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TWI851961B - Multi-capillary vapor chamber structure - Google Patents

Multi-capillary vapor chamber structure Download PDF

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Publication number
TWI851961B
TWI851961B TW111103892A TW111103892A TWI851961B TW I851961 B TWI851961 B TW I851961B TW 111103892 A TW111103892 A TW 111103892A TW 111103892 A TW111103892 A TW 111103892A TW I851961 B TWI851961 B TW I851961B
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Taiwan
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area
plate
capillary
section
hair
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TW111103892A
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Chinese (zh)
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TW202331180A (en
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黃建程
江文雄
陳昱丞
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尼得科超眾科技股份有限公司
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Priority to TW111103892A priority Critical patent/TWI851961B/en
Publication of TW202331180A publication Critical patent/TW202331180A/en
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Publication of TWI851961B publication Critical patent/TWI851961B/en

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Abstract

The multi-capillary vapor chamber structure having a shell, a composite capillary and a plurality of supporting structures is provided. The shell includes a first plate and a second plate and has a first zone, second zone and a connected zone. A step part is formed on the connected zone. The composite capillary includes a first capillary and a second capillary arranged in the first plate, a third capillary arranged in the second plate and a bundled capillary passing through the connected zone. The bundled capillary passes through a spacing of the supporting structures to extend to the first zone and the second zone and is sandwiched between the first plate and the second plate. The connected zone forms an overlapping zone overlapped by the first capillary and the second capillary, and the overlapping zone is located downstream of the step part.

Description

多毛細均溫板結構Multi-hair uniform temperature plate structure

本發明係與一種熱交換元件有關,尤指一種多毛細均溫板結構。The present invention relates to a heat exchange element, in particular to a multi-hairy temperature-averaging plate structure.

按,現有的均溫板(Vapor Chamber),主要係由上、下二導熱性良好的板件封邊焊合而成一真空腔體,且其腔體內部包含如毛細組織及工作流體等高效率熱傳物質,從而使均溫板在接觸熱源後,能夠將熱量快速傳導並擴散到其大面積的板面上進行冷卻,已為現今不可或缺的散熱構件之一。According to the existing Vapor Chamber, it is mainly composed of two upper and lower plates with good thermal conductivity that are sealed and welded together to form a vacuum chamber. The interior of the chamber contains high-efficiency heat transfer materials such as capillary structures and working fluids. As a result, after the Vapor Chamber contacts the heat source, it can quickly transfer and diffuse the heat to its large area of the plate surface for cooling. It has become one of the indispensable heat dissipation components today.

而在實際的應用上,均溫板往往也需要視使用場合的不同,來改變其板件的幾何形狀、甚至將其板面設計為複數斷面且使彼此不在同一水平面上,藉以能配合應用場合的周邊元件,以期能有效利用板面面積。In actual applications, the temperature vapor chamber often needs to change its geometry depending on the application scenario, or even design its surface into multiple sections that are not on the same horizontal plane, so as to match the peripheral components of the application scenario and effectively utilize the surface area of the board.

然而,由於均溫板內部必須透過工作流體的回流,方可維持其進行熱交換循環。故若改變均溫板的外形、尤其是設計為具有段差型態時,其板體內部為了薄化而配合外形的改變,極有可能影響到工作流體的回流效率。However, since the working fluid must reflux inside the temperature-vaporizing plate to maintain its heat exchange cycle, if the shape of the temperature-vaporizing plate is changed, especially if it is designed to have a step difference, the inside of the plate will be thinner to match the shape change, which is very likely to affect the reflux efficiency of the working fluid.

有鑑於此,本發明人係為改善並解決上述之缺失,乃特潛心研究並配合學理之運用,終於提出一種設計合理且有效改善上述缺失之本發明。In view of this, the inventors of the present invention have conducted intensive research and applied theories to improve and solve the above-mentioned deficiencies, and finally proposed the present invention which has a reasonable design and effectively improves the above-mentioned deficiencies.

本發明之主要目的,在於可提供一種多毛細均溫板結構,其係採多毛細搭配的方式,尤其利用束狀毛細作為工作流體在傳輸上的主流,以維持均溫板內之工作流體的回流效益。The main purpose of the present invention is to provide a multi-capillary temperature plate structure, which adopts a multi-capillary matching method, especially using bundled capillaries as the main flow of working fluid in transmission to maintain the reflux efficiency of the working fluid in the temperature plate.

