As an example, the measuring unit 60 is located in the supply unit 10A, but it can also be configured in other units (not shown). Alternatively, as another example, it can be configured as follows (not shown): the measuring unit 60 is located outside the compression molding apparatus 1, and measurement data on the presence or absence of electronic components Wb for each workpiece W is sent to this apparatus (compression molding apparatus 1).

The supply unit 10A includes a resin supply section 80 for supplying the second sealant R2. As an example, the resin supply section 80 includes a distributor, a conveying device, etc., for supplying the second sealant R2. Furthermore, when conveying the second sealant R2 from the supply unit 10A to the pressing unit 10B, the conveying device can be the first loader 22, or other conveying devices (not shown).

Furthermore, the supply unit 10A may also be configured to include a workpiece stage (not shown) for placing the workpiece W taken from the supply box 12. Additionally, the supply unit 10A may also be configured to include a resin stage (not shown) for placing the sealing resin R (which may be a first sealing resin R1, or a first sealing resin R1 and a second sealing resin R2, hereinafter the same).

The workpiece W and the sealant R are held in the first loader 22 and conveyed to the pressing unit 10B, where they are installed in a predetermined position on the second mold 202. In this embodiment, the workpiece W is held in the workpiece holding portion 205 of the second lower mold 206, and the sealant R is placed above the workpiece W held in the workpiece holding portion 205 (details of the steps will be described later). Furthermore, the holding mechanism for the workpiece W and the sealant R in the first loader 22 uses a known holding mechanism (e.g., a structure with holding claws for clamping, a structure with suction holes communicating with a suction device for adsorption, etc.) (not shown).

As a variation of the conveying device, it can also be configured as follows (not shown): a conveying device (loader) that moves along the X direction for inter-unit transport, and a conveying device (loader) that moves along the Y direction for loading and installation into the second mold 202, replacing the first loader 22 that moves along both the X and Y directions.

Additionally, the supply unit 10A includes a preheating heater (not shown) for preheating the workpiece W or the sealant R. As an example, the preheating heater uses a known heating mechanism (e.g., an electric heating wire heater, an infrared heater, etc.). This allows for preheating of the workpiece W or the sealant R before it is loaded into the second mold 202. Alternatively, the structure may not include a preheating heater. Furthermore, the structure may include a preheating heater (not shown) in the first loading machine 22 instead of a preheating heater, or the first loading machine 22 may include both a preheating heater (not shown) and a preheating heater.

(Pressure unit)

Next, the compression forming unit 10B included in the compression forming apparatus 1 will be described.

The pressing unit 10B includes a resin sealing part 70, which seals the workpiece W with resin and processes it into a molded article Wp. In this embodiment, one pressing unit 10B includes one (or more) resin sealing parts 70 (see FIG. 1). Alternatively, there may be two (or more, or one) pressing units 10B containing the resin sealing part 70.

The resin sealing part 70 includes a sealing mold (second mold) 202, which has a pair of molds for opening and closing (e.g., a mold assembled from multiple mold blocks, mold plates, mold pillars, or other components made of alloy tool steel). It also includes a pressing device (second pressing device) 250 for driving the opening and closing of the second mold 202. As an example, it may be configured to include two second pressing devices 250, or it may be configured to include one, or it may be configured to include multiple (three or more) devices (not shown). A side view (schematic view) of the second pressing device 250 is shown in FIG. 4, and a front cross-sectional view (schematic view) of the second mold 202 is shown in FIG. 5.

Here, as shown in Figure 4, the second pressing device 250 includes a pair of pressing plates 254 and 256, multiple pull rods 252 supporting the pair of pressing plates 254 and 256, and a drive device for making the pressing plates 256 movable (lifting). Specifically, the drive device includes a drive source (e.g., an electric motor) 260 and a drive transmission mechanism (e.g., a ball screw or toggle mechanism) 262, etc. (but is not limited to this). In this embodiment, the pressure plate 254 on the upper side in the vertical direction is designated as a fixed pressure plate (fixed to the pull rod 252), and the pressure plate 256 on the lower side is designated as a movable pressure plate (a pressure plate that can slide and be held in place by the pull rod 252 while rising and falling). However, this is not a limitation; the configuration can be reversed, i.e., the upper side can be designated as a movable pressure plate and the lower side as a fixed pressure plate, or both the upper and lower sides can be designated as movable pressure plates (neither shown in the figures).

On the other hand, as shown in Figure 5, the second mold 202 includes one mold (second upper mold 204) on the upper side in the vertical direction and another mold (second lower mold 206) on the lower side, serving as a pair of molds disposed between the pair of pressure plates 254 and 256 in the second pressing device 250. That is, the second upper mold 204 is assembled to the upper pressure plate (a fixed pressure plate 254 in this embodiment), and the second lower mold 206 is assembled to the lower pressure plate (a movable pressure plate 256 in this embodiment). Mold closing/opening is achieved by the second upper mold 204 and the second lower mold 206 approaching/moving away from each other (the vertical direction becomes the mold opening/closing direction).

Next, the second upper mold 204 of the second mold 202 will be described in detail. As shown in Figure 5, the second upper mold 204 includes an upper mold groove (second upper mold groove) 210, and a mold cavity component (second mold cavity component) 226 and a clamping device (second clamping device) 228 held therein. The second upper mold groove 210 is fixed to the lower surface of the support plate (second support plate) 214 by a support post (second support post) 212. A mold cavity (second mold cavity) 208 is provided on the lower surface of the second upper mold 204 (the surface on the side of the second lower mold 206).

The second clamping member 228 is configured in an annular shape to surround the second mold cavity module 226, and is assembled in a manner that allows it to move up and down detachably (floatably) relative to the lower surface of the second support plate 214 via a push pin (second push pin) 222 and a clamping spring (second clamping spring) 224 (e.g., a force-applying component exemplified by a coil spring). (However, this assembly structure is not limited.) The second mold cavity module 226 forms the interior (bottom) of the second mold cavity 208, and the second clamping member 228 forms the side of the second mold cavity 208. Furthermore, the shape or number of second mold cavities 208 disposed on a second upper mold 204 is suitably set (one or more) according to the shape or number of workpieces W.

Here, the second pressing apparatus 250 is provided with a film supply unit (second upper mold film supply unit) 211, which supplies film F to cover the mold surface 204a (a defined area) in the second upper mold 204, which includes the inner surface of the second mold cavity 208. Furthermore, as an example, film F is roller-shaped, but it can also be elongated.

