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TWI847391B - Detection system for slimsas slot and method thereof - Google Patents

Detection system for slimsas slot and method thereof Download PDF

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TWI847391B
TWI847391B TW111145376A TW111145376A TWI847391B TW I847391 B TWI847391 B TW I847391B TW 111145376 A TW111145376 A TW 111145376A TW 111145376 A TW111145376 A TW 111145376A TW I847391 B TWI847391 B TW I847391B
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chip
pin
detection
slimsas
pins
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TW111145376A
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TW202422092A (en
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鄒凱
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英業達股份有限公司
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Abstract

A detection system for SlimSAS slot and a method thereof are provided. Detection signal is generated by detection device and detection signal is transferred to TAP controller. Detection signal is converted to detection signal in JTAG format and detection signal in JTAG format is transferred to CPLD chip and controllable power module chip of detection card and/or boundary scan chip of circuit board. SMBus pins, differential signal receiving pins, differential signal transmitting pins, CLK pins, SIDEBAND pins and GND pins of SlimSAS connection interface are detected through boundary scan chip, HCSL to LVDS module chip, IIC chip and CPLD chip. Therefore, the improve efficiency of detecting SlimSAS slot stability and detection coverage may be achieved.

Description

適用於SlimSAS插槽的檢測系統及其方法Detection system and method applicable to SlimSAS slot

一種檢測系統及其方法,尤其是指一種分別透過電路板的邊界掃描晶片以及/或是檢測卡的HCSL轉LVDS模組晶片、IIC晶片以及CPLD晶片以對SlimSAS插槽進行檢測的系統及其方法。A detection system and method thereof, in particular, refers to a system and method thereof for detecting a SlimSAS slot through a boundary scanning chip of a circuit board and/or a HCSL to LVDS module chip, an IIC chip and a CPLD chip of a detection card.

現有邊界掃描檢測用於主機板上的SlimSAS插槽時,先要定制腳位轉換的轉接卡、定制腳位轉接的連接線以及定制SlimSAS的轉接卡以透過虛擬的PCIE進行測試。When the existing border scan test is used for the SlimSAS slot on the motherboard, a custom pin conversion adapter card, a custom pin conversion cable, and a custom SlimSAS adapter card are first required to perform the test through a virtual PCIE.

現有檢測方案由於使用的檢測元件數量較多,使得檢測元件彼此之間的連接方式相對複雜造成檢測結果不穩定,並且在檢測產生異常時除錯較為耗時,除此之外,現有的檢測方案並無法提供SlimSAS插槽中CLK腳位訊號、SMBus腳位訊號以及SIDEBAND腳位訊號的檢測覆蓋,以及無法提供SlimSAS插槽差分訊號腳位短路故障異常類型的檢測覆蓋,當多個SlimSAS插槽需要進行解測時,則需要使用多個虛擬PCIE,對於虛擬PCIE的通訊進一步需要使用JTAG形成串接,更進一步使得檢測元件彼此之間的連接方式相對複雜造成檢測結果不穩定。The existing detection scheme uses a large number of detection components, which makes the connection between the detection components relatively complicated, resulting in unstable detection results, and it is time-consuming to debug when an abnormality occurs during detection. In addition, the existing detection scheme cannot provide detection coverage for the CLK pin signal, SMBus pin signal and SIDEBAND pin signal in the SlimSAS slot, and cannot provide detection coverage for the short-circuit fault abnormality type of the differential signal pin of the SlimSAS slot. When multiple SlimSAS slots need to be de-detected, multiple virtual PCIEs need to be used. For the communication of the virtual PCIE, JTAG needs to be used to form a series connection, which further makes the connection between the detection components relatively complicated, resulting in unstable detection results.

綜上所述,可知先前技術中長期以來一直存在現有邊界掃描檢測於SlimSAS插槽檢測不穩定、除錯耗時以及檢測覆蓋不全的問題,因此有必要提出改進的技術手段,來解決此一問題。In summary, it can be seen that the existing boundary scanning detection in the SlimSAS slot has long existed in the prior art, such as unstable detection, time-consuming debugging, and incomplete detection coverage. Therefore, it is necessary to propose an improved technical means to solve this problem.

有鑒於先前技術存在現有邊界掃描檢測於SlimSAS插槽檢測不穩定、除錯耗時以及檢測覆蓋不全的問題,本發明遂揭露一種適用於SlimSAS插槽的檢測系統及其方法,其中:In view of the problems of unstable detection, time-consuming debugging and incomplete detection in the prior art boundary scanning detection of SlimSAS slots, the present invention discloses a detection system and method applicable to SlimSAS slots, wherein:

本發明所揭露的適用於SlimSAS插槽的檢測系統,其包含:電路板、檢測卡、測試存取埠(Test Access Port,TAP)控制器以及檢測裝置,檢測卡更包含:SlimSAS連接介面、HCSL轉LVDS模組晶片、積體匯流排電路(Inter-Integrated Circuit,IIC)晶片、可控電源模組晶片、複雜可程式邏輯裝置(Complex Programmable Logic Device,CPLD)晶片以及聯合測試工作群組(Joint Test Action Group,JTAG)連接埠。The present invention discloses a detection system for a SlimSAS slot, which includes: a circuit board, a detection card, a test access port (TAP) controller and a detection device. The detection card further includes: a SlimSAS connection interface, an HCSL to LVDS module chip, an integrated bus circuit (Inter-Integrated Circuit, IIC) chip, a controllable power module chip, a complex programmable logic device (Complex Programmable Logic Device, CPLD) chip and a joint test action group (Joint Test Action Group, JTAG) connection port.

電路板具有至少一SlimSAS插槽以及邊界掃描晶片;The circuit board has at least one SlimSAS slot and a border scanning chip;

檢測卡的SlimSAS連接介面更包含二組系統管理匯流排(System Management Bus,SMBus)腳位、多個差分訊號接收腳位、多個差分訊號傳送腳位、二組時鐘(Clock,CLK)腳位、多個邊帶(SIDEBAND)腳位以及多個接地(GND)腳位;檢測卡的HCSL轉LVDS模組晶片與二組CLK腳位形成電性連接;檢測卡的IIC晶片與SMBus腳位形成電性連接;檢測卡的CPLD晶片分別與HCSL轉LVDS模組晶片、可控電源模組晶片、IIC晶片、SIDEBAND腳位以及GND腳位形成電性連接;及檢測卡的JTAG連接埠分別與CPLD晶片以及可控電源模組晶片形成電性連接。The SlimSAS connection interface of the test card further includes two sets of System Management Bus (SMBus) pins, multiple differential signal receiving pins, multiple differential signal transmitting pins, two sets of clock (CLK) pins, multiple sideband (SIDEBAND) pins and multiple ground (GND) pins; the HCSL to LVDS module chip of the test card is electrically connected to the two sets of CLK pins; the IIC chip of the test card is electrically connected to the SMBus pins; the CPLD chip of the test card is electrically connected to the HCSL to LVDS module chip, the controllable power module chip, the IIC chip, the SIDEBAND pins and the GND pins; and the JTAG connection port of the test card is electrically connected to the CPLD chip and the controllable power module chip.

