TWI472065B - Resin sealing device - Google Patents

Description

Resin sealing device Field of invention

The present invention relates to a resin sealing device which seals an electronic component such as a semiconductor element mounted on a substrate with a resin material, in particular, a film supply unit.

Background of the invention

Conventionally, the resin sealing device is, for example, a release film supply mechanism that supplies a release film to a resin sealing mold, and the release film supply mechanism is characterized in that the release film wound into a cylindrical shape is cut into a predetermined length. A cutting device for a short strip film having a delivery portion for feeding the release film wound in a cylindrical shape, a guide for guiding the delivered release film, and feeding to the guide plate The release film is cut from the cutter portion that is wound away from the cylindrical release film, and the surface of the guide plate has an air ejection mechanism that can discharge air toward the discharged release film (refer to the patent) Document 1).

Advanced technical literature Patent literature

[Patent Document 1] JP-A-2008-302550

Summary of invention

However, the aforementioned resin sealing device is formed into a short strip shape. The film and film transport mechanism (substrate loader, unloader) enters between the upper and lower molds and supplies the film to the lower mold. Therefore, the above-described film transport mechanism is required, and the control device and the control system are complicated, resulting in an increase in cost.

Moreover, since a large working space is required between the lower mold and the upper mold in order to use the film transport mechanism, there is a problem that the overall height of the device is increased and the size cannot be reduced.

Accordingly, an object of the present invention is to provide a resin sealing device which has a film supply unit and is simple in construction and inexpensive.

The resin sealing device of the present invention has at least an upper mold and a lower mold, and the substrate and the film are sandwiched between the upper mold and the lower mold, and the resin material which has been filled between the substrate and the film is used. The electronic component mounted on the substrate is sealed with a resin, and is configured to have a transfer mechanism for transferring the lower mold to a forming position opposed to the upper mold, a side surface on one side of the upper mold, and supplying the film. a film supply position directly below the film supply unit and a substrate supply position on a side of the other side of the upper mold; and a control mechanism for transferring the lower mold to the film supply position and transferring the substrate to the substrate Supply location.

According to the invention, the lower mold is transferred directly below the film supply unit and supplied to the film. Therefore, there is no need for a film transporter as in the conventional example. A resin sealing device which is simple and inexpensive in construction and control system can be obtained.

Further, the lower mold can be separately transferred to the film supply position on the side of the one side of the upper mold and supplied to the film. Therefore, a large working space is not required between the upper mold and the lower mold, a small resin sealing device having a small height and a small size can be obtained, and the mold opening amount of the upper mold and the lower mold can be reduced. Therefore, it is possible to obtain a resin sealing device which can reduce the production cost of the mold, reduce the production cost, shorten the time required for the switching of the upper mold and the lower mold, shorten the cycle time of the entire resin sealing device, and achieve high production efficiency.

According to an embodiment of the present invention, an upper mold, an intermediate mold having a through hole, and a mold in which the intermediate mold is sandwiched by the upper mold may be configured, and the upper mold and the intermediate mold may be used to mount the electronic mold. The substrate of the component is sandwiched, and the film is sandwiched by the intermediate mold and the lower mold, and the resin material filled between the intermediate mold and the film is disposed in the through hole of the intermediate mold. The aforementioned electronic components are sealed with a resin.

According to the present embodiment, even in the case of a resin sealing device having three upper and lower molds, a small resin sealing device having a simple structure and a simple control system can be obtained.

According to another embodiment of the present invention, the film supply unit may adsorb and hold the drawn elongated resin film on the lower surface of the adsorption plate, and supply the resin film which has been cut to a predetermined length to the moved film. Go directly below the mold below.

According to this embodiment, since the elongated resin film can be cut out The resin film of a predetermined length is continuously and automatically supplied, so that a resin sealing device having high productivity can be obtained.

As another embodiment of the present invention, a plurality of adsorption plates may be provided.

According to the present embodiment, the lower mold can be divided into a plurality of pieces, and even if the height positions of the respective lower molds are not uniform, the unevenness can be absorbed by adjusting the position of each of the adsorption plates, and a good film supply can be obtained.

Further, since the film is cut to an optimum size in accordance with the area where the film is required, the film having the minimum necessary amount can be supplied, thereby reducing the waste of the film.

As a different embodiment of the present invention, the substrate may be a lead frame, and the electronic component may also be an LED.

According to this embodiment, there is an effect that a resin sealing device capable of resin-sealing various types of substrates and electronic components can be obtained.

Simple illustration

Fig. 1 is a plan view showing a first embodiment of the fully automatic resin sealing device of the invention of the present application.

Fig. 2 is a front elevational view showing the resin sealing device shown in Fig. 1.

Figure 3 is an enlarged front elevational view of the mold set shown in Figure 2.

Figure 4 is a plan view of the mold set shown in Figure 3.

Figure 5 is a side elevational view of the mold set shown in Figure 2.

Figure 6 is a cross-sectional view of the VI-VI portion of the mold set shown in Figure 3.

