TWI848371B - Inspection system, control method, manufacturing method of electronic component and cutting device - Google Patents

Abstract

The problem to be solved by the present invention is to provide an inspection system, a control method, a method for manufacturing an electronic component, and a cutting device that can automatically adjust the irradiation state of light irradiated to the inspection object when inspecting the inspection object. In order to solve this problem, the inspection system inspects the inspection object based on a captured image of the inspection object. The inspection system includes an illumination unit, a camera, a control unit, and a memory unit. The illumination unit can change the irradiation state of light and irradiate the inspection object with light. In the state of irradiating the inspection object with light, the camera generates a captured image. The control unit controls each of the illumination unit and the camera to generate a plurality of captured images generated under different irradiation states. The memory unit stores a reference histogram. The control unit compares each histogram generated based on each of the plurality of captured images with a reference histogram, and determines an irradiation state used in the inspection based on the comparison result.

Description

Inspection system, control method, manufacturing method of electronic component and cutting device

The present invention relates to an inspection system, a control method, a manufacturing method of an electronic component and a cutting device.

Japanese Patent Laid-Open No. 2021-115668 (Patent Document 1) discloses a processing device including a camera unit. The camera unit includes an illuminator for irradiating light to a workpiece. In the processing device, the workpiece is photographed while the workpiece is irradiated with light (see Patent Document 1). [Prior Technical Document] [Patent Document]

Patent document 1: Japanese Patent Application Publication No. 2021-115668

[The problem the invention is trying to solve]

For example, in the processing device disclosed in Patent Document 1, the illuminator can be adjusted manually. In this case, the brightness of the light irradiated on the workpiece (hereinafter also referred to as "light irradiation state") is determined based on the judgment of the operator. However, this judgment is not always easy.

The present invention is completed to solve this problem, and its purpose is to provide an inspection system, a control method, an electronic component manufacturing method and a cutting device that can automatically adjust the irradiation state of light irradiated to the inspection object when inspecting the inspection object. [Technical means for solving the problem]

According to one aspect of the present invention, an inspection system inspects an inspection object based on a captured image of the inspection object. The inspection system includes an illumination unit, a camera, a control unit, and a memory unit. The illumination unit can change the irradiation state of light and irradiate light to the inspection object. In the state of irradiating light to the inspection object, the camera generates a captured image. The control unit controls each of the illumination unit and the camera to generate a plurality of captured images generated under different irradiation states. The memory unit stores a reference histogram. The control unit compares each histogram generated based on each of the plurality of captured images with the reference histogram, and determines the irradiation state used in the inspection based on the comparison result.

Furthermore, a control method according to another aspect of the present invention is a control method for the above-mentioned inspection system. The control method includes a control step and a determination step, wherein the control step controls each of the illumination unit and the camera to generate a plurality of captured images generated under different illumination conditions, and the determination step compares each histogram generated based on each of the plurality of captured images with a reference histogram, and determines the illumination condition used in the inspection based on the comparison result.

Furthermore, a method for manufacturing electronic components according to another aspect of the present invention is a method for manufacturing electronic components using the above-mentioned inspection system. The method for manufacturing electronic components includes a determination step and a manufacturing step, wherein the determination step determines the irradiation state used in the above-mentioned inspection, and the manufacturing step uses a cutting mechanism to cut the substrate sealed with resin to manufacture a plurality of electronic components. Each of the plurality of electronic components is an inspection object. The method for manufacturing electronic components also includes the step of generating a captured image in a state where light is irradiated to the inspection object under the determined irradiation state and performing the above-mentioned inspection.

Furthermore, according to another aspect of the present invention, the cutting device includes a cutting mechanism and the above-mentioned inspection system. The cutting mechanism cuts the substrate after the resin sealing is completed. [Effect of the invention]

According to the present invention, it is possible to provide an inspection system, a control method, a method for manufacturing an electronic component, and a cutting device that can automatically adjust the irradiation state of light irradiated to an inspection object when inspecting the inspection object.

Hereinafter, a detailed description is given using drawings for an embodiment of one side of the present invention (hereinafter, also referred to as "this embodiment"). In addition, the same symbols are given to the same or equivalent parts in the drawings, and their descriptions are not repeated. In addition, for easy understanding, appropriate objects are omitted or exaggerated and schematically depicted in each drawing. [1. Configuration] ＜1-1. Overall configuration of the cutting device＞

Fig. 1 is a schematic plan view of a cutting device 1 according to the present embodiment. The cutting device 1 is configured to separate a package substrate (cutting object) into a plurality of electronic components (package components) by cutting the package substrate. In the package substrate, a substrate or a lead frame on which a semiconductor chip is mounted is sealed with resin.

Examples of package substrates include BGA (Ball Grid Array) package substrates, LGA (Land Grid Array) package substrates, CSP (Chip Size Package) package substrates, LED (Light Emitting Diode) package substrates, and QFN (Quad Flat No-leaded) package substrates.

The cutting device 1 is configured to inspect each of the plurality of electronic components that have been singulated. In the cutting device 1, an image of each electronic component is captured, and each electronic component is inspected based on the image. Inspection data is generated through the inspection to classify each electronic component as "good" or "defective".

In this example, a package substrate P1 is used as a cutting object, and the package substrate P1 is singulated into a plurality of electronic components S1 by a cutting device 1. Hereinafter, the side of the package substrate P1 sealed with resin is referred to as a sealing surface, and the side opposite to the sealing surface is referred to as a solder ball/wire surface.

As shown in FIG. 1, the cutting device 1 includes a cutting module A1 and an inspection and storage module B1 as components. The cutting module A1 is configured to manufacture a plurality of electronic components S1 by cutting a package substrate P1. The inspection and storage module B1 is configured to inspect each of the manufactured plurality of electronic components S1 and then store the electronic components S1 in a tray. In the cutting device 1, each component can be mounted and removed from other components and exchanged.