TAP控制器與JTAG連接埠形成電性連接;及檢測裝置與TAP控制器形成電性連接。The TAP controller is electrically connected to the JTAG port; and the detection device is electrically connected to the TAP controller.

其中,檢測裝置生成檢測訊號並傳送至TAP控制器,TAP控制器將檢測訊號轉換為JTAG格式的檢測訊號再傳送至檢測卡的CPLD晶片以及可控電源模組晶片以及/或是電路板的邊界掃描晶片,透過邊界掃描晶片、HCSL轉LVDS模組晶片、IIC晶片以及CPLD晶片以對SlimSAS連接介面中SMBus腳位、差分訊號接收腳位、差分訊號傳送腳位、CLK腳位、SIDEBAND腳位以及接地腳位進行檢測。The detection device generates a detection signal and transmits it to the TAP controller. The TAP controller converts the detection signal into a detection signal in JTAG format and then transmits it to the CPLD chip and the controllable power module chip of the detection card and/or the boundary scanning chip of the circuit board. The SMBus pin, differential signal receiving pin, differential signal transmitting pin, CLK pin, SIDEBAND pin and ground pin in the SlimSAS connection interface are detected through the boundary scanning chip, HCSL to LVDS module chip, IIC chip and CPLD chip.

本發明所揭露的適用於SlimSAS插槽的檢測方法,其包含下列步驟:The detection method disclosed in the present invention is applicable to a SlimSAS slot, and comprises the following steps:

首先,電路板具有至少一SlimSAS插槽以及邊界掃描晶片;接著,檢測卡具有SlimSAS連接介面、HCSL轉LVDS模組晶片、IIC晶片、可控電源模組晶片、CPLD晶片以及JTAG連接埠;接著,SlimSAS連接介面插接於SlimSAS插槽,SlimSAS連接介面包含二組SMBus腳位、多個差分訊號接收腳位、多個差分訊號傳送腳位、二組CLK腳位、多個SIDEBAND腳位以及多個GND腳位;接著,HCSL轉LVDS模組晶片與二組CLK腳位形成電性連接;接著,IIC晶片與SMBus腳位形成電性連接;接著,CPLD晶片分別與HCSL轉LVDS模組晶片、可控電源模組晶片、IIC晶片、SIDEBAND腳位以及GND腳位形成電性連接;接著,JTAG連接埠分別與CPLD晶片以及可控電源模組晶片形成電性連接;接著,TAP控制器與JTAG連接埠形成電性連接;接著,檢測裝置與TAP控制器形成電性連接;接著,檢測裝置生成檢測訊號並傳送至TAP控制器;接著,TAP控制器將檢測訊號轉換為JTAG格式的檢測訊號再傳送至檢測卡的CPLD晶片以及可控電源模組晶片以及/或是電路板的邊界掃描晶片;最後,透過邊界掃描晶片、HCSL轉LVDS模組晶片、IIC晶片以及CPLD晶片以對SlimSAS連接介面中SMBus腳位、差分訊號接收腳位、差分訊號傳送腳位、CLK腳位、SIDEBAND腳位以及接地腳位進行檢測。First, the circuit board has at least one SlimSAS slot and a border scanning chip; then, the detection card has a SlimSAS connection interface, an HCSL to LVDS module chip, an IIC chip, a controllable power module chip, a CPLD chip and a JTAG connection port; then, the SlimSAS connection interface is plugged into the SlimSAS slot, and the SlimSAS connection interface includes two sets of SMBus pins, multiple differential signal receiving pins, multiple differential signal transmitting pins, two sets of CLK pins, multiple SIDEBAND pins and multiple GND pins; then, the HCSL to LVDS module chip is electrically connected to the two sets of CLK pins; then, the IIC chip is electrically connected to the SMBus pins; then, the CPLD chip is electrically connected to the HCSL to LVDS module chip, the controllable power module chip, the IIC chip, the SIDEBAND pins and the GND pins. The ND pin and the GND pin are electrically connected; then, the JTAG port is electrically connected to the CPLD chip and the controllable power module chip respectively; then, the TAP controller is electrically connected to the JTAG port; then, the detection device is electrically connected to the TAP controller; then, the detection device generates a detection signal and transmits it to the TAP controller; then, the TAP controller converts the detection signal into a detection signal in the JTAG format. The detection signal is then transmitted to the CPLD chip and the controllable power module chip of the detection card and/or the boundary scanning chip of the circuit board; finally, the SMBus pin, differential signal receiving pin, differential signal transmitting pin, CLK pin, SIDEBAND pin and ground pin in the SlimSAS connection interface are detected through the boundary scanning chip, HCSL to LVDS module chip, IIC chip and CPLD chip.

本發明所揭露的系統及方法如上,與先前技術之間的差異在於檢測裝置生成檢測訊號並傳送至TAP控制器,TAP控制器將檢測訊號轉換為JTAG格式的檢測訊號再傳送至檢測卡的CPLD晶片以及可控電源模組晶片以及/或是電路板的邊界掃描晶片,透過邊界掃描晶片、HCSL轉LVDS模組晶片、IIC晶片以及CPLD晶片以對SlimSAS連接介面中SMBus腳位、差分訊號接收腳位、差分訊號傳送腳位、CLK腳位、SIDEBAND腳位以及接地腳位進行檢測。The system and method disclosed in the present invention are as described above. The difference between the system and method and the prior art is that the detection device generates a detection signal and transmits it to the TAP controller. The TAP controller converts the detection signal into a detection signal in the JTAG format and then transmits it to the CPLD chip and the controllable power module chip of the detection card and/or the boundary scanning chip of the circuit board. The SMBus pin, differential signal receiving pin, differential signal transmitting pin, CLK pin, SIDEBAND pin and ground pin in the SlimSAS connection interface are detected through the boundary scanning chip, HCSL to LVDS module chip, IIC chip and CPLD chip.

透過上述的技術手段,本發明可以達成提高檢測SlimSAS插槽穩定性與檢測覆蓋性的技術功效。Through the above-mentioned technical means, the present invention can achieve the technical effect of improving the stability and coverage of the detection of SlimSAS slots.