Fig. 7 is a partial cross-sectional view taken along line VII-VII of Fig. 4 showing a state in which the intermediate mold holding unit is at the lowermost position and the upper jaw member is opened in the present invention.

Fig. 8 is a partial cross-sectional view showing the intermediate mold holding unit of the present invention in the middle of raising from the lowermost position to the intermediate position and closing the upper jaw member.

Fig. 9 is a partial cross-sectional view showing a state in which the intermediate mold holding unit is in the intermediate position and the upper jaw member is closed in the invention of the present application.

Fig. 10 is a partial cross-sectional view showing a state in which the intermediate mold holding unit is at the uppermost position and the upper jaw member is closed in the invention of the present application.

Fig. 11 is a partial cross-sectional view showing a state in which the intermediate mold holding unit and the lower mold are at the uppermost position and the upper jaw member is closed in the invention of the present application.

Figure 12 is a plan view of the film supply unit shown in Figure 1.

Figure 13 is a front elevational view of the film supply unit illustrated in Figure 12 .

Figure 14 is a sectional view taken along line XIV-XIV of Figure 13.

Figure 15 is a right side view of the film supply unit illustrated in Figure 12 .

Figure 16 is a sectional view taken along line XVI-XVI of Figure 13.

Fig. 17 is a sectional view taken along line XVII-XVII of Fig. 13 for explaining the operation of the film supply unit shown in Fig. 1.

Fig. 18 is a cross-sectional view of Fig. 17 for explaining the operation of the film supply unit shown in Fig. 1.

Fig. 19 is a cross-sectional view of Fig. 18 for explaining the operation of the film supply unit shown in Fig. 1.

Figure 20 is a cross-sectional view of Figure 19 for explaining the operation of the film supply unit shown in Figure 1.

Fig. 21 is a cross-sectional view of Fig. 20 for explaining the operation of the film supply unit shown in Fig. 1.

Figure 22 is a continuation of the action of the film supply unit shown in Figure 1 Figure 21 is a cross-sectional view.

Figure 23 is a cross-sectional view of Figure 22 for explaining the operation of the film supply unit shown in Figure 1.

Fig. 24 is a plan view showing a second embodiment of the semi-automatic resin sealing device of the present invention.

Fig. 25 is a partially enlarged sectional view showing a third embodiment of the resin sealing device of the present invention.

Form for implementing the invention

As shown in FIG. 1 and FIG. 2, in the first embodiment, the resin sealing device roughly has a supply unit 1, a molding unit 2, and a discharge unit 3. In the case where each of the drawings is easily explained, it is schematically illustrated.

As shown in FIGS. 1 and 2, the supply unit 1 includes a substrate supply device 10, an array device 11, a loader 12, and a resin supply device 13.

The substrate supply device 10 transfers the crucible 14 that accommodates the plurality of substrates 4 in a stacked state from the position A to the position B. Then, the substrate 4 is pulled out one by one from the position B to the alignment device 11 at the position C by a pull-out unit (not shown). The arraying device 11 preheats the substrate 4 with a built-in heater (not shown), and moves the substrate 4 from the position C to the position D along the guide rail 15, and then transfers the substrate 4 to the loader 12 at the position D. The loader 12 has a chuck (not shown) that can hold both ends of the substrate 4, and transports the substrate 4 received at the position D to the intermediate mold 22 in standby at the substrate supply position E of the molding unit 2.

Moreover, the aforementioned loader 12 combines the resin supply devices 13 The two liquid supply tanks (not shown) provided in the resin supply device 13 are mixed and supplied with different liquid resin materials in the crucible 23a (Fig. 23) of the mold 23, which will be described later.

The forming unit 2 has an upper mold 21, a mold set 20 composed of an intermediate mold 22 and a lower mold 23, a film supply unit 30, and a cleaner 31.

The mold 21 above the mold set 20 is fixed to the underside of the platform 34 spanning over the upper end of the tie bar 33, and the tie bar 33 is erected at the corner of the platform 32 (Fig. 6) below the square. Further, as shown in Figs. 3 and 4, the intermediate mold holding unit 40 is mounted to be movable up and down by the guide rails 35, 35 attached to the opposite sides of the upper stage 34.

The intermediate mold holding unit 40 is constituted by a pair of mounting plates 41 and 41 having a substantially L-shaped cross section, and the mounting plates 41 and 41 are attached so as to be vertically slidable along the guide rails 35 of the upper stage 34. Further, the upper end portions of the attachment plates 41 and 41 are coupled by a connecting rod 42, and the connecting rod 42 is supported by the vertical driving cylinder 43 disposed at the center of the upper surface of the upper deck 34 so as to be movable up and down.