The cutting module A1 mainly includes a substrate supply unit 3, a positioning unit 4, a cutting table 5, a spindle unit 6, and a conveying unit 7.

The substrate supply unit 3 pushes out the package substrates P1 one at a time from the cassette M1 storing a plurality of package substrates P1, thereby supplying the package substrates P1 one at a time toward the positioning unit 4. At this time, the package substrates P1 are arranged with the solder balls/leads facing upward.

The positioning unit 4 positions the package substrate P1 pushed out from the substrate supply unit 3 on the rail unit 4 a , thereby positioning the package substrate P1 . Thereafter, the positioning unit 4 conveys the positioned package substrate P1 toward the cutting stage 5 .

The cutting table 5 holds the package substrate P to be cut. In this example, a cutting device 1 having a double cutting table structure with two cutting tables 5 is illustrated. The cutting table 5 includes a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c. The holding member 5a absorbs the package substrate P1 conveyed by the positioning portion 4 from below to hold the package substrate P1. The rotating mechanism 5b can rotate the holding member 5a in the θ1 direction of the figure. The moving mechanism 5c can move the holding member 5a along the Y axis of the figure.

The core shaft portion 6 separates the package substrate P1 into a plurality of electronic components S1 by cutting the package substrate P1. In this example, a cutting device 1 having a double core shaft portion structure with two core shaft portions 6 is illustrated. The core shaft portion 6 can move along the X-axis and the Z-axis of the figure. In addition, the cutting device 1 can also be a single core shaft portion structure having one core shaft portion 6.

Fig. 2 is a side view schematically showing the spindle portion 6. As shown in Fig. 2, the spindle portion 6 includes a blade 6a, a rotation shaft 6c, a first flange 6d, a second flange 6e, and a fastening member 6f.

The blade 6a cuts the package substrate P1 by high-speed rotation to singulate the package substrate P1 into a plurality of electronic components S1. The blade 6a is mounted on the rotating shaft 6c while being clamped by a flange (first flange) 6d on one side and a flange (second flange) 6e on the other side. The first flange 6d and the second flange 6e are fixed to the rotating shaft 6c by a fastening member 6f such as a nut. The first flange 6d is called an inner flange, and the second flange 6e is called an outer flange.

The spindle portion 6 is provided with a cutting water nozzle, a cooling water nozzle, and a cleaning water nozzle (none of which is shown). The cutting water nozzle sprays cutting water toward the blade 6a rotating at a high speed. The cooling water nozzle sprays cooling water. The cleaning water nozzle sprays cleaning water for cleaning cutting chips and the like.

Referring again to FIG. 1, after the cutting stage 5 absorbs the package substrate P1, the first position confirmation camera 5d is used to photograph the package substrate P1 to confirm the position of the package substrate P1. The confirmation performed using the first position confirmation camera 5d is, for example, confirmation of the position of a mark provided on the package substrate P1. The mark indicates, for example, the cutting position of the package substrate P1.

Thereafter, the cutting table 5 is moved along the Y axis of the figure toward the mandrel portion 6. After the cutting table 5 is moved to the bottom of the mandrel portion 6, the package substrate P1 is cut by moving the cutting table 5 relative to the mandrel portion 6. Thereafter, as required, the package substrate P1 is photographed by the second position confirmation camera 6b included in the mandrel portion 6 to confirm the position of the package substrate P1, etc. The confirmation performed using the second position confirmation camera 6b is, for example, confirmation of the cutting position and cutting width of the package substrate P1.

After the package substrate P1 is cut, the cutting table 5 moves along the Y axis of the figure away from the core shaft portion 6 while the plurality of electronic components S1 formed into individual pieces are adsorbed. During this movement, the upper surface (solder ball/wire surface) of the electronic component S1 is cleaned and dried by the first cleaning device 5e.

The conveyor 7 sucks the electronic component S1 held on the cutting table 5 from above and conveys the electronic component S1 toward the inspection table 11 of the inspection and storage module B1. During this conveying process, the lower surface (sealing surface) of the electronic component S1 is cleaned and dried by the second cleaner 7a.

The inspection and storage module B1 mainly includes an inspection table 11, a first optical inspection camera 12, a second optical inspection camera 13, lighting units 16 and 17, a configuration unit 14, and a extraction unit 15. In addition, the first optical inspection camera 12 may also be disposed in the cutting module A1.

In order to perform optical inspection on the electronic component S1, the inspection table 11 holds the electronic component S1. The inspection table 11 can move along the X-axis of the figure. In addition, the inspection table 11 can be turned upside down. In the inspection table 11, a holding member is provided, and the holding member holds the electronic component S1 by adsorbing the electronic component S1. In addition, in the inspection table 11, the surface for holding the electronic component S1 is made of, for example, black rubber. In addition, the color of the rubber may not be black, for example, it may be white, etc.

The first optical inspection camera 12 and the second optical inspection camera 13 photograph both sides (solder ball/wire side and encapsulation side) of the electronic component S1. Various inspections of the electronic component S1 are performed based on the photographed images (image data) generated by the first optical inspection camera 12 and the second optical inspection camera 13. Each of the first optical inspection camera 12 and the second optical inspection camera 13 is arranged near the inspection table 11 and photographs the upper side. The photographed images generated by each of the first optical inspection camera 12 and the second optical inspection camera 13 are, for example, grayscale (256-level) images.

The first optical inspection camera 12 photographs the sealing surface of the electronic component S1 transported to the inspection table 11 by the transport unit 7. Thereafter, the transport unit 7 places the electronic component S1 on the holding member of the inspection table 11. After the holding member absorbs the electronic component S1, the inspection table 11 is turned upside down. The inspection table 11 moves above the second optical inspection camera 13, and the second optical inspection camera 13 photographs the solder ball/wire surface of the electronic component S1.

