TWI844321B - Substrate processing equipment - Google Patents

Abstract

The present invention provides a substrate processing device, which can ensure the safety of operators during maintenance and suppress the overall size of the device, thereby improving productivity. The device of the present invention includes: a plurality of carriers (10A, 10B), which are arranged adjacent to each other and respectively hold substrates (W); units (20B, 20C), which are arranged opposite to the carriers (10A, 10B), move relative to the substrates (W), and process the terminals (P) of the substrates (W); and a first shielding plate (30), which moves following the unit (20B (20C)) arranged opposite to the carrier (10A (10B)) and shields the unit (20C (20B)) arranged opposite to the adjacent carrier (10B (10A)).

Description

Substrate processing equipment

The present invention relates to a substrate processing device.

In the manufacturing process of display panels such as liquid crystal panels or organic electroluminescence (EL) panels, there is a step of assembling chip-shaped electronic components such as driver integrated circuits (ICs) for driving the substrate, or film-shaped electronic components called chip on film (COF) equipped with driver ICs on the substrate of the display panel. Prior to the above step, an anisotropic conductive member called anisotropic conductive film (ACF) is attached to the terminals of the substrate in order to bond the terminals of the substrate with the terminals of the electronic components. That is, the driver IC or COF is assembled on the substrate via the ACF.

ACF is a film-like component with many small conductive particles added to the thermosetting resin as the base material, and is supplied in the form of a tape-shaped component (hereinafter also referred to as ACF tape) attached to a release tape and attached to the terminals of the substrate. This ACF is pre-cut according to the size of the driver IC or COF, and when the release tape is pulled away from the substrate after being attached to the terminals of the substrate, the ACF attached to the terminals of the substrate is separated from the ACF tape by the slits.

As a substrate processing device for attaching ACF to the terminals of a substrate, for example, the device disclosed in Patent Document 1 is known. The substrate processing device disclosed in Patent Document 1 realizes improved productivity by arranging units for attaching ACF to a substrate adjacent to each other and attaching ACF to different terminals of a substrate simultaneously and in parallel. In addition, Patent Document 1 also discloses a large-scale substrate processing device in which such substrate processing devices are arranged adjacent to each other, and ACF is attached to a plurality of substrates simultaneously and in parallel. [Prior Art Document] [Patent Document]

[Patent Document 1] International Publication No. 2011/001692

[Problem to be solved by the invention] Compared with two substrate processing devices configured separately, this large substrate processing device can be made compact and reduce the footprint by omitting the common parts of the device. However, since the units in the device are close to each other, when replacing the ACF tape or performing maintenance work, the entire device has to be stopped in order for the operator to perform the work safely, and there is a problem of reduced productivity. In addition, this problem exists not only in substrate processing devices including a unit for attaching ACF to the terminals of the substrate, but also in substrate processing devices including a unit for cleaning the terminals of the substrate.

The purpose of the present invention is to provide a substrate processing device that can ensure the safety of operators during maintenance and suppress the overall size of the device, thereby improving productivity. [Technical means for solving the problem]

The substrate processing device of the present invention comprises: a plurality of carriers, which are arranged adjacent to each other and hold substrates respectively; a plurality of units, which are arranged corresponding to each of the carriers, move relative to the substrates held on the carriers, and process the terminals of the substrates; and a first shielding plate, which moves following the units and shields the units arranged corresponding to the adjacent carriers. [Effects of the invention]

The present invention can ensure the safety of operators during maintenance and suppress the enlargement of the entire device, thereby improving productivity.

The embodiment of the present invention (hereinafter referred to as the present embodiment) will be described in detail with reference to the accompanying drawings. In addition, the accompanying drawings schematically show each component and each structural part, and do not accurately show their size or interval, etc.

[Structure] The structure of the substrate processing device 1 of the present embodiment is described with reference to FIGS. 1 to 11. As shown in FIG. 1, the substrate processing device 1 includes: a plurality of carriers 10, which are arranged adjacent to each other and respectively hold a plurality of substrates W; a plurality of units 20, which are respectively arranged opposite to the carriers 10 and process the terminals P of the substrates W; a first shielding plate 30, which is arranged in a part of the unit 20; and a second shielding plate 40, which is arranged between the carrier 10 and the unit 20. In addition, as shown in FIG. 11, the substrate processing device 1 includes a control unit 80 for controlling these structures.

The substrate W is a substrate of a display panel such as a liquid crystal panel or an organic EL panel, and is roughly rectangular in shape. A plurality of terminal groups including a plurality of terminals, namely terminals P, are arranged on one side of the substrate W. In the present embodiment, four terminals P are arranged at intervals, as shown in FIG. 2 , and the ACF 100 is attached to the terminals P through the unit 20 described later. The ACF 100 is a strip-shaped component in which many small conductive particles are added to a resin serving as a base material, and is attached to the terminals P. That is, four terminals P are arranged on one side of each substrate W, and the ACF 100 is attached to each terminal P through the unit 20.

The carrier 10 is a roughly rectangular platform for holding the substrate W. In the present embodiment, two carriers 10 are arranged adjacent to each other, and each carrier 10 arranges and holds two substrates W. The direction in which the two carriers 10 are arranged is the same as the direction in which the two substrates W are arranged, and this direction is referred to as the X direction below. Therefore, the substrate W is held on the carrier 10 in a manner in which the terminals P of the substrate W are arranged along the X direction. In addition, in the plane on which the substrate W is placed on the carrier 10, the direction perpendicular to the X direction is referred to as the Y direction, and the direction perpendicular to the X direction and the Y direction is referred to as the Z direction. This is represented in FIG. 1, in the viewing direction of the figure, the left-right direction is the X direction, the up-down direction is the Y direction, and the front-to-back direction of the paper is the Z direction. In addition, in FIG. 1, the lower side viewed in the figure (one side of the carrier 10) is referred to as the "front", and the upper side viewed in the figure (one side of the unit 20) is referred to as the "back". 1, the left stage 10 is referred to as stage 10A, and the right stage 10 is referred to as stage 10B. Furthermore, the stage 10 has a moving mechanism (not shown) and can move in the XY direction, and can move in and out from under the unit 20 during the bonding operation described later.

The unit 20 is a device that is disposed opposite to the stage 10 in the Y direction and processes the terminal P of the substrate W. The unit 20 of this embodiment is a pasting unit that pastes the ACF 100 on the terminal P of the substrate W as a process. Two units 20 of this embodiment are provided for each stage 10, and are arranged along the X direction opposite to the substrate W held by each stage 10 in the Y direction. Specifically, each unit 20 is disposed opposite to one side of the substrate W where the terminal P is arranged.

