TWI901553B - Heat dissipation module - Google Patents

Abstract

The present disclosure provides a heat dissipation module, the heat dissipation module comprises: a heat conductive element movably floated on a circuit board and having a convex ring portion and at through hole, wherein the through hole penetrates through the convex ring portion; a locking element penetrated through the through hole and fixed on the circuit board; and at least one elastic element connected to the heat conductive element and abutted against the circuit board; wherein the convex ring portion can move along the locking element to close to the circuit board or away from the circuit board to compress or release the elastic element.

Description

Heat dissipation module

This disclosure relates to a heat dissipation module, particularly a heat dissipation module that can accommodate solid-state drive cards of varying thicknesses.

In response to modern demands, computers and various electronic devices are developing rapidly and their performance is constantly improving. However, this process also brings with it the problem of heat dissipation brought about by high-performance hardware. Generally speaking, computers and various electronic devices usually use heat dissipation components to dissipate heat. For example, thermal paste or heat sinks are attached to the electronic components to absorb and dissipate the heat.

Solid-state drive cards installed on motherboards also require heat dissipation. However, existing SSD card heat sinks are typically fixed at a uniform height, allowing the SSD card to be clamped between the motherboard and the heat sink. However, different SSD cards have varying thicknesses due to the height of the chip. This results in greater interference and pressure on thicker SSD cards, potentially damaging the chip.

The present disclosure provides a heat dissipation module for use with a circuit board having a connector capable of connecting to a storage device. The heat dissipation module includes a heat conductive member movably floated on the circuit board and having a first surface and a second surface facing each other, a raised ring portion, a through hole, and a receiving space. The first surface faces the circuit board, the raised ring portion extends outward from the first surface and surrounds and defines the receiving space, exposing the receiving space to the second surface, and the through hole passes through the raised ring portion and is connected to the receiving space. A locking member extends through the through hole and is fixedly connected to the circuit board, and has a head portion, wherein the head portion is located in the accommodating space and spaced apart from the circuit board; and at least one elastic member is connected to the first surface of the thermally conductive member and abuts against the circuit board, and constantly provides an elastic force; wherein the protruding ring portion of the thermally conductive member can move along the locking member to approach or move away from the circuit board, thereby compressing or releasing the elastic member, and the elastic force continuously causes the thermally conductive member to contact the storage element.

As in the aforementioned heat sink module, the elastic member includes a fixed portion and two wings. The fixed portion is fixed to the first surface of the thermally conductive member. The wings extend outward from opposite sides of the fixed portion and abut the circuit board. The elastic force can be provided by changing the angle between the wings and the fixed portion.

As in the aforementioned heat dissipation module, the fixing portion has two protrusions, and the heat conducting element further has at least two through-holes, with the protrusions respectively inserted into the through-holes.

As in the aforementioned heat dissipation module, the protrusion has a head section and a column section after heat fusion, and the head section and the column section both have a T-shaped cross-section. The column section is inserted into the through-hole, and the head section abuts the second surface of the thermal conductor.

As in the aforementioned heat dissipation module, each of the wings has a support post, which is used to abut the circuit board and corresponds to two opposite long sides of the heat conducting element.

As in the aforementioned heat sink module, the locking member further comprises a step portion and a screw-fastening portion. The step portion extends outward from the head portion and is inserted into the through hole, while the screw-fastening portion extends outward from the step portion and is screwed to the circuit board.

As in the aforementioned heat dissipation module, the cross-sectional area of the head portion is larger than the cross-sectional area of the through hole, and the cross-sectional area of the through hole is larger than the cross-sectional area of the step portion.

As in the aforementioned heat sink module, the raised ring portion has a ring wall and a base plate connected to the end of the ring wall. The through hole passes through the base plate, and the thickness of the base plate is less than the height of the step portion, allowing the base plate to move along the step portion and be restrained by the head portion and the circuit board.

The heat dissipation module described above further includes a first thermally conductive rubber pad disposed on the second surface, so that the storage component disposed on the second surface of the heat conductive element contacts the first thermally conductive rubber pad.

The heat dissipation module described above further includes a heat sink disposed on the storage element and a second thermally conductive pad disposed between the heat sink and the storage element.

As in the aforementioned heat sink module, the circuit board has a fixing screw. The fixing screw and the connector correspond to two opposite short sides adjacent to the heat conducting element. A plurality of screws pass through the heat sink and are screwed to the connector and the fixing screw, respectively, so that the heat sink contacts the second thermally conductive pad.