On the other hand, one end of the clamp cylinder 44 is rotatably mounted to the outer side of the aforementioned mounting plate 41, and is assembled into the front end of the piston 45 of the aforementioned clamp cylinder 44, and one end of the jaw member 46 of a different shape. The part is mounted to be rotatable. Further, the other end portion of the upper jaw member 46 is hingedly supported by the mounting plate 41. Further, a lower jaw portion 47 that sandwiches the intermediate die 22 with the engaging claw 46a of the upper jaw member 46 is protruded from the lower end portion of the attachment plate 41. The lower jaw portion 47 is provided with a positioning pin 47a for positioning the intermediate mold 22.

The intermediate mold 22 is provided with a positioning pin (not shown) on which a substrate, a lead frame or the like can be positioned, and is provided at a position corresponding to a cavity of the mold 23 to be described later, and is detachably mounted on the substrate and the lead frame. Through holes for LEDs, electronic components, etc.

The lower mold 23 is provided with a plurality of cavities, runners, and gates (not shown) on the upper mold, and the crucibles 23a (Fig. 23) are formed by passing through the runners and gates in the cavities. Further, the lower mold 23 is disposed through the guide rail 37 so as to be reciprocally movable between the substrate supply position E and the film supply position F.

As shown in FIGS. 12 to 14, the film supply unit 30 can prevent the lift-off property of the molded article from being lifted, the resin is lost, the mold is dirty, and has one end side supported to support the base 60 of the H-shaped cross section. The film roll 70 and the film attached to the outer side of the susceptor 60 pull out the block member 80.

The film supply unit 30 supplies a film 71 (FIG. 13) to be described later to the upper surface of the lower mold 23 at the film supply position F, and has a film for inserting the film into the crucible 23a of the lower mold 23 to be molded into the mold. Pin 69 (Figure 17). Further, the film supply unit 30 can be reciprocated to the left side from the position shown in FIG.

As shown in Fig. 13, the base 60 is provided with a pressing cylinder 61 at a substantially central portion thereof, and a pressing plate 63 is attached from the pressing cylinder 61 to the front end of the telescopic pressing piston 62. The pressing plate 63 is supported by the four first guide shafts 64 that are inserted into the base 60. On the other hand, the pressing plate 63 is passed through the second guide shaft 65 on the lower surface thereof, and the pair of frame-shaped first and second suction plates 66 and 67 are assembled to be able to enter and exit in the thickness direction. Further, the pressing plate 63 and the frame-shaped first and second suction plates 66 and 67 are provided to be used to form the first and second frames. The suction plates 66 and 67 give a kinetic energy coil spring 68 to the lower side. Further, the lower side of the aforementioned pressing plate 63 is inserted into the pin 69 at a predetermined pitch. Further, as shown in Fig. 17, the frame-shaped first and second suction plates 66 and 67 are disposed at predetermined pitches along the suction holes 66a and 67a which communicate with each other along the lower surface thereof, and are along the same direction side. Grooves 66b and 67b are provided on the lower side of one side.

As shown in Fig. 13, the film roll 70 winds the elongated resin film 71 and passes through the film roll motor 72 and the timing belt 73 (Fig. 17) to adjust the amount of rotation. Further, the resin film 71 pulled out from the film roll 70 is transmitted through the tension roller 74 and the guide roller 75, and is supplied to a film drawing block member 80 which will be described later. The guide roller 75 is moved up and down through the guide roller cylinder 76 illustrated in Fig. 15 . Further, the tension roller 74 prevents the resin film 71 from being slack by lowering the resin film 71 toward the lower side in the drawing by its own weight.

The film pull-out block member 80 is assembled on the guide rail 81 provided on the outer surface of the base 60, and is passed through the pull-out block motor 82, the pulleys 83a and 83b, and the timing belt 84 so as to be along the guide rail. 81 reciprocating movement.

Further, as shown in Fig. 14, the pull-out arm portion 85 is supported to be movable up and down along the guide rail 80a provided on the side of the pulley 83b side of the film drawing block member 80, and the pull-out arm portion 85 is pulled out and pulled out. The arm is moved up and down by the cylinder 80b. Further, the drawing arm portion 85 is provided with a suction hole 85a for adsorbing the resin film 71 at a predetermined pitch. Further, the pull-out arm portion 85 is configured to be reciprocally movable by passing the cutter 86 for cutting the resin film 71 through the cutter cylinder 87.

Further, the film supply unit 30 is provided with a cleaner 31 (FIG. 1). The cleaner 31 is used for sweeping the rotating motion The resin mold residue remaining on the surface of the mold is removed and attracted to the lower surface of the intermediate mold 22. Further, after moving from the position shown in FIG. 1 to the left side and stopping above the guide rail 37 together with the film supply unit 30, it is possible to reciprocate directly along the guide rail 37 to the upper stage 34.

As shown in FIGS. 1 and 2, the discharge unit 3 includes an unloader 50, a receiving device 51, and a substrate discharge device 53 that houses the crucible 52, and a control device 54 is disposed.

