TWI863631B - Cutting device and method for manufacturing cut product - Google Patents

Abstract

The present invention provides a cutting device and a method for manufacturing a cut product that can relatively efficiently automatically set an inspection area in a photographed image of a cut product. The cutting device includes a photographing unit, a first processing unit, and a second processing unit. The photographing unit generates a photographed image by photographing a part or all of a plurality of cut products. The first processing unit sets a plurality of inspection areas in the photographed image. The second processing unit inspects the appearance of each cut product contained in the photographed image based on the images respectively contained in the plurality of inspection areas in the photographed image. The first processing unit performs a determination process that determines whether a specific number of pixels in the photographed image contain a part of any side of a plurality of cut products based on the pixel values of each of the specific number of pixels continuously located in a first direction. The first processing unit repeatedly moves the positions of a specific number of pixels to perform determination processing to set at least a portion of a plurality of inspection areas.

Description

Cutting device and method for manufacturing cut product

The present invention relates to a cutting device and a method for manufacturing a cut product.

Japanese Patent Publication No. 2010-125488 (Patent Document 1) discloses a cutting device for cutting a workpiece. In the cutting device, a plurality of singulated workpieces are manufactured by cutting the workpiece, and the appearance of each singulated workpiece is inspected (see Patent Document 1). [Prior Art Document] (Patent Document)

Patent document 1: Japanese Patent Application Publication No. 2010-125488

[The problem the invention is trying to solve]

The inspection of the appearance of a cut product (e.g., a singulated workpiece) manufactured by cutting a substrate is performed, for example, based on a photographed image of the cut product. At this time, an inspection area is set in the photographed image of the cut product, and the appearance of the cut product is inspected based on the image in the inspection area. That is, in order to inspect the appearance of the cut product based on the photographed image of the cut product, it is necessary to set an inspection area in the photographed image of the cut product. However, in the above-mentioned patent document 1, a specific setting method of the inspection area is not disclosed.

The present invention is completed to solve the above-mentioned problem, and its purpose is to provide a cutting device and a method for manufacturing a cut product that can relatively efficiently automatically set the inspection area in the photographed image of the cut product. [Technical means for solving the problem]

According to one aspect of the present invention, a cutting device manufactures a plurality of cut products by cutting a substrate. The cutting device includes a photographing unit, a first processing unit, and a second processing unit. The photographing unit generates a photographed image by photographing a part or all of the plurality of cut products. The first processing unit sets a plurality of inspection areas in the photographed image. The second processing unit inspects the appearance of each cut product contained in the photographed image based on the images contained in each of the plurality of inspection areas in the photographed image. Each of the plurality of inspection areas is rectangular in shape. The shape of each cut product is rectangular. The first processing unit performs a determination process, the determination process determining whether a specific number of pixels includes a portion of any side of a plurality of cut products based on the pixel values of each of the specific number of pixels continuously located in the first direction in the photographed image. The specific number is smaller than the number of pixels in the first direction of the entire photographed image. The first processing unit repeatedly moves the position of the specific number of pixels to perform the determination process to set at least a portion of the plurality of inspection areas.

According to another aspect of the present invention, a method for manufacturing a cut product uses the above-mentioned cutting device. The cutting device includes a cutting table and a cutting unit. A substrate is arranged on the cutting table. The cutting unit cuts the substrate arranged on the cutting table. The manufacturing method includes the following steps: arranging a substrate on the cutting table; and, cutting the substrate arranged on the cutting table. (Effect of the invention)

According to the present invention, a cutting device and a method for manufacturing a cut product can be provided, which can relatively efficiently automatically set the inspection area in the photographed image of the cut product.

Hereinafter, an embodiment of one aspect of the present invention (hereinafter also referred to as "this embodiment") is described in detail with reference to the drawings. In addition, the same symbols are attached to the same or corresponding parts in the drawings, and their descriptions are omitted. In addition, in order to facilitate understanding, each drawing is schematically described by appropriately omitting or exaggerating objects.

[1. Configuration] ＜1-1. Configuration of cutting device＞ FIG. 1 schematically shows a top view of a cutting device 1 according to the present embodiment. The cutting device 1 is configured to singulate a package substrate (an example of an object to be cut) into a plurality of electronic components (an example of a cut product) by cutting the package substrate. In the package substrate, a substrate or a lead frame to which a semiconductor chip is fixed is sealed by a resin. Furthermore, the object to be cut does not necessarily have to be a package substrate, and for example, it may be a substrate (including a wafer) that is not sealed by a resin.

As an example of a package substrate, there can be listed a ball grid array (BGA) package substrate, a land grid array (LGA) package substrate, a chip size package (CSP) package substrate, a light emitting diode (LED) package substrate, and a quad flat no-leaded (QFN) package substrate.

The cutting device 1 is configured to inspect each of the plurality of singulated electronic components. In the cutting device 1, each electronic component is photographed, and each electronic component is inspected based on the photographed image. Inspection data is generated through the inspection, and each electronic component is classified as "good" or "defective".

In this example, a package substrate P1 is used as the object to be cut, and the cutting device 1 singulates the package substrate P1 into a plurality of electronic components S1 (see FIG. 2). Hereinafter, of the two surfaces of the package substrate P1, the surface sealed by the resin is referred to as the mold surface, and the surface opposite to the mold surface is referred to as the ball/lead surface. Furthermore, when the object to be cut is a substrate not sealed by the resin, the surface facing upward during cutting (cutting surface) is equivalent to the ball/lead surface in this embodiment, and the surface opposite to the cutting surface is equivalent to the mold surface in this embodiment.

As shown in FIG. 1 , the cutting device 1 includes a cutting module A1 and an inspection and storage module B1 as components. The cutting module A1 is configured to manufacture a plurality of electronic components S1 by cutting a package substrate P1. The inspection and storage module B1 is configured to inspect each of the manufactured plurality of electronic components S1 and then store the electronic components S1 in a tray. In the cutting device 1 , each component is detachable and interchangeable with respect to other components.

The cutting module A1 mainly includes a substrate supply unit 3, a positioning unit 4, a cutting table 530, a spindle unit 6 and a conveying unit 7.

The substrate supply unit 3 supplies the package substrates P1 one by one to the positioning unit 4 by pushing out the package substrates P1 one by one from the magazine M1 accommodating a plurality of package substrates P1. At this time, the package substrates P1 are arranged in a state where the ball/lead surface faces upward.

The positioning section 4 positions the package substrate P1 pushed out from the substrate supply section 3 on the rail section 4a. Then, the positioning section 4 transports the positioned package substrate P1 to the cutting table 5.

The cutting table 5 holds the package substrate P to be cut. Here, a cutting device 1 having a double cutting table structure with two cutting tables 5 is exemplified. The cutting table 5 includes a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c. The holding member 5a holds the package substrate P1 by sucking the package substrate P1 conveyed by the positioning unit 4 from below. The rotating mechanism 5b can rotate the holding member 5a in the θ1 direction in the figure on a horizontal plane. The moving mechanism 5c can move the holding member 5a along the Y axis in the figure.

The spindle unit 6 separates the package substrate P1 into a plurality of electronic components S1 by cutting the package substrate P1. Here, a cutting device 1 having a dual spindle structure with two spindle units 6 is exemplified. The spindle unit 6 can move along the X-axis and the Z-axis in the figure. Furthermore, the cutting device 1 can also be a single spindle structure with one spindle unit 6.

The main shaft portion 6 includes a rotating shaft 6c. A blade 6a is fixed to the rotating shaft 6c of the main shaft portion 6. The blade 6a cuts the package substrate P1 by rotating at high speed, thereby singulating the package substrate P1 into a plurality of electronic components S1. The blade 6a is mounted on the rotating shaft 6c in a state of being clamped by the first and second flanges not shown. The first and second flanges are fixed to the rotating shaft 6c by fastening members not shown such as nuts.

The cutting module A1 is provided with a cutting water nozzle, a cooling water nozzle, and a chip removal water nozzle (not shown). The cutting water nozzle sprays cutting water toward the high-speed rotating blade 6a. The cooling water nozzle sprays cooling water toward the cutting position of the package substrate P1. The chip removal water nozzle sprays chip removal water to blow away the cutting chips.

After the cutting station 5 absorbs the package substrate P1, the first position confirmation camera 5d photographs the package substrate P1 to confirm the position of the package substrate P1. The confirmation performed using the first position confirmation camera 5d is, for example, confirmation of the position of the alignment mark set on the package substrate P1. The position information of the alignment mark is used, for example, to determine the cutting line of the package substrate P1.