The unit 20 disposed opposite to the stage 10A is referred to as the unit 20A and the unit 20B in order from the left side in Fig. 1. In addition, the unit 20 disposed opposite to the stage 10B is referred to as the unit 20C and the unit 20D in order from the left side in Fig. 1. That is, in the present embodiment, the unit 20B and the unit 20C correspond to the positions where the stage 10A and the stage 10B are adjacent to each other and are disposed adjacent to each other.

Thus, in this embodiment, two units 20 are arranged for one stage 10, and the two units 20 are used to process the substrate W held on the stage 10. The stage 10 and the units 20 that process the same substrate W correspond to each other. That is, in the above content, the unit 20A and the unit 20B correspond to the stage 10A. In addition, the unit 20C and the unit 20D correspond to the stage 10B.

As shown in FIGS. 3 to 5 , the unit 20 of the present embodiment includes a supply unit 21, a cutting unit 22, a pasting unit 23, a peeling unit 24, a conveying unit 25, and a collecting unit 26, and is configured to be able to independently move in the X direction through a moving mechanism such as a guide mechanism that uses a motor as a driving source (not shown) to move the object. In addition, the supply unit 21, the cutting unit 22, the peeling unit 24, the conveying unit 25, and the collecting unit 26 are arranged across the pasting unit 23. This unit 20 cuts the ACF 100 supplied from the supply unit 21 as a strip-shaped member T described later by the cutting unit 22, and adheres the ACF 100 to the terminal P of the substrate W by the pasting unit 23. At this time, the release tape R described later is peeled off from the ACF 100 by the peeling section 24, and the release tape R after being attached to the ACF 100 is recovered to the recovery section 26. In addition, the belt-shaped member T is transported by the conveying section 25. In addition, as shown in Figures 3 and 8 to 10, the unit 20 exceeds the width of the substrate W in the X direction according to the position of the terminal P set on the substrate W. When the terminal P is at the left end of the substrate W, the portion of the area A of the unit 20 shown in (A) of Figure 8 will extend from the left end of the substrate W. That is, as in the unit 20C of Figure 9, the area A of the unit 20 will extend to the area of the adjacent stage 10A. In (B) of Figure 8, B represents the area of the unit 20 that extends when the terminal P is at the right end of the substrate W. That is, as in the unit 20B of FIG. 10 , the region B of the unit 20 extends into the region of the adjacent stage 10B.

The attachment section 23 is provided on one side of the carrier 10 at the front side of the unit 20. At the rear side of the unit 20, on the side opposite to the carrier side without the attachment section 23 (the area M side in FIGS. 4 and 5 ), the supply of the strip member T used in the attachment section 23, the collection of the release tape R as the used strip member T, and various maintenance can be performed (hereinafter, the rear side of the unit 20 and the area M side in FIGS. 4 and 5 are also referred to as the side for loading and unloading).

The tape-shaped member T is a member in which an adhesive tape S including the ACF 100 is attached to a release tape R. The release tape R is a tape that can be peeled from the adhesive tape S and is formed of a resin film such as polyimide. The width of the tape-shaped member T of the present embodiment is about 0.5 mm to 3.5 mm.

The supply unit 21 supplies the tape-shaped member T to the attaching unit 23. The supply unit 21 includes a supply reel 211, a tension mechanism 212, and a path roller 213.

The supply reel 211 is a reel that winds up the strip-shaped member T and delivers the strip-shaped member T by rotating. As shown in FIG4 , the supply reel 211 is disposed at the inner rear side of the unit 20, and is disposed in the order of the attachment portion 23 and the supply reel 211 in the Y direction from the stage side toward the loading and unloading side. The shaft of the unillustrated supporting member of the unit 20 is engaged with the center of the supply reel 211 and is rotatable. Furthermore, the shaft is disposed in a manner that the shaft faces the X direction side of the unit 20. Therefore, the supply reel 211 is installed in a manner that the rotating surface of the supply reel 211 faces the X direction side. That is, the supply reel 211 is rotatably and detachably mounted on the unit 20 with its rotation surface standing in the vertical direction (Z direction). Then, when the belt member T is replaced or maintained, the supply reel 211 is removed from the side for attachment and detachment (the area M side in FIG. 4 ).

Regarding the supply reel 211, in the unit 20B shown in Figure 4, in order to easily identify the supporting structure of the supply reel 211 from the side where the supply reel 211 is loaded and unloaded (the area M side in Figure 4), and also, in order to easily load and unload the supply reel 211, the mounting surface of the supply reel 211 (the circular surface, the rotation surface of the supply reel 211) is tilted toward the side where the supply reel 211 is loaded and unloaded, for example, it is installed so that the surface is rotated 15° relative to the Y direction and is tilted toward the rear side of the unit 20B. In order to make the substrate processing apparatus 1 compact, it is most preferable to make the mounting surface of the supply reel 211 form 0° with respect to the Y direction. However, if this is done, it is difficult to identify the mounting position of the supply reel 211 from the side where the supply reel 211 is loaded and unloaded, and the supply reel 211 becomes difficult to load and unload. Furthermore, as in the unit 20C shown in FIG. 5 , by arranging the first shielding plate 30 described later on the side of the supply reel 211, the space in the X direction becomes smaller, and therefore it is more difficult to identify the mounting position of the supply reel 211, and it becomes difficult to load and unload. Therefore, by tilting the mounting surface of the supply reel 211 toward the side on which the supply reel 211 is attached and detached, even if the first shielding plate 30 described later is provided, the supply reel 211 can be easily attached and detached.

The tensioning mechanism 212 applies tension to the strip-like member T. As shown in FIG3 , the tensioning mechanism 212 is a pair of rollers arranged at a distance up and down in such a manner as to guide the movement of the strip-like member T pulled out from the supply reel 211. One of the rollers is a fixed roller 212a that does not move up and down, and the other roller is a movable roller 212b that can move up and down. The movable roller 212b moves up and down by a lifting mechanism not shown in the figure. That is, it moves in the direction of the black arrow in the figure. The path roller 213 is a roller that changes the moving direction of the strip-like member T from the tensioning mechanism 212 and sends the strip-like member T toward the attachment portion 23.

The cutting section 22 cuts the adhesive tape S in the tape-shaped member T. Hereinafter, the operation of cutting only the adhesive tape S is referred to as half-cutting, and the cut formed in the adhesive tape S by the cutting section 22 is referred to as a half-cut line HC. The half-cut line HC is formed at intervals corresponding to the size of the terminal P. Therefore, the adhesive tape S (ACF 100) is cut into a length corresponding to the size of the terminal P.

