TWI852841B - Electronic component holder and electronic component holding and cooling assembly - Google Patents

Abstract

A holder for holding an electronic component between an electrical connector and a threaded post on a circuit board is provided. The holder includes a main body, a positioning post, an elastic arm and a plurality of elastic hooks. The positioning post is provided at a first edge of the main body and is configured to fit over the threaded post. The elastic arm is provided at a second edge of the main body and is configured to firmly engage the electrical connector. The elastic hooks are arranged on third and fourth edges of the main body and are configured to engage edges of the electronic component.

Description

Electronic component fixing frame and electronic component fixing and heat dissipation assembly

The present disclosure relates to an electronic component fixing frame and an electronic component fixing and heat dissipation assembly.

M.2 interface cards have been widely used in recent years. However, the M.2 fixing mechanism of the motherboards currently on the market still has shortcomings that need to be improved, such as poor ability to absorb manufacturing and assembly tolerances, resulting in the M.2 interface card being unable to be installed correctly. In addition, with the evolution of technology, the M.2 interface card also has a tendency to generate more heat, but there is currently no easy-to-install M.2 heat sink on the market.

In view of this, one purpose of the present disclosure is to provide an electronic component fixing rack and an electronic component fixing and heat dissipation assembly to solve the above-mentioned problem.

To achieve the above-mentioned purpose, according to some embodiments of the present disclosure, an electronic component fixing frame is used to fix the electronic component between the electrical connector and the stud on the circuit board, and includes a main body, a positioning column, an elastic arm structure and a plurality of first elastic arm hooks. The main body has a first edge, a second edge, a third edge and a fourth edge. The first edge is opposite to the second edge, and the third edge and the fourth edge extend from the first edge to the second edge. The positioning column is disposed on the first edge of the main body and is configured to be sleeved on the stud. The elastic arm structure includes a first extension portion and a second extension portion. The first extension portion is connected to the second edge of the main body and extends substantially parallel to the main body. The second extension portion is connected to the first extension portion and extends obliquely to the first extension portion. The second extension portion is configured to tightly snap the electrical connector. The first elastic arm hook is arranged along the third edge and the fourth edge of the main body and is configured to hook the edge of the electronic component.

In one or more embodiments of the present disclosure, the second extension portion of the elastic arm structure extends from the end of the first extension portion and extends in a curved manner away from the main body and the plane where the first extension portion is located.

In one or more embodiments of the present disclosure, the stud has a screw hole, the positioning column has a through hole, the through hole is connected to the screw hole, and the inner diameter of the through hole is larger than the inner diameter of the screw hole.

In one or more embodiments of the present disclosure, the positioning column has a side opening, and the positioning column includes a pair of second spring arm hooks disposed on both sides of the side opening.

In one or more embodiments of the present disclosure, the positioning post has an annular groove configured to engage with a notch structure of the electronic component.

In one or more embodiments of the present disclosure, the electronic component holder further comprises a pair of guide structures, the guide structures protrude from the second edge of the body and are located on both sides of the elastic arm structure. The distance between the guide structures is substantially equal to the width of the electrical connector.

In one or more embodiments of the present disclosure, the main body has an opening portion that penetrates the main body.

According to some embodiments of the present disclosure, an electronic component fixing and heat dissipation assembly includes the aforementioned electronic component fixing frame, a heat sink, and a thermally conductive pad. The body of the electronic component fixing frame has an opening portion that penetrates the body. The heat sink is disposed in the opening portion of the body. The thermally conductive pad is flatly attached to the bottom surface of the heat sink and is configured to contact the electronic component.

In one or more embodiments of the present disclosure, the heat sink includes a base and a plurality of heat sink fins. The heat sink fins are disposed on the base and extend through an opening of the body.

In one or more embodiments of the present disclosure, the electronic component holder further includes a flange structure disposed along the inner periphery of the opening portion, the base of the heat sink has an outer peripheral area surrounding the heat sink fin, and the flange structure abuts against the outer peripheral area of the base.