為了達成上述之目的,本發明係提供一種多毛細均溫板結構,包括一殼體、複合毛細以及複數支撐結構:殼體包含一第一板與一第二板相蓋合而成,並具有一第一區域、一第二區域、以及連通於第一區域與第二區域之間的連通區域,且連通區域上至少構成一段差部;複合毛細設於殼體內,並包含設於第一板內的第一毛細與第二毛細、設於第二板內的第三毛細、以及通過連通區域而延伸於第一區域與第二區域之間的束狀毛細;而各支撐結構則支撐於殼體內;其中,束狀毛細通過支撐結構的間距,以延伸於第一區域至第二區域而被夾置第一板與第二板之間,且連通區域上形成由第一毛細與第二毛細重疊的交疊區,交疊區位於段差部的下游處。藉以維持均溫板內之工作流體的回流效益。In order to achieve the above-mentioned purpose, the present invention provides a multi-capillary temperature plate structure, including a shell, a composite capillary and a plurality of supporting structures: the shell includes a first plate and a second plate covered together, and has a first area, a second area, and a connecting area connecting the first area and the second area, and the connecting area forms at least a step; the composite capillary is arranged in the shell, and includes a first capillary arranged in the first plate and a second capillary arranged in the first plate. The second capillary, the third capillary arranged in the second plate, and the bundled capillary extending between the first area and the second area through the connecting area; each supporting structure is supported in the housing; wherein the bundled capillary extends from the first area to the second area through the spacing of the supporting structure and is sandwiched between the first plate and the second plate, and an overlapping area formed by the first capillary and the second capillary overlaps is formed on the connecting area, and the overlapping area is located downstream of the step difference part, so as to maintain the reflux effect of the working fluid in the temperature-averaging plate.

為了使 貴審查委員能更進一步瞭解本發明之特徵及技術內容,請參閱以下有關本發明之詳細說明與附圖,然而所附圖式僅提供參考與說明用,並非用來對本發明加以限制者。In order to enable the Honorable Review Committee to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the attached drawings are only provided for reference and explanation and are not used to limit the present invention.

請參閱圖1,係為本發明之立體分解示意圖。本發明係提供一種多毛細均溫板結構,包括一殼體1、設於該殼體1內的複合毛細2以及複數支撐結構3;其中:Please refer to FIG1, which is a three-dimensional exploded schematic diagram of the present invention. The present invention provides a multi-capillary temperature plate structure, including a shell 1, a composite capillary 2 disposed in the shell 1, and a plurality of supporting structures 3; wherein:

該殼體1係包含一第一板10與一第二板11相蓋合而成,並具有一第一區域100/110、一第二區域101/111、以及連通於所述第一區域100/110與第二區域101/111之間的連通區域102/112。且如圖4所示,所述連通區域102/112上至少構成一段差部103/113,以供第一區域100/110與第二區域101/111產生高低落差,即第一區域100/110與第二區域101/111不在同一水平位置上。所述段差部103/113在寬度方向上可由連通區域102/112朝向第二區域101/111為由窄漸寬的型態(如圖1至圖3所示)。The housing 1 comprises a first plate 10 and a second plate 11, and has a first area 100/110, a second area 101/111, and a connecting area 102/112 connecting the first area 100/110 and the second area 101/111. As shown in FIG4, the connecting area 102/112 has at least one step 103/113 formed thereon, so that the first area 100/110 and the second area 101/111 have a height difference, that is, the first area 100/110 and the second area 101/111 are not at the same level. The step portion 103 / 113 may be gradually widened from the connecting area 102 / 112 toward the second area 101 / 111 in the width direction (as shown in FIGS. 1 to 3 ).