In summary, the elastic member disclosed herein can effectively adapt to changes in thickness of components within the heat sink module, or changes in thickness or height of electronic components connected to the heat sink module, generating compression or release. It can also automatically adjust the amount of interference with the storage element, preventing damage to the storage element due to excessive pressure while maintaining heat transfer efficiency.

100: Heat dissipation module

200: Circuit board

201: Fixing screw

300: Connector

400: Storage component

500: First thermal pad

600: Second thermal pad

700: Heat sink

800: Screw parts

1: Thermal Conductor

11: Side 1

12: Side 2

13:Protruding ring part

131: Ring Wall

132: Baseboard

14: Through hole

15: Storage space

16: Perforation

2: Lock the firmware

21: Head

22: Stage Department

23: Screw fastening part

3: Elastic parts

31: Fixed part

311: Boss

3111: Header

3112: Column Segment

32: Wings

321: Support Pillar

H1, H2: Thickness

θ1, θ2: Intersection angle

Figure 1 is a schematic diagram of an exploded view of the heat dissipation module disclosed herein.

Figure 2 is an exploded schematic diagram of the heat dissipation module disclosed herein from another perspective.

Figure 3 is a schematic diagram of the heat dissipation module disclosed herein when in use.

Figure 4 is an exploded schematic diagram of Figure 3.

Figure 5 is a schematic cross-sectional view of Figure 3 along line A-A.

Figure 6 is a schematic cross-sectional view taken along line B-B in Figure 3.

Figure 7 is a schematic cross-sectional view of another embodiment of the heat dissipation module of the present invention.

Figures 8 and 9 are schematic cross-sectional views of another embodiment of Figures 5 and 6, respectively.

The following describes the implementation of the present disclosure using specific embodiments. Those skilled in the art can easily understand the other advantages and effects of the present disclosure from the contents disclosed in this specification, and can also implement or apply the present disclosure through other different specific embodiments.

Referring to Figures 1 and 2, the heat dissipation module 100 disclosed herein can be mounted on a circuit board 200 (e.g., a motherboard). The circuit board 200 has a connector 300. The heat dissipation module 100 includes a heat conducting element 1, a locking element 2, and two elastic elements 3.

The thermal conductor 1 is roughly in the form of a rectangular plate and has a first surface 11 and a second surface 12 opposite to each other, a protruding ring portion 13, a through hole 14, a receiving space 15 and a plurality of through holes 16. The thermal conductor 1 is arranged above the circuit board 200 with the first surface 11 facing the circuit board 200. The protruding ring portion 13 extends outward from the first surface 11 (i.e., extends toward the circuit board 200) and has an annular wall 131 and a bottom plate 132. The annular wall 131 has a roughly circular cross-section and tapers away from the first surface 11. The bottom plate 132 is connected to the end of the annular wall 131 and together with the annular wall 131 surrounds and defines the receiving space 15, so that the receiving space 15 is exposed to the second surface 12. The through hole 14 is formed through the bottom plate 132 and is connected to the receiving space 15. The through holes 16 are located in groups of two on opposite sides of the heat conducting element 1.

In this embodiment, the material of the heat conducting element 1 can be a metal with thermal conductivity (such as aluminum, copper, etc.), but the present disclosure is not limited to this.

Referring also to Figure 6 , the locking member 2 passes through the through-hole 14 and is secured to the circuit board 200. The locking member 2 comprises a head portion 21, a step portion 22, and a screw-fastening portion 23. The head portion 21 is located within the accommodating space 15 and spaced from the circuit board 200. The step portion 22 extends outward from the head portion 21 and passes through the through-hole 14. The screw-fastening portion 23 extends outward from the step portion 22 and is screwed to the circuit board 200.

In this embodiment, the cross-sectional area of the head portion 21 is larger than that of the through-hole 14. Therefore, the head portion 21 cannot pass through the through-hole 14 and can only be positioned within the accommodating space 15. The cross-sectional area of the through-hole 14 is larger than that of the step portion 22, and the thickness of the bottom plate 132 is less than the vertical extension height of the step portion 22 from the circuit board 200. Therefore, the bottom plate 132 can move along the annular side surface of the step portion 22 through the through-hole 14, while being restrained by the head portion 21 and the circuit board 200. In other words, the thermal conductor 1 is movably suspended above the circuit board 200 via the locking member 2.