以下將配合圖式及實施例來詳細說明本發明的實施方式,藉此對本發明如何應用技術手段來解決技術問題並達成技術功效的實現過程能充分理解並據以實施。The following will be used in conjunction with drawings and embodiments to explain the implementation of the present invention in detail, so that the implementation process of how the present invention applies technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

以下首先要說明本發明所揭露的適用於SlimSAS插槽的檢測系統,並請參考「第1圖」所示,「第1圖」繪示為本發明適用於SlimSAS插槽的檢測系統的系統方塊圖。The following first describes the detection system for SlimSAS slots disclosed in the present invention, and please refer to "FIG. 1", which is a system block diagram of the detection system for SlimSAS slots disclosed in the present invention.

本發明所揭露的適用於SlimSAS插槽的檢測系統,其包含:電路板10、檢測卡20、TAP控制器30以及檢測裝置40,檢測卡20更包含:SlimSAS連接介面21、HCSL轉LVDS模組晶片22、IIC晶片23、可控電源模組晶片24、CPLD晶片25以及JTAG連接埠26。The detection system for SlimSAS slot disclosed in the present invention comprises: a circuit board 10, a detection card 20, a TAP controller 30 and a detection device 40. The detection card 20 further comprises: a SlimSAS connection interface 21, a HCSL to LVDS module chip 22, an IIC chip 23, a controllable power module chip 24, a CPLD chip 25 and a JTAG connection port 26.

電路板10具有至少一SlimSAS插槽11以及邊界掃描晶片12,檢測卡20的SlimSAS連接介面21插接於電路板10的SlimSAS插槽11其中之一,TAP控制器30與JTAG連接埠26以及電路板10的邊界掃描晶片12形成電性連接,檢測裝置40與TAP控制器30形成電性連接。The circuit board 10 has at least one SlimSAS slot 11 and a boundary scanning chip 12. The SlimSAS connection interface 21 of the detection card 20 is plugged into one of the SlimSAS slots 11 of the circuit board 10. The TAP controller 30 is electrically connected to the JTAG connection port 26 and the boundary scanning chip 12 of the circuit board 10. The detection device 40 is electrically connected to the TAP controller 30.

請參考「第2圖」所示,「第2圖」繪示為本發明適用於SlimSAS插槽的檢測系統的檢測卡方塊圖。Please refer to "Figure 2", which shows a block diagram of the test card of the test system applicable to the SlimSAS slot of the present invention.

檢測卡20的SlimSAS連接介面21更包含二組SMBus腳位211、多個差分訊號接收腳位212、多個差分訊號傳送腳位213、二組CLK腳位214、多個SIDEBAND腳位215以及多個GND腳位216。The SlimSAS connection interface 21 of the detection card 20 further includes two sets of SMBus pins 211, a plurality of differential signal receiving pins 212, a plurality of differential signal transmitting pins 213, two sets of CLK pins 214, a plurality of SIDEBAND pins 215 and a plurality of GND pins 216.

檢測卡20的HCSL轉LVDS模組晶片22與二組CLK腳位214形成電性連接,檢測卡20的IIC晶片23與SMBus腳位211形成電性連接,檢測卡20的CPLD晶片25分別與HCSL轉LVDS模組晶片22、可控電源模組晶片24、IIC晶片23、SIDEBAND腳位215以及GND腳位216形成電性連接,以及檢測卡20的JTAG連接埠26分別與CPLD晶片25以及可控電源模組晶片24形成電性連接。The HCSL-to-LVDS module chip 22 of the test card 20 is electrically connected to the two sets of CLK pins 214, the IIC chip 23 of the test card 20 is electrically connected to the SMBus pin 211, the CPLD chip 25 of the test card 20 is electrically connected to the HCSL-to-LVDS module chip 22, the controllable power module chip 24, the IIC chip 23, the SIDEBAND pin 215 and the GND pin 216, and the JTAG connection port 26 of the test card 20 is electrically connected to the CPLD chip 25 and the controllable power module chip 24.

在進行電路板10的SlimSAS插槽11檢測時,檢測裝置40生成檢測訊號並傳送至TAP控制器30,TAP控制器30將檢測訊號轉換為JTAG格式的檢測訊號再傳送至檢測卡20的CPLD晶片25以及可控電源模組晶片24以及/或是電路板10的邊界掃描晶片12,透過邊界掃描晶片12、HCSL轉LVDS模組晶片22、IIC晶片23以及CPLD晶片25以對SlimSAS連接介面21中SMBus腳位211、差分訊號接收腳位212、差分訊號傳送腳位213、CLK腳位214、SIDEBAND腳位215以及接地腳位進行檢測。When the SlimSAS slot 11 of the circuit board 10 is detected, the detection device 40 generates a detection signal and transmits it to the TAP controller 30. The TAP controller 30 converts the detection signal into a detection signal in the JTAG format and then transmits it to the CPLD chip 25 and the controllable power module chip 24 of the detection card 20 and/or the boundary scanning chip 12 of the circuit board 10. The SMBus pin 211, the differential signal receiving pin 212, the differential signal transmitting pin 213, the CLK pin 214, the SIDEBAND pin 215 and the ground pin in the SlimSAS connection interface 21 are detected through the boundary scanning chip 12, the HCSL to LVDS module chip 22, the IIC chip 23 and the CPLD chip 25.

請參考「第3圖」所示,「第3圖」繪示為本發明適用於SlimSAS插槽的檢測的差分訊號接收腳位與差分訊號傳送腳位電性連接示意圖。Please refer to FIG. 3 , which is a schematic diagram showing the electrical connection between the differential signal receiving pins and the differential signal transmitting pins for detecting the SlimSAS slot according to the present invention.

檢測卡20的SlimSAS連接介面21中的差分訊號接收腳位212與指定的差分訊號傳送腳位213位移交錯形成電性連接,值得注意的是,差分訊號接收腳位212與差分訊號傳送腳位213是分別設置於SlimSAS連接介面21的不同面,SlimSAS連接介面21的一面稱之為A面以及SlimSAS連接介面21的另一面稱之為B面。The differential signal receiving pin 212 and the designated differential signal transmitting pin 213 in the SlimSAS connection interface 21 of the detection card 20 are shifted and staggered to form an electrical connection. It is worth noting that the differential signal receiving pin 212 and the differential signal transmitting pin 213 are respectively arranged on different sides of the SlimSAS connection interface 21, one side of the SlimSAS connection interface 21 is called the A side and the other side of the SlimSAS connection interface 21 is called the B side.

在實施例中,SlimSAS連接介面21中具有8組差分腳位,SlimSAS連接介面21中A面的2、5、14、17、20、23、32以及35為DIFF_RX_DP腳位(即差分訊號接收腳位212),SlimSAS連接介面21中A面的3、6、15、18、21、24、33以及36為DIFF_RX_DN腳位(即差分訊號接收腳位212)。In the embodiment, the SlimSAS connection interface 21 has 8 sets of differential pins, 2, 5, 14, 17, 20, 23, 32 and 35 on the A side of the SlimSAS connection interface 21 are DIFF_RX_DP pins (i.e., differential signal receiving pins 212), and 3, 6, 15, 18, 21, 24, 33 and 36 on the A side of the SlimSAS connection interface 21 are DIFF_RX_DN pins (i.e., differential signal receiving pins 212).