再請參閱圖1所示,該複合毛細2係設於上述殼體1內壁上,並包含貼附於該殼體1之第一板10內的第一毛細20與第二毛細21、貼附於該殼體1之第二板11內的第三毛細23、以及一通過該殼體1之連通區域102/112而延伸於第一區域100/110與第二區域101/111之間的束狀毛細24。如圖2所示,該第一板10內的毛細係由舖設於第一區域100內的所述第一毛細20、以及舖設於第二區域101內的所述第二毛細21構成,且第一毛細20與第二毛細21皆分別朝向連通區域102延伸,以於所述連通區域102上形成由第一毛細20與第二毛細21重疊而成的交疊區O,所述第一毛細20為粉末燒結、所述第二毛細21為編織網,而所述交疊區O則為粉末繞結與編織網混合而成。Referring to FIG. 1 , the composite capillary 2 is disposed on the inner wall of the housing 1 and includes a first capillary 20 and a second capillary 21 attached to the first plate 10 of the housing 1, a third capillary 23 attached to the second plate 11 of the housing 1, and a bundle of capillaries 24 extending between the first area 100/110 and the second area 101/111 through the connecting area 102/112 of the housing 1. As shown in FIG. 2 , the capillaries in the first plate 10 are composed of the first capillaries 20 arranged in the first area 100 and the second capillaries 21 arranged in the second area 101, and the first capillaries 20 and the second capillaries 21 extend toward the connecting area 102 respectively to form an overlapping area O formed by the overlapping of the first capillaries 20 and the second capillaries 21 on the connecting area 102. The first capillaries 20 are powder sintering, the second capillaries 21 are woven mesh, and the overlapping area O is a mixture of powder winding and woven mesh.

承上所述,如圖3所示,上述第三毛細23係舖設於第二板11內,即第二板11內之第一區域110、第二區域111及連通區域112皆由第三毛細23所構成,且所述第三毛細23為編織網。As mentioned above, as shown in FIG. 3 , the third capillaries 23 are arranged in the second plate 11 , that is, the first area 110 , the second area 111 and the connecting area 112 in the second plate 11 are all formed by the third capillaries 23 , and the third capillaries 23 are a woven mesh.

再請一併參閱圖1及圖3所示,該等支撐結構3係支撐於上述述殼體1之第一板10與第二板11之間,並包含分佈配置於該殼體1之第一區域100/110內的第一支撐柱30、分佈配置於該殼體1之連通區域102/112內的第二支撐柱31、以及分佈配置於該殼體1之第二區域101/111內的第三支撐柱32,其中各第一支撐柱30係包含實心部300以及包覆於該實心部300外圍的燒結部301,各第二支撐柱31則由如銅或鋁等材質構成實心柱,而各第三支撐柱32則為粉末燒結而成。最後,再由呈長條狀之束狀毛細24,通過各支撐結構3的間距而從殼體1之第一區域100/110,並通過連通區域102/112延伸至第二區域101/111,以被夾置於第一板10與第二板11之間。該束狀毛細24為纖維束。Please refer to FIG. 1 and FIG. 3 together. The supporting structures 3 are supported between the first plate 10 and the second plate 11 of the shell 1, and include a first supporting column 30 distributed in the first area 100/110 of the shell 1, a second supporting column 31 distributed in the connecting area 102/112 of the shell 1, and a third supporting column 32 distributed in the second area 101/111 of the shell 1, wherein each first supporting column 30 includes a solid portion 300 and a sintered portion 301 wrapped around the solid portion 300, each second supporting column 31 is formed of a solid column made of a material such as copper or aluminum, and each third supporting column 32 is formed by sintering powder. Finally, the long-strip bundled capillaries 24 pass through the spacing of the supporting structures 3 and extend from the first area 100/110 of the housing 1 through the connecting area 102/112 to the second area 101/111, so as to be sandwiched between the first plate 10 and the second plate 11. The bundled capillaries 24 are fiber bundles.

據此,請一併參閱圖1及圖4所示,上述束狀毛細24係具有一第一段240、以及一與所述第一段240相遠離的第二段241,其中第一段240可呈一直線狀,並由殼體1之第一區域100/110延伸至連通區域102/112,以連接至位於第二區域101/111的第二段241,並可視殼體1之形狀而調整第二段241的延伸方向;例如於第一段240與第二段241之間形成一彎曲段242,以供第二段241朝向彎曲段242的彎曲方向延伸。另外,由於殼體1之連通區域102/112上具有所述段差部103/113,故束狀毛細24上亦具有通過所述段差部103/113的傾斜段243。如圖5所示,所述連通區域102/112上的交疊區O即位於所述段差部103/113或該傾斜段243的下游處。Accordingly, please refer to FIG. 1 and FIG. 4 together. The above-mentioned bundled hair 24 has a first section 240 and a second section 241 far away from the first section 240, wherein the first section 240 can be in a straight line and extend from the first area 100/110 of the shell 1 to the connecting area 102/112 to connect to the second section 241 located in the second area 101/111, and the extension direction of the second section 241 can be adjusted according to the shape of the shell 1; for example, a curved section 242 is formed between the first section 240 and the second section 241, so that the second section 241 extends toward the curved direction of the curved section 242. In addition, since the connecting area 102/112 of the housing 1 has the step portion 103/113, the bundled capillaries 24 also have an inclined section 243 passing through the step portion 103/113. As shown in FIG5, the overlapping area O on the connecting area 102/112 is located downstream of the step portion 103/113 or the inclined section 243.

