TWI479113B - Temperature equalizing plate structure with heated convex portion - Google Patents

Description

Temperature equalizing plate structure with heated convex portion

The present invention relates to a temperature equalizing plate, and more particularly to a temperature equalizing plate structure having heated protrusions.

According to the Vapor Chamber, a commonly used heat conduction module mainly comprises a flat casing, a working fluid filled in the interior of the flat casing, and a molded body formed on the inner wall of the flat casing. a capillary structure and a support structure disposed inside the flat casing. The support structure is used to provide sufficient compressive strength to the flat shell to prevent the flat shell from being recessed by external pressure. In use, a surface of the temperature equalizing plate that contacts the heat generating component is referred to as a "heat absorbing surface", and a surface away from the heat generating component is referred to as a "heat releasing surface", and a portion of the working fluid in the uniform temperature plate adjacent to the heat absorbing surface absorbs the heat generating component The generated heat is vaporized, and the vaporized working fluid flows to the heat releasing surface, and after the heat radiating surface is exothermicly condensed, it flows back along the capillary structure to the heat absorbing surface, and the heating element is heated by the vapor-liquid phase change of the working fluid and the capillary action of the capillary action. The heat is transmitted to the outside world.

The inner wall of the above-mentioned temperature equalizing plate is provided with capillary structure, so that the entire heat absorbing surface can be used to conduct heat generated by the heat generating component. However, not all heat absorbing surfaces are in contact with the heat generating component, and therefore, the inner surface of the heat absorbing surface The remaining capillary structure does not have a substantial effect on the heat conduction of the heating element, and the excess idle capillary structure undoubtedly increases the manufacturing cost of the entire temperature equalizing plate. If the exclusive capillary structure can be designed for the position of the heat generating component to absorb the heat generated by the heat generating component, the working efficiency of the capillary structure can be greatly improved, and the manufacturing cost can be reduced.

On the other hand, with the rapid development of technology, many large-area printed circuit boards are provided with a plurality of heating elements, and the thickness of these heating elements is inevitably different. The conventional uniform temperature plate structure cannot be flattened with a flat heat absorption surface. The thermal contact with each of the heating elements results in the need to design different temperature equalizing plates for each heating element, which not only increases the overall production cost, but also the steps of mounting these temperature equalizing plates on the printed circuit board are complicated.

Therefore, how to solve the above problems has become an improvement target of the present inventors.

It is an object of the present invention to provide a temperature equalizing plate structure having a heat-receiving convex portion which is raised by a portion where a temperature equalizing plate is not in contact with a heat generating element, and is advantageous for mounting and guiding a specific single heat generating element. Cooling.

Another object of the present invention is to provide a temperature equalizing plate structure having heated projections, which is provided with a capillary structure corresponding to the position of the heat generating component, thereby increasing the heat transfer performance of the capillary structure and reducing the cost.

In order to achieve the above object, the present invention provides a temperature equalizing plate structure having a heated convex portion for guiding heat dissipation of a heat generating component, the temperature equalizing plate structure comprising: a bottom plate having a thermal contact on one side thereof At least one heated convex portion of the component, the other side is formed with a receiving recess corresponding to the heated convex portion; a first capillary structure is disposed in the receiving recess; a second capillary structure is placed The second capillary structure is provided with an opening corresponding to the receiving groove and a plurality of air flow channels communicating with the opening; a cover plate on which the sealing cover is attached; and a plurality of supporting columns located at the bottom And a clamping fluid is sandwiched between the cover plate and the first capillary structure; and a working fluid is filled between the cover plate and the bottom plate.

Compared with the prior art, the present invention has the following effects: since the bottom plate side of the present invention has at least one heated convex portion that thermally contacts the heat generating component, the peripheral size of the heated convex portion can be designed according to the peripheral size and thickness of the heat generating component. With the thickness, in this way, heat-receiving protrusions of different thicknesses can be formed in the structure of the uniform temperature plate, so as to simultaneously conduct heat dissipation of a plurality of heat-generating elements having different thicknesses on the printed circuit board.

Since the present invention has a receiving groove corresponding to the heat receiving convex portion formed on the other side of the bottom plate, and the first capillary structure is placed in the receiving groove, the first capillary structure can be properly controlled according to the peripheral size of the heat generating component. The size of a capillary structure greatly improves the working efficiency of the first capillary structure and reduces the manufacturing cost.

Since the second capillary structure of the present invention has an opening corresponding to the groove and a plurality of air flow channels communicating with the opening, the working fluid in the first capillary structure can be directly and quickly transmitted through the opening and the air flow groove after being vaporized. The road flows to the cover plate, thereby rapidly transferring the heat generated by the heat generating component to the cover.