SlimSAS連接介面21中B面的2、5、14、17、20、23、32以及35為DIFF_TX_DP腳位(即差分訊號傳送腳位213),SlimSAS連接介面21中A面的3、6、15、18、21、24、33以及36為DIFF_TX_DN腳位(即差分訊號傳送腳位213)。Pins 2, 5, 14, 17, 20, 23, 32, and 35 on the B side of the SlimSAS connection interface 21 are DIFF_TX_DP pins (i.e., differential signal transmission pins 213), and pins 3, 6, 15, 18, 21, 24, 33, and 36 on the A side of the SlimSAS connection interface 21 are DIFF_TX_DN pins (i.e., differential signal transmission pins 213).

SlimSAS連接介面21中A面的2腳位與SlimSAS連接介面21中B面的20腳位形成電性連接,SlimSAS連接介面21中A面的3腳位與SlimSAS連接介面21中B面的21腳位形成電性連接;SlimSAS連接介面21中A面的5腳位與SlimSAS連接介面21中B面的23腳位形成電性連接,SlimSAS連接介面21中A面的6腳位與SlimSAS連接介面21中B面的24腳位形成電性連接;SlimSAS連接介面21中A面的14腳位與SlimSAS連接介面21中B面的32腳位形成電性連接,SlimSAS連接介面21中A面的15腳位與SlimSAS連接介面21中B面的33腳位形成電性連接;後續如「第3圖」所示,在此不再進行贅述。Pin 2 of the A side of the SlimSAS connection interface 21 is electrically connected to pin 20 of the B side of the SlimSAS connection interface 21, pin 3 of the A side of the SlimSAS connection interface 21 is electrically connected to pin 21 of the B side of the SlimSAS connection interface 21; pin 5 of the A side of the SlimSAS connection interface 21 is electrically connected to pin 23 of the B side of the SlimSAS connection interface 21, and the SlimSAS connection interface Pin 6 of the A side of SlimSAS connection interface 21 is electrically connected to pin 24 of the B side of SlimSAS connection interface 21; pin 14 of the A side of SlimSAS connection interface 21 is electrically connected to pin 32 of the B side of SlimSAS connection interface 21; pin 15 of the A side of SlimSAS connection interface 21 is electrically connected to pin 33 of the B side of SlimSAS connection interface 21; the subsequent steps are shown in "FIG. 3" and will not be described in detail here.

電路板10的邊界掃描晶片12自TAP控制器30接收到JTAG格式的檢測訊號是要進行差分訊號的檢測時,電路板10的邊界掃描晶片12依據JTAG格式的檢測訊號以邊界掃描方式推送至差分訊號接收腳位212(即上述SlimSAS連接介面21中A面的2、5、14、17、20、23、32以及35腳位與SlimSAS連接介面21中A面的3、6、15、18、21、24、33以及36腳位)。When the boundary scanning chip 12 of the circuit board 10 receives the detection signal in the JTAG format from the TAP controller 30 to perform differential signal detection, the boundary scanning chip 12 of the circuit board 10 pushes the detection signal in the JTAG format to the differential signal receiving pin 212 (i.e., pins 2, 5, 14, 17, 20, 23, 32 and 35 on the A side of the above-mentioned SlimSAS connection interface 21 and pins 3, 6, 15, 18, 21, 24, 33 and 36 on the A side of the SlimSAS connection interface 21) in a boundary scanning manner.

再自差分訊號傳送腳位213(即上述SlimSAS連接介面21中B面的20、23、32、35、2、5、14以及17腳位與SlimSAS連接介面21中B面的21、24、33、36、3、6、15以及18腳位)接收訊號以實現差分訊號接收腳位212與指定的差分訊號傳送腳位213的差分訊號檢測。Then, a signal is received from the differential signal transmission pin 213 (i.e., pins 20, 23, 32, 35, 2, 5, 14, and 17 on the B side of the SlimSAS connection interface 21 and pins 21, 24, 33, 36, 3, 6, 15, and 18 on the B side of the SlimSAS connection interface 21) to realize differential signal detection of the differential signal receiving pin 212 and the designated differential signal transmission pin 213.

電路板10的邊界掃描晶片12自TAP控制器30接收到JTAG格式的檢測訊號是要進行SMBus腳位的訊號檢測時,電路板10的邊界掃描晶片12依據JTAG格式的檢測訊號模擬出IIC協議的檢測訊號,再將模擬出IIC協議的檢測訊號透過SMBus腳位211發送至檢測卡20的IIC晶片23,以實現SMBus腳位的訊號檢測。When the boundary scanning chip 12 of the circuit board 10 receives the detection signal in the JTAG format from the TAP controller 30 to perform the signal detection of the SMBus pin, the boundary scanning chip 12 of the circuit board 10 simulates the detection signal of the IIC protocol according to the detection signal in the JTAG format, and then sends the simulated detection signal of the IIC protocol to the IIC chip 23 of the detection card 20 through the SMBus pin 211 to realize the signal detection of the SMBus pin.

電路板10的邊界掃描晶片12自TAP控制器30接收到JTAG格式的檢測訊號是要進行CLK腳位的訊號檢測時,電路板10的邊界掃描晶片12透過CLK腳位214以及檢測卡20的HCSL轉LVDS模組晶片22傳送HCSL訊號至檢測卡20的CPLD晶片25,以實現CLK腳位的訊號檢測。When the boundary scanning chip 12 of the circuit board 10 receives the detection signal in the JTAG format from the TAP controller 30 to perform the signal detection of the CLK pin, the boundary scanning chip 12 of the circuit board 10 transmits the HCSL signal to the CPLD chip 25 of the detection card 20 through the CLK pin 214 and the HCSL to LVDS module chip 22 of the detection card 20 to realize the signal detection of the CLK pin.

檢測卡20的CPLD晶片25自TAP控制器30接收到JTAG格式的檢測訊號是要進行SIDEBAND腳位或是GND腳位的訊號檢測時,檢測卡20的CPLD晶片25對直接電性連接的SIDEBAND腳位215以及GND腳位216進行邊界掃描檢測以實現SIDEBAND腳位以及GND腳位的訊號檢測。When the CPLD chip 25 of the test card 20 receives a JTAG format test signal from the TAP controller 30 to perform a signal test on the SIDEBAND pin or the GND pin, the CPLD chip 25 of the test card 20 performs a boundary scan test on the directly electrically connected SIDEBAND pin 215 and the GND pin 216 to implement the signal test on the SIDEBAND pin and the GND pin.