此外,上述殼體之第二區域101/111亦可進一步連通一延伸區域104/114,所述延伸區域104/ 114可視均溫板實際所需的形狀而定,且該束狀毛細24之第二段241亦可朝向所述延伸區域104/114作延伸;其中,所述延伸區域104於第一板10處亦由第二毛細21延伸而貼附,所述延伸區域114於第二板11處亦由第三毛細23延伸而貼附,而其內的支撐結構3則為複數第三支撐柱32。In addition, the second area 101/111 of the above-mentioned shell can be further connected to an extended area 104/114, and the extended area 104/114 can be determined according to the actual shape required by the temperature balance plate, and the second section 241 of the bundled capillaries 24 can also extend toward the extended area 104/114; wherein, the extended area 104 is also extended and attached to the first plate 10 by the second capillaries 21, and the extended area 114 is also extended and attached to the second plate 11 by the third capillaries 23, and the supporting structure 3 therein is a plurality of third supporting columns 32.

是以,藉由上述之構造組成,即可得到本發明多毛細均溫板結構。Therefore, by the above-mentioned structural composition, the multi-hairy temperature-equalizing plate structure of the present invention can be obtained.

因此,藉由本發明多毛細均溫板結構,透過上述殼體1之段差部103/113,可以使殼體1之第一區域100/110與第二區域101/111分別貼附於厚度或高度不同的發熱源上,同時能藉由該束狀毛細24維持第一區域100/110與第二區域101/111之間的工作流體回流效益;更重要地,所述連通區域102/112在段差部103/113(或束狀毛細24之傾斜段243)的下游處形成有由第一毛細20與第二毛細21重疊的的交疊區O,可有助配合束狀毛細24將工作流體快速回流至第一區域100/110。Therefore, by means of the multi-capillary temperature-averaging plate structure of the present invention, the first area 100/110 and the second area 101/111 of the housing 1 can be respectively attached to heat sources of different thicknesses or heights through the step portion 103/113 of the housing 1, and at the same time, the working fluid reflux efficiency between the first area 100/110 and the second area 101/111 can be maintained through the capillaries 24; more importantly, the connecting area 102/112 forms an overlapping area O where the first capillaries 20 and the second capillaries 21 overlap at the downstream of the step portion 103/113 (or the inclined section 243 of the capillaries 24), which can help cooperate with the capillaries 24 to quickly reflux the working fluid to the first area 100/110.

另外,本發明在該等支撐結構3上,係視第一區域100/110、連通區域102/112與第二區域101/ 111而分別配置第一支撐柱30、第二支撐柱31與第三支撐柱32;其中第一支撐柱30包含實心部300以及包覆於該實心部300外圍的燒結部301,故具有良好的支撐及部分的回流功能,而第二支撐柱31係位於段差部103/113而以實心柱提供穩固地支撐功能,最後第三支撐柱32乃考量回流效率以粉末燒結而成,以視均溫板各部位作了優化的支撐及兼具回流等功能的支撐結構3。In addition, the present invention configures the first supporting column 30, the second supporting column 31 and the third supporting column 32 on the supporting structures 3 according to the first area 100/110, the connecting area 102/112 and the second area 101/111 respectively; wherein the first supporting column 30 includes a solid portion 300 and a sintered portion 301 wrapped around the outer periphery of the solid portion 300, so it has good support and partial reflow functions, and the second supporting column 31 is located at the step portion 103/113 and provides a stable support function with a solid column, and finally the third supporting column 32 is formed by sintering powder in consideration of the reflow efficiency, so as to optimize the support for each part of the temperature balancing plate and provide a supporting structure 3 with functions such as reflow.

綜上所述,本發明確可達到預期之使用目的,而解決習知之缺失,又因極具新穎性及進步性,完全符合發明專利申請要件,爰依專利法提出申請,敬請詳查並賜准本案專利,以保障發明人之權利。In summary, this invention can achieve the intended purpose and solve the lack of knowledge. It is also extremely novel and progressive and fully meets the requirements for invention patent application. Therefore, we have filed an application in accordance with the Patent Law. We sincerely request that you carefully examine and grant the patent in this case to protect the rights of the inventor.