The lighting section 16 is disposed above the first optical inspection camera 12, and the lighting section 17 is disposed above the second optical inspection camera 13. Each of the lighting sections 16 and 17 is constituted by, for example, so-called coaxial illumination. The lighting section 16 is configured to irradiate light to the electronic component S1 on the inspection table 11 when the inspection is performed by the first optical inspection camera 12. The lighting section 17 is configured to irradiate light to the electronic component S1 on the inspection table 11 when the inspection is performed by the second optical inspection camera 13. Since the lighting sections 16 and 17 have, for example, the same configuration, the configuration of the lighting section 17 will be representatively described below.

FIG. 3 is a diagram schematically showing a cross section of the illumination unit 17. As shown in FIG. 3, during the inspection by the second optical inspection camera 13, the electronic component S1 is irradiated with light emitted by the illumination unit 17. In a state where the light is irradiated to the electronic component S1, a captured image of the electronic component S1 is generated by the second optical inspection camera 13. Based on the captured image, the electronic component S1 is inspected.

The lighting unit 17 is composed of a dome-shaped lighting, and includes a dome 17a and a plurality of LEDs 17b. In addition, the dome-shaped lighting can be composed of a so-called dome lighting, but it is not necessarily composed of a dome lighting, and can include a dome-shaped (umbrella-shaped) component and a plurality of light-emitting components (for example, LEDs) arranged in the component. The dome 17a has a dome shape, and the shape of the dome 17a when viewed from above is circular. In addition, a plurality of LEDs 17b are arranged on the inner surface of the dome 17a. In the lighting unit 17, a plurality of segments (Ch01 to Ch08) are formed from the radial inner side to the outer side of the dome 17a. In each of the plurality of segments, a plurality of LEDs 17b are arranged at predetermined intervals along the circumferential direction of the dome 17a.

The lighting section 17 is a so-called multi-channel lighting. In the lighting section 17, dimming can be performed individually for each segment. That is, in the lighting section 17, the illumination (brightness of light) can be adjusted for each segment. For example, in each segment, the illumination level can be adjusted within the range of 0-100. In this case, for example, the closer the illumination level is to 100, the higher the illumination is, and the closer the illumination level is to 0, the lower the illumination is. For example, by adjusting the illumination in each segment, the illumination state (illumination condition) of the light in the lighting section 17 is adjusted. For example, the adjustment of the illumination in each segment can be performed manually by an operator or automatically. The automatic adjustment of the illumination in each segment will be described in detail later.

Referring again to FIG. 1 , the electronic component S1 after inspection is arranged on the arrangement section 14 . The arrangement section 14 is movable along the Y axis of the figure. The inspection table 11 arranges the electronic component S1 after inspection on the arrangement section 14 .

The extraction unit 15 transfers the electronic component S1 that has been configured in the configuration unit 14 to the tray. Based on the inspection results using the first optical inspection camera 12 and the second optical inspection camera 13, the electronic component S1 is distinguished as "good" or "defective". Based on the distinction result, the extraction unit 15 transfers each electronic component S1 to the good tray 15a or the defective tray 15b. In other words, good products are stored in the good tray 15a, and defective products are stored in the defective tray 15b. If each good tray 15a and defective tray 15b are full of electronic components S1, they are replaced with new trays.

The cutting device 1 further includes a computer 50 and a monitor 20. The monitor 20 is configured to display an image. The monitor 20 is configured with a display device such as a liquid crystal monitor or an organic EL (Electro Luminescence) monitor.

The computer 50 controls the operation of the cutting module A1 and the inspection and storage module B1. The computer 50 controls the operation of the substrate supply unit 3, the positioning unit 4, the cutting table 5, the spindle unit 6, the conveying unit 7, the inspection table 11, the first optical inspection camera 12, the second optical inspection camera 13, the lighting units 16 and 17, the configuration unit 14, the extraction unit 15, and the monitor 20.

Furthermore, the computer 50 performs various inspections of the electronic component S1 based on image data generated by, for example, the first optical inspection camera 12 and the second optical inspection camera 13. Next, the computer 50 is described in detail. ＜1-2. Hardware configuration of the computer＞

Fig. 4 schematically shows the hardware configuration of the computer 50. As shown in Fig. 4, the computer 50 includes a computing unit 70, an input/output I/F (interface) 90, a receiving unit 95, and a memory unit 80, and each of the components is electrically connected via a bus.

The calculation unit 70 includes a CPU (Central Processing Unit) 72, a RAM (Random Access Memory) 74, and a ROM (Read Only Memory) 76. The calculation unit 70 is configured to control each component in the computer 50 and each component in the cutting device 1 in accordance with information processing.

The input/output I/F 90 is configured to communicate with each component included in the cutting device 1 via a signal line. The input/output I/F 90 is used to transmit data from the computer 50 to each component in the cutting device 1 and to receive data transmitted from each component in the cutting device 1 to the computer 50. The receiving unit 95 is configured to receive instructions from the user. The receiving unit 95 is composed of, for example, a part or all of a touch panel, a keyboard, a mouse, and a microphone.

The memory unit 80 is an auxiliary memory device such as a hard disk drive, a solid state hard disk, etc. The memory unit 80 is configured to store, for example, a control program 81. The control unit 70 executes the control program 81 to implement various actions in the cutting device 1. When the control unit 70 executes the control program 81, the control program 81 is expanded in the RAM 74. In addition, the control unit 70 controls each component by causing the CPU 72 to interpret and execute the control program 81 expanded in the RAM 74. [2. Automatic adjustment of the irradiation state of light]

As described above, the inspection of the electronic component S1 is performed, for example, based on the captured image generated by the first optical inspection camera 12 and the captured image generated by the second optical inspection camera 13. Therefore, the quality of the inspection of the electronic component S1 is affected by the quality of each captured image. The quality of each captured image is affected by the irradiation state of the light emitted from the lighting units 16 and 17 to the electronic component S1 when the electronic component S1 is photographed. Since the lighting units 16 and 17 can be said to be the same, the following description focuses on the lighting unit 17.