After that, the cutting table 5 moves along the Y axis in the figure toward the main shaft portion 6. After the cutting table 5 moves to the bottom of the blade 6a, the cutting table 5 and the main shaft portion 6 are moved relative to each other, thereby cutting the package substrate P1. After that, if necessary, the package substrate P1 is photographed by the second position confirmation camera 6b of the cutting module A1 to confirm the position of the package substrate P1, etc. The confirmation performed using the second position confirmation camera 6b is, for example, confirmation of the cutting position and cutting width of the package substrate P1.

After the cutting of the package substrate P1 is completed, the cutting table 5 moves along the Y-axis in the figure in a direction away from the main shaft portion 6 while adsorbing a plurality of singulated electronic components S1. During the movement, the upper surface (ball/lead surface) of the electronic component S1 is cleaned and dried by the first cleaner 5e. The cleaning can be performed, for example, by directly spraying cleaning water on the upper surface of the electronic component S1, or by supplying cleaning water to the upper surface of the electronic component S1 through a brush or the like. Furthermore, in the cutting device 1, two first cleaners 5e arranged along the X-axis in the figure are provided, but the number of the first cleaners 5e is not limited thereto.

The conveying unit 7 sucks and holds the electronic component S1 held on the cutting table 5 from above, and conveys the electronic component S1 to the inspection table 11 of the inspection and storage module B1. During the conveying process, the lower surface (mold surface) of the electronic component S1 is cleaned and dried by the second cleaner 7a. The cleaning can be performed by directly spraying cleaning water on the lower surface of the electronic component S1, or by supplying cleaning water to the lower surface of the electronic component S1 through a brush or the like.

The inspection and storage module B1 mainly includes an inspection table 11, a first optical inspection camera 12, a second optical inspection camera 13, a configuration unit 14, and a withdrawal unit 15. Furthermore, the first optical inspection camera 12 may also be disposed in the cutting module A1.

The inspection table 11 holds the electronic component S1 to perform optical inspection of the electronic component S1. The inspection table 11 can move along the X axis in the figure. In addition, the inspection table 11 can be reversed up and down. The inspection table 11 is provided with a holding member 11b (refer to FIG. 2) that holds the electronic component S1 by adsorbing the electronic component S1.

The first optical inspection camera 12 and the second optical inspection camera 13 respectively photograph the mold surface and the ball/lead surface of the electronic component S1. Based on the image data generated by the first optical inspection camera 12 and the second optical inspection camera 13, various inspections related to the appearance of the electronic component S1 (appearance inspection) are performed. As an example of appearance inspection, there can be listed the inspection of the size of the electronic component S1, the inspection of the size of the ball part BA1, and the inspection of the length between adjacent ball parts BA1. The first optical inspection camera 12 and the second optical inspection camera 13 are respectively configured to shoot upward near the inspection table 11.

The first optical inspection camera 12 photographs the mold surface of the electronic component S1 transported by the transport unit 7 to the inspection table 11. After that, the transport unit 7 places the electronic component S1 on the holding member 11b of the inspection table 11. After the holding member 11b absorbs the electronic component S1, the inspection table 11 is turned upside down. The inspection table 11 moves to the top of the second optical inspection camera 13, so that the second optical inspection camera 13 photographs the ball/lead surface of the electronic component S1.

FIG. 2 is a diagram schematically showing the situation of photographing the electronic component S1 using the second optical inspection camera 13. The inspection table 11 includes an inspection table main body 11a and a retaining member 11b. The retaining member 11b is arranged below the inspection table main body 11a. In the retaining member 11b, the surface retaining the electronic component S1 is made of, for example, black rubber. Furthermore, the color of the rubber does not have to be black, for example, it can also be white. The plurality of electronic components S1 adsorbed and retained by the retaining member 11b are photographed by the second optical inspection camera 13. Inspection related to the appearance of the ball/lead surface of each electronic component S1 is performed based on the image data or the captured image (hereinafter also referred to as the "captured image") representing the captured image generated by the second optical inspection camera 13. The inspection process related to the appearance of the ball/lead surface of each electronic component S1 will be described in detail later.

Referring to FIG. 1 again, the electronic component S1 after inspection is arranged in the arrangement section 14. The arrangement section 14 can move along the Y axis in the figure. The inspection table 11 arranges the electronic component S1 after inspection in the arrangement section 14.

The extraction unit 15 transfers the electronic components S1 arranged in the arrangement unit 14 to the tray. The electronic components S1 are classified as "good products" or "defective products" based on the results of the inspection using the first optical inspection camera 12 and the second optical inspection camera 13. The extraction unit 15 transfers each electronic component S1 to the good product tray 15a or the defective product tray 15b based on the classification results. That is, good products are stored in the good product tray 15a, and defective products are stored in the defective product tray 15b. The good product tray 15a and the defective product tray 15b are replaced with new trays when they are full of electronic components S1.

The cutting device 1 further includes a computer 50 and a monitor 20. The monitor 20 is configured to display an image. The monitor 20 is, for example, a display device such as a liquid crystal monitor or an organic electroluminescence (EL) monitor. The monitor 20 is, for example, disposed on the front of the cutting device 1.

The computer 50 controls the operation of the cutting module A1 and the inspection and storage module B1. The computer 50 controls the operation of the substrate supply unit 3, the positioning unit 4, the cutting table 5, the spindle unit 6, the conveying unit 7, the inspection table 11, the first optical inspection camera 12, the second optical inspection camera 13, the configuration unit 14, the extraction unit 15 and the monitor 20.

Furthermore, the computer 50 performs various inspections of the electronic component S1 based on, for example, image data generated by the first optical inspection camera 12 and the second optical inspection camera 13. Next, the computer 50 will be described in detail.

<1-2. Computer structure> Figure 3 is a diagram schematically showing the hardware structure of the computer 50. As shown in Figure 3, the computer 50 includes a control unit 70, an input/output I/F (interface) 90, a receiving unit 95, and a memory unit 80, and each structure is electrically connected via a bus.

The control unit 70 includes a central processing unit (CPU) 72, a random access memory (RAM) 74, and a read-only memory (ROM) 76. The control unit 70 is configured to control each component in the computer 50 and each component in the cutting device 1 according to information processing.

The input/output I/F 90 is configured to communicate with each component included in the cutting device 1 via a signal line. The input/output I/F 90 is used to send data from the computer 50 to each component in the cutting device 1, and is used to receive data sent from each component in the cutting device 1 to the computer 50. The receiving unit 95 is configured to receive instructions from the user. The receiving unit 95 is composed of, for example, a part or all of a touch panel, a keyboard, a mouse, and a microphone.

The memory unit 80 is, for example, an auxiliary memory device such as a hard disk drive or a solid state hard disk. The memory unit 80 is, for example, configured to store a control program. By using the control unit 70 to execute the control program 81, various actions in the cutting device 1 are realized. When the control unit 70 executes the control program 81, the control program 81 is expanded in the RAM 74. In addition, the control unit 70 controls each component by using the CPU 72 to interpret and execute the control program 81 expanded in the RAM 74.

[2. Necessity of automatic setting of inspection area] As described above, in the cutting device 1, the appearance inspection of the electronic component S1 is performed based on the captured images generated by the first optical inspection camera 12 and the second optical inspection camera 13.

FIG. 4 is a diagram schematically showing an example of a captured image IM1 generated by the second optical inspection camera 13. Referring to FIG. 4, in the captured image IM1, a plurality of electronic components S1 are displayed, for example, electronic components S1A, S1B, S1C, and S1D are displayed. In the captured image IM1, a plurality of electronic components S1 are arranged in a grid pattern. Since the captured image IM1 is an image obtained by photographing the ball/lead surface of each electronic component S1, a plurality of ball portions BA1 of each electronic component S1 are displayed in the captured image IM1. In addition, between two adjacent electronic components S1, the retaining member 11b of the inspection table 11 is displayed.

The captured image IM1 is a grayscale image (256 grayscales). In this example, the color of each electronic component S1 is brighter than the color of the holding member 11b. For example, each electronic component S1 is represented by gray, and the holding member 11b is represented by black. Furthermore, "appearing" the photographed image is also referred to as "including" the photographed image.

The shape of the captured image IM1 is a rectangle, and the shape of each electronic component S1 is a rectangle. Furthermore, in this specification, "rectangle" refers to a rectangle (a quadrilateral with four equal angles), and may also refer to a square. The left side IL1, the right side IR1, the top side IT1, and the bottom side IB1 of the captured image IM1 are parallel to the left side EL1, the right side ER1, the top side ET1, and the bottom side EB1 of each electronic component S1, respectively. Here, parallel not only includes a strict meaning, but also includes a substantial meaning. That is, even if the angle formed by the two sides is not 0, the two sides are parallel when the angle formed by the two sides is a value within the error range.