The cutting section 22 is disposed between the tensioning mechanism 212 and the path roller 213, and includes a cutter 221 and a supporting member 222. The cutter 221 is a member that cuts the adhesive tape S in the width direction. That is, the blade at the front end of the cutter 221 extends in the width direction of the strip-shaped member T. In addition, the blade at the front end of the cutter 221 contacts/separates from the adhesive tape S through a moving mechanism not shown. As described above, the cutter 221 forms a half-cut line HC on the adhesive tape S of the strip-shaped member T supplied by the supply section 21 according to the size of the terminal P. The supporting member 222 is a block in a roughly rectangular shape. The supporting member 222 has a flat surface 222a that sandwiches the strip-shaped member T between the cutter 221 and the cutter 221 and is in contact with the demolding tape R.

The attaching section 23 is disposed on the downstream side of the path roller 213, and attaches the adhesive tape S in the strip-shaped member T to the terminal P provided on the substrate W held on the stage 10. The substrate W is positioned below the attaching section 23 through the stage 10 that enters and exits below the attaching section 23. The attaching section 23 has a press head 231. The press head 231 is moved up and down by an unillustrated lifting device, thereby pressing the strip-shaped member T and attaching the adhesive tape S to the terminal P provided on the substrate W. The press head 231 is provided with an unillustrated heater, and the contact surface with the strip-shaped member T is heated to a predetermined temperature. Furthermore, the buffer member 231a is supplied to the contact surface with the strip-shaped member T in the press head 231 by an unillustrated supply mechanism. The buffer member 231a is, for example, a sheet formed of an elastic body, and prevents the adhesive tape S softened by heat from adhering to the pressure head 231.

The peeling section 24 is provided on the downstream side of the attachment section 23, and peels the release tape R from the adhesive tape S attached to the terminal P of the substrate W. The peeling section 24 has a peeling rod 241 and a peeling rod 242. The peeling rod 241 and the peeling rod 242 are, for example, round rods provided in a manner extending in the Y direction, and are members in contact with the release tape R. The peeling rod 241 is in contact with the surface of the release tape R, that is, the surface on the adhesive tape S side, and the peeling rod 242 is in contact with the back side of the release tape R. The stripping rods 241 and 242 are horizontally moved toward the upstream side (in the direction of the dotted arrow) of the tape-shaped member T while sandwiching the release tape R by a moving mechanism (not shown), thereby stripping the release tape R from the adhesive tape S attached to the terminal P of the substrate W.

The conveying section 25 delivers the strip-shaped member T from the supply section 21 to the recovery reel 261 of the recovery section 26 via the attachment section 23. The conveying section 25 has a conveying roller 251 and a conveying motor (not shown). The conveying roller 251 clamps the release tape R with a pair of rollers, and moves the strip-shaped member T from the supply section 21 side to the recovery section 26 side by the rotation of the rollers. The conveying motor is a driving source for rotating the conveying roller 251. The rotating shaft of the conveying motor is connected to the conveying roller 251, and the rotating shaft rotates around the shaft by the drive of the motor, thereby rotating the conveying roller 251 around the rotating shaft.

The recovery unit 26 is provided on the downstream side of the peeling unit 24 , and recovers the release tape R peeled off from the adhesive tape S attached to the terminal P of the substrate W. The recovery unit 26 includes a recovery reel 261 and a path roller 262 .

The recovery reel 261 is a reel for winding and recovering the demoulding tape R. As shown in FIG4 , it is arranged at the inner rear side of the unit 20, from the stage side toward the loading and unloading side, in the order of the attachment portion 23 and the recovery reel 261 in the Y direction. The shaft of the unillustrated supporting member of the unit 20 is engaged with the center of the recovery reel 261 and is rotatable. Furthermore, the shaft is arranged in a manner that the shaft faces the X direction side of the unit 20. Therefore, the recovery reel 261 is installed in a manner that the rotating surface of the recovery reel 261 faces the X direction side. That is, the recovery reel 261 can be rotatably and detachably mounted on the unit 20 with its rotation surface standing in the up-down direction (Z direction). Then, when the belt member T is replaced or other maintenance is performed, the recovery reel 261 is removed from the side for attachment and detachment (the area M side in FIG. 4 ).

Regarding the recovery reel 261, in the unit 20B shown in Figure 4, similarly to the supply reel 211, in order to easily identify the supporting structure of the recovery reel 261 from the side where the recovery reel 261 is loaded and unloaded (the area M side in Figure 4), and further, in order to easily load and unload the recovery reel 261, the mounting surface of the recovery reel 261 (the circular surface, the rotation surface of the recovery reel 261) is tilted toward the side where the recovery reel 261 is loaded and unloaded, for example, it is installed so that the surface is rotated 15° relative to the Y direction and is tilted toward the rear side of the unit 20B. In order to make the substrate processing device 1 compact, it is most preferred that the mounting surface of the recovery reel 261 is 0° with respect to the Y direction. However, if this is done, it is difficult to identify the mounting position of the recovery reel 261 from the side where the recovery reel 261 is loaded and unloaded, and the recovery reel 261 becomes difficult to load and unload. Furthermore, as shown in FIG4 , by arranging the first shielding plate 30 described later on the side of the recovery reel 261, the space in the X direction becomes less, so it is more difficult to identify the mounting position of the recovery reel 261, and it becomes difficult to load and unload. Therefore, by tilting the mounting surface of the recovery reel 261 toward the side where the recovery reel 261 is loaded and unloaded, even if the first shielding plate 30 described later is provided, it becomes a structure that makes it easy to load and unload the recovery reel 261.

The path roller 262 is a roller that changes the moving direction of the release tape R from the attachment portion 23 side and sends the release tape R toward the recovery reel 261. In addition, the path roller 262 is provided between the stripping portion 24 and the conveying portion 25.

4 and 5, a maintenance area M is provided on the side where the supply reel 211 and the recovery reel 261 of the unit 20 are loaded and unloaded. That is, the area M is provided at the rear of the unit 20 and is used by the operator to perform maintenance work on the unit 20, such as loading and unloading the supply reel 211 and the recovery reel 261.

The first shielding plate 30 is a plate-shaped member extending in a direction parallel to the YZ plane orthogonal to the moving direction (X direction) of the unit 20. The first shielding plate 30 of the present embodiment includes a transparent member such as an acrylic plate or a polycarbonate plate. The first shielding plate 30 shields the adjacent units 20 during maintenance operations to ensure the safety of the operators in the maintenance operations. Therefore, the first shielding plate 30 has a size and strength sufficient to prevent interference such as contact between the operating unit 20 and the operator. Specifically, it is set to a size that covers at least the side of the unit 20 (refer to Figure 7).