As an example, consider the case where the electronic component S1 is a BGA. For example, the solder ball/wire surface of the electronic component S1 is inspected by photographing the solder ball/wire surface of the electronic component S1 using the second optical inspection camera 13. In this case, the second optical inspection camera 13 photographs a plurality of electronic components S1 that are singulated by cutting the package substrate P1. Therefore, the photographed image shows the plurality of electronic components S1 and the rubber (inspection table 11) located at the boundary portion between adjacent electronic components S1.

Fig. 5 is a diagram showing an example of a preferred photographic image. As shown in Fig. 5, the photographic image IM1 includes a plurality of electronic component parts 100, a plurality of solder beads 120 located on each electronic component part 100, and a black groove part 110 located between adjacent electronic component parts 100. The black groove part 110 is the rubber on the inspection table 11.

The characteristics of the captured image IM1 are that (1) the electronic component portion 100 and the black groove portion 110 show a clear contrast, and (2) the image as a whole is not too bright. Such a good captured image is generated when the illumination state of the light emitted from the illumination portion 17 toward the electronic component S1 is appropriate. The quality of the inspection based on such a good captured image is high.

FIG. 6 is a diagram showing a histogram of the captured image shown in FIG. 5. Referring to FIG. 6, the horizontal axis represents the scale, and the vertical axis represents the number of pixels. Histogram HG1 includes components C1, C2, and C3. Component C1 corresponds to the electronic component portion 100 (FIG. 5), and component C2 corresponds to the black groove portion 110. Component C3 corresponds to the solder bead portion 120. In histogram HG1, components C1 and C2 are clearly separated. In addition, the peak value of component C1 having the largest number of pixels appears near the center of the scale. The histogram corresponding to a better captured image has such characteristics.

FIG. 7 is a diagram showing an example of a poor captured image. As shown in FIG. 7, the captured image IM2 includes a plurality of electronic component parts 200, a plurality of solder bead parts 220 located on each electronic component part 200, and a black groove part 210 located between adjacent electronic component parts 200. In the captured image IM2, the electronic component part 200 and the black groove part 210 do not show a clear contrast. Such a poor captured image is generated when the illumination state of the light emitted from the illumination part 17 toward the electronic component S1 is inappropriate. The quality of the inspection based on such a poor captured image is low.

FIG. 8 is a diagram showing a histogram of the captured image shown in FIG. 7. Referring to FIG. 8, the horizontal axis represents the level and the vertical axis represents the number of pixels. Histogram HG2 includes components C4, C5, and C6. Component C4 corresponds to the electronic component section 200 (FIG. 7), and component C5 corresponds to the black groove section 210. Component C6 corresponds to the solder bead section 220. In histogram HG2, components C4 and C5 are not clearly separated, but are mixed. A histogram corresponding to an example of a poorly captured image has such characteristics.

As described above, the quality of the captured image generated by the second optical inspection camera 13 is affected by whether the irradiation state of the light emitted from the lighting section 17 toward the electronic component S1 is appropriate, and thus the inspection of the electronic component S1 is affected. It is assumed that the adjustment of the illumination of each section of the lighting section 17 can only be performed manually. In this case, the irradiation state of the light of the lighting section 17 is determined based on the judgment of the operator. However, this judgment is not always easy. Therefore, there is at least partially a problem that the irradiation state of the light of the lighting section 17 is inappropriate, resulting in a low-quality inspection, and a problem that the adjustment of the illumination of each section of the lighting section 17 requires a long time.

In the cutting device 1 of the present embodiment, the computer 50 can automatically adjust the irradiation state of the light of the lighting unit 17 to an appropriate state. That is, the computer 50 can automatically adjust the illumination level of each section of the lighting unit 17 to an appropriate value. Thereby, the possibility of the above-mentioned problem can be reduced. That is, according to the cutting device 1 of the present embodiment, the illumination of each section of the lighting unit 17 can be adjusted to an appropriate value without being affected by the operator's proficiency, etc., and high-quality inspection can be performed.

In order to realize such a function, the memory unit 80 of the computer 50 stores in advance information representing a histogram of an ideal captured image (hereinafter also referred to as a "reference histogram"). The reference histogram is a histogram generated based on a reference captured image. For example, the reference histogram is generated based on an ideal captured image. An example of an ideal captured image is an image including an electronic component S1 as an inspection object, and as shown in FIG. 5, the captured image has the characteristics of (1) a clear contrast between the electronic component portion 100 and the black groove portion 110 and (2) the image as a whole is not too bright.

FIG. 9 is a flowchart showing the sequence of generating a reference histogram. Each step shown in the flowchart is performed by an operator, for example, during the manufacturing of the cutting device 1 (when the reference histogram is not stored in the memory unit 80). In the steps shown in the flowchart, a plurality of captured images are generated while changing the combination pattern of the illumination level of each section of the lighting unit 17, and a reference histogram is generated based on the most ideal captured image. The generated reference histogram is stored in the memory unit 80. A detailed description will be given below.

Referring to FIG. 9 , the operator adjusts the illumination level of each section of the lighting unit 17 (step S100). The operator operates the cutting device 1, and in a state where light is irradiated from the lighting unit 17 to the electronic component S1, the second optical inspection camera 13 photographs the electronic component S1 (step S110). The operator determines whether the photographed image generated by the second optical inspection camera 13 is an ideal photographed image based on past experience (step S120).