When the appearance inspection of the electronic component S1 is performed based on the captured image IM1, first, a plurality of inspection areas T1 in the captured image IM1 are set. Each inspection area T1 corresponds to any electronic component S1 included in the captured image IM1. For example, the inspection areas T1A, T1B, T1C, and T1D correspond to the electronic components S1A, S1B, S1C, and S1D, respectively. In the cutting device 1, based on the images included in each of the plurality of inspection areas T1 in the captured image IM1, the appearance of each electronic component S1 included in the captured image IM1 is inspected.

As a method for setting each inspection area T1, for example, a method of manually setting by an operator may be considered. However, when the operator manually sets each inspection area T1, there may be problems such as that the setting of the inspection area T1 requires a relatively long time, the setting accuracy of the inspection area T1 varies between operators, and the frequency of setting errors of the inspection area T1 is high.

In the cutting device 1 according to the present embodiment, each inspection area T1 is automatically set. Therefore, according to the cutting device 1, it is possible to suppress the occurrence of various problems that may occur when the operator manually sets each inspection area T1. In addition, although the details will be described below, in the cutting device 1, various efforts are made on the algorithm related to the automatic setting of each inspection area T1. Therefore, according to the cutting device 1, it is possible to perform the automatic setting of each inspection area T1 relatively efficiently.

[3. Appearance inspection process of electronic components (cut products)] Figure 5 is a flow chart showing the appearance inspection process of electronic components S1. In the cutting device 1 according to the present embodiment, the second optical inspection camera 13 only photographs some of the electronic components S1 arranged on the inspection table 11 at a time, and inspects the appearance of each electronic component S1 in units of photographed images. By repeatedly adjusting the positional relationship between the second optical inspection camera 13 and the inspection table 11 and photographing by the second optical inspection camera 13, the appearance of all electronic components S1 arranged on the inspection table 11 is inspected.

The processing shown in the flowchart of FIG. 5 is executed by the control unit 70 of the computer 50, for example, when performing the first shot of a plurality of shots for the appearance inspection of all the electronic components S1 arranged on the inspection table 11.

Referring to FIG. 5 , the control unit 70 controls the second optical inspection camera 13 to photograph the plurality of electronic components S1 disposed on the inspection table 11 (step S100). The control unit 70 performs setting processing of each inspection area T1 in the photographed image IM1 generated by the second optical inspection camera 13 (step S110). The processing in step S110 will be described in detail later.

The control unit 70 performs various appearance inspection processes of each electronic component S1 included in the photographed image IM1 based on the images included in each inspection area T1 (step S120). For example, when the appearance inspection is performed using the second and subsequent photographs among the multiple photographs performed for the appearance inspection of all the electronic components S1 arranged on the inspection table 11, each inspection area T1 set for the appearance inspection using the first photograph is used, thereby omitting the processing of step S110.

Fig. 6 is a flowchart showing the process of setting the inspection area (step S110 in Fig. 5). The process shown in the flowchart is executed by the control unit 70 of the computer 50.

Referring to FIG. 6 , the control unit 70 performs a setting process (step S200 ) of the inspection area T1 (for example, the inspection area T1A in FIG. 4 ) corresponding to the first electronic component S1 among the plurality of electronic components S1 included in the captured image IM1 . The process in step S200 will be described in detail later.

The control unit 70 performs a setting process (step S210) of the inspection area T1 corresponding to the electronic component S1 located after the movement in the row direction (for example, the inspection area T1B in FIG. 4) based on the inspection area T1 set in step S200. The process in step S210 will be described in detail later.

The control unit 70 performs setting processing of the inspection area T1 (for example, the inspection area T1C in FIG. 4 ) corresponding to the electronic component S1 located at the position after the movement in the row direction based on the inspection area T1 set in step S200 (step S220 ). The processing in step S220 will be described in detail later.

The control unit 70 determines the number of inspection areas T1 in the row direction and the number of inspection areas T1 in the column direction based on the inspection areas T1 set through the processing in steps S200, S210, and S220, and sets other inspection areas T1 (for example, the inspection area T1D in FIG. 4) based on the result (step S230). In the example shown in FIG. 4, after the processing in steps S200, S210, and S220, the number of inspection areas T1 in the row direction is determined to be "2", and the number of inspection areas T1 in the column direction is determined to be "2". In addition, the other inspection areas T1 are set so that the inspection areas T1 are arranged in a grid shape of two columns and two rows.

Fig. 7 is a flow chart showing the steps of the setting process of the first inspection area T1 (step S200 of Fig. 6). The process shown in the flow chart is executed by the control unit 70 of the computer 50.

Referring to FIG. 7 , the control unit 70 performs a process (step S300) for determining the left side EL1 of the first electronic component S1 (hereinafter also referred to as the "first electronic component") among the plurality of electronic components S1 included in the photographed image IM1. The process in step S300 will be described in detail later. Based on the determined left side EL1, the control unit 70 performs a process (step S310) for determining the right side ER1 of the first electronic component S1. The process in step S310 will be described in detail later.

The control unit 70 performs processing for determining the upper side ET1 of the first electronic component S1 based on the determined left side EL1 and right side ER1 (step S320). The processing in step S320 will be described in detail later. The control unit 70 performs processing for determining the lower side EB1 of the first electronic component S1 based on the determined left side EL1 and right side ER1 (step S330). The processing in step S330 will be described in detail later. The control unit 70 sets the inspection area T1 corresponding to the first electronic component S1 based on the determined left side EL1, right side ER1, upper side ET1 and lower side EB1 (step S340).

FIG. 8 is a diagram for explaining the process of determining a portion of the left side EL1 of the first electronic component S1 in the captured image IM1. Referring to FIG. 8, in the cutting device 1, a left side determination process is performed. The left side determination process is the following process: based on the pixel values of each of a specific number of pixels (hereinafter also referred to as "a specific number of pixels") continuously located in the row direction, it is determined whether the specific number of pixels includes a portion of the left side EL1. In the left side determination process, based on the pixel values of each of the specific number of pixels, the boundary between the retaining component 11b and the electronic component S1 is determined. For example, a portion is determined in which pixels with smaller pixel values (pixels corresponding to the retaining component 11b (dark pixels)) and pixels with larger pixel values (pixels corresponding to the electronic component S1 (bright pixels)) are arranged adjacent to each other in sequence from the left side to the right side in the figure.

When it is determined through the left edge determination process that a portion of the left edge EL1 is not included in the specific number of pixels, the position of the specific number of pixels to be determined is changed, for example, to the lower right, and the left edge determination process is performed on the changed specific number of pixels. By repeatedly performing the position change of the specific number of pixels to be determined and the left edge determination process, the position of a portion of the left edge EL1 is determined.

Fig. 9 is a diagram for explaining how the positions of a specific number of pixels that are the target of the left edge determination process change. In the captured image IM1 shown in this figure, the images of the electronic components S1 and the like are omitted for the sake of convenience.

Referring to FIG. 9, the captured image IM1 is composed of a plurality of pixels PX1. In the cutting device 1, first, five pixels (an example of a specific number of pixels) are selected from the upper left pixel PX1 to the right in the row direction, and the selected five pixels are subjected to left edge determination processing. When it is determined that the selected five pixels do not include a portion of the left edge EL1, the positions of the five pixels are changed by one pixel each to the right in the row direction and to the bottom in the column direction. And, the left edge determination processing is performed on the changed five pixels. The position change of the five pixels and the left edge determination processing are repeatedly performed until a portion of the left edge EL1 is determined.

FIG. 10 is a diagram for explaining the generation of the approximate curve L1 in the left edge determination process. Referring to FIG. 10, the horizontal axis represents the position of each of the specific number of pixels, and the vertical axis represents the pixel value. In the left edge determination process, an approximate curve L1 is generated to represent how the pixel values of the specific number of pixels change from the left side to the right side in the self-shot image IM1. When generating the approximate curve L1, for example, various known techniques are applied.

FIG. 11 schematically shows a curve L2 which is a result of differentiating the approximate curve L1. Referring to FIG. 11, the horizontal axis represents the positions of the respective specific number of pixels, and the vertical axis represents the differential value. In the left edge determination process, the generated approximate curve L1 is differentiated. In the left edge determination process, when the maximum value of the differential value exceeds the threshold value (first specific value), it is determined that a part of the left edge EL1 exists in the specific number of pixels. If it is determined that a part of the left edge EL1 exists in the specific number of pixels, the other parts of the left edge EL1 are determined based on the determined part of the left edge EL1.