Furthermore, the second upper mold 204 is provided with suction channels (holes or grooves, etc.) (not shown) that communicate with the suction device on the lower surface of the second clamping member 228 or at the boundary between the second clamping member 228 and the second mold cavity member 226. This allows the film F supplied from the second upper mold film supply unit 211 to be adsorbed and held on the mold surface 204a, which includes the inner surface of the second mold cavity 208.

Furthermore, in this embodiment, a second upper mold heating mechanism (not shown) is provided to heat the second upper mold 204 to a predetermined temperature. This second upper mold heating mechanism includes a heater (e.g., an electric heating wire heater), a temperature sensor, a power supply, etc., and the heating is controlled by a control calculation unit 30. As an example, the heater is built into the second upper mold groove 210 and heats the second upper mold 204 to a predetermined temperature (e.g., 100°C to 300°C).

Next, the second lower mold 206 of the second mold 202 will be described in detail. As shown in Figure 5, the second lower mold 206 includes a lower mold groove (second lower mold groove) 240 and a lower plate (second plate) 242 held therein.

In this embodiment, a workpiece holding part 205 is provided to hold the workpiece W at a predetermined position on the upper surface of the second plate 242. As an example, the workpiece holding part 205 has a workpiece guide pin (not shown) and a suction path (hole or groove, etc.) (not shown) that passes through the second plate 242 and communicates with a suction device. Specifically, one end of the suction path passes through the mold surface 206a of the second lower mold 206, and the other end is connected to a suction device disposed outside the second lower mold 206. This allows the suction device to be driven to draw the workpiece W from the suction path, and the workpiece W to be adsorbed and held on the mold surface 206a (the upper surface of the second plate 242). Alternatively, the structure can be configured such that retaining claws (not shown) clamping the outer periphery of the workpiece W replace the adsorption and holding mechanism, or it can include both retaining claws (not shown) clamping the outer periphery of the workpiece W and the adsorption and holding mechanism. Furthermore, the shape or number of workpiece holding portions 205 disposed on a second lower mold 206 is appropriately set according to the shape or number of workpieces W (one or more).

Furthermore, in this embodiment, a second lower mold heating mechanism (not shown) is provided to heat the second lower mold 206 to a predetermined temperature. This second lower mold heating mechanism includes a heater (e.g., an electric heating wire heater), a temperature sensor, a power supply, etc., and the heating is controlled by a control calculation unit 30. As an example, the heater is built into the second lower mold groove 240 and heats the second lower mold 206 to a predetermined temperature (e.g., 100°C to 300°C).

(Storage Unit)

Next, the storage unit 10C included in the compression molding apparatus 1 will be described.

The molded article Wp is held in the second loading machine 24 and removed from the second mold 202, then conveyed to the receiving unit 10C. Furthermore, the holding mechanism of the molded article Wp in the second loading machine 24 uses a known holding mechanism (e.g., a structure with holding claws for clamping, a structure with a suction hole communicating with a suction device for adsorption, etc.) (not shown).

As a variation of the conveying device, it can also be configured as follows (not shown): a conveying device (loader) that moves along the X direction to transport between units, and a conveying device (loader) that moves along the Y direction to remove parts from the second mold 202, replacing the second loader 24 that moves along both the X and Y directions.

The storage unit 10C includes a storage box 14 for storing multiple molded parts Wp. Here, the storage box 14 uses known stackable boxes, narrow-gauge boxes, etc.

Furthermore, the storage unit 10C can also be configured to include a molded article platform (not shown) for holding the molded article Wp transported by the self-pressing unit 10B.

(Compression forming method)

Next, the steps of the compression molding method of this embodiment, implemented using the compression molding apparatus 1, will be explained. Here, Figures 6 to 13 are explanatory diagrams of each step, and are shown as front cross-sectional views in the same direction as Figures 3 and 5.

First, a first preparation step is performed. This first preparation step includes the following steps: A heating step is performed whereby the first lower mold 106 is adjusted to a predetermined temperature (a temperature at which the base resin Rm and the first sealing resin R1 will not fully harden, for example, 50°C to 80°C) and heated using a first lower mold heating mechanism (first lower mold heating step). Additionally, a heating step is performed whereby the first upper mold 104 is adjusted to a predetermined temperature (a temperature at which the base resin Rm and the first sealing resin R1 will not fully harden, for example, 50°C to 80°C) and heated using a first upper mold heating mechanism (first upper mold heating step). Additionally, a lower mold film supply step (first lower mold film supply step) is implemented, in which the first lower mold film supply unit 111 is operated to supply new film F, and the film is adsorbed in a manner covering a predetermined area of the mold surface 106a, which includes the inner surface of the first mold cavity 108, in the first lower mold 106. Furthermore, a higher mold film supply step (first upper mold film supply step) is implemented, in which the first upper mold film supply unit 113 is operated to supply new film F, and the film is adsorbed in a manner covering a predetermined area of the mold surface 104a of the first upper mold 104.

Before, after, or in parallel with the first preparation step, a resin preparation step for preparing the first sealing resin R1 is performed. The first sealing resin R1 is a solid/semi-solid resin having a predetermined shape (described later) corresponding to the shape of the workpiece W, and has a first component (the amount of resin, i.e., grams). In this embodiment, the "first component" is set to the same amount required to seal the workpiece W when there are no missing electronic components Wb mounted on the substrate Wa. However, this is not a limitation; as another example of the "first component," it can also be configured as follows: multiple shaped quantities corresponding to the type of workpiece W to be sealed are prepared, and the control calculation unit 30 or the operator selects and sets the most suitable one based on the type of workpiece W among the shaped quantities.

As an example of the resin preparation step, in the base resin supply section 40, a base resin Rm having a first component is supplied by a dispenser (not shown). Next, a tableting step is performed: in the resin forming section 50, the base resin Rm is tableted to form a solid/semi-solid resin having a predetermined shape (described later) corresponding to the shape of the workpiece W as a first sealing resin R1 having a first component. Normally, a "whole" of the first sealing resin R1 having a first component is formed in one piece, but it can also be configured to form a "whole" of the first sealing resin R1 having a first component in several (e.g., two or three) segments. Furthermore, the term "semi-solid" refers to a state that is not completely solid but rather molten to the so-called B-stage.