As shown in Fig. 4 and Fig. 5, the first shielding plate 30 is attached to the shielding plate holding portion 27 provided on the side of the unit 20. For example, as shown in Fig. 6, the lower side of the first shielding plate 30 is held by the shielding plate holding portion 27. Therefore, the first shielding plate 30 moves following the unit 20.

The so-called side of the unit 20 on which the first shielding plate 30 is installed is the adjacent side of each unit 20 of the multiple units 20 corresponding to each stage 10, which is arranged on the adjacent side of each stage 10. For example, it is the adjacent side of each unit 20B and the unit 20C. Specifically, one of the first shielding plates 30 is arranged on the right side of the unit 20B in the X direction (the stage 10B side of the unit 20B) among the unit 20A and the unit 20B corresponding to the stage 10A, and the other first shielding plate 30 is arranged on the left side of the unit 20C in the X direction (the stage 10A side of the unit 20C) among the unit 20C and the unit 20D corresponding to the stage 10B. That is, they are respectively provided at the opposing positions of the unit 20A and the unit 20B.

As shown in FIG. 1 , the second shielding plate 40 is a plate-shaped member extending in a direction parallel to an XZ plane parallel to the moving direction (X direction) of the unit 20. The second shielding plate 40 of the present embodiment includes, for example, a transparent member such as an acrylic plate or a polycarbonate plate. The second shielding plate 40 is disposed between the carrier 10 and the unit 20. In the present embodiment, the space between the carrier 10 and the unit 20 mentioned here refers to the space between the carrier 10 and the unit 20 when viewed from above in a state where the carrier 10 and the unit 20 are separated from each other (initial state) before the substrate W held on the carrier 10 enters directly below the attachment portion of the unit 20 for processing. Therefore, even when the stage 10 and the unit 20 overlap in a plan view for processing, the second shielding plate 40 is provided between the stage 10 and the unit 20 in the initial state.

The second shielding plate 40 is, for example, a shielding plate that opens and closes in the Z direction. When the unit 20 performs ACF bonding on the substrate W held on the stage 10, the second shielding plate 40 is opened, and the substrate W can enter the bonding part of the unit 20. When the operator performs maintenance work on the unit 20, the second shielding plate 40 is closed to ensure the safety of the operator. Therefore, in this case, the stage 10 and the unit 20 are in an initial state. In order to ensure the safety of the operator, the second shielding plate 40 has a size and strength sufficient to prevent interference such as contact between the stage 10 and the operator. If the dustproof effect described later is also considered, it is preferably set to a size that covers the length of the stage 10 in the X direction (refer to Figure 1). Furthermore, in order to prevent the stage or the substrate held on the stage from entering the attachment area, the second shielding plate 40 is set to a size that shields the movable portion of the stage 10 when closed.

As described above, the second shielding plate 40 is disposed along the X direction of the substrate processing apparatus 1. Therefore, it is a cover orthogonal to the first shielding plate 30 and is disposed at a predetermined interval in the Y direction so as not to hinder the movement of the unit 20 and the first shielding plate 30 in the X direction. The second shielding plate 40 includes two components, namely, a fixed cover 410 and a baffle 420.

The fixed cover 410 is disposed between the stage 10 and the unit 20, and is a plate-like component (the length of the stage) that is orthogonal to the stage 10 and extends from the top surface of the device in the XZ direction. The fixed cover 410 is disposed with a gap with the unit 20 in the Y direction so as not to hinder the operation of the unit 20. In addition, the gap between the fixed cover 410 and the stage 10 in the Z direction is set so that when the stage 10 moves, it will not interfere with the substrate W located on the stage 10 even when the ACF is attached. That is, it is sufficient as long as it is set to a height that does not interfere when the substrate W enters directly under the pressure head. In addition, the lower end of the fixed cover 410 has a bent portion that extends toward the side of the unit 20 by a specified length.

The baffle 420 is located between the stage 10 and the unit 20 and closer to the unit 20 than the fixed cover 410, similarly to the fixed cover 410, and is plate-shaped and extends in the XZ direction in a manner corresponding to the fixed cover 410. The baffle 420 is supported by a lifting drive (not shown) provided on the side of the stage on which the stage 10 and the unit 20 are placed, and can be lifted and lowered in the Z direction. In addition, the lifting and lowering of the baffle 420 can also be set manually, but it is ideal to be linked to the maintenance mode. The length of the baffle 420 in the X direction is the length corresponding to the stage. In addition, as shown in (A) and (B) of Figure 6, the baffle 420 can be lowered to allow the stage 10 and the substrate W to enter under the pressure head 231. On the contrary, as shown in FIG. 7 , by raising the baffle plate 420, the stage 10 is prevented from intruding under the pressure head 231. In addition, the vertical lifting range of the baffle plate 420 may be, for example, the height at which the uppermost end of the baffle plate 420 contacts the lower end of the fixed cover 410 as the upper limit and the height at which no interference occurs with the stage 10 as the lower limit, or may be set to a lifting range other than this. In addition, in the present embodiment, the baffle plate 420 and the fixed cover 410 are offset in the Y direction. In this case, the uppermost end of the baffle plate 420 does not need to be the height at which the uppermost end contacts the lower end of the fixed cover 410 as the upper limit, and may overlap when viewed from the front. In addition, in order to eliminate the gap caused by the offset in the Y direction, the lower end (bend portion) of the fixed cover 410 can be provided on the fixed cover 410, and the bend portion can be extended to a specified length toward the side of the carrier with respect to the upper end of the baffle 420. The bend portion can also be provided on both the fixed cover and the baffle instead of on only one of them.

The control unit 80 is a device for controlling the unit 20. The control unit 80 includes, for example, a dedicated electronic circuit or a computer running a predetermined program. The control unit 80 programs the control contents of each unit, and a processing device such as a programmable logic controller (PLC) or a central processing unit (CPU) executes the program.

As shown in FIG. 11 , the control unit 80 includes a mechanism control unit 81, a storage unit 82, and an input/output control unit 83. The mechanism control unit 81 controls the movement of the stage 10 and the unit 20. In particular, in the present embodiment, the control is performed in a non-contact manner with the unit 20A, the unit 20B, the unit 20C, and the unit 20D. The storage unit 82 stores information required for the control of the present embodiment, such as programs and data for realizing the movement of the stage 10 and the unit 20. The input/output control unit 83 is an interface for controlling the conversion of signals or input/output between the various parts that become the controlled objects.