In summary, the electronic component holder disclosed in the present invention is provided with a spring hook on the edge for holding the electronic component, and a positioning column is provided at one end of the electronic component holder, which can cooperate with the stud on the circuit board and has the ability to absorb tolerance. A spring structure is provided at the other end of the electronic component holder, and the spring structure can buckle the electrical connector and provide a force pointing the electronic component in the direction of the electrical connector to ensure that the electronic component is securely connected to the electrical connector. In addition, the electronic component holder can be matched with a heat sink. For example, the electronic component holder can have an opening facing the electronic component for installing a heat sink to assist in heat dissipation of the electronic component.

In order to make the description of the present disclosure more detailed and complete, reference may be made to the attached drawings and various embodiments described below. The elements in the drawings are not drawn to scale and are provided only for the purpose of illustrating the present disclosure. Many practical details are described below to provide a comprehensive understanding of the present disclosure. However, a person of ordinary skill in the relevant art should understand that the present disclosure can be implemented without one or more of the practical details, and therefore, these details should not be used to limit the present disclosure.

Please refer to FIG. 1 and FIG. 2. FIG. 1 is an exploded view of an electronic component fixing and heat dissipation assembly 10 according to an embodiment of the present disclosure, and FIG. 2 is an assembly view of the electronic component fixing and heat dissipation assembly 10 shown in FIG. 1. The electronic component fixing and heat dissipation assembly 10 can be installed on a circuit board B and cover the electronic component E. The electronic component fixing and heat dissipation assembly 10 can be used to fix the electronic component E on the circuit board B and at the same time assist in heat dissipation of the electronic component E. The electronic component E is, for example, an M.2 interface card, and the circuit board B is, for example, a motherboard of a computer or a motherboard of a server, but is not limited thereto. An electrical connector C and a stud D are provided on the circuit board B. The electronic component E has a first end M1 and a second end M2 relative to each other, wherein the first end M1 has an electrical contact and is configured to be inserted into a slot of the electrical connector C. The position of the stud D corresponds to the second end M2 of the electronic component E.

As shown in FIG. 1 and FIG. 2, the electronic component fixing and heat dissipation assembly 10 includes an electronic component fixing frame 30, and the electronic component fixing frame 30 is used to fix the electronic component E between the electrical connector C and the stud D on the circuit board B. The electronic component fixing frame 30 is, for example, a plastic part, but is not limited thereto. The electronic component fixing frame 30 includes a body 31. The body 31 is generally rectangular and has a first edge 41, a second edge 42, a third edge 43 and a fourth edge 44. The first edge 41 is opposite to the second edge 42, and the third edge 43 and the fourth edge 44 extend from the first edge 41 to the second edge 42 (in other words, the third edge 43/the fourth edge 44 are connected between the first edge 41 and the second edge 42). The third edge 43 and the fourth edge 44 are, for example, long sides of the main body 31.

As shown in FIG. 1 and FIG. 2 , the electronic component holder 30 further includes a plurality of first elastic hooks 33. The first elastic hooks 33 protrude from the bottom surface of the body 31 and are disposed along the third edge 43 and the fourth edge 44 of the body 31. The first elastic hooks 33 are configured to hook the edge of the electronic component E, thereby fixing the electronic component E on one side of the body 31.

As shown in FIG. 1 and FIG. 2 , at least one first elastic arm hook 33 is disposed on each of the third edge 43 and the fourth edge 44, so that the electronic component E is restricted by the first elastic arm hook 33 and does not deviate left or right. In some embodiments, the first elastic arm hook 33 can be symmetrically arranged on the third edge 43 and the fourth edge 44.

As shown in FIG. 1 and FIG. 2, the electronic component holder 30 further includes a positioning column 35. The positioning column 35 is disposed on the first edge 41 of the body 31 and is configured to be sleeved on the stud D of the circuit board B. In addition, when the electronic component E is assembled with the electronic component holder 30 (that is, when the electronic component E is hooked by the first elastic arm hook 33 and fixed on the electronic component holder 30), the positioning column 35 abuts against the second end M2 of the electronic component E to limit the electronic component E. The electronic component E has a notch structure M3 at the second end M2, and the positioning column 35 is configured to abut against the notch structure M3 of the electronic component E.