The elastic member 3 includes a fixing portion 31 and two wing portions 32. The fixing portion 31 is roughly in the form of a rectangular plate and has two bosses 311, and the bosses 311 are respectively inserted into the through-holes 16. In this embodiment, the fixing portion 31 can be fixed to the first surface 11 of the thermal conductor 1 by, for example, snapping the bosses 311 into the through-holes 16 or adhering the bosses 311 to the through-holes 16. The fixing method is not limited to the above. In one embodiment, as shown in FIG7 , after the bosses 311 are respectively inserted into the through-holes 16, the bosses 311 are melted by hot melting so that the bosses 311 have a head section 3111 and a column section 3112. The cross-section of the head section 3111 is larger than the cross-section of the column section 3112, so that the head section 3111 and the column section 3112 have a T-shaped cross-section. The post section 3112 is inserted into the through hole 16, while the head section 3111 abuts against the second surface 12 of the thermal conductor 1, thereby securing the fixing portion 31 to the first surface 11 of the thermal conductor 1.

Referring also to Figure 5 , the wings 32 are each roughly rectangular, extending outward from opposite sides of the fixing portion 31 and forming an angle θ1 with the fixing portion 31. The wings 32 also have a supporting post 321 , extending in a direction opposite to that of the boss 311 . The supporting post 321 corresponds to two opposite long sides of the thermal conductor 1 and is used to abut the circuit board 200 .

In this embodiment, the elastic member 3 can be made of a flexible metal, plastic, or stainless steel, and can provide an elastic force by varying the angle θ1 between the wing portion 32 and the fixing portion 31. For example, when the collar portion 13 moves along the locking member 2 and approaches the circuit board 200, the angle θ1 between the wing portion 32 and the fixing portion 31 increases, compressing the elastic member 3 and causing it to expand, lengthen, or widen (as shown in FIG8 ). When the collar portion 13 moves along the locking member 2 and away from the circuit board 200, the angle θ1 between the wing portion 32 and the fixing portion 31 decreases, releasing the elastic member 3 and causing it to shrink, shorten, or narrow (as shown in FIG5 ).

Referring to Figures 3 and 4 , a first thermally conductive pad 500 with heat-conducting properties can be provided on the second surface 12 of the thermally conductive element 1 . The storage component 400 is connected to the connector 300 and is positioned on the second surface 12 of the thermally conductive element 1 , contacting the first thermally conductive pad 500 . This allows the electronic components (chips) on the storage component 400 to dissipate heat through the first thermally conductive pad 500 and the thermally conductive element 1 .

A second thermally conductive rubber pad 600 with heat transfer properties may also be provided on the storage element 400. The heat sink 700 is provided on the storage element 400, such that the second thermally conductive rubber pad 600 is sandwiched between the heat sink 700 and the storage element 400.

In this embodiment, the circuit board 200 has a set screw 201 spaced apart from the connector 300. The set screw 201 and the connector 300 correspond to opposite short sides of the heat conductor 1. A plurality of screws 800 penetrate opposite ends of the heat sink 700 and are screwed to the connector 300 and the set screw 201, respectively, so that the heat sink 700 contacts the second thermal pad 600. Thus, heat is dissipated from the electronic components (chips) on the storage device 400 via the second thermal pad 600 and the heat sink 700.

Since the elastic member 3 in the heat dissipation module 100 of the present disclosure is elastic and the thermal conductive member 1 can move along the locking member 2 , the heat dissipation module 100 of the present disclosure can match different thicknesses of the storage components 400 . For example, as shown in Figures 5 and 6 , when the storage component 400 has a relatively small thickness H1, the angle θ1 between the wing portion 32 and the fixing portion 31 is relatively small, and the bottom plate 132 is adjacent to the head portion 21 (i.e., further away from the circuit board 200). As shown in Figures 8 and 9 , when the storage component 400 has a relatively large thickness H2, the angle θ2 between the wing portion 32 and the fixing portion 31 is relatively large (up to 180 degrees, meaning that the wing portion 32 is parallel to the fixing portion 31), and the bottom plate 132 is relatively far away from the head portion 21 (i.e., adjacent to the circuit board 200). Regardless of whether the protruding ring portion 13 is close to or far from the circuit board 200, the elastic force generated by the elastic member 3 can continuously keep the thermal conductive member 1 in contact with the storage element 400 to ensure heat transfer efficiency.

In another embodiment, when the connector 300 is shorter or the thermally conductive element 1 is thicker, the collar portion 13 moves along the locking member 2 and approaches the circuit board 200, increasing the angle θ1 between the wing portion 32 and the fixing portion 31, and compressing the elastic member 3 (see the elastic member 3 in FIG8 ). When the connector 300 is taller or the thermally conductive element 1 is thinner, the collar portion 13 moves along the locking member 2 and away from the circuit board 200, decreasing the angle θ1 between the wing portion 32 and the fixing portion 31, and releasing the elastic member 3 (see the elastic member 3 in FIG5 ).