Furthermore, the control unit 80 is connected to an input device 91 and an output device 92. The input device 91 is an input component such as a switch, a touch panel, a keyboard, a mouse, etc., which allows an operator to operate the electronic component assembly device via the control unit 80. The output device 92 is an output component such as a display device that sets information for confirming the state of the electronic component assembly device in a state that the operator can visually recognize.

[Function] The function of the substrate processing device 1 described above is explained with reference to the flowchart of FIG12. As a premise, as shown in FIG1, two substrates W are held on the stage 10A and the stage 10B respectively, and units 20A and 20B are provided at positions facing the substrates W held on the stage 10A corresponding to the stage 10A, and units 20C and 20D are provided at positions facing the substrates W held on the stage 10B corresponding to the stage 10B.

First, each unit 20 is positioned at the terminal P at the end of the terminals P provided on the corresponding substrate W, for example, the terminal P at the leftmost end in FIG. 2 (step S01). Specifically, the attachment portion 23 of each unit 20 is positioned above the terminal P at the leftmost end. That is, the attachment portion 23 of each unit 20A, unit 20B, unit 20C, and unit 20D is positioned above the terminal P at the leftmost end of the corresponding substrate W. In addition, the positioning is achieved, for example, by moving the stage 10 holding the substrate W in and out from under the attachment portion 23 of the unit 20, or by moving the unit 20 along the X direction.

At this time, in the attaching section 23, as shown in FIG3, the tape member T is positioned so that the half-cut line HC provided on the adhesive tape S is aligned with both ends of the terminal P. In this state, the pressing head 231 of the attaching section 23 is lowered to press the tape member T from the side of the release tape R, so that the half-cut adhesive tape S is attached to the terminal P provided on the substrate W (step S02).

After the adhesive tape S is attached, the pressure head 231 is raised, and the stripping rods 241 and 242 are moved horizontally toward the upstream side of the strip-shaped member T, thereby stripping the release tape R from the adhesive tape S attached to the terminal P (step S03). In this way, the adhesive tape S, that is, the ACF 100, is attached to the terminal P provided on the substrate W.

After the ACF 100 is attached to the terminal P at the leftmost end of the substrate W, each unit 20 moves along the X direction and is positioned at the adjacent terminal P (step S04). Thereafter, the steps S02 to S04 are repeated until the ACF 100 is attached to all the terminals P provided on the substrate W (step S05 of NO). Then, after the ACF 100 is attached to the terminal P at the rightmost end of the substrate W, that is, after the ACF 100 is attached to all the terminals P provided on the substrate W (step S05 of YES), each stage 10 moves along the Y direction, retreats from the bottom of the attachment portion 23 to the recovery position of the substrate W, and each unit 20 moves along the X direction and is positioned at the terminal P provided on the leftmost end of the substrate W. The substrate W with the ACF 100 attached is collected from each stage 10, and two substrates W without the ACF 100 attached are newly held on each stage 10. That is, the substrate W is replaced in each stage 10 (step S06). Hereinafter, in any of the units 20, the steps S01 to S06 are repeatedly performed until the strip-shaped member T wound around the supply reel 211 disappears (No in step S07).

When a maintenance operation such as the disappearance of the belt-shaped member T wound around the supply reel 211 is required in any of the units 20 (Yes in step S07), the attaching operation of the unit 20 and the unit 20 corresponding to the same stage 10 is stopped (step S08). Here, it is assumed that the belt-shaped member T disappears in the unit 20B, and the attaching operation of the unit 20B and the attaching operation of the unit 20A corresponding to the stage 10A in the same manner as the unit 20B are stopped. At this time, the units 20C and 20D continue to perform the attaching operation.

Next, the unit 20A and the unit 20B that have stopped the attaching operation retreat in the X direction by leaving the stage 10B (step S09), and the stage 10A moves in the Y direction to move the substrate W back from under the attaching portion 23. For example, as shown in FIG. 13 , the unit 20A and the unit 20B retreat by moving to the leftmost side in the X direction where they can move.

In this way, the unit 20A and the unit 20B retreat close to the leftmost side of the substrate processing device 1 in a manner that does not hinder the attachment operation of the unit 20C and the unit 20D. In addition, when the maintenance work of the unit 20C and the unit 20D is performed, the unit 20C and the unit 20D retreat close to the rightmost side of the substrate processing device 1 in a manner that does not hinder the attachment operation of the unit 20A and the unit 20B. The position where the retreat is performed is the maintenance position, and the maintenance position is the rightmost or leftmost side of the device. For example, the unit 20A and the unit 20B become the leftmost side of the substrate processing device 1, and the unit 20C and the unit 20D become the rightmost side of the substrate processing device 1.

The operator performs maintenance work on the unit 20A and the unit 20B on the leftmost side of the substrate processing device 1 (step S10). The baffle 420 automatically rises and falls in conjunction with the switch to the maintenance mode, and the unit 20 is separated from the stage 10 by the fixed cover 410 and the baffle 420. By bringing the unit 20 to the maintenance position in this way, the operator can work on the side of the device while the unit is surrounded by the first shielding plate 30 and the second shielding plate 40.

The following is an explanation of the replacement operation of a new supply reel as a specific example of the maintenance operation. The operator removes the supply reel 211 from which the strip-like component T has disappeared and the recovery reel 261 from which the release tape R has been recovered from the unit 20B. Furthermore, the operator installs the supply reel 211 on which the strip-like component T is wound and the empty recovery reel 261 in the unit 20B. Then, the operator sets the strip-like component T pulled out from the supply reel 211 on the tensioning mechanism 212, the path roller 213, the cutting section 22, the attaching section 23, the stripping section 24, the conveying section 25, the path roller 262, and installs it on the recovery reel 261. Thus, the maintenance operation of the unit 20B is completed. In addition, the maintenance operation of the unit 20A may be performed in parallel with the maintenance operation of the unit 20B. After the maintenance operation is completed, for example, by returning to the step S01, the attachment operation of the unit 20A and the unit 20B may be restarted.

[Effects] (1) The substrate processing device 1 of the present embodiment includes: a plurality of carriers 10A and 10B, which are arranged adjacent to each other and hold substrates W respectively; a plurality of units 20, which are arranged corresponding to the carriers 10A and 10B, respectively, move relative to the held substrates W, and process the terminals P of the substrates W; and a first shielding plate 30, which moves following the unit 20B (20C) arranged corresponding to the carrier 10A (10B), and shields the unit 20C (20B) arranged corresponding to the adjacent carrier 10B (10A). In addition, the units 20B and 20C are attachment units for attaching the ACF 100 to the terminals P of the substrate W.