As shown in FIG. 1 and FIG. 2 , the electronic component holder 30 further includes an elastic arm structure 37. The elastic arm structure 37 is disposed on the second edge 42 of the body 31 and is configured to buckle the electrical connector C. When the electronic component holder 30 and the electronic component E are mounted on the circuit board B together, and the elastic arm structure 37 buckles the electrical connector C, the elastic arm structure 37 is slightly deformed to generate a restoring force, and the restoring force causes the positioning column 35 to press the electronic component E toward the electrical connector C, so that the electronic component E can be stably connected to the electrical connector C.

As shown in FIG. 1 and FIG. 2 , the elastic arm structure 37 includes a first extension portion 51 and a second extension portion 52. The first extension portion 51 is connected to the second edge 42 of the body 31 and extends substantially parallel to the body 31. The second extension portion 52 is connected to the first extension portion 51 and extends obliquely to the first extension portion 51 (in other words, not extending parallel to the first extension portion 51). The second extension portion 52 is configured to tightly lock the electrical connector C. Specifically, the second extension portion 52 is configured to abut the back surface of the electrical connector C (i.e., the surface of the electrical connector C away from its slot).

As shown in FIG. 1 and FIG. 2 , in some embodiments, the electronic component holder 30 further includes a pair of guide structures 56, which protrude from the second edge 42 of the body 31 and are located on both sides of the elastic arm structure 37. The distance between the guide structures 56 is substantially equal to the width of the electrical connector C. In the process of installing the electronic component E and the electronic component holder 30 together on the circuit board B, the guide structures 56 can be abutted against the two side surfaces of the electrical connector C to guide the first end M1 of the electronic component E to be aligned with the slot of the electrical connector C for insertion.

As shown in FIG. 1 and FIG. 2, in some embodiments, the body 31 of the electronic component holder 30 has an opening 39, and the opening 39 passes through the body 31. The electronic component fixing and heat dissipation assembly 10 further includes a heat sink 60 and a thermally conductive pad 61. The heat sink 60 is disposed in the opening 39 of the electronic component holder 30. The thermally conductive pad 61 is flatly attached to the bottom surface of the heat sink 60 and is configured to contact the electronic component E. In other words, the thermally conductive pad 61 is located between the heat sink 60 and the electronic component E, and the upper and lower surfaces of the thermally conductive pad 61 are in close contact with the heat sink 60 and the electronic component E, respectively, so as to quickly guide the heat generated by the electronic component E to the heat sink 60, and utilize the larger surface area of the heat sink 60 to promote heat dissipation. The heat sink 60 may include a material that is easily heat-conducting, such as aluminum, copper, or other metals. The thermal pad 61 may include a material that is easily heat-conducting and deformable, such as silicone rubber.

Please refer to FIG. 3 and FIG. 4. FIG. 3 is a three-dimensional diagram showing another perspective of the electronic component holder 30 shown in FIG. 1, and FIG. 4 is a cross-sectional diagram showing the electronic component fixing and heat dissipation assembly 10 shown in FIG. 2 along line segment 4-4'. In some embodiments, the end of the positioning column 35 away from the main body 31 has a groove 32, and the groove 32 is configured to receive the stud D. The positioning column 35 also has a side opening 34 connected to the groove 32. Through the above configuration, the positioning column 35 can absorb tolerances and dock with the stud D with a slightly deviated position. Furthermore, under the action of the restoring force of the aforementioned elastic arm structure 37, even if the positioning column 35 fails to accurately match the position of the stud D, the electronic component holder 30 can still allow the electronic component E to be stably connected to the electrical connector C.

As shown in FIG. 3 and FIG. 4 , in some embodiments, the positioning post 35 further includes a pair of second spring arm hooks 36 disposed on both sides of the side opening 34, and the second spring arm hooks 36 are configured to interfere with the stud D. When the stud D has a slight position deviation due to tolerance, the second spring arm hooks 36 can provide the electronic component E with an additional thrust (i.e., a force pointing in the direction of the electrical connector C), helping the electronic component E to be firmly inserted into the electrical connector C.

As shown in FIG. 3 and FIG. 4 , in some embodiments, the electronic component holder 30 can be additionally locked and fixed on the circuit board B using screws 45 to prevent the electronic component holder 30 from being separated from the circuit board B. In some embodiments, the stud D has a screw hole N, and the screw hole N has an internal thread. The positioning column 35 has a through hole 38, and the through hole 38 is connected to the screw hole N. The screw 45 can pass through the through hole 38 and lock into the screw hole N.