The unloader 50 has a chuck for holding the substrate 4 in the same manner as the loader 12 described above, and has a suction holding device for sucking and removing the used film. Further, the unloader 50 is reciprocally movable between the substrate supply position E of the forming unit 2 and the position G of the discharge unit 3, and the substrate 4 of the molded article is received from the intermediate mold 22 at the substrate supply position E of the forming unit 2. Move toward the position G of the discharge unit 3. Further, the unloader 50 mounts the molded article on the receiving device 51 that has moved to the position G through the guide rail 55. After the receiving device 51 is moved to the position H via the guide rail 55, the substrate 4 of the molded article that has been molded is stored in the crucible 52 of the substrate discharge device 53 by a pusher (not shown). Then, when the aforementioned cymbal 52 is full, the aforementioned cymbal 52 is moved to the position J.

The resin sealing device having the above configuration controls the supply unit 1, the molding unit 2, and the discharge unit 3 by the control device 54.

Next, the operation of the resin sealing device having the above configuration will be described.

(preparation project)

The dispensing device 11 is first heated at position C to a predetermined temperature.

Further, in the molding unit 2, the jaw members 46 and the lower jaw portion 47 are sandwiched between the both side edges of the intermediate mold 22, and the upper and lower driving cylinders 43 are driven, whereby the intermediate mold is previously formed on the lower surface of the upper mold 21. 22 contact and keep. On the other hand, the lower mold 23 is previously transferred to the film supply position F located directly below the film supply unit 30.

Further, the discharge unit 3 transfers the receiving device 51 to the position G in advance.

As shown in FIGS. 17 to 23, the film supply unit 30 supplies the resin film 71 to each of the first and second adsorption plates 66 and 67.

In other words, the film roll 70 is transmitted through the tension roller 74 and the guide roller 75, and the leading edge portion of the resin film 71 that has been pulled out is sucked and held by the suction hole 85a of the drawing arm portion 85 of the film drawing block member 80 (Fig. 17). ). At this time, by controlling the roller motor 72, the resin film 71 is not slack by the tension roller 74.

Further, as shown in FIG. 12, the pull-out block member 80 is slid along the guide rail 81 by the pull-out block motor 82, the pulleys 83a and 83b, and the timing belt 84. Thereby, as shown in Fig. 18, the resin film 71 adsorbed and held by the drawing arm portion 85 is pulled out until the left side of the drawing is full. Further, the guide roller cylinder 76 and the pull-out arm cylinder 80b are driven to raise the guide roller 75 and the pull-out arm portion 85. Then, after the resin film 71 is sucked and held by the adsorption holes 66a and 67a of the first and second adsorption plates 66 and 67, the suction and holding of the pull-out arm portion 85 are released. Further, the pull-out arm cylinder 80b is driven to lower the pull-out arm portion 85 along the guide rail 80a, and the guide roller cylinder 76 is driven to lower the guide roller 75. Thereafter, the pull-out piece is driven by the motor 82, and the cutter 86 is slid along the guide rail 81 to a position corresponding to the groove 66b of the first suction plate 66. Further, the pull-out arm portion 85 is raised (FIG. 19), and the intermediate portion of the resin film 71 is sucked by the suction hole 85a. Attached, kept. Next, the cutter is driven by the cylinder 87, and the cutter 86 is moved along the groove 66b, whereby the resin film 71 is cut.

After the adsorption of the second adsorption plate 67 is released, the pull-out arm portion 85 and the guide roller 75 are lowered, and the pull-out arm portion 85 is moved to a position corresponding to the lower side of the lower side of one of the second suction plates 67. By raising this (FIG. 20), the front edge part of the resin film 71 is adsorb|sucked and hold|maintained in the adsorption hole 67a of the 2nd adsorption-plate 67. Thereby, the resin film 71 can be used without waste. On the other hand, at this time, the resin film 71 is not slack by the tension roller 74.

As shown in Fig. 21, after the suction of the pull-out arm portion 85 is released, the pull-out block member 80 is lowered, and the pull-out block member 80 is placed along the guide rail in the groove 67b of the second suction plate 67. 81 moves to the position corresponding to the cutter 86. Next, the drawing arm portion 85 is raised, and the cutter 86 is slid along the groove 67b, whereby the resin film 71 is cut. At this time, the drawing arm portion 85 maintains the state in which the resin film 71 is adsorbed and held, and the resin film 71 is not slack by the tension roller 74. Further, as shown in FIG. 22, the pull-out arm portion 85 is moved to the vicinity of the guide roller 75, and the guide roller cylinder 76 and the pull-out arm cylinder 80b are driven to lower the guide roller 75 and the pull-out arm portion 85.