FIG. 12 is a diagram for explaining the process of determining the other parts of the left edge EL1. Referring to FIG. 12, pixel PX1A is an example of a pixel PX1 corresponding to the maximum value (maximum value> first specific value) of the differential value obtained through the left edge determination process. In the process of determining the other parts of the left edge EL1, first, the process of determining the upper end of the left edge EL1 is performed, and then the process of determining the lower end of the left edge EL1 is performed.

Specifically, five pixels including pixel PX1A, two pixels on the left side of pixel PX1A, and two pixels on the right side of pixel PX1A are selected as pixels to be determined. The processing of moving the positions of the five pixels to be determined by one pixel to the side in the column direction and the left-side determination processing are repeatedly performed until it is determined that the selected five pixels do not include a part of the left side EL1. When the selected five pixels each represent the holding member 11b (refer to Figure 4), the processing of moving the positions of the five pixels to be determined by one pixel to the side in the column direction is stopped, and the upper end of the left side EL1 is determined. Furthermore, the pixels to be determined do not necessarily have to be five pixels including pixel PX1A, two pixels on the left side of pixel PX1A, and two pixels on the right side of pixel PX1A. For example, the pixels to be determined may be three pixels including pixel PX1A, a pixel on the left side of pixel PX1A, and a pixel on the right side of pixel PX1A; or four pixels including pixel PX1A, two pixels on the left side of pixel PX1A, and a pixel on the right side of pixel PX1A; or four pixels including pixel PX1A, a pixel on the left side of pixel PX1A, and two pixels on the right side of pixel PX1A.

If the upper end of the left side EL1 is determined, the processing of moving the positions of the five pixels to be determined by one pixel downward in the column direction and the left side determination processing are repeatedly performed until it is determined that the five pixels including the pixel PX1A, the two pixels on the left side of the pixel PX1A, and the two pixels on the right side of the pixel PX1A do not include a part of the left side EL1. If the selected five pixels correspond to the holding member 11b (refer to Figure 4), respectively, the processing of moving the positions of the five pixels to be determined by one pixel downward in the column direction is stopped, and the lower end of the left side EL1 is determined.

FIG. 13 is a diagram for explaining the process of determining the left side EL1 based on each pixel position corresponding to each maximum value (maximum value > first specific value) of the differential value obtained through the left side determination process. In this example, a plurality of pixels PX1 each including a pixel position (differential maximum position PO1) corresponding to the maximum value (maximum value > first specific value) of the differential value are arranged in the row direction. At this time, for example, by applying a specific algorithm to each differential maximum position PO1, the left side EL1 is determined. As an example of a specific algorithm, Random Sample Consensus (RANSAC) can be cited. In this way, the left side of the first electronic component S1 is determined.

Fig. 14 is a flow chart showing the process of determining the left side EL1 of the first electronic component S1 (step S300 in Fig. 7). The process shown in the flow chart is executed by the control unit 70 of the computer 50.

14, the control unit 70 determines the positions of a specific number of pixels as targets for left edge determination processing (step S400). For example, the control unit 70 determines five pixels to the right from the upper left pixel PX1 of the captured image IM1 as targets for left edge determination processing.

The control unit 70 generates an approximate curve based on the pixel values of the determined five pixels (step S410). The control unit 70 performs differentiation of the generated approximate curve (step S420). The control unit 70 determines whether the maximum value of the differential value is greater than the first specific value (step S430). If it is determined that the maximum value of the differential value is less than the first specific value ("No" in step S430), the control unit 70 moves the position of the five pixels that are the object of the left side judgment processing to the right and downward (step S440), and executes steps S410, S420, and S430 (left side judgment processing) again.

On the other hand, if it is determined that the maximum value of the differential value is greater than the first specific value ("Yes" in step S430), the control unit 70 executes a process of separately determining the upper end and the lower end of the left side EL1 (step S450). The process of separately determining the upper end and the lower end of the left side EL1 will be described in detail later.

If the upper end and the lower end of the left side EL1 are determined, the control unit 70 determines whether the difference between the length between the upper end and the lower end and the first specific length is less than the second specific value (step S460). The first specific length is, for example, a length corresponding to the specification value of the length between the upper end and the lower end of the electronic component S1. The second specific value may also be, for example, a length corresponding to 0.5% to 5% of the specification value of the length between the upper end and the lower end of the electronic component S1.

If it is determined that the difference between the length between the upper end and the lower end and the first specific length is greater than the second specific value ("No" in step S460), the control unit 70 finally performs the processing of step S440 in step S430 based on the five pixels whose maximum value of the differential value is greater than the first specific value. For example, this may occur when the ball part BA1 (refer to Figure 4) is included in the specific number of pixels as the object of the left side determination processing.

On the other hand, if it is determined that the difference between the length between the upper end and the lower end and the first specific length is less than the second specific value ("Yes" in step S460), the control unit 70 determines the left edge EL1 based on the pixel positions corresponding to the maximum values (maximum value > first specific value) of the differential values obtained after the left edge judgment processing (step S470).

Fig. 15 is a flowchart showing the process of determining the upper end and the lower end of the left side EL1 (step S450 in Fig. 14). The process shown in the flowchart is executed by the control unit 70 of the computer 50.

Referring to Figure 15, the control unit 70 shifts the position of a specific number of pixels (five pixels) that are the objects of left-side judgment processing by one pixel to the side in the column direction based on the position of a specific number of pixels (five pixels) including the pixel PX1 corresponding to the maximum value of the differential value calculated in step S420 of Figure 14 (maximum value > first specific value) (step S500).

The control unit 70 generates an approximate curve based on the pixel values of the five pixels after the position change (step S510). The control unit 70 performs differentiation of the generated approximate curve (step S520). The control unit 70 determines whether the maximum value of the differential value is greater than the first specific value (step S530). If it is determined that the maximum value of the differential value is greater than the first specific value ("Yes" in step S530), the control unit 70 executes the processing of step S500 again. On the other hand, if it is determined that the maximum value of the differential value is less than the first specific value ("No" in step S530), the control unit 70 determines the upper end of the left side EL1 (step S540).

The control unit 70 moves the position of a specific number of pixels (five pixels) that are the objects of left-side judgment processing by one pixel downward in the column direction based on the position of a specific number of pixels (five pixels) including the pixel PX1 corresponding to the maximum value of the differential value calculated in step S420 of Figure 14 (maximum value > first specific value) (step S550).

The control unit 70 generates an approximate curve based on the pixel values of the five pixels after the position change (step S560). The control unit 70 performs differentiation of the generated approximate curve (step S570). The control unit 70 determines whether the maximum value of the differential value is greater than the first specific value (step S580). If it is determined that the maximum value of the differential value is greater than the first specific value ("Yes" in step S580), the control unit 70 executes the processing of step S550 again. On the other hand, if it is determined that the maximum value of the differential value is less than the first specific value ("No" in step S580), the control unit 70 determines the lower end of the left side EL1 (step S590). Thereby, the upper end and the lower end of the left side EL1 are determined.

Thus, in the cutting device 1 according to the present embodiment, the positions of a specific number of pixels are repeatedly moved to perform the left edge determination process to set at least a portion of the plurality of inspection areas T1. Therefore, according to the cutting device 1, for example, compared with setting the inspection area T1 based on the pixel value of each pixel PX1 included in the entire captured image IM1, the inspection area T1 can be automatically set efficiently.

Furthermore, according to the cutting device 1, since the positions of a specific number of pixels gradually move diagonally, a portion of any side (for example, the left side EL1) of the plurality of electronic components S1 intersects with the specific number of pixels at a relatively early stage, so a portion of any side of the plurality of electronic components S1 can be determined relatively efficiently.

Furthermore, according to the cutting device, since the other parts of the left side EL1 are determined based on the determined part of the left side EL1, the entire left side EL1 can be determined relatively efficiently.

Fig. 16 is a diagram for explaining the process of determining the right side ER1 of the first electronic component S1. Referring to Fig. 16, after the left side EL1 is determined, the right side ER1 of the first electronic component S1 is determined based on the left side EL1.

A set of five pixels is generated by selecting a specific number of pixels (five pixels) to the right of the row direction based on the positions of the pixels included in the left side EL1 after being moved a plurality of pixels to the right in the row direction. The right side determination process is performed on each of the five pixels included in the set of five pixels. The position of each pixel located on the left side of each of the five pixels selected first to determine the right side ER1 is the position after being moved a plurality of pixels to the right of the row direction from the position of the left side EL1. The number of the plurality of pixels moved from the position of the left side EL1 is predetermined, for example, based on the specification value of the length of the electronic component S1 in the left-right direction.