接著,以下將說明本發明的運作方法,並請同時參考「第4A圖」以及「第4B圖」所示,「第4A圖」以及「第4B圖」繪示為本發明適用於SlimSAS插槽的檢測方法的方法流程圖。Next, the operation method of the present invention will be described below, and please refer to "Figure 4A" and "Figure 4B" at the same time. "Figure 4A" and "Figure 4B" are method flow charts of the detection method of the present invention applicable to the SlimSAS slot.

本發明所揭露的適用於SlimSAS插槽的檢測方法,其包含下列步驟:The detection method disclosed in the present invention is applicable to a SlimSAS slot, and comprises the following steps:

首先,電路板具有至少一SlimSAS插槽以及邊界掃描晶片(步驟501);接著,檢測卡具有SlimSAS連接介面、HCSL轉LVDS模組晶片、IIC晶片、可控電源模組晶片、CPLD晶片以及JTAG連接埠(步驟502);接著,SlimSAS連接介面插接於SlimSAS插槽,SlimSAS連接介面包含二組SMBus腳位、多個差分訊號接收腳位、多個差分訊號傳送腳位、二組CLK腳位、多個SIDEBAND腳位以及多個GND腳位(步驟503);接著,HCSL轉LVDS模組晶片與二組CLK腳位形成電性連接(步驟504);接著,IIC晶片與SMBus腳位形成電性連接(步驟505);接著,CPLD晶片分別與HCSL轉LVDS模組晶片、可控電源模組晶片、IIC晶片、SIDEBAND腳位以及GND腳位形成電性連接(步驟506);接著,JTAG連接埠分別與CPLD晶片以及可控電源模組晶片形成電性連接(步驟507);接著,TAP控制器與JTAG連接埠形成電性連接(步驟508);接著,檢測裝置與TAP控制器形成電性連接;接著,檢測裝置生成檢測訊號並傳送至TAP控制器(步驟509);接著,TAP控制器將檢測訊號轉換為JTAG格式的檢測訊號再傳送至檢測卡的CPLD晶片以及可控電源模組晶片以及/或是電路板的邊界掃描晶片(步驟510);最後,透過邊界掃描晶片、HCSL轉LVDS模組晶片、IIC晶片以及CPLD晶片以對SlimSAS連接介面中SMBus腳位、差分訊號接收腳位、差分訊號傳送腳位、CLK腳位、SIDEBAND腳位以及接地腳位進行檢測(步驟511)。First, the circuit board has at least one SlimSAS slot and a border scanning chip (step 501); then, the detection card has a SlimSAS connection interface, an HCSL to LVDS module chip, an IIC chip, a controllable power module chip, a CPLD chip and a JTAG connection port (step 502); then, the SlimSAS connection interface is plugged into the SlimSAS slot, and the SlimSAS connection interface includes two sets of SMBus pins, a plurality of differential signal receiving pins, and a plurality of differential signal receiving pins. bits, multiple differential signal transmission pins, two sets of CLK pins, multiple SIDEBAND pins and multiple GND pins (step 503); then, the HCSL to LVDS module chip is electrically connected to the two sets of CLK pins (step 504); then, the IIC chip is electrically connected to the SMBus pins (step 505); then, the CPLD chip is electrically connected to the HCSL to LVDS module chip, the controllable power module chip, the IIC chip, the SIDEBAND pins, and the GND pins. The JTAG port is electrically connected to the CPLD chip and the controllable power module chip (step 507); the TAP controller is electrically connected to the JTAG port (step 508); the detection device is electrically connected to the TAP controller; the detection device generates a detection signal and transmits it to the TAP controller (step 509); the TAP controller converts the detection signal into a JTAG signal. The detection signal in G format is then transmitted to the CPLD chip and the controllable power module chip of the detection card and/or the boundary scanning chip of the circuit board (step 510); finally, the SMBus pin, differential signal receiving pin, differential signal transmitting pin, CLK pin, SIDEBAND pin and ground pin in the SlimSAS connection interface are detected through the boundary scanning chip, HCSL to LVDS module chip, IIC chip and CPLD chip (step 511).

綜上所述,可知本發明與先前技術之間的差異在於檢測裝置生成檢測訊號並傳送至TAP控制器,TAP控制器將檢測訊號轉換為JTAG格式的檢測訊號再傳送至檢測卡的CPLD晶片以及可控電源模組晶片以及/或是電路板的邊界掃描晶片,透過邊界掃描晶片、HCSL轉LVDS模組晶片、IIC晶片以及CPLD晶片以對SlimSAS連接介面中SMBus腳位、差分訊號接收腳位、差分訊號傳送腳位、CLK腳位、SIDEBAND腳位以及接地腳位進行檢測。In summary, the difference between the present invention and the prior art is that the detection device generates a detection signal and transmits it to the TAP controller, and the TAP controller converts the detection signal into a detection signal in the JTAG format and then transmits it to the CPLD chip and the controllable power module chip of the detection card and/or the boundary scanning chip of the circuit board. The SMBus pin, differential signal receiving pin, differential signal transmitting pin, CLK pin, SIDEBAND pin and ground pin in the SlimSAS connection interface are detected through the boundary scanning chip, HCSL to LVDS module chip, IIC chip and CPLD chip.

藉由此一技術手段可以來解決先前技術所存在現有邊界掃描檢測於SlimSAS插槽檢測不穩定、除錯耗時以及檢測覆蓋不全的問題,進而達成提高檢測SlimSAS插槽穩定性與檢測覆蓋性的技術功效。This technical means can solve the problems of unstable detection, time-consuming debugging and incomplete detection coverage of the existing boundary scanning detection in the SlimSAS slot in the previous technology, thereby achieving the technical effect of improving the stability and detection coverage of the SlimSAS slot.

雖然本發明所揭露的實施方式如上,惟所述的內容並非用以直接限定本發明的專利保護範圍。任何本發明所屬技術領域中具有通常知識者,在不脫離本發明所揭露的精神和範圍的前提下,可以在實施的形式上及細節上作些許的更動。本發明的專利保護範圍,仍須以所附的申請專利範圍所界定者為準。Although the implementation methods disclosed in the present invention are as above, the above contents are not used to directly limit the scope of patent protection of the present invention. Any person with ordinary knowledge in the technical field to which the present invention belongs can make slight changes in the form and details of implementation without departing from the spirit and scope disclosed in the present invention. The scope of patent protection of the present invention shall still be defined by the scope of the attached patent application.