If it is determined that the captured image generated by the second optical inspection camera 13 is not an ideal captured image (No in step S120), the operator changes to a pattern different from the combined pattern of the illumination levels of the respective sections of the illumination section 17 (step S100). On the other hand, if it is determined that the captured image generated by the second optical inspection camera 13 is an ideal captured image (Yes in step S120), the operator operates the cutting device 1 to generate a reference histogram based on the ideal captured image (step S130).

As a method of generating a histogram based on a captured image, various known methods can be used. For example, a reference histogram can be generated by modifying a histogram of an ideal captured image. For example, a histogram of an ideal captured image can be modified by abstracting the histogram of an ideal captured image.

Furthermore, when the step value at the peak of the inspection object is known in advance from past inspection results, an ideal histogram can be created based on the operator's experience without the need for additional photography.

Then, the operator operates the cutting device 1 to store the generated reference histogram in the memory unit 80 (step S140). In the cutting device 1, the irradiation state of the light in the lighting unit 17 is automatically adjusted by using the reference histogram generated based on the ideal captured image. The following is a detailed description of the sequence of automatic adjustment of the irradiation state of the light in the lighting unit 17. [3. Action]

As described above, in each section of the lighting unit 17, the illumination level can be adjusted within a range of, for example, 0 to 100. For example, in the inspection of the state of the electronic component S1 singulated by cutting the package substrate P1 (sealed substrate), it is preferable to irradiate light from a direction close to perpendicular to the surface (inspection surface) of the electronic component S1. In the present embodiment, only Ch01 to Ch03 of the plurality of sections (Ch01 to Ch08) of the lighting unit 17 are used. That is, the illumination level of Ch04 to Ch08 is set to 0. In the cutting device 1 according to the present embodiment, the best combination is automatically searched as a combination of each illumination level of Ch01 to Ch03.

FIG. 10 is a flowchart showing the automatic adjustment sequence of the illumination state of light in the illumination unit 17. In the stage before the actual manufacture of the electronic component S1 of the cutting device 1 begins, the processing shown in the flowchart is executed by the control unit 70 of the computer 50. For example, at the beginning of the flowchart, the illumination level of each of Ch01 to Ch03 is set to 0.

10 , for each of Ch01 to Ch03 , the control unit 70 executes a process for determining a refined range (for example, a range in which the width of the illumination level is 10) within the range of illumination levels of 0 to 100 (the width of the illumination level is 100) (step S200 ).

Fig. 11 is a flowchart showing the processing executed in step S200 of Fig. 10. The processing shown in the flowchart is executed by the control unit 70 of the computer 50.

11, the control unit 70 changes the illumination level by a first unit (e.g., 5) for Ch01 of the illumination unit 17 (step S300). The control unit 70 controls the second optical inspection camera 13 to photograph the electronic component S1 in a state where light is irradiated from the illumination unit 17 toward the electronic component S1 (step S305). The control unit 70 generates a histogram based on the photographed image generated by the second optical inspection camera 13 (step S310).

The control unit 70 calculates the deviation between the generated histogram and the reference histogram stored in the memory unit 80 (step S315). Specifically, the control unit 70 calculates the difference in the number of pixels at each level between the generated histogram and the reference histogram, and calculates the sum of the absolute values of the calculated differences. The sum of the absolute values is an example of the "deviation".

The control section 70 determines whether the calculated deviation is smaller than the deviation stored in the memory section 80 (step S320). In addition, if the deviation is not stored in the memory section 80, it is determined as yes in step S320. If it is determined that the calculated deviation is smaller than the deviation stored in the memory section 80 (yes in step S320), the control section 70 controls the illumination level of each of the current Ch01, Ch02, and Ch03, and controls the memory section 80 to store the deviation calculated in step S315 (step S325). That is, the illumination level and deviation of each of Ch01, Ch02, and Ch03 stored in the memory section 80 are updated.

When it is determined that the calculated deviation amount is greater than the deviation amount stored in the memory unit 80 (No in step S320), or when the processing of step S325 is completed, the control unit 70 determines whether all patterns of the illumination level of Ch01 have been completed in the current combination of illumination levels of Ch02 and Ch03 (step S330). In addition, when the first unit is 5, all patterns of the illumination level of Ch01 are 0, 5, 10, 15, 20, ..., 90, 95, 100.

If it is determined that all patterns of the illumination level of Ch01 have not been completed in the current combination of illumination levels of Ch02 and Ch03 (No in step S330), the processing of steps S300 to S330 is performed again. On the other hand, if it is determined that all patterns of the illumination level of Ch01 have been completed in the current combination of illumination levels of Ch02 and Ch03 (Yes in step S330), the control unit 70 determines whether all patterns of the illumination level of Ch02 have been completed in the current illumination level of Ch03 (step S335).

If it is determined that all patterns of the illumination level of Ch02 have not been completed in the current illumination level of Ch03 (No in step S335), the control section 70 changes the illumination level of Ch02 by the first unit (step S340). Thereafter, the processing of steps S300 to S335 is performed again. On the other hand, if it is determined that all patterns of the illumination level of Ch02 have been completed in the current illumination level of Ch03 (Yes in step S335), the control section 70 determines whether all patterns of the illumination level of Ch03 have been completed (step S345).

If it is determined that all patterns of the illumination level of Ch03 have not been completed (No in step S345), the control unit 70 changes the illumination level for Ch03 by the first unit (step S350). Thereafter, the processing of steps S300 to S345 is performed again. On the other hand, if it is determined that all patterns of the illumination level of Ch03 have been completed (Yes in step S345), the control unit 70 determines the detailed inspection range based on the illumination levels of each of Ch01, Ch02, and Ch03 stored in the memory unit 80 (step S355).