Regarding the tableting step, specifically, a base resin Rm with a first component supplied from the base resin supply unit 40 is received in the first mold cavity 108 of the first lower mold 106 by a conveying device or the like (see FIG. 6). Next, the first pressing device 150 is operated to close the first mold 102, which is heated to the predetermined temperature (see FIG. 7). At this time, the first mold cavity module 126 rises relative to each other within the first mold cavity 108, and the base resin Rm is tableted (clamped and pressurized) using the first mold cavity module 126 and the first plate 142. This forms a first sealing resin R1 in a solid/semi-solid state with a predetermined shape and without heat curing (formal curing). At this point, the base resin Rm that enters the foot forming groove 143 of the first plate 142 through the membrane F becomes the foot Rb of the first sealing resin R1, and the remaining base resin Rm becomes the main body Ra of the first sealing resin R1 (the detailed structure of the first sealing resin R1 will be described later). Furthermore, as a variation of the tableting process, a portion of the base resin Rm can also be held (melted, held, etc.) in the first upper mold 104 (not shown).

The tableting step is crucially performed at a temperature at which the base resin Rm will not undergo thermosetting (formal curing) (by heating the first lower mold 106 and the first upper mold 104 to a temperature at which thermosetting (formal curing) will not occur), so that the formed first sealing resin R1 can undergo thermosetting (formal curing) in the subsequent resin sealing step. As mentioned above, the "temperature at which thermosetting will not occur" also depends on the material of the base resin Rm, but as a specific example, it is approximately 50°C to 80°C (approximately 70°C in this embodiment).

Furthermore, it is preferable to use powdered resin as the base resin Rm. Accordingly, compared to using granular or crushed resin, the amount of resin can be adjusted and supplied with extremely high precision. However, it is not limited to powdered resin.

Alternatively, as another example of the resin preparation step, it can be configured as follows (not shown): a first sealing resin R1 with the same structure as described is pre-formed outside the device and housed in a storage container or the like, or supplied to this device (compression molding device 1) via a conveying device.

Following the tableting step, the first mold 102 is opened, and the first sealant R1 is separated from the used film F and removed (first mold opening step) (see FIG. 8). In this embodiment, by including the lower mold film supply step and the upper mold film supply step, the film F is placed on both the mold surface 106a of the first lower mold 106 and the mold surface 104a of the first upper mold 104. Therefore, demolding of the first sealant R1 formed by tableting becomes easier, thereby preventing defects caused by resin adhering to the mold.

After the first mold-opening step, the resin loading step, described later, is performed. Additionally, after the first mold-opening step, or concurrently, the following mold film supply steps (first lower mold film supply step, first upper mold film supply step) are performed: the first lower mold film supply unit 111 and the first upper mold film supply unit 113 are operated to deliver the used film F from the first mold 102, and a new film F is delivered and installed in the first mold 102.

Additionally, a second preparation step is performed before, after, or in parallel with the first preparation step. The second preparation step includes the following steps: A heating step (second upper mold heating step) is performed, in which the second upper mold 204 is adjusted to a predetermined temperature (e.g., 100°C to 300°C) and heated using a second upper mold heating mechanism. Additionally, a heating step (second lower mold heating step) is performed, in which the second lower mold 206 is adjusted to a predetermined temperature (e.g., 100°C to 300°C) and heated using a second lower mold heating mechanism. Additionally, a membrane supply step (second upper mold membrane supply step) is implemented, in which the second upper mold membrane supply unit 211 is operated to supply a new membrane F, which is adsorbed in such a way that it covers a predetermined area of the mold surface 204a, which includes the inner surface of the second mold cavity 208, in the second upper mold 204.

Following the second preparation step, a workpiece holding step is performed to hold the workpiece W in the workpiece holding portion 205 of the second lower mold 206. Specifically, the first loader 22 holds the workpiece W supplied from the feed hopper 12 and moves it into the second mold 202, where it is held in the workpiece holding portion 205.

Following the workpiece holding step, a resin placement step (see Figure 9) is performed, in which the first sealing resin R1 prepared in the resin preparation step is placed at a predetermined position. Specifically, the first sealing resin R1 prepared in the resin preparation step (for example, formed in the resin forming section 50) is transported into the second mold 202 by the first loading machine 22 (or other conveying device), and placed above the workpiece W held by the workpiece holding section 205 (specifically, on the mounting surface of the electronic component of the substrate Wa).

Alternatively, as another example of the resin loading step, it can be implemented by loading the first sealing resin R1 prepared in the resin preparation step onto the workpiece W before the workpiece holding step. In this case, the workpiece holding step becomes a step of holding the workpiece W with the first sealing resin R1 loaded in the workpiece holding part 205. That is, the first loader 22 holds the workpiece W with the first sealing resin R1 loaded and moves it into the second mold 202, and holds it in the workpiece holding part 205. This has the advantage that the workpiece W and the first sealing resin R1 are moved into the second mold 202 at the same time, rather than being moved into the second mold 202 separately.

Furthermore, a calculation step is performed at any point before the workpiece holding step. Specifically, the measuring unit 60 measures the quantity of electronic components Wb mounted on a substrate Wa for each workpiece W (the quantity mounted or missing, and may also include measuring the height of the electronic components Wb or measuring their weight). Then, the control calculation unit 30 calculates the total amount of sealant R required to seal the measured workpiece W based on the measurement data, and compares the total amount with a first component of the first sealant R1. Furthermore, as described above, the following structure (not shown) can also be configured: the measuring unit 60 is disposed outside the compression molding apparatus 1, and sends measurement data on the presence or absence of electronic components Wb for each workpiece W to the control and calculation unit 30 of this apparatus.

Next, if the calculation step results in the first component being insufficient relative to the total quantity, the following additional resin preparation step is performed: in addition to the first sealing resin R1, a second sealing resin R2 having a second component (amount of resin, i.e., grams) equivalent to the insufficient amount is also prepared as sealing resin R. Specifically, the control calculation unit 30 outputs an instruction to supply the second sealing resin R2 having a second component equivalent to the insufficient amount, and the resin supply unit 80 supplies the second sealing resin R2, thereby setting it to a state usable in the next resin supply step. Here, the insufficient amount is caused by the absence (not mounted, fallen, etc.) of the electronic component Wb in the workpiece W. Furthermore, as the second sealing resin R2, powdered resin, granular resin, crushed resin, solid resin, and liquid resin can be used.

Next, an additional resin supply step is performed, in which the second sealing resin R2 is supplied to a designated position (see Figure 10). Specifically, the second sealing resin R2, prepared in the additional resin preparation step, is transported into the second mold 202 by the first loading machine 22 (or other conveying device), and supplied (placed) onto the first sealing resin R1 held in the workpiece holding part 205 (or onto the workpiece W (substrate Wa)). Accordingly, even if the total amount of resin required increases due to a lack of electronic components Wb in the workpiece W, the required total amount of resin can be easily and quickly ensured, thus preventing molding defects caused by insufficient resin.