The right edge determination process is a process for determining whether a portion of the right edge ER1 is included in a specific number of pixels based on the pixel values of each of the specific number of pixels. In the right edge determination process, the boundary between the holding member 11b and the electronic component S1 is determined based on the pixel values of each of the specific number of pixels. For example, a portion is determined where pixels with smaller pixel values (pixels corresponding to the holding member 11b (dark pixels)) and pixels with larger pixel values (pixels corresponding to the electronic component S1 (bright pixels)) are arranged adjacent to each other in sequence from the right side to the left side in the figure.

In the above-mentioned left side determination processing, for the five pixels as the object of the left side determination processing, it is determined whether a part of the left side EL1 is included in a certain number of pixels based on how each pixel value changes from the left side to the right side in the figure. On the other hand, in the right side determination processing, for the five pixels as the object of the right side determination processing, it is determined whether a part of the right side ER1 is included in a certain number of pixels based on how each pixel value changes from the right side to the left side in the figure. The reason is that, in the five pixels including the left side EL1, the pixel value increases (becomes brighter) from the left side to the right side, while, in contrast, in the five pixels including the right side ER1, the pixel value increases from the right side to the left side. In other respects, the content of the left side determination processing is the same as that of the right side determination processing.

When it is determined through the right edge determination process that there are a certain number of pixels that do not include a part of the right edge ER1 in the set of the certain number of pixels (the selected five pixels), the position of the set of the certain number of pixels is moved one pixel to the right in the row direction. And the right edge determination process is performed on the changed set of the certain number of pixels. By repeatedly performing the position change of the set of the certain number of pixels and the right edge determination process, the position of the right edge ER1 is determined.

Fig. 17 is a flow chart showing the process of determining the right side ER1 of the first electronic component S1 (step S310 of Fig. 7). The process shown in the flow chart is executed by the control unit 70 of the computer 50.

Referring to FIG. 17 , the control unit 70 determines the position of a set of a specific number of pixels as the target of the right edge determination process (step S600). For example, the control unit 70 determines the position of a specific number of pixels (five pixels) as the target of the right edge determination process to the right in the row direction, based on the position of each pixel PX1 included in the left edge EL1 after being shifted to the right in the row direction by a plurality of pixels.

The control unit 70 generates a plurality of approximate curves based on the pixel values of each of the five pixels determined (step S610). The control unit 70 performs differentiation on each of the generated plurality of approximate curves (step S620). The control unit 70 determines whether each maximum value of the differential value is greater than a first specific value (step S630). If it is determined that a part of the maximum values of the differential values is less than the first specific value ("No" in step S630), the control unit 70 moves the position of the set of five pixels as the object of the right side determination processing by one pixel to the right (step S640).

The control unit 70 determines whether an error has occurred based on the position of the set of five pixels that are the object of the changed right edge determination process (step S650). For example, when the length between the position of each pixel at the left end of the set of five pixels that are the object of the changed right edge determination process and the position of the left edge EL1 is longer than the specification value of the length of the electronic component S1 in the left-right direction, and the difference between them is greater than a preset length, it is determined that an error has occurred.

If it is determined that an error has occurred ("Yes" in step S650), the control unit 70 finally executes the process of step S440 again based on the five pixels whose maximum value of the differential value is greater than the first specific value in step S430 of FIG. 14. On the other hand, if it is determined that no error has occurred ("No" in step S650), the control unit 70 executes steps S610, S620, and S630 (right judgment process) again.

On the other hand, if it is determined that the maximum values of the differential values are greater than the first specific value ("Yes" in step S630), the control unit 70 determines the right edge ER1 based on the pixel positions corresponding to the maximum values of the differential values obtained after the right edge determination processing (maximum value > first specific value) (step S650).

Fig. 18 is a diagram for explaining the process of respectively determining the upper side ET1 and the lower side EB1 of the first electronic component S1. Referring to Fig. 18, after the left side EL1 and the right side ER1 are determined, the upper side ET1 and the lower side EB1 of the first electronic component S1 are respectively determined based on the left side EL1 and the right side ER1.

Specifically, a specific number of pixels located at the left end of a set of a specific number of pixels (five pixels) arranged in the column direction and orthogonal to the straight line connecting the pixels at the upper ends of the left edge EL1 and the right edge ER1 are selected, and the upper edge determination processing is performed on the selected five pixels. The upper edge determination processing is the following processing: based on the pixel value of each of the specific number of pixels, it is determined whether the specific number of pixels contains a part of the upper edge ET1. In the upper edge determination processing, based on the pixel value of each of the specific number of pixels, the boundary between the retaining member 11b and the electronic component S1 is determined. For example, from the upper side to the lower side in the figure, the part where the pixels with smaller pixel values (pixels corresponding to the retaining member 11b (dark pixels)) and the pixels with larger pixel values (pixels corresponding to the electronic component S1 (bright pixels)) are arranged adjacent to each other in sequence is determined.

In the above-mentioned left edge determination processing, for the five pixels that are the object of the left edge determination processing, it is determined whether a part of the left edge EL1 is included in a specific number of pixels based on how each pixel value changes from the left side to the right side in the figure. On the other hand, in the top edge determination processing, for the five pixels that are the object of the top edge determination processing, it is determined whether a part of the top edge ET1 is included in a specific number of pixels based on how each pixel value changes from the top side to the bottom side in the figure. The reason is that, among the five pixels that include the left edge EL1, the pixel value increases (becomes brighter) from the left side to the right side, while, in contrast, among the five pixels that include the top edge ET1, the pixel value increases from the top side to the bottom side. In other respects, the content of the left edge determination processing is the same as that of the top edge determination processing.

The position change of the specific number of pixels to be determined toward the right in the row direction and the upper edge determination process are repeatedly performed until it is determined through the upper edge determination process that the specific number of pixels does not include a portion of the upper edge ET1. If it is determined through the upper edge determination process that the specific number of pixels does not include a portion of the upper edge ET1, the left end and the right end of the upper edge ET1 are determined respectively, thereby determining the upper edge ET1.

In addition, a specific number of pixels located at the left end of a set of a specific number of pixels (five pixels) arranged in the column direction and orthogonal to the straight line connecting the pixels at the lower ends of the left side EL1 and the right side ER1 are selected, and the bottom judgment processing is performed on the selected five pixels. The bottom judgment processing is as follows: based on the pixel value of each of the specific number of pixels, it is determined whether the specific number of pixels includes a part of the bottom EB1. In the bottom judgment processing, based on the pixel value of each of the specific number of pixels, the boundary between the holding member 11b and the electronic component S1 is determined. For example, from the bottom to the top in the figure, the part where pixels with smaller pixel values (pixels corresponding to the holding member 11b (dark pixels)) and pixels with larger pixel values (pixels corresponding to the electronic component S1 (bright pixels)) are arranged adjacent to each other in sequence is determined.

In the above-mentioned left edge determination processing, for the five pixels that are the object of the left edge determination processing, it is determined whether a part of the left edge EL1 is included in a specific number of pixels based on how each pixel value changes from the left side to the right side in the figure. On the other hand, in the bottom edge determination processing, for the five pixels that are the object of the bottom edge determination processing, it is determined whether a part of the bottom edge EB1 is included in a specific number of pixels based on how each pixel value changes from the bottom side to the top side in the figure. The reason is that, among the five pixels that include the left edge EL1, the pixel value increases (becomes brighter) from the left side to the right side, while, in contrast, among the five pixels that include the bottom edge EB1, the pixel value increases from the bottom side to the top side. In other respects, the content of the left edge determination processing is the same as that of the bottom edge determination processing.

The position change of the specific number of pixels to be determined toward the right side in the row direction and the bottom edge determination process are repeatedly performed until it is determined through the bottom edge determination process that the specific number of pixels does not include a part of the bottom edge EB1. If it is determined through the bottom edge determination process that the specific number of pixels does not include a part of the bottom edge EB1, the left end and the right end of the bottom edge EB1 are determined respectively, thereby determining the bottom edge EB1.

Fig. 19 is a flow chart showing the process of determining the upper edge ET1 in the first electronic component S1 (step S320 in Fig. 7). The process shown in the flow chart is executed by the control unit 70 of the computer 50.

Referring to FIG. 19 , the control unit 70 determines the positions of a specific number of pixels as the target of the upper edge determination process (step S700). For example, the control unit 70 determines a specific number of pixels located at the left end of a set of a specific number of pixels (five pixels) arranged in the column direction and perpendicular to a straight line connecting pixels at the upper ends of the left edge EL1 and the right edge ER1 as the target of the upper edge determination process.