The detailed inspection range for Ch01 is, for example, a range of 5 before and after the illumination level of Ch01 stored in the memory unit 80. The detailed inspection range for CH02 is, for example, a range of 5 before and after the illumination level of CH02 stored in the memory unit 80. The detailed inspection range for CH03 is, for example, a range of 5 before and after the illumination level of CH03 stored in the memory unit 80. For example, it is assumed that the illumination levels of Ch01, Ch02, and Ch03 stored in the memory unit 80 are 40, 50, and 55, respectively. In this case, the detailed inspection ranges of Ch01, Ch02, and Ch03 are, for example, 35-45, 45-55, and 50-60, respectively.

Referring again to FIG. 10 , when the detailed inspection range is determined in step S200 , the control unit 70 executes processing for determining the irradiation state for inspection (step S210 ).

Fig. 12 is a flowchart showing the processing executed in step S210 of Fig. 10. The processing shown in the flowchart is executed by the control unit 70 of the computer 50.

Referring to FIG. 12, for Ch01 of the lighting unit 17, the control unit 70 changes the illumination level by a second unit (e.g., 1) within the detailed inspection range (step S400). The second unit is a unit smaller than the first unit described above. Since the processing of steps S405 to S425 is respectively the same as the processing of steps S305 to S325 in FIG. 11, they will not be repeated.

When it is determined in step S420 that the calculated deviation amount is greater than the deviation amount stored in the memory unit 80 (No in step S420), or when the processing of step S425 is completed, the control unit 70 determines whether all patterns of the illumination level of Ch01 within the refined inspection range have been completed in the current combination of illumination levels of Ch02 and Ch03 (step S430). In addition, when the second unit is 1 and the refined inspection range of Ch01 is, for example, 35-45, all patterns of the illumination level of Ch01 are 35, 36, 37, 38, 39, ..., 43, 44, 45.

If it is determined that all patterns of the illumination level of Ch01 within the refined inspection range have not been completed in the current combination of illumination levels of Ch02 and Ch03 (No in step S430), the processing from step S400 to step S430 is performed again. On the other hand, if it is determined that all patterns of the illumination level of Ch01 within the refined inspection range have been completed in the current combination of illumination levels of Ch02 and Ch03 (Yes in step S430), the control unit 70 determines whether all patterns of the illumination level of Ch02 within the refined inspection range have been completed in the current illumination level of Ch03 (step S435).

If it is determined that all patterns of the illumination level of Ch02 within the refined inspection range have not been completed at the current illumination level of Ch03 (No in step S435), the control unit 70 changes the illumination level of Ch02 within the refined inspection range by the second unit (step S440). Thereafter, the processing of steps S400 to S435 is performed again. On the other hand, if it is determined that all patterns of the illumination level of Ch02 within the refined inspection range have been completed at the current illumination level of Ch03 (Yes in step S435), the control unit 70 determines whether all patterns of the illumination level of Ch03 within the refined inspection range have been completed (step S445).

If it is determined that all modes of the illumination level of Ch03 within the detailed inspection range have not been completed (No in step S445), the control unit 70 changes the illumination level of Ch03 by the second unit within the detailed inspection range (step S450). Thereafter, the processing of steps S400 to S445 is performed again. On the other hand, if it is determined that all modes of the illumination level of Ch03 within the detailed inspection range have been completed (Yes in step S445), the control unit 70 determines the illumination level of each of Ch01, Ch02, and Ch03 stored in the memory unit 80 as the illumination level for inspection (step S455). That is, the control unit 70 determines the irradiation state of light stored in the memory unit 80 as the irradiation state of light for inspection. [4. Features]

As described above, in the cutting device 1 according to the present embodiment, the second optical inspection camera 13 generates a plurality of captured images generated under different light irradiation states, and the control unit 70 compares each histogram generated based on each of the plurality of captured images with a reference histogram, and determines the light irradiation state used in the inspection of the electronic component S1 based on the comparison result. According to the cutting device 1, the light irradiation state in the lighting unit 17 can be automatically determined based on the comparison result between each histogram generated based on each of the plurality of captured images and the reference histogram. As a result, according to the cutting device 1 of this embodiment, the illumination of each section of the lighting unit 17 can be adjusted to an appropriate value without being affected by the operator's proficiency, etc., and high-quality inspection can be performed.

Furthermore, in the cutting device 1 according to the present embodiment, the control unit 70 calculates the deviation between each histogram generated based on each of the plurality of captured images and the reference histogram, and determines the irradiation state when the captured image corresponding to the histogram having the smallest deviation is generated as the irradiation state used for inspection. According to the cutting device 1, since the irradiation state of light when the captured image corresponding to the histogram close to the reference histogram is generated is adopted as the irradiation state for inspection, the degradation of the quality of the captured image of the second optical inspection camera 13 can be suppressed. As a result, the degradation of the inspection quality of the electronic component S1 can be suppressed.

Furthermore, in the cutting device 1 according to the present embodiment, the control unit 70 determines the detailed inspection range by changing the illumination level by a first unit in order to determine the illumination state of the illumination unit 17, and then searches for the optimal illumination state by changing the illumination level by a second unit smaller than the first unit within the detailed inspection range. According to the cutting device 1, since the entire range of the settable range of the illumination level is not searched in detail for each section of the illumination unit 17, the search for the optimal illumination state can be performed effectively.