Alternatively, as another example of the resin supply step, it can be implemented by supplying (placing) the second sealing resin R2 prepared in the resin preparation step onto the first sealing resin R1 (or the workpiece W (substrate Wa)) before the workpiece holding step. In this case, the workpiece holding step becomes the step of holding the workpiece W, which is in a state of having the first sealing resin R1 and the second sealing resin R2 placed on it, in the workpiece holding portion 205. That is, the first loading machine 22 holds the workpiece W, which is in a state of having the first sealing resin R1 and the second sealing resin R2 placed on it, and moves it into the second mold 202, thereby holding it in the workpiece holding portion 205. It has the following advantages: The workpiece W, the first sealant R1, and the second sealant R2 are all loaded into the second mold 202 in one operation, rather than being loaded into the second mold 202 separately. Furthermore, since the sealing mold 202 can be filled in simultaneously, the thermal processes of the first sealant R1 and the second sealant R2 are also identical.

Furthermore, as another example of the additional resin supply step, it can also be implemented as follows: before the next resin sealing step, the second sealing resin R2 prepared in the additional resin preparation step is loaded into the second mold 202 by the first loader 22 (or other conveying device), and then supplied (melting, holding, etc.) to the mold cavity 208 provided in the second mold 202 (upper mold 204 in this embodiment) and disposed therein.

After all the aforementioned steps are performed, a resin sealing step is performed to seal the workpiece W with a sealing resin R (although there are first sealing resin R1 and second sealing resin R2, there is also a possibility that the second sealing resin R2 may not be supplied based on the result of the calculation step) to process it into a molded product Wp. Specifically, a mold closing step (second mold closing step) is performed, in which the second mold 202 is closed and the second mold cavity component 226 is lowered relative to the second mold cavity 208 to heat and pressurize the workpiece W with the sealing resin R. Herein, the sealing resin R is thermocured, and resin sealing (compression molding) is completed (see Figure 12).

As described above, for example, for workpieces W such as those carrying wire-connected strip-shaped electronic components (semiconductor chips) Wb, in previous compression molding apparatuses with a cavity in the upper die, during the die-closing step, the wire portion of the workpiece held in the lower die deforms due to contact with the sealing resin pre-supplied to the cavity or the sealing resin supplied to the workpiece, thus causing difficulties in resin sealing. Therefore, for such workpieces W, compression molding apparatuses with a cavity in the lower die are generally used. However, even with a cavity in the lower die, the aforementioned problems still exist (as described above).

To address the aforementioned problem, the compression molding apparatus 1 of this embodiment has a structure in which a second mold cavity 208 is provided in the second upper mold 204, and the first sealing resin R1 used as the sealing resin R is a solid/semi-solid resin formed with a predetermined shape corresponding to the shape of the workpiece W, thereby achieving the solution.

Specifically, the "defined shape" refers to a shape that does not abut against the electronic component Wb (which includes the wires if it is placed on the substrate Wa of the workpiece W). As an example, as shown in FIG9, a first sealing resin R1 is preferably shaped like having a main body Ra and feet Rb that are intermittently (or continuously) erected on one side of the main body Ra (the side facing the electronic component Wb of the workpiece W) (however, it is not limited to this shape). The main body Ra is the size that enters the second mold cavity 208 when viewed from above, and is preferably slightly smaller than the shape of the second mold cavity 208 (especially the second mold cavity module 226) if resin flow is taken into account. Furthermore, the foot Rb needs to have a height H (refer to 11A in Figure 11) that does not contact the electronic component Wb, but this does not preclude contact to the extent that the wires will not undergo plastic deformation. Additionally, the foot Rb is positioned so that it does not contact the electronic component Wb when viewed from above the main body Ra, and that the main body Ra does not tilt when placed on the substrate Wa of the workpiece W. Furthermore, it is preferable to position it between or around the electronic components Wb so that the wiring (especially the wires) of the workpiece W is not damaged during molding. Details of a specific structural example of the first sealant R1 (Figures 15-18) will be described later.

According to the structure described, during the mold closing step, as shown in Figure 11, transitioning from 11A to 11B, the sealing resin R (first sealing resin R1, second sealing resin R2) softens and melts due to heating (furthermore, Figures 11A and 11B are shown as enlarged views of part XI in Figure 10). At this time, the resin (specifically, the main body Ra of the first sealing resin R1) is uniformly in contact with all the conductors (see Figure 11B). As a result, the effect of preventing conductor flow is achieved.

The inventors of this application conducted experiments using the compression molding apparatus 1 of this embodiment. As a result, compared to previous compression molding apparatuses that hold the workpiece in the upper die and have a mold cavity in the lower die to which sealing resin (specifically, granular resin) is supplied, it was confirmed that the apparatus prevents wire flow and improves molding quality.

Furthermore, by using a solid/semi-solid resin as the first sealing resin R1, problems such as uneven distribution, residual gas, and dust generated during molding caused by particulate resins, or difficulties in handling, can be solved or reduced, as previously described. Additionally, even when forming molded articles with a thickness exceeding 1 mm, it can prevent the film F from biting into the molded article Wp.

Furthermore, the subsequent steps following the second mold closing step are the same as the previous compression molding method. In summary, the second mold 202 is opened, and the molded article Wp is separated from the used film F and removed (second mold opening step) (see Figure 13). Next, the molded article Wp is removed from the second mold 202 and transported to the storage unit 10C by the second loading machine 24. Additionally, after the molded article removal step, or concurrently, the second upper mold film supply unit 211 is operated to deliver the used film F from the second mold 202, and a new film F is fed into and installed in the second mold 202 (second upper mold film supply step).

The above outlines the main steps of the compression molding method using compression molding apparatus 1. However, the order of these steps is only one example; the order can be changed or they can be performed in parallel, provided it does not impede the process.

(Sealing resin)

Next, the specific structure of the first sealing resin R1 used in the compression molding method using the compression molding apparatus 1 is illustrated in Figures 15-18, and its features are explained.

First, as a common structure in the examples shown in Figures 15 to 18, the main body Ra is formed in a plate shape (or, it can be a shape other than a plate shape, such as a block shape with concave or convex portions). Additionally, the foot Rb is vertically disposed on the main body Ra at a predetermined position (designed position) on the substrate Wa of the workpiece W, such that it does not come into contact with the electronic component Wb of the workpiece W, and is formed at a height H (see 11A in Figure 11) to ensure that the main body Ra does not come into contact with the electronic component Wb. As described above, in the tableting step, the base resin Rm that enters the foot forming groove 143 of the first plate 142 via the membrane F becomes the foot Rb of the first sealing resin R1, and the remaining base resin Rm becomes the main body Ra of the first sealing resin R1.