The control unit 70 generates an approximate curve based on the pixel values of the determined five pixels (step S710). The control unit 70 performs differentiation of the generated approximate curve (step S720). The control unit 70 determines whether the maximum value of the differential value is greater than the first specific value (step S730). If it is determined that the maximum value of the differential value is greater than the first specific value ("Yes" in step S730), the control unit 70 moves the positions of the five pixels that are the objects of the upper judgment processing by one pixel to the right in the row direction (step S740), and executes steps S710, S720, and S730 (upper judgment processing) again.

On the other hand, if it is determined that the maximum value of the differential value is less than the first specific value ("No" in step S730), the control unit 70 determines whether the difference between the length (left-right length) between the position of the upper end of the left side EL1 and the position of the specific number of pixels where the maximum value of the differential value is determined to be less than the first specific value and the second specific length is less than a third specific value (step S750). The second specific length is, for example, a length corresponding to the specification value of the length of the electronic component S1 in the left-right direction. The third specific value may also be, for example, a length corresponding to 0.5% to 5% of the specification value of the length of the electronic component S1 in the left-right direction.

If it is determined that the difference between the left and right lengths and the second specific length is greater than the third specific value ("No" in step S750), the control unit 70 finally executes the processing of step S440 again based on the five pixels in step S430 of Figure 14 where the maximum value of the differential value is greater than the first specific value.

On the other hand, if it is determined that the difference between the left and right lengths and the second specific length is less than the third specific value ("Yes" in step S750), the control unit 70 determines the upper edge ET1 based on the pixel positions corresponding to the maximum values (maximum value > first specific value) of the differential values obtained through the upper edge determination processing (step S760).

Fig. 20 is a flow chart showing the process of determining the lower edge EB1 in the first electronic component S1 (step S330 in Fig. 7). The process shown in the flow chart is executed by the control unit 70 of the computer 50.

Referring to FIG. 20, the control unit 70 determines the positions of a specific number of pixels as the target of the bottom edge determination process (step S800). For example, the control unit 70 determines a specific number of pixels located at the left end of a set of a specific number of pixels (five pixels) arranged in the column direction and perpendicular to a straight line connecting pixels at the bottom ends of the left side EL1 and the right side ER1 as the target of the bottom edge determination process.

The control unit 70 generates an approximate curve based on the pixel values of the determined five pixels (step S810). The control unit 70 performs differentiation of the generated approximate curve (step S820). The control unit 70 determines whether the maximum value of the differential value is greater than the first specific value (step S830). If it is determined that the maximum value of the differential value is greater than the first specific value ("Yes" in step S830), the control unit 70 moves the positions of the five pixels that are the objects of the following determination processing by one pixel to the right in the row direction (step S840), and executes steps S810, S820, and S830 again (the following determination processing).

On the other hand, if the maximum value of the differential value is determined to be less than the first specific value ("No" in step S830), the control unit 70 determines whether the difference between the length (left-right length) between the position of the lower end of the left side EL1 and the position of a specific number of pixels where the maximum value of the differential value is determined to be less than the first specific value and the second specific length is less than a third specific value (step S850).

If it is determined that the difference between the left and right lengths and the second specific length is greater than the third specific value ("No" in step S850), the control unit 70 finally executes the processing of step S440 again based on the five pixels in step S430 of Figure 14 where the maximum value of the differential value is greater than the first specific value.

On the other hand, if it is determined that the difference between the left and right lengths and the second specific length is less than the third specific value ("Yes" in step S850), the control unit 70 determines the lower edge EB1 based on the pixel positions corresponding to the maximum values (maximum value>first specific value) of the differential values obtained through the lower edge determination process (step S860). Furthermore, the inspection area T1 is set based on the determined left edge EL1, right edge ER1, upper edge ET1, and lower edge EB1.

In this way, according to the cutting device 1 of this embodiment, the inspection area T1 can be set relatively efficiently because the other three sides of the electronic component S1 including the left side EL1 are determined based on the determined left side EL1.

Furthermore, according to the cutting device 1, when searching for the right side ER1 opposite to the left side EL1, the left side EL1 has been determined, and the approximate positions of the two ends (upper end and lower end) of the right side ER1 have been grasped, so the right side ER1 can be determined relatively efficiently. Furthermore, according to the cutting device 1, when searching for two sides (upper end ET1 and lower end EB1) other than the left side EL1 and the right side ER1, the left side EL1 and the right side ER1 have been determined, and the approximate positions of the two ends of the two sides other than the left side EL1 and the right side ER1 have been grasped, so the two sides other than the left side EL1 and the right side ER1 can be determined relatively efficiently.

FIG. 21 is a diagram for explaining the process of setting other inspection regions T1 at positions relative to the first inspection region T1 after moving along the row direction or column direction. Referring to FIG. 21, for example, based on the inspection region T1A, the inspection region T1B at the position relative to the inspection region T1A after moving along the row direction and the inspection region T1C at the position relative to the inspection region T1A after moving along the column direction are set.

In order to set the inspection area T1 relative to the inspection area T1A after the inspection area T1A is moved in the row direction, for example, a temporary inspection area T1B1 having the same shape as the inspection area T1A is selected. The shape of the temporary inspection area T1B1 is the same as that of the inspection area T1A. That is, the lengths of the left side, right side, top side and bottom side of the temporary inspection area T1B1 are respectively the same as the lengths of the left side, right side, top side and bottom side of the inspection area T1A.

The position of the temporary inspection area T1B1 is a position shifted by a plurality of pixels in the row direction relative to the position of the inspection area T1A. The number of pixels shifted from the position of the inspection area T1A is preset based on the specification value of the length of the electronic component S1 in the left-right direction, for example.

If the temporary inspection area T1 (e.g., temporary inspection area T1B1) is selected, a determination process (hereinafter also referred to as "each side determination process") is performed to determine whether the left side, right side, top side, and bottom side of the temporary inspection area T1 (e.g., temporary inspection area T1B1) correspond to the left side, right side, top side, and bottom side of the electronic component S1 (e.g., electronic component S1B), respectively. In the each side determination process, the left side determination process is repeatedly performed along the left side of the temporary inspection area T1, and the right side determination process is repeatedly performed along the right side of the temporary inspection area T1. In addition, the top side determination process is repeatedly performed along the top side of the temporary inspection area T1, and the bottom side determination process is repeatedly performed along the bottom side of the temporary inspection area T1. In this way, it is determined whether the sides of the temporary inspection area T1 correspond to the sides of the electronic component S1.

If it is determined that any side of the temporary inspection area T1 does not correspond to the side of the electronic component S1, a new temporary inspection area T1 (for example, temporary inspection area T1B2) is selected at the position after moving one pixel along the row direction. And, the side determination process is performed on the newly selected temporary inspection area T1. The process of moving the position of the temporary inspection area T1 along the row direction and the side determination process are repeated until it is determined that the sides of the temporary inspection area T1 correspond to the sides of the electronic component S1. In this way, another inspection area T1 is set relative to the position of the first inspection area T1 after moving along the row direction. By repeatedly performing the same process, an inspection area T1 is set corresponding to each electronic component S1 existing at a position after moving along the row direction relative to the first set inspection area T1.

In order to set the inspection region T1 relative to the inspection region T1A after being moved in the row direction, for example, a temporary inspection region T1C1 having the same shape as the inspection region T1A is selected. The shape of the temporary inspection region T1C1 is the same as that of the inspection region T1A. That is, the lengths of the left side, right side, top side, and bottom side of the temporary inspection region T1C1 are respectively the same as the lengths of the left side, right side, top side, and bottom side of the inspection region T1A.

The position of the temporary inspection area T1C1 is a position shifted by a plurality of pixels in the row direction relative to the position of the inspection area T1A. The number of pixels shifted from the position of the inspection area T1A is preset based on the specification value of the length of the electronic component S1 in the vertical direction, for example.

If a temporary inspection area T1 (for example, temporary inspection area T1C1) is selected, the edge determination process is performed. If it is determined that any edge of the temporary inspection area T1 does not correspond to the edge of the electronic component S1, a new temporary inspection area T1 (for example, temporary inspection area T1C2) is selected at the position after moving one pixel along the column direction. And, the edge determination process is performed on the newly selected temporary inspection area T1. The process of moving the position of the temporary inspection area T1 along the column direction and the edge determination process are repeated until it is determined that the edges of the temporary inspection area T1 correspond to the edges of the electronic component S1. In this way, another inspection area T1 is set relative to the position of the first inspection area T1 after moving along the column direction. By repeatedly performing the same process, the inspection area T1 corresponding to each electronic component S1 existing at the position after being moved along the row direction relative to the first set inspection area T1 is set.