(supply engineering)

Further, as shown in FIG. 23, the lower mold 23 is moved to the film supply position F of the forming unit 2. Thereafter, the pressing cylinder 61 is driven, the pressing piston 62 is passed, the pressing plate 63 is lowered by the first and second adsorption plates 66 and 67, and the resin film 71 is contacted on the upper surface of the lower mold 23. Therefore, the resin film 71 is sandwiched by the lower mold 23 and the first and second adsorption plates 66 and 67. Further, when the pressing piston 62 is extended and the pressing plate 63 is pressed, the coil spring 68 is compressed and will be pressed. The insertion pin 69 is pushed into the crucible 23a of the lower mold 23 to form a recess in which the resin film 71 is pushed in and the resin is accumulated. Then, the resin film 71 of the first and second adsorption plates 66 and 67 is adsorbed and held, and the resin film 71 is adsorbed and held by the adsorption holes (not shown) of the lower mold 23. Thereafter, the pressing piston 62 is pulled up, and the first and second suction plates 66 and 67 are separated from the resin film 71, whereby the supply operation of the resin film 71 is completed. Thereafter, the resin film 71 can be continuously supplied by repeating the same operation.

Further, the lower mold 23 is moved along the guide rail 37 directly below the upper stage 34. Next, the upper and lower driving cylinders 43 are driven to lower the connecting rod 42 and the intermediate mold 22 is placed on the lower mold 23, and the clamp cylinder 44 is driven to open the upper jaw member 46 to hold the intermediate mold 22 The status is released. At this time, the through holes of the intermediate mold 22 and the cavity of the lower mold 23 pass through the film 71 to face each other. Further, the upper and lower driving cylinders 43 are driven to lower the intermediate mold holding unit 40 to the lowest position (FIG. 7).

Further, the lower mold 23 on which the intermediate mold 22 is placed is transferred to the substrate supply position E along the guide rail 37.

On the other hand, as shown in FIG. 1, the supply unit 1 transfers the crucible 14 of the position A to the position B, and pulls the substrate 4 accommodated in the crucible 14 of the position B one by one by a drawing unit (not shown). It is placed and placed in the arrangement device 11 at position C. Then, the substrate 4 is heated by the arrangement device 11, and the arrangement device 11 is transferred to the position D through the guide rail 15.

The substrate 4 is held by the chuck of the loader 12 from the sorting device 11 at the position D, and the loader 12 is transferred to the substrate supply position E of the forming unit 2 together with the resin supply device 13, and positioned in the middle mold With 22 above.

And, by controlling the loader 12, the chuck is opened, and the substrate 4 is placed and positioned in a recess above the intermediate mold 22, thereby electronic components such as LEDs mounted on the substrate 4 (not The figure is positioned in the through hole. Therefore, the electronic component is located in the through hole of the intermediate mold 22 and is opposed to the cavity of the lower mold 23 through the film 71.

Next, the lower mold 23 is conveyed along the guide rail 37 directly below the upper stage 34. Further, the upper and lower drive cylinders 43 are driven, the connecting rod 42 is pulled up, the edge portion of the intermediate mold 21 is locked by the lower jaw portion 47 (FIG. 8), and the clamp cylinder 44 is driven to move the intermediate mold 22 Both side edges are sandwiched by the upper jaw member 46 and the lower jaw portion 47 (Fig. 9). Further, the upper and lower driving cylinders 43 are driven to raise the intermediate mold holding unit 40, whereby the substrate 4 is sandwiched by the lower surface of the upper mold 21 and the upper surface of the intermediate mold 22 (FIG. 10).

Further, since the intermediate mold 22 can be moved to the side without being placed in the lower mold 23, the substrate 4 can be placed on the intermediate mold 22, so that it is not required between the upper mold 21 and the intermediate mold 22. Great working space. Therefore, since the upper and lower driving cylinders 43 have a short stroke, that is, a small size can be employed, there is an advantage that cost can be reduced.

On the other hand, only the lower mold 23 is transferred to the substrate supply position E along the guide rail 37, and positioned immediately below the resin supply unit 13 that has been transferred beforehand, and the liquid resin is injected into the crucible 23a of the lower mold 23. Then, the lower mold 23 is transferred to the directly below the upper stage 34 through the guide rails 37, the lower mold 23 is pushed up, and the intermediate mold 22 is clamped together with the upper mold 21 (FIG. 11). At this time, the electronic component mounted on the substrate 4 is transmitted through the film. 71 is opposite to the cavity of the lower mold 23.

Then, the air in the mold set 20 is sucked to a vacuum state, and the liquid resin in the crucible 23a is pushed up by the push-up of the plunger in the crucible 23a of the lower mold 23. Thereby, the liquid resin is pushed out along the upper surface of the film 71, and flows into and fills the cavity of the lower mold 23 through the runner and the gate. Therefore, the liquid resin expands a part of the film 71 covering the respective cavity portions on the cavity side of the lower mold 23, and the electronic component is resin-sealed.

After the liquid resin is cured, the lower mold 23 is lowered to perform gate braking, and the lower mold 23 is again raised to contact the intermediate mold 22. Further, after the upper jaw member 46 is opened, the intermediate mold holding unit 40 is lowered to the lowest position, and on the other hand, the intermediate mold 22 and the lower mold 23 are simultaneously lowered. Further, the lower mold 23 is transferred together with the intermediate mold 22 along the guide rail 37 to the substrate supply position E.