10:電路板 11:SlimSAS插槽 12:邊界掃描晶片 20:檢測卡 21:SlimSAS連接介面 211:SMBus腳位 212:差分訊號接收腳位 213:差分訊號傳送腳位 214:CLK腳位 215:SIDEBAND腳位 216:GND腳位 22:HCSL轉LVDS模組晶片 23:IIC晶片 24:可控電源模組晶片 25:CPLD晶片 26:JTAG連接埠 30:TAP控制器 40:檢測裝置 步驟 501:電路板具有至少一SlimSAS插槽以及邊界掃描晶片 步驟 502:檢測卡具有SlimSAS連接介面、HCSL轉LVDS模組晶片、IIC晶片、可控電源模組晶片、CPLD晶片以及JTAG連接埠 步驟 503:SlimSAS連接介面插接於SlimSAS插槽,SlimSAS連接介面包含二組SMBus腳位、多個差分訊號接收腳位、多個差分訊號傳送腳位、二組CLK腳位、多個SIDEBAND腳位以及多個GND腳位 步驟 504:HCSL轉LVDS模組晶片與二組CLK腳位形成電性連接 步驟 505:IIC晶片與SMBus腳位形成電性連接 步驟 506:CPLD晶片分別與HCSL轉LVDS模組晶片、可控電源模組晶片、IIC晶片、SIDEBAND腳位以及GND腳位形成電性連接 步驟 507:JTAG連接埠分別與CPLD晶片以及可控電源模組晶片形成電性連接 步驟 508:TAP控制器與JTAG連接埠形成電性連接 步驟 509:檢測裝置與TAP控制器形成電性連接;接著,檢測裝置生成檢測訊號並傳送至TAP控制器 步驟 510:TAP控制器將檢測訊號轉換為JTAG格式的檢測訊號再傳送至檢測卡的CPLD晶片以及可控電源模組晶片以及/或是電路板的邊界掃描晶片 步驟 511:透過邊界掃描晶片、HCSL轉LVDS模組晶片、IIC晶片以及CPLD晶片以對SlimSAS連接介面中SMBus腳位、差分訊號接收腳位、差分訊號傳送腳位、CLK腳位、SIDEBAND腳位以及接地腳位進行檢測 10: Circuit board 11: SlimSAS slot 12: Boundary scanning chip 20: Detection card 21: SlimSAS connection interface 211: SMBus pin 212: Differential signal receiving pin 213: Differential signal transmitting pin 214: CLK pin 215: SIDEBAND pin 216: GND pin 22: HCSL to LVDS module chip 23: IIC chip 24: Controllable power module chip 25: CPLD chip 26: JTAG port 30: TAP controller 40: Detection device Step 501: The circuit board has at least one SlimSAS slot and a boundary scanning chip Step 502: The test card has a SlimSAS connection interface, a HCSL to LVDS module chip, an IIC chip, a controllable power module chip, a CPLD chip, and a JTAG connection port. Step 503: The SlimSAS connection interface is plugged into the SlimSAS slot. The SlimSAS connection interface includes two sets of SMBus pins, multiple differential signal receiving pins, multiple differential signal transmitting pins, two sets of CLK pins, multiple SIDEBAND pins, and multiple GND pins. Step 504: The HCSL to LVDS module chip is electrically connected to the two sets of CLK pins. Step 505: The IIC chip is electrically connected to the SMBus pins. Step 506: The CPLD chip is electrically connected to the HCSL to LVDS module chip, the controllable power module chip, the IIC chip, the SIDEBAND pin and the GND pin respectively. Step 507: The JTAG port is electrically connected to the CPLD chip and the controllable power module chip respectively. Step 508: The TAP controller is electrically connected to the JTAG port. Step 509: The detection device is electrically connected to the TAP controller; then, the detection device generates a detection signal and transmits it to the TAP controller. Step 510: The TAP controller converts the detection signal into a detection signal in the JTAG format and transmits it to the CPLD chip and the controllable power module chip of the detection card and/or the boundary scanning chip of the circuit board. Step 511: Use boundary scanning chip, HCSL to LVDS module chip, IIC chip and CPLD chip to detect SMBus pin, differential signal receiving pin, differential signal transmitting pin, CLK pin, SIDEBAND pin and ground pin in SlimSAS connection interface

第1圖繪示為本發明適用於SlimSAS插槽的檢測系統的系統方塊圖。 第2圖繪示為本發明適用於SlimSAS插槽的檢測系統的檢測卡方塊圖。 第3圖繪示為本發明適用於SlimSAS插槽的檢測的差分訊號接收腳位與差分訊號傳送腳位電性連接示意圖。 第4A圖以及第4B圖繪示為本發明適用於SlimSAS插槽的檢測方法的方法流程圖。 FIG. 1 is a system block diagram of the detection system for SlimSAS slots of the present invention. FIG. 2 is a block diagram of the detection card of the detection system for SlimSAS slots of the present invention. FIG. 3 is a schematic diagram of the electrical connection between the differential signal receiving pin and the differential signal transmitting pin for detection of SlimSAS slots of the present invention. FIG. 4A and FIG. 4B are method flow charts of the detection method for SlimSAS slots of the present invention.

10:電路板 11:SlimSAS插槽 12:邊界掃描晶片 20:檢測卡 21:SlimSAS連接介面 22:HCSL轉LVDS模組晶片 23:IIC晶片 24:可控電源模組晶片 25:CPLD晶片 26:JTAG連接埠 30:TAP控制器 40:檢測裝置 10: Circuit board 11: SlimSAS slot 12: Boundary scanning chip 20: Test card 21: SlimSAS connection interface 22: HCSL to LVDS module chip 23: IIC chip 24: Controllable power module chip 25: CPLD chip 26: JTAG port 30: TAP controller 40: Test device

Claims (10)