FIG. 22 is a flowchart showing the process of setting another inspection area T1 at a position after the first inspection area T1 is moved in the row direction (step S210 in FIG. 6 ). The process shown in the flowchart is executed by the control unit 70 of the computer 50 .

Referring to FIG. 22, the control unit 70 selects a temporary inspection area T1 at a position after the set inspection area T1 is moved by a plurality of pixels along the row direction (step S900). The control unit 70 performs each edge determination processing on the selected temporary inspection area T1 (step S910). The control unit 70 determines whether each edge of the temporary inspection area T1 corresponds to the edge of the electronic component S1 (step S920).

If it is determined that any side of the temporary inspection area T1 does not correspond to the side of the electronic component S1 ("No" in step S920), the control unit 70 changes the position of the temporary inspection area T1 by moving the position of the temporary inspection area T1 by one pixel in the row direction (step S930). Afterwards, the control unit 70 executes the processing of steps S910 and S920 again.

On the other hand, if it is determined that the sides of the temporary inspection area T1 correspond to the sides of the electronic component S1 ("Yes" in step S920), the control unit 70 sets the currently selected temporary inspection area T1 as the inspection area T1 (step S940). Thereafter, the control unit 70 determines whether the inspection area T1 corresponding to all the electronic components S1 existing in the row direction has been set (step S950). If it is determined that the setting of the inspection area T1 corresponding to all the electronic components S1 existing in the row direction is not completed ("No" in step S950), the control unit 70 executes the processing of step S900 again. On the other hand, if it is determined that the inspection area T1 corresponding to all the electronic components S1 existing in the row direction has been set (“Yes” in step S950 ), the processing shown in the flowchart ends.

FIG. 23 is a flowchart showing the process of setting another inspection area T1 at a position after the first inspection area T1 is moved in the row direction (step S220 in FIG. 6 ). The process shown in the flowchart is executed by the control unit 70 of the computer 50 .

Referring to FIG. 23 , the control unit 70 selects a temporary inspection area T1 based on the set inspection area T1 at a position after the set inspection area T1 is moved by a plurality of pixels along the column direction (step S1000). The control unit 70 performs each edge determination processing on the selected temporary inspection area T1 (step S1010). The control unit 70 determines whether each edge of the temporary inspection area T1 corresponds to the edge of the electronic component S1 (step S1020).

If it is determined that any side of the temporary inspection area T1 does not correspond to the side of the electronic component S1 ("No" in step S1020), the control unit 70 changes the position of the temporary inspection area T1 by moving the position of the temporary inspection area T1 by one pixel in the column direction (step S1030). Afterwards, the control unit 70 executes the processing of steps S1010 and S1020 again.

On the other hand, if it is determined that the sides of the temporary inspection area T1 correspond to the sides of the electronic component S1 ("Yes" in step S1020), the control unit 70 sets the currently selected temporary inspection area T1 as the inspection area T1 (step S1040). Thereafter, the control unit 70 determines whether the inspection area T1 corresponding to all the electronic components S1 existing in the column direction has been set (step S1050). If it is determined that the setting of the inspection area T1 corresponding to all the electronic components S1 existing in the column direction is not completed ("No" in step S1050), the control unit 70 executes the processing of step S1000 again. On the other hand, if it is determined that the inspection area T1 corresponding to all the electronic components S1 existing in the row direction has been set (“Yes” in step S1050 ), the processing shown in the flowchart ends.

In this way, according to the cutting device 1 of this embodiment, since other inspection areas T1 are determined based on the inspection area T1 that is determined first, a plurality of inspection areas T1 can be determined relatively efficiently.

[4. Features] As described above, in the cutting device 1 according to the present embodiment, the positions of a specific number of pixels PX1 are repeatedly moved to perform a determination process (e.g., a left determination process) to set at least a portion of a plurality of inspection areas T1. Therefore, according to the cutting device 1, for example, compared with setting the inspection area T1 based on the pixel value of each pixel PX1 included in the entire captured image IM1, the inspection area T1 can be efficiently and automatically set.

Furthermore, the cutting device 1 is an example of the "cutting device" in the present invention. The electronic component S1 is an example of the "cut product" in the present invention. The first optical inspection camera 12 and the second optical inspection camera 13 are examples of the "photographing unit" in the present invention. The control unit 70 is an example of the "first processing unit" and an example of the "second processing unit" in the present invention. The photographed image IM1 is an example of the "photographed image" in the present invention.

[5. Other implementations] The concept of the above implementation is not limited to the implementation described above. For example, at least a part of the structure of any one implementation can be combined with at least a part of the structure of any other implementation. Below, an example of other implementations to which the concept of the above implementation can be applied is described.

<5-1> In the above-mentioned embodiment, the cutting device 1 is controlled by the computer 50. However, the cutting device 1 can also be controlled by a plurality of computers, without being controlled by a single computer 50.

<5-2> In the above-mentioned embodiment, the color of the holding member 11b of the inspection table 11 is black. However, as described above, the color of the holding member 11b may also be white. When the color of the holding member 11b is white, on the left side of the electronic component S1, the pixel value decreases from left to right, and on the right side, the pixel value decreases from right to left. Also, on the top of the electronic component S1, the pixel value decreases from top to bottom, and on the bottom, the pixel value decreases from bottom to top. Therefore, in the left side judgment processing, when the minimum value of the differential value of the approximate curve representing the change of the pixel value from left to right is less than the threshold value, it can be judged that a part of the left side is included in a specific number of pixels. Also, in the left side judgment processing, when the maximum value of the differential value of the approximate curve representing the change of the pixel value from right to left is greater than the threshold value, it can be judged that a part of the left side is included in a specific number of pixels. It can be said that the same is true for the right judgment process, the upper judgment process, and the lower judgment process.

<5-3> In addition, in the above-mentioned embodiment, in order to set the first inspection area T1, the left side EL1 is determined first. However, the side to be determined first is not limited to the left side EL1. The right side ER1 may be determined first, the upper side ET1 may be determined first, or the lower side EB1 may be determined first.

<5-4> In addition, in the processing for determining the left side EL1, the right side ER1, the upper side ET1, and the lower side EB1, the unit of pixels when moving a specific number of pixels may not be one pixel. The position of a specific number of pixels may be moved by a plurality of pixels. In addition, the specific number of pixels does not necessarily have to be five pixels. The specific number of pixels may be two or more pixels. In addition, in the processing for setting the second and subsequent inspection areas T1, the unit of pixels when moving the temporary inspection area T1 may not be one pixel. The position of the temporary inspection area T1 may be moved by a plurality of pixels.

<5-5> In the above-mentioned embodiment, the sides of the electronic component S1 in the photographed image IM1 are determined based on the differential value of the approximate curve generated based on the pixel values of each of a specific number of pixels. However, the differential value does not have to be used in determining the sides of the electronic component S1 in the photographed image IM1.

<5-6> In addition, in the above-mentioned embodiment, the second optical inspection camera 13 only photographs a part of the plurality of electronic components S1 arranged on the inspection table 11 at a time. However, the photographing area of the second optical inspection camera 13 is not limited thereto, and the second optical inspection camera 13 may also be used to photograph all the plurality of electronic components S1 arranged on the inspection table 11 at a time.

<5-7> In addition, in the above-mentioned embodiment, part of the inspection area T1 (for example, the inspection area T1D in FIG. 4) in the second and subsequent inspection areas T1 is set without the side determination processing. However, the setting method of the second and subsequent inspection areas T1 is not limited to this. For example, all the second and subsequent inspection areas T1 in the captured image IM1 may be set through the side determination processing.

<5-8> In the above-mentioned embodiment, after setting the first inspection area T1, the inspection area T1 at the position after moving along the row direction is set, and then the inspection area T1 at the position after moving along the column direction is set. However, the setting order of each inspection area T1 is not limited to this. For example, after setting the first inspection area T1, the inspection area T1 at the position after moving along the column direction may be set, and then the inspection area T1 at the position after moving along the row direction may be set.

<5-9> In addition, in the above-mentioned embodiment, in order to set the first inspection area T1, the left side EL1, the right side ER1, the upper side ET1 and the lower side EB1 are determined in sequence. However, the order of determining the sides is not limited to this.