In the example of the first sealant R1 shown in Figure 15, the foot Rb is formed as a convex body Rb1 with a thin tip, entirely (or partially) arranged in a dotted pattern. As an example, the convex body Rb1 is disposed at multiple locations, and is formed such that, in top view, the ratio t of length L1 to width W1 is 0.5 ≤ t ≤ 2. Accordingly, by having the foot Rb as a columnar structure with dotted arrangements, the flow of the sealant R (especially the first sealant R1) placed on the workpiece W during compression molding can be suppressed. Therefore, wire flow can be prevented, thereby improving molding quality. Furthermore, in Figure 15, the four corners are R-shaped, but they could also be chamfered or angled.

In the example of the first sealant R1 shown in Figure 16, the foot Rb is formed as a partially (or entirely) linearly arranged convex body Rb2. As an example of the convex body Rb2, it is disposed at one position (or multiple positions) and formed such that the ratio t of its length L2 to its width W2 when viewed from above is t<0.5 or 2<t. In this way, resin flow can be intentionally generated from the foot Rb (in this case, the convex body Rb2) with a dam-like structure of a predetermined length, thereby promoting the filling of the sealant R (especially the first sealant R1) into narrow portions of the workpiece W (e.g., between a substrate Wa connected via a flip chip and an electronic component Wb). Therefore, it prevents gas from remaining in the molded part Wp, thereby improving the molding quality.

In the example of the first sealing resin R1 shown in Figure 17, the foot Rb is formed as a convex body Rb3 arranged in a way that discontinuously (or continuously) surrounds the entire area (outer edge region) of the outer periphery (referring to the outer edge region) of the main body Ra. As an example of the convex body Rb3, convex bodies with the same structure as the convex body Rb2 are formed by connecting them circumferentially while providing gaps L3 at predetermined intervals. Generally, the outer periphery of the sealing resin R in the molded article Wp is the position cut by a slicing machine or the like during monolithization, and there are no electronic components Wb there. Therefore, a larger amount of resin is required for sealing compared to the central position. Therefore, by arranging the foot Rb (in this case, a convex body Rb3) in a manner that surrounds the entire outer periphery, as in this structure, more resin can be supplied to the outer periphery while suppressing resin flow during compression molding. Furthermore, by providing the gap L3, the discharge of gaseous components such as air from the interior (central portion) to the exterior is promoted.

On the other hand, the example of the first sealant R1 shown in FIG18 is a structural example related to the other side of the main body Ra (the side without the foot Rb, i.e., the side not facing the electronic component Wb of the workpiece W). Specifically, on the other side of the main body Ra, a linear groove Rg is formed at the position for single-piece cutting. This reduces wear on the cutting edge and dust generated during cutting. As an example, the groove Rg is arranged in a grid pattern consistent with the cutting position, but it is not limited to this. Furthermore, to form the groove Rg, the pressing step can be performed using a first mold cavity module 126 with corresponding protrusions (not shown) on its upper surface.

[Second Implementation Form]

Next, a second embodiment of the invention will be described. The basic structure of the compression molding apparatus 1 and compression molding method in this embodiment is the same as that in the first embodiment, but there are differences in the structure of the pressing unit 10B (particularly the structure of the pressing apparatus and the sealing mold) and the steps implemented centered on the pressing unit 10B. Hereinafter, this embodiment will be described focusing on these differences.

The pressing unit 10B of this embodiment includes a sealing mold (third mold) 302, which has a pair of molds for opening and closing (e.g., a mold assembled from multiple mold blocks, mold plates, mold pillars, or other components made of alloy tool steel). It also includes a pressing device (third pressing device) 350 that drives the opening and closing of the third mold 302. As an example, in FIG1 (shown as a structure shared with the second pressing device 250), it is configured to include two third pressing devices 350, or it may include one, or it may include multiple (three or more) (not shown). Figure 19 shows a side view (schematic view) of the third pressing device 350, and Figure 20 shows a front cross-sectional view (schematic view) of the third mold 302.

Here, as shown in Figure 19, the third pressing device 350 includes a pair of pressing plates 354 and 356, multiple pull rods 352 supporting the pair of pressing plates 354 and 356, and a drive device for making the pressing plates 356 movable (lifting). Specifically, the drive device includes a drive source (e.g., an electric motor) 360 and a drive transmission mechanism (e.g., a ball screw or toggle mechanism) 362, etc. (but is not limited to this). In this embodiment, the pressure plate 354 on the upper side in the vertical direction is designated as a fixed pressure plate (the pressure plate fixed to the pull rod 352), and the pressure plate 356 on the lower side is designated as a movable pressure plate (the pressure plate that can slide and be held in place by the pull rod 352 and raised and lowered). However, this is not a limitation; the configuration can be reversed, i.e., the upper side can be designated as a movable pressure plate and the lower side as a fixed pressure plate, or both the upper and lower sides can be designated as movable pressure plates (neither shown in the figures).

On the other hand, as shown in FIG20, the third mold 302 includes one mold (third upper mold 304) on the upper side in the vertical direction and another mold (third lower mold 306) on the lower side, serving as a pair of molds disposed between the pair of pressure plates 354 and 356 in the third pressing device 350. That is, the third upper mold 304 is assembled with the upper pressure plate (a fixed pressure plate 354 in this embodiment), and the third lower mold 306 is assembled with the lower pressure plate (a movable pressure plate 356 in this embodiment). Mold closing/opening is achieved by the third upper mold 304 and the third lower mold 306 approaching/moving away from each other (the vertical direction (up and down direction) becomes the mold opening and closing direction).

Next, the third lower mold 306 of the third mold 302 will be described in detail. As shown in Figure 20, the third lower mold 306 includes a lower mold groove (third lower mold groove) 310, a mold cavity component (third mold cavity component) 326 held therein, and a clamping device (third clamping device) 328. The third lower mold groove 310 is fixed to the upper surface of the support plate (third support plate) 314 by a support post (third support post) 312. A mold cavity (third mold cavity) 308 is provided on the upper surface of the third lower mold 306 (the side of the third upper mold 304).