As shown in FIG. 3 and FIG. 4 , in some embodiments, the inner diameter of the through hole 38 of the positioning post 35 is larger than the inner diameter of the screw hole N of the stud D. This design helps to absorb tolerances, and when the position of the stud D is slightly deviated due to tolerances, the screw 45 can be successfully locked into the screw hole N through the through hole 38.

As shown in Figures 3 and 4, in some embodiments, the electronic component E has a notch structure M3 at the second end M2 (see Figure 1), and the positioning column 35 has an annular groove 46, which is located in the middle section of the positioning column 35 and is configured to engage with the notch structure M3 of the electronic component E.

Please refer to FIG. 5. FIG. 5 is a cross-sectional view of the electronic component fixing and heat dissipation assembly 10 shown in FIG. 2 along line segment 5-5'. In some embodiments, the second extension portion 52 of the elastic arm structure 37 extends from the end of the first extension portion 51 and extends away from the body 31 and the plane PL where the first extension portion 51 is located. The second extension portion 52 is configured to abut the back surface of the electrical connector C (i.e., the surface of the electrical connector C away from its slot).

As shown in FIG. 5 , the second extension portion 52 may include an arc-shaped structure and have a curved surface 53. The design of the curved surface 53 allows the elastic arm structure 37 to smoothly slide down along the edge of the electrical connector C when the assembler presses down the electronic component holder 30 for installation, and then fastens it.

Please refer to FIG. 6. FIG. 6 is a cross-sectional view of the electronic component fixing and heat dissipation assembly 10 shown in FIG. 2 along line segment 6-6'. In some embodiments, the heat sink 60 includes a base 64 and a plurality of heat dissipation fins 65. The heat dissipation fins 65 are disposed on the base 64 and extend through the opening 39 of the body 31 of the electronic component fixing frame 30. The thermal pad 61 is attached to the bottom surface of the base 64.

As shown in FIG. 6 , in some embodiments, the heat sink 60 and the thermal pad 61 can be fixed on the electronic component holder 30 together with the electronic component E. In other words, the electronic component E, the electronic component holder 30, the heat sink 60 and the thermal pad 61 can be combined to form a module, and then mounted together on the circuit board B. For example, when the electronic component E is hooked by the first spring arm hook 33 and fixed on the electronic component holder 30, the heat sink 60 and the thermal pad 61 can be clamped between the electronic component E and the body 31 of the electronic component holder 30. In some embodiments, the electronic component holder 30 includes a flange structure 47 disposed along the inner periphery of the opening portion 39, and the base 64 of the heat sink 60 has an outer peripheral area 66 surrounding the heat sink fin 65. The flange structure 47 abuts against the outer peripheral area 66 of the base 64, thereby fixing the heat sink 60 and the thermal pad 61.

In summary, the electronic component holder disclosed in the present invention is provided with a spring hook on the edge for holding the electronic component, and a positioning column is provided at one end of the electronic component holder, which can cooperate with the stud on the circuit board and has the ability to absorb tolerance. A spring structure is provided at the other end of the electronic component holder, and the spring structure can buckle the electrical connector and provide a force pointing the electronic component in the direction of the electrical connector to ensure that the electronic component is securely connected to the electrical connector. In addition, the electronic component holder can be matched with a heat sink. For example, the electronic component holder can have an opening facing the electronic component for installing a heat sink to assist in heat dissipation of the electronic component.

In this embodiment, the server of the present invention can be used for artificial intelligence (AI) computing, edge computing, and can also be used as a 5G server, cloud server, or Internet of Vehicles server.

Although the present disclosure has been disclosed in the above implementation form, it is not intended to limit the present disclosure. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be determined by the scope of the attached patent application.