On the other hand, in the case where the gate is broken, when the lower mold 23 is lowered in a state where the intermediate mold 22 is held by the upper mold 21, the intermediate mold 22 is strongly pulled by the lower mold 23. However, the intermediate mold 22 is held by the upper mold 21 by the lower jaw portion 47. Therefore, since the strong tension is not directly applied to the clamp cylinder 44, the clamp cylinder 44 can be made small, and the unit can be miniaturized and the cost can be reduced.

Next, the unloader 50 of the discharge unit 3 is transferred to the substrate supply position E of the forming unit 2, and positioned above the intermediate mold 22. Then, the both side edges of the substrate 4 of the molded article are jammed by the chuck of the unloader 50, and after the molded article is separated from the intermediate mold 22, the unloader 50 is transported to the position G of the discharge unit 3. Further, opening the folder of the unloader 50 The head and the molded article transferred to the position G are placed on the receiving device 51.

The molded article placed on the substrate 4 of the receiving device 51 is moved to the position H through the guide rail 55, and then stored in the crucible 52 in the substrate discharge device 53 one at a time. Further, after the cassette 52 is full, the cassette 52 is transferred to the position J and exchanged with the space (not shown).

On the other hand, after the lower mold 23 and the intermediate mold 22 are simultaneously transferred to the immediately below the upper stage 34, the upper and lower driving cylinders 43 are driven, and the lower jaw portion 47 is locked to both side edges of the intermediate mold 22, and the upper mold portion 47 is used. The jaw member 46 and the lower jaw portion 47 sandwich the intermediate mold 22 and lift it up. Thereafter, the lower mold 23 is moved along the guide rail 37 to the substrate supply position E, and the adsorption to the used film 71 remaining on the upper surface of the lower mold 22 is released, and is sucked and held by the unloader 50. Next, the unloader 50 is moved to the discharge unit 3 side, and the used film 71 is discarded from the disposal hole 36 provided near the boundary between the molding unit 2 and the discharge unit 3.

Further, when the used film 71 is discarded, the cleaner 31 is moved to the left side together with the film supply unit 30, and after the upper portion of the guide rail 37 is stopped, the cleaner 31 is moved along the guide rail 37 to the upper stage 34. Next, the lower surface of the intermediate mold 22 is rubbed by the brush rotating by the cleaner 31, and the remaining resin slag is sucked and removed. After the film supply unit 30 and the cleaner 31 are returned to the predetermined position, the lower mold 23 is moved to the film supply position F through the guide rail 37, and the film 71 is supplied from the film supply unit 30 to the lower mold 23 in the same manner as described above. Thereafter, the lower mold 23 is transferred to directly below the upper stage 34, the upper and lower driving cylinders 43 are driven, the intermediate mold 22 is lowered and placed on the lower mold 23, and the upper jaw member is opened. 46, and the intermediate mold holding unit 40 is lowered to the lowest position.

Thereafter, the electronic component mounted on the substrate 4 can be continuously resin-sealed by repeating the same operation as described above.

According to the present embodiment, the reciprocating movement along the guide rail 37 of the lower mold 23, the up-and-down movement of the upper and lower driving cylinders 43 by the intermediate mold holding unit 40, and the switching operation by the clamp cylinder 44 can be performed. operation. Therefore, since the structure is simple and complicated control is not required, the cost can be reduced.

Further, since a large working space is not required between the upper mold 21 and the lower mold 23, a small resin sealing device having a low height can be obtained, and the mold opening amount of the upper mold and the lower mold can be reduced. Therefore, the driving mechanism of the mold can be miniaturized, the production cost can be reduced, and the time required for switching the upper mold and the lower mold can be shortened, and the cycle time of the entire resin sealing device can be shortened, so that the production efficiency is high. advantage.

As shown in Fig. 24, the second embodiment is applied to a fully automatic resin sealing device as compared with the above-described embodiment, and is applied to a semi-automatic resin sealing device.

That is, the film is automatically supplied to the lower mold 23 by the film supply device 30, and the liquid resin is automatically supplied by the resin supply device 13. On the other hand, the supply of the substrate 4 to the intermediate mold, the take-out of the molded article, the disposal of the used film, and the cleaning of the mold are performed by the operator. Further, the resin supply device 13 of the supply unit 1 can be reciprocated to the substrate supply position E of the forming unit 2.

Since the other is the same as the first embodiment described above, the same portion is assigned The same reference numerals are given and the description is omitted.

According to the present embodiment, there is an advantage that a resin sealing device having a small installation area and suitable for a small number of types of production can be obtained.

As shown in Fig. 25, the third embodiment is applied to a resin sealing device of two molds.

That is, the upper mold 21 is fixed to the lower surface of the upper platform 34 supported by the four tie bars 33, and the lower mold 23 is disposed to be slidable in the horizontal direction.