The third clamping member 328 is configured in a ring shape to surround the third mold cavity module 326, and is assembled in a manner that allows it to move up and down (separately and buoyantly) relative to the upper surface of the third support plate 314 via a push pin (third push pin) 322 and a clamping spring (third clamping spring) 324 (e.g., a force-applying component exemplified by a coil spring) (however, this assembly structure is not limited). The third mold cavity module 326 forms the interior (bottom) of the third mold cavity 308, and the third clamping member 328 forms the side of the third mold cavity 308. Furthermore, the shape or number of third mold cavities 308 disposed in a third lower mold 306 is suitably set (one or more) according to the shape or number of workpieces W.

Here, a film supply unit (third lower mold film supply unit) 311 is provided in the third pressing device 350. This film supply unit (third lower mold film supply unit) 311 supplies film F to cover the mold surface 306a (a defined area) in the third lower mold 306, which includes the inner surface of the third mold cavity 308. Furthermore, as an example, film F is roller-shaped, but it can also be elongated.

Furthermore, the third lower mold 306 is provided with suction channels (holes or grooves, etc.) (not shown) that communicate with the suction device on the upper surface of the third clamping member 328 or at the boundary between the third clamping member 328 and the third mold cavity member 326. This allows the film F supplied from the third lower mold film supply unit 311 to be adsorbed and held on the mold surface 306a, which includes the inner surface of the third mold cavity 308.

Furthermore, in this embodiment, a third lower mold heating mechanism (not shown) is provided to heat the third lower mold 306 to a predetermined temperature. This third lower mold heating mechanism includes a heater (e.g., an electric heating wire heater), a temperature sensor, a power supply, etc., and the heating is controlled by a control calculation unit 30. As an example, the heater is built into the third lower mold groove 310 and heats the mold to bring the third lower mold 306 to a predetermined temperature (e.g., 100°C to 300°C).

Next, the third upper mold 304 of the third mold 302 will be described in detail. As shown in Figure 20, the third upper mold 304 includes an upper mold groove (third upper mold groove) 340 and an upper plate (third plate) 342 held therein.

In this embodiment, a workpiece holding part 305 is provided to hold the workpiece W at a predetermined position on the lower surface of the third plate 342. As an example, the workpiece holding part 305 has a workpiece guide pin (not shown) and a suction path (hole or groove, etc.) (not shown) that passes through the third plate 342 and communicates with a suction device. Specifically, one end of the suction path passes through the mold surface 304a of the third upper mold 304, and the other end is connected to a suction device disposed outside the third upper mold 304. This allows the suction device to be driven to draw the workpiece W from the suction path, and the workpiece W to be adsorbed and held on the mold surface 304a (the lower surface of the third plate 342). Alternatively, the structure can be configured as follows (not shown): a retaining claw that clamps the outer periphery of the workpiece W may replace the adsorption and holding mechanism; or a structure may include both a retaining claw that clamps the outer periphery of the workpiece W and an adsorption and holding mechanism. Furthermore, the shape or number of workpiece holding portions 305 disposed on a third upper mold 304 may be appropriately set (one or more) according to the shape or number of workpieces W.

Furthermore, in this embodiment, a third upper mold heating mechanism (not shown) is provided to heat the third upper mold 304 to a predetermined temperature. This third upper mold heating mechanism includes a heater (e.g., an electric heating wire heater), a temperature sensor, a power supply, etc., and the heating is controlled by a control calculation unit 30. As an example, the heater is built into the third upper mold groove 340 and heats the mold to bring the third upper mold 304 to a predetermined temperature (e.g., 100°C to 300°C).

Next, the steps of the compression molding method of this embodiment, implemented using the compression molding apparatus 1 including the described structure, will be explained. Here, Figures 21 to 24 are explanatory diagrams of each step, and are shown as front cross-sectional views in the same direction as Figure 20.

First, implement the first preparatory step. Specifically, it is the same as the first implementation method.

Before, after, or in parallel with the first preparation step, a resin preparation step for preparing the first sealant R1 is performed. The first sealant R1 is a solid/semi-solid resin with a predetermined shape whose overall shape corresponds to the shape of the workpiece W, and has a first component (the amount of resin, i.e., grams). The specific steps are the same as in the first embodiment.

In this embodiment, a third preparation step is implemented instead of the second preparation step. The third preparation step includes the following steps: A heating step (third upper mold heating step) is implemented, in which the third upper mold 304 is adjusted to a predetermined temperature (e.g., 100°C to 300°C) and heated using a third upper mold heating mechanism. Additionally, a heating step (third lower mold heating step) is implemented, in which the third lower mold 306 is adjusted to a predetermined temperature (e.g., 100°C to 300°C) and heated using a third lower mold heating mechanism. Additionally, a membrane supply step (third lower mold membrane supply step) is implemented, in which the third lower mold membrane supply unit 311 is operated to supply a new membrane F, which is adsorbed in a manner that covers a predetermined area of the mold surface 306a, including the inner surface of the third mold cavity 308, in the third lower mold 306.

Following the third preparation step, a workpiece holding step is performed to hold the workpiece W in the workpiece holding portion 305 of the third upper mold 304. Specifically, the first loader 22 holds the workpiece W supplied by the feed box 12 and moves it into the third mold 302, where it is held in the workpiece holding portion 305.

Before or after the workpiece holding step, or concurrently, a resin placement step (see FIG. 21) is performed to place the first sealing resin R1 prepared in the resin preparation step into a predetermined position. Specifically, the first sealing resin R1 prepared in the resin preparation step (for example, formed in the resin forming section 50) is moved into the third mold 302 by the first loading machine 22 (or other conveying device) and received within the third mold cavity 308 (specifically, placed on the upper surface of the third mold cavity module 326).

Furthermore, a calculation step is performed at any point before the workpiece holding step. Specifically, the measuring unit 60 measures the quantity of electronic components Wb mounted on a substrate Wa for each workpiece W (the quantity mounted or missing, and may also include measuring the height of the electronic components Wb or measuring their weight). Then, the control calculation unit 30 calculates the total amount of sealant R required to seal the measured workpiece W based on the measurement data, and compares the total amount with a first component of the first sealant R1. Furthermore, as described above, the following structure (not shown) can also be configured: the measuring unit 60 is disposed outside the compression molding apparatus 1, and sends measurement data on the presence or absence of electronic components Wb for each workpiece W to the control and calculation unit 30 of this apparatus.

Next, if the calculation step results in the first component being insufficient relative to the total amount, the following additional resin preparation step is performed: In addition to the first sealing resin R1, a second sealing resin R2 having a second component (amount of resin, i.e., grams) equivalent to the insufficient amount is also prepared as sealing resin R. The specific steps are the same as in the first embodiment.