一種適用於SlimSAS插槽的檢測系統,其包含: 一電路板,具有至少一SlimSAS插槽以及一邊界掃描晶片; 一檢測卡,所述檢測卡更包含: 一SlimSAS連接介面,所述SlimSAS連接介面更包含二組系統管理匯流排(System Management Bus,SMBus)腳位、多個差分訊號接收腳位、多個差分訊號傳送腳位、二組時鐘(Clock,CLK)腳位、多個邊帶(SIDEBAND)腳位以及多個接地(GND)腳位; 一HCSL轉LVDS模組晶片,與所述二組CLK腳位形成電性連接; 一積體匯流排電路(Inter-Integrated Circuit,IIC)晶片,與所述SMBus腳位形成電性連接; 一可控電源模組晶片; 一複雜可程式邏輯裝置(Complex Programmable Logic Device,CPLD)晶片,分別與所述HCSL轉LVDS模組晶片、所述可控電源模組晶片、所述IIC晶片、所述SIDEBAND腳位以及所述GND腳位形成電性連接;及 一聯合測試工作群組(Joint Test Action Group,JTAG)連接埠,分別與所述CPLD晶片以及所述可控電源模組晶片形成電性連接; 一測試存取埠(Test Access Port,TAP)控制器,與所述JTAG連接埠形成電性連接;及 一檢測裝置,與所述TAP控制器形成電性連接; 其中,所述檢測裝置生成一檢測訊號並傳送至所述TAP控制器,所述TAP控制器將所述檢測訊號轉換為JTAG格式的所述檢測訊號再傳送至所述檢測卡的所述CPLD晶片以及所述可控電源模組晶片以及/或是所述電路板的所述邊界掃描晶片,透過所述邊界掃描晶片、所述HCSL轉LVDS模組晶片、所述IIC晶片以及所述CPLD晶片以對所述SlimSAS連接介面中所述SMBus腳位、所述差分訊號接收腳位、所述差分訊號傳送腳位、所述CLK腳位、所述SIDEBAND腳位以及所述接地腳位進行檢測。 A detection system suitable for a SlimSAS slot, comprising: A circuit board having at least one SlimSAS slot and a boundary scanning chip; A detection card, the detection card further comprising: A SlimSAS connection interface, the SlimSAS connection interface further comprising two sets of system management bus (SMBus) pins, a plurality of differential signal receiving pins, a plurality of differential signal transmitting pins, two sets of clock (CLK) pins, a plurality of sideband (SIDEBAND) pins and a plurality of ground (GND) pins; An HCSL to LVDS module chip, electrically connected to the two sets of CLK pins; An inter-integrated circuit (IIC) chip, electrically connected to the SMBus pins; A controllable power module chip; A complex programmable logic device (CPLD) chip, electrically connected to the HCSL to LVDS module chip, the controllable power module chip, the IIC chip, the SIDEBAND pin and the GND pin; and A joint test action group (JTAG) connection port, electrically connected to the CPLD chip and the controllable power module chip; A test access port (TAP) controller, electrically connected to the JTAG connection port; and A detection device, electrically connected to the TAP controller; The detection device generates a detection signal and transmits it to the TAP controller. The TAP controller converts the detection signal into the detection signal in JTAG format and transmits it to the CPLD chip of the detection card and the controllable power module chip and/or the boundary scanning chip of the circuit board. The boundary scanning chip, the HCSL to LVDS module chip, the IIC chip and the CPLD chip are used to detect the SMBus pin, the differential signal receiving pin, the differential signal transmitting pin, the CLK pin, the SIDEBAND pin and the ground pin in the SlimSAS connection interface. 如請求項1所述的適用於SlimSAS插槽的檢測系統,其中所述差分訊號接收腳位與指定的所述差分訊號傳送腳位位移交錯形成電性連接,所述電路板的所述邊界掃描晶片依據JTAG格式的所述檢測訊號進行的邊界掃描檢測以實現所述差分訊號接收腳位與指定的所述差分訊號傳送腳位的差分訊號檢測。A detection system suitable for a SlimSAS slot as described in claim 1, wherein the differential signal receiving pins and the designated differential signal transmitting pins are shifted and staggered to form an electrical connection, and the boundary scanning chip of the circuit board performs boundary scanning detection based on the detection signal in the JTAG format to realize differential signal detection of the differential signal receiving pins and the designated differential signal transmitting pins. 如請求項1所述的適用於SlimSAS插槽的檢測系統,其中所述邊界掃描晶片依據JTAG格式的所述檢測訊號模擬出IIC協議的所述檢測訊號,將模擬出IIC協議的所述檢測訊號透過所述SMBus腳位發送至所述IIC晶片,以實現所述SMBus腳位的訊號檢測。A detection system suitable for a SlimSAS slot as described in claim 1, wherein the boundary scanning chip simulates the detection signal of the IIC protocol according to the detection signal in the JTAG format, and sends the simulated detection signal of the IIC protocol to the IIC chip through the SMBus pin to realize signal detection of the SMBus pin. 如請求項1所述的適用於SlimSAS插槽的檢測系統,其中所述邊界掃描晶片透過所述CLK腳位以及所述HCSL轉LVDS模組晶片傳送HCSL訊號至所述CPLD晶片,以實現所述CLK腳位的訊號檢測。A detection system suitable for a SlimSAS slot as described in claim 1, wherein the boundary scanning chip transmits the HCSL signal to the CPLD chip via the CLK pin and the HCSL to LVDS module chip to implement signal detection of the CLK pin. 如請求項1所述的適用於SlimSAS插槽的檢測系統,其中所述CPLD晶片對直接電性連接的所述SIDEBAND腳位以及所述GND腳位進行邊界掃描檢測以實現所述SIDEBAND腳位以及所述GND腳位的訊號檢測。A detection system suitable for a SlimSAS slot as described in claim 1, wherein the CPLD chip performs boundary scanning detection on the SIDEBAND pin and the GND pin that are directly electrically connected to realize signal detection of the SIDEBAND pin and the GND pin. 一種適用於SlimSAS插槽的檢測方法,其包含下列步驟: 一電路板具有至少一SlimSAS插槽以及一邊界掃描晶片; 一檢測卡具有一SlimSAS連接介面、一HCSL轉LVDS模組晶片、一IIC晶片、一可控電源模組晶片、一CPLD晶片以及一JTAG連接埠; 所述SlimSAS連接介面插接於所述SlimSAS插槽,所述SlimSAS連接介面包含二組SMBus腳位、多個差分訊號接收腳位、多個差分訊號傳送腳位、二組CLK腳位、多個SIDEBAND腳位以及多個GND腳位; 所述HCSL轉LVDS模組晶片與所述二組CLK腳位形成電性連接; 所述IIC晶片與所述SMBus腳位形成電性連接; 所述CPLD晶片分別與所述HCSL轉LVDS模組晶片、所述可控電源模組晶片、所述IIC晶片、所述SIDEBAND腳位以及所述GND腳位形成電性連接; 所述JTAG連接埠分別與所述CPLD晶片以及所述可控電源模組晶片形成電性連接; 一TAP控制器與所述JTAG連接埠形成電性連接; 一檢測裝置與所述TAP控制器形成電性連接; 所述檢測裝置生成一檢測訊號並傳送至所述TAP控制器; 所述TAP控制器將所述檢測訊號轉換為JTAG格式的所述檢測訊號再傳送至所述檢測卡的所述CPLD晶片以及所述可控電源模組晶片以及/或是所述電路板的所述邊界掃描晶片;及 透過所述邊界掃描晶片、所述HCSL轉LVDS模組晶片、所述IIC晶片以及所述CPLD晶片以對所述SlimSAS連接介面中所述SMBus腳位、所述差分訊號接收腳位、所述差分訊號傳送腳位、所述CLK腳位、所述SIDEBAND腳位以及所述接地腳位進行檢測。 