The upper mold 21 is configured to adsorb and hold the substrate 4 on which the electronic component 5 is mounted. On the other hand, the lower mold 23 is provided with an adsorption hole 23c at a corner of the cavity 23b provided on the upper mold 23, and an adsorption hole 23d for sucking and holding the edge of the film 71 is provided at the opening edge of the cavity 23b.

Since the film 71 cut into a predetermined length is supplied by the film supply unit 30 as in the first embodiment, detailed description thereof will be omitted.

In the present embodiment, the film 71 is sucked by the adsorption holes 23c and 23d of the lower mold 23, and the film 71 is adhered to the inner peripheral surface of the cavity 23b, and then the liquid resin is supplied to the crucible 23a (see FIG. 23). . Then, the lower mold 23 is raised, and the lower mold 23 and the upper mold 21 are used to sandwich the substrate 4 and the film 71, and then the plunger (not shown) in the crucible 23a is protruded, and the crucible 23a is placed. The liquid resin inside is pushed up through the film 71. Thereby, the liquid resin is pushed out along the upper surface of the film 71, and flows into the cavity 23b by a runner or a gate (not shown), and is filled and pressurized, and the electronic component 5 is resin-sealed. Further, the lower mold 23 is lowered, and the resin-sealed substrate 4 is taken out from the cavity 23h, and cut into individual pieces, whereby the wafer-formed electronic component 5 can be used.

Further, the resin sealing operation is not limited to the above-described working steps. For example, the film 71 can be sucked by the suction holes 23c and 23d of the lower mold 23, whereby the film 71 is adhered to the inner peripheral surface of the cavity 23b, and the cavity is covered. A liquid resin is supplied on the upper surface of the film 71 of 23b. Next, the lower mold 23 is raised, and the lower mold 23 and the upper mold 21 are used to sandwich the substrate 4 and the film 71, whereby the electronic component 5 is resin-sealed.

According to the present embodiment, the film 71 can be directly supplied to the film 71 by the film supply unit 30 by the lower mold 23 moving in the horizontal direction. Therefore, there is no need for a film transport mechanism, and there is an advantage that a resin seal device having a simple structure and a small control system can be obtained.

Industrial availability

The resin sealing device of the present invention is not limited to the above embodiment, and can be suitably applied to other resin-sealed electronic components.

1‧‧‧Supply unit

2‧‧‧forming unit

3‧‧‧Draining unit

4‧‧‧Substrate

5‧‧‧Electronic parts

10‧‧‧Substrate supply device

11‧‧‧Arrangement device

12‧‧‧Loader

13‧‧‧Resin supply device

14‧‧‧匣

15‧‧‧rail

20‧‧‧Mold group

21‧‧‧Upper mold

22‧‧‧Intermediate mould

23‧‧‧ Lower mold

23a‧‧‧ cans

23b‧‧‧ cavity

23c, 23d‧‧‧Adsorption holes

30‧‧‧film supply unit

31‧‧‧cleaner

32‧‧‧Under platform

33‧‧‧ tied

34‧‧‧Upper platform

35‧‧‧rails

36‧‧‧Abandoned holes

37‧‧‧rails

40‧‧‧Intermediate mold holding unit

41‧‧‧Installation board

42‧‧‧ Connecting rod

43‧‧‧Upper and lower drive cylinders

44‧‧‧Clamp cylinder

45‧‧‧Piston

46‧‧‧Upper jaw members

46a‧‧‧Card claws

47‧‧‧ lower jaw

47a‧‧‧Locating pin

50‧‧‧ Unloader

51‧‧‧ Receiving device

52‧‧‧匣

53‧‧‧Substrate discharge device

54‧‧‧Control device

55‧‧‧rail

60‧‧‧Base

61‧‧‧Pushing cylinder

62‧‧‧Pushing piston

63‧‧‧Pressing plate

64‧‧‧1st guide shaft

65‧‧‧2nd guide shaft

66‧‧‧1st adsorption plate

67‧‧‧2nd adsorption plate

66a, 67a‧‧‧Adsorption holes

66b, 67b‧‧‧ groove

68‧‧‧Coil spring

69‧‧‧Admission

70‧‧‧roll

71‧‧‧Resin film

72‧‧‧film roller motor

73‧‧‧ Timing belt

74‧‧‧ Tension roller

75‧‧‧guide roller

76‧‧‧Guide roller

80‧‧‧film pull out pieces

80b‧‧‧ Pull out the cylinder for the arm

81‧‧‧rail

82‧‧‧Block motor

83a, 83b‧‧‧ pulley

84‧‧‧ Timing belt

85‧‧‧ Pull out the arm

85a‧‧‧Adsorption holes

86‧‧‧Cut cutter

87‧‧‧Cut cylinder

A~D, G~J‧‧‧Location

E‧‧‧Substrate supply location

F‧‧‧ film supply location

Fig. 1 is a plan view showing a first embodiment of the fully automatic resin sealing device of the invention of the present application.

Fig. 2 is a front elevational view showing the resin sealing device shown in Fig. 1.