Since the cover plate of the present invention is formed with a plurality of support columns, and the second capillary structure is disposed between the cover plate and the bottom plate, the vaporous working fluid flowing to the cover plate can be condensed after the heat is condensed by the cover plate, and the condensed working fluid can utilize the second The capillary structure and the plurality of support columns are quickly returned to the first capillary structure, thereby avoiding a "dry-out" phenomenon of the working fluid in the first capillary structure, and greatly improving the heat transfer effect of the uniform temperature plate.

The bottom plate of the present invention has a receiving groove, and the cover plate is formed with a plurality of supporting columns at positions corresponding to the receiving grooves, and the supporting columns are connected and supported between the cover plate and the first capillary structure, so that the support The column can not only serve as a means for the vaporized working fluid to flow back to the first capillary structure, but also provide sufficient support strength between the cover plate and the first capillary structure to prevent the cover from being recessed in the receiving recess.

The detailed description and technical content of the present invention will be described with reference to the accompanying drawings.

Referring to the first to fifth figures, the present invention provides a temperature equalizing plate structure having a heated convex portion (hereinafter referred to as "soaked plate structure 1") for performing a heating element 100 (fourth drawing). The heat dissipation plate structure 1 includes a bottom plate 10, a first capillary structure 20, a second capillary structure 30, a cover plate 40, and a working fluid 50.

The bottom plate 10 is made of a metal material, one side of which has a heat receiving convex portion 11 (second drawing) which is in thermal contact with the heat generating component 100, and the other side is formed with a receiving groove 12 corresponding to the heat receiving convex portion 11. . As can be seen from the first and second figures, the heated convex portion 11 is substantially square, and the receiving recess 12 is also square, but the shape of the heated convex portion 11 and the receiving recess 12 is not limited thereto. It can be suitably changed according to the peripheral dimension of the heat generating element 100.

The first capillary structure 20 is disposed in the accommodating recess 12, and the first capillary structure 20 is formed into a plate shape to be laid flat on the bottom of the accommodating recess 12; thereby, heat generated by the heat generating component 100 can be transmitted through The heated convex portion 11 of the bottom plate 10 is conducted into the accommodating recess 12 and is absorbed by the working fluid 50 in the first capillary structure 20. The first capillary structure 20 may be an element made of any one of a metal sintered powder and a metal woven mesh, but the texture made of the metal sintered powder is relatively dense.

The bottom surface of the bottom plate 10 and the surface of the receiving recess 12 are formed with a flange 13 having a thickness substantially equal to the thickness of the second capillary structure 30, whereby the second capillary structure 30 can be placed flush. On the bottom plate 10. The second capillary structure 30 is made of a metal woven mesh, and the second capillary structure 30 has an opening 31 corresponding to the receiving groove 12 and a plurality of air flow channels 32 communicating with the opening; more specifically, the second capillary The structure 30 is substantially in the shape of a flat plate to be flatly attached to the bottom plate 10. In the center of the second capillary structure 30, an opening 31 is provided corresponding to the receiving groove 12 of the bottom plate 10, and a space is arranged at the periphery of the opening 31. The plurality of capillary sheets 33 form an air flow channel 32 between the adjacent two capillary sheets 33. Therefore, the air flow channels 32 are radially arranged around the opening 31. Similarly, the air flow channels 32 can be mostly interconnected. The "ten" shaped channel is routed (as shown in FIG. 9) whereby the vaporized working fluid 50 can be rapidly diffused from the opening 31 through the air flow channel 32 to all sides.

It is worth mentioning that each capillary piece 33 is bent adjacent to the end of the opening 31 toward the first capillary structure 20 into a drainage section 331, whereby a portion of the condensed working fluid 50 is transmitted through the second capillary structure 30. The capillary sheets 33 follow the drainage sections 331 and quickly merge into the first capillary structure 20 in the accommodating recess 12, thus preventing the working fluid 50 in the first capillary structure 20 from being dry-out. phenomenon.

The cover 40 is made of a metal material and the sealing cover is placed on the bottom plate 10. The contour of the cover 40 corresponds to the contour of the bottom plate 10 to form a sealed space therebetween for the working fluid 50 to be vaporized and liquidized therein. Change and cycle reflow. The cover plate 40 is extended with a plurality of support columns 41 at positions corresponding to the recesses 12, and the support columns 41 may be metal powder sintered components, metal columns (see FIG. 9) or a mixed arrangement of the foregoing, thereby generating Has a better support effect. The support post 41 is sandwiched between the cover 40 and the first capillary structure 20 to prevent the cover 40 from being recessed in the accommodating recess 12 due to external pressure. In addition, each of the support columns 41 may be separately fabricated and then connected to the inner wall of the cover 40 or the surface of the first capillary structure 20.