Next, an additional resin supply step is performed to supply the second sealant R2 to a designated position (see Figure 22). Specifically, the second sealant R2 prepared in the additional resin preparation step is moved into the third mold 302 by the first loader 22 (or other conveying device), and supplied (placed) onto the first sealant R1 held in the third mold cavity 308 (preferably at a position that does not overlap with the electronic component Wb of the workpiece W in top view; it is marked as the outer side of the convex body Rb1 in Figure 22, but it can also be between the convex bodies Rb1 in the paper direction). Therefore, even when the total amount of resin required increases due to a lack of electronic components Wb in workpiece W, the required total amount of resin can be easily and quickly ensured, thus preventing molding defects caused by insufficient resin.

Alternatively, as another example of the additional resin supply step, it can be implemented as a step of supplying (loading) the second sealing resin R2 prepared in the additional resin preparation step onto the first sealing resin R1 before the resin loading step. In this case, the resin loading step becomes a step of loading the first sealing resin R1, which is in a state of loading the second sealing resin R2, into a predetermined position. That is, the first loading machine 22 moves the first sealing resin R1, which is in a state of loading the second sealing resin R2, into the third mold 302 and holds it in the mold cavity 308. It has the following advantages: the first sealant R1 and the second sealant R2 are fed into the third mold 302 in one operation, rather than being fed into the third mold 302 separately.

After all the aforementioned steps are performed, a resin sealing step is performed to seal the workpiece W with a sealing resin R (although there are first sealing resin R1 and second sealing resin R2, there is also a possibility that the second sealing resin R2 may not be supplied based on the calculation results) to process it into a molded product Wp. Specifically, a mold closing step (third mold closing step) is performed, in which the third mold 302 is closed and the third mold cavity component 326 is raised relative to each other within the third mold cavity 308 to heat and pressurize the workpiece W with the sealing resin R. Thus, the sealing resin R is thermocured, completing the resin sealing (compression molding) (see Figure 23).

In previous compression molding apparatuses with a cavity in the lower die, when using granulated resin as a sealant, the particle size or height (layer thickness) of the sealant (granulated resin) contained in the cavity does not become uniform. Therefore, for example, depending on the type of granulated resin and its melt state, it may not become completely liquid (low viscosity state), and the following problem arises: when performing the die-closing step on a workpiece W such as a strip-shaped electronic component (semiconductor chip) Wb connected by wires, as shown in FIG25, depending on the position, the wire portion of the workpiece held in the upper die comes into strong (obvious) local contact with the sealant (granulated resin) and deforms. Consequently, as shown in Figure 26, significant resin flow occurs within the mold cavity, leading to problems such as wire breakage and deformation.

To address the aforementioned problem, the compression molding apparatus 1 of this embodiment has a structure in which a third mold cavity 308 is provided on the third lower mold 306, and the first sealing resin R1 used as the sealing resin R is a solid/semi-solid resin formed with a predetermined shape corresponding to the shape of the workpiece W, thereby achieving the solution.

Specifically, the "prescribed shape" is as follows: during the closing of the third mold 302, the third upper mold 304 gradually approaches the third lower mold 306, and the front end (upper end) of the foot Rb of the first sealant R1 housed in the third mold cavity 308 abuts against the substrate Wa of the workpiece W held in the workpiece holding part 305, while the main body Ra of the first sealant R1 does not abut against the electronic component Wb of the workpiece W (the electronic component Wb with wires includes the wires). Furthermore, if the second sealant R2 placed on the first sealant R1 is a resin other than a liquid resin, it is even more preferable that the second sealant R2 does not abut against the electronic component Wb of the workpiece W.

Here, the specific structure (shape) of the first sealing resin R1 is the same as that of the specific examples of the first embodiment (Figures 15-18). However, it is not limited to these structures.

Furthermore, the subsequent steps following the third mold closing step are the same as the previous compression molding method. In summary, the mold opening step (third mold opening step) involves opening the third mold 302 and separating the molded article Wp from the used film F to remove the molded article Wp (see Figure 24). Next, a molded article removal step is performed, in which the molded article Wp is removed from the third mold 302 and transported to the storage unit 10C by the second loading machine 24. Additionally, after the molded article removal step, or concurrently, a film supply step (third lower mold film supply step) is performed, in which the third lower mold film supply unit 311 is operated to deliver the used film F from the third mold 302 and a new film F is delivered and installed into the third mold 302.

The other structures of this embodiment are the same as those of the first embodiment, and repeated descriptions are omitted.

[Third Implementation Form]

Next, a third embodiment of the present invention will be described. The basic structure of the compression molding apparatus 1 and the compression molding method of this embodiment is the same as that of the first or second embodiment; the following description will focus on the differences.

In this embodiment, the first sealing resin R1 is a resin that has undergone temporary molding (first temporary molding) of the base resin Rm. As an example, the "temporary molding (first temporary molding)" is a "sheet molding," which can be implemented using the resin forming portion 50. However, "temporary molding" is not limited to "sheet molding," and structures other than the resin forming portion 50 (not shown) may also be used.

Furthermore, in this embodiment, the sealing resin R is a resin that has been temporarily molded (second temporary molding) while a second sealing resin R2 is added to a first sealing resin R1. As an example, the "temporary molding (second temporary molding)" is a "sheet," which can be implemented using the aforementioned resin forming section 50. Specifically, the second temporary molding can also be performed by re-encapsulating the resin forming section 50 where the first temporary molding has been performed, or it can be performed by encapsulating the resin forming section 50, which is different from the resin forming section 50 where the first temporary molding has been performed. However, the "temporary molding" is not limited to a "sheet," and structures other than the resin forming section 50 (not shown) can also be used.

Furthermore, as described above, powdered resin, granular resin, crushed resin, solid resin, liquid resin, etc., can be used as the second sealant R2. However, in this embodiment, the structure is as follows: while the second sealant R2 is added to the first sealant R1, temporary molding (specifically, sheet forming) is performed to form an integral sealant R. Therefore, it is preferable to use the same resin (specifically, powdered resin) for both the first sealant R1 and the second sealant R2. This is because using the same resin improves the quality of the finished product.