A detection method for a SlimSAS slot comprises the following steps: A circuit board has at least one SlimSAS slot and a boundary scanning chip; A detection card has a SlimSAS connection interface, a HCSL to LVDS module chip, an IIC chip, a controllable power module chip, a CPLD chip and a JTAG connection port; The SlimSAS connection interface is plugged into the SlimSAS slot, and the SlimSAS connection interface comprises two sets of SMBus pins, a plurality of differential signal receiving pins, a plurality of differential signal transmitting pins, two sets of CLK pins, a plurality of SIDEBAND pins and a plurality of GND pins; The HCSL to LVDS module chip is electrically connected to the two sets of CLK pins; The IIC chip is electrically connected to the SMBus pins; The CPLD chip is electrically connected to the HCSL to LVDS module chip, the controllable power module chip, the IIC chip, the SIDEBAND pin and the GND pin respectively; The JTAG port is electrically connected to the CPLD chip and the controllable power module chip respectively; A TAP controller is electrically connected to the JTAG port; A detection device is electrically connected to the TAP controller; The detection device generates a detection signal and transmits it to the TAP controller; The TAP controller converts the detection signal into the detection signal in JTAG format and then transmits it to the CPLD chip and the controllable power module chip of the detection card and/or the boundary scanning chip of the circuit board; and The SMBus pin, the differential signal receiving pin, the differential signal transmitting pin, the CLK pin, the SIDEBAND pin and the ground pin in the SlimSAS connection interface are detected through the boundary scanning chip, the HCSL to LVDS module chip, the IIC chip and the CPLD chip. 如請求項6所述的適用於SlimSAS插槽的檢測方法,其中所述透過所述邊界掃描晶片、所述HCSL轉LVDS模組晶片、所述IIC晶片以及所述CPLD晶片以對所述SlimSAS連接介面中所述SMBus腳位、所述差分訊號接收腳位、所述差分訊號傳送腳位、所述CLK腳位、所述SIDEBAND腳位以及所述接地腳位進行檢測的步驟中,所述差分訊號接收腳位與指定的所述差分訊號傳送腳位位移交錯形成電性連接,所述電路板的所述邊界掃描晶片依據JTAG格式的所述檢測訊號進行的邊界掃描檢測以實現所述差分訊號接收腳位與指定的所述差分訊號傳送腳位的差分訊號檢測。A detection method applicable to a SlimSAS slot as described in claim 6, wherein in the step of detecting the SMBus pin, the differential signal receiving pin, the differential signal transmitting pin, the CLK pin, the SIDEBAND pin and the ground pin in the SlimSAS connection interface through the boundary scanning chip, the HCSL to LVDS module chip, the IIC chip and the CPLD chip, the differential signal receiving pin and the designated differential signal transmitting pin are shifted and staggered to form an electrical connection, and the boundary scanning chip of the circuit board performs boundary scanning detection based on the detection signal in the JTAG format to realize differential signal detection of the differential signal receiving pin and the designated differential signal transmitting pin. 如請求項6所述的適用於SlimSAS插槽的檢測方法,其中所述透過所述邊界掃描晶片、所述HCSL轉LVDS模組晶片、所述IIC晶片以及所述CPLD晶片以對所述SlimSAS連接介面中所述SMBus腳位、所述差分訊號接收腳位、所述差分訊號傳送腳位、所述CLK腳位、所述SIDEBAND腳位以及所述接地腳位進行檢測的步驟中,所述邊界掃描晶片依據JTAG格式的所述檢測訊號模擬出IIC協議的所述檢測訊號,將模擬出IIC協議的所述檢測訊號透過所述SMBus腳位發送至所述IIC晶片,以實現所述SMBus腳位的訊號檢測。As described in claim 6, the detection method applicable to the SlimSAS slot, wherein in the step of detecting the SMBus pin, the differential signal receiving pin, the differential signal transmitting pin, the CLK pin, the SIDEBAND pin and the ground pin in the SlimSAS connection interface through the boundary scanning chip, the HCSL to LVDS module chip, the IIC chip and the CPLD chip, the boundary scanning chip simulates the detection signal of the IIC protocol according to the detection signal in the JTAG format, and sends the simulated IIC protocol detection signal to the IIC chip through the SMBus pin to realize the signal detection of the SMBus pin. 如請求項6所述的適用於SlimSAS插槽的檢測方法,其中所述透過所述邊界掃描晶片、所述HCSL轉LVDS模組晶片、所述IIC晶片以及所述CPLD晶片以對所述SlimSAS連接介面中所述SMBus腳位、所述差分訊號接收腳位、所述差分訊號傳送腳位、所述CLK腳位、所述SIDEBAND腳位以及所述接地腳位進行檢測的步驟中,所述邊界掃描晶片透過所述CLK腳位以及所述HCSL轉LVDS模組晶片傳送HCSL訊號至所述CPLD晶片,以實現所述CLK腳位的訊號檢測。As described in claim 6, the detection method applicable to the SlimSAS slot, wherein in the step of detecting the SMBus pin, the differential signal receiving pin, the differential signal transmitting pin, the CLK pin, the SIDEBAND pin and the ground pin in the SlimSAS connection interface through the boundary scanning chip, the HCSL to LVDS module chip, the IIC chip and the CPLD chip, the boundary scanning chip transmits the HCSL signal to the CPLD chip through the CLK pin and the HCSL to LVDS module chip to realize the signal detection of the CLK pin. 如請求項6所述的適用於SlimSAS插槽的檢測方法,其中所述透過所述邊界掃描晶片、所述HCSL轉LVDS模組晶片、所述IIC晶片以及所述CPLD晶片以對所述SlimSAS連接介面中所述SMBus腳位、所述差分訊號接收腳位、所述差分訊號傳送腳位、所述CLK腳位、所述SIDEBAND腳位以及所述接地腳位進行檢測的步驟中,所述CPLD晶片對直接電性連接的所述SIDEBAND腳位以及所述GND腳位進行邊界掃描檢測以實現所述SIDEBAND腳位以及所述GND腳位的訊號檢測。As described in claim 6, the detection method applicable to the SlimSAS slot, wherein in the step of detecting the SMBus pin, the differential signal receiving pin, the differential signal transmitting pin, the CLK pin, the SIDEBAND pin and the ground pin in the SlimSAS connection interface through the boundary scanning chip, the HCSL to LVDS module chip, the IIC chip and the CPLD chip, the CPLD chip performs boundary scanning detection on the SIDEBAND pin and the GND pin that are directly electrically connected to realize signal detection of the SIDEBAND pin and the GND pin.
TW111145376A 2022-11-28 2022-11-28 Detection system for slimsas slot and method thereof TWI847391B (en)

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