The working fluid 50 is filled between the cover plate 40 and the bottom plate 10. The liquid working fluid 50 is automatically collected in the accommodating recess 12 and enters the first capillary structure 20 due to gravity.

Referring to the fourth and fifth figures, when the temperature equalizing plate structure 1 of the present invention is placed on the heat generating component 100 of a printed circuit board P, the heat receiving convex portion 11 thermally contacts the heat generating component 100 to absorb the heat of the heat generating component 100. The heat absorbed by the heat convex portion 11 is transmitted through the metal of the bottom plate 10 into the accommodating recess 12, thereby vaporizing the working fluid 50 in the first capillary structure 20 in the accommodating recess 12 along the air flow grooves. The channel 32 (fifth figure) flows to the cover plate 40; the outer side of the cover plate 40 is connected with a heat dissipation fin set 200 for dissipating the heat of the cover plate 40 to the outside; the working fluid 50 condensed by the heat release is along The capillary sheet 33 (fifth view) of the second capillary structure 30 and the support columns 41 (fourth view) are returned to the first capillary structure 20.

Referring to the sixth to eighth embodiments, another embodiment of the present invention will be described. The difference between this embodiment and the prior embodiment is that there are two heat generating elements 110, 120, so that the bottom plate 10 has two heat receiving convex portions 11 11'; however, the number of the heat-receiving protrusions 11 of the present invention is not limited to one or two, and the number, position, and thickness may be formed on the temperature-regulating plate structure 1 according to the number, position, and thickness of the heat-generating elements. Heated convex portion 11.

The temperature equalizing plate structure 1 of the present embodiment also includes a bottom plate 10, a first capillary structure 20, a second capillary structure 30, a cover plate 40, a support column 41, and a working fluid 50, and the same description as in the previous embodiment is omitted here. So as not to repeat.

As shown in the sixth figure and the seventh figure, the heat generating convex portions having different peripheral sizes and thicknesses can be formed according to the peripheral size and thickness of the heat generating component; specifically, the printed circuit board P has a first heat generating component thereon. 110 and a second heating element 120, the circumference of the first heating element 110 is smaller than the circumferential size and thickness of the second heating element 120; therefore, the bottom plate 10 is formed with a first heated convex portion 11 and a second heated portion. The position of the first heat receiving convex portion 11 corresponds to the circumference of the first heat generating element 110, and the position of the second heat receiving convex portion 11' corresponds to the circumference of the second heat generating element 120, but the first heat receiving convex portion 11 The amount of protrusion is larger than the amount of protrusion of the second heat receiving convex portion 11'. In other words, the total amount of protrusion of the first heat receiving convex portion 11 from the bottom plate 10 and the thickness of the first heat generating element 110 is equal to the second heat receiving convex portion 11 The sum of the amount of protrusion from the bottom plate 10 and the thickness of the second heat generating element 120 is thereby maintained at an equal distance between the cover 40 of the entire temperature equalizing plate structure 1 and the printed circuit board P.

The receiving groove 12 on the opposite side of the first heat receiving convex portion 11 is provided with a first capillary structure 20, the cover plate 40 is formed with a supporting column 41, and the receiving groove 12' on the opposite side of the second heated convex portion 11' is provided with a first receiving portion a capillary structure 20', the cover plate 40 is formed with a support column 41'; the second capillary structure 30 is formed corresponding to the receiving groove 12 and the receiving groove 12' to form two openings (eighth figure) and communicate with the two openings The plurality of air flow channels 32.

As shown in the seventh and eighth figures, when the temperature equalizing plate structure 1 of the present invention is placed on the printed circuit board P, the first heat receiving convex portion 11 thermally contacts the first heat generating component 110 to absorb the first heat generating component 110. The heat absorbed by the first heated convex portion 11 is transmitted through the metal of the bottom plate 10 into the accommodating recess 12, thereby vaporizing the working fluid 50 in the first capillary structure 20 in the accommodating recess 12 along the heat. The air flow channel 32 flows to the cover plate 40; the outer side of the cover plate 40 is connected with a heat dissipation fin set 200 for dissipating the heat of the cover plate 40 to the outside; the working fluid 50 condensed by the heat release along the The second capillary structure 30 (eighth view) and the support columns 41 (seventh view) are returned to the first capillary structure 20.

Similarly, the second heated protrusion 11' thermally contacts the second heating element 120 to absorb the heat of the second heating element 120, and the heat absorbed by the second heated protrusion 11' is transmitted through the metal of the bottom plate 10 into the receiving recess. The groove 12' further vaporizes the working fluid 50' in the first capillary structure 20' in the receiving groove 12' to flow along the air flow channel 32 to the cover plate 40; the outer side of the cover plate 40 is connected a heat dissipation fin set 200 for dissipating heat of the cover plate 40 to the outside; the working fluid 50' condensed by exotherm along the second capillary structure 30 (eighth figure) and the support columns 41' Seven graphs) are returned to the first capillary tissue 20'.