In existing substrate processing devices, when performing ACF tape replacement or maintenance work, the entire device needs to be stopped to ensure the safety of operators. On the other hand, there is a problem of reduced productivity due to the stop of the entire device. Therefore, in order not to reduce productivity, it is considered to stop only one of the adjacent substrate processing devices and continue to operate the other. In this case, for the safety of operators, it is considered to set a shielding plate in the substrate processing device to shield the areas of both.

Therefore, when a shielding plate is to be installed between adjacent substrate processing devices, a space is required around the shielding plate for each unit to move without hindrance, which results in an increase in the size of the entire device. Thus, if a shielding plate is installed to improve productivity and ensure operator safety, the problem of an increase in the size of the entire device occurs.

Therefore, in the substrate processing apparatus 1 of the present embodiment, since the first shielding plate 30 provided in the unit 20 shields the adjacent unit 20, the maintenance work of the unit 20 as the maintenance object can be safely performed without being affected by the movement of the adjacent unit 20. Furthermore, since the first shielding plate 30 moves following the unit 20, the space for installing the shielding plate can be saved compared to the case where the shielding plate is fixedly provided between the unit 20B and the unit 20C between the adjacent stages 10.

(2) The attaching unit includes: a supply reel 211 for supplying the ACF attached to the release tape to the substrate W; and a recovery reel 261 for recovering the release tape R, wherein the supply reel 211 is arranged to be inclined relative to the first shielding plate 30 so that the mounting surface of the supply reel 211 faces the side on which the supply reel 211 is loaded and unloaded from the attaching unit. Thus, the mounting position of the supply reel 211 is exposed on the side on which the supply reel 211 is loaded and unloaded, and a space in the X direction can be ensured between the supply reel 211 and the first shielding plate 30, so that the operator can easily remove the supply reel 211 and can easily install the supply reel 211.

(3) The attaching unit includes: a supply reel 211 for supplying the ACF attached to the release tape to the substrate W; and a recovery reel 261 for recovering the release tape R, wherein the recovery reel 261 is provided at an angle relative to the first shielding plate 30 so that the mounting surface of the recovery reel 261 faces the side where the recovery reel 261 is loaded and unloaded from the attaching unit. Thus, the mounting position of the recovery reel 261 is exposed on the side where the recovery reel 261 is loaded and unloaded, and a space in the X direction can be ensured between the recovery reel 261 and the first shielding plate 30, so that the operator can easily remove the recovery reel 261 and can easily install the recovery reel 261.

(4) The first shielding plate 30 of the present embodiment is provided in the unit 20B and the unit 20C. Therefore, there is no need to separately provide a moving mechanism for moving the first shielding plate 30 in accordance with the unit 20B and the unit 20C, thereby simplifying the structure of the substrate processing apparatus 1.

(5) The first shielding plate 30 and the second shielding plate 40 of the present embodiment include transparent components. Thus, the lighting from the periphery of the substrate processing apparatus 1 is not blocked, and thus it is not necessary to provide new lighting for maintenance work. In addition, since the status of the unit 20 or the stage 10 is easy to grasp, the work can be performed more safely.

(6) By forming the second shielding plate 40 by the fixed cover 410 and the baffle plate 420, the unit side where dust, debris, and fine dust mist (hereinafter referred to as garbage) are easily generated during the operation of the device is separated from the stage side, thereby preventing the garbage from being attached to the substrate W, and preventing and reducing the garbage from entering the stage 10 side from the unit 20 side even during maintenance. In addition, it is also possible to create air flow by utilizing the air pressure difference between the unit 20 and the stage 10 side, thereby further achieving the prevention and reduction of garbage. Furthermore, it has the function of a protective baffle for preventing the stage from moving to the unit 20 side due to erroneous operation during maintenance, thereby ensuring the safety of the operator.

[Variation] The stage 10A and the stage 10B of the embodiment respectively hold two substrates W, but they may respectively hold one substrate W. In this case, two units 20 may be provided for each substrate W, or two units 20 may be provided for each substrate W, for a total of four units 20. In the case where two units 20 are provided for one substrate W, for example, one of the units 20 may attach the ACF 100 to the terminal P provided on the left half of the substrate W, and the other unit 20 may attach the ACF 100 to the terminal P provided on the right half of the substrate W.

The stage 10 of the embodiment is provided with two stages 10A and 10B, but the present invention is not limited thereto. For example, as shown in FIG14 , three stages 10A, 10B, and 10C may be provided. In FIG14 , in a substrate processing apparatus 2 having the same structure as the substrate processing apparatus 1, a stage 10C is provided between the two stages 10 of the structure of the embodiment, and a first shielding plate 30 is provided in the unit 20E and the unit 20F provided corresponding to the stage 10C. In this case, when the maintenance work of the unit 20A and the unit 20B corresponding to the stage 10A is performed, since the stage 10B and the stage 10C are in operation, the unit 20A and the unit 20B are moved to the leftmost side in the X direction in which the substrate processing apparatus 2 can move and retreat, as in the above-mentioned embodiment. In addition, when the maintenance work of the unit 20C and the unit 20D corresponding to the stage 10B is performed, since the stage 10A and the stage 10C are in operation, the unit 20C and the unit 20D are moved to the rightmost side in the X direction in which the substrate processing apparatus 2 can move and retreat, as in the above-mentioned embodiment. When the maintenance work of the unit 20E and the unit 20F corresponding to the stage 10C is performed, since the stage 10A and the stage 10B are in operation, the unit 20E and the unit 20F move to the center of the stage 10C. At this time, since the first shielding plate 30 provided in the unit 20E is provided on the side of the stage 10A in operation, and the first shielding plate 30 provided in the unit 20F is provided on the side of the stage 10B in operation, the maintenance work of the unit 20E and the unit 20F can be performed safely. In addition, in FIG. 14, for the convenience of explanation, the substrate W is omitted from the illustration. In this way, a plurality of stages equivalent to the stage 10C can also be provided between the stages 10A and the stages 10B.

15, in a substrate processing apparatus 3 having the same structure as the substrate processing apparatus 1, only one stage 10 may be provided. In this case, by dividing one stage into two areas AA and BB, one stage 10 can virtually function as two stages 10A and 10B.

In addition to the contents shown in the substrate processing apparatus 1 to the substrate processing apparatus 3, various combinations of the plurality of stages 10 and the plurality of units 20 and the number of substrates held on the stages 10 can be performed. In any case, it is sufficient to provide the first shielding plate 30 in the unit 20 for maintenance so that the unit 20 that continues to operate adjacent to the unit 20 that stops operating and performs maintenance can be shielded.