As explained above, this invention prevents molding defects caused by the flow, uneven distribution, and residual gas of the sealant. In particular, even when the total amount of resin required increases due to a lack of electronic components in the workpiece, the required amount of resin can be easily and quickly ensured, thus preventing molding defects caused by insufficient resin. Furthermore, the handling of the sealant is simplified, and dust generation from the sealant during molding is prevented. In addition, thin molded articles (thickness less than 1 mm) can be formed, and thick molded articles (thickness of 1 mm or more) can also be formed. Moreover, while the upper limit of the thickness depends on various setting conditions, it is believed that it can be sufficiently formed up to approximately 10 mm. Furthermore, by applying a structure that provides a cavity in the upper mold, the aforementioned problems in a structure that provides a cavity in the lower mold can be solved. On the other hand, it is also preferable to apply it to a structure that provides a cavity in the lower mold.

Furthermore, the structure is designed to include the same number of resin forming units and resin sealing units (for example, two units each, but not limited to this). This allows the cycle time for forming the first sealing resin using the base resin in the resin forming unit to match the cycle time for forming the molded article using the first sealing resin (and the second sealing resin) in the pressing unit, thereby achieving efficient forming. Furthermore, units that easily generate resin (base resin) dust (especially base resin supply units) can be configured to be far removed from units (especially pressing units) where dust may become a cause of defective products (molded articles that are defective manufactured products). (Alternatively, a separator or gate can be provided between the two). This prevents the generation of defective products due to the aforementioned dust.

Furthermore, this invention is not limited to the described embodiments, and various modifications can be made without departing from the scope of this invention.

202: Sealing mold (second mold)

204: Second upper mold (upper mold)

204a, 206a: Mold surface

205: Workpiece Holding Part

206: Second lower mold (lower mold)

208: Mold Cavity (Second Mold Cavity)

210: Upper mold groove (second upper mold groove)

212: Support Column (Second Support Column)

214: Support Board (Second Support Board)

222: Push Selling (Second Push Selling)

224: Clamping Spring (Second Clamping Spring)

226: Mold Cavity Component (Second Mold Cavity Component)

228: Clamping device (second clamping device)

240: Lower mold slot (second lower mold slot)

242: Lower board (second board)

F: Membrane

R: Sealing resin (temporary molding resin)

R1: First sealing resin

R2: Second sealing resin

Ra: Main body

Rb: Feet

W: Workpiece (the part to be formed)

Wa: Base material (glass or metal pallet)

Wb: Electronic components (semiconductor chips)

X, Y, Z: Direction (X, Y, Z: Direction)

Claims (12)

A compression molding apparatus is disclosed, comprising a sealing mold including an upper mold and a lower mold, and using a sealing resin to seal a workpiece having an electronic component mounted on a substrate, thereby processing it into a molded article. The compression molding apparatus is characterized in that a first sealing resin is used as the sealing resin. The first sealing resin is a solid/semi-solid resin integrally shaped to correspond to the shape of the workpiece and has a first component. The first sealing resin includes a main body formed in a plate or block shape and a plurality of feet erected on one side of the main body. The compression molding apparatus includes a conveying device for conveying the solid/semi-solid resin. The first sealant is facing the workpiece, and the first sealant is transported to the sealing mold; the control calculation unit calculates the total amount of resin required based on data obtained by measuring the number of electronic components mounted on a substrate for each workpiece, and compares the total amount with the first component; and the resin supply device supplies the second sealant as the sealant on the first sealant if the first component is insufficient relative to the total amount, by adding a second sealant on the first sealant, the second sealant having a second component equivalent to the insufficient amount. The compression molding apparatus as described in claim 1, wherein, as the first sealing resin, a powdered resin is compressed into a solid/semi-solid resin of the predetermined shape. The compression molding apparatus as claimed in claim 2, wherein the predetermined shape is a shape that does not abut against the electronic component when the first sealant is placed on the substrate. The compression molding apparatus as described in claim 1, wherein powdered resin, granular resin, crushed resin, solid resin, or liquid resin is used as the second sealing resin. The compression molding apparatus as described in any of claims 1 to 4 includes a resin supply unit that supplies the second sealing resin, the resin supply unit comprising: a structure for supplying to the first sealing resin or the workpiece in a state before being loaded into the sealing mold; a structure for supplying to the first sealing resin or the workpiece in a state after being loaded into the sealing mold; or a structure for supplying to the sealing mold disposed in a cavity of the upper mold or the lower mold. The compression molding apparatus as described in claim 1, wherein the first sealing resin is a resin temporarily formed by molding a base resin, the second sealing resin is a powdered resin, granular resin, crushed resin, solid resin, or liquid resin, and the sealing resin is a resin temporarily formed while the second sealing resin is added to the first sealing resin. A compression molding method is a compression molding method that uses a sealing mold including an upper mold and a lower mold, and uses a sealing resin to seal a workpiece having an electronic component mounted on a substrate to process it into a molded article. The compression molding method is characterized by including: a resin preparation step, preparing a first sealing resin as the sealing resin, the first sealing resin being a solid/semi-solid resin integrally shaped to correspond to the shape of the workpiece, and having a first component, wherein the first sealing resin includes a main body formed in a plate or block shape and a plurality of feet erected on one side of the main body; a conveying step, causing the solid/semi-solid... The first sealant is facing the workpiece, and the first sealant is transferred to the sealing mold; a calculation step is performed, based on data obtained by measuring the number of electronic components mounted on a substrate for each workpiece, to estimate the total amount of resin required, and the total amount is compared with the first component; and an additional resin preparation step is performed, if the first component is insufficient relative to the total amount, then a second sealant is supplied on the first sealant as the sealant, the second sealant having a second component equivalent to the insufficient amount. The compression molding method as described in claim 7, wherein, as the first sealing resin, a powdered resin is pressed into a sheet to form a solid/semi-solid resin of the predetermined shape. The compression molding method as described in claim 8, wherein the defined shape is a shape that does not abut against the electronic component when the first sealant is placed on the substrate. The compression molding method as described in claim 7, wherein powdered resin, granular resin, crushed resin, solid resin, or liquid resin is used as the second sealing resin. The compression molding method as described in any of claims 7 to 10 includes an additional resin supply step, which supplies the second sealing resin prepared in the additional resin preparation step to a predetermined position. The additional resin supply step comprises any one of the following steps: supplying to the first sealing resin or the workpiece in a state before being moved into the sealing mold, supplying to the first sealing resin or the workpiece in a state after being moved into the sealing mold, or supplying to a cavity of the sealing mold disposed in the upper mold or the lower mold. The compression molding method as described in claim 7, wherein, as the first sealing resin, a resin formed by temporarily molding a base resin is used, the compression molding method further includes a step of temporarily molding the first sealing resin with the second sealing resin added to it to form the sealing resin.