In summary, the elastic member disclosed herein can effectively adapt to changes in thickness within the heat sink module, or in thickness or height within the electronic components connected to the heat sink module (e.g., connectors), generating compression or relaxation. The elastic member can also automatically adjust the amount of interference with the storage element, preventing damage to the storage element from excessive pressure while maintaining heat transfer efficiency.

The above embodiments are merely illustrative of the technical principles, features, and effects of this disclosure and are not intended to limit the scope of this disclosure. Anyone skilled in the art may modify and alter the above embodiments without departing from the spirit and scope of this disclosure. However, any equivalent modifications and alterations achieved by applying the teachings of this disclosure are still covered by the patent application below. The scope of protection of this disclosure is as set forth in the patent application below.

100: Heat dissipation module

200: Circuit board

201: Fixing screw

300: Connector

1: Thermal Conductor

12: Side 2

14: Through hole

15: Storage space

16: Perforation

2: Lock the firmware

3: Elastic parts

31: Fixed part

311: Boss

32: Wings

321: Support Pillar

Claims (11)

A heat dissipation module is used for a circuit board having a connector, wherein the connector is connected to a storage component. The heat dissipation module includes: A heat conducting member is movably floated on the circuit board and comprises a first surface and a second surface facing each other, a raised ring portion, a through hole, and a receiving space. The first surface faces the circuit board, the raised ring portion extends outward from the first surface and surrounds and defines the receiving space, exposing the receiving space to the second surface, and the through hole passes through the raised ring portion and is connected to the receiving space. A locking member, which penetrates the through hole and is fixed to the circuit board, and has a head, wherein the head is located in the accommodating space and is spaced apart from the circuit board; and At least one elastic member connected to the first surface of the thermally conductive member and abutting against the circuit board, and constantly providing an elastic force; The protruding ring portion of the heat conductive element moves along the locking member to approach or move away from the circuit board, thereby compressing or releasing the elastic element, and the elastic force continuously causes the heat conductive element to contact the storage element. The heat dissipation module of claim 1, wherein the elastic member includes a fixed portion and two wing portions. The fixed portion is fixedly attached to the first surface of the thermally conductive member. The wing portions extend outward from opposite sides of the fixed portion and abut the circuit board to change the angle between the wing portions and the fixed portion to provide the elastic force. The heat dissipation module as described in claim 2, wherein the fixing portion has two protrusions, and the heat conducting member further has at least two through-holes, wherein the protrusions are respectively disposed in the through-holes. The heat dissipation module as described in claim 3, wherein the protrusion has a head section and a column section after heat fusion, the head section and the column section having a T-shaped cross-section, the column section is inserted into the through hole, and the head section abuts the second surface of the thermal conductor. The heat dissipation module as described in claim 2, wherein each of the wings has a support post, the support post being used to abut the circuit board and corresponding to two opposite long sides of the heat conducting element. The heat dissipation module as described in claim 1, wherein the locking member further comprises a step portion and a screw-fastening portion, the step portion extending outward from the head portion and passing through the through-hole, and the screw-fastening portion extending outward from the step portion and being screwed to the circuit board. The heat dissipation module as described in claim 6, wherein the cross-sectional area of the head portion is larger than the cross-sectional area of the through hole, and the cross-sectional area of the through hole is larger than the cross-sectional area of the step portion. The heat dissipation module as described in claim 6, wherein the raised ring portion has a ring wall and a base plate connected to the end of the ring wall, the through hole passes through the base plate, and the thickness of the base plate is less than the height of the step portion, so that the base plate moves along the step portion and is restrained by the head portion and the circuit board. The heat dissipation module as described in claim 1 further includes a first thermally conductive rubber pad disposed on the second surface, so that the storage component disposed on the second surface of the thermally conductive element contacts the first thermally conductive rubber pad. The heat dissipation module as described in claim 1 further comprises a heat sink disposed on the storage element and a second thermally conductive rubber pad disposed between the heat sink and the storage element. The heat sink module as described in claim 10, wherein the circuit board has a fixing screw, the fixing screw and the connector respectively corresponding to two opposite short sides adjacent to the heat conductive element, and a plurality of screws passing through the heat sink and screwed to the connector and the fixing screw respectively, so that the heat sink contacts the second thermally conductive pad.