Figure 3 is an enlarged front elevational view of the mold set shown in Figure 2.

Figure 4 is a plan view of the mold set shown in Figure 3.

Figure 5 is a side elevational view of the mold set shown in Figure 2.

Figure 6 is a cross-sectional view of the VI-VI portion of the mold set shown in Figure 3.

Fig. 7 is a partial cross-sectional view taken along line VII-VII of Fig. 4 showing a state in which the intermediate mold holding unit is at the lowermost position and the upper jaw member is opened in the present invention.

Fig. 8 is a partial cross-sectional view showing the intermediate mold holding unit of the present invention in the middle of raising from the lowermost position to the intermediate position and closing the upper jaw member.

Fig. 9 is a partial cross-sectional view showing a state in which the intermediate mold holding unit is in the intermediate position and the upper jaw member is closed in the invention of the present application.

Fig. 10 is a partial cross-sectional view showing a state in which the intermediate mold holding unit is at the uppermost position and the upper jaw member is closed in the invention of the present application.

Fig. 11 is a partial cross-sectional view showing a state in which the intermediate mold holding unit and the lower mold are at the uppermost position and the upper jaw member is closed in the invention of the present application.

Figure 12 is a plan view of the film supply unit shown in Figure 1.

Figure 13 is a front elevational view of the film supply unit illustrated in Figure 12 .

Figure 14 is a sectional view taken along line XIV-XIV of Figure 13.

Figure 15 is a right side view of the film supply unit illustrated in Figure 12 .

Figure 16 is a sectional view taken along line XVI-XVI of Figure 13.

Fig. 17 is a sectional view taken along line XVII-XVII of Fig. 13 for explaining the operation of the film supply unit shown in Fig. 1.

Fig. 18 is a cross-sectional view of Fig. 17 for explaining the operation of the film supply unit shown in Fig. 1.

Fig. 19 is a cross-sectional view of Fig. 18 for explaining the operation of the film supply unit shown in Fig. 1.

Figure 20 is a cross-sectional view of Figure 19 for explaining the operation of the film supply unit shown in Figure 1.

Fig. 21 is a cross-sectional view of Fig. 20 for explaining the operation of the film supply unit shown in Fig. 1.

Figure 22 is a continuation of the action of the film supply unit shown in Figure 1 Figure 21 is a cross-sectional view.

Figure 23 is a cross-sectional view of Figure 22 for explaining the operation of the film supply unit shown in Figure 1.

Fig. 24 is a plan view showing a second embodiment of the semi-automatic resin sealing device of the present invention.

Fig. 25 is a partially enlarged sectional view showing a third embodiment of the resin sealing device of the present invention.

1‧‧‧Supply unit

2‧‧‧forming unit

3‧‧‧Draining unit

10‧‧‧Substrate supply device

11‧‧‧Arrangement device

12‧‧‧Loader

13‧‧‧Resin supply device

14‧‧‧匣

15‧‧‧rail

20‧‧‧Mold group

21‧‧‧Upper mold

30‧‧‧film supply unit

31‧‧‧cleaner

33‧‧‧ tied

34‧‧‧Upper platform

36‧‧‧Abandoned holes

37‧‧‧rails

40‧‧‧Intermediate mold holding unit

50‧‧‧ Unloader

51‧‧‧ Receiving device

52‧‧‧匣

53‧‧‧Substrate discharge device

54‧‧‧Control device

55‧‧‧rail

A~D, G~J‧‧‧Location

E‧‧‧Substrate supply location

F‧‧‧ film supply location

Claims (6)

A resin sealing device having at least an upper mold and a lower mold, sandwiching a substrate and a film between the upper mold and the lower mold, and using a resin material that has been filled between the substrate and the film, has been mounted on The electronic component of the substrate is sealed with a resin, and the transfer mechanism is configured to transfer the lower mold to a molding position opposed to the upper mold, and to be located on one side of the upper mold and to supply the film. a film supply position immediately below the film supply unit and a substrate supply position on the other side of the upper mold; and a control mechanism for transferring the lower mold to the film supply position and transferring to the substrate Supply location. The resin sealing device of claim 1, comprising an upper mold, an intermediate mold having a through hole, and a mold for sandwiching the intermediate mold with the upper mold, and using the upper mold and the intermediate mold The substrate is mounted with the electronic component, and the intermediate mold and the lower mold are used to sandwich the film. On the other hand, the resin material filled between the intermediate mold and the film is disposed in the intermediate mold. The aforementioned electronic components in the through holes are resin-sealed. The resin sealing device according to claim 1 or 2, wherein the film supply unit adsorbs and holds the drawn elongated resin film under the adsorption plate, and the resin obtained by cutting into a predetermined length The film is supplied to the upper surface of the mold that has been moved below. The resin sealing device of claim 3, which has a plurality of adsorption plates. The resin sealing device of claim 1, wherein the substrate is a lead frame. The resin sealing device of claim 1, wherein the electronic component is an LED.