<5-10> In addition, in the above-mentioned embodiment, the setting of the inspection area T1 in the image IM1 photographed by the second optical inspection camera 13 is mainly described, but the same processing can also be performed in the setting of the inspection area in the image photographed by the first optical inspection camera 12.

<5-11> In addition, in the above-mentioned implementation, when determining a part of the left side EL1 and determining the other part of the left side EL1, first, determine the upper end of the left side EL1, and then determine the lower end of the left side EL1. However, the order of determining the upper end and the lower end is not limited to this. For example, when determining a part of the left side EL1 and determining the other part of the left side EL1, the lower end of the left side EL1 may be determined first, and then the upper end of the left side EL1 may be determined.

The above is an exemplary description of the implementation of the present invention. That is, the detailed description and the attached drawings are disclosed for the purpose of exemplary description. Therefore, the components described in the detailed description and the attached drawings sometimes include components that are not necessary to solve the problem. Therefore, it should not be directly determined that these non-essential components are essential just because they are described in the detailed description and the attached drawings.

Furthermore, the above-mentioned embodiments are merely illustrative of the present invention in all aspects. The above-mentioned embodiments may be variously improved or modified within the scope of the present invention. That is, when implementing the present invention, a specific configuration may be appropriately adopted according to the embodiments.

1: Cutting device 3: Substrate supply unit 4: Positioning unit 4a: Track unit 5: Cutting table 5a: Holding member 5b: Rotating mechanism 5c: Moving mechanism 5d: First position confirmation camera 5e: First cleaner 6: Main shaft unit 6a: Blade 6b: Second position confirmation camera 6c: Rotating shaft 7: Transport unit 7a: Second cleaner 11: Inspection table 11a: Inspection table body 11b: Holding member 12: First optical inspection camera 13: Second optical inspection camera 14: Arrangement unit 15: Extraction unit 15a: Tray for good products 15b: Tray for defective products 20: Monitor 50: Computer 70: Control unit 72: CPU 74: RAM 76: ROM 80: Memory unit 81: Control program 90: Input/output I/F 95: Acceptance unit A1: Cutting module B1: Inspection and storage module BA1: Ball unit EB1, IB1: Bottom EL1, IL1: Left ER1, IR1: Right ET1, IT1: Top IM1: Image capture L1: Approximate curve L2: Curve M1: Material box P1: Package substrate PO1: Differential maximum position PX1, PX1A: Pixel S1, S1A, S1B, S1C, S1D: Electronic components S100~S120,S200~S230,S300~S340,S400~S470,S500~S590,S600~S660,S700~S760,S800~S860,S900~S950,S1000~S1050: Steps T1,T1A,T1B,T1C,T1D: Inspection area T1B1,T1B2,T1B3,T1C1,T1C2,T1C3: Temporary inspection area X,Y,Z: Axes θ1: Direction

FIG. 1 is a schematic top view of a cutting device. FIG. 2 is a schematic diagram showing a situation where an electronic component is photographed using a second optical inspection camera. FIG. 3 is a schematic diagram showing the hardware configuration of a computer. FIG. 4 is a schematic diagram showing an example of a photographed image generated by a second optical inspection camera. FIG. 5 is a flowchart showing the process of appearance inspection of electronic components. FIG. 6 is a flowchart showing the process of setting the inspection area. FIG. 7 is a flowchart showing the process of setting the first inspection area. FIG. 8 is a diagram for explaining the process of determining a portion of the left side of the first electronic component in the photographed image. FIG. 9 is a diagram for explaining how the position of a specific number of pixels that are the object of the left judgment process changes. FIG. 10 is a diagram for explaining the generation of an approximate curve in the left side determination process. FIG. 11 is a diagram schematically showing a curve representing the result of differentiating the approximate curve. FIG. 12 is a diagram for explaining the process of determining the other parts of the left side. FIG. 13 is a diagram for explaining the process of determining the left side based on each pixel position corresponding to each maximum value (maximum value > first specific value) of the differential value obtained after the left side determination process. FIG. 14 is a flowchart showing the process of determining the left side in the first electronic component. FIG. 15 is a flowchart showing the process of determining the upper end and the lower end of the left side. FIG. 16 is a diagram for explaining the process of determining the right side of the first electronic component. FIG. 17 is a flowchart showing the process of determining the right side of the first electronic component. FIG. 18 is a diagram for explaining the process of determining the upper side and the lower side of the first electronic component. FIG. 19 is a flowchart showing the process of determining the upper side of the first electronic component. FIG. 20 is a flowchart showing the process of determining the lower side of the first electronic component. FIG. 21 is a diagram for explaining the process of setting another inspection area at a position after the first inspection area is moved in the row direction or column direction. FIG. 22 is a flowchart showing the process of setting another inspection area at a position after the first inspection area is moved in the row direction. FIG. 23 is a flowchart showing the process of setting another inspection area at a position after the first inspection area is moved in the column direction.

Domestic storage information (please note in the order of storage institution, date, and number) None Foreign storage information (please note in the order of storage country, institution, date, and number) None

1: Cutting device

3: Substrate supply unit

4: Positioning unit

4a: Track section

5: Cutting table

5a: Retaining components

5b: Rotating mechanism

5c: Mobile mechanism

5d: First position confirmation camera

5e: First Cleaner

6: Main shaft

6a: Blade

6b: Second location confirmation camera

6c: Rotation axis

7: Transportation Department

7a: Second cleaner

11: Inspection table

12: First optical inspection camera

13: Second optical inspection camera

14: Configuration Department

15: Extraction section

15a: Tray for good products

15b: Tray for defective products

20: Monitor

50: Computer

A1: Cutting module

B1: Inspection and storage module

M1: Material box

P1: packaging substrate

X,Y,Z: axis

θ1: direction

Claims (10)

A cutting device, which manufactures a plurality of cut products by cutting a substrate, comprises: a photographing unit, which generates a photographed image by photographing a part or all of the plurality of cut products; a first processing unit, which sets a plurality of inspection areas in the photographed image; and a second processing unit, which inspects the appearance of each cut product contained in the photographed image based on the image contained in each of the plurality of inspection areas in the photographed image; and each of the plurality of inspection areas is rectangular in shape. The shape of the cut product is a rectangle. The first processing unit performs a determination process. The determination process determines whether a part of any side of the plurality of cut products is included in the specific number of pixels, based on the pixel values of each of the specific number of pixels continuously located in the first direction in the photographed image. The specific number is less than the number of pixels of the entire photographed image. The first processing unit repeatedly moves the position of the specific number of pixels to perform the determination process to set at least a part of the plurality of inspection areas. A cutting device as described in claim 1, wherein the left side, right side, top side and bottom side of the photographed image are respectively parallel to the left side, right side, top side and bottom side of each cut product. The cutting device as described in claim 1 or 2, wherein the first processing unit repeatedly moves the position of the specific number of pixels along a second direction to perform the determination process to set at least a portion of the plurality of inspection areas, and the second direction is a direction inclined relative to the first direction. A cutting device as described in claim 1 or 2, wherein the first direction is a row direction or a column direction. A cutting device as described in claim 3, wherein the first processing unit moves the positions of the specific number of pixels along the second direction by moving the positions of the specific number of pixels by one pixel or a plurality of pixels along the row direction and by one pixel or a plurality of pixels along the column direction. The cutting device as claimed in claim 1 or 2, wherein when the first processing unit determines through the determination processing that the specific number of pixels includes a portion of the first side that is any side of the plurality of cut products, the first processing unit determines the other portion of the first side based on at least a portion of the specific number of pixels that are determined to include a portion of the first side, thereby determining the first side. The cutting device as described in claim 6, wherein the first processing unit determines the other three sides of the cut product including the first side based on the determined first side, and sets any one of the plurality of inspection areas based on the determined four sides. The cutting device as described in claim 7, wherein the first processing unit determines the second side opposite to the first side among the other three sides based on the determined first side, and then determines two sides other than the first side and the second side. A cutting device as described in claim 1 or 2, wherein the first processing unit sets other inspection areas among the plurality of inspection areas based on the inspection area that is first set among the plurality of inspection areas. A method for manufacturing a cut product, using the cutting device described in any one of claims 1 to 9, the cutting device comprising: a cutting table, which is provided with the substrate; and a cutting section, which cuts the substrate provided on the cutting table; and the manufacturing method comprises the following steps: providing the substrate on the cutting table; manufacturing the plurality of cut products by cutting the substrate provided on the cutting table; generating the photographed image by photographing a part or all of the plurality of cut products; setting the plurality of inspection areas in the photographed image; and inspecting the appearance of each cut product contained in the photographed image based on the images contained in each of the plurality of inspection areas in the photographed image.