10: Electronic component fixing and heat dissipation assembly 30: Electronic component fixing frame 31: Body 32: Groove 33: First spring arm hook 34: Side opening 35: Positioning column 36: Second spring arm hook 37: Spring arm structure 38: Through hole 39: Opening part 41: First edge 42: Second edge 43: Third edge 44: Fourth edge 45: Screw 46: Annular groove 47: Flange structure 51: First extension part 52: Second extension part 53: Curved surface 56: Guide structure 60: Heat sink 61: Thermal pad 64: Base 65: Heat dissipation fin 66: peripheral area B: circuit board C: electrical connector D: stud E: electronic component M1: first end M2: second end M3: notch structure N: screw hole PL: plane

In order to make the above and other purposes, features, advantages and implementation methods of the present disclosure more clearly understandable, the attached drawings are described as follows: FIG. 1 is an exploded view of an electronic component fixing and heat dissipation assembly according to an implementation method of the present disclosure. FIG. 2 is a combined view of the electronic component fixing and heat dissipation assembly shown in FIG. 1. FIG. 3 is a three-dimensional view of another viewing angle of the electronic component fixing frame shown in FIG. 1. FIG. 4 is a cross-sectional view of the electronic component fixing and heat dissipation assembly shown in FIG. 2 along line segment 4-4'. FIG. 5 is a cross-sectional view of the electronic component fixing and heat dissipation assembly shown in FIG. 2 along line segment 5-5'. FIG. 6 is a cross-sectional view of the electronic component fixing and heat dissipation assembly shown in FIG. 2 along line segment 6-6'.

Domestic storage information (please note in the order of storage institution, date, and number) None Foreign storage information (please note in the order of storage country, institution, date, and number) None

10: Electronic component fixing and heat dissipation components

30: Electronic component holder

31:Entity

33: The first spring arm hooks

35: Positioning column

37: Bomb arm structure

39: Opening

45: Screws

56: Guidance structure

60: Radiator

61: Thermal pad

B: Circuit board

C:Electrical connector

D: Stud

E: Electronic components

M1: First end

M2: Second end

M3: Notch structure

Claims (9)

An electronic component fixing frame is used to fix an electronic component between an electrical connector and a stud on a circuit board, comprising: a body having a first edge, a second edge, a third edge and a fourth edge, the first edge is opposite to the second edge, the third edge and the fourth edge extend from the first edge to the second edge, wherein the body has an opening portion, and the opening portion passes through the body; a positioning column is arranged at the first edge of the body and is configured to Sleeved on the stud; an elastic arm structure, including a first extension portion and a second extension portion, the first extension portion is connected to the second edge of the body and extends substantially parallel to the body, the second extension portion is connected to the first extension portion and extends obliquely to the first extension portion, wherein the second extension portion is configured to tightly buckle the electrical connector; and a plurality of first elastic arm hooks are arranged along the third edge and the fourth edge of the body and configured to hook the edge of the electronic component. The electronic component holder as described in claim 1, wherein the second extension portion of the elastic arm structure extends from the end of the first extension portion and extends away from the main body and a plane on which the first extension portion is located in a curved manner. The electronic component fixing frame as described in claim 1, wherein the stud has a screw hole, the positioning column has a through hole, the through hole is connected to the screw hole, and the inner diameter of the through hole is larger than the inner diameter of the screw hole. An electronic component holder as described in claim 1, wherein the positioning column has a side opening, and the positioning column includes a pair of second spring arm hooks arranged on both sides of the side opening. An electronic component holder as described in claim 1, wherein the positioning column has an annular groove, and the annular groove is configured to engage with a notch structure of the electronic component. The electronic component holder as described in claim 1 further comprises a pair of guide structures, which protrude from the second edge of the body and are located on both sides of the elastic arm structure, wherein the distance between the pair of guide structures is substantially equal to the width of the electrical connector. An electronic component fixing and heat dissipation assembly, comprising: an electronic component fixing frame as described in any one of claims 1 to 6; a heat sink disposed in the opening of the body; and a thermally conductive pad flatly attached to a bottom surface of the heat sink and configured to contact the electronic component. An electronic component fixing and heat dissipation assembly as described in claim 7, wherein the heat sink comprises a base and a plurality of heat dissipation fins, the heat dissipation fins are disposed on the base and extend through the opening of the body. As described in claim 8, the electronic component fixing and heat dissipation assembly, wherein the electronic component fixing frame further includes a flange structure arranged along the inner periphery of the opening portion, the base of the heat sink has an outer peripheral area surrounding the heat dissipation fins, and the flange structure abuts against the outer peripheral area of the base.

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