In addition, the electronic component S1 is an example of the "inspection object" in the present invention. Each of the first optical inspection camera 12 and the second optical inspection camera 13 is an example of the "camera" in the present invention. Each of the lighting units 16 and 17 is an example of the "lighting unit" in the present invention. The control unit 70 is an example of the "control unit" in the present invention. The memory unit 80 is an example of the "memory unit" in the present invention. LED17b is an example of the "lighting" in the present invention. The entire range of the settable range of the illumination level is an example of the "first range" in the present invention, and the detailed inspection range is an example of the "second range" in the present invention. [5. Variations]

The concept of the above-mentioned implementation form is not limited to the implementation form described above. The following describes an example of another implementation form to which the concept of the above-mentioned implementation form can be applied. ＜5-1＞

In the above-described embodiment, the control unit 70 changes the illumination level by a first unit to determine a detailed inspection range, and then changes the illumination level by a second unit (second unit < first unit) within the detailed inspection range to search for the optimal light irradiation state. However, it is not necessarily necessary to search for the irradiation state in two stages. For example, the control unit 70 may change the illumination level by a second unit within the entire settable range of the illumination level without determining the detailed inspection range to search for the optimal irradiation state. In this case, since a more detailed search is performed, the optimal light irradiation state can be specified more accurately.

Furthermore, the light irradiation state may be searched by searching in three or more stages. For example, the control unit 70 may change the illumination level by a first unit to determine a first precision inspection range, and then change the illumination level by a second unit (second unit < first unit) within the first precision inspection range to determine a second precision inspection range, and change the illumination level by a third unit (third unit < second unit) within the second precision inspection range to search for the best light irradiation state (three-stage search). If the number of search stages increases, the light irradiation state in the lighting unit 17 can be made closer to the ideal irradiation state due to a more detailed search. ＜5-2＞

In the above-mentioned embodiment, each of the lighting units 16 and 17 is composed of a plurality of segments. However, each of the lighting units 16 and 17 may not necessarily be composed of a plurality of segments. For example, as long as the segment is dimmable, each of the lighting units 16 and 17 may be composed of one segment. Furthermore, the number of segments of each of the lighting units 16 and 17 does not necessarily have to be 8, and may be less than 8 or more than 9. Furthermore, in the above-mentioned embodiment, the illumination level of Ch04 to Ch08 is set to 0, but the illumination level of Ch04 to Ch08 may not necessarily be 0. Furthermore, for example, the illumination level may be automatically adjusted in all Ch01 to Ch08. ＜5-3＞

In the above-mentioned embodiment, a BGA in which solder beads are formed on the entire solder ball/conductor surface is exemplified as the electronic component S1. However, the electronic component S1 is not limited thereto. For example, the electronic component S1 may be a BGA in which solder beads are not formed on a part of the solder ball/conductor surface, or may be an LGA, QFN, etc. as described above.

Fig. 13 is a diagram showing an example of a photographed image of an electronic component S1 in a modified example. As shown in Fig. 13, a photographed image IM3 shows a plurality of electronic components S1. In each electronic component S1, a region T1 where no solder bead is formed is provided. Such electronic components S1 can also be used as an inspection object.

In addition, regarding the reference histogram, the accuracy of the value of the number of pixels in the peak value may be lower than the accuracy of the value of the step in the peak value. That is, if the accuracy of the step value in the peak value is high to a certain extent, the value of the number of pixels in the peak value does not need such accuracy. This is because, in the calculation of the deviation amount, a calculation is performed to obtain the difference in the value of each pixel in each step, and a comparison is performed. Like the histogram of the captured image of FIG. 5 (refer to FIG. 6), the histogram of the captured image of FIG. 13 includes a composition C1 corresponding to the electronic component part 100, a composition C2 corresponding to the black groove part 110, and a composition C3 corresponding to the solder bead part 120 (that is, the steps in the peak value are the same, but the number of pixels is different). Therefore, the reference histogram of the captured image of FIG. 5 can be used as the reference histogram of the captured image of FIG. 13 .

In the above-mentioned embodiment, the sum of the absolute values of the difference between the number of pixels (histogram values) of the histogram of the captured image and the reference histogram in each level is defined as the "deviation amount". However, the "deviation amount" is not limited to this. The shape of each of the histogram of the captured image and the reference histogram is represented by a function, and the "deviation amount" can be, for example, the correlation of these functions. ＜5-4＞

In the above-mentioned embodiment, the baseline histogram is generated by using the sequence shown in the flowchart of Figure 9. However, the baseline histogram may not necessarily be generated by such a sequence. For example, the baseline histogram may be automatically generated based on the characteristics of the electronic component S1. Also, for example, a baseline histogram corresponding to each of a plurality of types of electronic components S1 may be prepared, and a plurality of baseline histograms may be stored in the memory unit 80. In this case, the baseline histogram used may be changed depending on the type of electronic component S1 that the inspection object is.

The above is an example of the implementation of the present invention. That is, the detailed description and the attached drawings are disclosed for the purpose of illustration. Therefore, the components recorded in the detailed description and the attached drawings may include components that are not necessary for solving the problem. Therefore, although these non-essential components are recorded in the detailed description and the attached drawings, these non-essential components should not be directly regarded as necessary.

Furthermore, the above-mentioned embodiments are merely examples of the present invention from various viewpoints. Various improvements and modifications can be made to the above-mentioned embodiments within the scope of the present invention. The present invention can be implemented by appropriately adopting specific configurations corresponding to the embodiments.