The first shielding plate 30 or the second shielding plate 40 of the embodiment includes a transparent component, but may also include an opaque component. Thus, the movable unit will not enter the operator's field of vision, so the operator can work safely without being surprised by the normal movement of the stage 10 or the unit 20.

In addition, the first shielding plate 30 or the second shielding plate 40 is not limited to a resin member such as acrylic or polycarbonate, and may be a metal member such as aluminum or stainless steel. As long as it has a strength that can protect the operator. In addition, it may be a member with an opening such as a net or a perforated plate. Such a member with an opening can be made lightweight and is suitable for following the movement of the unit 20. Furthermore, since it is breathable, the wind that is raised when the shielding plate moves can be suppressed, thereby suppressing the dispersion of particles. In addition, the air resistance that becomes a load of movement can also be reduced.

The second shielding plate 40 of the embodiment is not necessarily required. When performing maintenance such as reel replacement, the unit 20 grouped with the unit 20 is also stopped. In addition, the stage 10 corresponding to the unit 20 is also stopped. Furthermore, the area M where the operator is located is separated from the stage 10 by the unit 20, so the stage does not come into direct contact with the operator. Therefore, the second shielding plate 40 may not be provided.

However, by providing the second shielding plate 40 of the above-described embodiment, particles generated by maintenance can be prevented from scattering toward the substrate W.

In addition, the second shielding plate 40 may also be a fixed plate that does not open or close. The structure can be simplified. In addition, in this case, the second shielding plate 40 may not be fixedly arranged on the substrate processing device 1, but may be mounted on the front surface of the unit 20. In this way, particles generated by maintenance can be prevented from scattering to the substrate W. In addition, if the second shielding plate 40 is fixed to the substrate processing device 1, the quality of the moving drive of the unit 20 can be reduced, so it is easy to ensure the accuracy or speed of movement during processing.

The second shielding plate 40 of the embodiment includes two components, namely, a fixed cover 410 and a baffle 420. The baffle 420 is arranged on the side of the platform, or on the side of the fixed cover. In either case, the effect of ensuring safety and vibration prevention can be obtained in the same manner. By placing the baffle 420 on the fixed cover arranged on the upper part, the baffle 420 itself can be maintained, and in particular, it can be easily opened and closed manually.

The second shielding plate 40 of the embodiment includes two components, namely a fixed cover 410 and a baffle 420, but is not limited thereto. As long as it can prevent the stage 10 from entering the area where the operation is performed, for example, it can be only the baffle 420. Therefore, the baffle 420 can also be set on the top side instead of the stage side. In addition, by being set on the stage side, particles accompanying the opening and closing action of the baffle are less likely to reach the surface of the substrate W. By setting the baffle 420 on the top side, for example, it can be shared by multiple adjacent stages 10. As a result, the number of baffles 420 can be reduced, thereby reducing the cost of the device. Here, the so-called shared means that the baffle 420 can be moved between the platforms 10 on the top surface through a slider, and can be moved to the side of the platform 10 where maintenance is performed to avoid dangers or prevent dust accompanying the maintenance.

The second shielding plate 40 of the embodiment can be opened and closed manually or by a control mechanism not shown. In addition, the second shielding plate 40 can also open the area for the unit 20 to attach the ACF 100 to the terminal P of the substrate W held on the stage 10, thereby not only ensuring the safety of the operator but also preventing dust generated by the unit 20 from being attached to the substrate W.

The control mechanism of the second shielding plate 40, for example, automatically closes the baffle 420 of the second shielding plate 40 when the operator sets the device to the maintenance mode, and opens the baffle 420 of the second shielding plate 40 when the maintenance mode is canceled. Regarding the setting change to the maintenance mode, a switch button or switch to the maintenance mode can be set in the device, and the setting change can also be made from an input device connected to the device. In addition, the operator can detect the opening and closing of the maintenance door (door on the side of the area M) of the device, and the opening and closing action of the baffle 420 of the second shielding plate 40 can be performed in conjunction with it.

The first shielding plate 30 of the embodiment is provided at the unit 20, but the present invention is not limited thereto. For example, as shown in FIG. 16 , a moving mechanism N that moves following the unit 20 may be provided at the first shielding plate 30, and the first shielding plate 30 may be moved by the moving mechanism. In this case, the moving mechanism N may be provided at the top side of the substrate processing apparatus 1. Thus, the moving mechanism N can be provided without being restricted by the arrangement of the moving mechanisms of the plurality of units 20.

Alternatively, the first shielding plate 30 may be manually set by the operator. In this case, in the embodiment, the operator may selectively set the first shielding plate 30 at two locations: when the units 20A and 20B are close to the leftmost side of the substrate processing apparatus 1 and retreat, and when the units 20C and 20D are close to the rightmost side of the substrate processing apparatus 1 and retreat. Thus, the operator can safely perform maintenance work, as in the embodiment. In addition, the first shielding plate 30 may be set at the shielding plate holding portion 27 of the unit 20, or may be set at the substrate processing apparatus itself, as in the embodiment.

The unit 20 of the embodiment includes a supply unit 21, a cutting unit 22, a bonding unit 23, a peeling unit 24, a conveying unit 25, and a collecting unit 26, but is not limited thereto. The unit 20 only needs to include at least the bonding unit 23, and the other structures, namely the supply unit 21, the cutting unit 22, the peeling unit 24, the conveying unit 25, and the collecting unit 26, can be different from the unit 20.

In the above-described embodiment, the adhesive tape S is provided with a half-cut line HC as a slit by the cutting portion 22, but the present invention is not limited thereto. The adhesive tape S may be provided with a slit in advance according to the size of the terminal P. In addition, the adhesive tape S does not necessarily need to be provided with a slit, and for example, the adhesive tape S may be provided with numerous fine holes over the entire surface, and the adhesive tape may be torn by the peeling portion 24 with the end of the substrate W as the boundary line.

The substrate processing device 1 of the embodiment has been described as a device for attaching the ACF 100 to the terminal P of the substrate W, but the same structure may also be used as a device for cleaning the terminal P of the substrate W, for example. Before attaching the ACF 100 to the terminal P of the substrate W, the terminal P of the substrate W is sometimes cleaned. In this case, the unit 20 for processing the terminal P of the substrate W is a cleaning unit for cleaning the terminal P of the substrate W. A cleaning tape not shown is wound around the cleaning unit as a tape-shaped member T instead of the ACF 100 as the tape-shaped member T. In addition, a cleaning liquid may be supplied to the cleaning tape to enhance the cleaning force. Thus, the cleaning unit can clean the terminal P of the substrate W. Of course, as shown in FIG. 4 and FIG. 5 , the cleaning supply reel or the cleaning recovery reel of the cleaning tape may be tilted toward the side where the cleaning supply reel or the cleaning recovery reel is loaded and unloaded, for example, 15° relative to the Y direction. Therefore, in addition to the mounting platform for attachment, the substrate processing device 1 may also be provided with a mounting platform for cleaning. In addition, the substrate processing device 1 may also be used for cleaning.