惟以上所述僅為本發明之較佳可行實施例,非因此即拘限本發明之專利範圍,故舉凡運用本發明說明書及圖式內容所為之等效技術、手段等變化,均同理皆包含於本發明之範圍內,合予陳明。However, the above is only the preferred feasible embodiment of the present invention, and does not limit the patent scope of the present invention. Therefore, all equivalent technologies, means and other changes made by using the contents of the description and drawings of the present invention are also included in the scope of the present invention and are appropriately stated.

<本發明> 1:殼體 10:第一板 100:第一區域 101:第二區域 102:連通區域 103:段差部 104:延伸區域 11:第二板 110:第一區域 111:第二區域 112:連通區域 113:段差部 114:延伸區域 2:複合毛細 20:第一毛細 21:第二毛細 23:第三毛細 24:束狀毛細 240:第一段 241:第二段 242:彎曲段 243:傾斜段 3:支撐結構 30:第一支撐柱 300:實心部 301:燒結部 31:第二支撐柱 32:第三支撐柱 O:交疊區 <The present invention> 1: Shell 10: First plate 100: First area 101: Second area 102: Connecting area 103: Step difference 104: Extension area 11: Second plate 110: First area 111: Second area 112: Connecting area 113: Step difference 114: Extension area 2: Composite hair 20: First hair 21: Second hair 23: Third hair 24: Bunch hair 240: First section 241: Second section 242: Bending section 243: Inclined section 3: Support structure 30: First supporting column 300: Solid part 301: Sintering section 31: Second support column 32: Third support column O: Overlapping area

圖1係本發明之立體分解示意圖。FIG. 1 is a schematic diagram of a three-dimensional exploded view of the present invention.

圖2係本發明之第一板體的平面示意圖。FIG. 2 is a schematic plan view of the first plate of the present invention.

圖3係本發明之第二板體的平面示意圖。FIG. 3 is a schematic plan view of the second plate of the present invention.

圖4係本發明之剖面示意圖。FIG. 4 is a schematic cross-sectional view of the present invention.

圖5係圖4之A部分放大詳圖。FIG. 5 is an enlarged detailed view of portion A of FIG. 4 .

1:殼體 1: Shell

10:第一板 10: First board

100:第一區域 100: First area

101:第二區域 101: Second Area

102:連通區域 102: Connecting area

103:段差部 103: Step difference

11:第二板 11: Second board

110:第一區域 110: First area

111:第二區域 111: Second area

112:連通區域 112: Connecting area

113:段差部 113: Step difference

24:束狀毛細 24: Bunch of hair

240:第一段 240: First paragraph

242:彎曲段 242: Bend section

243:傾斜段 243: Inclined section

30:第一支撐柱 30: The first support pillar

300:實心部 300: Solid part

301:燒結部 301: Sintering section

32:第三支撐柱 32: The third pillar

Claims (10)