1: Cutting device 3: Substrate supply unit 4: Positioning unit 4a: Track unit 5: Cutting table 5a: Holding member 5b: Rotating mechanism 5c: Moving mechanism 5d: First position confirmation camera 5e: First cleaning device 6: Core shaft unit 6a: Blade 6b: Second position confirmation camera 6c: Rotating shaft 6d: First flange 6e: Second flange 6f: Fastening member 7: Transport unit 7a: Second cleaning device 11: Inspection table 12: First optical inspection camera 13: Second optical inspection camera 14: Arrangement unit 15: Extraction unit 15a: Tray for good products 15b: Tray for defective products 16, 17: Lighting unit 17a: Dome 17b: LED 20: Monitor 50: Computer 70: Control unit 72: CPU 74: RAM 76: ROM 80: Memory unit 81: Control program 90: Input/output I/F 100, 200: Electronic component unit 110, 210: Black groove unit 120, 220: Solder bead unit A1: Cutting module B1: Inspection and storage module C1, C2, C3, C4, C5, C6: Composition HG1, HG2: Histogram IM1, IM2, IM3: Image capture M1: Cassette P1: Package substrate S1: Electronic component T1: Region

FIG. 1 is a plan view schematically showing a cutting device. FIG. 2 is a side view schematically showing a spindle portion. FIG. 3 is a view including a cross section schematically showing an illumination portion. FIG. 4 is a view schematically showing a hardware configuration of a computer. FIG. 5 is a view showing an example of a better shot image. FIG. 6 is a view showing a histogram of the shot image shown in FIG. 5. FIG. 7 is a view showing an example of a worse shot image. FIG. 8 is a view showing a histogram of the shot image shown in FIG. 7. FIG. 9 is a flowchart showing a procedure for generating a reference histogram. FIG. 10 is a flowchart showing a procedure for automatically adjusting the illumination state of light in the illumination portion. FIG. 11 is a flowchart showing the processing performed in step S200 of FIG. 10. FIG. 12 is a flowchart showing the processing performed in step S210 of FIG. 10. FIG. 13 is a diagram showing an example of a photographed image of an electronic component in a modified example.

Domestic storage information (please note in the order of storage institution, date, and number) None Foreign storage information (please note in the order of storage country, institution, date, and number) None

1: Cutting device

3: Substrate supply unit

4: Positioning unit

4a: Track section

5: Cutting table

5a: Retaining components

5b: Rotating mechanism

5c: Mobile mechanism

5d: First position confirmation camera

5e: First scrubber

6: Spindle part

6a: leaves

6b: Second location confirmation camera

7: Transportation Department

7a: Second scrubber

11: Inspection table

12: First optical inspection camera

13: Second optical inspection camera

14: Configuration Department

15: Extraction section

15a: Tray for good products

15b: Tray for defective products

16, 17: Lighting Department

20: Monitor

50: Computer

M1: Cartridge

P1: packaging substrate

Claims (9)

An inspection system for inspecting an inspection object based on a photographed image of the inspection object, comprising: an illumination unit that can change the irradiation state of light and irradiate the light to the inspection object; a camera that generates the photographed image in the state of irradiating the light to the inspection object; a control unit that controls each of the illumination unit and the camera to generate a plurality of photographed images generated under different irradiation states; and a memory unit that stores a reference histogram; wherein the inspection object is an electronic component; the photographed image includes a plurality of electronic components arranged in the longitudinal direction and the transverse direction and grooves between adjacent electronic components; the reference histogram includes a plurality of peaks; the illumination unit is composed of a plurality of regions. The plurality of segments include a plurality of illuminations respectively arranged in the circumferential direction, the plurality of segments are arranged from the inner side to the outer side in the radial direction of the illumination unit, each of the plurality of segments can be individually dimmed by changing the illumination level, and the illumination state is changed by dimming each of the plurality of segments, and the pattern of the illumination state includes a pattern in which the illumination levels of two or more segments in the light emitted by the plurality of segments are different from each other, and the control unit compares each histogram generated based on each of the plurality of captured images with the reference histogram, and determines the illumination state used in the inspection based on the comparison result. The inspection system as described in claim 1, wherein the control unit changes the illumination state by not changing the illumination level of at least one of the plurality of segments, but changing the illumination level of one of the other segments included in the plurality of segments. The inspection system as recited in claim 1, wherein the control unit calculates the deviation between each histogram generated based on each of the plurality of captured images and the reference histogram, and determines the illumination state when the captured image corresponding to the histogram having the smallest deviation is generated as the illumination state used for the inspection. A checking system as recited in claim 3, wherein the offset is the sum of the absolute values of the differences in the values of the histogram in each level. The inspection system as recited in claim 3, wherein the control unit calculates the deviation between the generated histogram and the reference histogram when generating a histogram based on the photographed image of the inspection object, and when the calculated deviation is less than the deviation stored in the storage unit, stores the calculated deviation and the irradiation state when generating the photographed image corresponding to the generated histogram in the storage unit. An inspection system as recited in any one of claim 1 to claim 5, wherein the control unit performs the following steps: changing the illumination state by a first unit in a first range, and controlling the illumination unit and each of the cameras to generate the plurality of captured images, performing a first comparison between each histogram generated for each of the plurality of captured images generated based on changing the illumination state by the first unit and the reference histogram, and determining whether to include the images based on the result of the first comparison. A second range is included in the first range, the illumination state is changed by a second unit smaller than the first unit in the second range, and each of the illumination unit and the camera is controlled to generate the plurality of captured images, a second comparison is performed between each histogram generated for each of the plurality of captured images generated based on the illumination state being changed by the second unit and the reference histogram, and the illumination state used for the inspection is determined based on the result of the second comparison. An inspection system as described in any one of claim 1 to claim 5, wherein the aforementioned lighting unit is composed of a dome-shaped lighting. A method for manufacturing electronic components, which is a method for manufacturing electronic components using an inspection system as described in any one of claim 1 to claim 7, comprising the following steps: determining the aforementioned irradiation state used for the aforementioned inspection; Using a cutting mechanism to cut the substrate sealed with resin to manufacture a plurality of electronic components; and, generating the aforementioned photographed image in a state where light is irradiated onto the aforementioned inspection object under the determined aforementioned irradiation state, and performing the aforementioned inspection. A cutting device, comprising: a cutting mechanism for cutting a substrate sealed with resin; and an inspection system as described in any one of claim 1 to claim 7.