In this way, the temperature equalizing plate structure 1 can quickly transfer the heat generated by the first heating element 110 and the second heating element 120 to the heat dissipation fin set 200 and dissipate to the outside through the heat dissipation fin set 200.

In summary, it is known that the "smooth plate structure having a heated convex portion" of the present invention has industrial applicability, novelty, and advancement, and the structure of the present invention has not been seen in similar products and is publicly used, and is fully in accordance with the invention. The patent application requirements are filed in accordance with the Patent Law.

1. . . Temperature uniform plate structure

10. . . Bottom plate

11, 11’. . . Heated convex

12, 12’. . . Locating groove

13. . . Flange

20, 20’. . . First capillary tissue

30. . . Second capillary tissue

31. . . Opening

32. . . Air flow channel

33. . . Capillary film

331. . . Drainage section

40. . . Cover

41, 41’. . . Support column

50, 50’. . . Working fluid

100, 110, 120. . . Heating element

200. . . Heat sink fin set

P. . . A printed circuit board

The first figure is an exploded perspective view of the present invention.

The second drawing is a combined perspective view of the present invention.

The third drawing is a side cross-sectional view of the present invention.

The fourth figure is a schematic diagram of the operation of the present invention.

Figure 5 is a top plan view of the present invention showing the flow of working fluid.

Figure 6 is a side cross-sectional view showing another embodiment of the present invention.

Figure 7 is a schematic view showing the operation of another embodiment of the present invention.

Figure 8 is a plan view of another embodiment of the present invention showing the flow of working fluid.

Figure 9 is an exploded perspective view of still another embodiment of the present invention.

1. . . Temperature uniform plate structure

10. . . Bottom plate

12. . . Locating groove

13. . . Flange

20. . . First capillary tissue

30. . . Second capillary tissue

31. . . Opening

32. . . Air flow channel

33. . . Capillary film

331. . . Drainage section

40. . . Cover

41. . . Support column

Claims (9)

A temperature equalizing plate structure having a heated convex portion for guiding heat dissipation of a heat generating component, the temperature equalizing plate structure comprising: a bottom plate having one side having at least one heated convex portion thermally contacting the heat generating component, and the other The side is formed with a receiving groove corresponding to the heat convex portion; a first capillary structure is disposed in the receiving groove; a second capillary structure is placed on the bottom plate, and the second capillary structure is disposed An opening corresponding to the recess and a plurality of air flow passages communicating with the opening; a cover plate on which the sealing cover is attached; and a plurality of support columns located in the receiving recess and being clamped Between the cover plate and the first capillary structure; and a working fluid filled between the cover plate and the bottom plate; wherein the second capillary structure is a metal woven mesh, the opening is disposed on the metal woven mesh In the middle, the metal woven mesh is formed with a plurality of drainage sections attached to the inner wall surface of the accommodating recess, the metal woven mesh further comprising a plurality of capillary sheets sandwiched between the bottom plate and the cover plate, each of the capillary sheets Is bent from each of the drainage sections and is in each of the hairs It is formed between each of the gas flow channel plate. A temperature equalizing plate structure having a heated convex portion according to claim 1, wherein the first capillary structure is formed into a plate shape to be laid flat on the bottom of the receiving groove, and the first capillary structure is a metal powder sintered Element or a metal woven mesh. a temperature equalizing plate structure having a heated convex portion as claimed in claim 1 A flange is formed on a surface of the bottom surface of the bottom plate on the same side of the receiving groove, and the flange enables the metal woven mesh to be placed flush between the bottom plate and the cover plate. A temperature equalizing plate structure having a heated convex portion as claimed in claim 1, wherein the air flow channels are radially arranged around the opening. A temperature equalizing plate structure having a heated convex portion as claimed in claim 1, wherein the air flow channels are arranged in a plurality of mutually connected "ten" shaped channels. A temperature equalizing plate structure having heat-receiving projections as claimed in claim 1, wherein each of the support columns is a metal powder sintered component. A uniform temperature plate structure having heat-receiving protrusions as claimed in claim 1, wherein each of the support columns is a metal column. A temperature equalizing plate structure having a heated convex portion according to claim 1, wherein a part of the supporting column is a metal powder sintered component and the other supporting pillar is a metal pillar. The structure of claim 1, wherein the heating element comprises a first heating element and a second heating element, and the bottom plate is formed with a first position corresponding to the position of the first heating element. The heat receiving convex portion forms a second heat receiving convex portion corresponding to the position of the second heat generating component.