一種多毛細均溫板結構,包括:一殼體,包含一第一板與一第二板相蓋合而成,並具有一第一區域、一第二區域、以及連通於所述第一區域與所述第二區域之間的連通區域,且所述連通區域上至少構成一段差部;一複合毛細,設於該殼體內,並包含設於該第一板內的第一毛細與第二毛細、設於該第二板內的第三毛細、以及通過所述連通區域而延伸於所述第一區域與所述第二區域之間的束狀毛細;以及複數支撐結構,支撐於該殼體內;其中,該束狀毛細係通過所述支撐結構的間距,以延伸於所述第一區域至所述第二區域而被夾置該第一板與該第二板之間,且所述連通區域上形成由該第一毛細與該第二毛細重疊的交疊區,所述交疊區位於該段差部的下游處。 A multi-capillary temperature plate structure includes: a shell, which includes a first plate and a second plate covered together, and has a first area, a second area, and a connecting area between the first area and the second area, and the connecting area at least forms a step difference; a composite capillary, which is arranged in the shell, and includes a first capillary and a second capillary arranged in the first plate, a third capillary arranged in the second plate, and a first capillary arranged in the second plate. A bundle of hairs extending between the first area and the second area through a connecting area; and a plurality of supporting structures supported in the housing; wherein the bundle of hairs is sandwiched between the first plate and the second plate by extending from the first area to the second area through the spacing of the supporting structures, and an overlapping area formed by the first hairs and the second hairs overlapping is formed on the connecting area, and the overlapping area is located downstream of the step portion. 如請求項1所述之多毛細均溫板結構,其中該殼體之第二區域係進一步連通一延伸區域,且該束狀毛細朝向所述延伸區域作延伸。 The multi-hair temperature-averaging plate structure as described in claim 1, wherein the second area of the shell is further connected to an extension area, and the bundled hairs extend toward the extension area. 如請求項2所述之多毛細均溫板結構,其中所述延伸區域於該第一板處係由該第二毛細延伸設置,而於該第二板處則由該第三毛細延伸設置。 The multi-capillary temperature-averaging plate structure as described in claim 2, wherein the extension area is extended by the second capillary at the first plate, and is extended by the third capillary at the second plate. 如請求項1至3任一項所述之多毛細均溫板結構,其中所述第一毛細係為粉末燒結、所述第二毛細則為編織網。 A multi-hair temperature-averaging plate structure as described in any one of claim items 1 to 3, wherein the first hair is powder sintered and the second hair is a woven mesh. 如請求項4所述之多毛細均溫板結構,其中所述第三毛細係為編織網。 The multi-hair temperature-equalizing plate structure as described in claim 4, wherein the third hair is a woven mesh. 如請求項1所述之多毛細均溫板結構,其中該束狀毛細係具有一第一段、以及一與所述第一段相遠離的第二段,且所述第一段由該殼體之第一區域延伸至所述連通區域,以連接至位於所述第二區域的第二段。 The multi-hair temperature-averaging plate structure as described in claim 1, wherein the bundled hair has a first section and a second section far away from the first section, and the first section extends from the first area of the housing to the connecting area to connect to the second section located in the second area. 如請求項6所述之多毛細均溫板結構,其中該束狀毛細之第一段與第二段之間形成一彎曲段,且所述第二段係朝向所述彎曲段的彎曲方向延伸。 The multi-hair temperature-averaging plate structure as described in claim 6, wherein a curved section is formed between the first section and the second section of the bundled hairs, and the second section extends in the curved direction of the curved section. 如請求項1、6或7所述之多毛細均溫板結構,其中該束狀毛細係為纖維束。 A multi-hair temperature-regulating plate structure as described in claim 1, 6 or 7, wherein the bundled hairs are fiber bundles. 如請求項1所述之多毛細均溫板結構,其中該等支撐結構係包含分佈配置於所述第一區域內的第一支撐柱、分佈配置於所述連通區域內的第二支撐柱、以及分佈配置於所述第二區域內的第三支撐柱。 The multi-hair temperature-averaging plate structure as described in claim 1, wherein the supporting structures include a first supporting column distributed in the first area, a second supporting column distributed in the connecting area, and a third supporting column distributed in the second area. 如請求項9所述之多毛細均溫板結構,其中各該第一支撐柱係包含實心部以及包覆於該實心部外圍的燒結部,各該第二支撐柱為銅或鋁構成的實心柱,而各該第三支撐柱則為粉末燒結而成。 The multi-hairy temperature-averaging plate structure as described in claim 9, wherein each of the first supporting columns comprises a solid portion and a sintered portion surrounding the solid portion, each of the second supporting columns is a solid column made of copper or aluminum, and each of the third supporting columns is made of powder sintering.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479113B (en) * 2011-06-22 2015-04-01 Chaun Choung Technology Corp Temperature equalizing plate structure with heated convex portion
TW202119903A (en) * 2018-12-21 2021-05-16 訊凱國際股份有限公司 Heat dissipation device having irregular shape
TWM615716U (en) * 2021-02-08 2021-08-11 大陸商亞浩電子五金塑膠(惠州)有限公司 Double-sided heat source heat dissipation structure
JP2022016147A (en) * 2020-07-10 2022-01-21 尼得科超▲しゅう▼科技股▲ふん▼有限公司 Heat conductive member

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479113B (en) * 2011-06-22 2015-04-01 Chaun Choung Technology Corp Temperature equalizing plate structure with heated convex portion
TW202119903A (en) * 2018-12-21 2021-05-16 訊凱國際股份有限公司 Heat dissipation device having irregular shape
JP2022016147A (en) * 2020-07-10 2022-01-21 尼得科超▲しゅう▼科技股▲ふん▼有限公司 Heat conductive member
TWM615716U (en) * 2021-02-08 2021-08-11 大陸商亞浩電子五金塑膠(惠州)有限公司 Double-sided heat source heat dissipation structure

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