The reels (supply reel, recovery reel) of the unit 20 of the embodiment are tilted toward the rear side of the unit 20. An example of the tilt is 15°. The tilt angle can be appropriately determined to be the best angle based on, for example, the interval between the unit 20 and the shielding plate, the diameter and width of the reels, the distance to the area M where the operator is located, and the like.

In addition, it is not necessary to tilt all the reels. It is preferred to tilt the reels facing the shielding plate. However, the reels not facing the shielding plate may be along the Y direction (0°). In this case, as described above, the substrate processing device 1 can be made compact with sufficient space for replacing the reels and no obstruction to the replacement of the reels.

[Other embodiments] The embodiments and variations of the present invention have been described above, but the embodiments or variations of the embodiments are provided as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other ways and can be omitted, replaced, or modified without departing from the gist of the invention. These embodiments or variations thereof are included in the scope or gist of the invention and are included in the invention described in the scope of the patent application.

1, 2, 3: substrate processing device 10, 10A, 10B, 10C: stage 20, 20A, 20B, 20C, 20D, 20E, 20F: unit 21: supply section 211: supply reel 212: tensioning mechanism 212a: fixed roller 212b: movable roller 213: path roller 22: cutting section 221: cutter 222: support member 222a: flat surface 23: attachment section 231: pressure head 231a: buffer member 24: stripping section 241, 242: stripping rods 25: conveying section 251: conveyor roller 26: recovery unit 261: recovery reel 262: path roller 27: shield plate holding unit 30: first shield plate 40: second shield plate 410: fixed cover 420: baffle 80: control unit 81: mechanism control unit 82: storage unit 83: input and output control unit 91: input device 92: output device 100: ACF A, B, AA, BB: area HC: half-cut line M: area N: moving mechanism P: terminal R: demoulding tape S: adhesive tape S01~S10: step T: belt member W: substrate X, Y, Z: direction

FIG. 1 is a plan view of a substrate processing device according to an embodiment. FIG. 2 is a plan view of a substrate and its terminals according to an embodiment. FIG. 3 is a front view of a unit according to an embodiment. FIG. 4 is a plan view of a unit according to an embodiment. FIG. 5 is a plan view of a unit according to an embodiment. FIG. 6 is a left side view (A) of a unit according to an embodiment, and a right side view (B) of a unit according to an embodiment. FIG. 7 is a side view of the entire unit according to an embodiment and an operator. FIG. 8 is a front view (A) of the extended left end of a unit according to an embodiment, and a front view (B) of the extended right end of a unit according to an embodiment. FIG. 9 is a plan view showing the movement of a unit according to an embodiment. FIG. 10 is a plan view showing the movement of a unit according to an embodiment. FIG. 11 is a functional block diagram of a control unit according to an embodiment. FIG. 12 is a flowchart showing the operation of the substrate processing apparatus of the embodiment. FIG. 13 is a plan view showing the retreat of the unit of the embodiment. FIG. 14 is a plan view showing a substrate processing apparatus of a modification. FIG. 15 is a plan view showing a substrate processing apparatus of a modification. FIG. 16 is a front view showing a substrate processing apparatus of a modification.

1: Substrate processing equipment

10, 10A, 10B: Carrier

20, 20A, 20B, 20C, 20D: Unit

30: First shielding plate

40: Second shielding plate

W: Substrate

X, Y, Z: direction

Claims (9)

A substrate processing device includes: a plurality of carriers, which are arranged adjacent to each other and hold substrates respectively; a plurality of units, which are arranged corresponding to each of the carriers, move relative to the substrates held on the carriers, and process the terminals of the substrates; and a first shielding plate, which moves following the units and shields the units arranged corresponding to the adjacent carriers. A substrate processing device as described in claim 1, wherein the unit is a sticking unit that sticks the adhesive tape to the terminal of the substrate. The substrate processing device as described in claim 1, wherein the first shielding plates are respectively arranged at the positions where the units arranged corresponding to the adjacent carriers face each other. The substrate processing device as described in claim 2, wherein the attachment unit includes: a supply reel for supplying the adhesive tape attached to the release tape to the substrate; and a recovery reel for recovering the release tape, the supply reel being arranged obliquely relative to the first shielding plate in such a manner that the mounting surface of the supply reel faces the side for loading and unloading the supply reel from the attachment unit, and the recovery reel being arranged obliquely relative to the first shielding plate in the opposite direction to the supply reel. The substrate processing device as described in claim 2, wherein the attachment unit includes: a supply reel for supplying the adhesive tape attached to the release tape to the substrate; and a recovery reel for recovering the release tape, wherein the recovery reel is arranged obliquely relative to the first shielding plate in such a manner that the mounting surface of the recovery reel faces a side for loading and unloading the recovery reel from the attachment unit. A substrate processing device as described in claim 3, wherein the unit includes: a cleaning unit for cleaning the terminals of the substrate; a cleaning supply reel for supplying a cleaning tape for cleaning the terminals; and a cleaning recovery reel for recovering the cleaning tape, wherein the cleaning supply reel is arranged obliquely relative to the first shielding plate in such a manner that the mounting surface of the cleaning supply reel faces a side for loading and unloading the cleaning supply reel from the unit. A substrate processing device as described in claim 3, wherein the unit includes: a cleaning unit for cleaning the terminals of the substrate; a cleaning supply reel for supplying a cleaning tape for cleaning the terminals; and a cleaning recovery reel for recovering the cleaning tape, wherein the cleaning recovery reel is arranged obliquely relative to the first shielding plate in such a manner that the mounting surface of the cleaning recovery reel faces a side for loading and unloading the cleaning recovery reel from the unit. A substrate processing device as described in any one of claim 4 to claim 7, wherein a second shielding plate is included between the carrier and the unit, the second shielding plate is along a direction orthogonal to the first shielding plate, and is arranged at a position where the lower end of the second shielding plate does not interfere with the substrate. The substrate processing device as described in claim 8, wherein the second shielding plate includes: a fixed cover, which is set at a height that does not interfere with the substrate; and a baffle, which is set below the fixed cover, and the baffle has an up-and-down lifting mechanism for adjusting between the lower end of the fixed cover and the upper end of the baffle, and the carrier holding the substrate moves back and forth between the fixed cover and the baffle.